Single board and communication device

Abstract

The present application relates to the technical field of communications, and discloses a single board and a communication device, aiming at improving the heat dissipation capability of single boards and further improving the use reliability of communication devices. The single board comprises a circuit board, a first chip, a first heat sink and a second heat sink. The first chip is arranged on the surface of one side of the circuit board. The first heat sink is arranged on the side of the first chip facing away from the circuit board, and the first heat sink is thermo-conductively connected to the first chip. The second heat sink is arranged on the side of the circuit board facing away from the first heat sink, and the second heat sink is spaced apart from the circuit board. In addition, a first boss is provided on the surface of the first heat sink facing the circuit board; a second boss is provided on the surface of the second heat sink facing the circuit board; the first boss and the second boss are arranged opposite to each other; and the first boss is in thermo-conductive contact with the second boss. In this way, heat of the first heat sink can be transmitted to the second heat sink sequentially by means of the first boss and the second boss.

Description

Single board and communication equipment

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on March 30, 2024, with application number 202420657768.5 and application name “A single board and communication equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of communication technology, and in particular to a single board and communication equipment. Background Art

[0004] The single board is the basic functional component used to complete data exchange in the optical line terminal equipment. The single board is equipped with a switching chip and an optical module. The switching chip is used to process and forward data packets, and the optical module is used to convert the electrical signals sent by the switching chip into optical signals and output them, as well as convert the received optical signals into electrical signals and send them to the switching chip.

[0005] Driven by 5G, cloud computing, big data, and artificial intelligence, high-speed optical transmission networks are developing towards high capacity, packetization, and intelligence. While the performance of switch chips in optical line terminal equipment continues to improve, their power consumption is also increasing, which means that the switch chips generate more heat during operation. Currently, insufficient heat dissipation area for the switch chips in mid-mount boards is common, resulting in poor heat dissipation and impacting equipment reliability. Summary of the Invention

[0006] The present application provides a single board and a communication device to improve the heat dissipation capability of the single board, thereby improving the reliability of the communication device.

[0007] In a first aspect, the present application provides a single board comprising a circuit board, a first chip, a first heat sink, and a second heat sink. The first chip is disposed on a side surface of the circuit board, the first heat sink is disposed on a side of the first chip facing away from the circuit board, and the first heat sink and the first chip are thermally conductively connected so that heat generated by the first chip during operation can be transferred to the first heat sink. The second heat sink is disposed on a side of the circuit board facing away from the first heat sink, that is, the second heat sink and the first heat sink are disposed on opposite sides of the circuit board, and the second heat sink and the circuit board are spaced apart. Furthermore, a first boss is disposed on a side of the first heat sink facing the circuit board, and a second boss is disposed on a side of the second heat sink facing the circuit board. The first boss and the second boss are disposed opposite each other and in thermal contact with each other, such that heat from the first heat sink can be transferred to the second heat sink sequentially through the first boss and the second boss. In the present application, by disposing the first and second heat sinks on opposite sides of the circuit board, after the heat generated by the first chip is transferred to the first heat sink, some of the heat is directly dissipated by the first heat sink, while some of the heat can be transferred to the second heat sink through the first and second bosses and dissipated by the second heat sink. That is to say, part of the heat generated by the first chip can be pulled away to the second heat sink on the other side of the circuit board through the first boss and the second boss, thereby compensating for the problem of insufficient heat dissipation area when dissipating heat on one side of the circuit board and effectively improving the heat dissipation capacity of the single board.

[0008] Exemplarily, the first boss and the second boss may be made of a high thermal conductivity material such as copper or aluminum to improve the heat transfer efficiency of the first boss and the second boss.

[0009] In some embodiments, the first boss and the second boss can be connected by a thermal interface material, which can fill the micro gaps between the first boss and the second boss due to the uneven surfaces, thereby reducing the heat transfer resistance between the first boss and the second boss and improving the heat transfer efficiency between the first boss and the second boss.

[0010] Illustratively, the thermal interface material includes but is not limited to thermally conductive silica gel, thermally conductive silicone grease, and the like.

[0011] In some embodiments, the first boss and the first heat sink may be an integral structure to simplify the assembly process of the single board. Similarly, the second boss and the second heat sink may also be an integral structure.

[0012] In some embodiments, the circuit board is provided with an opening, and the first boss can extend from one side of the circuit board to the other side of the circuit board through the opening, thereby achieving thermal connection with the first heat sink and the second heat sink.

[0013] In some embodiments, the first boss may extend from one side of the circuit board to the other side of the circuit board through the area around the circuit board to facilitate thermal connection with the first heat sink and the second heat sink located on both sides of the circuit board.

[0014] In some embodiments, the single board further includes a fastener, and the first radiator and the second radiator can be fixedly connected by the fastener. In a specific implementation, a first sleeve is provided on the side of the first radiator facing the circuit board, and a through hole is provided at the position of the first radiator corresponding to the first sleeve. A sleeve is provided on the first side of the second radiator facing the circuit board, and a thread is provided in the second sleeve. The fastener passes through the through hole, the first sleeve, and the second sleeve in sequence. The fastener and the first sleeve are slidably fitted, and the fastener and the second sleeve are threadedly connected. With this design, the first radiator and the second radiator can be fixed by the threaded connection between the fastener and the second sleeve, and the first sleeve and the second sleeve can also form a protective effect on the fastener, thereby helping to improve the structural reliability of the fastener.

[0015] In some embodiments, the first heat sink may include a first substrate and a plurality of first fins. The side of the first substrate facing away from the first chip includes a first area and a second area, the projection of the first area in the vertical direction at least partially overlaps with the projection of the first boss in the vertical direction, and the projection of the second area in the vertical direction covers the projection of the first chip in the vertical direction; part of the first fins is arranged in the first area, and part of the first fins is arranged in the second area. In one implementation, the material density of the first fins in the first area is less than the material density of the first fins in the second area, which can increase the weight of the part of the first heat sink where the second area is located, thereby shifting the center of gravity of the first heat sink toward the part where the second area is located, so that the first heat sink can form good contact with the first chip under the action of gravity, thereby helping to improve the heat transfer efficiency between the first chip and the first heat sink.

[0016] In another implementation, the distribution density of the first fins in the first area is less than the distribution density of the first fins in the second area. This design can also increase the weight of the part of the first heat sink where the second area is located, thereby shifting the center of gravity of the first heat sink toward the part where the second area is located, so that the first heat sink forms good contact with the first chip.

[0017] In some embodiments, the second heat sink may include a second substrate and a plurality of second fins, wherein the plurality of second fins are arranged on a side of the second substrate facing away from the circuit board, and the material density of the second fins is less than the material density of the first fins in the second area. In this way, after the first heat sink is connected to the second heat sink, the center of gravity of the overall structure formed by the first heat sink and the second heat sink can be made close to the top of the first chip, thereby helping to further improve the contact effect between the first chip and the first heat sink.

[0018] In some embodiments, the first substrate can be a vapor chamber. The first substrate can utilize the internal cooling medium to circulate between liquid and gas phases to dissipate heat, transferring heat generated by the first chip to various locations on the first substrate, thereby achieving efficient heat dissipation of the first chip. The second substrate can be a metal plate, utilizing the excellent thermal conductivity of metal to enhance the heat dissipation effect of the second heat sink.

[0019] In some embodiments, the single board may further include a protective plate, which is disposed on the side of the second heat sink facing away from the circuit board. The protective plate is fixedly connected to the circuit board. A locating pin is disposed on the side of the protective plate facing the second heat sink. The second heat sink is provided with a locating hole, and the locating pin slides vertically into the locating hole. During the process of securely connecting the first and second heat sinks, the locating pin is used to vertically position the second heat sink, thereby reducing the risk of the second heat sink shaking and improving the assembly reliability of the single board.

[0020] In some embodiments, the single board also includes a second chip and a third heat sink. The second chip is arranged on the other side surface of the circuit board facing away from the first chip, and the third heat sink is arranged on the side of the second chip facing away from the circuit board. The third heat sink is thermally conductively connected to the second chip so that the heat generated by the second chip during operation can be dissipated through the third heat sink.

[0021] In some embodiments, a single board includes multiple optical modules, some of which are arranged on one side surface of the circuit board, and some of which are arranged on the other side surface of the circuit board. This can increase the deployment density of the optical modules in the single board, thereby meeting the communication needs of the single board.

[0022] In a second aspect, the present application further provides a single board, which includes a circuit board, a first chip, a first radiator, a second radiator and a heat pipe. The first chip is arranged on one side surface of the circuit board, the first radiator is arranged on the side of the first chip facing away from the circuit board, and the first radiator and the first chip are thermally connected so that the heat generated by the first chip during operation can be transferred to the first radiator; the second radiator is arranged on the side of the circuit board facing away from the first radiator, that is, the second radiator and the first radiator are arranged on both sides of the circuit board, and the second radiator and the circuit board are spaced apart. The heat pipe includes an evaporation section, a condensation section and a connection section, the evaporation section and the condensation section are arranged on both sides of the circuit board, the evaporation section is thermally connected to the first radiator, the condensation section is thermally connected to the second radiator, and the connection section is connected between the evaporation section and the condensation section. By utilizing the reciprocating flow of the cooling medium in the heat pipe between the evaporation section and the condensation section, the cooling medium can continuously transfer the heat of the first radiator to the second radiator. Therefore, part of the heat generated by the first chip can be pulled away to the second heat sink on the other side of the circuit board through the heat pipe, thereby compensating for the problem of insufficient heat dissipation area when dissipating heat on one side of the circuit board and effectively improving the heat dissipation capacity of the single board.

[0023] In a third aspect, the present application further provides a communication device comprising a housing and a board according to any one of the embodiments of the first and second aspects, the board being disposed within the housing. The board in the communication device has good heat dissipation performance, thereby improving the reliability of the communication device.

[0024] In some embodiments, the shell is provided with an insertion frame, and the single board is inserted into the insertion frame. Along the height direction of the insertion frame, there is a gap between the circuit board and the top and bottom of the insertion frame. This single-board centering design can provide installation space for the above-mentioned first radiator and second radiator, thereby increasing the feasibility of installing the single board in the communication equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] FIG1 is a schematic structural diagram of a communication device provided in an embodiment of the present application;

[0026] FIG2 is a schematic diagram of a partial planar structure of the single board shown in FIG1 ;

[0027] FIG3 is a side view of the single board shown in FIG2;

[0028] FIG4 is a side view of a single board provided in an embodiment of the present application;

[0029] FIG5 is a schematic diagram of a partial structure of the single board shown in FIG4 ;

[0030] FIG6 is a side view of another single board provided in an embodiment of the present application;

[0031] FIG7 is a side view of another single board provided in an embodiment of the present application.

[0032] Reference numerals: 1000 - communication device; 1001 - housing; 1002 - communication main body; 10021 - frame; 100 - single board; 110 - circuit board; 111 - opening; 120 - first chip; 130 - optical module; 140 - connector; 150 - second chip; 160 - protective plate; 161 - support column; 162 - positioning pin; 170 - first heat sink; 171 - first substrate; 172 - first fin; 173 - first sleeve; 180 - second heat sink; 181 - second substrate; 1811 - positioning hole; 182 - second fin; 183 - second sleeve; 190 - thermal conductive connector; 191 - first boss; 192 - second boss; 193-evaporation section; 194-condensation section; 195-connection section; 1100-fastener; 1110-third radiator; 200-back plate. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all explained using the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings in the embodiments of the present application are only used to illustrate the relative position relationship and do not represent the true proportion.

[0034] It should be noted that the following description sets forth specific details to facilitate understanding of the present application. However, the embodiments of the present application can be implemented in a variety of other ways than those described herein, and those skilled in the art can make similar generalizations without violating the connotations of the embodiments of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0035] Figure 1 is a schematic structural diagram of a communication device 1000 provided in an embodiment of the present application. Referring to Figure 1, in an embodiment of the present application, the communication device 1000 can be a router, a switch, a fiber optic transceiver, a fiber optic network card or a base station, etc., or can also be other fiber optic devices with communication functions, and the present application does not limit this. The communication device 1000 may include a housing 1001 and a communication body 1002 disposed in the housing, and the communication device 1000 can use the communication body 1002 to implement the communication function. In addition, the communication device 1000 may also include a power supply device, which is also disposed in the housing 1001, for example, it can be disposed on the top of the communication body 1002 to supply power to the communication body 1002.

[0036] In this embodiment, a plurality of plug-in frames 10021 may be provided in the housing 1001, and the plurality of plug-in frames 10021 may be parallel to each other. For example, the plurality of plug-in frames 10021 may be arranged side by side along the height direction of the housing 1001. The communication body 1002 includes a plurality of single boards 100 and a backplane 200, and the plurality of single boards 100 may be plugged into each plug-in frame 10021 in a one-to-one correspondence. For example, the plurality of single boards 100 may include a business board and a control board. The plug-in direction of the single board 100 is defined as a first direction, and the backplane 200 may be provided on one side of each single board 100 along the first direction.

[0037] FIG2 is a schematic diagram of a partial planar structure of the single board 100 shown in FIG1 , and FIG3 is a side view of the single board 100 shown in FIG2 . Referring to FIG2 and FIG3 , the single board 100 includes a circuit board 110, a first chip 120, and an optical module 130. The circuit board 110 is arranged horizontally, and the first chip 120 and the optical module 130 are respectively arranged on the surface of the circuit board 110. The first chip 120 may be a switching chip, and the optical module 130 is arranged at an end of the circuit board 110 away from the backplane. The optical module 130 has an optical interface that can send and receive optical signals. The optical module 130 can be used to receive electrical signals sent by the first chip 120, convert the electrical signals into optical signals, and then output them through the optical interface. Furthermore, the optical module 130 is used to receive optical signals input by the optical interface, convert the optical signals into electrical signals, and then transmit them to the first chip 120. This allows the single board 100 to communicate with external devices through the optical module 130.

[0038] In addition, the single board 100 also includes a connector 140. The connector 140 can be disposed at one end of the circuit board 110 near the backplane. In other words, the connector 140 and the optical module 130 can be disposed at both ends of the single board 100 along a first direction. As shown in FIG1 , the single board 100 can be electrically connected to the backplane 200 via the connector 140. In a specific implementation, the backplane 200 is provided with a mating connector that mates with the connector 140. When the single board 100 is inserted into the aforementioned insertion frame 10021, the mating of the connector 140 and the mating connector establishes a connection between the single board 100 and the backplane 200.

[0039] When the communication device 1000 is working, the single board 100 can receive external optical signals through the optical module 130, convert the optical signal into an electrical signal and send it to the first chip 120 for processing. The first chip 120 transmits the processed signal to the backplane 200 through the connector 140, and then the backplane 200 transmits it to other single boards 100. After being processed by the first chip 120 on the other single boards 100, the optical module 130 converts it into an optical signal and outputs it to the outside, thereby enabling the communication device 1000 to realize network switching or network processing functions.

[0040] In some embodiments, the single board 100 may further include a plurality of second chips 150. The plurality of second chips 150 may be disposed on the same side surface of the circuit board 110 as the first chip 120, or may be disposed on a different side surface of the circuit board 110 than the first chip 120. For example, the first chip 120 may be disposed on the upper surface of the circuit board 110, and the second chip 150 may be disposed on the lower surface of the circuit board 110. Exemplarily, the second chip 150 may be a logic chip, such as, but not limited to, a central processing unit (CPU). The second chip 150 may be used to control the single board 100 to perform service transmission and reception, speed regulation, and emergency response.

[0041] In some embodiments, the single board 100 further includes a protective plate 160, which is disposed on one side of the circuit board 110, for example, on the side of the circuit board 110 facing away from the first chip 120. The protective plate 160 is fixedly connected to the circuit board 110 to support the circuit board 110. In a specific implementation, a certain distance may be provided between the protective plate 160 and the circuit board 110 to facilitate avoiding components disposed on the side of the circuit board 110 facing away from the first chip 120. Exemplarily, the protective plate 160 and the circuit board 110 may be fixedly connected via a support column 161, which may be, but is not limited to, a stud or other rigid column structure.

[0042] Referring to Figures 1 to 3 , in an embodiment of the present application, the communication device 1000 may further include a fan (not shown in the figures) that can be used to dissipate heat from the communication body 1002. Within the communication device 1000, air ducts may be formed between adjacent boards 100. A fan may be disposed at one end of each air duct to supply air into the duct, thereby removing heat generated by the boards 100 during operation through air cooling. In one implementation, each air duct may be disposed along a second direction that is perpendicular to the first direction.

[0043] With the upgrade and evolution of communication networks, the volume and transmission rate of communication data in communication networks have been significantly improved. In order to meet the communication needs of communication equipment, in addition to optimizing the performance of the optical module 130, this can also be achieved by increasing the deployment density of the optical module 130 in the single board 100. For example, as shown in reference to Figure 3, the single board 100 includes a plurality of optical modules 130, some of the multiple optical modules 130 are arranged on one side surface of the circuit board 110, and other part of the optical modules 130 are arranged on the other side surface of the circuit board 110. This can make full use of the space on both sides of the circuit board 110 and provide feasibility for arranging more optical modules 130 on the circuit board 110. In addition, this design can achieve good heat dissipation for the optical modules 130 arranged on both sides of the circuit board 110, thereby helping to improve the working reliability of the optical modules 130.

[0044] It is worth mentioning that, referring to Figures 1 and 3 , when the single board 100 shown in Figure 3 is installed in the subrack 10021 of the communication device 1000, a certain gap is left between the circuit board 110 and both the top and bottom of the subrack 10021 along the height direction of the subrack 10021, thereby providing space for the optical module 130 and other components on the upper and lower surfaces of the circuit board 110. For example, the circuit board 110 can be centered within the subrack 10021, or the circuit board 110 can be located somewhere above or below the middle of the subrack 10021. A single board 100 that adopts this arrangement with the subrack 10021 can be referred to as a center-mounted single board.

[0045] For the center-mounted board 100, due to the relatively limited space above and below the circuit board 110 within the subrack 10021, high-power electrical components within the board 100 are prone to insufficient heat dissipation. For example, the first chip 120 within the board 100 is responsible for processing and forwarding data packets. With the rapid development of communication networks, the power consumption of the first chip 120 is increasing, which means that the first chip 120 generates more heat during operation. Therefore, improving the heat dissipation performance of the first chip 120 within the center-mounted board is a pressing technical issue.

[0046] To address the above issues, the present embodiment adopts a remote heat dissipation solution, which distributes some of the heat generated by the first chip 120 located on one surface of the circuit board 110 to the other side of the circuit board 110. This fully utilizes the space above and below the circuit board 110 for heat dissipation, effectively improving the heat dissipation effect on the first chip 120 and, in turn, enhancing the overall heat dissipation performance of the board 100. The board's heat dissipation solution is described in detail below with reference to Figures 4 to 6.

[0047] Referring to Figure 4, Figure 4 is a side view of a single board 100 provided in an embodiment of the present application. In the embodiment of the present application, the single board 100 may further include a first heat sink 170, a second heat sink 180, and a thermally conductive connector 190. The first heat sink 170 is arranged on the side of the first chip 120 facing away from the circuit board 110, and the first heat sink 170 is thermally connected to the first chip 120 so that the heat generated by the first chip 120 during operation can be transferred to the first heat sink 170. The second heat sink 180 is arranged on the side of the circuit board 110 facing away from the first heat sink 170. The thermally conductive connector 190 is thermally connected to the first heat sink 170 and the second heat sink 180 respectively so as to transfer part of the heat of the first heat sink 170 to the second heat sink 180.

[0048] In this embodiment, the first heat sink 170 and the second heat sink 180 are disposed on opposite sides of the circuit board 110. After the heat generated by the first chip 120 is transferred to the first heat sink 170, part of the heat is dissipated directly by the first heat sink 170, while another part of the heat is transferred to the second heat sink 180 via the thermally conductive connector 190 and dissipated by the second heat sink 180. In other words, the thermally conductive connector 190 can draw part of the heat generated by the first chip 120 to the second heat sink 180 on the other side of the circuit board 110 for dissipation, thereby compensating for the insufficient heat dissipation area that would result from heat dissipation on one side of the circuit board 110 and effectively improving the heat dissipation effect on the first chip 120.

[0049] The thermally conductive connector 190 may be one or more, and this application does not impose any restrictions thereon. In the case where there are multiple thermally conductive connectors 190, utilizing the multiple thermally conductive connectors 190 can effectively improve the heat transfer efficiency between the first heat sink 170 and the second heat sink 180, thereby providing a better heat dissipation effect for the first chip 120.

[0050] In the embodiment of the present application, the first heat sink 170 may include a first substrate 171 and a plurality of first fins 172. The first substrate 171 contacts the first chip 120. The plurality of first fins 172 are disposed on the side of the first substrate 171 facing away from the first chip 120. The plurality of first fins 172 can effectively increase the surface area of ​​the first heat sink 170, thereby improving the heat exchange efficiency between the first heat sink 170 and the air flowing over its surface. Similarly, the second heat sink 180 may include a second substrate 181 and a plurality of second fins 182. The second substrate 181 is connected to the thermally conductive connector 190. The plurality of second fins 182 are disposed on the side of the second substrate 181 facing away from the circuit board 110. The plurality of second fins 182 can effectively increase the surface area of ​​the second heat sink 180, thereby improving the heat exchange efficiency between the second heat sink 180 and the air flowing over its surface.

[0051] The first substrate 171 can be a vapor chamber (VC) liquid cooling heat sink. A VC liquid cooling heat sink, also known as a planar heat pipe, temperature equalizer, or heat spreader, utilizes an internal cooling medium (e.g., water) to circulate heat between liquid and gaseous states, transferring heat generated by the first chip 120 to various locations on the first substrate 171, thereby achieving efficient heat dissipation of the first chip 120. The second substrate 181 can be a metal substrate. Exemplarily, the material of the second substrate 181 includes, but is not limited to, metal materials with good thermal conductivity, such as copper and aluminum.

[0052] Of course, in some other embodiments, the first substrate 171 and the second substrate 181 may both be temperature equalizing plates, or the first substrate 171 and the second substrate 181 may both be metal substrates, which are all within the protection scope of the present application.

[0053] In the embodiment of the present application, the surface of the first substrate 171 facing away from the circuit board 110 may include a first area A1 and a second area A2. The vertical projection of the first area A1 at least partially overlaps with the vertical projection of the thermal connector 190, while the vertical projection of the second area A2 covers the vertical projection of the first chip 120. Here, the vertical direction can be understood as the thickness direction of the single board 100. Of the multiple first fins 172, some are located within the first area A1, and some are located within the second area A2.

[0054] In one implementation, the material density of the first fins 172 in the first area A1 is lower than the material density of the first fins 172 in the second area A2. For example, the first fins 172 in the first area A1 may be made of aluminum, and the first fins 172 in the second area A2 may be made of copper. Because the vertical projection of the thermal connector 190 at least partially overlaps with the vertical projection of the first area A1, without considering the first fins 172, the weight of the portion of the first heat sink 170 corresponding to the first area A1 is greater than the weight of the portion corresponding to the second area A2. However, by configuring the first fins 172 in the first area A1 and the first fins 172 in the second area A2 to be made of two different materials, and ensuring that the material density of the first fins 172 in the first area A1 is greater than the material density of the first fins 172 in the second area A2, the weight of the portion in the second area A2 can be increased, thereby shifting the center of gravity of the first heat sink 170 toward the portion in the second area A2.

[0055] Alternatively, in another implementation, the weight of the portion of the second area A2 can be increased by increasing the distribution density of the first fins 172 in the second area A2. Of course, the above two implementations can also be applied to the first heat sink 170, that is, the first fins 172 in the first area A1 are aluminum fins, and the first fins 172 in the second area A2 are copper fins, and the distribution density of the first fins in the first area A1 is less than the distribution density of the first fins 172 in the second area A2.

[0056] For the second heat sink 180, the plurality of second fins 182 of the second heat sink 180 may all be made of aluminum, which helps reduce the overall weight of the second heat sink 180. Alternatively, the plurality of second fins 182 of the second heat sink 180 may also be configured with reference to the plurality of first fins 172 of the first heat sink 170, and the details are not repeated here.

[0057] Based on the above structural description of the first heat sink 170 and the second heat sink 180, by reasonably designing the areas of the first area A1 and the second area A2 on the first substrate 171 and the material or distribution density of the first fins 172 in the two areas, the center of gravity of the overall structure composed of the first heat sink 170, the second heat sink 180 and the thermally conductive connector 190 can be maintained above the first chip 120. In this way, the first heat sink 170 can form good contact with the first chip 120 under the action of gravity, thereby helping to improve the heat transfer efficiency between the first chip 120 and the first heat sink 170.

[0058] FIG5 is a schematic diagram of a partial structure of the single board 100 shown in FIG4 . Referring to FIG4 and FIG5 together, in an embodiment of the present application, the first heat sink 170 and the second heat sink 180 can be relatively fixed by a fastener 1100 . For example, a first sleeve 173 can be provided on the side of the first heat sink 170 facing the circuit board 110 (i.e., the side of the first heat sink 170 facing the second heat sink 180 ), and a through hole (not shown in the figure) can be provided on the first heat sink 170 at a position corresponding to the first sleeve 173 ; a second sleeve 183 can be provided on the side of the second heat sink 180 facing the circuit board 110 (i.e., the side of the second heat sink 180 facing the first heat sink 170 ), and a thread can be provided in the second sleeve 183 . The fastener 1100 is sequentially penetrated by a through hole, a first sleeve 173 and a second sleeve 183 on the side of the first radiator 170 facing away from the second radiator 180. The fastener 1100 and the first sleeve 173 are slidably fitted together, and the end of the fastener 1100 is tightened in the second sleeve 183. In this way, the first radiator 170 and the second radiator 180 can be fixed by the threaded connection between the fastener 1100 and the second sleeve 183, and the first sleeve 173 and the second sleeve 183 can also form a protective effect on the fastener 1100, thereby helping to improve the structural reliability of the fastener 1100.

[0059] In a specific implementation, the first sleeve 173 can be disposed on a side of the first substrate 171 facing the second heat sink 180. For example, the first sleeve 173 and the first substrate 171 can be integrally formed. Similarly, the second sleeve 183 can be disposed on a side of the second substrate 181 facing the first heat sink 170. For example, the second sleeve 183 and the second substrate 181 can be integrally formed.

[0060] It is worth mentioning that there can be multiple first sleeves 173 and multiple second sleeves 183, respectively, and the first heat sink 170 and the second heat sink 180 can be fixedly connected via corresponding multiple fasteners 1100 to improve the connection strength between the two. In one implementation, the multiple first sleeves 173 can be relatively dispersed on the first substrate 171, and correspondingly, the second sleeves 183 can also be relatively dispersed on the second substrate 181 to improve the uniformity of force applied to the first heat sink 170 and the second heat sink 180. In addition, the circuit board 110 can be provided with avoidance holes at the positions corresponding to the first sleeves 173 and the second sleeves 183 to prevent interference between the two sleeves and the fasteners 1100 and the circuit board.

[0061] In other embodiments, the first heat sink 170 and the second heat sink 180 may each be provided with a through hole, and the fastener 1100 may be sequentially penetrated through two through holes on the side of the first heat sink 170 facing away from the second heat sink 180. A nut matching the fastener 1100 may be fixedly provided on the side of the second substrate 181 facing away from the first heat sink 170, and the end of the fastener 1100 may be locked into the nut. This method can also securely connect the first heat sink 170 and the second heat sink 180.

[0062] In the embodiment of the present application, to increase the heat dissipation area of ​​the second heat sink 180, the second heat sink 180 can be appropriately extended in the horizontal direction. Considering that electrical components will also be installed on the side surface of the circuit board 110 facing away from the first chip 120, in order to avoid occupying the area of ​​this side surface of the circuit board 110, the second heat sink 180 can be spaced apart from the circuit board 110. This space between the second heat sink 180 and the circuit board 110 can be used to avoid the relevant electrical components and their heat sink. This does not affect the installation and heat dissipation of the electrical components on this side surface of the circuit board 110, and also helps to achieve a large-area design for the second heat sink 180.

[0063] For example, when the second chip 150 is disposed on the surface of the circuit board 110 facing away from the first chip 120, the single board 100 may further include a third heat sink 1110. The third heat sink 1110 is disposed on the side of the second chip 150 facing away from the circuit board 110, and the third heat sink 1110 is thermally connected to the second chip 150 so that heat generated by the second chip 150 during operation can be dissipated through the third heat sink 1110. In this case, the distance between the second heat sink 180 and the circuit board 110 may be no less than the sum of the thickness of the second chip 150 and the thickness of the third heat sink 1110.

[0064] Continuing with FIG4 , in the embodiment of the present application, the thermally conductive connector 190 may include a first boss 191 and a second boss 192. The first boss 191 is disposed on the side of the first heat sink 170 facing the circuit board 110, and the second boss 192 is disposed on the side of the second heat sink 180 facing the circuit board 110. The first boss 191 and the second boss 192 are disposed opposite each other along the thickness direction of the single board 100, and the first boss 191 and the second boss 192 abut against each other. In this way, heat from the first heat sink 170 can be transferred to the second heat sink 180 via the first boss 191 and the second boss 192 in sequence.

[0065] In this embodiment, the circuit board 110 is provided with an opening 111, which is positioned opposite the first boss 191 and the second boss 192, and the cross-sectional area of ​​the opening 111 is greater than or equal to the cross-sectional area of ​​the first boss 191 and the second boss 192. Alternatively, it can be understood that the projections of the first boss 191 and the second boss 192 in the thickness direction of the single board 100 are located within the projection of the opening 111 in the thickness direction of the single board 100, so that the first boss 191 and the second boss 192 can be connected through the opening 111. It can also be understood that the thermal connector 190 can extend from one side of the circuit board 110 to the other side of the circuit board 110 through the opening 111, thereby achieving thermal connection with the first heat sink 170 and the second heat sink 180.

[0066] The first boss 191 and the second boss 192 can also be made of a highly thermally conductive material such as copper or aluminum to improve the heat transfer efficiency of the thermal connector 190. In one embodiment, the first boss 191 and the first heat sink 170 can be an integral structure to simplify the assembly process of the first heat sink 170. In another embodiment, the first boss 191 and the first heat sink 170 can be fixedly connected by welding or other methods. Similarly, the second boss 192 and the second heat sink 180 can be either an integral structure or a separate structure fixedly connected by welding or other methods.

[0067] In one implementation, a thermal interface material may be disposed between the first boss 191 and the second boss 192. The thermal interface material may fill the micro-gap between the first boss 191 and the second boss 192 due to the uneven surfaces, thereby reducing the heat transfer resistance between the first boss 191 and the second boss 192 and improving the heat transfer efficiency of the thermal connector 190. Exemplarily, the thermal interface material includes, but is not limited to, thermally conductive silicone, thermally conductive silicone grease, and the like.

[0068] In addition, according to the aforementioned connection method between the first radiator 170 and the second radiator 180, the threaded connection between the fastener 1100 and the second sleeve 183 of the second radiator 180 can be used to make the position of the second radiator 180 in the vertical direction adjustable. In this way, the distance between the first radiator 170 and the second radiator 180 can be shortened by moving the second radiator 180 upward, so that the distance between the first radiator 170 and the second radiator 180 can meet the tight connection requirements of the first boss 191 and the second boss 192, thereby helping to further improve the heat transfer efficiency of the thermal conductive connector 190.

[0069] Exemplarily, the sum of the heights of the first sleeve 173 and the second sleeve 183 can be equal to or slightly smaller than the sum of the heights of the first boss 191 and the second boss 192. In this way, when the second radiator 180 is moved until the first sleeve 173 and the second sleeve 183 contact each other, the first boss 191 and the second boss 192 can be made to abut against each other.

[0070] The fastener 1100 used to fix the first radiator 170 and the second radiator 180 can be a fixed distance screw. The fixed distance screw can not only fix the first radiator 170 and the second radiator 180, but also maintain a certain distance between the first radiator 170 and the second radiator 180. By reasonably designing the pitch of the fixed distance screw, the distance between the first radiator 170 and the second radiator 180 can meet the close fitting requirement of the first boss 191 and the second boss 192, thereby helping to further improve the heat transfer efficiency of the thermal conductive connector 190.

[0071] Continuing to refer to Figures 4 and 5, in this embodiment, a positioning pin 162 may be provided on the side of the protective plate 160 facing the second heat sink 180, and accordingly, the second heat sink 180 is provided with a positioning hole 1811. Specifically, the positioning hole 1811 may be provided on the second substrate 181. The positioning pin 162 is slidably provided in the positioning hole 1811 in the vertical direction. In other words, the second heat sink 180 can slide relative to the protective plate 160 through the cooperation between the positioning pin 162 and the positioning hole 1811. Therefore, in the process of fixing the first heat sink 170 and the second heat sink 180 with the fastener 1100, the positioning pin 162 is used to position the second heat sink 180 in the vertical direction, thereby reducing the risk of shaking of the second heat sink 180 and improving the assembly reliability of the single board 100.

[0072] When assembling the single board 100, first place the second heat sink 180 on one side of the protective plate 160, so that the positioning pin 162 of the protective plate 160 is inserted into the positioning hole 1811 of the second heat sink 180, then place the circuit board 110 on the side of the second heat sink 180 facing away from the protective plate 160, and fix the circuit board 110 and the protective plate 160 together through the support column 161. Finally, place the first heat sink 170 on the side of the circuit board 110 facing away from the second heat sink 180, and fix the first heat sink 170 and the second heat sink 180 together through the fastener 1100, so that the first boss 191 and the second boss 192 are thermally connected through the thermal interface material.

[0073] FIG6 is a side view of another single board 100 provided in an embodiment of the present application. Referring to FIG6 , in the embodiment of the present application, a thermally conductive connector 190 can extend from one side of the circuit board 110 to the other side of the circuit board 110 through the peripheral area of ​​the circuit board 110, thereby facilitating thermal connection with the first heat sink 170 and the second heat sink 180 located on both sides of the circuit board 110. Again, taking the thermally conductive connector 190 as an example, comprising a first boss 191 and a second boss 192 abutting each other, a side edge of the first heat sink 170 is positioned beyond the circuit board 110, and a corresponding side edge of the second heat sink 180 is also positioned beyond the circuit board 110. The first boss 191 is positioned in the area where the first heat sink 170 extends beyond the circuit board 110, and the second boss 192 is positioned in the area where the second heat sink 180 extends beyond the circuit board 110. In this way, the first boss 191 and the second boss 192 can be butted against each other without opening a hole.

[0074] In addition, in this embodiment, the first radiator 170 and the second radiator 180 can also be relatively fixed by fasteners 1100. The installation method of the fasteners can be set with reference to the examples in Figures 4 and 5, and will not be repeated here.

[0075] FIG7 is a side view of another single board 100 provided in an embodiment of the present application. Referring to FIG7 , in this embodiment of the present application, the thermally conductive connector 190 may be a heat pipe, comprising an evaporation section 193, a condensation section 194, and a connection section 195. The evaporation section 193 and the condensation section 194 are respectively disposed on opposite sides of the circuit board 110. The evaporation section 193 contacts the first heat sink 170, and the condensation section 194 contacts the second heat sink 180. The connection section 195 extends from one side of the circuit board 110 to the other side of the circuit board 110, connecting the evaporation section 193 and the condensation section 194. For example, the evaporation section 193 may be in contact with the side of the first substrate 171 of the first radiator 170 facing away from the circuit board 110, the condensation section 194 may be in contact with the side of the second substrate 181 of the second radiator 180 facing away from the circuit board 110, and the connecting section 195 may be connected to the ends of the evaporation section 193 and the condensation section 194 respectively. At this time, the thermal conductive connector 190 may be roughly a "C"-shaped structure.

[0076] When the thermal connector 190 is working, the cooling medium in the evaporation section 193 becomes gaseous through evaporation and heat exchange with the first radiator 170, and the gaseous cooling medium flows to the condensation section 194 through the connecting section 195, and condenses into liquid through condensation and heat exchange with the second radiator 180 in the condensation section 194. The liquid cooling medium returns to the evaporation section 193 through the connecting section 195 again. In this process, the first radiator 170 achieves heat dissipation and cooling by heat exchange with the cooling medium in the evaporation section 193, and the second radiator 180 increases in temperature by heat exchange with the cooling medium in the condensation section 194. This cycle repeats itself, and the thermal connector 190 can continuously transfer the heat of the first radiator 170 to the second radiator 180.

[0077] In this embodiment, the ends of the evaporation section 193 and the condensation section 194 can be respectively disposed beyond the edge of the circuit board 110, so that the connection section 195 can extend from one side of the circuit board 110 to the other side of the circuit board 110 through the peripheral area of ​​the circuit board 110. Of course, in other embodiments, an opening can also be provided in the circuit board 110 so that the connection section 195 extends from one side of the circuit board 110 to the other side of the circuit board 110 through the opening.

[0078] Similarly, in this embodiment, the first radiator 170 and the second radiator 180 can also be relatively fixed by fasteners. The installation method of the fasteners can be set with reference to the examples in Figures 4 and 5, and will not be repeated here.

[0079] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A single board, characterized in that: The device comprises a circuit board, a first chip, a first heat sink, and a second heat sink, wherein: The first chip is arranged on a side surface of the circuit board; The first heat sink is arranged on a side of the first chip facing away from the circuit board, and the first heat sink is thermally connected to the first chip, and a first boss is arranged on a side of the first heat sink facing the circuit board; The second heat sink is arranged on the side of the circuit board facing away from the first heat sink, and the second heat sink is spaced apart from the circuit board. A second boss is provided on the side of the second heat sink facing the circuit board, and the second boss is arranged opposite to the first boss, and the second boss is in thermal contact with the first boss.

2. The single board according to claim 1, wherein The first boss and the second boss are thermally connected via a thermal interface material.

3. The single board according to claim 1 or 2, characterized in that The first boss and the first heat sink are an integral structure, and the second boss and the second heat sink are an integral structure.

4. The single board according to any one of claims 1 to 3, characterized in that: The circuit board is provided with an opening, and the first boss extends from one side of the circuit board to the other side of the circuit board through the opening.

5. The single board according to any one of claims 1 to 3, characterized in that: The first boss extends from one side of the circuit board to the other side of the circuit board through an area around the circuit board.

6. The single board according to any one of claims 1 to 5, characterized in that: The single board also includes a fastener; A first sleeve is provided on a side of the first radiator facing the circuit board, and a through hole is provided on the first radiator at a position corresponding to the first sleeve; a second sleeve is provided on a side of the second radiator facing the circuit board, and a thread is provided in the second sleeve; The fastener is sequentially inserted into the through hole, the first sleeve and the second sleeve, and the fastener is threadedly connected to the second sleeve.

7. The single board according to any one of claims 1 to 6, characterized in that: The first heat sink includes a first substrate and a plurality of first fins; The first substrate has a surface facing away from the first chip, including a first area and a second area, wherein a projection of the first area in a vertical direction at least partially overlaps with a projection of the first boss in the vertical direction, and a projection of the second area in the vertical direction covers a projection of the first chip in the vertical direction; Part of the first fins is arranged in the first area, and another part of the first fins is arranged in the second area. The material density of the first fins in the first area is less than the material density of the first fins in the second area; or, the distribution density of the first fins in the first area is less than the distribution density of the first fins in the second area.

8. The single board according to claim 7, wherein: The second heat sink includes a second substrate and a plurality of second fins. The plurality of second fins are arranged on a side of the second substrate facing away from the circuit board, and a material density of the second fins is smaller than a material density of the first fins in the second area.

9. The single board according to claim 8, characterized in that The first substrate is a temperature-averaging plate, and the second substrate is a metal plate.

10. The single board according to any one of claims 1 to 9, characterized in that: The single board includes a protective plate, which is arranged on a side of the second radiator facing away from the circuit board, the protective plate is fixedly connected to the circuit board, and a positioning pin is provided on a side of the protective plate facing the second radiator; The second radiator is provided with a positioning hole, and the positioning pin is slidably arranged in the positioning hole along a vertical direction.

11. The single board according to any one of claims 1 to 10, characterized in that: The single board includes a second chip and a third heat sink. The second chip is arranged on the other side of the circuit board facing away from the first chip. The third heat sink is arranged on the side of the second chip facing away from the circuit board, and the third heat sink is thermally connected to the second chip.

12. A communication device, characterized in that: The invention comprises a shell and a single board according to any one of claims 1 to 11, wherein the single board is arranged in the shell.

13. The communication device according to claim 12, wherein: An insertion frame is provided in the housing, and the single board is inserted into the insertion frame. Along the height direction of the insertion frame, there is a gap between the circuit board and the top and bottom of the insertion frame.

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