Temperature sensor fault handling method and program product, electronic equipment

Abstract

The application discloses a temperature sensor fault processing method and program product, and an electronic device, which are applied to a server. The server comprises a bus switching switch, a single board management controller, a plurality of temperature sensors and a plurality of cooling fans. The method comprises the following steps: acquiring temperature information corresponding to the plurality of temperature sensors at a target position in the server, and determining whether each temperature sensor is faulty based on the plurality of temperature information; acquiring backup information of the temperature sensor and a mapping relationship between the temperature sensor and the rotating speed of the cooling fan in the case that it is determined that the temperature sensor is faulty; determining an influence level of the temperature sensor on the server based on the backup information and the mapping relationship; and adjusting an access period of the single board management controller to the temperature sensor based on the influence level. The method can improve the operation efficiency of the single board management controller and the sensitivity of the fan speed regulation to the temperature sensor.

Description

Technical Field

[0001] The present application relates to the technical field of temperature sensors, and in particular to a method for handling temperature sensor faults, a program product, and an electronic device. Background Art

[0002] As server equipment becomes increasingly complex, overall energy consumption also increases significantly, posing significant challenges for overall cooling. The industry utilizes two cooling technologies: fan cooling and liquid cooling. Liquid cooling is currently relatively expensive, so air cooling remains the preferred method for most manufacturers. Air cooling relies on temperature sensors. Storage devices are significantly more complex than servers, and the number of temperature sensors increases with board complexity. If a temperature sensor fails, frequent access increases the BMC's (Baseboard Management Controller) access cycle for all temperature sensors, reducing fan speed control efficiency. Summary of the Invention

[0003] The present application provides a temperature sensor fault handling method and program product, storage medium, and electronic device to at least solve the problem in the related art that if a sensor fails and continues to be accessed frequently, the cycle of the single-board management controller accessing all temperature sensors will increase, and the efficiency of fan speed regulation will be reduced. It can improve the operating efficiency of the single-board management controller and increase the sensitivity of fan speed regulation to the temperature sensor.

[0004] The present application provides a temperature sensor fault handling method, characterized in that it is applied in a server, the server including a bus switch, a single board management controller, multiple temperature sensors, and multiple cooling fans, the single board management controller being connected to the multiple temperature sensors via the bus switch, the method comprising:

[0005] At a target location in the server, acquiring temperature information corresponding to a plurality of the temperature sensors at the target location, and determining whether each of the temperature sensors is faulty based on the plurality of temperature information;

[0006] When it is determined that the temperature sensor fails, obtaining backup information of the temperature sensor and obtaining a mapping relationship between the temperature sensor and the speed control of the cooling fan;

[0007] determining an impact level of the temperature sensor on the server based on the backup information and the mapping relationship;

[0008] An access period for the board management controller to access the temperature sensor is adjusted based on the impact level.

[0009] The present application also provides a computer program product, including a computer program / instruction, which implements the above-mentioned temperature sensor fault processing method when executed by a processor.

[0010] The present application also provides a non-volatile computer-readable storage medium having a program stored thereon, which implements the above-mentioned temperature sensor fault processing method when executed by a processor.

[0011] The present application also provides an electronic device, including a memory, a processor, and a program stored in the memory and executable on the processor. When the processor executes the program, the above-mentioned temperature sensor fault processing method is implemented.

[0012] Through this application, at a target location in a server, the corresponding temperature information of multiple temperature sensors at the target location is obtained, and based on the multiple temperature information, it is determined whether each temperature sensor is faulty. If a temperature sensor is determined to be faulty, the backup information of the temperature sensor is obtained, and the mapping relationship between the temperature sensor and the speed control of the cooling fan is obtained. Based on the backup information and the mapping relationship, the impact level of the temperature sensor on the server is determined, and the access cycle of the single board management controller to the temperature sensor is adjusted based on the impact level. As a result, this method can improve the operating efficiency of the single board management controller and increase the sensitivity of fan speed control to the temperature sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0014] Figure 1 This is a flow chart of a method for handling a temperature sensor failure according to one embodiment of the present application;

[0015] Figure 2 Schematic diagram of a hardware control circuit according to one embodiment of the present application;

[0016] Figure 3 A flow chart of a method for handling a temperature sensor failure according to a specific example of the present application;

[0017] Figure 4 Schematic diagram of a block diagram of an electronic device according to an embodiment of the present application.

[0018] Reference numerals: 200 - electronic device, 210 - memory, 220 - processor. DETAILED DESCRIPTION

[0019] The following describes in detail embodiments of the present application, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0020] The following describes a temperature sensor fault processing method, a computer program product, a non-volatile computer-readable storage medium, and an electronic device proposed in embodiments of the present application with reference to the accompanying drawings.

[0021] Figure 1 Flowchart of a temperature sensor fault handling method according to an embodiment of the present application.

[0022] like Figure 1 As shown, the temperature sensor fault processing method of the embodiment of the present application may include the following steps:

[0023] S1, at a target location in a server, obtaining temperature information corresponding to a plurality of temperature sensors at the target location, and determining whether each temperature sensor is faulty based on the plurality of temperature information.

[0024] S2: When it is determined that the temperature sensor fails, backup information of the temperature sensor is obtained, and a mapping relationship between the temperature sensor and the speed control of the cooling fan is obtained.

[0025] S3: Determine the impact level of the temperature sensor on the server based on the backup information and the mapping relationship.

[0026] S4: Adjust the access period of the board management controller to the temperature sensor based on the impact level.

[0027] Specifically, in an embodiment of the present application, a server may include a bus switch, a board management controller (BMC), multiple temperature sensors, and multiple cooling fans. Specifically, temperature sensors may be distributed at targeted locations (critical locations) within the server, such as the CPU (Central Processing Unit), memory, hard disk, power module, etc., to monitor the temperatures of these components in real time. A bus switch (e.g., an I2C-switch) connects the BMC and the temperature sensors. Furthermore, each temperature sensor can have a dedicated I2C-switch channel, which improves communication reliability and efficiency. The BMC is responsible for managing and controlling the server's hardware status, such as reading temperature sensors, detecting faults, and adjusting cooling strategies. Cooling fans are used to reduce the internal temperature of the server, ensuring that the server operates within a normal temperature range. Multiple cooling fans provide redundancy; even if a fan fails, the remaining fans can still maintain system cooling.

[0028] At the target location in the server, first, the temperature information corresponding to each temperature sensor at the target location is acquired, and whether each temperature sensor is faulty is determined based on the temperature information. For example, a baseboard management controller (BMC) can periodically acquire temperature data from each temperature sensor through an I2C (Inter-Integrated Circuit) bus or other communication interfaces. These temperature sensors are distributed at target locations in the server, such as CPU, memory, hard disk, power module, etc., for real-time monitoring of the temperature of these components. Then, the acquired temperature data is analyzed to determine whether the temperature sensor is faulty. The basis for fault determination can include but is not limited to the following cases: if temperature data cannot be acquired from a certain temperature sensor within a specified time, or the acquired data is invalid (such as exceeding the measurement range of the sensor, data format error, etc.), the sensor is considered to be faulty; if the temperature value read by a certain temperature sensor is significantly higher or lower than that of other sensors of the same type, and the actual temperature change is excluded, the sensor can be considered to be faulty; under normal circumstances, the rate of change of the internal temperature of the server is relatively stable, if the rate of change of the temperature detected by a certain temperature sensor is much higher than the normal range, it may be a false reading caused by sensor failure.

[0029] For example, there are 5 temperature sensors in the server, marked as T1, T2, T3, T4 and T5. The BMC acquires temperature data from these sensors every 1 second. During a certain data collection process, the BMC finds that it cannot acquire temperature data from T3, and after 3 consecutive attempts, it still fails, so it determines that T3 is faulty. At the same time, the BMC also finds that the temperature value of T4 is 100℃, while the temperature values of other sensors of the same type are all around 50℃, and the actual operating environment temperature of the server is not high, so it determines that T4 may be faulty.

[0030] In the case where it is determined that there is a malfunction of the temperature sensor, backup information of the temperature sensor can be obtained, and a mapping relationship between the temperature sensor and the speed regulation of the cooling fan can be obtained. In obtaining the backup information, a backup temperature sensor of the malfunctioning temperature sensor can be found according to a pre-set backup strategy. The backup temperature sensor can be a sensor of the same type or a sensor of a different type, but the temperature data of the two sensors can be referenced and verified with each other. For example, the backup strategy can be based on the geographical location of the sensor, the monitored object, and other factors. The mapping relationship refers to the correspondence between the output (temperature data) of the temperature sensor and the speed of the cooling fan, for example, if the temperature sensor reading exceeds a certain threshold, the speed of the cooling fan will increase; if the temperature sensor reading is below a certain threshold, the speed of the cooling fan will decrease. That is, the mapping relationship between the temperature sensor and the speed regulation of the cooling fan involves the fan speed regulation strategy, for example, the temperature value of some temperature sensors may directly affect the speed of the cooling fan, while the temperature value of other sensors may only be used as a reference, and the role and weight of each temperature sensor in the fan speed regulation strategy need to be determined. Therefore, by obtaining the backup information of the temperature sensor, more reference data is provided for subsequent fault handling, which helps to more accurately assess the impact of the fault on the system. And determining the mapping relationship between the temperature sensor and the speed regulation of the cooling fan helps to reasonably adjust the cooling strategy when a fault occurs, ensuring that the cooling needs of the server are met.

[0031] After determining the backup information and the mapping relationship, the impact level of the temperature sensor on the server can be determined according to the backup information and the mapping relationship. For example, the impact level is determined according to the presence or absence of a backup temperature sensor. If there is a backup temperature sensor and the backup temperature sensor can completely replace the function of the malfunctioning sensor, the impact level of the malfunctioning sensor is low; if there is no backup temperature sensor or the backup temperature sensor cannot completely replace the function of the malfunctioning sensor, the impact level is high. For example, the impact level is determined according to the weight of the mapping relationship of the speed, such as the greater the weight of the malfunctioning sensor in the speed regulation of the cooling fan, the higher the impact level of the cooling system. For example, if the temperature value of a temperature sensor directly affects the full-speed operation of the cooling fan, the impact level of the temperature sensor will be high. That is, according to the above factors, the impact level of each malfunctioning temperature sensor is determined according to the pre-set rules, which can be realized in the form of tables, formulas, etc.

[0032] For example, after BMC discovers T3 and T4 faults, it looks up backup information. Assume that the backup temperature sensors of T3 are T1 and T2, which are located in the same area of the server and monitor the temperature of the same component. T4 has no backup temperature sensor because it monitors a special component and no other sensor can replace it. Then, BMC obtains the mapping relationship of T3 and T4 and the speed control of the cooling fan. According to the fan speed control strategy, the temperature value of T3 accounts for 30% of the weight of the fan speed control, and the temperature value of T4 accounts for 20% of the weight. According to the backup information and the mapping relationship, the influence level of T3 and T4 is determined. Since T3 has backup temperature sensors T1 and T2, which can provide reliable temperature data, and T3 has a weight of 30% in the speed control of the cooling fan, BMC determines the influence level of T3 as medium. T4 has no backup temperature sensor, and the weight in the speed control of the cooling fan is 20%. Although the weight is not high, since there is no backup, the influence level of T4 can be determined as high.

[0033] After determining the influence level, the access period of the single board management controller to the temperature sensor can be adjusted according to the influence level. For example, for a temperature sensor with a high influence level, even if it fails, a short access period is required to obtain data from the backup temperature sensor in time to ensure the normal operation of the cooling system. For example, the access period can be shortened to 1 / 2 or 1 / 3 of the original. For a temperature sensor with a medium influence level, the access period can be appropriately extended, but not too long to ensure that the backup temperature sensor can be discovered in time when it fails. For example, the access period can be extended to twice the original. For a temperature sensor with a low influence level, the access period can be greatly extended, or even suspended for a certain period of time to save system resources. For example, the access period can be extended to 10 times the original, or the access can be suspended for a certain period of time if the backup temperature sensor data is normal for a plurality of times in succession. That is, the access period is dynamically adjusted according to the real-time system running state and fault condition. If the data of the backup temperature sensor is abnormal or the running state of the cooling system changes, BMC can reevaluate the influence level and adjust the access period accordingly.

[0034] Thus, by reasonably adjusting the access period, the number of times BMC accesses the temperature sensor is reduced, the access efficiency of the system is improved, and the load of the system is reduced.

[0035] According to one embodiment of the present application, the impact level of the temperature sensor on the server is determined based on the backup information and the mapping relationship, including: when the backup information is that the temperature sensor has no corresponding backup temperature sensor, and if the temperature sensor fails, the cooling fan runs at the maximum speed, the impact level is determined to be the first level; when the backup information is that the temperature sensor has a corresponding backup temperature sensor, and if the temperature sensor and the backup temperature sensor are all faulty, the cooling fan runs at the maximum speed, the impact level is determined to be the second level; when the backup information is that the temperature sensor has a corresponding backup temperature sensor, and if the temperature sensor and the backup temperature sensor are all faulty, the cooling fan increases the operating speed to the first target speed threshold, the impact level is determined to be the third level, wherein the first target speed threshold is less than the maximum speed; when the backup information is that the temperature sensor has no corresponding backup temperature sensor, and if the temperature sensor fails, the cooling fan increases the operating speed to the second target speed threshold, the impact level is determined to be the fourth level, wherein the second target speed threshold is less than the maximum speed.

[0036] Specifically, when determining the impact level of a temperature sensor on a server based on backup information and mapping relationships, if the backup information indicates that there is no corresponding backup temperature sensor, and if the temperature sensor fails, the cooling fan will operate at maximum speed, the impact level can be determined to be Level 1. In this case, the temperature sensor failure will cause the cooling fan to run directly at maximum speed to prevent damage from overheating. Furthermore, since there is no backup temperature sensor, the system's cooling is completely dependent on the normal operation of this sensor, resulting in the highest impact level, Level 1.

[0037] If the backup information indicates that a temperature sensor has a corresponding backup temperature sensor, and if both the primary and backup temperature sensors fail, the cooling fan will continue to operate at maximum speed, the impact level is determined to be Level 2. In this case, even though a backup temperature sensor exists, if both the primary and backup temperature sensors fail, the cooling fan will still need to operate at maximum speed. In this case, the system's cooling relies on the normal operation of both sensors, resulting in a higher impact level of Level 2.

[0038] If the backup information indicates that a temperature sensor has a corresponding backup temperature sensor, and if both the primary and backup temperature sensors fail, the cooling fan will increase its speed to the first target speed threshold, the impact level is determined to be Level 3. In this case, even if both the primary and backup temperature sensors fail, the cooling fan will not directly operate at maximum speed. Instead, it will increase its speed to the first target speed threshold (which is lower than the maximum speed). This indicates that the system has some cooling redundancy, but a higher speed is still required to ensure safety. Therefore, the impact level is Level 3.

[0039] If the backup information indicates that there is no corresponding backup temperature sensor for the temperature sensor, and if the temperature sensor fails, the cooling fan will increase its operating speed to the second target speed threshold, the impact level can be determined to be Level 4. In this case, although there is no backup temperature sensor, the cooling fan will only increase its operating speed to the second target speed threshold (less than the maximum speed) when the sensor fails. This indicates that the sensor has a relatively small impact on system cooling, and therefore its impact level is Level 4.

[0040] Suppose a server has four temperature sensors, labeled T1, T2, T3, and T4. Their backup information and mapping relationships are as follows: For T1, the backup information indicates that there is no backup temperature sensor. Mapping relationship: If T1 fails, the cooling fan runs at maximum speed, and the impact level is determined to be Level 1. For T2, the backup information indicates that there is a backup temperature sensor, T5. Mapping relationship: If both T2 and T5 fail, the cooling fan runs at maximum speed, and the impact level is determined to be Level 2. For T3, the backup information indicates that there is a backup temperature sensor, T6. Mapping relationship: If both T3 and T6 fail, the cooling fan increases to the first target speed threshold (for example, 80% of the maximum speed). The impact level is determined to be Level 3. For T4, the backup information indicates that there is no backup temperature sensor. Mapping relationship: If T4 fails, the cooling fan increases to the second target speed threshold (for example, 60% of the maximum speed). The impact level is determined to be Level 4.

[0041] Therefore, by dividing the impact levels in detail, we can accurately assess the impact of each temperature sensor on the server, providing a scientific basis for subsequent troubleshooting and cooling strategy adjustments.

[0042] According to one embodiment of the present application, the access period of the single board management controller to the temperature sensor is adjusted based on the impact level, including: when the impact level is the first level or the fourth level, keeping the access period of the single board management controller to the temperature sensor unchanged at the initial access period; when the impact level is the second level or the third level, adjusting the access period of the single board management controller to the temperature sensor based on the failure condition of the backup temperature sensor.

[0043] Specifically, when adjusting the access period of the BMC accessing the temperature sensor according to the impact level, the current impact level is determined. If the impact level is the first level or the fourth level, the access period of the BMC accessing the temperature sensor can be kept unchanged at the initial access period. That is, the sensor failure of the first level causes the cooling fan to run directly at the maximum speed, so it is necessary to frequently monitor its state to ensure system safety. Although the sensor of the fourth level has less impact on the cooling system, there is no backup temperature point, and its state still needs to be monitored regularly to avoid potential problems.

[0044] If the impact level is the second level or the third level, the access period of the BMC accessing the temperature sensor can be adjusted according to the failure condition of the backup temperature sensor. For example, if the backup temperature sensor is working normally, the access period can be appropriately extended to reduce the access frequency of the BMC to save system resources. If the backup temperature sensor also fails, the access period is kept unchanged or shortened to ensure that problems can be discovered and handled in a timely manner. In this way, the access period of the BMC accessing the temperature sensor can be dynamically adjusted based on the impact level of the temperature sensor and the backup information. This method not only improves the access efficiency of the system, but also optimizes the cooling control strategy to ensure that the server can run stably under various conditions. At the same time, by reasonably adjusting the access period, system resources can be saved and the overall performance of the system can be improved.

[0045] According to one embodiment of the present application, adjusting the access period of the BMC accessing the temperature sensor based on the failure condition of the backup temperature sensor includes: in the case where the backup temperature sensor is fault-free, closing the access of the BMC to the temperature sensor; in the case where there are multiple backup temperature sensors and all of the multiple backup temperature sensors fail, determining one of the multiple backup temperature sensors as a target backup temperature sensor, and keeping the access period of the BMC accessing the target temperature sensor unchanged at the initial access period, and closing the access of the BMC to temperature sensors other than the target backup temperature sensor.

[0046] Specifically, when adjusting the access period of the BMC accessing the temperature sensor according to the failure condition of the backup temperature sensor, if the backup temperature sensor is fault-free, the BMC can be closed to the original temperature sensor. That is, in this case, the backup temperature sensor can completely replace the function of the original sensor, so there is no need to access the original sensor, thereby saving system resources and reducing access load.

[0047] In the case of all backup temperature sensors failing, one of the backup temperature sensors is selected as a target backup temperature sensor. The access period of the BMC to the target backup temperature sensor is kept unchanged from the initial access period, and the BMC is closed to access other temperature sensors except the target backup temperature sensor. That is, in this case, although all backup temperature sensors fail, one target backup temperature sensor is selected for monitoring, which can ensure that the system can still obtain the necessary temperature data, while reducing access to other failed sensors and saving resources.

[0048] Suppose there are 4 temperature sensors in the server, labeled as T1, T2, T3 and T4, and their backup information is as follows: T1: Backup temperature sensor: T5, failure condition: T5 is not faulty, the access strategy can be determined as: close the BMC access to T1, and only access T5. T2: Backup temperature sensors: T6, T7, failure condition: T6 and T7 all fail, the access strategy can be determined as selecting T6 as the target backup temperature sensor, keeping the access period of the BMC to T6 unchanged from the initial access period (e.g. access once every second). Close the BMC access to T7. T3: Backup temperature sensor: T8, failure condition: T8 is not faulty, the access strategy can be determined as: close the BMC access to T3, and only access T8. T4: Backup temperature sensors: T9, T10, failure condition: T9 and T10 all fail, the access strategy can be determined as: select T9 as the target backup temperature sensor, keep the access period of the BMC to T9 unchanged from the initial access period (e.g. access once every second), and close the BMC access to T10.

[0049] Thus, by the above steps, the access period of the BMC to access the temperature sensor can be dynamically adjusted based on the failure condition of the backup temperature sensor. This method not only saves system resources, but also optimizes the access strategy, ensuring that the status of the temperature sensor can be effectively monitored in various situations, improving the overall performance and reliability of the system.

[0050] According to an embodiment of the present application, the temperature sensor failure processing method further comprises: after a preset time, re-determining one backup temperature sensor in the plurality of backup temperature sensors as a target backup temperature sensor, and keeping the access period of the single board management controller to the target temperature sensor unchanged from the initial access period, closing the single board management controller to access temperature sensors other than the target backup temperature sensor, until each backup temperature sensor in the plurality of backup temperature sensors is selected as a target backup temperature sensor during the failure of all backup temperature sensors. Wherein, the preset time can be determined according to actual conditions.

[0051] Specifically, in the server, the fault handling method of the temperature sensor not only needs to deal with the current fault situation, but also needs to consider the long-term stability and reliability. Therefore, in addition to selecting a target backup temperature sensor for monitoring when all the backup temperature sensors fail, the target backup temperature sensor also needs to be periodically re-evaluated and selected. That is, after a preset time (for example, every 10 minutes, every hour, or a time interval set according to actual needs), the status of the multiple backup temperature sensors is re-evaluated. One of the multiple backup temperature sensors can be re-selected as a target backup temperature sensor, the access period of the BMC to the newly selected target backup temperature sensor is kept unchanged from the initial access period, and the BMC is closed to access other backup temperature sensors except the newly selected target backup temperature sensor, until each backup temperature sensor is at least once as a target backup temperature sensor during the failure of all the backup temperature sensors.

[0052] Suppose there are 4 temperature sensors in the server, marked as T1, T2, T3 and T4, and their backup information is as follows: T1: backup temperature sensor: T5, fault condition: T5 is not faulty, access strategy: close the BMC access to T1, and only access T5. T2: backup temperature sensors: T6, T7, fault condition: T6 and T7 are all faulty, access strategy: initially select T6 as the target backup temperature sensor. Keep the access period of the BMC to T6 unchanged from the initial access period (for example, access once every second). Close the BMC access to T7. Re-evaluate every 10 minutes and select T7 as the target backup temperature sensor. Keep the access period of the BMC to T7 unchanged from the initial access period. Close the BMC access to T6. In this way, T6 and T7 are at least once as a target backup temperature sensor. T3: backup temperature sensor: T8, fault condition: T8 is not faulty, access strategy: close the BMC access to T3, and only access T8. T4: backup temperature sensors: T9, T10, fault condition: T9 and T10 are all faulty, access strategy: initially select T9 as the target backup temperature sensor. Keep the access period of the BMC to T9 unchanged from the initial access period (for example, access once every second). Close the BMC access to T10. Re-evaluate every 10 minutes and select T10 as the target backup temperature sensor, keep the access period of the BMC to T10 unchanged from the initial access period, and close the BMC access to T9. In this way, T9 and T10 are at least once as a target backup temperature sensor.

[0053] Therefore, the access period of the BMC accessing the temperature sensor can be dynamically adjusted based on the failure condition of the backup temperature sensor. This method not only saves system resources, but also optimizes the access strategy, ensures that the status of the temperature sensor can be effectively monitored in various conditions, improves the overall performance and reliability of the system, and further enhances the stability and reliability of the system by periodically re-evaluating and selecting the target backup temperature sensor.

[0054] According to an embodiment of the present application, the temperature sensor failure processing method further comprises: after the plurality of backup temperature sensors recover normally, the access period of the single board management controller accessing the backup temperature sensor is the initial access period.

[0055] Specifically, in the server, when the plurality of backup temperature sensors recover normally, the normal access strategy to these sensors needs to be restored. This step is an important part of the temperature sensor failure processing method, which ensures that the system can effectively monitor the temperature data after the sensors recover normally. That is, the state of each backup temperature sensor can be detected periodically by the BMC to determine whether they have recovered normally, which can be achieved by reading temperature data, checking communication status, etc. When all backup temperature sensors are detected to have recovered normally, the BMC restores the access period to the initial access period, re-enables access to all backup temperature sensors, and ensures that the system can comprehensively monitor temperature data.

[0056] For example, the BMC periodically (e.g., once per second) obtains temperature data from each backup temperature sensor, checks whether the obtained data is valid and the communication is normal, and if valid data is successfully obtained continuously for multiple times (e.g., 3 times), it is considered that the backup temperature sensor has recovered normally. When all backup temperature sensors have recovered normally, the BMC restores the access period to the initial access period, re-enables access to all backup temperature sensors, and ensures that the system can comprehensively monitor temperature data. Therefore, the access period of the BMC accessing the temperature sensor can be dynamically adjusted based on the recovery condition of the backup temperature sensor. This method not only improves the reliability of the system, but also optimizes resource utilization, ensures that temperature data can be comprehensively monitored after the sensors recover normally, and improves the overall performance and stability of the system. By timely restoring the access strategy, the system can quickly recover to the normal operating state after the sensors recover normally, reducing false positives and false operations caused by sensor failure.

[0057] According to an embodiment of the present application, each channel of the bus switch is connected to a temperature sensor, and the temperature sensor failure processing method further comprises: controlling the single board management controller to access the temperature sensor based on the bus switch.

[0058] Specifically, as Figure 2As shown, each channel of the bus switch (I2C-SWITCH) is individually connected to a temperature sensor, allowing the BMC (i.e. Figure 2 the BMC chip in the BMC) to selectively access specific temperature sensors through the bus switch. Through the bus switch, the BMC can flexibly control access to individual temperature sensors, reducing communication conflicts and improving communication efficiency.

[0059] That is, under normal circumstances, the BMC periodically accesses all temperature sensors through the bus switch to obtain temperature data. If a temperature sensor fails, the BMC stops accessing the sensor through the bus switch to avoid unnecessary communication attempts. If there is a backup temperature sensor, the BMC switches to the backup temperature sensor through the bus switch to continue obtaining temperature data. When the faulty sensor recovers, the BMC re-enables access to the sensor through the bus switch.

[0060] It should be noted that in Figure 2 , the RST (Reset) pin is the reset signal or reset pin. It is used to initialize or reset circuits, microcontrollers, chips or other digital components to a known initial state. The reset can be a power-on reset (occurring when the device is powered on) or a manual reset (triggered by pressing a button or sending a control signal). The Rst pin is connected to the I2C-SWITCH and individual temperature sensors. At system startup, the I2C-SWITCH can be reset to ensure it is in a known state and ready for communication. If a temperature sensor fails or needs to be resynchronized, the sensor can be reset through the reset pin to restore normal operation.

[0061] Thus, by using the bus switch to control the BMC's access to the temperature sensors, the flexibility and reliability of the system can be effectively improved. In the event of a temperature sensor failure, the backup temperature sensor can be quickly switched to through the bus switch to ensure that the system can continuously monitor temperature data. After the faulty sensor recovers, the access strategy is restored in a timely manner to ensure that system resources are used reasonably and the overall performance and stability of the system are improved. This method not only improves the reliability of the system, but also optimizes resource utilization to ensure that the status of the temperature sensors can be effectively monitored under various conditions.

[0062] According to an embodiment of the present application, the temperature sensor fault handling method further comprises: determining a target handling mode based on the impact level when the temperature sensor fails.

[0063] Specifically, if a temperature sensor fails, the temperature of the corresponding monitoring point cannot be read, and the single board where the temperature sensor is located needs to be replaced. Storage devices carry the customer's data access business, and replacing a single board may cause business degradation. The replacement of important components requires suspending business before resuming business, which brings great inconvenience to customers. Currently, after the BMC reports a temperature sensor failure alarm, the single board where this sensor is located will be required to be replaced by the customer, which will affect the customer's business. However, subsequent technical analysis shows that this temperature sensor has little effect on the heat dissipation of the entire system. This is equivalent to the fact that the failure of this sensor has not reached the level of affecting the customer's business, and there is no value in replacing the single board. For the entire system, it is equivalent to a false alarm. For this reason, in the server of the present application, the target processing method for temperature sensor failure can also be determined based on the impact level. This method can take different processing measures according to sensor failures of different impact levels to ensure the stability and reliability of the system.

[0064] For example, for an impact level of level one, the fault can be reported immediately, and the system can be operated at maximum speed to ensure system safety. For an impact level of level two, the fault can be reported, the system can be switched to the backup temperature sensor, and the system can be operated at maximum speed. For an impact level of level three, the fault can be recorded, the system can be switched to the backup temperature sensor, and the system can be operated at the first target speed threshold. For an impact level of level four, the fault can be recorded, the system can be operated at the second target speed threshold without switching to the backup temperature sensor. Therefore, by determining the target handling method for temperature sensor failures based on the impact level, the reliability and stability of the server can be effectively improved. This method adopts different handling measures according to different impact levels, ensuring that the system can adopt the most appropriate response strategy for various fault situations. Through reasonable fault handling methods, not only is the system reliability improved, but resource utilization is also optimized, ensuring that the system can operate efficiently without affecting system safety.

[0065] Further, according to an embodiment of the present application, the target processing method when the temperature sensor fails is determined based on the impact level, including: when the impact level is the first level, reporting the temperature sensor failure; when the impact level is the second level, determining the target processing method based on the failure condition of the backup temperature sensor; when the impact level is the third level, determining the target processing method based on the failure condition of the backup temperature sensor and the speed of the cooling fan; when the impact level is the fourth level, recording the temperature sensor failure.

[0066] Specifically, when determining the target response to a temperature sensor failure based on the impact level, the current impact level is evaluated. For impact level 1, the temperature sensor failure can be directly reported. This means that a level 1 sensor failure has the greatest impact on system cooling, and therefore requires immediate reporting so that emergency measures can be taken. For impact level 2, the target response can be determined based on the failure status of the backup temperature sensor. This means that a level 2 sensor has a backup, but different response measures must still be taken based on the backup temperature sensor's status. For impact level 3, the target response can be determined based on the backup temperature sensor's failure status and the cooling fan speed. This means that a level 3 sensor has a backup, and the cooling fan speed will be increased to a lower target speed threshold when a failure occurs. The response must comprehensively consider the backup temperature sensor's status and the current fan speed. For impact level 4, only the temperature sensor failure needs to be recorded. This means that a level 4 sensor has a minimal impact on system cooling, and therefore, only the failure information needs to be recorded, without requiring immediate reporting or emergency measures.

[0067] For example, a server has four temperature sensors, labeled T1, T2, T3, and T4. Their backup information and impact levels are as follows: T1: Backup Information: No backup temperature sensor, Impact Level: Level 1. The target action is to immediately report the fault and run the cooling fan at maximum speed. T2: Backup Information: A backup temperature sensor T6 is present, Impact Level: Level 2. The target action is to monitor the status of backup temperature sensor T6. If T6 is normal, the fault is switched to T6, but the fault is not reported. If T6 is also faulty, the fault is reported and the cooling fan speed is increased to the maximum speed. T3: Backup Information: A backup temperature sensor T7 is present, Impact Level: Level 3. The target action is to monitor the status of backup temperature sensor T7. If T7 is normal, the fault is switched to T7, but the fault is not reported. If T7 is also faulty, the fault is recorded and the cooling fan speed is increased to the first target speed threshold (for example, 80% of the maximum speed). T4: Backup Information: No backup temperature sensor, Impact Level: Level 4. The target action is to record the fault and take no other measures.

[0068] Therefore, by determining the targeted handling method for temperature sensor failures based on the impact level, server reliability and stability can be effectively improved. This approach adopts different handling measures according to the impact level, ensuring that the system adopts the most appropriate response strategy for various failure scenarios. This rational fault handling method not only improves system reliability but also optimizes resource utilization, ensuring efficient system operation without compromising system security.

[0069] According to one embodiment of the present application, a target processing method is determined based on the fault condition of the backup temperature sensor, including: reporting the temperature sensor fault when all backup temperature sensors fail; and recording the temperature sensor fault when some backup temperature sensors fail.

[0070] Specifically, when determining the target processing method based on the failure status of the backup temperature sensors, the current fault situation is judged. If all backup temperature sensors fail, the temperature sensor failure can be reported. In other words, if all backup temperature sensors fail, the system cannot obtain reliable temperature data through the backup temperature sensors, so the failure needs to be reported immediately so that emergency measures can be taken, such as increasing the speed of the cooling fan to ensure that the system is not damaged by overheating. If there is a partial failure of the backup temperature sensors, the temperature sensor failure can be recorded. In other words, if some backup temperature sensors fail, but there are still other backup temperature sensors that can provide reliable temperature data, the system can continue to monitor the temperature, so only the fault information needs to be recorded and no immediate reporting is required. This can avoid unnecessary alarms and reduce the workload of operation and maintenance personnel.

[0071] Suppose a server has four temperature sensors, labeled T1, T2, T3, and T4. Their backup information is as follows: T2: Backup temperature sensors: T6 and T7. Failure: T6 is faulty, but T7 is normal. The target action is to record the failure of temperature sensor T2 and continue to use backup temperature sensor T7 to obtain temperature data. The cooling fan speed can also be appropriately increased to a lower threshold to ensure system operation within a safe range. T4: Backup temperature sensors: T9 and T10. Failure: T9 is faulty, but T10 is faulty. The target action is to report the failure of temperature sensor T4 and increase the cooling fan speed to its maximum to prevent system damage due to overheating.

[0072] Therefore, by determining targeted handling methods based on backup temperature sensor failure conditions, server reliability and stability can be effectively improved. This approach implements different handling measures based on the specific backup temperature sensor failure conditions, ensuring that the system can adopt the most appropriate response strategy for each failure scenario. This rational fault handling method not only improves system reliability but also optimizes resource utilization, ensuring efficient system operation without compromising system security. Furthermore, this approach reduces unnecessary alerts and improves operational efficiency.

[0073] According to one embodiment of the present application, the target processing mode is determined based on the failure condition of the backup temperature sensor and the rotation speed of the cooling fan, including: in the case of partial failure of the backup temperature sensor, recording the temperature sensor failure; in the case of total failure of the backup temperature sensor, obtaining the corresponding fan speed value determined based on the backup temperature sensor in the last fan speed adjustment period, and obtaining the actual fan speed value at the end of the last fan speed adjustment period; and determining the target processing mode based on the fan speed value and the actual fan speed value.

[0074] Further, according to one embodiment of the present application, the target processing mode is determined based on the fan speed value and the actual fan speed value, including: in the case of the fan speed value being less than the actual fan speed value, recording the temperature sensor failure; and in the case of the fan speed value being greater than or equal to the actual fan speed value, reporting the temperature sensor failure.

[0075] Specifically, when determining the target processing mode based on the failure condition of the backup temperature sensor and the rotation speed of the cooling fan, if there is partial failure of the backup temperature sensor, the temperature sensor failure can be recorded, that is, if some of the backup temperature sensors fail, but other backup temperature sensors can still provide reliable temperature data, the system can continue to monitor the temperature, so only the failure information needs to be recorded, and it is not necessary to report immediately. This can avoid unnecessary alarms and reduce the workload of the operation and maintenance personnel. If all the backup temperature sensors fail, the corresponding fan speed value determined based on the backup temperature sensor in the last fan speed adjustment period can be obtained, and the actual fan speed value at the end of the last fan speed adjustment period can be obtained. For example, the fan speed value determined based on the backup temperature sensor in the last fan speed adjustment period can be obtained from the record of the BMC, and the actual fan speed value at the end of the last fan speed adjustment period can be obtained from the record of the BMC.

[0076] After obtaining the fan speed value and the actual fan speed value, the target processing mode can be determined according to the fan speed value and the actual fan speed value. That is, the size relationship between the current fan speed value and the actual fan speed value is judged, in the case of the fan speed value being less than the actual fan speed value, the temperature sensor failure can be recorded, that is, at this time it is indicated that this temperature sensor is not the key temperature value in the last fan speed adjustment, and even if it fails, it will not trigger the fan full speed, so the failure state can not be reported. In the case of the fan speed value being greater than or equal to the actual fan speed value, the temperature sensor failure can be reported, indicating that the current cooling capacity may not be sufficient to meet the system demand, and the failure of the failed temperature sensor may affect the system cooling. Therefore, the failure needs to be reported immediately in order to take emergency measures, such as increasing the rotation speed of the cooling fan, to ensure that the system will not be damaged due to overheating.

[0077] For example, suppose there are 4 temperature sensors in the server, marked as T1, T2, T3 and T4, and their backup information is as follows: T3: Backup temperature sensors: T7, T8, fault condition: T7 fails, T8 is normal, it can be determined that the target processing method is to record the failure of temperature sensor T3, and continue to use the backup temperature sensor T8 to obtain temperature data. If necessary, appropriately increase the speed of the cooling fan to a lower threshold to ensure that the system operates within a safe range. T4: Backup temperature sensors: T9, T10, fault condition: T9 fails, T10 fails, it can be determined that the target processing method is to record the failure of temperature sensor T4, and obtain the fan speed value PWM_last determined based on the backup temperature sensor in the last fan speed adjustment cycle, obtain the actual fan speed value PWM_max at the end of the last fan speed adjustment cycle, compare PWM_last and PWM_max, if PWM_last<PWM_max,记录故障,保持当前风扇转速不变。如果PWM_last> =PWM_max, report a fault and increase the cooling fan speed to PWM_last.

[0078] Therefore, by determining the target handling method based on the fan speed value and the actual fan speed value, the reliability and stability of the server can be effectively improved. This method adopts different handling measures according to the different backup temperature sensor failure conditions and the current cooling status, ensuring that the system adopts the most appropriate response strategy in various failure scenarios. This reasonable fault handling method not only improves system reliability but also optimizes resource utilization, ensuring efficient system operation without compromising system security. At the same time, this method can reduce unnecessary alerts and improve operation and maintenance efficiency.

[0079] In addition, in one embodiment of the present application, when determining the corresponding fan speed value based on the backup temperature sensor, the fan speed value can be determined through a pre-set correspondence. For example, the relationship between the temperature obtained by the backup temperature sensor and the fan speed value can be pre-determined. After the temperature is determined, the fan speed value can be directly obtained by directly calling the correspondence. Furthermore, if a temperature reading fails during the sensor reading process, clock signal repair (timing error repair) and chip reset repair (internal chip logic failure) can also be performed.

[0080] The following combination Figure 3 To describe the method of this application.

[0081] As a specific example, the temperature sensor fault handling method of the present application may include the following steps:

[0082] S101 , at a target location in a server, obtaining temperature information corresponding to a plurality of temperature sensors at the target location, and determining whether each temperature sensor is faulty based on the plurality of temperature information.

[0083] S102, in a case where it is determined that there is a temperature sensor failure, backup information of the temperature sensor is acquired, and a mapping relationship when the temperature sensor regulates the rotating speed of the cooling fan is acquired.

[0084] S103, an influence level of the temperature sensor on the server is determined based on the backup information and the mapping relationship.

[0085] S104, it is judged whether the influence level is a first level or a fourth level. If yes, step S105 is executed; if no, step S106 is executed.

[0086] S105, an access period of the single board management controller accessing the temperature sensor is kept unchanged as an initial access period.

[0087] S106, it is judged whether the influence level is a second level or a third level. If yes, step S107 is executed; if no, step S101 is executed.

[0088] S107, it is judged whether the backup temperature sensor is fault-free. If yes, step S108 is executed, if no; step S109 is executed.

[0089] S108, the access of the single board management controller to the temperature sensor is closed.

[0090] S109, a backup temperature sensor is determined as a target backup temperature sensor, an access period of the single board management controller accessing the target temperature sensor is kept unchanged as an initial access period, and the access of the single board management controller to temperature sensors other than the target backup temperature sensor is closed.

[0091] In summary, according to the temperature sensor failure processing method of the embodiments of the present application, at a target position in a server, temperature information corresponding to a plurality of temperature sensors at the target position is acquired, and it is determined whether each temperature sensor is faulty based on the plurality of temperature information. In a case where it is determined that there is a temperature sensor failure, backup information of the temperature sensor is acquired, and a mapping relationship when the temperature sensor regulates the rotating speed of the cooling fan is acquired. An influence level of the temperature sensor on the server is determined based on the backup information and the mapping relationship, and an access period of the single board management controller accessing the temperature sensor is adjusted based on the influence level. Thus, the method can improve the running efficiency of the single board management controller and improve the sensitivity of fan speed regulation to the temperature sensor.

[0092] Corresponding to the above-mentioned embodiments, the present application also proposes a computer program product.

[0093] The computer program product of the embodiments of the present application includes computer programs / instructions, which are executed by a processor to implement the above-mentioned temperature sensor failure processing method.

[0094] According to the computer program product of the embodiment of the present application, by executing the temperature sensor fault processing method described above, the running efficiency of the single board management controller can be improved and the sensitivity of the fan speed to the temperature sensor can be improved.

[0095] Corresponding to the above-mentioned embodiments, the present application also provides a non-volatile computer readable storage medium.

[0096] The non-volatile computer readable storage medium of the embodiment of the present application has a program stored thereon, and the program is executed by the processor to implement the temperature sensor fault processing method described above.

[0097] According to the non-volatile computer readable storage medium of the embodiment of the present application, by executing the temperature sensor fault processing method described above, the running efficiency of the single board management controller can be improved and the sensitivity of the fan speed to the temperature sensor can be improved.

[0098] Corresponding to the above-mentioned embodiments, the present application also provides an electronic device.

[0099] As shown in Figure 4 The electronic device 200 of the embodiment of the present application can include a memory 210, a processor 220, and a program stored on the memory 210 and executable on the processor 220, and when the processor 220 executes the program, the temperature sensor fault processing method described above is implemented.

[0100] According to the electronic device of the embodiment of the present application, by executing the temperature sensor fault processing method described above, the running efficiency of the single board management controller can be improved and the sensitivity of the fan speed to the temperature sensor can be improved.

[0101] It is to be appreciated that the above description and the examples that follow are intended to be illustrative only and that changes can be made to the description, either functionally or chronologically, as well as changes being made concerning the order of implementation. The logic and / or steps represented in the flow diagrams and / or described herein can be considered as a sequence of executable instructions, and can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, processor-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. For purposes of this specification, a "computer-readable medium" can be any apparatus that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. The computer-readable medium can be, for example, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system (or apparatus) or a propagation medium. More specific examples (a non-exhaustive list) of the computer-readable medium include the following: an electrical connection (electronic) having one or more wires, a portable computer diskette (magnetic), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber (optical), and a portable compact disc read-only memory (CDROM). Note that the computer-readable medium can even be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, for example via the optical scanner of a device or device or via an intermediary, such as a facility bureau, then compiled, interpreted, or otherwise processed in a suitable manner, if necessary, and then stored in a computer storage medium.

[0102] It is to be understood that the various parts of the present application can be implemented in hardware, software, firmware or a combination thereof. In the above embodiments, various steps or methods can be implemented in software or firmware that is stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, implementation can be with any or a combination of the following technologies, which are all well-known in the art: a discrete logic circuit(s) having logic gates for implementing logic functions upon an application of data signals, an application specific integrated circuit having appropriate combinational logic gates, a programmable gate array(s) (PGA), a field programmable gate array (FPGA), etc.

[0103] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific feature, structure, material or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. Descriptive expressions of the above terms in the present specification do not necessarily refer to the same embodiment or example. Also, the specific feature, structure, material or characteristic described can be combined in any one or more embodiments or examples in an appropriate manner.

[0104] In addition, the terms "first", "second", etc. are used only for the purpose of description, and should not be understood as indicating or implying relative importance or implying a number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly and specifically limited.

[0105] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0106] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A method for handling temperature sensor failure, characterized in that: The method is applied in a server, the server including a bus switch, a single board management controller, multiple temperature sensors, and multiple cooling fans, the single board management controller being connected to the multiple temperature sensors via the bus switch, and the method including: At a target location in the server, acquiring temperature information corresponding to a plurality of the temperature sensors at the target location, and determining whether each of the temperature sensors is faulty based on the plurality of temperature information; When it is determined that the temperature sensor fails, obtaining backup information of the temperature sensor and obtaining a mapping relationship between the temperature sensor and the speed control of the cooling fan; determining an impact level of the temperature sensor on the server based on the backup information and the mapping relationship; Adjusting an access period of the board management controller to the temperature sensor based on the impact level, wherein determining the impact level of the temperature sensor on the server based on the backup information and the mapping relationship includes: When the backup information indicates that the temperature sensor has no corresponding backup temperature sensor, and if the temperature sensor fails, the cooling fan runs at a maximum speed, determining that the impact level is the first level; If the backup information indicates that the temperature sensor has a corresponding backup temperature sensor, and if both the temperature sensor and the backup temperature sensor fail, the cooling fan operates at a maximum speed, determining that the impact level is the second level; The impact level is determined to be the third level if the backup information indicates that the temperature sensor has a corresponding backup temperature sensor, and if both the temperature sensor and the backup temperature sensor fail, the cooling fan increases its operating speed to a first target speed threshold, wherein the first target speed threshold is less than the maximum speed; When the backup information indicates that the temperature sensor has no corresponding backup temperature sensor, and if the temperature sensor fails, the cooling fan increases the operating speed to the second target speed threshold, the impact level is determined to be the fourth level, wherein the second target speed threshold is less than the maximum speed.

2. The temperature sensor fault processing method according to claim 1, characterized in that: The adjusting, based on the impact level, an access period of the board management controller to the temperature sensor includes: When the impact level is the first level or the fourth level, maintaining the access period of the board management controller to the temperature sensor at the initial access period; When the impact level is the second level or the third level, an access period of the board management controller to the temperature sensor is adjusted based on the fault condition of the backup temperature sensor.

3. The temperature sensor fault processing method according to claim 2, characterized in that: The adjusting, based on a fault condition of the backup temperature sensor, an access cycle of the board management controller to the temperature sensor includes: When the backup temperature sensor is not faulty, shutting down the board management controller's access to the temperature sensor; In the case that there are multiple backup temperature sensors and all of the backup temperature sensors fail, one backup temperature sensor is determined from the multiple backup temperature sensors as the target backup temperature sensor, and the access cycle of the single board management controller to the target backup temperature sensor is kept unchanged at the initial access cycle, and the access of the single board management controller to the temperature sensors other than the target backup temperature sensor is closed.

4. The temperature sensor fault processing method according to claim 3, characterized in that: The method further comprises: After a preset time, a backup temperature sensor is re-determined from the multiple backup temperature sensors as the target backup temperature sensor, and the access period of the single board management controller to the target backup temperature sensor is kept unchanged at the initial access period, and the access of the single board management controller to the temperature sensors other than the target backup temperature sensor is closed until all the backup temperature sensors fail, and each of the multiple backup temperature sensors is used as the target backup temperature sensor.

5. The temperature sensor fault processing method according to claim 4, characterized in that: The method further comprises: After the plurality of backup temperature sensors return to normal, the access period of the board management controller to the backup temperature sensors is controlled to be an initial access period.

6. The temperature sensor fault handling method according to any one of claims 2 to 5, characterized in that: Each channel of the bus switch is individually connected to the temperature sensor, and the method further includes: The access of the board management controller to the temperature sensor is controlled based on the bus switch.

7. The temperature sensor fault processing method according to claim 1, characterized in that: The method further comprises: A target processing method when the temperature sensor fails is determined based on the impact level.

8. The temperature sensor fault processing method according to claim 7, characterized in that: The determining, based on the impact level, a target processing method when the temperature sensor fails, includes: When the impact level is the first level, reporting a temperature sensor failure; When the impact level is the second level, determining a target processing method based on the fault condition of the backup temperature sensor; When the impact level is the third level, determining a target processing method based on the fault condition of the backup temperature sensor and the rotation speed of the cooling fan; When the impact level is the fourth level, a temperature sensor failure is recorded.

9. The temperature sensor fault processing method according to claim 8, characterized in that: The determining of a target processing method based on the fault condition of the backup temperature sensor includes: In the event that all backup temperature sensors fail, reporting a temperature sensor failure; In the event that there is a partial failure of the backup temperature sensor, a temperature sensing failure is recorded.

10. The temperature sensor fault processing method according to claim 8, characterized in that: The determining of a target processing method based on the fault condition of the backup temperature sensor and the rotation speed of the cooling fan includes: In the event that a partial failure occurs in the backup temperature sensor, recording the temperature sensor failure; In the event that all of the backup temperature sensors fail, obtaining the corresponding fan speed value determined based on the backup temperature sensors in the last fan speed adjustment cycle, and obtaining the actual fan speed value at the end of the last fan speed adjustment cycle; The target processing mode is determined based on the fan speed value and the actual fan speed value.

11. The temperature sensor fault processing method according to claim 10, characterized in that: The determining the target processing mode based on the fan speed value and the actual fan speed value includes: When the fan speed value is less than the actual fan speed value, a temperature sensor failure is recorded; When the fan speed value is greater than or equal to the actual fan speed value, a temperature sensor failure is reported.

12. A computer program product comprising a computer program / instructions, characterized in that When the computer program / instruction is executed by a processor, the temperature sensor fault processing method according to any one of claims 1 to 11 is implemented.

13. A non-volatile computer-readable storage medium, characterized in that: A program is stored thereon, and when the program is executed by a processor, the temperature sensor fault processing method according to any one of claims 1 to 11 is implemented.

14. An electronic device, characterized in that: include: A memory, a processor, and a program stored in the memory and executable on the processor, wherein when the processor executes the program, the temperature sensor fault processing method according to any one of claims 1 to 11 is implemented.

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