SMD (Surface Mount Device) packaging film as well as preparation method and application thereof

Abstract

The invention provides a patch type packaging film and a preparation method and application thereof, and belongs to the technical field of packaging materials. According to the invention, the flexible metal foil is used as the substrate of the packaging film, so that the packaging film has good mechanical strength and weather resistance; the extremely low water and oxygen permeability of the high polymer material is utilized, so that the water and oxygen permeability of the packaging film is reduced, and the packaging effect is improved; the water-absorbing particles are added in the high-molecular sealing layer, so that water molecules penetrating through the metal foil are absorbed, and the water-blocking performance is improved; and the liquid drying agent layer is arranged to adsorb water and oxygen dissociating on the surface of the organic electronic device, so that the protection effect on the organic electronic device is further improved. The result of the embodiment shows that the attenuation of the patch type packaging film organic electronic device provided by the invention is lower than 30% in 600 hours.

Description

Technical Field

[0001] The present invention belongs to the technical field of packaging materials, and in particular relates to a patch-type packaging film and a preparation method and application thereof. Background Art

[0002] In recent years, organic electronic devices, such as organic light-emitting diodes, organic solar cells, and organic thin-film transistors, have been applied in various fields due to their low cost, high efficiency, and flexibility. However, due to their sensitivity to water and oxygen in the air, these substances can adversely affect the lifespan and performance of these devices.

[0003] Effective encapsulation can reduce the corrosion of water and oxygen on devices, maintain their structure and performance, enhance their reliability, and extend their service life. In some special application scenarios, such as outdoor lighting and underwater displays, encapsulated electronic devices can function normally in harsh environmental conditions, thereby expanding their application range and meeting different needs.

[0004] The flexible lamination packaging method of thin metal foil has good practicality, can achieve large-area flexible packaging and waterproof packaging, and has good weather resistance, but it still has shortcomings in terms of resistance to water and oxygen corrosion, and has limited effect on improving the service life of organic electronic devices. Summary of the Invention

[0005] The present invention aims to provide a patch-type packaging film and its preparation method and application. The patch-type packaging film provided by the present invention has good water and oxygen barrier effects and can extend the service life of organic electronic devices.

[0006] In order to achieve the above-mentioned object of the invention, the present invention provides the following technical solutions:

[0007] The present invention provides a patch-type packaging film, comprising a metal foil and a polymer sealing layer and a liquid desiccant layer sequentially arranged on one side of the metal foil; the material of the polymer sealing layer comprises water-absorbing particles and a polymer material; the polymer material comprises polyisobutylene, butyl rubber or epoxy resin.

[0008] Preferably, the water-absorbing particles include calcium oxide, aluminum oxide, zeolite, silicon dioxide, calcium chloride or calcium carbonate.

[0009] Preferably, the mass ratio of the water-absorbing particles to the polymer material in the polymer sealing layer is (1-100):(1-100).

[0010] Preferably, the thickness of the polymer sealing layer is 100 to 5000 nm.

[0011] Preferably, the thickness of the liquid desiccant layer is 10 to 550 nm.

[0012] Preferably, the material of the liquid desiccant layer includes water-absorbing particles and silicone oil.

[0013] Preferably, the silicone oil includes methyl silicone oil, phenyl silicone oil or fluorine-containing silicone oil.

[0014] Preferably, the thickness of the metal foil is 5 to 500 μm.

[0015] The present invention also provides a method for preparing the patch-type packaging film described in the above technical solution, comprising: mixing water-absorbing particles with a polymer material and coating the mixture on one side of a metal foil to obtain a metal foil-polymer sealing layer complex; and coating a liquid desiccant on the surface of the polymer sealing layer of the metal foil-polymer sealing layer complex to obtain a patch-type packaging film.

[0016] The present invention also provides the use of the patch-type packaging film described in the above technical solution or the patch-type packaging film prepared by the preparation method described in the above technical solution in the packaging of organic electronic devices. When the organic electronic device is packaged, the liquid desiccant layer in the patch-type packaging film faces the organic electronic device.

[0017] The present invention provides a patch-type packaging film comprising a metal foil, and a polymer sealing layer and a liquid desiccant layer sequentially arranged on one side of the metal foil; the polymer sealing layer is made of water-absorbing particles and a polymer material; the polymer material comprises polyisobutylene, butyl rubber, or epoxy resin. The present invention utilizes a flexible metal foil as the substrate for the packaging film, which has good mechanical strength and weather resistance; utilizes the extremely low water and oxygen permeability of a specific polymer material to reduce the water and oxygen permeability of the packaging film, thereby improving the packaging effect; by adding water-absorbing particles to the polymer sealing layer, water molecules that have penetrated the metal foil are absorbed, thereby improving the water barrier performance; and by providing a liquid desiccant layer to adsorb water and oxygen free on the surface of organic electronic devices, the protective effect of the organic electronic devices is further improved. The results of the examples show that the attenuation of organic electronic devices using the patch-type packaging film provided by the present invention is less than 30% after 600 hours. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the SMD package after thin film packaging provided in Example 1 of the present invention;

[0019] Figure 2 The time-performance curves of organic light-emitting diodes encapsulated using the patch-type encapsulation films provided in Example 1 and Comparative Examples 1 to 4 of the present invention;

[0020] Figure 3The time-performance curves of organic light-emitting diodes encapsulated using the surface-mount encapsulation films provided in Examples 2 to 5 of the present invention;

[0021] Figure 4 The time-performance curves of organic light-emitting diodes encapsulated using the surface-mount encapsulation films provided in Examples 6 to 9 of the present invention;

[0022] Figure 5 The time-performance curves of organic light-emitting diodes encapsulated using the patch-type encapsulation films provided in Example 10 and Comparative Examples 5 to 8 of the present invention;

[0023] Figure 6 The time-performance curves of organic light-emitting diodes encapsulated using the surface-mount encapsulation films provided in Examples 11 to 14 of the present invention;

[0024] Figure 7 The time-performance curves of organic light-emitting diodes encapsulated using the surface-mount encapsulation films provided in Examples 15 to 18 of the present invention;

[0025] Figure 8 The time-performance curves of organic light-emitting diodes encapsulated using the patch-type encapsulation films provided in Example 19 of the present invention and Comparative Examples 9 to 12;

[0026] Figure 9 The time-performance curves of organic light-emitting diodes encapsulated using the patch-type encapsulation films provided in Examples 20 to 23 of the present invention;

[0027] Figure 10 The time-performance curves after encapsulating an organic light-emitting diode using the patch-type encapsulation films provided in Examples 24 to 27 of the present invention;

[0028] Figure 11 The time-performance curves after encapsulating organic / inorganic solar cells using the patch-type encapsulation films provided in Example 28 of the present invention and Comparative Examples 13 to 16;

[0029] Figure 12 The time-performance curves of organic / inorganic solar cells encapsulated using the patch-type encapsulation films provided in Examples 29 to 32 of the present invention;

[0030] Figure 13 The time-performance curves after encapsulating organic / inorganic solar cells using the patch-type encapsulation films provided by Examples 33 to 36 of the present invention. DETAILED DESCRIPTION

[0031] All raw materials of the present invention are not particularly limited in their sources and can be purchased from the market or prepared according to conventional methods well known to those skilled in the art.

[0032] There is no particular limitation on the purity of all raw materials in the present invention, and industrial pure raw materials are preferably used in the present invention.

[0033] The present invention provides a patch-type packaging film, comprising a metal foil and a polymer sealing layer and a liquid desiccant layer sequentially arranged on one side of the metal foil; the material of the polymer sealing layer comprises water-absorbing particles and a polymer material; the polymer material comprises polyisobutylene, butyl rubber or epoxy resin.

[0034] The patch-type packaging film provided by the present invention comprises a metal foil.

[0035] In the present invention, the thickness of the metal foil is preferably 5 to 500 μm, more preferably 50 to 300 μm. As one embodiment of the present invention, the thickness of the metal foil can be 20 μm, 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, or 500 μm. A metal foil thickness within the above range balances flexibility and mechanical properties, facilitating the encapsulation of organic electronic devices.

[0036] The present invention has no particular limitation on the material of the metal foil, and any metal foil material known to those skilled in the art can be used. As one embodiment of the present invention, the metal foil can be made of aluminum foil, nickel-iron alloy foil, or stainless steel foil.

[0037] The patch-type packaging film provided by the present invention further comprises a polymer sealing layer arranged on one side of the metal foil.

[0038] In the present invention, the material of the polymer sealing layer includes water-absorbing particles and polymer materials.

[0039] In the present invention, the water-absorbing particles preferably include calcium oxide, aluminum oxide, zeolite, silicon dioxide, calcium chloride or calcium carbonate. These materials have good water absorption, are widely available and low in cost, which helps to reduce costs.

[0040] The present invention has no particular limitation on the particle size of the water-absorbing particles, as long as they can be uniformly dispersed in the polymer material. As an embodiment of the present invention, the particle size of the water-absorbing particles can be 5 to 80 nm.

[0041] In the present invention, the polymer material includes polyisobutylene (PIB), butyl rubber or epoxy resin, preferably PIB. The polymer material has extremely low water and oxygen permeability, which can reduce the water and oxygen permeability of the packaging film and improve the packaging effect.

[0042] The present invention has no particular limitation on the molecular weight of the polymer material, and the molecular weight of the polymer material well known to those skilled in the art can be used.

[0043] In the present invention, the mass ratio of the water-absorbing particles to the polymer material in the polymer sealing layer is preferably (1-100):(1-100), more preferably (1-100):100. As one embodiment of the present invention, the mass ratio of the water-absorbing particles to the polymer material in the polymer sealing layer can be 1:100, 3:100, 20:100, 50:100, 80:100, 100:100, 100:50, 100:20, 100:10, 100:5, or 100:1. A mass ratio of the water-absorbing particles to the polymer material in the polymer sealing layer within the above range is beneficial for balancing the water-absorbing particles and the polymer material, fully utilizing the characteristics of each, and further improving the encapsulation effect of the encapsulation film.

[0044] In the present invention, the thickness of the polymer sealing layer is preferably 100 to 5000 nm, more preferably 500 to 3000 nm. As one embodiment of the present invention, the thickness of the polymer sealing layer can be 100 nm, 200 nm, 500 nm, 1000 nm, 1500 nm, 2000 nm, 2500 nm, 3000 nm, 3500 nm, 4000 nm, 4500 nm, or 5000 nm. A polymer sealing layer thickness within the above range facilitates leveraging the extremely low water and oxygen permeability of the polymer material, further improving the encapsulation effect of the encapsulation film.

[0045] The patch-type packaging film provided by the present invention further comprises a liquid desiccant layer arranged on the surface of the polymer sealing layer.

[0046] In the present invention, the thickness of the liquid desiccant layer is preferably 10 to 550 nm, more preferably 50 to 300 nm. In one embodiment of the present invention, the thickness of the liquid desiccant layer can be 15 nm, 50 nm, 120 nm, 200 nm, 250 nm, 300 nm, 350 nm, 400 nm, 450 nm, or 550 nm. A liquid desiccant thickness within the above range is beneficial for absorbing free water and oxygen on the surface of organic electronic devices, further enhancing the protective effect on the organic electronic devices.

[0047] In the present invention, the material of the liquid desiccant preferably includes water-absorbing particles and silicone oil; the water-absorbing particles are the same as the water-absorbing particles in the aforementioned polymer sealing layer, and are not described in detail here.

[0048] In the present invention, the silicone oil preferably includes methyl silicone oil, phenyl silicone oil or fluorine-containing silicone oil. The above-mentioned silicone oils have good water barrier and oxygen absorption properties, which can further improve the encapsulation effect of the encapsulation film.

[0049] The present invention does not specifically limit the mass ratio of the water-absorbing particles and silicone oil. The mass ratio of the water-absorbing particles and silicone oil in a liquid desiccant well known to those skilled in the art can be used. As one embodiment of the present invention, the mass percentage of the water-absorbing particles in the liquid desiccant can be 30-60%.

[0050] The present invention utilizes a flexible metal foil as the substrate of the packaging film, which has good mechanical strength and weather resistance; utilizes the extremely low water and oxygen permeability of the polymer material to reduce the water and oxygen permeability of the packaging film, thereby improving the packaging effect; by adding water-absorbing particles to the polymer sealing layer, the water molecules that pass through the metal foil are absorbed, thereby improving the water barrier performance; and by providing a liquid desiccant layer to absorb water and oxygen free on the surface of the organic electronic device, the protection effect of the organic electronic device is further improved.

[0051] The present invention also provides a method for preparing the patch-type packaging film described in the above technical solution, comprising: mixing water-absorbing particles with a polymer material and coating the mixture on one side of a metal foil to obtain a metal foil-polymer sealing layer complex; and coating a liquid desiccant on the surface of the polymer sealing layer of the metal foil-polymer sealing layer complex to obtain a patch-type packaging film.

[0052] The present invention has no particular limitation on the mixing method, as long as the water-absorbing particles and the polymer material are uniformly mixed. In an embodiment of the present invention, the water-absorbing particles are added to the polymer material according to a mass ratio, and after adding magnets, the mixture is placed on a magnetic stirring table and mixed uniformly.

[0053] The present invention has no particular limitation on the coating method, as long as a uniform coating can be obtained.

[0054] The preparation method provided by the present invention has simple process and can stably obtain high-quality products; the raw materials are widely available and the cost is low, which is conducive to industrial production.

[0055] The present invention also provides the use of the patch-type packaging film described in the above technical solution or the patch-type packaging film prepared by the preparation method described in the above technical solution in the packaging of organic electronic devices. When the organic electronic device is packaged, the liquid desiccant layer in the patch-type packaging film faces the organic electronic device.

[0056] As an embodiment of the present invention, the chip packaging film can be packaged on the surface of the organic electronic device using a hot pressing packaging machine.

[0057] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions of the present invention. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0058] Example 1

[0059] A patch-type packaging film comprises a metal foil, a polymer sealing layer, and a liquid desiccant layer sequentially arranged on one side of the metal foil; the metal foil is 100 μm aluminum foil, the polymer sealing layer is made of calcium oxide (particle size 5 nm) and PIB (Daelim Industrial Co., Ltd., South Korea) in a mass ratio of 3:100, the polymer sealing layer is 200 nm thick, and the liquid desiccant layer is a calcium oxide-silicone oil liquid desiccant (Dow Corning), with a thickness of 50 nm.

[0060] The preparation method is as follows: calcium oxide and PIB are mixed (magnetically stirred) and then coated on one side of an aluminum foil to obtain an aluminum foil-PIB complex; a liquid desiccant is coated on the surface of the PIB layer of the aluminum foil-PIB complex to obtain a patch-type packaging film.

[0061] Comparative Examples 1 to 4

[0062] A patch-type packaging film is a 100μm aluminum foil.

[0063] A patch-type packaging film consists of a metal foil and a polymer material layer arranged on one side of the metal foil: the metal foil is a 100μm aluminum foil, and the polymer material layer is made of PIB with a thickness of 200nm.

[0064] A patch-type packaging film consists of a metal foil and a polymer sealing layer arranged on one side of the metal foil: the metal foil is a 100μm aluminum foil, and the polymer material layer is made of calcium oxide and PIB in a mass ratio of 3:100, with a thickness of 200nm.

[0065] A patch-type packaging film consists of a metal foil and a polymer sealing layer arranged on one side of the metal foil: the metal foil is a 100μm aluminum foil, and the polymer material layer is made of calcium oxide and polyvinyl alcohol (molecular weight 70,000) in a mass ratio of 3:100, with a thickness of 200nm.

[0066] Examples 2 to 5

[0067] A patch-type packaging film has the same structure as that of Example 1, except that the thickness of the liquid desiccant layer is 550 nm.

[0068] A patch-type packaging film has the same structure as that of Example 1, except that the thickness of the liquid desiccant layer is 15 nm.

[0069] A patch-type packaging film has the same structure as that of Example 1, except that the thickness of the liquid desiccant layer is 200 nm.

[0070] A patch-type packaging film has the same structure as that of Example 1, except that the thickness of the liquid desiccant layer is 400 nm.

[0071] Examples 6 to 9

[0072] A patch-type packaging film has the same structure as that of Example 1, except that the polymer material layer is made of calcium oxide and PIB in a mass ratio of 1:100.

[0073] A patch-type packaging film has the same structure as that of Example 1, except that the polymer material layer is made of calcium oxide and PIB in a mass ratio of 50:100.

[0074] A patch-type packaging film has the same structure as that of Example 1, except that the polymer material layer is made of calcium oxide and PIB in a mass ratio of 100:100.

[0075] A patch-type packaging film has the same structure as that of Example 1, except that the polymer material layer is made of calcium oxide and PIB in a mass ratio of 100:10.

[0076] Application Example 1

[0077] The chip packaging films provided in Examples 1 to 9 and Comparative Examples 1 to 4 were respectively packaged on the surface of the organic light emitting diode using a hot pressing packaging machine. The structural diagram after packaging using the chip packaging film provided in Example 1 is shown in FIG. Figure 1 As shown in the figure: the chip packaging film consists of a metal foil substrate and a water-absorbing particle / polymer material blend film and a liquid desiccant (CLD) sequentially arranged on one side of the metal foil substrate. The semiconductor device (OLED) is arranged on one side of the ITO. The chip packaging film is bonded to the ITO to encapsulate the semiconductor device.

[0078] Record the changes in the brightness of the encapsulated organic light-emitting diode over time. The results are as follows Figure 2 、 Figure 3 and Figure 4 shown. Figure 2 In the figure, Al represents comparative example 1, Al / PIB represents comparative example 2, Al / calcium oxide:PIB (3:100) represents comparative example 3, and Al / calcium oxide:PVA (3:100) represents comparative example 4. Figure 2It can be seen that after the organic light emitting diode is encapsulated by the patch-type encapsulation film provided in Example 1, the brightness can still reach 80% of the original brightness after 600 hours, and the protection effect is significantly better than that of Comparative Examples 1 to 4 (the brightness after 600 hours can only reach 20.1%, 45%, 69.4%, and 60% of the original brightness respectively); Figure 3 It can be seen that the protection effect of liquid desiccant with different thicknesses on organic light-emitting diodes is somewhat different, but all are in a good protection state (the brightness after 600h can reach 76.7%, 74.7%, 81%, and 79.7% of the original brightness respectively); Figure 4 It can be seen that the mass ratio of the water-absorbing particles to the polymer material in the polymer material layer will affect the encapsulation effect, but can effectively protect the organic light-emitting diodes (the brightness after 600 hours can reach 78.3%, 82%, 75.3%, and 71.4% of the original brightness, respectively), effectively extending the service life of the organic light-emitting diodes.

[0079] Example 10

[0080] A patch-type packaging film comprises a metal foil, a polymer sealing layer, and a liquid desiccant layer sequentially arranged on one side of the metal foil; the metal foil is 20 μm aluminum foil, the polymer sealing layer is made of zeolite (particle size 5 nm) and PIB (Daelim Industrial Co., Ltd., South Korea) in a mass ratio of 3:100, the polymer sealing layer is 100 nm thick, and the liquid desiccant layer is a calcium oxide-methyl silicone oil liquid desiccant (Dow Corning), with a thickness of 50 nm.

[0081] The preparation method is as follows: zeolite and PIB are mixed (magnetically stirred) and then coated on one side of aluminum foil to obtain an aluminum foil-PIB complex; a liquid desiccant is coated on the surface of the PIB layer of the aluminum foil-PIB complex to obtain a patch-type packaging film.

[0082] Comparative Examples 5 to 8

[0083] A patch-type packaging film, which is a 20μm aluminum foil.

[0084] A patch-type packaging film consists of a metal foil and a polymer material layer arranged on one side of the metal foil: the metal foil is a 20μm aluminum foil, and the polymer material layer is made of PIB with a thickness of 100nm.

[0085] A patch-type packaging film consists of a metal foil and a polymer sealing layer arranged on one side of the metal foil: the metal foil is a 20μm aluminum foil, and the polymer material layer is made of zeolite and PIB in a mass ratio of 3:100 and has a thickness of 100nm.

[0086] A patch-type packaging film consists of a metal foil and a polymer sealing layer arranged on one side of the metal foil: the metal foil is a 20μm aluminum foil, and the polymer material layer is made of zeolite and polyvinyl alcohol (molecular weight 70,000) in a mass ratio of 3:100, with a thickness of 100nm.

[0087] Examples 11 to 14

[0088] A patch-type packaging film has the same structure as that of Example 10, except that the thickness of the liquid desiccant layer is 550 nm.

[0089] A patch-type packaging film has the same structure as that of Example 10, except that the thickness of the liquid desiccant layer is 15 nm.

[0090] A patch-type packaging film has the same structure as that of Example 10, except that the thickness of the liquid desiccant layer is 200 nm.

[0091] A patch-type packaging film has the same structure as that of Example 10, except that the thickness of the liquid desiccant layer is 400 nm.

[0092] Examples 15 to 18

[0093] A patch-type packaging film has the same structure as that of Example 10, except that the polymer material layer is made of zeolite and PIB in a mass ratio of 1:100.

[0094] A patch-type packaging film has the same structure as that of Example 10, except that the polymer material layer is made of zeolite and PIB in a mass ratio of 50:100.

[0095] A patch-type packaging film has the same structure as that of Example 10, except that the polymer material layer is made of zeolite and PIB in a mass ratio of 100:100.

[0096] A patch-type packaging film has the same structure as that of Example 10, except that the polymer material layer is made of zeolite and PIB in a mass ratio of 100:10.

[0097] Application Example 2

[0098] The chip packaging films provided in Examples 10 to 18 and Comparative Examples 5 to 8 were respectively packaged on the surface of the organic light emitting diode using a hot pressing packaging machine, with the liquid desiccant layer in the chip packaging film facing the organic light emitting diode.

[0099] Record the changes in the brightness of the encapsulated organic light-emitting diode over time. The results are as follows Figure 5 、 Figure 6 and Figure 7 shown. Figure 5In the figure, Al represents Comparative Example 5, Al / PIB represents Comparative Example 6, Al / zeolite:PIB (3:100) represents Comparative Example 7, and Al / zeolite:PVA (3:100) represents Comparative Example 8. Figure 5 It can be seen that after the organic light emitting diode is encapsulated with the patch-type encapsulation film provided in Example 10, the brightness can reach 73.6% of the original brightness after 600 hours, and the protection effect is significantly better than that of Comparative Examples 5 to 8 (the brightness after 600 hours can only reach 14.3%, 40%, 65.4%, and 55% of the original brightness respectively); Figure 6 It can be seen that the protection effect of liquid desiccant with different thicknesses on organic light-emitting diodes is somewhat different, but all are in a good protection state (the brightness after 600h can reach 69.7%, 67.7%, 74%, and 72% of the original brightness respectively); Figure 7 It can be seen that the mass ratio of the water-absorbing particles to the polymer material in the polymer material layer will affect the encapsulation effect, but both can effectively protect the organic light-emitting diodes (the brightness after 600 hours can reach 71.3%, 75%, 68.7%, and 66.2% of the original brightness, respectively), effectively extending the service life of the organic light-emitting diodes.

[0100] Example 19

[0101] A patch-type packaging film comprises a metal foil, a polymer sealing layer, and a liquid desiccant layer sequentially arranged on one side of the metal foil; the metal foil is 100 μm aluminum foil, the polymer sealing layer is made of aluminum oxide (particle size 5 nm) and PIB (Daelim Industrial Co., Ltd., South Korea) in a mass ratio of 3:100, the polymer sealing layer is 200 nm thick, and the liquid desiccant layer is a calcium oxide-phenyl silicone oil liquid desiccant (Dow Corning), with a thickness of 50 nm.

[0102] The preparation method is as follows: alumina and PIB are mixed (magnetically stirred) and then coated on one side of an aluminum foil to obtain an aluminum foil-PIB complex; a liquid desiccant is coated on the surface of the PIB layer of the aluminum foil-PIB complex to obtain a patch-type packaging film.

[0103] Comparative Examples 9 to 12

[0104] A patch-type packaging film is a 100μm aluminum foil.

[0105] A patch-type packaging film consists of a metal foil and a polymer material layer arranged on one side of the metal foil: the metal foil is a 100μm aluminum foil, and the polymer material layer is made of PIB with a thickness of 200nm.

[0106] A patch-type packaging film consists of a metal foil and a polymer sealing layer arranged on one side of the metal foil: the metal foil is a 100μm aluminum foil, and the polymer material layer is made of aluminum oxide and PIB in a mass ratio of 3:100, with a thickness of 200nm.

[0107] A patch-type packaging film consists of a metal foil and a polymer sealing layer arranged on one side of the metal foil: the metal foil is a 100μm aluminum foil, and the polymer material layer is made of aluminum oxide and polyvinyl alcohol (molecular weight 70,000) in a mass ratio of 3:100, with a thickness of 200nm.

[0108] Examples 20 to 23

[0109] A patch-type packaging film has the same structure as Example 19, except that the thickness of the liquid desiccant layer is 550 nm.

[0110] A patch-type packaging film has the same structure as Example 19, except that the thickness of the liquid desiccant layer is 15 nm.

[0111] A patch-type packaging film has the same structure as Example 19, except that the thickness of the liquid desiccant layer is 200 nm.

[0112] A patch-type packaging film has the same structure as Example 19, except that the thickness of the liquid desiccant layer is 400 nm.

[0113] Examples 24 to 27

[0114] A patch-type packaging film has the same structure as Example 19, except that the polymer material layer is made of aluminum oxide and PIB in a mass ratio of 1:100.

[0115] A patch-type packaging film has the same structure as Example 19, except that the polymer material layer is made of aluminum oxide and PIB in a mass ratio of 50:100.

[0116] A patch-type packaging film has the same structure as Example 19, except that the polymer material layer is made of aluminum oxide and PIB in a mass ratio of 100:100.

[0117] A patch-type packaging film has the same structure as Example 19, except that the polymer material layer is made of aluminum oxide and PIB in a mass ratio of 100:10.

[0118] Application Example 3

[0119] The chip packaging films provided in Examples 19 to 27 and Comparative Examples 9 to 12 were respectively packaged on the surface of the organic light emitting diode using a hot pressing packaging machine, with the liquid desiccant layer in the chip packaging film facing the organic light emitting diode.

[0120] Record the changes in the brightness of the encapsulated organic light-emitting diode over time. The results are as follows Figure 8 、 Figure 9 and Figure 10 shown. Figure 8 In the figure, Al represents Comparative Example 9, Al / PIB represents Comparative Example 10, Al / alumina:PIB (3:100) represents Comparative Example 11, and Al / alumina:PVA (3:100) represents Comparative Example 12. Figure 8 It can be seen that after the organic light emitting diode is encapsulated with the patch-type encapsulation film provided in Example 19, the brightness can still reach 79.1% of the original brightness after 600 hours, and the protection effect is significantly better than that of Comparative Examples 9 to 12 (the brightness after 600 hours can only reach 19.1%, 44%, 68.4%, and 59% of the original brightness respectively); Figure 9 It can be seen that the protection effect of liquid desiccant with different thicknesses on organic light-emitting diodes is somewhat different, but all are in a good protection state (the brightness after 600h can reach 76.1%, 74%, 80%, and 78.9% of the original brightness respectively); Figure 10 It can be seen that the mass ratio of the water-absorbing particles to the polymer material in the polymer material layer will affect the encapsulation effect, but both can effectively protect the organic light-emitting diodes (the brightness after 600 hours can reach 77%, 81.2%, 74.5%, and 70.2% of the original brightness, respectively), effectively extending the service life of the organic light-emitting diodes.

[0121] Example 28

[0122] A patch-type packaging film comprises a metal foil, a polymer sealing layer, and a liquid desiccant layer sequentially arranged on one side of the metal foil; the metal foil is 450μm aluminum foil, the polymer sealing layer is made of calcium carbonate (particle size 5nm) and PIB (Daelim Industrial Co., Ltd., South Korea) in a mass ratio of 3:100, the polymer sealing layer is 3000nm thick, and the liquid desiccant layer is a calcium oxide-silicone oil liquid desiccant (Dow Corning) with a thickness of 50nm.

[0123] The preparation method is as follows: calcium carbonate and PIB are mixed (magnetically stirred) and then coated on one side of an aluminum foil to obtain an aluminum foil-PIB complex; a liquid desiccant is coated on the surface of the PIB layer of the aluminum foil-PIB complex to obtain a patch-type packaging film.

[0124] Comparative Examples 13-16

[0125] A patch-type packaging film is a 200μm aluminum foil.

[0126] A patch-type packaging film consists of a metal foil and a polymer material layer arranged on one side of the metal foil: the metal foil is a 200μm aluminum foil, and the polymer material layer is made of PIB with a thickness of 3000nm.

[0127] A patch-type packaging film consists of a metal foil and a polymer sealing layer arranged on one side of the metal foil: the metal foil is a 200μm aluminum foil, and the polymer material layer is made of calcium carbonate and PIB in a mass ratio of 3:100, with a thickness of 3000nm.

[0128] A patch-type packaging film consists of a metal foil and a polymer sealing layer arranged on one side of the metal foil: the metal foil is a 200μm aluminum foil, and the polymer material layer is made of calcium carbonate and polyvinyl alcohol (molecular weight 70,000) in a mass ratio of 3:100, with a thickness of 3000nm.

[0129] Examples 29 to 32

[0130] A patch-type packaging film has the same structure as Example 28, except that the thickness of the liquid desiccant layer is 550 nm.

[0131] A patch-type packaging film has the same structure as Example 28, except that the thickness of the liquid desiccant layer is 15 nm.

[0132] A patch-type packaging film has the same structure as Example 28, except that the thickness of the liquid desiccant layer is 200 nm.

[0133] A patch-type packaging film has the same structure as Example 28, except that the thickness of the liquid desiccant layer is 400 nm.

[0134] Examples 33 to 36

[0135] A patch-type packaging film has the same structure as Example 28, except that the polymer material layer is made of calcium carbonate and PIB in a mass ratio of 1:100.

[0136] A patch-type packaging film has the same structure as Example 28, except that the polymer material layer is made of calcium carbonate and PIB in a mass ratio of 50:100.

[0137] A patch-type packaging film has the same structure as Example 28, except that the polymer material layer is made of calcium carbonate and PIB in a mass ratio of 100:100.

[0138] A patch-type packaging film has the same structure as Example 28, except that the polymer material layer is made of calcium carbonate and PIB in a mass ratio of 100:10.

[0139] Application Example 4

[0140] The chip-type packaging films provided in Examples 28 to 36 and Comparative Examples 13 to 16 were respectively packaged on the surface of the organic / inorganic solar cell by a hot pressing packaging machine, with the liquid desiccant layer in the chip-type packaging film facing the organic / inorganic solar cell.

[0141] The changes of the photoelectric conversion efficiency (PCE) of the encapsulated organic / inorganic solar cells over time are recorded. Figure 11 、 Figure 12 and Figure 13 shown. Figure 11 In the figure, Al represents Comparative Example 13, Al / PIB represents Comparative Example 14, Al / calcium carbonate:PIB (3:100) represents Comparative Example 15, and Al / calcium carbonate:PVA (3:100) represents Comparative Example 16. Figure 11 It can be seen that after the patch-type encapsulation film provided in Example 28 is used to encapsulate the organic / inorganic solar cell, the PCE after 600h can still reach 88% of the original PCE, and the protection effect is significantly better than that of Comparative Examples 13 to 16 (the PCE after 600h can only reach 25%, 47.8%, 69.2%, and 64% of the original PCE, respectively); Figure 12 It can be seen that the protection effects of liquid desiccants of different thicknesses on organic / inorganic solar cells are somewhat different, but all are in a good protection state (the PCE after 600h can reach 85.7%, 82.7%, 89%, and 88.3% of the original PCE respectively); Figure 13 It can be seen that the mass ratio of water-absorbing particles to polymer materials in the polymer material layer will affect the encapsulation effect, but can effectively protect organic / inorganic solar cells (the PCE of 600h can reach 86.3%, 89.3%, 79.8% and 77% of the original PCE respectively), effectively extending the service life of organic / inorganic solar cells.

[0142] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A patch-type packaging film comprising a metal foil and a polymer sealing layer and a liquid desiccant layer sequentially disposed on one side of the metal foil; the polymer sealing layer is made of water-absorbing particles and a polymer material; the polymer material comprises polyisobutylene, butyl rubber, or epoxy resin.

2. The chip packaging film according to claim 1, characterized in that: The water-absorbing particles include calcium oxide, aluminum oxide, zeolite, silicon dioxide, calcium chloride or calcium carbonate.

3. The chip packaging film according to claim 1, characterized in that: The mass ratio of the water-absorbing particles to the polymer material in the polymer sealing layer is (1-100):(1-100).

4. The chip packaging film according to any one of claims 1 to 3, characterized in that: The thickness of the polymer sealing layer is 100 to 5000 nm.

5. The chip packaging film according to claim 1, characterized in that: The thickness of the liquid desiccant layer is 10 to 550 nm.

6. The patch packaging film according to claim 1 or 5, characterized in that: The material of the liquid desiccant layer includes water-absorbing particles and silicone oil.

7. The chip packaging film according to claim 6, characterized in that: The silicone oil includes methyl silicone oil, phenyl silicone oil or fluorine-containing silicone oil.

8. The chip packaging film according to claim 1, characterized in that: The thickness of the metal foil is 5 to 500 μm.

9. The method for preparing the chip packaging film according to any one of claims 1 to 8, comprising: The water-absorbing particles are mixed with a polymer material and then coated on one side of a metal foil to obtain a metal foil-polymer sealing layer composite; A liquid desiccant is coated on the surface of the polymer sealing layer of the metal foil-polymer sealing layer complex to obtain a patch-type packaging film.

10. Use of the patch-type packaging film according to any one of claims 1 to 8 or the patch-type packaging film prepared by the preparation method according to claim 9 in packaging of organic electronic devices, characterized in that: When the organic electronic device is packaged, the liquid desiccant layer in the patch-type packaging film faces the organic electronic device.

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