Display device

Abstract

A display device includes: a first substrate having a display area and a non-display area; a planarization layer disposed on the first substrate in the display area and the non-display area; a light emitting diode disposed on the planarization layer, in the display area, and including an anode, an organic layer, and a cathode; a protective layer disposed on the planarization layer, in the display area and the non-display area, and disposed to cover an end portion of the anode and surround a side surface of the planarization layer; a bank disposed on at least a portion of the protective layer to cover an end portion of the anode; a second substrate disposed to face the first substrate; and an adhesive layer disposed on the bank to adhere the second substrate to the first substrate. In this way, moisture penetration into the organic layer at the peripheral region may be reduced.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2024-0028737 filed on February 28, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to a display device, and more particularly, to a display device having improved moisture permeability characteristics. Background Art

[0004] With the development of the information age, the demand for display devices for displaying images is increasing. Display devices can be used in various types of devices such as televisions, monitors, tablet computers, navigation devices, game consoles, and mobile phones. Various types of display devices are used as such display devices, examples of which include liquid crystal display (LCD) devices, organic light emitting display (OLED) devices, etc.

[0005] The application range of display devices has become more diverse to include not only computer monitors and televisions but also personal portable devices, and research on display devices having a large display area but reduced in size and weight is underway. Summary of the Invention

[0006] An object to be achieved by the present disclosure is to provide a display device in which a moisture permeation path at a peripheral area is blocked.

[0007] Another object to be achieved by the present disclosure is to provide a display device capable of reducing defects occurring in a light emitting diode due to moisture penetration.

[0008] Still another object to be achieved by the present disclosure is to provide a display device capable of easily absorbing outgassing of a planarization layer.

[0009] The objects of the present disclosure are not limited to the above-mentioned objects, and other objects not mentioned above can be clearly understood by those skilled in the art from the following description.

[0010] According to one aspect of the present disclosure, a display device includes: a first substrate having a display area and a non-display area; a planarization layer disposed on the first substrate, located in the display area and the non-display area; a light-emitting diode, disposed on the planarization layer, located in the display area, and including an anode, an organic layer, and a cathode; a protective layer disposed on the planarization layer, located in the display area and the non-display area, and disposed to cover an end of the anode and surround a side surface of the planarization layer; a dam disposed on at least a portion of the protective layer to cover an end of the anode; a second substrate disposed to face the first substrate; and an adhesive layer disposed on the dam to adhere the second substrate to the first substrate.

[0011] According to an embodiment of the present disclosure, a display device includes: a substrate; a thin film transistor on the substrate; an insulating layer on the thin film transistor; and a light-emitting diode on the insulating layer. The light-emitting diode may include a first electrode, an organic light-emitting layer, and a second electrode. The display device also includes a protective layer on the insulating layer. One or more openings may be formed in the protective layer to expose one or more portions of the insulating layer. The display device also includes a bank disposed on and in contact with at least a portion of the protective layer, an adhesive layer on the bank, and a second substrate on the adhesive layer.

[0012] Additional details of exemplary embodiments are included in the detailed description and accompanying drawings.

[0013] According to the present disclosure, a protective layer may be provided to surround the planarization layer to block a path for moisture penetration that may occur at the peripheral area.

[0014] The present disclosure may reduce or minimize degradation of reliability due to defects of a light emitting diode caused by moisture penetration.

[0015] According to the present disclosure, a plurality of openings may be provided in the protective layer made of an inorganic material to provide a path through which outgassing inside the planarization layer is absorbed.

[0016] The effects according to the present disclosure are not limited to those exemplified above, and more various effects are included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0018] Figure 1 is a plan view schematically illustrating a display device according to an exemplary embodiment of the present disclosure.

[0019] Figure 2 It is along Figure 1 A cross-sectional view taken along line II-II′.

[0020] Figure 3 It is along Figure 1 A cross-sectional view taken along line III-III′.

[0021] Figure 4 is a cross-sectional view illustrating a display device according to another exemplary embodiment of the present disclosure.

[0022] Figure 5 is a cross-sectional view illustrating a display device according to still another exemplary embodiment of the present disclosure.

[0023] Figure 6 is a cross-sectional view illustrating a display device according to still another exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0024] The advantages and features of the present disclosure and methods for achieving these advantages and features will be apparent by reference to the exemplary embodiments described in detail below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only by way of example so that those skilled in the art can fully understand the disclosure and scope of the present disclosure.

[0025] The shapes, sizes, ratios, angles, numbers, etc. shown in the drawings for describing the exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. Throughout the specification, the same reference numerals generally represent the same elements. In addition, in the following description of the present disclosure, detailed descriptions of known related arts may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "including," "having," and "consisting of" used herein are generally intended to allow the addition of other components, unless these terms are used together with the term "only." Unless expressly stated otherwise, references to the singular may include the plural.

[0026] Even if not explicitly stated, the components are interpreted as including the ordinary error range.

[0027] When terms such as "on," "over," "below," and "adjacent" are used to describe a positional relationship between two components, one or more components may be positioned between the two components unless these terms are used together with the terms "immediately" or "directly."

[0028] When an element or layer is referred to as being “on” another element or layer, other layers or other elements may be interposed therebetween or directly on the other element or layer.

[0029] Although the terms "first," "second," and the like are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from other components. Therefore, the first component to be mentioned below may be the second component in the technical concept of the present disclosure.

[0030] Throughout the specification, like reference numerals generally refer to like elements.

[0031] For convenience of description, the size and thickness of each component shown in the drawings are illustrated, and the present disclosure is not limited to the size and thickness of the components shown.

[0032] The features of the various embodiments of the present disclosure may be partially or completely dependent on or combined with each other, and may be technically interlocked and operated in various ways, and these embodiments may be performed independently or in association with each other.

[0033] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0034] Figure 1 is a plan view schematically illustrating a display device according to an exemplary embodiment of the present disclosure. Figure 2 It is along Figure 1 A cross-sectional view taken along line II-II′. Figure 3 It is along Figure 1 For ease of explanation, Figure 1 Only the first substrate 110, the second substrate 170, the plurality of flexible films 180, and the plurality of printed circuit boards 190 are shown among the various components of the display device 100. Figure 2 and Figure 3 , for convenience of illustration, the plurality of flexible films 180 and the plurality of printed circuit boards 190 are omitted.

[0035] Reference Figures 1 to 3 The first substrate 110 may be configured to support various components included in the display device 100. The first substrate 110 may be made of an insulating material or a flexible material. For example, the substrate 110 may be a plastic substrate such as a polymer or polyimide (PI).

[0036] On the other hand, the display device 100 may be configured as a top emission type or a bottom emission type depending on an emission direction of light emitted from the light emitting diode OLED.

[0037] The top emission type is configured such that light is emitted from the light emitting diode toward the top of the first substrate 110 on which the light emitting diode OLED is disposed. In the top emission type, a reflective layer may be formed under the anode AN so that light emitted from the light emitting diode OLED travels toward the top of the first substrate 110, that is, toward the cathode CA.

[0038] The bottom emission type is configured so that light is emitted from the light emitting diode toward the bottom of the first substrate 110 on which the light emitting diode OLED is provided. In the bottom emission type, in order to allow the light emitted from the light emitting diode OLED to travel toward the bottom of the first substrate 110, the anode AN may be made of only a transparent conductive material, and the cathode CA may be made of a metal material having high reflectivity.

[0039] Hereinafter, for convenience of explanation, it is assumed that the display device 100 according to an exemplary embodiment of the present disclosure is a bottom emission type, but the present disclosure is not limited thereto.

[0040] Reference Figure 1 , the first substrate 110 includes a display area AA and a non-display area NA.

[0041] The display area AA is an area for displaying an image. A plurality of sub-pixels SP for displaying an image may be disposed in the display area AA. The plurality of sub-pixels SP include red sub-pixels, green sub-pixels, blue sub-pixels, and white sub-pixels. For example, the red sub-pixels, white sub-pixels, blue sub-pixels, and green sub-pixels may be arranged sequentially along a row direction. However, the arrangement order of the plurality of sub-pixels SP is not limited thereto.

[0042] Each of the multiple sub-pixels SP includes an emission area and a circuit area. The emission area is an area that can independently emit light of a single color, and a light-emitting diode OLED can be set in the emission area. Specifically, among the areas where the multiple color filters CF and the anode AN overlap with each other, the area exposed relative to the embankment 150 so that the light emitted from the light-emitting diode OLED can travel to the outside can be defined as the emission area. The circuit area is the remaining area except the emission area, and can include a driving circuit for driving the multiple light-emitting diodes OLED and a plurality of lines for transmitting various signals to the driving circuit. Additionally, the circuit area provided with the driving circuit, the multiple lines, the embankment 150, etc. can be a non-emitting area.

[0043] The non-display area NA is an area where no image is displayed and is provided to surround the display area AA. The non-display area NA may be an area where various lines and driver integrated circuits (ICs) for driving the plurality of sub-pixels SP provided in the display area AA are provided. For example, various driver ICs such as gate driver ICs and data driver ICs may be provided in the non-display area NA, but the present invention is not limited thereto. The non-display area NA where no image is displayed may be a frame area, but exemplary embodiments of the present disclosure are not limited thereto.

[0044] Refer to the description of the configuration of the sub-pixel SP. Figure 2 Each sub-pixel SP includes a first substrate 110, an inorganic insulating layer 120, a planarization layer 130, a protective layer 140, a bank 150, an adhesive layer 160, a first transistor TR, a storage capacitor SC, a light emitting diode OLED, and a color filter CF.

[0045] The inorganic insulating layer 120 is disposed on the first substrate 110. The inorganic insulating layer 120 may include an insulating layer 121, a buffer layer 122, a gate insulating layer 123, and a passivation layer 124.

[0046] First, an insulating layer 121 is provided on the first substrate 110. The insulating layer 121 can suppress the diffusion of moisture and / or oxygen penetrating from the outside of the first substrate 110. The moisture permeability of the display device 100 can be controlled by controlling the thickness or stacking structure of the insulating layer 121. Additionally, the insulating layer 121 can suppress short circuit defects that occur due to contact between the first substrate 110 made of a transparent conductive oxide or an oxide semiconductor and other components such as transistors. The insulating layer 121 can be made of an inorganic material, for example, the insulating layer 121 can be configured by a single layer of silicon oxide (SiOx) or silicon nitride (SiNx) or a multilayer of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0047] A light shielding layer LS is provided on the insulating layer 121. The light shielding layer LS may be made of a conductive material. For example, the light shielding layer LS may be made of a conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof, but is not limited thereto. The light shielding layer LS may be provided to overlap with the active layer ACT of the transistor TR to block light incident on the active layer ACT. When light is irradiated onto the active layer ACT, leakage current may be generated. This may reduce the reliability of the transistor TR as a driving transistor. In this case, when the light shielding layer LS made of an opaque conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof is provided to overlap with the active layer ACT, it can block light incident on the active layer ACT from the bottom of the first substrate 110, thereby improving the reliability of the transistor TR.

[0048] Meanwhile, in the drawings, the light shielding layer LS is shown as a single layer, but the light shielding layer LS may also include a plurality of layers. For example, the light shielding layer LS may include a plurality of layers arranged to overlap each other, wherein at least one of the insulating layer 121, the buffer layer 122, the gate insulating layer 123, and the passivation layer 124 is interposed between the plurality of layers.

[0049] The buffer layer 122 is provided on the light shielding layer LS. The buffer layer 122 can reduce the penetration of moisture or impurities through the first substrate 110. For example, the buffer layer 122 can be formed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. Additionally, the buffer layer 122 can be omitted depending on the type of the first substrate 110 or the type of transistor, but is not limited thereto.

[0050] A transistor TR and a storage capacitor SC are provided on the buffer layer 122 in each of the plurality of sub-pixels SP.

[0051] First, the transistor TR includes an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE.

[0052] The active layer ACT is provided on the buffer layer 122. The active layer ACT may be made of a semiconductor material such as an oxide semiconductor, amorphous silicon, or polycrystalline silicon, but is not limited thereto. For example, when the active layer ACT is formed of an oxide semiconductor, the active layer ACT may include a channel region, a source region, and a drain region, and the source region and the drain region may be conductive regions, but are not limited thereto.

[0053] The gate insulating layer 123 is provided on the active layer ACT. The gate insulating layer 123 is a layer for insulating the gate electrode GE from the active layer ACT and can be made of an insulating material. For example, the gate insulating layer 123 can be formed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0054] The gate electrode GE is disposed on the gate insulating layer 123 to overlap the active layer ACT. The gate electrode GE may be made of a conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof, but is not limited thereto.

[0055] The source electrode SE and the drain electrode DE are provided on the gate insulating layer 123 and are spaced apart from each other. The source electrode SE and the drain electrode DE can be electrically connected to the active layer ACT through a contact hole formed in the gate insulating layer 123. The source electrode SE and the drain electrode DE can be provided on the same layer as the gate electrode GE and thus can be made of the same conductive material, but are not limited thereto. For example, the source electrode SE and the drain electrode DE can be made of copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or alloys thereof, but are not limited thereto.

[0056] At the same time, although not Figure 2 , but the drain electrode DE can be electrically connected to the high potential power line to be supplied with a high potential power voltage. In this case, in order to electrically connect the drain electrode DE to the high potential power line, an auxiliary high potential power line can be additionally provided. One end of the auxiliary high potential power line can be electrically connected to the high potential power line, and the other end can be electrically connected to the drain electrode of each sub-pixel in the plurality of sub-pixels SP. For example, in the case where the auxiliary high potential power line and the drain electrode DE on the same layer are made of the same material, one end of the auxiliary high potential power line can be electrically connected to the high potential power line through a contact hole formed in the gate insulating layer 123 and the buffer layer 122. The other end of the auxiliary high potential power line can extend toward the drain electrode DE to be formed integrally with the drain electrode DE. However, the drain electrode DE and the high potential power line can be electrically connected in different ways, without being limited thereto.

[0057] The source electrode SE can be electrically connected to the light shielding layer LS through contact holes formed in the gate insulating layer 123 and the buffer layer 122. Additionally, the portion of the active layer ACT connected to the source electrode SE can be electrically connected to the light shielding layer LS through contact holes formed in the buffer layer 122. If the light shielding layer LS is floated, the threshold voltage of the transistor TR and other factors may change, thereby affecting the driving of the display device 100. Therefore, by electrically connecting the light shielding layer LS to the source electrode SE, a voltage can be applied to the light shielding layer LS, thereby suppressing the impact on the driving of the transistor TR. However, in the present disclosure, it has been described that both the active layer ACT and the source electrode SE are in contact with the light shielding layer LS. Alternatively, only one of the source electrode SE and the active layer ACT may be directly in contact with the light shielding layer LS, but the present invention is not limited thereto.

[0058] At the same time, Figure 2 , the gate insulating layer 123 is shown to be formed on the entire surface of the first substrate 110, but the gate insulating layer 123 may be patterned to overlap only the gate electrode GE, the source electrode SE, and the drain electrode DE, but is not limited thereto.

[0059] A storage capacitor SC is provided in the circuit region of each of the plurality of sub-pixels SP. The storage capacitor SC can store the voltage between the gate electrode GE and the source electrode SE of the transistor TR, so that the light emitting diode OLED maintains the same state within a frame. The storage capacitor SC includes a first capacitor electrode SC1 and a second capacitor electrode SC2.

[0060] The first capacitor electrode SC1 is provided between the insulating layer 121 and the buffer layer 122 in each of the plurality of sub-pixels SP. Among the conductive components provided on the first substrate 110, the first capacitor electrode SC1 may be provided closest to the first substrate 110. The first capacitor electrode SC1 may be integrally formed with the light shielding layer LS and may be electrically connected to the source electrode SE through the light shielding layer LS.

[0061] A buffer layer 122 is provided on the first capacitor electrode SC1, and a second capacitor electrode SC2 is provided on the buffer layer 122. The second capacitor electrode SC2 may be provided to overlap with the first capacitor electrode SC1. The second capacitor electrode SC2 may be electrically connected to the gate electrode GE. For example, a semiconductor material may be provided on the buffer layer 122, and a portion of the semiconductor material may be converted into a conductor to form the second capacitor electrode SC2, but the present invention is not limited thereto.

[0062] In summary, the first capacitor electrode SC1 of the storage capacitor SC can be integrally formed with the light shielding layer LS and can be electrically connected to the light shielding layer LS and the source electrode SE. The second capacitor electrode SC2 can be electrically connected to the gate electrode GE. Therefore, the first capacitor electrode SC1 and the second capacitor electrode SC2, which overlap each other with the buffer layer 122 interposed therebetween, can continuously maintain the voltages of the gate electrode GE and the source electrode SE of the transistor TR while the light emitting diode OLED emits light, thereby maintaining the light emitting diode OLED in the same state.

[0063] A passivation layer 124 is provided on the storage capacitor SC. The passivation layer 124 is an insulating layer for protecting the configuration below the passivation layer 124. For example, the passivation layer 124 may be formed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. In addition, according to an exemplary embodiment, the passivation layer 124 may be omitted.

[0064] In the emission region of each of the plurality of sub-pixels SP, a color filter CF is provided on the passivation layer 124. As described above, the display device 100 according to the exemplary embodiment of the present disclosure is a bottom emission type in which light emitted from the light-emitting diode OLED is guided to the bottom of the light-emitting diode OLED and the first substrate 110. Therefore, the color filter CF may be provided below the light-emitting diode OLED. The light emitted from the light-emitting diode OLED may be transformed into light of various colors by the color filter CF.

[0065] A planarization layer 130 is provided on the passivation layer 124 and the color filter CF in the display area AA and the non-display area NA. The planarization layer 130 is an insulating layer that planarizes the upper portion of the first substrate 110 where the transistor TR and the storage capacitor SC are provided. The planarization layer 130 may be made of an organic material, for example, a single layer or multiple layers of polyimide or photoacrylic, but is not limited thereto.

[0066] The light emitting diode OLED is disposed in the emission region of each of the plurality of sub-pixels SP. The light emitting diode OLED is disposed on the planarization layer 130 in each of the plurality of sub-pixels SP and in the display area AA. The light emitting diode OLED includes an anode AN, a light emitting layer EL, and a cathode CA.

[0067] The anode AN is disposed on the planarization layer 130 and in the emission area EA. Since the anode AN supplies holes to the light-emitting layer EL, it can be made of a conductive material having a high work function. The anode AN can be formed of, for example, a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto.

[0068] On the other hand, the anode AN may extend toward the circuit area CA1. A portion of the anode AN may extend from the emission area EA toward the source electrode SE of the circuit area CA1 and may be electrically connected to the source electrode SE through a contact hole formed in the planarization layer 130 and the passivation layer 124. Therefore, the anode AN of the light emitting diode OLED may extend to the circuit area CA1 to be electrically connected to the source electrode SE of the transistor TR and the first capacitor electrode SC1 of the storage capacitor SC.

[0069] The light-emitting layer EL is disposed on the anode AN, within the emission area EA, and within the circuit area CA1. The light-emitting layer EL may be configured as a single layer over the plurality of sub-pixels SP. That is, the corresponding light-emitting layers EL of the plurality of sub-pixels SP may be integrally connected. The light-emitting layer EL may be configured as a single light-emitting layer, or may have a structure in which multiple light-emitting layers emitting different colors of light are stacked. The light-emitting layer EL may further include organic layers such as a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, and the like.

[0070] The cathode CA is provided on the light emitting layer EL, in the emission area EA and the circuit area CA1. Since the cathode CA supplies electrons to the light emitting layer EL, it can be made of a conductive material having a low work function. The cathode CA can be configured by a layer above the plurality of sub-pixels SP. That is, the corresponding cathodes CA of the plurality of sub-pixels SP can be connected integrally. For example, the cathode CA can be formed of a transparent conductive material such as indium tin oxide ITO or indium zinc oxide IZO or ytterbium (Yb) alloy, and may also include a metal doping layer, but is not limited thereto. At the same time, although there is no Figure 2 , but the cathode CA of the light emitting diode OLED may be electrically connected to a low-potential power line to be supplied with a low-potential power voltage.

[0071] A protective layer 140 and a bank 150 are provided between the anode AN and the light emitting layer EL.

[0072] The protective layer 140 is disposed on the planarization layer 130 and is located in the display area AA and the non-display area NA. The protective layer 140 is disposed to cover the end of the anode AN in the display area AA. The end of the protective layer 140 is covered by the bank 150, and thus the protective layer and the light emitting layer are insulated by being spaced apart.

[0073] The protective layer 140 may be made of an inorganic material. For example, the protective layer 140 may be made of an inorganic material such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiNxOy), or aluminum oxide (AllyOz), but is not limited thereto.

[0074] The bank 150 is provided on at least a portion of the protective layer 140 to overlap with the display area AA and covers the end of the anode AN and the end of the protective layer 140. The bank 150 is provided at the boundary between adjacent sub-pixels SP to reduce color mixing of light emitted from the light emitting diode OLED of each of the plurality of sub-pixels SP. The bank 150 may be made of an insulating material, for example, polyimide, acryl, or benzocyclobutene (BCB)-based resin, but is not limited thereto.

[0075] An adhesive layer 160 is provided on the cathode CA. The adhesive layer 160 can bond the first substrate 110 to the second substrate 170. The adhesive layer 160 can be made of any one of a resin such as an epoxy resin, a phenolic resin, an amino resin, an unsaturated polyester, a polyimide, a silicone resin, an acrylic resin, a vinyl resin, and an olefin resin. The adhesive layer 160 can be adhered by a high-energy curing method (for example, by using heat, ultraviolet rays, or a laser), or can be adhered by using a pressure-sensitive adhesive (PSA) to apply physical pressure. The adhesive layer 160 can also be configured by multiple layers. For example, the adhesive layer 160 can include a layer comprising an epoxy resin and a polyolefin and a hygroscopic filter layer. In this case, the hygroscopic filter layer can be made of a hygroscopic agent. The adhesive layer 160 can be configured to be larger than the size of the display area AA and cover the entire display area AA so as to obtain an encapsulation effect by covering all the light-emitting diodes OLED in the display area AA.

[0076] A second substrate 170 is provided on the adhesive layer 160. The second substrate 170 may be a thin metal substrate (face seal metal (FSM)) made of an opaque material. More specifically, the second substrate 170 may be provided to completely cover the display area AA to protect the plurality of sub-pixels SP provided on the first substrate 110 from external impact and scratches. The metal forming the second substrate 170 may be, for example, a material having a high modulus of approximately 200 MPa to 900 MPa, and may be aluminum (Al), nickel (Ni), chromium (Cr), or an alloy of iron (Fe) and nickel, which has high corrosion resistance and is easily processed into a thin film.

[0077] Return to reference Figure 1 , the second substrate 170 may have a smaller size than the first substrate 110. More specifically, the second substrate 170 is configured such that the flexible film 180 electrically connected to one end of the first substrate 110 is exposed to the outside. In this case, the end of the second substrate 170 and the end of the flexible film 180 may be spaced apart by a certain distance.

[0078] A film member may be provided below the first substrate 110. The film member may include at least one of a polarizer and a barrier film. For example, a polarizer is provided below the first substrate 110. The polarizer may selectively transmit light to reduce the reflection of external light incident on the first substrate 110. Specifically, in the display device 100, various metal materials used for semiconductor devices, wiring lines, light-emitting diodes, etc. are provided on the first substrate 110. Therefore, external light incident on the first substrate 110 may be reflected from the metal material, and the visibility of the display device 100 may be reduced due to the reflection of external light. In this case, the outdoor visibility of the display device 100 may be increased by providing a polarizer below the first substrate 110 that suppresses the reflection of external light. The polarizer may be adhered to the first substrate 110 by using an adhesive. However, depending on the implementation of the display device 100, the polarizer may be omitted.

[0079] Meanwhile, a barrier film may be provided below the first substrate 110, either with or without the polarizer. The barrier film can reduce or minimize the penetration of moisture and oxygen from outside the first substrate 110 into the interior of the first substrate 110, thereby protecting the light-emitting diode OLED. However, depending on the implementation of the display device 100, the barrier film may be omitted, but is not limited thereto.

[0080] A plurality of flexible films 180 are provided on one end of the non-display area NA of the first substrate 110. The plurality of flexible films 180 are films that provide various components on a flexible base film to provide signals to the plurality of sub-pixels SP in the display area AA. The plurality of flexible films 180 may be provided in the non-display area NA of the first substrate 110 to provide data voltages, etc. to the plurality of sub-pixels in the display area AA. Figure 1 In the embodiment, there are four flexible films 180 , but the number of flexible films 180 may vary according to design and is not limited thereto.

[0081] Driver ICs, such as gate driver ICs and data driver ICs, may be provided on the multiple flexible films 180. The driver ICs process data used to display images and drive signals used to process the data. Depending on the mounting method, the driver ICs may be provided in a chip-on-glass (COG) format, a chip-on-film (COF) format, a tape carrier package (TCP), or the like. In this disclosure, for ease of explanation, the driver ICs are described as being mounted on the multiple flexible films 180 in a COF format, but are not limited thereto.

[0082] The printed circuit board 190 is connected to the plurality of flexible films 180. The printed circuit board 190 is a component for providing signals to the driver IC. Various components for providing various signals such as driving signals, data voltages, etc. to the driver IC may be provided on the printed circuit board 190. Figure 1 In the embodiment, there are two printed circuit boards 190, but the number of printed circuit boards 190 may vary according to design and is not limited thereto.

[0083] Reference Figure 3 In the display device 100 according to an exemplary embodiment of the present disclosure, the inorganic insulating layer 120, the planarization layer 130, the protective layer 140, the embankment 150, and the adhesive layer 160 extend from the display area AA of the first substrate 110 to be disposed in the non-display area NA.

[0084] The insulating layer 121 , the buffer layer 122 , and the gate insulating layer 123 included in the inorganic insulating layer 120 may be provided by extending up to the end of the first substrate 110 .

[0085] A link line LNK is disposed on the gate insulating layer 123. The link line LNK may transmit a signal by being connected to various signal lines or power lines disposed in the display area AA.

[0086] The link line LNK may be made of the same material as the gate electrode GE, the source electrode SE, and the drain electrode DE. The link line LNK may be made of a conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof, but is not limited thereto.

[0087] A passivation layer 124 is disposed on the link line LNK, and a planarization layer 130 , a protective layer 140 , a bank 150 , an adhesive layer 160 , and a second substrate 170 are sequentially disposed on the passivation layer 124 .

[0088] The protective layer 140 may be provided by extending up to the end of the first substrate 110. The protective layer 140 may be provided to surround the side surface of the planarization layer 130. Therefore, the side surface of the planarization layer 130 (i.e., the end of the planarization layer 130) may be covered by the protective layer 140 made of an inorganic material without being exposed to the outside.

[0089] A plurality of first openings OP1 are provided in the protective layer 140 to expose the planarization layer 130. The plurality of first openings OP1 may be provided in a stripe shape or a mesh shape on a plane. Therefore, in one embodiment, one or more openings are formed in the protective layer 140 to expose one or more portions of the planarization layer 130.

[0090] The plurality of first openings OP1 can be formed by etching the protective layer 140 using the bank pattern before forming the bank 150 as a mask. Specifically, after forming the bank pattern on a portion not including the plurality of first openings OP1, the protective layer 140 on which the bank pattern is not provided is etched using the bank pattern as a mask, thereby forming the plurality of first openings OP1. Thereafter, the bank pattern can be reflowed along the plurality of first openings OP1 by heat treatment.

[0091] As described above, the bank 150 formed by reflowing the bank pattern may contact the planarization layer 130 through the plurality of first openings OP1. That is, portions of the lower surface of the bank 150 disposed in the plurality of first openings OP1 may contact the upper surface of the planarization layer 130 exposed through the plurality of first openings OP1.

[0092] The embankment 150 may be configured to have a curved upper surface along the plurality of first openings OP1. Therefore, the height h1 of the embankment 150 overlapping the protective layer 140 may be higher than the height h2 of the embankment 150 overlapping the plurality of first openings OP1. That is, the upper surface of the embankment 150 disposed on the protective layer 140 may be higher than the upper surface of the embankment 150 disposed in the first openings OP1. Here, the heights h1 and h2 of the embankment 150 refer to the heights from the substrate 110 to the upper surface of the embankment 150. In addition, the thickness d1 of the embankment 150 overlapping the protective layer 140 may be greater than the thickness d2 of the embankment 150 overlapping the plurality of first openings OP1. That is, the thickness d1 of the embankment 150 disposed on the protective layer 140 may be greater than the thickness d2 of the embankment 150 disposed in the first openings OP1. In one embodiment, the thickness of the embankment 150 disposed on the portion of the protective layer 140 may be greater than the thickness of the embankment 150 disposed on the portion of the planarization layer 130 that is in the first openings OP1. After forming the bank pattern on the portion excluding the plurality of first openings OP1, the bank pattern may be heat-treated so that the portion of the bank pattern disposed on the protective layer 140 may reflow toward the plurality of first openings OP1. Thus, the bank 150 may be disposed to have a curved upper surface along the plurality of first openings OP1.

[0093] An adhesive layer 160 is provided on the bank 150. In this case, the lower surface of the adhesive layer 160 may be in contact with the bank 150. Therefore, the adhesive layer 160 may absorb outgassing of the planarization layer 130 passing through the bank 150. In this case, the adhesive layer 160 may be provided along the curved upper surface of the bank 150 so as to be in contact with the bank 150 over a wide area.

[0094] Bottom-emission display devices use a surface-contact adhesive layer to slow moisture penetration. While the adhesive layer, along with the upper substrate, can slow moisture penetration from the top, it struggles to prevent moisture from penetrating through the organic layer at the outermost periphery (i.e., the non-display area). This leads to the following problem: moisture penetrating through the side surfaces of the organic layer at the outermost periphery interacts with the light-emitting diodes (LEDs) located at the edge of the display area, causing defects.

[0095] Therefore, in the display device 100 according to the exemplary embodiment of the present disclosure, the protective layer 140 may be provided between the planarization layer 130 and the bank 150 to suppress moisture from penetrating through the planarization layer 130 and the bank 150. Specifically, in the display device 100 according to the exemplary embodiment of the present disclosure, the protective layer 140 is provided in the display area AA and the non-display area NA extending from the display area AA, and is located between the planarization layer 130 and the bank 150. Therefore, the protective layer 140 can suppress moisture from penetrating through the interface between the planarization layer 130 made of an organic material and the bank 150. Additionally, the protective layer 140 is provided to surround the side surface of the planarization layer 130 in the non-display area NA. Therefore, the protective layer 140 can suppress moisture from penetrating through the side surface of the planarization layer 130 made of an organic material. Therefore, in the display device 100 according to the embodiment of the present disclosure, penetration of moisture through the planarization layer 130 and the bank 150 made of an organic material may be reduced or minimized.

[0096] In addition, in the display device 100 according to the exemplary embodiment of the present disclosure, moisture penetration through the planarization layer 130 and the embankment 150 in the non-display area NA can be reduced or minimized, thereby reducing or minimizing defects in the light-emitting diode OLED. Specifically, in the display device 100 according to the exemplary embodiment of the present disclosure, the protective layer 140 can be provided to surround the side surface of the planarization layer 130 and can be located between the planarization layer 130 and the embankment 150, thereby reducing or minimizing moisture penetration. Therefore, the planarization layer 130 provided on the upper portion of the light-emitting diode OLED can expand due to moisture penetration in a high temperature and high humidity environment, thereby reducing or minimizing the phenomenon of short circuit defects between electrodes electrically connected to the light-emitting diode OLED. This can improve the display quality in the display device 100 according to the exemplary embodiment of the present disclosure.

[0097] Meanwhile, outgassing may occur in the planarization layer 130 made of an organic material. Outgassing occurs in the planarization layer 130. If gas is trapped in the planarization layer 130 without being exhausted to the outside, a problem may occur in which components disposed on top of the planarization layer 130 are peeled off.

[0098] Therefore, in the display device 100 according to the exemplary embodiment of the present disclosure, a plurality of first openings OP1 may be provided in the protective layer 140 to provide a path through which outgassing from the planarization layer 130 is absorbed. Specifically, due to the provision of the plurality of first openings OP1 that expose the planarization layer 130, portions of the upper surface of the planarization layer 130 may not be covered by the protective layer 140, and the upper surface of the planarization layer 130 corresponding to the plurality of first openings OP1 may be in direct contact with the bank 150. This can provide a path through which outgassing within the planarization layer 130 can flow out through the bank 150 toward the adhesive layer 160 and be absorbed. Therefore, in the display device 100 according to the exemplary embodiment of the present disclosure, the plurality of first openings OP1 that expose the planarization layer 130 may be provided to provide a path through which outgassing from the planarization layer 130 is absorbed. This can improve the delamination effect caused by outgassing.

[0099] In the display device 100 according to the exemplary embodiment of the present disclosure, a plurality of first openings OP1 may be provided in the protective layer 140 so that the peeling phenomenon is reduced or minimized due to the curved upper surface of the embankment 150 provided along the plurality of first openings OP1. Specifically, in the display device 100 according to the exemplary embodiment of the present disclosure, the curved upper surface of the embankment 150 provided along the plurality of first openings OP1 may contact the lower surface of the adhesive layer 160. Therefore, compared with the case where the upper surface of the embankment 150 is flat, the bonding area between the embankment 150 and the adhesive layer 160 may be increased. Therefore, in the display device 100 according to the exemplary embodiment of the present disclosure, the adhesive force of the adhesive layer 160 may be increased by the curved upper surface of the embankment 150 provided along the plurality of first openings OP1.

[0100] In the display device 100 according to the exemplary embodiment of the present disclosure, the protective layer 140 can be formed using a bank pattern, thereby simplifying the process and reducing manufacturing costs. Specifically, in the display device 100 according to the exemplary embodiment of the present disclosure, the bank pattern is formed before forming the bank 150, and then a process of etching the protective layer 140 on which the bank pattern is not provided can be performed by using the bank pattern as a mask. Therefore, a separate process of patterning the protective layer 140 can be omitted, thereby reducing manufacturing costs. Therefore, in the display device 100 according to the exemplary embodiment of the present disclosure, the protective layer 140 can be formed using a bank pattern, thereby simplifying the process and reducing manufacturing costs.

[0101] Figure 4 is a cross-sectional view showing a display device according to another exemplary embodiment of the present disclosure. Figures 1 to 3 Compared with the display device 100 of FIG. 1 , in addition to the protective layer 240 , the bank 250 and the adhesive layer 260 , Figure 4 The display device 200 is configured to include substantially the same components. Therefore, redundant descriptions will be omitted.

[0102] Reference Figure 4 , a second opening OP2 may be provided in the embankment 250 to expose the planarization layer 130 in the plurality of first openings OP1. As described above, the plurality of first openings OP1 may be formed by etching the protective layer 240 using the embankment pattern before the embankment 250 is formed as a mask. At this time, the second opening OP2 may be formed by further widening the spacing between the embankment patterns. For example, although the spacing between the embankment patterns is basically set to the first spacing L1, the spacing between the embankment patterns at a specific position may be set to a second spacing L2 that is wider than the first spacing L1. In this case, even if reflow is performed later by heat treatment, the embankment patterns provided at the second spacing (i.e., the wider gap) may not be connected to each other. Therefore, as Figure 4 As shown, a portion in which the bank 250 is disconnected may be formed so that the second opening OP2 may be formed in the bank 250 .

[0103] Since the second openings OP2 are provided in the bank 250, the planarization layer 130 can be exposed through the plurality of first openings OP1 and second openings OP2. In the region where the first openings OP1 and second openings OP2 overlap, the upper surface of the planarization layer 130 can be exposed without being covered by the protective layer 240 and the bank 250. Therefore, the planarization layer 130 can be in contact with the adhesive layer 260 in the region where the first openings OP1 and second openings OP2 overlap. That is, a portion of the upper surface of the planarization layer 130 can be in direct contact with a portion of the lower surface of the adhesive layer 260. In one embodiment, the first portion of the bank 250 and the second portion of the bank 250 are separated from each other, and the adhesive layer 260 is in contact with the portion of the planarization layer 130 disposed between the first portion and the second portion of the bank 250.

[0104] In the display device 200 according to another exemplary embodiment of the present disclosure, a protective layer 240 may be provided between the planarization layer 130 and the bank 250 to suppress moisture from penetrating through the planarization layer 130 and the bank 250. Therefore, the protective layer 240 can suppress moisture from penetrating through the interface between the planarization layer 130 made of an organic material and the bank 250. In addition, the protective layer 240 can suppress moisture from penetrating through the side surface of the planarization layer 130 made of an organic material.

[0105] In the display device 200 according to another exemplary embodiment of the present disclosure, moisture permeation through the planarization layer 130 and the bank 250 in the non-display area NA may be reduced or minimized, thereby minimizing defects of the light emitting diode OLED and improving display quality of the display device 200 .

[0106] In the display device 200 according to another exemplary embodiment of the present disclosure, the protective layer 240 may be formed by using a bank pattern, thereby omitting a separate process of patterning the protective layer 240 and reducing manufacturing costs.

[0107] In a display device 200 according to another exemplary embodiment of the present disclosure, a plurality of first openings OP1 and a second opening OP2 may be provided to provide a path through which outgassing in the planarization layer 130 is absorbed. Specifically, due to the provision of the plurality of first openings OP1 and the second opening OP2 exposing the planarization layer 130, a portion of the upper surface of the planarization layer 130 may not be covered by the protective layer 240 and the bank 250. That is, the upper surface of the planarization layer 130 corresponding to the plurality of first openings OP1 may be in direct contact with the bank 250, and the upper surface of the planarization layer 130 corresponding to the second openings OP2 may be in direct contact with the adhesive layer 260. This may provide a path through which outgassing in the planarization layer 130 can be absorbed through the bank 250 or by flowing directly into the adhesive layer 260. Therefore, in a display device 200 according to another exemplary embodiment of the present disclosure, a plurality of first openings OP1 and a second opening OP2 exposing the planarization layer 130 may be provided to provide a path through which outgassing in the planarization layer 130 is absorbed. This can improve the peeling effect caused by outgassing.

[0108] In the display device 200 according to another exemplary embodiment of the present disclosure, a plurality of first openings OP1 and a second opening OP2 may be provided to reduce or minimize the peeling phenomenon. Specifically, in the display device 200 according to another exemplary embodiment of the present disclosure, the curved upper surface of the embankment 250 provided according to the plurality of first openings OP1 may contact the lower surface of the adhesive layer 260. Compared to the case where the embankment 250 has a flat upper surface, this can increase the bonding area between the embankment 250 and the adhesive layer 260. Therefore, the bonding force of the adhesive layer 260 can be increased. In addition, since the planarization layer 130 made of an organic material and the adhesive layer 260 can directly contact each other through the second opening OP2, the bonding force can be further increased. Therefore, in the display device 200 according to another exemplary embodiment of the present disclosure, the bonding force of the adhesive layer 260 can be increased by providing a plurality of first openings OP1 and a second opening OP2, thereby reducing or minimizing the peeling phenomenon.

[0109] Figure 5 is a cross-sectional view showing a display device according to another exemplary embodiment of the present disclosure. Figures 1 to 3 Compared with the display device 100 of FIG. 1 , in addition to the planarization layer 330 , the bank 350 and the adhesive layer 360 , Figure 5 The display device 300 is configured to include substantially the same components. Therefore, redundant descriptions will be omitted.

[0110] Reference Figure 5 , the planarization layer 330 may have an upper surface with a recessed portion OM. The recessed portions OM on the upper surface of the planarization layer 330 may be respectively arranged in areas corresponding to the plurality of first openings OP1. The process of forming recesses in the upper surface of the planarization layer 330 is described as follows: in a state where a protective layer 140 is formed on the planarization layer 330, a levee pattern with different heights is formed on the protective layer 140. For example, a first levee pattern with a first height is formed on a portion (region) of the non-display area NA adjacent to the display area AA. A second levee pattern with a second height lower than the first height is formed on a portion of the peripheral area of ​​the first levee pattern where the plurality of first openings OP1 are not provided. Thereafter, a plurality of first openings OP1 may be formed by etching the protective layer 140 using the levee pattern as a mask. Subsequently, an ashing process may be performed. The ashing process may be performed until the levee pattern with the second height is removed. Therefore, when the bank 350 having a height lower than the first height is formed on a portion (region) of the non-display area NA adjacent to the display area AA, the bank 350 is not provided on the protective layer 140. In the ashing process, portions of the planarization layer 330 overlapping with the plurality of first openings OP1 may be removed, and thus a recess OM may be formed in the upper surface of the planarization layer 330.

[0111] The protective layer 140 disposed between the plurality of first openings OP1 may be in contact with the adhesive layer 360. As described above, in the process of forming the bank 350 using the bank pattern having different heights, the bank 350 is not formed on the protective layer 140. Therefore, the protective layer 140 disposed between the plurality of first openings OP1 may be in direct contact with the adhesive layer 360. Therefore, in one embodiment, the bank 350 is not provided on another portion of the protective layer 140 between the first opening OP1 and another first opening OP1 in the protective layer 140.

[0112] Additionally, the recessed portion OM in the upper surface of the planarization layer 330 may be in contact with the adhesive layer 360. As described above, in the process of removing the bank pattern by the ashing process, portions of the planarization layer 330 may also be removed, and thus the recessed portion OM formed in the upper surface of the planarization layer 330, overlapping with the plurality of first openings OP1, may be exposed without being covered by the protective layer 140 and the bank 350. Therefore, the recessed portion in the upper surface of the planarization layer 330 may be in direct contact with the adhesive layer 360.

[0113] In the display device 300 according to another exemplary embodiment of the present disclosure, a protective layer 140 may be provided between the planarization layer 330 and the bank 350 to suppress moisture from penetrating through the planarization layer 330 and the bank 350. Therefore, the protective layer 140 can suppress moisture from penetrating through the interface between the planarization layer 330 made of an organic material and the bank 350. In addition, the protective layer 140 can suppress moisture from penetrating through the side surface of the planarization layer 330 made of an organic material.

[0114] In the display device 300 according to another exemplary embodiment of the present disclosure, moisture permeation through the planarization layer 330 and the embankment 350 in the non-display area NA can be reduced or minimized, thereby reducing or minimizing defects of the light emitting diode OLED and improving the display quality of the display device 300.

[0115] In the display device 300 according to still another exemplary embodiment of the present disclosure, the protective layer 140 may be formed by using a bank pattern, thereby omitting a separate process of patterning the protective layer 140 and reducing manufacturing costs.

[0116] In the display device 300 according to another embodiment of the present disclosure, a plurality of first openings OP1 may be provided to provide a path through which outgassing of the planarization layer 330 is absorbed. Specifically, by providing a plurality of first openings OP1 that expose the planarization layer 330, portions of the upper surface of the planarization layer 330 may not be covered by the protective layer 140. That is, the upper surface of the planarization layer 330 corresponding to the plurality of first openings OP1 may be in direct contact with the adhesive layer 360. This may provide a path through which outgassing within the planarization layer 330 may be absorbed by flowing directly toward the adhesive layer 360. Therefore, in the display device 300 according to another exemplary embodiment of the present disclosure, the plurality of first openings OP1 that expose the planarization layer 330 may be provided to provide a path through which outgassing of the planarization layer 330 is absorbed. This may improve the peeling effect caused by outgassing.

[0117] In a display device 300 according to another exemplary embodiment of the present disclosure, the delamination phenomenon can be reduced or minimized by providing recesses OM in the upper surface of the planarization layer 330 in portions corresponding to the first openings OP1. Specifically, in the display device 300 according to another exemplary embodiment of the present disclosure, the recesses OM provided along the plurality of first openings OP1 on the upper surface of the planarization layer 330 can contact the lower surface of the adhesive layer 360. This can increase the bonding area between the planarization layer 330 and the adhesive layer 360 compared to a case where the planarization layer 330 has a flat upper surface. Thus, the bonding force of the adhesive layer 360 can be increased. On the other hand, the bonding force between organic materials can be stronger than the bonding force between inorganic materials and organic materials. Therefore, the direct contact between the planarization layer 330 made of an organic material and the adhesive layer 360 can significantly increase the bonding force compared to the bonding between the protective layer 140 made of an inorganic material and the adhesive layer 360. Therefore, in the display device 300 according to another exemplary embodiment of the present disclosure, since the adhesive force of the adhesive layer 360 is increased by the recess OM provided in the portion of the upper surface of the planarization layer 330 corresponding to the first opening OP1 , the peeling phenomenon may be reduced or minimized.

[0118] Figure 6 is a cross-sectional view showing a display device according to another exemplary embodiment of the present disclosure. Figure 5 Compared with the display device 300, in addition to the bank 450, Figure 6 The display device 400 is configured to include substantially the same components. Therefore, redundant descriptions will be omitted.

[0119] Reference Figure 6 , the embankment 450 is arranged to completely overlap with the protective layer 140 and may not overlap with the plurality of first openings OP1. The plurality of first openings OP1 can be formed by etching the protective layer 140 using the embankment 450 as a mask. Specifically, after forming the embankment 450 in the portion that does not include the plurality of first openings OP1, the protective layer 140 on which the embankment 450 is not provided is etched using the embankment 450 as a mask, thereby forming the plurality of first openings OP1. Therefore, the embankment 450 can be provided only in the region where it overlaps with the protective layer 140. Therefore, in one embodiment, the embankment 450 is provided on another portion of the protective layer 140 between the first opening OP1 in the protective layer 140 and another first opening OP1.

[0120] The planarization layer 330 may have recesses in its upper surface. The recesses OM in the upper surface of the planarization layer 330 may be provided in regions corresponding to the plurality of first openings OP1. The process of forming the recesses OM in the upper surface of the planarization layer 330 will be described below. The ashing process may be performed while the protective layer 140 having the plurality of first openings OP1 is formed on the planarization layer 330. Portions of the planarization layer 330 not covered by the protective layer 140 may be removed by the ashing process. Consequently, the recesses OM may be formed in the upper surface of the planarization layer 330.

[0121] The recessed portion OM in the upper surface of the planarization layer 330 may be in contact with the adhesive layer 460. As described above, since portions of the planarization layer 330 are removed by the ashing process, the recessed portion OM in the upper surface of the planarization layer 330 overlapping with the plurality of first openings OP1 may be exposed without being covered by the protective layer 140 and the bank 450. Therefore, the recessed portion OM in the upper surface of the planarization layer 330 may be in direct contact with the adhesive layer 460.

[0122] In a display device 400 according to another exemplary embodiment of the present disclosure, a protective layer 140 may be provided between the planarization layer 330 and the bank 450 to suppress moisture from penetrating through the planarization layer 330 and the bank 450. Therefore, the protective layer 140 can suppress moisture from penetrating through the interface between the planarization layer 330 made of an organic material and the bank 450. In addition, the protective layer 140 can suppress moisture from penetrating through the side surface of the planarization layer 330 made of an organic material.

[0123] In the display device 400 according to yet another exemplary embodiment of the present disclosure, moisture permeation through the planarization layer 330 and the bank 450 in the non-display area NA may be reduced or minimized, thereby minimizing defects of the light emitting diode OLED and improving display quality of the display device 400 .

[0124] In the display device 400 according to still another exemplary embodiment of the present disclosure, the protective layer 140 may be formed by using the bank 450 , thereby omitting a separate process of patterning the protective layer 140 and reducing manufacturing costs.

[0125] In the display device 400 according to another exemplary embodiment of the present disclosure, since the plurality of first openings OP1 are provided, the upper surface of the planarization layer 330 corresponding to the plurality of first openings OP1 can be in direct contact with the adhesive layer 460. This can provide a path through which outgassing inside the planarization layer 330 can be directly absorbed into the adhesive layer 460, thereby improving the peeling effect caused by outgassing.

[0126] In a display device 400 according to another exemplary embodiment of the present disclosure, delamination can be reduced or minimized by providing recessed portions OM provided in the upper surface of the planarization layer 330 in regions corresponding to the plurality of first openings OP1. Specifically, the side surfaces and upper surfaces of the embankment 450 provided between the recessed portions OM provided along the plurality of first openings OP1 in the upper surface of the planarization layer 330, as well as the plurality of first openings OP1, can contact the lower surface of the adhesive layer 460. Therefore, compared to a case where the upper surface of the planarization layer 330 is flat, the bonding area between the planarization layer 330 and the adhesive layer 460 can be increased. Furthermore, the bonding area can be increased by providing the side surfaces and upper surfaces of the embankment 450 provided between the plurality of first openings OP1, thereby increasing the adhesive force of the adhesive layer 460. Furthermore, the direct contact of the adhesive layer 460 with the planarization layer 330 and the embankment 450, both of which are made of an organic material, can further increase the adhesive force. Therefore, in the display device 400 according to another exemplary embodiment of the present disclosure, the peeling phenomenon can be minimized because the adhesive force of the adhesive layer 460 is increased by the recess OM provided in the area corresponding to the first opening OP1 provided in the upper surface of the planarization layer 330 and the side surface and upper surface of the embankment 450 provided between the multiple first openings OP1.

[0127] Exemplary embodiments of the present disclosure may also be described as follows:

[0128] According to one aspect of the present disclosure, a display device includes: a first substrate having a display area and a non-display area; a planarization layer disposed on the first substrate, located in the display area and the non-display area; a light-emitting diode, disposed on the planarization layer, located in the display area, and including an anode, an organic layer, and a cathode; a protective layer disposed on the planarization layer, located in the display area and the non-display area, and disposed to cover an end of the anode and surround a side surface of the planarization layer; a dam disposed on at least a portion of the protective layer to cover an end of the anode; a second substrate disposed to face the first substrate; and an adhesive layer disposed on the dam to adhere the second substrate to the first substrate.

[0129] A plurality of first openings may be provided in the protection layer to expose the planarization layer in the non-display area.

[0130] The bank may be in contact with the planarization layer in the plurality of first openings.

[0131] A height at which the embankment overlaps the protective layer may be higher than a height at which the embankment overlaps the plurality of first openings.

[0132] A thickness of the bank overlapping the protective layer may be thicker than a thickness of the bank overlapping the plurality of first openings.

[0133] A lower surface of the adhesive layer may be in contact with the bank in the non-display area.

[0134] Second openings exposing the planarization layer in the plurality of first openings may be provided in the bank.

[0135] The planarization layer exposed through the plurality of first and second openings may make contact with the adhesive layer.

[0136] The recessed portion provided in the upper surface of the planarization layer may be in contact with the adhesive layer.

[0137] The protection layer disposed between the plurality of first openings may be in contact with the adhesive layer.

[0138] The bank may be provided not to overlap with the plurality of first openings but to completely overlap with the protective layer.

[0139] The protective layer may be made of an inorganic material.

[0140] According to one aspect of the present disclosure, a display device includes: a substrate; a thin film transistor on the substrate; an insulating layer on the thin film transistor; a light-emitting diode on the insulating layer, the light-emitting diode including a first electrode, an organic light-emitting layer, and a second electrode; a protective layer on the insulating layer, wherein one or more openings may be formed in the protective layer to expose one or more portions of the insulating layer; a dam disposed on and in contact with at least a portion of the protective layer; an adhesive layer on the dam; and a second substrate on the adhesive layer.

[0141] The bank may be disposed within the opening in the protective layer on a portion of the insulating layer, and a first thickness of the bank on the portion of the insulating layer may be less than a second thickness of the bank on the portion of the protective layer.

[0142] The first portion of the bank and the second portion of the bank may be separated from each other, and the adhesive layer may be in contact with a portion of the insulating layer disposed between the first portion and the second portion of the bank.

[0143] The insulating layer within the opening may have a concave surface.

[0144] A bank may be provided on a second portion of the protective layer between the first opening and the second opening in the protective layer.

[0145] The bank may not be provided on the second portion of the protective layer between the first opening and the second opening in the protective layer.

[0146] The insulating layer may include an organic material, and the protective layer may include an inorganic material.

[0147] The protective layer may cover at least a portion of a side surface of the insulating layer in the non-display area of ​​the substrate, and the protective layer may cover an end portion of the first electrode of the light emitting diode in the display area.

Claims

1. A display device comprising: A first substrate having a display area and a non-display area; a planarization layer disposed on the first substrate and located in the display area and the non-display area; a light emitting diode disposed on the planarization layer, located in the display area, and comprising an anode, an organic layer, and a cathode; a protective layer disposed on the planarization layer, located in the display area and the non-display area, and disposed to cover an end portion of the anode and surround a side surface of the planarization layer; a bank provided on at least a portion of the protective layer to cover the end portion of the anode; a second substrate disposed to face the first substrate; as well as An adhesive layer is provided on the bank to adhere the second substrate to the first substrate.

2. The display device according to claim 1, wherein A plurality of first openings are provided in the protection layer to expose the planarization layer in the non-display area.

3. The display device according to claim 2, wherein: The bank contacts the planarization layer in the plurality of first openings.

4. The display device according to claim 3, wherein A height at which the embankment overlaps the protection layer is higher than a height at which the embankment overlaps the plurality of first openings.

5. The display device according to claim 3, wherein The thickness of the bank overlapping the protective layer is thicker than the thickness of the bank overlapping the plurality of first openings. The display device according to claim 3 , wherein: A lower surface of the adhesive layer contacts the bank in the non-display area.

7. The display device according to claim 3, wherein: A second opening exposing the planarization layer in the plurality of first openings is provided in the bank.

8. The display device according to claim 7, wherein: The planarization layer exposed through the plurality of first openings and the second openings contacts the adhesive layer.

9. The display device according to claim 3, wherein: The recessed portion provided in the upper surface of the planarization layer is in contact with the adhesive layer.

10. The display device according to claim 3, wherein The protection layer disposed between the plurality of first openings is in contact with the adhesive layer.

11. The display device according to claim 3, wherein The bank is provided so as not to overlap with the plurality of first openings but to completely overlap with the protective layer.

12. The display device according to claim 1, wherein The protective layer is made of inorganic material.

13. A display device comprising: substrate; a thin film transistor on the substrate; an insulating layer on the thin film transistor; A light emitting diode on the insulating layer, the light emitting diode comprising: the first electrode, an organic light-emitting layer, and a second electrode; a protective layer on the insulating layer, wherein one or more openings are formed in the protective layer to expose one or more portions of the insulating layer; a bank disposed on and in contact with at least a portion of the protective layer; an adhesive layer on the bank; and A second substrate is on the adhesive layer.

14. The display device according to claim 13, wherein: The bank is disposed within the opening in the protective layer over a portion of the insulating layer, and wherein a first thickness of the bank over the portion of the insulating layer is less than a second thickness of the bank over the portion of the protective layer.

15. The display device according to claim 13, wherein The first portion of the bank and the second portion of the bank are separated from each other, and wherein the adhesive layer is in contact with a portion of the insulating layer disposed between the first portion and the second portion of the bank.

16. The display device according to claim 13, wherein The insulating layer has a concave surface within the opening.

17. The display device according to claim 16, wherein: The bank is provided on a second portion of the protective layer between the first opening and the second opening in the protective layer.

18. The display device according to claim 16, wherein: The bank is not provided on a second portion of the protective layer between the first opening and the second opening in the protective layer.

19. The display device according to claim 13, wherein The insulating layer includes an organic material, and the protective layer includes an inorganic material.

20. The display device according to claim 13, wherein The protective layer covers at least a portion of a side surface of the insulating layer in a non-display area of ​​the substrate, and wherein the protective layer covers an end portion of the first electrode of the light emitting diode in a display area.

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