Display device

Abstract

Embodiments of the present disclosure relate to a display device, and may provide a display device. The display device includes a metal layer disposed at a boundary between a display area and a non-display area, a protective layer on the metal layer and including a first portion overlapping the metal layer, and a second portion on a substrate and not overlapping the metal layer, and a photosensitive resin layer between the substrate and the second portion to delay a time in which moisture and oxygen permeate into the display area.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2024-0028075, filed on February 27, 2024, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] An embodiment of the present disclosure relates to a display device. Background Art

[0004] The development of a smart society has led to an increase in demand for various types of display devices.

[0005] In the display industry, flat panel display devices (FPDs), which can be made thin and light and have large screen areas, have rapidly replaced bulky cathode ray tubes (CRTs).

[0006] Flat panel display devices include liquid crystal displays (LCDs), plasma display panels (PDPs), organic light emitting displays (OLEDs), and electrophoretic displays (EDs).

[0007] Among them, the organic light emitting display device is a self-luminous device that emits light by itself, and has advantages such as fast response, high light emitting efficiency and brightness, and a wide viewing angle.

[0008] In particular, an organic light emitting display device can be formed on a flexible substrate and can be driven at a lower voltage, consume less power, and express brighter colors than a plasma display panel or an inorganic electroluminescent (EL) display. Summary of the Invention

[0009] Since moisture and oxygen permeation occurs very strongly in organic films, an undercut structure is used to prevent or at least reduce moisture and oxygen permeation into the frame portion. However, there is a problem that the cathode electrode and the inorganic film have a step that adversely affects the formation of seamless step coverage due to the steps of the undercut structure. Therefore, the inventors of the present disclosure have invented a display device in which the cathode electrode and the inorganic film can form seamless step coverage.

[0010] Embodiments of the present disclosure may provide a display device capable of delaying the time at which moisture and oxygen penetrate into a display area.

[0011] Embodiments of the present disclosure may provide a display device capable of process optimization.

[0012] An embodiment of the present disclosure may provide a display device comprising: a substrate comprising a display area and a non-display area surrounding the display area; a metal layer disposed on the substrate and at a boundary between the display area and the non-display area; a protective layer located on the metal layer and comprising a first portion overlapping with the metal layer and a second portion located on the substrate and not overlapping with the metal layer; and a photosensitive resin layer located between the substrate and the second portion.

[0013] An embodiment of the present disclosure may provide a display device comprising a substrate comprising a display area and a non-display area surrounding the display area, a filler layer disposed on the substrate at a boundary between the display area and the non-display area and comprising a first portion comprising a metal or an alloy thereof and a second portion comprising a photosensitive resin, and a protective layer located on the filler layer.

[0014] According to an embodiment of the present disclosure, a display device capable of delaying the time at which moisture and oxygen penetrate into a display area may be provided.

[0015] According to an embodiment of the present disclosure, a display device capable of process optimization can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other objects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0017] Figure 1 is a diagram illustrating a system configuration of a display device according to an embodiment of the present disclosure.

[0018] Figure 2A and Figure 2B is a plan view illustrating an example of a position where an undercut region is provided in a display panel applied to a display device according to an embodiment of the present disclosure.

[0019] Figure 3A and Figure 3B It shows Figure 2A and Figure 2B An enlarged plan view of area X.

[0020] Figure 4A and Figure 4B It is along Figure 3A Line I-I' and Figure 3B A cross-sectional view taken along line II-II'.

[0021] Figure 5 It shows the settings Figure 2A and Figure 2B sectional view of an example of an undercut region in region X.

[0022] Figure 6 is a diagram showing an embodiment according to the present disclosure Figure 4A An enlarged cross-sectional view of region Y.

[0023] Figure 7 Another embodiment according to the present disclosure is shown Figure 4A An enlarged cross-sectional view of region Y.

[0024] Figure 8A 、 8B 8C are views briefly illustrating a process of forming a partial area of ​​a display panel according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0025] In the following description of examples or embodiments of the present disclosure, reference will be made to the accompanying drawings, which show by way of illustration specific examples or embodiments that can be implemented, and in which the same reference numerals and symbols may be used to represent the same or similar parts even when the same or similar parts are shown in different drawings from each other. In addition, in the following description of examples or embodiments of the present disclosure, when it is determined that the description of well-known functions and components incorporated herein may make the subject matter of some embodiments of the present disclosure unclear, the detailed description will be omitted. Terms such as "including," "having," "containing," "consisting of," "consisting of," and "formed of" as used herein are generally intended to allow for the addition of other components unless these terms are used together with the term "only." As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise.

[0026] Terms such as "first," "second," "A," "B," "(A)," or "(B)" may be used herein to describe elements of the present disclosure. Each of these terms is not used to define the nature, order, sequence, or quantity of the elements, but is only used to distinguish the corresponding element from other elements.

[0027] When it is mentioned that a first element is “connected or coupled to”, “contacting or overlapping”, etc., with a second element, it should be interpreted that not only the first element may be “directly connected or coupled to” or “directly contacting or overlapping” with the second element, but also a third element may be “interposed” between the first and second elements, or the first and second elements may be “connected or coupled to”, “contacting or overlapping”, etc., with each other via a fourth element. Here, the second element may be included in at least one of the two or more elements “connected or coupled to”, “contacting or overlapping”, etc., with each other.

[0028] When time relative terms such as “after,” “subsequently,” “next,” “before” are used to describe a process or operation of an element or configuration, or a flow or step in an operation, process, or method of manufacture, these terms may be used to describe non-sequential or non-sequential processes or operations unless the terms “directly” or “immediately” are used together.

[0029] In addition, when referring to any dimension, relative size, etc., it should be considered that the numerical value of the element or feature, or corresponding information (e.g., level, range, etc.) includes tolerances or error ranges that may be caused by various factors (e.g., process factors, internal or external influences, noise, etc.) even when no relevant description is specified. In addition, the term "may" fully encompasses all meanings of the term "can."

[0030] When describing embodiments of the present disclosure, the term "Group" refers to a Group in the Periodic Table of the Elements.

[0031] Furthermore, when describing embodiments of the present disclosure, "period" refers to a period in the periodic table of elements.

[0032] “Group II” may include Group IIA (or 2A) and Group IIB (or 2B), and Group II elements may include, but are not limited to, Be, Mg, Ca, Sr, Zn, Cd, and Hg.

[0033] “Group III” may include Group IIIA (or 3A) and Group IIIB (or 3B), and Group III elements may include, but are not limited to, In, Ga, Al, and Tl.

[0034] Hereinafter, various embodiments of the present disclosure are described in detail with reference to the accompanying drawings.

[0035] Figure 1 is a diagram illustrating a system configuration of a display device according to an embodiment of the present disclosure.

[0036] refer to Figure 1 The display driving system of the display device 100 according to an embodiment of the present disclosure may include a display panel 110 and a display driving circuit for driving the display panel 110 .

[0037] The display panel 110 may include a display area AA where an image is displayed and a non-display area NA where no image is displayed.

[0038] The display panel 110 may include a plurality of sub-pixels SP disposed on a substrate SUB for image display.

[0039] The display panel 110 may include a plurality of signal lines disposed on a substrate SUB.

[0040] For example, the plurality of signal lines may include data lines DL, gate lines GL, driving voltage lines, and the like.

[0041] Each of the plurality of data lines DL is disposed while extending in a first direction (eg, a column direction or a row direction), and each of the plurality of gate lines GL is disposed while extending in a direction crossing the first direction.

[0042] The display driving circuit may include a data driving circuit 120 and a gate driving circuit 130 , and may further include a controller 140 for controlling the data driving circuit 120 and the gate driving circuit 130 .

[0043] The data driving circuit 120 may output data signals (also referred to as data voltages) corresponding to image signals to the plurality of data lines DL.

[0044] The gate driving circuit 130 may generate a gate signal and output the gate signal to the plurality of gate lines GL.

[0045] The controller 140 may convert input image data input from the external host 150 to satisfy a data signal format used in the data driving circuit 120 and provide the converted image data to the data driving circuit 120 .

[0046] The data driving circuit 120 may include one or more source driver integrated circuits.

[0047] For example, each source driver integrated circuit may be connected to the display panel 110 via a tape automated bonding (TAB) method, or connected to a bonding pad of the display panel 110 via a chip on glass (COG) or chip on panel (COP) method, or may be implemented and connected to the display panel 110 via a chip on film (COF) method.

[0048] The gate driving circuit 130 may be connected to the display panel 110 by a tape automated bonding (TAB) method, connected to a bonding pad of the display panel 110 by a COG or COP method, connected to the display panel 110 by a COF method, or may be formed in the non-display area NA of the display panel 110 by a gate in panel (GIP) method.

[0049] refer to Figure 1 In the display device 100 according to an embodiment of the present disclosure, each sub-pixel SP may include a light emitting element ED and a pixel driving circuit SPC for driving the light emitting element ED. The pixel driving circuit SPC may include a driving transistor DRT, a scanning transistor SCT, and a storage capacitor Cst.

[0050] The driving transistor DRT may control current flowing to the light emitting element ED to drive the light emitting element ED.

[0051] The scan transistor SCT may transfer the data voltage Vdata to the second node N2 which is the gate node of the driving transistor DRT.

[0052] The storage capacitor Cst may be configured to maintain a voltage for a predetermined period of time.

[0053] The light emitting element ED may include an anode electrode AE ​​and a cathode electrode CE, and a light emitting layer EL located between the anode electrode AE ​​and the cathode electrode CE.

[0054] The anode electrode AE ​​may be a pixel electrode related to the light emitting element ED forming each sub-pixel SP and may be electrically connected to the first node N1 of the driving transistor DRT.

[0055] The cathode electrode CE may be a common electrode involving the light emitting elements ED forming all sub-pixels SP, and a ground voltage EVSS may be applied thereto.

[0056] For example, the light emitting element ED may be an organic light emitting diode OLED, an inorganic light emitting diode (LED), or a quantum dot light emitting element which is a self-luminous semiconductor crystal.

[0057] The driving transistor DRT is a transistor for driving the light emitting element ED and may include a first node N1 , a second node N2 , and a third node N3 .

[0058] The first node N1 may be a source node or a drain node and may be electrically connected to the anode electrode AE ​​of the light emitting element ED.

[0059] The second node N2 is a gate node and may be electrically connected to a source node or a drain node of the scan transistor SCT.

[0060] The third node N3 may be a drain node or a source node and may be electrically connected to a driving voltage line DVL providing a driving voltage EVDD.

[0061] For convenience of description, in examples described below, the first node N1 is a source node, and the third node N3 may be a drain node.

[0062] The scan transistor SCT may switch the connection between the data line DL and the second node N2 of the driving transistor DRT.

[0063] The scan transistor SCT may control connection between the second node N2 of the drive transistor DRT and a corresponding data line DL of the plurality of data lines DL in response to a scan signal SCAN supplied from a scan line SCL as a type of gate line GL.

[0064] The storage capacitor Cst may be configured between the first node N1 and the second node N2 of the driving transistor DRT.

[0065] Figure 1 The structure of the sub-pixel SP shown is merely an example for description and may further include one or more transistors or one or more storage capacitors.

[0066] The plurality of sub-pixels SP may have the same structure, or some of the plurality of sub-pixels SP may have different structures.

[0067] Each of the driving transistor DRT and the scanning transistor SCT may be an n-type transistor or a p-type transistor.

[0068] The display device 100 according to an embodiment of the present disclosure may have a top emission structure or a bottom emission structure.

[0069] A top emission structure is described below as an example.

[0070] For example, in a top emission structure, the anode electrode AE ​​may be a reflective metal, and the cathode electrode CE may be a transparent conductive film.

[0071] Figure 2A and Figure 2B is a plan view illustrating an example of a position where an undercut region is provided in a display panel applied to a display device according to an embodiment of the present disclosure.

[0072] refer to Figure 2A and Figure 2B , in the display panel 110 applied to the display device according to the embodiment of the present disclosure, the non-display area NA surrounds the display area AA.

[0073] The non-display area NA includes a first non-display area NA1 including the data driving circuit 120, a second non-display area NA2 including the gate driving circuit 130, a third non-display area NA3 facing the first non-display area NA1, and a fourth non-display area NA4 facing the second non-display area NA2.

[0074] refer to Figure 2A and Figure 2B , the undercut area UCA may be provided along a boundary between the display area AA and the non-display area NA of the display panel 110 .

[0075] The undercut area UCA may be provided in either the display area AA or the non-display area NA, and may be provided in both areas.

[0076] For example, reference Figure 2A, the undercut area UCA may be provided in the display area AA along a boundary between the display area AA and the non-display area NA.

[0077] In addition, reference Figure 2B , the undercut area UCA may be provided in the non-display area NA along a boundary between the display area AA and the non-display area NA.

[0078] The undercut area UCA may be disposed along a boundary line between the display area AA and at least one of the first to fourth non-display areas.

[0079] For example, the undercut area UCA may be disposed along a boundary line between the display area AA and the second non-display area NA2 , and the undercut area UCA may be disposed along a boundary line between the display area AA and the first and second non-display areas NA1 and NA2 .

[0080] The undercut area UCA may be disposed along a boundary line between the display area AA and the first and third non-display areas NA1 and NA3 , and the undercut area UCA may be disposed along a boundary line between the display area AA and the second and fourth non-display areas NA2 and NA4 .

[0081] The undercut area UCA may be continuously provided along a boundary line of the first non-display area NA1 or may be partially provided.

[0082] The undercut area UCA may be continuously disposed along a boundary line of adjacent non-display areas.

[0083] For example, when the undercut area UCA is disposed on the boundary line between the display area AA and the first and second non-display areas NA1 and NA2 , the undercut area UCA may be continuously disposed along the boundary line between the first and second non-display areas NA1 and NA2 .

[0084] Figure 3A and Figure 3B It shows Figure 2A and Figure 2B An enlarged plan view of region X, Figure 4A It is along Figure 3A A cross-sectional view taken along line II' of Figure 4B It is along Figure 3B A cross-sectional view taken along line II-II', and Figure 5 It shows the settings Figure 2A and Figure 2B A cross-sectional view of an example of an undercut region in the X region.

[0085] Hereinafter, specifically, the embodiment of the present disclosure is described using the second non-display area NA2 in which the gate driving circuit 130 is disposed in a GIP type in the non-display area NA.

[0086] When the gate driving circuit 130 is disposed in the fourth non-display area NA4 facing the second non-display area NA2 in a GIP type, the structure of the fourth non-display area NA4 may be substantially the same as that of the second non-display area NA2.

[0087] In the present disclosure, when A is substantially the same as B, this may mean that A and B are considered to be the same taking into account slight differences due to processing errors.

[0088] The first and third non-display areas NA1 and NA3 may have substantially the same structure as the undercut area of ​​the second non-display area NA2 , except that the gate driving circuit 130 is not provided.

[0089] refer to Figures 3A to 5 The display device 100 according to an embodiment of the present disclosure may include a substrate SUB including a display area AA for displaying an image through a plurality of sub-pixels and a non-display area NA surrounding the display area AA; metal layers 230 and 231 disposed on the substrate SUB and disposed at a boundary between the display area AA and the non-display area NA; a protective layer 310 disposed on the metal layers 230 and 231; and an undercut structure UC disposed along the boundary between the display area AA and the non-display area NA. The undercut area UCA may include the protective layer disposed on the substrate SUB and disposed at the boundary between the display area AA and the non-display area NA. The undercut structure UC may include a protruding edge of the layer 310.

[0090] The display device 100 according to an embodiment of the present disclosure may include an anode electrode 331 arranged on a protective layer 310, a dam layer 320 arranged on the anode electrode 331, a light-emitting layer 333 arranged on the anode electrode 331 and the dam layer 320, a cathode electrode 335 arranged on the light-emitting layer 333, a covering layer 340 arranged on the cathode electrode 335, a passivation layer 410 covering the covering layer 340, an encapsulation layer 420 arranged on the upper surface of the passivation layer 410, and an encapsulation substrate 430 arranged on the encapsulation layer 420.

[0091] The display device according to an embodiment of the present disclosure may include an undercut structure UCS disposed in the undercut area UCA along the display area AA.

[0092] exist Figure 3A In FIG. 1 , an undercut structure UCS is shown to be disposed in the undercut area UCA, but this is for the sake of convenience of description and is not necessarily limited thereto. Figure 3B As shown, several undercut structures UCS may be provided in the undercut area UCA.

[0093] refer to Figures 3A to 5 , the substrate SUB may be a glass substrate or a plastic substrate, and may be formed of various types of films.

[0094] The light shielding layer 210 may be disposed on the substrate SUB.

[0095] The light shielding layer 210 may be a plurality of signal lines.

[0096] For example, the plurality of signal lines may be GIP output lines, data lines, reference voltage lines, driving voltage lines, and the like.

[0097] The buffer layer 220 may be provided on a plurality of signal lines.

[0098] The buffer layer 220 serves to protect a thin film transistor (not shown) formed in a subsequent process from impurities such as alkali ions released from the substrate SUB.

[0099] The buffer layer 220 may be a single layer of silicon oxide (SiOx) or silicon nitride (SiNx) or a multilayer thereof.

[0100] Metal layers 230 and 231 may be disposed on the buffer layer 220 .

[0101] The metal layers 230 and 231 may be gate lines 231 .

[0102] The metal layers 230 and 231 may include any one of metals such as aluminum (Al), gold (Au), silver (Ag), copper (Cu), tungsten (W), molybdenum (Mo), chromium (Cr), tantalum (Ta), titanium (Ti), etc., or alloys thereof, but are not limited thereto.

[0103] A protection layer 310 including a first portion overlapping the metal layers 230 and 231 and a second portion not overlapping the metal layers 230 and 231 may be disposed on the metal layers 230 and 231 .

[0104] refer to Figure 4A and Figure 4B , the undercut region may include an undercut structure UC in which the metal layer 231 is located within a lower portion of the protection layer 310 .

[0105] In other words, one end of the protection layer 310 may be disposed to protrude further outward than the edge of the metal layer 231 .

[0106] The undercut structure UC may be formed by wet etching.

[0107] refer to Figure 4A and Figure 4B, the undercut structure UCS may have the undercut structure UC including the metal layer 231 below the protection layer 310 and in which the metal layer 231 is located in a lower portion of the protection layer 310 .

[0108] exist Figure 4A In FIG. 1 , only one undercut structure UCS is shown, but this is exemplified for the convenience of description, and the arrangement is not limited thereto. Figure 4B As shown, several undercut structures UCS can be provided.

[0109] The bank layer 320 may be disposed on the protection layer 310 .

[0110] Figure 4A and Figure 4B It is illustrated that one end of the protective layer 310 and one end of the bank layer 320 are substantially the same in the undercut region, but this is exemplary and the present disclosure is not necessarily limited thereto.

[0111] However, according to one embodiment, one end of the protection layer 310 and one end of the bank layer 320 are substantially the same in the undercut region.

[0112] The bank layer 320 may include an ultraviolet (UV) blocking material.

[0113] Since the bank layer 320 includes the ultraviolet blocking material, ultraviolet rays may be prevented from reaching the undercut structure UC located in the lower portion of the protective layer 310 during exposure.

[0114] Here, when the bank layer 320 covers the upper and side surfaces of the protective layer 310 , UV rays do not reach the lower portion of the bank layer 320 including the UV blocking material, so that a photosensitive resin layer 500 to be described below may remain in the undercut structure UC.

[0115] However, the present disclosure is not limited thereto, and the UV blocking material may be included or not, depending on the type of a photosensitive resin layer provided in the undercut structure UC, which will be described below.

[0116] For example, when the photosensitive resin layer is a positive photosensitive resin layer, it is preferable to include an ultraviolet blocking material in the bank layer 320 .

[0117] As another example, when the photosensitive resin layer is a negative photosensitive resin layer, the bank layer 320 does not include an ultraviolet blocking material.

[0118] When a negative-type photosensitive resin is used as the photosensitive resin, a mask may be used instead of not including a UV blocking material in the bank layer 320 to allow a photosensitive resin layer 500 described below to remain in the undercut structure UC.

[0119] Meanwhile, a planarization layer (not shown) may be disposed on the protection layer 310 .

[0120] refer to Figure 5 The pixel driving circuit layer 250 including a light shielding layer, a buffer layer, a metal layer, a protective layer, etc. can be disposed on the substrate SUB.

[0121] The pixel driving circuit layer 250 may include a pixel driving circuit including a driving transistor.

[0122] The light emitting device 330 may be disposed on the pixel driving circuit layer 250 .

[0123] The light emitting device 330 may include an anode electrode 331 , a light emitting layer 333 , and a cathode electrode 335 .

[0124] The anode electrode 331 is a pixel electrode and may be independently provided in each sub-pixel.

[0125] The anode electrode 331 may be formed of a metal, an alloy thereof, and a combination of a metal and an oxide metal, and may include a transparent conductive material.

[0126] The anode electrode 331 may be formed by stacking a transparent electrode, an opaque electrode, or a transparent electrode and an opaque electrode.

[0127] In addition, the anode electrode 331 may be a transflective electrode or a reflective electrode.

[0128] For example, the anode electrode 331 may be formed of one of ITO, IZO, ITZO, ITO / APC / ITO, AINd / ITO, Ag / ITO, or ITO / APC / ITO.

[0129] The bank layer 320 may be provided to cover the outer edge, and thus, may form an opening through which light is output from one pixel.

[0130] In other words, the bank layer 320 may be provided in the display area and the non-display area, and an opening through which the anode electrode 331 of each pixel is exposed may be formed in the bank layer 320 provided in the display area, and light may be output through the opening.

[0131] The bank layer 320 may be formed of at least one inorganic layer or at least one organic layer.

[0132] In addition, the bank layer 320 may be formed by stacking at least one inorganic layer and at least one organic layer.

[0133] The bank layer 320 may cover the undercut structure UC in the undercut area UCA.

[0134] In other words, the bank layer 320 may cover the edge of the protective layer 310 and the metal layers 230 and 231 disposed in the lower portion of the protective layer 310 .

[0135] The light emitting layer 333 may be provided to cover the anode electrode 331 and the bank layer 320 .

[0136] The light emitting layer 333 may be any one of an organic light emitting layer, an inorganic light emitting layer and a quantum dot light emitting layer.

[0137] In addition, the light emitting layer 333 may include a stacked or mixed structure of an organic light emitting layer (or an inorganic light emitting layer) and a quantum dot light emitting layer.

[0138] The light emitting layer 333 may be composed of a multilayer of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer to improve light emitting efficiency.

[0139] The cathode electrode 335 is provided on the light emitting layer 333 .

[0140] The cathode electrode 335 is a common electrode and may be commonly provided in all sub-pixels.

[0141] The cathode electrode 335 may be a transflective electrode or a reflective electrode.

[0142] In addition, the cathode electrode 335 may be formed by stacking a transparent electrode, an opaque electrode, or a transparent electrode and an opaque electrode.

[0143] For example, the cathode electrode 335 can be any one selected from the group consisting of silver (Ag), aluminum (Al), magnesium (Mg), chromium (Cr), titanium (Ti), nickel (Ni), tungsten (W), gold (Au), tantalum (Ta), copper (Cu), cobalt (Co), iron (Fe), molybdenum (Mo) and platinum (Pt), or an alloy of the metals.

[0144] For example, when the display device according to an embodiment of the present disclosure uses a top emission method in which light is output to the outside through the cathode electrode 335, the cathode electrode 335 can be formed of a transparent metal such as ITO or IZO, or can be formed of a metal mixed material including magnesium (Mg) and silver (Ag).

[0145] In this case, the anode electrode 331 may include a transparent electrode and a reflective electrode.

[0146] Meanwhile, a capping layer 340 may be disposed on the cathode electrode 335 .

[0147] The capping layer 340 may serve to protect the cathode electrode 335 .

[0148] refer to Figure 5, the light emitting layer 333 and the cathode electrode 335 may be configured to be disconnected by an undercut structure UC in the undercut area UCA.

[0149] In the undercut area UCA, the light emitting layer 333 and the cathode electrode 335 may cover side surfaces of the pixel driving circuit layer 250 and the bank layer 320 .

[0150] The pixel driving circuit layer 250 may include at least one of a light shielding layer, a buffer layer, a metal layer, and a protective layer.

[0151] refer to Figure 5 , a side surface of the light emitting layer 333 disposed in the undercut area UCA may be covered by the cathode electrode 335 .

[0152] The passivation layer 410 may be disposed on the capping layer 340 .

[0153] The encapsulation layer 420 and the encapsulation substrate 430 may be disposed on the passivation layer 410 .

[0154] The encapsulation layer 420 may cover side surfaces and an upper surface of the passivation layer 410 .

[0155] like Figure 5 As shown, the encapsulation layer 420 may cover the bank layer 320 , the light emitting layer 333 , the cathode electrode 335 , and side surfaces of the capping layer 340 disposed below the encapsulation layer 420 , as well as an upper surface of the capping layer 340 .

[0156] Therefore, the encapsulation layer 420 may perform an encapsulation function of blocking the components from the outside.

[0157] The encapsulation substrate 430 may be formed of, for example, at least one inorganic film or at least one organic film, or as another example, may be formed by stacking at least one inorganic film and at least one organic film, or may be a metal encapsulation layer.

[0158] In this case, the encapsulation layer 420 and the encapsulation substrate 430 may include an adhesive layer FSP and a metal encapsulation layer FSM.

[0159] According to an embodiment of the present disclosure, when the side surface of the light-emitting layer 333 is covered by the cathode electrode 335, moisture and oxygen introduced through the side surface of the light-emitting layer set on the outermost side of the display device are difficult to penetrate into the display area, and a display device capable of delaying the time for moisture and oxygen to penetrate into the display area can be provided.

[0160] at the same time, Figures 3A to 5 A case where there is only one undercut structure UCS is shown, but this is exemplary and the present disclosure is not necessarily limited thereto, and several, preferably nine or ten, undercut structures UCS may be provided.

[0161] Figure 6 and Figure 7 is a diagram showing an embodiment according to the present disclosure Figure 4A An enlarged cross-sectional view of region Y.

[0162] about Figure 6 and Figure 7 The contents of the light shielding layer 210, the buffer layer 220, the metal layer 230, the protective layer 310, the bank layer 320, the light emitting layer 333, the cathode electrode 335, the cover layer 340 and the passivation layer 410 may be the same as those of the reference Figures 3A to 5 The light shielding layer 210 , the buffer layer 220 , the metal layers 230 and 231 , the protective layer 310 , the bank layer 320 , the light emitting layer 333 , the cathode electrode 335 , the capping layer 340 and the passivation layer 410 are described in substantially the same manner.

[0163] refer to Figure 6 , a filler layer may be provided between the buffer layer 220 and the protective layer 310 .

[0164] The filler layer may be disposed on the buffer layer 220 and may serve to support components such as the protection layer 310 , the bank layer 320 , the light emitting layer 333 , the cathode electrode 335 , the capping layer 340 , and the passivation layer 410 .

[0165] exist Figure 6 In the embodiment, although the filler layer is substantially the same as the metal layer 230 , the filler layer is not necessarily limited to being composed of only the metal layer 230 , but may be a filler layer including other components disposed between the buffer layer 220 and the protective layer 310 .

[0166] A distance t between one end of the metal layer 230 and one end of the protective layer 310 may be greater than or equal to 0.2 μm and less than or equal to 1.0 μm.

[0167] As the distance t between one end of the metal layer 230 and one end of the protection layer 310 decreases, the cathode electrode 335 and the passivation layer 410 can more easily form seamless step coverage.

[0168] refer to Figure 6 , the thickness h2 of the light emitting layer 333 may be smaller than the thickness h1 of the metal layer 230 .

[0169] As the thickness h2 of the light emitting layer 333 becomes smaller than the thickness h1 of the metal layer 230 , that is, as the thickness h1 of the metal layer 230 becomes larger than the thickness h2 of the light emitting layer 333 , moisture permeation may be delayed.

[0170] When the thickness h1 of the metal layer 230 is greater than the thickness h2 of the light emitting layer 333 , the light emitting layer 333 may be disconnected by the cathode electrode 335 and the passivation layer 410 .

[0171] The thickness h1 of the metal layer 230 may be 1.2 to 1.3 times, and more preferably 1.25 times, the thickness h2 of the light emitting layer 333 .

[0172] However, the present disclosure is not necessarily limited thereto, and the thickness h1 of the metal layer 230 may be smaller than the thickness h2 of the light emitting layer 333. For example, the thickness h1 of the metal layer 230 may be 0.8 to 1 times the thickness h2 of the light emitting layer 333.

[0173] refer to Figure 6 , the protection layer 310 may include an inclined portion that overlaps at least a portion of a region that does not overlap with the metal layer 230 .

[0174] Here, an angle between a tangent line at an inflection point of the inclined portion and the bottom surface of the protective layer 310 may be greater than or equal to 20 degrees and less than or equal to 40 degrees.

[0175] In one embodiment, an angle between a tangent line at an inflection point of the inclined portion and the bottom surface of the protective layer 310 may be greater than or equal to 20 degrees and less than or equal to 30 degrees.

[0176] When the angle between the tangent line at the inflection point of the inclined portion and the bottom surface of the protective layer 310 is greater than or equal to 20 degrees and less than or equal to 40 degrees, the cathode electrode 335 and the passivation layer 410 may more easily form seamless step coverage.

[0177] refer to Figure 7 , the filler layer of the display device according to another embodiment of the present disclosure may include a metal layer 230 and a photosensitive resin layer 500 .

[0178] The metal layer 230 may be a gate line, but is not limited thereto.

[0179] The photosensitive resin layer 500 may include a positive photosensitive resin or a negative photosensitive resin.

[0180] When the photosensitive resin layer 500 includes a positive photosensitive resin, the photosensitive resin layer may be disposed in the undercut structure UC through the ultraviolet blocking material included in the bank layer 320 without using a mask during exposure.

[0181] At least a portion of the bank layer 320 may overlap with the photosensitive resin layer 500 to dispose the photosensitive resin layer in the undercut structure UC without using a mask.

[0182] exist Figure 7 In the description, a case where the photosensitive resin included in the photosensitive resin layer 500 is a positive photosensitive resin is described as an example, but the present disclosure is not limited thereto, and the photosensitive resin may be a negative photosensitive resin.

[0183] When the photosensitive resin included in the photosensitive resin layer 500 is a negative type photosensitive resin, the bank layer 320 may not include a UV blocking material.

[0184] Therefore, a mask can be used during exposure.

[0185] Here, the mask may block UV rays like the bank layer 320 including the UV blocking material, and thus the UV blocking material may not be included in the bank layer 320 .

[0186] The photosensitive resin included in the photosensitive resin layer 500 may be at least one of a group II element, a group III element, or Ce.

[0187] For example, the photosensitive resin included in the photosensitive resin layer 500 may include at least one of Mg, Ca, Ba, Al, In, Ti, or Ce.

[0188] When the photosensitive resin included in the photosensitive resin layer 500 includes at least one of Mg, Ca, Ba, Al, In, Ti, or Ce, the photosensitive resin may capture moisture or oxygen penetrating into the undercut area UCA to delay the penetration time of moisture or oxygen.

[0189] In addition, since the photosensitive resin layer 500 is disposed on the buffer layer 220 inside the undercut structure UC, the distance between one end of the filler layer and one end of the protective layer can be reduced.

[0190] When the distance between one end of the filler layer and one end of the protection layer is reduced, the cathode electrode 335 and the passivation layer 410 can more easily form seamless step coverage.

[0191] refer to Figure 7 , the thickness h2 of the light emitting layer 333 may be smaller than the thickness h1 of the filler layer.

[0192] As the thickness h2 of the light emitting layer 333 becomes smaller than the thickness h1 of the filler layer, that is, as the thickness h1 of the filler layer becomes thicker than the thickness h2 of the light emitting layer 333 , moisture permeation may be delayed.

[0193] When the thickness h1 of the filler layer is thicker than the thickness h2 of the light emitting layer 333 , the light emitting layer 333 may be disconnected by the cathode electrode 335 and the passivation layer 410 .

[0194] The thickness h1 of the metal layer 230 may preferably be 1.2 to 1.3 times, and more preferably 1.25 times, the thickness h2 of the light emitting layer 333 .

[0195] However, the present disclosure is not necessarily limited thereto, and the thickness h1 of the metal layer 230 may be smaller than the thickness h2 of the light emitting layer 333. For example, the thickness h1 of the metal layer 230 may be 0.8 to 1 times the thickness h2 of the light emitting layer 333.

[0196] refer to Figure 7 , the protection layer 310 may include an inclined portion that overlaps at least a portion of a region that does not overlap with the metal layer 230 .

[0197] Here, an angle between a tangent line at an inflection point of the inclined portion and the bottom surface of the protective layer 310 may be greater than or equal to 20 degrees and less than or equal to 40 degrees.

[0198] In one embodiment, an angle between a tangent line at an inflection point of the inclined portion and the bottom surface of the protective layer 310 may be greater than or equal to 20 degrees and less than or equal to 30 degrees.

[0199] When the angle between the tangent line at the inflection point of the inclined portion and the bottom surface of the protective layer 310 is greater than or equal to 20 degrees and less than or equal to 40 degrees, the cathode electrode 335 and the passivation layer 410 may more easily form seamless step coverage.

[0200] Figure 8A 、 8B 8C are views briefly illustrating a process of forming a partial area of ​​a display panel according to an embodiment of the present disclosure.

[0201] refer to Figure 4B To describe Figures 8A to 8C , wherein a number of undercut structures UCS are arranged in the undercut area UCA.

[0202] refer to Figure 8A , the photosensitive resin composition 500 may cover the bank layer 320 and the buffer layer 220 in a region except the undercut structure UCS and the undercut area UCA.

[0203] Figure 8A The photosensitive resin composition 500 may include the reference Figure 7 The photosensitive resin layer 500 is made of substantially the same material as described.

[0204] Will Figures 8A to 8C The photosensitive resin composition 500 is described as a positive photosensitive resin composition.

[0205] refer to Figure 8B , the photosensitive resin composition 500 may be exposed to ultraviolet (UV) rays to remove the remaining photosensitive resin composition 500 except for the photosensitive resin composition 500 located under the bank layer 320 .

[0206] refer to Figure 8C , Figure 8B The photosensitive resin composition 500 that is not removed may be formed of a photosensitive resin layer 500 .

[0207] The embodiments of the present disclosure described above are briefly described below.

[0208] A display device according to an embodiment of the present disclosure may include a substrate, the substrate including a display area and a non-display area surrounding the display area; a metal layer, the metal layer being arranged on the substrate and at a boundary between the display area and the non-display area; a protective layer, the protective layer being located on the metal layer and including a first portion overlapping with the metal layer and a second portion being located on the substrate and not overlapping with the metal layer; and a photosensitive resin layer, the photosensitive resin layer being located between the substrate and the second portion.

[0209] In the display device according to an embodiment of the present disclosure, the photosensitive resin layer may include at least one of a Group II element, a Group III element, or Ce.

[0210] In the display device according to an embodiment of the present disclosure, the photosensitive resin layer may include at least one of Mg, Ca, Ba, Al, In, Ti, or Ce.

[0211] In the display device according to the embodiment of the present disclosure, the photosensitive resin layer may be a positive photosensitive resin layer.

[0212] In the display device according to an embodiment of the present disclosure, the display device may further include a bank layer provided on the protective layer. At least a portion of the bank layer may overlap with the photosensitive resin layer.

[0213] In the display device according to the embodiment of the present disclosure, the bank layer may include an ultraviolet (UV) blocking material.

[0214] In the display device according to the embodiment of the present disclosure, the display device may further include a light emitting layer provided on the protective layer and having a thickness smaller than that of the photosensitive resin layer, and a cathode electrode provided on the light emitting layer.

[0215] In the display device according to the embodiment of the present disclosure, a distance between one end of the photosensitive resin layer and one end of the protective layer located in the second portion may be greater than or equal to 0.2 μm and less than or equal to 1.0 μm.

[0216] In the display device according to an embodiment of the present disclosure, the second portion may include an inclined portion overlapping at least a portion of the photosensitive resin layer. An angle between a tangent line at an inflection point of the inclined portion and a bottom surface of the second portion may be greater than or equal to 20 degrees and less than or equal to 40 degrees.

[0217] A display device according to an embodiment of the present disclosure may include a substrate including a display area and a non-display area surrounding the display area; a filler layer, which is arranged on the substrate, at a boundary between the display area and the non-display area, and includes a first part including a metal or an alloy thereof and a second part including a photosensitive resin; and a protective layer, which is located on the filler layer.

[0218] In the display device according to the embodiment of the present disclosure, the first portion may be a gate line.

[0219] In the display device according to the embodiment of the present disclosure, the second portion may include at least one of a Group II element, a Group III element, or Ce.

[0220] In the display device according to the embodiment of the present disclosure, the second portion may include at least one of magnesium Mg, calcium Ca, barium Ba, aluminum Al, indium In, titanium Ti, or cerium Ce.

[0221] In the display device according to the embodiment of the present disclosure, the photosensitive resin may be a positive photosensitive resin.

[0222] In the display device according to an embodiment of the present disclosure, the display device may further include a bank layer provided on the protective layer. At least a portion of the bank layer may overlap with the second portion.

[0223] In the display device according to the embodiment of the present disclosure, the bank layer may include an ultraviolet (UV) blocking material.

[0224] In the display device according to the embodiment of the present disclosure, the display device may further include a light emitting layer provided on the protective layer and having a thickness smaller than that of the filler layer, and a cathode electrode provided on the light emitting layer.

[0225] In the display device according to the embodiment of the present disclosure, a distance between one end of the filler layer and one end of the protective layer may be greater than or equal to 0.2 μm and less than or equal to 1.0 μm.

[0226] In the display device according to an embodiment of the present disclosure, the protective layer may include an inclined portion overlapping at least a portion of the second portion. An angle between a tangent line at an inflection point of the inclined portion and the bottom surface of the protective layer may be greater than or equal to 20 degrees and less than or equal to 40 degrees.

[0227] The above description has been presented to enable any person skilled in the art to obtain and use the technical concepts of the present disclosure, and has been provided in the context of a specific application and its requirements. Various modifications, additions, and substitutions to the described embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present disclosure. The above description and accompanying drawings provide examples of the technical concepts of the present disclosure for illustrative purposes only. That is, the disclosed embodiments are intended to illustrate the scope of the technical concepts of the present disclosure.

Claims

1. A display device comprising: a substrate comprising a display area and a non-display area surrounding the display area; a metal layer on the substrate and at a boundary between the display area and the non-display area; a protective layer on the metal layer, the protective layer comprising a first portion overlapping the metal layer and a second portion on the substrate and not overlapping the metal layer; as well as A photosensitive resin layer is located between the substrate and the second portion.

2. The display device according to claim 1, wherein The photosensitive resin layer includes at least one of a Group II element, a Group III element, or Ce.

3. The display device according to claim 2, wherein: The photosensitive resin layer includes at least one of Mg, Ca, Ba, Al, In, Ti, or Ce.

4. The display device according to claim 1, wherein The photosensitive resin layer is a positive photosensitive resin layer.

5. The display device according to claim 1 , further comprising a bank layer on the protective layer, in, At least a portion of the bank layer overlaps with the photosensitive resin layer. The display device according to claim 5 , wherein: The bank layer includes an ultraviolet (UV) blocking material.

7. The display device according to claim 1, further comprising: a light-emitting layer on the protective layer, the light-emitting layer having a thickness smaller than that of the photosensitive resin layer; as well as A cathode electrode is located on the light emitting layer.

8. The display device according to claim 1, wherein A distance between one end of the photosensitive resin layer and one end of the protective layer is greater than or equal to 0.2 μm and less than or equal to 1.0 μm.

9. The display device according to claim 1, wherein The second portion includes an inclined portion overlapping at least a portion of the photosensitive resin layer, and an angle between a tangent line at an inflection point of the inclined portion and a bottom surface of the second portion is greater than or equal to 20 degrees and less than or equal to 40 degrees.

10. A display device comprising: a substrate comprising a display area and a non-display area surrounding the display area; a filler layer on the substrate, the filler layer being located at a boundary between the display area and the non-display area, the filler layer including a first portion comprising a metal or an alloy thereof and a second portion comprising a photosensitive resin; and A protective layer on the filler layer.

11. The display device according to claim 10, wherein: The first portion is a gate line.

12. The display device according to claim 10, wherein: The second portion includes at least one of a Group II element, a Group III element, or Ce.

13. The display device according to claim 12, wherein: The second portion includes at least one of Mg, Ca, Ba, Al, In, Ti, or Ce.

14. The display device according to claim 10, wherein: The photosensitive resin is a positive photosensitive resin.

15. The display device according to claim 10, further comprising a bank layer on the protective layer, in, At least a portion of the bank overlaps with the second portion.

16. The display device according to claim 15, wherein The bank layer includes an ultraviolet (UV) blocking material.

17. The display device according to claim 10, further comprising: a light-emitting layer on the protective layer, the light-emitting layer having a thickness less than that of the filler layer; as well as A cathode electrode is located on the light emitting layer.

18. The display device according to claim 17, further comprising: a passivation layer on top of the cathode electrode, The light emitting layer is separated by the cathode electrode and the passivation layer.

19. The display device according to claim 10, wherein A distance between one end of the filler layer and one end of the protective layer is greater than or equal to 0.2 μm and less than or equal to 1.0 μm.

20. The display device according to claim 10, wherein The protective layer includes an inclined portion overlapping at least a portion of the second portion, and an angle between a tangent line at an inflection point of the inclined portion and a bottom surface of the protective layer is greater than or equal to 20 degrees and less than or equal to 40 degrees.

21. The display device according to claim 10, further comprising an undercut region along a boundary between the display region and the non-display region, in, The undercut region includes an undercut structure, and the second portion including the photosensitive resin is disposed in the undercut structure.

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