Display device

Abstract

An embodiment of the present disclosure relates to a display device, and more particularly, to a display device including a substrate extension portion extending from an optical bezel region to a portion of an optical region, and a substrate protrusion portion protruding from the substrate extension portion, thereby reducing the bezel region and preventing moisture penetration.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2024-0029002, filed on February 28, 2024, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] An embodiment of the present disclosure relates to a display device. Background Art

[0004] With the development of the information society, the demand for display devices for displaying images in various forms is increasing, and recently, various display devices such as liquid crystal displays and organic light emitting displays are being applied.

[0005] Since optoelectronic devices are required to receive light from the front of the display device, they need to be installed in a position that is conducive to light reception. Therefore, the camera (or camera lens) and detection sensor may be exposed on the front of the display device. As a result, the bezel of the display panel may be widened or a notch may need to be formed in the display area of ​​the display panel, and the camera or detection sensor may be installed in the notch.

[0006] If a bezel is widened or a notch is formed on the front surface of a display panel, the size of a display area for displaying an image on the display panel may be reduced.

[0007] Therefore, a "Hole in Active Area (HiAA)" type display device can be proposed, in which at least a portion of the substrate is removed from the display area of ​​the display panel, and the optoelectronic device is arranged to overlap with the area where at least a portion of the substrate is removed, thereby increasing the size of the display area.

[0008] However, there is a problem that cracks may be generated during the process of removing a portion of the substrate, or moisture may penetrate into the area where the substrate is removed, thereby deteriorating display quality. Therefore, there is a need to solve this problem. Summary of the Invention

[0009] There may be a problem that cracks may occur or moisture may penetrate into the display area of ​​the display panel, thereby deteriorating the display quality. Therefore, the inventors of the present disclosure have invented a display device that can prevent cracks from occurring or moisture from penetrating, thereby maintaining display quality.

[0010] Embodiments of the present disclosure may provide a display device having an optical area arranged so as not to expand the width of an optical bezel area.

[0011] Embodiments of the present disclosure may provide a display device capable of preventing moisture penetration and cracks from spreading from an optical bezel area to a display area.

[0012] Embodiments of the present disclosure may provide a display device capable of removing moisture penetration and crack penetration occurring in an optical bezel area.

[0013] Embodiments of the present disclosure may provide a display device that is applied through process optimization in which a dam is formed through a substrate during the process of removing at least a portion of the substrate from a display area and disposing an optoelectronic device to overlap with the area from which at least a portion of the substrate is removed.

[0014] A display device according to an embodiment of the present disclosure may include: a substrate including a non-display region and a display region, the non-display region having an optical region and an optical frame region, the optical frame region being an area outside the optical region; a light-emitting device disposed in the display region; and an organic layer disposed on the substrate. Furthermore, the substrate may include a substrate extension extending from the optical frame region to a portion of the optical region, and a substrate protrusion protruding from the substrate extension in the optical region.

[0015] According to an embodiment of the present disclosure, a display device having an optical area arranged so as not to expand the width of an optical bezel area may be provided.

[0016] According to an embodiment of the present disclosure, a display device capable of preventing moisture penetration and cracks from spreading from an optical bezel area to a display area can be provided.

[0017] According to an embodiment of the present disclosure, a display device capable of removing moisture penetration and crack penetration occurring in an optical bezel area can be provided.

[0018] According to an embodiment of the present disclosure, a display device can be provided, which is applied through process optimization (wherein, a dam is formed through the substrate during the process of removing at least a portion of the substrate from the display area and setting the optoelectronic device to overlap with the area from which at least a portion of the substrate is removed). BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a system configuration diagram of a display device according to an embodiment of the present disclosure.

[0020] Figure 2 An equivalent circuit of a sub-pixel in a display panel according to an embodiment of the present disclosure is shown.

[0021] Figure 3 is a cross-sectional view of a display area in a display panel according to an embodiment of the present disclosure.

[0022] Figure 4 It is a figure for demonstrating the optical area|region concretely.

[0023] Figure 5 yes Figure 4 A cross-sectional view of the optical frame area along line II'.

[0024] Figure 6 、 Figure 7 and Figure 8 is a cross-sectional view of an optical bezel region and an optical region in which a substrate protrusion is disposed according to an embodiment of the present disclosure.

[0025] Figure 9 、 Figure 10 、 Figure 11 and Figure 12 is a cross-sectional view of an optical bezel area and an optical area in which a substrate protrusion is provided in a display panel including a touch sensor according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0026] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. When assigning reference numerals to components of the various drawings, the same components may be assigned the same reference numerals even when shown on different drawings. When it is determined that the details of a known technology or function make the subject matter of the present disclosure unclear, the details may be omitted. As used herein, when a component "includes," "has" or "consists of" another component, other components may be added to the component unless the component "only" includes, has or consists of the other component. As used herein, the singular forms "a", "the" are intended to also include the plural forms, unless the context clearly indicates otherwise.

[0027] "First," "second," "A," "B," "(a)," and "(b)" may be used to describe components of the present disclosure. These designations are provided only to distinguish one component from another, and the nature, order, or number of the components is not limited by the designations.

[0028] When describing the positional relationship between components, when two or more components are described as being “connected,” “combined,” or “linked,” the two or more components may be directly “connected,” “combined,” or “linked,” or another component may be interposed. Here, the other component may be included in one or more of the two or more components that are “connected,” “combined,” or “linked” to each other.

[0029] When terms such as “after,” “next,” “subsequently,” and “before” are used to describe a time flow relationship with respect to components, methods of operation, and methods of manufacture, they may include non-sequential relationships unless the terms “immediately” or “directly” are used.

[0030] When a component is assigned a value or its corresponding information (eg, a level), the value or corresponding information may be interpreted as including tolerances that may arise due to various factors (eg, process factors, internal or external influences, or noise).

[0031] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0032] Figure 1 is a system configuration diagram of the display device 100 according to an embodiment of the present disclosure.

[0033] Reference Figure 1 The touch display device 100 may include a display panel 110 and a display driving circuit as components for displaying an image.

[0034] The display driving circuit may be a circuit for driving the display panel 110 , and may include a data driving circuit 120 , a gate driving circuit 130 , and a display controller 140 .

[0035] The display panel 110 may include a display area AA that displays an image and a non-display area NA that does not display an image. The non-display area NA may be an area outside the display area AA and may also be referred to as a bezel area. All or part of the non-display area NA may be visible from the front of the touch display device 100, or may be a curved area that is not visible from the front of the touch display device 100.

[0036] The display panel 110 may include a substrate SUB and a plurality of sub-pixels SP arranged on the substrate SUB. In addition, the display panel 110 may further include various types of signal lines to drive the plurality of sub-pixels SP.

[0037] The display device 100 according to the embodiment of the present disclosure may be a liquid crystal display device, or may be a self-luminous display device in which the display panel 110 emits light. When the display device 100 according to the embodiment of the present disclosure is a self-luminous display device, each of the plurality of sub-pixels SP may include a light emitting device.

[0038] The display device 100 according to an embodiment of the present disclosure may be an organic light-emitting display device in which the light-emitting device is implemented as an organic light-emitting diode (OLED). As another example, the touch display device 100 according to an embodiment of the present disclosure may be an inorganic light-emitting display device in which the light-emitting device is implemented as an inorganic-based light-emitting diode. As yet another example, the touch display device 100 according to an embodiment of the present disclosure may be a quantum dot display device in which the light-emitting device is implemented as a quantum dot, which is a semiconductor crystal that emits light.

[0039] The structure of each of the plurality of sub-pixels SP may vary depending on the type of the display device 100. For example, if the display device 100 is a self-luminous display device in which the sub-pixels SP emit light by themselves, each sub-pixel SP may include a light-emitting device capable of emitting light by itself, one or more transistors, and one or more capacitors.

[0040] For example, the various types of signal lines may include a plurality of data lines DL transmitting data signals (also referred to as data voltages or image signals) and a plurality of gate lines GL transmitting gate signals (also referred to as scan signals).

[0041] The plurality of data lines DL and the plurality of gate lines GL may cross each other. Each of the plurality of data lines DL may be arranged to extend along a first direction. Each of the plurality of gate lines GL may be arranged to extend along a second direction.

[0042] Here, the first direction may be a column direction, and the second direction may be a row direction. Alternatively, the first direction may be a row direction, and the second direction may be a column direction.

[0043] The data driving circuit 120 is a circuit for driving a plurality of data lines DL and can output data signals to the plurality of data lines DL. The gate driving circuit 130 is a circuit for driving a plurality of gate lines GL and can output gate signals to the plurality of gate lines GL.

[0044] The display controller 140 is a device configured to control the data driving circuit 120 and the gate driving circuit 130. The display controller 140 may control a driving timing of a plurality of data lines DL and a driving timing of a plurality of gate lines GL.

[0045] The display controller 140 may supply a data driving control signal DCS to the data driving circuit 120 to control the data driving circuit 120 , and may supply a gate driving control signal GCS to the gate driving circuit 130 to control the gate driving circuit 130 .

[0046] The display controller 140 may receive input image data from the host system 150 and supply image data Data to the data driving circuit 120 based on the input image data.

[0047] The data driving circuit 120 may supply data signals to the plurality of data lines DL according to the driving timing control of the display controller 140 .

[0048] The data driving circuit 120 may receive image data in a digital form from the display controller 140 , convert the received image data into a data signal in an analog form, and output the converted image data to a plurality of data lines DL.

[0049] The gate driving circuit 130 may supply gate signals to the plurality of gate lines GL according to the timing control of the display controller 140. The gate driving circuit 130 may receive a first gate voltage corresponding to an on-level voltage, a second gate voltage corresponding to an off-level voltage, and various gate driving control signals GCS, generate gate signals, and supply the generated gate signals to the plurality of gate lines GL.

[0050] For example, the data driving circuit 120 may be connected to the display panel 110 via a tape automated packaging (TAB) method, or may be connected to a bonding pad of the display panel 110 via a chip on glass (COG) or chip on panel (COP) method, or may be connected to the display panel 110 by being implemented as a chip on film (COF) method.

[0051] The gate drive circuit 130 may be connected to the display panel 110 using a tape automated packaging (TAB) method, or may be connected to a bonding pad of the display panel 110 using a chip on glass (COG) or chip on panel (COP) method, or may be connected to the display panel 110 according to a chip on film (COF) method. Alternatively, the gate drive circuit 130 may be a gate in panel (GIP) type and may be formed in the non-display area NA of the display panel 110. The gate drive circuit 130 may be provided on or connected to the substrate SUB. That is, if the gate drive circuit 130 is a GIP type, it may be provided in the non-display area NDA of the substrate SUB. The gate drive circuit 130 may be connected to the substrate in the case of a chip on glass (COG) type, a chip on film (COF) type, or the like.

[0052] On the other hand, at least one of the data driving circuit 120 and the gate driving circuit 130 may be disposed in the display area AA. For example, at least one of the data driving circuit 120 and the gate driving circuit 130 may be disposed so as not to overlap with the sub-pixel SP, or may be disposed so as to partially or completely overlap with the sub-pixel SP.

[0053] The data driving circuit 120 may be connected to one side (e.g., the upper side or the lower side) of the display panel 110. Depending on a driving method, a panel design method, etc., the data driving circuit 120 may be connected to both sides (e.g., the upper side and the lower side) of the display panel 110, or may be connected to two or more of the four sides of the display panel 110.

[0054] The gate driving circuit 130 may be connected to one side (e.g., the left side or the right side) of the display panel 110. Depending on a driving method, a panel design method, etc., the gate driving circuit 130 may be connected to both sides (e.g., the left side and the right side) of the display panel 110, or may be connected to two or more of the four sides of the display panel 110.

[0055] The display controller 140 may be implemented as a separate component from the data driving circuit 120 , or may be implemented as an integrated circuit integrated with the data driving circuit 120 .

[0056] The display controller 140 may be a timing controller used in typical display technologies, or may be a control device including a timing controller capable of further performing other control functions, or may be a control device different from a timing controller, or may be a control device other than a timing controller, or may be a circuit within a control device. The display controller 140 may be implemented using various circuits or electronic components such as an integrated circuit (IC), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), or a processor.

[0057] The display controller 140 may be mounted on a printed circuit board, a flexible printed circuit, or the like, and may be electrically connected to the data driving circuit 120 and the gate driving circuit 130 through the printed circuit board, the flexible printed circuit, or the like.

[0058] The display controller 140 may send and receive signals to and from the data driving circuit 120 according to one or more predetermined interfaces. For example, the interface may include a low voltage differential signaling (LVDS) interface, an embedded clock point-to-point interface (EPI), or a serial peripheral interface (SPI).

[0059] Reference Figure 1 , the display device 100 according to an embodiment of the present disclosure may include one or more optical areas OA from which at least a portion of the substrate SUB is removed.

[0060] One or more optoelectronic devices (not shown) may be provided in an area overlapping at least a portion of the optical area OA. For example, the one or more optoelectronic devices may include one or more of an imaging device such as a camera (e.g., an image sensor), a detection sensor such as a proximity sensor, and an illumination sensor.

[0061] For example, an imaging device such as a camera may be located under the first optical area OA1, and a detection sensor may be located under the second optical area OA2.

[0062] The optoelectronic device may be located under the substrate SUB, and the optoelectronic device may be arranged to overlap at least a portion of the optical area OA.

[0063] The first optical area OA1 and the second optical area OA2 may have various shapes, such as a circle, an ellipse, a square, a hexagon, or an octagon. The shapes of the first optical area OA1 and the second optical area OA2 may be the same, or different. The area of ​​the first optical area OA1 may be the same as the area of ​​the second optical area OA2, or different.

[0064] Hereinafter, for convenience of explanation, a case will be described in which the first optical area OA1 and the second optical area OA2 have a circular shape and have the same area, but embodiments of the present disclosure are not limited thereto.

[0065] On the other hand, one or more optical areas OA may be located in a region where the substrate SUB is removed, and the optical area OA may be a non-display area NA where the sub-pixels SP are not disposed.

[0066] The optical area OA located within the display area AA may also be referred to as a “HiAA (hole in active area)” area.

[0067] Signal lines (eg, data lines DL, gate lines GL, etc.) disposed on the substrate SUB may be disposed to surround (or bypass) the optical area OA.

[0068] In order to provide a touch sensing function in addition to an image display function, the display device 100 according to an embodiment of the present disclosure may include a touch sensor and a touch sensing circuit that senses the touch sensor to detect whether a touch object such as a finger or a pen has touched or detects a touch position.

[0069] The touch sensing circuit may include a touch driving circuit 160 for driving and sensing the touch sensor to generate and output touch sensing data; and a touch controller 170 for detecting a touch occurrence or a touch position using the touch sensing data.

[0070] The touch sensor may include a plurality of touch electrodes and a plurality of touch lines for electrically connecting the plurality of touch electrodes to the touch driving circuit 160 .

[0071] The touch sensor may be located outside the display panel 110 or inside the display panel 110 .

[0072] If the touch sensor is located outside the display panel 110 in the form of a panel, the touch sensor is called an external type. If the touch sensor is an external type, the touch panel and the display panel 110 can be manufactured separately and combined during the assembly process. An external type touch panel may include a substrate and a plurality of touch electrodes on the substrate.

[0073] If the touch sensor is located inside the display panel 110 , the touch sensor may be formed on the substrate SUB together with signal lines and electrodes related to display driving during a manufacturing process of the display panel 110 .

[0074] The touch driving circuit 160 may supply a touch driving signal to at least one of the plurality of touch electrodes and sense at least one of the plurality of touch electrodes to generate touch sensing data.

[0075] The touch sensing circuit may perform touch sensing in a self-capacitance sensing manner or a mutual-capacitance sensing manner.

[0076] When the touch sensing circuit performs touch sensing in a self-capacitance sensing manner, the touch sensing circuit may perform touch sensing based on capacitance between each touch electrode and a touch object (eg, a finger, a pen, etc.).

[0077] According to the self-capacitance sensing method, each of the multiple touch electrodes can serve as a driving touch electrode or a sensing touch electrode. The touch driving circuit 160 can drive all or part of the multiple touch electrodes and sense all or part of the multiple touch electrodes.

[0078] When the touch sensing circuit performs touch sensing using a mutual capacitance sensing method, the touch sensing circuit may perform touch sensing based on capacitance between touch electrodes.

[0079] According to the mutual capacitance sensing method, the plurality of touch electrodes can be divided into driving touch electrodes and sensing touch electrodes. The touch driving circuit 160 can drive the driving touch electrodes and sense the sensing touch electrodes.

[0080] The touch driving circuit 160 and the touch controller 170 included in the touch sensing circuit 150 may be implemented as separate devices or as one device. In addition, the touch driving circuit 160 and the data driving circuit 120 may be implemented as separate devices or as one device.

[0081] The display device 100 may further include a power supply circuit that supplies various types of power to the display driving circuit and / or the touch sensing circuit.

[0082] The display device 100 according to an embodiment of the present disclosure may be a mobile terminal such as a smartphone or a tablet, or a display or television (TV) of various sizes, and is not limited thereto, and may be a display of various types and sizes capable of displaying information or images.

[0083] Figure 2 An equivalent circuit of a sub-pixel SP in the display panel 110 according to an embodiment of the present disclosure is shown.

[0084] Reference Figure 2 Each subpixel SP provided in the display area AA of the display panel 110 may include a light emitting device ED, a driving transistor DRT for driving the light emitting device ED, a scan transistor SCT for transmitting a data voltage Vdata to a first node N1 of the driving transistor DRT, and a storage capacitor Cst for maintaining a constant voltage during one frame.

[0085] The driving transistor DRT may include a first node N1 to which a data voltage Vdata is applied, a second node N2 electrically connected to the light emitting device ED, and a third node N3 to which a high potential common voltage ELVDD is applied from the driving voltage line DVL. In the driving transistor DRT, the first node N1 may be a gate node, the second node N2 may be one of a source node and a drain node, and the third node N3 may be the other of the source node and the drain node.

[0086] The light emitting device ED may include an anode AE, a light emitting layer EL, and a cathode CE. The anode AE ​​may be a pixel electrode provided in each sub-pixel SP and may be electrically connected to the second node N2 of the driving transistor DRT of each sub-pixel SP. The cathode CE may be a common electrode provided in common to the plurality of sub-pixels SP and supplied with a low-potential common voltage ELVSS.

[0087] For example, the anode AE ​​may be a pixel electrode and the cathode CE may be a common electrode. Alternatively, the anode AE ​​may be a common electrode and the cathode CE may be a pixel electrode. In the following, for ease of explanation, it is assumed that the anode AE ​​is a pixel electrode and the cathode CE is a common electrode.

[0088] For example, the light emitting device ED may be an organic light emitting diode (OLED), an inorganic light emitting diode, or a quantum dot light emitting device. In this case, if the light emitting device ED is an organic light emitting diode, the light emitting layer EL in the light emitting device ED may include an organic light emitting layer including an organic material.

[0089] The scan transistor SCT may be turned on and off by a scan signal SCAN, which is a gate signal applied through the gate line GL. The scan transistor SCT may switch electrical connection between the first node N1 of the drive transistor DRT and the data line DL.

[0090] The storage capacitor Cst may be electrically connected between the first node N1 and the second node N2 of the driving transistor DRT.

[0091] like Figure 2As shown, each sub-pixel SP may have a 2T (transistor)-1C (capacitor) structure including two transistors DRT and SCT and one capacitor Cst, and may further include one or more transistors or one or more capacitors according to circumstances.

[0092] The storage capacitor Cst may be an external capacitor intentionally designed outside the driving transistor DRT, rather than a parasitic capacitor (eg, Cgs, Cgd) that may exist between the first node N1 and the second node N2 of the driving transistor DRT.

[0093] Each of the driving transistor DRT and the scanning transistor SCT may be an n-type transistor or a p-type transistor.

[0094] Since the circuit elements (particularly, the light-emitting device ED) within each sub-pixel SP are easily affected by external moisture or oxygen, an encapsulation layer ENCAP may be provided on the display panel 110 to prevent external moisture or oxygen from penetrating into the circuit elements (particularly, the light-emitting device ED). The encapsulation layer ENCAP may be provided in a form that covers the light-emitting device ED.

[0095] Figure 3 is a cross-sectional view of a display area AA in a display panel 110 according to an embodiment of the present disclosure.

[0096] Reference Figure 3 , the substrate SUB may include a first substrate SUB1, an interlayer insulating film IPD, and a second substrate SUB2. The interlayer insulating film IPD may be located between the first substrate SUB1 and the second substrate SUB2. Since the substrate SUB is configured to include the first substrate SUB1, the interlayer insulating film IPD, and the second substrate SUB2, moisture penetration can be prevented. For example, the first substrate SUB1 and the second substrate SUB2 may be polyimide (PI) substrates. The first substrate SUB1 may be referred to as a primary PI substrate, and the second substrate SUB2 may be referred to as a secondary PI substrate.

[0097] However, the configuration of the substrate SUB is not limited thereto. For example, the substrate SUB may be a single glass substrate SUB. Alternatively, the substrate SUB may be a single plastic substrate SUB.

[0098] Reference Figure 3 Various patterns ACT, SD1, and GATE, various insulating films MBUF, ABUF1, ABUF2, GI, ILD1, ILD2, and PAS0, and various metal patterns TM, GM, ML1, and ML2 may be provided on a substrate SUB to form a transistor such as a driving transistor DRT.

[0099] Reference Figure 3, a multi-buffer layer MBUF may be disposed on the second substrate SUB2 , and a first active buffer layer ABUF1 may be disposed on the multi-buffer layer MBUF.

[0100] The first metal layer ML1 and the second metal layer ML2 may be disposed on the first active buffer layer ABUF1. Here, the first metal layer ML1 and the second metal layer ML2 may be light shielding layers LS for shielding light.

[0101] The second active buffer layer ABUF2 may be disposed on the first metal layer ML1 and the second metal layer ML2. The active layer ACT of the driving transistor DRT may be disposed on the second active buffer layer ABUF2.

[0102] The gate insulating film GI may be provided to cover the active layer ACT.

[0103] The gate GATE of the driving transistor DRT may be provided on the gate insulating film GI. In this case, the gate GATE of the driving transistor DRT and a gate material layer GM may be provided on the gate insulating film GI at a position different from the formation position of the driving transistor DRT.

[0104] A first interlayer insulating film ILD1 may be provided to cover the gate GATE and the gate material layer GM. A metal pattern TM may be provided on the first interlayer insulating film ILD1. The metal pattern TM may be located at a position different from the formation position of the drive transistor DRT. A second interlayer insulating film ILD2 may be provided to cover the metal pattern TM on the first interlayer insulating film ILD1.

[0105] Two first source-drain patterns SD1 may be disposed on the second interlayer insulating film ILD2. One of the two first source-drain patterns SD1 may be a source node of the driving transistor DRT, and the other may be a drain node of the driving transistor DRT.

[0106] The two first source drain patterns SD1 may be electrically connected to one side and the other side of the active layer ACT through contact holes of the second interlayer insulating film ILD2 , the first interlayer insulating film ILD1 , and the gate insulating film GI.

[0107] On the other hand, refer to Figure 3 The second interlayer insulating film ILD2 may include a 2-1 interlayer insulating film ILD2-1 and a 2-2 interlayer insulating film ILD2-2. The 2-1 interlayer insulating film ILD2-1 may be arranged to cover the metal pattern TM. The 2-2 interlayer insulating film ILD2-2 may be located on the 2-1 interlayer insulating film ILD2-1.

[0108] A portion of the active layer ACT overlapping the gate GATE may be a channel region. One of the two first source drain patterns SD1 may be connected to one side of the channel region in the active layer ACT, and the other of the two first source drain patterns SD1 may be connected to the other side of the channel region in the active layer ACT.

[0109] The passivation layer PAS0 may be provided to cover the two first source-drain patterns SD1. The planarization layer PLN may be provided on the passivation layer PAS0. The planarization layer PLN may include a first planarization layer PLN1 and a second planarization layer PLN2.

[0110] A first planarization layer PLN1 may be disposed on the passivation layer PAS0 .

[0111] The second source-drain pattern SD2 may be disposed on the first planarization layer PLN1. The second source-drain pattern SD2 may be connected to one of the two first source-drain patterns SD1 (corresponding to the first source-drain pattern SD1) through a contact hole of the first planarization layer PLN1. Figure 2 a second node N2 of the driving transistor DRT in the sub-pixel SP).

[0112] The second planarization layer PLN2 may be provided to cover the second source-drain pattern SD2. The light emitting device ED may be provided on the second planarization layer PLN2.

[0113] As a stacked structure of the light emitting device ED, the anode AE ​​may be disposed on the second planarization layer PLN2 and may be electrically connected to the second source-drain pattern SD2 through a contact hole of the second planarization layer PLN2.

[0114] The bank BANK may be provided to cover a portion of the anode AE. A portion of the bank BANK corresponding to the emission area EA of the sub-pixel SP may be opened. Here, the bank BANK may further include a spacer SPC.

[0115] A portion of the anode AE ​​may be exposed to the opening (ie, the opening portion) of the bank BANK. The light emitting layer EL may be located on one side of the bank BANK and in the opening (ie, the opening portion) of the bank BANK. All or part of the light emitting layer EL may be located between adjacent banks BANK.

[0116] The light emitting layer EL may be in contact with the anode AE ​​in the opening of the bank BANK, and the cathode CE may be provided on the light emitting layer EL.

[0117] The light emitting device ED may be formed of an anode AE, a light emitting layer EL, and a cathode CE. The light emitting layer EL may include an organic film.

[0118] An encapsulation layer ENCAP may be disposed on the light emitting device ED.

[0119] The encapsulation layer ENCAP may have a single-layer structure or a multi-layer structure. Figure 3 As shown, the encapsulation layer ENCAP may include a first encapsulation layer PAS1 , a second encapsulation layer PCL and a third encapsulation layer PAS2 .

[0120] For example, the first encapsulation layer PAS1 and the third encapsulation layer PAS2 may be inorganic films, and the second encapsulation layer PCL may be an organic film. Among the first encapsulation layer PAS1, the second encapsulation layer PCL, and the third encapsulation layer PAS2, the second encapsulation layer PCL may be the thickest. Therefore, the second encapsulation layer PCL may serve as a planarization layer. The first encapsulation layer PAS1 may also be referred to as the first inorganic encapsulation layer, the second encapsulation layer PCL may also be referred to as the organic encapsulation layer, and the third encapsulation layer PAS2 may also be referred to as the second inorganic encapsulation layer.

[0121] The first encapsulation layer PAS1 may be disposed on the cathode CE and may be disposed closest to the light emitting device ED. The first encapsulation layer PAS1 may be formed of an inorganic insulating material capable of low temperature deposition. For example, the first encapsulation layer PAS1 may be formed of silicon nitride (SiN x ), silicon oxide (SiO x Since the first encapsulation layer PAS1 can be deposited in a low temperature atmosphere, the first encapsulation layer PAS1 can prevent the light emitting layer EL including the organic material susceptible to high temperature atmosphere from being damaged during the deposition process.

[0122] The second encapsulation layer PCL can be formed with a smaller area than the first encapsulation layer PAS1. In this case, the second encapsulation layer PCL can be formed to expose both ends of the first encapsulation layer PAS1. The second encapsulation layer PCL can be used as a buffer to relieve the stress between the layers caused by the bending of the display device 100, and can also be used to enhance the planarization performance. For example, the second encapsulation layer PCL can be made of acrylic resin, epoxy resin, polyimide, polyethylene or silicon oxycarbon (SiOC), and can be formed of an organic insulating material. For example, the second encapsulation layer PCL can be formed by an inkjet method.

[0123] The third encapsulation layer PAS2 may be formed on the substrate SUB on which the second encapsulation layer PCL is formed to cover the upper surface and side surfaces of each of the second encapsulation layer PCL and the first encapsulation layer PAS1. The third encapsulation layer PAS2 may minimize or block external moisture or oxygen from penetrating into the first encapsulation layer PAS1 and the second encapsulation layer PCL. For example, the third encapsulation layer PAS2 may be made of, for example, silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiON) or aluminum oxide (Al2O3) inorganic insulating materials.

[0124] Reference Figure 3 If the touch sensor TS is a type built into the display panel 110, the touch sensor TS may be disposed on the encapsulation layer ENCAP. The touch sensor structure is described in detail as follows.

[0125] The touch buffer film T-BUF may be disposed on the encapsulation layer ENCAP, and the touch sensor TS may be disposed on the touch buffer film T-BUF.

[0126] The touch sensor TS may include a touch sensor metal portion TSM and a bridge metal portion BRG located in different layers.

[0127] A touch interlayer insulating film T-ILD may be disposed between the touch sensor metal part TSM and the bridge metal part BRG.

[0128] For example, the touch sensor metal portion TSM may include a first touch sensor metal portion TSM, a second touch sensor metal portion TSM, and a third touch sensor metal portion TSM disposed adjacent to each other. If the third touch sensor metal portion TSM is required to be disposed between the first touch sensor metal portion TSM and the second touch sensor metal portion TSM, and the first touch sensor metal portion TSM and the second touch sensor metal portion TSM are required to be electrically connected to each other, the first touch sensor metal portion TSM and the second touch sensor metal portion TSM may be electrically connected to each other via a bridge metal portion BRG in different layers. The bridge metal portion BRG may be insulated from the third touch sensor metal portion TSM by a touch interlayer insulating film T-ILD.

[0129] When forming the touch sensor TS on the display panel 110, chemical solutions (e.g., developing solutions or etching solutions) used in the process may be introduced, or moisture may be introduced from the outside. Since the touch sensor TS is disposed on the touch buffer film T-BUF, the chemical solutions or moisture can be prevented from penetrating into the light-emitting layer EL, which is composed of organic materials, during the manufacturing process of the touch sensor TS. Therefore, the touch buffer film T-BUF prevents damage to the light-emitting layer EL, which is susceptible to chemical solutions or moisture.

[0130] The touch buffer film T-BUF can be formed of an organic insulating material that can be formed at a low temperature (e.g., below 100 degrees (°C)) and has a low dielectric constant of 1 to 3 to prevent damage to the light-emitting layer EL containing an organic material that is susceptible to high temperatures. For example, the touch buffer film T-BUF can be formed of an acrylic material, an epoxy material, or a silicone material. When the display device 100 is bent, the encapsulation layer ENCAP may be damaged and the touch sensor metal portion located on the touch buffer film T-BUF may be broken. Even if the display device 100 is bent, the touch buffer film T-BUF made of an organic insulating material with a flattening property can prevent damage to the encapsulation layer ENCAP and / or breakage of the metal (e.g., TSM and BRG) forming the touch sensor TS.

[0131] The protection layer PAC may be provided to cover the touch sensor TS. The protection layer PAC may be an organic insulating film.

[0132] Figure 4 It is a figure for demonstrating the optical area OA specifically.

[0133] Reference Figure 4 , the substrate SUB may be cut along the inner trimming line as a cutting line, and the cutting area may form the optical area OA.

[0134] The HiAA optical frame area (hereinafter also referred to as the optical frame area) may be located around the optical area OA on the substrate SUB. Subpixels are not provided in the optical frame area, and the optical frame area may be a non-display area NA similar to the optical area OA.

[0135] The optical bezel area may be configured to prevent moisture penetration that may occur along a cutting line (eg, an inner trim line) and prevent microcracks that may be generated in a process of forming the optical area OA from penetrating or spreading to the display area AA.

[0136] Figure 5 yes Figure 4 A cross-sectional view of the optical frame area along line II'.

[0137] Reference Figure 5 The substrate SUB may be provided on the front side of the optical frame region (e.g., the HiAA frame region). Furthermore, a substrate extension portion 510 may be provided, which is a portion of the substrate SUB that is provided to extend to a portion of the optical area OA that is adjacent to the optical frame region (e.g., the HiAA frame region).

[0138] However, the shape and arrangement of the substrate extension 510 are merely examples for ease of explanation and are not limited thereto. For example, the substrate extension 510 may be a portion of the substrate SUB that is not completely removed during the trimming process for forming the optical area OA. Alternatively, the substrate extension 510 may be formed by curing a paste made of the same material as the substrate SUB on the trimmed portion of the substrate SUB after trimming the substrate SUB.

[0139] On the other hand, the weir DAM may be located in the optical bezel region, and the weir DAM may include at least one weir structure. The weir DAM may be provided in the optical bezel region to prevent the second encapsulation layer PCL from overflowing.

[0140] The optoelectronic device 530 may be disposed to overlap at least a portion of the optical area OA.

[0141] On the other hand, refer to Figure 5 , the optical bezel area may include a first sub-area SA1 and a second sub-area SA2 arranged from the first sub-area SA1 toward the optical area OA.

[0142] At least one touch sensor TS for touch sensing may be provided in the first sub-region SA1. The first sub-region SA1 may be a region overlapping with the second planarization layer PLN2 in the optical frame region (eg, HiAA frame region). The touch sensor TS may be covered by the protective layer PAC.

[0143] exist Figure 5 In the following drawings, for convenience of explanation, the touch sensor TS is illustrated as being disposed on the touch insulating film T-ILD. In actual configuration, the touch interlayer insulating film T-ILD may be disposed between the touch sensor metal portion TSM and the bridge metal portion BRG included in the touch sensor TS.

[0144] The weir DAM may be provided in the second sub-area SA2. The protection layer PAC may extend from the first sub-area SA1 to at least a portion of the second sub-area SA2.

[0145] One end of the protective layer PAC may be located on the weir DAM.

[0146] On the other hand, preferably, the protective layer PAC does not extend to the optical area OA. Since the protective layer PAC contains an organic material, the protective layer PAC may be a path for moisture to penetrate. Therefore, one end of the protective layer PAC may be located in the first sub-area SA1 or on the weir DAM, as shown in FIG. Figure 5 shown.

[0147] On the other hand, refer to Figure 5Moisture may penetrate through various paths at the cut line (e.g., the inner trim line), which is the boundary between the optical frame area (e.g., the HiAA frame area) and the optical area OA. For example, moisture may penetrate through the second encapsulation layer PCL containing organic materials. The infiltrated moisture may penetrate into the thin film transistors or the light-emitting layer, thereby deteriorating the performance of the display device.

[0148] Furthermore, an inorganic insulating film configuration, such as the buffer layer BUF, may serve as a crack transmission path. If a crack occurs during the process of forming the optical area OA by removing at least a portion of the substrate SUB in the optical area OA, the crack may penetrate into the display area through the inorganic insulating film.

[0149] In order to prevent such moisture penetration and crack penetration, it may be necessary to expand the width of the optical frame area (e.g., HiAA frame area) to arrange various patterns. However, if the width of the optical frame area (e.g., HiAA frame area) is expanded, the display area AA may be reduced due to the expanded width, and the non-display area NA on the display panel 110 may be expanded, which may limit the design of the display device 100 or reduce the aesthetics of the display device.

[0150] The display device 100 according to an embodiment of the present disclosure may provide a structure capable of preventing moisture penetration and crack penetration into the display area AA without greatly expanding the width of an optical bezel area (eg, HiAA bezel area).

[0151] Figure 6 、 Figure 7 and Figure 8 1 is a cross-sectional view of an optical bezel region (eg, HiAA bezel region) and an optical area OA provided with substrate protrusions 620 , 720 , and 820 according to an embodiment of the present disclosure.

[0152] Reference Figure 6 The substrate SUB may be disposed in the optical frame region (eg, HiAA frame region) and a portion of the optical area OA. The substrate SUB may include a substrate extension 510 extending from the optical frame region to a portion of the optical area OA, and a substrate protrusion 620 protruding from the substrate extension 510.

[0153] For example, the substrate extension 510 may be raised by applying heat with a laser to form the substrate protrusion 620 .

[0154] Reference Figure 6The substrate protrusion 620 may be provided in a weir shape on the substrate extension 510. For example, the substrate protrusion 620 may be formed in a trapezoidal weir shape in which the length of the lower region, which is the region adjacent to the substrate extension 510, is longer and the length of the upper region is shorter. Furthermore, the substrate protrusion 620 may be provided so that its height is longer than its width.

[0155] However, this is merely an example of the shape of the substrate protrusion 620, and the shape of the substrate protrusion 620 is not limited thereto. For example, the substrate protrusion 620 may be provided in a shape such as a triangle, a rectangle, and an ellipse.

[0156] Reference Figure 6 In the left optical bezel region (eg, HiAA bezel region) of the substrate protrusion 620 , a configuration for forming the display panel 110 on the substrate SUB may be provided.

[0157] For example, Figure 6 As shown, a buffer layer BUF may be provided in the optical frame region on the substrate SUB. A gate insulating film GI may be provided on the buffer layer BUF. An interlayer insulating film ILD1 may be provided on the gate insulating film GI. Planarization layers PLN1 and PLN2 may be provided on the interlayer insulating film ILD1. A spacer SPC may be provided on the planarization layers PLN1 and PLN2. The spacer SPC may have the same configuration as the embankment BANK. A light-emitting layer EL may be provided on the spacer SPC. A first encapsulation layer PAS1 and a second encapsulation layer PCL may be provided on the light-emitting layer EL.

[0158] like Figure 6 As shown, the above-mentioned configuration of being set in the optical frame area can be a configuration of being set in the left optical frame area from the display area AA to the substrate protrusion 620.

[0159] according to Figure 6 , the optical area OA may be formed on the right side of the substrate protrusion 620. The optoelectronic device 530 may be disposed in the optical area OA. The optoelectronic device 530 may be disposed on the lower right side of the substrate protrusion 620 in the optical area OA.

[0160] The second encapsulation layer PCL disposed on the left side of the substrate protrusion 620 can be formed to fill the gap between the substrate protrusion 620 and the optical frame area (e.g., the HiAA frame area). That is, the second encapsulation layer PCL, which is an organic layer, can contact a portion of the upper surface of the substrate extension 510 in the optical area OA. In this case, since the substrate protrusion 620 is provided in the form of a dam, the problem of the second encapsulation layer PCL overflowing into the optical area OA to the right of the substrate protrusion 620 can be prevented.

[0161] The substrate protrusion 620 may be provided so that the height of the upper surface is higher than the point where the second encapsulation layer PCL contacts the side surface of the substrate protrusion 620. Since the second encapsulation layer PCL is formed after the substrate protrusion is formed, the second encapsulation layer PCL may be provided to rise from the lower area of ​​the side surface of the substrate protrusion 620.

[0162] The substrate protrusion 620 may block the optical bezel area from the optical area OA, thereby preventing moisture from penetrating through components disposed in the optical bezel area without expanding the optical bezel area.

[0163] On the other hand, refer to Figure 7 , the substrate protrusion 720 may be configured as a solid by penetrating a crack or a raised portion formed in a component on the substrate SUB and filling an empty space caused by the crack or the raised portion.

[0164] Reference Figure 7 , Figure 7 The configuration shown in can be used with Figure 6 The substrate protrusion 720 may also be provided at a position corresponding to the Figure 6 The substrate protrusion 620 is shown in the same area.

[0165] The shape and arrangement characteristics of the substrate protrusion 720 can be Figure 6 However, the substrate protrusion 720 may be formed after the second encapsulation layer PCL is provided.

[0166] For example, the second encapsulation layer PCL as an organic layer may be disposed on the first encapsulation layer PAS1 before disposing the substrate protrusion 720. The second encapsulation layer PCL may be disposed as an upper surface of the substrate extension 510 from the optical bezel area to the optical area OA.

[0167] During the process of forming the display panel 110, after the second encapsulation layer PCL is provided, the second encapsulation layer PCL, as an organic layer, may shrink due to factors such as heat and pressure. For example, during the process of forming the optical area OA after the second encapsulation layer PCL is provided, the second encapsulation layer PCL may shrink due to the heat generated. Due to this shrinkage, the second encapsulation layer PCL may cause cracks at a first point 701 and lift at a second point 702. The lift at the second point 702 may correspond to the point where the substrate extension 510 and the second encapsulation layer PCL separate from the optical area OA and are lifted.

[0168] The substrate protrusion 720 may be provided in the optical area OA to fill the first point 701 and the second point 702 of the second encapsulation layer PCL. For example, the substrate protrusion 720 may be provided to fill the first point 701 and the second point 702, and the second point 702 may be formed by applying heat to the substrate extension 510 using a laser to raise the substrate extension 510. In other words, the substrate protrusion 720 may be provided to cover a portion of the side surface of the second encapsulation layer PCL, which is an organic layer. The substrate protrusion 720 may be provided to protrude in a weir-like manner.

[0169] Reference Figure 7 , the substrate protrusion 720 may be configured similar to Figure 6 The substrate protrusion 620 may be configured to have a weir shape. For example, the substrate protrusion 720 may be configured to have a trapezoidal weir shape in which the length of the lower region adjacent to the substrate extension 510 is greater than the length of the upper region. In addition, the substrate protrusion 720 may be configured to have a height greater than its width.

[0170] However, this is merely an example of the shape of the substrate protrusion 720, and the shape of the substrate protrusion 720 is not limited thereto. For example, the substrate protrusion 720 may be provided in a shape such as a triangle, a rectangle, and an ellipse.

[0171] Alternatively, refer to Figure 8 , the substrate protrusion 820 can be set to a shape other than a weir.

[0172] Reference Figure 8 , the substrate protrusion 820 can be formed by applying a paste to the substrate extension 510 and then curing the applied paste. The paste can be the same material as the substrate SUB. For example, the substrate SUB can be a glass material. The paste applied to the substrate extension 510 can also be a fine raw material of a glass material. The paste as a fine raw material of a glass material can be applied to the substrate extension 510, and then heat is applied to the paste to melt the paste. In this case, a laser can be used as a means of heat-treating the paste. The paste that has been heat-treated by the laser on the substrate extension 510 can be melted and physically bonded to the second encapsulation layer PCL. After the paste is heat-treated, a hardening process can be performed on the paste to form a strong bonding structure with the second encapsulation layer PCL.

[0173] In addition to the substrate protrusion 820, Figure 8 The features of the configuration shown in Figure 7 The features of the configuration shown in . That is, refer to Figure 8 The buffer layer BUF, the gate insulating film GI, the interlayer insulating film ILD1 , the planarization layers PLN1 and PLN2 , the spacer SPC, the light emitting layer EL, and the encapsulation layer ENCAP may be disposed on the left side of the substrate protrusion 820 .

[0174] exist Figure 8 In the embodiment of the present invention, the optical area OA may be formed on the right side of the substrate protrusion 820. The optoelectronic device 530 may be located on the lower right side of the substrate protrusion 820 in the optical area OA.

[0175] The substrate protrusion 820 may be formed after the second encapsulation layer PCL as an organic layer is provided, similar to the Figure 7 The substrate protrusion 720 described in .

[0176] For example, the second encapsulation layer PCL as an organic layer may be disposed on the first encapsulation layer PAS1 before disposing the substrate protrusion 820. The second encapsulation layer PCL may be disposed as an upper surface of the substrate extension 510 from the optical bezel area to the optical area OA.

[0177] During the process of forming the display panel 110, after the second encapsulation layer PCL is provided, the second encapsulation layer PCL, which is an organic layer, may shrink due to factors such as heat and pressure. Due to the shrinkage, the second encapsulation layer PCL may cause cracks at a first point 701 and lift at a second point 702. The lift at the second point 702 may correspond to the point where the substrate extension 510 and the second encapsulation layer PCL separate from each other in the optical area OA and are lifted.

[0178] The substrate protrusion 820 can be set in the optical area OA to fill the first point 701 and the second point 702 of the second encapsulation layer PCL. For example, the paste can be applied to the substrate extension 510 and then cured to fill the first point 701 and the second point 702. That is, the substrate protrusion 820 can be formed to cover a portion of the side surface of the second encapsulation layer PCL. For example, the substrate protrusion 820 can be a paste of a glass material as described above. The paste of the glass material can be applied to the substrate extension 510 and heat-treated with a laser. The heat-treated paste can be melted and then seep into the gap between the first point 701 and the second point 702 of the second encapsulation layer PCL to fill the cracks and the protruding portions. Thereafter, a hardening process can be performed to form a strong bonding structure with the second encapsulation layer PCL.

[0179] In addition, the substrate protrusion 820 may be disposed to contact a portion of the upper surface of the second encapsulation layer. A portion of the upper surface of the second encapsulation layer PCL on which the substrate protrusion 820 is disposed may be located on an optical bezel area (eg, HiAA bezel area).

[0180] Figure 7 The substrate protrusion 720 and Figure 8The substrate protrusion 820 can be formed to fill the first point 701 and the second point 702 of the second encapsulation layer PCL, thereby preventing moisture penetration and crack penetration into the display area AA due to cracks in the first point 701 and lifting in the second point 702 without expanding the width of the optical frame area (e.g., the HiAA frame area).

[0181] Figure 9 、 Figure 10 、 Figure 11 and Figure 12 is a cross-sectional view of an optical bezel region (eg, HiAA bezel region) and an optical area OA in which a substrate protrusion 920 , 1020 , 1120 , or 1220 is provided in a display panel 110 having a touch sensor TS according to an embodiment of the present disclosure.

[0182] Reference Figure 9 , in addition to providing Figure 5 In addition to the configuration of the display device 100 with the same touch sensing function, the substrate protrusion 920 may be provided on the substrate extension 510 .

[0183] The substrate protrusion 920 may be disposed to be in contact with the protection layer PAC in the optical area OA. More specifically, the protection layer PAC may be disposed to be in contact with a side surface of the substrate protrusion 920 in the optical area OA.

[0184] The substrate protrusion 920 may be provided in the optical area OA in a weir shape. For example, the substrate protrusion 920 may be provided by applying heat with a laser to elevate the substrate extension 510 .

[0185] Reference Figure 9 The substrate protrusion 920 may be formed in a weir shape on the substrate extension 510. For example, the substrate protrusion 920 may be formed in a trapezoidal weir shape in which the length of the lower region adjacent to the substrate extension 510 is greater than the length of the upper region. Furthermore, the substrate protrusion 920 may be formed to have a height greater than its width.

[0186] However, this is merely an example of the shape of the substrate protrusion 920, and the shape of the substrate protrusion 920 is not limited thereto. For example, the substrate protrusion 920 may be formed in a shape such as a triangle, a rectangle, and an ellipse.

[0187] like Figure 9 As shown, the optical area OA may be formed on the right side of the substrate protrusion 920. The optoelectronic device 530 may be disposed on the lower right side of the substrate protrusion 920 in the optical area OA.

[0188] exist Figure 9In the embodiment, the configuration for forming the display panel 110 may be provided on the substrate SUB in the left optical bezel region of the substrate protrusion 920 .

[0189] For example, refer to Figure 9 A buffer layer BUF, a gate insulating film GI, an interlayer insulating film ILD1, planarization layers PLN1 and PLN2, a spacer SPC, a light emitting layer EL, a first encapsulation layer PAS1, and a second encapsulation layer PCL may be provided on the left substrate SUB of the substrate protrusion 920.

[0190] In addition, a configuration for a touch sensing function may be provided on the second encapsulation layer PCL on the left side of the substrate protrusion 920. For example, a touch buffer layer T-BUF, a touch insulating film T-ILD, a touch sensor TS may be provided, and a protective layer PAC as an organic layer for protecting the touch sensor TS may be provided to cover the touch sensor TS.

[0191] Furthermore, the weir DAM may be provided in the left region of the substrate protrusion 920 . Specifically, the weir DAM may be provided outside the second encapsulation layer PCL as an organic layer. That is, the weir DAM may be provided between the second encapsulation layer PCL and the substrate protrusion 920 .

[0192] Reference Figure 9 , a portion of the left side of the substrate protrusion 920 may be disposed to be in contact with the protective layer as the organic layer.

[0193] In this case, the upper surface of the substrate protrusion 920 may be located higher than a position where the protection layer PAC contacts the substrate protrusion 920. In this case, the substrate protrusion 920 may prevent the protection layer PAC from overflowing to the optical area OA.

[0194] Reference Figure 10The substrate protrusion 1020 can be configured in a form other than a weir. For example, the substrate protrusion 1020 can be formed by applying a paste to the substrate extension 510 and then curing the paste. In this case, the paste can be made of the same material as the substrate SUB. For example, the substrate SUB can be made of glass. The paste applied to the substrate extension 510 can also be a fine glass material. The paste, which is a fine glass material, can be applied to the substrate extension 510 and then melted by applying heat to the paste. In this case, a laser can be used as a means of heat-treating the paste. The paste heat-treated by the laser on the substrate extension 510 can melt and then penetrate beneath the protective layer PAC. Alternatively, the heat-treated paste can be arranged to cover a portion of the upper surface of the touch insulation film T-ILD and the touch buffer layer T-BUF. Thereafter, the paste can be bonded to the side surfaces of the various components of the display panel 110 through a curing process to form a structure for sealing the moisture penetration path.

[0195] In addition to the substrate protrusion 1020, Figure 10 The features of the configuration shown in Figure 9 The features of the configuration shown in . That is, refer to Figure 10 A buffer layer BUF, a gate insulating film GI, an interlayer insulating film ILD1, planarization layers PLN1 and PLN2, a spacer SPC, a light emitting layer EL, a first encapsulation layer PAS1, and a second encapsulation layer PCL may be provided on the left side of the substrate protrusion 1020.

[0196] In addition, a configuration for a touch sensing function may be provided on the second encapsulation layer PCL on the left side of the substrate protrusion 1020. For example, a touch buffer layer T-BUF, a touch insulating film T-ILD, a touch sensor TS may be provided, and a protective layer PAC as an organic layer for protecting the touch sensor TS may be provided to cover the touch sensor TS.

[0197] The substrate protrusion 1020 may be provided to contact a portion of the upper surface of the touch insulation film T-ILD. A portion of the upper surface of the touch insulation film T-ILD on which the substrate protrusion 1020 is provided may be located on an optical frame area (eg, HiAA frame area).

[0198] Furthermore, a portion of the substrate protrusion 1020 may be disposed in contact with the protective layer PAC. More specifically, a portion of the substrate protrusion 1020 may be disposed in the optical bezel region and may be in contact with the protective layer PAC. That is, the substrate protrusion 1020 may be disposed between the protective layer PAC and the substrate extension 510.

[0199] exist Figure 10In the embodiment of the present invention, the optical area OA may be formed on the right side of the substrate protrusion 1020. The optoelectronic device 530 may be disposed at the lower right side of the substrate protrusion 1020 in the optical area OA.

[0200] In addition, the weir DAM may be provided on the left side of the substrate protrusion 1020 . Specifically, the weir DAM may be provided outside the second encapsulation layer PCL as an organic layer. That is, the weir DAM may be provided between the second encapsulation layer PCL and the substrate protrusion 1020 .

[0201] Figure 9 The substrate protrusion 920 and Figure 10 The substrate protrusion 1020 can separate the optical border area (e.g., HiAA border area) from the optical area OA, thereby preventing crack propagation and moisture penetration through components set in the optical border area (e.g., HiAA border area) without expanding the optical border area.

[0202] On the other hand, the display device may be formed with the depression pattern 1100 .

[0203] Reference Figure 11 The substrate SUB may be disposed in an optical frame region (e.g., HiAA frame region) and a portion of the optical area OA. The substrate SUB may include a substrate extension 510 extending from the optical frame region to a portion of the optical area OA, and a substrate protrusion 1120 protruding from the optical substrate extension 510.

[0204] For example, the substrate protrusion 1120 can be formed into a weir shape by applying heat with a laser to elevate the substrate extension 510. For example, the substrate protrusion 1120 can be formed into a trapezoidal weir shape in which the length of the lower region adjacent to the substrate extension 510 is longer and the length of the upper region is shorter. Furthermore, the substrate protrusion 1120 can be formed so that its height is longer than its width.

[0205] However, this is merely an example of the shape of the substrate protrusion 1120, and the shape of the substrate protrusion 1120 is not limited thereto. For example, the substrate protrusion 1120 may be formed in a shape such as a triangle, a rectangle, and an ellipse.

[0206] exist Figure 11 In the embodiment of the present invention, the optical area OA may be formed on the right side of the substrate protrusion 1120. The optoelectronic device 530 may be disposed on the lower right side of the substrate protrusion 1120 in the optical area OA.

[0207] Reference Figure 11 , a configuration for forming the display panel 110 capable of providing a touch sensing function may be formed on the substrate SUB in the left optical bezel region of the substrate protrusion 1120 .

[0208] For example, refer to Figure 11 A buffer layer BUF, a gate insulating film GI, an interlayer insulating film ILD1, planarization layers PLN1 and PLN2, a spacer SPC, a light emitting layer EL, a first encapsulation layer PAS1 and a second encapsulation layer PCL may be provided on the substrate SUB on the left side of the substrate protrusion 1120.

[0209] In addition, a configuration for a touch sensing function may be provided on the second encapsulation layer PCL on the left side of the substrate protrusion 1120. For example, a touch buffer layer T-BUF, a touch insulating film T-ILD, a touch sensor TS may be provided, and a protective layer PAC as an organic layer for protecting the touch sensor TS may be provided to cover the touch sensor TS.

[0210] Furthermore, the weir DAM may be formed in the left region of the substrate protrusion 1120 . Specifically, the weir DAM may be provided outside the second encapsulation layer PCL as an organic layer. That is, the weir DAM may be provided between the second encapsulation layer PCL and the substrate protrusion 1120 .

[0211] In addition, the recess pattern 1100 may be further provided on the substrate SUB in the optical bezel region (eg, HiAA bezel region) in the left region of the substrate protrusion 1120 .

[0212] The recess pattern 1100 may be formed by removing at least a portion of an organic insulating layer (eg, ILD2 - 2 , PLN1 , PLN2 , etc.).

[0213] The light emitting layer EL may be located on the recessed pattern 1100, and the light emitting layer EL may be intermittently arranged on the recessed pattern 1100. That is, the light emitting layer EL may be disconnected by the recessed pattern 1100. Since the recessed pattern 1100 performs the function of disconnecting the light emitting layer, the recessed pattern 1100 may also be referred to as a partition.

[0214] The first encapsulation layer PAS1 may be disposed on the light emitting layer EL in the optical bezel region and may fill the concave portion of the concave pattern 1100 .

[0215] The dam DAM may be provided between the recess patterns 1100 or outside the second encapsulation layer PCL. The recess pattern 1100 may be divided into an inner recess pattern 1101 and an outer recess pattern 1102.

[0216] The inner recessed pattern 1101 may be located in a direction from the dam DAM to the display area AA. The inner recessed pattern 1101 may be arranged to overlap with the second encapsulation layer PCL, which is an organic layer. The outer recessed pattern 1102 may be located in a direction from the dam DAM to the optical area OA. In other words, the outer recessed pattern 1102 may be arranged between the substrate protrusion 1120 and the dam DAM.

[0217] The recess pattern 1100 and the bank DAM may be provided in the second sub-area SA2. The protection layer PAC may extend from the first sub-area SA1 to at least a portion of the second sub-area SA2.

[0218] exist Figure 11 , the protection layer PAC is illustrated as being arranged to a region overlapping the outer recess pattern 1102 , but is not limited thereto, and the protection layer PAC may be provided to the bank DAM or the inner recess pattern 1101 .

[0219] On the other hand, the substrate protrusion 1120 may be provided to contact the protective layer PAC. A portion of the substrate protrusion 1120 may be provided at the outer edge of the outer concave pattern 1102. Alternatively, the substrate protrusion 1120 may be provided to contact the outer concave pattern 1102 in the optical area OA.

[0220] In this case, the substrate protrusion 1120 may be formed so that the height of the upper surface is higher than the point where the protection layer PAC contacts the side surface of the substrate protrusion 1120. Therefore, the problem that the protection layer PAC, which is an organic layer, overflows into the optical area OA on the right side of the substrate protrusion 1120 can be prevented.

[0221] On the other hand, the substrate protrusion 1120 may be formed in a form other than a weir.

[0222] Reference Figure 12 For example, the substrate protrusion 1220 can be formed by applying a paste to the substrate extension 510 and then curing the paste. The paste can be made of the same material as the substrate SUB. For example, the substrate SUB can be made of glass. The paste applied to the substrate extension 510 can also be a fine raw material of glass. The paste, which is a fine raw material of glass, can be applied to the substrate extension 510 and then melted by applying heat to the paste. At this time, a laser can be used as a means of heat-treating the paste. The paste heat-treated by the laser on the substrate extension 510 can melt and then penetrate under the protective layer PAC. Alternatively, the heat-treated paste can be arranged to cover a portion of the upper surface of the touch insulation film T-ILD and the touch buffer layer T-BUF. The paste can be heat-treated and then hardened to form the substrate protrusion 1220.

[0223] In addition to the substrate protrusion 1220, Figure 12 The features of the configuration shown in Figure 11 The features of the configuration shown in . That is, refer to Figure 12 A buffer layer BUF, a gate insulating film GI, an interlayer insulating film ILD1, planarization layers PLN1 and PLN2, a spacer SPC, a light emitting layer EL, a first encapsulation layer PAS1, and a second encapsulation layer PCL may be provided on the left side of the substrate protrusion 1220.

[0224] exist Figure 12 In the embodiment, the optical area OA may be formed on the right side of the substrate protrusion 1220. The optoelectronic device 530 may be disposed on the lower right side of the substrate protrusion 1220 in the optical area OA.

[0225] In addition, a configuration for a touch sensing function may be provided on the second encapsulation layer PCL on the left side of the substrate protrusion 1220. For example, a touch buffer layer T-BUF, a touch insulating film T-ILD, a touch sensor TS may be provided, and a protective layer PAC as an organic layer for protecting the touch sensor TS may be provided to cover the touch sensor TS.

[0226] In addition, the weir DAM may be provided in the left region of the substrate protrusion 1220 . Specifically, the weir DAM may be provided outside the second encapsulation layer PCL as an organic layer. That is, the weir DAM may be provided between the second encapsulation layer PCL and the substrate protrusion 1220 .

[0227] Reference Figure 12 , Figure 11 The recessed pattern 1100 described in the accompanying drawings can also be formed in the left area of ​​the substrate protrusion 1220. Specifically, the inner recessed pattern 1101 can be arranged to overlap with the second encapsulation layer PCL as an organic layer. The outer recessed pattern 1102 can be arranged in the direction from the weir DAM to the optical area OA. That is, the outer recessed pattern 1102 can be arranged between the substrate protrusion 1220 and the weir DAM. The substrate protrusion 1220 can replace the function and effect of the outer recessed pattern 1102, thereby reducing the physical length of the outer recessed pattern 1102. By forming the substrate protrusion 1220, it is possible to prevent moisture and cracks from penetrating through the substrate protrusion 1220 without increasing the arrangement length of the outer recessed pattern 1102. Therefore, the physical length of the outer recessed pattern 1220 can be reduced to reduce the optical frame area (for example, the HiAA frame area).

[0228] On the other hand, refer to Figure 12The substrate protrusion 1220 may be disposed to overlap with the outer recessed pattern 1102 in the optical frame region (e.g., the HiAA frame region). Specifically, the substrate protrusion 1220 may be disposed in the optical frame region and cover the touch insulation film T-ILD in the region overlapping with the outer recessed pattern 1102. The substrate protrusion 1220 may be disposed to contact the protective layer PAC in the optical frame region (e.g., the HiAA frame region).

[0229] In addition, Figure 12 , the protective layer PAC is illustrated as being arranged to overlap the outer recess pattern 1102 , but is not limited thereto. The protective layer PAC may be provided to the bank DAM or the inner recess pattern 1101 .

[0230] Figure 11 The substrate protrusion 1120 and Figure 12 The substrate protrusion 1220 may separate the optical bezel area (eg, HiAA bezel area) from the optical area OA, thereby preventing crack penetration and moisture penetration through components disposed in the optical bezel area without expanding the optical bezel area.

[0231] As mentioned above Figures 6 to 12 The features of the present disclosure are shown as embodiments related to the optical area OA where the optoelectronic device 530 is provided, but may also be applied to the non-display area NA surrounding the periphery of the display panel 110. For example, Figures 6 to 12 The substrate protrusions 620, 720, 820, 920, 1020, 1120 and 1220 shown in the figure can be set at the boundary between the display area AA of the display panel 110 and the non-display area NA surrounding the periphery of the display panel 110, thereby preventing moisture and cracks from penetrating from the outer edge of the display panel 110 into the display area AA.

[0232] The embodiments of the present disclosure described above are briefly described as follows.

[0233] A display device according to an embodiment of the present disclosure may include: a substrate including a non-display region and a display region, the non-display region having an optical region and an optical frame region, the optical frame region being an area outside the optical region; a light-emitting device disposed in the display region; and an organic layer disposed on the substrate. In this case, the substrate may include a substrate extension extending from the optical frame region to a portion of the optical region, and a substrate protrusion protruding from the substrate extension in the optical region.

[0234] The organic layer may be provided to contact a portion of an upper surface of the substrate extension portion and to contact a portion of a side surface of the substrate protrusion portion.

[0235] The upper surface of the substrate protrusion may be located higher than a position where the organic layer contacts the substrate protrusion.

[0236] The substrate protrusion may be provided to cover a portion of a side surface of the organic layer.

[0237] The substrate protrusion may have a weir shape.

[0238] The substrate protrusion may be provided to contact a side surface of the organic layer and a portion of an upper surface of the organic layer.

[0239] The organic layer may include a crack, and / or a portion of the organic layer may be disposed to be spaced apart from the substrate extension in the optical region.

[0240] The display device according to an embodiment of the present disclosure may further include a dam disposed outside the organic layer, a touch sensor disposed on the organic layer, and a protective layer disposed to cover the touch sensor. The substrate protrusion may be disposed to contact the protective layer.

[0241] The substrate protrusion may be provided in the optical region in the form of a weir.

[0242] A portion of the substrate protrusion may be disposed in the optical bezel region and may be disposed between the protective layer and the substrate extension.

[0243] The display device according to an embodiment of the present disclosure may further include an inner concave pattern arranged to overlap with the organic layer, and an outer concave pattern arranged outside the dam. In this case, at least a portion of the substrate protrusion may be arranged outside the outer concave pattern.

[0244] The substrate protrusion may be disposed to contact the outer concave pattern in the optical region.

[0245] The substrate protrusion may be disposed to overlap the outer recessed pattern in the optical bezel region.

[0246] Each of the inner and outer concave patterns may include at least one concave pattern.

[0247] The display device according to an embodiment of the present disclosure may further include an optoelectronic device disposed on the optical region.

[0248] The optical border area may include a first sub-area and a second sub-area located between the first sub-area and the optical area, the outer concave pattern, the inner concave pattern and the dam are arranged in the second sub-area, and the protective layer extends from the first sub-area to at least a portion of the second sub-area.

[0249] The substrate extension may be raised by applying heat with a laser to form the substrate protrusion.

[0250] The above description has been presented to enable any person skilled in the art to make and use the technical concepts of the present invention, and the above description has been provided in the context of a specific application and its requirements. Various modifications, additions, and substitutions to the described embodiments will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of the present invention. The above description and accompanying drawings provide examples of the technical concepts of the present invention for illustrative purposes only. That is, the disclosed embodiments are intended to illustrate the scope of the technical concepts of the present invention.

Claims

1. A display device comprising: A substrate comprising a display area and a non-display area, wherein the non-display area has an optical area and an optical frame area, and the optical frame area is an outer area of ​​the optical area; a light emitting device, the light emitting device being arranged in the display area; as well as an organic layer, the organic layer being disposed on the substrate, The substrate includes a substrate extension portion extending from the optical frame area to a portion of the optical area, and a substrate protrusion protruding from the substrate extension portion in the optical area.

2. The display device according to claim 1, wherein The organic layer is provided in contact with a portion of an upper surface of the substrate extension portion and in contact with a portion of a side surface of the substrate protrusion portion.

3. The display device according to claim 2, wherein: The upper surface of the substrate protrusion is located higher than a position where the organic layer contacts the substrate protrusion.

4. The display device according to claim 1, wherein The substrate protrusion is provided to cover a portion of a side surface of the organic layer.

5. The display device according to claim 1, wherein The substrate protrusion has a weir shape. The display device according to claim 1 , wherein: The substrate protrusion is provided to be in contact with a side surface of the organic layer and a portion of an upper surface of the organic layer.

7. The display device according to claim 1, wherein The organic layer includes a crack, and / or a portion of the organic layer is disposed to be spaced apart from the substrate extension in the optical region.

8. The display device according to claim 1, further comprising: a weir, the weir being arranged outside the organic layer; a touch sensor disposed on the organic layer; as well as a protective layer, the protective layer being configured to cover the touch sensor, Wherein, the substrate protrusion is configured to contact the protection layer.

9. The display device according to claim 8, wherein The substrate protrusion is provided in the optical region in the form of a weir.

10. The display device according to claim 8, wherein A portion of the substrate protrusion is disposed in the optical bezel region and between the protective layer and the substrate extension.

11. The display device according to claim 8, further comprising: an inner concave pattern, the inner concave pattern being arranged to overlap with the organic layer; an outer concave pattern, the outer concave pattern being arranged on the outer side of the weir, Wherein, at least a portion of the substrate protrusion is arranged outside the outer recessed pattern.

12. The display device according to claim 11, wherein The substrate protrusion is disposed to contact the outer concave pattern in the optical region.

13. The display device according to claim 11, wherein The substrate protrusion is disposed to overlap the outer recessed pattern in the optical bezel region.

14. The display device according to claim 11, wherein Each of the inner concave pattern and the outer concave pattern includes at least one concave pattern. The display device according to claim 1 , further comprising an optoelectronic device disposed in the optical region.

16. The display device according to claim 11, wherein The optical border area includes a first sub-area and a second sub-area located between the first sub-area and the optical area, the outer concave pattern, the inner concave pattern and the dam are arranged in the second sub-area, and the protective layer extends from the first sub-area to at least a portion of the second sub-area.

17. The display device according to claim 1, wherein The substrate extension portion is raised by applying heat with a laser to form the substrate protrusion.

Images