Wireless ap mounting kit for clean room

Abstract

The invention provides a wireless ap mounting kit for a clean room, which comprises a meter cover, a mounting screw fixing hole, a base, a middle sealing strip, a wireless ap mounting hole, a connecting pipe, a silica gel sealing ring and a fixing screw. A wireless ap is installed in the base of the suite through wireless ap installation holes in the base, a meter cover, a middle sealing strip, the base and a silica gel sealing ring are connected through fixing screws, the base of the suite is provided with a connecting pipe leading to a technical interlayer of a clean area, and the connecting pipe is connected with an SC pipe or a bridge of a network system in the technical interlayer. According to the wireless AP, the function of connecting the wired network to the wireless AP is achieved, the heat dissipation hole is formed in the connecting pipe, heat generated when the wireless AP works is discharged into the technical interlayer, the heat dissipation function is achieved, and meanwhile the environment of a clean room is not polluted. The kit can realize normal operation of the wireless ap in a clean room, and is low in cost, simple in construction and convenient to maintain.

Description

Technical Field

[0001] The present invention is applicable to the field of wireless network technology in clean rooms with cleanliness requirements of Class 10,000, Class 1,000, etc., and specifically relates to an installation kit for a wireless AP in a clean room. Background Art

[0002] Wireless AP is an access point for users who use wireless devices (mobile devices such as mobile phones and wireless devices such as laptops) to access wired networks. It is mainly used in broadband homes, inside buildings, inside parks, as well as warehouses, factories and other places where wireless networks are required.

[0003] In some places such as semiconductor clean rooms and clean laboratories, facing the ever-changing new era of data networks, the use and coverage of wireless networks are essential functions for these places. And the use of wireless networks is inseparable from wireless APs.

[0004] There are two main types of APs on the market: panel-type APs and ceiling-mounted APs. There are several issues with how these APs are installed and deployed in clean areas: traditional panel-type APs protrude from the surface of the cleanroom panel, which does not meet the disinfection and wiping requirements of the cleanroom. Panel-type APs also have poor heat dissipation, while ceiling-mounted APs, due to the heat dissipation holes on their surface, will pollute the cleanroom environment. Summary of the Invention

[0005] In order to overcome the existing problems, the present invention provides an installation kit for a wireless AP in a clean room, which meets the daily use needs of the wireless AP while not polluting the clean room environment, and has low cost and simple construction.

[0006] The present application is implemented by providing a wireless AP installation kit for a clean room, characterized in that: the kit (1) uses the wireless AP installation hole (6) on the base to install the wireless AP in the base (4) of the kit, uses fixing screws through the installation screw fixing holes (3) to connect the cover (2), the middle sealing strip (5), the base (4), and the silicone sealing ring (10), and then tightens the fixing nuts on the technical interlayer to install the entire kit on the clean room ceiling to complete the installation.

[0007] According to the present application, a wireless AP installation kit for a clean room is characterized in that: the kit base has a connecting pipe (7) leading to the technical interlayer of the clean area, which is connected to the SC pipe or bridge of the network system in the technical interlayer via a thread (9) to achieve the function of connecting the wired network to the wireless AP. The connecting pipe is provided with a heat dissipation hole (8) to discharge the heat generated by the wireless AP during operation into the technical interlayer, thereby achieving the heat dissipation function while not polluting the clean room environment. The kit can realize the normal operation of the wireless AP in the clean room, and is low-cost, simple to construct, and easy to maintain.

[0008] According to the installation kit for a wireless AP in a clean room described in the present application, the feature is that the installation kit can meet the normal use of the wireless AP function without affecting the clean room environment, is easy to maintain, and meets the heat dissipation requirements of the wireless AP during operation.

[0009] The present application discloses a wireless access point installation kit for a cleanroom, characterized by a kit mounted on the exterior of a ceiling-mounted access point. The kit comprises a cover and a base. The kit is entirely made of PC plastic, a material with high transparency and hardness commonly used in many electronic devices. PC plastic has minimal impact on radio frequency signals, effectively penetrates signals, and maintains high-quality data transmission. It is commonly used in wireless routers, mobile phone cases, and electronic product housings. Using this material in the kit provides excellent protection for the wireless communication signals employed in this invention.

[0010] The present invention has the following advantages: it can meet the normal use of wireless AP functions without affecting the clean room environment, is easy to repair, and meets the heat dissipation requirements of wireless AP during operation. Specifically, it has the following advantages: 1. Advantages of adaptability to clean environments: The multi-stage sealing structure ensures the cleanliness level. The middle sealing strip (5) between the cover (2) and the base (4) and the silicone sealing ring (10) on the contact surface between the base and the ceiling form a double sealing system. The symmetrical fastening design of the fixing screw hole (3) achieves an airtight connection. According to actual measurements, the particle concentration (≥0.5μm) on the clean room side is ≤352,000 particles / m³ under a pressure difference of 10Pa, which fully meets the ISO 14644-1 Class 8 clean room standard, prevents external dust and aerosols from entering the clean area, and solves the clean environment pollution problem caused by direct installation of traditional wireless APs. The non-contact heat dissipation design prevents contamination. The heat dissipation holes (8) on the connecting pipe (7) discharge the working heat of the wireless AP to the technical interlayer through natural convection. The heat conduction path is completely isolated from the clean room space, avoiding airflow disturbance or particle migration caused by heat dissipation, ensuring that the clean room airflow organization is not affected, and at the same time meeting the temperature control requirements of the equipment for long-term operation (the measured surface temperature rise of the clean area is ≤2℃). 2. Functional realization and reliability improvement: High-transmittance PC material ensures signal quality. The main body of the kit is made of PC plastic with a transmittance of ≥89%. The attenuation of 2.4GHz / 5GHz wireless signals is ≤0.25dB, which is significantly better than the metal shell solution (attenuation 3.2dB), ensuring wireless signal penetration and data transmission quality. The material hardness is ≥118HRM, which can withstand the mechanical impact of daily cleaning operations in the clean room and prevent the deformation of the shell from affecting the sealing performance. Standardized interface enables convenient networking. The M20×1.5 thread (9) of the base connection pipe (7) is directly matched with the standard interface of the technical interlayer SC pipe / bridge, without the need for additional adapters. The RJ45 network cable realizes wired network access through the channel inside the pipe, supporting plug-and-play modular networking, meeting the reliability and standardization requirements of the clean room for network deployment. 3. Maintenance convenience and cost advantages: The quick-release structure simplifies the maintenance process. The table cover (2) can be independently removed using four sets of fixing screws. The wireless AP working status indicator can be directly viewed without destroying the overall sealing structure, shortening troubleshooting time by 70%. The entire kit can be rotated and removed through the technical interlayer. The single maintenance time is ≤10 minutes, which complies with GMP clean room rapid maintenance standards and reduces downtime losses. Low-cost lightweight design PC plastic material costs are 60% lower than stainless steel solutions. The injection molding process reduces processing steps. The weight of a single kit is ≤300g, and no additional load-bearing structure is required during installation. The standardized component design supports large-scale production. No specialized tools are required during the construction process. The installation time of a single kit is ≤30 minutes, significantly reducing labor costs and project cycles. IV. Environmental compatibility and application scalability: Stable operation over a wide temperature range. The PC material has a temperature resistance range of -40-120°C. Combined with the optimized layout of the heat dissipation holes, the wireless AP can still maintain normal operation in a high temperature environment of 50°C in the technical interlayer (the internal temperature rise is controlled within 35°C), meeting the complex temperature and humidity environment requirements of clean rooms in the pharmaceutical and electronics industries. Universal adaptability design. The base mounting holes (6) adopt modular dimensions and are compatible with mainstream ceiling-mounted wireless AP models on the market (dimensional error ±2mm). The connecting pipe length supports customized adjustment (adjustable from 50-200mm), which is suitable for clean room ceiling structures of different thicknesses, improving product adaptability and engineering flexibility. In summary, the present invention realizes the reliable deployment of wireless APs in the special environment of clean rooms through material innovation, sealing structure design and functional integration. It has multiple advantages such as environmental friendliness, high-quality signal, convenient maintenance and cost-effectiveness, and provides an efficient solution for the construction of wireless networks in high-cleanliness scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic diagram of the components of the installation kit of the present invention, Figure 2It is a schematic diagram of the installation implementation of the installation kit of the present invention.

[0012] Wherein: installation kit (1), table cover (2), installation screw fixing hole (3), base (4), middle sealing strip (5), wireless AP installation hole (6), connecting pipe (7), heat dissipation hole (8), thread (9), silicone sealing ring (10). DETAILED DESCRIPTION

[0013] The following will be combined with the Figure 1-Figure 2 The present invention is described in detail, and the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0014] The present invention provides an installation kit for a wireless AP in a clean room by improving Figure 1-Figure 2 As shown, the kit can be implemented as follows: the kit 1 utilizes the wireless AP mounting holes 6 on the base to install the wireless AP in the kit's base 4. The cover 2, intermediate sealing strip 5, base 4, and silicone sealing ring 10 are connected using screws through the mounting screw holes 3. The fixing nuts on the technical interlayer are then tightened, and the entire kit is mounted on the cleanroom ceiling to complete the installation. The kit base has a connecting pipe 7 leading to the cleanroom's technical interlayer. This connects to the SC pipe or bridge of the network system in the technical interlayer via threads 9, enabling the wired network to connect to the wireless AP. This connecting pipe is equipped with a heat dissipation hole 8 to dissipate heat generated by the wireless AP into the technical interlayer.

[0015] The specific implementation process of this application is described below; 1. Component Manufacturing and Assembly: The main body of the kit is produced using an injection molding process for the cover 2 and base 4. The raw material is PC plastic particles that meet the standards for electronic device enclosures, with a light transmittance of ≥89% and a Rockwell hardness of ≥118 HRM, ensuring 2.4GHz / 5GHz wireless signal attenuation of ≤0.3dB. A mounting hole 6 with a diameter matching the shape of the wireless AP is reserved in the center of the base 4. Four sets of evenly spaced M3 threaded blind holes are provided around the hole for securing the wireless AP. A connecting tube 7 is vertically injection-molded in the center of the bottom surface. The tube has an outer diameter of φ20mm and an inner wall threaded with M20×1.5 standard threads 9. Eight sets of φ3mm heat dissipation holes 8 are arranged in a circular array. The sealing assembly is prepared using a central sealing strip 5 molded from food-grade silicone rubber. It is a rectangular ring with a width of 15mm and a thickness of 3mm. The inner ring has a groove that mates with the edge of the base 4. The silicone sealing ring 10 is a φ25mm O-ring with a hardness of 60±5 Shore A, which seals the base and the ceiling mounting hole. 2. Wireless AP Preinstallation Process: Device Securing: Align the wireless AP with the mounting hole 6 on the base 4. Use M2.5×8mm countersunk screws to screw from the AP's bottom screw hole into the pre-threaded blind hole in the base. Ensure the AP antenna is facing vertically upward, and the clearance between the device bottom and the base mounting surface is ≤0.5mm. Cable Pretreatment: Route the wireless AP's RJ45 network cable through the base's connecting tube 7, leaving 20cm of excess cable length. Tin the cable ends to prevent oxidation and ensure a stable network connection. III. Kit Assembly Steps: Lay the sealing layers in the order of cover 2 - intermediate sealing strip 5 - base 4 - silicone sealing ring 10, ensuring the intermediate sealing strip completely covers the upper edge of the base and the silicone sealing ring fits into the annular groove on the base's underside. Use four sets of M4 x 12mm stainless steel screws to symmetrically secure the cover and base fixing screw holes 3. For ceiling installation, locate the cleanroom ceiling's technical mezzanine with pre-set φ20mm mounting holes that match the base connecting pipe 7. M20 x 1.5 stainless steel fixing nuts are embedded around the holes. Align the assembled kit with the mounting holes from the cleanroom side. Rotate the base so that the connecting pipe threads 9 engage the SC pipe or bridge interface in the technical mezzanine, ensuring a tight fit between the silicone sealing ring and the ceiling panel. 4. Network and Cooling System Connection: Wired network access is located within the technical mezzanine. An RJ45 network cable, derived from an SC tube or bridge, is connected to the wireless AP's network port through the interior of the connecting pipe (7). A metal lock is used to secure the connector, which is wrapped with fire-resistant insulation tape. Thread sealant is applied to the threaded joints of the connecting pipe to prevent dust from entering the cleanroom. The heat dissipation structure ensures that heat generated by the wireless AP during operation is transferred from the base metal mounting plate to the connecting pipe (7). Heat is then discharged to the technical mezzanine through the heat dissipation holes (8) in the pipe wall by natural convection. V. Inspection and Maintenance: Daily inspections require direct visual inspection of the wireless AP's operating indicators through the transparent PC viewing window on the clean area cover 2, ensuring accurate equipment operation without removing the equipment kit. Troubleshooting: Loosen the four sets of screws securing cover 2 and pull upward to remove the cover, revealing the internal wireless AP and connecting cables. For complete replacement, rotate the base counterclockwise in the technical compartment to disconnect the threaded connections and remove the kit. A single inspection takes ≤10 minutes, meeting GMP cleanroom rapid maintenance requirements. VI. Material and Performance Verification: Signal penetration testing at 30dBm transmit power revealed a spectrum analyzer-measured signal attenuation of 0.25dB through the PC plastic housing, a 92% improvement compared to the metal housing solution (3.2dB attenuation), ensuring wireless coverage meets design requirements. Sealing verification was conducted using an aerosol leak detector at a 10Pa pressure differential around the housing. The cleanroom-side particle concentration (≥0.5μm) remained ≤352,000 particles / m³, meeting Class 8 cleanroom standards. Through the above implementation process, the reliable installation of wireless APs in clean room environments was achieved. It has the technical advantages of low cost (material cost is 60% lower than that of stainless steel solutions), easy construction (single set installation time ≤ 30 minutes), and high reliability (mean time between failures ≥ 50,000 hours), meeting the wireless network deployment needs of clean rooms in industries such as pharmaceuticals and electronics.

[0016] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wireless AP installation kit for a clean room, characterized by: The kit (1) uses the wireless AP installation hole (6) on the base to install the wireless AP in the base (4) of the kit, and uses fixing screws through the installation screw fixing holes (3) to connect the cover (2), the middle sealing strip (5), the base (4), and the silicone sealing ring (10). Then, the fixing nuts on the technical interlayer are tightened, and the entire kit is installed on the clean room ceiling to complete the installation.

2. The installation kit for a wireless AP in a clean room according to claim 1, characterized in that: The base of the kit has a connecting pipe (7) leading to the technical interlayer of the clean area, which is connected to the SC pipe or bridge of the network system in the technical interlayer through a thread (9) to realize the function of connecting the wired network to the wireless AP. A heat dissipation hole (8) is provided at the connecting pipe to discharge the heat of the wireless AP during operation into the technical interlayer, realizing the heat dissipation function while not polluting the clean room environment. The kit can realize the normal operation of the wireless AP in the clean room, and has low cost, simple construction and convenient maintenance.

3. The installation kit for a wireless AP in a clean room according to claim 1, characterized in that: The installation kit can meet the normal use of the wireless AP function without affecting the clean room environment, is easy to repair, and meets the heat dissipation requirements of the wireless AP when working.

4. The installation kit for a wireless AP in a clean room according to claim 1, characterized in that: A kit is set on the outside of the ceiling-mounted AP, which consists of a cover and a base. The entire kit is made of PC plastic, which has high transparency and hardness. It is one of the manufacturing materials of many electronic devices. It has little effect on radio frequency signals, can effectively penetrate signals, and maintain high-quality data transmission. It is often used in wireless routers, mobile phone cases, electronic product shells, etc. Using this material to make a kit can provide good protection for the wireless communication signals used in this invention.

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