This invention relates to the field of
copper alloy strip preparation technology, and discloses a high-strength, high-temperature resistant
copper alloy strip and its application in AI computing centers. The
copper alloy strip comprises, by
mass percentage: Ni 0.6%–3.8%, Co 0.9%–1.6%, Si 0.35%–0.85%, Zn 0.03%–0.45%, Sn 0.02%–0.18%, Re 0.001%–0.02%, with the balance being Cu and unavoidable impurities; preferably, it also includes B. The preparation method includes melting and
casting according to the proportions, heating in a walking beam furnace, hot rolling, milling, rough rolling,
solution treatment, cold rolling, aging treatment, finished product rolling, and finished product annealing. By combining the Ni, Co, and Si
precipitation strengthening
system with the
microstructure regulation effects of Zn, Sn, Re, and B, coarse second-phase particles in the metallographic structure are discretely distributed, and the continuous network of second-phase aggregation regions at grain boundaries are reduced. This results in a
copper alloy strip with high electrical
conductivity, high tensile strength, high
thermal conductivity, and good high-
temperature stress retention capability, which is suitable for AI
computing center connection, conductive, and heat dissipation components.