Lightweight vapor chamber, manufacturing method of lightweight vapor chamber and electronic equipment

Abstract

The invention provides a light-weight uniform temperature plate, a manufacturing method of the light-weight uniform temperature plate and electronic equipment, and can be applied to the technical field of heat dissipation. The light-weight vapor chamber comprises a shell and a lower capillary layer. The shell comprises an upper cover and a lower cover, and the upper cover comprises a plurality of supporting columns which are integrally punched and formed; an inner cavity of the shell is a vacuum cavity, and the vacuum cavity is filled with a heat transfer working medium; the lower capillary layer is laid on the inner surface of the lower cover, and the lower ends of the supporting columns abut against the lower capillary layer. According to the light-weight uniform-temperature plate, the upper cover is provided with the supporting columns integrally formed with the upper cover in a punching mode, additional material manufacturing and assembling of the supporting columns are not needed, the overall weight of the uniform-temperature plate is effectively reduced on the basis that the strength of the uniform-temperature plate is ensured through the supporting effect of the supporting columns, and the uniform-temperature plate obtains the excellent light-weight performance.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a lightweight temperature equalizing plate, a method for manufacturing the lightweight temperature equalizing plate, and an electronic device. Background Art

[0002] As the performance of electronic devices continues to improve, the integration and computing density of their internal components are growing exponentially, resulting in a sharp increase in the heat generated by the devices during operation.

[0003] For this reason, more and more electronic devices are beginning to use vapor chambers as their heat dissipation modules. Using vapor chambers as heat dissipation modules for electronic devices offers advantages such as high thermal conductivity, strong temperature uniformity, good structural adaptability, quiet operation, and excellent reliability.

[0004] However, as electronic devices pursue the ultimate trend of combining thinness and lightness with high performance, further reducing the weight of the vapor chamber has become a key issue that needs to be overcome in the field of heat dissipation technology. Therefore, further reducing the weight of the vapor chamber is an important step in achieving overall lightweighting and high performance in electronic devices. Summary of the Invention

[0005] The present application provides a lightweight temperature averaging plate, a method for manufacturing a lightweight temperature averaging plate, and an electronic device, to solve the technical problem of insufficient lightweight performance of existing temperature averaging plates.

[0006] According to a first aspect disclosed in the present application, the present application provides a lightweight temperature homogenizing plate, comprising a shell and a lower capillary layer;

[0007] The housing comprises an upper cover and a lower cover, wherein the upper cover comprises a plurality of support columns formed by integral stamping; the inner cavity of the housing is a vacuum chamber, and the vacuum chamber is filled with a heat transfer medium;

[0008] The lower capillary layer is laid on the inner surface of the lower cover, and the lower end of the support column abuts against the lower capillary layer.

[0009] In a feasible implementation manner, a plurality of local capillary layers are provided on the upper surface of the lower capillary layer; wherein the specifications of the local capillary layers are different from those of the lower capillary layer.

[0010] In a feasible embodiment, the local capillary layer has a gradient structure with a cross-sectional area gradually decreasing from bottom to top.

[0011] In a feasible embodiment, an upper capillary layer is laid on the inner surface of the upper cover, and the upper capillary layer is provided with through holes for the support pillars to pass through.

[0012] In a feasible embodiment, a plurality of conductive capillaries are provided in the vacuum chamber, wherein the lower ends of the conductive capillaries are communicated with the lower capillary layer, and the upper ends of the conductive capillaries are communicated with the upper capillary layer.

[0013] In a feasible implementation manner, the conductive capillary is sleeved on the supporting column.

[0014] In a feasible implementation manner, the conductive capillary is a braided copper wire capillary or a sintered powder strip capillary.

[0015] In a feasible embodiment, the support column is conical.

[0016] According to the second aspect disclosed in the present application, the present application provides a method for manufacturing a lightweight temperature equalizing plate, comprising:

[0017] The upper cover and the lower cover are produced by stamping; wherein the upper cover includes a plurality of support columns formed by integral stamping;

[0018] Laying a lower capillary layer on the inner surface of the lower cover;

[0019] Welding the joint between the upper cover and the lower cover to form a shell;

[0020] A heat transfer medium is injected into the inner cavity of the shell through an injection port reserved on the shell, and after the inner cavity of the shell is evacuated, the injection port is sealed to obtain a formed temperature equalizing plate.

[0021] According to a third aspect disclosed in the present application, the present application provides an electronic device, which includes a device body and a lightweight temperature vapor chamber as described in any one of the first aspects.

[0022] Compared with the existing technology, this application has the following beneficial effects:

[0023] The present application provides a lightweight temperature equalizing plate, a method for manufacturing a lightweight temperature equalizing plate, and an electronic device. By arranging a support column that is stamped and formed integrally with the upper cover on the upper cover, there is no need to add additional materials to manufacture and assemble the support column. The temperature equalizing plate effectively reduces its overall weight on the basis of utilizing the supporting effect of the support column to ensure its own strength, so that the temperature equalizing plate obtains excellent lightweight performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0025] Figure 1 A schematic structural diagram of a lightweight temperature equalizing plate provided in an embodiment of the present application;

[0026] Figure 2 A schematic structural diagram of an upper cover provided in an embodiment of the present application;

[0027] Figure 3 A schematic structural diagram of a lower cover provided in an embodiment of the present application;

[0028] Figure 4 A schematic structural diagram of a capillary layer provided in an embodiment of the present application;

[0029] Figure 5 A schematic flow chart of a method for manufacturing a lightweight temperature equalizing plate provided in an embodiment of the present application.

[0030] Description of reference numerals:

[0031] 100-upper cover;

[0032] 101-support column;

[0033] 200-conductive capillary;

[0034] 300-local capillary layer;

[0035] 400-lower capillary layer;

[0036] 500-lower cover.

[0037] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below in conjunction with the drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals throughout represent the same or similar parts or parts with the same or similar functions. The described embodiments are part of the embodiments of the present application, not all of the embodiments. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0039] As the performance of electronic devices continues to improve, the integration and computing density of their internal components are growing exponentially, resulting in a sharp increase in the heat generated by the devices during operation. In particular, driven by technologies such as 5G communications, AI computing, and high-resolution displays, the CPU frequency, RF front-end complexity, and screen power consumption of electronic devices such as smartphones and laptops have increased significantly. In this context, existing electronic equipment heat dissipation modules achieve efficient thermal management through the synergy of multiple components. Its core structure includes heat pipes, heat dissipation fins, and fans. The heat pipes use liquid-vapor phase change to achieve rapid heat conduction, while the fans accelerate heat dissipation through forced convection. The heat dissipation module optimizes the thermal resistance path through a composite design to ensure that the device maintains a stable operating temperature in a compact space, avoiding performance degradation or hardware damage due to overheating.

[0040] However, as electronic devices continue to upgrade in performance, their power consumption and heat generation have increased significantly. At the same time, to meet users' demand for lightweight and portable devices, the internal space of devices continues to shrink. In this context, traditional cooling solutions are gradually exposing their limitations.

[0041] To address these issues, a growing number of electronic devices are adopting vapor chambers as heat dissipation modules. Vapor chambers are highly efficient heat diffusion devices based on the principle of phase change heat transfer. They contain a vacuum chamber filled with a heat transfer medium (such as deionized water). Heat is rapidly and evenly distributed through a cycle of fluid evaporation at the heat source, diffusion to the cold end where it condenses and releases heat, and the condensed liquid returns to the heat source via a capillary layer. Using vapor chambers as heat dissipation modules for electronic devices offers advantages such as high thermal conductivity, strong temperature uniformity, excellent structural adaptability, quiet operation, and superior reliability.

[0042] However, as electronic devices pursue the ultimate fusion of lightweight and high performance, further reducing the weight of vapor chambers has become a critical challenge in the field of heat dissipation technology. As the consumer market continues to demand greater portability in electronic devices, weight control for products like laptops, tablets, and smartphones is becoming increasingly stringent. Every gram of weight reduction can become a key advantage in the market. Therefore, further reducing the weight of vapor chambers is a crucial step in achieving overall lightweighting and high performance in electronic devices.

[0043] In response to the above technical problems, the present application proposes a lightweight temperature equalizing plate, a method for manufacturing a lightweight temperature equalizing plate, and an electronic device. By arranging a support column that is stamped and formed integrally with the upper cover on the upper cover, there is no need to add additional materials to manufacture and assemble the support column. The temperature equalizing plate effectively reduces its overall weight on the basis of utilizing the supporting effect of the support column to ensure its own strength, so that the temperature equalizing plate obtains excellent lightweight performance.

[0044] The following describes in detail the lightweight temperature vapor chamber, the method for manufacturing the lightweight temperature vapor chamber, and the technical solution for the electronic device provided by this application through specific embodiments. It should be noted that the following embodiments can exist independently or in combination with each other, and the same or similar content may not be repeated in different embodiments.

[0045] Figure 1 This is a schematic diagram of the structure of a lightweight temperature equalizing plate provided in an embodiment of the present application, see Figure 1 In some embodiments, the temperature equalizing plate includes a shell and a lower capillary layer 400; the shell includes an upper cover 100 and a lower cover 500, and the upper cover 100 includes a plurality of support columns 101 integrally stamped; the inner cavity of the shell is a vacuum chamber, and the vacuum chamber is filled with a heat transfer medium; the lower capillary layer 400 is laid on the inner surface of the lower cover 500, and the lower end of the support column 101 abuts against the lower capillary layer 400.

[0046] In this embodiment, combined with Figure 2 and Figure 3 By providing a support column 101 that is stamped integrally with the upper cover 100, there is no need to add additional materials to make and assemble the support column 101. The temperature vapor chamber effectively reduces its overall weight while utilizing the supporting function of the support column 101 to ensure its own strength, so that the temperature vapor chamber obtains excellent lightweight performance.

[0047] At the same time, the lower end of the support column 101 directly contacts the lower capillary layer 400, and the lower capillary layer 400 does not need to be punched to avoid the support column 101, so that the lower capillary layer 400 has a larger capillary effective area, thereby improving the performance of the temperature distribution board.

[0048] Specifically, during the use of the temperature equalizer, the temperature equalizer is installed on the device body of the electronic device, and the lower cover 500 is in contact with the heating device of the device body. The heat of the heating device enters the vacuum chamber of the shell through the lower cover 500 and heats the bottom of the vacuum chamber. After the liquid heat transfer medium in the capillary layer absorbs the heat, a phase change occurs, and it is converted from liquid to gas. Evaporation causes the local vapor pressure to increase, which drives the vapor to diffuse from the high-temperature area to the low-temperature area. After the vapor reaches the low-temperature area of ​​the shell, it releases heat and re-condenses into liquid. The condensation process releases heat equal to the latent heat absorbed during evaporation, completing the heat transfer. The liquid after the heat transfer medium condenses returns to the contact area with the heating device under the capillary action of the capillary layer, forming a closed-loop circulation. Through the evaporation and condensation cycle of the internal heat transfer medium and the autonomous liquid circulation ability of the capillary layer, the rapid diffusion and uniform distribution of heat are achieved, and the heat is continuously transferred.

[0049] Specifically, the support columns 101 physically support the housing to prevent the housing's interior from collapsing and deforming in a vacuum environment, thereby ensuring the housing's structural strength and guaranteeing the reliability of the vapor chamber. The support columns 101 are arranged in an array or grid pattern to provide uniform support throughout the housing.

[0050] Specifically, the inner cavity of the shell is configured as a vacuum chamber. The working principle of the heat spreader mainly relies on the phase change (evaporation and condensation) of the heat transfer medium to achieve heat transfer. In a vacuum state, the boiling point of the heat transfer medium will decrease. This means that under the same temperature conditions, the heat transfer medium is more likely to undergo an evaporation phase change and absorb more heat; at the same time, it is also easier to release heat and complete the phase change back to a liquid state. This optimized phase change process enables the heat spreader to operate efficiently over a wider temperature range and respond to heat changes more quickly, further improving heat dissipation performance.

[0051] In addition, the inner cavity of the shell is configured as a vacuum chamber. From the perspective of heat conduction, in a vacuum environment, the number of gas molecules is extremely small, which can effectively reduce the impact of gas convection heat transfer. Because gas convection is one of the common ways of heat transfer, reducing the number of gas molecules significantly reduces the heat transfer caused by gas molecular movement and collisions, making heat transfer mainly rely on more efficient phase change heat transfer (the heat transfer medium transfers heat during evaporation and condensation), thereby significantly improving heat conduction efficiency and allowing heat to be distributed more quickly and evenly within the vapor chamber. Taking electronic equipment heat dissipation as an example, a vapor chamber with a vacuum chamber can more quickly conduct heat generated by the chip, reducing the chip temperature and avoiding performance degradation or even damage due to overheating.

[0052] At the same time, the vacuum environment can also prevent unnecessary chemical reactions between the heat transfer fluid and the gas, thus avoiding the heat transfer fluid from deteriorating or being lost due to the reaction, extending the service life of the temperature spreader, and ensuring that it can perform its efficient heat dissipation function in a long-term and stable manner.

[0053] Specifically, the lower cover 500 is made of copper. Copper has ultra-high thermal conductivity and low thermal resistance, which can quickly transfer heat from the heating device to the vacuum chamber and reduce energy loss when heat is transferred through the lower cover 500, ensuring efficient heat transfer.

[0054] Specifically, the upper cover 100 is made of a copper-steel composite material, a copper-aluminum composite material, or a copper-titanium composite material. The composite metal material is not only lightweight, but also has high strength and good tensile properties. The high strength improves the strength of the upper cover 100, while the good tensile properties ensure the formation of the support column 101.

[0055] See Figure 2 Optionally, the support column 101 is conical.

[0056] Among them, since metal will break if it exceeds a certain limit during stamping and stretching, in order to ensure that the support column 101 of the upper cover 100 can be formed in one piece and the support column 101 can have sufficient support height, the support column 101 is designed to be conical to ensure its stamping quality.

[0057] Optionally, the capillary layer is one or more of metal powder sintered capillaries, multi-layer metal mesh capillaries, and foam metal capillaries.

[0058] The capillary layer not only uses capillary force to guide the condensed liquid of the heat transfer medium back from the condensation zone to the evaporation zone, but also serves as a supporting framework, cooperating with support pillars 101 to maintain the structural stability of the vacuum chamber. Therefore, it is necessary to ensure that the capillary layer has a certain structural strength. Therefore, the structure of the capillary layer is one or more of metal powder sintered capillaries, multi-layer metal mesh capillaries, and foam metal capillaries, ensuring that the capillary layer has both capillary force and structural strength.

[0059] Specifically, the metal powder sintered capillary wick is a porous material made by forming and high-temperature firing of metal powder. It has the advantages of porous concave structure, large specific surface area, light weight, strong capillary force, and good anti-gravity performance. There are various material options, such as nickel, copper, etc. By adjusting the sintering process parameters, its pore structure can be controlled to adapt to different application requirements.

[0060] The multi-layer metal mesh capillary core is made of multiple layers of metal woven wire mesh through a special lamination pressing and vacuum sintering process. It has high mechanical strength and overall rigid structure. The mesh holes of each layer of wire mesh are staggered to form a uniform filtration structure. It can reasonably match and design the pore size, permeability and strength characteristics, and has excellent filtration performance and mechanical properties.

[0061] The foam metal capillary wick is based on a special metal material containing foam pores. It has extremely high porosity, large pore specific surface area, high air permeability and almost interconnected pores. Its thermal conductivity and mechanical properties are affected by the porosity and structure. For example, foam nickel has high air permeability, high specific surface area and strong capillary force due to its high porosity and interconnected pore structure.

[0062] Among them, the composite use of metal powder sintered capillaries, multi-layer metal mesh capillaries, and foam metal capillaries can give full play to their respective advantages and achieve complementary advantages. The metal powder sintered capillary core has a strong capillary force and good anti-gravity performance, which can effectively enhance the driving force of liquid reflux; the multi-layer metal mesh capillary core has high mechanical strength and stable structure, which can provide good support for the overall structure and enhance its compression and deformation resistance; the foam metal capillary core has a high porosity, large specific surface area, and good air permeability, which is conducive to the rapid passage of fluids and heat exchange. The use of multiple capillary layer composite applications can combine the advantages of different structures, thereby significantly improving the heat dissipation efficiency, filtration effect and other comprehensive performance of related equipment, and broadening its application scenarios.

[0063] Optionally, the heat transfer medium is deionized water, pure water, ethanol or fluorocarbon.

[0064] Specifically, deionized water is pure water from which ionic impurities have been removed. As a heat transfer medium, it has the advantages of high thermal conductivity, low price, environmental protection, pollution-free, and good compatibility with metals such as copper. Pure water is similar in nature to deionized water and is also low-cost and environmentally friendly. Ethanol has good wetting properties on the wick of the heat spreader, but its latent heat of vaporization and specific heat capacity are small, and its ability to carry heat at the same volume is weaker than that of deionized water. Fluorocarbons are insulating, inert, non-flammable, and highly safe. They can directly contact heat dissipation components and are suitable for scenarios with high safety requirements such as data centers, but they are relatively expensive and costly.

[0065] See Figure 1 and Figure 4 In some embodiments, a plurality of local capillary layers 300 are disposed on the upper surface of the lower capillary layer 400 ; wherein the specifications of the local capillary layers 300 and the lower capillary layer 400 are different.

[0066] Among them, by arranging multiple local capillary layers 300 on the lower capillary layer 400, the local capillary layers 300 with different specifications from the lower capillary layer 400 are used to change the capillary force and permeability of the local area, thereby improving the performance of the vapor chamber itself.

[0067] Specifically, the specifications of the capillary layer include porosity, permeability, and capillary force. Porosity refers to the ratio of the pore volume in the capillary layer to the total volume, permeability indicates the ease with which liquid flows in the capillary layer, and capillary force refers to the ability of the capillary layer to draw the condensed liquid of the heat transfer medium from the condensation end to the evaporation end.

[0068] See Figure 1 Optionally, the local capillary layer 300 has a gradient structure in which the cross-sectional area gradually decreases from bottom to top.

[0069] The local capillary layer 300 with a gradient structure can balance the capillary force and permeability, ensuring that the liquid after the heat transfer medium is condensed can efficiently reflux while reducing the flow resistance, thereby improving the performance of the temperature distribution plate.

[0070] In some embodiments, an upper capillary layer is provided on the inner surface of the upper cover 100 , and the upper capillary layer is provided with through holes for the support pillars 101 to pass through.

[0071] By laying a capillary layer on the inner surface of the upper cover 100, capillary layers are provided on both the upper cover 100 and the lower cover 500, creating a bidirectional capillary force. This allows the condensed liquid of the heat transfer medium to flow back to the evaporation zone more quickly and evenly. Compared to providing a capillary layer only on the lower cover 500, the double-sided capillary layer significantly shortens the return path, reduces liquid accumulation in the condensation zone, and avoids localized overheating. The double-sided capillary layer design more effectively guides liquid flow, reduces the flow resistance of the liquid in the capillary layer, and thus improves overall heat transfer efficiency.

[0072] See Figure 1 Optionally, a plurality of conductive capillaries 200 are provided in the vacuum chamber, wherein the lower ends of the conductive capillaries 200 are connected to the lower capillary layer 400 , and the upper ends of the conductive capillaries 200 are connected to the upper capillary layer.

[0073] The conductive capillary 200 can be used to connect the lower capillary layer 400 and the upper capillary layer, thereby preventing the problem of dry burning caused by the discontinuity between the lower capillary layer 400 and the upper capillary layer.

[0074] Optionally, the conductive capillary 200 is sleeved on the supporting column 101 .

[0075] The conductive capillary 200 can be sleeved on the support column 101 by relying on the support column 101, so that the conductive capillary 200 can be positioned and installed by using the support column 101. Compared with setting the conductive capillary 200 separately, the stability of the setting of the conductive capillary 200 can be improved.

[0076] Optionally, the conductive capillary 200 is a braided copper wire capillary or a sintered powder strip capillary.

[0077] Among them, the braided copper wire capillary or sintered powder strip capillary has a simple manufacturing process, light weight, and low manufacturing cost. The use of braided copper wire capillary or sintered powder strip capillary to connect the upper and lower covers of 500 capillary layers increases the steam space and effective evaporation area in the vacuum chamber of the temperature equalizing plate, thereby improving the performance of the temperature equalizing plate.

[0078] Specifically, the braided copper wire capillary is a capillary layer braided with copper wires.

[0079] Specifically, the sintered powder strip capillary is a strip-shaped capillary layer formed by sintering metal powder.

[0080] Figure 5 A schematic diagram of a method for manufacturing a lightweight temperature equalizing plate according to an embodiment of the present application is provided. Figure 5 In some embodiments, the manufacturing method of the lightweight vapor chamber includes the following steps:

[0081] S501 , stamping and manufacturing the upper cover 100 and the lower cover 500 ; wherein the upper cover 100 includes a plurality of support columns 101 that are integrally stamped and formed.

[0082] Among them, the upper cover 100 and the lower cover 500 are manufactured by a stamping process. While the upper cover 100 is being stamped, the support column 101 is integrally stamped on the upper cover 100, so that the support column 101 does not need to be manufactured separately, which simplifies the manufacturing process of the temperature equalizing plate, improves the manufacturing efficiency of the temperature equalizing plate, and reduces the manufacturing cost of the temperature equalizing plate.

[0083] In terms of production efficiency, the stamping process is fast and can be carried out continuously, and can produce a large number of upper covers 100 and lower covers 500 in a short period of time, meeting the needs of large-scale production and greatly shortening the production cycle; in terms of cost, the stamping mold can be used for a long time, and the cost allocated to a single upper cover 100 or lower cover 500 is low, and the material utilization rate is high, which can reduce the waste of scraps and effectively reduce production costs; in terms of precision and consistency, the stamping process can accurately control the size and shape of the upper cover 100 and the lower cover 500, ensuring that each shell is highly consistent, providing a guarantee for subsequent assembly and stable performance.

[0084] In addition, the stamping process can produce upper covers 100 and lower covers 500 with complex shapes to meet different design requirements, and can also enhance the structural strength of the upper cover 100 and lower cover 500, thereby improving the overall performance and reliability of the temperature distribution board.

[0085] S502 , laying a lower capillary layer 400 on the inner surface of the lower cover 500 .

[0086] The lower capillary layer 400 is laid on the inner surface of the lower cover 500 to promote the reflux of the heat transfer medium through the capillary layer of the lower capillary layer 400 .

[0087] Specifically, the lower capillary layer 400 is sintered and connected to the inner surface of the lower cover 500. The sintering connection utilizes the property of metal powder particles to form a metallurgical bond at high temperature to connect the lower capillary layer 400 to the inner surface of the lower cover 500, and makes the connection between the two have higher mechanical strength, thereby improving the reliability of the connection between the lower capillary layer 400 and the inner surface of the lower cover 500.

[0088] S503 , welding the joints of the upper cover 100 and the lower cover 500 to form a shell.

[0089] The upper cover 100 and the lower cover 500 are welded by any welding method such as diffusion welding, laser welding or solder brazing to form a shell.

[0090] S504: Inject heat transfer medium into the inner cavity of the shell through the injection port reserved on the shell.

[0091] S505 , after the inner cavity of the shell is vacuumed through the injection port, the injection port is sealed to obtain a formed temperature uniform plate.

[0092] The inner cavity of the shell is evacuated, and finally the injection port is sealed to form a shell with a vacuum chamber.

[0093] In this embodiment, multiple support columns 101 are integrally stamped and formed on the upper cover 100 during the stamping process, thereby producing an upper cover 100 having support columns 101. Since no additional materials are required to manufacture and assemble the support columns 101, the manufacturing process of the vapor chamber is simplified, the efficiency of the vapor chamber is improved, the manufacturing cost of the vapor chamber is reduced, and the overall weight of the vapor chamber is effectively reduced, resulting in an excellent lightweight performance.

[0094] In some embodiments, the present application also provides an electronic device, which includes a device body and the above-mentioned temperature vapor chamber.

[0095] In this embodiment, the temperature evaporating plate is installed on the device body, and the lower cover 500 of the temperature evaporating plate is in contact with the heating device of the device body, so that the temperature evaporating plate is used to quickly dissipate heat from the heating device.

[0096] Specifically, the heat generating device is generally a heat generating chip in the device body, such as a CPU, GPU, etc.

[0097] Optionally, a thermal interface material, such as silicone grease or liquid metal, may be applied to the contact surface between the chip or other heat-generating device and the lower cover 500. The thermal interface material, with its high thermal conductivity and good fluidity, can fully wet the contact surface and form a continuous heat conduction path. The thermal interface material can then fill the tiny gaps between the contact surfaces caused by microscopic unevenness (these gaps form an air insulation layer at the microscopic scale, hindering heat transfer), effectively reducing the interfacial thermal resistance and ensuring that the heat generated by the heat-generating device can be more efficiently transferred to the vapor chamber, avoiding local overheating caused by interfacial thermal resistance. This ensures that the heat-generating device operates stably within a safe temperature range and extends its service life.

[0098] Specifically, the electronic device is a laptop computer, a tablet computer, a mobile phone, etc.

[0099] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0100] It should be noted that the terms "center", "longitudinal", "lateral", "length", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0101] The terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication of two components.

[0102] The terms "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person skilled in the art taking into account the measurement in question and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one. For a person skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0103] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some or all of the technical features therein, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A lightweight temperature equalizing plate, characterized in that: including a shell and a lower capillary layer; The housing comprises an upper cover and a lower cover, wherein the upper cover comprises a plurality of support columns formed by integral stamping; the inner cavity of the housing is a vacuum chamber, and the vacuum chamber is filled with a heat transfer medium; The lower capillary layer is laid on the inner surface of the lower cover, and the lower end of the support column abuts against the lower capillary layer.

2. The lightweight temperature evaporating plate according to claim 1, characterized in that: A plurality of local capillary layers are provided on the upper surface of the lower capillary layer; wherein the specifications of the local capillary layers are different from those of the lower capillary layer.

3. The lightweight temperature evaporating plate according to claim 2, characterized in that: The local capillary layer has a gradient structure in which the cross-sectional area gradually decreases from bottom to top.

4. The lightweight temperature vapor chamber according to any one of claims 1 to 3, characterized in that: An upper capillary layer is laid on the inner surface of the upper cover, and the upper capillary layer is provided with through holes for the support columns to pass through.

5. The lightweight temperature evaporating plate according to claim 4, characterized in that: A plurality of conductive capillaries are provided in the vacuum chamber, wherein the lower ends of the conductive capillaries are communicated with the lower capillary layer, and the upper ends of the conductive capillaries are communicated with the upper capillary layer.

6. The lightweight temperature equalizing plate according to claim 5, characterized in that: The conductive capillary is sleeved on the supporting column.

7. The lightweight temperature equalizing plate according to claim 5, characterized in that: The conductive capillary is a braided copper wire capillary or a sintered powder strip capillary.

8. The lightweight temperature vapor chamber according to any one of claims 1 to 3, characterized in that: The supporting column is conical.

9. A method for manufacturing a lightweight temperature equalizing plate, characterized in that: include: The upper cover and the lower cover are produced by stamping; wherein the upper cover includes a plurality of support columns formed by integral stamping; Laying a lower capillary layer on the inner surface of the lower cover; Welding the joint between the upper cover and the lower cover to form a shell; injecting a heat transfer medium into the inner cavity of the shell through an injection port reserved on the shell; After the inner cavity of the shell is vacuumed through the injection port, the injection port is sealed to obtain a formed temperature equalizing plate.

10. An electronic device, characterized in that: The electronic device includes a device body and a lightweight temperature vapor chamber according to any one of claims 1 to 8.

Images