Additive manufacturing of manganese copper alloys and methods of making and using the same

Abstract

The application discloses additive manufacturing of a manganese-copper alloy and a preparation method and application thereof, and mainly utilizes a laser selective melting technology to prepare the manganese-copper alloy, optimizes the composition of the manganese-copper alloy by adding a nickel element, and combines with optimized printing process parameters, control of a substrate preheating temperature and a scanning interval time and a scanning strategy, so that the microstructure of the manganese-copper alloy can be effectively controlled, the residual thermal stress generated in the rapid melting and cooling forming process of the manganese-copper alloy powder is reduced, the solidification cracks generated in the printing forming process are effectively eliminated, the alloy has good forming quality and high density, and has the combination of good damping performance and mechanical properties. The method realizes one-step preparation of the high-performance manganese-copper damping alloy without post-heat treatment, and effectively reduces the production cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of additive manufacturing, in particular to a manganese-copper alloy prepared by additive manufacturing, a preparation method and application thereof. BACKGROUND

[0002] With the continuous progress of industrial technology, various types of mechanical equipment are developing towards high speed, high efficiency and automation, but the problems of vibration and noise caused by this are becoming increasingly prominent. Mechanical vibration not only causes the acceleration of equipment fatigue damage, shortens the service life, but also affects the machining precision of parts, and in severe cases may even cause catastrophic accidents. Traditional vibration reduction methods mainly adopt two ways of system damping and structure damping, but these methods often lead to an increase in equipment size, weight and cost. In contrast, damping alloy materials convert vibration energy into heat energy dissipation through their own microstructure, have the unique advantage of reducing vibration and noise from the source, and have excellent processing performance, wide temperature range, good frequency adaptability and other characteristics.

[0003] Manganese-copper alloy, as a kind of functional material with excellent damping performance and mechanical properties, has been successfully applied in many vibration and noise reduction fields such as automobile manufacturing, ship propeller, precision instruments, etc. Its damping performance mainly comes from the movement of twin boundary interfaces and the movement of martensite twin and parent phase interfaces in the material. These interface movements convert mechanical vibration energy into heat energy to achieve energy dissipation. This twin structure is formed in the non-diffusion type phase transition process from FCC austenite to FCT martensite, and the martensite phase transition temperature has a high dependence on the content of manganese. When the manganese content is less than 82 at.%, the martensite phase transition temperature will be lower than room temperature, resulting in a lack of twin martensite as a damping source in the material at room temperature, thereby reducing its damping performance. To improve this situation, a solid solution treatment at 750-950°C is usually performed first, followed by water quenching to room temperature to obtain a supersaturated FCC solid solution, and then aging heat treatment at 350-500°C. The amplitude modulation decomposition occurring during the aging process will form a manganese-rich matrix and copper-rich nanoparticles, thereby promoting the occurrence of martensite phase transition.

[0004] In recent years, selective laser melting (SLM) technology has been widely used in industrial manufacturing due to its unique advantages. This technology melts metal powder layer by layer using a high-energy laser beam to directly form complex structural parts, offering advantages such as high design freedom, high material utilization, and short product development cycles. Compared with traditional manufacturing methods, laser additive manufacturing can achieve dimensional accuracy down to 0.1mm and surface quality Ra 30-50µm, making it particularly suitable for complex structural parts that are difficult to process using traditional methods. However, in the laser additive manufacturing of manganese-copper alloys, the powder undergoes a rapid melting and solidification non-equilibrium thermal cycle, which easily leads to defects such as incomplete fusion, porosity, and solidification cracks. Manganese-copper alloys with high manganese content, which have wide-temperature-range vibration damping and noise reduction properties, exhibit higher crack sensitivity. This not only severely affects the material's mechanical properties but also significantly reduces its damping performance, greatly limiting its practical application in engineering vibration reduction. Although optimizing printing process parameters such as laser power and scanning speed can alleviate residual stress and cracking problems to some extent, it is difficult to completely eliminate solidification cracks. Therefore, how to reduce the solidification crack sensitivity of laser additive manufacturing manganese-copper alloys and prepare high-performance additive manufacturing manganese-copper alloys is an urgent technical problem to be solved.

[0005] In view of this, the present invention is proposed. Summary of the Invention

[0006] The purpose of this invention is to provide an additive manufacturing method for manganese-copper alloys and their application, so as to improve the above-mentioned technical problems.

[0007] This invention is implemented as follows:

[0008] In a first aspect, the present invention provides a method for preparing an additively manufactured manganese-copper alloy, comprising:

[0009] After the manganese copper-nickel alloy powder is placed on the substrate, the substrate is preheated, and the manganese copper-nickel alloy powder is laser selective melting in the forming chamber to obtain a manganese copper alloy sample.

[0010] The chemical composition of the manganese-copper-nickel alloy powder, by mass percentage, is: Cu 10%~25%, Ni 3%~10%, C≤0.03%, Si≤0.02%, S≤0.02%, P≤0.005%, with the balance being Mn and other unavoidable impurities. The parameters of the laser selective melting are: laser power of 80W-300W, scanning speed of 300mm / s~1200mm / s, scanning spacing of 0.06mm~0.16mm, powder thickness of 0.04mm~0.10mm, scanning interval of 30s~120s, and the laser scanning strategy is either strip 67° or checkerboard 67°.

[0011] In an optional embodiment, the laser power is 120W-150W, the scanning speed is 700mm / s-900mm / s, the scanning spacing is 0.13mm-0.15mm, the powder thickness is 0.07mm-0.09mm, and the scanning interval is 60s-110s.

[0012] In an optional embodiment, the laser power is 130W-150W, the scanning speed is 800mm / s-900mm / s, the scanning spacing is 0.13mm-0.15mm, the powder thickness is 0.07mm-0.09mm, and the scanning interval is 70s-100s.

[0013] In an optional implementation, the laser scanning strategy uses a checkerboard pattern of 67°.

[0014] In an optional embodiment, the chemical composition of the manganese-copper-nickel alloy powder is: Cu 13%~18%, Ni 6%~10%, C≤0.03%, Si≤0.02%, S≤0.02%, P≤0.005%, with the balance being Mn and other unavoidable impurities.

[0015] In an optional embodiment, the substrate is preheated to a temperature of 100°C to 300°C, preferably 150°C to 200°C.

[0016] In an optional embodiment, the manganese-copper-nickel alloy powder is obtained by mechanically mixing manganese-copper alloy powder and nickel powder. Preferably, the manganese-copper alloy powder and the nickel powder are prepared by vacuum atomization.

[0017] In an optional embodiment, the composition of the substrate is the same as that of the manganese-copper-nickel alloy powder.

[0018] Secondly, the present invention also provides an additive manufacturing manganese-copper alloy, which is prepared by the preparation method described in any of the foregoing embodiments.

[0019] Thirdly, the present invention also provides the application of additively manufactured manganese-copper alloys as described in the foregoing embodiments in automobiles, ships, weapons and equipment or aerospace.

[0020] This invention offers the following advantages: It utilizes laser selective melting technology to prepare manganese-copper alloys. By optimizing the composition of the manganese-copper alloy through the addition of nickel, and combining this with optimized printing process parameters, control of substrate preheating temperature and scanning interval, and scanning strategy, the microstructure of the alloy can be effectively controlled. This helps reduce residual stress generated during rapid laser processing and cooling, effectively eliminating solidification cracks during the printing process. The resulting alloy exhibits excellent forming quality and density, along with a combination of good damping and mechanical properties. This method achieves one-step preparation of high-performance manganese-copper damping alloys without post-heat treatment, effectively reducing production costs. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the selected laser scanning strategy;

[0023] Figure 2 Metallographic photographs of the manganese-copper alloy samples prepared in Examples 1-6 and Comparative Examples 1-6. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased commercially.

[0025] The present invention provides a detailed description of an additive manufacturing manganese-copper alloy, its preparation method, and its application.

[0026] Some embodiments of the present invention provide a method for preparing an additively manufactured manganese-copper alloy, comprising:

[0027] After the manganese copper-nickel alloy powder is placed on the substrate, the substrate is preheated, and the manganese copper-nickel alloy powder is laser selective melting in the forming chamber to obtain a manganese copper alloy sample.

[0028] The chemical composition of the manganese-copper-nickel alloy powder, by mass percentage, is: Cu 10%~25%, Ni 3%~10%, C≤0.03%, Si≤0.02%, S≤0.02%, P≤0.005%, with the balance being Mn and other unavoidable impurities. The parameters for laser selective melting are: laser power 80W-300W, scanning speed 300mm / s~1200mm / s, scanning spacing 0.06mm~0.16mm, powder thickness 0.04mm~0.10mm, scanning interval 30s~120s, and the laser scanning strategy is either strip 67° or checkerboard 67°.

[0029] By optimizing the chemical composition of manganese-copper alloys and adjusting the parameters of selective laser melting (SLM), the microstructure of the alloys can be controlled. In particular, by adjusting the scanning interval and scanning strategy, residual stress formed in the manganese-copper alloy powder during rapid melting and solidification is reduced, eliminating solidification cracks and resulting in manganese-copper alloys with excellent forming quality, damping, and mechanical properties. Furthermore, this method allows for the one-step preparation of high-performance manganese-copper damping alloys without the need for post-heat treatment steps such as aging, effectively reducing costs.

[0030] In some embodiments, the preparation method of additive manufacturing manganese-copper alloy specifically includes the following steps:

[0031] S1. Prepare manganese-copper-nickel alloy powder.

[0032] Manganese-copper-nickel alloy powder can be obtained by mechanically mixing manganese-copper alloy powder and nickel powder. The manganese-copper alloy powder and nickel powder are self-prepared materials, and vacuum atomization is preferred for obtaining them. This method produces manganese-copper alloy powder and nickel powder with good sphericity, resulting in better uniformity of the prepared alloy products.

[0033] It should be noted that vacuum atomization powder preparation is an existing process for preparing alloy powders.

[0034] In some embodiments, the manganese-copper alloy powder comprises, by mass percentage: Cu 13%-15%, C≤0.03%, Si≤0.02%, S≤0.02%, P≤0.005%, with the balance being Mn and other unavoidable impurities; the nickel powder has a purity greater than 99.9%; by optimizing the composition of the manganese-copper alloy powder, the forming quality of the manganese-copper alloy product can be further improved.

[0035] Specifically, the copper content can be 13%, 14%, 15%, etc., and the Ni content can be 1%, 3%, 5%, 7%, 10%, etc.

[0036] In some implementations, manganese-copper alloy powder and nickel powder are mechanically mixed using a V-type powder mixer to ensure a more uniform distribution of the components, which is beneficial for improving subsequent printing results.

[0037] In some embodiments, the particle size range of both the manganese-copper alloy powder and the nickel powder is 15μm-53μm, which allows the particle size of the manganese-copper-nickel alloy powder to be controlled within the aforementioned range, resulting in low oxygen content and good sphericity. The manganese-copper-nickel alloy powder has a flowability of 22s / 50g-35s / 50g and a loose packing density of 3.3g / cm³. 3 -4.2g / cm 3 By controlling the powder's flowability and loose density, the powder can be easily melted to meet experimental requirements. Manganese-copper alloy powder and nickel powder have good flowability, sphericity, and loose density. Laser selective melting has a short forming cycle and can be directly formed. The density of the printed manganese-copper alloy can reach up to 99.8%.

[0038] For example, the particle size range of the manganese-copper-nickel alloy powder can be any two values ​​between 15μm, 25μm, 35μm, 45μm, and 53μm; the flowability of the manganese-copper alloy powder can be 22s / 50g, 24s / 50g, 26s / 50g, 28s / 50g, 30s / 50g, and 33s / 50g; and the loose packing density of the manganese-copper alloy powder can be 3.3g / cm³. 3 3.5g / cm 3 3.7g / cm 3 3.9g / cm 3 4.2g / cm 3 wait.

[0039] It should be noted that the flowability of metal powder refers to the time required for a certain amount of powder to flow through a standard funnel with a specified aperture. This is the flow time of 50g of standard substance through a new funnel. For details, please refer to GB / T 1482-2022 Standard Funnel Method for Determination of Flowability of Metal Powder (Hall Flowmeter).

[0040] Furthermore, in order to achieve better forming quality and damping and mechanical properties, the chemical composition of the manganese-copper-nickel alloy powder can be optimized as follows: Cu 13%~18%, Ni 6%~10%, C≤0.03%, Si≤0.02%, S≤0.02%, P≤0.005%, with the balance being Mn and other unavoidable impurities.

[0041] S2. Preparation of manganese-copper alloy samples by laser selective melting process.

[0042] Specifically, manganese-copper alloy powder is laid on a homogeneous printing substrate in the forming chamber, and the substrate is preheated. A laser is applied as a heat source to perform selective laser melting on the printing substrate to obtain a manganese-copper alloy sample. After printing, the manganese-copper alloy can be cut from the substrate using an electrical discharge wire cutting device, and cut into the required metallographic sample size of 10mm×10mm×10mm according to the size requirements. The above dimensions are in length, width, and height, but are not limited to the above dimensions.

[0043] In some implementations, the printing substrate is preheated before printing begins to reduce thermal stress and defects during the printing process. The preheated substrate surface temperature is higher, and when the first layer of powder is melted by the laser, the molten metal can better wet the substrate surface, reducing "incomplete fusion" defects, ensuring the connection strength between the bottom of the part and the substrate, and improving the part forming quality and stability.

[0044] Specifically, the temperature of the preheated substrate is set to 100°C to 300°C, preferably 150°C to 200°C. For example, the preheating temperature can be 150°C, 175°C, 200°C, etc.

[0045] In some embodiments, the composition of the substrate is the same as that of the manganese-copper-nickel alloy powder to ensure wettability between the raw material powder and the substrate.

[0046] In some implementations, the laser selective melting printing equipment used may be the EOS M290 printer manufactured in Germany. This equipment consists of a powder spreading system, a scanning system, a laser, a gas protection system, and an optical path system. The EOS M290 system is equipped with a 400W fiber laser, providing a high-performance, high-stability, and high-quality laser source. This equipment is compatible with both nitrogen and argon protective gases, making the M 290 system compatible with various metal materials such as stainless steel, high-temperature alloys, and tool steel.

[0047] In some implementations, the forming process parameters are optimized as follows: laser power is 120W-150W, scanning speed is 700mm / s-900mm / s, scanning spacing is 0.13mm-0.15mm, powder thickness is 0.07mm-0.09mm, and scanning interval is 60s-110s.

[0048] In some implementations, the laser power is further optimized to be 130W-150W, the scanning speed is 800mm / s-900mm / s, the scanning spacing is 0.13mm-0.15mm, the powder thickness is 0.07mm-0.09mm, and the scanning interval is 70s-100s.

[0049] By controlling the above forming parameters, the microstructure of manganese-copper alloy can be regulated, the residual stress of the alloy can be reduced, thereby improving the forming quality and density of manganese-copper alloy and eliminating solidification cracks generated during the preparation process.

[0050] In some implementations, a checkerboard 67° laser scanning strategy is used. By selecting a specific scanning method, interlaminar stress can be significantly reduced through thermal isolation effects, and a specific scanning angle can suppress the accumulation of thermal stress, thereby reducing solidification cracks during the preparation process and improving the mechanical and damping properties of the material.

[0051] In some embodiments, the obtained block-shaped printed manganese-copper alloy sample can be surface-treated and then its microstructure observed. The surface treatment can be performed as follows: the surface of the block-shaped printed manganese-copper alloy sample is polished with 400#, 600#, 800#, 1000#, or 1500# silicon carbide sandpaper, then mechanically polished with a woolen polishing cloth, the surface is cleaned with anhydrous ethanol, and finally the surface is dried with a hair dryer.

[0052] Some embodiments of the present invention also provide an additively manufactured manganese-copper alloy, which is prepared by the preparation method described in any of the foregoing embodiments. This manganese-copper alloy possesses good formability and density.

[0053] Some embodiments of the present invention also provide applications of additively manufactured manganese-copper alloys as described in the foregoing embodiments in automobiles, ships, weapons, or aerospace.

[0054] The features and performance of the present invention will be further described in detail below with reference to embodiments.

[0055] Example 1

[0056] This embodiment provides a method for preparing additively manufactured manganese-copper alloys, including the following steps:

[0057] (1) Powder preparation

[0058] Manganese-copper alloy powder and nickel powder were prepared by gas atomization, and the alloy powder was sieved to select powder with a particle size range of 15μm~53μm.

[0059] By mass percentage, the manganese-copper alloy powder comprises: Cu 15%, C 0.02%, Si 0.015%, S 0.015%, P 0.003%, with the balance being Mn and other unavoidable impurities.

[0060] Manganese-copper alloy powder and 3 wt% nickel powder were mechanically mixed for 12 hours using a V-type powder mixer to obtain manganese-copper-nickel powder.

[0061] (2) Preparation of manganese-copper alloy samples by laser selective melting process

[0062] The laser selective melting forming process parameters are set as follows: laser power 100 W, scanning speed 500 mm / s, scanning spacing 0.1 mm, powder thickness 0.05 mm, printing strategy set to strip 67°, and laser scanning interval set to 50 s. Powder is placed into the powder feeding cylinder of the printing equipment, the substrate is heated to 150°C, and then the forming of the manganese-copper alloy begins.

[0063] Example 2

[0064] This embodiment provides a method for preparing additively manufactured manganese-copper alloys, including the following steps:

[0065] (1) Powder preparation

[0066] Manganese-copper alloy and nickel powder were prepared by gas atomization, and the alloy powder was sieved to select a particle size range of 15μm~53μm.

[0067] By mass percentage, the manganese-copper alloy powder comprises: Cu 15%, C 0.02%, Si 0.015%, S 0.015%, P 0.003%, with the balance being Mn and other unavoidable impurities.

[0068] Manganese-copper alloy powder and 5 wt% nickel powder were mechanically mixed for 12 hours using a V-type powder mixer to obtain manganese-copper-nickel powder.

[0069] (2) Preparation of manganese-copper alloy samples by laser selective melting process

[0070] The laser selective melting forming process parameters are set as follows: laser power 100 W, scanning speed 600 mm / s, scanning spacing 0.12 mm, powder thickness 0.06 mm, scanning strategy set to strip 67°, and laser scanning interval set to 60 s. Powder is placed into the powder feeding cylinder of the printing equipment, the substrate is heated to 175°C, and then the forming of the manganese-copper alloy begins.

[0071] Example 3

[0072] This embodiment provides a method for preparing additively manufactured manganese-copper alloys, including the following steps:

[0073] (1) Powder preparation

[0074] Manganese-copper alloy and nickel powder were prepared by gas atomization, and the alloy powder was sieved to select a particle size range of 15μm~53μm.

[0075] By mass percentage, the manganese-copper alloy powder comprises: Cu 15%, C 0.02%, Si 0.015%, S 0.015%, P 0.003%, with the balance being Mn and other unavoidable impurities.

[0076] Manganese-copper alloy powder and 7 wt% nickel powder were mechanically mixed for 12 hours using a V-type powder mixer to obtain manganese-copper-nickel powder.

[0077] (2) Preparation of manganese-copper alloy samples by laser selective melting process

[0078] The laser selective melting forming process parameters were set as follows: laser power 120 W, scanning speed 700 mm / s, scanning spacing 0.14 mm, powder thickness 0.07 μm, scanning strategy set to strip 67°, and laser scanning interval set to 70 s. Powder was placed into the powder feeding cylinder of the printing equipment, the substrate was heated to 175°C, and then the forming of the manganese-copper alloy began.

[0079] Example 4

[0080] This embodiment provides a method for preparing additively manufactured manganese-copper alloys, including the following steps:

[0081] (1) Powder preparation

[0082] Manganese-copper alloy and nickel powder were prepared by gas atomization, and the alloy powder was sieved to select a particle size range of 15μm~53μm.

[0083] By mass percentage, the manganese-copper alloy powder comprises: Cu 15%, C 0.02%, Si 0.015%, S 0.015%, P 0.003%, with the balance being Mn and other unavoidable impurities.

[0084] Manganese-copper alloy powder and 10 wt% nickel powder were mechanically mixed for 12 hours using a V-type powder mixer to obtain manganese-copper-nickel powder.

[0085] (2) Preparation of manganese-copper alloy samples by laser selective melting process

[0086] The laser selective melting forming process parameters were set as follows: laser power 140 W, scanning speed 800 mm / s, scanning spacing 0.14 mm, powder thickness 0.08 mm, scanning strategy set to checkerboard 67°, and laser scanning interval set to 70 s. Powder was placed into the powder feeding cylinder of the printing equipment, the substrate was heated to 200°C, and then the forming of the manganese-copper alloy began.

[0087] Example 5

[0088] This embodiment provides a method for preparing additively manufactured manganese-copper alloys, including the following steps:

[0089] (1) Powder preparation

[0090] Manganese-copper alloy and nickel powder were prepared by gas atomization, and the alloy powder was sieved to select a particle size range of 15μm~53μm.

[0091] By mass percentage, the manganese-copper alloy powder comprises: Cu 15%, C 0.02%, Si 0.015%, S 0.015%, P 0.003%, with the balance being Mn and other unavoidable impurities.

[0092] Manganese-copper alloy powder and 10 wt% nickel powder were mechanically mixed for 12 hours using a V-type powder mixer to obtain manganese-copper-nickel powder.

[0093] (2) Preparation of manganese-copper alloy samples by laser selective melting process

[0094] The laser selective melting forming process parameters were set as follows: laser power 140 W, scanning speed 900 mm / s, scanning spacing 0.14 mm, powder thickness 0.08 mm, scanning strategy set to checkerboard 67°, and laser scanning interval set to 100 s. Powder was placed into the powder feeding cylinder of the printing equipment, the substrate was heated to 200°C, and then the forming of the manganese-copper alloy began.

[0095] Example 6

[0096] This embodiment provides a method for preparing additively manufactured manganese-copper alloys, including the following steps:

[0097] (1) Powder preparation

[0098] Manganese-copper alloy and nickel powder were prepared by gas atomization, and the alloy powder was sieved to select a particle size range of 15μm~53μm.

[0099] By mass percentage, the manganese-copper alloy powder comprises: Cu 15%, C 0.02%, Si 0.015%, S 0.015%, P 0.003%, with the balance being Mn and other unavoidable impurities.

[0100] Manganese-copper alloy powder and 10 wt% nickel powder were mechanically mixed for 12 hours using a V-type powder mixer to obtain manganese-copper-nickel powder.

[0101] (2) Preparation of manganese-copper alloy samples by laser selective melting process

[0102] The laser selective melting forming process parameters are set as follows: laser power 140 W, scanning speed 900 mm / s, scanning spacing 0.14 mm, powder thickness 0.08 mm, scanning strategy set to strip 67°, and laser scanning interval set to 100 s. Powder is placed into the powder feeding cylinder of the printing equipment, the substrate is heated to 200°C, and then the forming of the manganese-copper alloy begins.

[0103] Comparative Example 1

[0104] This embodiment provides a method for preparing additively manufactured manganese-copper alloys, including the following steps:

[0105] (1) Powder preparation

[0106] Manganese-copper alloy powder was prepared by gas atomization and then sieved to select a particle size range of 15μm to 53μm.

[0107] By mass percentage, the manganese-copper alloy powder comprises: Cu 15%, C 0.02%, Si 0.015%, S 0.015%, P 0.003%, with the balance being Mn and other unavoidable impurities.

[0108] (2) Preparation of manganese-copper alloy samples by laser selective melting process

[0109] The laser selective melting forming process parameters are set as follows: laser power 100W, scanning speed 500mm / s, scanning spacing 0.1mm, powder thickness 0.05mm, printing strategy set to strip 67°, and laser scanning interval set to 50s. Powder is placed into the powder feeding cylinder of the printing equipment, the substrate is heated to 150℃, and then the forming of the manganese-copper alloy begins.

[0110] Comparative Example 2

[0111] The only difference from Example 2 is that the homogeneous substrate in this comparative example is not preheated.

[0112] Comparative Example 3

[0113] The only difference from Example 3 is that the laser selective melting forming process parameters in this comparative example are set as follows: laser power is 500 W, scanning speed is 1500 mm / s, scanning distance is 0.04 mm, and powder thickness is 0.03 mm.

[0114] Comparative Example 4

[0115] The only difference from Example 4 is that the scanning strategy used in this comparative example is a checkerboard 0°.

[0116] Comparative Example 5

[0117] The only difference from Example 5 is that the laser scanning interval in this comparative example is 0s.

[0118] Comparative Example 6

[0119] The only difference from Example 5 is that the laser scanning interval in this comparative example is 25s.

[0120] In the above embodiments and comparative examples, the scanning strategies for strip 67°, checkerboard 0°, and checkerboard 67° are as follows: Figure 1 As shown.

[0121] Experimental Example

[0122] The manganese-copper alloys prepared in Examples 1-6 and Comparative Examples 1-6 were analyzed using metallographic observation of sample defects and their relative densities were calculated using ImageJ software. Damping and tensile properties at room temperature were measured using a thermodynamic mechanical analyzer and a universal servo motor. The experimental results are shown in Tables 1, 2, and 3. Figure 2 As shown.

[0123] Table 1 Density results of manganese-copper alloy

[0124]

[0125] Table 2 Strain amplitude of additively manufactured manganese-copper alloys at room temperature =8×10 -4 Damping performance

[0126]

[0127] Table 3 Tensile test results of manganese-copper alloy

[0128]

[0129] As shown in Table 1, the manganese-copper alloys prepared in Examples 1-6 have high density, reaching up to 99.8%. In contrast, the manganese-copper alloys prepared in Comparative Examples 1-6 (without Ni addition, no substrate preheating, laser power of 500 W, scanning speed of 1500 mm / s, scanning spacing of 0.04 mm, powder thickness of 0.03 mm, checkerboard scanning strategy of 0°, and laser interval time not exceeding 25 s) have lower relative density or poorer damping and mechanical properties. Combined with... Figure 2It can be seen that Comparative Example 1 has a large number of cracks and the lowest relative density. Table 2 shows that the manganese-copper alloys prepared in Examples 1-6 have good damping properties. Compared with Comparative Examples 1-6, the damping properties of the manganese-copper alloys prepared in Examples 1-6 are improved by 15-155%. In particular, Example 5 shows significantly better damping properties than Comparative Examples 1-6. Table 3 shows that the manganese-copper alloys prepared in Examples 1-6 have good mechanical properties. Compared with Comparative Examples 1-6, the yield strength of the manganese-copper alloys prepared in Examples 1-6 is increased by 7-90%, the tensile strength is increased by 10-43%, and the elongation after fracture is increased by 20%-60%.

[0130] In summary, this invention utilizes manganese-copper alloy powder and nickel powder as raw materials, employs an in-situ powder mixing process to prepare manganese-copper-nickel alloy powder, and optimizes the alloy composition; selects a homogeneous manganese-copper alloy substrate and preheats it; utilizes laser selective melting technology to prepare the manganese-copper alloy, and rationally controls printing parameters, laser scanning strategy, and scanning interval time; combines alloying with optimized printing process to regulate the alloy's microstructure, reduce residual stress formed by the manganese-copper alloy powder during the rapid solidification process, eliminate solidification cracks in the manganese-copper alloy, and give the manganese-copper alloy good forming quality and good damping and mechanical properties.

[0131] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for preparing an additively manufactured manganese-copper alloy, characterized in that, It includes: After the manganese copper-nickel alloy powder is placed on the substrate, the substrate is preheated, and the manganese copper-nickel alloy powder is laser selective melting in the forming chamber to obtain a manganese copper alloy sample. The chemical composition of the manganese-copper-nickel alloy powder, by mass percentage, is: Cu 13%~18%, Ni 5%~10%, C≤0.03%, Si≤0.02%, S≤0.02%, P≤0.005%, with the balance being Mn and other unavoidable impurities. The parameters for laser selective melting are: laser power 120W-150W, scanning speed 700mm / s~900mm / s, scanning spacing 0.13mm~0.15mm, powder thickness 0.07mm~0.09mm, scanning interval 60s~110s, and a checkerboard 67° laser scanning strategy. The manganese-copper-nickel alloy powder is obtained by mechanically mixing manganese-copper alloy powder and nickel powder, both of which are prepared using vacuum atomization.

2. The preparation method according to claim 1, characterized in that, The laser power is 130W-150W, the scanning speed is 800mm / s-900mm / s, the scanning spacing is 0.13mm-0.15mm, the powder thickness is 0.07mm-0.09mm, and the scanning interval is 70s-100s.

3. The preparation method according to any one of claims 1 to 2, characterized in that, Preheat the substrate to 100°C~300°C.

4. The preparation method according to any one of claims 1 to 2, characterized in that, The composition of the substrate is the same as that of the manganese-copper-nickel alloy powder.

5. An additively manufactured manganese-copper alloy, characterized in that, It is prepared by the preparation method described in any one of claims 1 to 4.

6. The application of the additive manufacturing manganese-copper alloy as described in claim 5 in automobiles, ships, weapons and equipment, or aerospace.

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