Alkali-soluble photosensitive resin and manufacturing method thereof, alkali-soluble photosensitive resin composition and color filter

Abstract

The invention discloses a novel alkali-soluble photosensitive resin polymer, which is characterized in that a heat-resistant siloxane structure and a cyanoacrylic acid structure with potential curing are introduced into resin, so that the problem that pixels are detached is solved. The display device made of the color filter containing the resin composition can be used for scenes with severe environment changes, such as vehicle-mounted display and the like.

Description

Technical Field

[0001] The present disclosure relates to the field of liquid crystal display manufacturing, and in particular to an alkali-soluble photosensitive resin and a manufacturing method thereof, an alkali-soluble photosensitive resin composition, and a color filter. Background Art

[0002] In the liquid crystal display industry, color filters are crucial components for creating image color. During manufacturing, negative photosensitive resin compositions are typically used, leveraging their photosensitivity and alkali solubility to create RGB (Red, Blue, and Blue) color filters. Different colors are displayed within a single pixel by adjusting the ratio of the three colors.

[0003] As living standards improve, people's demands for material goods are also increasing. High-resolution in-car displays are becoming increasingly popular. High resolution requires a smaller pixel matrix size. To meet this demand, panel manufacturers are required to reduce the amount of polymerization initiator used when producing high-resolution products to ensure that there is no overlap or cross-coloring between the three RGB colors. This results in defective color filters due to poor adhesion, resulting in pixels that appear to be separated. Furthermore, the unique application scenarios of in-car displays require displays to have excellent heat and weather resistance. Therefore, how to provide alkali-soluble photosensitive resins with good adhesion, heat resistance and weather resistance for color filter manufacturing is a practical problem that the industry currently needs to solve. Summary of the Invention

[0004] The present invention aims to provide a novel alkali-soluble photosensitive resin that not only enables high-resolution pixel filters but also significantly improves the heat and weather resistance of color filters, while reducing the risk of pixel disassembly. To achieve these objectives, the inventors conducted in-depth research and ultimately discovered that introducing a silicon-oxygen structure into the polymer backbone and a cyano group structure into the polymer can achieve the stated goals of the present invention.

[0005] Specifically, the present invention provides an alkali-soluble photosensitive resin, which contains one or more structures represented by formula (1):

[0006]

[0007] In formula (1), R 1 、R 2 、R 3 、R 4 are independently hydrogen, C1-C10 alkyl or CN, and R 1 、R 2 、R 3 、R 4 At least one of them is CN;

[0008] R 5 、R 6 Each independently represents H, OH, -CH3, -OCH3, -CH2=CR 7 -COOR 8 、-OCOCH2=CR 7 (CH2), R 7 、R 8 Each is independently hydrogen, C1-C10 alkyl;

[0009] X is a silicon atom;

[0010] Y is or * represents the site forming a bond with the main chain; n is a positive integer from 1 to 30.

[0011] The -Si-O- structure introduced into the main chain of the compound of the present invention is very important and is the key to achieving good adhesion.

[0012] A siloxane chain structure and cyano groups are introduced into the molecular chain of an alkali-soluble photosensitive resin. The inventors speculate that the introduction of a -Si-O- structure into the molecular backbone provides greater stability due to the higher bond energy of the siloxane chain's silicon-oxygen bond (452 ​​kJ / mol) compared to the carbon-oxygen bond (326 kJ / mol). This can mitigate performance fluctuations in the color filter under harsh environments, resulting in improved stability.

[0013] Introducing an appropriate amount of CN groups into the compound can further enhance adhesion and improve weather resistance. This is due to its high polarity, which not only increases the cohesive force between molecules, but also promotes the anionic polymerization of the cyanoacrylate groups in the alkaline developer used during development, which has a hardening effect on the pixel edges, thus preventing the pixel from being separated during development.

[0014] In a preferred embodiment of the present invention, the C1-C10 alkyl group is a C1-C3 alkyl group, more preferably a methyl group or an ethyl group.

[0015] In a preferred embodiment of the present invention, R 5 、R 6 -CH3, R 1 、R 2 、R 3 、R 4 All are CN.

[0016] The photosensitive resin of the present invention can be obtained by heating and polymerizing cyanoacrylic acid monomer, acrylic acid monomer, methylsilanetriol monomer, benzophenonetetracarboxylic acid derivative or biphenyltetracarboxylic acid derivative. The biphenyltetracarboxylic acid derivative is preferably biphenyltetracarboxylic dianhydride, and the benzophenonetetracarboxylic acid derivative is preferably benzophenonetetracarboxylic dianhydride.

[0017] In the present invention, the methylsilanetriol monomer may be a monomer in the form of a solution obtained by adding methyltrimethoxysilane to propylene glycol monomethyl ether acetate to dissolve the mixture, and then adding hydrochloric acid to react the mixture.

[0018] In a preferred embodiment of the present invention, n is an integer of 1 to 20, more preferably n is an integer of 2 to 15, and more preferably n is an integer of 8 to 15.

[0019] In a preferred embodiment of the present invention, the weight average molecular weight of the alkali-soluble sensory resin is 2000-15000, more preferably 3000-6000. In a preferred embodiment of the present invention, the acid value is 50-200 mg / gKOH, more preferably 60-90 mgKOH / g.

[0020] The present invention provides a method for preparing the aforementioned alkali-soluble photosensitive resin. For example, a cyano group-containing acrylic acid monomer, an acrylic acid monomer, and a methylsilanetriol monomer are contacted in an ether solvent, an acidic substance is added, mixed, and then a benzophenone tetracarboxylic acid derivative or a biphenyl tetracarboxylic acid derivative is added. The mixture is heated to react to obtain the desired photosensitive resin. Preferably, the ether solvent is selected from ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monopropyl ether, diethylene glycol dimethyl ether, and propylene glycol monomethyl ether acetate, and the acidic substance is dilute sulfuric acid, hydrochloric acid, phosphoric acid, acetic acid, or the like. The benzophenone tetracarboxylic acid derivative or biphenyl tetracarboxylic acid derivative herein is preferably an acid anhydride compound.

[0021] In a preferred embodiment of the present invention, the methylsilanetriol monomer is prepared by dissolving methyltrimethoxysilane in propylene glycol monomethyl ether acetate, then adding hydrochloric acid to react to obtain a solution containing the methylsilanetriol monomer. Freshly prepared methylsilanetriol helps improve the adhesion of the resin of the present invention.

[0022] More specifically, the compound of formula (1) of the present invention can be obtained by thermal polymerization of the following specific compounds. Other photosensitive resins of the present invention can be obtained by referring to the following synthetic routes:

[0023] first step:

[0024]

[0025] Step 2:

[0026]

[0027] As a specific synthesis method, for example, the following process can be used: propylene glycol monomethyl ether acetate is added to a refluxing three-necked flask, methyltrimethoxysilane is dissolved therein, the pH value is adjusted to 2 with concentrated hydrochloric acid, and the reduced pressure, vacuumization, and nitrogen filling are repeated four times, followed by heating to 80°C and reflux for four hours. Next, dicyanoacrylic acid, biphenyltetracarboxylic dianhydride, and polymerization initiator azobisisobutyronitrile are added to the above system. Reflux and stir at 110°C for 6 hours, then the temperature is lowered to 60°C, the reflux is turned off, propylene glycol monomethyl ether acetate is added, and distillation is continued for 0.5 hours. The hydrochloric acid is removed, and the reaction mixture is reheated several times to obtain an alkali-soluble photosensitive resin. However, the synthesis method of the alkali-soluble photosensitive resin of the present invention is not limited to the above synthesis method.

[0028] Another aspect of the present invention provides a photosensitive resin composition comprising the alkali-soluble photosensitive resin of the present invention, and further comprising a photopolymerizable monomer, a photoinitiator, a colorant, and a solvent. Preferably, the mass ratio of the alkali-soluble photosensitive resin, the photopolymerizable monomer, the photoinitiator, the colorant, and the solvent is (5-15):(10-20):(1-10):(20-50):(40-65).

[0029] In a preferred embodiment of the present invention, the photopolymerizable monomer is a multifunctional (meth)acrylate; in a preferred embodiment of the present invention, the photoinitiator is one or more selected from acetone compounds, benzophenone compounds, triazine compounds, biimidazole compounds, thioxanthone compounds and oxime ester compounds. Further preferably, the initiator includes oxime ester initiators OXE01, OXE02, OXE03 or their analogs.

[0030] The resin of the present invention can provide better adhesion due to its special molecular design. At the same time, the addition of photopolymerizable monomers in the resin composition can improve the strength and photosensitivity of the resin cured product and reduce the amount of initiator used.

[0031] In a preferred embodiment of the present invention, the solvent is at least one selected from ethyl acetate, acetone, benzene, toluene, xylene, cyclohexane, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monopropyl ether, diethylene glycol dimethyl ether, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, diethylene glycol methyl ether acetate, diethylene glycol butyl ether acetate and ethyl 3-ethoxypropionate.

[0032] Preferably, the solvent comprises ethylene glycol methyl ether acetate, ethylene glycol ethyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, or a combination of the above compounds.

[0033] In a preferred embodiment of the present invention, the photosensitive resin composition further comprises auxiliary agents, the content of which is 0.1-5% of the total mass of the photosensitive resin composition, such as photosensitizers, leveling agents, silane coupling agents, surfactants and other auxiliary agents commonly used in the art.

[0034] Another aspect of the present invention provides a method for preparing a color filter, characterized in that the photosensitive resin composition of the present invention is applied to a substrate, and the process is followed by spin coating, pre-baking, exposure, development, and post-baking.

[0035] In a preferred embodiment, the pre-baking treatment is performed at a temperature of 80 to 100° C. for 60 to 120 seconds; and the post-baking treatment is performed at a temperature of 200 to 230° C. for 10 to 60 minutes.

[0036] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0037] 1. The present invention introduces a cyanoacrylate structure into the resin molecular chain and adopts an alkali-soluble photosensitive resin with a suitable average molecular weight and acid value, thereby ensuring the photocuring sensitivity and development speed of the negative photosensitive resin composition, while improving the adhesion to the substrate, avoiding the risk of pixels being disassembled and peeling, and effectively improving the resolution of the negative photoresist.

[0038] 2. The present invention introduces a silicone chain with better heat resistance into the main chain of the molecule, which can effectively solve the problem of chromaticity deviation caused by molecular chain breakage due to excessive temperature in conventional resins. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 is an electron microscope (OM) image of the film layer prepared in Example 1;

[0040] Figure 2 is an electron microscope (OM) image of the film prepared in Example 2;

[0041] Figure 3 is an electron microscope (OM) image of the film prepared in Comparative Example 1;

[0042] Figure 4 is an electron microscope (OM) image of the film prepared in Comparative Example 3;

[0043] Figure 5 This is an electron microscope (OM) image of the pixel sheet prepared in Example 1;

[0044] Figure 6 This is an electron microscope (OM) image of the pixel sheet prepared in Example 2;

[0045] Figure 7is the electron microscope (OM) image of the pixel slice prepared in comparative case 3;

[0046] Figure 8 yes Figure 7 Magnified electron microscopy (OM) image of the boxed area. DETAILED DESCRIPTION

[0047] The technical solutions of the present invention are further illustrated by specific examples below. Those skilled in the art should understand that the examples are only for helping to understand the present invention and should not be regarded as specific limitations of the present invention.

[0048] Example

[0049] Synthesis example one

[0050] In a refluxing three-necked flask, add 200g of propylene glycol monomethyl ether acetate and dissolve 13.6g (0.1mol) of methyltrimethoxysilane (Dow Corning Z-6070). Adjust the pH to 2 with concentrated hydrochloric acid, repeat the process four times with vacuum evacuation and nitrogen filling, then heat to 80°C and reflux for four hours. Next, add 9.7g (0.1mol) of dicyanoacrylic acid, 29.4g (0.1mol) of biphenyltetracarboxylic dianhydride, and 1.0g of azobisisobutyronitrile (polymerization initiator). Reflux and stir at 110°C for 6 hours. Then, lower the temperature to 60°C, turn off reflux, add 50g of propylene glycol monomethyl ether acetate, and distill for 0.5 hours to remove the hydrochloric acid. Repeat this process five times to obtain an alkali-soluble photosensitive resin A. The solution has a solids content of 39.2wt% and an acid value (based on solids) of 67.8mgKOH / g.

[0051] Synthesis Example 2

[0052] In a refluxing three-necked flask, add 200g of propylene glycol monomethyl ether acetate and dissolve 13.6g (0.1mol) of methyltrimethoxysilane (Dow Corning Z-6070). Adjust the pH to 2 with concentrated hydrochloric acid. Repeat the process four times, evacuate the solution and refill with nitrogen. Heat to 80°C and reflux for four hours. Next, add 4.85g (0.05mol) of dicyanoacrylic acid, 3.6g (0.05mol) of acrylic acid, 29.4g (0.1mol) of biphenyltetracarboxylic dianhydride, and 1.0g of azobisisobutyronitrile (polymerization initiator). Reflux at 110°C with stirring for 6 hours. The temperature is then lowered to 60°C, reflux is stopped, 50g of propylene glycol monomethyl ether acetate is added, and distillation is continued for 0.5 hours to remove the hydrochloric acid. Repeat this process five times to obtain an alkali-soluble photosensitive resin B. The solution has a solids content of 38.5wt% and an acid value (based on solids) of 72.6mgKOH / g.

[0053] Comparative Synthesis Example 1

[0054] On the basis of Synthesis Example 1, except that 0.1 mol of dicyanoacrylic acid was replaced by 0.1 mol of acrylic acid, the rest of the operations were carried out in the same manner to prepare an alkali-soluble photosensitive resin C.

[0055] Comparative Synthesis Example 2

[0056] On the basis of Synthesis Example 2, the trimethylolsilane solution prepared from methyltrimethoxysilane was directly replaced with trimethylolpropane, and the rest of the operations were carried out in the same manner, thereby preparing an alkali-soluble photosensitive resin D.

[0057] Example 1

[0058] This example provides a photosensitive resin composition comprising 20 parts of the alkali-soluble photosensitive resin A obtained in Synthesis Example 1, 30 parts of commercially available S8600 resin (SMS Co., Ltd.), 50 parts of a polymerizable monomer, dipentaerythritol hexaacrylate (DPHA), 350 parts of pigment G-8 (G58 pigment), 3 parts of an oxime ester photopolymerization initiator, OXE01 (BASF), 2 parts of additives [a leveling agent, AFKA-3600 (Ciba Specialty Chemicals), a silicone coupling agent, KH550 (J&K KH550), and a hindered phenol antioxidant, IRGANOX 1010 (BASF)], and 545 parts of propylene glycol monomethyl ether acetate and 3-methoxybutyl acetate.

[0059] Example 2

[0060] This embodiment provides a photosensitive resin composition, comprising 20 parts of the alkali-soluble photosensitive resin B obtained in Synthesis Example 2, 30 parts of commercially available S8600 resin (SMS Co., Ltd.), 50 parts of a polymerizable monomer dipentaerythritol hexaacrylate (DPHA), 350 parts of pigment G-8 (G58 pigment), 3 parts of an oxime ester-based photopolymerization initiator OXE01 (BASF), and additives [leveling agent AFKA-3600 (Ciba Specialty Chemicals), silicone coupling agent (J&K KH550), hindered phenol antioxidant IRGANOX

[0061] 1010 (BASF)] totaling 2 parts, propylene glycol monomethyl ether acetate and 3-methoxybutyl acetate totaling 545 parts.

[0062] Comparative Example 1

[0063] This embodiment provides a photosensitive resin composition, comprising 20 parts of the alkali-soluble photosensitive resin C obtained in Comparative Synthesis Example 1, 30 parts of commercially available S8600 resin (SMS Co., Ltd.), 50 parts of a polymerizable monomer dipentaerythritol hexaacrylate (DPHA), 350 parts of pigment G-8 (G58 pigment), 3 parts of an oxime ester-based photopolymerization initiator OXE01 (BASF), and additives [leveling agent AFKA-3600 (Ciba Specialty Chemicals), silicone coupling agent (J&K KH550), hindered phenol antioxidant IRGANOX

[0064] 1010 (BASF)] totaling 2 parts, propylene glycol monomethyl ether acetate and 3-methoxybutyl acetate totaling 545 parts.

[0065] Comparative Example 2

[0066] This embodiment provides a photosensitive resin composition, comprising 20 parts of the alkali-soluble photosensitive resin D obtained in Comparative Synthesis Example 2, 30 parts of commercially available S8600 resin (SMS Co., Ltd.), 50 parts of a polymerizable monomer dipentaerythritol hexaacrylate (DPHA), 350 parts of pigment G-8 (G58 pigment), 3 parts of an oxime ester-based photopolymerization initiator OXE01 (BASF), and additives [leveling agent AFKA-3600 (Ciba Specialty Chemicals), silicone coupling agent (J&K KH550), hindered phenol antioxidant IRGANOX

[0067] 1010 (BASF)] totaling 2 parts, propylene glycol monomethyl ether acetate and 3-methoxybutyl acetate totaling 545 parts.

[0068] Comparative Example 3

[0069] On the basis of Example 1, 20 parts of the alkali-soluble photosensitive resin A was replaced with 20 parts of commercially available S8600 (SMS Co., Ltd.) resin, and the other composition ratios were the same.

[0070] Filter preparation

[0071] The photosensitive resin compositions obtained in Example 1, Example 2 and Comparative Examples 1, 2 and 3 were prepared into color filters. The specific process is as follows:

[0072] (1) Spin coating process: The photosensitive composition of the present application is evenly dispersed on the glass substrate using a spin coating device. The thickness of the film after coating is preferably 0.1 to 10 μm, more preferably 1.5 to 2.5 μm;

[0073] (2) Pre-baking process: After coating, the photosensitive resin composition is baked using a heating plate or an oven;

[0074] The temperature is preferably 80 to 100° C., more preferably 90° C., and the time is preferably 90 to 120 s.

[0075] (3) Exposure Process: In the exposure step, the colored layer formed in the above step is exposed through a mask having a predetermined mask pattern. The radiation used for exposure is preferably ultraviolet radiation such as g-rays, ray-rays, and i-rays. The irradiation intensity is preferably 10 mJ / cm² to 200 mJ / cm², more preferably 50 mJ / cm².

[0076] (4) Development process: To obtain the target pattern, the exposed and non-exposed areas need to be developed. The developer can be selected according to the application and can be organic or inorganic alkaline compounds such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, potassium hydroxide, sodium hydroxide, potassium bicarbonate, etc. The development temperature is preferably 20-30°C, more preferably 23°C. The developer can be diluted with pure water, and the dilution concentration is preferably 0.01% to 1% by weight. After alkaline solution development, it is also necessary to rinse with pure water.

[0077] (7) Post-baking process: In order to make the film layer further reach a certain density, the developed film layer needs to be post-baked and cured. The curing can be carried out using a heating plate, an oven, etc. The temperature is preferably 200-250°C, more preferably 230°C, and the time is preferably 100s-3600s, more preferably 600s-1200s.

[0078] Performance evaluation:

[0079] (1) Base curing degree test

[0080] In order to compare the effects of the invention, the curing degree of the bottom of the film layer prepared by the above method was evaluated. Figure 1 , Attachment Figure 2 , Attachment Figure 3 , Attachment Figure 4 These are OM images of the films prepared in Example 1, Example 2, Comparative Example 1, and Comparative Example 3. The deep-layer curing performance of the colored photosensitive resin is compared by comparing whether pixels have fallen off. The degree of bottom curing is evaluated by counting the number of pixels within the target range; a higher number indicates a higher degree of bottom curing.

[0081] (2) Development residue test

[0082] OM was used to judge the residue on the glass substrate after the development. The evaluation results of Example 1, Example 2, and Comparative Case 3 were as follows: Figure 5 、 Figure 6 、 Figure 7 As shown, the residue situations can be compared.

[0083] The evaluation criteria for developer residue are:

[0084] A: No residue was observed on the glass substrate after development.

[0085] B: Residue was very slightly observed on the glass substrate after development, but it was not problematic for use;

[0086] C: Slight residue was observed on the glass substrate after development, but in practice, it slightly affected performance.

[0087] D: Residues were clearly observed on the glass substrate after development.

[0088] (3) Chromaticity deviation test

[0089] The degree of heat resistance is mainly reflected in the degree of color deviation. Good heat resistance means small color deviation; conversely, poor heat resistance means large color deviation.

[0090] The chromaticity test method refers to GB / T15609-2008 color display chromaticity measurement method, and the chromaticity coordinates (x, y) are tested.

[0091] The obtained photosensitive resin composition is prepared into the color coordinates (X0, Y0) of the color filter. After the test is completed, the color filter is placed in an 80°C oven for 500 hours to test the color coordinates (X1, Y1) of the filter.

[0092] Chromaticity deviation calculation method

[0093] The smaller Δ is, the smaller the chromaticity deviation is.

[0094] The test results are shown in Table 1

[0095] Table 1

[0096]

[0097] It can be seen from this that the photoresist containing the alkali-soluble photosensitive resin of the present invention has high adhesion and excellent photosensitivity, and its other properties are also suitable for industrial production.

Claims

1. An alkali-soluble photosensitive resin, comprising one or more of the structures represented by formula (1): In formula (1), R 1 、R 2 、R 3 、R 4 are independently hydrogen, C1-C10 alkyl or CN, and R 1 、R 2 、R 3 、R 4 At least one of them is CN; R 5 、R 6 Each independently represents H, OH, -CH3, -OCH3, -CH2=CR 7 -COOR 8 、-OCOCH2=CR 7 (CH2), R 7 、R 8 Each is independently hydrogen, C1-C10 alkyl; X is a silicon atom; Y is or * represents the site forming a bond with the main chain; n is a positive integer from 1 to 30.

2. The alkali-soluble photosensitive resin according to claim 1, wherein R 5 、R 6 -CH3, R 1 、R 2 、R 3 、R 4 All are CN.

3. The alkali-soluble photosensitive resin according to claim 1, wherein The invention is obtained by heating and polymerizing cyanoacrylic acid monomer, acrylic acid monomer, methylsilanetriol monomer, benzophenonetetracarboxylic acid derivative or biphenyltetracarboxylic acid derivative. The biphenyltetracarboxylic acid derivative is preferably biphenyltetracarboxylic acid dianhydride, and the benzophenonetetracarboxylic acid derivative is preferably benzophenonetetracarboxylic acid dianhydride.

4. The alkali-soluble sensory resin according to claim 1, wherein n is an integer of 1-20, preferably, n is an integer of 8-15.

5. The alkali-soluble sensory resin according to claim 1, wherein The weight average molecular weight is 2000-15000, preferably the weight average molecular weight is 3000-6000; The acid value is 50-200 mg / gKOH, preferably the acid value is 60-90 mgKOH / g.

6. The method for preparing the alkali-soluble photosensitive resin according to claim 1, wherein: The desired photosensitive resin can be obtained by contacting cyano acrylic acid monomer, acrylic acid monomer, and methylsilanetriol monomer in an ether solvent, adding an acidic substance, mixing, and then adding a benzophenone tetracarboxylic acid derivative or a biphenyl tetracarboxylic acid derivative and heating to react. Preferably, the ether solvent is one selected from ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monopropyl ether, diethylene glycol dimethyl ether, and propylene glycol monomethyl ether acetate, and the acidic substance is dilute sulfuric acid, hydrochloric acid, phosphoric acid, or acetic acid.

7. The preparation method according to claim 6, characterized in that The methylsilanetriol monomer is a solution obtained by dissolving methyltrimethoxysilane in propylene glycol monomethyl ether acetate, and then adding hydrochloric acid to react the mixture.

8. A photosensitive resin composition comprising the alkali-soluble photosensitive resin according to claim 1, and further comprising a photopolymerizable monomer, a photoinitiator, a colorant, and a solvent, wherein: The mass ratio of the alkali-soluble photosensitive resin, the photopolymerizable monomer, the photoinitiator, the colorant and the solvent is (5-15): (10-20): (1-10): (20-50): (40-65).

9. The photosensitive resin composition according to claim 8, characterized in that The photopolymerizable monomer is a multifunctional (meth)acrylate.

10. The photosensitive resin composition according to claim 8, characterized in that The photoinitiator is one or more selected from acetone compounds, benzophenone compounds, triazine compounds, biimidazole compounds, thioxanthone compounds and oxime ester compounds.

11. The photosensitive resin composition according to claim 8, characterized in that The solvent is at least one selected from ethyl acetate, acetone, benzene, toluene, xylene, cyclohexane, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monopropyl ether, diethylene glycol dimethyl ether, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, diethylene glycol methyl ether acetate, diethylene glycol butyl ether acetate and ethyl 3-ethoxypropionate. Preferably, the solvent is selected from one or a combination of two or more solvents selected from ethylene glycol methyl ether acetate, ethylene glycol ethyl ether acetate, propylene glycol methyl ether acetate and propylene glycol ethyl ether acetate.

12. The photosensitive resin composition according to claim 8, characterized in that The photosensitive resin composition also includes an auxiliary agent, the content of which is 0.1-5% of the total mass of the photosensitive resin composition.

13. A method for preparing a color filter, characterized in that: The photosensitive resin composition according to claim 8 is coated on a substrate, and then subjected to spin coating, pre-baking, exposure, development, and post-baking treatments in sequence.

14. The method for preparing a color filter according to claim 13, wherein: The pre-baking temperature is 80-100°C and the time is 60-120s; the post-baking temperature is 200-230°C and the time is 10-60min, preferably the pre-baking temperature is 90°C and the pre-baking time is 100s; the exposure energy is 50mj / cm 2 ; Developer temperature 23 ℃, development time 100s; Post-baking temperature 230 ℃, post-baking time 20min.

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