Backlight module with multiple heat dissipation components

By introducing a graphene heat-conducting plate, heat exchange components, and airflow guiding components into the backlight module, the problem of insufficient heat dissipation in small displays is solved, achieving effective heat exchange and heat dissipation, and ensuring the accuracy of optical signals.

CN120593245BActive Publication Date: 2025-12-12广东浪尖光电科技有限公司
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Patent Information

Application Number
CN202510590676.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-05-08
Publication Date
2025-12-12
Estimated Expiration
2045-05-08

AI Technical Summary

Technical Problem

When a fan cannot be installed in a smaller display and heat dissipation is achieved solely through a heat-conducting plate, the heat dissipation effect of the backlight module is affected, resulting in inaccurate demodulation reference frequency of the light.

Method used

Multiple heat dissipation components are used, including a graphene thermal conductive plate, a heat exchange component, an airflow guiding component, and a cooling component. Heat exchange and dissipation are achieved through the synergistic effect of liquid and airflow. The graphene thermal conductive plate is used for initial heat exchange, the airflow guiding component assists in heat dissipation, and the cooling component further reduces the temperature.

Benefits of technology

This improved the heat dissipation of the backlight module, ensured the accuracy of the light demodulation reference frequency, and avoided the impact of temperature rise on the light signal.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to a backlight module with multiple heat dissipation components, and belongs to the technical field of backlight sources. The backlight module with multiple heat dissipation components comprises a light guide positioning plate, the surface of the light guide positioning plate is fixedly connected with a rubber frame, a heat dissipation mechanism is installed on the side of the light guide positioning plate far from the rubber frame, wherein the heat dissipation mechanism comprises a graphene temperature guide plate fixedly connected with the side of the light guide positioning plate far from the rubber frame, a plurality of heat exchange components are installed on the other side of the graphene temperature guide plate, and airflow guide components are arranged between adjacent heat exchange components; while the heat exchange components exchange heat with the graphene temperature guide plate, the graphene temperature guide plate can form a better cooling and heat dissipation effect under the joint action of the heat exchange components and the airflow guide components, the influence of the backlight source heat dissipation effect is reduced, and the light demodulation reference frequency accuracy is ensured.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of backlight, in particular to a backlight module with multiple heat dissipation components. BACKGROUND

[0002] The backlight module is located at the back of the display screen, fixed and supported by specific mechanical structure, and ensures that the light can be efficiently and uniformly irradiated to the display screen through optical design; the backlight module is composed of light source, optical film, light guide plate, support frame and driving constant current plate, etc., and the display screen itself is a passive light emitting device and cannot emit light independently, and its display function completely depends on the light provided by the backlight module; the backlight module generates light source through light emitting elements such as LED and CCFL, and then uniformly distributes the light to the surface of the display screen through optical components, thereby forming a visible image.

[0003] The light emitting elements in the backlight module will generate a large amount of heat during work; taking LED as an example, its electro-optical conversion efficiency is usually only 20% to 30%, and the remaining electrical energy will be continuously released in the form of heat, resulting in temperature rise of the backlight module; the continuous temperature rise will affect the light signal restoration, and is easy to cause wavelength drift, so that the wavelength of the blue light chip is red-shifted, resulting in inaccurate demodulation reference frequency and causing signal synchronization error.

[0004] According to the search of Chinese patent technology, a backlight heat dissipation module and a backlight, the publication number is "CN208652230U", the device can discharge a large amount of heat through the conduction of aluminum casting, aluminum substrate, heat-conducting glue and heat dissipation fan, but for some relatively small size display, it is difficult to install the fan due to space limitation, and only through the heat-conducting glue and heat-conducting plate for heat dissipation, which will affect the heat dissipation effect of the backlight, and further cause the demodulation reference frequency of light to be inaccurate. SUMMARY

[0005] Therefore, it is necessary to provide a backlight module with multiple heat dissipation components to solve the problem that the heat dissipation effect of the backlight is affected by the heat dissipation through the heat-conducting plate only for the small display which cannot install the fan.

[0006] The application discloses a backlight module with multiple heat dissipation components, which comprises a light guide positioning plate, the surface of the light guide positioning plate is fixedly connected with a rubber frame, a heat dissipation mechanism is installed on the side of the light guide positioning plate far from the rubber frame, wherein the heat dissipation mechanism comprises a graphene temperature guide plate fixedly connected with the side of the light guide positioning plate far from the rubber frame, a plurality of heat exchange components are installed on the other side of the graphene temperature guide plate, an air flow guide component is arranged between adjacent heat exchange components, the surface of the air flow guide component extends to the other side of the heat exchange component, a cooling component is fixedly connected with the side of the air flow guide component far from the heat exchange component, the heat exchange component comprises two connecting temperature guide plates fixedly connected with the other side of the graphene temperature guide plate, a circular arc plate is fixedly connected with the lower end of the connecting temperature guide plate, a plurality of temperature guide guide frames are fixedly connected with the opposite sides of the two connecting temperature guide plates respectively, and adjacent temperature guide guide frames are staggered.

[0007] In one of the embodiments, the lower end of the circular arc plate is fixedly connected with a fixed temperature guide plate, the opposite sides of the two fixed temperature guide plates close to the circular arc plate are fixedly connected with inclined blocks respectively, and a temperature guide circular block fixedly connected with the other side of the graphene temperature guide plate is arranged in the interiors of the two circular arc plates, the center of the temperature guide circular block is located above the center of the circular arc plate, and adjacent temperature guide circular blocks are staggered.

[0008] In one of the embodiments, the temperature guide guide frame comprises a middle block between the two connecting temperature guide plates, the middle block is fixedly connected with the other side of the graphene temperature guide plate, a lower block is fixedly connected with the lower end of the middle block, two connecting strips are fixedly connected with the vertical surface of the middle block, and the connecting strips are fixedly connected with the surfaces of adjacent connecting temperature guide plates.

[0009] In one of the embodiments, the lower end surface of the lower block is arc-shaped, the longitudinal section of the lower block is C-shaped, and the end of the lower block far from the middle block is hook-shaped.

[0010] In one of the embodiments, the air flow guide component comprises a temperature insulation hollow plate fixedly connected with the sides of the plurality of heat exchange components far from the graphene temperature guide plate, the upper and lower ends of the temperature insulation hollow plate are fixedly connected with connecting heads respectively, the two sides of the connecting heads are respectively in communication with the surfaces of adjacent heat exchange components and cooling components, a plurality of air flow guide frames are fixedly connected with the side of the temperature insulation hollow plate close to the graphene temperature guide plate, and the air flow guide frames are located between adjacent heat exchange components.

[0011] In one of the embodiments, the airflow guide frame comprises a fixed plate fixedly connected to the surface of the thermal insulation hollow slab, two positioning fastening frames are fixedly connected to the lower end of the side of the fixed plate away from the thermal insulation hollow slab, two first piezoelectric ceramics are fixedly connected between the two positioning fastening frames, the first piezoelectric ceramics are arranged in parallel with the fixed plate, a Mylar sheet is arranged between the two first piezoelectric ceramics, and the upper end of the Mylar sheet penetrates to the upper side of the first piezoelectric ceramic and is fixedly connected with a flexible plastic film.

[0012] In one of the embodiments, a flow guide bump fixedly connected to the surface of the fixed plate is arranged above each of the two positioning fastening frames, and the two flow guide bumps are staggered.

[0013] In one of the embodiments, the cooling assembly comprises a liquid storage plate-shaped box fixedly connected to the side of the thermal insulation hollow slab away from the heat exchange assembly, a plurality of plate-shaped heat pipes are fixedly connected to the inner wall of the liquid storage plate-shaped box, a waterproof plug fixedly connected to the inner wall of the liquid storage plate-shaped box is arranged between the upper plate-shaped heat pipe and the lower plate-shaped heat pipe, and the surface of the plate-shaped heat pipe penetrates to the other side of the liquid storage plate-shaped box.

[0014] In one of the embodiments, a connecting fastening frame is fixedly connected between adjacent plate-shaped heat pipes, two second piezoelectric ceramics are fixedly connected to the inner wall of the connecting fastening frame, the second piezoelectric ceramics are perpendicular to the other side of the liquid storage plate-shaped box, and a plastic sheet is arranged between the two second piezoelectric ceramics.

[0015] In one of the embodiments, the waterproof plug comprises a plurality of arc-shaped metal frames fixedly connected to the inner wall of the liquid storage plate-shaped box, the arc-shaped metal frames are horizontally distributed along the inner wall of the liquid storage plate-shaped box, a flexible soft rubber film is arranged on the surface of the arc-shaped metal frame, and the lower end of the flexible soft rubber film is wavy.

[0016] The backlight module with multiple heat dissipation assemblies can make the airflow guide assembly assist in forming the heat dissipation effect of the graphene temperature guide plate while the heat exchange assembly exchanges heat with the graphene temperature guide plate. The device forms sufficient contact between the liquid flowing in the liquid flow channel and the graphene temperature guide plate, and carries away the heat generated by the light guide positioning plate in the contact heat exchange. The liquid contacts the temperature guide frame alternately distributed in the flow to assist heat exchange. The airflow guide assembly blows the graphene temperature guide plate between adjacent heat exchange assemblies, carrying away the heat on the surface of the graphene temperature guide plate. Under the joint action of the heat exchange assembly and the airflow guide assembly, the graphene temperature guide plate can form a better cooling and heat dissipation effect, the influence of the backlight source on the heat dissipation effect is reduced, and the accuracy of the light demodulation reference frequency is ensured.

[0017] Through setting the heat exchange assembly and the cooling assembly, the liquid can be circulated under the action of the heat exchange assembly and the cooling assembly after heat exchange, the liquid in the liquid flow channel is heated after heat exchange of the graphene temperature guide plate by the heat exchange assembly, the heated liquid moves upward and enters the liquid storage plate-shaped box, at this time, the low-temperature liquid below will be supplemented into the lower part of the heat exchange assembly, and meanwhile, the liquid in the liquid storage plate-shaped box can be continuously supplemented into the heat exchange assembly, so that the graphene temperature guide plate is kept to have the auxiliary heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present application or prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0019] Figure 1 It is a structural schematic diagram of the present application;

[0020] Figure 2 It is a position schematic diagram of the graphene temperature guide plate of the present application;

[0021] Figure 3 It is a partial explosion structural schematic diagram of the heat dissipation mechanism of the present application;

[0022] Figure 4 It is a partial explosion structural schematic diagram of the heat exchange assembly of the present application;

[0023] Figure 5 It is a structural schematic diagram of the temperature guide guide frame of the present application;

[0024] Figure 6 It is a partial structural schematic diagram of the air flow guide assembly of the present application;

[0025] Figure 7 It is an explosion structural schematic diagram of the air flow guide frame of the present application;

[0026] Figure 8 It is a partial explosion sectional view of the cooling assembly of the present application;

[0027] Figure 9 It is a connection schematic diagram of the plate-shaped heat pipe and the connecting fastening frame of the present application;

[0028] Figure 10 It is a position schematic diagram of the arc-shaped metal frame of the present application.

[0029] Reference signs:

[0030] 100, light guide positioning plate; 200, glue frame; 300, heat dissipation mechanism; 310, heat exchange component; 311, connecting temperature guide sheet; 312, temperature guide guide frame; 313, arc plate; 314, fixed temperature guide sheet; 315, temperature guide round block; 316, inclined block; 3121, middle block; 3122, connecting strip; 3123, lower block; 320, air flow guide component; 321, temperature insulation hollow plate; 322, connecting head; 323, air flow guide frame; 3231, fixed plate; 3232, flow guide protrusion; 3233, positioning fastening frame; 3234, first piezoelectric ceramic; 3235, Mylar sheet; 3236, flexible plastic film; 330, cooling component; 331, liquid storage plate-shaped box; 332, water stop; 333, plate-shaped heat pipe; 334, connecting fastening frame; 335, second piezoelectric ceramic; 336, plastic sheet; 3321, arc-shaped metal frame; 3322, flexible soft rubber film; 340, graphene temperature guide plate. DETAILED DESCRIPTION

[0031] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely explain the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0032] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly on the other component or there can be a middle component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or there can be a middle component. The terms "vertical", "horizontal", "up", "down", "left", "right", and similar expressions used in the description of the present application are for the purpose of illustration only and do not indicate the only implementation.

[0033] In addition, the terms "first", "second", etc. are used only for descriptive purposes and should not be construed as indicating or implying relative importance or an indicated number of technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specified.

[0034] In the present application, unless otherwise explicitly specified and limited, the first feature is "on", "under" the second feature can be that the first feature is in direct contact with the second feature, or the first feature is indirectly in contact with the second feature through an intermediate medium. Moreover, the first feature is "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. The first feature is "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature.

[0035] Unless otherwise defined, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the specification of the present application includes any and all combinations of one or more related listed items.

[0036] The following will be described in conjunction with Figures 1-10 The backlight module with multiple heat dissipation components of the present application is described, which comprises: a light guide positioning plate 100, the surface of the light guide positioning plate 100 is fixedly connected with a rubber frame 200; a heat dissipation mechanism 300 is installed on the side of the light guide positioning plate 100 away from the rubber frame 200; wherein the heat dissipation mechanism 300 comprises a graphene temperature guide plate 340 fixedly connected to the side of the light guide positioning plate 100 away from the rubber frame 200, a plurality of heat exchange components 310 are installed on the other side of the graphene temperature guide plate 340, an air flow guide component 320 is arranged between adjacent heat exchange components 310, the surface of the air flow guide component 320 extends to the other side of the heat exchange component 310, and a cooling component 330 is fixedly connected to the side of the air flow guide component 320 away from the heat exchange component 310;

[0037] As shown in Figures 1-5 The heat exchange component 310 comprises two connection temperature guide plates 311 fixedly connected to the other side of the graphene temperature guide plate 340, the lower end of the connection temperature guide plate 311 is fixedly connected with a circular arc plate 313, a plurality of temperature guide guide frames 312 are fixedly connected to the opposite sides of the two connection temperature guide plates 311 respectively, adjacent temperature guide guide frames 312 are staggered, the lower end of the circular arc plate 313 is fixedly connected with a fixed temperature guide plate 314, the opposite sides of the two fixed temperature guide plates 314 close to the circular arc plate 313 are fixedly connected with inclined blocks 316 respectively, a temperature guide circular block 315 fixedly connected to the other side of the graphene temperature guide plate 340 is arranged in the interior of the two circular arc plates 313, the center of the temperature guide circular block 315 is located above the center of the circular arc plate 313, and adjacent temperature guide circular blocks 315 are staggered.

[0038] The temperature guide frame 312 includes a middle block 3121 between two connecting temperature guide sheets 311, the middle block 3121 is fixedly connected to the other side of the graphene temperature guide plate 340, the lower end of the middle block 3121 is fixedly connected with a lower block 3123, the vertical surface of the middle block 3121 is fixedly connected with two connecting strips 3122, the connecting strips 3122 are fixedly connected to the surface of the adjacent connecting temperature guide sheet 311, the lower end surface of the lower block 3123 is arc-shaped, the longitudinal section of the lower block 3123 is C-shaped, and the end of the lower block 3123 away from the middle block 3121 is hook-shaped;

[0039] When the device is in use, the fixed temperature guide sheet 314 is in communication with the liquid storage plate-shaped box 331 through the lower end connector 322, so that the liquid in the liquid storage plate-shaped box 331 can flow into the fixed temperature guide sheet 314, and the liquid in the fixed temperature guide sheet 314 moves upward into the inside of the arc plate 313, so that the liquid in the arc plate 313 exchanges heat with the temperature guide round block 315 cooperating with the arc plate 313, and flows to both sides under the action of the temperature guide round block 315 and the inclined block 316, and the distance between the surface of the temperature guide round block 315 and the inner wall of the arc plate 313 gradually decreases from bottom to top, so that the flow rate of the liquid entering the liquid flow channel is greater than that of the fixed temperature guide sheet 314, at this time, the two liquids are preliminarily mixed;

[0040] The two connecting temperature guide sheets 311 cooperate with the graphene temperature guide plate 340 and the temperature insulation hollow plate 321 to form a liquid flow channel, the liquid flows in the liquid flow channel while fully contacting the graphene temperature guide plate 340, and exchanges heat with the graphene temperature guide plate 340 while contacting, and carries away the heat generated by the light guide positioning plate 100, wherein the liquid contacts the temperature guide frame 312 alternately distributed while flowing, and assists in heat exchange. Since the liquid absorbs heat, the molecular thermal motion is intensified, the volume is increased, the mass is unchanged but the unit volume density is reduced, and the heated liquid moves upward;

[0041] At this time, the shape formed by the combination of the middle block 3121 and the lower block 3123 will make part of the liquid flow to the connecting strip 3122 and approach the adjacent connecting temperature guide sheet 311, and another part of the liquid moves upward at the hook part of the lower block 3123. Since the vertical surface of the middle block 3121 and the vertical surface of the connecting temperature guide sheet 311 heat part of the liquid together, the liquid flows faster at this part, another part of the liquid forms turbulent flow when passing through the hook part of the lower block 3123, and is temporarily stored in the concave part of the lower block 3123, and another part of the liquid has a larger flow cross section, so that the flow rate of another part of the liquid is relatively slow;

[0042] Due to the adhesion of the liquid, the rapidly rising liquid drives part of the turbulent flow to continue to move upwards, and the liquid continues to rise and contacts the adjacent temperature guide frame 312. Due to the opposite and staggered arrangement of the multiple adjacent temperature guide frames 312, the lower part of the liquid that is heated and moves upward at a faster speed will contact the hook part of the lower block 3123 and generate turbulent flow. The liquid is mixed at this position, and the flow rate is slowed down, so that the liquid as a whole has sufficient time for heat exchange, and the liquid as a whole is heated relatively uniformly. The liquid flow channel is in communication with the upper end of the liquid storage plate-shaped box 331 through the upper end connector 322, and the heated liquid flows back to the inside of the liquid storage plate-shaped box 331;

[0043] As shown in Figure 1 、 Figure 2 、 Figure 3 、 Figure 6 、 Figure 7 、 Figure 8 The air flow guide assembly 320 includes a temperature insulation hollow plate 321 fixedly connected to the side of the multiple heat exchange assemblies 310 away from the graphene temperature guide plate 340. The upper and lower ends of the temperature insulation hollow plate 321 are fixedly connected with the connectors 322, and the two sides of the connectors 322 are respectively in communication with the surfaces of the adjacent heat exchange assemblies 310 and the cooling assembly 330. The side of the temperature insulation hollow plate 321 close to the graphene temperature guide plate 340 is fixedly connected with multiple air flow guide frames 323, and the air flow guide frames 323 are located between the adjacent heat exchange assemblies 310. The air flow guide frame 323 includes a fixed plate 3231 fixedly connected to the surface of the temperature insulation hollow plate 321. The side of the fixed plate 3231 away from the temperature insulation hollow plate 321 is fixedly connected with two positioning and fastening frames 3233 at the lower end. The two positioning and fastening frames 3233 are fixedly connected with two first piezoelectric ceramics 3234 therebetween. The first piezoelectric ceramics 3234 are arranged in parallel with the fixed plate 3231. A Mylar sheet 3235 is arranged between the two first piezoelectric ceramics 3234. The upper end of the Mylar sheet 3235 penetrates to the upper side of the first piezoelectric ceramic 3234 and is fixedly connected with a flexible plastic film 3236. The upper sides of the two positioning and fastening frames 3233 are both provided with a flow guide block 3232 fixedly connected to the surface of the fixed plate 3231. The two flow guide blocks 3232 are staggered arranged.

[0044] The temperature insulation hollow plate 321 is made of plastic and has the effect of temperature insulation. The connecting heads 322 at the upper and lower ends of the temperature insulation hollow plate 321 can make the liquid in the liquid flow channel of the heat exchange assembly 310 and the liquid in the liquid storage plate-shaped box 331 flow smoothly. The combination of the graphene temperature guide plate 340 and the temperature insulation hollow plate 321 forms an air flow channel between the two heat exchange assemblies 310. The first piezoelectric ceramic 3234 is energized to periodically generate vibration to drive the Mylar sheet 3235 to swing. The swinging direction is perpendicular to the other side of the graphene temperature guide plate 340. At this time, the air flow flows from the direction of the positioning and fastening frame 3233 to the direction of the flexible plastic film 3236 when the Mylar sheet 3235 swings. When the flexible plastic film 3236 swings to the other side, the air flow flows to the guide block 3232 under the guidance of the fixed plate 3231. Under the action of the guide block 3232, the air flow flows to the surface of the graphene temperature guide plate 340 again, taking away the heat on the surface of the graphene temperature guide plate 340. Since the flowing direction of the air flow is at an acute angle to the surface of the graphene temperature guide plate 340 when the flexible plastic film 3236 swings, the heat on the surface of the graphene temperature guide plate 340 can be more fully taken away, thereby improving the efficiency of heat dissipation.

[0045] As shown in Figure 1 , Figure 2 , Figure 3 , Figure 8 , Figure 9 , Figure 10 The cooling assembly 330 includes a liquid storage plate-shaped box 331 fixedly connected to the temperature insulation hollow plate 321 away from the heat exchange assembly 310. The inner wall of the liquid storage plate-shaped box 331 is fixedly connected with a plurality of plate-shaped heat pipes 333. The upper end plate-shaped heat pipe 333 and the lower end plate-shaped heat pipe 333 are provided with a water stop plug 332 fixedly connected to the inner wall of the liquid storage plate-shaped box 331. The surface of the plate-shaped heat pipe 333 penetrates to the other side of the liquid storage plate-shaped box 331. The adjacent plate-shaped heat pipes 333 are fixedly connected with a connecting fastening frame 334. The inner wall of the connecting fastening frame 334 is fixedly connected with two second piezoelectric ceramics 335. The second piezoelectric ceramics 335 are perpendicular to the other side of the liquid storage plate-shaped box 331. A plastic sheet 336 is arranged between the two second piezoelectric ceramics 335. The water stop plug 332 includes a plurality of arc-shaped metal frames 3321 fixedly connected to the inner wall of the liquid storage plate-shaped box 331. The plurality of arc-shaped metal frames 3321 are horizontally distributed along the inner wall of the liquid storage plate-shaped box 331. The surface of the arc-shaped metal frame 3321 is provided with a flexible soft rubber film 3322. The lower end of the flexible soft rubber film 3322 is wavy.

[0046] The device forms temporary storage for fluid through the liquid storage plate-shaped box 331, and the shape and position of the flexible soft rubber film 3322 are positioned through the arc-shaped metal frame 3321 under the action of the water stop plug 332, and since the flexible soft rubber film 3322 is made of a silicon rubber material that is easy to deform, when the liquid in the liquid storage plate-shaped box 331 flows downward, the deformation of the flexible soft rubber film 3322 causes the liquid to flow to the lower side of the flexible soft rubber film 3322, and since the longitudinal section of the arc-shaped metal frame 3321 is convex parabolic, the liquid in the liquid storage plate-shaped box 331 can be moved upward to contact the flexible soft rubber film 3322, so that the flexible soft rubber film 3322 forms a skin bowl piston effect in the liquid storage plate-shaped box 331.

[0047] The plate-shaped heat pipe 333 can form an auxiliary heat dissipation effect for the liquid in the liquid storage plate-shaped box 331, so that the liquid in the liquid storage plate-shaped box 331 gradually cools and dissipates, the second piezoelectric ceramic 335 is positioned by the connecting fastening frame 334, so that when the second piezoelectric ceramic 335 is powered, it drives the plastic sheet 336 to swing to the plate-shaped heat pipe 333 on both sides to produce air flow, so that the air flow carries away the surface temperature of the plate-shaped heat pipe 333, and auxiliary cooling effect is formed on the plate-shaped heat pipe 333.

[0048] In use, the fixed temperature guide sheet 314 is connected to the liquid storage plate-shaped box 331 through the lower end connector 322, and the liquid in the liquid storage plate-shaped box 331 flows into the fixed temperature guide sheet 314, and the liquid moves upward into the inside of the circular arc plate 313 through the fixed temperature guide sheet 314, after the liquid enters the inside of the circular arc plate 313, the temperature guide circular block 315 cooperates with the circular arc plate 313 to exchange heat with the liquid, the two connecting temperature guide sheets 311 cooperate with the graphene temperature guide plate 340 and the temperature insulation hollow plate 321 to form a liquid flow channel, the liquid in the liquid flow channel is in full contact with the graphene temperature guide plate 340, and the heat generated by the light guide positioning plate 100 is carried away in the heat exchange, and the liquid flows in contact with the alternating temperature guide guide frame 312, which assists in heat exchange; the plate-shaped heat pipe 333 forms an auxiliary heat dissipation effect for the liquid in the liquid storage plate-shaped box 331, the liquid in the liquid storage plate-shaped box 331 gradually cools and dissipates, the second piezoelectric ceramic 335 is positioned by the connecting fastening frame 334, the second piezoelectric ceramic 335 drives the plastic sheet 336 to swing to the plate-shaped heat pipe 333 on both sides to produce air flow, the air flow carries away the surface temperature of the plate-shaped heat pipe 333, and auxiliary cooling effect is formed on the plate-shaped heat pipe 333;

[0049] The graphene temperature conducting plate 340 and the temperature insulation hollow plate 321 are combined to form an air flow channel between the two heat exchange assemblies 310. The first piezoelectric ceramic 3234 periodically vibrates to drive the Mylar sheet 3235 to swing. The swinging direction is perpendicular to the other side of the graphene temperature conducting plate 340. When the Mylar sheet 3235 swings, the air flow flows from the direction of the positioning and fastening frame 3233 to the direction of the flexible plastic film 3236. When the flexible plastic film 3236 swings to the graphene temperature conducting plate 340, the air flow is generated to impact the surface of the graphene temperature conducting plate 340. When the flexible plastic film 3236 swings to the other side, the air flow is guided by the guide block 3232 to flow to the surface of the graphene temperature conducting plate 340 again, thereby improving the heat dissipation efficiency.

[0050] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not contradict, they should be considered within the scope of the present disclosure.

[0051] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be pointed out that, for those skilled in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A backlight module with multiple heat dissipation components, characterized in that, include: A light guide positioning plate (100) is fixedly connected to a frame (200) on its surface. A heat dissipation mechanism (300) is installed on the side of the light guide positioning plate (100) away from the frame (200); The heat dissipation mechanism (300) includes a graphene heat-conducting plate (340) fixedly connected to the side of the light guide positioning plate (100) away from the frame (200). Multiple heat exchange components (310) are installed on the other side of the graphene heat-conducting plate (340). An airflow guiding component (320) is provided between adjacent heat exchange components (310). The surface of the airflow guiding component (320) extends to the other side of the heat exchange component (310). A cooling component (330) is fixedly connected to the side of the airflow guiding component (320) away from the heat exchange component (310). The heat exchange assembly (310) includes two connecting heat-conducting plates (311) fixedly connected to the other side of the graphene heat-conducting plate (340). The lower end of the connecting heat-conducting plate (311) is fixedly connected to an arc plate (313). The opposite surfaces of the two connecting heat-conducting plates (311) are respectively fixedly connected to multiple heat-conducting guide frames (312), and the adjacent heat-conducting guide frames (312) are staggered. The lower end of the arc plate (313) is fixedly connected to a fixed temperature-conducting plate (314). Two fixed temperature-conducting plates (314) are respectively fixedly connected to inclined blocks (316) on opposite sides of the arc plate (313). Inside the two arc plates (313), there are temperature-conducting circular blocks (315) fixedly connected to the other side of the graphene temperature-conducting plate (340). The center of the temperature-conducting circular blocks (315) is located above the center of the arc plate (313), and adjacent temperature-conducting circular blocks (315) are staggered. The temperature-conducting guide frame (312) includes a middle block (3121) located between two connecting temperature-conducting plates (311). The middle block (3121) is fixedly connected to the other side of the graphene temperature-conducting plate (340). A lower block (3123) is fixedly connected to the lower end of the middle block (3121). Two connecting strips (3122) are fixedly connected to the vertical surface of the middle block (3121). The connecting strips (3122) are fixedly connected to the surface of the adjacent connecting temperature-conducting plates (311). The airflow guiding component (320) includes a heat-insulating hollow plate (321) fixedly connected to the side of multiple heat exchange components (310) away from the graphene heat-conducting plate (340). The upper and lower ends of the heat-insulating hollow plate (321) are fixedly connected to connectors (322). The two sides of the connectors (322) are respectively connected to the surfaces of the adjacent heat exchange components (310) and cooling components (330). Multiple airflow guiding frames (323) are fixedly connected to the side of the heat-insulating hollow plate (321) near the graphene heat-conducting plate (340). The airflow guiding frames (323) are located between adjacent heat exchange components (310). The cooling component (330) includes a liquid storage plate box (331) fixedly connected to the side of the heat insulation hollow plate (321) away from the heat exchange component (310). The inner wall of the liquid storage plate box (331) is fixedly connected with a plurality of plate heat pipes (333). A water-proof plug (332) fixedly connected to the inner wall of the liquid storage plate box (331) is provided between the upper plate heat pipe (333) and the lower plate heat pipe (333). The surface of the plate heat pipe (333) extends to the other side of the liquid storage plate box (331).

2. The backlight module with multiple heat dissipation components according to claim 1, characterized in that, The airflow guide frame (323) includes a fixing plate (3231) fixedly connected to the surface of the heat-insulating hollow plate (321). Two positioning fasteners (3233) are fixedly connected to the lower end of the side of the fixing plate (3231) away from the heat-insulating hollow plate (321). Two first piezoelectric ceramics (3234) are fixedly connected between the two positioning fasteners (3233). The first piezoelectric ceramics (3234) are arranged parallel to the fixing plate (3231). A Mylar sheet (3235) is arranged between the two first piezoelectric ceramics (3234). The upper end of the Mylar sheet (3235) extends through to the top of the first piezoelectric ceramics (3234) and is fixedly connected to a flexible plastic film (3236).

3. The backlight module with multiple heat dissipation components according to claim 1, characterized in that, The lower end face of the lower block (3123) is arc-shaped, the longitudinal section of the lower block (3123) is C-shaped, and the end of the lower block (3123) away from the middle block (3121) is hook-shaped.

4. The backlight module with multiple heat dissipation components according to claim 2, characterized in that, Each of the two positioning fasteners (3233) is provided with a flow guide protrusion (3232) fixedly connected to the surface of the fixed plate (3231), and the two flow guide protrusions (3232) are staggered.

5. The backlight module with multiple heat dissipation components according to claim 1, characterized in that, A connecting fastener (334) is fixedly connected between adjacent plate heat pipes (333). Two second piezoelectric ceramics (335) are fixedly connected to the inner wall of the connecting fastener (334). The second piezoelectric ceramics (335) are perpendicular to the other side of the liquid storage plate box (331). A plastic sheet (336) is provided between the two second piezoelectric ceramics (335).

6. The backlight module with multiple heat dissipation components according to claim 5, characterized in that, The water-blocking plug (332) includes multiple arc-shaped metal frames (3321) fixedly connected to the inner wall of the liquid storage plate box (331). The multiple arc-shaped metal frames (3321) are horizontally distributed along the inner wall of the liquid storage plate box (331). A flexible soft rubber film (3322) is provided on the surface of the arc-shaped metal frame (3321), and the lower end of the flexible soft rubber film (3322) is wavy.

Citation Information

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