Multi-software collaborative loudspeaker design simulation method

Through the multi-software collaborative design method, combined with graphic design, circuit simulation, COMSOL and STEPPING software, the speaker design process is optimized, and the speaker design cycle is solved, and the speaker design cycle is long and the adjustment is frequently adjusted, achieving efficient simulation testing and sound quality restoration.

CN120597445APending Publication Date: 2025-09-05DONGGUAN RUIDA ACOUSTIC TECH CO LTD
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Patent Information

Application Number
CN202510703122.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-29
Publication Date
2025-09-05

AI Technical Summary

Technical Problem

The existing speaker design cycle is long, the structural design and circuit design need to be continuously adjusted, the production progress is affected, and the lack of a complete simulation model has led to the extension of the production cycle.

Method used

Multi-software collaborative design methods are adopted, including graphic design software, circuit simulation design software, COMSOL software and STEPPING software. Through multi-software collaborative design, the simulation and simulation of the speaker structure and circuit are realized, and the design process is optimized.

Benefits of technology

It simplifies the simulation test steps, shortens the design cycle, improves test accuracy and production efficiency, reduces the physical adjustment time, and improves the sound quality restoration effect of the speaker.

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Abstract

The invention discloses a multi-software collaborative loudspeaker design simulation method, which comprises graphic design software and circuit simulation software, and is characterized in that the graphic design software is used for designing a loudspeaker structure, and the loudspeaker structure comprises a first structure and a second structure; the first structure comprises a structure between the voice coil and the diaphragm; the second structure comprises a structure between a voice coil and a magnetic circuit, the circuit simulation design software is used for designing a circuit structure of the loudspeaker, internal reference data of a circuit are obtained through the circuit structure, and the internal reference data are used for obtaining mechanical data of the loudspeaker. Multi-software collaborative design is adopted, graphic design software, circuit simulation design software, COMSOL software and STEPPING software are included, parameters of a first structure and a second structure are adjusted according to amplitude curve data, the first structure and the second structure in design points serve as two modules to be designed and tested, the steps of simulation testing are effectively simplified, and the simulation testing efficiency is improved. Therefore, the time is effectively saved, and the testing precision of the loudspeaker is improved at the same time.
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Description

Technical Field

[0001] The present invention relates to the field of loudspeaker simulation systems, and in particular to a multi-software collaborative loudspeaker design simulation method. Background Art

[0002] A speaker is a transducer device that converts electrical signals into acoustic signals. Its performance significantly impacts sound quality. While the speaker is the weakest component in audio equipment, it is also the most crucial component for sound quality. There are many different types of speakers, and their prices vary widely. Audio electrical energy, through electromagnetic, piezoelectric, or electrostatic effects, causes the cone or diaphragm to vibrate, resonating with the surrounding air and producing sound.

[0003] The main points involved in a speaker are as follows:

[0004] 1. Structural design, including the magnetic circuit structure and the sound membrane structure;

[0005] 2. Circuit design, where the circuit design is a conversion unit. Through the coordination of magnetic circuit design and circuit design, it is determined whether the sound quality conversion of the speaker meets the predetermined requirements.

[0006] However, the existing design approach generally involves first designing the magnetic circuit structure and the diaphragm structure to obtain the magnetic field distribution, and then designing the circuit based on the magnetic field distribution and the diaphragm structure. For example, whether the resistor or capacitor design needs to be increased or decreased, but there is currently no complete system to implement a simulated model of the speaker. Therefore, the speaker design cycle is long, and the adjustment plan needs to be constantly changed or iterated to achieve good sound quality.

[0007] At the same time, the structural design and circuit design need to be constantly adjusted, which in turn affects the production progress. The corresponding production cycle will also increase accordingly, and each product needs to be modified one by one according to the structural design and circuit design.

[0008] For example, China's authorized invention patent 202210110283.X uses CATIA software to achieve parametric modeling of speaker masks. However, its modeling parameters are relatively simple and cannot be applied to overall testing. Summary of the Invention

[0009] The main purpose of the present invention is to propose a multi-software collaborative loudspeaker design simulation method, aiming to adopt the existing multi-software collaborative design to realize the production of loudspeakers.

[0010] To achieve the above objectives, the present invention proposes a multi-software collaborative loudspeaker design simulation method, comprising:

[0011] Graphic design software, wherein the graphic design software is used to design a speaker structure, wherein the speaker structure includes a first structure and a second structure;

[0012] The first structure includes a structure between the voice coil and the diaphragm;

[0013] The second structure includes a structure between the voice coil and the magnetic circuit;

[0014] Circuit simulation design software, which is used to design the circuit structure of the speaker and obtain the circuit's internal parameter data through the circuit structure. The internal parameter data is used to obtain the speaker's mechanical data;

[0015] In the design step,

[0016] S1: In the circuit simulation design software, a simulation speaker circuit model is established;

[0017] The loudspeaker circuit model includes internal parameter data of the circuit, mechanical data of the sound device and acoustic data of the loudspeaker;

[0018] S2: completing a 3D structural design of the speaker in a graphic design software, wherein the 3D structural design includes the first structure and the second structure;

[0019] S3: In COMSOL software, obtain COMSOL-CMS displacement curve data according to the simulation of the first structure in the 3D structure and obtain COMSOL-BL displacement curve data for the second structure;

[0020] S4: Send the data of the loudspeaker circuit model, COMSOL-BL displacement curve data and COMSOL-BL displacement curve data to STEPPING software simulation to obtain simulation data.

[0021] The simulation data is used to obtain SPL curve data, amplitude data and impedance curve data of the simulated loudspeaker,

[0022] And adjust the BL value, CMS value and voltage value through STEPPING software simulation;

[0023] According to the STEPPING software, the amplitude curve data of the simulated speaker is obtained.

[0024] The parameter data of the first structure or the second structure is adjusted according to the amplitude curve data of the speaker.

[0025] In the actual design, multi-software collaborative design was adopted, including graphic design software, circuit simulation design software, COMSOL software and STEPPING software;

[0026] Among them, graphic design software and circuit simulation design software are the basic design.

[0027] By storing the original basic design parameters, and manually or by computer (of course, the existing software of this type has its own storage of relevant data), measuring and storing COMSOL-CMS displacement curve data, COMSOL-BL displacement curve data, speaker SPL curve data, amplitude data and impedance curve data,

[0028] The actual data can be adjusted or changed according to the material or different applicability of the product, thereby obtaining different product parameters.

[0029] And obtain the simulation test data of the speaker through COMSOL software and STEPPING software,

[0030] Then, the parameters of the first structure and the second structure are adjusted according to the amplitude curve data.

[0031] That is, Creo solves the structural module design of the speaker;

[0032] COMSOL software solves the magnetic circuit and diaphragm design modules and obtains predetermined parameter data through structural design;

[0033] Microcap solves the acoustic output and amplitude design module, and then obtains whether the predetermined standard value can be achieved between the acoustic device structure and the speaker circuit structure.

[0034] The design method of the present invention has a simple structural logic and the software is an existing technology. By modularizing the design of each software, it effectively solves the difficulties and pain points of existing speaker simulation testing and design, and is a better design model in the industry.

[0035] Of course, specific model design software and testing software can also be replaced or substituted by other existing software or partially adjusted to obtain a more simplified process or comparison. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 Design a method flow chart for this application;

[0037] Figure 2 Design drawings for Croe 3D;

[0038] Figure 3 Import creo 3D calculation into comsol software to obtain BL-X curve;

[0039] Figure 4 Import creo 3D calculations into comso to obtain CMS-X curves;

[0040] Figure 5 Electro-mechanical-acoustic model for Microcap simulation software;

[0041] Figure 6 Calculate CMS value, U value and BL value using STEPPING software for Microcap simulation software;

[0042] Figure 7 Calculate the simulated SPL value for Microcap using STEPPING software;

[0043] Figure 8 Use STEPPING software to calculate the simulated amplitude value for Microcap simulation;

[0044] Figure 9 The simulated impedance curve value is calculated using STEPPING software for Microcap simulation. DETAILED DESCRIPTION

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0046] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial...), then the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0047] In addition, if there are descriptions involving "first" or "second" in the embodiments of the present invention, the descriptions of "first" or "second" are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0048] like Figures 1 to 9 As shown, a multi-software collaborative loudspeaker design simulation method includes:

[0049] Graphic design software, wherein the graphic design software is used to design a speaker structure, wherein the speaker structure includes a first structure and a second structure;

[0050] The first structure includes a structure between the voice coil and the diaphragm;

[0051] The second structure includes a structure between the voice coil and the magnetic circuit;

[0052] Circuit simulation design software, which is used to design the circuit structure of the speaker and obtain the circuit's internal parameter data through the circuit structure. The internal parameter data is used to obtain the speaker's mechanical data;

[0053] In the design step,

[0054] S1: In the circuit simulation design software, a simulation speaker circuit model is established;

[0055] The loudspeaker circuit model includes internal parameter data of the circuit, mechanical data of the sound device and acoustic data of the loudspeaker;

[0056] S2: completing a 3D structural design of the speaker in a graphic design software, wherein the 3D structural design includes the first structure and the second structure;

[0057] S3: In COMSOL software, obtain COMSOL-CMS displacement curve data according to the simulation of the first structure in the 3D structure and obtain COMSOL-BL displacement curve data for the second structure;

[0058] S4: Send the data of the loudspeaker circuit model, COMSOL-BL displacement curve data and COMSOL-BL displacement curve data to STEPPING software simulation to obtain simulation data.

[0059] The simulation data is used to obtain SPL curve data, amplitude data and impedance curve data of the simulated loudspeaker,

[0060] And adjust the BL value, CMS value and voltage value through STEPPING software simulation;

[0061] According to the STEPPING software, the amplitude curve data of the simulated speaker is obtained.

[0062] The parameter data of the first structure or the second structure is adjusted according to the amplitude curve data of the speaker.

[0063] (In the actual design, multi-software collaborative design was adopted, including graphic design software, circuit simulation design software, COMSOL software and STEPPING software;

[0064] Among them, graphic design software and circuit simulation design software are the basic design.

[0065] By storing the original basic design parameters, and manually or by computer (of course, the existing software of this type has its own storage of relevant data), measuring and storing COMSOL-CMS displacement curve data, COMSOL-BL displacement curve data, speaker SPL curve data, amplitude data and impedance curve data,

[0066] The actual data can be adjusted or changed according to the material or different applicability of the product, thereby obtaining different product parameters.

[0067] And obtain the simulation test data of the speaker through COMSOL software and STEPPING software,

[0068] Then, the parameters of the first structure and the second structure are adjusted according to the amplitude curve data. In the design point, the first structure and the second structure are designed and tested as two modules, which effectively simplifies the steps of the simulation test, effectively saves time, and also improves the test accuracy of the speaker.

[0069] That is, Creo solves the structural module design of the speaker;

[0070] COMSOL software solves the magnetic circuit and diaphragm design modules and obtains predetermined parameter data through structural design;

[0071] Microcap solves the acoustic output and amplitude design module, and then obtains whether the predetermined standard value can be achieved between the acoustic device structure and the speaker circuit structure.

[0072] Specifically, the diaphragm parameter data includes curvature, thickness, and material, and the amplitude or amplitude of the diaphragm is obtained based on the curvature, thickness, and / or material of the diaphragm;

[0073] The voice coil parameter data includes material, thickness, and width, and COMSOL-CMS displacement curve data of the first structure is obtained according to the material, thickness, and width of the voice coil;

[0074] The magnetic circuit parameter data includes magnet thickness, washer thickness, and magnetic circuit gap, and the magnetic flux and magnetic field direction data are obtained according to the magnetic circuit.

[0075] The COMSOL-BL displacement curve data of the voice coil is obtained through the magnet thickness, washer thickness, and magnetic circuit gap.

[0076] In actual design, the speaker includes a voice coil, a diaphragm and a magnetic circuit assembly. When the voice coil is energized, the magnetic flux between the voice coil and the magnetic circuit assembly is tangent, thereby driving the vibration of the diaphragm, and then obtaining the predetermined displacement data curve through COMSOL.

[0077] Specifically, the graphic design software is Croe 3D Design,

[0078] The circuit simulation design software is a Microcap simulation model.

[0079] Of course, the specific graphic design software can also be SOLIWORKS software.

[0080] Among them, Croe 3D design, Microcap simulation model, COMSOL software and STEPPING software are all existing designs. Through the existing software and the model design provided by the software, simulation design is realized.

[0081] This reduces the problem of adjustments after physical production.

[0082] It can reduce the demoulding time and adjustment time.

[0083] Of course, in actual production, there will be errors or deviations between the simulation design and the actual design, such as production process deviation or material deviation.

[0084] Then when deviations occur during the production process, the data causing the deviations can be input into COMSOL software and STEPPING software.

[0085] This improves the accuracy of the simulation design and the consistency between the physical object and the simulation design model.

[0086] Of course, specifically, when the speaker structure or the speaker circuit structure is different, there will be deviations between the two, and the data obtained by COMSOL software and STEPPING software will also have deviations.

[0087] Specifically, the COMSOL software and the STEPPING software are respectively provided with a first database and a second database.

[0088] The first database is used to store a first parameter value between the first structure and COMSOL-CMS displacement curve data;

[0089] The first database is used to store a second parameter value between the second structure and COMSOL-BL displacement curve data.

[0090] Specifically, the first parameter value and the second parameter value are a curve ratio or a fixed ratio. In the actual acoustic field, the ratio of acoustic changes generally presents a curve value. Depending on different materials or different designs, the locations of the peaks and troughs of the ratio are also different.

[0091] When there are uncertainties in software operations, adjustments can also be made based on the technicians' experience or test data.

[0092] Specifically, when the speaker structure includes a coaxial speaker, a tweeter, a woofer, or a high- and low-frequency speaker;

[0093] After the speaker passes through the graphic design software, circuit simulation design software, COMSOL software and STEPPING software to obtain the first simulation data,

[0094] After the speaker is physically produced, the speaker obtains corresponding actual data and first test data.

[0095] The second simulation data is compared with the second test data, and a second difference is obtained. (Different speakers may have significantly different parameters, such as the thickness or magnetic flux of the voice coil, and the layers of the magnetic circuit structure (e.g., multiple center magnets or multiple ring magnets).

[0096] Then the sound quality or high and low frequencies of the speaker are determined by the different magnet arrangements, voice coil thickness, diaphragm curvature, degree of curvature, or number of curved surfaces.

[0097] The speaker structure is a micro speaker, which is applied to headphones or small electronic devices.

[0098] Specifically, the speaker is circular or elliptical in shape.

[0099] After the speaker passes through the graphic design software, circuit simulation design software, COMSOL software and STEPPING software to obtain the second simulation data,

[0100] After the speaker is physically produced, the speaker obtains corresponding actual data and second test data.

[0101] The second simulation data is compared with the second test data to obtain a second difference. (In different shapes, the parameter values ​​will also change accordingly. Depending on the shape, data can be stored in the first or multiple tests, and then continuously updated and iterated to reduce the deviation between the test data and the simulation data.

[0102] The simulation data can obtain the simulation frequency response curve;

[0103] The test data can obtain the test frequency response curve,

[0104] The frequency response curve can be understood as the current in the output band. When the voice coil is tangent to the magnetic circuit, the vibration frequency should be consistent with or the same as the output band of the current, or the curvature should be similar, so as to maximize the restoration of the sound quality.

[0105] However, in actual use or production, adjustments can be made based on the speaker simulation data.

[0106] Under certain circumstances, the magnetic flux direction, material elasticity and voice coil impedance are fixed values. Changes in the values, including cavity sealing, material changes, hole position changes, width or height changes, will all cause changes or deviations in the actual product.

[0107] Therefore, when deviations occur in the actual product, the process or material can be adjusted based on the data.

[0108] like Figure 7 As shown, the Microcap simulation model uses the dynamic parameter values ​​of CMS value, U value and BL value of STEPPING software to calculate the simulated SPL value.

[0109] like Figure 8 As shown, the Microcap simulation model uses the dynamic parameter values ​​of the CMS value, U value and BL value of the STEPPING software to calculate the simulated amplitude value of the speaker.

[0110] like Figure 9 As shown, the Microcap simulation model uses the dynamic parameter values ​​of CMS value, U value and BL value of STEPPING software to calculate the simulated impedance curve of the speaker.

[0111] Specifically, simulation values ​​are obtained based on the design requirements of FO, SPL, and amplitude; the 3D structure design, voice coil design parameters, and diaphragm parameters are determined.

[0112] Among them, cms value, u value and bl value;

[0113] 1. CMS Value

[0114] The CMS value, or equivalent diaphragm mass, is the total mass of the diaphragm, including the air load, minus the air load mass. The CMS value is measured by adding a known mass to the diaphragm and measuring the new resonant frequency. This method allows the equivalent mass of the diaphragm to be calculated.

[0115] 2. U Value

[0116] The U-value, or force impedance, is the complex ratio of the force acting on a point in a mechanical system to the velocity at that point. The U-value describes the damping of a vibration system and corresponds to resistance in an electrical system.

[0117] 3.BL Value

[0118] The BL value, or electromagnetic coupling coefficient, is calculated by calculating the force required to restore the diaphragm to its original position. When mass is added to the diaphragm, a downward displacement occurs, and a stable force is required to restore the diaphragm to its original position. The BL value can be calculated using the equilibrium condition: BLI = m'g. The above is only a preferred embodiment of the present invention and does not limit the scope of the patent of the present invention. All equivalent structural transformations made using the contents of the present invention's specification and drawings, or direct / indirect applications in other related technical fields under the inventive concept of the present invention are included in the scope of patent protection of the present invention.

Claims

1. A multi-software collaborative loudspeaker design simulation method, characterized in that: include: Graphic design software, wherein the graphic design software is used to design a speaker structure, wherein the speaker structure includes a first structure and a second structure; The first structure includes a structure between the voice coil and the diaphragm; The second structure includes a structure between the voice coil and the magnetic circuit; Circuit simulation design software, which is used to design the circuit structure of the speaker and obtain the circuit's internal parameter data through the circuit structure. The internal parameter data is used to obtain the speaker's mechanical data; In the design step, S1: In the circuit simulation design software, a simulation speaker circuit model is established; The loudspeaker circuit model includes internal parameter data of the circuit, mechanical data of the sound device and acoustic data of the loudspeaker; S2: completing a 3D structural design of the speaker in a graphic design software, wherein the 3D structural design includes the first structure and the second structure; S3: In COMSOL software, obtain COMSOL-CMS displacement curve data according to the simulation of the first structure in the 3D structure and obtain COMSOL-BL displacement curve data for the second structure; S4: Send the data of the loudspeaker circuit model, COMSOL-BL displacement curve data and COMSOL-BL displacement curve data to STEPPING software simulation to obtain simulation data. The simulation data is used to obtain SPL curve data, amplitude data and impedance curve data of the simulated loudspeaker, And adjust the BL value, CMS value and voltage value through STEPPING software simulation; According to the STEPPING software, the amplitude curve data of the simulated speaker is obtained. The parameter data of the first structure or the second structure is adjusted according to the amplitude curve data of the speaker.

2. The multi-software collaborative loudspeaker design simulation method according to claim 1, wherein: The diaphragm parameter data includes curvature, thickness, and material, and the amplitude or amplitude of the diaphragm is obtained based on the curvature, thickness, and / or material of the diaphragm; The voice coil parameter data includes material, thickness, and width, and COMSOL-CMS displacement curve data of the first structure is obtained according to the material, thickness, and width of the voice coil; The magnetic circuit parameter data includes magnet thickness, washer thickness, and magnetic circuit gap, and the magnetic flux and magnetic field direction data are obtained according to the magnetic circuit. The COMSOL-BL displacement curve data of the voice coil is obtained through the magnet thickness, washer thickness, and magnetic circuit gap.

3. The multi-software collaborative loudspeaker design simulation method according to claim 1, wherein: The graphic design software is Croe 3D Design, The circuit simulation design software is a Microcap simulation model.

4. The multi-software collaborative loudspeaker design simulation method according to claim 1, wherein: The COMSOL software and the STEPPING software are respectively provided with a first database and a second database. The first database is used to store a first parameter value between the first structure and COMSOL-CMS displacement curve data; The first database is used to store a second parameter value between the second structure and COMSOL-BL displacement curve data.

5. The multi-software collaborative loudspeaker design simulation method according to claim 4, wherein: The first parameter value and the second parameter value are a curve ratio or a fixed ratio.

6. The multi-software collaborative loudspeaker design simulation method according to claim 1, wherein: When the speaker structure includes a coaxial speaker, a tweeter, a woofer, or a high and low frequency speaker; After the speaker passes through the graphic design software, circuit simulation design software, COMSOL software and STEPPING software to obtain the first simulation data, After the speaker is physically produced, the speaker obtains corresponding actual data and first test data. Comparing the first simulation data with the first test data and obtaining a second difference; The speaker structure is a micro speaker, which is applied to headphones or small electronic devices.

7. The multi-software collaborative loudspeaker design simulation method according to claim 1, wherein: The speaker is circular or elliptical in shape, After the speaker passes through the graphic design software, circuit simulation design software, COMSOL software and STEPPING software to obtain the second simulation data, After the speaker is physically produced, the speaker obtains corresponding actual data and second test data. The second simulation data is compared with the second test data to obtain a second difference.

8. The multi-software collaborative loudspeaker design simulation method according to claim 3, wherein: The Microcap simulation model calculates the simulated SPL value using the dynamic parameter values ​​of the CMS value, U value and BL value of the STEPPING software.

9. The multi-software collaborative loudspeaker design simulation method according to claim 3, wherein: The Microcap simulation model uses the dynamic parameter values ​​of the CMS value, U value and BL value of the STEPPING software to calculate the simulated amplitude value of the speaker.

10. The multi-software collaborative loudspeaker design simulation method according to claim 3, wherein: The Microcap simulation model uses the dynamic parameter values ​​of CMS value, U value and BL value of STEPPING software to calculate the simulated impedance curve of the speaker.

Citation Information

Patent Citations

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