Hot transfer RFID tag using method and hot transfer RFID tag
By using a film substrate instead of a paper substrate and peeling off the release layer, the bulge problem of paper RFID tags is solved, the flatness and reliability of the tags are improved, and the installation accuracy and production efficiency are enhanced.
Patent Information
- Application Number
- CN202510717708.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-30
- Publication Date
- 2025-09-05
AI Technical Summary
Existing paper RFID hot stamping labels contain a paper base layer, which has a raised surface and a strong feel, affecting the fit between the label and the surface of the attached object, limiting its use in scenarios where high flatness requirements are required.
A film substrate is used instead of a paper substrate, and the release layer is peeled off after the label is transferred and installed, leaving the release layer, functional layer and glue layer, reducing the protrusion of the label on the attached object, providing a positioning function through the electric eye recognition mark, and improving the installation accuracy and stability.
It improves the flatness of the surface of the attached object and the reliability of the label, reduces the risk of damage to the chip or antenna during transportation and storage, and improves production efficiency and yield.
Smart Images
Figure CN120597920A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of label production, and in particular to a method for using an iron-on transfer RFID label and a label. Background Art
[0002] With the development of the Internet of Things (IoT), paper RFID hot-stamp labels, thanks to their low cost and printability, have gained widespread application in areas such as library management, product traceability, and logistics packaging. Existing technologies typically use a paper substrate as the antenna substrate. One side of the paper substrate is printed with a variable or fixed barcode, logo, or other information. The other side is then printed to form the electronic tag antenna surface. This is then laminated and compacted with a PET film coated with a barrier layer to create the antenna. A chip is then bonded to the laminated antenna to create the electronic tag inlay layer. After applying adhesive film to the inlay surface, the finished product is die-cut and rolled. However, the paper-based RFID hot-stamped labels produced by the aforementioned production method exhibit noticeable ridges on their surface, which provide a noticeable convex feel. These ridges also affect the label's adherence to the surface of the object being attached, limiting its use in applications requiring high flatness. Improvements to existing production methods are urgently needed to address these issues. Summary of the Invention
[0003] In order to improve the flatness of the surface of the attached object, the purpose of this application is to provide a method for using an iron-on transfer RFID tag and a tag.
[0004] The present application provides a method for using a heat transfer RFID tag and the tag adopts the following technical solutions: A method for using a heat transfer RFID tag includes the following steps: Get the tag; where: obtaining a film substrate; Setting the release layer: printing the release layer on the film substrate and curing the release layer; Setting the functional layer: screen-printing the conductive silver paste antenna on the cured release layer and binding the RFID chip, printing the chip protection oil, and covering the RFID chip with the chip protection oil; Setting the glue layer: Print hot melt glue on the functional layer, and the hot melt glue dries to form a glue layer; Installation label; where: Positioning label: positioning the label at the target location of the attached object; Lamination label: The label is heated to restore the adhesive layer to its original viscosity, and the label is attached to the attached item. The heated release layer softens and the film substrate is separated from the release layer.
[0005] By adopting the above technical solution, since the thickness of the paper substrate in the traditional label accounts for the vast majority of the thickness of the label, the present application uses a film substrate instead of the traditional paper substrate, and peels off the release layer after the label is hot-transferred and installed, so that the label remaining on the attached object is only the release layer, functional layer and glue layer, which greatly reduces the protrusion of the label on the attached object and makes the surface flatness of the attached object better.
[0006] In actual applications, the raised tags are prone to damage to the chip or antenna due to friction and compression during transportation and storage, reducing the reliability of the tag. Therefore, the tag of the present application can effectively improve the reliability of the tag by reducing the raised tags.
[0007] Optionally, the step of providing the functional layer further includes: printing an electric eye identification mark on the cured release layer.
[0008] By adopting the above technical solution, the electric eye recognition tag exists, and the rear label is installed on the attached object. The electric eye recognition tag can also provide a positioning function for the installation of the electric silver paste antenna and RFID chip on the attached object, thereby effectively improving the installation and positioning accuracy of the electric silver paste antenna and RFID chip.
[0009] Optionally, the step of printing the electric eye identification mark is performed before the step of positioning the silk-screen conductive silver paste antenna and binding the RFID chip.
[0010] By adopting the above technical solution, the hot stamping machine electric eye is first printed on the release layer, and then the conductive silver paste antenna and RFID chip are installed based on the position of the electric eye. This can provide a positioning function for the installation of the conductive silver paste antenna and RFID chip on the release layer, thereby improving the position accuracy between the conductive silver paste antenna and the RFID chip, thereby further improving the installation accuracy of the conductive silver paste antenna and the RFID chip on the attached object.
[0011] Optionally, the step of setting the functional layer also includes: After the conductive silver paste antenna is screen-printed, the release layer is heated to fix the conductive silver paste antenna on the release layer.
[0012] By adopting the above technical solution, the release layer is heated to soften the resin of the release layer, and the printed conductive silver paste antenna is pressed into the resin for fixation, thereby improving the installation stability of the printed conductive silver paste antenna.
[0013] Optionally, the release layer is heated for 25 to 35 minutes at a temperature of 100 to 120°C.
[0014] By adopting the above technical solution, the heating time and temperature are controlled to ensure that the release layer, the functional layer and the glue layer are not damaged when the film substrate is separated from the release layer.
[0015] Optionally, multiple functional layers may be provided on the film substrate at a time. The method for using the heat transfer RFID tag further includes cutting the tag before installing the tag. The step of cutting the tag includes: The film substrate is cut into pieces, and each cut film substrate has only one set of conductive silver paste antenna and RFID chip.
[0016] By adopting this technical solution, a single film substrate can be equipped with multiple sets of conductive silver paste antennas and RFID chips during production, effectively improving tag production efficiency. Although an additional slitting process is required, the overall efficiency is still significantly higher in large-scale production.
[0017] Optionally, the chip protection oil is UV varnish, and the step of printing the chip protection oil further includes: after printing the UV varnish, using UV light to cure the UV varnish.
[0018] By adopting the above technical solution, in the actual test phase, when there is only one release layer on the PET film substrate and no printed chip protection oil, the thrust test of the chip solder joint is only 1 to 2N. After the chip with printed chip protection oil is tested, the thrust test can be 6.5 to 7N. This makes the chip of the product of this application less likely to break during the subsequent hot transfer, the product is more stable, and the yield rate is higher.
[0019] Optionally, the release layer is made of a water-based release agent.
[0020] By adopting the above technical solution, the water-based release agent itself can be easily separated from the film substrate, and is convenient for production and use.
[0021] Optionally, in the step of setting the glue layer, the hot melt glue is dried by heating and air drying.
[0022] By adopting the above technical solution, the heating and air drying method can accelerate the drying of hot melt glue, thereby improving the production efficiency of labels.
[0023] A heat transfer RFID tag is produced and used using the above method.
[0024] By adopting the above technical solution, the film substrate can be peeled off during use, thereby effectively reducing the thickness of the label on the attached object, so that the label can effectively improve the flatness of the surface of the attached object during actual use.
[0025] In summary, this application includes at least one of the following beneficial technical effects: 1. Since the thickness of the paper substrate in traditional labels accounts for the vast majority of the label's thickness, this application uses a film substrate instead of the traditional paper substrate. After the label is transferred and installed, the release layer is peeled off, so that only the release layer, functional layer and glue layer remain on the attached object. This greatly reduces the protrusion of the label on the attached object and makes the surface of the attached object smoother. 2. Raised labels are prone to damage to the chip or antenna due to friction and compression during transportation and storage, reducing the reliability of the label. Therefore, the label of this application can effectively improve the reliability of label use by reducing the protrusion. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 This is a schematic diagram of the structure of the hot transfer RFID tag according to an embodiment of the present application; Figure 2 This is a schematic diagram of the structure of multiple functional layers on a film substrate according to an embodiment of the present application; Figure 3 This is a schematic diagram of the structure of the label of the embodiment of the present application installed on the attached object.
[0027] In the figure: A, label; 1, film substrate; 2, release layer; 3, functional layer; 4, glue layer; B, attached object. DETAILED DESCRIPTION
[0028] The following is combined with Figure 1-3 , further details of this application are given.
[0029] The embodiment of the present application discloses an iron-on transfer RFID tag A, which is mainly used for iron-on transfer to attached items B such as packaging boxes, especially for de-plasticized digital RFID packaging boxes.
[0030] Reference Figure 1 and Figure 2 A heat transfer RFID tag A comprises a film substrate 1, a release layer 2, a functional layer 3, and an adhesive layer 4, stacked in sequence. During mass production of tags A, the film substrate 1 may be provided with at least one set of release layer 2, functional layer 3, and adhesive layer 4. A slitting machine can then be used to separate the film substrate 1 into separate sets consisting of only a single set of release layer 2, functional layer 3, and adhesive layer 4 for attachment to an article. In this embodiment, for ease of description, the film substrate 1 is shown as consisting of only a single set of release layer 2, functional layer 3, and adhesive layer 4.
[0031] Film substrate 1 is made of PET film or other film materials with similar properties, and is stable at temperatures of at least 150°C. It should be noted that film substrate 1 replaces the paper substrate of traditional paper label A, not the paper layer used to adhere label A to the packaging box; that layer is part of the attached item. In actual use, to reduce the raised appearance of label A on the attached item B, film substrate 1 is peeled off, leaving only the release layer 2, functional layer 3, and adhesive layer 4 on the attached item B.
[0032] The release layer 2 is formed by printing on the film substrate 1 and then curing. The material forming the release layer 2 is commonly referred to in the industry as a water-based release agent or water-based polyurethane resin. The release layer 2 softens easily when heated, but its other properties remain stable. The softened release layer 2 is easier to separate from the film substrate 1.
[0033] Functional layer 3 is used to provide RFID function. Specifically, functional layer 3 includes an electric eye identification label, a conductive silver paste antenna, an RFID chip and a chip protection oil. The electric eye identification label is formed on the release layer 2 by printing. The main purpose of the electric eye identification label is to provide label A for positioning during the subsequent installation process, and it can also locate the position of the conductive silver paste antenna and the RFID chip. The conductive silver paste antenna is realized by screen printing the conductive silver paste on the release layer 2, and the conductive silver paste antenna needs to be heated and cured at 100-120°C for 25-35 minutes. After the required information is pre-entered, the RFID chip is bound by an RFID binding machine. The chip protection oil is used to protect the functional layer 3. The chip protection oil uses UV varnish, and the UV varnish needs to cover the RFID chip when printing. It is worth mentioning that, especially when printing with a digital printing machine, the UV varnish can make the protection of the printing more uniform and effective.
[0034] The glue layer 4 is used to connect the attached object B. The glue layer 4 is formed by air-drying hot melt glue printed on the functional layer 3. When heated, the glue layer 4 becomes sticky so that the label A can be attached to the attached object B.
[0035] The present application embodiment provides a method for using a heat transfer RFID tag A: S1. Reference Figure 1 and Figure 2 , obtain label A. Label A can be self-produced or purchased. Taking self-production as an example, the steps include: S11, obtaining a film substrate 1; S12, providing a release layer 2: printing an aqueous release agent on the film substrate 1, the aqueous release agent is cured to form a release layer 2; S13, setting function layer 3: S131. Print an electric eye identification mark on the cured release layer 2. The electric eye identification mark can provide a positioning guide for the conductive silver paste antenna and the RFID chip. The electric eye identification mark can also provide a positioning guide for the subsequent placement of the conductive silver paste antenna and the RFID chip on the attached object B.
[0036] S132. Screen-print conductive silver paste on the cured release layer 2 to form a conductive silver paste antenna. Heat the release layer 2 to fix the conductive silver paste antenna to the release layer 2. The release layer 2 is heated for 25 to 35 minutes at a temperature of 100 to 120°C.
[0037] S133, binding an RFID chip on the cured release layer 2; S134, using a digital printing machine to print chip protection oil made of UV varnish, the chip protection oil covers the RFID chip, and then using UV light to cure the chip protection oil; S14, setting glue layer 4: using a flexographic printing machine to print hot melt glue on the functional layer 3, and the hot melt glue is dried by heating and air drying to form glue layer 4; S15. (This step is only required when there are multiple sets of functional layers 3 on the film substrate 1) Cut the film substrate 1 so that the film substrate 1 has only one set of conductive silver paste antenna and RFID chip.
[0038] S2, reference Figure 1 and Figure 3 , install tag A.
[0039] S21. Positioning label A: Using a hot stamping machine to identify the electric eye mark to locate the position between label A and the attached object B, thereby positioning label A at the target position of the attached object B; S22. Laminating Label A: The heated hot stamping plate of the hot stamping machine is used to press label A and the positioned object B together. The heating of label A restores the adhesive layer 4 to its original viscosity, allowing label A to adhere to the object B. Simultaneously, the heated release layer 2 softens, allowing the film substrate 1 and release layer 2 to separate.
[0040] S23, recovering the film substrate 1.
[0041] The examples of this specific embodiment are all preferred embodiments of the present application and are not intended to limit the scope of protection of the present application. Identical parts are denoted by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, and the terms "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included within the scope of protection of the present application.
Claims
1. A method for using a heat transfer RFID tag, characterized in that: The following steps are involved: Get the tag (A); where: obtaining a film substrate (1); Providing a release layer (2): printing the release layer (2) on the film substrate (1), and curing the release layer (2); Setting a functional layer (3): screen printing a conductive silver paste antenna on the solidified release layer (2) and binding the RFID chip, printing chip protection oil, and the chip protection oil covering the RFID chip; Setting a glue layer (4): printing hot melt glue on the functional layer (3), and drying the hot melt glue to form a glue layer (4); Installation label (A); where: Positioning the tag (A): Position the tag (A) at the target location of the attached object (B); Laminating the label (A): heating the label (A) to restore the adhesiveness of the glue layer (4), the label (A) is attached to the attached object (B), the heated release layer (2) is softened, and the film substrate (1) is separated from the release layer (2).
2. The method for using a heat transfer RFID tag according to claim 1, characterized in that: The step of providing the functional layer (3) further comprises: printing an electric eye identification mark on the cured release layer (2).
3. The method for using a heat transfer RFID tag according to claim 2, characterized in that: The step of printing the electric eye identification mark is performed before the step of positioning the silk-screen conductive silver paste antenna and binding the RFID chip.
4. The method for using a heat transfer RFID tag according to claim 1, characterized in that: The step of setting the functional layer (3) further includes: After the conductive silver paste antenna is screen-printed, the release layer (2) is heated to fix the conductive silver paste antenna on the release layer (2).
5. The method for using a heat transfer RFID tag according to claim 4, characterized in that: The time for heating the release layer (2) is 25 to 35 minutes, and the heating temperature is 100 to 120°C.
6. The method for using a heat transfer RFID tag according to claim 1, characterized in that: Multiple groups of functional layers (3) can be provided on the film substrate (1) at a time. The method for using the heat transfer RFID tag further includes cutting the tag (A) before installing the tag (A). The step of cutting the tag (A) includes: The film substrate (1) is cut, and each cut film substrate (1) has only one set of conductive silver paste antenna and RFID chip.
7. The method for using a heat transfer RFID tag according to claim 1, characterized in that: The chip protection oil is UV varnish, and the step of setting and printing the chip protection oil further includes: after printing the UV varnish, using UV light to cure the UV varnish.
8. The method for using a heat transfer RFID tag according to claim 1, characterized in that: The release layer (2) is made of a water-based release agent.
9. The method for using a heat transfer RFID tag according to claim 1, characterized in that: In the step of setting the glue layer (4), the hot melt glue is dried by heating and air drying.
10. A heat transfer RFID tag, characterized in that: The method is produced and used using the method described in any one of claims 1 to 9.