RFID electronic tag and manufacturing method thereof

Abstract

The present application relates to the technical field of electronic record carrier, and particularly relates to an RFID electronic tag and a manufacturing method thereof.The method comprises the following steps: attaching a small antenna encapsulating a chip to an attaching surface of a bearing base cloth and fixing by dispensing, wherein the non-imitation cloth of the bearing base cloth is composed of fabric; pressing a pressing cloth strip and the bearing base cloth through a roll-to-roll pressing process, so that the pressing cloth strip is pressed on the electronic tag body and a clamping fixed structure is formed; arranging a plurality of electronic tag bodies in an array form on a base strip, and conveying to a roll-to-roll detection device to perform functional and consistency test; after the test is completed, performing surface printing, laser coding and UV coding on the electronic tag body; and obtaining target product information and writing into the RFID chip.The present application realizes efficient production of the RFID electronic tag through the roll-to-roll pressing and fixing technology, so as to improve the production efficiency and enhance the label identification performance and traceability.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic recording media, and in particular to an RFID electronic tag and a manufacturing method thereof. Background Art

[0002] In the current field of RFID electronic tag production and application, traditional technologies have the following major problems: low production efficiency and reliance on manual or semi-automated equipment, resulting in slow production and unstable product quality. The tag's fixed method is simple, difficult to adapt to target products with different materials and usage environments, and the fixing stability is poor. In addition, the weather resistance and chemical stability of traditional carrier fabric materials are insufficient, which shortens the tag's service life. Furthermore, the antenna layout of existing tags is unreasonable, resulting in low signal transmission efficiency and reduced recognition rate in complex environments. Traditional tags lack unique identification, making effective traceability difficult and unable to meet the requirements of modern production management for product quality monitoring and traceability. Summary of the Invention

[0003] Based on this, it is necessary to provide an RFID electronic tag and a manufacturing method thereof to solve at least one of the above technical problems.

[0004] To achieve the above objectives, an RFID electronic tag is provided, comprising a carrier base fabric, an electronic tag body, and a pressed cloth strip; the carrier base fabric is made of non-woven fabric, polyester, or silicone and has an attachment surface, wherein the non-woven fabric is various fabrics; the electronic tag body is composed of an RFID chip and an antenna, wherein the antenna is divided into a small antenna and an amplified coupling antenna, and is fixed to the attachment surface horizontally or vertically; the pressed cloth strip is narrower than the carrier base fabric, is pressed on the electronic tag body, and is clamped and fixed with the carrier base fabric through roll-to-roll lamination, so that the electronic tag body is clamped between the carrier base fabric and the pressed cloth strip.

[0005] The present invention also provides a method for manufacturing an RFID electronic tag, the method comprising the following steps:

[0006] Step S1: attaching a small antenna encapsulated with a chip to an attachment surface of a supporting base fabric and fixing it with glue, wherein the supporting base fabric is made of fabric;

[0007] Step S2: Laminating the pressing strips of fabric with the supporting base fabric through a roll-to-roll lamination process, so that the pressing strips of fabric cover the electronic tag body and form a clamping and fixing structure;

[0008] Step S3: Multiple electronic tag bodies are arranged in an array on a base tape and transported to a roll-to-roll inspection device for functionality and consistency testing. After the test is completed, the electronic tag bodies are surface printed, laser engraved, and UV coded. The target product information is obtained and written into the RFID chip.

[0009] Step S4: The base tape is transported to a cutting mechanism and cut into individual RFID electronic tags in sequence; pre-iron and cursor printing operations are performed on the cut individual RFID electronic tags;

[0010] Step S5: Using an automatic conveying mechanism to suck up the cut single RFID electronic tag and fix it on the target product by sewing, sleeve, hot stamping or gluing.

[0011] The beneficial effects of the present invention are:

[0012] (1) Through the roll-to-roll lamination process, the lamination strips and the supporting base fabric are continuously pressed together to form a clamping and fixing structure, so that the electronic tag body is firmly clamped between the two. This process has a high degree of automation and can significantly improve the production speed of RFID electronic tags, reduce manual intervention, and reduce production costs. Multiple electronic tag bodies are arranged in an array on the base tape and cut sequentially to form a single RFID electronic tag through a precise shearing mechanism. The shearing mechanism adopts a crank slider mechanism, whose movement is controlled by a groove wheel mechanism. It can accurately cut the gap between each electronic tag body according to the preset shearing interval, ensuring shearing accuracy, reducing material waste, and further improving production efficiency.

[0013] (2) Provide multiple fixing methods such as sewing, card sleeve, hot stamping or gluing, and be able to select the most suitable fixing method according to the material of the target product and the use environment; sewing is suitable for soft materials such as textiles, and hot stamping or gluing is suitable for hard materials, ensuring the firmness of RFID electronic tags in different application scenarios; the supporting base fabric is made of non-woven fabric, polyester or silicone, which has good weather resistance and chemical stability, can adapt to different environmental conditions, extend the service life of RFID electronic tags, and improve the environmental adaptability of tags.

[0014] (3) The electronic tag body consists of an RFID chip and an antenna, wherein the antenna is divided into a small antenna and an amplified coupling antenna, which is fixed to the attached surface horizontally or vertically. This design can optimize the layout of the RFID chip and antenna, improve signal transmission efficiency, enhance the reading and writing performance of the tag, and ensure high recognition rate in complex environments. Pre-iron and cursor printing operations are performed on the cut single RFID electronic tag, which can add a unique mark to the tag, facilitate subsequent tracking and management, improve product traceability, and meet the requirements of modern production management for product quality monitoring and traceability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic flow chart of a method for producing an RFID electronic tag;

[0016] Figure 2 This is a physical picture of the electronic tag;

[0017] Figure 3 It is a stage pressure control curve diagram;

[0018] Figure 4 It is the temperature control response curve;

[0019] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0020] The following is a clear and complete description of the technical method of the present invention in conjunction with the accompanying drawings. It is obvious that the embodiments described are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts are within the scope of protection of the present invention.

[0021] In addition, the accompanying drawings are merely schematic illustrations of the present invention and are not necessarily drawn to scale. Identical reference numerals in the figures denote identical or similar parts, and thus repetitive descriptions thereof will be omitted. Some of the block diagrams shown in the accompanying drawings are functional entities that do not necessarily correspond to physically or logically separate entities. These functional entities may be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor and / or microcontroller approaches.

[0022] It should be understood that although the terms "first," "second," and the like may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used solely to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of the exemplary embodiments. The term "and / or" as used herein includes any and all combinations of one or more of the listed associated items.

[0023] To achieve this, please refer to Figure 2 , an RFID electronic tag includes a carrier base fabric, an electronic tag body, and a pressed cloth strip; the carrier base fabric is made of non-woven fabric, polyester, or silicone and has an attachment surface; the electronic tag body is composed of an RFID chip and an antenna, wherein the antenna is divided into a small antenna and an amplified coupling antenna, which is fixed to the attachment surface horizontally or vertically; the pressed cloth strip is smaller in width than the carrier base fabric, is pressed on the electronic tag body, and is formed into a clamping and fixing structure with the carrier base fabric through roll-to-roll pressing, so that the electronic tag body is clamped between the carrier base fabric and the pressed cloth strip.

[0024] See also Figures 1 to 4The present invention also provides a method for manufacturing an RFID electronic tag, the method comprising the following steps:

[0025] Preferably, step S1: attaching the small antenna encapsulated with the chip to the attachment surface of the supporting base fabric and fixing it by glue, wherein the non-imitation fabric of the supporting base fabric is composed of fabric;

[0026] Optionally, the specific operation of attaching the small antenna packaged with the chip in step S1 is as follows:

[0027] Design small antennas and amplified coupling antennas according to the performance requirements of electronic tags;

[0028] The small antenna is embedded into the circuit board using the etching process of the PCB or FPC circuit board;

[0029] The chip is packaged in DFN and mounted on a PCB via SMT, and connected to a small antenna to form a small tag with RF performance.

[0030] The amplified coupling antenna is mounted on the carrier base fabric by stamping or bonding. The amplified coupling antenna adopts soft stainless steel wire or hard metal material. The mounting method includes embroidery thread or bonding.

[0031] In this embodiment, the performance indicators of the RFID electronic tag, such as the operating frequency range, reading distance requirements, and application scenarios, are determined; based on these performance requirements, the parameters such as the size, shape, and line width of the small antenna are designed; at the same time, the structure and size of the amplified coupling antenna are designed.

[0032] In one implementation of this embodiment, a suitable PCB or FPC material is selected as the substrate, and the conductive pattern of the small antenna is accurately transferred to the circuit board through photolithography and etching processes according to the designed small antenna pattern. Specifically, a layer of photoresist is coated on the surface of the circuit board, and exposure is performed through a mask so that the photoresist is exposed and cured in the area of ​​the small antenna pattern. Then, development is performed to remove the unexposed photoresist and expose the circuit board surface. Finally, a chemical etching process is used to etch away the exposed portion of the circuit board to form the conductive pattern of the small antenna.

[0033] In another implementation of this embodiment, a suitable chip is selected and packaged using the DFN packaging process. Using SMT placement equipment, the packaged chip is precisely mounted to a predetermined position on a PCB. Through soldering, the chip's pins are connected to pads on the PCB, and conductive wires are used to electrically connect the chip to the connection points of the small antenna, completing the assembly of the small tag.

[0034] In one operation step of this embodiment, depending on the design of the amplified coupling antenna, either soft stainless steel wire or hard metal is selected as the antenna material. For the soft stainless steel wire, the antenna thread is embroidered onto the carrier fabric according to the designed pattern using embroidery thread. For the hard metal material, it is stamped into the desired antenna shape and then affixed to the designated location on the carrier fabric using adhesive.

[0035] Optionally, before attaching to the attachment surface of the supporting base fabric and fixing with glue in step S1, the following steps may be included:

[0036] The production batch, production date and product model traceability information of the product are written into the RFID chip through the roll-to-roll writing device;

[0037] After writing is completed, the RFID chip is encrypted;

[0038] Encryption processing is achieved by setting access rights in the storage area of ​​the RFID chip and setting that only authenticated devices can read or write information.

[0039] In one embodiment, an RFID tag is installed at the starting end of a roll-to-roll production line to ensure that the tag can be recognized by a reader / writer. The RFID reader / writer is checked for proper operation to ensure that it can accurately read and write data. Traceability information such as the product's production batch, production date, and product model is entered into the control software of the RFID reader / writer system. The entered information is ensured to be accurate and meets the requirements for production records.

[0040] In another embodiment, a roll-to-roll production line is started, and the RFID tag passes through the read-write area of ​​a radio frequency reader / writer; the radio frequency reader / writer writes the entered traceability information such as production batch, production date, and product model into the RFID chip according to preset instructions; during the writing process, the device automatically verifies whether the written information is complete and accurate to ensure that the information is written correctly.

[0041] It should be noted that access rights are set in the storage area of ​​the RFID chip, dividing the storage area into multiple areas, each with different access rights. For example, the storage area can be divided into a public area and a private area, with the public area allowing all devices to read and the private area allowing only authorized devices to read and write.

[0042] It's important to note that an appropriate encryption algorithm, such as AES (Advanced Encryption Standard) or RSA (asymmetric encryption algorithm), is selected and a corresponding key is generated. This key is then stored in the secure storage area of ​​the RFID chip. Using an RFID reader / writer, the encryption algorithm and key are applied to the RFID chip's private storage area, allowing only authenticated devices to read or write information in the private storage area. The authentication process involves both device identity verification and key authentication. Only devices that pass the pre-set key authentication algorithm can read or write to the private storage area.

[0043] Preferably, step S2: pressing the pressing strip of fabric and the supporting base fabric by a roll-to-roll pressing process, so that the pressing strip of fabric covers the electronic tag body and forms a clamping and fixing structure;

[0044] Optionally, step S2 includes the following steps:

[0045] Step S21: In the roll-to-roll lamination process, the lamination strips and the supporting base fabric are combined under the action of the lamination rollers;

[0046] Step S22: A groove corresponding to the outline of the electronic tag body is provided on the surface of the pressing roller. During pressing, the electronic tag body is embedded in the groove, and the pressing cloth strip and the supporting base cloth form a clamping and fixing structure under the pressure of the pressing roller;

[0047] Step S23: providing a hot melt adhesive layer between the pressed fabric strips and the supporting base fabric, and simultaneously increasing the stability of the fixed structure through UV curing adhesive;

[0048] Step S24: The hot melt adhesive layer is heated and melted during the lamination process to enhance the bonding strength between the lamination fabric strips and the supporting base fabric.

[0049] In one embodiment, the laminating strip and the supporting base fabric are separately mounted on the unwinding device of the roll-to-roll production line. The widths of the laminating strip and the supporting base fabric should match to ensure uniform force during the laminating process. The surface flatness and cleanliness of the laminating roller should be inspected to ensure that the laminating roller surface is free of debris and damage. Wipe the laminating roller surface with a soft cloth and detergent to remove any dust and oil.

[0050] It should be noted that the pressure and temperature of the lamination roller are adjusted according to the process requirements; usually, the pressure of the lamination roller is set between 0.5-1.0 MPa and the temperature is set between 50-80°C, and the specific values ​​are adjusted according to the characteristics of the material.

[0051] In another embodiment, a roll-to-roll production line is activated, and the laminating fabric strip and the supporting base fabric are bonded together by laminating rollers. During the laminating process, the laminating rollers apply uniform pressure to the fabric strip and base fabric, tightly bonding them. Monitoring equipment monitors the pressure and temperature during the laminating process in real time to ensure stable laminating conditions. If pressure or temperature anomalies are detected, equipment parameters are adjusted promptly.

[0052] In one implementation of this embodiment, a groove is designed on the surface of the lamination roller based on the size and shape of the electronic tag. The groove's depth and width should match the thickness and width of the tag itself to ensure the tag fits completely within the groove. Specifically, a three-dimensional model of the groove is drawn using computer-aided design (CAD) software to ensure dimensional accuracy. Simultaneously, the designed groove is machined into the lamination roller using precision machining equipment, such as a CNC milling machine or laser engraving machine. During this machining process, the groove's dimensional accuracy and surface finish must be maintained.

[0053] In another implementation of this embodiment, during the lamination process, the electronic tag body is placed between the lamination strip and the carrier fabric, aligned with the groove on the surface of the lamination roller. A visual alignment system or manual adjustment ensures that the electronic tag body is accurately embedded in the groove. When the lamination roller applies pressure, the lamination strip and the carrier fabric form a clamping and fixing structure under the pressure of the lamination roller, and the electronic tag body is firmly fixed in the groove.

[0054] In another implementation of this embodiment, an automatic gluing device is used to evenly apply a layer of hot melt adhesive to the surface of the pressed fabric strips or the supporting base fabric. The thickness of the adhesive is typically between 0.1 and 0.3 mm, and the specific thickness is adjusted according to the characteristics of the material and the process requirements. During the gluing process, the adhesive layer should be uniform and free of bubbles and impurities to ensure the bonding quality after lamination. A layer of UV curing adhesive is evenly applied to the surface of the hot melt adhesive layer. High-precision gluing equipment, such as a glue sprayer or screen printer, is used to apply the UV curing adhesive. The UV curing adhesive should be applied evenly, and the thickness is typically between 0.05 and 0.1 mm.

[0055] It should be noted that during the lamination process, the UV curing adhesive is simultaneously cured by a UV curing device. The UV curing device should be set with appropriate light intensity and curing time according to the process requirements. Generally, the light intensity is between 100-200 mW / cm² and the curing time is between 5-10 seconds.

[0056] It should be noted that the lamination roller should be preheated to an appropriate temperature according to the melting temperature of the hot melt adhesive. Usually, the melting temperature of the hot melt adhesive is between 60-80°C, and the specific temperature is adjusted according to the characteristics of the hot melt adhesive. Use an electric heater or a hot oil circulation system to preheat the lamination roller to ensure that the temperature of the lamination roller is uniform.

[0057] Optionally, in step S22, the electronic tag body is embedded in the groove during pressing:

[0058] The grooves on the surface of the pressing roller completely correspond to the outline of the electronic tag body, and the depth of the grooves is equal to the thickness of the electronic tag body;

[0059] During the lamination process, before the electronic tag body enters the lamination roller, the center position of the groove is located, and the electronic tag body is aligned and embedded in the groove.

[0060] In one embodiment, the groove on the surface of the pressing roller is designed based on the outline dimensions of the electronic tag body, ensuring that the shape of the groove completely matches the electronic tag body. High-precision processing equipment, such as a CNC milling machine or a laser engraving machine, is used to process the surface of the pressing roller to form a groove with a thickness equal to that of the electronic tag body.

[0061] In another embodiment, a visual positioning device or a mechanical positioning device is provided at the feed end of the lamination roller to determine the position of the electronic tag body. The visual positioning device can capture an image of the electronic tag body through a camera and calculate its center position; the mechanical positioning device can locate the electronic tag body through physical contact.

[0062] In another embodiment, before the lamination roller is about to laminarize the electronic tag body, the electronic tag body is precisely aligned and embedded in the groove according to the position information provided by the positioning device. This process can be completed by automated equipment to ensure that the electronic tag body can be accurately embedded in the groove and avoid offset during the lamination process.

[0063] Optionally, in step S22, forming a clamping and fixing structure between the pressing cloth strip and the supporting base cloth under the pressure of the pressing roller includes:

[0064] The groove surface of the pressing roller is provided with groove surface protrusions, wherein the groove surface protrusions are evenly distributed in the groove;

[0065] When the electronic tag body is embedded in the groove, the groove surface protrusion contacts the surface of the electronic tag body;

[0066] Under the pressure of the pressing roller, the hot melt adhesive layer is evenly distributed and melted between the groove and the electronic tag body and between the pressing strip and the supporting base fabric, and forms a clamping and fixing structure after cooling.

[0067] In one embodiment, evenly distributed groove surface protrusions are machined on the groove surface of the lamination roller. The shape and size of the groove surface protrusions are designed based on the surface characteristics of the electronic tag body so that they can contact the surface of the electronic tag body during the lamination process. High-precision processing equipment, such as a CNC milling machine or a laser engraving machine, is used to machine the groove on the surface of the lamination roller and to machine the groove surface protrusions within the groove.

[0068] In another embodiment, during the lamination process, before the electronic tag body enters the lamination roller, the center position of the groove is determined by a positioning device; the electronic tag body is aligned and embedded in the groove so that the groove surface protrusion contacts the surface of the electronic tag body.

[0069] In another embodiment, a hot melt adhesive layer is provided between the pressing cloth strip and the supporting base fabric. The thickness of the hot melt adhesive layer is uniform, typically between 0.1 and 0.3 mm. When the pressing cloth strip and the supporting base fabric are combined under the pressure of a pressing roller, the hot melt adhesive layer is evenly distributed and melted between the groove and the electronic tag body and between the pressing cloth strip and the supporting base fabric. The temperature and pressure of the pressing roller are controlled so that the hot melt adhesive layer can fully melt and fill the gap between the groove and the electronic tag body.

[0070] In another embodiment, after lamination is completed, the lamination strips and base fabric are cooled by a cooling device to rapidly solidify the hot melt adhesive layer; the cooled hot melt adhesive layer forms a clamping and fixing structure between the groove and the electronic tag body and between the lamination strips and the supporting base fabric.

[0071] Optionally, the hot melt adhesive layer is evenly distributed and melted between the groove and the electronic tag body and between the pressed cloth strip and the supporting base cloth as follows:

[0072] Before lamination, a hot melt adhesive layer is pre-applied on the laminating fabric strips. The thickness of the pre-applied hot melt adhesive layer is controlled between 0.1 and 0.3 mm.

[0073] During the lamination process, pressure is applied in stages, with 30% to 50% of the total pressure applied in the first stage and the remaining 50% to 70% applied in the second stage, so that the hot melt adhesive layer gradually melts and is evenly distributed under the action of pressure;

[0074] At the entrance of the laminating roller, the conveying speed of the laminating cloth strip and the supporting base cloth is controlled so that the hot melt adhesive layer is fully melted and evenly distributed when entering the laminating roller;

[0075] During the lamination process, the temperature of the lamination roller is adjusted to keep it between 100% and 110% of the melting point of the hot melt adhesive, so that the hot melt adhesive layer is completely melted and evenly distributed during the lamination process.

[0076] In one implementation of this embodiment, before lamination, an automatic coating machine is used to evenly pre-coat the hot melt adhesive on the lamination strips. By adjusting the gap between the coating machine's scraper blades, the thickness of the pre-coated hot melt adhesive layer is precisely controlled to be between 0.1 and 0.3 mm. For example, when a 0.2 mm thick layer of hot melt adhesive is required, the scraper gap is adjusted to 0.2 mm, and a trial coating is performed to verify whether the thickness meets the requirements.

[0077] See also Figure 3 In another implementation of this embodiment, during the lamination process, the control system of the lamination device applies pressure in stages according to a preset program. In the first stage, the lamination device applies 30% to 50% of the total pressure.

[0078] For example, if the total pressure is set to 1.0 MPa, the pressure applied in the first stage is 0.3 to 0.5 MPa. In the second stage, the laminating device applies the remaining 50% to 70% of the pressure, that is, 0.5 to 0.7 MPa. In this way, the hot melt adhesive layer gradually melts and is evenly distributed under the action of pressure;

[0079] It should be noted that at the inlet of the lamination roller, the conveying speed of the lamination strip and the supporting base fabric is adjusted by the lamination equipment's tension control system. The conveying speed can be adjusted from 0.5 to 2.0 m / min, and the specific speed is selected based on the melting characteristics of the hot melt adhesive.

[0080] For example, if the hot melt adhesive takes a long time to melt, the conveyor speed can be adjusted to a slower 0.5 m / min; if the melting time is short, the conveyor speed can be increased to 2.0 m / min. By adjusting the conveyor speed, the hot melt adhesive layer can be fully melted and evenly distributed when it enters the lamination roller.

[0081] See also Figure 4 It should be noted that during the lamination process, the lamination roller's temperature is adjusted by the lamination equipment's heating system. The lamination roller's temperature setting range is 100% to 110% of the hot melt adhesive's melting point. For example, if the hot melt adhesive's melting point is 80°C, the lamination roller's temperature should be set between 80°C and 88°C. The temperature control system monitors the lamination roller's temperature in real time and makes fine adjustments as needed to ensure that the hot melt adhesive layer is completely melted and evenly distributed during the lamination process.

[0082] Optionally, the clamping and fixing structure formed after cooling is specifically:

[0083] When the laminated structure enters the cooling zone immediately at the exit of the lamination roller, the temperature of the cooling zone is controlled to keep it 5 to 10 degrees Celsius below the ambient temperature;

[0084] During the cooling process, the temperature is lowered in stages. The first stage is to lower the temperature to 5 degrees Celsius below the ambient temperature, and the second stage is to lower the temperature to 10 degrees Celsius below the ambient temperature, so that the hot melt adhesive layer solidifies evenly during the cooling process.

[0085] During the cooling process, the cooling time is adjusted to be between 10 and 30 seconds, so that the hot melt adhesive layer is fully solidified during the cooling process;

[0086] After cooling is completed, the hardness of the pressed structure is tested and the test results are recorded in the traceability database.

[0087] In one embodiment, a cooling zone is located directly behind the lamination roller exit. The length of the cooling zone is designed based on the dimensions of the lamination structure and the cooling requirements. A temperature sensor and cooling device, such as a cooling fan or a cooling water circulation system, are installed within the cooling zone. The cooling device's control system regulates the cooling zone's temperature to 5 to 10 degrees Celsius below the ambient temperature. For example, if the ambient temperature is 25 degrees Celsius, the cooling zone should be adjusted to 15 to 20 degrees Celsius.

[0088] It should be noted that during the cooling process, the first stage of cooling is initiated, where the cooling device lowers the temperature of the pressed structure to 5°C below the ambient temperature. For example, if the ambient temperature is 25°C, the target temperature for the first stage of cooling is 20°C. After maintaining the first stage cooling temperature for a period of time, the second stage of cooling begins, further lowering the temperature to 10°C below the ambient temperature. For example, the target temperature for the second stage of cooling is 15°C.

[0089] In another embodiment, the cooling time is controlled between 10 and 30 seconds by adjusting the operating time of the cooling device based on the curing characteristics of the hot melt adhesive layer. For example, if the hot melt adhesive layer requires a shorter curing time, the cooling time can be set to 10 seconds; if it requires a longer curing time, the cooling time can be set to 30 seconds. The cooling time is adjusted by the cooling device's control system to ensure that the hot melt adhesive layer is fully cured during the cooling process.

[0090] In another embodiment, after cooling is complete, the pressed structure is subjected to a hardness test using a hardness testing device. The hardness testing device can be a portable hardness tester or an online hardness testing system. The measured hardness values ​​are recorded in a traceability database for subsequent quality tracing and data analysis. The traceability database can be a local server or a cloud-based database, and the recorded information includes test time, hardness value, production batch, etc.

[0091] Preferably, step S3: multiple electronic tag bodies are arranged in an array on a base tape and transported to a roll-to-roll inspection device for functionality and consistency testing; after the test is completed, the electronic tag bodies are surface printed, laser engraved, and UV coded; target product information is obtained and written into the RFID chip;

[0092] It is particularly important that the multiple electronic tag bodies are arranged in an array on the baseband in step S3 as follows:

[0093] Staggered positioning marks are set on the base tape, each positioning mark corresponds to the position of an electronic tag body, and the spacing of the positioning marks is adjusted according to the size of the electronic tag body;

[0094] Attach the electronic tag body to the base tape in sequence according to the staggered positioning marks;

[0095] Attach the first electronic tag body to the starting position of the baseband, attach the second electronic tag body to the diagonal position of the first tag body, attach the third electronic tag body to the diagonal position of the second tag body, and so on, to form a staggered array;

[0096] The base tape with the electronic tag body arranged thereon is transported to the shearing mechanism through a multi-axis synchronous conveying device. During the conveying process, the position of the base tape is monitored in real time by a sensor, and each electronic tag body is accurately brought to the shearing position of the shearing mechanism.

[0097] In one embodiment, staggered positioning marks are provided on the base tape, each corresponding to a position of the electronic tag body. The positioning marks can be small dots, cross marks or other easily identifiable graphics printed on the base tape.

[0098] For example, the spacing of the positioning marks is adjusted according to the size of the electronic tag body; if the width of the electronic tag body is 20 mm and the length is 30 mm, the spacing of the positioning marks can be set to 25 mm (horizontally) and 35 mm (vertically) to ensure that there is enough space between the electronic tag bodies while maximizing the utilization of the baseband.

[0099] In another embodiment, the electronic tag bodies are sequentially attached to the base tape according to the staggered positioning marks. An automated attaching device, such as a labeling machine or a robotic arm, is used to accurately attach the electronic tag bodies to the base tape based on the coordinate information of the positioning marks.

[0100] It should be noted that the specific attachment order is: attach the first electronic tag body to the starting position of the baseband, the second electronic tag body to the diagonal position of the first tag body, the third electronic tag body to the diagonal position of the second tag body, and so on, forming a staggered array. For example, if the first electronic tag body is located in the upper left corner of the baseband, the second electronic tag body will be attached to the lower right corner of the first tag body, the third electronic tag body will be attached to the upper left corner of the second tag body, and so on.

[0101] In another embodiment, the base tape with the electronic tag bodies is conveyed to the cutting mechanism by a multi-axis synchronous conveying device. The multi-axis synchronous conveying device can be a conveyor belt system with multiple drive shafts, each driven by an independent motor to ensure smooth and accurate conveyance of the base tape.

[0102] It's important to note that during the conveying process, sensors monitor the position of the base tape in real time. These sensors, which can be photoelectric or laser sensors, are installed at key locations on the conveyor to detect positioning marks on the base tape or the edges of the electronic tag bodies. When the sensors detect that an electronic tag body is about to reach the cutting position of the shearing mechanism, they send a signal to the conveyor to adjust the conveying speed or pause the conveyor to ensure that each electronic tag body reaches the cutting position accurately.

[0103] The delivery to the roll-to-roll inspection device for functionality and consistency testing in step S3 includes:

[0104] Perform appearance integrity inspection on the electronic tag body, scanning its surface to identify scratches, wrinkles and breaks;

[0105] Perform read and write performance tests on RFID chips to measure read and write speeds;

[0106] Perform functional testing on the electronic tag, including verifying its communication protocol compatibility, signal strength, response time, and data integrity;

[0107] Conduct consistency testing on the electronic tag body, including checking its dimensional accuracy, material properties, packaging quality, and matching with design specifications;

[0108] Based on the results of functionality and consistency tests, qualified electronic tag bodies are transported to the next process, and unqualified electronic tag bodies are automatically rejected.

[0109] In one operation mode of this embodiment, a high-resolution industrial camera is used to capture an image of a single cut RFID tag. The industrial camera should have a resolution of at least 3.2 million pixels to ensure that subtle features on the surface of the tag can be captured. The camera is mounted on a fixed bracket, with the lens aimed at the surface of the tag. The distance and angle between the camera and the tag surface are maintained to obtain a clear image.

[0110] For example, the acquired image is binarized, converting it to black and white. Binarization can be accomplished by setting a grayscale threshold, setting pixels above the threshold to white and pixels below the threshold to black. Edge detection algorithms, such as the Canny edge detection algorithm, are then used to detect edges in the binarized image and extract the edge contours of the electronic tag. The extracted edge contours are then analyzed to detect discontinuities or abnormal mutations, which are signs of scratches or breaks. Wrinkles are identified by calculating the grayscale mean and standard deviation of different regions in the image. Wrinkles often result in localized grayscale value changes.

[0111] In another operating mode of this embodiment, an RFID reader / writer is used to test the read / write performance of the RFID chip in the electronic tag body. The reader / writer is installed at a testing station with its antenna aligned with the electronic tag body. The reader / writer first sends a read command to test the read speed of the RFID chip. The read speed is determined by measuring the time from sending the command to receiving the response. The reader / writer then sends a write command to test the write speed of the RFID chip. The write speed is also determined by measuring the time from sending the command to completing the write. The reader / writer transmits the test results to the control system, which determines whether the read / write performance of the RFID chip meets the requirements based on preset performance standards.

[0112] In another operating mode of this embodiment, a functional test is performed on the electronic tag body, where the functional test includes verifying its communication protocol compatibility, signal strength, response time, and data integrity. Specifically, a dedicated test device is used to simulate the actual use environment, and communication instructions are sent to the electronic tag body to verify whether it can respond normally according to the preset communication protocol. At the same time, the signal strength of the electronic tag body is measured at different distances and angles to ensure that it can stably transmit data within the effective range. The time from sending the instruction to the electronic tag body's response is recorded to evaluate whether its response time meets the requirements. In addition, data reading and writing operations are performed on the electronic tag body to check whether the data can be stored and read completely and accurately to ensure data integrity.

[0113] In another operating mode of this embodiment, the electronic tag body is subjected to a consistency test, wherein the consistency test includes checking its dimensional accuracy, material properties, packaging quality, and matching with the design specifications. Specifically, a high-precision measuring tool, such as a laser rangefinder or a precision caliper, is used to measure the dimensions of the electronic tag body to ensure that its dimensional accuracy meets the design requirements. The material composition of the electronic tag body is tested using material testing equipment, such as a spectrometer, to verify whether its material properties meet the standards. The packaging of the electronic tag body is checked for integrity, air leaks, damage, etc., to ensure packaging quality. Finally, the various parameters of the electronic tag body are compared with the design specifications to ensure that they fully match.

[0114] In another operating mode of this embodiment, qualified electronic tag bodies are conveyed to the next process step based on the results of functionality and consistency testing, while unqualified electronic tag bodies are automatically rejected. Specifically, electronic tag bodies that pass quality inspection are conveyed to the next process step via a conveyor device. For unqualified electronic tag bodies, the control system drives a rejection device to automatically reject them. The rejection device can be a rotating rejection rod that scrapes away unqualified electronic tags to prevent them from adhering back to the material strip.

[0115] Step S4: The base tape is transported to a cutting mechanism and cut into individual RFID electronic tags in sequence; pre-iron and cursor printing operations are performed on the cut individual RFID electronic tags;

[0116] It is particularly important that in step S4, the base tape is transported to the cutting mechanism and cut in sequence to form a single RFID electronic tag:

[0117] The shearing mechanism adopts a crank slider mechanism, whose movement is controlled by a grooved wheel mechanism. The grooved wheel mechanism transmits power to the gear to realize the rotation of the crank, and then drives the shearing tool to perform the shearing action.

[0118] When the base tape is transported to the shearing mechanism, the grooved wheel mechanism controls the shearing tool to cut the gap between each electronic tag body according to the preset shearing interval; the shearing interval matches the array spacing of the electronic tag bodies;

[0119] The shearing operation is divided into two stages: in the first stage, the shearing tool performs pre-cutting at the diagonal position of the electronic tag body to form an initial separation gap; in the second stage, the shearing tool performs final cutting based on the initial separation gap to completely separate the electronic tag body;

[0120] Perform size detection on the cut individual RFID electronic tags and record the size data of each tag.

[0121] In one embodiment, the shearing mechanism employs a slider-crank mechanism, whose motion is controlled by a shear mechanism. The shear mechanism's input is connected to a power source, such as a servo motor, which transmits power to the crank via a gear transmission, causing the crank to rotate. One end of the crank is connected to a slider, which moves linearly within a guide rail. The other end of the slider is connected to a shearing tool. When the crank rotates, the slider drives the shearing tool in an up-and-down reciprocating motion, completing the shearing action.

[0122] In another embodiment, as the base tape is fed to the cutting mechanism, a grooved wheel mechanism controls the cutting blade to cut the gaps between each electronic tag body according to a preset cutting interval. The cutting interval matches the array spacing of the electronic tag bodies, ensuring that the cutting blade can accurately cut the gaps between the electronic tag bodies.

[0123] For example, if the array pitch of the electronic tag bodies is 20 mm, the groove wheel mechanism sets the cutting interval to 20 mm, so that the cutting tool can perform precise cutting between each electronic tag body.

[0124] In another implementation, in the first stage, the shearing tool performs pre-cutting at diagonal locations on the electronic tag bodies to create a preliminary separation gap. The purpose of pre-cutting is to create a smaller separation gap between the electronic tag bodies, preparing for the final cut. In the second stage, the shearing tool performs final cuts based on the initial separation gap, completely separating the electronic tag bodies. The final cut ensures complete separation of the electronic tag bodies by increasing the shearing tool's stroke and pressure.

[0125] In another implementation, the cut individual RFID tags are dimensional inspected using high-precision measuring equipment, such as a laser rangefinder or optical measurement system, to precisely measure the dimensions of each tag. The measured dimensional data is recorded in a traceability database. This database can be a local server or a cloud-based database, and the recorded information includes inspection time, dimensional data, production batch, and more.

[0126] Step S5: Using an automatic conveying mechanism to suck up the cut single RFID electronic tag and fix it on the target product by sewing, sleeve, hot stamping or gluing.

[0127] In one embodiment, a suitable wire material, such as metalized wire or ordinary sewing thread, is selected based on the material of the target product and the usage environment, and an RFID electronic tag is prepared, ensuring that its size and shape are suitable for the fixed position of the target product;

[0128] It should be noted that the RFID electronic tag is fixed to the designated position of the target product using a sewing machine or hand sewing tools.

[0129] For example, for clothing, RFID tags can be sewn onto the inner layer of clothing, collar, cuffs, or spare buttons. During the sewing process, ensure that the thread tension is moderate to avoid damage to the RFID tag. After sewing, check the firmness of the thread to ensure that the tag has not loosened.

[0130] In another embodiment, a suitable ferrule material, such as plastic or metal, is selected and customized according to the size and shape of the RFID tag. The ferrule should have sufficient strength and elasticity to securely hold the RFID tag while also being easy to install and remove. The RFID tag is inserted into the ferrule, ensuring a tight fit between the tag and the ferrule. The ferrule is then secured to the designated location on the target product, such as with screws, adhesive, or other fixing methods. Ensure that the ferrule is securely fixed and will not shift or fall off due to external forces.

[0131] In another embodiment, a suitable hot stamping material, such as a hot melt adhesive film or a composite adhesive film, is selected based on the material and intended use of the target product. An RFID tag is prepared, ensuring its size and shape are suitable for the desired location on the target product. Hot stamping equipment, such as a heat press or hot stamping machine, is then used to secure the RFID tag to the designated location on the target product. During the hot stamping process, the temperature and pressure are controlled to ensure that the hot stamping material is fully melted and firmly bonded to the surface of the target product. After hot stamping, the RFID tag's adhesion is checked to ensure it will not fall off due to external forces.

[0132] For example, the hot stamping temperature is usually controlled at 130-160° C., and the thickness of the hot melt adhesive film is between 20-100 μm.

[0133] It should be noted that it is important to select the appropriate adhesive, such as epoxy resin glue, hot melt glue or UV curing glue, according to the material of the target product and the use environment. Prepare the RFID electronic tag and ensure that its size and shape are suitable for the fixed position of the target product.

[0134] In another embodiment, adhesive is evenly coated on the back of the RFID electronic tag to ensure that the coating is uniform and free of bubbles and impurities; the RFID electronic tag coated with adhesive is placed at a designated position on the target product, and appropriate pressure is applied to ensure that the adhesive can fully contact the surface of the target product; and according to the curing characteristics of the adhesive, the adhesive is allowed to cure.

[0135] For example, for UV curing adhesive, it can be cured by UV curing equipment, and the curing time is generally between 10-30 seconds.

[0136] The present invention is therefore intended to be illustrative and non-restrictive in all respects, with the scope of the invention being defined by the appended claims rather than the foregoing description, and all changes that come within the meaning and range of equivalents of the application documents are intended to be embraced therein.

[0137] The foregoing description is intended only to provide specific embodiments of the present invention, which will enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not intended to be limited to the embodiments shown herein, but is to be construed in the widest possible manner consistent with the principles and novel features disclosed herein.

Claims

1. A method for producing an RFID electronic tag, characterized in that: The method comprises the following steps: Step S1: attaching a small antenna encapsulated with a chip to an attachment surface of a supporting base fabric and fixing it with glue, wherein the supporting base fabric is made of fabric; Step S2: Laminating the pressing strips of fabric with the supporting base fabric through a roll-to-roll lamination process, so that the pressing strips of fabric cover the electronic tag body and form a clamping and fixing structure; Step S2 includes the following steps: Step S21: In the roll-to-roll lamination process, the lamination strip and the supporting base fabric are combined under the action of a lamination roller; Step S22: a groove corresponding to the outline of the electronic tag body is provided on the surface of the pressing roller. During pressing, the electronic tag body is embedded in the groove. The pressing strip and the supporting base fabric form a clamping and fixing structure under the pressure of the pressing roller. The forming of the clamping and fixing structure between the pressing strip and the supporting base fabric under the pressure of the pressing roller in step S22 includes: The groove surface of the pressing roller is provided with groove surface protrusions, wherein the groove surface protrusions are evenly distributed in the groove; When the electronic tag body is embedded in the groove, the groove surface protrusion contacts the surface of the electronic tag body; Under the pressure of the pressing roller, the hot melt adhesive layer is evenly distributed and melted between the groove and the electronic tag body and between the pressing strip and the supporting base fabric, and forms a clamping and fixing structure after cooling; Step S23: providing a hot melt adhesive layer between the pressed fabric strips and the supporting base fabric, and simultaneously increasing the stability of the fixed structure through UV curing adhesive; Step S24: melting the hot melt adhesive layer during the lamination process to enhance the bonding strength between the lamination fabric strips and the supporting base fabric; Step S3: Multiple electronic tag bodies are arranged in an array on a base tape and transported to a roll-to-roll inspection device for functionality and consistency testing. After the test is completed, the electronic tag bodies are surface printed, laser engraved, and UV coded. The target product information is obtained and written into the RFID chip. Step S4: The base tape is transported to a cutting mechanism and cut into individual RFID electronic tags in sequence; pre-iron and cursor printing operations are performed on the cut individual RFID electronic tags; Step S5: Using an automatic conveying mechanism to suck up the cut single RFID electronic tag and fix it on the target product by sewing, sleeve, hot stamping or gluing.

2. The method for making an RFID electronic tag according to claim 1, wherein: The specific operation of attaching the small antenna packaged with the chip in step S1 is as follows: Design small antennas and amplified coupling antennas according to the performance requirements of electronic tags; The small antenna is embedded into the circuit board using the etching process of the PCB or FPC circuit board; The chip is packaged in DFN and mounted on a PCB via SMT, and connected to a small antenna to form a small tag with RF performance. The amplified coupling antenna is mounted on the carrier base fabric by stamping or bonding. The amplified coupling antenna adopts soft stainless steel wire or hard metal material. The mounting method includes embroidery thread or bonding.

3. The method for making an RFID electronic tag according to claim 1, wherein: Before attaching to the attachment surface of the carrier base cloth and fixing with glue in step S1, the following steps are included: The production batch, production date and product model traceability information of the product are written into the RFID chip through the roll-to-roll writing device; After writing is completed, the RFID chip is encrypted; Encryption processing is achieved by setting access rights in the storage area of ​​the RFID chip and setting that only authenticated devices can read or write information.

4. The method for making an RFID electronic tag according to claim 1, wherein: The electronic tag body is embedded in the groove during pressing in step S22 as follows: The grooves on the surface of the pressing roller completely correspond to the outline of the electronic tag body, and the depth of the grooves is equal to the thickness of the electronic tag body; During the lamination process, before the electronic tag body enters the lamination roller, the center position of the groove is located, and the electronic tag body is aligned and embedded in the groove.

5. The method for making an RFID electronic tag according to claim 1, wherein: The hot melt adhesive layer is evenly distributed and melted between the groove and the electronic tag body and between the pressed cloth strip and the supporting base cloth. Specifically: Before lamination, a hot melt adhesive layer is pre-applied on the laminating fabric strips. The thickness of the pre-applied hot melt adhesive layer is controlled between 0.1 and 0.3 mm. During the lamination process, pressure is applied in stages, with 30% to 50% of the total pressure applied in the first stage and the remaining 50% to 70% applied in the second stage, so that the hot melt adhesive layer gradually melts and is evenly distributed under the action of pressure; At the entrance of the laminating roller, the conveying speed of the laminating cloth strip and the supporting base cloth is controlled so that the hot melt adhesive layer is fully melted and evenly distributed when entering the laminating roller; During the lamination process, the temperature of the lamination roller is adjusted to keep it between 100% and 110% of the melting point of the hot melt adhesive, so that the hot melt adhesive layer is completely melted and evenly distributed during the lamination process.

6. The method for manufacturing an RFID electronic tag according to claim 5, wherein: The clamping and fixing structure formed after cooling is specifically: When the laminated structure enters the cooling zone immediately at the exit of the lamination roller, the temperature of the cooling zone is controlled to keep it 5 to 10 degrees Celsius below the ambient temperature; During the cooling process, the temperature is lowered in stages. The first stage is to lower the temperature to 5 degrees Celsius below the ambient temperature, and the second stage is to lower the temperature to 10 degrees Celsius below the ambient temperature, so that the hot melt adhesive layer solidifies evenly during the cooling process. During the cooling process, the cooling time is adjusted to be between 10 and 30 seconds, so that the hot melt adhesive layer is fully solidified during the cooling process; After cooling is completed, the hardness of the pressed structure is tested and the test results are recorded in the traceability database.

7. The method for manufacturing an RFID electronic tag according to claim 1, wherein: The delivery to the roll-to-roll inspection device for functionality and consistency testing in step S3 includes: Perform appearance integrity inspection on the electronic tag body, scanning its surface to identify scratches, wrinkles and breaks; Perform read and write performance tests on RFID chips to measure read and write speeds; Perform functional testing on the electronic tag, including verifying its communication protocol compatibility, signal strength, response time, and data integrity; Conduct consistency testing on the electronic tag body, including checking its dimensional accuracy, material properties, packaging quality, and matching with design specifications; Based on the results of functionality and consistency tests, qualified electronic tag bodies are transported to the next process, and unqualified electronic tag bodies are automatically rejected.

8. An RFID electronic tag, characterized in that: Used to execute the method for manufacturing an RFID electronic tag as described in claim 1, the RFID electronic tag includes a carrier base fabric, an electronic tag body, and a pressed cloth strip; the carrier base fabric is made of non-woven fabric, polyester, or silicone and has an attachment surface; the electronic tag body is composed of an RFID chip and an antenna, wherein the antenna is divided into a small antenna and an amplified coupling antenna, and is fixed to the attachment surface horizontally or vertically; the pressed cloth strip is smaller in width than the carrier base fabric, is pressed on the electronic tag body, and is formed into a clamping and fixing structure with the carrier base fabric through roll-to-roll lamination, so that the electronic tag body is clamped between the carrier base fabric and the pressed cloth strip.

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