Laminated ceramic electronic component

Abstract

The invention provides a multilayer ceramic capacitor which is easy to stabilize in a mounting state. The present invention is provided with a laminated body (10) and a pair of external electrodes (40) disposed at both end portions of the laminated body, the external electrodes including main surface-side external electrodes (411A), and in a cross-sectional view along a lamination direction (T) and a longitudinal direction (L), the external electrodes are arranged in a direction perpendicular to the lamination direction (T) and the longitudinal direction (L). The main surface-side external electrode has, on the surface thereof, a recess (510A) recessed toward the laminate side, a first protrusion (710) disposed on the center side in the longitudinal direction of the laminate with the recess therebetween, and a second protrusion (720) disposed on the end side in the longitudinal direction of the laminate. The distance (L1) in the longitudinal direction between the apex (710p) of the first boss and the apex (720p) of the second boss is longer than the distance (L2) in the longitudinal direction between the inner end (411e) of the main surface-side external electrode in the longitudinal direction and the apex of the first boss.

Description

Technical Field

[0001] The present invention relates to a multilayer ceramic electronic component. Background Art

[0002] Conventionally, multilayer ceramic capacitors are known as multilayer ceramic electronic components. Generally speaking, a multilayer ceramic capacitor comprises a rectangular parallelepiped stack composed of a plurality of dielectric layers and internal electrode layers alternately stacked, and external electrodes provided on both end surfaces of the stack. For example, Patent Document 1 discloses a multilayer ceramic capacitor having the aforementioned structure, wherein the external electrodes include a base electrode layer formed by sintering.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2003-243249

[0006] However, the external electrodes of multilayer ceramic capacitors are typically located on the principal surface of the rectangular multilayer body, which forms the widest plane. Furthermore, the surface of the external electrodes located on this principal surface has an overall curved shape (a shape with rounded corners). This reduces the contact area between the external electrodes and the substrate when the multilayer ceramic capacitor is mounted on a substrate, sometimes resulting in unstable mounting. Summary of the Invention

[0007] Problems to be solved by the invention

[0008] An object of the present invention is to provide a multilayer ceramic capacitor that can be easily stabilized during mounting.

[0009] Technical solutions to solve problems

[0010] The multilayer ceramic capacitor according to the present invention comprises: a multilayer body including a plurality of ceramic layers and a plurality of internal conductor layers alternately stacked in a height direction, and including a first main surface and a second main surface opposite to each other in the height direction, a first end surface and a second end surface opposite to each other in a length direction perpendicular to the height direction, and a first side surface and a second side surface opposite to each other in a width direction perpendicular to the height direction and the length direction; and a pair of external electrodes separately arranged at both end portions of the multilayer body in the length direction, the internal conductor layers including: a first internal conductor layer extending to the first end surface; and a second internal conductor layer extending to the second end surface, the external electrodes including: a first internal conductor layer extending to the first end surface; and a second internal conductor layer extending to the second end surface. The main surface side external electrode on at least one of the first main surface and the second main surface has, in a cross-sectional view along the height direction and the length direction, a concave portion on its surface, which is recessed toward the stacked body side; and a first convex portion and a second convex portion sandwiching the concave portion, the first convex portion being arranged on the center side in the length direction of the stacked body, and the second convex portion being arranged on the end side in the length direction of the stacked body, and a distance L1 in the length direction between the vertex of the first convex portion and the vertex of the second convex portion being longer than a distance L2 in the length direction between the inner end in the length direction of the main surface side external electrode and the vertex of the first convex portion.

[0011] Effects of the Invention

[0012] According to the present invention, it is possible to provide a multilayer ceramic capacitor that can be easily stabilized during mounting. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a perspective view of the appearance of a multilayer ceramic capacitor according to an embodiment.

[0014] Figure 2 It is along Figure 1 Cross-sectional view along line II-II.

[0015] Figure 3 It is along Figure 2 Cross-sectional view along line III-III.

[0016] Figure 4 It is along Figure 2 A cross-sectional view taken along line IV-IV.

[0017] Figure 5A yes Figure 2 The enlarged view of the portion indicated by V in FIG. 1 is a view showing a cross section of the first main surface side external electrode.

[0018] Figure 5B yes Figure 2The enlarged view of the portion indicated by V in FIG. 1 is a view showing a cross section of the first main surface side external electrode.

[0019] Figure 6A 1 is a diagram illustrating a method for manufacturing a multilayer ceramic capacitor according to an embodiment, and is a diagram illustrating a first step of forming external electrodes on a multilayer body.

[0020] Figure 6B 1 is a diagram illustrating a method for manufacturing a multilayer ceramic capacitor according to an embodiment, and is a diagram illustrating a second step of forming external electrodes on a multilayer body.

[0021] Figure 6C It is a diagram illustrating a method for manufacturing a multilayer ceramic capacitor according to an embodiment, and is a diagram illustrating a third step of forming external electrodes on a multilayer body.

[0022] Figure 7A A diagram showing a two-cell multilayer ceramic capacitor.

[0023] Figure 7B A diagram showing a triple-structured multilayer ceramic capacitor.

[0024] Figure 7C A diagram showing a quadruple-structured multilayer ceramic capacitor.

[0025] Description of Reference Numerals

[0026] 1: Multilayer ceramic capacitors (multilayer ceramic electronic components);

[0027] 10: laminate;

[0028] 11E: Counter electrode portion;

[0029] 20: dielectric layer (ceramic layer);

[0030] 30: internal electrode layer (internal conductor layer);

[0031] 31: first internal electrode layer (first internal conductor layer);

[0032] 32: second internal electrode layer (second internal conductor layer);

[0033] 35: floating internal electrode layer (floating internal conductor layer);

[0034] 40: external electrode;

[0035] 411A: first main surface side external electrode (main surface side external electrode);

[0036] 411B: first main surface side external electrode (main surface side external electrode);

[0037] 411e: inner end;

[0038] 412A: Second main surface side external electrode (main surface side external electrode);

[0039] 412B: second main surface side external electrode (main surface side external electrode);

[0040] 510A: Recessed portion (recessed portion) on the first main surface side;

[0041] 510B: Recessed portion (recessed portion) on the first main surface;

[0042] 510d: The deepest part of the concave part on the first main surface (the deepest part of the concave part);

[0043] 520A: Second main surface side concave portion (recessed portion);

[0044] 520B: Second main surface side concave portion (recessed portion);

[0045] 711A: first main surface side plating layer (main surface side plating layer);

[0046] 711B: first main surface side plating layer (main surface side plating layer);

[0047] 712A: Second main surface side plating layer (main surface side plating layer);

[0048] 712B: Second main surface side plating layer (main surface side plating layer);

[0049] 710: 1st raised portion;

[0050] 710H: Height of the first raised portion;

[0051] 710p: apex of the first convex part;

[0052] 720: second raised portion;

[0053] 720H: Height of the second raised portion;

[0054] 720p: the apex of the second convex part;

[0055] D: Depth of the concave portion on the first main surface (depth of the concave portion);

[0056] LG: outer layer on the end face side;

[0057] L: length direction;

[0058] T: stacking direction (height direction);

[0059] W: width direction;

[0060] LS1: 1st end face;

[0061] LS2: 2nd end face;

[0062] TS1: 1st main surface;

[0063] TS2: 2nd main surface;

[0064] WS1: side 1;

[0065] WS2: Side 2. DETAILED DESCRIPTION

[0066] Below, use Figures 1 to 4 A multilayer ceramic capacitor 1 as a multilayer ceramic electronic component according to an embodiment will be described. Figure 1 It is an external perspective view of a multilayer ceramic capacitor 1 according to the embodiment. Figure 2 yes Figure 1 sectional view of the multilayer ceramic capacitor 1 taken along line II-II. Figure 3 yes Figure 2 1 is a cross-sectional view of the multilayer ceramic capacitor 1 taken along line III-III. Figure 4 yes Figure 2 1 is a cross-sectional view of the multilayer ceramic capacitor 1 taken along line IV-IV.

[0067] The multilayer ceramic capacitor 1 includes a laminate 10 and external electrodes 40 .

[0068] exist Figures 1 to 4 In FIG, an XYZ orthogonal coordinate system is shown. The length direction L of the multilayer ceramic capacitor 1 and the multilayer body 10 corresponds to the X direction. The width direction W of the multilayer ceramic capacitor 1 and the multilayer body 10 corresponds to the Y direction. The stacking direction T, which is the height direction of the multilayer ceramic capacitor 1 and the multilayer body 10, corresponds to the Z direction. Here, Figure 2 The section shown is also referred to as the LT section. Figure 3 The cross section shown is also referred to as the WT cross section. Figure 4 The cross section shown is also referred to as the LW cross section.

[0069] like Figures 1 to 4 As shown, the stack 10 includes a first main surface TS1 and a second main surface TS2 opposite to each other in the stacking direction T, a first side surface WS1 and a second side surface WS2 opposite to each other in the width direction W perpendicular to the stacking direction T, and a first end surface LS1 and a second end surface LS2 opposite to each other in the length direction L perpendicular to the stacking direction T and the width direction W.

[0070] like Figure 1As shown, the laminate 10 has a generally rectangular parallelepiped shape. Furthermore, the dimension of the laminate 10 in the longitudinal direction L is not necessarily longer than the dimension in the width direction W. The corners and ridges of the laminate 10 are preferably rounded. A corner is where three surfaces of the laminate intersect, and a ridge is where two surfaces of the laminate intersect. Furthermore, concavities and convexities may be formed on part or all of the surface constituting the laminate 10.

[0071] The dimensions of the laminate 10 are not particularly limited. However, if the dimension in the longitudinal direction L of the laminate 10 is defined as the L dimension, the L dimension is preferably 0.2 mm or more and 10 mm or less. Furthermore, if the dimension in the stacking direction T of the laminate 10 is defined as the T dimension, the T dimension is preferably 0.1 mm or more and 10 mm or less. Furthermore, if the dimension in the width direction W of the laminate 10 is defined as the W dimension, the W dimension is preferably 0.1 mm or more and 10 mm or less.

[0072] like Figure 2 as well as Figure 3 As shown, the laminate 10 includes an inner layer portion 11 , and a first main surface side outer layer portion 12A and a second main surface side outer layer portion 12B arranged in the lamination direction T so as to sandwich the inner layer portion 11 .

[0073] The inner portion 11 includes a plurality of dielectric layers 20 serving as ceramic layers and a plurality of internal electrode layers 30 serving as internal conductor layers. In the stacking direction T, the inner portion 11 includes the internal electrode layer 30 located closest to the first main surface TS1 to the internal electrode layer 30 located closest to the second main surface TS2. In the inner portion 11, the plurality of internal electrode layers 30 are arranged opposite each other with the dielectric layer 20 interposed therebetween. The inner portion 11 generates capacitance and essentially functions as a capacitor.

[0074] The plurality of dielectric layers 20 are formed of a dielectric material. For example, the dielectric material may be a dielectric ceramic containing BaTiO3, CaTiO3, SrTiO3, or CaZrO3. Alternatively, the dielectric material may be a material containing these main components with the addition of secondary components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, or Ni compounds.

[0075] The thickness of dielectric layer 20 is preferably not less than 0.5 μm and not more than 30 μm. The number of dielectric layers 20 stacked is preferably not less than 10 and not more than 1500. The number of dielectric layers 20 is the sum of the number of dielectric layers in inner layer portion 11 and the number of dielectric layers in first principal surface-side outer layer portion 12A and second principal surface-side outer layer portion 12B.

[0076] The plurality of internal electrode layers 30 include first internal electrode layers 31 as a plurality of first internal conductor layers and second internal electrode layers 32 as a plurality of second internal conductor layers. The plurality of first internal electrode layers 31 are arranged on the plurality of dielectric layers 20. The plurality of second internal electrode layers 32 are arranged on the plurality of dielectric layers 20. The plurality of first internal electrode layers 31 and the plurality of second internal electrode layers 32 are alternately arranged with the dielectric layers 20 interposed therebetween in the stacking direction T of the laminate 10. The first internal electrode layers 31 and the second internal electrode layers 32 are arranged so as to sandwich the dielectric layer 20. In the following description, when it is not necessary to distinguish between the first internal electrode layers 31 and the second internal electrode layers 32, the first internal electrode layers 31 and the second internal electrode layers 32 may be collectively referred to as the internal electrode layers 30.

[0077] The first internal electrode layer 31 includes a first opposing portion 31A opposing the second internal electrode layer 32 and a first lead portion 31B led out from the first opposing portion 31A toward the first end surface LS1. The first lead portion 31B is exposed at the first end surface LS1.

[0078] The second internal electrode layer 32 includes a second opposing portion 32A opposing the first internal electrode layer 31 and a second lead portion 32B led out from the second opposing portion 32A toward the second end surface LS2. The second lead portion 32B is exposed on the second end surface LS2.

[0079] In the embodiment, the first opposing portion 31A and the second opposing portion 32A face each other with the dielectric layer 20 interposed therebetween, thereby forming capacitance and exhibiting capacitor characteristics.

[0080] The shapes of the first opposing portion 31A and the second opposing portion 32A are not particularly limited, but are preferably rectangular. However, the corners of the rectangular shape may be rounded, or the corners of the rectangular shape may be inclined. The shapes of the first lead portion 31B and the second lead portion 32B are not particularly limited, but are preferably rectangular. However, the corners of the rectangular shape may be rounded, or the corners of the rectangular shape may be inclined.

[0081] The first opposing portion 31A and the first lead portion 31B may have the same dimension in the width direction W, or one of them may be smaller. The second opposing portion 32A and the second lead portion 32B may have the same dimension in the width direction W, or one of them may be smaller.

[0082] The first internal electrode layer 31 and the second internal electrode layer 32 are formed of a suitable conductive material such as a metal such as Ni, Cu, Ag, Pd, or Au, or an alloy containing at least one of these metals. When an alloy is used, the first internal electrode layer 31 and the second internal electrode layer 32 can be formed of, for example, an Ag-Pd alloy.

[0083] The thickness of each of the first internal electrode layer 31 and the second internal electrode layer 32 is preferably about 0.2 μm to 2.0 μm, for example. The total number of the first internal electrode layers 31 and the second internal electrode layers 32 is preferably 10 to 1500.

[0084] The first principal surface-side outer layer portion 12A is located on the first principal surface TS1 side of the laminate 10. The first principal surface-side outer layer portion 12A is an aggregate of a plurality of dielectric layers 20 located between the first principal surface TS1 and the internal electrode layer 30 closest to the first principal surface TS1. The dielectric layers 20 used in the first principal surface-side outer layer portion 12A may be the same as the dielectric layers 20 used in the internal layer portion 11, or may be dielectric layers composed of different materials.

[0085] The second main surface side outer layer portion 12B is located on the second main surface TS2 side of the laminate 10. The second main surface side outer layer portion 12B is an aggregate of a plurality of dielectric layers 20 located between the second main surface TS2 and the internal electrode layer 30 closest to the second main surface TS2. The dielectric layers 20 used in the second main surface side outer layer portion 12B may be the same as the dielectric layers 20 used in the internal layer portion 11, or may be dielectric layers made of different materials.

[0086] Furthermore, the laminate 10 includes an opposing electrode portion 11E. The opposing electrode portion 11E is a portion where the first opposing portion 31A of the first internal electrode layer 31 and the second opposing portion 32A of the second internal electrode layer 32 face each other. The opposing electrode portion 11E is configured as a portion of the inner layer portion 11. Figure 4 , the range of the opposing electrode portion 11E in the width direction W and the length direction L is shown. Note that the opposing electrode portion 11E is also referred to as a capacitor effective portion.

[0087] In addition, the stacked body 10 has a side outer layer portion WG. The side outer layer portion WG has a first side outer layer portion WG1 and a second side outer layer portion WG2. The first side outer layer portion WG1 is a portion including the dielectric layer 20 located between the opposing electrode portion 11E and the first side WS1. The second side outer layer portion WG2 is a portion including the dielectric layer 20 located between the opposing electrode portion 11E and the second side WS2. Figure 3 as well as Figure 4, the range of the first side outer layer portion WG1 and the second side outer layer portion WG2 in the width direction W is shown. In addition, the side outer layer portion is also called a W interval or a side interval.

[0088] In addition, the stacked body 10 has an end face side outer layer portion LG. The end face side outer layer portion LG has a first end face side outer layer portion LG1 and a second end face side outer layer portion LG2. The first end face side outer layer portion LG1 is a portion including the dielectric layer 20 located between the opposing electrode portion 11E and the first end face LS1. The second end face side outer layer portion LG2 is a portion including the dielectric layer 20 located between the opposing electrode portion 11E and the second end face LS2. Figure 2 as well as Figure 4 , the ranges of the first end surface side outer layer portion LG1 and the second end surface side outer layer portion LG2 in the longitudinal direction L are shown. In addition, the end surface side outer layer portion is also referred to as an L interval or an end interval.

[0089] The external electrode 40 includes a first external electrode 40A arranged on the first end surface LS1 side and a second external electrode 40B arranged on the second end surface LS2 side.

[0090] The first external electrode 40A is disposed on the first end surface LS1. The first external electrode 40A is connected to the first internal electrode layer 31. The first external electrode 40A is disposed on a portion of the first main surface TS1 and a portion of the second main surface TS2. In the embodiment, the first external electrode 40A is formed to extend from the first end surface LS1 to a portion of the first main surface TS1 and a portion of the second main surface TS2, and to a portion of the first side surface WS1 and a portion of the second side surface WS2.

[0091] The second external electrode 40B is disposed on the second end surface LS2. The second external electrode 40B is connected to the second internal electrode layer 32. The second external electrode 40B is disposed on a portion of the first main surface TS1 and a portion of the second main surface TS2. In the embodiment, the second external electrode 40B is formed to extend from the second end surface LS2 to a portion of the first main surface TS1 and a portion of the second main surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2.

[0092] As described above, within the laminate 10, the first opposing portion 31A of the first internal electrode layer 31 and the second opposing portion 32A of the second internal electrode layer 32 oppose each other via the dielectric layer 20, thereby forming a capacitor. Consequently, capacitor characteristics are exhibited between the first external electrode 40A connected to the first internal electrode layer 31 and the second external electrode 40B connected to the second internal electrode layer 32.

[0093] The first external electrode 40A includes a first base electrode layer 50A containing a metal component, a first conductive resin layer 60A disposed on the first base electrode layer 50A, and a first plated layer 70A disposed on the first conductive resin layer 60A. The first plated layer 70A includes a first Ni plated layer 71A as a lower plated layer and a first Sn plated layer 72A as an upper plated layer.

[0094] The second external electrode 40B includes a second base electrode layer 50B containing a metal component, a second conductive resin layer 60B disposed on the second base electrode layer 50B, and a second plated layer 70B disposed on the second conductive resin layer 60B. The second plated layer 70B includes a second Ni plated layer 71B as a lower plated layer and a second Sn plated layer 72B as an upper plated layer.

[0095] Here, the basic structure of the layers constituting the first external electrode 40A and the second external electrode 40B is the same. Furthermore, the first external electrode 40A and the second external electrode 40B are substantially plane-symmetrical with respect to an LW cross-section taken at the center of the multilayer ceramic capacitor 1 in the longitudinal direction L. Therefore, when the first external electrode 40A and the second external electrode 40B are not specifically distinguished from each other in the description, the first external electrode 40A and the second external electrode 40B are sometimes collectively referred to as the external electrode 40. Furthermore, when the first base electrode layer 50A and the second base electrode layer 50B are not specifically distinguished from each other in the description, the first base electrode layer 50A and the second base electrode layer 50B are sometimes collectively referred to as the base electrode layer 50. Furthermore, when the first conductive resin layer 60A and the second conductive resin layer 60B are not specifically distinguished from each other in the description, the first conductive resin layer 60A and the second conductive resin layer 60B are sometimes collectively referred to as the conductive resin layer 60. In the case where the first plating layer 70A and the second plating layer 70B do not need to be specifically distinguished from each other and are described, the first plating layer 70A and the second plating layer 70B are sometimes collectively referred to as the plating layer 70. In the case where the first Ni plating layer 71A and the second Ni plating layer 71B are not need to be specifically distinguished from each other and are described, the first Ni plating layer 71A and the second Ni plating layer 71B are sometimes collectively referred to as the Ni plating layer 71. In the case where the first Sn plating layer 72A and the second Sn plating layer 72B are not need to be specifically distinguished from each other and are described, the first Sn plating layer 72A and the second Sn plating layer 72B are sometimes collectively referred to as the Sn plating layer 72.

[0096] The foundation electrode layer 50 includes a first foundation electrode layer 50A and a second foundation electrode layer 50B.

[0097] The first foundation electrode layer 50A is disposed on the first end surface LS1. The first foundation electrode layer 50A is connected to the first internal electrode layer 31. In the embodiment, the first foundation electrode layer 50A is formed to extend from the first end surface LS1 to a portion of the first main surface TS1, a portion of the second main surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2.

[0098] The second foundation electrode layer 50B is disposed on the second end surface LS2. The second foundation electrode layer 50B is connected to the second internal electrode layer 32. In the embodiment, the second foundation electrode layer 50B is formed to extend from the second end surface LS2 to a portion of the first main surface TS1, a portion of the second main surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2.

[0099] The first and second base electrode layers 50A and 50B of the embodiment are sintered layers. The sintered layers preferably contain either a metal component and a glass component or a ceramic component, or both. This improves the adhesion between the laminate 10 and the base electrode layer. The metal component may, for example, include at least one selected from Cu, Ni, Ag, Pd, an Ag-Pd alloy, Au, and the like. The glass component may, for example, include at least one selected from B, Si, Ba, Mg, Al, Li, and the like. The presence of a glass component facilitates sintering of the metal component in the base electrode layer, thereby accelerating sintering. The ceramic component may be the same or a different type of ceramic material as the dielectric layer 20. The ceramic component may, for example, include at least one selected from BaTiO3, CaTiO3, (Ba,Ca)TiO3, SrTiO3, CaZrO3, and the like.

[0100] The sintered layer is, for example, a sintered layer formed by applying a conductive paste containing glass and metal to a laminate and sintering it. The sintered layer can be formed by simultaneously sintering a laminated chip having internal electrodes and a dielectric layer and the conductive paste applied to the laminated chip, or it can be formed by sintering the laminated chip having internal electrodes and a dielectric layer, and then applying the conductive paste to the laminate and sintering it. Furthermore, when the laminated chip having internal electrodes and a dielectric layer and the conductive paste applied to the laminated chip are sintered simultaneously, the sintered layer is preferably formed by sintering a paste to which a ceramic material has been added in place of the glass component. In this case, the added ceramic material is particularly preferably the same type of ceramic material as that of the dielectric layer 20. The sintered layer can also be a plurality of layers.

[0101] The thickness of the first foundation electrode layer 50A located on the first end surface LS1 in the longitudinal direction L is preferably about 2 μm or more and 220 μm or less in the central portion in the stacking direction T and the width direction W of the first foundation electrode layer 50A.

[0102] The thickness of the second foundation electrode layer 50B located on the second end surface LS2 in the longitudinal direction L is preferably about 2 μm or more and 220 μm or less in the central portion in the stacking direction T and the width direction W of the second foundation electrode layer 50B.

[0103] When the first base electrode layer 50A is also provided on a portion of at least one of the first main surface TS1 and the second main surface TS2, the thickness of the first base electrode layer 50A provided on the portion in the stacking direction T is preferably, for example, greater than 3 μm and less than 40 μm in the central portion in the length direction L and the width direction W of the first base electrode layer 50A provided on the portion.

[0104] When the first base electrode layer 50A is also provided on a portion of at least one of the first side surface WS1 and the second side surface WS2, the thickness in the width direction of the first base electrode layer 50A provided on the portion is preferably, for example, greater than 3 μm and less than 40 μm in the central portion in the length direction L and the stacking direction T of the first base electrode layer 50A provided on the portion.

[0105] In the case where a second base electrode layer 50B is also provided on a portion of at least one of the first main surface TS1 and the second main surface TS2, the thickness of the second base electrode layer 50B provided on the portion in the stacking direction T is preferably, for example, greater than 3 μm and less than 40 μm in the central portion in the length direction L and the width direction W of the second base electrode layer 50B provided on the portion.

[0106] In the case where the second base electrode layer 50B is also provided on a portion of at least one of the first side surface WS1 and the second side surface WS2, the thickness in the width direction of the second base electrode layer 50B provided on the portion is preferably, for example, greater than 3 μm and less than 40 μm in the central portion in the length direction L and the stacking direction T of the second base electrode layer 50B provided on the portion.

[0107] The external electrode 40 includes a conductive resin layer 60 including a resin component and a metal component and disposed on the base electrode layer 50 .

[0108] The conductive resin layer 60 includes a first conductive resin layer 60A and a second conductive resin layer 60B.

[0109] The first conductive resin layer 60A is arranged to cover the first foundation electrode layer 50A. In the embodiment, the first conductive resin layer 60A is formed to extend from the first end surface LS1 to a portion of the first principal surface TS1, a portion of the second principal surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2. The second conductive resin layer 60B is arranged to cover the second foundation electrode layer 50B. In the embodiment, the second conductive resin layer 60B is formed to extend from the second end surface LS2 to a portion of the first principal surface TS1, a portion of the second principal surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2. The length L of the first conductive resin layer 60A on the first principal surface TS1 and the second principal surface TS2 is longer than the length L of the first foundation electrode layer 50A on the first principal surface TS1 and the second principal surface TS2. Furthermore, the dimensions of the second conductive resin layer 60B in the longitudinal direction L on the first and second principal surfaces TS1 and TS2 are longer than the dimensions of the second foundation electrode layer 50B in the longitudinal direction L on the first and second principal surfaces TS1 and TS2 .

[0110] The thickness of the first conductive resin layer 60A in the longitudinal direction L located on the first end surface LS1 side is preferably about 5 μm or more and 200 μm or less in the center portion in the stacking direction T and the width direction W of the first conductive resin layer 60A.

[0111] The thickness of the second conductive resin layer 60B in the longitudinal direction L located on the second end surface LS2 side is preferably about 5 μm or more and 200 μm or less in the center portion in the stacking direction T and the width direction W of the second conductive resin layer 60B.

[0112] When the first conductive resin layer 60A is also provided on a portion of the first main surface TS1 side and a portion of the second main surface TS2 side, the thickness of the first conductive resin layer 60A provided on the portion in the stacking direction T is preferably, for example, greater than 5 μm and less than 200 μm in the central portion in the length direction L and the width direction W of the first conductive resin layer 60A provided on the portion.

[0113] When the first conductive resin layer 60A is also provided on a portion of the first side surface WS1 and a portion of the second side surface WS2, the thickness in the width direction of the first conductive resin layer 60A provided in the portion is preferably, for example, greater than 5 μm and less than 200 μm in the central portion in the longitudinal direction L and the stacking direction T of the first conductive resin layer 60A provided in the portion.

[0114] When the second conductive resin layer 60B is also provided on a portion of the first main surface TS1 side and a portion of the second main surface TS2 side, the thickness of the second conductive resin layer 60B provided in the portion in the stacking direction T is preferably, for example, greater than 5 μm and less than 200 μm in the central portion in the length direction L and the width direction W of the second conductive resin layer 60B provided in the portion.

[0115] When the second conductive resin layer 60B is also provided on a part of the first side surface WS1 and a part of the second side surface WS2, the thickness in the width direction of the second conductive resin layer 60B provided in the part is preferably, for example, greater than 5 μm and less than 200 μm in the central part in the longitudinal direction L and the stacking direction T of the second conductive resin layer 60B provided in the part.

[0116] The conductive resin layer 60 is disposed on the base electrode layer 50. Furthermore, the plating layer 70 is disposed so as to cover the conductive resin layer 60. The plating layer 70 includes a Ni plating layer 71 and a Sn plating layer 72.

[0117] The conductive resin layer 60 includes a resin portion as a resin component and a conductive filler as filler powder dispersed in the resin portion.

[0118] The resin portion of the conductive resin layer 60 may also include at least one selected from various well-known thermosetting resins, such as epoxy resin, phenoxy resin, phenolic resin, urethane resin, silicone resin, and polyimide resin. Among these, epoxy resin is particularly suitable due to its excellent heat resistance, moisture resistance, and adhesion. Furthermore, the resin portion of the conductive resin layer 60 preferably includes a curing agent along with the thermosetting resin. When epoxy resin is used as the base resin, the epoxy resin curing agent may also be various well-known compounds such as phenols, amines, acid anhydrides, imidazoles, active esters, and amide-imides.

[0119] Because the conductive resin layer 60 includes such a resin portion, it is more flexible than, for example, the base electrode layer 50, which is composed of a fired product of a plating film, a metal component, and a glass component. Therefore, even when the multilayer ceramic capacitor 1 is subjected to physical shock or shock resulting from thermal cycling, the conductive resin layer 60 functions as a buffer layer. Consequently, the conductive resin layer 60 suppresses cracking in the multilayer ceramic capacitor 1.

[0120] The conductive fillers are dispersed in a substantially uniform distribution within the resin portion. They primarily contribute to the electrical conductivity of the conductive resin layer 60. Specifically, the contact between the conductive fillers creates an electrical path within the conductive resin layer 60, providing electrical continuity between the base electrode layer 50 and the plated layer 70.

[0121] The metal constituting the conductive filler can be Ag alone, or an alloy containing Ag or a metal powder coated with Ag. Ag has the lowest resistivity among metals, making it suitable for electrode materials. Furthermore, Ag is a noble metal and therefore resistant to oxidation, resulting in high weather resistance. Therefore, Ag metal powder is suitable as a conductive filler. Furthermore, when using a metal powder coated with Ag, the metal powder is preferably Cu, Ni, Sn, Bi, or an alloy powder containing these.

[0122] Furthermore, the conductive filler may be a conductive filler in which Cu or Ni has been subjected to an anti-oxidation treatment. Furthermore, the conductive filler may be a metal powder in which Sn, Ni, or Cu is coated on the surface of the metal powder. When using a metal powder in which Sn, Ni, or Cu is coated on the surface of the metal powder, the metal powder is preferably Ag, Cu, Ni, Sn, Bi, or an alloy powder thereof. The conductive filler more preferably has Cu particles as a core. Furthermore, it is more preferred that at least a portion of the surface of the Cu particles be coated with a Cu-Ag alloy of Cu and Ag. At least a portion of the surface of the Cu particles may also be coated with Ag. Thus, the affinity with the Ni plating layer becomes good, and the electrical properties become good.

[0123] The shape of the conductive filler is not particularly limited. Spherical or flat shapes can be used. A mixture of spherical and flat metal powders is preferably used. In other words, the conductive filler powder contains either flat or spherical powder.

[0124] The average particle size of the conductive filler may be, for example, 0.3 μm or more and 10 μm or less.

[0125] The average particle size of the conductive filler contained in the conductive resin layer 60 is measured by a laser diffraction particle size measurement method based on ISO 13320, regardless of the shape of the conductive filler.

[0126] The plating layer 70 includes a first plating layer 70A and a second plating layer 70B.

[0127] The first plating layer 70A is disposed to cover the first conductive resin layer 60A. In the embodiment, the first plating layer 70A is disposed to extend from the first end surface LS1 to a portion of the first and second main surfaces TS1 and TS2 and to a portion of the first and second side surfaces WS1 and WS2.

[0128] The second plating layer 70B is arranged to cover the second conductive resin layer 60B. In the embodiment, the second plating layer 70B is arranged to extend from the first end surface LS1 to a portion of the first main surface TS1 and a portion of the second main surface TS2 and a portion of the first side surface WS1 and a portion of the second side surface WS2.

[0129] The plating layer 70 preferably has a two-layer structure of a Ni plating layer 71 and a Sn plating layer 72. A first Sn plating layer 72A is preferably disposed on the first Ni plating layer 71A, and a second Sn plating layer 72B is preferably disposed on the second Ni plating layer 71B. The Ni plating layer 71 prevents corrosion of the base electrode layer 50 and the conductive resin layer 60 by the solder used when mounting the multilayer ceramic capacitor 1. The Sn plating layer 72 improves the wettability of the solder used when mounting the multilayer ceramic capacitor 1. This facilitates mounting the multilayer ceramic capacitor 1.

[0130] The thickness of each of the first Ni plating layer 71A and the first Sn plating layer 72A is preferably 1 μm or more and 15 μm or less.

[0131] The thickness of each of the second Ni plating layer 71B and the second Sn plating layer 72B is preferably not less than 1 μm and not more than 15 μm.

[0132] The above is the basic structure of the multilayer ceramic capacitor 1 according to the embodiment. Furthermore, if the dimension of the multilayer ceramic capacitor 1 in the longitudinal direction L, including the multilayer body 10 and the external electrodes 40, is defined as the L dimension, then the L dimension is preferably 0.2 mm or more and 10 mm or less. Furthermore, if the dimension of the multilayer ceramic capacitor 1 in the stacking direction T is defined as the T dimension, then the T dimension is preferably 0.05 mm or more and 10 mm or less. Furthermore, if the dimension of the multilayer ceramic capacitor 1 in the width direction W is defined as the W dimension, then the W dimension is preferably 0.1 mm or more and 10 mm or less.

[0133] The multilayer ceramic capacitor 1 of the embodiment having the above-described basic structure has the following features in the external electrodes 40 (ie, the first external electrode 40A and the second external electrode 40B).

[0134] The external electrode 40 of the embodiment includes a main surface side external electrode arranged on at least one of the first main surface TS1 and the second main surface TS2. In detail, as described above, the first external electrode 40A of the embodiment is arranged on the first end surface LS1 and is formed to extend from the first end surface LS1 to a portion of the first main surface TS1 and a portion of the second main surface TS2 and a portion of the first side surface WS1 and a portion of the second side surface WS2. That is, in the first external electrode 40A of the embodiment, as Figure 2 as well as Figure 4As shown, the first end surface side external electrode 400A as the end surface side external electrode is arranged on the first end surface LS1, the first main surface side external electrode 411A as the main surface side external electrode is arranged on the first main surface TS1, and the second main surface side external electrode 412A as the main surface side external electrode is arranged on the second main surface TS2. Figure 4 As shown, it includes a first side surface side external electrode 421A arranged on the first side surface WS1 and a second side surface side external electrode 422A arranged on the second side surface WS2.

[0135] As described above, the first external electrode 40A includes a first base electrode layer 50A, a first conductive resin layer 60A disposed on the first base electrode layer 50A, and a first plating layer 70A disposed on the first conductive resin layer 60A. Furthermore, in the embodiment, the first base electrode layer 50A is formed to extend from the first end surface LS1 to a portion of the first main surface TS1, a portion of the second main surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2. The first conductive resin layer 60A is disposed to cover the first base electrode layer 50A, and the first plating layer 70A is disposed to cover the first conductive resin layer 60A.

[0136] That is, Figure 2 as well as Figure 4 As shown, the first end face-side external electrode 400A of the embodiment includes a first end face-side base electrode layer 500A disposed on the first end face LS1, a first end face-side conductive resin layer 600A formed above the first end face-side conductive resin layer 600A, and a first end face-side plating layer 700A formed above the first end face-side conductive resin layer 600A. The first end face-side base electrode layer 500A is a portion of the first base electrode layer 50A. The first end face-side conductive resin layer 600A is a portion of the first conductive resin layer 60A. The first end face-side plating layer 700A is a portion of the first plating layer 70A and includes a first Ni plating layer 71A and a first Sn plating layer 72A formed on the first Ni plating layer 71A.

[0137] like Figure 2As shown, the first main surface-side external electrode 411A of the embodiment includes a first main surface-side base electrode layer 511A as a main surface-side base electrode layer disposed on the first main surface TS1, a first main surface-side conductive resin layer 611A as a main surface-side conductive resin layer formed above the first main surface-side base electrode layer 511A, and a first main surface-side plated layer 711A as a main surface-side plated layer formed above the first main surface-side conductive resin layer 611A. The first main surface-side base electrode layer 511A is part of the first base electrode layer 50A. The first main surface-side conductive resin layer 611A is part of the first conductive resin layer 60A. The first main surface-side plated layer 711A is part of the first plated layer 70A and includes a first Ni plated layer 71A and a first Sn plated layer 72A formed on the first Ni plated layer 71A.

[0138] like Figure 2 As shown, the second main surface-side external electrode 412A of the embodiment includes a second main surface-side base electrode layer 512A as a main surface-side base electrode layer disposed on the second main surface TS2, a second main surface-side conductive resin layer 612A as a main surface-side conductive resin layer formed above the second main surface-side base electrode layer 512A, and a second main surface-side plated layer 712A as a main surface-side plated layer formed above the second main surface-side conductive resin layer 612A. The second main surface-side base electrode layer 512A is part of the first base electrode layer 50A. The second main surface-side conductive resin layer 612A is part of the first conductive resin layer 60A. The second main surface-side plated layer 712A is part of the first plated layer 70A and includes a first Ni plated layer 71A and a first Sn plated layer 72A formed on the first Ni plated layer 71A.

[0139] like Figure 4 As shown, the first-side external electrode 421A of the embodiment includes a first-side base electrode layer 521A disposed on the first side surface WS1, a first-side conductive resin layer 621A formed above the first-side base electrode layer 521A, and a first-side plated layer 721A formed above the first-side conductive resin layer 621A. The first-side base electrode layer 521A is part of the first base electrode layer 50A. The first-side conductive resin layer 621A is part of the first conductive resin layer 60A. The first-side plated layer 721A is part of the first plated layer 70A and includes a first Ni plated layer 71A and a first Sn plated layer 72A formed on the first Ni plated layer 71A.

[0140] like Figure 4As shown, the second-side external electrode 422A of the embodiment includes a second-side base electrode layer 522A disposed on the second side surface WS2, a second-side conductive resin layer 622A formed above the second-side base electrode layer 522A, and a second-side plating layer 722A formed above the second-side conductive resin layer 622A. The second-side base electrode layer 522A is part of the first base electrode layer 50A. The second-side conductive resin layer 622A is part of the first conductive resin layer 60A. The second-side plating layer 722A is part of the first plating layer 70A and includes a first Ni plating layer 71A and a first Sn plating layer 72A formed on the first Ni plating layer 71A.

[0141] The thickness of each of the first principal surface side foundation electrode layer 511A, the second principal surface side foundation electrode layer 512A, the first lateral surface side foundation electrode layer 521A, and the second lateral surface side foundation electrode layer 522A is preferably, for example, 5 μm or more and 10 μm or less.

[0142] The thickness of each of the first Ni plating layer 71A and the first Sn plating layer 72A of the first main surface side plating layer 711A, the second main surface side plating layer 712A, the first side surface side plating layer 721A, and the second side surface side plating layer 722A is preferably 1 μm or more and 4 μm or less.

[0143] As described above, the second external electrode 40B of the embodiment is arranged on the second end surface LS2 and is formed to extend from the second end surface LS2 to a portion of the first main surface TS1 and a portion of the second main surface TS2 and a portion of the first side surface WS1 and a portion of the second side surface WS2. That is, in the second external electrode 40B of the embodiment, as shown in FIG. Figure 2 As shown, the second end surface side external electrode 400B as the end surface side external electrode is arranged on the second end surface LS2, the first main surface side external electrode 411B as the main surface side external electrode is arranged on the first main surface TS1, and the second main surface side external electrode 412B as the main surface side external electrode is arranged on the second main surface TS2, as shown in FIG. Figure 4 As shown, it includes a first side surface side external electrode 421B arranged on the first side surface WS1 and a second side surface side external electrode 422B arranged on the second side surface WS2.

[0144] As described above, the second external electrode 40B includes a second base electrode layer 50B, a second conductive resin layer 60B disposed on the second base electrode layer 50B, and a second plating layer 70B disposed on the second conductive resin layer 60B. Furthermore, in the embodiment, the second base electrode layer 50B is formed to extend from the second end surface LS2 to a portion of the first main surface TS1, a portion of the second main surface TS2, a portion of the first side surface WS1, and a portion of the second side surface WS2. The second conductive resin layer 60B is disposed to cover the second base electrode layer 50B, and the second plating layer 70B is disposed to cover the second conductive resin layer 60B.

[0145] That is, Figure 2 as well as Figure 4 As shown, the second end face-side external electrode 400B of the embodiment includes a second end face-side base electrode layer 500B disposed on the second end face LS2, a second end face-side conductive resin layer 600B formed above the second end face-side conductive resin layer 500B, and a second end face-side plating layer 700B formed above the second end face-side conductive resin layer 600B. The second end face-side base electrode layer 500B is a portion of the second base electrode layer 50B. The second end face-side conductive resin layer 600B is a portion of the second conductive resin layer 60B. The second end face-side plating layer 700B is a portion of the second plating layer 70B and includes a second Ni plating layer 71B and a second Sn plating layer 72B formed on the second Ni plating layer 71B.

[0146] like Figure 2 As shown, the first main surface-side external electrode 411B of the embodiment includes a first main surface-side base electrode layer 511B as a main surface-side base electrode layer disposed on the first main surface TS1, a first main surface-side conductive resin layer 611B as a main surface-side conductive resin layer formed above the first main surface-side base electrode layer 511B, and a first main surface-side plated layer 711B as a main surface-side plated layer formed above the first main surface-side conductive resin layer 611B. The first main surface-side base electrode layer 511B is part of the second base electrode layer 50B. The first main surface-side conductive resin layer 611B is part of the second conductive resin layer 60B. The first main surface-side plated layer 711B is part of the second plated layer 70B and includes a second Ni plated layer 71B and a second Sn plated layer 72B formed on the second Ni plated layer 71B.

[0147] like Figure 2As shown, the second main surface-side external electrode 412B of the embodiment includes a second main surface-side base electrode layer 512B as a main surface-side base electrode layer disposed on the second main surface TS2, a second main surface-side conductive resin layer 612B as a main surface-side conductive resin layer formed above the second main surface-side base electrode layer 512B, and a second main surface-side plated layer 712B as a main surface-side plated layer formed above the second main surface-side conductive resin layer 612B. The second main surface-side base electrode layer 512B is part of the second base electrode layer 50B. The second main surface-side conductive resin layer 612B is part of the second conductive resin layer 60B. The second main surface-side plated layer 712B is part of the second plated layer 70B and includes a second Ni plated layer 71B and a second Sn plated layer 72B formed on the second Ni plated layer 71B.

[0148] like Figure 4 As shown, the first-side external electrode 421B of the embodiment includes a first-side base electrode layer 521B disposed on the first side surface WS1, a first-side conductive resin layer 621B formed above the first-side base electrode layer 521B, and a first-side plated layer 721B formed above the first-side conductive resin layer 621B. The first-side base electrode layer 521B is part of the second base electrode layer 50B. The first-side conductive resin layer 621B is part of the second conductive resin layer 60B. The first-side plated layer 721B is part of the second plated layer 70B and includes a second Ni plated layer 71B and a second Sn plated layer 72B formed on the second Ni plated layer 71B.

[0149] like Figure 4 As shown, the second-side external electrode 422B of the embodiment includes a second-side base electrode layer 522B disposed on the second side surface WS2, a second-side conductive resin layer 622B formed above the second-side base electrode layer 522B, and a second-side plating layer 722B formed above the second-side conductive resin layer 622B. The second-side base electrode layer 522B is part of the second base electrode layer 50B. The second-side conductive resin layer 622B is part of the second conductive resin layer 60B. The second-side plating layer 722B is part of the second plating layer 70B and includes a second Ni plating layer 71B and a second Sn plating layer 72B formed on the second Ni plating layer 71B.

[0150] The thickness of each of the first principal surface side foundation electrode layer 511B, the second principal surface side foundation electrode layer 512B, the first lateral surface side foundation electrode layer 521B, and the second lateral surface side foundation electrode layer 522B is preferably, for example, 5 μm or more and 10 μm or less.

[0151] The thickness of the second Ni plating layer 71B and the second Sn plating layer 72B of the first main surface plating layer 711B, the second main surface plating layer 712B, the first side surface plating layer 721B, and the second side surface plating layer 722B is preferably, for example, 1 μm or more and 4 μm or less.

[0152] Figure 2 The LT cross section of the multilayer ceramic capacitor 1 and the laminate 10 along the stacking direction T and the longitudinal direction L is shown. In this LT cross section, the first main surface side external electrode 411A of the first external electrode 40A has a first main surface side recessed portion 510A as a recessed portion that is recessed toward the laminate 10 side. The first main surface side recessed portion 510A is formed on the surface of the first main surface side external electrode 411A. The first main surface side recessed portion 510A has a width direction W (i.e., perpendicular to the LT cross section) that is perpendicular to the width direction W. Figure 2 The first principal surface side recess 510A may be formed to extend in the width direction W of the first principal surface side external electrode 411A. The first principal surface side recess 510A is disposed approximately near the center of the first principal surface side external electrode 411A in the longitudinal direction L.

[0153] like Figure 2 As shown, in the LT cross-section, the second main surface side external electrode 412A of the first external electrode 40A has a second main surface side recessed portion 520A as a recessed portion that is recessed toward the laminate 10 side. The second main surface side recessed portion 520A is formed on the surface of the second main surface side external electrode 412A. The second main surface side recessed portion 520A has a width direction W (i.e., perpendicular to the LT cross-section) perpendicular to the width direction W. Figure 2 The second main surface side recess 520A may be formed to extend in the width direction W of the second main surface side external electrode 412A. The second main surface side recess 520A is disposed approximately near the center of the second main surface side external electrode 412A in the longitudinal direction L.

[0154] like Figure 2 As shown, in the LT cross-section, the first main surface side external electrode 411B of the second external electrode 40B has a first main surface side recessed portion 510B as a recessed portion that is recessed toward the laminate 10 side. The first main surface side recessed portion 510B is formed on the surface of the first main surface side external electrode 411B. The first main surface side recessed portion 510B has a width direction W (i.e., perpendicular to the LT cross-section) perpendicular to the width direction W. Figure 2 The first principal surface side recess 510B may be formed to extend in the direction of the inside and outside of the paper (in the inside and outside directions of the paper). The first principal surface side recess 510B may be formed to extend across the entire length of the first principal surface side external electrode 411B along the width direction W. The first principal surface side recess 510B is disposed approximately near the center of the first principal surface side external electrode 411B in the longitudinal direction L.

[0155] like Figure 2 As shown, in the LT cross-section, the second main surface side external electrode 412B of the second external electrode 40B has a second main surface side recessed portion 520B as a recessed portion that is recessed toward the laminate 10 side. The second main surface side recessed portion 520B is formed on the surface of the second main surface side external electrode 412B. The second main surface side recessed portion 520B has a width direction W (i.e., perpendicular to the LT cross-section) perpendicular to the width direction W. Figure 2 The second main surface side recess 520B may be formed to extend in the direction (inward and outward) of the paper. The second main surface side recess 520B may also be formed to extend across the entire length of the second main surface side external electrode 412B along the width direction W. The second main surface side recess 520B is disposed approximately near the center of the second main surface side external electrode 412B in the longitudinal direction L.

[0156] Figure 4 The LW cross section of the multilayer ceramic capacitor 1 and the laminate 10 along the longitudinal direction L and the width direction W is shown. In this LW cross section, the first side surface external electrode 421A of the first external electrode 40A has a first side surface recessed portion 530A as a recessed portion that is recessed toward the laminate 10. The first side surface recessed portion 530A is formed on the surface of the first side surface external electrode 421A. The first side surface recessed portion 530A has a longitudinal direction T (i.e., perpendicular to the LW cross section) that is perpendicular to the laminate direction T. Figure 4 The first side surface recess 530A may be formed to extend in the direction (inward and outward) of the first side surface external electrode 421A along the stacking direction T. The first side surface recess 530A is disposed approximately near the center of the first side surface external electrode 421A in the longitudinal direction L. The first side surface recess 530A may communicate with either or both of the first main surface recess 510A and the second main surface recess 520A, or may not communicate with either.

[0157] like Figure 4 As shown, in the LW cross-sectional view, the second side surface side external electrode 422A of the first external electrode 40A has a second side surface side recessed portion 540A as a recessed portion that is recessed toward the stacked body 10 side. The second side surface side recessed portion 540A is formed on the surface of the second side surface side external electrode 422A. The second side surface side recessed portion 540A has a shape that is perpendicular to the stacking direction T (i.e., Figure 4 The second side surface recess 540A may be formed to extend in the direction (inward and outward) of the second side surface external electrode 422A along the stacking direction T. The second side surface recess 540A is disposed approximately near the center of the second side surface external electrode 422A in the longitudinal direction L. The second side surface recess 540A may communicate with either or both of the first main surface recess 510A and the second main surface recess 520A described above.

[0158] like Figure 4 As shown, in the LW cross-sectional view, the first side surface side external electrode 421B of the second external electrode 40B has a first side surface side recessed portion 530B as a recessed portion that is recessed toward the stacked body 10 side. The first side surface side recessed portion 530B is formed on the surface of the first side surface side external electrode 421B. The first side surface side recessed portion 530B has a recessed portion in the stacking direction T (i.e., perpendicular to the LW cross-sectional view) that is perpendicular to the LW cross-sectional view. Figure 4 The first side surface recess 530B may be formed to extend in the direction (inward and outward) of the paper. The first side surface recess 530B may also be formed across the entire length of the first side surface external electrode 421B along the stacking direction T. The first side surface recess 530B is disposed approximately near the center of the first side surface external electrode 421B in the longitudinal direction L. The first side surface recess 530B may communicate with either or both of the first main surface recess 510B and the second main surface recess 520B described above.

[0159] like Figure 4 As shown, in the LW cross-sectional view, the second side surface external electrode 422B of the second external electrode 40B has a second side surface concave portion 540B as a concave portion that is recessed toward the stacked body 10. The second side surface concave portion 540B is formed on the surface of the second side surface external electrode 422B. The second side surface concave portion 540B has a concave portion in the stacking direction T (i.e., perpendicular to the LW cross-sectional view) that is perpendicular to the LW cross-sectional view. Figure 4 The second side surface recess 540B may be formed to extend in the direction (inward and outward) of the second side surface external electrode 422B along the stacking direction T. The second side surface recess 540B is disposed approximately near the center of the second side surface external electrode 422B in the longitudinal direction L. The second side surface recess 540B may communicate with either or both of the first main surface recess 510B and the second main surface recess 520B described above.

[0160] The first principal surface-side external electrode 411A and the second principal surface-side external electrode 412A of the first external electrode 40A, and the first principal surface-side external electrode 411B and the second principal surface-side external electrode 412B of the second external electrode 40B have the same structure. Furthermore, the first side surface-side external electrode 421A and the second side surface-side external electrode 422A of the first external electrode 40A, and the first side surface-side external electrode 421B and the second side surface-side external electrode 422B of the second external electrode 40B also have the same structure as the four principal surface-side external electrodes 411A, 412A, 411B, and 412B described above.

[0161] The first main surface side recessed portions 510A and the second main surface side recessed portions 520A of the first external electrode 40A and the first main surface side recessed portions 510B and the second main surface side recessed portions 520B of the second external electrode 40B have the same structure. Furthermore, the first side surface side recessed portions 530A and the second side surface side recessed portions 540A of the first external electrode 40A and the first side surface side recessed portions 530B and the second side surface side recessed portions 540B of the second external electrode 40B also have the same structure as the four main surface side recessed portions 510A, 520A, 510B, and 520B described above.

[0162] Therefore, as representatives of the main surface side external electrodes and main surface side recesses at these four locations and the side side external electrodes and side side recesses at these four locations, the first main surface side external electrode 411A and the first main surface side recess 510A of the first external electrode 40A are described below, thereby serving as a description of the main surface side external electrodes and main surface side recesses at the four locations and the side side external electrodes and side side recesses at the four locations.

[0163] Furthermore, the first principal surface-side external electrode 411A of the first external electrode 40A corresponds to the second principal surface-side external electrode 412A, the first side surface-side external electrode 421A, and the second side surface-side external electrode 422A of the first external electrode 40A, and the first principal surface-side external electrode 411B, the second principal surface-side external electrode 412B, the first side surface-side external electrode 421B, and the second side surface-side external electrode 422B of the second external electrode 40B. The first principal surface-side recessed portion 510A of the first external electrode 40A corresponds to the second principal surface-side recessed portion 520A, the first side surface-side recessed portion 530A, and the second side surface-side recessed portion 540A of the first external electrode 40A, and the first principal surface-side recessed portion 510B, the second principal surface-side recessed portion 520B, the first side surface-side recessed portion 530B, and the second side surface-side recessed portion 540B of the second external electrode 40B.

[0164] The first base electrode layer 50A, the first conductive resin layer 60A, and the first plating layer 70A of the first external electrode 40A correspond to the second base electrode layer 50B, the second conductive resin layer 60B, and the second plating layer 70B of the second external electrode 40B. The first Ni plating layer 71A and the first Sn plating layer 72A of the first plating layer 70A of the first external electrode 40A correspond to the second Ni plating layer 71B and the second Sn plating layer 72B of the second plating layer 70B of the second external electrode 40B.

[0165] Figure 5A as well as Figure 5B Both Figure 2 The enlarged view of the portion indicated by V is a LT cross-sectional view showing the first main surface side external electrode 411A of the first external electrode 40A. Figure 5Aas well as Figure 5B In the figure, it is shown that Figures 1 to 4 The same XYZ orthogonal coordinate system. In addition, Figure 5A as well as Figure 5B In the figures, hatching is omitted to clearly show the reference numerals, reference numeral lead lines, and dimension lines.

[0166] like Figure 5A as well as Figure 5B As shown, the first main surface side external electrode 411A of the first external electrode 40A includes a first main surface side base electrode layer 511A and a first main surface side conductive resin layer 611A arranged on the first main surface TS1, and a first main surface side plated layer 711A including a first Ni plated layer 71A and a first Sn plated layer 72A. The first main surface side recessed portion 510A is formed by three layers, namely, the outermost first Sn plated layer 72A, the first Ni plated layer 71A below the first Sn plated layer 72A, and the first main surface side conductive resin layer 611A below the first Ni plated layer 71A, in the stacking direction T (in the direction of the first main surface side recessed portion 510A). Figure 5A 、 Figure 5B In the Z direction, it is formed so as to be recessed toward the stacked body 10 side.

[0167] like Figure 5A as well as Figure 5B As shown, the surface of the first principal surface-side external electrode 411A has the aforementioned first principal surface-side recessed portion 510A, as well as a first protrusion 710 and a second protrusion 720. The first protrusion 710 is formed on the inner side of the first principal surface-side recessed portion 510A in the longitudinal direction L, that is, on the center side of the laminate 10 in the longitudinal direction L (on the side farther from the first end surface LS1 in the longitudinal direction L). The second protrusion 720 is formed on the outer side of the first principal surface-side recessed portion 510A in the longitudinal direction L, that is, on the outer side of the laminate 10 in the longitudinal direction L (on the side closer to the first end surface LS1 in the longitudinal direction L). In other words, the first main surface side external electrode 411A has a first main surface side recess 510A and a first protrusion 710 arranged on the center side in the longitudinal direction L of the stack 10 with the first main surface side recess 510A sandwiched therebetween, and a second protrusion 720 arranged on the end side in the longitudinal direction L of the stack 10.

[0168] Figure 5AReference numeral 700 indicates an area in the longitudinal direction L of the first principal surface side recessed portion 510A in the embodiment. The area 700 in the longitudinal direction L of the first principal surface side recessed portion 510A is based on the distance in the longitudinal direction L between a first midpoint 510m1 of a line connecting the deepest portion 510d of the first principal surface side recessed portion 510A and the vertex 710p of the first protruding portion 710, and a second midpoint 510m2 of a line connecting the deepest portion 510d of the first principal surface side recessed portion 510A and the vertex 720p of the second protruding portion 720. The deepest portion 510d of the first principal surface side recessed portion 510A is the portion of the first principal surface side recessed portion 510A that is closest to the first principal surface TS1 of the stacked body 10 in the stacking direction T. The vertex 710p of the first protrusion 710 is the point on the surface of the first protrusion 710 farthest from the first main surface TS1 of the stacked body 10 in the stacking direction T. The vertex 720p of the second protrusion 720 is the point on the surface of the second protrusion 720 farthest from the first main surface TS1 of the stacked body 10 in the stacking direction T.

[0169] The distance in the stacking direction T between the vertex 710p of the first protrusion 710 and the first main surface TS1 of the stacked body 10 is the height 710H of the first protrusion 710. The distance in the stacking direction T between the vertex 720p of the second protrusion 720 and the first main surface TS1 of the stacked body 10 is the height 720H ​​of the second protrusion 720.

[0170] In the embodiment, the height 710H of the first protrusion 710 is preferably greater than the height 720H ​​of the second protrusion 720. Furthermore, the height 710H of the first protrusion 710 and the height 720H ​​of the second protrusion 720 may be the same or different. In different cases, the height 710H of the first protrusion 710 may be greater than the height 720H ​​of the second protrusion 720 as described above, or conversely, the height 710H of the first protrusion 710 may be less than the height 720H ​​of the second protrusion 720.

[0171] In the embodiment, the depth D of the first main surface side recess 510A refers to the shortest distance between a line connecting the apex 710 p of the first protrusion 710 and the apex 720 p of the second protrusion 720 and the deepest portion 510 d.

[0172] In the embodiment, the depth D of the first main surface side recess 510A is preferably 3 μm or more and 10 μm or less.

[0173] In the embodiment, the depth D of the first principal surface side recess 510A is preferably greater than the thickness in the stacking direction T of the Ni plating layer 71A in the first principal surface side external electrode 411A.

[0174] like Figure 5AAs shown, in the embodiment, the distance L1 between the apex 710 p of the first protrusion 710 and the apex 720 p of the second protrusion 720 in the longitudinal direction L is preferably not less than 100 μm and not more than 400 μm.

[0175] like Figure 5A As shown, the distance L1 is preferably longer than the distance L2 in the longitudinal direction L between the inner end 411 e of the first principal-surface-side external electrode 411A and the apex 710 p of the first protrusion 710 .

[0176] exist Figure 2 In FIG. 1 , L4 represents the distance in the longitudinal direction L of the end surface side outer layer portion LG (the first end surface side outer layer portion LG1 and the second end surface side outer layer portion LG2 ) of the laminate 10 . Figure 5A , L4 represents the distance in the first end surface side outer layer portion LG1 in the longitudinal direction L. In the embodiment, the distance L1 in the longitudinal direction L between the apex 710p of the first protrusion 710 and the apex 720p of the second protrusion 720 is preferably longer than the distance L4 in the longitudinal direction L of the first end surface side outer layer portion LG1 of the laminate 10.

[0177] The distance L1 is preferably greater than the maximum thickness of the first principal-surface-side external electrode 411A in the stacking direction T. Furthermore, the distance L1 is preferably greater than the maximum thickness of the first principal-surface-side conductive resin layer 611A in the stacking direction T. Furthermore, the distance L1 is preferably greater than the maximum thickness of the first principal-surface-side base electrode layer 511A in the stacking direction T.

[0178] like Figure 5A As shown, the distance L3 in the longitudinal direction L between the inner end 411e of the first principal surface side external electrode 411A and the deepest portion 510d of the first principal surface side recess 510A is preferably longer than the distance L4 in the longitudinal direction L of the end surface side outer layer portion LG of the laminate 10. The distance L3 is preferably 300 μm or more, for example.

[0179] In the embodiment, the depth D of the first principal surface side recess 510A is preferably 5% or more and 15% or less of the maximum thickness of the first principal surface side external electrode 411A in the stacking direction T.

[0180] like Figure 5A As shown, in the embodiment, the distance L5 in the longitudinal direction L between the inner end 560 a of the first principal surface side base electrode layer 511A and the deepest portion 510 d of the first principal surface side recess 510A is preferably 15 μm or more and 150 μm or less.

[0181] like Figure 5AAs shown, in the embodiment, the distance L6 in the longitudinal direction L between the inner end 560 a of the first principal-surface-side base electrode layer 511A and the apex 710 p of the first protrusion 710 is preferably 100 μm or more and 300 μm or less.

[0182] As described above, the first main surface side recessed portion 510A is formed by recessing the three layers of the outermost first Sn plating layer 72A, the first Ni plating layer 71A below the first Sn plating layer 72A, and the first main surface side conductive resin layer 611A below the first Ni plating layer 71A toward the laminate 10 in the stacking direction T. In other words, the first main surface side base electrode layer 511A does not have a recessed portion that is recessed toward the laminate 10 in the stacking direction T.

[0183] like Figure 5B As shown, in a cross-sectional view taken along the lamination direction T and the longitudinal direction L, the first main surface side conductive resin layer 611A has a conductive resin layer recess 611c that is recessed toward the laminate 10 at the boundary surface 611k with the first Ni plating layer 71A of the first main surface side plating layer 711A. The conductive resin layer recess 611c corresponds to the first main surface side recess 510A in the longitudinal direction L and is formed at substantially the same position as the first main surface side recess 510A in the longitudinal direction L. The area of ​​the conductive resin layer recess 611c in the longitudinal direction L is substantially the same as the area of ​​the first main surface side recess 510A in the longitudinal direction L ( Figure 5A 700).

[0184] like Figure 5B As shown, in the LT cross-sectional view, the deepest portion 611d of the conductive resin layer recess 611c is located inward of the inner end portion 560a of the first principal-surface-side base electrode layer 511A, that is, in the center of the laminate 10 in the longitudinal direction L. The deepest portion 611d of the conductive resin layer recess 611c is the portion of the conductive resin layer recess 611c that is closest to the first principal surface TS1 of the laminate 10 in the stacking direction T.

[0185] The thickness 611t of the conductive resin layer 611A at the deepest portion 611d of the conductive resin layer recess 611c is preferably 5 μm to 20 μm. The thickness 611t is the distance in the stacking direction T between the deepest portion 611d and the first main surface TS1.

[0186] like Figure 5BAs shown, in a LT cross-sectional view, the first principal surface-side conductive resin layer 611A includes the conductive resin layer recess 611c described above, as well as first conductive resin layer protrusions 810 and second conductive resin layer protrusions 820. The first conductive resin layer protrusions 810 are formed inside the conductive resin layer recess 611c in the longitudinal direction L. The second conductive resin layer protrusions 820 are formed outside the conductive resin layer recess 611c in the longitudinal direction L. In other words, the first principal surface-side conductive resin layer 611A includes the conductive resin layer recess 611c, the first conductive resin layer protrusions 810 located at the center of the laminate 10 in the longitudinal direction L, sandwiching the conductive resin layer recess 611c, and the second conductive resin layer protrusions 820 located at the end portions of the laminate 10 in the longitudinal direction L.

[0187] The surface of the laminate 10 that is closest to (i.e., at the shortest distance from) the apex 810p of the first conductive resin layer protrusion 810 and the apex 820p of the second conductive resin layer protrusion 820 is the first principal surface TS1. The distance in the stacking direction T between the apex 810p of the first conductive resin layer protrusion 810 and the first principal surface TS1 of the laminate 10 is the height 810H of the first conductive resin layer protrusion 810. Furthermore, the distance in the stacking direction T between the apex 820p of the second conductive resin layer protrusion 820 and the first principal surface TS1 of the laminate 10 is the height 820H of the second conductive resin layer protrusion 820.

[0188] In the embodiment, the height 810H of the first conductive resin layer protrusion 810 is preferably greater than the height 820H of the second conductive resin layer protrusion 820. Furthermore, the height 810H of the first conductive resin layer protrusion 810 and the height 820H of the second conductive resin layer protrusion 820 may be the same or different. In different cases, the height 810H of the first conductive resin layer protrusion 810 may be greater than the height 820H of the second conductive resin layer protrusion 820 as described above, or conversely, the height 810H of the first conductive resin layer protrusion 810 may be less than the height 820H of the second conductive resin layer protrusion 820.

[0189] In the embodiment, the height 810H of the first conductive resin layer protrusion 810 is preferably 15 μm to 30 μm inclusive. On the other hand, the height 820H of the second conductive resin layer protrusion 820 is preferably 5 μm to 20 μm inclusive.

[0190] The multilayer ceramic capacitor 1 of the embodiment is mounted on a substrate. When mounting on the substrate, the external electrode 40 is sometimes joined to the terminal of the substrate by welding. When the first main surface side external electrode 411A is joined to the substrate by welding, the bending stress generated in the first main surface side external electrode 411A is particularly concentrated on Figure 5B The inner end 411e of the first principal-surface-side external electrode 411A or the inner end 611e of the first principal-surface-side conductive resin layer 611A shown in FIG. is transmitted to the laminate 10 as tensile stress, potentially causing cracks in the laminate 10. In the multilayer ceramic capacitor 1 of the embodiment, the first principal-surface-side external electrode 411A includes a first principal-surface-side recess 510A, and the first principal-surface-side conductive resin layer 611A includes a conductive resin layer recess 611c. This disperses the flexural stress to the first principal-surface-side recess 510A and the conductive resin layer recess 611c, or to the areas surrounding these recesses. This alleviates the flexural stress and suppresses cracks in the laminate 10. As a result, durability in harsh environments is improved.

[0191] When the first main surface-side external electrode 411A of the multilayer ceramic capacitor 1 according to the embodiment is mounted on a substrate (i.e., bonded to the substrate by soldering), the apex 710p of the first protrusion 710 and the apex 720p of the second protrusion 720, separated in the longitudinal direction L by the first main surface-side recess 510A, are placed on a surface of a terminal, etc., of the substrate. In other words, the first main surface-side external electrode 411A is bonded to the substrate in a two-point supported state. Furthermore, the solder enters the interior of the first main surface-side recess 510A and comes into contact with the inner surface of the first main surface-side recess 510A. The distance L1 between the apex 710p of the first protrusion 710 and the apex 720p of the second protrusion 720 in the longitudinal direction L is longer than the distance L2 between the inner end 411e of the first main surface-side external electrode 411A in the longitudinal direction L and the apex 710p of the first protrusion 710. As a result, the inner surface area of ​​the first main surface-side recess 510A increases, increasing the solder contact area. Consequently, even if the surface of the first main surface-side external electrode 411A is, for example, arcuate along the longitudinal direction L, combined with the aforementioned two-point support bonding, the substantial ground contact area with the substrate increases, strengthening the bonding to the substrate. In other words, the multilayer ceramic capacitor 1 of this embodiment is easily stabilized when mounted on a substrate.

[0192] The aforementioned dimensions, such as the thickness of each layer constituting the first principal surface-side external electrode 411A, the depth of the first principal surface-side recess 510A, and the height of each protrusion, can be measured, for example, by the following method. Specifically, the multilayer ceramic capacitor 1 is ground from the first side surface WS1 or the second side surface WS2 to a position approximately half the width direction W. This exposes a cross-section (LT) of the multilayer ceramic capacitor 1 at the exact center in the width direction W. Next, the aforementioned dimensions are measured using a digital microscope on the exposed LT cross-section.

[0193] Next, a method for manufacturing the multilayer ceramic capacitor 1 according to the embodiment will be described. The method for manufacturing the multilayer ceramic capacitor 1 according to the embodiment is not limited as long as the aforementioned requirements are met. However, a preferred manufacturing method includes the following steps. Each step is described in detail below.

[0194] A dielectric sheet for dielectric layer 20 and a conductive paste for internal electrode layer 30 are prepared. The dielectric sheet and the conductive paste for internal electrode contain a binder and a solvent. The binder and solvent may be known binders and solvents.

[0195] Conductive paste for the internal electrode layer 30 is printed on the dielectric sheet in a predetermined pattern by, for example, screen printing or gravure printing. Thus, a dielectric sheet having a pattern for the first internal electrode layer 31 and a dielectric sheet having a pattern for the second internal electrode layer 32 are prepared.

[0196] A predetermined number of dielectric sheets without an internal electrode layer pattern printed thereon are stacked to form the portion that will become the first principal surface outer layer portion 12A on the first principal surface TS1 side. A dielectric sheet with a pattern printed thereon for the first internal electrode layer 31 and a dielectric sheet with a pattern printed thereon for the second internal electrode layer 32 are sequentially stacked thereon to form the portion that will become the inner layer portion 11. A predetermined number of dielectric sheets without an internal electrode layer pattern printed thereon are stacked to form the portion that will become the second principal surface outer layer portion 12B on the second principal surface TS2 side. In this manner, a laminated sheet is produced.

[0197] The laminated sheets are pressed in the lamination direction by isostatic pressing or the like, thereby producing a laminated block.

[0198] The stacked block is cut into a predetermined size to produce stacked small pieces. At this time, the corners and ridges of the stacked small pieces may be rounded by barrel grinding or the like.

[0199] The stacked small pieces are fired to produce the stacked body 10. The firing temperature depends on the materials of the dielectric layer 20 and the internal electrode layer 30, but is preferably 900°C or higher and 1400°C or lower.

[0200] A conductive paste, which will become the base electrode layer 50, is applied to both end surfaces of the laminate 10. In the embodiment, the base electrode layer 50 is a sintered layer. For example, a conductive paste containing a glass component and a metal is applied to the laminate 10 by a method such as dipping. A sintering process is then performed to form the base electrode layer 50. The sintering process temperature is preferably between 700°C and 950°C.

[0201] In the embodiment, the first foundation electrode layer 50A is impregnated so as to extend from the first end surface LS1 to a portion of the first main surface TS1 and the second main surface TS2. Furthermore, the second foundation electrode layer 50B is impregnated so as to extend from the second end surface LS2 to a portion of the first main surface TS1 and the second main surface TS2. Furthermore, at this time, it is preferable to simultaneously impregnate the first foundation electrode layer 50A so as to extend to a portion of the first side surface WS1 and the second side surface WS2. Furthermore, it is preferable to impregnate the second foundation electrode layer 50B so as to extend to a portion of the first side surface WS1 and the second side surface WS2.

[0202] Alternatively, the pre-fired laminated pieces and the conductive paste applied to the laminated pieces can be fired simultaneously. In this case, the sintered layer is preferably formed by sintering a paste to which a ceramic material has been added in place of the glass component. In this case, the added ceramic material is particularly preferably the same type as that used in dielectric layer 20. In this case, the conductive paste is applied to the pre-fired laminated pieces, and the laminated pieces and the conductive paste applied to the laminated pieces are sintered simultaneously, thereby forming a laminate 10 having a sintered layer.

[0203] Next, the conductive resin layer 60 is formed. In addition, the conductive resin layer 60 of the embodiment is formed on the surface of the base electrode layer 50 and a portion of the surface of the laminate 10 .

[0204] First, a conductive resin paste is prepared, in which a conductive filler is dispersed in a thermosetting resin serving as the base resin for the resin portion. This conductive resin paste is produced by stirring and mixing the thermosetting resin and the conductive filler. This ensures that the conductive filler is uniformly dispersed throughout the conductive resin paste. Here, the thermosetting resin is, for example, epoxy resin. The conductive filler is, for example, Ag metal powder.

[0205] Next, a conductive resin paste is applied to the base electrode layer 50 using a dipping method and heat-treated at a temperature between 200°C and 550°C. This thermally cures the resin portion, forming the conductive resin layer 60. The heat treatment is preferably performed in an N2 atmosphere. Furthermore, to prevent scattering of the resin and oxidation of the various metal components, the oxygen concentration is preferably kept below 100 ppm.

[0206] In the embodiment, the impregnation is performed so that the first conductive resin layer 60A is arranged to extend from the first end surface LS1 to a portion of the first main surface TS1 and the second main surface TS2. Furthermore, the impregnation is performed so that the second conductive resin layer 60B is arranged to extend from the second end surface LS2 to a portion of the first main surface TS1 and the second main surface TS2. Furthermore, at this time, it is preferable to simultaneously perform the impregnation so that the first conductive resin layer 60A is arranged to extend to a portion of the first side surface WS1 and the second side surface WS2. Furthermore, it is preferable to perform the impregnation so that the second conductive resin layer 60B is arranged to extend to a portion of the first side surface WS1 and the second side surface WS2.

[0207] Then, a plating layer 70 is formed on the surface of the conductive resin layer 60. In the embodiment, a Ni plating layer 71 and a Sn plating layer 72 are formed on the conductive resin layer 60. The Ni plating layer 71 and the Sn plating layer 72 are sequentially formed using electrolytic plating. As the plating method, for example, barrel plating is preferably used.

[0208] Here, when obtaining the above-mentioned groove-shaped recessed portions in each main surface-side external electrode and each side surface-side external electrode of the external electrode 40 as in the embodiment, for example, the following methods can be used.

[0209] Figures 6A to 6C The steps of forming the base electrode layer 50 and the conductive resin layer 60 in this method are schematically shown. Figure 6A As shown, at the end portion of the laminate 10 in the longitudinal direction L, a base electrode paste 50P to be the base electrode layer 50 is applied by dip coating, and then a conductive resin paste 60P to be the conductive resin layer 60 is applied by dip coating. Figure 6B As shown, the stacked body 10 is passed between a pair of rod-shaped clamps 90 arranged facing each other. Figure 6B The middle is the inside and outside direction of the paper. Figure 6C As shown, groove-shaped recesses G are formed on both sides of conductive resin paste 60P (i.e., conductive resin layer 60) by the tips of a pair of rod-shaped jigs 90. These recesses G serve as the aforementioned first principal surface side recesses 510A, second principal surface side recesses 520A, first side surface side recesses 530A, second side surface side recesses 540A, first principal surface side recesses 510B, second principal surface side recesses 520B, first side surface side recesses 530B, and second side surface side recesses 540B. Subsequently, Ni plating layers 71 and Sn plating layers 72 are formed on conductive resin layer 60.

[0210] Furthermore, the recessed portion can be formed by appropriately adjusting the viscosity of the base electrode paste 50P and the conductive resin paste 60P or designing a dipping method.

[0211] Through the above-described manufacturing steps, the multilayer ceramic capacitor 1 can be manufactured.

[0212] The structure of the multilayer ceramic capacitor 1 is not limited to Figures 1 to 4 For example, the multilayer ceramic capacitor 1 may also be as shown in FIG. Figure 7A 、 Figure 7B as well as Figure 7C The following are multilayer ceramic capacitors with dual, triple, and quadruple structures.

[0213] Figure 7A The multilayer ceramic capacitor 1 shown is a multilayer ceramic capacitor 1 of a two-element structure, and as an internal electrode layer 30, in addition to the first internal electrode layer 33 and the second internal electrode layer 34, it also has a floating internal electrode layer 35 as a floating internal conductor layer that is not extended to either the first end surface LS1 or the second end surface LS2.

[0214] Figure 7B The illustrated multilayer ceramic capacitor 1 is a triple-structured multilayer ceramic capacitor 1 , and includes a first floating internal electrode layer 35A and a second floating internal electrode layer 35B as floating internal electrode layers 35 .

[0215] Figure 7C The illustrated multilayer ceramic capacitor 1 is a quadruple structure multilayer ceramic capacitor 1 , and includes, as floating internal electrode layers 35 , a first floating internal electrode layer 35A, a second floating internal electrode layer 35B, and a third floating internal electrode layer 35C.

[0216] By providing the floating internal electrode layer 35 as the internal electrode layer 30, the multilayer ceramic capacitor 1 has a structure in which the opposing electrode portion is divided into multiple layers. This results in a structure in which multiple capacitors are formed between the opposing internal electrode layers 30, and these capacitors are connected in series. Consequently, the voltage applied to each capacitor is reduced, enabling the multilayer ceramic capacitor 1 to achieve a higher withstand voltage. Furthermore, it goes without saying that the multilayer ceramic capacitor 1 of the embodiment can also have a multi-layer structure of four or more layers.

[0217] exist Figure 7A 、 Figure 7B as well as Figure 7C In the multilayer ceramic capacitor 1 having the structure shown, similarly to the above-described embodiment, the first external electrode 40A and the second external electrode 40B each include a main-surface-side external electrode having a main-surface-side recessed portion. Furthermore, although not shown in the figure, the conductive resin layer constituting each main-surface-side external electrode includes a conductive resin layer recessed portion that is recessed toward the laminated body at the interface with the main-surface-side plating layer.

[0218] In addition, Figure 7A 、 Figure 7B as well as Figure 7C In the multilayer ceramic capacitor 1 having the structure shown, similarly to the above-described embodiment, the first external electrode 40A and the second external electrode 40B each have a side surface external electrode having a side surface recess. Furthermore, although not shown, the conductive resin layer constituting each side surface external electrode has a conductive resin layer recessed toward the laminate at the interface with the side surface plating layer.

[0219] in particular, Figures 7A to 7C The multilayer ceramic capacitor 1 of the double, triple, and quadruple structures with the floating internal electrode layer 35 shown is effective for use under high voltage. However, under high voltage, it is preferable to apply shrinkage stress to the multilayer body 10 as a countermeasure against electrostriction. To achieve this, the plating thickness of the external electrodes on the main surface and side surfaces of the multilayer body 10 is increased. However, in this case, due to the application of Figure 5B The tensile stress at the inner end 411e of the external electrode 40 and the inner end 611e of the conductive resin layer 60A shown in the figure increases, resulting in a problem of poor flexural resistance. However, by providing recessed portions (first main surface side recessed portions and second main surface side recessed portions) in the main surface side external electrodes and recessed portions in the conductive resin layer, as in the embodiment, flexural resistance can be improved as described above, and the occurrence of cracks in the laminate 10 can be suppressed.

[0220] According to the multilayer ceramic capacitor 1 according to the embodiment described above, the following effects are achieved.

[0221] (1) A multilayer ceramic capacitor 1 according to an embodiment includes a multilayer body 10 including a plurality of dielectric layers 20 as ceramic layers and a plurality of internal electrode layers 30 as internal conductor layers alternately stacked in a stacking direction T as a height direction, and including a first main surface TS1 and a second main surface TS2 opposing each other in the stacking direction T, a first end surface LS1 and a second end surface LS2 opposing each other in a longitudinal direction L perpendicular to the stacking direction T, and a first end surface LS2 opposing each other in a width direction W perpendicular to the stacking direction T and the longitudinal direction L. The side surface WS1 and the second side surface WS2; and a pair of external electrodes 40, which are respectively arranged at the two end portions in the longitudinal direction L of the stack 10, separated from each other, the internal electrode layer 30 includes a first internal electrode layer 31 as a first internal conductor layer extended to the first end surface LS1 and a second internal electrode layer 32 as a second internal conductor layer extended to the second end surface LS2, and the external electrode 40 includes a first main surface side external electrode 411A as a main surface side external electrode respectively arranged on the first main surface TS1 and the second main surface TS2. and the second main surface side external electrode 412A and the first main surface side external electrode 411B and the second main surface side external electrode 412B, in a cross-sectional view along the stacking direction T and the length direction L, the first main surface side external electrode 411A and the second main surface side external electrode 412A and the first main surface side external electrode 411B and the second main surface side external electrode 412B each have on its surface a first main surface side recessed portion 510A and a second main surface side recessed portion 520A and a first main surface side recessed portion 510B as recessed portions that are recessed toward the stacked body 10 side As well as the second main surface side recess 520B, the first protrusion 710 arranged on the center side in the longitudinal direction L of the stack 10 with these recesses sandwiched therebetween, and the second protrusion 720 arranged on the end side in the longitudinal direction L of the stack 10, the distance L1 in the longitudinal direction between the vertex 710p of the first protrusion 710 and the vertex 720p of the second protrusion 720 is longer than the distance L2 in the longitudinal direction L between the inner end 411e in the longitudinal direction L of the main surface side external electrode and the vertex 710p of the first protrusion 710.

[0222] Thus, when the multilayer ceramic capacitor 1 is mounted on a substrate, the contact area of ​​the solder entering the recessed portion increases, thereby substantially increasing the ground contact area with the substrate, and facilitating a stable state when mounted on the substrate.

[0223] (2) In the multilayer ceramic capacitor 1 according to the embodiment, the multilayer body 10 preferably includes an opposing electrode portion 11E in which the first internal electrode layer 31 and the second internal electrode layer 32 are opposed to each other in the stacking direction T, and an end surface side outer layer portion LG located between the opposing electrode portion 11E and the first end surface LS1 and between the opposing electrode portion 11E and the second end surface LS2, respectively, and a distance L1 is longer than a distance L4 in the longitudinal direction L of the end surface side outer layer portion LG.

[0224] This allows the distance L1 between the apex 710p of the first protrusion 710 and the apex 720p of the second protrusion 720 in the longitudinal direction L to be sufficiently long. Consequently, when the multilayer ceramic capacitor 1 is mounted on a substrate, the contact area of ​​the solder entering the recessed portion is increased, thereby increasing the substantial ground contact area with the substrate, and facilitating a stable state when mounted on the substrate.

[0225] (3) In the multilayer ceramic capacitor 1 according to the embodiment, the distance L1 is preferably greater than the maximum thickness of the main surface-side external electrode in the stacking direction T.

[0226] This allows the distance L1 between the apex 710p of the first protrusion 710 and the apex 720p of the second protrusion 720 in the longitudinal direction L to be sufficiently long. Consequently, when the multilayer ceramic capacitor 1 is mounted on a substrate, the contact area of ​​the solder entering the recessed portion is increased, thereby increasing the substantial ground contact area with the substrate, and facilitating a stable state when mounted on the substrate.

[0227] (4) In the multilayer ceramic capacitor 1 according to the embodiment, preferably, a lengthwise distance L3 between the inner end 441 e of the main surface-side external electrode in the lengthwise direction L and the deepest portion 510 d of the main surface-side recess is longer than a lengthwise distance L4 of the end surface-side outer layer portion LG.

[0228] As a result, the distance L1 between the apex 710p of the first protrusion 710 and the apex 720p of the second protrusion 720 in the longitudinal direction L can be made sufficiently long. Therefore, when the multilayer ceramic capacitor 1 is mounted on a substrate, the contact area of ​​the solder entering the recessed portion is increased, thereby increasing the substantial ground contact area with the substrate, and facilitating a stable state when mounted on the substrate.

[0229] (5) In the multilayer ceramic capacitor 1 according to the embodiment, preferably, the height 710H of the first protrusion 710 is higher than the height 720H ​​of the second protrusion 720, wherein the height 710H of the first protrusion 710 is the shortest distance in the stacking direction T from the surface of the stack 10 to the vertex 710p of the first protrusion 710, and the height 720H ​​of the second protrusion 720 is the shortest distance in the stacking direction T from the surface of the stack 10 to the vertex 720p of the second protrusion 720.

[0230] Thus, when the multilayer ceramic capacitor 1 is mounted on a substrate, the amount of solder between the apex 720 p of the second protrusion 720 and the substrate surface can be increased, thereby improving the bonding strength.

[0231] (6) In the multilayer ceramic capacitor 1 according to the embodiment, preferably, when a cross-section is taken along the stacking direction T and the longitudinal direction L, and the shortest distance between a line connecting the apex 710p of the first protrusion 710 and the apex 720p of the second protrusion 720 and the deepest portion 510d of the above-mentioned recess is set as the depth D of the recess, the depth D is not less than 5% and not more than 15% of the maximum thickness of the external electrode layer on the main surface side.

[0232] This allows the recess to have a relatively large depth, thereby increasing the area within the recess and the solder contact area. Consequently, the substantial ground contact area with the substrate is increased, making the state of the device when mounted on the substrate more stable.

[0233] (7) In the multilayer ceramic capacitor 1 according to the embodiment, the internal electrode layer 30 includes a floating internal electrode layer 35 as a floating internal conductor layer, which is not extended to either the first end surface LS1 or the second end surface LS2 and is opposed to at least one of the first internal electrode layer 31 and the second internal electrode layer 32 with the dielectric layer 20 interposed therebetween.

[0234] This makes it possible to increase the withstand voltage of the multilayer ceramic capacitor 1 .

[0235] In the multilayer ceramic capacitor 1 involved in the embodiment, preferably, the distance L3 in the length direction L between the inner end 411e in the length direction L of the first main surface side external electrode 411A and the deepest part 510d of the first main surface side recess 510A is longer than the distance L4 in the length direction L of the end surface side outer layer part LG of the stack 10, and the distance L3 is, for example, greater than 300 μm.

[0236] As a result, the region of the portion of the first principal-surface-side external electrode 411A having a thickness greater than or equal to a certain value and extending over the distance L3 becomes wider, thereby increasing the mechanical strength of the inner end portion 411 e and improving the flexural resistance.

[0237] The multilayer ceramic capacitor 1 of the embodiment may have a structure in which each of the first external electrode 40A and the second external electrode 40B includes a side surface external electrode having a recess similar to that of the main surface external electrode.

[0238] That is, the multilayer ceramic capacitor 1 according to the embodiment includes:

[0239] The laminate 10 includes a plurality of dielectric layers 20 serving as ceramic layers and a plurality of internal electrode layers 30 serving as internal conductor layers alternately stacked in a stacking direction T serving as a height direction, and includes a first main surface TS1 and a second main surface TS2 opposing each other in the stacking direction T, a first end surface LS1 and a second end surface LS2 opposing each other in a longitudinal direction L orthogonal to the stacking direction T, and a first side surface WS1 and a second side surface WS2 opposing each other in a width direction W orthogonal to the stacking direction T and the longitudinal direction L; and

[0240] A pair of external electrodes 40 are disposed at both ends of the stacked body 10 in the longitudinal direction L, separated from each other.

[0241] The internal electrode layer 30 includes:

[0242] A first internal electrode layer 31 serving as a first internal conductor layer is led out to the first end surface LS1; and

[0243] The second internal electrode layer 32, which is the second internal conductor layer, is led out to the second end surface LS2.

[0244] The external electrode 40 includes a side surface external electrode disposed on at least one of the first side surface and the second side surface.

[0245] The side external electrode has, on its surface, in a cross-sectional view along the height direction and the length direction, a recessed portion recessed toward the stacked body; and a first protruding portion and a second protruding portion sandwiching the recessed portion, the first protruding portion being arranged at the center side in the length direction of the stacked body, and the second protruding portion being arranged at the end side in the length direction of the stacked body.

[0246] A distance L1 between the apex of the first protrusion and the apex of the second protrusion in the longitudinal direction is longer than a distance L2 between the inner end of the side external electrode in the longitudinal direction and the apex of the first protrusion.

[0247] The present invention is not limited to the configuration of the above embodiment, and can be applied with appropriate modifications within the scope of the present invention. In addition, a combination of two or more configurations of the preferred configurations described in the above embodiment also constitutes the present invention.

[0248] For example, the multilayer ceramic capacitor 1 may be a two-terminal multilayer ceramic capacitor including two external electrodes, or may be a multi-terminal multilayer ceramic capacitor including a plurality of external electrodes.

[0249] In the above embodiment, a laminated ceramic capacitor using dielectric ceramics is exemplified as a laminated ceramic electronic component. However, the laminated ceramic electronic component of the present disclosure is not limited to this application and can be applied to various laminated ceramic electronic components, such as piezoelectric components using piezoelectric ceramics, thermistors using semiconductor ceramics, and inductors using magnetic ceramics. Examples of piezoelectric ceramics include PZT (lead zirconate titanate) ceramics, semiconductor ceramics include spinel ceramics, and magnetic ceramics include ferrites.

[0250] Although the external electrode 40 in the embodiment includes the conductive resin layer 60 , the external electrode 40 may not include the conductive resin layer 60 .

[0251] The present disclosure includes the following combinations. [1]

[0253] A laminated ceramic electronic component comprising:

[0254] a laminate comprising a plurality of ceramic layers and a plurality of internal conductor layers alternately stacked in a height direction, and comprising a first main surface and a second main surface opposing each other in the height direction, a first end surface and a second end surface opposing each other in a length direction perpendicular to the height direction, and a first side surface and a second side surface opposing each other in a width direction perpendicular to the height direction and the length direction; and

[0255] A pair of external electrodes are disposed at both ends of the stack in the longitudinal direction thereof, separated from each other.

[0256] The inner conductor layer comprises:

[0257] a first internal conductor layer extending to the first end surface; and

[0258] The second internal conductor layer is led out to the second end surface,

[0259] The external electrodes include a main surface side external electrode arranged on at least one of the first main surface and the second main surface,

[0260] In a cross-sectional view along the height direction and the length direction, the main surface side external electrode has on its surface:

[0261] a recessed portion recessed toward the laminated body; and

[0262] a first protrusion and a second protrusion sandwiching the recess, wherein the first protrusion is disposed at a center side in the longitudinal direction of the stacked body, and the second protrusion is disposed at an end side in the longitudinal direction of the stacked body;

[0263] A distance L1 between the apex of the first protrusion and the apex of the second protrusion in the longitudinal direction is longer than a distance L2 between the inner end of the principal surface side external electrode in the longitudinal direction and the apex of the first protrusion. [2]

[0265] The multilayer ceramic electronic component according to [1], wherein

[0266] The laminate includes an opposing electrode portion in which the first internal conductive layer and the second internal conductive layer are opposed to each other in the height direction, and end surface side outer layer portions located between the opposing electrode portion and the first end surface and between the opposing electrode portion and the second end surface, respectively.

[0267] The distance L1 is longer than a distance L4 of the end surface side outer layer portion in the longitudinal direction. [3]

[0269] The multilayer ceramic electronic component according to [1] or [2], wherein

[0270] The distance L1 is greater than the maximum thickness of the main-surface-side external electrode in the height direction. [4]

[0272] The multilayer ceramic electronic component according to any one of [1] to [3], wherein

[0273] A distance L3 in the longitudinal direction between the inner end portion of the main surface side external electrode in the longitudinal direction and the deepest portion of the recess is longer than a distance L4 in the longitudinal direction of the end surface side outer layer portion. [5]

[0275] The multilayer ceramic electronic component according to any one of [1] to [4], wherein

[0276] The height of the first protrusion is higher than that of the second protrusion. The height of the first protrusion is the shortest distance in the height direction from the surface of the stack to the vertex of the first protrusion, and the height of the second protrusion is the shortest distance in the height direction from the surface of the stack to the vertex of the second protrusion. [6]

[0278] The multilayer ceramic electronic component according to any one of [1] to [5], wherein

[0279] In a state where the main surface side external electrode is cross-sectionally viewed along the height direction and the length direction,

[0280] When the shortest distance between a line connecting the apex of the first protrusion and the apex of the second protrusion and the deepest part of the concave portion is set as the depth of the concave portion, the depth of the concave portion is greater than or equal to 5% and less than or equal to 15% of the maximum thickness of the main surface side external electrode layer. [7]

[0282] The multilayer ceramic electronic component according to any one of [1] to [6], wherein

[0283] The internal conductive layer includes a floating internal conductive layer that is not drawn out to either the first end surface or the second end surface and faces at least one of the first internal conductive layer and the second internal conductive layer with the ceramic layer interposed therebetween.

Claims

1. A multilayer ceramic electronic component comprising: a laminate comprising a plurality of ceramic layers and a plurality of internal conductor layers alternately stacked in a height direction, and comprising a first main surface and a second main surface opposing each other in the height direction, a first end surface and a second end surface opposing each other in a length direction perpendicular to the height direction, and a first side surface and a second side surface opposing each other in a width direction perpendicular to the height direction and the length direction; and A pair of external electrodes are disposed at both ends of the stack in the longitudinal direction thereof, separated from each other. The inner conductor layer comprises: a first internal conductor layer extending to the first end surface; and The second internal conductor layer is led out to the second end surface, The external electrodes include a main surface side external electrode arranged on at least one of the first main surface and the second main surface, In a cross-sectional view along the height direction and the length direction, the main surface side external electrode has on its surface: a recessed portion recessed toward the laminated body; and a first protrusion and a second protrusion sandwiching the recess, wherein the first protrusion is disposed at a center side in the longitudinal direction of the stacked body, and the second protrusion is disposed at an end side in the longitudinal direction of the stacked body; A distance L1 between the apex of the first protrusion and the apex of the second protrusion in the longitudinal direction is longer than a distance L2 between the inner end of the principal surface side external electrode in the longitudinal direction and the apex of the first protrusion.

2. The multilayer ceramic electronic component according to claim 1, wherein The laminate includes an opposing electrode portion in which the first internal conductive layer and the second internal conductive layer are opposed to each other in the height direction, and end surface side outer layer portions located between the opposing electrode portion and the first end surface and between the opposing electrode portion and the second end surface, respectively. The distance L1 is longer than a distance L4 of the end surface side outer layer portion in the longitudinal direction.

3. The multilayer ceramic electronic component according to claim 1 or 2, wherein The distance L1 is greater than the maximum thickness of the main-surface-side external electrode in the height direction.

4. The multilayer ceramic electronic component according to any one of claims 1 to 3, wherein A distance L3 in the longitudinal direction between the inner end portion of the main surface side external electrode in the longitudinal direction and the deepest portion of the recess is longer than a distance L4 in the longitudinal direction of the end surface side outer layer portion.

5. The multilayer ceramic electronic component according to any one of claims 1 to 4, wherein The height of the first protrusion is higher than that of the second protrusion. The height of the first protrusion is the shortest distance in the height direction from the surface of the stack to the vertex of the first protrusion, and the height of the second protrusion is the shortest distance in the height direction from the surface of the stack to the vertex of the second protrusion.

6. The multilayer ceramic electronic component according to any one of claims 1 to 5, wherein In a state where the main surface side external electrode is cross-sectionally viewed along the height direction and the length direction, When the shortest distance between a line connecting the apex of the first protrusion and the apex of the second protrusion and the deepest part of the concave portion is set as the depth of the concave portion, the depth of the concave portion is greater than or equal to 5% and less than or equal to 15% of the maximum thickness of the main surface side external electrode layer.

7. The multilayer ceramic electronic component according to any one of claims 1 to 6, wherein The internal conductive layer includes a floating internal conductive layer that is not drawn out to either the first end surface or the second end surface and faces at least one of the first internal conductive layer and the second internal conductive layer with the ceramic layer interposed therebetween.

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