Semiconductor manufacturing apparatus, push-up unit, and method for manufacturing semiconductor device

Abstract

The invention provides a semiconductor manufacturing apparatus, a push-up unit, and a method of manufacturing a semiconductor device. A novel mechanism for driving a plurality of blocks of the push-up unit is used. The push-up unit is provided with a mechanism unit that independently imparts vertical movement to each of the plurality of blocks. The mechanism part is provided with a first mechanism part having: (a) a first member having an upper surface, a lower surface opposite the upper surface, and a through-hole penetrating between the upper surface and the lower surface; (b) a first lever that is connected to the upper surface of the first member and transmits the vertical movement of the first member to the block; and (c) a second lever that passes through the through-hole, extends from below, and transmits vertical movement to the block.

Description

Technical Field

[0001] The present invention relates to a semiconductor manufacturing apparatus and can be applied to, for example, a die mounter having a push-up unit. Background Art

[0002] One of the steps in the semiconductor device manufacturing process is the peeling process, which involves peeling the bare chips separated from the wafer from the dicing tape. In this peeling process, for example, a push-up unit pushes the bare chips up from the back of the dicing tape, peeling the bare chips one by one from the dicing tape held in the wafer supply unit. The bare chips are then picked up using a suction nozzle, such as a collet, mounted on a pickup head or placement head.

[0003] For example, the push-up unit peels off the dicing tape from the periphery of the bare chip by moving a plurality of blocks up and down. Sometimes, a drive unit composed of a motor and a push rod mechanism is provided for each block (for example, Patent Document 1).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2017-224640 Summary of the Invention

[0007] The present invention aims to provide a novel mechanism for driving a plurality of blocks of a push-up unit. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings.

[0008] The outline of the representative aspects of the present invention will be briefly described as follows.

[0009] That is, the push-up unit includes a mechanism portion that independently imparts vertical movement to the plurality of blocks. The mechanism portion includes a first mechanism portion, the first mechanism portion including: (a) a first component having an upper surface, a lower surface opposite to the upper surface, and a through hole extending between the upper surface and the lower surface; (b) a first rod connected to the upper surface of the first component and transmitting the vertical movement of the first component to the blocks; and (c) a second rod extending from below through the through hole and transmitting the vertical movement to the blocks.

[0010] Effects of the Invention

[0011] According to the present invention, for example, the number of push-up blocks can be increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic plan view showing a configuration example of a die mounter in the embodiment.

[0013] Figure 2 It means Figure 1A diagram of the schematic structure when viewed from the direction of arrow A.

[0014] Figure 3 Yes Figure 1 A schematic cross-sectional view of the main parts of the wafer supply unit is shown.

[0015] Figure 4 Yes Figure 1 The block diagram shows the schematic structure of the control system of the chip mounter.

[0016] Figure 5 Is to use Figure 1 FIG. 1 is a flow chart of a method for manufacturing a semiconductor device using a chip mounter.

[0017] Figure 6 It is a front view of the push-up unit in the embodiment.

[0018] Figure 7 It is schematically represented Figure 6 Diagram of the push-up unit shown.

[0019] Figure 8 yes Figure 6 A top view of the head is shown.

[0020] Figure 9 yes Figure 6 A longitudinal sectional view of the upper plate portion is shown.

[0021] Figure 10 yes Figure 9 A cross-sectional view of the upper plate portion taken along line CC is shown.

[0022] Figure 11 yes Figure 9 A cross-sectional view of the upper plate portion taken along line EE is shown.

[0023] Figure 12 yes Figure 6 A longitudinal sectional view of the lower block is shown.

[0024] Figure 13 yes Figure 12 A cross-sectional view of the lower block at line FF is shown.

[0025] Figure 14 Yes Figure 6 A top view of an example of the arrangement of the drive unit shown.

[0026] Figure 15 Yes Figure 6 A side view of an example of the arrangement of the drive unit shown.

[0027] Figure 16 Yes Figure 15 FIG. 1 is a diagram showing an example of the structure of the driving unit.

[0028] Figure 17 Yes Figure 15 FIG. 2 is a diagram showing another example of the structure of the driving unit.

[0029] Description of Reference Numerals

[0030] 1. Chip mounter (semiconductor manufacturing equipment)

[0031] 13···Push-up unit

[0032] 100···Head

[0033] B1~B7···block

[0034] 200···Organization Department

[0035] 210···Upper plate (first mechanism, second mechanism)

[0036] UP···Upper plate (Part 1, Part 2)

[0037] UR···Upper pole (1st pole, 2nd pole, 3rd pole)

[0038] 220···Lower block (first mechanism, second mechanism)

[0039] LB···Lower block (first part, second part)

[0040] LR···Lower pole (1st pole, 2nd pole, 3rd pole)

[0041] 300···Drive unit

[0042] M···Motor

[0043] PM···Drive output section DETAILED DESCRIPTION

[0044] The following describes the embodiments using the accompanying drawings. However, in the following description, identical components may be denoted by the same reference numerals, and duplicate descriptions may be omitted. Furthermore, to clarify the description, the drawings may schematically represent the width, thickness, shape, and other aspects of various components, as compared to their actual appearance. Furthermore, the dimensional relationships and ratios of the various elements may not necessarily be consistent across multiple drawings.

[0045] use Figures 1 to 3 The structure of a die mounter as one embodiment of a semiconductor manufacturing apparatus will be described. Figure 1 It is a schematic plan view showing a configuration example of a die mounter in the embodiment. Figure 2 It means Figure 1A diagram of the schematic structure when viewed from the direction of arrow A. Figure 3 Yes Figure 1 A schematic cross-sectional view of the main parts of the wafer supply unit is shown.

[0046] The die bonder 1 generally comprises a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a placement unit 40, a conveyor unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (control device) 80. The Y2-Y1 direction represents the front-to-back direction of the die bonder 1, the X2-X1 direction represents the left-to-right direction, and the Z1-Z2 direction represents the up-down direction. The wafer supply unit 10 is located at the front of the die bonder 1, and the placement unit 40 is located at the rear.

[0047] The wafer supply unit 10 includes a wafer cassette elevator 11 , a wafer holding table 12 , a push-up unit 13 , and a wafer recognition camera 14 .

[0048] The wafer cassette elevator 11 moves a wafer cassette (not shown) containing multiple wafer rings WR up and down to a wafer transfer height. A wafer alignment chute (not shown) aligns the wafer rings WR supplied from the wafer cassette elevator 11. A wafer unloader (not shown) removes wafer rings WR from the wafer cassette and supplies them to the wafer holding table 12, or removes them from the wafer holding table 12 and stores them in the wafer cassette.

[0049] The wafer holding table 12 includes an expansion ring 121 for holding the wafer ring WR and a support ring 122 for holding the wafer ring WR and horizontally positioning the dicing tape DT.

[0050] A wafer W, which is divided into multiple bare chips D, is bonded (attached) to the dicing tape DT. The dicing tape DT is transparent to visible light. A film-like adhesive material DF, called a die attach film (DAF), is attached between the wafer W and the dicing tape DT. The adhesive material DF cures by heating.

[0051] The wafer holding table 12 is moved in the X1-X2 and Y1-Y2 directions by a drive unit (not shown), moving the picked-up bare chip D toward the position of the push-up unit 13. Furthermore, the wafer holding table 12 is rotated within the XY plane by a drive unit (not shown). The push-up unit 13 is moved vertically by a drive unit (not shown). The push-up unit 13 peels the bare chip D from the dicing tape DT. The wafer holding table 12 and the push-up unit 13 constitute a pickup device. The pickup device may also include a pickup unit 20.

[0052] When pushing up the bare die D, the wafer holding table 12 lowers the expansion ring 121 holding the wafer ring WR. At this time, since the support ring 122 does not descend, the dicing tape DT held by the wafer ring WR is stretched, increasing the spacing between the bare die D. This prevents interference and contact between the bare die D, allowing for separation and easier pushing up. The expansion ring 121 and support ring 122 are collectively referred to as the expander. The push-up unit 13 pushes the bare die D upward from below, allowing for separation of the bare die D, thereby improving the collet's ability to pick up the bare die D.

[0053] The wafer recognition camera 14 recognizes the pickup position of the bare chip D picked up from the wafer W and performs surface inspection of the bare chip D.

[0054] The pickup unit 20 includes a pickup head 21 and a Y-drive unit 23. The pickup head 21 is provided with a collet 22, which holds the peeled bare chip D at its front end by suction. The pickup head 21 picks up the bare chip D from the wafer supply unit 10 and places it on the intermediate stage 31. The Y-drive unit 23 moves the pickup head 21 in the Y1-Y2 direction. The pickup unit 20 includes various drive units (not shown) that raise and lower, rotate, and move the pickup head 21 in the X direction.

[0055] The intermediate stage unit 30 includes an intermediate stage 31 on which a bare chip D is placed, and a stage recognition camera 34 for identifying the bare chip D on the intermediate stage 31. The intermediate stage 31 has suction holes for sucking the placed bare chip D. The placed bare chip D is temporarily held on the intermediate stage 31. The intermediate stage 31 serves as a placement stage for placing the bare chip D and also as a pickup stage for picking up the bare chip D.

[0056] The mounting section 40 includes a mounting head 41, a Y drive section 43, a substrate recognition camera 44, and a mounting platform 46. The mounting head 41 is provided with a collet 42, which adsorbs and holds the bare chip D at the front end. The Y drive section 43 moves the mounting head 41 in the Y1-Y2 direction. The substrate recognition camera 44 captures the position recognition mark (not shown) on the substrate S to identify the mounting position. Here, a plurality of product areas (hereinafter referred to as package areas P) that ultimately become one package are formed on the substrate S. Position recognition marks are provided for each package area P. When the bare chip D is placed on the substrate S, the mounting platform 46 rises and supports the substrate S from below. The mounting platform 46 has a suction port (not shown) for vacuum adsorption of the substrate S, which can fix the substrate S. The mounting platform 46 has a heating section (not shown) for heating the substrate S. The mounting section 40 includes various drive sections (not shown) that lift, rotate, and move the mounting head 41 in the X direction.

[0057] With this configuration, the placement head 41 corrects the pickup position and posture based on the image data from the stage recognition camera 34, and picks up the bare chip D from the intermediate stage 31. Furthermore, the placement head 41 places the bare chip D on the package area P of the substrate S based on the image data from the substrate recognition camera 44, or places the bare chip D in a stacked form on a bare chip already placed on the package area P of the substrate S.

[0058] The transport unit 50 includes a transport claw 51 that grips and transports a substrate S, and a transport path 52 along which the substrate S moves. The substrate S is moved in the X direction by a ball screw (not shown) provided along the transport path 52, which drives a nut (not shown) attached to the transport claw 51 of the transport path 52. With this structure, the substrate S moves from the substrate supply unit 60 along the transport path 52 to the placement position. After placement, the substrate S moves to the substrate removal unit 70, where it is delivered.

[0059] The substrate supply unit 60 takes out the substrate S held in the transport jig and carried in from the transport jig and supplies it to the transport unit 50. The substrate unloading unit 70 holds the substrate S transported by the transport unit 50 on the transport jig.

[0060] Next, use Figure 4 The control unit 80 will be described. Figure 4 Yes Figure 1 The block diagram shows the schematic structure of the control system of the chip mounter.

[0061] The control system 8 includes a control unit (control device) 80, a drive unit 86, a signal unit 87, an optical system 88, and the like. The control unit 80 generally comprises a control and computing device 81, primarily composed of a CPU (Central Processing Unit), a storage device 82, an input / output device 83, a bus 84, and a power supply 85. The storage device 82 includes a main storage device 82a and an auxiliary storage device 82b. The main storage device 82a comprises a RAM (Random Access Memory) that stores processing programs, etc. The auxiliary storage device 82b comprises an HDD (Hard Disk Drive) or SSD (Solid State Drive), etc., that stores control data and image data required for control.

[0062] The input / output device 83 includes a monitor 83a that displays device status and information, a touch panel 83b for inputting operator instructions, a mouse 83c for operating the monitor 83a, and an image capture device 83d for capturing image data from the optical system 88. The input / output device 83 also includes a motor control unit 83e and an I / O signal control unit 83f. The motor control unit 83e controls the XY stage (not shown) of the wafer supply unit 10, the ZY drive axes of the placement head stage, and the drive unit of the push-up unit 13. The I / O signal control unit 83f receives signals from and controls a signal unit 87 that includes various sensors and switches or knobs for controlling the brightness of lighting devices. The optical system 88 includes the wafer recognition camera 14, the stage recognition camera 34, and the substrate recognition camera 44. The control and calculation unit 81 receives necessary data and performs calculations via the bus 84, controls the pickup head 21, and transmits information to the monitor 83a and other devices.

[0063] use Figure 5 A part of the manufacturing process of a semiconductor device (a method of manufacturing a semiconductor device) using the die mounter 1 will be described. Figure 5 Is to use Figure 1 In the following description, the operation of each component constituting the die mounter 1 is controlled by the control unit 80 .

[0064] (Wafer loading process: process S1)

[0065] The wafer ring WR is supplied to the wafer cassette of the wafer cassette elevator 11. The supplied wafer ring WR is supplied to the wafer holding table 12.

[0066] (Substrate loading process: process S2)

[0067] The transport jig holding the substrate S is supplied to the substrate supply unit 60 . The substrate supply unit 60 takes out the substrate S from the transport jig and fixes the substrate S to the transport claws 51 .

[0068] (Picking process: process S3)

[0069] After step S1, the wafer holding table 12 is moved so that the desired bare chip D can be picked up from the dicing tape DT. The bare chip D is imaged by the wafer recognition camera 14, and the bare chip D is positioned and inspected based on the image data obtained. Image processing is performed on the image data to calculate the offset (in the X, Y, and θ directions) of the bare chip D on the wafer holding table 12 from the die placement machine's bare chip position reference point, and then position the bare chip. Furthermore, the wafer holding table 12 is pre-set and maintained at a predetermined position with respect to the bare chip position reference point as the initial setting of the device. Image processing is performed on the image data to inspect the surface of the bare chip D.

[0070] The positioned bare chip D is peeled from the dicing tape DT by the push-up unit 13 and the pickup head 21. The bare chip D peeled from the dicing tape DT is sucked and held by the collet 22 provided on the pickup head 21, and is transported and placed on the intermediate stage 31.

[0071] The stage recognition camera 34 captures the bare chip D on the intermediate stage 31. The resulting image data is used to perform positioning and surface inspection of the bare chip D. Image processing is performed on the image data to calculate the offset (in the X, Y, and θ directions) of the bare chip D on the intermediate stage 31 from the die placement machine's bare chip position reference point, allowing for positioning. Furthermore, the intermediate stage 31 is pre-set and maintained at a predetermined position with respect to the bare chip position reference point as the initial setting for the device. Image processing is then performed on the image data to perform surface inspection of the bare chip D.

[0072] The pickup head 21 that has conveyed the bare chip D to the intermediate stage 31 returns to the wafer supply unit 10. The next bare chip D is peeled from the dicing tape DT in the above-described order, and the bare chips D are subsequently peeled from the dicing tape DT one by one in the same order.

[0073] (Placement process: process S4)

[0074] The conveying unit 50 conveys the substrate S to the mounting platform 46. The substrate S placed on the mounting platform 46 is photographed by the substrate recognition camera 44, and the positioning and surface inspection of the substrate S are performed based on the image data obtained by the photography. By performing image processing on the image data, the offset (X, Y, and θ directions) of the substrate S from the substrate position reference point of the chip mounter 1 is calculated. In addition, the predetermined position of the mounting unit 40 is pre-set as the initial setting of the device and maintained. By performing image processing on the image data, the surface inspection of the substrate S is performed.

[0075] The suction position of the placement head 41 is corrected based on the offset of the bare chip D on the intermediate stage 31 calculated in step S3, and the bare chip D is suctioned by the collet 42. The placement head 41, having suctioned the bare chip D from the intermediate stage 31, places the bare chip D on a predetermined portion of the substrate S supported on the placement stage 46. The predetermined portion of the substrate S is the package area P of the substrate S, an area where components are already placed and added to the area, or a placement area for stacked components. The bare chip D placed on the substrate S is photographed by the substrate recognition camera 44, and based on the image data obtained by the photography, an inspection is performed to determine whether the bare chip D is placed in the desired position.

[0076] The placement head 41 that has placed the bare chip D on the substrate S returns to the intermediate stage 31. Following the above sequence, the next bare chip D is picked up from the intermediate stage 31 and placed on the substrate S. This sequence is repeated to place bare chips D on all the packaging areas P of the substrate S.

[0077] (Substrate Unloading Step: Step S5)

[0078] The substrate S with the bare chip D mounted thereon is conveyed to the substrate unloading unit 70. The substrate S is taken out from the conveying claws 51 by the substrate unloading unit 70 and stored in a conveying jig. The conveying jig storing the substrate S is unloaded from the die mounter 1.

[0079] As described above, the bare chip D is mounted on the substrate S and unloaded from the die mounter 1. Then, for example, the transport jig holding the substrate S with the mounted bare chip D is transported to a wire bonding process, where the electrodes of the bare chip D are electrically connected to the electrodes of the substrate S via Au wires or the like. The substrate S is then transported to an injection molding process, where the bare chip D and the Au wires are sealed with an injection resin (not shown), completing the semiconductor package.

[0080] Next, use Figure 6 and Figure 7 The outline of the push-up unit 13 will be described. Figure 6 It is a front view of the push-up unit in the embodiment. Figure 7 It is schematically represented Figure 6 Diagram of the push-up unit shown.

[0081] like Figure 6 As shown, the push-up unit 13 includes a head 100, a mechanism 200, and a drive 300. Figure 7As shown, the head 100 includes a push-up block unit BLK having a plurality of blocks B1 to B8. The mechanism unit 200 drives the blocks B1 to B8 in the vertical direction. The mechanism unit 200 includes an upper plate 210, which serves as the first or second mechanism unit, and a lower block unit 220, which serves as the first or second mechanism unit. The drive unit 300 generates vertical movement and transmits it to the lower block unit 220. The lower block unit 220 transmits the vertical movement generated by the drive unit 300 to the upper plate 210. The upper plate 210 transmits the vertical movement generated by the lower block unit 220 to the head 100.

[0082] Alternatively, the mechanism unit 200 may be configured as an upper plate 210 and a drive unit 300. In this case, the drive unit 300 generates vertical movement and transmits it to the upper plate 210. The upper plate 210 transmits the vertical movement generated by the drive unit 300 to the head 100. Alternatively, the mechanism unit 200 may be configured as a lower block 220 and a drive unit 300. In this case, the drive unit 300 generates vertical movement and transmits it to the lower block 220. The lower block 220 transmits the vertical movement generated by the drive unit 300 to the head 100.

[0083] like Figure 7 As shown, blocks B1 to B8 can independently move up and down by drive shafts ND1 to ND8 of the mechanism unit 200 and the drive unit 300. The drive shafts ND1 to ND8 are driven by motors M (see Figure 16 ) and a push rod mechanism that converts the rotation of the motor M into vertical movement, thereby imparting vertical movement to the blocks B1 to B8. The push rod mechanism is composed of the upper plate portion 210, the lower block portion 220, and the portion of the drive portion 300 excluding the motor M.

[0084] use Figure 6 and Figure 8 The head 100 will be described. Figure 8 yes Figure 6 A top view of the head is shown.

[0085] like Figure 8 As shown, the head 100 includes a dome 110 and an upper push block portion BLK provided in the dome 110. The dome 110 is composed of a cylindrical component 111, a disc-shaped component 112 provided at the upper end of the cylindrical component 111, and a cylindrical component 113. An opening is provided in the central portion of the disc-shaped component 112, and the upper push block portion BLK can move up and down through the opening. A plurality of suction ports 112a and a plurality of grooves 112b connecting the plurality of suction ports 112a are provided on the peripheral portion of the disc-shaped component 112. When the upper push unit 13 is raised so that its upper surface contacts the back side of the cutting tape DT, the interior of the suction port 112a is depressurized by a suction mechanism not shown. At this time, the back side of the cutting tape DT is sucked downward and is in close contact with the upper surface of the dome 110 (disc-shaped component 112). As shown Figure 6As shown, the annular member 114 is provided outside the cylindrical member 113. The dome 110 is fixed to the upper plate portion 210 via the annular member 114.

[0086] Blocks B1 to B8 of the push-up block portion BLK push the cutting tape DT upward. The seven outer blocks B1 to B7 are hollow cylindrical (for example, quadrangular cylindrical) and have an opening of the same shape as the outer shape of the blocks inside thereof, which passes through in the Z1-Z2 direction. The innermost block B8 is a solid cylindrical (for example, quadrangular prism). Block B2 is arranged on the inner side of the largest block B1, block B3 is arranged on the inner side of block B2, and block B4 is arranged on the inner side of block B3. Block B5 is arranged on the inner side of block B4, block B6 is arranged on the inner side of block B5, block B7 is arranged on the inner side of block B6, and further, the smallest block B8 is arranged on its inner side.

[0087] The outermost block B1, the largest of the eight blocks B1 to B8, is preferably slightly smaller than the outer periphery of the bare chip D to be peeled. This positions the outer corner of the top surface of block B1 slightly inward from the outer edge of the bare chip D. This allows the force required to peel the bare chip D from the dicing tape DT to concentrate at the starting point (the outermost periphery of the bare chip D). The protrusion of the outer periphery of the bare chip D from the end of the outermost block B1 is referred to as overhang (OH).

[0088] use Figures 9 to 11 The upper plate portion 210 of the mechanism portion 200 will be described. Figure 9 yes Figure 6 A longitudinal sectional view of the upper plate portion is shown. Figure 10 yes Figure 9 A cross-sectional view of the upper plate portion taken along line CC is shown. Figure 11 yes Figure 9 A cross-sectional view of the upper plate portion taken along line EE is shown.

[0089] like Figure 9 As shown, the upper plate portion 210 includes an upper rod UR, an upper plate UP, and a dome covering the upper rod UR and the upper plate UP. The dome is composed of a cylindrical member 211 and a disc-shaped member 212 provided at the upper end of the cylindrical member 211. An annular member 213 is provided on the outside of the cylindrical member 211. The cylindrical member 211 is fixed to the lower block portion 220 via the annular member 213. An opening 212a is provided in the center of the disc-shaped member 212, through which the upper rod UR can move up and down. The upper rod UR includes rods UR1 to UR7. The upper plate UP includes plates UP1 to UP7. The rods UR1 to UR7 are respectively referred to as the first rod, the second rod, or the third rod.

[0090] Rods UR1-UR7 are each located on the upper surface of the corresponding plates UP1-UP7 and extend in the Z direction. One end of the rods UR1-UR7 is fixed to the plates UP1-UP7, and the other end is fixed to the blocks B1-B7. The outermost block B1 is preferably the topmost plate UP1. This allows the shortest, most rigid rod UR1, acting as a pin, to push up the larger outer block B1, which requires greater rigidity.

[0091] like Figure 10 As shown, four rods UR1 are provided, and three rods UR2 to UR7 are provided respectively. As a result, block B1 can be supported by four points, and blocks B2 to B7 can each be supported by three points, thereby increasing the rigidity between the block portion BLK and the upper plate UP, and increasing the parallelism during ascent and descent. Three or more rods UR1 to UR7 may also be provided respectively. The multiple rods constituting rod UR1 are preferably arranged concentrically and evenly spaced. The multiple rods constituting each rod UR2 to UR7 are also preferably arranged concentrically and evenly spaced. As a result, the parallelism of blocks B1 to B7 during ascent and descent can be further improved. Rods UR1 to UR7 transmit the up and down movement of plates UP1 to UP7 to blocks B1 to B7.

[0092] Furthermore, the mechanism 200 includes a rod LR8 that passes through the upper plate 210. One end of the rod LR8 is fixed to a block LB8 of the lower block LB (described later), and the other end is fixed to a block B8 of the block BLK. Only one rod LR8 is provided. The diameter of the rod LR8 is preferably larger than that of the rods UR1 to UR7.

[0093] Plates UP1 to UP7 are arranged in the up and down direction (Z direction) at a predetermined interval. Plates UP1 to UP7 are disc-shaped parts. In addition, plates UP1 to UP7 are provided with gaps that can move toward the inner wall of the dome (cylindrical part 211). Through these structures, many rods can be configured, and parallelism and verticality during movement can be maintained. The number of plates in the upper plate UP is one less than the number of blocks in the block part BLK, but it can also be the same number (eight). However, by setting the innermost block B8 to be pushed up directly (without using a plate) by the rod LR8, the outer shape of the innermost block B8 is small, and it is easy to maintain parallelism, so the mechanism can be simplified.

[0094] Plates UP1 to UP6 each have through-holes PTH through which rods UR2 to UR7 connected to the plates UP2 to UP7 below pass. Furthermore, plates UP2 to UP7 each have through-holes PTH through which rods LR1 to LR6 connected to blocks LB1 to LB7, described later, pass. Blocks LB1 to LB7 are used to connect to plates UP1 to UP6 above. Furthermore, plates UP1 to UP7 have through-holes PTH through which rod LR8 passes. The through-holes PTH and the rods UR2 to UR7 and LR8 preferably have the same shape when viewed from above, with gaps provided to allow for drive. Furthermore, the through-holes PTH and the rods UR2 to UR7 and LR8 do not necessarily have to have the same shape. This allows the dome to house a linkage mechanism that transmits a large amount of drive force from the lower block 220 to the upper push block BLK.

[0095] use Figure 6 、 Figure 12 and Figure 13 The lower block portion 220 of the mechanism portion 200 will be described. Figure 12 yes Figure 6 A longitudinal sectional view of the lower block is shown. Figure 13 yes Figure 12 A cross-sectional view of the lower block at line FF is shown.

[0096] like Figure 12 As shown, the lower block 220 comprises a lower rod LR, a lower block LB, and a housing covering the lower rod LR and lower block LB. The housing is composed of components 221 provided on both sides and the back. The lower rod LR comprises rods LR1 to LR8. The lower block LB comprises blocks LB1 to LB8. Rods LR1 to LR8 are referred to as the first rod, the second rod, or the third rod, respectively.

[0097] Rods LR1-LR8 are provided on the upper surfaces of corresponding blocks LB1-LB8, extending in the Z direction. One end of rods LR1-LR8 is fixed to blocks LB1-LB8, while the other ends of rods LR1-LR7 are fixed to plates UP1-UP7. The other end of rod LR8 is fixed to block B8.

[0098] like Figure 13As shown, three rods LR1 to LR7 are provided. Thus, since blocks B1 to B7 can be supported at three points, the rigidity between the upper plate UP and the lower block LB can be increased, and the parallelism during ascent and descent can be improved. Four or more rods LR1 to LR7 can also be provided. The multiple rods constituting rod LR1 are preferably arranged concentrically and evenly spaced. The multiple rods constituting each rod LR2 to LR7 are preferably arranged concentrically and evenly spaced. Furthermore, the multiple rods constituting rod LR1 are preferably arranged at equal angular intervals. The multiple rods constituting each rod LR2 to LR7 are preferably arranged at equal angular intervals. Thus, the parallelism of blocks B1 to B7 during ascent and descent can be further improved. Rods LR1 to LR7 transmit the up and down movement of blocks LB1 to LB7 to plates UP1 to UP7. Rod LR8 transmits the up and down movement of block LB8 to block B8.

[0099] Blocks LB1 to LB8 are arranged in a vertical direction. Blocks LB1 to LB8 are circular, rectangular, or polygonal. Blocks LB1 to LB8 are formed thicker than plates UP1 to UP7. Blocks LB1 to LB7 each have a through-hole BTH through which rods LR2 to LR8, which connect to blocks LB2 to LB8 below, pass. The through-holes BTH and rods LR2 to LR8 preferably have the same shape when viewed from above, with gaps provided to allow them to be driven independently. Furthermore, the through-holes PTH and rods UR2 to UR7 and LR8 do not necessarily have to have the same shape.

[0100] use Figures 14 to 17 The driving unit 300 will be described. Figure 14 Yes Figure 6 A top view of an example of the arrangement of the drive unit shown. Figure 15 Yes Figure 6 A side view of an example of the arrangement of the drive unit shown. Figure 16 Yes Figure 15 FIG. 1 is a diagram showing an example of the structure of the driving unit. Figure 17 Yes Figure 15 FIG. 2 is a diagram showing another example of the structure of the driving unit.

[0101] The drive unit 300 includes drive units DU1 to DU8. Drive units DU1 to DU8 are arranged around the lower block 220 and fixed to component 221. Drive units DU1, DU7, and DU8 are arranged on the X2 side of the lower block 220. Drive units DU2, DU5, and DU6 are arranged on the X1 side of the lower block 220. Drive units DU3 and DU4 are arranged on the Y1 side of the lower block 220. Drive units DU1 and DU2 are arranged on the upper side of the lower block 220. Drive units DU5 to DU8 are arranged on the lower side of the lower block 220.

[0102] The drive units DU1 to DU8 drive the blocks LB1 to LB8 in the vertical direction. Each of the drive units DU1 to DU8 includes a motor M and a drive output unit PM that converts the rotation of the motor M into vertical movement.

[0103] The drive output unit PM is composed of a ball screw BS. The ball screw BS consists of a screw shaft SS connected to the motor M and a nut NU threadedly engaged with the screw shaft SS. The nut NU is secured to the lower block LB using screws or other means. The motor M is configured so that its output shaft extends in the vertical direction. In other words, the screw shaft SS of the ball screw BS is configured to extend in the vertical direction.

[0104] like Figure 16 As shown, the motor M can be configured with the output shaft (motor shaft) of the motor M facing upward, as shown in FIG. Figure 17 In other words, the drive output unit PM can be arranged above the motor M, or below the motor M. The motors M of the drive units DU1, DU2, DU5 to DU8 are shown in FIG. Figure 16 The motor M of the drive unit DU3 and DU4 is configured as shown. Figure 17 As shown in the figure, the motor M can be compactly stored and the degree of freedom of arrangement can be ensured.

[0105] Furthermore, in the lower block 220, the thrust of the drive output unit PM is received by one of the side surfaces or the upper and lower surfaces of the lower block LB, and the power is transmitted to the lower rod LR. Thus, when a large number of power sources (motors M) are provided, the degree of freedom in the arrangement of the drive output unit PM and the arrangement of the power sources (motors M) can be increased.

[0106] According to this embodiment, at least one of the following effects (a) to (g) is achieved.

[0107] (a) The number of blocks in the push-up block portion BLK can be increased.

[0108] (b) According to (a), the peeling area per block (block width) can be reduced, thereby reducing the stress on the bare chip during the bare chip peeling.

[0109] (c) According to (a), even if the bare chip is enlarged, the overhang can be reduced.

[0110] (d) By performing step (c), the outer periphery of the bare chip is peeled off at a relatively low push-up height, and the outermost push-up block can be made lower than the total push-up height, thereby reducing deformation of the surrounding bare chips. As a result, the distance from the end face of the outermost push-up block to the end face of the picked-up bare chip is shortened, making deformation less likely.

[0111] (e) Through (d), product defects can be reduced.

[0112] (f) Through (d), thin bare chip processing can be stably performed.

[0113] (g) Since the upper plate 210 is composed of a disc-shaped member and a rod, the increase in dome diameter can be suppressed even if the number of push-up blocks BLK increases. This maintains compatibility with push-up units with fewer blocks. This is described below.

[0114] As described above, the wafer holding table 12 moves in the X and Y directions via the XY table, and the bare chip D to be picked up moves to the position of the push-up unit 13. However, when the bare chip D to be picked up is close to the wafer ring WR, the push-up unit 13 is located near the components of the wafer holding table 12, such as the support ring 122 or the XY table. If the size of the dome 110 and the dome of the upper plate 210 of the push-up unit 13 becomes larger, these components of the wafer holding table 12 become obstacles, and the bare chip D to be picked up cannot be moved to the position of the push-up unit 13. In other words, the area on the wafer that can be picked up (pick-up area) is reduced. Therefore, without changing the structure of the wafer holding table 12, the size of the push-up unit 13 cannot be set to be larger than the specified value. In addition, in the case where the second unit 13b is composed of a plurality of cylindrical blocks, as in Patent Document 1, the greater the number of blocks, the larger the diameter of the second unit 13b due to processing accuracy.

[0115] As mentioned above, the invention completed by the present inventors has been specifically described based on the embodiments. However, the present invention is not limited to the above-mentioned embodiments, and various modifications are possible, of course.

[0116] For example, in the embodiment, the push-up block portion BLK is described as including eight blocks B1 to B8 , but the number of blocks in the push-up block portion BLK may be more or less than 8. The number of blocks in the push-up block portion BLK only needs to be two or more.

[0117] If the number of blocks in the upper pusher block section BLK is different from eight, the structure of the head section 100 and the structure of the mechanism section 200 are modified. The number of upper plates, lower blocks, and motors is modified accordingly. For example, if the number of blocks in the upper pusher block section BLK is two, the upper plate is composed of one, the lower blocks are composed of two, and the motors are composed of two.

[0118] When the number of push-up blocks BLK is less than eight, only the structure of the head 100 can be changed without changing the mechanism of the mechanism 200. In this case, there is an upper rod not connected to the block BLK, but the motor that moves the upper rod up and down is not operated.

[0119] In the embodiment, the through hole BTH of the lower block LB and the lower rod LR are provided with a gap to enable independent driving, but bearings may also be provided. In this case, the push rod (rod) that transmits power between the plates (surfaces) can maintain perpendicularity and operate with high precision.

[0120] In the embodiment, the upper plate UP is described as a disk-shaped example, but it can also be a polygonal shape that contacts the inner surface of the dome at multiple points (three or more) or surfaces, and has bearings or pulleys on its edges. This can maintain the parallelism of the multiple upper plates UP.

[0121] In the embodiment, an example using a die bonding film has been described. However, a pre-processed portion on which an adhesive is applied may be provided on a substrate without using a die bonding film.

[0122] In the embodiments, a die placement machine is described in which a pickup head picks up bare chips from a wafer supply unit and places them on an intermediate stage, and a placement head places the bare chips placed on the intermediate stage on a substrate. However, the present invention is not limited to this embodiment and is also applicable to a die placement device that picks up bare chips from a bare chip supply unit.

[0123] For example, the present invention can also be applied to a die mounter that does not have an intermediate stage and a pickup head, but instead uses a placement head to mount a bare chip of a wafer supply unit onto a substrate.

[0124] Furthermore, the present invention can also be applied to a flip chip mounter that does not have an intermediate stage and picks up a bare chip from a wafer supply unit, rotates a bare chip pickup head upward, and delivers the bare chip to a placement head, which then places the bare chip on a substrate.

[0125] In the embodiment, the die mounter is described as an example, but the present invention is also applicable to a semiconductor manufacturing apparatus that places picked-up bare chips on a tray.

Claims

1. A semiconductor manufacturing device, characterized in that: have: A push-up unit comprising: a head having a plurality of blocks, a mechanism for independently imparting vertical movement to the plurality of blocks, and a drive unit having a motor and a drive output unit for converting power of the motor into vertical movement; and The head component has a collet for adsorbing the bare chip. The mechanism section includes a first mechanism section, and the first mechanism section includes: a first member having an upper surface, a lower surface opposite to the upper surface, and a through hole extending between the upper surface and the lower surface; a first rod connected to the upper surface of the first member and transmitting the vertical movement of the first member to the block; as well as The second rod passes through the through hole and extends from below to transmit the up-and-down movement to the block.

2. The semiconductor manufacturing apparatus according to claim 1, wherein The mechanism section further includes a second mechanism section, and the second mechanism section includes: a third rod connected to the lower surface of the first member; and The second member has an upper surface, a lower surface opposite to the upper surface, and a through hole extending between the upper surface and the lower surface, and is connected to the third rod at the upper surface.

3. The semiconductor manufacturing apparatus according to claim 1, wherein The mechanism section further includes a second mechanism section, and the second mechanism section includes: a second member having an upper surface, a lower surface opposite to the upper surface, and a through hole extending between the upper surface and the lower surface, and connected to the first rod on the lower surface; and a third rod connected to the upper surface of the second member.

4. The semiconductor manufacturing apparatus according to claim 2, wherein: The first components of the first mechanism portion are arranged in a plurality in the vertical direction. The second components of the second mechanism portion are arranged in a plurality in the vertical direction. The driving part includes a plurality of the motors and a plurality of the driving output parts. The number of the first components of the first mechanism portion is the same as the number of the second components of the second mechanism portion, or the number of the first components of the first mechanism portion is smaller than the number of the second components of the second mechanism portion.

5. The semiconductor manufacturing apparatus according to claim 2, wherein: The first components of the first mechanism portion are arranged in a plurality in the vertical direction. The second components of the second mechanism portion are arranged in a plurality in the vertical direction. The driving part includes a plurality of the motors and a plurality of the driving output parts. The number of the first components of the first mechanism portion is the same as or less than the number of the blocks, The number of the second components of the second mechanism portion is the same as the number of the drive output portions. The number of the drive output parts is the same as the number of the motors.

6. The semiconductor manufacturing apparatus according to claim 4 or 5, wherein: At least three first rods are provided on the upper surface of each of the plurality of first components of the first mechanism portion. A second rod is provided on the upper surface of one of the plurality of second components of the second mechanism portion. At least three third rods are provided on the upper surface of each of the other members among the plurality of second members of the second mechanism portion.

7. The semiconductor manufacturing apparatus according to claim 6, wherein: The first rods are arranged concentrically and at equal intervals. The third rods are concentrically arranged at equal intervals.

8. The semiconductor manufacturing apparatus according to claim 4 or 5, wherein: The first mechanism is housed in a cylindrical housing. The first member of the first mechanism portion has a circular or polygonal shape in a plan view, and has a drivable gap with the inner diameter of the housing.

9. The semiconductor manufacturing apparatus according to claim 2, wherein: The second member of the second mechanism portion has a circular, rectangular, or polygonal shape in a plan view.

10. The semiconductor manufacturing apparatus according to claim 4 or 5, wherein: The outer blocks among the plurality of blocks are pushed upward by the first rod provided on the member arranged on the upper side among the plurality of first members of the first mechanism portion.

11. The semiconductor manufacturing apparatus according to claim 4 or 5, wherein: The second rod is configured to push up the innermost block among the plurality of blocks without being connected to the plurality of first members of the first mechanism portion.

12. The semiconductor manufacturing apparatus according to claim 5, wherein: The plurality of drive output portions are each fixed to the plurality of second members of the second mechanism portion.

13. The semiconductor manufacturing apparatus according to claim 12, wherein: The driving portion is arranged around, above, or below the second mechanism portion.

14. The semiconductor manufacturing apparatus according to claim 13, wherein: The motor shafts of the plurality of motors are arranged to face upward or downward.

15. A push-up unit, characterized in that: The invention comprises: a head having a plurality of blocks, a mechanism for independently imparting vertical movement to the plurality of blocks, and a drive unit having a motor and a drive output unit for converting the power of the motor into a vertical movement. The mechanism section includes a first mechanism section, and the first mechanism section includes: a member having an upper surface, a lower surface opposite to the upper surface, and a through hole extending between the upper surface and the lower surface; a first rod connected to the upper surface of the component and transmitting the up and down movement of the component to the block; as well as The second rod passes through the through hole and extends from below to transmit the up-and-down movement to the block.

16. A method for manufacturing a semiconductor device, characterized in that: include: The step of carrying the wafer ring holding the dicing tape into the semiconductor manufacturing apparatus of claim 1; and A process of picking up the bare chip attached to the dicing tape.

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