Combined cold plate heat dissipation device

Abstract

The present invention provides a combined cold plate heat dissipation device, comprising a liquid cooling device, an air cooling device, and a controller. The liquid cooling device comprises a liquid cooling plate having a cooling chamber therein; a plurality of polygonal heat-conducting columns arranged in a regular array are provided in the cooling chamber, and a plurality of through-holes are provided on the polygonal heat-conducting columns; gaps between the plurality of polygonal heat-conducting columns and between the polygonal heat-conducting columns and the side walls of the cooling chamber are interconnected to form a liquid cooling channel for the flow of coolant; the air cooling device is provided on the liquid cooling plate and faces the cooling chamber, and the controller is electrically connected to both the liquid cooling device and the air cooling device; a plurality of bionic fishtail fin heat sinks arranged in a regular array are provided on the outer surface of the liquid cooling plate, and a plurality of bionic vortex guide grooves are formed on both sides of the bionic fishtail fin heat sinks. The present invention can effectively solve the problems of low heat dissipation capacity of air-cooled radiators in the prior art, poor heat dissipation performance of liquid-cooled radiators, small heat exchange area of ​​the coolant, and uneven distribution, resulting in low heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of server chip heat dissipation, and in particular to a combined cold plate heat dissipation device. Background Art

[0002] With the development of electronic devices, especially semiconductor technology, the computing power and integration of chips are constantly improving, which means that chips will generate more heat when working. If this heat cannot be dissipated effectively, it will lead to performance degradation. When the chip works at high temperature, the thermal effect may cause its operating frequency to decrease, thus affecting performance. If it is exposed to high temperature for a long time, the material and structure of the chip may age or even be damaged, thereby shortening the service life of the chip. Excessive temperature can also cause system instability and may even cause system crashes, erroneous calculations or hardware failures. Modern chips usually need to handle a large number of computing tasks. If the heat dissipation is not good, the efficiency of the chip will be affected, resulting in additional energy waste and increased energy consumption. Therefore, developing an effective heat dissipation structure to ensure that the chip can operate efficiently within the optimal temperature range, extend its service life, and at the same time improve the stability and performance of the system has become an important part of chip research and development. Some patents have proposed chip heat dissipation structures.

[0003] For example, patent CN118712150A discloses a chip air-cooling heat dissipation device and method. The device primarily comprises a chip and a heat dissipation assembly disposed above the chip. The heat dissipation assembly includes a heat dissipation cover with a mounting slot within the cover, a support point at the bottom of the slot, a fan within the slot, and a fan cover at the top of the slot. This heat dissipation structure, an air-cooled radiator, reduces the size of the heat dissipation device, simplifies the structure, facilitates control, and achieves uniform heat dissipation. However, the heat dissipation effect is poor and cannot meet the rapid heat dissipation requirements of high-power components.

[0004] Patent CN114242674A designs a multi-channel, wavy, liquid cooling plate structure consisting primarily of a plate body and multiple heat dissipation ribs. The plate body is provided with a fluid cavity within which the multiple heat dissipation ribs are disposed. The ribs are spaced apart along a first direction and extend along a second direction. A flow channel is formed between adjacent ribs, and at least one of the adjacent ribs is curved. This patent describes a liquid-cooled radiator that utilizes the heat transfer characteristics of liquids during flow to achieve efficient heat dissipation. However, the flow channel length of the cold plate structure in this patent is relatively long, resulting in relatively high flow resistance and poor temperature uniformity. Furthermore, the flow disturbance structure in the flow channel has little turbulence, resulting in weak heat transfer performance and low heat dissipation efficiency. Furthermore, if the water supply system fails, the entire liquid cooling system will immediately fail, and the equipment being cooled will overheat very quickly. Therefore, this liquid cooling method is not suitable for equipment with stringent heat dissipation requirements. Summary of the Invention

[0005] The purpose of the present invention is to provide a combined cold plate heat dissipation device, which can effectively solve the problems in the prior art such as low heat dissipation capacity of air-cooled radiators, poor heat dissipation performance of liquid-cooled radiators, small heat exchange area of ​​coolant, uneven distribution, and low heat dissipation efficiency.

[0006] The objective of the present invention is achieved in this way: a combined cold plate heat dissipation device includes a liquid cooling device, an air cooling device and a controller, the liquid cooling device includes a liquid cooling plate with a cooling chamber inside; a plurality of polygonal heat-conducting columns connected to the cavity top wall and the cavity bottom wall of the cooling chamber and arranged in a regular array are provided in the cooling chamber, and a plurality of through holes are opened on the polygonal heat-conducting columns; the gaps between the plurality of polygonal heat-conducting columns and between the polygonal heat-conducting columns and the cavity side walls of the cooling chamber are interconnected to form a liquid cooling flow channel for the flow of coolant; a cooling liquid inlet and a cooling liquid outlet that can be connected to the liquid cooling flow channel are also provided on the liquid cooling plate, the air cooling device is provided on one of the plate surfaces of the liquid cooling plate and faces the cooling chamber, and the controller is electrically connected to both the liquid cooling device and the air cooling device; a plurality of bionic fish tail fin heat sinks arranged in a regular array are provided on the outer surface of the plate surface where the air cooling device is installed in the liquid cooling plate, and a plurality of bionic vortex guide grooves are formed on both sides of the bionic fish tail fin heat sink, so that the airflow generated by the air cooling device can form a turbulent airflow when flowing through the plurality of bionic fish tail fin heat sinks.

[0007] In a preferred embodiment of the present invention, the bottom end of the bionic fish tail fin heat sink is connected to the liquid cooling plate, and the bionic fish tail fin heat sink includes two symmetrically arranged sheet bodies, and the upper parts of the two sheet bodies constitute a tail tip structure that forks toward both sides from the bottom end to the top end of the bionic fish tail fin heat sink and the width gradually decreases.

[0008] In a preferred embodiment of the present invention, the bionic vortex guide grooves on the two plates are symmetrically arranged, and the bionic vortex guide grooves are curved grooves extending from the bottom end to the top end of the bionic fish tail fin heat sink.

[0009] In a preferred embodiment of the present invention, the height of the bionic fish tail fin heat sink is 3-10 mm, the thickness is 0.5-2 mm, and the interval between two adjacent bionic fish tail fin heat sinks is 1-5 mm; the width of the bionic vortex guide groove is 0.5-2 mm, and the depth is 0.2-1 mm.

[0010] In a preferred embodiment of the present invention, the outer surface of the heat-conducting column and the flow bottom surface of the liquid-cooling channel are both bionic surfaces simulating the surface of a butterfly wing.

[0011] In a preferred embodiment of the present invention, a plurality of conical protrusions are vertically provided on the surface of the polygonal heat-conducting column and the bottom surface of the flow path.

[0012] In a preferred embodiment of the present invention, the height of the conical protrusion is 5-100 μm, and the bottom diameter is 10-200 μm.

[0013] In a preferred embodiment of the present invention, the diameter of the through hole is 10-500 μm.

[0014] In a preferred embodiment of the present invention, the liquid-cooling flow channel constitutes a honeycomb-like flow channel and includes a first direct flow channel and a second direct flow channel arranged in parallel and spaced apart, and a honeycomb-like flow channel network located between the first direct flow channel and the second direct flow channel; the first direct flow channel is connected to the cooling liquid inlet and is connected to the honeycomb-like flow channel network through a plurality of first branch straight channels, and the length direction of the first branch straight channels is perpendicular to the length direction of the first direct flow channel; the second direct flow channel is connected to the cooling liquid outlet and is connected to the honeycomb-like flow channel network through a plurality of second branch straight channels, and the length direction of the second branch straight channels is perpendicular to the length direction of the second direct flow channel.

[0015] In a preferred embodiment of the present invention, the liquid cooling plate includes a cold plate body and a cover body, a cooling groove is provided on the cold plate body, and a plurality of polygonal heat-conducting columns are arranged in the cooling groove; the cover body is arranged at the notch position of the cooling groove and is detachably fixed to the cold plate body, and each polygonal heat-conducting column can contact the cover body, the cover body and the cooling groove enclose a cooling cavity, the air cooling device is connected to the cover body, and the bionic fishtail fin heat sink is arranged on the outer surface of the cover body.

[0016] In a preferred embodiment of the present invention, the liquid cooling device also includes a circulation pump, a liquid cooler and a liquid storage device. The circulation pump is connected to the coolant inlet through a first pipe, and an electronic valve is provided on the first pipe; the coolant outlet is connected to the liquid cooler through a second pipe, and the liquid storage device is connected to both the circulation pump and the liquid cooler through corresponding pipes; the controller is electrically connected to the circulation pump and the electronic valve.

[0017] In a preferred embodiment of the present invention, a temperature sensor is further provided on the liquid cooling plate, and the controller is electrically connected to the temperature sensor.

[0018] In a preferred embodiment of the present invention, the air cooling device includes a frame, fan blades and a motor. The frame is fixed on the liquid cooling plate. The fan blades and the motor are arranged on the frame. The motor can drive the fan blades to rotate. The controller is electrically connected to the motor.

[0019] As described above, the heat dissipation device of the present invention utilizes multiple polygonal heat-conducting columns arranged in a regular array within a cooling chamber to ensure uniform distribution, cover the heat-generating area, maintain unobstructed flow paths, and avoid large pressure drops or dead spots, thereby achieving a balance between heat dissipation performance and coolant flow efficiency. The polygonal heat-conducting columns are made of a highly thermally conductive material, which modifies the flow pattern of the coolant around the columns, accelerating local flow velocity and creating a flow state more conducive to heat exchange, such as turbulence or turbulence, further enhancing the heat dissipation capacity of the liquid cooling system. The polygonal heat-conducting columns are provided with multiple tiny through-holes, increasing the surface area in contact with the coolant and further improving the heat exchange efficiency of the liquid cooling system. Furthermore, by combining liquid and air cooling, a controller can control the activation of the liquid cooling device and / or the air cooling device based on the temperature of the liquid cooling plate. This device features a wide temperature adjustment range, a wide range of applicability, and is energy-efficient and highly efficient. It can meet the rapid heat dissipation requirements of high-power components and variable-power electronic devices. In addition, the polygonal thermal conductive columns can efficiently transfer the heat generated by the chip to the liquid cooling plate and improve the efficiency of heat transfer from the heat source to the air cooling device; the air cooling device usually removes heat through a fan, and the polygonal thermal conductive columns can help optimize the uniform distribution of heat, and send the wind evenly to the chip surface through each polygonal thermal conductive column, leaving no dead corners, so that the air cooling device can remove heat more efficiently; and it can concentrate heat on the key areas of the liquid cooling plate, reduce the temperature difference within the system, and avoid certain areas from overheating and affecting the performance and stability of the equipment; by arranging multiple bionic fishtail fin heat sinks on the outer surface of the liquid cooling plate, the airflow generated when the air cooling device is working flows through the bionic fishtail fin heat sink and forms a turbulent airflow under the action of the bionic vortex guide groove, which can accelerate the heat dissipation of the heat transferred to the liquid cooling plate; thereby enhancing the heat exchange efficiency of the liquid cooling system and reducing the overall temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The following drawings are intended only to illustrate and explain the present invention, and are not intended to limit the scope of the present invention.

[0021] Figure 1 This is a structural schematic diagram of the combined cold plate heat dissipation device provided by the present invention.

[0022] Figure 2 This is a schematic structural diagram of the cold plate main body provided by the present invention.

[0023] Figure 3 This is a schematic structural diagram of the cover provided by the present invention.

[0024] Figure 4 This is a partial enlarged view of the surface of the polygonal heat-conducting column provided by the present invention.

[0025] Figure 5 This is a partial enlarged view of the liquid cooling channel provided by the present invention.

[0026] Figure 6 This is a schematic diagram of the cover body and multiple bionic fish tail fin heat sinks provided by the present invention.

[0027] Figure 7 This is an enlarged view of the bionic fish tail fin heat sink provided by the present invention.

[0028] Description of Figure Numbers:

[0029] 1. Liquid cooling device;

[0030] 11. Liquid cooling plate; 111. Cooling plate body; 1111. First screw hole; 1112. Second screw hole; 1113. Third screw hole; 1114. Fourth screw hole; 112. Cover; 1121. First bolt; 1122. Second bolt; 1123. Third bolt; 1124. Fourth bolt; 1125. Fifth screw hole; 1126. Sixth screw hole; 1127. Seventh screw hole; 1128. Eighth screw hole; 113. Bionic fishtail fin heat sink; 1131. Plate body; 114. Bionic vortex guide groove;

[0031] 12. Polygonal thermal conductive column; 121. Through hole; 122. Pentagonal thermal conductive column; 123. Hexagonal thermal conductive column;

[0032] 13. Coolant inlet; 14. Coolant outlet;

[0033] 15. Conical bulge;

[0034] 161. First straight channel; 162. First branch straight channel; 163. Honeycomb flow channel network; 164. Second branch straight channel; 165. Second straight channel;

[0035] 17. Circulation pump; 171. First pipeline; 172. Electronic valve;

[0036] 18. Liquid cooler; 181. Second pipeline;

[0037] 19. Temperature sensor;

[0038] 2. Air cooling device; 21. Frame; 22. Fan blades; 23. Motor.

[0039] 3. Controller;

[0040] 4. Chip. DETAILED DESCRIPTION

[0041] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific embodiments of the present invention are now described with reference to the accompanying drawings.

[0042] like Figures 1 to 7As shown, the present application provides a combined cold plate heat dissipation device, including a liquid cooling device 1, an air cooling device 2 and a controller 3. The liquid cooling device 1 includes a liquid cooling plate 11 with a cooling cavity inside; a plurality of polygonal heat-conducting columns 12 connected to the cavity top wall and cavity bottom wall of the cooling cavity and arranged in a regular array are provided in the cooling cavity, and a plurality of through holes 121 are opened on the polygonal heat-conducting columns 12; the gaps between the plurality of polygonal heat-conducting columns 12 and between the polygonal heat-conducting columns 12 and the cavity side wall of the cooling cavity are connected to each other and form a liquid cooling flow channel for the flow of coolant; a plurality of polygonal heat-conducting columns 12 ... There is a cooling liquid inlet 13 and a cooling liquid outlet 14 that can be connected to the liquid cooling flow channel. The air cooling device 2 is arranged on one of the plate surfaces of the liquid cooling plate 11 and faces the cooling cavity. The controller 3 is electrically connected to both the liquid cooling device 1 and the air cooling device 2. A plurality of bionic fish tail fin heat sinks 113 arranged in a regular array are provided on the outer surface of the plate surface on which the air cooling device 2 is installed in the liquid cooling plate 11. A plurality of bionic fish tail fin heat sinks 113 are formed on both side surfaces of the bionic fish tail fin heat sink 113. The airflow generated by the air cooling device 2 can form a disturbed airflow when flowing through the plurality of bionic fish tail fin heat sinks 113.

[0043] Therefore, the heat dissipation device of the present application, by arranging a plurality of polygonal heat-conducting columns 12 in the cooling cavity, and the plurality of polygonal heat-conducting columns 12 are arranged in a regular array, can ensure uniform distribution, cover the heating area, keep the flow channel unobstructed, avoid the formation of a large pressure drop or flow dead corners, thereby taking into account both heat dissipation performance and coolant flow efficiency. The polygonal heat-conducting columns 12 are made of a high thermal conductivity material, which changes the flow pattern of the coolant around the polygonal heat-conducting columns 12, accelerates the local flow speed, and forms a flow state that is more conducive to heat exchange, such as turbulence or disturbance effect, further improving the heat dissipation capacity of the liquid cooling system. The surface of the polygonal heat-conducting columns 12 is provided with a plurality of tiny through holes 121, which can increase the surface area in contact with the coolant, further improving the heat exchange efficiency of the liquid cooling.

[0044] At the same time, liquid cooling and air cooling are combined, and the controller 3 can control the liquid cooling device 1 and / or the air cooling device 2 to open according to the temperature of the liquid cooling plate 11. It has the characteristics of large temperature adjustment range, wide application range, energy saving and high efficiency, and can meet the rapid heat dissipation requirements of high-power components and the heat dissipation requirements of variable power electronic devices. In addition, the polygonal heat-conducting columns 12 can efficiently conduct the heat generated by the chip 4 to the liquid cooling plate 11, and improve the efficiency of heat transfer from the heat source to the air cooling device 2; the air cooling device 2 usually takes away heat through a fan, and the polygonal heat-conducting columns 12 can help optimize the uniform distribution of heat, and send the wind evenly to the surface of the chip 4 through each polygonal heat-conducting column 12, leaving no dead corners, so that the air cooling device 2 can more efficiently take away heat; and it can concentrate heat to the key areas of the liquid cooling plate 11, reduce the temperature difference inside the system, and avoid certain areas from overheating and affecting the performance and stability of the equipment; by arranging multiple bionic fishtail fin heat sinks 113 on the outer surface of the liquid cooling plate 11, the airflow generated when the air cooling device 2 is working flows through the bionic fishtail fin heat sink 113 and forms a turbulent airflow under the action of the bionic vortex guide groove 114, which can accelerate the heat dissipation of the heat conducted to the liquid cooling plate 11; thereby enhancing the heat exchange efficiency of the liquid cooling system and reducing the overall temperature.

[0045] In some embodiments, the multiple bionic fishtail fin heat sinks 113 may be arranged in a rectangular array, with gaps between adjacent bionic fishtail fin heat sinks 113. The multiple bionic fishtail fin heat sinks 113 are evenly arranged side by side on the liquid cooling plate 11, with spacing between them to facilitate airflow.

[0046] The bionic fishtail fin heat sink 113 is a plate structure with uniform thickness. A plurality of bionic vortex guide grooves 114 are provided on both side surfaces of the bionic fishtail fin heat sink 113 to guide the airflow through the heat sink surface and generate a disturbance effect, thereby destroying the thermal boundary layer and enhancing the convective heat transfer capacity of the air cooling device 2.

[0047] The dimensions of the bionic fishtail fin fins 113 and bionic vortex guide grooves 114 are designed based on actual needs. For example, the bionic fishtail fin fins 113 are 3-10 mm tall and 0.5-2 mm thick, with a spacing of 1-5 mm between adjacent bionic fishtail fin fins 113 to ensure a balanced balance between heat exchange efficiency and airflow. The bionic vortex guide grooves 114 are 0.5-2 mm wide and 0.2-1 mm deep to ensure a turbulent flow effect.

[0048] Reference Figure 6 and Figure 7The surface of the bionic fishtail fin heat sink 113 is perpendicular to the surface of the liquid cooling plate 11, and the bottom end of the bionic fishtail fin heat sink 113 is connected to the liquid cooling plate 11. The bionic fishtail fin heat sink 113 is shaped like a fishtail fin, comprising two symmetrically arranged plates 1131 (both integrally formed). The upper portions of the two plates 1131 form a tail tip structure that forks from the bottom end of the bionic fishtail fin heat sink 113 to the top end, gradually narrowing in width. The tip of the tail tip structure has a circular arc.

[0049] The bionic fishtail fin heat sink 113 mimics the streamlined structure of a fish's tail fin and guides air to mimic the swaying motion of a fish's tail, effectively directing airflow and enhancing heat exchange between the air and the heat sink. Furthermore, the forked top of the bionic fishtail fin heat sink 113 significantly expands the heat sink's surface area within a limited space, increasing its contact area with the air and achieving efficient heat dissipation in a compact space.

[0050] Further optionally, the bionic vortex guide grooves 114 on the two sheets 1131 are arranged symmetrically, and the bionic vortex guide grooves 114 are curved grooves extending from the bottom end to the top end of the bionic fish tail fin heat sink 113. Figure 7 The bionic vortex guide groove 114 shown in the figure is an arc-shaped groove that bends and bulges outward away from the center of the plate 1131, which can make the turbulence effect better and be more conducive to accelerating heat dissipation.

[0051] In some embodiments, the through holes 121 are microscopic holes that penetrate the polygonal heat-conducting pillars 12 and have a diameter of 10-500 μm. These microscopic holes can increase the contact area between the cooling medium and the polygonal heat-conducting pillars 12, thereby improving heat exchange efficiency.

[0052] In some embodiments, the outer surface of the polygonal heat-conducting column 12 and the flow bottom surface of the liquid-cooling channel (ie, the bottom wall of the cooling cavity corresponding to the liquid-cooling channel) are both bionic surfaces simulating the surface of butterfly wings.

[0053] Specifically, refer to Figure 4 and Figure 5 A plurality of conical protrusions 15 are vertically provided on the surface of the polygonal heat-conducting column 12 and the bottom surface of the flow passage to form a bionic surface.

[0054] The biomimetic surface mimics the tiny conical protrusions found on butterfly wings. These protrusions 15 have a height of 5-100 μm and a base diameter of 10-200 μm. These microstructures increase the contact area between the flow channel surface and the cooling medium, enhancing the flow disturbance of the cooling medium and thus further improving heat exchange efficiency.

[0055] Further, in a specific embodiment, referring to Figure 2The liquid cooling channel constitutes a honeycomb-like channel and includes a first direct current channel 161 and a second direct current channel 165 arranged in parallel and spaced apart, and a honeycomb-like channel network 163 located between the first direct current channel 161 and the second direct current channel 165; the first direct current channel 161 is connected to the cooling liquid inlet 13, and is connected to the honeycomb-like channel network 163 through a plurality of first branch straight channels 162, and the length direction of the first branch straight channels 162 is perpendicular to the length direction of the first direct current channel 161; the second direct current channel 165 is connected to the cooling liquid outlet 14, and is connected to the honeycomb-like channel network 163 through a plurality of second branch straight channels 164, and the length direction of the second branch straight channels 164 is perpendicular to the length direction of the second direct current channel 165.

[0056] The entire liquid cooling plate 11 is a rectangular plate, and the cooling cavity is a rectangular cavity. The side walls of the cooling cavity are provided with serrations to match the side shape of the polygonal heat-conducting column 12. The first direct current channel 161 and the second direct current channel 165 are arranged symmetrically. The first direct current channel 161, the second direct current channel 165, the first branch straight channel 162 and the second branch straight channel 164 are all linear flow channels. The number of first branch straight channels 162 and second branch straight channels 164 is the same. The coolant inlet 13 and the coolant outlet 14 are located on the same side of the liquid cooling plate 11 and at both ends of the side. The air cooling device 2 is provided on the first plate surface of the liquid cooling plate 11 and is spaced apart from the first plate surface. The second plate surface of the liquid cooling plate 11 is used to contact the chip 4. The first plate surface and the second plate surface are two opposite plate surfaces in the liquid cooling plate 11.

[0057] The honeycomb flow channel network 163 is generally rectangular and axially symmetrical, consisting of a plurality of hexagonal flow channel units. Adjacent flow channel units share a common flow channel, and the flow channel units are interconnected through the common flow channel, forming a honeycomb-like shape. Generally, the width of each position in the honeycomb flow channel network 163, as well as the width of the first branch straight channel 162 and the second branch straight channel 164, are equal. The widths of the first straight channel 161 and the second straight channel 165 are equal to and greater than the width of the honeycomb flow channel network 163.

[0058] In this embodiment, the plurality of polygonal heat conducting pillars 12 include pentagonal heat conducting pillars 122 arranged in the first and second direct current channels 161 and 165 , and hexagonal heat conducting pillars 123 arranged inside the cold plate body 111 .

[0059] Specifically, refer to Figure 2The multiple polygonal heat-conducting columns 12 adjacent to the first direct current channel 161 and arranged sequentially and spaced apart along the length of the first direct current channel 161 are all pentagonal heat-conducting columns 122. The multiple polygonal heat-conducting columns 12 adjacent to the second direct current channel 165 and arranged sequentially and spaced apart along the length of the second direct current channel 165 are all pentagonal heat-conducting columns 122. The remaining polygonal heat-conducting columns 12 located between these two rows of pentagonal heat-conducting columns 122 are all hexagonal heat-conducting columns 123. The cross-section of each pentagonal heat-conducting column 122 is a pentagon with two adjacent right angles, and the side between the two adjacent right angles is arranged toward the corresponding cavity sidewall of the cooling cavity and constitutes part of the sidewall of the corresponding direct current channel. The side between the two right angles of each pentagonal heat-conducting column 122 and the corresponding cavity sidewall of the cooling cavity form a corresponding direct current channel. The gaps between adjacent pentagonal heat-conducting columns 122 and the gaps between the sides of a pentagonal heat-conducting column 122 (sides other than the sides between two right angles) and the corresponding sidewalls of the cooling cavity constitute the aforementioned branch straight channels. The gaps around the periphery of each hexagonal heat-conducting column 123 constitute the aforementioned flow channel units.

[0060] The liquid cooling channel adopts a honeycomb-like channel, which can significantly enhance the disturbance of the cooling liquid compared to the traditional channel, so that the cooling liquid is evenly distributed in the liquid cooling plate 11, thereby increasing the heat exchange efficiency.

[0061] Further, for processing and installation, in some embodiments, reference is made to Figures 1 to 3 The liquid cooling plate 11 includes a cold plate body 111 and a cover body 112. A cooling groove is opened on the cold plate body 111, and a plurality of polygonal heat-conducting columns 12 are arranged in the cooling groove; the cover body 112 is arranged at the notch position of the cooling groove and is detachably fixed to the cold plate body 111, and each polygonal heat-conducting column 12 can contact the cover body 112. The cover body 112 and the cooling groove enclose a cooling cavity. The air cooling device 2 is connected to the cover body 112, and the bionic fishtail fin heat sink 113 is arranged on the outer surface of the cover body 112.

[0062] Generally, the cold plate body 111 and the cover 112 are both rectangular plates, and multiple polygonal heat-conducting columns 12 are integrally formed with the cold plate body 111. The polygonal heat-conducting columns 12, the cold plate body 111 and the cover 112 are all made of high thermal conductivity materials, such as copper, aluminum or graphite, to improve heat conduction efficiency.

[0063] The cover 112 and the cold plate body 111 can be sealed and fixedly connected by a plurality of fasteners. For example, in a specific example, referring to Figures 1 to 3 ,by Figure 2In the orientation shown in FIG, a first screw hole 1111 is provided at the upper left corner of the cold plate body 111, a second screw hole 1112 is provided at the upper right corner, a third screw hole 1113 is provided at the lower right corner, and a fourth screw hole 1114 is provided at the lower left corner. The coolant inlet 13 is fixed to the upper left end of the cold plate body 111, the coolant outlet 14 is fixed to the lower left end, and the temperature sensor 19 described below is fixed to the middle portion of the left side. A fifth screw hole 1125 is provided at the upper left corner of the cover 112, a sixth screw hole 1126 is provided at the upper right corner, a seventh screw hole 1127 is provided at the lower right corner, and an eighth screw hole 1128 is provided at the lower left corner. The first screw hole 1111 is connected to the fifth screw hole 1125 through the first bolt 1121, the second screw hole 1112 is connected to the sixth screw hole 1126 through the second bolt 1122, the third screw hole 1113 is connected to the seventh screw hole 1127 through the third bolt 1123, and the fourth screw hole 1114 is connected to the eighth screw hole 1128 through the fourth bolt 1124, so as to tightly connect the cover body 112 and the cold plate body 111.

[0064] Further, according to Figure 1 The liquid cooling device 1 also includes a circulation pump 17 (such as a water pump), a liquid cooler 18 and a liquid storage device. The circulation pump 17 is connected to the coolant inlet 13 through a first pipe 171, and an electronic valve 172 is provided on the first pipe 171; the coolant outlet 14 is connected to the liquid cooler 18 through a second pipe 181, and the liquid storage device is connected to both the circulation pump 17 and the liquid cooler 18 through corresponding pipes; the controller 3 is electrically connected to the circulation pump 17 and the electronic valve 172.

[0065] Furthermore, a temperature sensor 19 is provided on the liquid cooling plate 11, and the controller 3 is electrically connected to the temperature sensor 19. The temperature sensor 19 is used to detect the temperature of the liquid cooling plate 11. For example, it can be provided on the side of the liquid cooling plate 11, so that the controller 3 can control the operation of the liquid cooling device 1 and the air cooling device 2 based on the detected temperature.

[0066] Further, refer to Figure 1 The air cooling device 2 includes a frame 21, fan blades 22, and a motor 23. The frame 21 is fixed to the liquid cooling plate 11. The fan blades 22 and motor 23 are mounted on the frame 21. The motor 23 can drive the fan blades 22 to rotate. The controller 3 is electrically connected to the motor 23. The frame 21 is specifically fixed to the cover 112 and is spaced apart from the cover 112.

[0067] More specifically, the operation process of the heat dissipation device is as follows:

[0068] The temperature sensor 19 transmits its temperature information to the controller 3 in real time. The controller 3 starts the air cooling device 2 or the water pump according to the heat generation and heat dissipation requirements of the server during operation. When the heat generation is low, the controller 3 controls the electronic valve 172 to close and starts the motor 23 at the same time. The motor 23 drives the fan blades 22 to rotate. The generated airflow flows through the bionic fishtail fin heat sink 113 on the outer surface of the cover body 112, and forms a disturbed airflow under the action of the bionic vortex guide groove 114, which accelerates the heat dissipation of the heat conducted from the polygonal heat-conducting column 12 to the cover body 112, thereby realizing air cooling and heat dissipation.

[0069] When the heat generation is high, controller 3 activates the water pump and simultaneously opens electronic valve 172, allowing the coolant in liquid cooler 18 to flow through the coolant inlet 13 fixed to the cold plate body 111 to the first straight channel 161. After being diverted by a plurality of first branch straight channels 162, it flows through the honeycomb flow channel network 163, then flows through a plurality of second branch straight channels 164 to the second straight channel 165, and then flows through the coolant outlet 14 to the liquid cooler 18, where it is cooled. This cycle dissipates the heat transferred to the liquid cooling plate 11, achieving liquid cooling. If activating either air cooling device 2 or liquid cooling device 1 alone still cannot meet the server's heat dissipation requirements, controller 3 controls electronic valve 172 to open and activates air cooling device 2 simultaneously, achieving combined air and liquid cooling operation.

[0070] In summary, in this embodiment, by providing a polygonal heat-conducting column 12 within the cooling chamber, providing multiple through-holes 121 on the polygonal heat-conducting column 12, and providing biomimetic surfaces on the surface of the polygonal heat-conducting column 12 and the bottom surface of the liquid-cooling channel, these structures can effectively increase the contact area between the channel surface and the cooling medium, enhance the ability of the cooling medium to disturb the channel, and thus effectively increase the heat exchange efficiency. At the same time, the temperature sensor 19 transmits temperature information to the controller 3 in real time. The controller 3 activates the air cooling device 2 or the liquid cooling device 1 based on the heat generation and heat dissipation requirements of the server during operation, selecting the optimal heat dissipation method. When the server heat dissipation is low, the air cooling device 2 is turned on and the water pump is turned off. When the server heat dissipation is high, the liquid cooling device 1 is turned on. Based on the full utilization of the air cooling and liquid cooling capabilities of the heat dissipation device, efficient heat dissipation of each heat dissipation component in the server is achieved, making it widely applicable and having a uniform temperature distribution. This effectively solves the problems of low heat dissipation capacity of air-cooled radiators, poor heat dissipation performance of liquid-cooled radiators, small heat exchange area and uneven distribution of coolant, resulting in low heat dissipation efficiency in the prior art. In addition, by combining liquid cooling and air cooling, when liquid cooling or air cooling fails, the entire heat dissipation device will not fail immediately, which is suitable for some equipment with strict heat dissipation requirements.

[0071] The above is only an illustrative embodiment of the present invention and is not intended to limit the scope of the present invention. Any equivalent changes and modifications made by those skilled in the art without departing from the concept and principle of the present invention should fall within the scope of protection of the present invention.

Claims

1. A combined cold plate heat dissipation device, characterized in that: It includes a liquid cooling device, an air cooling device and a controller, wherein the liquid cooling device includes a liquid cooling plate with a cooling cavity inside; The cooling chamber is provided with a plurality of polygonal heat-conducting columns connected to the top wall and the bottom wall of the cooling chamber and arranged in a regular array, and the polygonal heat-conducting columns are provided with a plurality of through holes; the gaps between the plurality of polygonal heat-conducting columns and between the polygonal heat-conducting columns and the side walls of the cooling chamber are connected to each other and form a liquid cooling channel for the flow of coolant; the liquid cooling plate is also provided with a cooling liquid inlet and a cooling liquid outlet that can be connected to the liquid cooling channel, and the air cooling device is provided on one of the plate surfaces of the liquid cooling plate and faces the cooling chamber, and the controller is electrically connected to the liquid cooling device and the air cooling device; the outer surface of the plate surface where the air cooling device is installed in the liquid cooling plate is provided with a plurality of bionic fish tail fin heat sinks arranged in a regular array, and a plurality of bionic vortex guide grooves are formed on both side surfaces of the bionic fish tail fin heat sink, and the airflow generated by the air cooling device can form a disturbed airflow when flowing through the plurality of bionic fish tail fin heat sinks.

2. The combined cold plate heat dissipation device according to claim 1, wherein: The bottom end of the bionic fish tail fin heat sink is connected to the liquid cooling plate. The bionic fish tail fin heat sink includes two symmetrically arranged sheets. The upper parts of the two sheets constitute a tail tip structure that forks from the bottom end to the top end of the bionic fish tail fin heat sink toward both sides and the width gradually decreases.

3. The combined cold plate heat dissipation device according to claim 2, wherein: The bionic vortex guide grooves on the two sheet bodies are symmetrically arranged, and the bionic vortex guide grooves are curved groove bodies extending from the bottom end to the top end of the bionic fish tail fin heat sink.

4. The combined cold plate heat dissipation device according to claim 1, wherein: The bionic fish tail fin heat sink has a height of 3-10 mm and a thickness of 0.5-2 mm, and the interval between two adjacent bionic fish tail fin heat sinks is 1-5 mm; the bionic vortex guide groove has a width of 0.5-2 mm and a depth of 0.2-1 mm.

5. The combined cold plate heat dissipation device according to claim 1, wherein: The outer surface of the heat-conducting column and the flow bottom surface of the liquid-cooling channel are both bionic surfaces simulating the surface of butterfly wings.

6. The combined cold plate heat dissipation device according to claim 5, wherein: A plurality of conical protrusions are vertically provided on the surface of the polygonal heat-conducting column and the flow bottom surface.

7. The combined cold plate heat dissipation device according to claim 6, wherein: The height of the conical protrusion is 5-100 μm, and the bottom diameter is 10-200 μm.

8. The combined cold plate heat dissipation device according to claim 1, wherein: The through hole has a diameter of 10-500 μm.

9. The combined cold plate heat dissipation device according to claim 1, wherein: The liquid cooling channel is formed into a simulated honeycomb channel and includes a first straight flow channel and a second straight flow channel arranged in parallel and spaced apart from each other, and a honeycomb channel network located between the first straight flow channel and the second straight flow channel; The first direct current channel is connected to the coolant inlet and is connected to the honeycomb flow channel network through a plurality of first branch straight channels, and the length direction of the first branch straight channels is perpendicular to the length direction of the first direct current channel; the second direct current channel is connected to the coolant outlet and is connected to the honeycomb flow channel network through a plurality of second branch straight channels, and the length direction of the second branch straight channels is perpendicular to the length direction of the second direct current channel.

10. The combined cold plate heat dissipation device according to claim 9, wherein: The liquid cooling plate includes a cold plate body and a cover body, a cooling groove is opened on the cold plate body, and a plurality of polygonal heat-conducting columns are arranged in the cooling groove; the cover body is arranged at the notch position of the cooling groove and is detachably fixed to the cold plate body, and each polygonal heat-conducting column can contact the cover body, the cover body and the cooling groove enclose the cooling cavity, the air cooling device is connected to the cover body, and the bionic fishtail fin heat sink is arranged on the outer surface of the cover body.

11. The combined cold plate heat dissipation device according to claim 1, wherein: The liquid cooling device also includes a circulation pump, a liquid cooler and a liquid storage device. The circulation pump is connected to the coolant inlet through a first pipe, and an electronic valve is provided on the first pipe; the coolant outlet is connected to the liquid cooler through a second pipe, and the liquid storage device is connected to both the circulation pump and the liquid cooler through corresponding pipes; the controller is electrically connected to the circulation pump and the electronic valve.

12. The combined cold plate heat dissipation device according to claim 1, wherein: A temperature sensor is also provided on the liquid cooling plate, and the controller is electrically connected to the temperature sensor.

13. The combined cold plate heat dissipation device according to claim 1, wherein: The air cooling device includes a frame, fan blades and a motor. The frame is fixed to the liquid cooling plate. The fan blades and the motor are arranged on the frame. The motor can drive the fan blades to rotate. The controller is electrically connected to the motor.

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