A dual wideband dual-polarized nested structure antenna

Abstract

The application provides a kind of dual wideband dual polarization nested structure antenna, it relates to antenna design technical field.First high-frequency microstrip oscillator board and second high-frequency microstrip oscillator board are installed orthogonally and cross, pass through low-frequency metal radiation unit, and are vertically fixedly connected with microstrip hybrid board and metal bottom plate.Microstrip hybrid board is fixedly attached with metal bottom plate;Two high-frequency microstrip oscillator boards are fixedly connected with low-frequency metal radiation unit through target position;Microstrip hybrid board feeds low-frequency metal radiation unit, two high-frequency microstrip oscillator boards through the coupling feed structure of two high-frequency microstrip oscillator boards respectively.Metal bottom plate is used for signal reflection of low-frequency metal radiation unit;Low-frequency metal radiation unit is used for low-frequency dual polarization radiation and signal reflection of two high-frequency microstrip oscillator boards simultaneously;Two high-frequency microstrip oscillator boards are used for high-frequency dual polarization radiation respectively.The application effectively reduces the size and height of unit, realizes dual wideband dual polarization, and can be widely applied to sixth generation wireless network technology.

Description

Technical Field

[0001] The present invention relates to the technical field of microstrip antennas, and in particular to an antenna with a dual-broadband and dual-polarization nested structure. Background Art

[0002] With the development of communication technology, the requirements for antenna equipment are becoming higher and higher.

[0003] Currently, the sixth-generation wireless network technology, IEEE 802.11ax, has been extensively designed and researched. However, to achieve dual-bandwidth and dual-polarization, the corresponding microstrip antenna structure is relatively complex, large in size, and tall in height, which does not meet the trend of antenna miniaturization. Summary of the Invention

[0004] In view of the above problems, the present invention is proposed to provide an antenna with a dual-wideband dual-polarization nested structure that solves the above problems or partially solves the above problems.

[0005] An embodiment of the present invention provides a dual-bandwidth dual-polarization nested structure antenna, comprising: a metal base plate 1, a microstrip combiner plate 2, a low-frequency metal radiation unit 3, a first high-frequency microstrip oscillator plate 4, and a second high-frequency microstrip oscillator plate 5;

[0006] After the first high-frequency microstrip oscillator plate 4 and the second high-frequency microstrip oscillator plate 5 are orthogonally cross-mounted, they pass through the low-frequency metal radiation unit 3 and are vertically fixedly connected to the microstrip junction plate 2 and the metal base plate 1;

[0007] The microstrip junction board 2 is attached and fixed to the metal base plate 1;

[0008] The first high-frequency microstrip oscillator plate 4 and the second high-frequency microstrip oscillator plate 5 are fixedly connected to the low-frequency metal radiation unit 3 through a target position, and the target position is a position where the low-frequency metal radiation unit 3 passes through two high-frequency microstrip oscillator plates;

[0009] The microstrip combiner 2 feeds the low-frequency metal radiation unit 3, the first high-frequency microstrip oscillator plate 4, and the second high-frequency microstrip oscillator plate 5 through the respective coupling feeding structures of the first high-frequency microstrip oscillator plate 4 and the second high-frequency microstrip oscillator plate 5;

[0010] The metal base plate 1 is used to reflect the signal of the low-frequency metal radiation unit 3;

[0011] The low-frequency metal radiation unit 3 is used for both low-frequency dual-polarization radiation and signal reflection of two high-frequency microstrip oscillator plates;

[0012] The first high-frequency microstrip oscillator plate 4 and the second high-frequency microstrip oscillator plate 5 are respectively used for high-frequency dual-polarization radiation.

[0013] Optionally, the metal base plate 1 serves as a reflective base plate of the antenna and also serves as an installation support, and includes: a first installation slot 1a, a second installation slot 1b, a third installation slot 1c, a fourth installation slot 1d, a fifth installation slot 1e, a first installation hole 1f, and a second installation hole 1g;

[0014] The first mounting groove 1a, the second mounting groove 1b, and the third mounting groove 1c are formed according to the position where the first high-frequency microstrip oscillator plate 4 is vertically fixed to the metal base plate 1;

[0015] The fourth mounting groove 1d and the fifth mounting groove 1e are opened according to the position where the second high-frequency microstrip oscillator plate 5 is vertically fixed to the metal base plate 1;

[0016] The first mounting hole 1f and the second mounting hole 1g are used for attaching and fixing to the microstrip junction board 2 .

[0017] Optionally, the low-frequency metal radiation unit 3 includes: a first group of rectangular slots 3a, a second group of rectangular slots 3b, a third group of rectangular slots 3c and a fourth group of rectangular slots 3d;

[0018] The first group of rectangular grooves 3a, the third group of rectangular grooves 3c and the second group of rectangular grooves 3b, the fourth group of rectangular grooves 3d are orthogonal to each other;

[0019] The first high-frequency microstrip oscillator plate 4 passes through the first group of rectangular slots 3a, and the first group of rectangular slots 3a and the corresponding positions of the first high-frequency microstrip oscillator plate 4 are fixedly connected by welding;

[0020] The second high-frequency microstrip oscillator plate 5 passes through the second group of rectangular slots 3b, and the second group of rectangular slots 3b and the corresponding positions of the second high-frequency microstrip oscillator plate 5 are fixedly connected by welding;

[0021] The third group of rectangular grooves 3c is located in the middle of the first group of rectangular grooves 3a, and the width of the third group of rectangular grooves 3c is greater than the width of the first group of rectangular grooves 3a, and the length is less than the length of the first group of rectangular grooves 3a;

[0022] The fourth group of rectangular grooves 3d is located in the middle of the second group of rectangular grooves 3b, and the width of the fourth group of rectangular grooves 3d is greater than the width of the second group of rectangular grooves 3b, and the length of the fourth group of rectangular grooves 3d is less than the length of the second group of rectangular grooves 3b.

[0023] Optionally, the first high-frequency microstrip oscillator plate 4 includes: a first pad 4b and a second pad 4c;

[0024] The first pad 4b and the second pad 4c are copper-clad on both the front and back sides, and are provided with a plurality of metallized vias, which are used to conduct the copper-clad areas on the front and back sides of the first high-frequency microstrip oscillator plate 4;

[0025] The first soldering pad 4b and the second soldering pad 4c are soldered to the first group of rectangular grooves 3a.

[0026] Optionally, the second high-frequency microstrip oscillator plate 5 includes: a third pad 5b and a fourth pad 5c;

[0027] The third pad 5b and the fourth pad 5c are copper-clad on both the front and back sides, and are provided with a plurality of metallized vias, which are used to conduct the copper-clad areas on the front and back sides of the second high-frequency microstrip oscillator plate 5;

[0028] The third soldering pad 5b and the fourth soldering pad 5c are soldered to the second group of rectangular grooves 3b.

[0029] Optionally, the microstrip combining plate 2 includes: a first microstrip combining structure, a second microstrip combining structure, a first cable pad 2e, a second cable pad 2f, a third cable pad 2h, a fourth cable pad 2i, a third mounting hole 2a, and a fourth mounting hole 2b;

[0030] The first microstrip junction structure includes: a first branch 2c and a second branch 2d;

[0031] The second microstrip combining structure includes: a third branch 2g and a fourth branch 2j;

[0032] The first branch 2c and the third branch 2g are respectively fan-shaped structure filters, which are used to filter out high-frequency signals and allow low-frequency signals to pass;

[0033] The second branch 2d and the fourth branch 2j are respectively 90° bent structures, which are used to filter out low-frequency signals and allow high-frequency signals to pass through;

[0034] The first cable pad 2e and the second cable pad 2f are a group of cable pads, each of which is provided with a plurality of metallized vias, and the plurality of metallized vias are used to conduct the copper-clad areas on the front and back sides of the microstrip composite board 2;

[0035] The third cable pad 2h and the fourth cable pad 2i are another group of cable pads, each of which is provided with a plurality of metallized vias, and the plurality of metallized vias are used to conduct the copper-clad areas on the front and back sides of the microstrip junction board 2;

[0036] The two sets of cable welding pads are used to weld two cables respectively and effectively ground the two cables;

[0037] The top 2k of the first branch 2c is welded with the second coupling line 5d in the second high-frequency microstrip resonator plate 5;

[0038] The top 2m of the third branch 2g is welded with the first coupling line 4d in the first high-frequency microstrip resonator plate 4;

[0039] The third mounting hole 2a and the fourth mounting hole 2b are respectively used for being fixed by bolts with the first mounting hole 1f and the second mounting hole 1g.

[0040] Optionally, the first high-frequency microstrip resonator plate 4 further comprises a first feed line 4a, a first resonator arm 4h, the first coupling line 4d, a first protruding area 4e, a second protruding area 4f, a third protruding area 4g, a fourth protruding area 4i, and a fifth protruding area 4j.

[0041] The first feed line 4a, the first coupling line 4d, the first protruding area 4e, the second protruding area 4f, and the third protruding area 4g are located on the front face of the first high-frequency microstrip resonator plate 4.

[0042] The first resonator arm 4h, the fourth protruding area 4i, and the fifth protruding area 4j are located on the back face of the first high-frequency microstrip resonator plate 4.

[0043] The first feed line 4a is bent at the top and forms a radiation resonator of a coupling feed structure with the first resonator arm 4h.

[0044] The first coupling line 4d is located below the first pad 4b and is in an L shape.

[0045] The short side of the L shape is welded with the top 2m of the third branch 2g, and the long side of the L shape is close to the low-frequency metal radiation unit 3 and provides strong coupling feed for the low-frequency metal radiation unit 3.

[0046] The first protruding area 4e is welded with the second mounting groove 1b.

[0047] The second protruding area 4f and the fourth protruding area 4i are welded with the third mounting groove 1c.

[0048] The third protruding area 4g and the fifth protruding area 4j are welded with the first mounting groove 1a.

[0049] Optionally, the second high-frequency microstrip resonator plate 5 comprises a second feed line 5a, a second resonator arm 5g, the second coupling line 5d, a sixth protruding area 5e, a seventh protruding area 5f, an eighth protruding area 5h, and a ninth protruding area 5i.

[0050] The second feeding line 5a, the second coupling line 5d, the sixth protruding area 5e and the seventh protruding area 5f are located on the front surface of the second high-frequency microstrip vibrator plate 5.

[0051] The second vibrator arm 5g, the eighth protruding area 5h and the ninth protruding area 5i are located on the back surface of the second high-frequency microstrip vibrator plate 5.

[0052] The second feeding line 5a is bent at the top and forms a radiation vibrator of a coupling feeding structure with the second vibrator arm 5g.

[0053] The second coupling line 5d is located below the third pad 5b and is in the shape of L.

[0054] The short side of the L-shaped structure is welded with the top 2k of the first branch 2c, and the long side of the L-shaped structure is close to the low-frequency metal radiation unit 3 and provides strong coupling feeding for the low-frequency metal radiation unit 3.

[0055] The sixth protruding area 5e and the ninth protruding area 5i are welded with the fourth mounting slot 1d.

[0056] The seventh protruding area 5f and the eighth protruding area 5h are welded with the fifth mounting slot 1e.

[0057] Optionally, slots are formed between the first cable pad 2e and the second cable pad 2f and between the third cable pad 2h and the fourth cable pad 2i, and the sizes of the two slots are determined according to the specifications of the connected cables, so that the shielding nets of the cables are embedded in the slots.

[0058] Optionally, the microstrip combining plate 2 is a high-frequency microstrip PCB plate structure, the dielectric constant of the plate material thereof is 3.5, and the thickness of the plate material is 30 mil.

[0059] The low-frequency metal radiation unit 3 is a tin-plated copper plate structure, and the thickness of the plate material is 0.5 mm.

[0060] The first high-frequency microstrip vibrator plate 4 and the second high-frequency microstrip vibrator plate 5 are both double-sided copper-clad high-frequency microwave plate structures, the dielectric constant of the plate material thereof is 3.5, and the thickness of the plate material is 30 mil.

[0061] The antenna provided by the application comprises a metal bottom plate 1, a microstrip combining plate 2, a low-frequency metal radiation unit 3, a first high-frequency microstrip vibrator plate 4 and a second high-frequency microstrip vibrator plate 5.

[0062] The microstrip combiner 2 is bonded and fixed to the metal base plate 1; the first high-frequency microstrip oscillator plate 4 and the second high-frequency microstrip oscillator plate 5 are fixedly connected to the low-frequency metal radiation unit 3 through the target position; the microstrip combiner 2 feeds the low-frequency metal radiation unit 3, the first high-frequency microstrip oscillator plate 4 and the second high-frequency microstrip oscillator plate 5 through their respective coupling feeding structures.

[0063] The metal base plate 1 is used to reflect the signal of the low-frequency metal radiation unit 3; the low-frequency metal radiation unit 3 is used for low-frequency dual-polarization radiation and signal reflection of two high-frequency microstrip oscillator plates; the first high-frequency microstrip oscillator plate 4 and the second high-frequency microstrip oscillator plate 5 are respectively used for high-frequency dual-polarization radiation.

[0064] The dual-wideband dual-polarization nested structure antenna proposed in the present invention is innovative, based on the traditional microstrip fed patch antenna, by combining two high-frequency microstrip oscillator plates in an orthogonal cross pattern, then stacking them three-dimensionally with a low-frequency metal radiation unit 3, and finally feeding them through a microstrip combiner 2. This effectively reduces the size and height of the unit, thereby effectively miniaturizing the antenna while achieving dual-wideband dual-polarization. This makes the dual-wideband dual-polarization nested structure antenna proposed in the present invention widely applicable to the sixth-generation wireless network technology IEEE 802.11.ax, and has high practical value. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0066] Figure 1 1. This is an exploded diagram of the antenna structure of the dual-wideband dual-polarization nested structure according to an embodiment of the present invention;

[0067] Figure 2 This is a schematic structural diagram of a preferred metal base plate 1 in an embodiment of the present invention;

[0068] Figure 3 This is a schematic structural diagram of a preferred low-frequency metal radiation unit 3 in an embodiment of the present invention;

[0069] Figure 4 1 is a structural diagram of a preferred first high-frequency microstrip oscillator plate 4 in an embodiment of the present invention;

[0070] Figure 5 This is a structural diagram of a preferred second high-frequency microstrip oscillator plate 5 in an embodiment of the present invention.

[0071] Figure 6 This is a schematic structural diagram of a preferred microstrip junction board 2 in an embodiment of the present invention.

[0072] Figure 7 This is a side view of a 3D model of an antenna with a dual-broadband dual-polarization nested structure according to an embodiment of the present invention.

[0073] Figure 8 This is a side view of a 3D model of another dual-broadband dual-polarization nested antenna according to an embodiment of the present invention.

[0074] Figure 9 1 is a graph showing the standing wave ratio of the antenna in the embodiment of the present invention at two polarizations at 2.4-2.5 GHz;

[0075] Figure 10 1 is a graph showing the standing wave ratio of the antenna in the embodiment of the present invention under two polarizations at 5.15-7.125 GHz;

[0076] Figure 11 : This is a radiation pattern diagram of the first low-frequency polarization of the antenna in the embodiment of the present invention in the E-plane and H-plane at 2450 MHz;

[0077] Figure 12 : is a radiation pattern diagram of the second low-frequency polarization of the antenna in the embodiment of the present invention in the E-plane and H-plane at 2450 MHz;

[0078] Figure 13 : This is a radiation pattern diagram of the antenna proposed in an embodiment of the present invention in the E-plane and H-plane at the first high-frequency polarization at 5150 MHz;

[0079] Figure 14 : is the radiation pattern diagram of the second high-frequency polarization of the antenna in the embodiment of the present invention at 5150 MHz in the E-plane and H-plane;

[0080] Figure 15 : This is a radiation pattern diagram of the antenna proposed in an embodiment of the present invention in the E-plane and H-plane at 6000 MHz for the first high-frequency polarization;

[0081] Figure 16 : is a radiation pattern diagram of the second high-frequency polarization of the antenna in the embodiment of the present invention at 6000 MHz in the E-plane and H-plane;

[0082] Figure 17 : This is a radiation pattern diagram of the antenna in an embodiment of the present invention in the E-plane and H-plane at the first high-frequency polarization at 7125 MHz;

[0083] Figure 18 : is the radiation pattern diagram of the second high frequency polarization of the antenna in the embodiment of the present invention in the E-plane and H-plane at 7125 MHz;

[0084] Figure 19 is the gain of the two low-frequency polarizations of the antenna proposed in the embodiment of the present application at 2400-2500MHz;

[0085] Figure 20 is the gain of the two high-frequency polarizations of the antenna proposed in the embodiment of the present application at 5150-7125MHz. DETAILED DESCRIPTION

[0086] In order to make the above objectives, features and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, are only a part of the embodiments of the present application, and are not used to limit the present application.

[0087] The antenna with the double-wideband double-polarization nested structure provided by the present application comprises a metal bottom plate 1, a microstrip combining plate 2, a low-frequency metal radiation unit 3, a first high-frequency microstrip dipole plate 4, and a second high-frequency microstrip dipole plate 5. Figure 1 As shown in the antenna structure explosion diagram, the antenna structure explosion diagram comprises a metal bottom plate 1, a microstrip combining plate 2, a low-frequency metal radiation unit 3, a first high-frequency microstrip dipole plate 4, and a second high-frequency microstrip dipole plate 5.

[0088] The first high-frequency microstrip dipole plate 4 and the second high-frequency microstrip dipole plate 5 are orthogonally crossed and installed, pass through the low-frequency metal radiation unit 3, and are vertically fixedly connected with the microstrip combining plate 2 and the metal bottom plate 1. The microstrip combining plate 2 is fixedly attached to the metal bottom plate 1.

[0089] The first high-frequency microstrip dipole plate 4 and the second high-frequency microstrip dipole plate 5 are fixedly connected with the low-frequency metal radiation unit 3 through target positions; the microstrip combining plate 2 feeds the low-frequency metal radiation unit 3, the first high-frequency microstrip dipole plate 4, and the second high-frequency microstrip dipole plate 5 through the respective coupling feed structures of the first high-frequency microstrip dipole plate 4 and the second high-frequency microstrip dipole plate 5.

[0090] The metal bottom plate 1 is used for signal reflection of the low-frequency metal radiation unit 3; the low-frequency metal radiation unit 3 is used for low-frequency double-polarization radiation and signal reflection of the two high-frequency microstrip dipole plates; and the first high-frequency microstrip dipole plate 4 and the second high-frequency microstrip dipole plate 5 are respectively used for high-frequency double-polarization radiation.

[0091] In addition, Figure 1 Some parts related to the coupling feed structure in the microstrip combining plate 2, the first high-frequency microstrip dipole plate 4, and the second high-frequency microstrip dipole plate 5 are also marked in the drawings, and better understanding can be obtained through the detailed explanation and description of the microstrip combining plate 2, the first high-frequency microstrip dipole plate 4, and the second high-frequency microstrip dipole plate 5 and the corresponding drawings.

[0092] For the metal bottom plate 1, it serves as a reflecting bottom plate of the entire antenna and simultaneously plays a role of installation support. Preferably, the metal bottom plate 1 can be made of a metal material with a certain thickness. Referring toFigure 2 A structural schematic diagram of a preferred metal base plate 1 is shown, which includes: a first mounting groove 1a, a second mounting groove 1b, a third mounting groove 1c, a fourth mounting groove 1d, a fifth mounting groove 1e, a first mounting hole 1f, and a second mounting hole 1g.

[0093] The first mounting groove 1a, the second mounting groove 1b, and the third mounting groove 1c are opened according to the position where the first high-frequency microstrip oscillator plate 4 is vertically fixed to the metal base plate 1. Figure 4 From the structural schematic diagram of a preferred first high-frequency microstrip oscillator plate 4 shown, it can be seen that: the third protruding area 4g and the fifth protruding area 4j are welded to the first mounting groove 1a; the first protruding area 4e is welded to the second mounting groove 1b; the second protruding area 4f and the fourth protruding area 4i are welded to the third mounting groove 1c.

[0094] The fourth mounting groove 1d and the fifth mounting groove 1e are opened according to the position where the second high-frequency microstrip oscillator plate 5 is vertically fixed to the metal base plate 1. Figure 5 From the structural diagram of a preferred second high-frequency microstrip oscillator plate 5 shown, it can be seen that: the sixth protruding area 5e and the ninth protruding area 5i are welded to the fourth mounting groove 1d; the seventh protruding area 5f and the eighth protruding area 5h are welded to the fifth mounting groove 1e.

[0095] The first mounting hole 1f and the second mounting hole 1g are used for attaching and fixing the microstrip board 2. Figure 6 As shown in the structural diagram of a preferred microstrip junction board 2, it can be seen that the third mounting hole 2a is fixed to the first mounting hole 1f by bolts; and the fourth mounting hole 2b is fixed to the second mounting hole 1g by bolts.

[0096] For the low-frequency metal radiation unit 3, it can realize low-frequency antenna radiation and high-frequency antenna reflection through the combined action of the microstrip combiner 2 and two high-frequency microstrip oscillator plates. The preferred low-frequency metal radiation unit 3 is a tinned copper plate structure with a plate thickness of 0.5mm. Figure 3 The schematic structural diagram of a preferred low-frequency metal radiation unit 3 is shown, which includes: a first group of rectangular slots 3a, a second group of rectangular slots 3b, a third group of rectangular slots 3c and a fourth group of rectangular slots 3d.

[0097] The first group of rectangular grooves 3a, the third group of rectangular grooves 3c and the second group of rectangular grooves 3b, the fourth group of rectangular grooves 3d are also orthogonal to each other.

[0098] The first high-frequency microstrip oscillator plate 4 extends through the first set of rectangular slots 3a, and the first set of rectangular slots 3a and the corresponding positions of the first high-frequency microstrip oscillator plate 4 are fixedly connected by welding. The second high-frequency microstrip oscillator plate 5 extends through the second set of rectangular slots 3b, and the second set of rectangular slots 3b and the corresponding positions of the second high-frequency microstrip oscillator plate 5 are fixedly connected by welding.

[0099] The third group of rectangular grooves 3c is located in the middle position of the first group of rectangular grooves 3a, and the width of the third group of rectangular grooves 3c is greater than the width of the first group of rectangular grooves 3a, and the length is less than the length of the first group of rectangular grooves 3a; the fourth group of rectangular grooves 3d is located in the middle position of the second group of rectangular grooves 3b, and the width of the fourth group of rectangular grooves 3d is greater than the width of the second group of rectangular grooves 3b, and the length is less than the length of the second group of rectangular grooves 3b.

[0100] In fact, combined Figure 1 as well as Figure 4 、 Figure 5 As shown, the two high-frequency microstrip oscillator plates are both longer at the bottom and shorter at the top. Therefore, in the actual manufacturing process, after the first high-frequency microstrip oscillator plate 4 and the second high-frequency microstrip oscillator plate 5 are orthogonally combined, they are first fixedly connected to the microstrip combiner plate 2 and the metal base plate 1, and then the low-frequency metal radiation unit 3 is put on the orthogonal combination and welded to it.

[0101] The first high-frequency microstrip oscillator plate 4 can realize one polarization in the high-frequency polarization. Preferably, the first high-frequency microstrip oscillator plate 4 is a high-frequency microwave plate structure with double-sided copper cladding, the dielectric constant of the plate medium is 3.5, and the plate thickness is 30 mil. Figure 4 A structural diagram of a preferred first high-frequency microstrip oscillator plate 4 is shown, Figure 4 The left side of the figure shows the front structure of the first high-frequency microstrip oscillator plate 4, and the right side shows the back structure of the first high-frequency microstrip oscillator plate 4. It includes: a first feed line 4a, a first pad 4b, a second pad 4c, a first coupling line 4d, a first dipole arm 4h, a first protruding area 4e, a second protruding area 4f, a third protruding area 4g, a fourth protruding area 4i, and a fifth protruding area 4j.

[0102] The first feed line 4a, the first coupling line 4d, the first protruding area 4e, the second protruding area 4f, and the third protruding area 4g are all located on the front side of the first high-frequency microstrip oscillator plate 4; the first oscillator arm 4h, the fourth protruding area 4i, and the fifth protruding area 4j are all located on the back side of the first high-frequency microstrip oscillator plate 4.

[0103] The top of the first feed line 4a is bent, and it forms a radiation oscillator of the coupled feeding structure with the first dipole arm 4h; the first coupling line 4d is located below the first pad 4b and is L-shaped; the short side of the L-shaped Figure 6 The top 2m of the third branch 2g is welded and connected, and the long side of the L-shape is close to the low-frequency metal radiation unit 3, providing strong coupling feeding for the low-frequency metal radiation unit 3.

[0104] The first protruding area 4e is welded to the second mounting groove 1b; the second protruding area 4f and the fourth protruding area 4i are welded to the third mounting groove 1c; and the third protruding area 4g and the fifth protruding area 4j are welded to the first mounting groove 1a.

[0105] The first pad 4b and the second pad 4c are copper-clad on both the front and back sides, and are provided with a plurality of metallized vias ( Figure 4 8 metallized vias are shown as an example in the figure), multiple metallized vias are used to conduct the copper-clad areas on the front and back sides of the first high-frequency microstrip oscillator plate 4; the first pad 4b and the second pad 4c are welded to the first group of rectangular slots 3a.

[0106] For the second high-frequency microstrip oscillator plate 5, it can realize another polarization in the high-frequency polarization. Preferably, the material of the second high-frequency microstrip oscillator plate 5 is the same as that of the first high-frequency microstrip oscillator plate 4, and is also a high-frequency microwave plate structure with double-sided copper cladding. The dielectric constant of the plate medium is 3.5 and the plate thickness is 30 mil.

[0107] Reference Figure 5 A structural schematic diagram of a preferred second high-frequency microstrip oscillator plate 5 is shown, which includes: a second feed line 5a, a third pad 5b, a fourth pad 5c, a second coupling line 5d, a second oscillator arm 5g, a sixth protruding area 5e, a seventh protruding area 5f, an eighth protruding area 5h, and a ninth protruding area 5i.

[0108] The second feed line 5a, the second coupling line 5d, the sixth protruding area 5e, and the seventh protruding area 5f are all located on the front side of the second high-frequency microstrip oscillator plate 5; the second oscillator arm 5g, the eighth protruding area 5h, and the ninth protruding area 5i are all located on the back side of the second high-frequency microstrip oscillator plate 5.

[0109] The second feed line 5a is bent at the top, and it forms a radiation dipole of the coupled feeding structure with the second dipole arm 5g. The second coupling line 5d is located below the third pad 5b and is L-shaped; the short side of the L-shaped Figure 6 The top 2k of the first branch 2c is welded and connected, and the long side of the L-shape is close to the low-frequency metal radiation unit 3, providing strong coupling feeding for the low-frequency metal radiation unit 3.

[0110] The sixth protruding area 5e and the ninth protruding area 5i are welded to the fourth mounting groove 1d; the seventh protruding area 5f and the eighth protruding area 5h are welded to the fifth mounting groove 1e.

[0111] The third pad 5b and the fourth pad 5c are copper-clad on both the front and back sides, and are provided with a plurality of metallized vias ( Figure 5 8 metallized vias are shown as an example in FIG), multiple metallized vias are used to conduct the copper clad areas on the front and back sides of the second high-frequency microstrip oscillator plate 5. The third pad 5b and the fourth pad 5c are welded to the second set of rectangular slots 3b.

[0112] For the microstrip combiner 2, it is fed by a low-frequency metal radiation unit 3 and two high-frequency microstrip oscillator plates. Preferably, the microstrip combiner 2 can be a dual-frequency microstrip combiner structure made of a high-frequency microstrip PCB board, the dielectric constant of the board medium is 3.5, and the board thickness is 30 mil.

[0113] Reference Figure 6 The schematic diagram of a preferred microstrip combiner 2 is shown, which includes: a first microstrip combiner structure, a second microstrip combiner structure, a first cable pad 2e, a second cable pad 2f, a third cable pad 2h, a fourth cable pad 2i, a third mounting hole 2a, and a fourth mounting hole 2b. The first microstrip combiner structure includes: a first branch 2c and a second branch 2d; the second microstrip combiner structure includes: a third branch 2g and a fourth branch 2j.

[0114] The first branch 2c and the third branch 2g are respectively fan-shaped structure filters, which are used to filter out high-frequency signals and allow low-frequency signals to pass through; the second branch 2d and the fourth branch 2j are respectively 90° bent structures, which are used to filter out low-frequency signals and allow high-frequency signals to pass through. That is: through the third branch 2g and the first coupling line 4d, the low-frequency metal radiation unit 3 is coupled and fed to achieve one low-frequency polarization; through the first branch 2c and the second coupling line 5d, the low-frequency metal radiation unit 3 is coupled and fed to achieve another low-frequency polarization, thereby achieving low-frequency dual polarization. Through the fourth branch 2j and the first feed line 4a, the first high-frequency microstrip oscillator plate 4 is coupled and fed to achieve one high-frequency polarization; through the second branch 2d and the second feed line 5a, the second high-frequency microstrip oscillator plate 5 is coupled and fed to achieve another high-frequency polarization, thereby achieving high-frequency dual polarization.

[0115] The first cable pad 2e and the second cable pad 2f are a group of cable pads, each of which has a plurality of metallized vias ( Figure 6 4 metallized vias are shown as an example in FIG), multiple metallized vias are used to conduct the copper-clad areas on the front and back sides of the microstrip board 2; the third cable pad 2h and the fourth cable pad 2i are another group of cable pads, each of which is provided with multiple metallized vias ( Figure 6 4 metallized vias are exemplarily shown in FIG), multiple metallized vias are used to conduct the copper-clad areas on the front and back sides of the microstrip composite board 2.

[0116] The two sets of cable pads are used to solder two cables, each ensuring effective grounding. A slot is formed between the first and second cable pads 2e and 2f (this slot is located near one end of the second branch 2d). A slot is formed between the third and fourth cable pads 2h and 2i (this slot is located near one end of the fourth branch 2j). The dimensions of these two slots are determined based on the specifications of the connected cables, allowing the cable shields to fit within the slots.

[0117] The top 2k of the first branch 2c is welded to the second coupling line 5d in the second high-frequency microstrip oscillator plate 5; the top 2m of the third branch 2g is welded to the first coupling line 4d in the first high-frequency microstrip oscillator plate 4.

[0118] The third mounting hole 2a is fitted and fixed to the first mounting hole 1f by bolts; the fourth mounting hole 2b is fitted and fixed to the second mounting hole 1g by bolts.

[0119] In the actual structure of the dual-band dual-polarization nested antenna, the second high-frequency microstrip oscillator plate 5 is located on one side of the microstrip combiner 2 and has no spatial connection with the microstrip combiner 2. However, there is a spatial connection between the first high-frequency microstrip oscillator plate 4 and the microstrip combiner 2. Figure 7 The 3D model side view of a dual-band dual-polarization nested antenna is shown, referring to Figure 8 The side view of the 3D model of another dual-band dual-polarization nested antenna structure shown in the figure can more intuitively understand the spatial relationship between the five components: the metal base plate 1, the microstrip combiner 2, the low-frequency metal radiation unit 3, the first high-frequency microstrip oscillator plate 4, and the second high-frequency microstrip oscillator plate 5. Since the low-frequency metal radiation unit 3 will be blocked after welding, it is not conducive to the graphical expression of the spatial relationship. Figure 7 、 Figure 8 What is shown is the antenna structure without welding the low-frequency metal radiation unit 3. As mentioned above, the two high-frequency microstrip oscillator plates are both long at the bottom and short at the top. Therefore, in the actual production process, after the first high-frequency microstrip oscillator plate 4 and the second high-frequency microstrip oscillator plate 5 are orthogonally combined, they are first fixedly connected to the microstrip combiner plate 2 and the metal base plate 1, and then the low-frequency metal radiation unit 3 is put on the orthogonal combination and welded to it, thereby producing a dual-wideband dual-polarization nested structure antenna.

[0120] In order to verify the practicability of the dual-band dual-polarization nested antenna of the present invention, the antenna was manufactured and then measured to obtain a test curve. Figure 9 The standing wave ratio of the antenna shown in the figure for both polarizations at 2.4-2.5 GHz is: Figure 9 The horizontal axis represents frequency (GHz), and the vertical axis represents the standing wave ratio (SWR). The solid black line represents the SWR curve for the first low-frequency polarization, while the dashed line represents the SWR curve for the second low-frequency polarization. It can be seen that both low-frequency polarizations have low SWRs, enabling the antenna to operate very effectively in this frequency band.

[0121] Reference Figure 10 The antenna shown has two polarization standing wave ratios at 5.15-7.125 GHz. Figure 10The horizontal axis is frequency Freq, unit [GHz], and the vertical axis is standing wave ratio. The black solid line represents the standing wave ratio curve of the first high frequency polarization, and the dotted line represents the standing wave ratio curve of the second high frequency polarization. It can be seen that the electromagnetic waves of the two high frequency polarizations also have a lower standing wave ratio, so that the antenna can work very effectively in this frequency band.

[0122] Referring to Figure 11 The antenna shown in FIG. 6A shows the radiation pattern of the first low frequency polarization in the E plane and the H plane at 2450 MHz, Figure 11 The horizontal axis is beam width Theta, unit [deg], and the vertical axis is normalized radiation intensity. The black solid line represents the radiation intensity curve of the first low frequency polarization in the H plane, and the dotted line represents the radiation intensity curve of the first low frequency polarization in the E plane. It can be seen that the electromagnetic waves of the first low frequency polarization have good directivity and gain, so that the antenna can work very effectively in this frequency band.

[0123] Referring to Figure 12 The antenna shown in FIG. 6A shows the radiation pattern of the first low frequency polarization in the E plane and the H plane at 2450 MHz, Figure 12 The horizontal axis is beam width Theta, unit [deg], and the vertical axis is normalized radiation intensity. The black solid line represents the radiation intensity curve of the first low frequency polarization in the H plane, and the dotted line represents the radiation intensity curve of the first low frequency polarization in the E plane. It can be seen that the electromagnetic waves of the first low frequency polarization have good directivity and gain, so that the antenna can work very effectively in this frequency band.

[0124] Referring to Figure 13 The antenna shown in FIG. 6A shows the radiation pattern of the first low frequency polarization in the E plane and the H plane at 2450 MHz, Figure 13 The horizontal axis is beam width Theta, unit [deg], and the vertical axis is normalized radiation intensity. The black solid line represents the radiation intensity curve of the first low frequency polarization in the H plane, and the dotted line represents the radiation intensity curve of the first low frequency polarization in the E plane. It can be seen that the electromagnetic waves of the first low frequency polarization have good directivity and gain, so that the antenna can work very effectively in this frequency band.

[0125] Referring to Figure 14 The antenna shown in FIG. 6A shows the radiation pattern of the first low frequency polarization in the E plane and the H plane at 2450 MHz, Figure 14 The horizontal axis is beam width Theta, unit [deg], and the vertical axis is normalized radiation intensity. The black solid line represents the radiation intensity curve of the first low frequency polarization in the H plane, and the dotted line represents the radiation intensity curve of the first low frequency polarization in the E plane. It can be seen that the electromagnetic waves of the first low frequency polarization have good directivity and gain, so that the antenna can work very effectively in this frequency band.

[0126] Referring to Figure 15 The radiation pattern of the antenna shown in FIG. 6 at 6000 MHz for the first high frequency polarization in the E-plane and H-plane, Figure 15 The horizontal axis is the beam width Theta, in [deg], and the vertical axis is the normalized radiation intensity. The black solid line represents the radiation intensity curve of the first high frequency polarization in the H-plane, and the dotted line represents the radiation intensity curve of the first high frequency polarization in the E-plane. It can be seen that the electromagnetic waves of the first high frequency polarization also have good directivity and gain, so that the antenna can work very effectively in this frequency band.

[0127] Referring to Figure 16 The radiation pattern of the antenna shown in FIG. 6 at 6000 MHz for the second high frequency polarization in the E-plane and H-plane, Figure 16 The horizontal axis is the beam width Theta, in [deg], and the vertical axis is the normalized radiation intensity. The black solid line represents the radiation intensity curve of the second high frequency polarization in the H-plane, and the dotted line represents the radiation intensity curve of the second high frequency polarization in the E-plane. It can be seen that the electromagnetic waves of the second high frequency polarization also have good directivity and gain, so that the antenna can work very effectively in this frequency band.

[0128] Referring to Figure 17 The radiation pattern of the antenna shown in FIG. 6 at 7125 MHz for the first high frequency polarization in the E-plane and H-plane, Figure 17 The horizontal axis is the beam width Theta, in [deg], and the vertical axis is the normalized radiation intensity. The black solid line represents the radiation intensity curve of the first high frequency polarization in the H-plane, and the dotted line represents the radiation intensity curve of the first high frequency polarization in the E-plane. It can be seen that the electromagnetic waves of the first high frequency polarization also have good directivity and gain, so that the antenna can work very effectively in this frequency band.

[0129] Referring to Figure 18 The radiation pattern of the antenna shown in FIG. 6 at 7125 MHz for the second high frequency polarization in the E-plane and H-plane, Figure 18 The horizontal axis is the beam width Theta, in [deg], and the vertical axis is the normalized radiation intensity. The black solid line represents the radiation intensity curve of the second high frequency polarization in the H-plane, and the dotted line represents the radiation intensity curve of the second high frequency polarization in the E-plane. It can be seen that the electromagnetic waves of the second high frequency polarization also have good directivity and gain, so that the antenna can work very effectively in this frequency band.

[0130] Referring to Figure 19 The gain of the antenna shown in FIG. 6 at 2400-2500 MHz for the two low frequency polarizations, Figure 19The horizontal axis is frequency, and the vertical axis is gain. The solid black line represents the gain curve for the first low-frequency polarization, and the dashed line represents the gain curve for the second low-frequency polarization. It can be seen that both low-frequency polarizations have good gain, allowing the antenna to operate very effectively in this frequency band.

[0131] Reference Figure 20 The antenna shown has two high frequency polarization gains at 5150-7125 MHz. Figure 20 The horizontal axis is frequency, and the vertical axis is gain. The solid black line represents the gain curve for the first high-frequency polarization, and the dashed line represents the gain curve for the second high-frequency polarization. It can be seen that both high-frequency polarizations have good gain, allowing the antenna to operate very effectively in this frequency band.

[0132] In summary, the dual-broadband, dual-polarization nested antenna provided by the present invention includes: a metal base plate 1, a microstrip combiner plate 2, a low-frequency metal radiating element 3, a first high-frequency microstrip oscillator plate 4, and a second high-frequency microstrip oscillator plate 5. The first high-frequency microstrip oscillator plate 4 and the second high-frequency microstrip oscillator plate 5 are orthogonally mounted, pass through the low-frequency metal radiating element 3, and are vertically fixedly connected to the microstrip combiner plate 2 and the metal base plate 1.

[0133] The microstrip combiner 2 is bonded and fixed to the metal base plate 1; the first high-frequency microstrip oscillator plate 4 and the second high-frequency microstrip oscillator plate 5 are fixedly connected to the low-frequency metal radiation unit 3 through the target position; the microstrip combiner 2 feeds the low-frequency metal radiation unit 3, the first high-frequency microstrip oscillator plate 4 and the second high-frequency microstrip oscillator plate 5 through their respective coupling feeding structures.

[0134] The metal base plate 1 is used to reflect the signal of the low-frequency metal radiation unit 3; the low-frequency metal radiation unit 3 is used for low-frequency dual-polarization radiation and signal reflection of two high-frequency microstrip oscillator plates; the first high-frequency microstrip oscillator plate 4 and the second high-frequency microstrip oscillator plate 5 are respectively used for high-frequency dual-polarization radiation.

[0135] The dual-wideband dual-polarization nested structure antenna proposed in the present invention is innovative, based on the traditional microstrip fed patch antenna, by combining two high-frequency microstrip oscillator plates in an orthogonal cross pattern, then stacking them three-dimensionally with a low-frequency metal radiation unit 3, and finally feeding them through a microstrip combiner 2. This effectively reduces the size and height of the unit, thereby effectively miniaturizing the antenna while achieving dual-wideband dual-polarization. This makes the dual-wideband dual-polarization nested structure antenna proposed in the present invention widely applicable to the sixth-generation wireless network technology IEEE 802.11.ax, and has high practical value.

[0136] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they become aware of the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0137] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, an element defined by the sentence "comprises a..." does not exclude the presence of other identical elements in the process, method, article or terminal device that includes the element.

[0138] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are protected by the present invention.

Claims

1. A dual-bandwidth dual-polarization nested antenna, characterized in that: The antenna comprises: a metal base plate (1), a microstrip junction plate (2), a low-frequency metal radiation unit (3), a first high-frequency microstrip oscillator plate (4), and a second high-frequency microstrip oscillator plate (5); After the first high-frequency microstrip oscillator plate (4) and the second high-frequency microstrip oscillator plate (5) are orthogonally cross-mounted, they pass through the low-frequency metal radiation unit (3) and are vertically fixedly connected to the microstrip junction plate (2) and the metal base plate (1); The microstrip junction board (2) is bonded and fixed to the metal base board (1); The first high-frequency microstrip oscillator plate (4) and the second high-frequency microstrip oscillator plate (5) are fixedly connected to the low-frequency metal radiation unit (3) through a target position, and the target position is a position where the low-frequency metal radiation unit (3) passes through the two high-frequency microstrip oscillator plates; The microstrip combiner (2) feeds the low-frequency metal radiation unit (3), the first high-frequency microstrip oscillator plate (4), and the second high-frequency microstrip oscillator plate (5) through the respective coupling feeding structures of the first high-frequency microstrip oscillator plate (4) and the second high-frequency microstrip oscillator plate (5); The metal base plate (1) is used to reflect the signal of the low-frequency metal radiation unit (3); The low-frequency metal radiation unit (3) is used for both low-frequency dual-polarization radiation and signal reflection of two high-frequency microstrip oscillator plates; The first high-frequency microstrip oscillator plate (4) and the second high-frequency microstrip oscillator plate (5) are respectively used for high-frequency dual-polarization radiation.

2. The antenna according to claim 1, wherein The metal base plate (1) serves as a reflective base plate of the antenna and also plays a role of mounting support, and comprises: a first mounting slot (1a), a second mounting slot (1b), a third mounting slot (1c), a fourth mounting slot (1d), a fifth mounting slot (1e), a first mounting hole (1f), and a second mounting hole (1g); The first mounting groove (1a), the second mounting groove (1b), and the third mounting groove (1c) are opened according to the position where the first high-frequency microstrip oscillator plate (4) is vertically fixed to the metal base plate (1); The fourth mounting groove (1d) and the fifth mounting groove (1e) are opened according to the position where the second high-frequency microstrip oscillator plate (5) is vertically fixed to the metal base plate (1); The first mounting hole (1f) and the second mounting hole (1g) are used for bonding and fixing with the microstrip junction board (2).

3. The antenna according to claim 1, wherein The low-frequency metal radiation unit (3) comprises: a first group of rectangular slots (3a), a second group of rectangular slots (3b), a third group of rectangular slots (3c), and a fourth group of rectangular slots (3d); The first group of rectangular grooves (3a), the third group of rectangular grooves (3c) and the second group of rectangular grooves (3b), the fourth group of rectangular grooves (3d) are in an orthogonal relationship; The first high-frequency microstrip oscillator plate (4) passes through the first group of rectangular slots (3a), and the first group of rectangular slots (3a) and the first high-frequency microstrip oscillator plate (4) are fixedly connected at corresponding positions by welding; The second high-frequency microstrip oscillator plate (5) passes through the second group of rectangular slots (3b), and the second group of rectangular slots (3b) and the corresponding positions of the second high-frequency microstrip oscillator plate (5) are fixedly connected by welding; The third group of rectangular grooves (3c) is located in the middle of the first group of rectangular grooves (3a), and the width of the third group of rectangular grooves (3c) is greater than the width of the first group of rectangular grooves (3a), and the length is less than the length of the first group of rectangular grooves (3a); The fourth group of rectangular grooves (3d) is located in the middle of the second group of rectangular grooves (3b), and the width of the fourth group of rectangular grooves (3d) is greater than the width of the second group of rectangular grooves (3b), and the length is less than the length of the second group of rectangular grooves (3b).

4. The antenna according to claim 3, wherein: The first high-frequency microstrip oscillator plate (4) comprises: a first soldering pad (4b) and a second soldering pad (4c); The first solder pad (4b) and the second solder pad (4c) are copper-clad on both the front and back sides, and are provided with a plurality of metallized vias, the plurality of metallized vias being used to conduct the copper-clad areas on the front and back sides of the first high-frequency microstrip oscillator plate (4); The first welding pad (4b) and the second welding pad (4c) are welded to the first group of rectangular grooves (3a).

5. The antenna according to claim 3, wherein: The second high-frequency microstrip oscillator plate (5) comprises: a third solder pad (5b) and a fourth solder pad (5c); The third pad (5b) and the fourth pad (5c) are copper-clad on both the front and back sides, and are provided with a plurality of metallized vias, which are used to conduct the copper-clad areas on the front and back sides of the second high-frequency microstrip oscillator plate (5); The third welding pad (5b), the fourth welding pad (5c) and the second group of rectangular grooves (3b) are welded.

6. The antenna according to claim 2, wherein: The microstrip combining plate (2) comprises: a first microstrip combining structure, a second microstrip combining structure, a first cable soldering pad (2e), a second cable soldering pad (2f), a third cable soldering pad (2h), a fourth cable soldering pad (2i), a third mounting hole (2a), and a fourth mounting hole (2b); The first microstrip combining structure comprises: a first branch (2c), a second branch (2d); The second microstrip combining structure includes: a third branch (2g), a fourth branch (2j); The first branch (2c) and the third branch (2g) are respectively fan-shaped structure filters, which are used to filter out high-frequency signals and allow low-frequency signals to pass; The second branch (2d) and the fourth branch (2j) are respectively 90° bent structures, which are used to filter out low-frequency signals and allow high-frequency signals to pass through; The first cable pad (2e) and the second cable pad (2f) form a group of cable pads, each of which is provided with a plurality of metallized vias, and the plurality of metallized vias are used to conduct the copper-clad areas on the front and back sides of the microstrip circuit board (2); The third cable pad (2h) and the fourth cable pad (2i) are another group of cable pads, each of which is provided with a plurality of metallized vias, and the plurality of metallized vias are used to conduct the copper-clad areas on the front and back sides of the microstrip circuit board (2); The two sets of cable welding pads are used to weld two cables respectively and effectively ground the two cables; The top (2k) of the first branch (2c) is welded to the second coupling line (5d) in the second high-frequency microstrip oscillator plate (5); The top (2m) of the third branch (2g) is welded to the first coupling line (4d) in the first high-frequency microstrip oscillator plate (4); The third mounting hole (2a) and the fourth mounting hole (2b) are respectively used for being fitted and fixed with the first mounting hole (1f) and the second mounting hole (1g) by means of bolts.

7. The antenna according to claim 6, characterized in that The first high-frequency microstrip oscillator plate (4) further comprises: a first feed line (4a), a first oscillator arm (4h), the first coupling line (4d), a first protruding area (4e), a second protruding area (4f), a third protruding area (4g), a fourth protruding area (4i), and a fifth protruding area (4j); The first feed line (4a), the first coupling line (4d), the first protruding area (4e), the second protruding area (4f), and the third protruding area (4g) are all located on the front surface of the first high-frequency microstrip oscillator plate (4); The first dipole arm (4h), the fourth protruding area (4i), and the fifth protruding area (4j) are all located on the reverse side of the first high-frequency microstrip dipole plate (4); The first feed line (4a) is bent at the top, and forms a radiating dipole of a coupled feeding structure with the first dipole arm (4h); The first coupling line (4d) is located below the first pad (4b) in the first high-frequency microstrip oscillator plate (4) and is L-shaped; The L-shaped short side is welded to the top (2m) of the third branch (2g) and is in conduction, and the L-shaped long side is close to the low-frequency metal radiation unit (3), providing strong coupling feeding for the low-frequency metal radiation unit (3); The first protruding area (4e) is welded to the second mounting groove (1b); The second protruding area (4f), the fourth protruding area (4i) and the third mounting groove (1c) are welded; The third protruding area (4g) and the fifth protruding area (4j) are welded to the first mounting groove (1a).

8. The antenna according to claim 6, wherein: The second high-frequency microstrip oscillator plate (5) comprises: a second feed line (5a), a second oscillator arm (5g), the second coupling line (5d), a sixth protruding area (5e), ​​a seventh protruding area (5f), an eighth protruding area (5h), and a ninth protruding area (5i); The second feed line (5a), the second coupling line (5d), the sixth protruding area (5e), ​​and the seventh protruding area (5f) are all located on the front surface of the second high-frequency microstrip oscillator plate (5); The second dipole arm (5g), the eighth protruding area (5h), and the ninth protruding area (5i) are all located on the reverse side of the second high-frequency microstrip dipole plate (5); The second feed line (5a) is bent at the top, and forms a radiating dipole of a coupled feeding structure with the second dipole arm (5g); The second coupling line (5d) is located below the third pad (5b) in the second high-frequency microstrip oscillator plate (5) and is L-shaped; The L-shaped short side is welded to the top (2k) of the first branch (2c) to provide conduction, and the L-shaped long side is close to the low-frequency metal radiation unit (3), providing strong coupling feeding for the low-frequency metal radiation unit (3); The sixth protruding area (5e), ​​the ninth protruding area (5i) and the fourth mounting groove (1d) are welded; The seventh protruding area (5f), the eighth protruding area (5h) and the fifth mounting groove (1e) are welded.

9. The antenna according to claim 6, wherein: A slot is formed between the first cable pad (2e) and the second cable pad (2f), and a slot is formed between the third cable pad (2h) and the fourth cable pad (2i). The sizes of the two slots are determined according to the specifications of the connected cables, so that the shielding net of the cables is embedded in the slots.

10. The antenna according to claim 1, wherein The microstrip combiner (2) is a high-frequency microstrip PCB structure, the dielectric constant of the board medium is 3.5, and the board thickness is 30 mil; The low-frequency metal radiation unit (3) is a tinned copper plate structure with a plate thickness of 0.5 mm; The first high-frequency microstrip oscillator plate (4) and the second high-frequency microstrip oscillator plate (5) are both high-frequency microwave plate structures with double-sided copper cladding, the dielectric constant of the plate medium is 3.5, and the plate thickness is 30 mil.

Images