Optical fiber power 24-path synchronous measurement method and system based on leakage light

Abstract

The invention relates to an optical fiber power 24-path synchronous measurement method and system based on leakage light, and belongs to the technical field of optical fiber communication monitoring. The method comprises the steps that bending force is applied to a to-be-measured optical fiber through a micro-bend clamping coupler, and a leakage light signal is captured through a V-shaped angle positioning structure and a double-photosensitive sensor; and high-precision conversion and amplification of optical-electric signals are realized by combining 24 paths of parallel InGaAs-PIN photodiode arrays and a high-speed logarithmic amplifier. 24 paths of signals are synchronously acquired through an SPI protocol by adopting a master-slave single-chip microcomputer architecture, data processing is performed by combining a moving average filtering algorithm and a voltage-optical power conversion algorithm, and finally real-time monitoring of multi-channel optical power is realized through a data transmission interface. The device supports modular design, has the advantages of being non-invasive, low in additional loss, short in response time and the like, and is suitable for multi-channel online monitoring and maintenance of an optical fiber communication network.

Description

Technical Field

[0001] The present application relates to the field of optical fiber communication monitoring technology, and more specifically, to a 24-channel synchronous measurement method and system for optical fiber power based on leakage light. Background Art

[0002] Traditional fiber optic power measurement methods require interrupting the optical path (such as cutting the fiber or inserting a coupler), resulting in data loss, high maintenance costs, and difficulty supporting multi-channel synchronous measurement. Especially in scenarios such as large data centers, existing technologies cannot meet the needs of high-precision, real-time, synchronous measurement of 24 channels or more. Insufficient sensitivity and integration lead to inefficient system management. The main drawbacks of existing technologies are:

[0003] Intrusive detection: destroys the integrity of optical fibers and affects communication stability;

[0004] Single-channel limitations: Accuracy decreases and response speed is slow when multi-channel synchronous acquisition is performed;

[0005] Noise interference: Small current signals are easily affected by environmental interference and have a low signal-to-noise ratio.

[0006] Existing technology, such as Chinese patent application publication number "CN110429977A," discloses a signal measurement circuit topology for spectral detection. This uses an active detection method, deploying a light source array and a photodetector array at both ends of a spare fiber core to actively inject an optical signal and measure the attenuated power. This active optical signal injection method may affect other service cores and is not suitable for online fiber maintenance scenarios. Summary of the Invention

[0007] To solve the above technical problems, the present invention proposes a 24-channel synchronous measurement method and system for optical fiber power based on leakage light.

[0008] The technical solutions of the present invention are as follows:

[0009] The present invention proposes a 24-channel synchronous optical fiber power measurement system based on leakage light, comprising:

[0010] Non-invasive detection module: includes a micro-bend clamping coupler, which is used to apply bending force to the optical fiber to be tested, causing the optical signal transmitted in the optical fiber to generate leakage light;

[0011] Photoelectric conversion module: It consists of a 24-way parallel photodiode array, each photodiode is used to receive leakage light and convert it into a current signal;

[0012] Signal amplification module: includes 24 logarithmic amplifiers, each of which is connected to a photodiode and is used to convert and amplify the current signal output by the corresponding photodiode into a voltage signal;

[0013] Signal acquisition module: used to synchronously collect 24-channel voltage signals from the signal amplification module;

[0014] Data processing module: performs noise reduction on the 24 voltage signals collected by the signal acquisition module based on a sliding average filtering algorithm, and outputs 24 optical power values ​​through a voltage-optical power conversion algorithm;

[0015] Data transmission and display module: The 24-channel optical power values ​​output by the data processing module are transmitted to the host computer or cloud through the data transmission interface for real-time display.

[0016] Preferably, the micro-bend clamping coupler includes: a V-shaped angle positioning base, a fixed bracket, a fiber clamping assembly, a first photosensor and a second photosensor, and the middle part of the V-shaped angle positioning base forms an inwardly concave "V"-shaped groove; the fixed bracket is used to axially fix the optical fiber to be tested; the first photosensor and the second photosensor are symmetrically arranged on both sides of the "V"-shaped groove; the fiber clamping assembly is a pressing plate whose shape is adapted to the "V"-shaped groove, and is used to press the optical fiber to be tested onto the "V"-shaped groove.

[0017] Preferably, the microbend clamping coupler is used to apply a bending force to the optical fiber to be tested, so that the optical fiber to be tested is bent to the following preset radius:

[0018]

[0019] Where: R is the preset radius; U is the exponential factor of the optical fiber bending loss; A c is the bending loss mode coefficient; a c is the optical fiber bending loss coefficient; W(·) is the Lambert W function.

[0020] Preferably, the preset radius controls the leakage optical power ratio to be 0.1%-1%, and the additional loss is ≤0.2dB.

[0021] Preferably, the signal acquisition module includes a master single-chip microcomputer and a slave single-chip microcomputer, and the master single-chip microcomputer controls the slave single-chip microcomputer through the SPI protocol.

[0022] Preferably, the process of the master microcontroller and the slave microcontroller synchronously collecting 24 voltage signals of the signal amplification module is as follows:

[0023] The main MCU initializes the SPI to master mode and configures the ADC sampling frequency;

[0024] Initialize the SPI from the MCU to slave mode and receive instructions from the master MCU;

[0025] The master microcontroller collects 16 voltage signals from the 24 voltage signals output by the signal amplification module and sends transmission instructions to the slave microcontroller via the SPI protocol;

[0026] The microcontroller collects the other 8 voltage signals from the 24 voltage signals output by the signal amplification module, and transmits the data of the 8 voltage signals back to the main microcontroller through the SPI protocol;

[0027] The main microcontroller integrates the data of 24 voltage signals and transmits them to the data processing module via the serial port.

[0028] Preferably, the non-invasive detection module, photoelectric conversion module, signal amplification module and signal acquisition module adopt a modular design and support independent disassembly and upgrade.

[0029] On the other hand, the present invention also provides a method for synchronously measuring 24-channel optical fiber power based on leakage light, comprising the following steps:

[0030] A bending force is applied to the optical fiber to be tested through a microbend clamping coupler, causing the optical signal transmitted in the optical fiber to generate leakage light, and the leakage light is captured by symmetrically distributed photosensors;

[0031] The 24 leakage light signals are input into the 24 parallel photodiode arrays to generate corresponding current signals.

[0032] Each current signal is converted and amplified into a voltage signal through 24-channel high-speed logarithmic amplifiers;

[0033] 24-channel voltage signals are collected synchronously through the master-slave MCU architecture. The master MCU controls the slave MCU to complete the grouped synchronous sampling of 16-channel and 8-channel signals.

[0034] The collected voltage signal is processed by sliding average filtering and the voltage-optical power conversion algorithm is used to calculate and output the optical power values ​​of 24 channels;

[0035] The output 24-channel optical power values ​​are transmitted to the host computer or cloud through the data transmission interface for real-time display.

[0036] On the other hand, the present invention further provides an electronic device having a computer program stored thereon, wherein when the computer program is executed by a processor, the method for synchronously measuring 24-channel optical fiber power based on leakage light as described in any embodiment of the present invention is implemented.

[0037] On the other hand, the present invention also provides a computer-readable medium for storing one or more programs. When the one or more programs are executed by the one or more processors, the one or more processors implement a 24-channel synchronous measurement method of optical fiber power based on leakage light as described in any embodiment of the present invention.

[0038] The present invention has the following beneficial effects:

[0039] Non-intrusive measurement: A micro-bend clamping coupler enables lossless extraction of optical signals, avoiding interruption of fiber optic communications and ensuring continuous system operation.

[0040] High-precision synchronous acquisition: 24-channel parallel InGaAs-PIN photodiode array (responsivity ≥ 0.9A / W, response time ≤ 1ns) combined with high-speed logarithmic amplifier AD8304 (linearity error ≤ 1%) to achieve high-precision signal conversion with a 50dB dynamic range;

[0041] The master and slave microcontrollers are synchronously controlled via the SPI protocol, and the 12-bit ADC completes the acquisition of 24 channels of signals without delay at a 1MHz sampling rate.

[0042] Intelligent data processing: Uses sliding average filtering algorithm to eliminate noise interference, combined with voltage-to-optical power conversion algorithm to output standardized data, with an accuracy error of ≤0.1dBm.

[0043] Modular design: supports hot-swap, remote control, and independent module upgrades, reducing maintenance costs and improving system scalability.

[0044] Real-time monitoring and compatibility: Data is transmitted via USB / cloud, and the host computer supports real-time display of multi-channel optical power, suitable for complex fiber optic network environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0046] Figure 1 This is the overall flow chart of a 24-channel synchronous optical fiber power measurement system based on leakage light;

[0047] Figure 2 Schematic diagram of the basic structure of the micro-bend clamp coupler;

[0048] Figure 3 Schematic diagram of the detection principle of the micro-bend clamp coupler;

[0049] Figure 4 This is a schematic diagram of the connection structure of the main microcontroller;

[0050] Figure 5 This is a schematic diagram of the connection structure from the microcontroller;

[0051] Figure 6 This is a schematic diagram of the 24-channel ADC pin circuit structure. DETAILED DESCRIPTION

[0052] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0053] It should be understood that the step numbers used herein are only for convenience of description and are not intended to limit the order in which the steps are to be executed.

[0054] It should be understood that the terms used in the present specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the present specification and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0055] The terms “include” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0056] The term "and / or" refers to and includes any and all possible combinations of one or more of the associated listed items.

[0057] Example 1:

[0058] In order to make the purpose, technical solutions and advantages of the present invention more clear, the following will be combined with the specific embodiments of the present application and refer to the attached Figure 1 , clearly and completely describe the technical solution of the present invention.

[0059] To solve the problems of the prior art, the present invention provides a 24-channel synchronous optical fiber power measurement system based on leakage light, comprising:

[0060] Non-invasive detection module: includes a micro-bend clamping coupler, which is used to apply bending force to the optical fiber to be tested, causing the optical signal transmitted in the optical fiber to generate leakage light;

[0061] Photoelectric conversion module: It consists of a 24-way parallel photodiode array, each photodiode is used to receive leakage light and convert it into a current signal;

[0062] Signal amplification module: includes 24 logarithmic amplifiers, each of which is connected to a photodiode and is used to convert and amplify the current signal output by the corresponding photodiode into a voltage signal;

[0063] Signal acquisition module: used to synchronously collect 24-channel voltage signals from the signal amplification module;

[0064] Data processing module: performs noise reduction on the 24 voltage signals collected by the signal acquisition module based on a sliding average filtering algorithm, and outputs 24 optical power values ​​through a voltage-optical power conversion algorithm;

[0065] Data transmission and display module: The 24-channel optical power values ​​output by the data processing module are transmitted to the host computer or cloud through the data transmission interface for real-time display.

[0066] As a preferred implementation scheme of this embodiment, the micro-bend clamping coupler includes: a V-shaped angle positioning base 1, a fixed bracket 2, a fiber clamping assembly 4, a first photosensor 31 and a second photosensor 32. The middle part of the V-shaped angle positioning base 1 forms an inwardly concave "V"-shaped groove; the fixed bracket 2 is used to axially fix the optical fiber to be tested 5; the first photosensor 31 and the second photosensor are symmetrically arranged on both sides 32 of the "V"-shaped groove; the fiber clamping assembly 4 is a pressing piece whose shape is adapted to the "V"-shaped groove, and is used to press the optical fiber to be tested 5 on the "V"-shaped groove.

[0067] In this embodiment, Figure 2 As shown, the V-shaped angle positioning base 1 has a thickness of 12mm and a bottom width of 11mm. The aperture for placing the first photosensitive light sensor 31 and the second photosensitive light sensor 32 is 4mm. The top width of the fixed bracket 2 is 22mm and the height is 21mm. The optical fiber clamping assembly 4 adopts a fixed structure type pressing piece. The V-shaped angle positioning base has a high-precision angle positioning structure, which roughly forms a V-shaped angle. Two photosensitive areas of 1mm are selected. 2 The InGaAs-PIN photosensor is packaged in a V-shaped angle positioning base 1.

[0068] like Figure 3 As shown, the detection principle of the microbend clamping coupler is as follows: During the detection process, two InGaAs photosensors are respectively installed in the grooves for placing photosensors. A fiber clamping assembly is used to fix the optical fiber being tested and bring it into close contact with the photosensitive surfaces on these two planes. Under the action of mechanical pressure, the optical fiber microbends, forming a leaked optical signal. When the optical signal is transmitted through the optical fiber, the leakage photoelectric signal intensity detected by the second photosensor 32 is greater than that detected by the first photosensor 31 due to the difference in the optical signal transmission direction. The two signals of different magnitudes are subsequently amplified and collected and sent to the MCU processor for data analysis. This not only determines whether there is an optical signal passing through the optical fiber, but also determines the transmission direction of the optical fiber signal. Ultimately, the actual optical power signal value is displayed on the host computer, providing intuitive monitoring data for the user.

[0069] As a preferred implementation of this embodiment, the microbend clamping coupler is used to apply a bending force to the optical fiber to be tested, so that the optical fiber to be tested is bent to the following preset radius:

[0070]

[0071] Where: R is the preset radius; U is the exponential factor of the optical fiber bending loss; A c is the bending loss mode coefficient; a c is the optical fiber bending loss coefficient; W(·) is the Lambert W function.

[0072] In this embodiment, to ensure instrument sensitivity and prevent excessive insertion loss that would affect normal communication of the measured optical fiber, the structural parameters of the microbend clamping coupler must be optimized. According to the theoretical model, the insertion loss caused by optical fiber bending is related to the optical fiber bend radius and material modification technology, and the relationship is approximately as follows:

[0073]

[0074] Δn=n core -n clad ;

[0075] Where: a c A is the optical fiber bending loss coefficient, which is used to characterize the power loss per unit length of optical fiber caused by bending; c is the bending loss mode coefficient, which is a proportional factor of the fiber mode distribution and geometric characteristics and determines the baseline level of loss; R is the fiber bending radius; U is the exponential factor of the fiber bending loss, which describes the exponential decay rate of the loss with the bending radius and is related to the fiber material and mode; a is the core radius; u is the radial normalized phase constant; S is the radial normalized attenuation constant; V is the normalized frequency; Δn is the refractive index difference between the core and cladding; k(·) is the first-order second-kind deformed Bessel function; n core and n clad are the core refractive index and cladding refractive index, respectively.

[0076] In summary, by introducing the Lambert W function for variable substitution, the preset radius calculation formula is obtained:

[0077]

[0078] Where: R is the preset radius; U is the exponential factor of the optical fiber bending loss; A c is the bending loss mode coefficient; a c is the optical fiber bending loss coefficient; W(·) is the Lambert W function.

[0079] As a preferred implementation of this embodiment, the preset radius controls the leakage optical power ratio to 0.1%-1%, with additional loss ≤0.2dB. Based on the preset radius calculation formula, the optimal fiber radius R based on bending loss can be calculated. Furthermore, through material modification or chemical vapor deposition (CVD) technology, the refractive index of the leakage light is effectively controlled to reduce the leakage optical power ratio to 0.1%-1%, while ensuring that the additional loss of the communication link is ≤0.2dB, achieving stable and efficient extraction of leakage light.

[0080] Among them, the InGaAs-PIN photodiode has excellent characteristics such as responsivity. When the leakage light signal is irradiated on the photosensitive surface, it can achieve efficient photoelectric conversion. Among them, its low capacitance and current-limiting resistance characteristics make the signal-to-noise ratio of the output signal high, effectively reducing noise interference. The photocurrent formula used is as follows:

[0081]

[0082] Where: I p is the photocurrent; q is the electron charge; η is the quantum efficiency; P is the incident light power; h is the Planck constant; and v is the incident light frequency.

[0083] As a preferred implementation of this embodiment, the signal amplification module uses a high-speed logarithmic amplifier AD8304, which uses a logarithmic amplifier unit to convert the small current signal output by the photoelectric conversion unit into a voltage signal and amplify and stabilize the voltage. By accurately setting the slope and intercept of the AD8304, combining bipolar filtering technology, and providing a stable bias mode for the photodiode, the output signal meets the strict requirements of subsequent ADC acquisition on signal range and quality. The output amplification formula of the logarithmic amplifier used is as follows:

[0084]

[0085] Where: V out is the output voltage of the logarithmic amplifier; R A and R B is the gain adjustment resistor; V Y is the proportional constant of the logarithmic amplifier; I PD is the output current of the photodiode; I Z is the reference current.

[0086] As a preferred implementation of this embodiment, the signal acquisition module includes a master single-chip microcomputer and a slave single-chip microcomputer, and the master single-chip microcomputer controls the slave single-chip microcomputer through the SPI protocol.

[0087] As a preferred implementation of this embodiment, the process of the master microcontroller and the slave microcontroller synchronously collecting 24 voltage signals of the signal amplification module is as follows:

[0088] The main MCU initializes the SPI to master mode and configures the ADC sampling frequency;

[0089] Initialize the SPI from the MCU to slave mode and receive instructions from the master MCU;

[0090] The master microcontroller collects 16 voltage signals from the 24 voltage signals output by the signal amplification module and sends transmission instructions to the slave microcontroller via the SPI protocol;

[0091] The microcontroller collects the other 8 voltage signals from the 24 voltage signals output by the signal amplification module, and transmits the data of the 8 voltage signals back to the main microcontroller through the SPI protocol;

[0092] The main microcontroller integrates the data of 24 voltage signals and transmits them to the data processing module via the serial port.

[0093] In this embodiment, the signal acquisition module includes a master single-chip microcomputer, a slave single-chip microcomputer circuit chip, and a 24-channel ADC pin circuit. The signal acquisition module is controlled by the master single-chip microcomputer through the SPI protocol, and uses its built-in 12-bit ADC to synchronously acquire 24 amplified voltage signals with a sampling rate of 1MHz. The master and slave single-chip microcomputers are both STM32F103RCT6, where:

[0094] like Figure 4As shown, interface 1 of the main microcontroller U2 is connected to the power supply VBAT, interface 5 of the main microcontroller U2 is connected to the quartz crystal filter X28M through PD0, the other end of the quartz crystal filter X28M is connected to interface 6 of the main microcontroller U2 through PD1, one end of the quartz crystal filter X28M is connected to capacitor C2, the other end of capacitor C2 is connected to capacitor C1, the other end of capacitor C1 is connected to the quartz crystal filter X28M, the junction of capacitor C2 and capacitor C1 is grounded, interface 7 of the main microcontroller U2 is connected to NRST, interface 12 of the main microcontroller U2 is grounded, interface 13 of the main microcontroller U2 is connected to VDDA, interface 18 of the main microcontroller U2 is grounded, interface 19 of the main microcontroller U2 is connected to the positive voltage 3.3V, interface 28 of the main microcontroller U2 is connected to BOOT1, interface 31 of the main microcontroller U2 Grounded, interface 32 of the main microcontroller U2 is connected to a positive voltage of 3.3V, interface 33 of the main microcontroller U2 is connected to SPI2_NSS, interface 34 of the main microcontroller U2 is connected to SPI2_SCK, interface 35 of the main microcontroller U2 is connected to SPI2_MISO, interface 36 of the main microcontroller U2 is connected to SPI2_MOSI, interface 42 of the main microcontroller U2 is connected to TX, interface 43 of the main microcontroller U2 is connected to RX, interface 46 of the main microcontroller U2 is connected to JTMS, interface 47 of the main microcontroller U2 is grounded, interface 48 of the main microcontroller U2 is connected to a positive voltage of 3.3V, interface 49 of the main microcontroller U2 is connected to JTCK, interface 60 of the main microcontroller U2 is connected to BOOT0, interface 63 of the main microcontroller U2 is grounded, and interface 64 of the main microcontroller U2 is connected to a positive voltage of 3.3V.

[0095] like Figure 5As shown, the power supply VBAT is connected from the interface 1 of the single-chip microcomputer U1, the quartz crystal filter X18M is connected from the interface 5 of the single-chip microcomputer U1 through PD0, the other end of the quartz crystal filter X18M is connected to the interface 6 of the single-chip microcomputer U1 through PD1, one end of the quartz crystal filter X18M is connected to the capacitor C2, the other end of the capacitor C2 is connected to the capacitor C1, the other end of the capacitor C1 is connected to the quartz crystal filter X18M, the junction of the capacitor C2 and the capacitor C1 is grounded, the interface 7 of the single-chip microcomputer U1 is connected to NRST, the interface 12 of the single-chip microcomputer U1 is grounded, the interface 13 of the single-chip microcomputer U1 is connected to VDDA, and the interface 18 of the single-chip microcomputer U1 is grounded. , connect positive voltage 3.3V from interface 19 of microcontroller U1, connect BOOT1 from interface 28 of microcontroller U1, connect ground from interface 31 of microcontroller U1, connect positive voltage 3.3V from interface 32 of microcontroller U1, connect SPI2_NSS from interface 33 of microcontroller U1, connect SPI2_SCK from interface 34 of microcontroller U1, connect SPI2_MISO from interface 35 of microcontroller U1, connect SPI2_MOSI from interface 36 of microcontroller U1, connect BOOT0 from interface 60 of microcontroller U1, connect ground from interface 63 of microcontroller U1, and connect positive voltage 3.3V from interface 64 of microcontroller U1.

[0096] like Figure 6As shown, one end of the capacitor C16 of the 24-way ADC pin circuit is connected to the main microcontroller U2 through IN0, and the other end of the capacitor C16 is grounded. One end of the capacitor C17 is connected to the main microcontroller U2 through IN1, and the other end of the capacitor C17 is grounded. One end of the capacitor C18 is connected to the main microcontroller U2 through IN2, and the other end of the capacitor C18 is grounded. One end of the capacitor C19 is connected to the main microcontroller U2 through IN3, and the other end of the capacitor C19 is grounded. One end of the capacitor C20 is connected to the main microcontroller U2 through IN4, and the other end of the capacitor C20 is grounded. One end of the capacitor C21 is connected to the main microcontroller U2 through IN5, and the capacitor The other end of C21 is grounded, one end of capacitor C22 is connected to the main microcontroller U2 through IN6, the other end of capacitor C22 is grounded, one end of capacitor C23 is connected to the main microcontroller U2 through IN7, the other end of capacitor C23 is grounded, one end of capacitor C24 is connected to the main microcontroller U2 through IN8, the other end of capacitor C24 is grounded, one end of capacitor C25 is connected to the main microcontroller U2 through IN9, the other end of capacitor C25 is grounded, one end of capacitor C26 is connected to the main microcontroller U2 through IN10, the other end of capacitor C26 is grounded, one end of capacitor C27 is connected to the main microcontroller U2 through IN11, capacitor C27 The other end of capacitor C28 is grounded, one end of capacitor C28 is connected to the main microcontroller U2 through IN12, the other end of capacitor C28 is grounded, one end of capacitor C29 is connected to the main microcontroller U2 through IN13, the other end of capacitor C29 is grounded, one end of capacitor C30 is connected to the main microcontroller U2 through IN14, the other end of capacitor C30 is grounded, one end of capacitor C31 is connected to the main microcontroller U2 through IN15, the other end of capacitor C31 is grounded, one end of capacitor C3 is connected to the slave microcontroller U1 through IN16, the other end of capacitor C3 is grounded, one end of capacitor C4 is connected to the slave microcontroller U1 through IN17, the other end of capacitor C4 One end is grounded, one end of capacitor C5 is connected to the microcontroller U1 through IN18, and the other end of capacitor C5 is grounded, one end of capacitor C6 is connected to the microcontroller U1 through IN19, and the other end of capacitor C6 is grounded, one end of capacitor C9 is connected to the microcontroller U1 through IN20, and the other end of capacitor C9 is grounded, one end of capacitor C10 is connected to the microcontroller U1 through IN21, and the other end of capacitor C10 is grounded, one end of capacitor C11 is connected to the microcontroller U1 through IN22, and the other end of capacitor C11 is grounded, one end of capacitor C12 is connected to the microcontroller U1 through IN23, and the other end of capacitor C12 is grounded.

[0097] Pins IN0-IN23 in the 24-channel ADC pin circuit are connected to capacitors and then to ground. These pins are the entry points for external analog signals to enter the microcontroller's ADC module, responsible for collecting voltage signals processed by the photoelectric conversion and signal amplification modules. The capacitors in these pin circuits act as filters, removing high-frequency noise and clutter from the signals, improving the signal quality of the input to the ADC module and ensuring that the analog signals collected by the ADC module are more stable and accurate, thereby improving the measurement accuracy of the entire system. Pins IN0-IN15 are connected to the built-in 12-bit ADC module of the master microcontroller U2, while pins IN16-IN23 are connected to the built-in 12-bit ADC module of the slave microcontroller U1. The ADC module converts these analog voltage signals into digital signals for subsequent data processing by the microcontroller. During system operation, the slave microcontroller U1 and the master microcontroller U2 synchronously sample and convert the input signals through their respective ADC modules, providing the data foundation for the synchronous measurement of the 24 optical power channels.

[0098] In this embodiment, the acquisition process in the master-slave control mode is as follows:

[0099] After the master MCU U2 and the slave MCU U1 are powered on, their respective clock circuits start to oscillate and provide stable clock signals; a reset operation is performed through the reset pin NRST to put the chip into the initial state, and then the startup mode is set according to the BOOT0 and BOOT1 pin levels, and the corresponding program is loaded; the master MCU U2 and the slave MCU U1 initialize and configure the SPI interface and ADC module respectively. The master MCU U2 configures the SPI to master mode and sets the SPI2_NSS, SPI2_SCK, SPI2_MISO, and SPI2_MOSI pin functions and communication parameters; the slave MCU U1 configures the SPI to slave mode, sets the corresponding pin functions, and initializes the sampling frequency and accuracy of their respective ADC modules; the amplified 24-channel voltage signals are respectively connected to the IN0-IN15 pins of the master MCU U2 and the IN16-IN23 pins of the slave MCU U1. Driven by their respective internal clocks, master MCU U2 and slave MCU U1 synchronously sample and convert these analog voltage signals using their built-in 12-bit ADCs, converting the analog signals into digital signals and temporarily storing them in their respective registers. After master MCU U2 completes acquisition of 16 channels of signals, it enables slave MCU U1 by pulling SPI2_NSS low. Synchronized with the SPI2_SCK clock signal, master MCU U2 sends a transmission instruction to slave MCU U1 via SPI2_MOSI. Upon receiving the instruction, slave MCU U1 transmits the collected 8 channels of data bit by bit via SPI2_MISO to master MCU U2. Master MCU U2 receives the data on the SPI2_MISO pin and integrates it with its own collected 16 channels of data to form a complete 24-channel signal data set. Master MCU U2 processes this integrated 24 channels of data and transmits it via the serial port to the host computer for display and further analysis, thus completing the synchronous acquisition, transmission, and processing of the entire 24-channel signal.

[0100] In this embodiment, the data processing module uses filtering, smoothing and other algorithms to optimize data processing; the filtering algorithm preprocesses the data, and this algorithm effectively eliminates noise interference by averaging the data within a certain window; the smoothing algorithm makes data changes more stable, removes fluctuations, and improves data stability and reliability; all outputs strictly follow industrial protocol specifications, using "CHXX: [original value] [optical power] dBm" as a unified template, and the processed data is intuitively presented in the form of optical power value (dBm) on the host computer, making it convenient for users to monitor changes in optical fiber power in real time.

[0101] In this embodiment, the transmission and display module transmits data from the main microcontroller to the host computer via USB-to-serial port conversion. The USB-to-serial port module is used to convert the communication protocol between the USB interface and the serial port. In addition to having good anti-interference capabilities, its plug-and-play feature makes system maintenance and upgrades more convenient. The specific operation instructions are as follows:

[0102] In this measurement system, a suitable USB-to-serial port chip is selected, and the TX pin of the main microcontroller is connected to the RXD pin of the chip, and the RX pin of the main microcontroller is connected to the TXD pin of the chip. At the same time, the power supply and ground are connected; the USB interface of the chip is directly connected to the USB interface of the host computer, thus completing the construction of the data transmission path at the hardware level; after completing the collection and processing of 24 channels of optical power data, the main microcontroller sends the data to the USB-to-serial port chip through the serial port. The host computer parses the data packaged and sent by the USB-to-serial port chip according to the USB protocol, extracts the optical power data, and stores and displays it for further processing and analysis.

[0103] As a preferred implementation of this embodiment, the non-invasive detection module, photoelectric conversion module, signal amplification module and signal acquisition module adopt a modular design and support independent disassembly and upgrade.

[0104] Example 2:

[0105] This embodiment provides a method for synchronously measuring 24-channel optical fiber power based on leakage light, including the following steps:

[0106] A bending force is applied to the optical fiber to be tested through a microbend clamping coupler, causing the optical signal transmitted in the optical fiber to generate leakage light, and the leakage light is captured by symmetrically distributed photosensors;

[0107] The 24 leakage light signals are input into the 24 parallel photodiode arrays to generate corresponding current signals.

[0108] Each current signal is converted and amplified into a voltage signal through 24-channel high-speed logarithmic amplifiers;

[0109] 24-channel voltage signals are collected synchronously through the master-slave MCU architecture. The master MCU controls the slave MCU to complete the grouped synchronous sampling of 16-channel and 8-channel signals.

[0110] The collected voltage signal is processed by sliding average filtering and the voltage-optical power conversion algorithm is used to calculate and output the optical power values ​​of 24 channels;

[0111] The output 24-channel optical power values ​​are transmitted to the host computer or cloud through the data transmission interface for real-time display.

[0112] Example 3:

[0113] This embodiment provides an electronic device having a computer program stored thereon. When the computer program is executed by a processor, the method for synchronously measuring 24-channel optical fiber power based on leakage light as described in any embodiment of the present invention is implemented.

[0114] Example 4:

[0115] This embodiment provides a computer-readable medium for storing one or more programs. When the one or more programs are executed by the one or more processors, the one or more processors implement a 24-channel synchronous measurement method for optical fiber power based on leakage light as described in any embodiment of the present invention.

[0116] In the embodiments of the present application, "at least one" refers to one or more, and "more" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent the existence of A alone, the existence of A and B at the same time, and the existence of B alone. Among them, A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following" and similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b and c can represent: a, b, c, a and b, a and c, b and c or a and b and c, where a, b, c can be single or multiple.

[0117] Those skilled in the art will appreciate that the various units and algorithm steps described in the embodiments disclosed herein can be implemented using a combination of electronic hardware, computer software, and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0118] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0119] In the several embodiments provided in this application, if any function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in each embodiment of this application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory; hereinafter referred to as: ROM), random access memory (Random Access Memory; hereinafter referred to as: RAM), disk or optical disk, and other media that can store program code.

[0120] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention's description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A 24-channel synchronous optical fiber power measurement system based on leakage light, characterized in that: include: Non-invasive detection module: includes a micro-bend clamping coupler, which is used to apply bending force to the optical fiber to be tested, causing the optical signal transmitted in the optical fiber to generate leakage light; Photoelectric conversion module: It consists of a 24-way parallel photodiode array, each photodiode is used to receive leakage light and convert it into a current signal; Signal amplification module: includes 24 logarithmic amplifiers, each of which is connected to a photodiode and is used to convert and amplify the current signal output by the corresponding photodiode into a voltage signal; Signal acquisition module: used to synchronously collect 24-channel voltage signals from the signal amplification module; Data processing module: performs noise reduction on the 24 voltage signals collected by the signal acquisition module based on a sliding average filtering algorithm, and outputs 24 optical power values ​​through a voltage-optical power conversion algorithm; Data transmission and display module: The 24-channel optical power values ​​output by the data processing module are transmitted to the host computer or cloud through the data transmission interface for real-time display.

2. The 24-channel synchronous optical fiber power measurement system based on leakage light according to claim 1, characterized in that: The micro-bend clamping coupler includes: a V-shaped angle positioning base, a fixed bracket, a fiber clamping assembly, a first photosensor and a second photosensor. The middle part of the V-shaped angle positioning base forms an inwardly concave "V"-shaped groove; the fixed bracket is used to axially fix the optical fiber to be tested; the first photosensor and the second photosensor are symmetrically arranged on both sides of the "V"-shaped groove; the fiber clamping assembly is a pressing piece with a shape that matches the "V"-shaped groove, which is used to press the optical fiber to be tested on the "V"-shaped groove.

3. The 24-channel synchronous optical fiber power measurement system based on leakage light according to claim 1, characterized in that: The microbend clamping coupler is used to apply a bending force to the optical fiber to be tested, so that the optical fiber to be tested is bent to the following preset radius: Where: R is the preset radius; U is the exponential factor of the optical fiber bending loss; A c is the bending loss mode coefficient; a c is the optical fiber bending loss coefficient; W(·) is the Lambert W function.

4. The 24-channel synchronous optical fiber power measurement system based on leakage light according to claim 1, characterized in that: The preset radius controls the leakage optical power ratio to be 0.1%-1%, and the additional loss is ≤0.2dB.

5. The 24-channel synchronous optical fiber power measurement system based on leakage light according to claim 1, characterized in that: The signal acquisition module includes a master single-chip microcomputer and a slave single-chip microcomputer, and the master single-chip microcomputer controls the slave single-chip microcomputer through the SPI protocol.

6. The 24-channel synchronous optical fiber power measurement system based on leakage light according to claim 5, characterized in that: The process of the master microcontroller and the slave microcontroller synchronously collecting 24 voltage signals of the signal amplification module is as follows: The main MCU initializes the SPI to master mode and configures the ADC sampling frequency; Initialize the SPI from the MCU to slave mode and receive instructions from the master MCU; The master microcontroller collects 16 voltage signals from the 24 voltage signals output by the signal amplification module and sends transmission instructions to the slave microcontroller via the SPI protocol; The microcontroller collects the other 8 voltage signals from the 24 voltage signals output by the signal amplification module, and transmits the data of the 8 voltage signals back to the main microcontroller through the SPI protocol; The main microcontroller integrates the data of 24 voltage signals and transmits them to the data processing module via the serial port.

7. The 24-channel synchronous optical fiber power measurement system based on leakage light according to claim 1, characterized in that: The non-invasive detection module, photoelectric conversion module, signal amplification module and signal acquisition module adopt a modular design and support independent disassembly and upgrade.

8. A 24-channel synchronous measurement method for optical fiber power based on leakage light, characterized in that: The following steps are involved: A bending force is applied to the optical fiber to be tested through a microbend clamping coupler, causing the optical signal transmitted in the optical fiber to generate leakage light, and the leakage light is captured by symmetrically distributed photosensors; The 24 leakage light signals are input into the 24 parallel photodiode arrays to generate corresponding current signals. Each current signal is converted and amplified into a voltage signal through 24-channel high-speed logarithmic amplifiers; 24-channel voltage signals are collected synchronously through the master-slave MCU architecture. The master MCU controls the slave MCU to complete the grouped synchronous sampling of 16-channel and 8-channel signals. The collected voltage signal is processed by sliding average filtering and the voltage-optical power conversion algorithm is used to calculate and output the optical power values ​​of 24 channels; The output 24-channel optical power values ​​are transmitted to the host computer or cloud through the data transmission interface for real-time display.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the program, the method for synchronously measuring 24-channel optical fiber power based on leakage light as claimed in claim 8 is implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the method for synchronously measuring 24-channel optical fiber power based on leakage light as claimed in claim 8 is implemented.

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