Electrostatic chuck heater

Abstract

The invention provides an electrostatic chuck heater, and relates to the technical field of heating equipment, the heater comprises an upper substrate, a lower substrate, N + 1 insulating layers and N resistance wire layers, and N is a positive integer not less than 2; the N + 1 insulating layers and the N resistance wire layers are arranged between the upper substrate and the lower substrate in an alternate arrangement mode; resistance wires are arranged on the resistance wire layers, the projection positions of different resistance wire layers on a target substrate are different, the target substrate is an upper substrate or a lower substrate, and the sum of the projection areas of the resistance wire layers on the target substrate is the same as the area of the target substrate; and the resistance wires in different resistance wire layers correspond to different control circuits respectively. When an object to be heated is heated, the heating condition of each area on the heating surface of the electrostatic chuck heater can be automatically adjusted according to the heat distribution condition of the object to be heated, so that the heater of which the heating state of each heating area is adjustable is provided.

Description

Technical Field

[0001] The present invention relates to the technical field of heating equipment, and in particular to an electrostatic chuck heater. Background Art

[0002] An electrostatic chuck heater is a device based on the principles of electrostatic adsorption and thermal energy technology, primarily used in industrial production and automated processing. It processes or shapes materials by adsorbing objects onto an electrode plate and heating or cooling them.

[0003] Conventional electrostatic chuck heaters heat materials adsorbed to electrode surfaces using common heating methods, including resistance heating, induction heating, or infrared heating. Heating temperature and power are configured based on specific application requirements. Heating an object held in place by electrostatic chucks can result in uneven heat distribution due to the material's inherent conductivity and uneven heat distribution. This can affect processing quality, particularly when working with temperature-sensitive materials or precision machining. Summary of the Invention

[0004] In view of this, an embodiment of the present invention provides an electrostatic chuck heater, so as to provide an electrostatic chuck heater with adjustable heating states of each heating area.

[0005] To achieve the above objectives, the embodiments of the present invention provide the following technical solutions:

[0006] An electrostatic chuck heater, comprising:

[0007] An upper substrate, a lower substrate, N+1 insulating layers, and N resistance wire layers, where N is a positive integer not less than 2;

[0008] N+1 insulating layers and N resistance wire layers are arranged between the upper substrate and the lower substrate in an alternating manner;

[0009] The resistance wire layers are provided with resistance wires, and different resistance wire layers have different projection positions on the target substrate, the target substrate is an upper substrate or a lower substrate, and the sum of the projection areas of the resistance wire layers on the target substrate is the same as the area of ​​the target substrate;

[0010] The resistance wires in different resistance wire layers correspond to different control circuits respectively.

[0011] Optionally, in the electrostatic chuck heater, the distribution density of the resistance wires in each resistance wire layer is the same.

[0012] Optionally, in the electrostatic chuck heater, the projection of the first resistance wire layer among the N resistance wire layers on the target substrate is a circular area with a radius of r;

[0013] The i-th resistance wire layer is an annular region with an inner diameter of i×r and an outer diameter of (i+1)×r, where i is 2, 3, 4, ..., N.

[0014] Optionally, the electrostatic chuck heater further comprises:

[0015] N temperature sensors are provided on a surface of the upper substrate facing away from the lower substrate;

[0016] The positions of the N temperature sensors correspond one-to-one to the projection areas of the resistance wire layers in the N resistance wire layers on the upper substrate.

[0017] Optionally, in the above-mentioned electrostatic chuck heater, the value of N is 4.

[0018] Optionally, in the above-mentioned electrostatic chuck heater, the control circuit includes: a power supply circuit and a PLC control module;

[0019] The resistance wires in each resistance wire layer correspond to different power supplies and PLC control modules respectively. The PLC control module is used to control the power-on state of the resistors in the corresponding resistance wire layer and the current in the resistance wires.

[0020] Optionally, in the above-mentioned electrostatic suction cup heater, each of the resistance wire layers includes at least one resistance wire area, the resistance wires in each resistance wire area belonging to the same resistance wire layer are connected in parallel with each other, and the resistance wires in different resistance wire areas correspond to different PLC control modules, and the PLC control module is used to control the on and off state of the resistance wire in its corresponding resistance wire area.

[0021] Optionally, in the above-mentioned electrostatic suction cup heater, the first resistance layer is provided with four evenly distributed resistance wire areas, the second resistance layer is provided with eight evenly distributed resistance wire areas, the third resistance wire layer is provided with sixteen evenly distributed resistance wire areas, and the fourth resistance wire layer is provided with thirty-two evenly distributed resistance wire areas.

[0022] Optionally, the electrostatic chuck heater further comprises:

[0023] A human-computer interaction panel, configured to send a control signal to the PLC control module based on configuration parameters;

[0024] The control signal is used to configure the power-on state of the resistance wire in the resistance wire area corresponding to the PLC control module and the current size in the resistance wire.

[0025] Optionally, in the above-mentioned electrostatic chuck heater, the insulating layer is a polyimide film layer.

[0026] Based on the above technical solution, the electrostatic chuck heater provided by the embodiment of the present invention includes N resistance wire layers, and different resistance wire layers have different projections on the target substrate. The resistance wires in different resistance wire layers use different control circuits to control the conduction state and heating power. By controlling the power-on state and heating power of each resistance wire, the heating temperature of each heating area of ​​the electrostatic chuck heater can be controlled. At this time, the heating conditions of each area on the heating surface of the electrostatic chuck heater can be automatically adjusted according to the heat distribution of the heated object. For example, heat is concentrated in a certain area of ​​the heated object, and the temperature of this area is much higher than that of other areas. At this time, the heating power of the resistance wire in the resistance wire layer corresponding to the heat-concentrated area can be reduced by the controller. The heat dissipation in a certain area of ​​the heated object is faster, and the temperature of this area is much lower than that of other areas. At this time, the heating power of the resistance wire in the resistance wire layer corresponding to the low-temperature area can be increased by the controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0028] Figure 1 A cross-sectional view of an electrostatic chuck heater disclosed in an embodiment of the present application;

[0029] Figure 2 Schematic diagram of the shape of each resistance wire layer of the electrostatic chuck heater disclosed in the embodiment of the present application;

[0030] Figure 3 This is a schematic diagram of the shapes of the various resistance wire layers after splicing disclosed in the embodiments of this application. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] In many industrial production and scientific research experimental scenarios, electrostatic chuck heaters are widely used to precisely heat various heated objects. However, in actual applications, traditional electrostatic chuck heaters often face a thorny problem - the uneven temperature distribution of the heated object. This temperature unevenness can seriously affect the heating effect and may lead to many adverse consequences such as reduced product quality and deviations in experimental results. For example, in the field of semiconductor manufacturing, if the temperature of the wafer is uneven during the heating process, it will lead to local performance differences in the wafer, thereby affecting the overall performance and yield of the chip; in material research experiments, uneven temperature distribution may make the material performance test results inaccurate and mislead the research direction.

[0033] To effectively solve the above problems, the present application proposes an electrostatic chuck heater that can independently and accurately adjust the heating power to each area of ​​the heated object, thereby achieving the purpose of uniform heating.

[0034] The core design highlight of this electrostatic chuck heater lies in its N layers of resistance wires (04), where N is a positive integer not less than 2. The control circuit allows for precise control of the power supply status and heating power of each layer of resistance wires (04). This allows for flexible adjustment of the heating power of each layer based on the actual temperature requirements of each area of ​​the heated object, ensuring a uniform temperature across the entire surface of the object.

[0035] The following combination Figure 1 The specific structure of the electrostatic chuck heater disclosed in this embodiment is described in detail. The electrostatic chuck heater is mainly composed of an upper substrate 01, a lower substrate 02, N+1 insulating layers 03 and N resistance wire layers 04.

[0036] The resistance wire layer 04 is the key heating component of the heater, which is equipped with resistance wires for heating the object to be heated. These resistance wires will generate heat when energized, thereby achieving the heating function of the heated object.

[0037] N+1 insulating layers 03 and N resistance wire layers 04 are arranged alternately between the upper substrate 01 and the lower substrate 02. The specific arrangement is: upper substrate 01 - insulating layer 03 - resistance wire layer 04 - insulating layer 03 - resistance wire layer 04 - insulating layer 03 ... resistance wire layer 04 - insulating layer 03 - lower substrate 02. In this alternating arrangement, the insulating layers 03 effectively isolate the individual resistance wire layers 04, preventing electrical interference or short circuits between adjacent resistance wire layers and ensuring safe and stable operation of the heater.

[0038] On the resistance wire layer 04, resistance wires are arranged. Figure 2As shown, in the electrostatic chuck heater architecture of the present application, the projections of the resistance wire layers 04 on the target substrate (the target substrate is defined as the upper substrate 01 or the lower substrate 02) have a non-overlapping characteristic. Figure 3 As shown, when the projections of the resistance wire layers 04 on the target substrate are stitched together, the resulting complete projections completely match the target substrate surface. Specifically, the area of ​​the stitched complete projections is equal to the area of ​​the target substrate surface. Based on this, the stitched projections can achieve full coverage of the target substrate surface.

[0039] To achieve precise control over the resistance wires within each resistance wire layer 04, in this embodiment, independent control circuits are provided for the resistance wires in different resistance wire layers 04. These control circuits enable precise control over the power-on state and heating power of the resistance wires in a specific resistance wire layer 04.

[0040] The electrostatic chuck heater disclosed in this embodiment comprises N layers of resistance wires 04. The projections of different resistance wire layers 04 onto the target substrate (the target substrate being the upper substrate 01 or the lower substrate 02) differ, meaning that the projections of each resistance wire layer 04 are unique. Independent control circuits are configured for each resistance wire in each layer 04 to precisely control the conduction state and heating power of each resistance wire. By adjusting the conduction state and heating power of each resistance wire, the temperature of each heating zone of the electrostatic chuck heater can be precisely controlled. Based on this characteristic, the electrostatic chuck heater is capable of automatically adjusting the heating state of each zone on the heating surface based on the heat distribution of the heated object.

[0041] For example, when heat concentration occurs in a certain area of ​​the heated object, causing the temperature of this area to be significantly higher than that of other areas, the controller can automatically reduce the heating power of the resistance wire in the resistance wire layer 04 corresponding to the heat concentration area, thereby balancing the temperature of this area; conversely, if a certain area of ​​the heated object dissipates heat faster, causing the temperature of this area to be much lower than that of other areas, the controller will increase the heating power of the resistance wire in the resistance wire layer 04 corresponding to the low-temperature area to ensure that the surface temperature of the entire heated object is uniform.

[0042] In the technical solution disclosed in this embodiment, to achieve uniform heating of a conventional heated object, the resistance wire density within each resistance wire layer 04 is set to be the same. In this case, if the heat distribution of the heated object is ideal, unified control parameters can be used to operate the control circuits corresponding to each resistance wire layer 04, thereby achieving uniform heating of the heated object. It should be noted that the resistance wire density within different resistance wire layers 04 does not necessarily have to be the same; it can be consistent or vary. The specific resistance wire density setting should be independently selected and determined based on actual design requirements, taking into account various factors such as heating efficiency, cost, and process difficulty.

[0043] In this embodiment, the upper substrate 01 and the lower substrate 02 have a circular structure. For each of the N resistance wire layers 04, the projection of the first resistance wire layer 04 on the target substrate (the target substrate refers to the upper substrate 01 or the lower substrate 02) forms a circular area with a radius of r. The projection of the i-th resistance wire layer 04 (where i is 2, 3, 4, ...N) forms an annular area with an inner diameter of i × r and an outer diameter of (i + 1) × r. In this way, the projections of the first through the N-th resistance wire layers 04 on the target substrate together form a complete circle, which completely covers the target substrate, ensuring that the heating area is perfectly aligned with the target substrate.

[0044] It should be noted that the shapes of the upper and lower substrates 01 and 02 are not limited to circular; rectangular structures are also possible. When using rectangular substrates, the projection layout of the N resistance wire layers 04 is adjusted accordingly. In this case, the projection of the first resistance wire layer 04 on the target substrate is a rectangle with a length of L1 and a width of L2. The projection of the i-th resistance wire layer 04 on the target substrate is a rectangular ring with a width of r1 in the length direction and r2 in the width direction. The projections of two adjacent resistance wire layers 04 on the target substrate can be spliced ​​together, ultimately forming a rectangular ring with a width of 2×r1 in the length direction and 2×r2 in the width direction, achieving effective coverage and uniform heating of the rectangular target substrate.

[0045] In this embodiment, to achieve real-time temperature monitoring of each heating zone on the electrostatic chuck heater's heating surface (here, each heating zone is defined as the projection area of ​​each resistance wire layer 04 onto the heating surface), this application proposes installing N temperature sensors on the surface of the upper substrate 01 (the corresponding surface of the upper substrate 01 is designated as the heating surface) facing away from the lower substrate 02. The positions of these N temperature sensors strictly correspond to the projection areas of the N resistance wire layers 04 on the upper substrate 01. The control circuit has a data acquisition function that can acquire the data collected by these N temperature sensors in real time. Based on the difference between the collected data and the preset target temperature, the control circuit uses a PID closed-loop control algorithm for precise control. This closed-loop control mechanism can accurately control the heating temperature of each heating zone, ensuring stable and uniform heating of the electrostatic chuck heater under different operating conditions.

[0046] In this embodiment, N is set to 4, meaning the electrostatic chuck heater structure comprises 11 layers. The specific layer order is: first layer: lower substrate 02; second layer: insulation layer 03; third layer: resistance wire layer 04; fourth layer: insulation layer 03; fifth layer: resistance wire layer 04; sixth layer: insulation layer 03; seventh layer: resistance wire layer 04; eighth layer: insulation layer 03; ninth layer: resistance wire layer 04; tenth layer: insulation layer 03; and eleventh layer: upper substrate 01. Thus, the electrostatic chuck heater consists of four resistance wire layers 04, five insulation layers 03, an upper substrate 01, and a lower substrate 02. The resistance in each resistance wire layer 04 is evenly distributed within its layer, ensuring uniform heating. Furthermore, the projections of each resistance wire layer 04 on the substrate do not overlap, and adjacent projections can be joined together to form a single projection that completely covers the substrate, thereby achieving effective heating of the substrate.

[0047] In this embodiment, the control circuit adopts a modular design, primarily consisting of a power supply circuit and a PLC control module. Specifically, each resistance wire layer 04 is equipped with an independent power supply circuit and PLC control module. The power supply circuit, as the current supply unit, is responsible for providing a stable current to the resistance wires in the corresponding resistance wire layer 04, ensuring their proper operation. The PLC control module performs the core control function. On the one hand, it precisely controls the on / off state of the power supply circuit, enabling flexible switching between powering on and off of the resistance wires. On the other hand, it precisely adjusts the output current of the power supply circuit to meet different heating requirements. Through this design, the PLC control module can precisely control the power state of the resistors in the corresponding resistance wire layer 04 and the current flowing through the resistance wires. The current flowing through the resistance wires is directly positively correlated with the amount of heat released by the resistance wire layer 04. That is, the greater the current flowing through the resistance wire, the greater the heat released by the resistance wire layer 04, thus achieving precise control of the heating temperature.

[0048] In this embodiment, to achieve more precise control over the heating temperature, each resistance wire layer 04 is further subdivided into multiple resistance wire zones. The resistance wires within each resistance wire zone within the same resistance wire layer 04 are connected in parallel, ensuring the electrical independence of each resistance wire zone. Each resistance wire in each resistance wire zone corresponds to an independent PLC control module. The PLC control module serves as the core control unit, precisely controlling the on / off state of the resistance wire in its corresponding resistance wire zone. Based on this design, the power-on state of each resistance wire zone can be independently controlled by its corresponding PLC control module, enabling independent control of the heating of each resistance wire zone. By dividing each resistance wire layer 04 into multiple resistance wire zones, this embodiment effectively reduces the area of ​​the minimum adjustable unit, thereby enabling more refined temperature regulation of the heating surface of the electrostatic chuck heater. For example, the first resistance wire layer is evenly divided into four resistance wire zones, the second resistance wire layer is evenly divided into eight resistance wire zones, the third resistance wire layer is evenly divided into sixteen resistance wire zones, and the fourth resistance wire layer is evenly divided into thirty-two resistance wire zones. This layered and zoned division provides greater flexibility and precision in temperature control of the electrostatic chuck heater in different application scenarios.

[0049] In this embodiment, in addition to using a PLC control module to precisely control the on / off state of the resistors in each resistor wire area, the control strategy for the resistor wires in each resistor wire area can also achieve fine adjustment of the current in the resistor wire area by adjusting the duty cycle of the power switch tube in the corresponding branch. Specifically, a power switch tube is provided in the circuit branch corresponding to each resistor wire area. Changes in the duty cycle of the power switch tube will directly affect the current in the branch. The PLC control module can then adjust the current in the resistor wires in each resistor wire area by adjusting the duty cycle of the power switch tube. Based on the above two control methods, the power-on state (powered on or off) and the power-on current of the resistor wires in each resistor wire area within each resistor wire layer 04 in this embodiment can be flexibly adjusted according to actual needs, providing a highly customized solution for temperature control of the electrostatic chuck heater.

[0050] Furthermore, to enhance the operational convenience and intelligence of the electrostatic chuck heater, the device can also be equipped with a human-machine interface panel. This panel generates precise configuration parameters based on detailed user input (such as specific temperature settings, heating duration, etc.) or user selections from preset options (such as heating mode, preset temperature range, etc.) through internal algorithm processing. The panel then precisely sends control signals to each PLC control module based on these configuration parameters. These control signals are used to configure the power-on state (on or off) and current flow of the resistor wire in the resistor wire area corresponding to each PLC control module, thereby achieving refined and intelligent control of the electrostatic chuck heater's heating process.

[0051] In the technical solution of this embodiment, the specific types of upper substrate 01, lower substrate 02, and insulating layer 03 can be flexibly selected based on design requirements. For example, in the specific application scenario of this embodiment, aluminum is used for both upper and lower substrates 01 and 02. Aluminum offers excellent thermal conductivity, mechanical strength, and a relatively low cost, effectively meeting the basic performance requirements of the heater while controlling manufacturing costs. Insulating layer 03 is constructed from a polyimide film layer. Polyimide film has excellent insulation properties, high-temperature resistance, and chemical stability, ensuring safe and stable operation of the heater in harsh environments such as high temperature and high pressure.

[0052] This embodiment also innovatively discloses a method for controlling the resistance wire in an electrostatic chuck heater. This method is deeply integrated into the electrostatic chuck heater's controller. During operation, the user can conveniently input the target temperature of the heated object through a human-computer interaction panel. This target temperature clearly defines the desired temperature threshold for the heated object during the heating process. During the heating process, this control method utilizes a temperature acquisition device (such as a high-precision infrared image acquisition device) to accurately capture the actual temperature at each location on the heated object in real time. Subsequently, a built-in intelligent algorithm meticulously compares the actual temperature at each location with the preset target temperature to accurately determine whether there are areas where the actual temperature deviates from the target temperature (either above or below it). Once such areas are detected, the system obtains their precise coordinates. Based on these coordinates, the system can accurately locate the corresponding resistance wire layer 04 and further precisely identify the corresponding resistance wire area within that resistance wire layer 04. Finally, based on the comparison results between the actual temperature and the target temperature, the system will dynamically adjust the key parameters such as the on-off state and current size of the resistance wire in the resistance wire layer 04 corresponding to the area, thereby realizing dynamic and precise adjustment based on the actual temperature of each area of ​​the heated object, ensuring that the heating power of each resistance wire area can adapt to the actual heating needs in real time, and ensuring the uniformity and stability of the heating process.

[0053] In this embodiment, considering the varying heating temperature requirements of different regions of the same heating object, the object can be scientifically divided into multiple zones. Using a human-computer interaction device, users can intuitively and conveniently pre-mark the desired target temperature for each zone. When the electrostatic chuck heater is used to heat the object, an image acquisition device collects the temperature of each region in real time, acquiring actual temperature data for each area. The collected actual temperatures are then compared and analyzed with the pre-marked target temperatures for each region. Based on this comparison, the system intelligently determines the temperature deviation of each region (whether the actual temperature is too high or too low, and the difference between the two). Based on this comparison, the system dynamically adjusts the heating status of the corresponding resistance wire layer 04 and the resistance wires within the resistance wire zone. This includes, but is not limited to, on / off control of the resistance wires and current adjustment, enabling precise control of the heating temperature of each zone to meet the personalized heating requirements of each region.

[0054] In summary, the above-mentioned technical solutions disclosed in this application have the following advantages:

[0055] 1. Improve temperature control accuracy: The multi-layer structure allows independent adjustment of heating state and heating power in different resistance wire layers 04 to meet the different heating requirements of different parts of the material; the multi-zone design allows each area to be heated or cooled separately, avoiding the temperature unevenness problem that may be caused by traditional overall heating.

[0056] 2. Enhanced thermal efficiency: The design of the multi-layer resistance wire layer 04 can utilize the heat transfer between the layers to optimize the overall energy utilization rate; each resistance wire layer 04 can independently adjust the power according to actual needs, avoiding the energy waste caused by overheating or underheating of traditional heaters.

[0057] 3. Improve processing efficiency: The design of multiple resistance wire areas allows heating of multiple areas at the same time, shortening the overall heating time; each resistance wire area can independently adjust the temperature and power to meet the needs of different materials or different process stages.

[0058] 4. Improve temperature uniformity: The design structure of the multi-resistance wire layer 04 makes the heat more evenly distributed between different layers; the design of the multi-resistance wire area allows the temperature of each electronic wire area to be finely adjusted to avoid local overheating or underheating.

[0059] 5. Adapt to complex process requirements: The design of the multi-resistance wire layer 04 can adjust the temperature distribution of the heating surface corresponding to each resistance wire area according to different process stages to meet complex heat treatment requirements; each resistance wire area can be controlled independently, which is suitable for mixed processing scenarios of multiple materials.

[0060] 6. Reduce energy consumption: The design structure of the multi-resistance wire layer 04 can utilize heat more efficiently and reduce energy loss; the partition design of the independently controlled multi-resistance wire area avoids the energy waste caused by overall heating of traditional heaters.

[0061] 7. Extend the life of the equipment: The design structure of the multi-resistance wire layer 04 can disperse heat and reduce the damage to the equipment caused by local overheating; the partition design of the independently controlled resistance wire area allows the resistance wire in each resistance wire area to flexibly adjust the power according to demand, avoiding aging problems caused by long-term high-temperature operation

[0062] 8. Support intelligent production: Multi-resistance wire layer 04. The design of the multi-resistance wire area can be combined with the automatic control system to achieve real-time monitoring and intelligent adjustment of temperature; the data of each area of ​​the heated object can be collected and analyzed separately to support process optimization and predictive maintenance.

[0063] 9. Improve product quality: Higher temperature control accuracy and uniformity ensure high product quality; the design structure of the multi-resistance wire layer 04 can avoid deformation or defects of the material caused by excessive temperature difference during processing.

[0064] For the convenience of description, the above system is described as being divided into various modules according to their functions. Of course, when implementing the present invention, the functions of each module can be implemented in the same or multiple software and / or hardware.

[0065] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. The systems and system embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. A person of ordinary skill in the art can understand and implement it without expending creative effort.

[0066] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

[0067] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in random access memory (RAM), internal memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0068] It should also be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0069] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electrostatic chuck heater, characterized in that: include: An upper substrate, a lower substrate, N+1 insulating layers, and N resistance wire layers, where N is a positive integer not less than 2; N+1 insulating layers and N resistance wire layers are arranged between the upper substrate and the lower substrate in an alternating manner; The resistance wire layers are provided with resistance wires, and different resistance wire layers have different projection positions on the target substrate, the target substrate is an upper substrate or a lower substrate, and the sum of the projection areas of the resistance wire layers on the target substrate is the same as the area of ​​the target substrate; The resistance wires in different resistance wire layers correspond to different control circuits respectively.

2. The electrostatic chuck heater according to claim 1, wherein: The distribution density of the resistance wires in each resistance wire layer is the same.

3. The electrostatic chuck heater according to claim 1, wherein: The projection of the first resistance wire layer among the N resistance wire layers on the target substrate is a circular area with a radius r; The i-th resistance wire layer is an annular region with an inner diameter of i×r and an outer diameter of (i+1)×r, where i is 2, 3, 4, ..., N.

4. The electrostatic chuck heater according to claim 1, wherein: Also includes: N temperature sensors are provided on a surface of the upper substrate facing away from the lower substrate; The positions of the N temperature sensors correspond one-to-one to the projection areas of the resistance wire layers in the N resistance wire layers on the upper substrate.

5. The electrostatic chuck heater according to claim 3, wherein: The value of N is 4.

6. The electrostatic chuck heater according to claim 5, wherein: The control circuit includes: a power supply circuit and a PLC control module; The resistance wires in each resistance wire layer correspond to different power supplies and PLC control modules respectively. The PLC control module is used to control the power-on state of the resistors in the corresponding resistance wire layer and the current in the resistance wires.

7. The electrostatic chuck heater according to claim 6, wherein: Each of the resistance wire layers includes at least one resistance wire area. The resistance wires in each resistance wire area belonging to the same resistance wire layer are connected in parallel with each other. The resistance wires in different resistance wire areas correspond to different PLC control modules. The PLC control module is used to control the on and off state of the resistance wire in its corresponding resistance wire area.

8. The electrostatic chuck heater according to claim 7, wherein: The first resistance layer is provided with four evenly distributed resistance wire areas, the second resistance layer is provided with eight evenly distributed resistance wire areas, the third resistance wire layer is provided with sixteen evenly distributed resistance wire areas, and the fourth resistance wire layer is provided with thirty-two evenly distributed resistance wire areas.

9. The electrostatic chuck heater according to claim 7, wherein: Also includes: A human-computer interaction panel, configured to send a control signal to the PLC control module based on configuration parameters; The control signal is used to configure the power-on state of the resistance wire in the resistance wire area corresponding to the PLC control module and the current size in the resistance wire.

10. The electrostatic chuck heater according to claim 1, wherein: The insulating layer is a polyimide film layer.

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