Display panel, display device and equipment

Abstract

The invention discloses a display panel, a display device and equipment. The display panel comprises a substrate, an isolation structure, a light emitting device and a first packaging layer. The first electrode and the second electrode serve as electrodes of the light-emitting unit and drive the light-emitting unit to emit light. The first packaging layer comprises a first packaging sub-layer and a second packaging sub-layer, the first packaging sub-layer comprises a plurality of first packaging sub-parts, and the plurality of first packaging sub-parts are arranged corresponding to the light-emitting structure to form packaging of the light-emitting device. The arrangement of the second packaging sub-layer can further improve the packaging effect of the first packaging layer. The density of the second packaging sub-layer is greater than that of the first packaging sub-layer, and the second packaging sub-layer is more compact than the first packaging sub-layer, so that the overall packaging reliability of the first packaging layer is further improved, and the problem that a single first packaging sub-layer is difficult to meet the packaging requirement of the display panel is solved; and the display effect and the use performance of the display panel are improved.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel, a display device and equipment. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, power saving, thin body, and wide application range, becoming the mainstream display device.

[0003] Traditional display panel manufacturing typically uses a fine metal mask (FMM) to pattern luminescent pixels. FMM technology is mature and boasts extensive mass production experience. However, it also suffers from limitations such as limited precision, high development costs, and long development cycles. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-area scalability, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe FMM-free technology for reference.

[0004] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0005] The embodiments of the present application provide a display panel, a display device, and an apparatus, aiming to improve the performance of OLED display products.

[0006] A first aspect of the present application provides a display panel, comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing a plurality of isolation openings; a light-emitting device located on one side of the substrate and comprising a first electrode, a light-emitting unit, and a second electrode arranged in a stacked manner, the light-emitting device being arranged corresponding to the isolation openings; a first encapsulation layer located on a side of the second electrode facing away from the substrate, the first encapsulation layer comprising a first encapsulation sublayer and a second encapsulation sublayer, the second encapsulation sublayer being located on a side of the first encapsulation sublayer facing away from the substrate, the first encapsulation sublayer comprising a plurality of first encapsulation sub-portions; wherein the density of the second encapsulation sublayer is greater than the density of the first encapsulation sublayer.

[0007] According to a second aspect of the present application, a display panel is provided, comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing a plurality of isolation openings; a light-emitting device located on one side of the substrate and comprising a first electrode, a light-emitting unit, and a second electrode arranged in a stacked manner, the light-emitting device being arranged corresponding to the isolation openings; a first encapsulation layer located on a side of the second electrode facing away from the substrate; a second encapsulation layer located on a side of the first encapsulation layer facing away from the substrate, the material of the second encapsulation layer comprising an organic material; a third encapsulation layer located on a side of the second encapsulation layer facing away from the substrate, the material of the third encapsulation layer comprising an inorganic material; and a protective cover plate located on a side of the third encapsulation layer facing away from the substrate, the protective cover plate and the substrate being arranged opposite to each other, and a sealing structure being arranged between the protective cover plate and the substrate.

[0008] An embodiment of a third aspect of the present application provides a display device, which includes a display panel according to any of the above embodiments.

[0009] An embodiment of the fourth aspect of the present application provides a device, which includes a display panel according to any of the above embodiments.

[0010] According to an embodiment of the present application, a display panel includes a substrate, an isolation structure, a light-emitting device, and a first encapsulation layer. When preparing the light-emitting material, a significant drop in height is generated at the edge of the isolation structure, resulting in the material being separated at the edge of the isolation structure to form disconnected light-emitting units. This reduces carrier crosstalk between the light-emitting units and improves the display quality of the display panel. Furthermore, the light-emitting units can be prepared without the use of precision masks, reducing the development and use of precision masks and manufacturing costs. The first electrode and the second electrode serve as electrodes for the light-emitting units, driving their emission. The first encapsulation layer includes a first encapsulation sublayer and a second encapsulation sublayer. The first encapsulation sublayer includes multiple first encapsulation subsections, which are arranged corresponding to the light-emitting structure to encapsulate the light-emitting device. The provision of the second encapsulation sublayer further enhances the encapsulation efficiency of the first encapsulation layer. Furthermore, the second encapsulation sublayer has a greater density than the first encapsulation sublayer, making it denser than the first encapsulation sublayer. This further improves the overall encapsulation reliability of the first encapsulation layer, alleviating the problem that a single first encapsulation sublayer cannot meet the encapsulation requirements of the display panel, thereby improving the display quality and performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0012] Figure 1 is a schematic top view of a display panel provided in an embodiment of the present application; Figure 2 is a partial top view of a display panel provided in an embodiment of the present application; Figure 3 yes Figure 2 Schematic cross-sectional view at the middle BB; Figure 4 is a partial cross-sectional view of a display panel in another embodiment; Figure 5 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 6 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 7 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 8 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 9 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 10 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 11 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 12 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 13 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 14 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 15 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 16 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 17 is a schematic diagram of a pixel circuit provided in an embodiment of the present application; Figure 18 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0013] Description of reference numerals: 10. Display panel; AA, display area; NA, non-display area; NA1, side frame; NA2, bottom frame; 100. Substrate; 200, pixel definition layer; 201, first definition layer; 202, second definition layer; 210, pixel definition portion; 220, pixel opening; 230, light emitting unit; 300, isolation structure; 301, first sublayer; 302, second sublayer; 303, third sublayer; 310, isolation opening; 400, first electrode layer; 410, first electrode; 500, second electrode layer; 510, second electrode; 610, first encapsulation layer; 610a, first encapsulation sublayer; 610aa, first encapsulation subsection; 610b, second encapsulation sublayer; 610ba, second encapsulation subsection; 610c, third encapsulation sublayer; 610d, gap space; 620, second encapsulation layer; 630, third encapsulation layer; 640, first wear-resistant layer; 700, embankment; 800, protective cover; 810, sealing structure; 820, confined space; 900, polarizer; 910, recessed space; 920, water and oxygen resistant structure; 930, adhesive layer; D1, first thickness; D2, second thickness; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0014] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0015] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0016] It should be noted that similar reference numerals and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures. It should be noted that different features in the embodiments of the present application can be combined with each other without conflict.

[0017] For certain elements, terms such as "upper" or "above" are sometimes used to describe their position, while "lower" or "below" is used to describe the position of an element located in the opposite direction. Furthermore, when terms such as "upper," "above," "lower," "below," and "relatively" are used to define the relative position of two elements, this includes not only a state in which the two elements are directly in contact, but also a state in which the two elements are separated by a gap or other elements. Furthermore, terms such as "first," "second," and "third" are used solely for distinction and description and should not be understood to indicate or imply relative importance.

[0018] When applying the fine metal mask-free technology to large-size display products, the inventors discovered small black spots, which gradually grew larger and became large-sized black spots. Subsequent analysis revealed that this was because the thickness uniformity of the packaging material on large-size display products was poor, resulting in black spots and other defects.

[0019] In order to solve the problem of black spots caused by low packaging reliability in large-size display products, the embodiments of the present application provide a display panel, a display device and an apparatus. The following will describe various embodiments of the display panel, the display device and the apparatus with reference to the accompanying drawings.

[0020] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0021] The display panel 10 may be an organic light emitting diode (OLED) display panel or a quantum dot light emitting diode (QLED) display panel.

[0022] See also Figure 1 , Figure 1 3 is a schematic top view of a display panel provided in an embodiment of the present application.

[0023] like Figure 1 As shown, the display panel 10 includes a display area AA having a display function and a non-display area NA.

[0024] The display area AA of the display panel 10 may be in a rectangular shape, or in other shapes such as a square, a circle, or an ellipse.

[0025] The display area AA includes a plurality of pixels arranged in a first direction X and a second direction Y. The pixels include a plurality of sub-pixels that display different colors. In some embodiments, the pixels include a first sub-pixel, a second sub-pixel, and a third sub-pixel. For example, the first sub-pixel is a blue sub-pixel, the second sub-pixel is a green sub-pixel, and the third sub-pixel is a red sub-pixel. In some embodiments, in addition to the first sub-pixel, the second sub-pixel, and the third sub-pixel, the pixels also include sub-pixels that emit white or other colors.

[0026] The sub-pixels include pixel circuits and light-emitting devices driven by the pixel circuits to emit light of corresponding colors. The first sub-pixel includes a first light-emitting device, the second sub-pixel includes a second light-emitting device, and the third sub-pixel includes a third light-emitting device. One pixel circuit drives at least one light-emitting device to emit light. For example, the display area AA includes a normal display area and a light-transmitting display area. The light-transmitting display area is the display area AA that is set up corresponding to the sensor and has light-transmitting properties, and the normal display area is the display area AA that is not set up corresponding to the sensor. In the normal display area, one pixel circuit drives one light-emitting device to emit light, and in the light-transmitting display area, one pixel circuit drives one or more light-emitting devices to emit light. In some embodiments, the normal display area is also provided with a sensor.

[0027] See also Figures 1 to 3 , Figure 2 is a partial top view of a display panel provided in an embodiment of the present application; Figure 3 yes Figure 2 Schematic cross-sectional view at the middle BB.

[0028] like Figures 1 to 3 As shown, the first embodiment of the present application provides a display panel 10, which includes: a substrate 100; an isolation structure 300, located on one side of the substrate 100, the isolation structure 300 enclosing a plurality of isolation openings 310; a light-emitting device, located on one side of the substrate 100 and including a first electrode 410, a light-emitting unit 230 and a second electrode 510 arranged in a stacked manner, the light-emitting device being arranged corresponding to the isolation opening 310; a first encapsulation layer 610, located on the side of the second electrode 510 facing away from the substrate 100, the first encapsulation layer 610 including a first encapsulation sublayer 610a and a second encapsulation sublayer 610b, the second encapsulation sublayer 610b being located on the side of the first encapsulation sublayer 610a facing away from the substrate 100, the first encapsulation sublayer 610a including a plurality of first encapsulation sub-portions 610aa; wherein the density of the second encapsulation sublayer 610b is greater than the density of the first encapsulation sublayer 610a.

[0029] Density is a physical quantity that describes how tightly the atoms or molecules within a material are packed together. It reflects the number of atoms or molecules per unit volume. The greater the density, the better the material's ability to block water and oxygen.

[0030] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 300, a light-emitting device, and a first encapsulation layer 610. When preparing the light-emitting material, a large drop in the light-emitting material is generated at the edge of the isolation structure 300. The light-emitting material is separated at the edge of the isolation structure 300 to form mutually disconnected light-emitting units 230. This reduces crosstalk between carriers in the light-emitting units 230, improving the display effect of the display panel 10. Furthermore, the light-emitting units 230 can be prepared without the use of a precision mask, which can reduce the development and use of precision masks and reduce production costs. The first electrode 410 and the second electrode 510 serve as electrodes of the light-emitting unit 230, driving the light-emitting unit 230 to emit light. The first encapsulation layer 610 includes a first encapsulation sublayer 610a and a second encapsulation sublayer 610b. The first encapsulation sublayer 610a includes multiple first encapsulation subsections 610aa. The multiple first encapsulation subsections 610aa are arranged corresponding to the light-emitting structure to form an encapsulation for the light-emitting device, and each first encapsulation subsection 610aa independently encapsulates a light-emitting device. The provision of the second encapsulation sublayer 610b can further enhance the encapsulation effect of the first encapsulation layer 610. Furthermore, the density of the second encapsulation sublayer 610b is greater than that of the first encapsulation sublayer 610a. The second encapsulation sublayer 610b is denser than the first encapsulation sublayer 610a, further improving the overall encapsulation reliability of the first encapsulation layer 610. This alleviates the problem that a single first encapsulation sublayer 610a cannot meet the encapsulation requirements of the display panel 10, thereby improving the display effect and performance of the display panel 10. In particular, this can improve the poor thickness uniformity of the first encapsulation sublayer 610a on large-sized display panels 10, and mitigate defects such as black spots on large-sized display panels caused by low encapsulation reliability.

[0031] It should be noted that the solution of the present application is not only applicable to large-size display panels to improve problems such as black spots in large-size display panels, but is also applicable to display panels of other sizes to improve the packaging performance of display panels.

[0032] In some embodiments of the present application, the second encapsulation sublayer 610b is disposed on the side of the first encapsulation sublayer 610a of the light-emitting devices of various colors facing away from the substrate 100. In this way, the second encapsulation sublayer 610b can be formed after the light-emitting devices of various colors are prepared, thereby avoiding affecting the normal preparation process of the light-emitting devices due to the preparation of the second encapsulation sublayer 610b. The reason is as follows: if the second encapsulation sublayer 610b is prepared after the light-emitting unit 230, the second electrode layer 500, and the first encapsulation sublayer 610a of the first light-emitting device of a certain color are prepared, and before the light-emitting unit 230, the second electrode layer 500, and the first encapsulation sublayer 610a of the first light-emitting device at the locations of the multiple second isolation openings and the multiple third isolation openings are etched away, then when the film layer at the locations of the multiple second isolation openings and the multiple third isolation openings is etched away, the second encapsulation sublayer 610b at the locations of the multiple second isolation openings and the multiple third isolation openings needs to be additionally removed. However, due to the high density of the second encapsulation sublayer 610b, it is more difficult to remove the second encapsulation sublayer 610b. Therefore, after preparing light-emitting devices of various colors, the second encapsulation sublayer 610b is prepared to avoid affecting the preparation process of the light-emitting devices due to the preparation of the second encapsulation sublayer 610b. Among them, the first electrode 410 can be an anode, and the second electrode 510 can be a cathode. The first electrode 410 of each light-emitting device can be connected to the pixel circuit through a via, so that the pixel circuit drives the light-emitting device to emit light. Optionally, multiple first encapsulation sub-portions 610aa are arranged at intervals, or at least some of the first encapsulation sub-portions 610aa are interconnected, or at least some of the first encapsulation sub-portions 610aa overlap in the orthographic projection of the substrate 100 and overlap on the side of the isolation structure 300 facing away from the substrate 100.

[0033] Optionally, the second encapsulation sublayer 610b is formed by an atomic layer deposition (ALD) process, so that the second encapsulation sublayer 610b has a denser film structure. Optionally, the first encapsulation sublayer 610a is formed by a chemical vapor deposition (CVD) process.

[0034] Optionally, the light-emitting unit 230 includes a first light-emitting unit, a first light-emitting unit and a first light-emitting unit, and the light-emitting colors of the first light-emitting unit, the first light-emitting unit and the first light-emitting unit are different. For example, the light-emitting color of the first light-emitting unit is red, the light-emitting color of the first light-emitting unit is green, and the light-emitting color of the first light-emitting unit is blue.

[0035] Optionally, the refractive index of the first encapsulation sublayer 610 a is greater than the refractive index of the second encapsulation sublayer 610 b .

[0036] In these optional embodiments, the first and second encapsulation sublayers 610a and 610b have decreasing refractive indices, forming a progressive light coupling layer. This reduces interfacial reflection losses and improves light extraction efficiency. The high-refractive-index first encapsulation sublayer 610a is positioned close to the light-emitting unit 230, shortening the optical path difference and mitigating color shift caused by wavelength interference. The low-refractive-index second encapsulation sublayer 610b acts as a light-exiting interface buffer, scattering ambient light reflections.

[0037] See also Figure 4 , Figure 4 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0038] like Figure 4 As shown, in some optional embodiments, the display panel 10 further includes: a second encapsulation layer 620, located on the side of the first encapsulation layer 610 away from the substrate 100, and the material of the second encapsulation layer 620 includes an organic material; a third encapsulation layer 630, located on the side of the second encapsulation layer 620 away from the substrate 100, and the material of the third encapsulation layer 630 includes an inorganic material.

[0039] In these optional embodiments, the first encapsulation layer 610, the second encapsulation layer 620, and the third encapsulation layer 630 form a three-layer thin film evaporator (TFE) to improve the encapsulation performance of the display panel 10. Optionally, the material of the first encapsulation layer 610 includes an inorganic material. The second encapsulation layer 620 is formed on the side of the first encapsulation layer 610 facing away from the substrate 100 by printing or other methods to provide planarization and stress relief. The TFE encapsulation combined with the design of the second encapsulation sublayer 610b can improve the low encapsulation reliability of a conventional three-layer TFE encapsulation structure in a large-sized display panel 10, which only uses the first encapsulation sublayer 610a, the second encapsulation layer 620, and the third encapsulation layer 630. Optionally, the materials of the first encapsulation sublayer 610a and the second encapsulation sublayer 610b are the same or different. The materials of the first encapsulation layer 610 and the third encapsulation layer 630 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 620 is an organic insulating material, such as epoxy resin, acrylic resin, etc. The second encapsulation layer 620 and the third encapsulation layer 630 are continuously disposed at least in the entire display area AA, and a portion thereof is also disposed in the non-display area NA.

[0040] In some optional embodiments, the orthographic projection of the boundary of the second encapsulation layer 620 on the substrate 100 is located within the orthographic projection of the second encapsulation sublayer 610b on the substrate 100. That is, the boundary of the second encapsulation layer 620 is indented into the second encapsulation sublayer 610b.

[0041] See also Figure 4 and Figure 5 , Figure 5 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0042] like Figure 4 and Figure 5 As shown, optionally, the second encapsulation sublayer 610 b and the third encapsulation layer 630 are arranged in contact with each other on the peripheral side of the second encapsulation layer 620 .

[0043] In these optional embodiments, the boundary of the second encapsulation layer 620 is indented within the boundary of the second encapsulation sublayer 610b. After the third encapsulation layer 630 is deposited on the second encapsulation layer 620, the third encapsulation layer 630 can be arranged in contact with the second encapsulation sublayer 610b on at least a portion of the circumference of the second encapsulation layer 620, thereby improving edge encapsulation reliability.

[0044] In some optional embodiments, the orthographic projection of the second encapsulation sub-layer 610 b on the substrate 100 is located within the orthographic projection of the third encapsulation layer 630 on the substrate 100 .

[0045] In these optional embodiments, the third encapsulation layer 630 fully covers the second encapsulation sublayer 610 b and strengthens the encapsulation of the edge of the second encapsulation sublayer 610 b , further improving the encapsulation reliability of the display panel 10 .

[0046] See also Figure 6 , Figure 6 FIG. 4 is a partial cross-sectional view of a display panel in yet another embodiment.

[0047] like Figure 6 As shown, in some optional embodiments, the display panel 10 further includes: a first wear-resistant layer 640 , which is disposed on the outer surface of the third encapsulation layer 630 facing away from the second encapsulation layer 620 , and the wear rate of the first wear-resistant layer 640 is less than the wear rate of the third encapsulation layer 630 .

[0048] Wear rate is a quantitative parameter that characterizes the volume loss rate of a material under mechanical action. It is defined as "the volume worn under unit load per unit length".

[0049] In these optional embodiments, the wear rate of the first wear-resistant layer 640 is less than the wear rate of the third encapsulation layer 630, that is, the wear resistance of the first wear-resistant layer 640 is superior to the wear resistance of the third encapsulation layer 630. When the first wear-resistant layer 640 is disposed on the third encapsulation layer 630, the first wear-resistant layer 640 has better wear resistance and provides protection for the third encapsulation layer 630, thereby improving the encapsulation reliability of the display panel 10. Optionally, the material of the first wear-resistant layer 640 includes a wear-resistant material such as diamond carbon or SiO2 nanoparticle coating.

[0050] In some optional embodiments, the orthographic projection of the third encapsulation layer 630 on the substrate 100 is located within the orthographic projection of the first wear-resistant layer 640 on the substrate 100 .

[0051] In these optional embodiments, the first wear-resistant layer 640 fully covers the outer surface of the third packaging layer 630, thereby increasing the coverage of the first wear-resistant layer 640, so that the third packaging layer 630 is protected by the first wear-resistant layer 640, further improving the packaging reliability of the display panel 10.

[0052] In some optional embodiments, the orthographic projection of the first encapsulation sub-portion 610 aa on the substrate 100 is located within the orthographic projection of the second encapsulation sub-layer 610 b on the substrate 100 .

[0053] In these optional embodiments, the first encapsulation sublayer 610 a is covered by the second encapsulation sublayer 610 b , further improving the encapsulation reliability of the display panel 10 .

[0054] In some optional embodiments, the second encapsulation sublayer 610 b is provided as a whole layer, and the orthographic projections of the plurality of first encapsulation sub-parts 610 aa on the substrate 100 are located within the orthographic projection of the same second encapsulation sublayer 610 b on the substrate 100 .

[0055] In these optional embodiments, the second encapsulation sublayer 610b is provided as a continuous layer. The second encapsulation sublayer 610b not only covers and protects the areas where the multiple first encapsulation sub-units 610aa are located, but also covers the gaps between the first encapsulation sub-units 610aa, thereby improving encapsulation reliability. Furthermore, the second encapsulation sub-unit 610ba is provided as a continuous layer, which reduces the manufacturing difficulty.

[0056] See also Figure 7 , Figure 7 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0057] like Figure 7 As shown, optionally, the second encapsulation sublayer 610b includes multiple second encapsulation sub-portions 610ba, and the second encapsulation sub-portions 610ba are located on the side of the first encapsulation sub-portion 610aa facing away from the substrate 100, and the orthographic projection of the first encapsulation sub-portion 610aa on the substrate 100 is located within the orthographic projection of the second encapsulation sub-portion 610ba on the substrate 100.

[0058] In these optional embodiments, the second encapsulation sublayer 610b includes a plurality of second encapsulation sub-portions 610ba, the first encapsulation sublayer 610a includes a plurality of first encapsulation sub-portions 610aa, and the second encapsulation sub-portions 610ba and the first encapsulation sub-portions 610aa are arranged correspondingly. While improving the encapsulation performance of the display panel 10, the first encapsulation sub-portions 610aa and the second encapsulation sub-portions 610ba can be etched using the same mask plate to simplify the preparation process.

[0059] Optionally, the first encapsulation sub-portion 610 aa is located on a side of the second electrode 510 facing away from the substrate 100 , passes through a sidewall of the isolation structure 300 , and extends to a side of the isolation structure 300 facing away from the substrate 100 .

[0060] See also Figure 8 , Figure 8 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0061] like Figure 8 As shown, exemplarily, the first packaging sub-section 610aa includes a first segment and a second segment that are interconnected, the first segment is located in the isolation opening 310 and is arranged on the side of the light-emitting unit 230 facing away from the substrate 100, and the second segment is located on the side of the isolation structure 300 facing the isolation opening 310, and the side surface of the first segment facing away from the substrate 100 and the side surface of the second segment facing away from the isolation structure 300 are at least partially interconnected to enclose a gap space 610d.

[0062] For example, the surface of the first segment facing away from the substrate 100 and the surface of the second segment facing away from the isolation structure 300 may not be connected.

[0063] Illustratively, the first encapsulation sub-section 610aa further includes a third section connected to the second section, the third section being located on a side of the isolation structure 300 away from the substrate 100. Optionally, the third sections of at least two adjacent first encapsulation sub-sections 610aa are separated to form a spacing region. Optionally, the second encapsulation sub-layer 610b is continuously disposed in the spacing region, or the second encapsulation sub-layer 610b is disconnected in the spacing region.

[0064] Exemplarily, the third segment and the isolation structure 300 are spaced apart to form a separation space, and the second encapsulation layer 620 fills at least a portion of the separation space to improve adhesion between film layers.

[0065] See also Figure 9 , Figure 9 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0066] like Figure 9 As shown, in some optional embodiments, the display panel 10 has a display area AA, the second encapsulation layer 620 has a first thickness D1 in the display area AA, and the second encapsulation layer 620 has a second thickness D2 at an edge away from the display area AA, and the ratio of the second thickness D2 to the first thickness D1 is less than or equal to 0.4. For example, the ratio of the second thickness D2 to the first thickness D1 is 0.1, 0.2, 0.3, or 0.4.

[0067] In these optional embodiments, the second encapsulation layer 620 extends from the display area AA to the non-display area NA. The portion of the second encapsulation layer 620 located in the non-display area NA has an edge distal to the display area AA. The second encapsulation layer 620 has a second thickness D2 at the edge. The second encapsulation layer 620 has a first thickness D1 in the display area AA, and the second thickness D2 is less than the first thickness D1. The ratio of the second thickness D2 to the first thickness D1 is less than or equal to 0.4, to accommodate large-sized display panels 10. In large-sized display panels 10, the non-display area NA is relatively wide, resulting in a longer overflow path for the second encapsulation layer 620. During the leveling process of the second encapsulation layer 620, the edge thickness is further away from the display area AA and has a lower thickness, eliminating the need to strictly control the overflow path length of the second encapsulation layer 620 as in small-sized display panels 10.

[0068] See also Figure 1 and Figure 10 , Figure 10 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0069] like Figure 1 and Figure 10 As shown, in some optional embodiments, the display panel 10 has a display area AA and a non-display area NA, and the non-display area NA surrounds at least a portion of the display area AA, or the non-display area NA is arranged around a light-transmitting hole. The light-transmitting hole is a hole arranged corresponding to the sensor and passes through the display panel 10. For example, the non-display area NA includes a frame area surrounding the display area AA and an area surrounding the light-transmitting hole. The display panel 10 also includes: a dam 700, which is located in the non-display area NA, and the second encapsulation layer 620 is located on the side of the dam 700 facing the display area AA; wherein the dam 700 is arranged around the isolation structure 300, or the boundary of the isolation structure 300 is at least partially located on the dam 700, or the boundary of the isolation structure 300 is located outside the area enclosed by the dam 700.

[0070] In these optional embodiments, dam 700 is provided in the non-display area NA to block the second encapsulation layer 620, allowing the second encapsulation layer 620 to terminate at the dam 700, or to prevent the second encapsulation layer 620 from overflowing to the side of the dam 700 away from the display area AA, thereby ensuring the encapsulation reliability of the display panel 10. The second encapsulation sublayer 610b or the third encapsulation layer 630 extends to the side of the dam 700 away from the display area AA to increase the path for water and oxygen intrusion. When the non-display area width of a large-scale display product is sufficiently large, the dam 700 may not be required.

[0071] Optionally, the dam 700 is disposed around at least a portion of the display area AA. Optionally, there are multiple dams 700. Optionally, the multiple dams 700 are spaced apart in a direction from the display area AA to the non-display area NA.

[0072] In some optional embodiments, the second encapsulation layer 620 is spaced apart from the dam 700. Specifically, the second encapsulation layer 620 is spaced apart from the dam 700 closest to the display area AA.

[0073] Alternatively, the boundary of the second encapsulation layer 620 is located on the sidewall of the dam 700 facing the display area AA.

[0074] In these optional embodiments, the second encapsulation layer 620 and the dam 700 are spaced apart. For example, in a large-size display panel 10, the non-display area NA is relatively wide, and the distance between the dam 700 and the display area AA is relatively far. This makes it difficult for the second encapsulation layer 620 to flow to the dam 700 during leveling, thereby reducing the risk of overflow of the second encapsulation layer 620. The boundary of the second encapsulation layer 620 is located on the sidewall of the dam 700 facing the display area AA. The second encapsulation layer 620 flows to the dam 700 and is stopped by the dam 700, thereby preventing the second encapsulation layer 620 from continuing to overflow away from the display area AA.

[0075] In some optional embodiments, the second encapsulation sub-layer 610 b covers the sidewalls of the isolation structure 300 facing the dam 700 .

[0076] In these optional embodiments, the isolation opening 310 is independently encapsulated by the first encapsulation sub-portion 610aa, and the side wall of the isolation structure 300 facing the dam 700 is covered by the second encapsulation sub-layer 610b, which physically isolates the side wall of the isolation structure 300 and increases the water and oxygen intrusion path, thereby improving the problem of water and oxygen invading the light-emitting unit 230 through the side wall of the isolation structure 300, resulting in poor display.

[0077] Optionally, the dam 700 includes a single layer or multiple layers of metal material, or the dam 700 includes a metal material and an inorganic material, or the dam 700 includes a single layer or multiple layers of organic material.

[0078] There are many ways to set up the substrate 100. Optionally, the substrate 100 also includes a substrate and a pixel driving circuit. For example, the substrate 100 includes a substrate and a driving circuit layer and a planarization layer arranged on the substrate. The pixel driving circuit includes a transistor and a capacitor, the capacitor includes a first plate and a second plate, and the transistor includes a source, a drain, a gate and a semiconductor layer. The driving circuit layer also includes a plurality of signal lines, such as a data signal line, a scanning signal line, a driving power supply voltage signal line, etc. The driving circuit layer includes a plurality of conductive layers, the plurality of conductive layers include a first conductive layer, a second conductive layer and a third conductive layer, the gate and the first plate can be located in the first conductive layer, the second plate can be located in the second conductive layer, and the source and drain can be located in the third conductive layer. Optionally, the plurality of conductive layers also include a fourth conductive layer located on the side of the third conductive layer facing away from the substrate.

[0079] Optionally, at least a portion of the bank 700 is co-located with at least one of the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer. For example, at least a portion of the bank 700 is co-located with the fourth conductive layer, or at least a portion of the bank 700 is co-located with the first conductive layer, the second conductive layer, and the fourth conductive layer.

[0080] Optionally, in the same cross section extending along the thickness direction of the display panel 10 , the thickness of the first encapsulation sublayer 610 a is greater than the thickness of the second encapsulation sublayer 610 b .

[0081] In these optional embodiments, the second encapsulation sublayer 610b has the smallest thickness but the highest density, which improves the overall encapsulation reliability of the first encapsulation layer 610 while reducing the material usage of the second encapsulation sublayer 610b and the overall film thickness of the display panel 10.

[0082] See also Figure 11 , Figure 11 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0083] like Figure 11 As shown, in some optional embodiments, the first encapsulation layer 610 further includes a third encapsulation sublayer 610c, which is located on the side of the second encapsulation sublayer 610b facing away from the substrate 100, and the density of the second encapsulation sublayer 610b is greater than the density of the third encapsulation sublayer 610c.

[0084] In these optional embodiments, the provision of the third encapsulation sublayer 610c can further enhance the encapsulation effect of the first encapsulation layer 610. Furthermore, the density of the second encapsulation sublayer 610b is greater than that of the first encapsulation sublayer 610a and the third encapsulation sublayer 610c. The second encapsulation sublayer 610b is denser than the first encapsulation sublayer 610a, further enhancing the overall encapsulation reliability of the first encapsulation layer 610. This alleviates the problem that a single-layer first encapsulation layer 610 cannot meet the encapsulation requirements of the display panel 10, thereby improving the display effect and performance of the display panel 10. In particular, this can alleviate the problem that a single-layer first encapsulation layer 610 cannot meet the encapsulation requirements of large-sized display panels 10.

[0085] In some optional embodiments, on the same cross-section extending along the thickness direction of the display panel 10, the thickness of the first encapsulation sublayer 610a is greater than the thickness of the second encapsulation sublayer 610b, and the thickness of the third encapsulation sublayer 610c is greater than the thickness of the second encapsulation sublayer 610b.

[0086] In these optional embodiments, the second encapsulation sublayer 610b has the smallest thickness but the highest density, which improves the overall encapsulation reliability of the first encapsulation layer 610 while reducing the material usage of the second encapsulation sublayer 610b and the overall film thickness of the display panel 10.

[0087] In some optional embodiments, the refractive index of the first encapsulation sublayer 610a is greater than the refractive index of the second encapsulation sublayer 610b, and the refractive index of the second encapsulation sublayer 610b is greater than the refractive index of the third encapsulation sublayer 610c.

[0088] In these optional embodiments, the first, second, and third encapsulation sublayers 610a, 610b, and 610c have decreasing refractive indices, forming a graduated optical coupling layer. This reduces interfacial reflection losses and improves light extraction efficiency. The high-refractive-index first encapsulation sublayer 610a is positioned close to the light-emitting unit 230, shortening the optical path difference and mitigating color shift caused by wavelength interference. The low-refractive-index third encapsulation sublayer 610c acts as a light-exiting interface buffer, scattering ambient light reflections.

[0089] Optionally, when the first encapsulation layer 610 includes the first encapsulation sublayer 610a, the second encapsulation sublayer 610b, and the third encapsulation sublayer 610c, the thicknesses of the first encapsulation sublayer 610a and the third encapsulation sublayer 610c are both less than the thickness of the first encapsulation sublayer 610a when the first encapsulation layer 610 includes only the first encapsulation sublayer 610a and the second encapsulation sublayer 610b. Optionally, when the first encapsulation layer 610 includes the first encapsulation sublayer 610a, the second encapsulation sublayer 610b, and the third encapsulation sublayer 610c, the sum of the thicknesses of the first encapsulation sublayer 610a and the third encapsulation sublayer 610c is equal to the thickness of the first encapsulation sublayer 610a when the first encapsulation layer 610 includes only the first encapsulation sublayer 610a and the second encapsulation sublayer 610b.

[0090] See also Figure 12 , Figure 12 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0091] like Figure 12 As shown, in some optional embodiments, the display panel 10 further includes: a protective cover plate 800, located on the side of the first encapsulation layer 610 facing away from the substrate 100, the protective cover plate 800 and the substrate 100 are arranged opposite to each other, and a sealing structure 810 is arranged between the protective cover plate 800 and the substrate 100.

[0092] In these optional embodiments, a sealed chamber is formed between the protective cover 800 and the substrate 100 on which the light-emitting devices are mounted, through a sealing structure 810, to block ambient water and oxygen. The protective cover 800 and the first encapsulation layer 610 form a double encapsulation, with a hard encapsulation and a flexible encapsulation being provided in combination, further improving the packaging reliability of the display panel 10.

[0093] Optionally, the sealing structure 810 includes glass glue, which is sintered to form a seal between the protective cover plate 800 and the substrate 100. Optionally, the sealing structure 810 is fixedly connected to an inorganic material of the display panel 10. For example, the sealing structure 810 is fixed to the third encapsulation layer 630, or the sealing structure 810 is fixed to the second encapsulation sublayer 610b, or the sealing structure 810 is fixed to another inorganic insulating layer. Optionally, the sealing structure 810 includes an opaque sealing material such as a sealant.

[0094] Optionally, the display panel 10 further includes: a second wear-resistant layer, which is disposed on the outer surface of the protective cover plate 800 facing away from the first encapsulation layer 610 , and the wear rate of the second wear-resistant layer is lower than the wear rate of the protective cover plate 800 .

[0095] In these optional embodiments, the wear rate of the second wear-resistant layer is less than the wear rate of the protective cover plate 800, that is, the wear resistance of the second wear-resistant layer is superior to the wear resistance of the protective cover plate 800. When the second wear-resistant layer is provided on the protective cover plate 800, the second wear-resistant layer has better wear resistance and provides protection for the protective cover plate 800, thereby improving the packaging reliability of the display panel 10. Optionally, the second wear-resistant layer includes a wear-resistant material such as diamond carbon or SiO2 nanoparticle coating.

[0096] In some optional embodiments, the protective cover 800, the substrate 100, and the sealing structure 810 enclose a sealed space 820, and the light-emitting device and the isolation structure 300 are both located in the sealed space 820. The sealed space 820 is filled with an inert gas, such as nitrogen, argon, etc.

[0097] In these optional embodiments, the inert gas completely isolates oxygen and water vapor, thereby reducing the risk of oxidation of the light-emitting device from the root. The enclosed space 820 forms an air pressure buffer layer, thereby improving the impact resistance of the display panel 10.

[0098] See also Figure 13 , Figure 13 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0099] like Figure 13 As shown, in some optional embodiments, the display panel 10 further includes: a second encapsulation layer 620, located on the side of the first encapsulation layer 610 away from the substrate 100, and the material of the second encapsulation layer 620 includes an organic material; a third encapsulation layer 630, located on the side of the second encapsulation layer 620 away from the substrate 100, and the material of the third encapsulation layer 630 includes an inorganic material; and a protective cover plate 800 is located on the side of the third encapsulation layer 630 away from the substrate 100.

[0100] In these optional embodiments, the protective cover 800 forms an airtight cavity through the sealing structure 810 to block ambient water and oxygen. The first encapsulation layer 610, the second encapsulation layer 620, and the third encapsulation layer 630 form a three-layer thin film encapsulation. The protective cover 800 and the TFE form a dual encapsulation of hard and flexible encapsulation, further improving the packaging reliability of the display panel 10.

[0101] like Figure 1 and Figure 12As shown, optionally, the display panel 10 has a display area AA and a non-display area NA surrounding at least a portion of the display area AA. The non-display area NA includes side frames NA1 located on both sides of the display area AA in the first direction X and a bottom frame NA2 located on one side of the display area AA in the second direction Y. Within the side frames NA1, the sealing structure 810 is located on a side of the second encapsulation sublayer 610b or the third encapsulation layer 630 away from the display area AA. The display panel 10 also includes a driving power supply voltage signal line located at least partially in the bottom frame NA2. Within the bottom frame NA2, the orthographic projection of the sealing structure 810 on the substrate 100 at least partially overlaps with the driving power supply voltage signal line. The sealing structure 810 is disposed around the display area AA in the side frames NA1 and the bottom frame NA2 to provide sealed protection for the display area AA. Optionally, the driving power supply voltage signal line includes a high-level power line ELVDD and a low-level power line ELVSS.

[0102] In some optional embodiments, the orthographic projection of the second encapsulation layer 620 on the substrate 100 is located within the orthographic projection of the protection cover 800 on the substrate 100 .

[0103] In these optional embodiments, the second encapsulation layer 620 is retracted into the protective cover 800 , and the protective cover 800 provides physical covering and protection for the second encapsulation layer 620 to resist edge delamination caused by assembly stress.

[0104] In some optional embodiments, the orthographic projection of the third encapsulation layer 630 on the substrate 100 is located within the orthographic projection of the protection cover 800 on the substrate 100 .

[0105] In these optional embodiments, the edge of the third encapsulation layer 630 is covered by the protective cover 800, which can improve water and oxygen penetration caused by cutting cracks.

[0106] In some optional embodiments, the distance L0 between the boundary of the isolation structure 300 and the sealing structure 810 is greater than or equal to 50 μm. For example, the distance between the boundary of the isolation structure 300 and the sealing structure 810 is 50 μm, 60 μm, 70 μm, or 80 μm.

[0107] In these optional embodiments, the distance between the boundary of the isolation structure 300 and the sealing structure 810 is greater than or equal to 50 μm to accommodate a large-sized display panel 10 .

[0108] See also Figure 14 , Figure 14 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0109] like Figure 14As shown, in some optional embodiments, the display panel 10 further includes a polarizer 900 located between the display panel 10 and the protective cover plate 800, and the side walls of the polarizer 900 are concave relative to the substrate 100 and the protective cover plate 800 to form a recessed space 910, and the recessed space 910 is filled with a water and oxygen resistant structure 920.

[0110] In these optional embodiments, the edges of the substrate 100, the polarizer 900 and the protective cover 800 of the display panel 10 are uneven. For example, the edge side walls of the polarizer 900 are retracted relative to the substrate 100 and the protective cover 800 to form a recessed space 910. Water and oxygen are easily accumulated in the recessed space 910 and invade the interior of the screen. Therefore, a water and oxygen resistant structure 920 is filled in the recessed space 910 to isolate water and oxygen, cut off the water and oxygen invasion path, and improve the packaging reliability of the display panel 10.

[0111] Optionally, the water and oxygen resistant structure 920 includes glass glue.

[0112] Optionally, an adhesive layer 930 is provided between the polarizer 900 and the protective cover 800, and the adhesive layer 930 is used to bond the polarizer 900 and the protective cover 800. Optionally, the adhesive layer 930 includes OCA (Optical Clear Adhesive) or the like.

[0113] In some optional embodiments, in the same cross-section extending along the thickness direction of the display panel 10, the thickness of the second encapsulation sublayer 610b is less than the thickness of the first encapsulation sublayer 610a, and the ratio of the thickness of the second encapsulation sublayer 610b to the thickness of the first encapsulation sublayer 610a is less than or equal to 0.1. For example, the ratio of the thickness of the second encapsulation sublayer 610b to the thickness of the first encapsulation sublayer 610a is 0.02, 0.05, 0.08, 0.1, etc.

[0114] In these optional embodiments, the ratio of the thickness of the second encapsulation sublayer 610b to the thickness of the first encapsulation sublayer 610a is less than or equal to 0.1, which can improve the problem that the ratio of the thickness of the second encapsulation sublayer 610b to the thickness of the first encapsulation sublayer 610a is too large, the thickness of the second encapsulation sublayer 610b is too large, resulting in excessive material cost of the second encapsulation sublayer 610b and excessive overall film thickness of the display panel 10, or the thickness of the first encapsulation sublayer 610a is too small, resulting in poor encapsulation effect of the first encapsulation sublayer 610a and low structural strength.

[0115] In some optional embodiments, the thickness of the second encapsulation sublayer 610b ranges from 100A to 1000A. For example, the thickness of the second encapsulation sublayer 610b is 100A, 600A, 800A, 1000A, etc.

[0116] In these optional embodiments, the thickness of the second encapsulation sublayer 610b is greater than or equal to 100 Å, which can improve problems such as high preparation precision and difficulty of the second encapsulation sublayer 610b, poor encapsulation performance, and low structural strength of the second encapsulation sublayer 610b, which are prone to cracks, caused by a too small thickness of the second encapsulation sublayer 610b. The thickness of the second encapsulation sublayer 610b is less than or equal to 1000 Å, which can improve problems such as excessive material cost of the second encapsulation sublayer 610b and excessive overall thickness of the display panel 10, caused by an excessive thickness of the second encapsulation sublayer 610b.

[0117] Optionally, the display panel 10 further includes: a pixel definition layer 200, which is disposed on one side of the substrate 100. The pixel definition layer 200 includes a pixel defining portion 210 and a pixel opening 220 formed by the pixel defining portion 210. The pixel opening 220 is used to accommodate the light-emitting unit 230. The pixel definition layer 200 includes the pixel defining portion 210 and the pixel opening 220. The light-emitting unit 230 is located within the pixel opening 220. The pixel defining portion 210 can improve the problem of light crosstalk between adjacent light-emitting units 230. The isolation structure 300 encloses the isolation opening 310. The isolation opening 310 and the pixel opening 220 are correspondingly arranged. The isolation structure 300 can further improve the problem of light crosstalk between the light-emitting units 230.

[0118] Optionally, a first electrode layer 400 is provided on the substrate 100. The first electrode layer 400 includes a plurality of first electrodes 410 distributed in an array. Each first electrode 410 is provided corresponding to each pixel opening 220. The first electrode 410 is used to drive the light-emitting unit 230 to emit light. A portion of the first electrode 410 is exposed by the pixel opening 220, and another portion of the first electrode 410 is located between the pixel defining portion 210 and the substrate 100.

[0119] The first electrode 410 may include a multilayer structure. For example, the first electrode 410 may include a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed using, for example, a metal material with excellent light reflectivity, such as silver. Each conductive oxide layer can be formed using, for example, a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 510 may be formed using, for example, a metal material such as a magnesium and silver alloy (MgAg).

[0120] There are many ways to set the material of the pixel definition layer 200. For example, the material of the pixel definition layer 200 is an inorganic material, such as the pixel definition layer 200 is formed using at least one inorganic insulating material of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0121] See also Figure 15 , Figure 15 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0122] like Figure 15 As shown, in one embodiment, the pixel definition layer 200 includes multiple sub-layers, and the pixel definition layer 200 includes a first definition layer 201 and a second definition layer 202 stacked in sequence in a direction away from the substrate 100, that is, the pixel definition layer 200 can adopt a double-layer design.

[0123] For example, the first definition layer 201 has better film-forming properties than the second definition layer 202. That is, under conditions of equal thickness, the first definition layer 201 can better cover the step structure formed by the first electrode 410 than the second definition layer 202, without generating cracks. Conversely, to achieve the same step coverage effect, the thickness of the first definition layer 201 must be thinner than that of the second definition layer 202. This means that the thickness requirement for the first definition layer 201 is relatively low, which facilitates thinning of the product. Furthermore, good film-forming properties are reflected in the excellent coverage of the formed film, making it denser and more conducive to isolating from moisture. In other words, the material density of the first definition layer 201 is greater than that of the second definition layer 202.

[0124] For example, the second definition layer 202 has better etching resistance than the first definition layer 201. Since the side of the pixel definition layer 200 facing away from the substrate 100 is etched during the manufacturing process of the display panel 10, selecting a material with stronger etching resistance for the second definition layer 202 can improve the etching resistance of the pixel definition layer 200 and further improve the reliability of the display panel 10.

[0125] Exemplarily, the first definition layer 201 and the second definition layer 202 are made of different materials. For example, the first definition layer 201 is made of silicon nitride, and the second definition layer 202 is made of silicon oxide.

[0126] Exemplarily, the thickness of the first definition layer 201 is greater than or equal to 1000 micrometers and less than or equal to 5000 micrometers. For example, the thickness of the first definition layer 201 is 1000 micrometers, 2000 micrometers, 3000 micrometers, 4000 micrometers, 5000 micrometers, etc.

[0127] Exemplarily, the thickness of the second definition layer 202 is greater than or equal to 500 micrometers and less than or equal to 3000 micrometers. For example, the thickness of the second definition layer 202 is 500 micrometers, 1000 micrometers, 2000 micrometers, 3000 micrometers, etc.

[0128] In some optional embodiments, the isolation structure 300 includes a first sublayer 301 and a second sublayer 302 stacked in a direction away from the substrate 100 , and the second sublayer 302 protrudes relative to the first sublayer 301 toward the isolation opening 310 .

[0129] In these optional embodiments, the isolation structure 300 includes a first sublayer 301 and a second sublayer 302. The second sublayer 302 is arranged to protrude relative to the first sublayer 301 toward the isolation opening 310, so that a recess can be formed under the second sublayer 302. During the preparation of the light-emitting unit 230, the light-emitting material can be broken at the edge of the second sublayer 302 to form independent light-emitting units 230.

[0130] See also Figure 16 , Figure 16 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0131] like Figure 16 As shown, the isolation structure 300 optionally further includes a third sublayer 303. The third sublayer 303 is located on the side of the first sublayer 301 facing the substrate 100, and the third sublayer 303 is provided to protrude relative to the first sublayer 301 toward the isolation opening 310. During the preparation process of the isolation structure 300, when the first sublayer 301 is side-etched, the third sublayer 303 can provide protection for the film layer on the substrate 100 side.

[0132] Optionally, the first sublayer 301 and the second sublayer 302 are made of different materials, and the etching rate of the first sublayer 301 is lower than that of the second sublayer 302. The material of the first sublayer 301 includes a conductive material, specifically at least one of aluminum (Al) and an aluminum alloy. The aluminum alloy may include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The second sublayer 302 may have a single-layer structure or a multi-layer structure. If the second sublayer 302 is a single-layer structure, the material of the second sublayer 302 may include at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy. If the second sublayer 302 is a multi-layer structure, one layer of the second sublayer 302 may include at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy, and another layer of the second sublayer 302 may include a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0133] Optionally, the material of the third sublayer 303 includes a conductive material. For example, the material of the third sublayer 303 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0134] Optionally, the display panel 10 further includes a second electrode layer 500, and the second electrode layer 500 includes a second electrode 510 located on the side of each light-emitting unit 230 facing away from the substrate 100. Optionally, the light-emitting device is composed of the above-mentioned first electrode 410, the light-emitting unit 230 and the second electrode 510. Optionally, the second electrode 510 is located in each isolation opening 310. Optionally, the second electrode 510 is electrically connected to the isolation structure 300. For example, the material of the first sublayer 301 includes a conductive material, and the second electrode 510 is electrically connected to the first sublayer 301. Alternatively, the materials of the first sublayer 301 and the third sublayer 303 both include conductive materials, and the second electrode 510 is electrically connected to the third sublayer 303 and the first sublayer 301. Optionally, the second electrode 510 includes a main body and a contact portion in a closed ring surrounding the main body, and the contact portion and the third sublayer 303 are in contact with each other.

[0135] Optionally, at least one light-emitting unit 230 includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked in a direction away from the substrate 100 (thickness direction). The light-emitting unit 230 may include a single light-emitting material layer EML or a stacked light-emitting structure including multiple light-emitting material layers EML.

[0136] During the light-emitting process of the light-emitting unit 230, the first electrode 410 is used to generate holes, and the second electrode 510 is used to generate electrons. The holes and electrons combine within the light-emitting unit 230, causing the light-emitting unit 230 to emit light. The first electrode 410 contacts the light-emitting unit 230, and portions of the light-emitting unit 230 may overlap with the isolation structure 300. This may cause holes to crosstalk between adjacent light-emitting units 230 through the light-emitting unit 230 and the isolation structure 300. In the embodiment of the present application, the pixel defining portion 210 is provided with a recess, so that at least a portion of the light-emitting unit 230 can be broken at the recess, thereby reducing the hole transmission area and improving the problem of lateral crosstalk.

[0137] To enable the light-emitting unit 230 to emit light, a pixel voltage is supplied to the first electrode 410 and a common voltage is supplied to the second electrode 510, respectively. This creates a potential difference between the first electrode 410 and the second electrode 510, causing the light-emitting structure disposed between the first electrode 410 and the second electrode 510 to emit light. In one embodiment, when a potential difference is formed between the first electrode 410 and the second electrode 510 of the light-emitting unit 230, the light-emitting material layer EML of the light-emitting unit 230 emits light.

[0138] The pixel voltage of the first electrode 410 is provided by the pixel driving circuit, and the common voltage of the second electrode 510 is provided by the isolation structure 300. Specifically, the second electrode 510 is electrically connected to the isolation structure 300. By providing the common voltage to the isolation structure 300, the common voltage is supplied to the second electrode 510. In other words, the isolation structure 300 has the function of supplying the common voltage to the second electrode 510.

[0139] The display panel 10 may further include at least one film layer, such as a touch layer and a color filter substrate 100. This film layer may also be bonded to the display panel 10 via an adhesive layer such as an OCA (Optical Clear Adhesive). Optionally, the width of the signal line in the non-display area NA is greater than the width of the signal area in the display area AA. Optionally, the substrate 100 also includes a gate drive circuit in the non-display area NA, where the channel region size of the transistors in the gate drive circuit is greater than the channel region size of the transistors in the pixel drive circuit in the display area, to ensure the lifespan of the transistors in the gate drive circuit and improve the driving capability of the gate drive circuit.

[0140] See also Figure 17 , Figure 17 This is a schematic diagram of a pixel circuit provided in an embodiment of the present application.

[0141] Optional, reference Figure 17 The pixel driving circuit includes a driving transistor T1 and a data transistor T2. The source of the data transistor T2 is connected to a data line providing a data signal Data, the gate of the data transistor T2 is connected to a scan line providing a scan signal Scan, the drain of the data transistor T2 is connected to the gate of the driving transistor T1, the two ends of the storage capacitor C1 are respectively connected to the gate and source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting device. Figure 16 This is an embodiment of the pixel driving circuit. The pixel driving circuit of this application is not limited to Figure 16 The 2T1C pixel driving circuit shown may also be other pixel driving circuits, such as a 4T1C pixel driving circuit.

[0142] See also Figure 18 , Figure 18FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0143] like Figure 18 As shown, the second embodiment of the present application provides a display panel 10, which includes: a substrate 100; an isolation structure 300, located on one side of the substrate 100, the isolation structure 300 enclosing a plurality of isolation openings 310; a light-emitting device, located on one side of the substrate 100 and including a first electrode 410, a light-emitting unit 230 and a second electrode 510 arranged in a stacked manner, the light-emitting device being arranged corresponding to the isolation opening 310; a first encapsulation layer 610, located on a side of the second electrode 510 facing away from the substrate 100; a second encapsulation layer 620, located on a side of the first encapsulation layer 610 facing away from the substrate 100, the material of the second encapsulation layer 620 including an organic material; a third encapsulation layer 630, located on a side of the second encapsulation layer 620 facing away from the substrate 100, the material of the third encapsulation layer 630 including an inorganic material; a protective cover plate 800, located on a side of the third encapsulation layer 630 facing away from the substrate 100, the protective cover plate 800 and the substrate 100 being arranged opposite to each other, and a sealing structure 810 being arranged between the protective cover plate 800 and the substrate 100.

[0144] According to an embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 300, a light-emitting device, a first encapsulation layer 610, a second encapsulation layer 620, a third encapsulation layer 630, and a protective cover 800. When preparing the light-emitting material, a large drop in the light-emitting material is generated at the edge of the isolation structure 300. The light-emitting material is separated at the edge of the isolation structure 300, forming mutually disconnected light-emitting units 230. This reduces carrier crosstalk between the light-emitting units 230, improving the display quality of the display panel 10. Furthermore, the light-emitting units 230 can be prepared without the use of a precision mask, reducing the development and use of precision masks and lowering manufacturing costs. The first electrode 410 and the second electrode 510 serve as electrodes for the light-emitting units 230, driving their emission. The first encapsulation layer 610, the second encapsulation layer 620, and the third encapsulation layer 630 form a three-layer thin film evaporator (TFE), improving the encapsulation performance of the display panel 10. Optionally, the material of the first encapsulation layer 610 includes an inorganic material. A second encapsulation layer 620 is formed on the side of the first encapsulation layer 610 facing away from the substrate 100 by printing or other methods to provide planarization and stress relief. The protective cover 800 forms an airtight cavity through the sealing structure 810, blocking ambient water and oxygen. The first encapsulation layer 610, the second encapsulation layer 620, and the third encapsulation layer 630 form a three-layer thin film encapsulation. The protective cover 800 and TFE form a dual encapsulation of rigid and flexible packaging, further improving the packaging reliability of the display panel 10.

[0145] Next, a method for manufacturing the display panel 10 according to the embodiment of the present application will be described.

[0146] refer to Figures 1 to 18 , the method for preparing the display panel 10 includes: In step S11 , a substrate 100 is provided.

[0147] In step S12 , an isolation structure 300 is formed on one side of the substrate 100 . The isolation structure 300 encloses a plurality of isolation openings 310 . The plurality of isolation openings 310 include a plurality of first isolation openings 310 , a plurality of second isolation openings 310 , and a plurality of third isolation openings 310 .

[0148] Step S14 , manufacturing a film layer of the first light-emitting device, wherein the film layer of the first light-emitting device includes a light-emitting unit 230 layer and a second electrode layer 500 of the first light-emitting device.

[0149] Step S15: Fabricate the first encapsulation sublayer 610a of the first light-emitting device. Since the film layer of the first light-emitting device and the first encapsulation sublayer 610a are fabricated as a single layer, the film layer of the first light-emitting device and the first encapsulation sublayer 610a are located at the positions of the plurality of first isolation openings 310, the plurality of second isolation openings 310, and the plurality of third isolation openings 310.

[0150] In step S16, the film layer and the first encapsulation sublayer 610a of the first light-emitting device at the positions of the multiple second isolation openings 310 and the multiple third isolation openings 310 are etched away, thereby forming the light-emitting unit 230 and the second electrode 510 of the first light-emitting device and the first encapsulation sub-part 610aa of the first light-emitting device at the positions of the multiple first isolation openings 310.

[0151] Based on the above steps S14 to S16, the light-emitting unit 230 and the second electrode 510 of the second light-emitting device and the first packaging sub-portion 610aa of the second light-emitting device are respectively arranged at the positions of the multiple second isolation openings 310, and the light-emitting unit 230 and the second electrode 510 of the third light-emitting device and the first packaging sub-portion 610aa of the third light-emitting device are respectively arranged at the positions of the multiple third isolation openings 310.

[0152] Optionally, after the step of disposing the light-emitting unit 230 and the second electrode 510 of the third light-emitting device and the first encapsulation portion of the third light-emitting device at the positions of the plurality of third isolation openings 310 , the preparation method includes: Step S17 , preparing a second encapsulation sublayer 610 b on the side of the first encapsulation sublayer 610 a facing away from the substrate 100 .

[0153] The second encapsulation sub-layer 610 b is prepared by an atomic layer deposition (ALD) process, so that the density of the second encapsulation sub-layer 610 b is greater than the density of the first encapsulation sub-layer 610 a .

[0154] In some embodiments, step S17 is performed after light-emitting devices of various colors are prepared. This is because if step S17 is performed during the process of preparing the light-emitting devices, for example, between step S15 and step S16, then in step S16, not only the film layer and the first encapsulation sublayer 610a of the first light-emitting device at the locations of the multiple second isolation openings 310 and the multiple third isolation openings 310 must be etched and removed, but also the second encapsulation sublayer 610b at the locations of the multiple second isolation openings 310 and the multiple third isolation openings 310 must be removed. However, due to the higher density of the second encapsulation sublayer 610b, removing the second encapsulation sublayer 610b is more difficult. Therefore, preparing the second encapsulation sublayer 610b after preparing light-emitting devices of various colors can avoid affecting the light-emitting device preparation process due to the preparation of the second encapsulation sublayer 610b.

[0155] Optionally, step S15 includes: The first encapsulation sublayer 610a and the second encapsulation sublayer 610b of the first light-emitting device are manufactured. Since the film layer, the first encapsulation sublayer 610a and the second encapsulation sublayer 610b of the first light-emitting device are all manufactured as a whole layer, the film layer, the first encapsulation sublayer 610a and the second encapsulation sublayer 610b of the first light-emitting device are located at the positions of the plurality of first isolation openings 310, the plurality of second isolation openings 310 and the plurality of third isolation openings 310.

[0156] Step S16 includes: The film layer, the first encapsulation sublayer 610a and the second encapsulation sublayer 610b of the first light-emitting device at the positions of the multiple second isolation openings 310 and the multiple third isolation openings 310 are etched away, thereby forming the light-emitting unit 230 and the second electrode 510 of the first light-emitting device, the first encapsulation sub-portion 610aa of the first light-emitting device, and the second encapsulation sub-portion 610ba of the first light-emitting device only at the positions of the multiple first isolation openings 310.

[0157] Based on the above steps S14 to S16, the light-emitting unit 230 and the second electrode 510 of the second light-emitting device, the first packaging sub-portion 610aa of the second light-emitting device, and the second packaging sub-portion 610ba of the second light-emitting device are respectively arranged at the positions of the multiple second isolation openings 310, and the light-emitting unit 230 and the second electrode 510 of the third light-emitting device, the first packaging sub-portion 610aa of the third light-emitting device, and the second packaging sub-portion 610ba of the third light-emitting device are arranged at the positions of the multiple third isolation openings 310.

[0158] In some possible implementations, the present application further provides a display device, comprising the display panel 10 of the present application. The display device may include a device with image processing capabilities, such as a mobile phone, a desktop computer, a laptop computer, a tablet computer, a vehicle-mounted display, a wearable device, etc. Because the display device comprises the display panel 10 of the present application, the display device has higher reliability.

[0159] In some possible implementations, the present application further provides a device including the display panel 10 of the present application. The device may include a device with image processing capabilities, such as a television, a large-size display, etc. Because the device includes the display panel 10 of the present application, the device has higher reliability.

[0160] While the embodiments described above are not exhaustive, they do not limit the invention to the specific embodiments described. Clearly, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel includes: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; a light-emitting device located on one side of the substrate and comprising a first electrode, a light-emitting unit, and a second electrode stacked in layers, wherein the light-emitting device is disposed corresponding to the isolation opening; a first encapsulation layer, located on a side of the second electrode facing away from the substrate, the first encapsulation layer comprising a first encapsulation sublayer and a second encapsulation sublayer, the second encapsulation sublayer being located on a side of the first encapsulation sublayer facing away from the substrate, and the first encapsulation sublayer comprising a plurality of first encapsulation sub-portions; The density of the second encapsulation sublayer is greater than the density of the first encapsulation sublayer.

2. The display panel according to claim 1, wherein: The display panel further includes: a second encapsulation layer, located on a side of the first encapsulation layer facing away from the substrate, wherein the material of the second encapsulation layer comprises an organic material; The third encapsulation layer is located on a side of the second encapsulation layer away from the substrate, and the material of the third encapsulation layer includes an inorganic material.

3. The display panel according to claim 2, wherein: The orthographic projection of a boundary of the second encapsulation layer on the substrate is located within the orthographic projection of the second encapsulation sub-layer on the substrate.

4. The display panel according to claim 3, wherein: The second encapsulation sublayer and the third encapsulation layer are arranged in contact with each other at a peripheral side of the second encapsulation layer.

5. The display panel according to claim 2, wherein: An orthographic projection of the second encapsulation sublayer on the substrate is located within an orthographic projection of the third encapsulation layer on the substrate.

6. The display panel according to claim 2, wherein: The display panel further includes: The first wear-resistant layer is provided on an outer surface of the third encapsulation layer facing away from the second encapsulation layer, and the wear rate of the first wear-resistant layer is lower than the wear rate of the third encapsulation layer.

7. The display panel according to claim 6, wherein: The orthographic projection of the third encapsulation layer on the substrate is located within the orthographic projection of the first wear-resistant layer on the substrate.

8. The display panel according to claim 1, wherein: An orthographic projection of the first encapsulation sub-portion on the substrate is located within an orthographic projection of the second encapsulation sub-layer on the substrate.

9. The display panel according to claim 8, wherein: The second encapsulation sublayer is provided as a whole layer, and the orthographic projections of the plurality of first encapsulation sub-parts on the substrate are located within the orthographic projection of the same second encapsulation sublayer on the substrate; Alternatively, the second encapsulation sublayer includes a plurality of second encapsulation sub-portions, the second encapsulation sub-portions are located on a side of the first encapsulation sub-portion facing away from the substrate, and the orthographic projection of the first encapsulation sub-portion on the substrate is located within the orthographic projection of the second encapsulation sub-portion on the substrate.

10. The display panel according to claim 2, wherein: The display panel has a display area, the second encapsulation layer has a first thickness in the display area, the second encapsulation layer has a second thickness at an edge away from the display area, and a ratio of the second thickness to the first thickness is less than or equal to 0.

4.

11. The display panel according to claim 2, wherein: The display panel has a display area and a non-display area, the non-display area surrounds at least a portion of the display area, or the non-display area is arranged around the light-transmitting hole, and the display panel further includes: a dam located in the non-display area, and the second encapsulation layer located on a side of the dam facing the display area; The dam is arranged around the isolation structure, or the boundary of the isolation structure is at least partially located on the dam, or the boundary of the isolation structure is located outside the area enclosed by the dam.

12. The display panel according to claim 11, wherein: The second encapsulation layer and the dam are spaced apart from each other; or, a boundary of the second encapsulation layer is located on a side wall of the dam facing the display area.

13. The display panel according to claim 11, wherein: The second encapsulation sublayer covers a sidewall of the isolation structure facing the dam.

14. The display panel according to claim 11, wherein: The bank comprises a single layer or multiple layers of metal material, or the bank comprises a metal material and an inorganic material, or the bank comprises a single layer or multiple layers of organic material.

15. The display panel according to claim 1, wherein The first encapsulation layer further includes a third encapsulation sublayer. The third encapsulation sublayer is located on a side of the second encapsulation sublayer away from the substrate. The density of the second encapsulation sublayer is greater than that of the third encapsulation sublayer.

16. The display panel according to claim 15, wherein: On the same cross section extending along the thickness direction of the display panel, the thickness of the first encapsulation sublayer is greater than that of the second encapsulation sublayer, and the thickness of the third encapsulation sublayer is greater than that of the second encapsulation sublayer.

17. The display panel according to claim 15, wherein: The refractive index of the first encapsulation sublayer is greater than the refractive index of the second encapsulation sublayer, and the refractive index of the second encapsulation sublayer is greater than the refractive index of the third encapsulation sublayer.

18. The display panel according to claim 1, wherein The display panel further includes: The protective cover is located on a side of the first packaging layer away from the substrate. The protective cover and the substrate are arranged opposite to each other, and a sealing structure is provided between the protective cover and the substrate.

19. The display panel according to claim 18, wherein: The protective cover, the substrate and the sealing structure enclose a closed space, the light emitting device and the isolation structure are both located in the closed space, and the closed space is filled with an inert gas.

20. The display panel according to claim 18, wherein The display panel further includes: a second encapsulation layer, located on a side of the first encapsulation layer facing away from the substrate, wherein the material of the second encapsulation layer comprises an organic material; The third encapsulation layer is located on a side of the second encapsulation layer away from the substrate, and the material of the third encapsulation layer includes an inorganic material; the protective cover is located on a side of the third encapsulation layer away from the substrate.

21. The display panel according to claim 20, wherein: The display panel comprises a display area and a non-display area surrounding at least a portion of the display area, wherein the non-display area comprises side frames located on both sides of the display area in a first direction and a bottom frame located on one side of the display area in a second direction; In the side frame, the sealing structure is located on a side of the second encapsulation sublayer or the third encapsulation layer away from the display area; The display panel further includes a power signal line at least partially located in the lower frame. In the lower frame, the orthographic projection of the sealing structure on the substrate at least partially overlaps with the power signal line.

22. The display panel according to claim 20, wherein: The orthographic projection of the second encapsulation layer on the substrate is located within the orthographic projection of the protection cover on the substrate.

23. The display panel according to claim 20, wherein: The orthographic projection of the third encapsulation layer on the substrate is located within the orthographic projection of the protection cover on the substrate.

24. The display panel according to claim 18, wherein: A distance between a boundary of the isolation structure and the sealing structure is greater than or equal to 50 μm.

25. The display panel according to claim 18, wherein The display panel further includes a polarizer located between the display panel and the protective cover plate. The sidewall of the polarizer is concave relative to the substrate and the protective cover plate to form a recessed space, and the recessed space is filled with a water and oxygen resistant structure.

26. The display panel according to claim 1, wherein On the same cross section extending along the thickness direction of the display panel, the thickness of the second encapsulation sublayer is less than the thickness of the first encapsulation sublayer, and the ratio of the thickness of the second encapsulation sublayer to the thickness of the first encapsulation sublayer is less than or equal to 0.

1.

27. The display panel according to claim 1, wherein The thickness of the second encapsulation sublayer ranges from 100 Å to 1000 Å.

28. A display panel, characterized in that: The display panel includes: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; a light-emitting device located on one side of the substrate and comprising a first electrode, a light-emitting unit, and a second electrode stacked in layers, wherein the light-emitting device is disposed corresponding to the isolation opening; a first encapsulation layer, located on a side of the second electrode facing away from the substrate; a second encapsulation layer, located on a side of the first encapsulation layer facing away from the substrate, wherein the material of the second encapsulation layer comprises an organic material; a third encapsulation layer, located on a side of the second encapsulation layer facing away from the substrate, wherein the material of the third encapsulation layer comprises an inorganic material; The protective cover is located on a side of the third encapsulation layer away from the substrate. The protective cover and the substrate are arranged opposite to each other, and a sealing structure is provided between the protective cover and the substrate.

29. A display device, characterized in that: A display panel comprising any one of claims 1-28.

30. A device, characterized in that A display panel comprising any one of claims 1-28.

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