Display panel, preparation method thereof and display device

Abstract

The invention relates to the technical field of display, and particularly provides a display panel and a preparation method thereof, and a display device.The display panel comprises a substrate, an isolation structure, a display device layer, a first packaging layer and a second packaging layer, the isolation structure is located on one side of the substrate, and multiple isolation openings are defined by the isolation structure; the display device layer comprises a plurality of light-emitting elements, and the light-emitting elements are limited in the corresponding isolation openings; the first packaging layer comprises a plurality of packaging units arranged corresponding to the isolation openings, and the packaging units are at least partially located on the side, back to the substrate, of the light-emitting element; the second packaging layer is located in the isolation opening and is in contact with part of the surface of one side, back to the substrate, of at least part of the packaging units; wherein the packaging unit is attached to the isolation structure in the isolation opening, a cavity with an opening and communicated with the opening is defined by the packaging unit, and at least part of the second packaging layer is located at the opening to seal the cavity. The display panel is used for improving the processing performance of the display panel to a certain extent.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and more specifically, relates to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display technology is considered the most promising new display technology for the next generation. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-luminescence, wide viewing angle, and fast response speed.

[0003] Traditionally, pixel patterning is achieved using a fine metal mask (FMM) during the production of OLED display panels. FMM technology is mature and boasts extensive mass production experience. However, it also suffers from limitations such as limited precision and high cost. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-scale scalability, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe FMM-free technology for reference.

[0004] However, the process performance of current OLED display panels needs to be improved. Summary of the Invention

[0005] The present application provides a display panel and a manufacturing method thereof, and a display device, so as to improve the process performance of the display panel at least to a certain extent.

[0006] To achieve the above-mentioned objectives, the technical solution adopted in the present application is: in the first aspect, the present application provides a display panel, comprising a substrate, an isolation structure, a display device layer, a first encapsulation layer and a second encapsulation layer, wherein the isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; the display device layer comprises a plurality of light-emitting elements, and the light-emitting elements are confined within the corresponding isolation openings; the first encapsulation layer comprises a plurality of encapsulation units arranged corresponding to the isolation openings, and the encapsulation units are at least partially located on the side of the light-emitting elements facing away from the substrate; the second encapsulation layer is located within the isolation openings and in contact with a portion of the surface of at least part of the encapsulation unit facing away from the substrate; wherein the encapsulation unit is arranged in contact with the isolation structure within the isolation opening, and encloses a cavity having an opening and communicating with the opening, and at least part of the second encapsulation layer is located at the opening to seal the cavity.

[0007] In the display panel provided in the embodiments of the present application, by providing a second encapsulation layer to seal the cavity enclosed by the first encapsulation layer, the thickness of the first encapsulation layer can be effectively reduced while ensuring the packaging reliability of the packaging structure. This, in turn, reduces the processing cost of the first encapsulation layer to a certain extent and helps improve its production capacity. Furthermore, the reduced thickness of the first encapsulation layer also helps reduce the difficulty of etching the first encapsulation layer during the display panel manufacturing process, thereby further improving the etching reliability of the first encapsulation layer and helping to improve the processing yield and process performance of the display panel.

[0008] Optionally, the material of the second encapsulation layer includes organic material.

[0009] Optionally, the material of the first encapsulation layer includes an inorganic material.

[0010] Optionally, both the first encapsulation layer and the second encapsulation layer include silicon.

[0011] Optionally, a material of the first encapsulation layer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride.

[0012] Optionally, the orthographic projection of the second encapsulation layer on the substrate is located within the orthographic projection of the first encapsulation layer on the substrate.

[0013] Optionally, an orthographic projection outer contour of the second encapsulation layer on the substrate is connected to an orthographic projection outer contour of the cavity on the substrate.

[0014] Optionally, the orthographic projection of the second encapsulation layer on the substrate at least partially overlaps with the orthographic projection of the opening on the substrate, or the orthographic projection of the second encapsulation layer on the substrate exactly overlaps with the orthographic projection of the opening on the substrate.

[0015] Optionally, along a direction parallel to the plane of the substrate, the chamber is an annular structure close to the isolation structure and facing the isolation opening, and the second packaging layer is an annular structure and is located on a side of the chamber away from the isolation structure.

[0016] Optionally, along a direction parallel to the plane of the substrate, an end of the second encapsulation layer pointing to the middle of the isolation opening has an at least partially concave surface, and a portion of the second encapsulation layer away from the middle of the isolation opening has an at least partially convex surface.

[0017] Optionally, the packaging unit includes: a first packaging portion, located on a side of the light-emitting element facing away from the substrate; a second packaging portion, located on a side of the isolation structure facing away from the substrate; The third packaging part is located on the side of the isolation structure facing the isolation opening and connects the first packaging part and the second packaging part. The side of the first packaging part facing away from the substrate and the side of the third packaging part facing away from the isolation structure are at least partially connected to each other to enclose the cavity. The side of the second packaging layer facing the substrate is in contact with the first packaging part, and the side facing away from the substrate is in contact with the third packaging part.

[0018] Optionally, along a direction perpendicular to the plane where the substrate is located, the second packaging portion is spaced apart from a surface of the isolation structure facing away from the substrate.

[0019] Optionally, the third packaging part includes a first sub-part and a second sub-part connected in sequence, the first sub-part covers the side wall of the isolation structure facing the isolation opening and is connected to the end of the first packaging part pointing to the isolation structure, and the second sub-part connects the first sub-part and the second packaging part; wherein the second sub-part is arranged adjacent to the first packaging part, the opening is located between the first packaging part and the second sub-part, and at least part of the second packaging layer is in contact with the first packaging part and the second sub-part through the opening.

[0020] Optionally, a distance between the second sub-portion and the first encapsulation portion is greater than or equal to 500 angstroms.

[0021] Optionally, a distance between the second sub-portion and the first encapsulation portion is less than or equal to 1000 angstroms.

[0022] Optionally, the isolation structure includes a first isolation portion and a second isolation portion arranged in stacked layers, the second isolation portion is located on a side of the first isolation portion facing away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate.

[0023] Optionally, along a direction perpendicular to the plane of the substrate, the thickness of the first isolation portion is a first thickness, the thickness of the second isolation portion is a second thickness, the maximum thickness of the first encapsulation layer is a third thickness, and a relationship among the first thickness, the second thickness, and the third thickness satisfies: ; Wherein, h1 is the first thickness, h2 is the second thickness, and h3 is the third thickness.

[0024] Optionally, the relationship between the first thickness, the second thickness and the third thickness satisfies: .

[0025] Optionally, the chamber is located on the side of the second isolation portion facing the substrate, and the orthographic projection of the second encapsulation layer on the substrate at least partially overlaps with the orthographic projection of the second isolation portion on the substrate; the orthographic projection of the opening on the substrate and the orthographic projection of the second isolation portion on the substrate are arranged at intervals, or with their edges overlapping; along a direction perpendicular to the plane of the substrate, at least a portion of the surface of the second encapsulation layer on the side facing away from the substrate is higher than or flush with the second isolation portion.

[0026] Optionally, the isolation structure further includes a third isolation portion, which is located on the side of the first isolation portion facing the substrate, and the first isolation portion, the second isolation portion and the third isolation portion enclose the isolation opening; wherein the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

[0027] Optionally, the first encapsulation portion has a fourth thickness, the second encapsulation portion has a fifth thickness, and the third encapsulation portion has a sixth thickness, and the sixth thickness is smaller than any one of the fourth thickness and the fifth thickness.

[0028] Optionally, the relationship between the third thickness, the fourth thickness and the fifth thickness satisfies: ; Wherein, h4 is the fourth thickness, and h5 is the fifth thickness.

[0029] Optionally, the fourth thickness and the fifth thickness are the same.

[0030] Optionally, the light-emitting element has a first element, a second element and a third element with different luminous colors, and the isolation opening includes a first opening, a second opening and a third opening, the first opening is used to accommodate the first element, the second opening is used to accommodate the second element, and the third opening is used to accommodate the third element; wherein the second encapsulation layer is provided in at least one of the first opening, the second opening and the third opening, or the second encapsulation layer is provided in at least two of the first opening, the second opening and the third opening.

[0031] In a second aspect, the present application further provides a method for preparing a display panel, comprising: preparing an isolation structure on one side of the substrate, wherein the isolation structure encloses a plurality of isolation openings; preparing a light-emitting element in the isolation opening; preparing a first packaging material layer on a side of the light-emitting element facing away from the substrate, wherein the first packaging material layer encloses a cavity having an opening; A second packaging layer is prepared on a side of the first packaging material layer facing away from the substrate, wherein at least a portion of the second packaging layer is located at the opening to seal the cavity.

[0032] In the preparation method of the display panel provided in the embodiment of the present application, the cavity formed by the first packaging material layer can be effectively sealed by preparing a second packaging layer on the side of the first packaging material layer facing away from the substrate, thereby achieving thinning of the first packaging layer while ensuring the packaging reliability of the packaging structure, so as to improve the process performance of the display panel and reduce the production cost of the display panel to a certain extent, ultimately achieving the purpose of improving the reliability of the display panel and improving the yield of the display panel.

[0033] Optionally, the step of preparing a second encapsulation layer on a side of the first encapsulation material layer facing away from the substrate includes: preparing a second packaging material layer on a side of the first packaging material layer facing away from the substrate; The second packaging material layer is patterned to form the second packaging layer at least partially located at the opening.

[0034] Optionally, the step of patterning the second packaging material layer includes: The second packaging material layer is subjected to plasma etching treatment using a reactive gas.

[0035] Optionally, the reaction gas used in the plasma etching process includes a fluorine-containing gas; and / or the step of preparing a second packaging layer on the side of the first packaging material layer facing away from the substrate is implemented by the same equipment.

[0036] Optionally, after the second encapsulation layer is prepared, the preparation method further includes: The first packaging material layer is patterned to form a first packaging layer.

[0037] Optionally, the light-emitting element comprises a first element, a second element and a third element emitting different colors, the isolation opening comprises a first opening, a second opening and a third opening, the first opening is used to accommodate the first element, the second opening is used to accommodate the second element, and the third opening is used to accommodate the third element; The step of preparing the light-emitting element in the isolation opening includes: preparing the first element in the isolation opening; preparing a first packaging material layer on a side of the first component facing away from the substrate, wherein the first packaging material layer encloses a cavity having an opening; preparing a second encapsulation layer on a side of the first encapsulation material layer facing away from the substrate, wherein at least a portion of the second encapsulation layer is located at the opening to seal the cavity; Performing patterning on the first packaging material layer to form a first packaging layer corresponding to the first opening; The second element is prepared in the isolation opening.

[0038] preparing the first packaging material layer on a side of the second component facing away from the substrate, wherein the first packaging material layer encloses a cavity having an opening; preparing a second encapsulation layer on a side of the first encapsulation material layer facing away from the substrate, wherein at least a portion of the second encapsulation layer is located at the opening to seal the cavity; Performing patterning on the first packaging material layer to form a first packaging layer corresponding to the second opening; preparing the third element in the isolation opening; Alternatively, the method further includes: preparing the first packaging material layer on a side of the second component facing away from the substrate; Performing patterning on the first packaging material layer to form a first packaging layer corresponding to the second opening; The third element is prepared in the isolation opening.

[0039] In a third aspect, the present application further provides a display device, comprising any one of the display panels described above, or comprising the display panel prepared by any one of the preparation methods described above.

[0040] The display device provided in the embodiment of the present application includes the above-mentioned display panel and / or the method for preparing the display panel. Therefore, the display device includes at least the beneficial effects of any one or more of the above-mentioned display panels. The specific effects are described above and will not be repeated here.

[0041] The display panel, display panel manufacturing method, and display device provided herein have the following beneficial effects: Compared with related technologies, the display panel provided herein can effectively seal the cavity enclosed by the first encapsulation layer through a second encapsulation layer located on the side of the first encapsulation layer facing away from the substrate, thereby reducing the thickness of the first encapsulation layer without affecting the packaging reliability of the packaging structure, thereby reducing the processing cost of the first encapsulation layer and increasing the production capacity of the first encapsulation layer. In addition, the thinning of the first encapsulation layer also helps to reduce the difficulty of etching the first encapsulation layer in subsequent processes and helps improve etching reliability, thereby further optimizing the process performance of the display panel and ultimately achieving the purpose of improving the display reliability and processing yield of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application and should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0043] Figure 1 is a schematic diagram of a cross-sectional structure of a display panel in the related art; Figure 2 A schematic diagram of the planar structure of a display panel provided in an embodiment of the present application; Figure 3 for Figure 2 The shown panel shows an enlarged view of the structure of the S region; Figure 4 for Figure 3 A magnified view of the structure of the middle D area; Figure 5 for Figure 4 The schematic diagram of the cross-sectional structure of part of the film layer of the display panel taken along the AA direction is shown; Figure 6 for Figure 5 A magnified view of the structure of the middle C area; Figure 7 A schematic structural diagram of an array substrate in a display panel provided in an embodiment of the present application; Figure 8 A pixel circuit diagram of a display panel provided in an embodiment of the present application; Figure 9 for Figure 3A schematic diagram of a cross-sectional structure of a portion of a film layer of a display panel taken along the BB axis is shown; Figure 10 for Figure 3 Another schematic diagram of a BB-axis cross-sectional structure of a portion of the film layer of the display panel shown; Figure 11 A flow chart of a method for manufacturing a display panel provided in an embodiment of the present application; Figures 12A-12F A schematic diagram of a process for manufacturing a display panel according to an embodiment of the present application; Figure 13 A schematic structural diagram of a display device provided in an embodiment of the present application.

[0044] Among them, the reference numerals in the figures are: 100. Display device; 10. Display panel; 1. Substrate; 2. Isolation structure; 201. Isolation opening; 201a. First opening; 201b. Second opening; 201c. Third opening; 21. First isolation portion; 22. Second isolation portion; 23. Third isolation portion; 3. Light-emitting element; 31. First electrode; 32. Light-emitting functional layer; 33. Second electrode; R, first element; G, second element; B, third element; 4. First encapsulation layer; 401. Chamber; 41. First encapsulation portion; 42. Second encapsulation portion; 43. Third encapsulation portion; 431. First sub-portion; 432. Second sub-portion; 4', First encapsulation material layer; 5. Second encapsulation layer; 5', Second encapsulation material layer; 6. Pixel definition layer; 601. Pixel opening; 7. Transistor; 8. Planarization layer. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0046] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0047] It should be noted that similar reference numerals and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures. It should be noted that different features in the embodiments of the present application can be combined with each other without conflict.

[0048] For ease of understanding, the drawings show mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is referred to as the X-direction, the direction along the Y-axis is referred to as the Y-direction, and the direction along the Z-axis is referred to as the Z-direction. The Z-direction is the normal direction relative to the plane containing the X-direction and the Y-direction. In addition, the situation where various elements are viewed parallel to the plane containing the X-direction and the Y-direction is referred to as a top view. Alternatively, the planes in the X-direction and the Y-direction are parallel to the display surface of the display panel, and the Z-direction is parallel to the thickness direction of the display panel.

[0049] For certain elements, terms such as "upper" or "above" are sometimes used to describe the position of an element in the Z direction, while "lower" or "below" is used to describe the position of an element in the opposite direction. Furthermore, when terms such as "upper," "above," "lower," "below," and "relatively" are used to define the relative position of two elements, this includes not only states where the two elements are directly in contact, but also states where they are separated by a gap or other elements. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature. Furthermore, terms such as "first," "second," and "third" are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Therefore, features designated "first" or "second" may explicitly or implicitly include one or more of these features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined. It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element.

[0050] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0051] As used herein, the term "layer" may refer to a portion of a material layer corresponding to a material having a certain thickness. A layer may extend along the entire underlying structure or overlying structure, or may have an extent smaller than that of the underlying or overlying structure. Furthermore, a layer may be a region of a continuous, homogeneous or inhomogeneous structure whose thickness is less than the thickness of the continuous structure. For example, a layer may be located between the top and bottom surfaces of the continuous structure, or between any pair of transverse planes at the top and bottom surfaces. A layer may extend laterally, vertically, and / or along a tapered surface. A substrate may be a layer, may include one or more layers therein, and / or may have one or more layers located above, above, and / or below it. A layer may include multiple layers. For example, an interconnect layer may include one or more conductors and contact layers (in which contacts, interconnects, and / or vias are formed) and one or more dielectric layers.

[0052] In the related art, the display panel 10 may be an organic light emitting diode display panel (OLED) or a quantum dot light emitting diode (QLED). The display panel 10 is provided with an isolation structure 2, see Figure 1 The isolation structure 2 can be used to isolate some functional film layers in adjacent light-emitting elements 3 (also referred to as light-emitting devices), ensuring that adjacent light-emitting elements 3 do not interfere with each other, thereby helping to improve the display effect of the display panel 10. However, in related art, it has been found that some light-emitting elements 3 may fail, resulting in dark spots in the display panel 10, which to some extent affects the reliability and yield of the display panel 10.

[0053] Based on this, the embodiments of the present application provide a display panel 10 and a manufacturing method thereof, and a display device 100 to alleviate or improve the above technical problems to at least a certain extent and achieve the purpose of improving the process performance of the display panel 10.

[0054] The present application embodiment provides a display panel 10. Figure 2 and Figure 3 The display panel 10 includes a substrate 1, an isolation structure 2, a display device layer, a first encapsulation layer 4 and a second encapsulation layer 5, see Figure 4 and Figure 5 .

[0055] In this embodiment, the isolation structure 2 is located on one side of the substrate 1, and the isolation structure 2 encloses a plurality of isolation openings 201; the display device layer includes a plurality of light-emitting elements 3, and the plurality of light-emitting elements 3 are arranged along the X direction and the Y direction and are confined one by one within the corresponding isolation openings 201; the first encapsulation layer 4 includes a plurality of encapsulation units arranged corresponding to the isolation openings 201, and at least part of the encapsulation unit is located on the side of the light-emitting element 3 facing away from the substrate 1; the second encapsulation layer 5 is located in the isolation opening 201 and contacts a portion of the surface of at least part of the encapsulation unit facing away from the substrate 1; wherein the encapsulation unit is arranged in contact with the isolation structure in the isolation opening 201, and is enclosed to form a cavity 401 having an opening and connected to the opening, and at least part of the second encapsulation layer 5 is located at the opening to seal the cavity 401.

[0056] In the display panel 10 provided in the embodiment of the present application, by providing a second encapsulation layer 5 to seal the cavity 401 enclosed by the first encapsulation layer 4, the thickness of the first encapsulation layer 4 can be effectively reduced while ensuring the encapsulation reliability of the encapsulation structure, thereby reducing the processing cost of the first encapsulation layer 4 to a certain extent and helping to improve its production capacity. In addition, the thinning of the first encapsulation layer 4 also helps to reduce the difficulty of etching the first encapsulation layer 4 during the production process of the display panel 10, thereby further improving the etching reliability of the first encapsulation layer 4 and helping to improve the processing yield and process performance of the display panel 10.

[0057] It should be noted that the above-mentioned chamber 401 with an opening is enclosed by a packaging unit, and the orthographic projection of the chamber 401 on the substrate 1 is located within the orthographic projection of the isolation opening 201 on the substrate 1. During the film formation process of the packaging unit, the packaging material will be deposited on the surface of the isolation structure 2 and the light-emitting element 3, and part of the space located on the side of the isolation opening 201 close to the isolation structure 2 will be partially surrounded by the packaging material and form a cavity with an opening. As the deposition thickness of the packaging material gradually increases, the film layers constituting the cavity opening gradually approach, and the size of the opening gradually decreases, thereby hindering the further entry of the packaging material. Therefore, the first packaging layer 4 can eventually enclose a cavity with an opening, and the cavity is located outside the side wall of the isolation structure 2 close to the isolation opening 201. The second packaging layer 5 can make the opening closed by filling it at the opening. At this time, the cavity located on the side of the opening close to the isolation structure 2 is sealed.

[0058] Compared to the related structure in which the first encapsulation layer 4 is thickened so that the first encapsulation layer 4 forming the opening gradually approaches and connects to achieve sealing of the cavity 401, the second encapsulation layer 5 can effectively reduce the thickness of the first encapsulation layer 4, thereby reducing the amount of raw materials used to prepare the first encapsulation layer 4, helping to reduce production costs and increase production capacity while keeping the total amount of raw materials unchanged. At the same time, it can also help shorten the preparation time of the first encapsulation layer 4, thereby improving the preparation efficiency of the first encapsulation layer 4. In addition, if the first encapsulation layer 4 is too thick, it will increase the difficulty of etching it. During the etching process, not only will the etching accuracy be reduced, but it will also be more likely to produce etching residues and increase by-products. The possibility of encapsulation failure of the first encapsulation layer 4 will also increase, which in turn increases the probability of dark spots appearing on the display panel 10 to a certain extent, thereby increasing the possibility of dark spot failure of the display panel 10. When the thickness of the first encapsulation layer 4 is reduced, all of the above problems can be improved.

[0059] In this embodiment, the material of the second encapsulation layer 5 includes an organic material. The organic material has a certain degree of fluidity and viscosity, and can be firmly combined with the portion of the first encapsulation layer 4 enclosing the opening to achieve the sealing of the opening. In addition, the material of the second encapsulation layer 5 includes silicon. Specifically, the material of the second encapsulation layer 5 can include an organic silicon-containing material, such as hexamethyldisiloxane. (Hexamethyldisiloxane, HMDSO).

[0060] In this embodiment, the opening enclosed by the first packaging layer 4 is annular in structure, and accordingly, the cavity 401 connected to the opening is annular in structure. The second packaging layer 5 enclosing the cavity 401 through the opening is also annular in structure.

[0061] The chamber 401 is located on the side of the opening close to the substrate 1. Figure 5 Along a direction parallel to the plane of the substrate 1 , the chamber 401 is closer to the side of the isolation structure 2 facing the isolation opening 201 relative to the second encapsulation layer 5 .

[0062] Since the orthographic projection of the cavity 401 on the substrate 1 is located within the orthographic projection of the isolation opening 201 on the substrate 1 , at least part of the orthographic projection of the second encapsulation layer 5 on the substrate 1 is also located within the orthographic projection of the isolation opening 201 on the substrate 1 .

[0063] See also Figure 5 and Figure 6 , at this time, the orthographic outer contour of the second encapsulation layer 5 on the substrate 1 is connected to the orthographic outer contour of the chamber 401 on the substrate 1. It should be noted that being connected means that the orthographic projection of the second encapsulation layer 5 on the substrate 1 and the orthographic projection of the chamber 401 on the substrate 1 only touch each other in outline.

[0064] In the embodiment of the present application, along the opposite direction parallel to the plane where the substrate 1 is located, the end surface of the second encapsulation layer 5 pointing to the middle of the isolation opening 201 is at least partially concave, so that the end of the second encapsulation layer 5 close to the middle of the isolation opening 201 is a partially concave arc structure; correspondingly, at least part of the end surface of the second encapsulation layer 5 away from the middle of the isolation opening 201 is at least partially convex, so that the end of the second encapsulation layer 5 pointing to the chamber 401 is a partially convex arc structure.

[0065] See also Figure 5 and Figure 6 The isolation structure 2 is used to separate the light-emitting device layer, thereby constraining the light-emitting element 3 within the isolation opening 201. In a direction perpendicular to the plane of the substrate 1 (i.e., the Z direction), the isolation structure 2 formed between two adjacent isolation openings 201 has an overall cross-sectional shape similar to a rectangle or trapezoid. Alternatively, its cross-sectional shape can be "wide at the top and narrow at the bottom," i.e., an inverted trapezoid.

[0066] The isolation structure 2 can be a single-layer structure or a multi-layer structure.

[0067] In some embodiments, the isolation structure 2 is a stacked structure, comprising a first isolation portion 21 and a second isolation portion 22 arranged in a stacked manner, wherein the second isolation portion 22 is located on the side of the first isolation portion 21 facing away from the substrate 1. Figure 5 and Figure 6 , the orthographic projection of the first isolation portion 21 on the substrate 1 is located within the orthographic projection of the second isolation portion 22 on the substrate 1 .

[0068] Specifically, the isolation structure 2 further includes a third isolation portion 23, which is located on the side of the first isolation portion 21 facing away from the second isolation portion 22, that is, on the side of the first isolation portion 21 facing the substrate 1. The first isolation portion 21, the second isolation portion 22, and the third isolation portion 23 together form the aforementioned isolation opening 201, wherein the orthographic projection of the third isolation portion 23 on the substrate 1 is located within the orthographic projection of the second isolation portion 22 on the substrate 1, and the orthographic projection of the first isolation portion 21 on the substrate 1 is located within the orthographic projection of the third isolation portion 23 on the substrate 1.

[0069] Specifically, the orthographic projection of one end of the first isolation portion 21 near the second isolation portion 22 on the substrate 1 is located within the orthographic projection of one end of the first isolation portion 21 near the third isolation portion 23 on the substrate 1. In this case, the isolation structure 2 can form an undercut structure in which the portion near the substrate 1 is contracted toward the middle compared to the portion away from the substrate 1. This undercut structure can disconnect the film layer constituting the light-emitting element 3 at this point during the preparation of the display panel 10, thereby making the film layers within the two adjacent isolation openings 201 constitute independent film layers, so that different light-emitting elements 3 can be independently controlled. At the same time, the isolation structure 2 can also enable the display panel 10 to omit a mask when preparing the above film layers used to constitute the light-emitting element 3, thereby helping to reduce processing costs.

[0070] In some embodiments, the first isolation portion 21 located between the third isolation portion 23 and the second isolation portion 22 is a rectangular or trapezoidal structure.

[0071] Specifically, the first isolation portion 21 is a trapezoidal structure.

[0072] The side wall of the first isolation portion 21 close to the isolation opening 201 is offset in a direction away from the middle of the isolation opening 201 relative to the side wall of the second isolation portion 22 and the third isolation portion 23 close to the isolation opening 201, so as to further form an undercut structure between the first isolation portion 21 and the second isolation portion 22.

[0073] Of course, in other similar embodiments, the shape of the isolation structure 2 can also be adaptively adjusted according to processing requirements.

[0074] It should be noted that the material of the isolation structure 2 includes a conductive material, so that the light emitting elements 3 in adjacent isolation openings 201 can be electrically connected through the isolation structure 2 , thereby facilitating independent control of different light emitting elements 3 in the display panel 10 .

[0075] Specifically, the material of the second isolation portion 22 includes titanium, which is a titanium metal layer; the material of the first isolation portion 21 includes aluminum, which is an aluminum metal layer; and the material of the third isolation portion 23 includes molybdenum, which is a molybdenum metal layer.

[0076] See also Figure 5 and Figure 6The cavity 401 enclosed by the first encapsulation layer 4 is located on the side of the second isolation portion 22 facing the substrate 1, and is located outside the side of the first isolation portion 21 facing the isolation opening 201. The orthographic projection of the second encapsulation layer 5 on the substrate 1 at least partially overlaps with the orthographic projection of the second isolation portion 22 on the substrate 1. In some cases, the second encapsulation layer 5 is located exactly below the second isolation portion 22, and the orthographic projection of the second encapsulation layer 5 on the substrate 1 is within the orthographic projection of the second isolation portion 22 on the substrate 1 (including cases where the edges of the projections partially overlap). In some cases, the second encapsulation layer 5 is partially located below the second isolation portion 22 and partially located within the isolation opening 201. In this case, the orthographic projection of the second encapsulation layer 5 on the substrate 1 partially overlaps with the orthographic projection of the second isolation portion 22 on the substrate 1 (including cases where only the edges of the projections of the two partially overlap).

[0077] See also Figure 5 and Figure 6 The packaging unit includes a first packaging portion 41, a second packaging portion 42, and a third packaging portion 43. The first packaging portion 41 is located on the side of the light-emitting element 3 facing away from the substrate 1. The second packaging portion 42 is located on the side of the isolation structure 2 facing away from the substrate 1 and is suspended relative to the surface of the isolation structure 2 facing away from the substrate 1. The third packaging portion 43 is located on the side of the isolation structure 2 facing the isolation opening 201 and connects the first packaging portion 41 and the second packaging portion 42 to form a continuous packaging unit. The side of the third packaging portion 43 facing away from the isolation structure 2 is at least partially connected to the side of the first packaging portion 41 facing away from the substrate 1 to enclose and form the aforementioned cavity 401.

[0078] The second encapsulation layer 5 is located at the opening of the cavity 401 to seal the cavity 401. Therefore, the second encapsulation layer 5 can be connected to the third encapsulation portion 43 and the first encapsulation portion 41, respectively. It should also be noted that the orthographic projection of one end of the second encapsulation layer 5 near the middle of the isolation opening 201 on the substrate 1 and the orthographic projection of one end of the second encapsulation portion 42 near the middle of the isolation opening 201 on the substrate at least partially overlap or are close to each other.

[0079] In this embodiment, the material of the first encapsulation layer 4 includes an inorganic material, including silicon. For example, the material of the first encapsulation layer 4 includes at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The first encapsulation layer 4 can be formed by vapor deposition (e.g., chemical vapor deposition (CVD)) to effectively encapsulate the light-emitting element 3 located within the corresponding isolation opening 201.

[0080] During the film formation process of the first encapsulation layer 4, the encapsulation material constituting the first encapsulation layer 4 is gradually deposited and thickened on the surfaces of the isolation structure 2 and the light-emitting element 3 until the preparation is complete. During the deposition process, as the thickness of the deposited material gradually increases, the width of the opening gradually decreases, blocking the encapsulation material from entering the cavity. Therefore, the thickness of the first encapsulation layer 4 is not completely uniform, and the thickness of the film layer used to enclose the cavity is much thinner than the thickness of the film layers in other parts. Therefore, the thickness of the third encapsulation portion 43 is significantly thinner than the thickness of the first encapsulation portion 41 and the second encapsulation portion 42.

[0081] See also Figure 6 , it is defined that the first encapsulation portion 41 of the first encapsulation layer 4 has a fourth thickness, the second encapsulation portion 42 has a fifth thickness, and the third encapsulation portion 43 has a sixth thickness.

[0082] For example, the fourth thickness can be set to the maximum thickness of the first encapsulation portion 41, the fifth thickness can be set to the maximum thickness of the second encapsulation portion 42, and the sixth thickness can be set to the maximum thickness of the third encapsulation portion 43. In this case, the sixth thickness is less than either the fourth or fifth thicknesses. Similarly, the fourth thickness can be set to the average thickness of the first encapsulation portion 41, the fifth thickness can be set to the average thickness of the second encapsulation portion 42, and the sixth thickness can be set to the average thickness of the third encapsulation portion 43. In this case, the sixth thickness is less than either the fourth or fifth thicknesses.

[0083] Since the second packaging layer 5 is located at the opening formed by the first packaging part 41 and the third packaging part 43 , even if the packaging film layer forming the cavity 401 is thin, the packaging effect of the first packaging layer 4 on the light-emitting element 3 will not be reduced.

[0084] See also Figure 6 In this embodiment, the third encapsulation portion 43 includes a first sub-portion 431 and a second sub-portion 432 connected in sequence. The first sub-portion 431 covers the sidewall of the isolation structure 2 facing the isolation opening 201 and is connected to the end of the first encapsulation portion 41 pointing toward the isolation structure 2. The second sub-portion 432 connects the first sub-portion 431 and the second encapsulation portion 42. The second sub-portion 432 is arranged adjacent to and close to the first encapsulation portion 41. At this point, the opening described above is formed between the first encapsulation portion 41 and the second sub-portion 432. At least a portion of the second encapsulation layer 5 contacts the first encapsulation portion 41 and the second sub-portion 432 through the opening, thereby filling the opening and sealing the cavity 401.

[0085] Specifically, the distance between the second sub-portion 432 and the first packaging portion 41 may be set to be greater than or equal to 500 angstroms; and / or the distance between the second sub-portion 432 and the first packaging portion 41 may be set to be less than or equal to 1000 angstroms.

[0086] In this embodiment, the distance between the second sub-portion 432 and the first encapsulation portion 41 ranges from 500 angstroms to 1000 angstroms. Specifically, the distance between the second sub-portion 432 and the first encapsulation portion 41 can be any value, such as 500 angstroms, 600 angstroms, 700 angstroms, 800 angstroms, 900 angstroms, or 1000 angstroms. Accordingly, because the thickness of the second encapsulation layer 5 filling the opening is consistent with the size of the opening (i.e., the distance between the second sub-portion 432 and the first encapsulation portion 41), the thickness of the second encapsulation layer 5 is greater than or equal to 500 angstroms; and / or the thickness of the second encapsulation layer 5 is less than or equal to 1000 angstroms.

[0087] In order to control the spacing between the second sub-section 432 and the first encapsulation section 41 to meet the above requirements, in some embodiments, the maximum thickness of the first encapsulation layer 4 is set to the third thickness. The thickness of the first isolation section 21 is the first thickness, and the thickness of the second isolation section 22 is the second thickness. The relationship between the first thickness, the second thickness, and the third thickness satisfies the following formula: ; Among them, h1 is the first thickness, h2 is the second thickness, and h3 is the third thickness.

[0088] Compared with the related art, the thickness of the first encapsulation layer 4 is effectively reduced.

[0089] It should be noted that the first thickness refers to the distance between the side of the first isolation portion 21 facing the substrate 1 and the side facing away from the substrate 1 along the direction perpendicular to the plane of the substrate 1 (i.e., the Z direction); the second thickness refers to the distance between the side of the second isolation portion 22 facing the substrate 1 and the side facing away from the substrate 1 along the direction perpendicular to the plane of the substrate 1 (i.e., the Z direction).

[0090] In other similar embodiments, in order to prevent the opening formed between the second sub-portion 432 and the first encapsulation portion 41 from being too large, which would result in the second encapsulation layer 5 being unable to effectively seal the opening, the relationship among the first thickness, the second thickness, and the third thickness may be set to satisfy the following formula: .

[0091] The aforementioned thickness relationship also helps to reduce the possibility that the second encapsulation layer 5 only flows into the cavity 401 through its opening.

[0092] In combination with the foregoing, it can be seen that the thicknesses of the first encapsulation portion 41 and the second encapsulation portion 42 of the first encapsulation layer 4 are significantly greater than the thickness of the third encapsulation portion 43, and the maximum thickness of the first encapsulation portion 41 is the fourth thickness, and the maximum thickness of the second encapsulation portion 42 is the fifth thickness. Therefore, the third thickness can be the larger value between the fourth thickness and the fifth thickness, and the relationship among the third thickness, the fourth thickness, and the fifth thickness satisfies: , where the fourth thickness is h4 and the fifth thickness is h5.

[0093] Due to fluctuations in the manufacturing process, there may be a certain thickness difference between the fourth thickness and the fifth thickness.

[0094] The second encapsulation layer 5 is located at the opening of the cavity 401 and seals the cavity 401. Figure 5 and Figure 6 In this embodiment, the orthographic projection of the second encapsulation layer 5 on the substrate 1 is located within the orthographic projection of the first encapsulation layer 4 on the substrate 1. When the second encapsulation layer 5 is located only at the opening, the orthographic projection of the second encapsulation layer 5 on the substrate 1 exactly coincides with the orthographic projection of the opening on the substrate 1. When the second encapsulation layer 5 is partially attached to the surface of the first encapsulation layer 4 that is not enclosed to form the opening, the orthographic projection of the second encapsulation layer 5 on the substrate 1 at least partially coincides with the orthographic projection of the opening on the substrate 1.

[0095] This embodiment can achieve effective packaging of the light-emitting element 3 located in the isolation opening 201 through the packaging structure composed of the first packaging layer 4 and the second packaging layer 5, while also reducing the thickness of the packaging structure and optimizing the process performance.

[0096] The structure of the light emitting element 3 can be found in Figure 5 and Figure 6 .

[0097] In some embodiments, the light-emitting element 3 is a stacked structure, including a first electrode 31, a light-emitting functional layer 32 and a second electrode 33 arranged in a stacked manner. The second electrode 33 overlaps the side wall of the isolation structure 2 facing the isolation opening 201, that is, overlaps the third isolation portion 23 of the isolation structure 2.

[0098] Specifically, during actual processing, the second electrode 33 overlaps the third isolation portion 23 . Of course, there is also the possibility that part of the second electrode 33 extends along the side surface of the third isolation portion 23 facing away from the substrate 1 and overlaps the first isolation portion 21 .

[0099] The first electrode 31 may be an anode, and the second electrode 33 may be a cathode. The first electrode 31 is used to be connected to a pixel circuit so that the pixel circuit drives the light emitting element 3 to emit light.

[0100] The light-emitting functional layer 32 can be a laminated structure made of organic small molecule light-emitting materials, complex light-emitting materials, and high molecular polymers. For example, the light-emitting functional layer 32 may include a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL. One light-emitting functional layer 32 may include a single light-emitting material layer EML, or may include multiple light-emitting material layers EML arranged in a stacked arrangement. Different light-emitting functional layers 32 can be used to emit light of different colors. Generally speaking, there are three light-emitting functional layers 32, each used to emit red, green, and blue light, respectively.

[0101] In some embodiments, the display panel 10 further includes a pixel definition layer 6, which is located between the substrate 1 and the isolation structure 2. The pixel definition layer 6 has a plurality of pixel openings 601 formed therein. The pixel openings 601 correspond to and communicate with the isolation openings 201. The orthographic projections of the pixel openings 601 on the substrate 1 are located within the orthographic projections of the isolation openings 201 on the substrate 1. The light-emitting elements 3 are disposed in a one-to-one correspondence with the pixel openings 601.

[0102] Specifically, the first electrode 31 in the light-emitting element 3 is located between the substrate 1 and the pixel definition layer 6, at least part of the surface of the first electrode 31 facing away from the substrate 1 is exposed through the pixel opening 601, the light-emitting functional layer 32 covers the pixel opening 601 and contacts the first electrode 31, and the second electrode 33 covers the surface of the light-emitting functional layer 32 facing away from the substrate 1 and overlaps with the side wall of the isolation structure 2 facing the isolation opening 201 to achieve electrical connection.

[0103] The pixel opening 601 exposes the first electrode 31 of the light emitting element 3 and can be used to define a pixel area.

[0104] Specifically, the pixel definition layer 6 is made of an inorganic material, which can prevent moisture formed in the film layer such as the substrate 1 from corroding the light-emitting element 3 located on the side of the pixel definition layer 6 facing away from the substrate 1, thereby helping to improve the reliability of the display panel 10.

[0105] See also Figure 7 , an array substrate is also included between the substrate 1 and the pixel definition layer 6. The array substrate is a functional thin film structure prepared on the substrate 1, mainly including a thin film transistor (TFT) array and a driving circuit, which is used to control the switching, current size and light-emitting state of different light-emitting elements 3 in the display panel 10, so as to cooperate with the light-emitting elements to realize the image display function of the display panel 10. The array substrate includes a pixel circuit layer and a planarization layer 8. The pixel circuit layer includes pixel circuits for driving the light-emitting elements 3 to emit light. Please refer to Figure 7 , Figure 7The transistor 7 in the pixel circuit is drawn in the figure. A via is provided in the planarization layer 8. The first electrode 31 in the light-emitting element 3 can be electrically connected to the transistor 7 in the pixel circuit layer through the via. In addition, the pixel circuit layer also includes at least one insulating layer, which can include at least one of an inorganic layer and an organic layer. In addition, scan lines that provide scan signals Scan and data lines that provide data signals Data to the pixel circuit are also included between the substrate 1 and the pixel definition layer 6.

[0106] See also Figure 8 The pixel circuit includes a driving transistor T1 and a data transistor T2. The source of the data transistor T2 is connected to a data line providing a data signal Data, the gate of the data transistor T2 is connected to a scan line providing a scan signal Scan, the drain of the data transistor T2 is connected to the gate of the driving transistor T1, the two ends of the storage capacitor C1 are respectively connected to the gate and source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light emitting element 3. It should be noted that Figure 8 This is only one embodiment of the pixel circuit in the embodiment of the present application. The pixel circuit that the embodiment of the present application may have is not limited to Figure 8 The 2T1C pixel circuit shown may also be other pixel circuits, such as a 7T1C, 8T1C pixel circuit, etc.

[0107] See also Figure 3 and Figure 4 The isolation structure 2 encloses a plurality of isolation openings 201. The isolation openings 201 are arranged in a one-to-one correspondence with the light-emitting elements 3, and at least a portion of the light-emitting element 3 is located within the corresponding isolation opening 201. The light-emitting elements 3 arranged corresponding to the isolation openings 201 have different luminous colors. According to the different luminous colors, the plurality of light-emitting elements 3 are provided with a first element R, a second element G, and a third element B having different luminous colors. Accordingly, the plurality of isolation openings 201 are provided to include a first opening 201a, a second opening 201b, and a third opening 201c. The plurality of light-emitting elements 3 are located on one side of the substrate 1 and are confined within the first opening 201a, the second opening 201b, and the third opening 201c, respectively. The first opening 201a is used to accommodate the first element R, the second opening 201b is used to accommodate the second element G, and the third opening 201c is used to accommodate the third element B.

[0108] In some embodiments, the light emission wavelength of the first element R and the light emission wavelength of the second element G are both defined to be greater than the light emission wavelength of the third element B. For example, the light emitted by the third element B can be set to be blue.

[0109] In some embodiments, the light emission wavelength of the first element R is defined to be greater than the light emission wavelength of the second element G. For example, the light emitted by the first element R can be set to be red, and the light emitted by the second element G can be set to be green.

[0110] One or more of the three different light emitting elements 3 can be arranged in different isolation openings 201 according to design requirements. In a direction parallel to the plane of the substrate 1, at least two adjacent light emitting elements 3 have different emission wavelengths.

[0111] When packaging different light emitting elements 3 , the different light emitting elements 3 may adopt the same packaging structure or different packaging structures.

[0112] In some embodiments, the second encapsulation layer 5 is disposed in at least two of the first opening 201 a , the second opening 201 b , and the third opening 201 c .

[0113] See also Figure 9 In this case, the first encapsulation layer 4 is disposed at all isolation openings 201. The second encapsulation layer 5 is disposed within both the first opening 201a and the second opening 201b, but no second encapsulation layer 5 is disposed within the third opening 201c. The second encapsulation layer 5 is disposed corresponding to the first opening 201a and the second opening 201b. The orthographic projection of the second encapsulation layer 5 on the substrate 1 is within the range covered by the union of the orthographic projections of the first opening 201a and the second opening 201b on the substrate 1. In other words, the second encapsulation layer 5 is distributed within the first opening 201a and the second opening 201b.

[0114] Alternatively, in other similar embodiments, the second packaging layer 5 may be provided in the first opening 201a and the third opening 201c, while the second packaging layer 5 is not provided in the second opening 201b; or the second packaging layer 5 may be provided in the second opening 201b and the third opening 201c, while the second packaging layer 5 is not provided in the first opening 201a.

[0115] In other embodiments, the first encapsulation layer 4 and the second encapsulation layer 5 may be provided at all the isolation openings 201 , see Figure 10 At this time, the second encapsulation layer 5 is arranged corresponding to the first opening 201a, the second opening 201b and the third opening 201c, and the orthographic projection of the second encapsulation layer 5 on the substrate 1 is located within the range covered by the union of the orthographic projection areas of the first opening 201a, the second opening 201b and the third opening 201c on the substrate 1.

[0116] In some embodiments, the display panel 10 further includes a third encapsulation layer and a fourth encapsulation layer. The third encapsulation layer is located on the side of the first encapsulation layer 4 and the second encapsulation layer 5 facing away from the substrate 1 , and the fourth encapsulation layer is located on the side of the third encapsulation layer facing away from the substrate 1 .

[0117] Specifically, at least a portion of the third encapsulation layer is located within the isolation opening 201 to fill the isolation opening 201 , and a portion of the third encapsulation layer is located between the suspended second encapsulation portion 42 of the first encapsulation layer 4 and the isolation structure 2 .

[0118] The third encapsulation layer material includes an organic polymer (such as polyimide, acrylic resin, etc.).

[0119] The third encapsulation layer, made of an organic material, can be produced using techniques such as IJP (Ink Jet Printing). Part of the third encapsulation layer can flow into the isolation opening 201, thereby filling the isolation opening 201 and improving the flatness of the display panel 10 while also providing some protection for the underlying film layers.

[0120] The surface of the third encapsulation layer facing away from the substrate 1 is a flat surface, and the fourth encapsulation layer is located on the side of the third encapsulation layer facing away from the substrate 1 .

[0121] Specifically, the material of the fourth encapsulation layer may be the same as that of the first encapsulation layer 4 , for example, may be made of an inorganic material.

[0122] The display panel 10 may further include at least one film layer such as a touch layer, a polarizer, a color filter substrate, a protective cover, etc. The above film layers may also be bonded to the display panel 10 via an adhesive layer such as an OCA (Optical Clear Adhesive).

[0123] It is understood that the display panel 10 provided in the embodiment of the present application can achieve effective sealing of the cavity 401 enclosed by the first encapsulation layer 4 through the second encapsulation layer 5 located on the side of the first encapsulation layer 4 facing away from the substrate 1, thereby achieving a thinner thickness of the first encapsulation layer 4 without affecting the packaging reliability of the packaging structure, thereby achieving the effect of reducing the processing cost of the first encapsulation layer 4 and improving the production capacity of the first encapsulation layer 4. In addition, the thinning of the first encapsulation layer 4 also helps to reduce the difficulty of etching the first encapsulation layer 4 in subsequent processes and helps improve etching reliability, thereby further optimizing the process performance of the display panel 10 and ultimately achieving the purpose of improving the display reliability and processing yield of the display panel 10.

[0124] Based on the same inventive concept, in a second aspect, the present application embodiment further provides a method for preparing a display panel 10, see Figure 11 .

[0125] The preparation method comprises: Step S1: Prepare an isolation structure 2 on one side of the substrate 1. The isolation structure 2 encloses a plurality of isolation openings 201. Figure 12A ; Step S2: Prepare the light emitting element 3 in the isolation opening 201. Figure 12B ; Step S3: Prepare a first packaging material layer 4' on the side of the light emitting element 3 facing away from the substrate 1. The first packaging material layer 4' encloses a cavity 401 with an opening. Figure 12C ; Step S4 , forming a second encapsulation layer 5 on the side of the first encapsulation material layer 4 ′ facing away from the substrate 1 , wherein at least a portion of the second encapsulation layer 5 is located at the opening to seal the cavity 401 .

[0126] In the preparation method of the display panel 10 provided in the embodiment of the present application, the cavity 401 enclosed by the first packaging material layer 4' can be effectively sealed by preparing a second packaging layer 5 on the side of the first packaging material layer 4' facing away from the substrate 1, thereby achieving thinning of the first packaging layer 4 while ensuring the packaging reliability of the packaging structure, thereby improving the process performance of the display panel 10 and reducing the production cost of the display panel 10 to a certain extent, ultimately achieving the purpose of improving the reliability of the display panel 10 and improving the yield of the display panel 10.

[0127] In some embodiments, the above step S4, forming the second encapsulation layer 5 on the side of the first encapsulation material layer 4' facing away from the substrate 1, includes: Step S41: prepare a second packaging material layer 5' on the side of the first packaging material layer 4' facing away from the substrate 1, see Figure 12D ; Step S42: Patterning the second packaging material layer 5' to form a second packaging layer 5 at least partially located at the opening. Figure 12E .

[0128] Since the second packaging material layer 5 ′ prepared in step S41 is a whole layer, it needs to be patterned in step S42 to obtain a second packaging layer 5 whose distribution range meets the design requirements.

[0129] In step S42 , the second packaging material layer 5 ′ is patterned, including: applying a reactive gas to perform a plasma etching process on the second packaging material layer 5 ′.

[0130] Plasma etching is a technology that uses plasma (i.e., a substance partially or completely ionized into an ionic state under high temperature, strong electric field or laser action) to etch materials. By changing the parameters of the plasma, such as gas composition, power, pressure, etc., the plasma can have etching ability, which can remove thin film materials deposited on the surface of certain substrates or perform patterning processing on them.

[0131] In this embodiment, the reaction gas used in the plasma etching process includes a fluorine-containing gas.

[0132] It should be noted that step S4 can be implemented by the same device, that is, the same device is used to sequentially perform step S41 and step S42 to achieve the preparation and patterning of the second packaging material layer 5 ′.

[0133] In some embodiments, a device with a vapor deposition function may be configured to perform the above step S4. Of course, the device may also be used to perform step S3.

[0134] For example, the device may use a plasma enhanced chemical vapor deposition (PECVD) process to prepare the second packaging material layer 5 ′, and then use an in-situ etching method to etch the prepared second packaging material layer 5 ′ to obtain the second packaging layer 5 .

[0135] Specifically, PECVD utilizes plasma to enhance chemical reactions, promoting chemical reactions of gaseous substances on the substrate surface and depositing them into thin films. During the PECVD process, reactive gases are ionized to form plasma through methods such as radio frequency. The high-energy particles in the plasma activate the reactive gas molecules, making them more susceptible to chemical reactions. This allows for thin film deposition at relatively low temperatures, ultimately forming the second encapsulation material layer 5'.

[0136] After the second packaging material layer 5' is prepared, the prepared product is not removed from the same equipment as the PECVD thin film deposition. Instead, the plasma parameters are changed to enable the plasma to have etching ability, thereby removing the thin film material (second packaging material layer 5') deposited on the surface of the first packaging material layer 4', thereby achieving in-situ etching processing.

[0137] This in-situ etching technology can avoid contamination that may be introduced when samples are transferred between different devices, and can precisely control the deposition and etching processes of the thin film, achieving fine control of the film thickness, shape and structure.

[0138] It should be noted that the prepared second packaging material layer 5' is partially located at the opening and fills the opening, and partially adheres to the surface of the film layer of the first packaging material layer 4' that is not enclosed to form the cavity 401. When the second packaging material layer 5' is subjected to in-situ etching, the second packaging material layer 5' located at the opening will not be etched away or only the exposed portion of the film layer will be thinned, while the second packaging material layer 5' attached to the other half will be removed under the plasma etching process, thereby obtaining the following: Figure 12E The second encapsulation layer 5 is shown.

[0139] Since the first packaging material layer 4' and the related film layers for constituting the light emitting element 3 are prepared as a whole layer, the related film layers constituting the light emitting element 3 and the first packaging material layer 4' are distributed in the plurality of isolation openings 201, and some of the film layers need to be removed.

[0140] In some embodiments, after step S4 is completed, the preparation method further includes: Step S5: Patterning the first packaging material layer 4' to form the first packaging layer 4. Figure 12F .

[0141] Taking the display panel 10 structure described above as an example, the multiple isolation openings 201 of the display panel 10 include a first opening 201a, a second opening 201b and a third opening 201c, and the multiple light-emitting elements 3 include a first element R, a second element G and a third element B with different luminous colors. The first opening 201a is used to accommodate the first element R, the second opening 201b is used to accommodate the second element G, and the third opening 201c is used to accommodate the third element B.

[0142] It should be noted that the following only takes the order of the first element R, the second element G and the third element B as an example to illustrate the manufacturing process of the display panel 10, and is not intended to limit the actual manufacturing order.

[0143] When manufacturing the first element R, since the film layers (light-emitting functional layer 32 and second electrode 33) and the first packaging material layer 4' of the first element R are all prepared as a whole layer, the plurality of first openings 201a, the plurality of second openings 201b and the plurality of third openings 201c are all provided with the above film layers, and the surface of the isolation structure 2 facing away from the substrate 1 is also provided with the above film layers. The product structure obtained after step S4 is completed is shown in FIG. Figure 12E .

[0144] In step S5 , dry etching technology can be applied to pattern the first packaging material layer 4 ′ using a photoresist pattern as a mask to remove the first packaging material layer 4 ′ located at the second opening 201 b and the third opening 201 c to obtain the first packaging layer 4 .

[0145] During the above etching, the light-emitting functional layer 32 and the second electrode 33 located in the second opening 201b, the third opening 201c and the isolation structure 2 on the side facing away from the substrate 1 lose the protection of the first packaging material layer 4' and are also etched away, thereby obtaining a first element R located only in the first opening 201a and protected by the first packaging layer 4 and the second packaging layer 5.

[0146] Based on the above steps, by repeating the operations, the light-emitting functional layer 32 and the second electrode 33 of the second element G, as well as the first encapsulation layer 4 for encapsulating the second element G, can be respectively disposed at the locations of the plurality of second openings 201b; and the light-emitting functional layer 32 and the third electrode of the third element B, as well as the first encapsulation layer 4 for encapsulating the third element B, can be disposed at the locations of the plurality of third openings 201c. Of course, during the above processing, the second encapsulation layer 5 can be disposed corresponding to at least one of the first opening 201a, the second opening 201b, and the third opening 201c.

[0147] For example, when only the packaging structure of the first component R includes both the first packaging layer 4 and the second packaging layer 5, and the packaging structures corresponding to the second component G and the third component B do not include the second packaging layer 5, the manufacturing process of the display panel 10 is as follows: Step S01 , preparing a first element R in the isolation opening 201 . Here, the light-emitting functional layer 32 and the second electrode 33 of the first element R are simultaneously distributed in the first opening 201 a , the second opening 201 b , the third opening 201 c and the side of the isolation structure 2 facing away from the substrate 1 .

[0148] Step S02 : preparing a first packaging material layer 4 ′ on the side of the first component R facing away from the substrate 1 . The first packaging material layer 4 ′ encloses a cavity 401 with an opening. The first packaging material layer 4 ′ covers the light-emitting functional layer 32 and the second electrode 33 and is prepared as a whole layer.

[0149] Step S03 : preparing a second packaging layer 5 on the side of the first packaging material layer 4 ′ facing away from the substrate 1 . At least a portion of the second packaging layer 5 is located at the opening to seal the cavity 401 . For details, please refer to the aforementioned step S4 .

[0150] Step S04: Patterning the first packaging material layer 4' to form a first packaging layer 4 corresponding to the first opening 201a. For the specific operation method, please refer to the above-mentioned step S5. At this time, a product can be obtained in which the first component R, the first packaging layer 4 and the second packaging layer 5 are only arranged in the first opening 201a.

[0151] Then, step S05 is continued to prepare the second element G in the isolation opening 201. At this time, the light-emitting functional layer 32 and the second electrode 33 of the second element G are simultaneously distributed in the first opening 201a, the second opening 201b, the third opening 201c and the side of the isolation structure 2 facing away from the substrate 1.

[0152] Step S06: Prepare a first encapsulation material layer 4' on the side of the second component G facing away from the substrate 1. The first encapsulation material layer 4' covers the light-emitting functional layer 32 and the second electrode 33 and is prepared as a single layer. The resulting first encapsulation material layer 4' can enclose a cavity 401 with an opening or a closed cavity 401.

[0153] Step S07: The first packaging material layer 4' is patterned to form a first packaging layer 4 arranged corresponding to the second opening 201b. At this time, a product in which the second element G and the first packaging layer 4 are arranged in the second opening 201b can be obtained. At the same time, the first element R, the first packaging layer 4 and the second packaging layer 5 located in the first opening 201a can be retained under the protection of the relevant film layers (part of the first packaging material layer 4', part of the light-emitting functional layer 32 and the second electrode 33 constituting the second element G) removed in step S07.

[0154] Then, step S08 is continued to prepare a third element B in the isolation opening 201 . At this time, the light-emitting functional layer 32 and the second electrode 33 of the third element B are simultaneously distributed in the first opening 201 a , the second opening 201 b , the third opening 201 c and the side of the isolation structure 2 facing away from the substrate 1 .

[0155] Step S09: Form a first encapsulation material layer 4' on the side of the third component B facing away from the substrate 1. The first encapsulation material layer 4' covers the light-emitting functional layer 32 and the second electrode 33 and is formed as a single layer. The resulting first encapsulation material layer 4' can enclose a cavity 401 with an opening or a closed cavity 401.

[0156] Step S010: The first packaging material layer 4' is patterned to form a first packaging layer 4 arranged corresponding to the third opening 201c. At this time, a product in which the third element B and the first packaging layer 4 are arranged in the third opening 201c can be obtained. At the same time, the first element R, the first packaging layer 4 and the second packaging layer 5 located in the first opening 201a and the second element G and the first packaging layer 4 located in the second opening 201b can be retained under the protection of the relevant film layers (part of the first packaging material layer 4', part of the light-emitting functional layer 32 and the second electrode 33 constituting the third element B) removed in step S010.

[0157] For example, when only the packaging structure of the second component G includes both the first packaging layer 4 and the second packaging layer 5, and the packaging structures corresponding to the first component R and the third component B do not include the second packaging layer 5, the above preparation process can be adjusted as follows: Step S03 is adjusted to between step S06 and step S07 , and the parameters of step S06 can be adjusted at the same time, so that the prepared first packaging material layer 4 ′ can enclose and form a cavity 401 with an opening.

[0158] In addition, the parameters of step S02 can be adjusted so that the prepared first packaging material layer 4 ′ can enclose a cavity 401 with an opening or a closed cavity 401 .

[0159] For example, when only the packaging structure of the third component B includes both the first packaging layer 4 and the second packaging layer 5, and the packaging structures corresponding to the first component R and the second component G do not include the second packaging layer 5, the above preparation process can be adjusted as follows: Step S03 is adjusted to between step S09 and step S010 , and the parameters of step S09 can be adjusted at the same time, so that the prepared first packaging material layer 4 ′ can enclose and form a cavity 401 with an opening.

[0160] In addition, the parameters of step S02 can be adjusted so that the prepared first packaging material layer 4 ′ can enclose a cavity 401 with an opening or a closed cavity 401 .

[0161] For example, when the packaging structure corresponding to the first component R and the second component G includes both the first packaging layer 4 and the second packaging layer 5, and the packaging structure corresponding to the third component B does not include the second packaging layer 5, the above preparation process can be adjusted as follows: After step S06 is completed, step S03 is repeated, and after step S03 is repeated, step S07 is continued. Parameters of step S06 can be adjusted so that the prepared first packaging material layer 4' can enclose a cavity 401 with an opening.

[0162] For example, when the packaging structures corresponding to the first component R and the third component B include both the first packaging layer 4 and the second packaging layer 5, and the packaging structure corresponding to the second component G does not include the second packaging layer 5, the above preparation process can be adjusted as follows: After step S09 is completed, step S03 is repeated, and after step S03 is repeated, step S010 is continued. Parameters of step S09 can be adjusted so that the prepared first packaging material layer 4' can enclose a cavity 401 with an opening.

[0163] For example, when the packaging structures corresponding to the second component G and the third component B include both the first packaging layer 4 and the second packaging layer 5, and the packaging structure corresponding to the first component R does not include the second packaging layer 5, the above preparation process can be adjusted as follows: First, step S03 is adjusted to between step S06 and step S07 , and the parameters of step S06 can be adjusted at the same time, so that the prepared first packaging material layer 4 ′ can enclose and form a cavity 401 with an opening.

[0164] Next, after step S09 is completed, step S03 is repeated, and after step S03 is repeated, step S010 is continued. Parameters of step S09 can be adjusted so that the prepared first packaging material layer 4' can enclose a cavity 401 with an opening.

[0165] At this time, the parameters of step S02 may be adjusted so that the prepared first packaging material layer 4 ′ can enclose a cavity 401 with an opening or a closed cavity 401 .

[0166] After the first element R, the second element G, and the third element B are prepared and packaged in sequence, the third packaging layer, the fourth packaging layer, and other film layers may be prepared.

[0167] It can be understood that the preparation method of the display panel 10 provided in the embodiment of the present application can prepare a display panel 10 with high packaging reliability, and at the same time can reduce the processing cost of the display panel 10 to a certain extent, and realize the usage and thickness of the photoresist in the patterning process by thinning the thickness of the first packaging layer 4, thereby improving the etching reliability of the photoresist by reducing the risk of photoresist peeling and reducing the difficulty of the patterning process.

[0168] Based on the same inventive concept, in a third aspect, the present application embodiment further provides a display device 100, see Figure 13 The display device 100 includes any of the display panels 10 described above, or includes the display panel 10 manufactured by any of the manufacturing methods described above.

[0169] The display device 100 provided in this embodiment can be a product or component with display function, such as a mobile phone, a desktop computer, a laptop computer, a tablet computer, a car display, a wearable device (such as a smart watch, a smart bracelet), etc. Since the display panel 10 in the display device 100 has the beneficial effects of any one or more of the above-mentioned display panels 10, the specific effects are referred to the specific description in the aforementioned embodiments and will not be repeated here.

[0170] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0171] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; The display device layer includes a plurality of light-emitting elements, wherein the light-emitting elements are confined within the corresponding isolation openings; a first encapsulation layer comprising a plurality of encapsulation units arranged corresponding to the isolation openings, wherein at least a portion of the encapsulation units are located on a side of the light-emitting element facing away from the substrate; a second packaging layer located in the isolation opening and in contact with a portion of a surface of at least a portion of the packaging unit facing away from the substrate; The packaging unit is arranged in the isolation opening in contact with the isolation structure and is surrounded to form a cavity having an opening and communicating with the opening. At least a portion of the second packaging layer is located at the opening to seal the cavity.

2. The display panel according to claim 1, wherein: The material of the first encapsulation layer includes an inorganic material, the material of the second encapsulation layer includes an organic material, and both the first encapsulation layer and the second encapsulation layer include silicon.

3. The display panel according to claim 1, wherein: The orthographic projection of the second encapsulation layer on the substrate is located within the orthographic projection of the first encapsulation layer on the substrate; An orthographic projection outer contour of the second encapsulation layer on the substrate is connected to an orthographic projection outer contour of the cavity on the substrate; The orthographic projection of the second encapsulation layer on the substrate at least partially overlaps with the orthographic projection of the opening on the substrate, or the orthographic projection of the second encapsulation layer on the substrate exactly overlaps with the orthographic projection of the opening on the substrate.

4. The display panel according to claim 1, wherein: Along a direction parallel to the plane where the substrate is located, the chamber is an annular structure close to the isolation structure and facing the isolation opening, and the second encapsulation layer is an annular structure and is located on a side of the chamber away from the isolation structure; And / or, along a direction parallel to the plane of the substrate, one end of the second encapsulation layer pointing to the middle of the isolation opening has an at least partially concave surface, and the second encapsulation layer away from the middle of the isolation opening has an at least partially convex surface.

5. The display panel according to claim 1, wherein: The packaging unit includes: a first packaging portion, located on a side of the light-emitting element facing away from the substrate; a second packaging portion, located on a side of the isolation structure facing away from the substrate; a third encapsulation portion, located on a side of the isolation structure facing the isolation opening and connecting the first encapsulation portion and the second encapsulation portion, wherein a side of the first encapsulation portion facing away from the substrate and a side of the third encapsulation portion facing away from the isolation structure are at least partially connected to each other to enclose and form the cavity; The second encapsulation layer has a side facing the substrate in contact with the first encapsulation portion, and a side facing away from the substrate in contact with the third encapsulation portion; Along a direction perpendicular to the plane where the substrate is located, the second packaging portion is spaced apart from a surface of the isolation structure facing away from the substrate.

6. The display panel according to claim 5, wherein: The third packaging portion includes a first sub-portion and a second sub-portion connected in sequence, the first sub-portion covering the side wall of the isolation structure facing the isolation opening and connected to an end of the first packaging portion pointing to the isolation structure, and the second sub-portion connecting the first sub-portion and the second packaging portion; The second sub-section is arranged adjacent to the first encapsulation section, the opening is located between the first encapsulation section and the second sub-section, and at least a portion of the second encapsulation layer contacts the first encapsulation section and the second sub-section through the opening; A distance between the second sub-portion and the first encapsulation portion is greater than or equal to 500 angstroms; A distance between the second sub-portion and the first encapsulation portion is less than or equal to 1000 angstroms.

7. The display panel according to claim 5, wherein: The isolation structure includes a first isolation portion and a second isolation portion arranged in a stacked manner, wherein the second isolation portion is located on a side of the first isolation portion facing away from the substrate, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate; In a direction perpendicular to the plane of the substrate, the thickness of the first isolation portion is a first thickness, the thickness of the second isolation portion is a second thickness, the maximum thickness of the first encapsulation layer is a third thickness, and the relationship between the first thickness, the second thickness, and the third thickness satisfies: ； Wherein, h1 is the first thickness, h2 is the second thickness, and h3 is the third thickness.

8. The display panel according to claim 7, wherein: The relationship between the first thickness, the second thickness and the third thickness satisfies: .

9. The display panel according to claim 7, wherein: The chamber is located on a side of the second isolation portion facing the substrate, and an orthographic projection of the second encapsulation layer on the substrate at least partially overlaps with an orthographic projection of the second isolation portion on the substrate; The orthographic projection of the opening on the substrate and the orthographic projection of the second isolation portion on the substrate are arranged to be spaced apart from each other, or to have their edges overlapped; Along a direction perpendicular to the plane where the substrate is located, at least a portion of a surface of the second encapsulation layer on a side facing away from the substrate is higher than or flush with the second isolation portion.

10. The display panel according to claim 7, wherein: The isolation structure further includes a third isolation portion, the third isolation portion is located on a side of the first isolation portion facing the substrate, and the first isolation portion, the second isolation portion, and the third isolation portion enclose the isolation opening; The orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate; An orthographic projection of one end of the first isolation portion close to the second isolation portion on the substrate is located within an orthographic projection of one end of the first isolation portion close to the third isolation portion on the substrate.

11. The display panel according to claim 7, wherein: The first encapsulation portion has a fourth thickness, the second encapsulation portion has a fifth thickness, and the third encapsulation portion has a sixth thickness, the sixth thickness being smaller than either the fourth thickness or the fifth thickness; The relationship between the third thickness, the fourth thickness and the fifth thickness satisfies: ； Among them, h4 is the fourth thickness, and h5 is the fifth thickness.

12. The display panel according to any one of claims 1 to 11, characterized in that: The light emitting element comprises a first element, a second element and a third element having different luminous colors, the isolation opening comprises a first opening, a second opening and a third opening, the first opening is used to accommodate the first element, the second opening is used to accommodate the second element, and the third opening is used to accommodate the third element; The second encapsulation layer is disposed in at least one of the first opening, the second opening, and the third opening; or the second encapsulation layer is disposed in at least two of the first opening, the second opening, and the third opening.

13. The display panel according to any one of claims 1 to 11, characterized in that: The light-emitting element includes a first electrode, a light-emitting functional layer, and a second electrode that are stacked.

14. The display panel according to claim 13, wherein: The display panel further includes a pixel definition layer, the pixel definition layer is located between the substrate and the isolation structure, the pixel definition layer is provided with a plurality of pixel openings, and the pixel openings expose the first electrode of the light emitting element; The pixel opening is correspondingly arranged and connected to the isolation opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

15. A method for preparing a display panel, characterized in that: The preparation method comprises: preparing an isolation structure on one side of the substrate, wherein the isolation structure encloses a plurality of isolation openings; preparing a light-emitting element in the isolation opening; preparing a first packaging material layer on a side of the light-emitting element facing away from the substrate, wherein the first packaging material layer encloses a cavity having an opening; A second packaging layer is prepared on a side of the first packaging material layer facing away from the substrate, wherein at least a portion of the second packaging layer is located at the opening to seal the cavity.

16. The method for manufacturing a display panel according to claim 15, wherein: The step of preparing a second encapsulation layer on the side of the first encapsulation material layer facing away from the substrate comprises: preparing a second packaging material layer on a side of the first packaging material layer facing away from the substrate; The second packaging material layer is patterned to form the second packaging layer at least partially located at the opening.

17. The method for manufacturing a display panel according to claim 16, wherein: The step of patterning the second packaging material layer includes: performing plasma etching on the second packaging material layer using a reactive gas; The reaction gas used in the plasma etching process includes a fluorine-containing gas; And / or, the step of preparing the second encapsulation layer on the side of the first encapsulation material layer facing away from the substrate is implemented by the same equipment.

18. The method for manufacturing a display panel according to claim 15, wherein: After the second encapsulation layer is prepared, the preparation method further includes: The first packaging material layer is patterned to form a first packaging layer.

19. The method for manufacturing a display panel according to claim 18, wherein: The light emitting element comprises a first element, a second element and a third element having different luminous colors, the isolation opening comprises a first opening, a second opening and a third opening, the first opening is used to accommodate the first element, the second opening is used to accommodate the second element, and the third opening is used to accommodate the third element; The step of preparing a light-emitting element in the isolation opening includes: preparing the first element in the isolation opening; preparing a first packaging material layer on a side of the first component facing away from the substrate, wherein the first packaging material layer encloses a cavity having an opening; preparing a second encapsulation layer on a side of the first encapsulation material layer facing away from the substrate, wherein at least a portion of the second encapsulation layer is located at the opening to seal the cavity; Performing patterning on the first packaging material layer to form the first packaging layer corresponding to the first opening; preparing the second element in the isolation opening; preparing the first packaging material layer on a side of the second component facing away from the substrate, wherein the first packaging material layer encloses a cavity having an opening; preparing a second encapsulation layer on a side of the first encapsulation material layer facing away from the substrate, wherein at least a portion of the second encapsulation layer is located at the opening to seal the cavity; Performing patterning on the first packaging material layer to form the first packaging layer corresponding to the second opening; preparing the third element in the isolation opening; Or, also include: preparing the first packaging material layer on a side of the second component facing away from the substrate; Performing patterning on the first packaging material layer to form the first packaging layer corresponding to the second opening; The third element is prepared in the isolation opening.

20. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 14, or the display panel prepared by the preparation method according to any one of claims 15 to 19.

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