Display device and method of manufacturing same

Abstract

A display device and a method of manufacturing the same are disclosed. The display device includes: a display panel including one surface on which a screen is defined and an opposite surface positioned opposite the one surface; a first bonding target in a first region of the opposite surface; and a first resin layer between the first bonding target and the opposite surface, and covering at least a portion of a side surface of the first bonding target.

Description

[0001] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2024-0031525, filed on March 5, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] One or more embodiments relate to a display device and a method of manufacturing the display device, and more particularly, to a display device and a method of manufacturing the display device for preventing damage due to pressure applied when a certain component is attached to a display panel. Background Art

[0003] A display device is a device that receives information about an image and displays the image. The display device is sometimes used as a display unit for small-sized products such as mobile phones, and is also used as a display unit for large-sized products such as televisions.

[0004] A display device typically includes a plurality of pixels that receive electrical signals and emit light to display an image externally. Each pixel may include a light-emitting device. For example, in the case of an organic light-emitting display device, each pixel includes an organic light-emitting diode (OLED) as a light-emitting device. Generally speaking, in an organic light-emitting display device, a thin film transistor and an OLED are formed on a substrate, and the OLED operates by self-emitting light.

[0005] The display device may include a display panel, and various components may be attached to the rear surface of the display panel. Generally, an adhesive layer is used to attach the various components, and a pressurizing process is performed to attach the components by using the adhesive layer. Summary of the Invention

[0006] One or more embodiments include a display device and a method of manufacturing a display device to prevent damage caused by pressure applied when a component is attached to a display panel. However, this is exemplary and does not limit the scope of the present disclosure.

[0007] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0008] According to one or more embodiments, a display device includes: a display panel, including a surface on which a screen is defined and an opposite surface positioned opposite to the one surface; a first bonding target located in a first area of ​​the opposite surface; and a first resin layer located between the first bonding target and the opposite surface and covering at least a portion of a side surface of the first bonding target.

[0009] In one embodiment, the display device may further include a first upper resin layer disposed on the first resin layer and covering at least a portion of an upper surface of the first bonding target.

[0010] In one embodiment, when viewed in a direction perpendicular to the opposite surface, an area of ​​the first resin layer may be larger than an area of ​​the first bonding target.

[0011] In one embodiment, the display device may further include a cushion layer between the first resin layer and the opposite surface.

[0012] In one embodiment, the first resin layer may include one of a photocurable resin and a thermosetting resin.

[0013] In one embodiment, the first resin layer may further include a metal material mixed with the one of the photocurable resin and the thermosetting resin.

[0014] In one embodiment, the display device may further include: a second bonding target located in a second area of ​​the opposite surface, the second area being located on one side of the first area; and a second resin layer located between the second bonding target and the opposite surface and covering at least a portion of the side surface of the second bonding target.

[0015] In one embodiment, the first resin layer in the first region may include one of a photocurable resin and a thermosetting resin, and the second resin layer in the second region may include the other of the photocurable resin and the thermosetting resin.

[0016] In one embodiment, the display device may further include an integrated circuit film connected to the display panel and having a driving integrated circuit mounted thereon, and the first bonding target may include a printed circuit board connected to the integrated circuit film.

[0017] In one embodiment, the first resin layer may cover at least a portion of an upper surface of the first bonding target.

[0018] According to one or more embodiments, a method for manufacturing a display device includes: preparing a display panel, the display panel including a surface on which a screen is defined and an opposite surface positioned opposite to the one surface; forming a first resin layer on the opposite surface by applying resin to a first area of ​​the opposite surface; setting a first bonding target on the first resin layer; waiting for a predetermined time after setting the first bonding target; and curing the first resin layer.

[0019] In one embodiment, the method may further include: forming a first upper resin layer by further applying the resin to the first resin layer and the first bonding target after the curing of the first resin layer; and curing the first upper resin layer.

[0020] In an embodiment, the method may further include forming a cushion layer on the opposite surface, wherein forming the first resin layer may include applying the resin to the opposite surface and the cushion layer.

[0021] In one embodiment, when viewed in a direction perpendicular to the opposite surface, an area of ​​the first resin layer may be larger than an area of ​​the first bonding target.

[0022] In one embodiment, the first resin layer may include a light-curable resin or a heat-curable resin.

[0023] In one embodiment, the first resin layer may further include a metal material mixed with the photocurable resin or the thermosetting resin.

[0024] In one embodiment, the method may further include: forming a second resin layer by applying the resin to a second region of the opposite surface located on one side of the first region; and providing a second bonding target on the second resin layer.

[0025] In one embodiment, the method may further include: waiting for a predetermined time after the setting of the second bonding target; and curing the second upper resin layer.

[0026] In one embodiment, the first resin layer in the first region may include one of a photocurable resin and a thermosetting resin, and the second resin layer in the second region may include the other of the photocurable resin and the thermosetting resin.

[0027] In one embodiment, when viewed in a direction perpendicular to the opposite surface of the display panel, an area of ​​the first resin layer is greater than an area of ​​the pad layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other features of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 is a schematic perspective view showing a display panel of a display device according to an embodiment;

[0030] Figure 2 To show Figure 1 A schematic diagram of an example of another surface (or rear surface) of a display panel;

[0031] Figure 3 To show the Figure 2 A cross-sectional view of an example of a cross section of a display panel taken along line II';

[0032] Figure 4 To show the Figure 2 A cross-sectional view of an example of a cross section of a display panel taken along line II';

[0033] Figure 5 To show the Figure 2 A cross-sectional view of an example of a cross section of a display panel taken along line II';

[0034] Figure 6 To show the Figure 2 A cross-sectional view of an example of a cross section of a display panel taken along line II';

[0035] Figure 7 To show the Figure 2 A cross-sectional view of an example of a cross section of a display panel taken along line II';

[0036] Figure 8 To show the Figure 2 A cross-sectional view of an example of a cross section of a display panel taken along line II';

[0037] Figure 9 To show the Figure 2 A cross-sectional view of an example of a cross section of a display panel taken along line II';

[0038] Figure 10 To show Figure 1 A schematic diagram of another example of another surface (or rear surface) of a display panel;

[0039] Figures 11 to 13 To show the Figure 10 FIG. 1 is a diagram showing an example of a cross section of a display panel taken along line II-II′;

[0040] Figure 14 A schematic flow chart illustrating a method for manufacturing a display device according to an embodiment;

[0041] Figures 15 to 18 To show in order Figure 14 FIG. 1 is a flow chart of manufacturing a display panel;

[0042] Figure 19 A schematic flow chart illustrating a method for manufacturing a display device according to an embodiment;

[0043] Figure 20 To show that there is formed Figure 19 a diagram of a display panel having a first upper resin layer;

[0044] Figure 21 To show Figure 1 A schematic equivalent circuit diagram of an embodiment of a pixel of a display device; and

[0045] Figure 22 To show Figure 1 Schematic cross-sectional view of a portion of a display device. DETAILED DESCRIPTION

[0046] The present invention will now be described more fully hereinafter with reference to the accompanying drawings showing various embodiments. However, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout.

[0047] Because the present disclosure allows for various changes and numerous embodiments, specific embodiments will be illustrated in the drawings and described in detail in the written description. Reference is made to the accompanying drawings, which illustrate the embodiments, to gain a full understanding of the embodiments, their advantages, and the objectives achieved by practicing the present disclosure. However, the present disclosure is not limited to the embodiments disclosed below, but may be embodied in a variety of different forms.

[0048] Hereinafter, the present disclosure will be described in detail by explaining embodiments with reference to the accompanying drawings, in which like reference numerals denote like elements and repeated description thereof will not be given.

[0049] It will be understood that when an element is referred to as being “on” another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present. In the following embodiments, when an element such as a layer, film, region, and plate is referred to as being “under” another element, the element can be “directly under” the other element or intervening elements.

[0050] For ease of description, components may be enlarged or reduced in the drawings. For example, the dimensions (e.g., thickness) of elements shown in the drawings are for ease of description, and thus the present disclosure is not necessarily limited thereto. That is, for ease of description, the dimensions of components may be enlarged and / or reduced in the drawings. Therefore, the spatially relative terms "below," "beneath," "below," "above," or "on" may be used to easily describe a component's relationship to other components.

[0051] The terms used to describe space or direction in this specification are terms used to describe the space and direction shown in the accompanying drawings, but can be understood as terms used to describe various other directions or various perspectives. For example, when the device or component shown in the accompanying drawings is flipped, the device or component described as "below..." can be interpreted as being in a different orientation (e.g., rotated 90 degrees or in the opposite direction). For example, when the device or component shown in the accompanying drawings is flipped, the device or component described as "on..." can be interpreted as being in a different orientation (e.g., rotated 90 degrees or in the opposite direction). Accordingly, "below..." and "on..." can include both the above and below directions. The device or component can be oriented differently from the accompanying drawings, and the descriptors of the space or direction described herein can be interpreted in various ways.

[0052] The process order or method order understood in the description of the processing technology or manufacturing method in this disclosure may be different from the order described. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in the reverse order of the described order.

[0053] In the following embodiments, the D1 axis, D2 axis, and D3 axis are not limited to the three axes of the Cartesian coordinate system and can be interpreted in a broad sense including them. For example, the D1 axis, D2 axis, and D3 axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

[0054] It will be understood that although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, a first element, component, region, layer, or section discussed below could be termed a second element, component, region, layer, or section without departing from the teachings herein.

[0055] When a component is referred to as being “connected to” or “coupled to” another component, it will be understood that the component will be directly or indirectly connected or coupled to the other component.

[0056] Similarly, when a component is referred to as being “electrically connected” to another component, the component and the other component may be directly electrically connected or may be indirectly electrically connected via a conductive component.

[0057] When a component is referred to as being “between” two components, it should be understood that the component is the only component placed between the two components, or another component other than one component is placed between the two components.

[0058] The terms used herein are only used to describe the purpose of specific embodiments and are not intended to be restrictive. As used herein, "one", "said" and "at least one" do not represent a limit to quantity and are intended to include both the singular and the plural, unless the context clearly indicates otherwise. Therefore, in the claims, the reference to "said" element followed by the reference to "one" element includes one element and multiple elements. For example, unless the context clearly indicates otherwise, "one element" has the same meaning as "at least one element". "At least one" should not be interpreted as limiting "one". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more related listed items. Throughout this disclosure, the expression "at least one of a, b and c" or "at least one selected from a, b and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b and c or its variations.

[0059] For example, the expression "mixture," "mixture," "hybrid," or "having" specifies the presence of the described features, integers, steps, operations, elements, and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups.

[0060] For example, terms such as "substantially," "approximately," and similar terms are used as terms of approximation, rather than terms of degree, and describe the inherent variation in measured or calculated values ​​that one skilled in the art would recognize. For example, the use of a term such as "may" may be used to mean "one or more embodiments disclosed herein."

[0061] For example, in the present disclosure, when a layer has the "same layer structure" as another layer, this may mean that the multiple layers provided in the layer are provided in the same order in the other layer. For example, the multiple layers provided in the layer and the multiple layers provided in the other layer may each contain the same material and be formed in the same order.

[0062] The electronic or electrical devices and / or any other related devices or components (e.g., some of the various modules) according to the embodiments described herein may be implemented using any suitable hardware, firmware (e.g., an application specific integrated circuit), software, and combinations thereof. For example, the various components of these devices may be formed on a single integrated circuit (IC) chip or on separate IC chips. The various components of these devices may be formed on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or a single substrate. The various components of these devices may be processes or threads, may be executed in one or more processors, may execute computer program instructions in one or more computing devices, and may interact with other system components to perform the various functions described in this disclosure.

[0063] The computer program instructions are stored in a memory for implementation in a computing device using standard storage devices such as random access memory (RAM). The computer program instructions may also be stored on other non-transitory computer-readable media such as a CD-ROM or flash drive. It will be appreciated by those skilled in the art that the functionality of various computing devices may be combined or integrated into a single computing device, or the functionality of a particular computing device may be distributed across one or more other computing devices, without departing from the spirit and scope of the embodiments.

[0064] Hereinafter, a display device according to an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0065] Figure 1 1 is a schematic perspective view showing a display panel of a display device according to an embodiment. Figure 2 To show Figure 1 A schematic diagram of an example of another surface (or rear surface) of a display panel, and Figure 3 For the Figure 2 1-1' is a cross-sectional view of an example of a display panel. In detail, Figure 1 1 is a diagram showing one surface (or front surface) FA of the display panel.

[0066] like Figure 1 and Figure 2 As shown in FIG, a display device according to an embodiment may include a display panel 10. The display device may be any type of display device as long as the display device includes the display panel 10. In an embodiment, for example, the display device may be various types of devices such as a smartphone, a tablet computer, a laptop computer, a television, or a billboard. The display device according to an embodiment may include a thin film transistor and a capacitor, and the thin film transistor and the capacitor may be implemented by providing or forming a conductive layer and an insulating layer therein.

[0067] The display panel 10 includes a display area DA and a peripheral area PA located outside the display area DA. Figure 1 As shown in FIG, the display area DA may have a rectangular shape. However, the present disclosure is not limited thereto. Alternatively, the display area DA may have one of various other shapes such as a circle, an ellipse, a polygon, or a specific shape.

[0068] The display area DA may be a portion that displays an image and may include a plurality of pixels PX located therein. Each pixel PX may include a display element such as an organic light-emitting diode. Each pixel PX may emit, for example, red light, green light, or blue light. The pixel PX may further include a pixel circuit that includes a thin-film transistor (TFT) and a storage capacitor. The pixel circuit may be connected to a scan line SL configured to transmit a scan signal, a data line DL that intersects the scan line SL and is configured to transmit a data signal, and a driving voltage line PL configured to supply a driving voltage. The scan line SL may extend in a first direction D1, and the data line DL and the driving voltage line PL may extend in a second direction D2. Here, the third direction D3 may be a direction perpendicular to the first direction D1 and the second direction D2, and the third direction D3 may be the thickness direction of the display panel 10.

[0069] The pixels PX may emit light having a brightness corresponding to an electrical signal from an electrically connected pixel circuit. The display area DA may display a specific image using the light emitted from the pixels PX. In one embodiment, as described above, the pixels PX may be defined as an emission area that emits light of any one of red, green, and blue colors.

[0070] The peripheral area PA is an area where pixels PX are not located and where no image is displayed. Power lines for driving pixels PX may be located in the peripheral area PA. Pads may be located in the peripheral area PA, and an integrated circuit device such as a printed circuit board including a drive circuit or driver IC may be positioned to be electrically connected to the plurality of pads.

[0071] In one embodiment, the display panel 10 includes a substrate 100 (see Figure 22 ), thus the display area DA and the peripheral area PA may be defined on the substrate 100. Detailed features of the substrate 100 will be described below.

[0072] A plurality of transistors may be located in the display area DA. Regarding the plurality of transistors, depending on the type of transistor (N-type or P-type) and / or operating conditions, the first terminal of the transistor may be a source electrode or a drain electrode, and the second terminal may be an electrode different from the first terminal. In one embodiment, for example, the first terminal is a source electrode, and the second terminal may be a drain electrode.

[0073] The plurality of transistors may include a driving transistor, a data writing transistor, a compensation transistor, an initialization transistor, and a light emission control transistor. The driving transistor may be connected between a driving voltage line PL and an organic light emitting diode (OLED), and the data writing transistor may be connected to a data line DL and the driving transistor and may perform a switching operation for transmitting a data signal to the data line DL.

[0074] The compensation transistor may be turned on in response to a scan signal received through the scan line SL, and may compensate for a threshold voltage of the driving transistor by connecting the driving transistor to the organic light emitting diode (OLED).

[0075] The initialization transistor may be turned on in response to a scan signal received through the scan line SL and may initialize the gate electrode of the drive transistor by transmitting an initialization voltage to the gate electrode of the drive transistor. The scan line connected to the initialization transistor may be a separate scan line different from the scan line connected to the compensation transistor.

[0076] The light emission control transistor may be turned on in response to a light emission control signal received through the light emission control line, and as a result, a driving current may flow in the organic light emitting diode (OLED).

[0077] An organic light emitting diode (OLED) may include a pixel electrode (or anode) and a counter electrode (or cathode), and the counter electrode (see Figure 22 160) can receive the second power supply voltage ELVSS (see Figure 21 ). An organic light emitting diode (OLED) can display an image by receiving a driving current from a driving transistor and emitting light.

[0078] Hereinafter, an organic light-emitting display device will be described as an example of a display device according to one embodiment, but the present disclosure is not limited thereto. A display device according to another embodiment may be an inorganic light-emitting display (or inorganic EL display device) or a display device such as a quantum dot light-emitting display. For example, an emission layer of a display element provided in a display device may include an organic material or an inorganic material. The display device may include an emission layer and quantum dots located on a path of the emission layer.

[0079] In one embodiment, if Figure 1 and Figure 2 As shown in , the display panel 10 may include one surface FA displaying a picture (or defining a screen) and an opposite surface BA located opposite to the one surface FA. In one embodiment, for example, the one surface FA displaying an image may be the front surface (or display surface) of the display panel 10, and the opposite surface BA located opposite to the one surface FA may be the rear surface of the display panel 10.

[0080] The opposite surface BA may include a first area A1. The first area A1 may be an area where a first bonding target PB1, which will be described below, is located, and may refer to an area in which a resin is applied to fix the first bonding target PB1.

[0081] The first bonding target PB1 may be one of various components provided in the display device and located outside the display panel 10. In one embodiment, for example, the first bonding target PB1 may include various objects (e.g., components or modules) such as a printed circuit board, a camera module, or a battery. The first bonding target PB1 may be located in the first area A1 of the opposite surface BA of the display panel 10.

[0082] The first resin layer RS1 may be located between the first bonding target PB1 and the opposite surface BA, and may be a component for bonding the first bonding target PB1. After the first bonding target PB1 is positioned or disposed on the first resin layer RS1, the first resin layer RS1 is cured, so that the first bonding target PB1 may sink into the first resin layer RS1 to a certain depth. Then, as a result of the curing, at least a portion of the side surface of the first bonding target PB1 may be covered by the first resin layer RS1. The first resin layer RS1 may cover the entire side surface of the first bonding target PB1, or may cover a portion of the side surface of the first bonding target PB1. In one embodiment, for example, the first resin layer RS1 is cured after being applied to the other surface BA of the display panel 10, so that the edge of the cured first resin layer RS1 may have an inclined shape.

[0083] In one embodiment, if Figure 3 , the first resin layer RS1 may be located in the first area A1. The first resin layer RS1 may have a first first thickness (hereinafter, referred to as a "1-1th thickness") d1-1, and a distance between the first resin layer RS1 and the first bonding target PB1 may have a second first thickness (hereinafter, referred to as a "1-2th thickness") d1-2 that is smaller than the 1-1th thickness d1-1.

[0084] In one embodiment, for example, when viewed in a direction perpendicular to the opposite surface BA (or in the third direction D3), the area of ​​the first resin layer RS1 may be larger than the area of ​​the first bonding target PB1. In this embodiment, the first resin layer RS1 may be applied wider than the first bonding target PB1 to cover at least a portion of the side surface of the first bonding target PB1, thereby firmly fixing the first bonding target PB1.

[0085] The first resin layer RS1 may include one of a photocurable resin, a heat curable resin, a mixed resin, an electron beam curable resin, and a solvent curable resin.

[0086] The first resin layer RS1 serves as an adhesive layer for bonding the opposite surface BA of the display panel 10 to the first bonding target PB1. In other words, the first resin layer RS1 may be formed to fill the space between the opposite surface BA of the display panel 10 and the first bonding target PB1. In one embodiment, for example, the first resin layer RS1 may include a photocurable resin (or photobonding resin) to serve as an adhesive layer. The first resin layer RS1 may include a material that acquires adhesiveness when applied to the opposite surface BA of the display panel 10 and then light-cured or heat-cured.

[0087] In this embodiment, when the first resin layer RS1 serves as an adhesive layer, unlike other types of adhesive layers, a separate pressurization process can be omitted when bonding the first bonding target PB1. The first resin layer RS1 exhibits adhesive properties when cured using a photocuring process or a thermal curing process, thus eliminating the need for a pressurization process used to bond the first bonding target PB1 during the display manufacturing process. As a result, defects or damage to the display panel 10 that might otherwise occur due to the pressurization process can be effectively prevented. In this embodiment, the cured first resin layer RS1 effectively prevents the penetration of external moisture and external impacts.

[0088] In one embodiment, for example, the first resin layer RS1 may include at least one selected from the following resins: a resin having a polar group, such as a rosin ester resin, a phenolic resin, a xylene resin, a xylene phenolic resin or a terpene phenolic resin; various petroleum resins, such as aromatic resins with relatively low polarity, aliphatic-aromatic copolymer resins or alicyclic resins; and common tackifying resins, such as coumarone resins, low molecular weight polyethylene resins, terpene resins or hydrogenated resins thereof.

[0089] In one embodiment, for example, if necessary, the first resin layer RS1 may contain at least one selected from various additives, such as an extender, a plasticizer, a hygroscopic agent, a condensation reaction accelerating catalyst, a photosensitizer, a photopolymerization accelerator, a curing catalyst, a physical property regulator for improving tensile properties, a reinforcing agent, a colorant, a flame retardant, an anti-flow agent, an antioxidant, an anti-aging agent, an ultraviolet absorber, a solvent, a fragrance, a pigment, a dye, a filler, a diluent, a polymerization inhibitor or a solid polymer.

[0090] The material constituting the first resin layer RS1 may vary depending on the type of the first bonding target PB1. In one embodiment, for example, if the first bonding target PB1 is a heat-generating component such as a printed circuit board, it may be necessary to dissipate heat through the first resin layer RS1. In this embodiment, in order to dissipate heat more efficiently, a material with high thermal conductivity (for example, a metal material such as aluminum powder) may be mixed with the resin constituting the first resin layer RS1. In one embodiment, the first resin layer RS1 may include a mixture, and the mixture may be obtained by mixing a resin and a metal material.

[0091] In one embodiment, for example, when the first bonding target PB1 is a sensor for detecting light such as a camera module, the first resin layer RS1 may include a transparent resin. In another embodiment, when it is desired that the first resin layer RS1 block external light relative to the first bonding target PB1, the first resin layer RS1 may include an opaque resin.

[0092] In the embodiment of the present disclosure, as described above, the physical properties of the applied resin may vary according to the properties of the first bonding target PB1. As a result, the properties of the first resin layer RS1 also change, and the first resin layer RS1 suitable for the properties of the first bonding target PB1 may be formed.

[0093] Figure 4 To show the Figure 2 FIG. 1 is a cross-sectional view of an example of a cross section of a display panel taken along line II′.

[0094] For ease of description, the Figure 4 Any repeated detailed description of elements that are substantially the same as those described above.

[0095] like Figure 4 As shown in FIG, the display device according to an embodiment may further include a cushion layer (or coating layer) CSL located between the first resin layer RS1 and the opposite surface BA of the display panel 10. The cushion layer CSL may include the same material as that of the first resin layer RS1. The cushion layer CSL may be a layer cured by one of the above-mentioned photocuring process, thermal curing process, hybrid curing process, electron beam curing process, and solvent curing process.

[0096] In one embodiment, the cushion layer CSL may cover the first area A1 or a portion of the first area A1 on the opposite surface BA of the display panel 10. The above-mentioned first bonding target PB1 may be set on the cushion layer CSL. In this embodiment, after the first bonding target PB1 is positioned, the first resin layer RS1 may be formed to cover at least a portion of the side surface of the first bonding target PB1. As a result, the first resin layer RS1 covers the upper surface of the cushion layer CSL and may not be located between the cushion layer CSL and the first bonding target PB1. The first resin layer RS1 may cover the upper surface and side surfaces of the cushion layer CSL, and when viewed in a direction perpendicular to the opposite surface BA of the display panel 10, the area of ​​the first resin layer RS1 may be larger than the area of ​​the cushion layer CSL.

[0097] In one embodiment, if Figure 4As shown in FIG, the first resin layer RS1 may not cover the upper surface of the first bonding target PB1, but is not limited thereto. In another embodiment, the first resin layer RS1 may cover the upper surface of the first bonding target PB1 by utilizing the thickness of the cushion layer CSL. In some cases, the first resin layer RS1 may cover a portion of the upper surface of the first bonding target PB1.

[0098] The cushion layer CSL may be a member for preventing direct contact between the opposite surface BA of the display panel 10 and the first bonding target PB1. That is, the cushion layer CSL may be a member for protecting the opposite surface BA of the display panel 10 from the first bonding target PB1. In this embodiment, an impact applied to the first bonding target PB1 due to an external force or the like may not be directly transmitted to the display panel 10 due to the cushion layer CSL, and thus the display panel 10 may be protected by the cushion layer CSL.

[0099] Figure 5 To show the Figure 2 FIG. 1 is a cross-sectional view of an example of a cross section of a display panel taken along line II′.

[0100] For ease of description, the Figure 5 Any repeated detailed description of elements that are substantially the same as those described above.

[0101] In one embodiment, if Figure 5 As shown in , the first resin layer RS1 may cover the side surface of the first bonding target PB1 and cover at least a portion of the upper surface of the first bonding target PB1. For ease of illustration and description, Figure 5 , the first resin layer RS1 is shown to cover a portion of the upper surface of the first bonding target PB1, but in some cases, the first resin layer RS1 may cover the entire upper surface of the first bonding target PB1.

[0102] In one embodiment, if Figure 5 As shown in , the thickness of the first resin layer RS1 may be greater than the thickness of the first bonding target PB1. In this embodiment, after the resin of the first resin layer RS1 is applied on the opposite surface BA, the first bonding target PB1 may be set on the applied resin, and in this case, the thickness of the applied resin may be greater than the thickness of the first bonding target PB1. After positioning the first bonding target PB1, the curing process may not start for a certain period of time until the first bonding target PB1 is sufficiently sunk between the applied resin. The curing process may start after the first bonding target PB1 is sufficiently sunk between the applied resin, as a result, Figure 5 As shown in FIG, the first resin layer RS1 may cover the upper surface of the first bonding target PB1 or at least a portion of the upper surface.

[0103] In this embodiment, when the upper surface or at least a portion of the upper surface of the first bonding target PB1 is covered by the first resin layer RS1, the first bonding target PB1 can be more securely attached. The first bonding target PB1 can be more secure from external impact applied to the first bonding target PB1. The external impact applied to the first bonding target PB1 can be applied from various directions, so the first resin layer RS1 can cover at least a portion of the upper surface of the first bonding target PB1.

[0104] Figure 6 To show the Figure 2 A cross-sectional view of an example of a cross section of the display panel taken along line II', and Figure 7 To show the Figure 2 FIG. 1 is a cross-sectional view of an example of a cross section of a display panel taken along line II′.

[0105] For ease of description, the Figure 6 and Figure 7 Any repeated detailed description of elements that are substantially the same as those described above.

[0106] In one embodiment, if Figure 6 and Figure 7 As shown in FIG, a first upper resin layer RS1′ may be further disposed on the first resin layer RS1. The first upper resin layer RS1′ may cover a portion of a side surface of the first bonding target PB1 and / or may cover at least a portion of an upper surface of the first bonding target PB1.

[0107] The first upper resin layer RS1' may be formed after the first resin layer RS1 is cured. Thus, the resin of the first resin layer RS1 may be applied, the first bonding target PB1 may be positioned on the applied resin, and after positioning the first bonding target PB1, the first resin layer RS1 may be cured. After the first resin layer RS1 is cured, resin may be applied to cover the upper surface of the first resin layer RS1 and the upper surface (or at least a portion of the upper surface) of the first bonding target PB1, and when the applied resin is cured, the first upper resin layer RS1' is formed.

[0108] In one embodiment, if Figure 5 As shown in , the upper surface of the first bonding target PB1 may be covered by the first resin layer RS1, but this is possible only when the thickness of the first bonding target PB1 is thin enough. Figure 6 and Figure 7 As shown in , the separate first upper resin layer RS1 ′ may be further positioned so as to effectively cover the upper surface or at least a portion of the upper surface of the bonding target without being limited by the thickness of the bonding target.

[0109] In this embodiment, when the upper surface or at least a portion of the upper surface of the first bonding target PB1 is covered by the first upper resin layer RS1', the first bonding target PB1 can be more securely attached. The first bonding target PB1 can be more secure from external impact applied to the first bonding target PB1. The external impact applied to the first bonding target PB1 can be applied from various directions, so the first upper resin layer RS1' can cover at least a portion of the upper surface of the first bonding target PB1.

[0110] In one embodiment, if Figure 6 and Figure 7 As shown in , the properties of each of the resins constituting the first resin layer RS1 and the first upper resin layer RS1' disposed on the first resin layer RS1 may be different from each other. In one embodiment, for example, in the case where the first bonding target PB1 generates heat, the first resin layer RS1 may include a mixture of resin and metal material, and the first upper resin layer RS1' may also include a mixture of resin and metal material. In this embodiment, in order to increase the heat generation efficiency, the mixture of the first upper resin layer RS1' may include more metal material than the metal material of the mixture of the first resin layer RS1. In this embodiment, the heat of the first bonding target PB1 can be dissipated to the outside more efficiently.

[0111] Figure 8 To show the Figure 2 A cross-sectional view of an example of a cross section of the display panel taken along line II', and Figure 9 To show the Figure 2 FIG. 1 is a cross-sectional view of an example of a cross section of a display panel taken along line II′.

[0112] For ease of description, the Figure 8 and Figure 9 Any repeated detailed description of elements that are substantially the same as those described above.

[0113] In one embodiment, if Figure 8 As shown in FIG, the first bonding target PB1 may be a printed circuit board. In this embodiment where the first bonding target PB1 is a printed circuit board, the display device may further include an integrated circuit film FC connected to the display panel 10 and having a driving integrated circuit CH mounted thereon. The first bonding target PB1, which is a printed circuit board, may be connected to the integrated circuit film FC.

[0114] The integrated circuit film FC may be flexible. As a result, even if the printed circuit board is bonded to the opposite surface BA of the display panel 10, the printed circuit board and the display panel 10 can be electrically connected to each other through the flexible integrated circuit film FC.

[0115] like Figure 9As shown in the figure, the opposite surface BA of the display panel 10 may include a first area A1, which is a portion covered by the first resin layer RS1, and the first area A1 may include a first first area (hereinafter referred to as "1-1 area") A1-1 and a second first area (hereinafter referred to as "1-2 area") A1-2.

[0116] In one embodiment, for example, the 1-1st area A1-1 may refer to an area from one edge of the display panel 10 to a specific boundary line spaced a certain distance apart. In one embodiment, for example, the 1-1st area A1-1 may be an area where the first bonding target (hereinafter, referred to as "1-1st bonding target") PB1-1 is located.

[0117] In one embodiment, for example, the 1-2nd area A1-2 may be an area located to one side of the 1-1st area A1-1, and the sum of the 1-1st area A1-1 and the 1-2nd area A1-2 may be the first area A1. In one embodiment, for example, the 1-2nd area A1-2 may refer to an area extending from one boundary of the 1-1st area A1-1 to another specific boundary line spaced a certain distance apart. In one embodiment, for example, the 1-2nd area A1-2 may be the area where the second first binding target (hereinafter referred to as the "1-2nd binding target") PB1-2 is located.

[0118] The first resin layer RS1 may include a first first resin layer (hereinafter, referred to as a "1-1 resin layer") RS1-1 located in the 1-1 area A1-1 and a second first resin layer (hereinafter, referred to as a "1-2 resin layer") RS1-2 located in the 1-2 area A1-2. The 1-1 resin layer RS1-1 and the 1-2 resin layer RS1-2 may be provided in the same layer as each other (or directly on the same layer as each other) and may include the same material as each other.

[0119] In one embodiment, for example, the first resin layer RS1-1 can be cured using a first method. The first method can be one of the above-mentioned light curing process, heat curing process, hybrid curing process, electron beam curing process, and solvent curing process. The first resin layer RS1-2 can be cured using a second method. The second method can be one of the above-mentioned light curing process, heat curing process, hybrid curing process, electron beam curing process, and solvent curing process. In this case, the second method may be different from the first method.

[0120] Alternatively, the 1-1 resin layer RS1-1 and the 1-2 resin layer RS1-2 may be cured in the same manner but under different conditions. In one embodiment, for example, when both the 1-1 resin layer RS1-1 and the 1-2 resin layer RS1-2 are cured using a thermal curing process, the 1-1 resin layer RS1-1 may be thermally cured at a first temperature, and the 1-2 resin layer RS1-2 may be thermally cured at a second temperature.

[0121] In another embodiment, for example, when both the first resin layer RS1-1 and the second resin layer RS1-2 are cured using a photocuring process, the first resin layer RS1-1 may be photocured at a first wavelength, and the first resin layer RS1-2 may be photocured at a second wavelength. A different light source may be used in each of the first area A1-1 and the second area A1-2.

[0122] The 1-1 resin layer RS1-1 may cover the side surface or at least a portion of the side surface of the 1-1 bonding target PB1-1. The 1-2 resin layer RS1-2 may cover the side surface or at least a portion of the side surface of the 1-2 bonding target PB1-2. The 1-1 bonding target PB1-1 may be disposed on the 1-1 resin layer RS1-1 and may sink to a certain depth. After the 1-1 bonding target PB1-1 sinks to a certain depth in the 1-1 resin layer RS1-1, the curing process may begin. The 1-2 bonding target PB1-2 may be disposed on the 1-2 resin layer RS1-2 and may sink to a certain depth. After the 1-2 bonding target PB1-2 sinks to a certain depth in the 1-2 resin layer RS1-2, the curing process may begin.

[0123] In one embodiment, if Figure 9 As shown in , the first upper resin layer RS1' may be disposed on the 1-1 resin layer RS1-1 and the 1-2 resin layer RS1-2. The first upper resin layer RS1' may be disposed on the 1-1 bonding target PB1-1 and the 1-2 bonding target PB1-2. The first upper resin layer RS1' may cover the upper surface of the 1-1 bonding target PB1-1 or at least a portion of the upper surface. The first upper resin layer RS1' may cover the upper surface of the 1-2 bonding target PB1-2 or at least a portion of the upper surface. The first upper resin layer RS1' may cover a portion of the side surface of the 1-1 bonding target PB1-1 depending on the thickness of the 1-1 resin layer RS1-1. The first upper resin layer RS1' may cover a portion of the side surface of the 1-2 bonding target PB1-2 depending on the thickness of the 1-2 resin layer RS1-2. The first upper resin layer RS1' may cover the upper surface of the 1-1 resin layer RS1-1 and the upper surface of the 1-2 resin layer RS1-2.

[0124] Depending on the difference in the curing methods of the 1-1 resin layer RS1-1 and the 1-2 resin layer RS1-2, the properties of the 1-1 resin layer RS1-1 and the 1-2 resin layer RS1-2 may vary or be different from each other, that is, they may be set independently of each other. In one embodiment, for example, the 1-1 resin layer RS1-1 corresponding to the 1-1 bonding target PB1-1 may be cured using a photocuring process, and the 1-2 resin layer RS1-2 corresponding to the 1-2 bonding target PB1-2 may be cured using a thermal curing process. In this embodiment, due to the properties of the display panel 10, it may be difficult to apply high-temperature heat, so the hardness of the 1-1 resin layer RS1-1 may be higher than the hardness of the 1-2 resin layer RS1-2. Accordingly, the curing methods of the 1-1 resin layer RS1-1 and the 1-2 resin layer RS1-2 may vary depending on whether a higher hardness is required. In this way, due to the difference in curing methods, adjacent resin layers may have different properties from each other.

[0125] Figure 10 To show Figure 1 is a schematic diagram of another example of another surface (or rear surface) of the display panel, and Figures 11 to 13 To show the Figure 10 FIG. 1 is a diagram showing an example of a cross section of a display panel taken along line II-II′.

[0126] For ease of description, the Figures 10 to 13 Any repeated detailed description of elements that are substantially the same as those described above.

[0127] In one embodiment, if Figure 10 and Figure 11 As shown in FIG, the reverse surface BA of the display panel 10 may include a first area A1 and a second area A2. The first area A1 may be an area of ​​the reverse surface BA of the display panel 10. The first area A1 may be an area including an area (and surrounding areas) where the first bonding target PB1 of the reverse surface BA of the display panel 10 is located.

[0128] The second area A2 may be another area of ​​the opposite surface BA of the display panel 10. The second area A2 may be an area located on one side of the first area A1. The second area A2 may be an area spaced a certain distance from the first area A1. The second area A2 may be an area including the area (and surrounding areas) where the second bonding target PB2 of the opposite surface BA of the display panel 10 is located.

[0129] The first resin layer RS1 may be located in the first area A1 of the opposite surface BA of the display panel 10. The second resin layer RS2 may be located in the second area A2 of the opposite surface BA of the display panel 10. As a result, the first resin layer RS1 and the second resin layer RS2 may be provided in the same layer as each other (or directly on the same layer as each other). The first resin layer RS1 and the second resin layer RS2 may be spaced apart from each other by a certain distance. The composition of the resin material constituting the first resin layer RS1 and the composition of the resin material constituting the second resin layer RS2 may be different from each other. The curing method of the first resin layer RS1 and the curing method of the second resin layer RS2 may be different from each other.

[0130] exist Figure 10 and Figure 11 , for ease of illustration and description, the first binding target PB1 and the second binding target PB2 are shown as being located on the same line (e.g., line II-II'), but the first binding target PB1 and the second binding target PB2 are shown as being located at different positions, i.e., not aligned with each other in the second direction D2.

[0131] In one embodiment, if Figure 11 , the first resin layer RS1 may be located in the first area A1. The first resin layer RS1 may have a first first thickness (hereinafter, referred to as a "1-1th thickness") d1-1, and a distance between the first resin layer RS1 and the first bonding target PB1 may have a second first thickness (hereinafter, referred to as a "1-2th thickness") d1-2 that is smaller than the 1-1th thickness d1-1.

[0132] The second resin layer RS2 may be located in the second area A2. The second resin layer RS2 may have a first second thickness (hereinafter referred to as "2-1 thickness") d2-1, and a distance between the second resin layer RS2 and the second bonding target PB2 may have a second second thickness (hereinafter referred to as "2-2 thickness") d2-2 that is less than the 2-1 thickness d2-1. In one embodiment, the second resin layer RS2 may be located between the second bonding target PB2 and the opposite surface BA and may cover at least a portion of the side surface of the second bonding target PB2.

[0133] In one embodiment, if Figure 12 As shown in FIG, the first cushion layer CSL1 may be located between the 1-1 resin layer RS1-1 and the first bonding target PB1. The first cushion layer CSL1 may be positioned to cover a portion of the first area A1 of the opposite surface BA of the display panel 10. The second cushion layer CSL2 may be positioned to cover a portion of the second area A2 of the opposite surface BA of the display panel 10.

[0134] When viewed in a direction perpendicular to the opposite surface BA of the display panel 10 (i.e., in the third direction D3), the area of ​​the first cushion layer CSL1 may be larger than the area of ​​the first bonding target PB1. When viewed in a direction perpendicular to the opposite surface BA of the display panel 10, the area of ​​the first cushion layer CSL1 may be smaller than the area of ​​the first resin layer RS1. When viewed in a direction perpendicular to the opposite surface BA of the display panel 10, the area of ​​the second cushion layer CSL2 may be larger than the area of ​​the second bonding target PB2. When viewed in a direction perpendicular to the opposite surface BA of the display panel 10, the area of ​​the second cushion layer CSL2 may be smaller than the area of ​​the second resin layer RS2.

[0135] The first and second cushion layers CSL1 and CSL2 may have the same properties as those of the above-described cushion layer CSL, and thus any repeated detailed description thereof will be omitted.

[0136] In one embodiment, if Figure 13 As shown in FIG, a first upper resin layer RS1′ may be disposed on the first resin layer RS1. The first upper resin layer RS1′ may cover a portion of a side surface of the first bonding target PB1 and may cover at least a portion of an upper surface of the first bonding target PB1.

[0137] The first upper resin layer RS1' may be formed after the first resin layer RS1 is cured. Thus, the resin of the first resin layer RS1 may be applied, the first bonding target PB1 may be positioned on the applied resin, and after positioning the first bonding target PB1, the first resin layer RS1 may be cured. After the first resin layer RS1 is cured, resin may be applied to cover the upper surface of the first resin layer RS1 and the upper surface (or at least a portion of the upper surface) of the first bonding target PB1, and when the applied resin is cured, the first upper resin layer RS1' is formed.

[0138] In this embodiment, as mentioned above Figure 5 As described above, the upper surface of the first bonding target PB1 may be covered by the first resin layer RS1, but this is only possible when the thickness of the first bonding target PB1 is sufficiently thin. Accordingly, when the upper surface of the bonding target or at least a portion of the upper surface is covered without being restricted by the thickness of the bonding target, a separate first upper resin layer RS1′ may be further positioned.

[0139] In this embodiment, when the upper surface or at least a portion of the upper surface of the first bonding target PB1 is covered by the first upper resin layer RS1', the first bonding target PB1 can be more securely attached. The first bonding target PB1 can be more secure from external impact applied to the first bonding target PB1. The external impact applied to the first bonding target PB1 can be applied from various directions, so the first upper resin layer RS1' can cover at least a portion of the upper surface of the first bonding target PB1.

[0140] The second upper resin layer RS2′ may be disposed on the second resin layer RS2. The second upper resin layer RS2′ may cover a portion of a side surface of the second bonding target PB2 and / or may cover at least a portion of an upper surface of the second bonding target PB2.

[0141] The second upper resin layer RS2' may be formed after the second resin layer RS2 is cured. Thus, the resin of the second resin layer RS2 may be applied, the second bonding target PB2 may be positioned on the applied resin, and after positioning the second bonding target PB2, the second resin layer RS2 may be cured. After the second resin layer RS2 is cured, resin may be applied to cover the upper surface of the second resin layer RS2 and the upper surface (or at least a portion of the upper surface) of the second bonding target PB2, and when the applied resin is cured, the second upper resin layer RS2' is formed.

[0142] In this embodiment, as described above, the upper surface of the second bonding target PB2 may be covered by the second resin layer RS2, but this is only possible when the thickness of the second bonding target PB2 is sufficiently thin. Accordingly, when the upper surface of the bonding target or at least a portion of the upper surface is covered without being restricted by the thickness of the bonding target, a separate second upper resin layer RS2′ may be further positioned.

[0143] In this embodiment, when the upper surface or at least a portion of the upper surface of the second bonding target PB2 is covered by the second upper resin layer RS2', the second bonding target PB2 can be more securely attached. The second bonding target PB2 can be more secure from external impact applied to the second bonding target PB2. The external impact applied to the second bonding target PB2 can be applied from various directions, so the second upper resin layer RS2' can cover at least a portion of the upper surface of the second bonding target PB2.

[0144] In one embodiment of the display device according to the present disclosure, the bonding target may be allowed to be effectively bonded to the opposite surface BA of the display panel 10, depending on the type or nature of the bonding target. A resin layer suitable for the type or nature of the bonding target may be formed by mixing another material with the resin or changing the curing method. The shape of the resin layer and the area of ​​the target to which the resin layer is bonded may be adjusted. That is, in the case of a first bonding target PB1 in the first area A1 and a second bonding target PB2 in the second area A2, the areas covered by the corresponding resin layers may be different from each other. In one embodiment, for example, the first bonding target PB1 is a printed circuit layer, and thus the entire upper surface of the first bonding target PB1 may be covered by the first upper resin layer RS1' for safer protection. In one embodiment, for example, the second bonding target PB2 is a camera module, and thus the lens area may not need to be hidden, and a portion of the upper surface of the second bonding target PB2 may be covered by the second upper resin layer RS2'.

[0145] Hereinafter, a method for manufacturing a display device according to an embodiment (hereinafter referred to as a manufacturing method) will be described in detail. For reference, in the description of the manufacturing method, any repeated detailed description of elements identical or similar to those of the above-described display device may be omitted or simplified.

[0146] Figure 14 is a schematic flow chart illustrating a method for manufacturing a display device according to an embodiment, and Figures 15 to 18 To show in order Figure 14 FIG. 1 is a flowchart of manufacturing a display panel.

[0147] like Figure 14 and Figure 15 As shown in FIG, a manufacturing method according to an embodiment may include preparing a display panel 10, wherein the display panel 10 includes a surface FA (see FIG. Figure 1 ) and another surface (or opposite surface) BA (S1100) located opposite to the one surface FA. Figure 21 and Figure 22 Detailed features of the structure of an embodiment of the display panel 10 are described.

[0148] like Figure 14 and Figure 16 As shown in , the manufacturing method according to an embodiment may further include forming a first resin layer RS1 by applying a resin to the first area A1 of the opposite surface BA (S1200). The resin applied to the first area A1 may be applied in a liquid state. Before curing, the resin may be in a highly viscous liquid state.

[0149] like Figure 14 and Figure 17 As shown in FIG, the manufacturing method according to an embodiment may further include providing a first bonding target PB1 on the first resin layer RS1 (S1300). The first bonding target PB1 may be located on the resin in a highly viscous liquid state. In this case, when viewed in a direction perpendicular to the opposite surface BA of the display panel 10, the area of ​​the first resin layer RS1 may be larger than the area of ​​the first bonding target PB1.

[0150] like Figure 14 and Figure 18 As shown in , the manufacturing method according to an embodiment may further include, after providing the first bonding target PB1 on the first resin layer RS1, waiting for a certain (eg, predetermined) time ( S1400 ), and curing the first resin layer RS1 ( S1500 ).

[0151] After positioning the first bond target PB1 on the first resin layer RS1 and then waiting for a certain period of time, the first bond target PB1 may sink into the resin to a certain depth. If the first resin layer RS1 solidifies before the first bond target PB1 completely sinks, the first resin layer RS1 may be solidified after the first bond target PB1 sinks to a desired level. As a result, at least a portion of the side surface of the first bond target PB1 may be covered by the first resin layer RS1. Depending on the sinking depth or the waiting time, the upper surface of the first bond target PB1, or at least a portion of the upper surface, may be covered by the first resin layer RS1.

[0152] As such, by adjusting the waiting time after positioning the first bonding target PB1 on the first resin layer RS1 , the depth to which the first bonding target PB1 sinks may be easily controlled.

[0153] In one embodiment, the manufacturing method may further include forming a cushion layer CSL (see FIG. 1 ) on the opposite surface BA before forming the first resin layer RS1. Figure 4 ). In this case, the formation of the first resin layer RS1 may be an operation of applying resin on the opposite surface BA and the cushion layer CSL. In this embodiment, the cushion layer CSL is substantially the same as the cushion layer CSL described above. In this case, when viewed in a direction perpendicular to the opposite surface BA of the display panel 10, the area of ​​the first resin layer RS1 may be larger than the area of ​​the first bonding target PB1, and when viewed in a direction perpendicular to the opposite surface BA of the display panel 10, the area of ​​the first resin layer RS1 may be larger than the area of ​​the cushion layer CSL.

[0154] In one embodiment, for example, the first resin layer RS1 may include a light-curable resin or a heat-curable resin. That is, if necessary, the first resin layer RS1 may include another type of curable resin. Alternatively, the first resin layer RS1 may include a mixture of a light-curable resin or a heat-curable resin and a metal material.

[0155] In one embodiment of the manufacturing method, as described above Figure 10 and Figure 11 As shown in FIG, a second resin layer RS2 may be further formed in the second area A2. In one embodiment, for example, the manufacturing method according to one embodiment of the present disclosure may further include forming the second resin layer RS2 by applying a resin to the second area A2 located on the side of the first area A1 of the opposite surface BA of the display panel 10. Then, the manufacturing method may further include providing a second bonding target PB2 on the second resin layer RS2.

[0156] The manufacturing method according to an embodiment of the present disclosure may further include waiting for a certain (e.g., predetermined) time after setting the second bonding target PB2 and curing the second resin layer RS2. In this case, the first resin layer RS1 in the first area A1 may include one of a photocurable resin and a thermosetting resin, and the second resin layer RS2 in the second area A2 may include the other of the photocurable resin and the thermosetting resin. That is, the first resin layer RS1 and the second resin layer RS2 may include the same material (e.g., resin), but may also include materials with different properties (e.g., resin).

[0157] Figure 19 is a schematic flow chart showing a method for manufacturing a display device according to an embodiment, and Figure 20 To show that there is formed Figure 19 FIG. 1 is a diagram of a display panel of the embodiment of the present invention showing the first upper resin layer RS1′.

[0158] For ease of description, the Figure 19 and Figure 20 Any repeated detailed description of elements that are substantially the same as those described above.

[0159] like Figure 19 and Figure 20 As shown in , a manufacturing method according to an embodiment may further include forming a first upper resin layer RS1' (S1600) by applying a resin on the first resin layer RS1 and the first bonding target PB1 after curing the first resin layer RS1, and curing the first upper resin layer RS1' (S1700). The applied resin may be a highly viscous liquid. The resin may be applied with the first bonding target PB1 as the center. The resin may be applied to cover the side surface of the first bonding target PB1 and at least a portion of the upper surface of the first bonding target PB1. After applying the resin, the first upper resin layer RS1' may be cured using the above-mentioned curing method. The curing method may vary depending on the type of bonding target.

[0160] Hereinafter, a structure of an embodiment of the display panel 10 will be described in detail. This is merely an example of the display panel 10, and the embodiments of the present disclosure are not limited thereto.

[0161] Figure 21 To show Figure 1 Schematic equivalent circuit diagram of an embodiment of a pixel of a display device.

[0162] In one embodiment, if Figure 21 As shown in FIG, each pixel PX includes a pixel circuit PC connected to a scan line SL and a data line DL, and an organic light emitting device OLED connected to the pixel circuit PC.

[0163] In one embodiment, for example, the pixel circuit PC includes a driving thin film transistor Td, a switching thin film transistor Ts, and a storage capacitor Cst. The switching thin film transistor Ts is connected to a scan line SL and a data line DL, and a data signal Dm input through the data line DL is transmitted to the driving thin film transistor Td in response to a scan signal Sn input through the scan line SL.

[0164] In one embodiment, for example, the storage capacitor Cst is connected to the switching thin film transistor Ts and the driving voltage line PL, and stores a voltage corresponding to a difference between a voltage received from the switching thin film transistor Ts and a first power supply voltage (or driving voltage) ELVDD applied to the driving voltage line PL.

[0165] In one embodiment, for example, the driving thin film transistor Td may be connected to the driving voltage line PL and the storage capacitor Cst, and may control a driving current flowing from the driving voltage line PL to the organic light-emitting device OLED in response to a voltage value stored in the storage capacitor Cst. The organic light-emitting device OLED may emit light having a certain brightness corresponding to the driving current.

[0166] The organic light-emitting device OLED may receive a second power supply voltage (or common voltage) ELVSS. In one embodiment, for example, the organic light-emitting device OLED may receive the second power supply voltage (or common voltage) ELVSS through a counter electrode (or cathode), and may emit light having a certain brightness corresponding to the driving current according to a voltage difference between the first power supply voltage (or driving voltage) ELVDD and the second power supply voltage (or common voltage) ELVSS.

[0167] In one embodiment, if Figure 21 As shown in , the pixel circuit PC may include two thin film transistors and one storage capacitor, but the present disclosure is not limited thereto. In another embodiment, for example, the pixel circuit PC may include two or more storage capacitors and three or more thin film transistors.

[0168] Figure 22 To show Figure 1 Schematic cross-sectional view of a portion of a display device.

[0169] As described above, in one embodiment, the substrate 100 may include an area corresponding to the display area DA and the peripheral area PA outside the display area DA. The substrate 100 may include various flexible or bendable materials. In one embodiment, for example, the substrate 100 may include glass, metal, or a polymer resin. The substrate 100 may include a polymer resin such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. The substrate 100 may be modified in various ways and, for example, may have a multilayer structure including two layers each containing such a polymer resin and an isolation layer located between the layers and containing an inorganic material (such as silicon oxide, silicon nitride, or silicon oxynitride).

[0170] A buffer layer 101 may be provided on the substrate 100. The buffer layer 101 may function as an isolation layer and / or a barrier layer to effectively prevent the diffusion of impurity ions, prevent the penetration of moisture or external air, and provide a flat surface. The buffer layer 101 may include silicon oxide, silicon nitride, or silicon oxynitride. The buffer layer 101 may control the rate at which heat is supplied during the crystallization process to form the semiconductor layer 110, thereby ensuring uniform crystallization of the semiconductor layer 110.

[0171] The semiconductor layer 110 may be disposed on the buffer layer 101. The semiconductor layer 110 may comprise polycrystalline silicon and include a channel region that is not doped with impurities, and a source region and a drain region formed by doping impurities on both sides of the channel region. Here, the impurities vary depending on the type of thin film transistor and may be N-type impurities or P-type impurities. Although not shown in the figures, the display device according to an embodiment of the present disclosure may further include another semiconductor layer disposed on another layer.

[0172] The gate insulating film 102 may be provided on the semiconductor layer 110. The gate insulating film 102 may be a component for ensuring insulation between the semiconductor layer 110 and the gate layer 120. The gate insulating film 102 may include an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride, and may be located between the semiconductor layer 110 and the gate layer 120. The gate insulating film 102 may be formed to correspond to the entire surface of the substrate 100 and may have a structure in which contact holes are formed in predetermined portions. In this manner, the insulating film including the inorganic material may be formed by chemical vapor deposition (CVD) or atomic layer deposition (ALD). This also applies to the embodiments described below and their modifications.

[0173] The gate layer 120 may be disposed on the gate insulating film 102. The gate layer 120 may be located at a position vertically overlapping the semiconductor layer 110 and may include at least one metal selected from molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), titanium (Ti), tungsten (W), and copper (Cu). The detailed features of the gate layer 120 will be described below. Although not shown in the figures, the display device according to the present disclosure may further include another gate layer disposed on another layer.

[0174] The interlayer insulating film 103 may be disposed on the gate layer 120. The interlayer insulating film 103 may cover the gate layer 120. The interlayer insulating film 103 may include an inorganic material. In one embodiment, for example, the interlayer insulating film 103 may include a metal oxide or a metal nitride. For example, the inorganic material may include silicon oxide (SiO x ), silicon nitride (SiN y ), silicon oxynitride (SiO x N y ), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO x , which may be ZnO and / or ZnO2). In some embodiments, the interlayer insulating film 103 may have SiO x / SiN y or SiN y / SiO x dual structure.

[0175] The conductive layer 130 may be provided on the interlayer insulating film 103. The conductive layer 130 may function as an electrode connected to a source region and / or a drain region of the semiconductor layer through a via hole provided in the interlayer insulating film 103.

[0176] Conductive layer 130 may include at least one metal selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu). In one embodiment, for example, conductive layer 130 may include a Ti layer, an Al layer, and / or a Cu layer. In one embodiment, for example, conductive layer 130 may have a Ti / Al / Ti structure.

[0177] Although not shown in the figures, the display device according to an embodiment of the present disclosure may further include another conductive layer provided on another layer, and the other conductive layer may be, for example, a wiring layer used as wiring. The other conductive layer may include the same material as that of the conductive layer 130 and may have the same layer structure as that of the conductive layer 130.

[0178] The organic insulating layer 104 may be provided on the conductive layer 130. The organic insulating layer 104 may have a substantially flat upper surface covering the upper portion of the conductive layer 130 and may be an organic insulating layer serving as a planarization film. The organic insulating layer 104 may include an organic material such as acrylic acid, benzocyclobutene (BCB), or hexamethyldisiloxane (HMDSO). The organic insulating layer 104 may be modified in various ways, for example, it may be defined by a single layer or a plurality of layers.

[0179] Although not shown in the figures, the display device according to the present disclosure may further include another organic insulating layer provided on the other layer. The other organic insulating layer may be provided on the other conductive layer and may cover the upper portion of the other conductive layer to function as a planarization film. The other organic insulating layer may include the same material as that of the organic insulating layer 104 and may have the same layer structure as that of the organic insulating layer 104.

[0180] The pixel electrode 140 may be provided on the organic insulating layer 104. Alternatively, the pixel electrode 140 may be provided on another organic insulating layer described above. However, for ease of description, it is assumed that the pixel electrode 140 is provided on the organic insulating layer 104.

[0181] The pixel electrode 140 may be connected to the conductive layer 130 through a contact hole formed in the organic insulating layer 104. A display element may be provided on the pixel electrode 140. The organic light emitting device OLED (see Figure 21 ) can be used as a display element. That is, for example, an organic light-emitting device (OLED) can be located on the pixel electrode 140. The pixel electrode 140 may include a transmissive conductive layer including a transmissive conductive oxide such as ITO, In2O3, or IZO and / or a reflective layer including a metal such as Al or Ag. In one embodiment, for example, the pixel electrode 140 may have a three-layer structure of ITO / Ag / ITO.

[0182] The pixel-defining film 105 may be located on the organic insulating layer 104 and may be positioned to cover the edge of the pixel electrode 140. In one embodiment, for example, the pixel-defining film 105 may cover the edge of the pixel electrode 140. The pixel-defining film 105 may be provided with an opening corresponding to the pixel, and the opening may be formed to expose at least the central portion of the pixel electrode 140. The opening may be defined by the pixel-defining film 105.

[0183] The pixel defining film 105 may include an organic material such as polyimide or hexamethyldisiloxane (HMDSO). A spacer 80 may be provided on the pixel defining film 105. The spacer 80 is shown as being located in the peripheral area PA, but may also be located in the display area DA. The spacer 80 can effectively prevent the organic light-emitting device OLED from being damaged due to sagging of the mask during the manufacturing process using the mask. The spacer 80 may include an organic insulating material and may include a single layer or multiple layers.

[0184] The intermediate layer 150 and the counter electrode 160 may be disposed in the aforementioned opening. The intermediate layer 150 may comprise a low molecular weight or high molecular weight material. In one embodiment where the intermediate layer 150 comprises a low molecular weight material, the intermediate layer 150 may include a hole injection layer, a hole transport layer, an emission layer, an electron transport layer, and / or an electron injection layer. In one embodiment where the intermediate layer 150 comprises a high molecular weight material, the intermediate layer 150 may generally have a structure including a hole transport layer (HTL) and an emission layer (EML).

[0185] The structure of the intermediate layer 150 is not limited to those described above and may have various structures. In one embodiment, for example, at least one of the layers forming the intermediate layer 150 may be integrally formed with the counter electrode 160. According to another embodiment, the intermediate layer 150 may have a layer patterned to correspond to each of the plurality of pixel electrodes 140.

[0186] The counter electrode 160 may include a transmissive conductive layer including a transmissive conductive oxide such as ITO, In2O3, or IZO. The pixel electrode 140 may function as an anode, and the counter electrode 160 may function as a cathode, or vice versa.

[0187] The opposing electrode 160 may be disposed in the upper portion of the display area DA and may be disposed over the entire surface of the display area DA. That is, the opposing electrode 160 may be formed as a single body to cover a plurality of pixels. The opposing electrode 160 may be in electrical contact with the common power line 70 located in the peripheral area PA. In one embodiment, for example, the opposing electrode 160 may extend to the isolation wall 200.

[0188] The thin film encapsulation layer TFE may cover the entire display area DA and may extend toward the peripheral area PA to cover at least a portion of the peripheral area PA. The thin film encapsulation layer TFE may extend to an outside of the common power line 70.

[0189] The thin film encapsulation layer TFE may include a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320 located therebetween. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include one or more inorganic materials such as aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include a single layer or multiple layers including the above materials. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include the same material as each other or different materials from each other.

[0190] The thicknesses of the first inorganic encapsulating layer 310 and the second inorganic encapsulating layer 330 may be different from each other. The thickness of the first inorganic encapsulating layer 310 may be greater than the thickness of the second inorganic encapsulating layer 330. Alternatively, the thickness of the second inorganic encapsulating layer 330 may be greater than the thickness of the first inorganic encapsulating layer 310, or the thicknesses of the first inorganic encapsulating layer 310 and the second inorganic encapsulating layer 330 may be the same.

[0191] The organic encapsulation layer 320 may include a monomeric material or a polymeric material. The polymeric material may include acrylic resin, epoxy resin, polyimide, and polyethylene. In one embodiment, for example, the organic encapsulation layer 320 may include acrylate.

[0192] The isolation wall 200 may be located in the peripheral area PA of the substrate 100. In one embodiment, for example, the isolation wall 200 may include a portion 230 of the organic insulating layer 104, a portion 220 of the pixel defining film 105, and a portion 210 of the spacer 80, but is not necessarily limited thereto. In some cases, the isolation wall 200 may include at least one of the portion 230 of the organic insulating layer 104, the portion 220 of the pixel defining film 105, and the portion 210 of the spacer 80.

[0193] The partition wall 200 may be positioned to surround the display area DA and may prevent the organic encapsulation layer 320 of the thin film encapsulation layer TFE from overflowing to the outside of the substrate 100. Accordingly, the organic encapsulation layer 320 may be in contact with the inner surface of the partition wall 200 facing the display area DA. In this case, when the organic encapsulation layer 320 is in contact with the inner surface of the partition wall 200, it can be understood that the first inorganic encapsulation layer 310 is located between the organic encapsulation layer 320 and the partition wall 200, and the organic encapsulation layer 320 is in contact with the first inorganic encapsulation layer 310. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 are provided on the partition wall 200 and may extend toward the edge of the substrate 100.

[0194] According to another embodiment, the thin film encapsulation layer TFE can be replaced by a cover member that covers the entire display area DA. The cover member can be positioned to cover not only the display area DA but also at least a portion of the peripheral area PA. The cover member may include a rigid member (e.g., glass). When the thin film encapsulation layer TFE is replaced by a cover member, the isolation wall 200 described above can be omitted. In some cases, a transparent filler may be located between the cover member and the counter electrode 160.

[0195] According to the embodiments of the present disclosure, as described above, a display device for preventing damage due to pressure applied when a certain component is attached to a display panel and a method of manufacturing the same may be implemented.

[0196] The present invention should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the present invention to those skilled in the art.

[0197] While the invention has been particularly shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit or scope of the invention as defined by the claims.

Claims

1. A display device comprising: a display panel including one surface having a screen defined thereon and an opposite surface positioned opposite to the one surface; a first binding target located in a first region of the opposing surface; as well as A first resin layer is located between the first bonding target and the opposite surface and covers at least a portion of a side surface of the first bonding target. 2 . The display device according to claim 1 , further comprising a first upper resin layer disposed on the first resin layer and covering at least a portion of an upper surface of the first bonding target. 3 . The display device according to claim 1 , wherein an area of ​​the first resin layer is larger than an area of ​​the first bonding target when viewed in a direction perpendicular to the opposite surface. The display device according to claim 1 , further comprising a cushion layer between the first resin layer and the opposite surface. The display device according to claim 1 , wherein the first resin layer comprises one of a photocurable resin and a thermosetting resin. 6 . The display device according to claim 5 , wherein the first resin layer further includes a metal material mixed with the one of the photocurable resin and the thermosetting resin.

7. The display device according to claim 1, further comprising: a second binding target located in a second region of the opposing surface, the second region being located to one side of the first region; as well as The second resin layer is located between the second bonding target and the opposite surface and covers at least a portion of a side surface of the second bonding target.

8. The display device according to claim 7, wherein the first resin layer in the first region comprises one of a photocurable resin and a thermosetting resin, and The second resin layer in the second region includes the other of the photocurable resin and the thermosetting resin.

9. The display device according to claim 1, further comprising an integrated circuit film connected to the display panel and having a driving integrated circuit mounted thereon, The first bonding target includes a printed circuit board connected to the integrated circuit film. 10 . The display device according to claim 1 , wherein the first resin layer covers at least a portion of an upper surface of the first bonding target.

11. A method for manufacturing a display device, the method comprising: preparing a display panel including one surface on which a screen is defined and an opposite surface positioned opposite to the one surface; forming a first resin layer on the opposing surface by applying a resin to a first region of the opposing surface; providing a first bonding target on the first resin layer; After setting the first combination target, waiting for a predetermined time; as well as The first resin layer is cured.

12. The method according to claim 11, further comprising: forming a first upper resin layer by further applying the resin to the first resin layer and the first bonding target after curing the first resin layer; as well as The first upper resin layer is cured.

13. The method according to claim 11, further comprising forming a pad layer on the opposite surface, The forming of the first resin layer includes applying the resin to the opposite surfaces and the cushion layer. 14 . The method according to claim 11 , wherein an area of ​​the first resin layer is larger than an area of ​​the first bonding target when viewed in a direction perpendicular to the opposite surface. The method according to claim 11 , wherein the first resin layer comprises a photocurable resin or a thermosetting resin. 16 . The method according to claim 15 , wherein the first resin layer further comprises a metal material mixed with the photocurable resin or the thermosetting resin.

17. The method according to claim 11, further comprising: forming a second resin layer by applying the resin to a second region of the opposite surface located on one side of the first region; as well as A second bonding target is provided on the second resin layer.

18. The method according to claim 17, further comprising: After setting the second combination target, waiting for a predetermined time; as well as The second upper resin layer is cured.

19. The method according to claim 18, wherein the first resin layer in the first region comprises one of a photocurable resin and a thermosetting resin, and The second resin layer in the second region includes the other of the photocurable resin and the thermosetting resin. 20 . The method of claim 13 , wherein an area of ​​the first resin layer is larger than an area of ​​the pad layer when viewed in a direction perpendicular to the opposite surface of the display panel.

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