Membrane dialysis device

Abstract

A membrane dialysis device (100) is described, comprising: i) a first dialysis portion (110) having ia) a first dialysis medium region (112), ib) a first diffusion medium region (113), and ic) a first membrane portion (111) arranged between the first dialysis medium region (112) and the first diffusion medium region (113); ii) a second dialysis portion (120) having: iia) a second dialysis medium region (122), iib) a second diffusion medium region (123), and iic) a second membrane portion (121) arranged between the first dialysis medium region (122) and the second diffusion medium region (123); and iii) a separating device (140) which spatially separates the first dialysis part (110) from the second dialysis part (120). The first dialysis medium region (112) is thus fluidically coupled to the second dialysis medium region (122) such that the dialysis medium (101) flows through the first dialysis medium region (112) and then through the second dialysis medium region (122).

Description

Technical Field

[0001] The present invention relates to a membrane dialysis device having at least two dialysis sections separated by a separator. Furthermore, the present invention relates to a method for treating a dialysis medium, in particular waste fluid from component carrier production. Furthermore, the present invention relates to the specific use of a separator plate in membrane dialysis.

[0002] Thus, the present invention may relate to the technical field of (acid) membrane dialysis, for example to the field of treatment of wastewater from the manufacture of component carriers such as printed circuit boards and IC substrates. Background Art

[0003] In various industrial applications, it may be necessary to separate acids or bases from wastewater to enable their recovery or to improve wastewater treatment. This can be advantageous for separating acids from wastewater that often contains valuable metals such as copper ions. In this case, a very effective method can be membrane dialysis, in which the acid can be removed while the valuable metals remain in the wastewater. Membrane dialysis is a known process that can be used for this purpose.

[0004] FIG3 shows a conventional example of a membrane dialysis device 200. Wastewater 201 containing a high concentration of acid flows into the device 200 at a first side, where the wastewater 201 is divided into three (or more) parallel streams, namely, dialysis zones 212a to 212c. At a second side of the device 200, water 203 is input as a diffusion medium and divided into three parallel streams, namely, diffusion zones 213a to 213c. Each of the three dialysis zones 212a to 212c is separated from adjacent diffusion zones 213a-c by membranes 215a to 215e, respectively.

[0005] In other words, the flow of treatment medium 201 is separated from the flow of purified water 203 by the ion-selective membrane 215. The concentration gradient across the membrane ensures that all components diffuse into the flow of purified water 203. Thus, the membrane 215 can be configured to allow only acid ions and / or (alkali) metal ions to pass through, and thus the acid ions and / or (alkali) metal ions are separated into the flow of water 203. As a result, the treatment medium 201 can be free of acids and alkali metals, while the concentration of, for example, heavy metals can remain stable.

[0006] However, the application of membrane dialysis may still include the following disadvantages.

[0007] Gas formation: In some cases, gas bubble formation can be observed, for example, within approximately 24 hours after the start of treatment. This phenomenon can significantly reduce the active surface area of ​​the dialysis membrane. To remove the gas from the liquid, the treatment must be stopped for, for example, approximately 30 minutes. This impedes treatment continuity and, in some cases, can reduce treatment efficiency to approximately 80% to 90%.

[0008] When the pH changes during the dialysis process, gas may form due to changes in the solubility of carbon dioxide. The higher the acid concentration, the more gas is formed. In a particularly challenging example, the process had to be stopped after four hours due to bubbles. As a result, efficiency may drop to approximately 25%.

[0009] - Membrane area: The active area of ​​the membrane may still be considered small and therefore not very efficient.

[0010] - Stability and / or sealing: Especially during long-term operation, stability and sealing may not be guaranteed, thus affecting efficiency. Summary of the Invention

[0011] It may be desirable to provide an efficient and robust membrane dialysis, particularly for acid / metal-rich wastewaters.

[0012] A membrane dialysis device, a method for treating a dialysis medium, and a use are described.

[0013] According to a first aspect of the present invention, a membrane dialysis device is described, the membrane dialysis device comprising:

[0014] i) a first dialysis section having:

[0015] ia) a first dialysis medium region (e.g., a first dialysis medium flow path),

[0016] ib) a first diffusion medium region, and

[0017] ic) a first membrane portion (membrane or a portion of a membrane) arranged in a first

[0018] between the dialysis medium region and the first diffusion medium region;

[0019] ii) a second dialysis section having:

[0020] iia) a second dialysis medium region,

[0021] iib) a second diffusion medium region, and

[0022] iic) a second membrane portion, which is arranged between the first dialysis medium region and the second

[0023] between two diffusion medium regions; and

[0024] iii) A separation device (eg a plate) which spatially separates the first dialysis part from the second dialysis part.

[0025] The first dialysis medium region is here fluidically coupled to the second dialysis medium region, so that (in operation) the dialysis medium flows through the first dialysis medium region and then through the second dialysis medium region (ie the dialysis portions are arranged consecutively).

[0026] According to a second aspect of the present invention, a method for treating a dialysis medium, in particular a waste fluid from component carrier production, is described, comprising:

[0027] i) flowing the dialysis medium in a first dialysis portion through a first dialysis medium region separated from a first diffusion medium region by a first membrane portion; and then,

[0028] ii) flowing the dialysis medium in a spatially separated second dialysis portion through a second dialysis medium region fluidically connected to the first dialysis region, wherein the second dialysis medium region is separated from the second diffusion medium region by a second membrane portion.

[0029] According to a third aspect of the invention, the use (method of use) of a separator (separator) located between membrane-containing parts of a membrane dialysis device is described, which separator is used to enable a dialysis medium (containing acid and metal) to flow through the membrane dialysis device in a turbulent manner, in particular, the membrane dialysis device has six or more membranes.

[0030] According to another aspect of the present invention, a process control device for regulating the above method and / or the above device is discussed. The process control device comprises:

[0031] i) a database for capturing at least one process parameter, in particular a plurality of process parameters (and corresponding actual values) from the running process,

[0032] ii) a data model unit for storing at least one predetermined process parameter, in particular a plurality of predetermined process parameters (and corresponding target values), and iii) a calculation device adapted to:

[0033] a) comparing a captured process parameter with a predetermined process parameter (and correspondingly comparing a plurality of captured process parameters with a plurality of predetermined process parameters),

[0034] b) determining a control operation based on the comparison result (eg, actively compensating for a difference between the actual value and the target value), and c) executing a predetermined control operation (eg, adjusting the flow rate, etc.).

[0035] According to a further aspect of the invention, a computer program product for controlling a method for manufacturing a component carrier is described, which computer program product controls the method (as described above) and / or the device (as described above) and / or the process control device (as described above) when executed by one or more processors (and correspondingly by one or more computers).

[0036] In the context of this document, the term "acid- and metal-containing medium" may particularly denote any (liquid) medium comprising an acid and a metal (salt). Examples of such metals include: copper, nickel, gold, silver, cobalt, cadmium, magnesium, sodium, palladium, tin. Examples of acids include: sulfuric acid, hydrochloric acid, nitrous acid, phosphoric acid. A metal salt is a chemical compound between a metal and an acid, wherein the metal salt exists, for example, as a sulfate, chloride, nitrate or phosphate, respectively. Accordingly, the metal salt may be, for example, copper sulfate or copper chloride. This may be present in the acid- and metal-containing medium as metal ions and salt ions. The acid- and metal-containing medium may also include, in addition to the metal salt, a solution, which may be aqueous or acidic, in which the metal salt is dissolved. For example, in addition to water, the medium may also include hydrochloric acid and / or sulfuric acid or an organic solvent.

[0037] In an example, the acid-metal-containing medium originates from circuit board and / or substrate manufacturing and may include corresponding residues. Furthermore, the acid-metal-containing medium may be treated so that essentially only metal (salt) is present. In an example, the acid-metal-containing medium is (essentially) free of (unwanted) foreign metal (e.g., iron). In another example, the acid-metal-containing medium includes (residues of) foreign metal.

[0038] In the context of this document, the term "dialysis" may particularly denote the use of a concentration-driven membrane process to remove molecules (particularly ions) from a solution. Alternatively, a (partial) pressure-driven membrane process may also be used to remove molecules. In an embodiment, a dialysis medium is provided at a first side of the membrane via a first supply (dialysis input) and an additional medium (e.g. water) is provided at a second side of the membrane (opposite to the first side) via a second supply (diffusion input). The membrane may be semi-permeable and allow anions (e.g. chloride ions) to pass (anionic membrane) while allowing cations (e.g. Cu 2+ ions) to pass (anionic membrane). 2+) cannot pass. Therefore, cations, especially metal cations, may be enriched in the dialysate medium, while anions (such as chloride ions) may be enriched in the diffusate medium. Due to charge compensation, H + ions (protons). The combination of these two processes causes the pH to drop, making the diffuser highly acidic. Therefore, the term "acid dialysis" can be used for this dialysis process.

[0039] In the context of this document, the term "membrane" may particularly refer to a thin layer structure configured as a selective barrier. For the membrane dialysis described below, the same membrane or (preferably) different membranes may be used accordingly. The term "membrane portion" may particularly refer to a portion of a membrane or the entire membrane. For example, a membrane portion may be configured as a plate membrane. In another example, a membrane portion may be configured as a portion of a hollow membrane. This is because the same hollow membrane may be suitable for separating multiple dialysis medium regions from diffusion medium regions in different dialysis portions. Therefore, each dialysis portion may include membrane portions from the same membrane.

[0040] In addition to sheet membranes and hollow membranes, the membrane portion may also include, for example, one of the following: a dry membrane, a wet membrane, a spiral membrane (a spiral membrane may in particular be a wet membrane wound around a distribution core), a mesh-free membrane, a membrane with functional groups, a cation-selective membrane, an anion-selective membrane, an anion exchange membrane.

[0041] The anionic membrane can be functionalized, for example, with bromine (Br-), wherein the support material can be, for example, PET or PVC. In some cases, the metal salt-containing solution can include hydrogen peroxide (H2O2). In this case, an oxidation-resistant membrane based on, for example, PEEK (polyetheretherketone) can be preferably used.

[0042] In the context of this document, the term "dialysis medium region" may particularly refer to a region configured to allow a dialysis medium to flow through / over. In one example, the dialysis medium region may be configured as a channel through which the acid- and metal-containing medium flows. In another example, the dialysis medium region may be configured as a plate through which the acid- and metal-containing medium flows.

[0043] In the context of this document, the term "diffusion medium region" may refer to a region configured to allow diffusion medium to flow through. In one example, the diffusion medium region may be configured as a channel through which purified water or diffusion medium flows. In another example, the diffusion medium region may be configured as a plate through which purified water or diffusion medium flows.

[0044] In the context of this document, the term "separator" may particularly refer to a device suitable for separating a dialysis portion from another dialysis portion. In a basic embodiment, the separator is constructed as a plate between two dialysis portions, particularly oriented to be parallel to the membrane portion of the dialysis portion. In another embodiment, the separator may be constructed to seal one dialysis portion from another dialysis portion (in an airtight manner), particularly in a fluid-tight manner. Thus, the sealing performance of the membrane dialysis device can be significantly improved. In addition, the separator may be constructed to improve the stability of the membrane dialysis device. Thus, a large number of dialysis portions, such as six or more dialysis portions, can be applied. In an embodiment, the separator may include plastic, ceramic or metal materials. In a specific example, the separator is constructed as a rigid partition (e.g., corrosion-resistant plastic). The thickness may, for example, be in the range of about 5mm to 10mm.

[0045] In the context of this document, the term "process control device" may particularly denote any device (or devices) suitable for performing process control, wherein the process (at least partially) involves the manufacture of circuit boards and / or substrates. In particular, the process control device is suitable for (at least partially) correspondingly controlling and regulating a valuable material cycle, in which production residues are supplied, thereby generating substantially no waste (heavy metals and / or acids). To this end, the process control device may particularly include a database (unit) and a data model unit, wherein the database stores captured process data and the data model unit stores the required expected process data. The process control device may be coupled to a plurality of sensors and measuring devices in order to determine actual parameters at different process stations. Furthermore, the process control device may also include a computing unit that compares the captured parameters with desired parameters and, based on this comparison, determines and executes control operations. In a preferred embodiment, the process control device includes a self-learning algorithm (AI) by which the control and regulation of the process can be continuously improved accordingly.

[0046] In particular, the flow rate can be adjusted depending on the composition of the feed medium.

[0047] In the context of this document, term "substantially" may be understood to include negligible corresponding residues and pollutants that can no longer be removed by acceptable effort. In an embodiment, these negligible residues and pollutants are (intentionally) undesirable, but can no longer be removed by reasonable effort. For example, a medium with a discharge quality may be substantially free of heavy metals, which may represent that there may be negligible corresponding residues and pollutants (e.g., in the range of lower percentages, thousandths, or even ppm). It will be appreciated by those skilled in the art that, although these corresponding residues and pollutants are not desired, they still cannot be separated in a manner that is acceptable to the technical effort.

[0048] In the context of this document, the term "heavy metal" may particularly denote a metal with a density greater than 5.0 g / cm 3 (or greater than 4.5g / cm 3 ) metals. This includes, for example, copper, nickel, cobalt, gold, silver, palladium, tungsten, tin, zinc, iron, lead, chromium, rhodium, cadmium, etc. According to this definition, silicon, sodium, potassium, calcium, magnesium, etc., are not considered heavy metals. However, in this particular context, aluminum can be exceptionally considered a heavy metal because the described methods may be well suited for aluminum.

[0049] In the context of this document, the term "foreign metal" may particularly denote a metal that is present (in dissolved form) in a metal-containing fluid but is not desired (for certain applications). Examples of such foreign metals (and their corresponding ions) may include, depending on the application: iron, lead, tin, molybdenum, nickel, cobalt, indium, cadmium, zinc, chromium, manganese, palladium.

[0050] In the context of this document, the term "circuit board and / or substrate manufacturing" may particularly denote a process for manufacturing circuit boards and / or substrates, which process is performed in an industrial plant, such as a circuit board factory. The term "circuit board" may particularly relate to a printed circuit board (PCB), whereas the term "substrate" may, for example, relate to a substrate for a semiconductor chip such as an integrated circuit or an organic interposer. Circuit board and / or substrate manufacturing typically comprises an etching process, in which metal is removed by etching to obtain the desired metal structure, and a plating process, in which the metal is treated by plating. The starting materials for circuit board and / or substrate manufacturing mainly comprise metal and an electrically insulating material, which is typically an organic material, such as a resin. The products of the process may be finished circuit boards and substrates, respectively, or may also be intermediate products.

[0051] In the context of this document, the term "etching process" can particularly refer to the following process for the manufacture of circuit boards and / or substrates: the process involves etching metal, particularly copper, to provide the desired metal (electrical conduction) structure. According to an exemplary embodiment, the process can be carried out as follows: a photoresist protects the copper paths that should not be etched, while the copper areas that should be etched are not covered by the photoresist. First, for this purpose, the entire copper layer is coated with photoresist. Then, the photoresist is developed with UV light through a mask. The mask allows ultraviolet light to pass only at the locations where the photoresist should remain (i.e., the locations where the desired conductor traces should be set). During development, the photoresist (and the corresponding polymer) cross-links at the locations that have been exposed to UV light. After development, the unexposed (and corresponding undeveloped) photoresist can be easily rinsed off. Subsequently, the panel (and the corresponding component carrier preform) is etched. The photoresist protects the conductor traces, while the copper that is not covered with photoresist is etched / removed. When the etching process is complete, the photoresist is removed and stripped accordingly (the photoresist has been cross-linked and cured), and the conductor tracks remain. The stripped photoresist can then be precipitated by ferric chloride.

[0052] According to an exemplary embodiment, the present invention is based on the idea that efficient and robust membrane dialysis, in particular for acid / metal-rich wastewater, can be provided when the dialysis sections are connected in series (one after another, i.e. the fluid passes through the sections one after another) rather than in parallel (side by side, i.e. the fluid passes through all sections simultaneously) and are also separated by corresponding separation devices.

[0053] By using a spacer, the stability of the membrane device (membrane stack) can be significantly enhanced, and the packing density (the stacking of membranes and spacers) can also be increased. More membranes can be stacked (e.g., even in the range of one hundred or more), thereby reducing the total number of independent modules required for processing. Consequently, compared to conventional membrane devices, the effective area of ​​the membrane can be increased accordingly, thereby improving performance. Space requirements can be reduced, and the sealing of the membrane device (stack) can be improved.

[0054] In some examples, the efficiency of acid and / or metal recovery is improved, resulting in savings in material, procurement, transportation, and wastewater treatment costs. In addition, CO2 emissions can be reduced.

[0055] In particular, it has been unexpectedly discovered that the separators can generate turbulent flow, thereby suppressing the formation of bubbles. Additionally or alternatively, the turbulent flow can efficiently transport bubbles out of the membrane dialysis device. By adjusting the number of membranes and / or separators, the flow rate can be adjusted.

[0056] Exemplary embodiments

[0057] According to an embodiment, a first diffusion medium region is fluidly coupled to a second diffusion medium region such that the diffusion medium flows through the first diffusion medium region and then through the second diffusion medium region. By the terminology used, this example describes a flow pattern in which the dialysis medium and the diffusion medium flow in the same direction (in parallel).

[0058] According to an embodiment, a first diffusion medium region is fluidly coupled to a second diffusion medium region such that the diffusion medium flows through the second diffusion medium region and then through the first diffusion medium region. The terminology used in this example describes a flow pattern in which the dialysis medium and the diffusion medium flow in opposite directions (parallel). In this example, the freshest water flows against the most depleted dialysis medium.

[0059] According to an embodiment, the flow speed / velocity in the diffusion medium region may be the same as the flow speed / velocity in the dialysis medium region. Alternatively, the flow speeds may also be different.

[0060] Depending on the embodiment, a flow rate in the range of 0.05 l / min to 50 l / min may be applied.

[0061] According to another embodiment, the diffusion medium comprises water, in particular purified water. Thus, an efficient diffusion gradient can be established while using a non-swelling diffusion medium. In another embodiment, an organic solvent can be used as the diffusion medium.

[0062] According to another embodiment, the dialysis medium comprises an acid- and metal-containing medium, in particular wastewater from component carrier manufacturing. This offers the advantage of reducing (high) acid content while retaining valuable metals in solution. This also allows for efficient recovery and, on the one hand, reduces wastewater treatment and disposal costs.

[0063] According to another embodiment, the dialysate medium comprises an acid-free, in particular substantially acid-free, metal-containing medium. This dialysate medium can be fed back to the component carrier manufacturing process. For example, the dialysate medium can be further processed, for example by electrodialysis, to obtain valuable metals as elemental metals, such as pure copper, which can be directly used in the plating process.

[0064] According to another embodiment, the diffusate medium comprises an acidic medium, in particular a metal-free acidic medium (e.g., hydrochloric acid). In one example, the pH of the diffusate can be 5 or less, in particular 3 or less. This diffusate medium can be fed back to the component carrier manufacturing process, for example, as acid back to the etching process. Further processing is also possible, for example, by concentrating the acid.

[0065] According to further embodiments, the membrane dialysis device is configured such that the dialysis medium and / or the diffusion medium flows as at least one of:

[0066] i) continuous unidirectional flow,

[0067] ii) at least partially turbulent,

[0068] iii) Allowing air bubbles to be carried away.

[0069] The inventors have surprisingly found that turbulent flow (e.g., Reynolds number > 3200, preferably > 4000) can be advantageously established to carry away gas bubbles that would otherwise obstruct the process flow. An effective means of providing turbulent flow can be continuous unidirectional flow (continuous flow through the dialysis medium region / diffusion medium region), particularly in combination with one or more partitioning devices.

[0070] Furthermore, in the manner described, the separation rate can be increased, since the boundary layer becomes thinner and diffuses faster. Due to the spacer between the membrane and the separation means (plates / baffles), turbulence occurs.

[0071] According to a further embodiment, the membrane dialysis device further comprises a dialysis inlet for feeding a dialysis medium, wherein the dialysis inlet is coupled to the first dialysis medium region.

[0072] According to a further embodiment, the membrane dialysis device further comprises a dialysate outlet for discharging the dialysate medium, in particular wherein the dialysate outlet is coupled to a dialysis medium region downstream of the process.

[0073] According to another embodiment, the membrane dialysis device also includes a diffusion (medium) input part, which is used to input the diffusion medium, in particular, wherein the diffusion input part is coupled to the first diffusion medium area or to the diffusion medium area corresponding to the dialysis medium area downstream of the process.

[0074] According to a further embodiment, the membrane dialysis device further comprises a diffuser output for outputting the diffuser medium, wherein the diffuser output is coupled to the first diffusion medium region or to a diffusion medium region corresponding to a dialysis medium region downstream of the process.

[0075] According to a further embodiment, the membrane dialysis device is configured such that, during operation of the membrane dialysis device, the dialysis input and the diffusion input (eg purified water and feed) are arranged at the bottom.

[0076] According to a further embodiment, the membrane dialysis device further comprises a dialysate output and a diffuser output arranged at the top (see, for example, Figure 2 ). This can provide the following advantages: bubbles (especially bubbles carried away by turbulence) are more easily removed because they can flow directly upwards into the air. Compared to conventional devices (see Figure 4), the two outputs (permeate and diffused) are oriented towards the top to achieve efficient exhaust.

[0077] According to further embodiments, a bubble removal step may be performed before the dialysis process, for example by using a vacuum. This may provide the advantage of reducing the amount of bubbles that may form in particular in the area / sides of the diffuser medium.

[0078] According to another embodiment, the membrane dialysis device further includes a deflection device that laterally delimits the first dialysis portion and / or the second dialysis portion. This can further stabilize the membrane dialysis device. Compared to providing a partition between the individual portions, the deflection device can laterally separate the dialysis portion from the surrounding environment. Consequently, stability, sealing, and packing density can be further improved.

[0079] Additionally or alternatively, the deflection device may be configured to (further) create turbulence in the flow (eg by means of turbulence-promoting structures, such as specific protrusions). This may provide advantages in removing air bubbles, thereby enabling a more efficient dialysis process.

[0080] According to another embodiment, the separator and / or the deflection device are designed as a layered structure, in particular, the separator and the deflection device are arranged perpendicular to each other. In a specific embodiment, the separator and the deflection device are both designed as plates and are coupled (connected) at right angles. Thus, the separator can protect the dialysis parts from each other, while the deflection device can protect the dialysis devices laterally.

[0081] According to a further embodiment, the deflection device comprises a dialysis medium channel which fluidically connects the first dialysis medium region with the second dialysis medium region.

[0082] According to further embodiments, the deflection device includes a diffusion media channel fluidly connecting the first diffusion media region with the second diffusion media region.

[0083] This may provide the advantage that the deflection device can be used both as a protective device and as a channel.In an embodiment, the deflection device can be configured in a plate-like manner, and the channel can also be plate-like.

[0084] According to a further embodiment, the partitioning device and the deflecting device are coupled to each other, in particular connected to each other. This measure can improve at least one of the stability, the packing density and the sealing.

[0085] According to another embodiment, the first membrane part and / or the second membrane part is constructed according to at least one of the following: a dry membrane, a wet membrane, a plate membrane, a hollow membrane, a plurality of hollow membranes, a spiral membrane, a mesh-free membrane, a membrane with functional groups, a cation selective membrane, an anion selective membrane, an anion exchange membrane, in particular, wherein the first membrane part is different from the second membrane part.

[0086] Hollow membrane refers to a hollow module structure with a wet membrane or a dry membrane. A meshless membrane can be considered as a membrane with no mesh applied to it, which increases the effective surface area of ​​the membrane (estimated to increase by about 5% to 15% depending on the structure of the mesh), which can also bring advantages in price and processing engineering.

[0087] According to an embodiment, the membrane is not limited to metal cations. Other cations such as ammonium ions / phosphorus ions can also selectively pass through the membrane.

[0088] According to a further embodiment, the membrane dialysis device further comprises a third dialysis section having:

[0089] a) a third dialysis medium region,

[0090] b) a third diffusion medium region, and

[0091] c) a third membrane section disposed between a third dialysis medium region and a third diffusion medium region; and

[0092] d) A further partitioning device which spatially separates the second dialysis part from the third dialysis part.

[0093] The second dialysis medium region is fluidly coupled to the third dialysis medium region such that dialysis medium flows through the first dialysis medium region, then through the second dialysis medium region, and subsequently through the third dialysis medium region (the same may be true for the diffusion medium region).

[0094] According to a further embodiment, the spacer device and the further spacer device are oriented parallel. This may provide the advantage that the membrane devices can be stacked, in particular to form a stack with high density and high stability.

[0095] According to another embodiment, the membrane dialysis device further comprises further deflection means which laterally delimit the second dialysis part and / or the third dialysis part. This can provide the following advantages: the membrane device (stack) can be well protected laterally while increasing density and stability.

[0096] According to a further embodiment, the deflection device and the further deflection device are arranged on opposite sides of the membrane dialysis device, more particularly arranged essentially in parallel.

[0097] According to a further embodiment, the dialysis medium and the diffusion medium flow in countercurrent relative to one another.

[0098] According to an exemplary embodiment, the processing path in the plate type acid dialyzer is extended. The pressure-stable partition (separator) may not succumb to the contact pressure of the external pressure plate (deflection device), and can be designed to make the entire sealing surface provided by the spacer (separator) effective. In addition, the gas formed in the membrane stack can be discharged continuously, because the speed of water and medium can be increased accordingly and therefore bubbles can be transported away. Therefore, the membrane stack can be operated continuously and without interruption (reaching 100% efficiency). The innovative design of the plate dialyzer also provides the possibility of forming different separated areas (dialysis part) in the module. A separate area can be formed between each partition.

[0099] According to the exemplary embodiment, the following advantages can be achieved:

[0100] - Improved separation rate compared to standard mode,

[0101] - reduced water consumption and / or increased acid / base concentration in the diffused product,

[0102] -Ability to enrich acid / base concentration,

[0103] - operating parameters are constant even with exhaust media (no backwashing required and less water consumption),

[0104] -The system is self-monitoring and can adapt to fluctuating feed flows,

[0105] -Simple design of scalable compact modular design, easy to modify.

[0106] - Use dialysis for enrichment rather than just separation.

[0107] According to the embodiment, the membrane area loading speed (1 l / h / m 2 Up to 2 l / h / m 2 ) and overflow velocity are very important for forming turbulent flow and improving separation rate. Therefore, it is possible to avoid the formation of concentration gradients in laminar flow caused by slow flow rate and to avoid the reduction of separation performance of the plate.

[0108] According to an embodiment, dissolved gases in ultrapure water (diffusion medium) can be degassed by pH changes and thus the formation of "air pockets" in the module can be overcome.

[0109] According to an embodiment, the separation plate increases the flow rate in the module and thus increases the likelihood of entraining air bubbles and venting them from the module.

[0110] According to an embodiment, the orientation of the module outlet on the top allows gas to escape.

[0111] According to an embodiment, gas formation is suppressed by adjusting physical parameters, such as high pressure (eg 116 bar) / temperature setting (20° C. to 50° C., further 20° C. to 100° C.).

[0112] According to an embodiment, balancing of the flow restrictors enables different flow rates to be achieved without requiring adjustments to the pump.

[0113] Depending on the embodiment, switching between cross-flow and counter-flow produces different separation results.

[0114] According to an embodiment, resources are saved and the modular structure allows connection of individual modules if the flow fluctuates.

[0115] Depending on the embodiment, a control / regulation system is applied at the output, for example an optical inspection at the diffusate output or a pH measurement at the dialysate output.

[0116] According to a further embodiment, at least one membrane can be replaced or recycled. This is a fast and efficient way to ensure a high quality / throughput process.

[0117] According to further embodiments, the different membrane sections may comprise different membranes. For example, in the first dialysis section a "heavy duty" membrane may be used, whereas in the last dialysis section a purification membrane may be used.

[0118] According to another embodiment, the separator includes a flow structure for promoting turbulence. This can provide the advantage that the aforementioned positive effects of turbulence can be enhanced. For example, the separator can include projections extending into the corresponding medium area, such projections being shaped, for example, as rakes or teeth.

[0119] In an embodiment, the component carrier is configured as one of a printed circuit board, a substrate (in particular an IC substrate) and an interposer.

[0120] In one embodiment, the component carrier is formed as a plate-like member. This facilitates a compact design, while still providing a large base for mounting components. Furthermore, bare wafers, particularly as an example of embedded electronic components, can be easily embedded in thin boards such as printed circuit boards due to their small thickness.

[0121] In an embodiment, a component carrier stack includes at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate of one or more electrically insulating layer structures and one or more electrically conductive structures, particularly a laminate formed by applying mechanical pressure and / or heat. This stack can provide a plate-like component carrier that can provide a large mounting surface for other components while still being very thin and compact.

[0122] In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a plate-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, for example by applying pressure and / or providing heat energy. As a preferred material for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures may comprise resin and / or fiberglass, so-called prepregs or FR4 materials. The individual electrically conductive layer structures can be connected to one another in the desired manner by forming holes through the laminate, for example by laser drilling or mechanical drilling, and partially or completely filling the holes with an electrically conductive material, in particular copper, to form vias or any other through-hole connections. The filled holes may connect the entire stack (through-hole connections extending through multiple layers or the entire stack), or they may connect at least two electrically conductive layers, so-called vias. Similarly, optical interconnects may be formed through the various layers of the stack to accommodate electro-optical circuit boards (EOCBs). In addition to one or more components that can be embedded in the printed circuit board, the printed circuit board is generally configured to accommodate one or more components on one surface or two opposite surfaces of the plate-shaped printed circuit board. The one or more components can be connected to the corresponding main surface by soldering. The dielectric portion of the PCB may include a resin with reinforcing fibers (such as glass fibers).

[0123] In the context of the present application, the term "substrate" may particularly denote a small component carrier. A substrate may be a relatively small component carrier relative to a PCB, to which one or more components may be mounted, and which may serve as a connection medium between one or more chips and another PCB. For example, a substrate may have approximately the same dimensions as the components to be mounted thereon (e.g. in the case of a chip scale package (CSP)). In another embodiment, the substrate may be substantially larger than the allocated components (e.g. in a flip chip ball grid array - FCBGA configuration). More specifically, a substrate may be understood as a carrier for electrical connectors or electrical networks, and a component carrier for connectors arranged laterally and / or vertically that is comparable to a printed circuit board (PCB) but with a relatively high density. Lateral connectors are, for example, conductive paths, while vertical connectors may, for example, be drilled holes. These lateral and / or vertical connectors are arranged within the substrate and can be used to provide electrical, thermal, and / or mechanical connections between accommodated components or unaccommodated components (such as bare dies), in particular IC chips, and a printed circuit board or an intermediate printed circuit board. Therefore, the term "substrate" also includes "IC substrate." The dielectric portion of the substrate may comprise a resin with reinforcing particles (such as reinforcing spheres, in particular glass spheres).

[0124] The substrate or interposer may include or be composed of a layer of at least one of the following: glass; silicon (Si); and / or a photosensitive or dry-etchable organic material, such as an epoxy-based laminate material (e.g., an epoxy-based laminate film); or a polymer compound (which may or may not include photosensitive and / or heat-sensitive molecules), such as polyimide or polybenzoxazole.

[0125] In one embodiment, the at least one electrically insulating layer structure comprises at least one of the following: a resin or polymer, such as an epoxy resin, a cyanate ester resin, or a benzocyclobutene resin; a bismaleimide triazine resin; a polyphenylene derivative (e.g., based on polyphenylene ether, PPE), polyimide (PI), polyamide (PA), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), and / or combinations thereof. Reinforcement structures, such as mesh, fibers, spheres, or other types of filler particles, made of glass (multilayer glass), may also be used to form the composite. A semi-cured resin combined with a reinforcing agent, such as fibers impregnated with such resins, is referred to as a prepreg. These prepregs are often named after their properties, such as FR4 or FR5, which describe their flame retardancy. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based laminates (e.g., epoxy-based laminate films) or photosensitive dielectric materials, may also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and / or cyanate ester resins may be preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other low, very low or ultra-low DK materials can be used as electrically insulating structures in the component carrier.

[0126] In an embodiment, the at least one electrically conductive layer structure comprises at least one of the following: copper, aluminum, nickel, silver, gold, palladium, tungsten, magnesium, carbon, (particularly doped) silicon, titanium, and platinum. Although copper is generally preferred, other materials or coatings thereof are also possible, in particular coatings with superconducting materials or conductive polymers, such as graphene or poly(3,4-ethylenedioxythiophene) (PEDOT), respectively.

[0127] At least one additional component can be embedded in the stack and / or surface-mounted on the stack. The component and / or the at least one additional component can be selected from the following: a non-electrically conductive inlay, an electrically conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (such as a heat pipe), an optical element (such as an optical waveguide or optical conductor connector), an electronic component, or a combination thereof. The inlay can be, for example, a metal block with or without a coating of insulating material (IMS inlay), which can be embedded or surface-mounted to promote heat dissipation. Suitable materials are defined by their thermal conductivity, which should be at least 2 W / mK. Such materials are typically based on, but not limited to, metals, metal oxides, and / or ceramics, such as copper, aluminum oxide (Al2O3), or aluminum nitride (AlN). Other geometries with increased surface area are also often used to improve heat exchange capacity. Furthermore, the component may be an active electronic component (having at least one realized pn junction), a passive electronic component (such as a resistor, an inductor, or a capacitor), an electronic chip, a memory device (e.g., a DRAM or another data memory), a filter, an integrated circuit (such as a field programmable gate array (FPGA), a programmable array logic (PAL), a general array logic (GAL), and a complex programmable logic device (CPLD)), a signal processing component, a power management component (such as a field effect transistor (FET), a metal oxide semiconductor field effect transistor (MOSFET), a complementary metal oxide semiconductor (CMOS), a junction field effect transistor (JFET), or an insulated gate field effect transistor (IGFET)). Transistors (IGFETs), all of which are based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), indium phosphide (InP) and / or any other suitable inorganic compound), optoelectronic interface elements, light-emitting diodes, optocouplers, voltage converters (e.g. DC / DC converters or AC / DC converters), cryptographic components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips and energy harvesting units. However, other components can be embedded in the component carrier. For example, a magnetic element can be used as a component. Such a magnetic element can be a permanent magnetic element (such as a ferromagnetic element, an antiferromagnetic element, a multiferroic element or a ferrimagnetic element, such as a ferrite core) or can be a paramagnetic element. However, the component can also be an IC substrate, an interposer or another component carrier, for example in a board-in-board configuration. The component can be surface-mounted on the component carrier and / or embedded in the interior of the component carrier.In addition, other components, in particular components that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment, can also be used as components.

[0128] In an embodiment, the component carrier is a laminated component carrier. In this embodiment, the component carrier is a composite of multiple layers that are stacked and connected together by applying pressure and / or heat.

[0129] After the internal layer structure of the component carrier has been treated, one or both main surfaces of the treated layer structure can be covered symmetrically or asymmetrically with one or more further electrically insulating and / or electrically conductive layer structures (in particular by lamination). In other words, the layer buildup can be continued until the desired number of layers is achieved.

[0130] After the formation of the stack of electrically insulating and electrically conductive layer structures has been completed, the resulting layer structure or component carrier can be subjected to a surface treatment.

[0131] In particular, with regard to surface treatment, an electrically insulating solder resist can be applied to one or both major surfaces of a laminate or component carrier. For example, such a solder resist can be formed over the entire major surface, and the solder resist layer can then be patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to an electronic peripheral. Surface portions of the component carrier still covered with solder resist, particularly those containing copper, can be effectively protected from oxidation or corrosion.

[0132] In terms of surface treatment, a surface treatment can also be selectively applied to exposed electrically conductive surface portions of a component carrier. This surface treatment can be an electrically conductive covering material on exposed electrically conductive layer structures (such as pads, conductive traces, etc., particularly pads, conductive traces, etc. comprising or consisting of copper) on the surface of the component carrier. If such exposed electrically conductive layer structures are not protected, the exposed electrically conductive component carrier material (particularly copper) may oxidize, thereby reducing the reliability of the component carrier. The surface treatment can then be formed, for example, as a joint between a surface-mounted component and the component carrier. The surface treatment has the function of protecting the exposed electrically conductive layer structures (particularly copper circuits) and enables connection to one or more components, such as by soldering. Examples of suitable materials for the surface treatment include organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), electroless nickel immersion palladium immersion gold (ENEPIG), gold (particularly hard gold), electroless tin (chemical and electroplated), nickel gold, nickel palladium, etc. Nickel-free materials for the surface treatment can also be used, especially for high-speed applications. Examples are ISIG (Immersion Silver / Gold) and EPAG (Electroless Palladium Autocatalytic Gold).

[0133] The aspects defined above and further aspects of the present invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0134] Figure 1 A top view of a membrane dialysis device according to an exemplary embodiment of the present invention is shown.

[0135] Figure 2 Shown is a simplified side view of a membrane dialysis device according to an exemplary embodiment of the present invention.

[0136] FIG3 shows a top view of conventional membrane dialysis.

[0137] FIG4 shows a side view of conventional membrane dialysis.

[0138] FIG5 shows a schematic diagram of a membrane dialysis system according to an exemplary embodiment of the present invention.

[0139] The illustrations in the drawings are schematic. In different drawings, similar or identical elements are provided with the same reference signs. DETAILED DESCRIPTION

[0140] Figure 1 A top view (along the Z axis) of a membrane (acid) dialysis device 100 according to an exemplary embodiment of the present invention is shown. In this schematic example, the membrane dialysis device 100 includes three membrane sections 110, 120, 130 for performing a corresponding dialysis process. In other preferred embodiments, six or more membrane sections may be used. Contrary to the conventional example described above for FIG3 , the dialysis process is not performed simultaneously (in parallel), but is performed sequentially (continuously).

[0141] The membrane dialysis device 100 includes two inputs: a dialysis (medium) input for inputting a dialysis medium 101 and a diffusion (medium) input for inputting a diffusion medium 103. Accordingly, the membrane dialysis device 100 also includes two outputs: a dialysate output for outputting a dialysate medium 102 and a diffusion output for outputting a diffusion medium 104.

[0142] In the exemplary embodiment described here, the diffusion medium 103 provided at the diffusion input comprises purified water, while the dialysis medium 101 provided at the dialysis input comprises an acid- and metal-containing (salt) medium which does not originate from wastewater of component carrier manufacturing (eg etching processes).

[0143] Thus, the dialysate medium 102 produced at the dialysate output comprises an acid-free, preferably substantially acid-free, metal-containing medium, whereas the diffuser medium 104 obtained at the diffuser output comprises a metal-free, acid-containing medium.

[0144] The membrane dialysis device 100 is divided into three sections 110, 120, and 130, each of which includes one membrane section 111, 121, and 131, one dialysis medium region 112, 122, and 132, and one diffusion medium region 113, 123, and 133. In each section 110, 120, and 130, the corresponding membrane section 111, 121, and 131 is sandwiched between the corresponding dialysis medium region 112, 122, and 132 and the corresponding diffusion medium region 113, 123, and 133.

[0145] There are two different operating modes for the device 100: co-current or counter-current. In the first mode, the first diffusion medium region 113 is fluidically coupled to the second diffusion medium region 123 (and the second diffusion medium region 123 and the third diffusion medium region 133) so that the diffusion medium 103 flows through the first diffusion medium region 113 and then through the second diffusion medium region 123. In other words, fresh diffusion medium 103 is used in the first dialysis process. In the second mode, the diffusion medium 103 flows through the second diffusion medium region 123 and then through the first diffusion medium region 113 (and through the third diffusion medium region 133 before the second diffusion medium region 123). In other words, acid-rich diffusion medium 103 is used in the first dialysis process. As can be seen in FIG. Figure 1 As can be seen in FIG, a second mode, namely counter-flow, is employed. Thus, the dialysis medium 101 and the diffusion medium 103 flow in opposite directions relative to each other.

[0146] The dialysis input 101 is coupled to the first dialysis medium region 112, while the dialysate output 102 is coupled to the dialysis medium region downstream of the process (here, the third dialysis medium region 132). The diffusion input 103 is coupled to the diffusion medium region 133 (here, the third diffusion medium region 132) corresponding to the dialysis medium region downstream of the process, while the diffuser output 104 is coupled to the first diffusion medium region 113 corresponding to the dialysis medium region upstream of the process.

[0147] 3 , the membrane dialysis device 100 further includes a separator 140 that spatially separates the first dialysis section 110 (having a first dialysis medium region 112, a first diffusion medium region 113, and a first membrane section 111) from the second dialysis section 120 (having a second dialysis medium region 122, a second diffusion medium region 123, and a second membrane section 121). Similarly, an additional separator 145 separates the second dialysis section 120 from the third dialysis section 130. In the illustrated example, separators 140 and 145 are arranged between the dialysis sections 110, 120, and 130 and parallel to the membrane sections 111, 121, and 131.

[0148] The first dialysis medium region 112 is therefore fluidly coupled to the second dialysis medium region 122 , such that the dialysis medium 101 flows through the first dialysis medium region 112 and then through the second dialysis medium region 122 , and then through the third dialysis medium region 132 .

[0149] The membrane dialysis device 100 further includes a deflection device 150 that laterally delimits the first dialysis section 110 and the second dialysis section 120. A further deflection device 160 laterally delimits the second dialysis section 120 and the third dialysis section 130. The deflection device 150 and the further deflection device 160 are arranged on opposite sides of the membrane dialysis device 100 and are parallel to each other.

[0150] The separating devices 140 , 145 and the deflecting devices 150 , 160 are designed here as layer structures which are arranged perpendicular to one another and are connected.

[0151] The deflection device 150 includes a dialysis medium channel 152 that fluidly connects the first dialysis medium region 112 with the second dialysis medium region 122 to achieve continuous unidirectional flow. Accordingly, the deflection device 150 includes a diffusion medium channel 153 that fluidly connects the first diffusion medium region 113 with the second diffusion medium region 123. Corresponding additional dialysis medium channels 162 and additional diffusion medium channels 163 can be found in the additional deflection device 160.

[0152] The structure of the membrane dialysis device 100 described is such that the flow of the dialysis medium 101 and the flow of the diffusion medium 103 are continuous, unidirectional flows (continuously passing through each dialysis section) and at least partially turbulent. Preferably, the turbulent flow is capable of entraining (air) bubbles from the membrane dialysis device 100 (which would otherwise impede the function of the dialysis device 100).

[0153] Figure 2A simplified side view (along the Y axis) of a membrane dialysis device 100 according to an exemplary embodiment of the present invention is shown. The membrane dialysis device 100 may be the same as that described above for Figure 1 The membrane dialysis device 100 is arranged in its operating environment (and in operating mode), wherein the dialysis input 101 and the diffusion input 103 are arranged at the bottom. In addition, the dialyzate output 102 and the diffuser output 104 are arranged at the top.

[0154] This arrangement is in contrast to the conventional example shown in FIG4 , in which the input and output are arranged at the top and bottom, respectively. Figure 2 The structure of is chosen intentionally, in particular to make it easier to remove the air bubbles (which are carried away by the turbulence) (letting the bubbles escape directly into the air).

[0155] like Figure 1 As shown in , the membrane dialysis device also includes a plurality of layers stacked in the stacking thickness direction so that the flow of the diffusion medium and the flow of the diffusate medium meander through the layers. Note that this structure is not shown in Figure 2 Detailed description is not shown in FIG, but may be present in one embodiment.

[0156] Figure 5a and Figure 5b A schematic diagram of a membrane dialysis system 180 according to an exemplary embodiment of the present invention is shown. In this context, the term "membrane dialysis system" refers in particular to an arrangement of two or more membrane dialysis devices 100 as described above. As shown in this embodiment, these membrane dialysis devices 100 are preferably fluidically coupled. In these examples, the system 180 includes two membrane dialysis devices 100a, 100b, which are, for example, the membrane dialysis devices 100a, 100b described above. Figure 1 and Figure 2 The device 100 described, the supply means of the diffusion medium 103 (preferably purified water) is connected in parallel ( Figure 5a ) and concatenation ( Figure 5b ) is connected to the membrane dialysis device 100a, 100b.

[0157] Figure 5aPurified (desalinated) water is supplied as diffusion medium 103 to the respective diffusion (medium) inputs of membrane dialysis devices 100a, 100b. In this example, the dialysate 101 input to the first membrane dialysis device 100a is a medium containing highly acidic metal salts from a component carrier etching process. Acid-free metal salt-containing medium 102a is produced at the dialysate output of the first membrane dialysis device 100a. The second membrane dialysis device 100b operates in the same manner, but uses the diffuser output 104a of the first membrane dialysis device 100a as the dialysis medium input.

[0158] The diffusate medium 104a may include a concentration of a metal (e.g., copper) that is lower than the concentration of the metal in the dialysate medium 102a. This is due to the fact that some cations may still pass through the membrane, especially when the cations form complexes and aggregates (e.g., copper-chloride complexes). Without wishing to be bound by any particular theory, it is currently hypothesized that such aggregates may form as the cation concentration in the solution increases.

[0159] The described configuration may be used, for example, when it is desired to recover metals from the dialysis medium 101. A second membrane dialysis step may then be applied to remove acid from the dialysate and thereby obtain a second dialysate 102b having a potential target metal concentration.

[0160] Figure 5b :This implementation method is the same as that for Figure 5a The described embodiments are very similar. The difference is that the supply of diffusion medium 103 is connected to the diffusion medium input 103 of the second membrane dialysis device 100b. In this case, the input to the diffusion medium input 103 of the first membrane dialysis device 100a is the second diffusant medium 104b from the second membrane dialysis device 100b. Furthermore, the first dialysate 102a of the first membrane dialysis device 100a is the input to the dialysis medium input of the second membrane dialysis device 100b.

[0161] In this example, the amount of diffusion medium 103 required can be reduced (e.g., if Figure 5a The flow size of the example flow is the same, but can be reduced by half), thereby producing a diffusion medium containing a higher concentration of acid (particularly HCl). A preferred application may be to increase the velocity of both flows (diffusion medium 103 and dialysis medium 101) to create turbulent flow behavior. Furthermore, by introducing multiple valves, switching between parallel and series processes can be easily achieved (not shown).

[0162] Reference numerals

[0163] 100 Membrane Dialysis

[0164] 100a First membrane dialysis

[0165] 100b Second membrane dialysis

[0166] 101 Dialysis medium (input)

[0167] 102 dialysate (output)

[0168] 102a First dialyzate

[0169] 102b Second dialyzate

[0170] 103 Diffusion medium (input)

[0171] 104 Diffuser (Output)

[0172] 104a First diffuser

[0173] 104b Second diffuser

[0174] 110 First Dialysis Section

[0175] 111 First membrane part

[0176] 112 first dialysis medium area

[0177] 113 First diffusion medium region

[0178] 120 Second Dialysis Section

[0179] 121 Second membrane part

[0180] 122 Second dialysis medium area

[0181] 123 Second diffusion medium region

[0182] 130 Third Dialysis Section

[0183] 131 Third membrane part

[0184] 132 Third dialysis medium area

[0185] 133 Third diffusion medium region

[0186] 140 Separator

[0187] 145 Additional separation devices

[0188] 150 Deflection Device

[0189] 152 Dialysis medium channel

[0190] 153 Diffusion medium channel

[0191] 160 Additional deflection devices

[0192] 162 Additional dialysis medium channels

[0193] 163 Additional diffusion medium channels

[0194] 180 Membrane Dialysis Layout

[0195] Existing technology

[0196] 200 Membrane Dialysis

[0197] 201 Dialysis input

[0198] 202 dialysate output

[0199] 203 Diffusion Input Unit

[0200] 204 Diffuser Output

[0201] 212a to 212c dialysis area

[0202] Diffusion regions 213a to 213c

[0203] 215a to 215e membranes.

Claims

1. A membrane dialysis device (100), comprising: A first dialysis section (110), wherein the first dialysis section (110) has: a first dialysis medium region (112), a first diffusion medium region (113), and A first membrane portion (111) is arranged in the between the first dialysis medium region (112) and the first diffusion medium region (113); A second dialysis section (120), the second dialysis section (120) having: a second dialysis medium region (122), a second diffusion medium region (123), and a second membrane portion (121), the second membrane portion (121) being disposed between the first dialysis medium region (122) and the second diffusion medium region (123); and a partitioning device (140) for spatially separating the first dialysis part (110) from the second dialysis part (120); The first dialysis medium region (112) is fluidically coupled to the second dialysis medium region (122) such that the dialysis medium (101) flows through the first dialysis medium region (112) and then flows through the second dialysis medium region (122).

2. The membrane dialysis device (100) according to claim 1, in, The first diffusion medium region (113) is fluidly coupled to the second diffusion medium region (123), The diffusion medium (103) is caused to flow through the first diffusion medium region (113) and then through the second diffusion medium region (123).

3. The membrane dialysis device (100) according to claim 1, in, The first diffusion medium region (113) is fluidly coupled to the second diffusion medium region (123), The diffusion medium (103) is caused to flow through the second diffusion medium region (123) and then through the first diffusion medium region (113).

4. The membrane dialysis device (100) according to any one of the preceding claims, in, The diffusion medium (103) comprises water, and in particular, the diffusion medium (103) comprises purified water.

5. The membrane dialysis device (100) according to any one of the preceding claims, in, The dialysis medium (101) comprises an acid- and metal-containing medium, in particular, the dialysis medium (101) comprises wastewater from component carrier production.

6. The membrane dialysis device (100) according to any one of the preceding claims, in, The dialysate medium (102) comprises a metal-containing medium that is acid-free, in particular, the metal-containing medium is substantially acid-free.

7. The membrane dialysis device (100) according to any one of the preceding claims, in, The diffusant medium (104) comprises an acid-containing medium, and in particular, the diffusant medium (104) comprises a metal-free acid-containing medium.

8. The membrane dialysis device (100) according to any one of the preceding claims, wherein the membrane dialysis device (100) is configured such that the dialysis medium (101) and / or the diffusion medium (103) flows: Continuous unidirectional flow; and / or at least partially turbulent; and / or So that the bubbles are taken away.

9. The membrane dialysis device (100) according to any one of the preceding claims, further comprising at least one of the following: A dialysis input portion, the dialysis input portion is used to input the dialysis medium (101), in particular, wherein The dialysis input is coupled to the first dialysis medium region (112); a dialysate outlet for discharging the dialysate medium (102), wherein the dialysate outlet is coupled to a dialysate medium region (122, 132) downstream of the process; a diffusion input portion for inputting the diffusion medium (103), wherein the diffusion input portion is coupled to the first diffusion medium region (113), or the diffusion input portion is coupled to a diffusion medium region (123, 133) corresponding to a dialysis medium region (122, 132) downstream of the process; A diffuser output portion for outputting the diffuser medium (104), in particular, wherein the diffuser output portion is coupled to the first diffuser medium region (113), or the diffuser output portion is coupled to a diffuser medium region (123, 133) corresponding to a dialysis medium region (122, 132) downstream of the process.

10. The membrane dialysis device (100) according to claim 9, wherein the membrane dialysis device (100) is configured such that: during operation of the membrane dialysis device (100), The dialysis input (101) and the diffusion input (103) are arranged at the bottom; and / or The dialyzate output (102) and the diffusate output (104) are arranged at the top.

11. The membrane dialysis device (100) according to any one of the preceding claims, further comprising: A deflection device (150) is provided, which delimits the first dialysis portion (110) and / or the second dialysis portion (120) in a laterally direction.

12. The membrane dialysis device (100) according to claim 11, in, The partitioning device (140) and / or the deflecting device (150) are constructed as a layer structure, in particular, wherein the partitioning device (140) and the deflecting device (150) are arranged perpendicular to each other.

13. The membrane dialysis device (100) according to claim 11 or 12, in, The deflection device (150) includes a dialysis medium channel (152) that fluidly connects the first dialysis medium region (112) with the second dialysis medium region (122).

14. The membrane dialysis device (100) according to any one of claims 11 to 13, in, The deflection device (150) includes a diffusion medium channel (153) fluidly connecting the first diffusion medium region (113) and the second diffusion medium region (123).

15. The membrane dialysis device (100) according to any one of claims 11 to 14, in, The partitioning device (140) and the deflecting device (150) are coupled to each other, in particular, the partitioning device (140) and the deflecting device (150) are connected to each other.

16. The membrane dialysis device (100) according to any one of the preceding claims, in, The first membrane portion (111) and / or the second membrane portion (121) are constructed according to at least one of the following: dry membrane, wet membrane, plate membrane, hollow membrane, multiple hollow membranes, spiral membrane, meshless membrane, membrane with functional groups, cation selective membrane, anion selective membrane, anion exchange membrane, In particular, the first membrane portion (111) is different from the second membrane portion (121).

17. The membrane dialysis device (100) according to any one of the preceding claims, further comprising: A third dialysis section (130), the third dialysis section (130) having: a third dialysis medium region (132), a third diffusion medium region (133), and a third membrane section (131), the third membrane section (131) being disposed between the third dialysis medium region (132) and the third diffusion medium region (133); and a further partitioning device (145) which spatially separates the second dialysis part (120) from the third dialysis part (130); wherein the second dialysis medium region (122) is fluidically coupled to the third dialysis medium region (132) such that the dialysis medium (101) flows through the first dialysis medium region (112), then flows through the second dialysis medium region (122), and subsequently flows through the third dialysis medium region (132).

18. The membrane dialysis device (100) according to claim 17, in, The separating means (140) and the further separating means (145) are oriented in parallel.

19. The membrane dialysis device (100) according to claim 17 or 18, further comprising: further deflection means (160) which laterally delimit the second dialysis portion (120) and / or the third dialysis portion (130), In particular, the deflection device (150) and the further deflection device (160) are arranged on opposite sides of the membrane dialysis device (100), more particularly, the deflection device (150) and the further deflection device (160) are arranged substantially in parallel.

20. A method for treating a dialysis medium (101), in particular a waste fluid from component carrier manufacturing, comprising: causing the dialysis medium (101) to flow in the first dialysis section (110) through a first dialysis medium region (112) separated from a first diffusion medium region (113) by a first membrane section (111); and then, The dialysis medium (101) is caused to flow in a spatially separated second dialysis portion (120) through a second dialysis medium region (122) fluidically connected to the first dialysis region (112), wherein the second dialysis medium region (122) is separated from a second diffusion medium region (123) by a second membrane portion (121).

21. The method according to claim 20, in, The dialysis medium (101) and the diffusion medium (103) flow in countercurrent relative to each other.

22. Use of a separator (140, 145) between membrane-containing parts (110, 120) of a membrane dialysis device (100), the separator (140, 145) being used to enable a medium (101) containing acid and metal to flow turbulently through the membrane dialysis device (100), in particular, the membrane dialysis device (100) having six or more membranes.

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