Package, mother substrate, gas sensor module, and electronic device

Abstract

According to the packaging piece, the air permeability of gas in the packaging piece is improved, and the detection precision of a gas sensor element is improved. The insulating substrate has a first surface, a second surface located on the opposite side of the first surface, a third surface located between the first surface and the second surface, and a recess opening in the first surface. A cover body that closes the opening of the recess has a first through-hole that communicates with the recess. The insulating substrate has a second through-hole that communicates with the recess and opens on the second surface or the third surface.

Description

Technical Field

[0001] The present disclosure relates to a package, a mother substrate, a gas sensor module, and an electronic device. Background Art

[0002] Patent Document 1 describes a prior art gas sensor module. The gas sensor module described in Patent Document 1 (referred to as a MEMS sensor in Patent Document 1) comprises an insulating substrate with a recess for housing a gas sensor element (referred to as a MEMS chip in Patent Document 1), and a cover (referred to as a lid in Patent Document 1) that closes the opening of the recess. The cover has a plurality of through-holes (referred to as openings in Patent Document 1), each of which communicates with the recess in the insulating substrate.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2015-127642. Summary of the Invention

[0006] The package disclosed herein comprises: an insulating substrate having a first surface, a second surface opposite the first surface, a third surface between the first and second surfaces, and a recessed portion opening on the first surface; a wiring conductor located on the insulating substrate; and a lid located on the first surface and having a first through-hole communicating with the recessed portion and blocking the opening of the recessed portion. The insulating substrate has a second through-hole communicating with the recessed portion and opening on the second or third surface.

[0007] The gas sensor module of the present disclosure includes: the package described in the present disclosure; and a gas sensor element housed in the recess and electrically connected to the wiring conductor.

[0008] The electronic device of the present disclosure includes: the gas sensor module of the present disclosure; and a housing for housing a mounting substrate on which the gas sensor module is mounted. The housing has a vent hole that faces the first through hole and is used for ventilation of gas. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic perspective view showing the gas sensor module according to the first embodiment.

[0010] Figure 2 This is a schematic perspective view of the gas sensor module according to the first embodiment as viewed from the bottom side.

[0011] Figure 3 It is a schematic exploded perspective view showing the gas sensor module according to the first embodiment.

[0012] Figure 4 It is along Figure 6 Schematic cross-sectional view along line IV-IV.

[0013] Figure 5 It is along Figure 6 Schematic cross-sectional view along line VV in FIG.

[0014] Figure 6 It is a schematic plan view showing the package and the gas sensor module according to the first embodiment.

[0015] Figure 7 It is a schematic bottom view showing the package according to the first embodiment.

[0016] Figure 8 It is a schematic cross-sectional view showing the electronic device according to the first embodiment.

[0017] Figure 9 This is a schematic plan view showing a portion of the motherboard according to the first embodiment.

[0018] Figure 10 It is a schematic cross-sectional view showing a package and a gas sensor module according to a second embodiment.

[0019] Figure 11 It is a schematic cross-sectional view showing a package and a gas sensor module according to a third embodiment.

[0020] Figure 12 It is a schematic plan view showing a package and a gas sensor module according to a fourth embodiment.

[0021] Figure 13 It is along Figure 12 Schematic cross-sectional view along line XIII-XIII.

[0022] Figure 14 It is a schematic cross-sectional view showing a package and a gas sensor module according to another form of the fourth embodiment.

[0023] Figure 15 It is a schematic cross-sectional view showing a package and a gas sensor module according to another form of the fourth embodiment. DETAILED DESCRIPTION

[0024] Although gas flows into the recessed portion of the insulating substrate through the through-hole of the cover, the size of the through-hole of the cover may reduce the permeability of the gas in the package, thereby reducing the detection accuracy of the gas sensor element.

[0025] According to the present disclosure, the gas permeability within the package can be improved, and the detection accuracy of the gas sensor element accommodated in the recessed portion of the insulating substrate can be improved.

[0026] Hereinafter, the package, mother substrate, gas sensor module and electronic device of the embodiment will be described in detail using the accompanying drawings. However, for the sake of convenience, the figures referred to below only simplify the structural components required for explaining the embodiment. Therefore, the package, mother substrate, gas sensor module and electronic device of the embodiment can have any structural components not shown in the figures referred to. In addition, the dimensions of the structural components in the figures may not faithfully represent the dimensions of the actual structural components and the dimensional ratios of the components. In the present disclosure, a rectangle is not limited to a strict rectangular shape, and includes, for example, a shape that looks rectangular as a whole despite having curved corners. Annular refers to a rectangular ring shape and a circular ring shape.

[0027] [First embodiment]

[0028] Reference Figures 1 to 7 , the package 1 and the gas sensor module 100 according to the first embodiment will be described. Figure 1 It is a schematic perspective view showing the gas sensor module 100 according to the first embodiment. Figure 2 This is a schematic perspective view of the gas sensor module 100 according to the first embodiment as viewed from the bottom side. Figure 3 It is a schematic exploded perspective view showing the gas sensor module 100 according to the first embodiment. Figure 4 It is along Figure 6 Schematic cross-sectional view along line IV-IV. Figure 5 It is along Figure 6 Schematic cross-sectional view along line VV. Figure 6 1 is a schematic plan view showing the package 1 and the gas sensor module 100 according to the first embodiment. Figure 7 It is a schematic bottom view showing the package 1 according to the first embodiment.

[0029] like Figures 1 to 7 As shown in the example, the gas sensor module 100 of the first embodiment has the package 1 of the first embodiment and the gas sensor element 200 mounted on the package 1. The package 1 of the first embodiment may also have an insulating substrate 2, and the top view shape of the insulating substrate 2 may also be, for example, rectangular. The insulating substrate 2 is composed of ceramics such as an alumina sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body or a glass ceramic sintered body. The insulating substrate 2 may also be composed of three stacked insulating layers. The top view shape of the insulating substrate 2 is not limited to a rectangle and can be changed appropriately. The insulating substrate 2 may also be composed of a plurality of insulating layers other than three stacked together or one insulating layer.

[0030] like Figures 1 to 7 As shown in the example, the insulating substrate 2 may have a first surface 2a, a second surface 2b located opposite the first surface 2a, and four third surfaces 2c located between the first surface 2a and the second surface 2b. The first surface 2a of the insulating substrate 2 may be the top surface, and the second surface 2b of the insulating substrate 2 may be the bottom surface. The third surfaces 2c of the insulating substrate 2 may also be side surfaces.

[0031] The insulating substrate 2 may have a recess 21 for accommodating the gas sensor element 200, and the recess 21 may be open on the first surface 2a. The top view shape of the recess 21 of the insulating substrate 2 may be, for example, rectangular. The recess 21 of the insulating substrate 2 may also have an annular (rectangular) recessed step 22 on its opening side. In other words, the inner side surface 21i of the recess 21 of the insulating substrate 2 may also be stepped. The inner side surface 22i of the recessed step 22 of the insulating substrate 2 may also constitute a portion of the inner side surface 21i of the recess 21 of the insulating substrate 2.

[0032] The size of the portion of the recessed portion 21 of the insulating substrate 2, excluding the recessed step portion 22, when viewed from above may be slightly larger than the size of the gas sensor element 200 when viewed from above. The depth of the portion of the recessed portion 21 of the insulating substrate 2, excluding the recessed step portion 22, may also be equal to the thickness of the gas sensor element 200. The shape of the recessed portion 21 of the insulating substrate 2 when viewed from above is not limited to a rectangle and may be modified according to the shape of the gas sensor element 200 when viewed from above. The recessed portion 21 of the insulating substrate 2 may have two opposing recessed steps instead of the annular recessed step portion 22. The recessed step portion 22 may also be omitted from the recessed portion 21 of the insulating substrate 2.

[0033] The insulating substrate 2 may also have grooves 23 located at the boundaries of adjacent third surfaces 2c. Each groove 23 may extend from the first surface 2a to the second surface 2b. The grooves 23 of the insulating substrate 2 may be located not only at the boundaries of adjacent third surfaces 2c but also on the third surface 2c. The width direction of the third surface 2c of the insulating substrate 2 is a direction perpendicular to the thickness direction of the insulating substrate 2 and is a direction along the third surface 2c.

[0034] like Figures 1 to 7As shown in the example, the package 1 may also include a wiring conductor 3 located on the insulating substrate 2. The wiring conductor 3 may also include a plurality of electrode pads 31 located on the bottom surface 22b of the recessed step portion 22 of the insulating substrate 2. The plurality of electrode pads 31 may also be arranged along any inner side surface 21i of the recessed portion 21 of the insulating substrate 2. Each electrode pad 31 may be formed, for example, from a metallized metal powder containing tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), or copper (Cu). Each electrode pad 31 may also be printed on the bottom surface 22b of the recessed step portion 22 of the insulating substrate 2 and sintered by firing. Each electrode pad 31 may also be electrically connected to a corresponding electrode of the gas sensor element 200 using, for example, bonding wire W. Each electrode pad 31 may also be located on the bottom surface 21b or inner side surface 21i of the recessed portion 21 of the insulating substrate 2, instead of being located on the bottom surface 22b of the recessed step portion 22 of the insulating substrate 2.

[0035] The wiring conductor 3 may also have a plurality of external electrodes 32 located on the second surface 2b of the insulating substrate 2, and each external electrode 32 may also be located on the corner side of the second surface 2b of the insulating substrate 2. Each external electrode 32 is made of, for example, the same metallized metal powder as the electrode pad 31. Each external electrode 32 may also be printed on the second surface 2b of the insulating substrate 2 and sintered by firing. Each external electrode 32 may also be electrically connected to the corresponding substrate electrode 410 of the mounting substrate 400 using solder S (see Figure 8 ).

[0036] The wiring conductor 3 may also include a connection wiring 33 that electrically connects each electrode pad 31 to the corresponding external electrode 32. Each connection wiring 33 may include a through conductor that penetrates one or more insulating layers and one or more wiring layers located between the insulating layers. The wiring conductor 3 may also include a wiring layer located on the side of the groove portion 23 of the insulating substrate 2. Each connection wiring 33 is composed of, for example, the same metallized metal powder as the electrode pad 31.

[0037] The number of electrode pads 31 and external electrodes 32 corresponds to the number of electrodes of the gas sensor element 200 , which is four. However, the number of electrode pads 31 and external electrodes 32 may be changed as the number of electrodes of the gas sensor element 200 changes.

[0038] like Figures 1 to 6As shown in the example, the package 1 can include a cover 4 that blocks the opening of the recess 21 of the insulating substrate 2, and the cover 4 can also be located on the first surface 2a side of the insulating substrate 2. The top view shape of the cover 4 can also be, for example, rectangular, and the cover 4 can also be, for example, a rectangular plate. The cover 4 is made of ceramics such as an alumina sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. The cover 4 can also be made of a single insulating layer or a plurality of stacked insulating layers. The top view shape of the cover 4 is not limited to a rectangle and can be changed appropriately.

[0039] The cover 4 may also be bonded to the first surface 2a of the insulating substrate 2 using a bonding material 5. The bonding material 5 may be, for example, glass, solder, or a resin adhesive. When solder is used as the bonding material 5, a metal film may be provided on the first surface 2a of the insulating substrate 2 and on the back surface of the cover 4 facing the first surface 2a of the insulating substrate 2. The metal film may be formed, for example, from the same metallized metal powder as used for the electrode pads 31 and the like.

[0040] like Figures 1 to 6 As shown in the example, the cover body 4 may also have a plurality of circular first through holes 41, and each first through hole 41 may also be connected to the recess 21 of the insulating substrate 2. One end of each first through hole 41 of the cover body 4 may also be open on the surface of the cover body 4, that is, the upper surface, and the other end of each first through hole 41 of the cover body 4 may also be open on the back surface of the cover body 4, that is, the lower surface. Each first through hole 41 of the cover body 4 may also be linear along the thickness direction of the cover body 4. Each first through hole 41 of the cover body 4 may also be inclined relative to the thickness direction of the cover body 4. The plurality of first through holes 41 of the cover body 4 may also be arranged to overlap with the bottom surface 21b of the recess 21 of the insulating substrate 2 when viewed from above. The number of first through holes 41 of the cover body 4 is not limited to a plurality, and may also be one. The shape of each first through hole 41 of the cover body 4 is not limited to a circle, and may also be a shape other than a circle, such as a rectangle.

[0041] like Figures 1 to 4 、 Figure 6 As shown in the example, the insulating substrate 2 may also have a second through-hole 24 that is rectangular in side view, and the second through-hole 24 may also communicate with the recess 21 of the insulating substrate 2. One end of the second through-hole 24 of the insulating substrate 2 may also open on the third surface 2c of the insulating substrate 2. The other end of the second through-hole 24 of the insulating substrate 2 may also open on the inner side surface 21i of the recess 21 of the insulating substrate 2. The number of second through-holes 24 in the insulating substrate 2 is not limited to one, but may be multiple. The side view shape of the second through-hole 24 of the insulating substrate 2 is not limited to a rectangle, but may also be a shape other than a rectangle, such as a circle.

[0042] If the number of second through-holes 24 in the insulating substrate 2 is one, the second through-hole 24 may be opened in the center of the width direction of any third surface 2c of the insulating substrate 2 when viewed from the side. In other words, the second through-hole 24 may be opened in the center of the width direction of any outer edge of the rectangular third surface 2c of the insulating substrate 2 when viewed from the top. The second through-hole 24 in the insulating substrate 2 may be opened on an inner side surface 21i of the recess 21 different from the inner side surface 21i of the recess 21 along which the plurality of electrode pads 31 extend.

[0043] like Figure 6 As shown in the example, the second through hole 24 of the insulating substrate 2 may also be linear from the third surface 2c to the inner side surface 21i of the recess 21 when viewed in a plan perspective (cross-sectional view). Figure 4 As shown in the example, the second through-hole 24 of the insulating substrate 2 may be linear from the third surface 2c to the inner side surface 21i of the recess 21 in a longitudinal cross-sectional view (side perspective). The second through-hole 24 of the insulating substrate 2 may be inclined relative to a direction perpendicular to the thickness direction of the insulating substrate 2 in a longitudinal cross-sectional view. The second through-hole 24 of the insulating substrate 2 may be curved into a crank or L-shape in a longitudinal cross-sectional view. In this case, foreign matter is less likely to enter the recess 21 of the insulating substrate 2.

[0044] At least a portion (e.g., the bottom) of the opening on the recessed portion 21 side of the second through-hole 24 of the insulating substrate 2 may be located closer to the bottom surface 21 b of the recessed portion 21 than at a position halfway the depth of the recessed portion 21. The entire opening on the recessed portion 21 side of the second through-hole 24 of the insulating substrate 2 may be located closer to the bottom surface 21 b of the recessed portion 21 than at a position halfway the depth of the recessed portion 21.

[0045] like Figures 1 to 3 As shown in the example, the opening area of ​​each first through hole 41 of the cover body 4 may also be smaller than the opening area of ​​the second through hole 24 of the insulating substrate 2. The diameter or equivalent diameter of each first through hole 41 of the cover body 4 may also be greater than 10 μm and less than 100 μm. The diameter or equivalent diameter of each first through hole 41 of the cover body 4 may also be greater than 10 μm and less than 50 μm. The equivalent diameter refers to the diameter of a circular hole having the same area as the area of ​​the hole as the object. If the diameter or equivalent diameter of each first through hole 41 of the cover body 4 is less than 10 μm, the air permeability in the package 1 may be reduced. Since each first through hole 41 of the cover body 4 is fine, the possibility of water droplets or dust entering the package 1 can be reduced.

[0046] like Figures 1 to 4As shown in the example, when the insulating substrate 2 is composed of, for example, an alumina sintered body, the insulating substrate 2 is manufactured as follows. A suitable organic binder and solvent are added to raw material powders such as alumina and silicon oxide, and the mixture is mixed to form a slurry. This slurry is formed into a sheet by a doctor blade method or a rolling method to produce a ceramic green sheet for the insulating layer. Furthermore, the ceramic green sheet for the insulating layer is subjected to appropriate punching processing to form the recessed portion 21 with the recessed step portion 22, the groove portion 23, and the second through-hole 24. The ceramic green sheet for the insulating layer shrinks by approximately 10% to 20% during firing. Therefore, the punching dimensions of the recessed step portion 22, the recessed portion 21, the groove portion 23, and the second through-hole 24 are determined in consideration of the shrinkage during firing. A plurality of ceramic green sheets for the insulating layer are then stacked to produce a laminate. The laminate is then fired at a high temperature (approximately 1300 to 1600°C) to produce the insulating substrate 2.

[0047] like Figures 1 to 3 As shown in the example, when the cover 4 is composed of, for example, an alumina sintered body, the cover 4 is manufactured as follows. In the same manner as in the case of manufacturing the insulating substrate 2, a ceramic green sheet for the insulating layer is manufactured. In addition, the ceramic green sheet for the insulating layer is subjected to appropriate punching processing for forming a plurality of first through holes 41, etc. Here, the ceramic green sheet for the insulating layer shrinks by about 10% to 20% by firing, so that a hole having a diameter or an equivalent diameter that is about 10% to 20% larger than the diameter or the equivalent diameter of the first through hole 41 after firing is formed. Then, as needed, a plurality of ceramic green sheets for the insulating layer are stacked to manufacture a laminate. Then, the cover 4 is manufactured by firing the ceramic green sheet for the insulating layer or the laminate at a high temperature (about 1300 to 1600°C).

[0048] When ceramic is used as the constituent material for the insulating substrate 2 and the cover 4, the package 1 can be made thinner while maintaining sufficient strength compared to when silicon is used. Furthermore, when ceramic is used as the constituent material for the insulating substrate 2 and the cover 4, corrosion and degradation of the package 1 by water or gas can be reduced compared to when metal or organic materials are used.

[0049] The ceramic green sheet used for the insulating layer before firing is a soft material. This facilitates fine hole processing, making it easy to form micropores with diameters or equivalent diameters of 100 μm or less, which are generally difficult to form in metal or organic substrates. This makes it easy to produce a lid body 4 having multiple first through-holes 41 with diameters or equivalent diameters of 100 μm or less, thereby improving the productivity of the package 1.

[0050] The method of forming micropores in the ceramic green sheet for the insulating layer by punching can be performed in a shorter time than the method of forming holes in a substrate made of silicon or the like by etching. Therefore, by using ceramic as the constituent material of the lid 4, the productivity of the package 1 can be improved.

[0051] like Figure 2 、 Figure 3 、 Figure 5 and Figure 7 As shown in the example, if the electrode pads 31, external electrodes 32, and connecting wiring 33 are metallized layers made of, for example, tungsten, they can be formed as follows. The wiring layers of the electrode pads 31, external electrodes 32, and connecting wiring 33 are formed by screen-printing a metal paste made by mixing tungsten powder with an organic solvent and an organic binder onto predetermined locations of the ceramic green sheet used for the insulating layer, and then firing the resulting laminate. The through-conductors of the connecting wiring 33 are formed by providing holes for the through-conductors at predetermined locations in the ceramic green sheet used for the insulating layer and filling these holes with the metal paste.

[0052] The exposed surfaces of the electrode pads 31, external electrodes 32, and connecting wiring 33 are coated with a nickel-plated layer or a gold-plated layer using a plating method such as electrolytic plating or electroless plating. This effectively reduces corrosion of the electrode pads 31, external electrodes 32, and connecting wiring 33. The metal plating is not limited to nickel-plated layers or gold-plated layers, but may also be other metal plating layers including nickel-plated layers, palladium-plated layers, and gold-plated layers.

[0053] like Figures 3 to 6 As shown in the example, the gas sensor module 100 includes: a package 1; and a gas sensor element 200, which is housed in the recess 21 of the insulating substrate 2 in the package 1. The gas sensor element 200 detects the properties of the gas around the gas sensor module 100. The gas sensor element 200 can be bonded to the bottom surface 21b of the recess 21 of the insulating substrate 2 using a bonding material J, and the top view shape of the gas sensor element 200 can also be rectangular. The gas sensor element 200 can also be, for example, a MEMS type semiconductor gas sensor. The gas sensor element 200 includes a supporting substrate 210 with a diaphragm structure in which a heater is assembled, and a gas sensitive element 220 located on the surface of the supporting substrate 210. The gas sensitive element 220 is obtained by sintering particles composed of metal oxides such as tin oxide on the surface of the supporting substrate 210.

[0054] The gas sensor element 200 may also have two sensor electrodes and two heater electrodes as a plurality of electrodes. Each sensor electrode of the gas sensor element 200 may also be electrically connected to the corresponding electrode pad 31, for example, using a bonding wire W. Each heater electrode of the gas sensor element 200 may also be electrically connected to the corresponding electrode pad 31, for example, using a bonding wire W. In other words, the gas sensor element 200 may also be electrically connected to the wiring conductor 3, for example, using a plurality of bonding wires W. The bonding wire W may also be made of a material composed of gold (Au) that is not easily corroded by the inflowing gas. In addition, since the plurality of external electrodes 32 are located on the second surface 2b of the insulating substrate 2, the package 1 and the gas sensor module 100 can be surface-mounted on the mounting substrate 400 (see Figure 8 ).

[0055] Reference Figure 8 The electronic device 300 according to the first embodiment will be described. Figure 8 It is a schematic cross-sectional view showing the electronic device 300 according to the first embodiment.

[0056] like Figure 8 As shown in the example, the electronic device 300 of the first embodiment is a small electronic device such as a smartphone. The electronic device 300 of the first embodiment includes the gas sensor module 100 of the first embodiment and a housing 500 that houses a mounting substrate 400 on which the gas sensor module 100 is mounted. The mounting substrate 400 has a plurality of substrate electrodes 410, each of which can be electrically connected to a corresponding external electrode 32 of the package 1 using solder S.

[0057] The frame 500 is made of, for example, a metal such as aluminum (Al) or a resin such as PBT (polybutylene terephthalate). The frame 500 may also have a vent 510 for allowing gas to vent inside and outside the frame 500. The vent 510 may also be aligned with the plurality of first through-holes 41 of the cover 4 in the package 1. Furthermore, in the normal use state of the frame 500 with the vent 510 facing upward, the gas sensor element 200 may be located below the vent 510 of the frame 500.

[0058] Reference Figure 9 The motherboard 6 according to the embodiment will be described. Figure 9 : is a schematic top view showing a portion of the motherboard 6 according to the embodiment. Figure 9 In the figure, “LD” refers to longitudinal direction and “CD” refers to cross direction.

[0059] like Figure 9As shown in the example, the mother substrate 6 of the first embodiment has a plurality of substrate areas 61 corresponding to the insulating substrate 2 in the package 1. The second through holes 24 of the laterally adjacent substrate areas 61 may also be connected in a straight line when viewed from above (planar perspective). The second through holes 24 of the laterally adjacent substrate areas 61 may be in a straight line shape along the laterally. The second through holes 24 of the laterally adjacent substrate areas 61 may be in a straight line shape inclined relative to the laterally, or in a crank shape. The second through holes 24 of the laterally adjacent substrate areas 61 may also be in a rotationally symmetrical shape when viewed from above. In other words, the area of ​​the mother substrate 6 including two laterally adjacent substrate areas 61 may also be in a shape and configuration in which the second through holes 24 of one substrate area 61 and the second through holes 24 of the other substrate area 61 are the same when rotated 180° when viewed from above.

[0060] like Figures 1 to 6 As shown in the example shown, according to the package 1 and gas sensor module 100, as described above, the plurality of first through-holes 41 of the cover 4 communicate with the recess 21 of the insulating substrate 2. The second through-holes 24 of the insulating substrate 2 communicate with the recess 21 of the insulating substrate 2 and open on the third surface 2c. Therefore, gas can be ventilated between the interior and exterior of the package 1 not only through the plurality of first through-holes 41 of the cover 4 but also through the second through-holes 24 of the insulating substrate 2.

[0061] In particular, gas heated by the heater located below the gas sensor element 220 of the gas sensor element 200 is discharged to the outside (outside the package 1) through the plurality of first through-holes 41 of the cover 4. Consequently, the internal pressure of the package 1 decreases, and external gas flows into the package 1 through the second through-holes 24 of the insulating substrate 2. In other words, the gas flowing into the package 1 through the second through-holes 24 of the insulating substrate 2 is heated by the heater of the gas sensor element 200 and discharged to the outside through the first through-holes 41 of the cover 4 located above, forming a continuous flow of gas.

[0062] Therefore, according to the first embodiment of the present disclosure, the gas permeability in the package 1 can be improved, and the detection accuracy of the gas sensor element 200 accommodated in the recess 21 of the insulating substrate 2 can be improved.

[0063] When the opening area of ​​each first through-hole 41 of the cover 4 is smaller than the opening area of ​​the second through-hole 24 of the insulating substrate 2, the possibility of foreign matter such as water droplets or dust entering the recess 21 of the insulating substrate 2 through the plurality of first through-holes 41 of the cover 4 can be reduced. Even if the first through-holes 41 of the cover 4 are located near the vent 510 of the frame 500, foreign matter is less likely to enter through the first through-holes 41 with a smaller opening area, allowing gas to flow in through the second through-holes 24 of the insulating substrate 2, which are located at a position not opposite the vent 510 and have a larger opening area. Thus, according to the first embodiment of the present disclosure, stable operation of the gas sensor element 200 housed in the recess 21 of the insulating substrate 2 can be achieved.

[0064] When the diameter or equivalent diameter of each first through-hole of the cover 4 is 10 μm or more and 100 μm or less, the air permeability of the gas within the package 1 can be improved, and the possibility of dust entering the recess 21 of the insulating substrate 2 through the plurality of first through-holes 41 of the cover 4 can be reduced. Thus, according to the first embodiment of the present disclosure, the operation of the gas sensor element 200 housed in the recess 21 of the insulating substrate 2 can be stabilized.

[0065] When the diameter or equivalent diameter of each first through-hole 41 of the cover 4 is 10 μm or more and 50 μm or less, the air permeability of the gas within the package 1 can be improved, and the possibility of water droplets and dust entering the recess 21 of the insulating substrate 2 through the plurality of first through-holes 41 of the cover 4 can be reduced. Thus, according to the first embodiment of the present disclosure, the operation of the gas sensor element 200 housed in the recess 21 of the insulating substrate 2 can be stabilized.

[0066] Thus, particularly as the diameter of first through-hole 41 in cover 4 decreases, dust and water resistance improve, but on the other hand, the ingress and egress of external gas (air permeability) decreases. However, by having second through-hole 24 in insulating substrate 2, gas heated by the heater of gas sensor element 200 and rising is more easily discharged through first through-hole 4 in cover 4, thereby improving air permeability within gas sensor module 100 and enhancing the detection accuracy of gas sensor element 200.

[0067] When at least a portion of the opening on the recess 21 side of the second through-hole 24 of the insulating substrate 2 is located closer to the bottom surface 21b of the recess 21 than half the depth of the recess 21, the gas flowing in through the second through-hole 24 of the insulating substrate 2 flows toward the first through-hole 41 of the lid 4 located above the opening of the recess 21. In other words, the gas flowing in through the second through-hole 24 of the insulating substrate 2 flows from the bottom surface of the recess 21 toward the opening of the recess 21 along the depth direction of the recess 21, making it easier for the gas sensor 220 of the gas sensor element 200 housed in the recess 21 to come into contact. Thus, according to the first embodiment of the present disclosure, the detection accuracy of the gas sensor element 200 housed in the recess 21 of the insulating substrate 2 can be further improved.

[0068] When the second through-hole 24 of the insulating substrate 2 opens on an inner side surface 21i of the recess 21 different from the inner side surface 21i of the recess 21 along which the plurality of electrode pads 31 extend, the flow of gas is not impeded by the bonding wire W, further improving the gas permeability within the package 1. Furthermore, in this case, the bonding wire W is less likely to come into contact with the gas, reducing the possibility of corrosion of the bonding wire W. The plurality of electrode pads 31 can be isolated from the second through-hole 24 of the insulating substrate 2, thereby facilitating the placement of the gas sensor element 200.

[0069] In the case where the insulating substrate 2 has a second through-hole 24 opening in the center of the width direction of any third surface 2c, and the second through-hole 24 is linear from the third surface 2c to the inner side surface 21i of the recess 21 when viewed from a perspective plane, when manufacturing the mother substrate 6, two substrate regions 61 can be arranged adjacent to each other so that the openings of the second through-hole 24 are relatively connected to each other. Thus, by cutting at the boundary between the longitudinally and transversely adjacent substrate regions 61, it is easy to obtain an insulating substrate 2 (package 1) having a second through-hole 24 opening at the same position on the third surface 2c. That is, according to the first embodiment of the present disclosure, the rigidity of the mother substrate 6 can be maintained and multiple insulating substrates 2 can be removed from one mother substrate 6, which can improve the productivity of the package 1.

[0070] When the openings of the second through-holes 24 are not opposed to each other but arranged in the same direction, a dummy region having a horizontal hole communicating with the second through-holes 24 needs to be provided between the two substrate regions 61 in order to open the second through-holes 24. However, when the openings of the second through-holes 24 are opposed to each other and communicate with each other, it is not necessary to provide a dummy region between the two substrate regions 61.

[0071] In addition, when the line from the third surface 2c of the second through hole 24 of the insulating substrate 2 to the inner side surface 21i of the recess 21 is straight, the strength of the insulating substrate 2 can be sufficiently ensured, and the gas permeability in the second through hole 24 of the insulating substrate 2 can be improved.

[0072] like Figure 8 As shown in the example, in the electronic device 300 of the embodiment, when the vent 510 of the frame 500 is opposite to the plurality of first through holes 41 of the cover 4, it is possible to improve the air permeability between the outside (outside of the frame 500) and the inside of the package 1. Therefore, according to the first embodiment of the present disclosure, the detection accuracy of the gas sensor module 100 in the electronic device 300 can be improved.

[0073] In a normal use state with the vent 510 of the housing 500 facing upward, and the gas sensor element 200 positioned below the vent 510 of the housing 500, gas easily flows from the cover 4 into the recess 21 of the insulating substrate 2 due to gravity. Thus, according to the first embodiment of the present disclosure, the detection accuracy of the gas sensor module 100 in the electronic device 300 can be further improved.

[0074] like Figure 9 As shown in the example, in the mother substrate 6 of the embodiment, when the second through holes 24 of the laterally adjacent substrate regions 61 are connected in a straight line, the rigidity of the mother substrate 6 can be maintained, and a plurality of insulating substrates 2 can be taken out from one mother substrate 6. Therefore, according to the first embodiment of the present disclosure, the productivity of the package 1 can be improved.

[0075] [Second embodiment]

[0076] Reference Figure 10 A package 1A and a gas sensor module 100A according to a second embodiment will be described. Figure 10 1A and a gas sensor module 100A according to the second embodiment. Figure 10 In the figure, the bonding wire W is omitted.

[0077] like Figure 10 As shown in the example, the package 1A of the second embodiment has the same structure as the package 1 of the first embodiment except for a portion of the structure. The structure of the package 1A of the second embodiment that differs from the package 1 of the first embodiment will be described. For convenience of description, components having the same functions as those described in the first embodiment are denoted by the same reference numerals.

[0078] like Figure 10As shown in the example shown, in the package 1A of the second embodiment, similarly to the package 1 of the first embodiment, the insulating substrate 2 may have a second through-hole 24, and the second through-hole 24 may communicate with the recess 21 of the insulating substrate 2. Similar to the package 1 of the first embodiment, one end of the second through-hole 24 of the insulating substrate 2 may open on the third surface 2c of the insulating substrate 2. Unlike the package 1 of the first embodiment, the other end of the second through-hole 24 of the insulating substrate 2 may open on the bottom surface 21b of the recess 21 of the insulating substrate 2. Figure 10 Similarly to the illustrated example, the entire opening of the second through hole 24 of the insulating substrate 2 on the recess 21 side is positioned closer to the bottom surface 21 b of the recess 21 than half the depth of the recess 21 .

[0079] like Figure 10 As shown in the example, the gas sensor module 100A includes: a package 1A; and a gas sensor element 200, which is housed in the recess 21 of the insulating substrate 2 of the package 1A and detects the properties of the gas. In addition, since the plurality of external electrodes 32 are located on the second surface 2b of the insulating substrate 2, the package 1A and the gas sensor module 100A can be surface mounted on the mounting substrate 400 (see FIG. Figure 8 ).

[0080] like Figure 10 As shown in the example shown, according to the package 1A and the gas sensor module 100A, the plurality of first through-holes 41 of the cover 4 communicate with the recess 21 of the insulating substrate 2. The second through-holes 24 of the insulating substrate 2 communicate with the recess 21 of the insulating substrate 2 and open on the third surface 2c. Therefore, gas can be ventilated between the inside and outside of the package 1A not only through the plurality of first through-holes 41 of the cover 4 but also through the second through-holes 24 of the insulating substrate 2. Thus, according to the example of the second embodiment of the present disclosure, the gas permeability within the package 1A can be improved, and the detection accuracy of the gas sensor element 200 housed in the recess 21 of the insulating substrate 2 can also be improved.

[0081] Because the entire opening of the second through-hole 24 of the insulating substrate 2 on the side of the recess 21 is positioned closer to the bottom surface 21b of the recess 21 than half the depth of the recess 21, the gas flowing in through the second through-hole 24 of the insulating substrate 2 flows toward the first through-hole 41 of the lid 4 located above the opening of the recess 21. In other words, the gas flowing in through the second through-hole 24 of the insulating substrate 2 flows from the bottom surface of the recess 21 toward the opening of the recess 21 along the depth direction of the recess 21, making it easier for the gas sensor 220 of the gas sensor element 200 housed in the recess 21 to come into contact. Therefore, according to the second embodiment of the present disclosure, the detection accuracy of the gas sensor element 200 housed in the recess 21 of the insulating substrate 2 can be further improved.

[0082] In addition, the package 1B of the second embodiment has the same structure as the package 1 of the first embodiment except for a part of the structure. According to the second embodiment of the present disclosure, the same effects as those of the same structure corresponding to the first embodiment of the present disclosure are achieved.

[0083] [Third embodiment]

[0084] Reference Figure 11 A package 1B and a gas sensor module 100B according to a third embodiment will be described. Figure 11 : is a schematic cross-sectional view showing a package 1B and a gas sensor module 100B according to the third embodiment. Figure 11 In the figure, the bonding wire W is omitted.

[0085] like Figure 11 As shown in the example, the package 1B of the third embodiment has the same structure as the package 1 of the first embodiment except for a part of the structure. The structure of the package 1B of the third embodiment that is different from the package 1 of the first embodiment will be described. For convenience of description, components having the same functions as those described in the first embodiment are denoted by the same reference numerals.

[0086] like Figure 11 As shown in the example, in the package 1B of the third embodiment, the insulating substrate 2 may have a second through hole 24, similarly to the package 1 of the first embodiment, and the second through hole 24 may be connected to the recess 21 of the insulating substrate 2. In addition, unlike the package 1 of the first embodiment, one end of the second through hole 24 of the insulating substrate 2 may open on the second surface 2b of the insulating substrate 2. The other end of the second through hole 24 of the insulating substrate 2 may open on the bottom surface 21b of the recess 21 of the insulating substrate 2. Figure 11 In the illustrated example, the entire opening of the second through-hole 24 of the insulating substrate 2 on the side of the recess 21 is located closer to the bottom surface 21b of the recess 21 than half the depth of the recess 21. The other end of the second through-hole 24 of the insulating substrate 2 may open on the inner side surface 21i of the recess 21 of the insulating substrate 2. In this case, the second through-hole 24 of the insulating substrate 2 is curved into a crank shape or an L-shape in longitudinal cross-section.

[0087] The second through-hole 24 of the insulating substrate 2 may also be linear from the second surface 2b to the inner side surface 21i of the recess 21. In other words, the second through-hole 24 of the insulating substrate 2 may also be linear along the thickness direction of the insulating substrate 2 when viewed in cross-section. The second through-hole 24 of the insulating substrate 2 may also be inclined relative to the thickness direction of the insulating substrate 2 when viewed in longitudinal cross-section. The second through-hole 24 of the insulating substrate 2 may also be crank-shaped or L-shaped when viewed in cross-section.

[0088] like Figure 11 As shown in the example, the gas sensor module 100B includes: a package 1B; and a gas sensor element 200, which is housed in the recess 21 of the insulating substrate 2 in the package 1B and detects the properties of the gas. In addition, since the plurality of external electrodes 32 are located on the second surface 2b of the insulating substrate 2, the package 1B and the gas sensor module 100B can be surface mounted on the mounting substrate 400 (see FIG. Figure 8 ).

[0089] like Figure 11 As shown in the example shown, according to the package 1B and the gas sensor module 100B, the plurality of first through-holes 41 of the cover 4 communicate with the recess 21 of the insulating substrate 2. The second through-holes 24 of the insulating substrate 2 communicate with the recess 21 of the insulating substrate 2 and open on the second surface 2b. Therefore, gas can be ventilated between the inside and outside of the package 1A not only through the plurality of first through-holes 41 of the cover 4 but also through the second through-holes 24 of the insulating substrate 2. Thus, according to the example of the third embodiment of the present disclosure, the gas permeability within the package 1B can be improved, and the detection accuracy of the gas sensor element 200 housed in the recess 21 of the insulating substrate 2 can also be improved.

[0090] Because the opening of the second through-hole 24 of the insulating substrate 2 on the side of the recess 21 is positioned closer to the bottom surface 21b of the recess 21 than half the depth of the recess 21, the gas flowing in through the second through-hole 24 of the insulating substrate 2 flows toward the first through-hole 41 of the lid 4, which is located above the opening of the recess 21. In other words, the gas flowing in through the second through-hole 24 of the insulating substrate 2 flows from the bottom surface of the recess 21 toward the opening of the recess 21 along the depth direction of the recess 21, making it easier for the gas sensor 220 of the gas sensor element 200 housed in the recess 21 to come into contact. Therefore, according to the third embodiment of the present disclosure, the detection accuracy of the gas sensor element 200 housed in the recess 21 of the insulating substrate 2 can be further improved.

[0091] In addition, the package 1B of the third embodiment has the same structure as the package 1 of the first embodiment except for a part of the structure. Therefore, according to the third embodiment of the present disclosure, the same effects as those of the same structure corresponding to the first embodiment of the present disclosure are achieved.

[0092] [Fourth embodiment]

[0093] Reference Figure 12 and Figure 13 A package 1C and a gas sensor module 100C according to a fourth embodiment will be described. Figure 12It is a schematic plan view showing a package 1C and a gas sensor module 100C according to a fourth embodiment. Figure 13 It is along Figure 12 A schematic cross-sectional view taken along line XIII-XIII.

[0094] like Figure 12 and Figure 13 As shown in the example, the package 1C of the fourth embodiment has the same structure as the package 1 of the first embodiment except for a portion of the structure. The structure of the package 1C of the fourth embodiment that differs from the package 1 of the first embodiment will be described. For convenience of description, components having the same functions as those described in the first embodiment are denoted by the same reference numerals.

[0095] like Figure 12 and Figure 13 As shown in the example shown, in the package 1C of the fourth embodiment, similarly to the package 1 of the first embodiment, the insulating substrate 2 may have a second through-hole 24, and the second through-hole 24 may communicate with the recess 21 of the insulating substrate 2. Similar to the package 1 of the first embodiment, one end of the second through-hole 24 of the insulating substrate 2 may open on the third surface 2c of the insulating substrate 2. The other end of the second through-hole 24 of the insulating substrate 2 may open on the inner side surface 21i of the recess 21 of the insulating substrate 2. At least a portion of the opening of the second through-hole 24 of the insulating substrate 2 on the side of the recess 21 may be closer to the bottom surface 21b of the recess 21 than half the depth of the recess 21.

[0096] In the package C of the fourth embodiment, similarly to the package 1 of the first embodiment, the lid 4 may have a plurality of first through-holes 41. Unlike the package 1 of the first embodiment, the plurality of first through-holes 41 of the lid 4 may be arranged on the side opposite to the opening on the recessed portion 21 side of the second through-hole 24 of the insulating substrate 2 relative to the center of the recessed portion 21 of the insulating substrate 2 (the center line parallel to the third surface 2c on the second through-hole 24 side) when viewed from above.

[0097] like Figure 12 and Figure 13 As shown in the example, the gas sensor module 100C includes: a package 1C; and a gas sensor element 200, which is housed in the recess 21 of the insulating substrate 2 in the package 1C and detects the properties of the gas. In addition, since the plurality of external electrodes 32 are located on the second surface 2b of the insulating substrate 2, the package 1C and the gas sensor module 100C can be surface-mounted on the mounting substrate 400 (see FIG. Figure 8 ).

[0098] In the gas sensor module 100C, the gas sensing element 220 of the gas sensor element 200 may be arranged between the plurality of first through-holes 41 of the lid 4 and the second through-holes 24 of the insulating substrate 2 in a plan view.

[0099] like Figure 12 and Figure 13 As shown in the example shown, according to the package 1C and the gas sensor module 100C, the plurality of first through-holes 41 of the cover 4 communicate with the recess 21 of the insulating substrate 2. The second through-holes 24 of the insulating substrate 2 communicate with the recess 21 of the insulating substrate 2 and open on the second surface 2b. Therefore, gas can be ventilated between the inside and outside of the package 1C not only through the plurality of first through-holes 41 of the cover 4 but also through the second through-holes 24 of the insulating substrate 2. Thus, according to the example of the fourth embodiment of the present disclosure, the permeability of the gas within the package 1C can be improved, and the detection accuracy of the gas sensor element 200 housed in the recess 21 of the insulating substrate 2 can also be improved.

[0100] As described above, when at least a portion of the opening on the recess 21 side of the second through-hole 24 of the insulating substrate 2 is located closer to the bottom surface 21b of the recess 21 than half the depth of the recess 21, the gas flowing in through the second through-hole 24 of the insulating substrate 2 flows toward the first through-hole 41 of the lid 4 located above the opening of the recess 21. In other words, the gas flowing in through the second through-hole 24 of the insulating substrate 2 flows from the bottom surface of the recess 21 toward the opening of the recess 21 along the depth direction of the recess 21, making it easier for the gas sensor 220 of the gas sensor element 200 housed in the recess 21 to come into contact. Thus, according to the fourth embodiment of the present disclosure, the detection accuracy of the gas sensor element 200 housed in the recess 21 of the insulating substrate 2 can be further improved.

[0101] Furthermore, when the plurality of first through-holes 41 of the cover 4 are arranged on the side opposite to the opening on the recessed portion 21 side of the second through-hole 24 of the insulating substrate 2, gas flowing into the recessed portion 21 of the insulating substrate 2 via the second through-hole 24 of the insulating substrate 2 tends to pass through the center portion of the recessed portion 21 of the insulating substrate 2 when viewed from above. Consequently, gas flowing into the recessed portion 21 of the insulating substrate 2 via the second through-hole 24 of the insulating substrate 2 tends to come into contact with the gas sensing element 220 of the gas sensor element 200 housed in the recessed portion 21 of the insulating substrate 2. Therefore, according to the example of the fourth embodiment of the present disclosure, the detection accuracy of the gas sensor element 200 can be improved.

[0102] When the gas sensor element 220 of the gas sensor element 200 is positioned between the plurality of first through-holes 41 of the cover 4 and the second through-holes 24 of the insulating substrate 2 in a plan view, gas flowing from the second through-holes 24 of the insulating substrate 2 into the recessed portion 21 of the insulating substrate 2 easily contacts the gas sensor element 220 of the gas sensor element 200. Thus, according to the fourth embodiment of the present disclosure, the detection accuracy of the gas sensor element 200 can be further improved.

[0103] In particular, by satisfying the above-mentioned three conditions, the detection accuracy of the gas sensor element 200 can be further improved.

[0104] In addition, the package 1C of the fourth embodiment has the same structure as the package 1 of the first embodiment except for a part of the structure. Therefore, according to the fourth embodiment of the present disclosure, the same effects as those corresponding to the same structure of the first embodiment of the present disclosure are achieved.

[0105] [Other aspects of the fourth embodiment]

[0106] Reference Figure 14 and Figure 15 A package 1C and a gas sensor module 100C according to another aspect of the fourth embodiment will be described. Figure 14 and Figure 15 1 is a schematic cross-sectional view showing a package 1C and a gas sensor module 100C according to another embodiment of the fourth embodiment. Figure 14 and Figure 15 The illustration of the bonding wire W is omitted.

[0107] like Figure 14 As in the example shown, the package 1C of another embodiment of the fourth embodiment may also include a heater device (heater element) 7 as a heater located on the bottom surface 21b of the recess 21 of the insulating substrate 2. The heater device 7 may also be arranged to overlap with the plurality of first through holes 41 of the cover 4 in a plan view.

[0108] like Figure 15 As shown in the example, another embodiment of the package 1C of the fourth embodiment may also include a heater circuit pattern 8 as a heater located inside the insulating substrate 2. The heater circuit pattern 8 may overlap with the plurality of first through-holes 41 of the lid 4 in a plan view. The heater circuit pattern 8 may be formed of, for example, the same metallized metal powder as the electrode pads 31. The heater circuit pattern 8 may also be printed on the insulating layer of the insulating substrate 2 and sintered by firing.

[0109] When the heater device 7 or heater circuit pattern 8 overlaps with the plurality of first through-holes 41 of the cover 4 in a plan view, the flow of gas toward the plurality of first through-holes 41 of the cover 4 can be promoted, further improving the gas permeability within the package 1C. Thus, according to another aspect of the fourth embodiment of the present disclosure, the detection accuracy of the gas sensor element 200 housed in the recess 21 of the insulating substrate 2 can be further improved.

[0110] In the case where the heater circuit pattern 8, which is a heater located inside the insulating substrate 2, is printed on the insulating layer of the insulating substrate 2, the heater circuit pattern 8 can be formed integrally with the insulating substrate 2 while forming the wiring conductor 3. Therefore, the process of mounting the heater on the insulating substrate 2 can be omitted, and the productivity of the package 1C can be improved. In addition, there is no need for bonding materials when mounting the heater on the insulating substrate 2, and there is no contamination caused by the gas generated during solder bonding (solvents, flux, etc. in the solder paste). Furthermore, compared with the case of bonding the heater with an adhesive, the heat resistance is high, and the possibility of contamination caused by the gas generated by the adhesive due to the heat of the heater, etc. can be reduced.

[0111] In one embodiment, (1) a package includes: an insulating substrate having a first surface, a second surface opposite to the first surface, a third surface between the first and second surfaces, and a recessed portion opening on the first surface; a wiring conductor located on the insulating substrate; and a lid located on the first surface, having a first through-hole communicating with the recessed portion and closing the opening of the recessed portion. The insulating substrate includes a second through-hole communicating with the recessed portion and opening on the second surface or the third surface.

[0112] (2) In the package of (1) above, the opening area of ​​the first through hole may be smaller than the opening area of ​​the second through hole.

[0113] (3) In the package of (1) or (2) above, the diameter or equivalent diameter of the first through hole may be greater than or equal to 10 μm and less than or equal to 100 μm.

[0114] (4) In the package of (1) or (2) above, the diameter or equivalent diameter of the first through hole may be greater than or equal to 10 μm and less than or equal to 50 μm.

[0115] (5) In the package according to any one of (1) to (4), at least a portion of the opening of the second through hole on the recess side may be positioned closer to the bottom surface of the recess than half the depth of the recess.

[0116] (6) In the package of any one of (1) to (5), the first through hole may be arranged on the opposite side of the opening of the second through hole on the recessed portion side relative to the center of the recessed portion in a plan view.

[0117] (7) The package according to any one of (1) to (6) may further include a heater located on the bottom surface of the recess or inside the insulating substrate and overlapping with the first through hole in a plan view.

[0118] (8) In the package of any one of (1) to (7), a plurality of electrode pads constituting a portion of the wiring conductor may also be arranged along any inner side surface of the recess, and the second through hole opens on an inner side surface of the recess that is different from any inner side surface.

[0119] (9) In the packages of (1) to (8), the insulating substrate may be rectangular in top view, and the insulating substrate may have a second through hole opening in the central portion in the width direction of any one of the four third surfaces, and the second through hole may be linear from the third surface to the inner side surface of the recess.

[0120] (10) The mother substrate has a plurality of substrate regions corresponding to the insulating substrate in the package of (9), and the second through holes in adjacent substrate regions are connected in a straight line.

[0121] (11) A gas sensor module includes: the package according to any one of (1) to (9); and a gas sensor element housed in the recess and electrically connected to the wiring conductor.

[0122] (12) The gas sensor module comprises: the package of (6); and a gas sensor element housed in the recess and electrically connected to the wiring conductor; the gas sensitive element of the gas sensor element is arranged between the first through hole and the second through hole when viewed from above.

[0123] (13) The electronic device comprises: the gas sensor module of (11) or (12); and a frame body that accommodates a mounting substrate on which the gas sensor module is mounted; the frame body has a vent, which is opposite to the first through hole and is used to allow gas to ventilate.

[0124] (14) In the electronic device of (13), in a normal use state in which the vent is facing upward, the gas sensor element is located on the lower side of the vent.

[0125] The invention of the present disclosure has been described above based on the accompanying drawings and embodiments. However, the invention of the present disclosure is not limited to the above-mentioned embodiments. That is, the invention of the present disclosure can be subjected to various changes within the scope shown in the present disclosure, and the embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the invention of the present disclosure. That is, it should be noted that those skilled in the art can easily make various deformations or corrections based on the present disclosure. In addition, it should be noted that these deformations or corrections are also included in the scope of the present disclosure.

[0126] Description of Reference Numerals

[0127] 1 Package (Package of First Embodiment)

[0128] 2 Insulating substrate

[0129] 2a Side 1

[0130] 2b Side 2

[0131] 2c Third side

[0132] 21 recess

[0133] 21b bottom

[0134] 21i inner side

[0135] 22 Concave step

[0136] 22b bottom

[0137] 22i inner side

[0138] 23 groove

[0139] 24 Second through hole

[0140] 3 Wiring conductors

[0141] 31 electrode pads

[0142] 32 external electrodes

[0143] 33 Connection Wiring

[0144] 4. Cover

[0145] 41 First through hole

[0146] 5. Bonding materials

[0147] 100 Gas sensor module (gas sensor module of first embodiment)

[0148] 200 Gas sensor element

[0149] 210 Support substrate

[0150] 220 gas sensor

[0151] 300 Electronic Devices

[0152] 400 Mounting Base Plate

[0153] 410 substrate electrode

[0154] 500 frame

[0155] 510 vent

[0156] 6 motherboard

[0157] 61 substrate area

[0158] 1A Package (Package of Second Embodiment)

[0159] 100A Gas Sensor Module (Gas Sensor Module of Second Embodiment)

[0160] 1B Package (Package of Third Embodiment)

[0161] 100B Gas Sensor Module (Gas Sensor Module of Third Embodiment)

[0162] 1C Package (Package of Fourth Embodiment)

[0163] 100C Gas Sensor Module (Gas Sensor Module of Fourth Embodiment)

[0164] 7. Heater equipment (heater)

[0165] 8 Heater circuit pattern (heater)

Claims

1. A package, wherein: have: An insulating substrate having a first surface, a second surface located opposite to the first surface, a third surface located between the first surface and the second surface, and a recessed portion opened on the first surface; a wiring conductor located on the insulating substrate; as well as a cover body, located on the first surface, having a first through hole communicating with the recess and blocking an opening of the recess; The insulating substrate has a second through-hole that communicates with the recess and opens on the second surface or the third surface.

2. The package according to claim 1, wherein An opening area of ​​the first through hole is smaller than an opening area of ​​the second through hole.

3. The package according to claim 1 or 2, wherein: The diameter or equivalent diameter of the first through hole is greater than or equal to 10 μm and less than or equal to 100 μm.

4. The package according to claim 1 or 2, wherein: The diameter or equivalent diameter of the first through hole is greater than or equal to 10 μm and less than or equal to 50 μm.

5. The package according to any one of claims 1 to 4, wherein At least a portion of the opening of the second through hole on the recessed portion side is positioned closer to the bottom surface of the recessed portion than half the depth of the recessed portion.

6. The package according to any one of claims 1 to 5, wherein: The first through hole is arranged on a side opposite to an opening of the second through hole on the side of the recessed portion with respect to the center of the recessed portion in a plan view.

7. The package according to any one of claims 1 to 6, wherein: The package further includes a heater located on the bottom surface of the recess or inside the insulating substrate and overlapping with the first through-hole in a plan view.

8. The package according to any one of claims 1 to 7, wherein A plurality of electrode pads constituting a portion of the wiring conductor are arranged along any one inner side surface of the recessed portion, and the second through hole opens on an inner side surface of the recessed portion that is different from the any one inner side surface.

9. The package according to any one of claims 1 to 8, wherein The insulating substrate has a rectangular planar shape and includes one second through hole opened in the center of the width direction of any one of the four third surfaces. The second through hole is linear from the third surface to the inner side surface of the recess.

10. A mother substrate, wherein: The package according to claim 9 includes a plurality of substrate regions corresponding to the insulating substrate, and the second through-holes in adjacent substrate regions are connected in a linear manner.

11. A gas sensor module, wherein: have: The package according to any one of claims 1 to 9; and The gas sensor element is housed in the recess and is electrically connected to the wiring conductor.

12. A gas sensor module, wherein: have: The package according to claim 6; and a gas sensor element housed in the recess and electrically connected to the wiring conductor; The gas sensing element of the gas sensor element is arranged between the first through-hole and the second through-hole in a plan view.

13. An electronic device, wherein: have: The gas sensor module according to claim 11 or 12; and a frame for accommodating a mounting substrate on which the gas sensor module is mounted; The frame has a vent that faces the first through hole and is used to ventilate gas.

14. The electronic device according to claim 13, wherein: In a normal usage state in which the vent is facing upward, the gas sensor element is located on the lower side of the vent.

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