Interface assembly and method for producing interface assembly

Abstract

Disclosed herein is an interface assembly (100) comprising a functional multilayer structure (20) comprising a first substrate (22, 28), a layer of molding material (26) on a first side of the first substrate (22, 28), and at least one sensor (32; 32A, 32B), wherein the sensor arrangement (30) is arranged to be at least partially embedded in the moulding material layer (26). The assembly (100) further comprises a movable member (40) movable relative to the functional multilayer structure (20), where the movable member (40) comprises at least one detection portion (42), and the sensor arrangement (30) and the at least one detection portion (42) are arranged with respect to each other, such that a position or a change in position of the movable member (40) can be detected by the sensor arrangement (30) based on a position or a change in position of the at least one detection portion (42) relative to the sensor arrangement (30). Furthermore, a method for manufacturing an interface assembly (100) is disclosed.

Description

Technical Field

[0001] The present invention generally relates to functionally integrated structures, such as electronic (multi-layer) assemblies, and methods for their manufacture. In particular, but not exclusively, the present invention relates to interface assemblies, including, for example, electronic components and a layer of molded material, optionally injection molded material, such as a plastic material, and methods for their manufacture. Background Art

[0002] In the context of electronics and electronic products, there are a wide variety of stacked components and structures. The motivations behind the integration of electronics and related products can be as diverse as the relevant use cases. When the resulting solution ultimately exhibits a multi-layered nature, the goal is relatively often to achieve size savings, weight savings, cost savings, or simply efficient integration of components. Furthermore, associated use cases can involve product packaging or food boxes, the visual design of device housings, wearable electronics, personal electronic devices, displays, detectors or sensors, vehicle interiors, antennas, tags, and vehicle electronics.

[0003] Electronic components such as electronic components (passive or active components), ICs (integrated circuits) and conductors can generally be arranged on substrate elements by a variety of different technologies. For example, ready-made electronic components such as various surface mount devices (SMDs) can be mounted on a substrate surface, which ultimately forms an inner or outer interface layer of a multilayer structure. In addition, technologies that fall under the term "printed electronics" can be applied to actually produce electronic components directly and additionally onto an associated substrate. The term "printing" in this context refers to various printing technologies that can produce electronic components / electronic elements from printed matter by essentially additive printing processes, including but not limited to screen printing, flexographic printing and inkjet printing. The substrate used can be a flexible and organic printed material, but this is not always the case.

[0004] In addition, the concept of injection molded structural electronics (IMSE) involves building functional devices and their corresponding parts in the form of a multilayer structure, thereby encapsulating electronic functions as seamlessly as possible. The characteristic of IMSE is that the electronic parts are usually manufactured into a real 3D (non-planar) form according to a 3D model of the entire target product, part or generally the overall design. In order to realize the desired 3D layout of the electronic parts on the 3D substrate and in the associated final product, the electronic parts can still be arranged on an initially flat substrate such as a film using a two-dimensional (2D) method of electronic assembly. Therefore, the substrate that has accommodated the electronic parts can be formed into the desired three-dimensional, i.e. 3D shape and, for example, overmolded by a suitable plastic material, which covers and is embedded in the underlying components such as the electronic parts, thereby protecting and potentially hiding the components from environmental influences.

[0005] Typically, the circuit is produced on a printed circuit board (PCB) or a substrate film, which is then overmolded with a plastic material. However, the known structures and methods have some disadvantages, which again depend on the associated use scenario. In order to produce an electronic component with one or more functions, it is usually necessary to produce a relatively complex circuit for implementing these functions on a substrate by printing and / or using SMD, and then to overmold it with a plastic material. Therefore, providing functional elements or specific electronic components (such as related components) directly on a larger main substrate, as well as pre-preparing a collection of sub-components for subsequent installation thereon, have their own disadvantages in terms of, for example, the fragility of the electronic parts, the complexity of the structure and installation, and thermal management. Therefore, there is still room for improvement in terms of relevant improved or alternative manufacturing technologies and the final structure obtained.

[0006] In particular, structures with movable elements may be problematic, such as in the case of interface devices. For example, overmolding a knob, button or other (user) interface element would render it useless because the molding material would eventually solidify and fix the interface element in place. On the other hand, it would be desirable to use an IMSE structure to provide an interface for the user to control the overall structure and / or the main device. In many cases, these interfaces are implemented by passive sensing elements, such as based on capacitive sensing, in which case the sensing element does not need to be moved when in use. However, in many cases, it would be beneficial to provide feedback to the user in a manner such that the user feels the movement of the interface element (such as a button) when touching and operating the interface element. Therefore, there is still a need to develop structures and methods generally related to IMSE technology and integrated electronics, particularly structures and methods related to the interface assembly used therein. Summary of the Invention

[0007] The present invention aims to alleviate at least one or more of the aforementioned disadvantages associated with known solutions in the context of integrated structures comprising functional elements such as electronics and utilizing molded or cast material layers or structures. Another object is to provide a durable interface assembly with a high degree of integration and adaptable to different use cases, as well as a method for facilitating its efficient manufacture.

[0008] The object of the invention is achieved by an interface component and a method for producing an interface component as defined by the respective independent claims.

[0009] According to a first aspect, an interface assembly is provided, comprising a functional multilayer structure and a movable member movable relative to the functional multilayer structure.

[0010] The functional multilayer structure comprises a first substrate; a layer of molding material on a first side of the first substrate; and a sensor arrangement comprising at least one sensor, wherein the sensor arrangement is arranged at least partially embedded in the layer of molding material.

[0011] The movable member comprises at least one detection portion, however, in many cases several such portions.

[0012] In addition, the sensor arrangement and at least one or more detection parts are arranged relative to each other so that the position or position change of the movable member (for example, optionally, the speed, acceleration, jerkiness, and the direction of the speed, acceleration, jerkiness) can be detected by the sensor arrangement based on the position or position change of at least one detection part relative to the sensor arrangement.

[0013] In some embodiments, the movable member and the functional multilayer structure can be attached to each other in a removable manner. Therefore, the movable member and the functional multilayer structure may preferably not be completely separated and freely movable relative to each other, but there are at least some attachment features, such as forces, elements and / or structures that prevent or at least resist the complete separation of the two from each other when attached to each other by the attachment features. In many cases, the attachment features can limit but not necessarily completely prevent the movement of the movable member relative to the functional multilayer structure in one, several or all directions, or the rotation of the member around the axis of rotation, or at least resist movement along the directions. The attachment features can be arranged so that the movable member can move within some limitations in one or several directions without being resisted or restricted by the attachment features, however, when exceeding the limitations, the attachment features resist or even prevent (such as mechanical locking) movement.

[0014] In some embodiments, the removable attachment comprises a magnetic attachment arrangement comprising a first attachment portion on the functional multilayer structure and a second attachment portion on the removable member, wherein the magnetic attachment arrangement is arranged to exert a magnetic attraction force between the first attachment portion and the second attachment portion. This can be considered an attachment feature that resists separation.

[0015] Alternatively or additionally, the removable attachment may include a mechanical attachment arrangement that is arranged to prevent, or at least hinder, or resist, separation of the movable member relative to the functional multilayer structure. For example, the mechanical attachment arrangement may include a frame that is adapted to at least partially confine the movable member between the frame and the functional multilayer structure, such that the movable member is movable in the space between the frame and the functional multilayer structure.

[0016] In various embodiments, the functional multilayer structure can include a groove, hole, or through-hole, and a portion of the movable member including at least one detection portion can be adapted to extend into the groove, hole, or through-hole and be arranged to be movable therein. Furthermore, the interface assembly can optionally include a shape-interlocking arrangement between a portion of the groove, hole, or through-hole and the movable member to prevent, or at least hinder, or resist, separation of the movable member from the functional multilayer structure. For example, the groove or hole can define a concave shape in the multilayer structure.

[0017] In some embodiments, the movable member can be moved in a translational manner, such as linearly or non-linearly, relative to the functional multilayer structure, optionally within a groove, hole, or through-hole.

[0018] Alternatively or additionally, the movable member may be movable in a rotational manner relative to the functional multilayer structure, optionally in a groove, hole or through-hole.

[0019] In some embodiments, the functional multilayer structure may include a protrusion, pin, or other shape extending outwardly from a surface of the multilayer structure, and the movable member may be movable relative to the protrusion, pin, or other shape, such as being rotatable about the protrusion, pin, or other shape. For example, the protrusion, pin, or other shape may define a convex, dome-shaped shape of the multilayer structure.

[0020] Furthermore, the at least one sensor may be at least one optical sensor arranged to emit an optical detection signal for detecting a position or a change in position of the at least one detection portion.

[0021] In some embodiments, at least one detection portion may comprise one or several magnets and / or ferromagnetic elements, and the sensor arrangement comprises a magnetometer (such as comprising a coil) or a Hall effect sensor for detecting the position or position change of one or several magnets.

[0022] Alternatively or additionally, the sensor arrangement may comprise a capacitive sensing element to detect the position or a change in position of the at least one detection portion.

[0023] In some embodiments, rotational movement of the movable member may be detected by a magnetometer or Hall effect sensor, and linear movement thereof may be detected by a capacitive sensing element, or vice versa.

[0024] Furthermore, the movable member can be mechanically coupled to the functional multilayer structure via a spring. In some embodiments, the central portion of the spring can include a through-hole through which the movable member extends toward the functional multilayer structure. Alternatively or additionally, the spring can have a segmented dome shape, wherein, when the spring is not fully compressed, one or more edge portions of the segmented dome contact one of the functional multilayer structure and the movable member, and a central portion of the segmented dome is spaced apart from the other of the functional multilayer structure and the movable member.

[0025] In some embodiments, the spring may be a planar spring, such as an orthogonal planar spring. Optionally, the spring may be made of a plastic material, such as a thermoformable plastic film.

[0026] In various embodiments, the movable member may be attached and arranged to move relative to the functional multilayer structure in an articulated manner. For example, the movable member may be attached to the functional multilayer structure from one end thereof by a hinge mechanism.

[0027] The sensor arrangement may include a plurality of sensors, including at least two different types of sensors for detecting the position or position change of at least one detection part, and the sensor type may be selected from the group consisting of: optical sensors, capacitive sensors, inductive sensors, resistive sensors, magnetic sensors, current sensors, audio sensors or any combination thereof.

[0028] In various embodiments, the interface assembly may include a second substrate on an opposite side of the molding material layer relative to the first substrate.

[0029] The sensor arrangement may be provided on a surface of the first substrate and / or the second substrate.

[0030] One or both of the first substrate or the second substrate may be a thermoformable substrate film, optionally having at least partially a non-planar three-dimensional shape.

[0031] According to a second aspect, a method for manufacturing an interface assembly is provided. The method includes obtaining or producing a first substrate (such as a thermoformable substrate film) and obtaining at least one sensor configured to detect a position or position change of at least one detection portion. The method also includes molding material on one side of the first substrate to at least partially embed a sensor arrangement including the at least one sensor into the molding material layer, thereby obtaining a functional multilayer structure. The method also includes obtaining or producing a movable member including the at least one detection portion, and arranging the sensor arrangement and the at least one detection portion relative to each other so that the position or position change of the movable member can be detected by the sensor arrangement based on the position or position change of the at least one detection portion relative to the sensor arrangement.

[0032] In various embodiments, the method includes thermoforming the first substrate prior to molding to impart at least a portion thereof with a non-planar 3D shape. In some embodiments, thermoforming can include at least partially stretching the first substrate under elevated pressure to produce the non-planar 3D shape.

[0033] Additionally, the method may include providing, during the thermoforming process, grooves, holes, or through-holes; or protrusions, pins, or other shapes extending outwardly from the surface of the functional multilayer structure.

[0034] Furthermore, additionally or alternatively, the method may include removably attaching the movable member and the functional multilayer structure to each other.

[0035] The present invention provides an interface assembly and a method for manufacturing an interface assembly. The present invention provides advantages over known solutions in that a robust interface assembly can be produced in which a movable member (such as a button or switch) provides tactile feedback to a user when the member moves. In addition, by embedding the sensor arrangement in a layer of material provided by molding (such as injection molding), the interface assembly can be made more durable both with respect to the movable member and with respect to the functional multilayer structure. The resulting structure is not only structurally durable and simple while saving material, but also functionally robust or stable. In various embodiments, the movable member can be essentially passive, thereby providing a very robust and durable device.

[0036] Various other advantages will become apparent to the skilled person based on the following detailed description.

[0037] The expression "a number" may herein refer to any positive integer starting from one (1), that is to say one, at least one or several.

[0038] The expression "plurality" may refer to any positive integer starting from two (2), that is, at least two, at least two, or any integer greater than two.

[0039] The terms "first," "second," and the like are used herein to distinguish one element from another and do not particularly prioritize or rank them unless explicitly stated otherwise.

[0040] The exemplary embodiments of the present invention presented herein should not be interpreted as limiting the applicability of the appended claims. The verb "to comprise" is used herein as an open limitation that does not exclude the presence of features not yet enumerated. Unless expressly stated otherwise, the features recited in the dependent claims may be freely combined with each other.

[0041] The novel features which are believed to be characteristic of the invention are set forth with particularity in the claims appended hereto.The invention itself, however, both as to its organization and method of operation, together with further objects and advantages thereof, will be best understood from the following description of specific embodiments when read in connection with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In the following, the invention will be described in more detail with reference to exemplary embodiments according to the accompanying drawings, in which:

[0043] Figure 1 The interface components are shown;

[0044] Figure 2 The interface components are shown;

[0045] Figure 3 The interface components are shown;

[0046] Figure 4 An interface assembly having attachment features is shown;

[0047] Figure 5 An interface assembly having attachment features is shown;

[0048] Figure 6 An interface assembly having attachment features is shown;

[0049] Figure 7 The interface components are shown;

[0050] Figures 8A to 8C The interface components are shown;

[0051] Figure 9 The interface components are shown;

[0052] Figure 10 The interface components are shown;

[0053] Figures 11A to 11C The interface components are shown;

[0054] Figure 12A and Figure 12B The interface components are shown;

[0055] Figure 13 A spring with a segmented dome shape is shown;

[0056] 14A to 14C Shows the interface components.

[0057] Figure 15A and Figure 15B Shows the interface components.

[0058] Figure 16A and Figure 16B Shows the interface components.

[0059] 17A to 17C The interface components between the steering wheel and the main structure are shown.

[0060] Figure 18A and Figure 18B Shows the interface components.

[0061] 19A to 19D Some method steps for producing an interface assembly are presented.

[0062] Figure 20 A flow chart of a method for manufacturing an interface assembly is shown. DETAILED DESCRIPTION

[0063] In the various drawings, the same or corresponding components are denoted by the same reference numerals, and repeated text descriptions will be omitted in most cases.

[0064] According to various embodiments described herein, an interface assembly is provided. The interface assembly comprises a functional multilayer structure. The functional multilayer structure comprises: a first substrate, such as a substrate film (e.g. made of plastic); a layer of molding material on a first side of the first substrate; and a sensor arrangement comprising at least one sensor, wherein the sensor arrangement is at least partially embedded in the layer of molding material. Furthermore, preferably, the interface assembly comprises a movable member movable relative to the functional multilayer structure, wherein the movable member comprises at least one detection portion. The sensor arrangement and the at least one detection portion are arranged relative to each other or at least arrangable, such as being structurally adapted to each other, such that a position or a change in position of the movable member can be detected by the sensor arrangement based on a position or a change in position of the at least one detection portion relative to the sensor arrangement.

[0065] The substrate (such as a substrate film) may preferably be made of a thermoformable material, but is not required to be. In the case where the substrate is made of a thermoformable material, the substrate can be thermoformed into a shape that is different from its original shape. For example, a planar substrate or substrate film (if it is flexible and rolled into a roll, but is unrolled from the roll to define a sheet of film having a planar or "two-dimensional" shape, it is also considered planar). Therefore, the substrate can be thermoformed into a shape other than planar, such as a shape that at least partially includes dimensions in all three dimensions, thereby making the substrate non-planar.

[0066] Thermoforming, which can be performed at least at a lift pressure and optionally also at a lift temperature, can be performed on the substrate before or after providing the conductive traces on the substrate. This temperature can be, for example, heating the substrate to a temperature at which the substrate (film) does not melt but softens, enabling forming without damaging the substrate. For example, for plastic materials, this can be referred to as the glass transition temperature.

[0067] Alternatively or additionally, thermoforming can be performed before or preferably after providing a portion of the sensor arrangement and / or electronic components (if any) on the substrate. Thus, for example, the substrate can be thermoformed after providing the conductive traces but before providing a portion of the sensor arrangement and / or electronic components on the substrate. In other examples, the substrate can be thermoformed before providing the traces, sensors, and electronic components. Alternatively, the substrate can be thermoformed after providing the traces, sensors, and electronic components.

[0068] Substrate thermoforming in this context refers to a technique for shaping an existing substrate (typically having significantly larger dimensions in two lateral directions at least partially perpendicular to the substrate thickness direction) at least partially from one shape to another. Therefore, substrate thermoforming as referred to in this context does not mean producing a substrate (planar or non-planar) from a liquid or liquid-like material and then placing it in a mold and waiting for it to solidify, as is done in casting or molding.

[0069] In various embodiments, after providing the conductive traces (if any) and a portion of the sensor arrangement (at least one sensor) on the substrate, a layer of molding material can be molded (such as by injection molding) on ​​the first side of the substrate, thereby at least partially embedding or covering them in the molding material layer. Thermoforming is preferably performed before or simultaneously with providing the molding material layer. Of course, after providing the sensor arrangement (if any), the substrate can be post-processed, such as cutting, drilling, polishing, painting, etc.

[0070] In various embodiments, the substrate can be, for example, a substrate film made of a flexible and 3D-formable (3D-plastic) material, such as a thermoformable (plastic) material. As will be readily appreciated by those skilled in the art, the substrate film can be, for example, a multi-layer and / or multi-segmented structure with mutually distinct layers at least in certain locations, rather than a single, optionally monolithic film. Other substrates (films) may also be present in the structure.

[0071] The substrate film and / or other substrate films or general material layers included in the multilayer structure may include at least one material selected from the group consisting of: polymers, thermoplastic materials, electrical insulating materials, polymethyl methacrylate (PMMA), polycarbonate (PC), flame retardant (FR) PC film, FR700 type PC, copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass, polyethylene terephthalate (PET), carbon fiber, organic materials, biomaterials, leather, wood, textiles, fabrics, metals, organic natural materials, solid wood, veneer, plywood, leather, bark, birch bark, cork, natural leather, natural textile or fabric materials, naturally grown materials, cotton, wool, linen, silk and any combination of the above.

[0072] The thickness of the substrate film and optional other films or layers may vary depending on the embodiment; for example, the thickness may be only tens or hundreds of millimeters, or substantially thick, on the order of one or several millimeters.

[0073] The thickness of the molding material layer can also be selected on a case-by-case basis, but a thickness of several millimeters, such as approximately 3 to 5 millimeters, is applicable. In some embodiments, a thickness of only approximately 2 millimeters is sufficient, though not optimal; in other embodiments, the thickness can be greater, such as approximately 1 cm or greater, at least in certain locations. Indeed, the thickness can vary locally. For example, in addition to housing various components such as electronic or optical elements, the molding material layer can optionally include grooves or internal cavities for light guidance, processing, and / or thermal management purposes.

[0074] Figure 1 Schematically, an interface assembly 100 according to some embodiments is illustrated. As can be seen, the assembly 100 comprises a functional multilayer structure 20. The functional multilayer structure 20 comprises at least one substrate 22, 28, such as a substrate film, which is optionally flexible and / or thermoformable. Furthermore, the assembly 100 comprises a sensor arrangement 30 comprising at least one sensor 32, wherein the sensor arrangement 30 is arranged to be at least partially embedded in a molding material layer 26 (such as an injection molded plastic material layer). Furthermore, the interface assembly 100 may comprise a movable member 40 movable relative to the functional multilayer structure 20, wherein the movable member 40 comprises at least one detection portion 42. The movable member 40 may preferably comprise a body 41 or a frame portion 41.

[0075] like Figure 1 As shown by the solid arrow in FIG, the movable member 40 can be moved in a translational manner relative to the functional multilayer structure 20, such as linear or nonlinear movement. The multilayer structure 20 can optionally include a groove, hole, or through-hole, etc., in which the movable member 40 or at least the detection portion 42 is adapted to move. Alternatively, the multilayer structure 20 can optionally include a protrusion, pin, or other shape extending outward from the surface of the multilayer structure 20. The movable member 40 can then include a groove, hole, or through-hole, etc., into which the protrusion, pin, or other shape can extend.

[0076] Alternatively or additionally, the movable member 40 may be rotationally movable relative to the functional multilayer structure 20 . Figure 1 , wherein the axis of rotation is approximately perpendicular to the transverse direction of the functional multilayer structure 20. The movement can also occur in grooves, holes or through-holes of the functional multilayer structure 20, or around protrusions, pins or other shapes extending outwardly from the surface of the multilayer structure.

[0077] Regarding the sensor arrangement 30, the sensor 32 can be arranged on (the surface of) at least one substrate 22, 28, however, this is not required. The sensor 32 can also be arranged within the molding material layer 26 and spaced apart from the at least one substrate 22, 28. In some embodiments, in addition to the at least one (or more) sensor 32, the arrangement 30 can include a body or frame within which the sensor 32 resides, although in e.g. Figures 1 to 3 Not shown.

[0078] Furthermore, in some embodiments, where a plurality of sensors 32 are included in the arrangement 30, some sensors 32 may be disposed on (a surface of) at least one substrate 22, 28, while some other sensors 32 may be spaced apart from at least one substrate 22, 28. In some cases, some sensors 32 may even be completely external to the molding material layer 26. In one embodiment, one sensor 32 may be on one substrate 22, while another sensor may be on the other substrate 28, preferably disposed on opposite sides of the molding material layer 26.

[0079] Furthermore, in various embodiments, the movable member 40 and the functional multilayer structure 20 can be removably attached to each other. This is schematically illustrated by the long double-headed vertical arrow extending through the substrates 22, 28 above the molding material layer 26. Figure 1 Draw with dotted lines.

[0080] Therefore, movable member 40 and functional multilayer structure 20 can preferably not be completely separated and can be freely moved without restriction relative to each other, but there can be at least some attachment features, such as when attached to each other by attachment features, prevent or at least resist the force, element and / or structure that these two are completely separated from each other. In many cases, attachment features can limit the movement of movable member 40 relative to functional multilayer structure 20 along one, several or all directions, or at least resist the movement along said direction. For example, the movement between the two entities can be more or less free in the range of 0 cm to 10 cm, however this depends on the embodiment. Attachment features can be arranged so that movable member 40 can be not resisted or restricted by attachment features within some restrictions in one or several directions, however, when exceeding said restrictions, attachment features resist or even prevent (such as mechanical locking) movement.

[0081] Figure 1 Also shown are optional other electronic components 102, such as surface mount devices (SMDs), and conductive traces (such as printed traces 101), which may be included in one or several circuits of the component 100, or in one or several circuits of the main structure of the component 100.

[0082] Figure 2An interface assembly 100 is shown according to some embodiments. Figure 2 In the embodiment of the present invention, a movable member 40, such as a slider or a sliding member, is arranged to move in a translational manner (i.e., horizontally or parallel to the transverse direction of the functional multilayer structure 20) or in a direction perpendicular to the thickness direction of the functional multilayer structure 20. It can be further seen that there can be multiple sensors 32A, 32B in the sensor arrangement 30. The movable member 40 can preferably include a body 41 or a frame portion 41.

[0083] In addition, if Figure 2 shown (however, the same applies to Figure 1 and Figure 3 ), for example, the sensor arrangement 100 may comprise a plurality of sensors, including sensors of the same type or at least two different types of sensors 32; 32A, 32B; 33, for detecting the position or position change of at least one detection portion 42, 44. Figure 2 In the embodiment, sensors 32A and 32B are preferably optical sensors, but alternatively, they can be sensors that measure, for example, a magnetic field or its changes. Furthermore, a second sensor 33 is present, which in this particular case is a capacitive sensor. The type of sensors 32, 32A, 32B, and 33 can therefore be selected from the group consisting of: optical sensors, capacitive sensors, inductive sensors, resistive sensors, magnetic sensors, current sensors, audio sensors, or any combination thereof. Furthermore, as will be appreciated, movable member 40, and in particular at least one or both detection portions 42 and 44, includes portions corresponding to the type of sensors 32, 32A, 32B, and 33.

[0084] For example, an optical sensor (such as one including both transmitting and receiving portions) may be operated such that when the movable member 40 moves, an optical signal is cut off or passes through or through the movable member 40. A magnetic sensor or a capacitive sensor and corresponding detection portions 42, 44 may also be present in the assembly 100. Thus, the position of the movable member 40 or changes therein may be more reliably detected by using different technologies (such as those based on optical and capacitive sensing).

[0085] In preferred embodiments, the sensing portions 42, 44 of the movable member 40, which correspond to the sensors 32; 32A, 32B; 33 by their operational characteristics (as described above), are passive, in that they do not require an additional power source or control signal. Furthermore, in these embodiments, the sensors 32; 32A, 32B; 33 are provided with the necessary power and control circuitry and connections, such as provided on the substrates 22, 28.

[0086] Figure 3 An interface assembly 100 is shown according to some embodiments. Figure 3 In the embodiment of the present invention, the movable member 40 is arranged to be movable at least in a rotational manner relative to the functional multilayer structure, optionally in a groove, hole or through-hole. Alternatively, there may be a protrusion, pin or other shape extending outwardly from the surface of the multilayer structure 20, about which the movable member 40 can rotate.

[0087] Alternatively or additionally, the movable member 40 can be movable in a translational manner, in which case the translation direction is vertical or parallel to the thickness direction of the functional multilayer structure 20. As can be further seen from the figure, there can be multiple sensors 32A, 32B in the sensor arrangement 30. The movable member 40 can preferably include a body 41 or a frame portion 41.

[0088] Furthermore, the movable member 40 may be arranged to move in the thickness direction of the functional multilayer structure 20, ie, to essentially function as a button operation. In these cases, the movable member 40 may not rotate or move parallely at all.

[0089] Figure 3 It is illustrated that at least a portion of the movable member 40 may be arranged to extend, penetrate or protrude into the substrate 22 , 28 , such as into a groove, hole or through-hole in the substrate 22 , 28 .

[0090] Figure 3 It is also shown that the detection portion 42 may preferably be in the portion of the movable member 40 that extends, penetrates or protrudes into the substrate 22, 28. However, as Figure 2 As shown, the detection portion 42 may preferably be arranged to at least cooperate with the sensor arrangement 30 so that the movable member 40 can be detected by the sensor arrangement 30 based on a position or position change of at least one detection portion 42 relative to the sensor arrangement 30 .

[0091] Alternatively, the detection portion 42 may be arranged in a portion of the movable member 40 that does not extend, penetrate or protrude into the substrate 22, 28, even if such a portion exists. Figure 3 shown.

[0092] As mentioned earlier, Figures 1 to 3Also shown is a detection portion 42 of the movable member 40. The detection portion 42 may simply be a portion of the movable member 40, such as (a portion of) its body. For example, if the movable member 40 is made of a plastic material, the detection portion 42 may be a portion of the movable member 40 that is adapted to reside and / or move so that the sensor arrangement 100 can detect its position or changes. In some embodiments, the detection portion 42 may be made of a light-reflecting or light-absorbing material, and / or a transparent, translucent, or opaque material. In some other embodiments, the detection portion 42 may be made of a conductive material and / or a ferromagnetic material. For example, the detection portion 42 may include one or more permanent magnets. Alternatively, in some embodiments, the detection portion 42 may be or include an electromagnet, a light-emitting device, and / or a detection device, and / or a sensor coil or electrode connected to a processing unit and / or a power supply unit. Thus, the detection portion 42 may include at least an active component, in which case the movable member 40 preferably also includes a mechanism for operating and / or controlling the active component.

[0093] Regarding the sensor arrangement 30 , the at least one sensor 42 may be at least one optical sensor 32A arranged to emit an optical detection signal for detecting a position or a change in position of the at least one detection portion 42 .

[0094] Alternatively, the at least one sensor 32 may be one or several magnets and / or ferromagnetic elements, and the sensor arrangement 30 may comprise a magnetometer (such as comprising a magnetometer, such as comprising a coil) or a Hall effect sensor for detecting the position or position change of one or several magnets.

[0095] Alternatively or additionally, the sensor arrangement 30 may include a capacitive sensing element as the sensor 32 for detecting the position or position change of the at least one detection portion 42. In such embodiments, the detection portion 42 may or may not include other capacitive elements. Alternatively, the movable member 40 may affect the field measured or monitored by the sensor arrangement 30.

[0096] Figure 4 An interface assembly 100 is shown having an attachment feature 60. Figure 4 In the embodiment, the movable member 40 and the functional multilayer structure 20 may be, for example, Figure 2 similar or even identical to those shown and described in , although the following also applies to various other embodiments, such as Figure 3 The embodiment shown in or an embodiment similar thereto. Figure 4 One example of an attachment feature 60 is shown. As previously mentioned, the attachment feature 60 is preferably arranged to provide attachment of the movable member 40 relative to the functional multilayer structure 20 in a movable manner.

[0097] Figure 4 The attachment feature 60 is shown to be a mechanical attachment arrangement that includes a frame 61 that is adapted to at least partially confine the movable member 40 between the frame 61 and the functional multilayer structure 20, such that the movable member 40 can move within the space between the frame 61 and the functional multilayer structure 20. It can be seen that the frame 61 can be arranged on the substrates 22, 28, or even directly on the molding material layer 26. The frame 61 is preferably at least removably attached to the multilayer structure 20. Alternatively or additionally, the attachment feature 60 can include a groove, hole or through-hole in the functional multilayer structure 20, into which the movable member 40 at least partially extends or even completely resides. As will be appreciated, the shape, size, material used, etc. of the frame 61 may vary depending on the embodiment. The most important aspect of the mechanical attachment arrangement is to prevent or at least hinder or resist separation of the movable member 40 relative to the functional multilayer structure 20.

[0098] Figure 5 The interface assembly 100 is shown with another attachment feature 60. Also in this case, the movable member 40 and the functional multilayer structure 20 can be connected, for example, to Figure 2 Although the following also applies to various other embodiments, such as Figure 3 The embodiment shown or an embodiment similar thereto. Figure 5 In the embodiment, the removable attachment includes a magnetic attachment arrangement, which includes a first attachment portion 62 on the functional multilayer structure 20 and a second attachment portion 63 on the movable member 40, wherein the magnetic attachment arrangement is arranged to apply a magnetic attraction force between the first attachment portion 62 and the second attachment portion 63.

[0099] In some embodiments, the interface assembly 100 may include one or several mechanical attachment arrangements and one or several magnetic attachment arrangements.

[0100] Figure 6 An interface assembly 100 is shown having a further attachment feature 60. The assembly 100 can include a form-interlocking arrangement between a portion of the functional multilayer structure 20 (such as a portion of a groove, hole, or through-hole) and the movable member 40, thereby preventing or at least hindering separation of the movable member 40 relative to the functional multilayer structure 20.

[0101] exist Figure 6In the embodiment, there is a protruding element 65 in the functional multilayer structure 20 (i.e. in the wall of the through hole thereof), and a corresponding recess 64 is present in the portion of the movable member 40 extending into the through hole. Of course, the reverse is also possible, i.e. there is a protruding element 65 in the movable member 40, and so on. Thus, the movable member 40 can be provided in the through hole, such as by pushing it in with force, so that the protrusion 65 slides into the recess 64, thereby locking the movable member 40 to be movable relative to the multilayer structure 20. It will be understood that the interlocking shapes / joints should allow the movable member 40 to move. In Figure 6 , the movable member 40 is obviously capable of rotational movement, but its movement away from and toward the structure 20 is restricted unless a significant force is applied.

[0102] Additionally, in various embodiments, the Figures 4 to 6 Any of the attachment arrangements shown and described in , or any combination thereof. It should be understood that the mechanical, magnetic, and interlocking shapes / joints can have different shapes, sizes, related materials, etc. In addition, there can be grooves, recesses, protrusions, holes, through-holes in the multi-layer structure 100, or the attachment arrangement can be completely independent, such as a frame that is at least partially on the movable member 40 after the movable member 40 is arranged to be connected to the structure 20 so as to be operated in a movable manner.

[0103] Figure 7 Another interface assembly 100 is shown. Figure 7 In the embodiment of the present invention, the movable member 40 can be arranged to rotate and / or move vertically. In this case, as previously described, the sensor arrangement 100 includes at least one sensor 32 (e.g., a rotary switch or micro switch), and additionally includes a body 34 or frame 34 that defines a cavity including a space or volume, and the sensor 32 is arranged inside the cavity. The body 34 can be, for example, a printed circuit board (PCB) or similar substrate (material).

[0104] like Figure 7 As shown by the horizontal dashed line, the body 34 can be a single-piece body 34, such as a U-shaped PCB board, wherein the cavity is formed in the PCB board by means such as carving, drilling or milling. Alternatively, the body 34 can be composed of multiple parts, for example, having a horizontal or lateral extension portion to accommodate the sensor 32, such as Figure 7As shown, a vertically extending sidewall (such as a PCB or plastic material) is then extended from the first substrate 22 or the laterally extending portion to the second substrate 28, thereby enclosing the sensor 32 and preventing it from being overmolded into the molding material layer 26. In some embodiments, the sidewall can be circular or annular so as to surround the sensor 32. Therefore, when the molding material layer 26 is disposed on a first side of the first substrates 22, 28, the sensor arrangement 100 is at least partially embedded in the molding material layer 26 because the molding material surrounds and contacts the body 34 on the other side relative to the cavity.

[0105] In embodiments where the body 34 (such as at least its horizontally or laterally extending portion) is a PCB or similar substrate, the body 34 may be used to provide electrical connections to the sensor 32. The body 34 may include a connection portion 39 for providing electrical connections to the sensor arrangement 100 from outside the sensor arrangement 100 (such as from the first substrate 22). The connection portion 39 may be on an opposite side of the horizontally or laterally extending portion relative to the sensor 32 and / or the molding material layer 26, or on a side of the horizontally or laterally extending portion or sidewall. Figure 7 An example is shown in which the connection portion 39 is arranged on the side of the horizontal or transversely extending portion. The connection portion 39 can be, for example, a tooth-shaped hole cut in half or a plated half-hole. Thus, an electrical connection can be provided from the conductive trace 24 to the connection portion 39, for example, by using a solder material. Figure 7 Further shown is an adhesive 29 , such as an electrically insulating structural adhesive, arranged for attaching the body 34 to the first substrate 22 .

[0106] Figures 8A to 8C An interface assembly 100 is shown, which in this case comprises a mechanical button or the like, movable towards and away from the functional multilayer structure 20 . Figure 8C A perspective view of the side of the interface assembly 100 is shown, with at least a portion of the movable member 40 visible from the side of the assembly 100 . Figure 8C Cross-sections along AA and BB are also shown. Figure 8A A cross-sectional view along AA is shown, and Figure 8B A cross-section along BB is shown. Even though shown as being perpendicular to each other, this is not necessarily the case.

[0107] Figure 8A At least one sensor 32 is shown embedded in the molding material layer 26. The sensor 32 may be, for example, a Hall sensor, a reed switch, or a sensing coil for sensing changes in a magnetic field. Thus, when the movable member 40 is pushed toward the multi-layer structure 20, the sensor 32 detects changes in the magnetic field. The same is true when the movable member 40 is moved away from the multi-layer structure 20. Therefore, the detection portion 42 is preferably one or more permanent magnets.

[0108] Figure 8B A second permanent magnet is shown in section BB at a different position than in section AA, and a first permanent magnet 51 in the movable member 40 is also shown. The first permanent magnet 51 is arranged to interact with the second permanent magnet 52 in the functional multilayer structure 20. The first permanent magnet 51 and the second permanent magnet 52 are arranged to generate a repulsive force between them. This means that when the movable member 40 is pushed down and released, the movable member 40 will move away from the structure 20 due to the repulsive force between the first permanent magnet 51 and the second permanent magnet 52. In a preferred embodiment, the magnet of the detection portion 42 and the first permanent magnet 51 can be the same and placed in sequence or otherwise around the vertical center axis of the movable member 40. On the other hand, the detection portion 42 can be on a portion extending into the hole (if any) in the structure 20, while the first permanent magnet 51 is as Figure 8B shown.

[0109] Figure 9 An interface assembly 100 is shown. Figure 9 The movable member 40 or "slider" in the functional multilayer structure 20 includes a permanent magnet as a detection portion 42. In addition, the functional multilayer structure 20 includes a coil assembly, wherein the sensor 32 is a coil and is included in the coil assembly. In addition, the coil assembly can include a magnetic core 35, and the coil is wound around the magnetic core 35, such as around the teeth of the magnetic core. The coil can be further connected to a sensing unit (not shown), which includes, for example, a sensing circuit and a processing unit.

[0110] In addition to measuring the position of the movable member 40 or its changes, the coil can also be used to vibrate the movable member 40. This can be achieved by injecting an appropriate current pattern into the coil, thereby generating a preferably varying magnetic field, which then causes the movable member 40 to vibrate when the magnetic field interacts with the magnet of the movable member 40. In this way, the interface assembly 100 can generate tactile feedback, such as vibrotactile feedback.

[0111] Figure 10 The interface assembly 100 is shown. Its working principle is based on Figure 9 The illustrated embodiments are substantially the same, however, the coil is provided on a substrate, such as a multi-layer PCB. Thus, the coil can be provided by etching. In other embodiments, the conductive traces forming the coil in a substrate (such as a multi-layer substrate) can be printed via printed electronics techniques. Examples of such techniques include screen printing, flexographic printing, and inkjet printing or 3D printing, which are essentially additive printing processes (e.g., compared to etching).

[0112] In various embodiments, the electrically conductive and / or thermally conductive elements (traces, pads, connecting elements, electrodes, etc.) may comprise at least one material selected from the group consisting of: conductive ink, conductive nanoparticle ink, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesive, carbon fiber, graphene, alloys, silver alloys, zinc, brass, titanium, solder, and any combination thereof. The conductive material used may be optically opaque, translucent, and / or transparent at a desired wavelength, such as at least a portion of visible light, in order to, for example, shield radiation, such as visible light, or cause the radiation to reflect from, be absorbed in, or pass through the conductive material. As practical examples of feasible conductive materials, for example, Dupont TM ME602 or ME603 conductive ink.

[0113] Figures 11A to 11C An interface assembly 100 is shown. Figure 11A shows a side cross-sectional view of the interface assembly 100, Figure 11B is a perspective view, and Figure 11C It is a top view, that is, viewed from the side of the assembly 100 where the movable member 40 is located.

[0114] Figures 11A to 11C The movable member 40 in is a rotatable movable member 40. In this case, the movable member is movably attached to the functional multilayer structure 20 by means of an attachment feature 60, ie by means of a mechanical attachment arrangement comprising an axis of rotation or a shaft. Figure 11A The attachment feature 60 is shown, in this case, to limit movement in the lateral and upward directions by a flange at the rotation axis or shaft tip.

[0115] The attachment feature 60 can be a separate shaft attached to the surface of the structure 20. Alternatively, the attachment feature can be at least partially an integral part of the structure 20, such as an integral part of its base plate 22, 28 or its molded material layer 26. Thus, the attachment feature 60 can be a protrusion, pin, or other shape extending outwardly from the structure 20. The movable member 40 can be arranged to move, such as rotate, about the protrusion, pin, or other shape.

[0116] Alternatively or additionally, as Figure 11A As shown, the movable member 40 can move in the vertical direction (thickness direction of the structure 20 or surface normal direction of the structure 20) and / or horizontal direction (lateral direction of the structure 20) in the figure, as described above in conjunction with other figures.

[0117] Figure 11BThe main body 41 of the movable member 40 is shown to be U-shaped in this case, but other shapes may also be present. A plurality of detection portions 42 are, for example, permanent magnets or magnetic material pieces, such as pieces made of ferromagnetic material, arranged around the axis of rotation or the shaft. In this case, the magnets are arranged at the peripheral portion of the main body 41, but may also be close to the axis of rotation or the shaft. The detection portion 42 may alternatively or additionally be made of a magnetic material (such as a ferromagnetic material). For example, the detection portion 42 may include iron or an iron alloy or a similar material with magnetism that can be detected by a magnetometer or the like.

[0118] Furthermore, it can be seen that the permanent magnets can be arranged so that every other magnet's pole points in a different direction from the adjacent magnets, i.e. the polarity alternates. Thus, as one moves from one magnet to the other, the direction of the magnetic field alternates.

[0119] pass Figure 11C To better understand the Figures 11A to 11C The working principle of the interface component 100. Figure 11C The interface assembly 100 is shown as including at least two sensors 32 in a sensor arrangement 30. The sensors 32 are arranged in the functional multilayer structure 20 at positions corresponding to the circular rotation paths of the permanent magnets. In this particular embodiment, the sensors 32 are positioned so that when one sensor is aligned with one of the magnets, the other sensor 32 is between two adjacent magnets. The arrangement of the sensors 32 and / or the detection portion 42 (both of which are permanent magnets) may also vary from that described above.

[0120] Thus, rotation of the movable member 40 causes the sensor 32 adapted to measure the magnetic field or changes thereto to in turn measure the changing magnetic field.

[0121] Figures 11A to 11C Further shown is an optional first permanent magnet 51. Even though not shown, a second permanent magnet 52 may be present in the multilayer structure 20, such as Figure 8B Alternatively, there may be a coil below the first permanent magnet 51 (see Figure 9 and Figure 10 ) to provide tactile feedback to the movable member 40.

[0122] about Figures 11A to 11CIn operation of the interface assembly 100, when the movable member 20 rotates, the sensor 32 detects changes in the magnetic field as the magnets 42 move past the sensor 32. In the presence of magnets 42 having alternating polarity (as shown), the sensor 32 can detect such changes, including polarity (or magnetic field direction), because every other magnet 42 produces an opposite change in polarity compared to the previous magnet. Thus, the sensor 32 generates a sensing signal representing or indicating movement of the movable member 40.

[0123] In various embodiments, the interface assembly 100 can include a spring arranged to interact with the movable member 40. For example, the movable member 40 can be mechanically coupled to the functional multilayer structure 20 via the spring. On the other hand, the movable member 40 can be out of contact with the spring in one position, but can come into contact with the spring when it moves. The spring can be, for example, a coil spring or a leaf spring that is arranged to compress or extend / stretch from its resting position when the movable member 40 moves (such as in a translational manner, vertically, or horizontally / laterally). In some embodiments, the central portion of the spring can include a through hole through which the movable member 40 extends toward the functional multilayer structure 20.

[0124] Figure 12A and Figure 12B The interface assembly 100 is shown. In this case, the movable member 40 can be moved by rotating and / or pushing downward. However, the interface assembly 100 further includes a spring 70. Figure 12A In , the spring 70 is in a rest position or at most partially compressed. Figure 12B , the spring 70 is substantially fully compressed. Figure 12A and Figure 12B The spring 70 in FIG. 1 is a dome-shaped spring. When the spring 70 is not fully compressed, one or more edge portions of the dome are in contact with one of the functional multilayer structure 20 (such as the first substrate 22 or the second substrate 28, or the molding material layer 26) and the movable member 40, while the center portion of the dome is spaced apart from the other of the functional multilayer structure 20 and the movable member 40. Figure 12A and Figure 12B The edge portion is shown in contact with the functional multilayer structure 20 . Figure 12A and Figure 12B The dome-shaped spring 70 in the embodiment can be made of plastic (such as a thermoformable plastic film) or metal. The central portion of the spring 70 may include a through hole through which the movable member 40 can extend toward the functional multilayer structure 20. In some embodiments, the movement of the movable member 40 may cause the spring 70 to bend.

[0125] Figure 12A and Figure 12B The interface component 100 in the embodiment operates so that Figure 12AIn the case of , there is a clear path between sensors 32A and 32B. For example, sensor 32A can transmit light waves, such as light or infrared rays, to sensor 32B, for example, and sensor 32B can be used to record or detect the transmitted waves. Figure 12B In the embodiment of the present invention, the movable member 40 is pushed downwards and a part of it (i.e., the detection portion 42) blocks the path. This can be detected by the sensor 32B which no longer receives the transmitted wave. Alternatively, of course, the movable member 40 can be in the first position (corresponding to Figure 12A ) blocks the path, and then in the second position (corresponding to Figure 12B ) allows the transmitted wave to reach sensor 32B. The detection portion 42 of the movable member 40 may, for example, include a through hole or a portion containing a material that is transparent to the transmitted wave. It should be noted that sensor 32B may also be, for example, a reflective surface arranged to reflect the transmitted wave back to sensor 32A, which is arranged to detect the reflected signal.

[0126] Figure 13 A spring 70 having a particularly advantageous segmented dome shape is shown. The small arrows in the figure indicate the height separation between the center portion and one or more edge portions. The spring 70 operates in essentially the same manner as the dome-shaped spring described above. When the segmented dome-shaped spring is not fully compressed, one or more edge portions of the segmented dome contact one of the functional multilayer structure 20 (such as the first substrate 22 or the second substrate 28, or the molding material layer 26) and the movable member 40, while the center portion of the dome is spaced apart from the other of the functional multilayer structure 20 and the movable member 40. Figure 13 The edge portion is shown in contact with the functional multilayer structure 20 . Figure 13 The dome-shaped spring 70 is preferably made of a plastic material, such as a thermoformable plastic film. The central portion of the segmented dome-shaped spring may include a through hole through which the movable member 40 may extend toward the functional multilayer structure 20.

[0127] Alternatively, the spring 70 can be a planar spring, such as an orthogonal planar spring. It can also be made of a plastic material, such as a thermoformable plastic film. In the case of a planar spring, the functional multilayer structure 20 can, for example, include holes, grooves, or cavities into which the planar spring can extend when the movable member 40 moves toward the structure 20. Alternatively, the planar spring can extend into such holes, grooves, or cavities in the movable member 40, or such holes, grooves, or cavities can be present in both the structure 20 and the movable member 40. Alternatively, a support frame (such as a support ring or the like) can be used to provide space for the planar spring to move.

[0128] The spring 70 can slide on the surface of the structure 20 and the movable member 40 when compressed. Figure 13Further shown is a spring support member 80, such as a pin or the like or a protrusion, for providing support for the spring 70 in a lateral direction in the figure. Depending on the embodiment, the spring support member 80 or members 80 can be arranged on the structure 20 or the movable member 40 so that they align with the groove or hole or other corresponding element in the spring 70. Preferably, the support member 80 can provide support for the spring 70 so that when the spring 70 is compressed, it will contact the support member 80 in a direction perpendicular to the direction of movement of the movable member 40.

[0129] Alternatively, the spring element 70 may be disposed in a hole, cavity, or other structure (such as a ring) that defines an outer wall that the spring element 70 may contact when compressed or in substantially all positions.

[0130] 14A to 14C The interface assembly 100 is shown. For ease of reading, Figure 14A Only the movable member 40 and the sensors 32A, 32B are shown. The movable member 40 may include a through hole 49 or a channel 49 extending transversely through the movable member 40 in its detection portion 42, or include a through hole 49 or a channel 49 extending transversely through the movable member 40 as its detection portion 42. The through hole 49 or channel 49 functions to allow light waves (such as light) to pass when the movable member 40 is in the first position relative to the functional multilayer structure 20. The operation of the assembly 100 will be combined with Figure 14B and Figure 14C Describe in more detail.

[0131] Figure 14B The movable member 40 is shown in a first position. It can be seen that the signal from the sensor 32A can pass through the channel 49 and be received by the sensor 32B. Figure 14C The movable member 40 is shown in a second position. The movable member 40 has been depressed and the channel 49 is no longer aligned with the sensors 32A, 32B. Thus, detection of the position of the movable member 40 and / or its changes can be performed. Figure 14B and Figure 14C As shown, assembly 100 may optionally include a spring 70. In various embodiments, movable member 40 may also be rotatable.

[0132] Figure 14B and Figure 14CAn alternative embodiment is also shown in which the channel 49 is arranged in a portion of the movable member 40 near the surface to be operated (i.e., the outer surface) of the movable member 40. In such an embodiment, the sensors 32; 32A, 32B can be arranged on the substrates 22, 28 near the outer surface, as shown. There may or may not be another substrate 22 on the other side of the molding material layer 26 that is at least partially embedded in the sensor arrangement 30.

[0133] Figure 15A and Figure 15B The interface assembly 100 is shown. The movable member 40 includes a detection portion 42, which is a permanent magnet or a group of permanent magnets, or other materials that affect the surrounding magnetic field. On the other hand, the functional multilayer structure 20 includes at least one sensor 32, which is a coil. The coil can be similar to the voice coil of a speaker, that is, it includes a support ring around which the coil is wound. Therefore, when the movable member 40 (especially a magnet or magnetic material) moves towards the coil, a current is induced in the coil, which can be used to detect the movement of the movable member 40. Figure 15A and Figure 15B As shown, a spring 70 may be disposed between the movable member 40 (which is movable in a parallel manner (vertically) and optionally also in a rotational manner) and the multi-layer structure 20. In various embodiments, the movable member 40 may also be rotatable, as shown by the dashed double-headed arrow.

[0134] exist Figure 15A and Figure 15B In the embodiment, a coil can also be used to provide movement for the movable member 40. By injecting current into the coil, the magnetic field generated by the injected current interacts with the detection portion 42 of the movable member 40, thereby causing the movable member 40 to move. This can be used to at least induce vibration, for example, and can even be used to generate sound.

[0135] In some embodiments, the movable member 40 may be substantially as follows Figure 13 The spring 70 shown is similar to the spring 70 shown, but with a solid core and no through-holes. Optionally, the core can include a ferromagnetic material that can be moved by changing the magnetic field around it. In addition, the movable member 40 includes a support member 80 that secures the edge portions of the movable member 40 relative to the functional multilayer structure 20. Furthermore, the material of the movable member 40 is flexible, at least with respect to one or more edge portions thereof, thereby enabling the movable member 40 to move relative to the structure 20.

[0136] Figure 16A and Figure 16B An interface assembly 100 is shown. Figure 16AIn the embodiment, the interface assembly 100 comprises a movable member 40 which is arranged to move in an articulated manner relative to the functional multilayer structure 20. Thus, the movable member 40 can be rotated about a pivot point if the movable member has a Figure 16A In the longitudinal shape shown, the pivot point is preferably (but not necessarily) arranged at one end of the movable member 40. The movable member 40 may be, for example, a switch.

[0137] Figure 16A and Figure 16B The attachment features 60 in the functional multilayer structure 20 may include one or more hinges 66. Optionally, the movable member 40 can be arranged to be away from the functional multilayer structure 20 when in an idle position (i.e., not being operated or touched). For example, there may be a spring that holds the movable member 40 in the idle position. In some embodiments, the hinge 66 can be at least partially an integral part of the functional multilayer structure 20, such as a protruding portion of the substrate 22, 28 and / or the molded material layer 26. Alternatively, the hinge 66 can be a separate structure attached to the functional multilayer structure 20. Alternatively, the idle position can be when the movable member 40 is in a position closer to the structure 20.

[0138] Figure 16B Another interface assembly 100 is shown in which the movable member 40 is arranged in an articulated manner. In these embodiments, the movable member 40 is not attached to the functional multilayer structure 20, but rather to the main structure 90. Preferably, the main structure 90 (such as a substrate or other support structure) can be fixed relative to the multilayer structure 20 by a fixing arrangement 92 when installed for use. The fixing arrangement 92 can be, for example, another substrate or support member, on which the main structure 90 and the functional multilayer structure 20 are arranged. Of course, the functional multilayer structure 20 can be directly attached to the main structure 90.

[0139] Furthermore, the movable member 40 may include, for example, a magnet, a metal material (such as a magnetic metal material), an optically reflective material, or a capacitive sensing element. The functional multilayer structure 20, and in particular its sensor arrangement 30, may include a magnetic sensor, an inductive sensor (such as one or more coils), a capacitive sensor, or an optical sensor (such as one including a transmitter and a receiver) for measuring a magnetic field or a change thereof. Thus, the position of the movable member 40 and / or its change can be determined or detected based on the sensor arrangement 30.

[0140] 17A to 17C An interface assembly 100 and a steering wheel 200 are shown within a host structure 90 . Figure 17A The interface assembly 100 is shown wherein the movable member 40 is arranged to move in an articulated manner relative to the functional multilayer structure 20. The movable member 40 is attached to the functional multilayer structure 20 by a hinge 66 or hinge arrangement 66.

[0141] Figure 17B The interface assembly 100 is shown wherein the movable member 40 is arranged to move in a hinged manner relative to the functional multilayer structure 20. The movable member 40 is attached to the main structure 90 by a hinge 66 or hinge arrangement 66. The main structure 90 is preferably fixed relative to the functional multilayer structure 20.

[0142] Figure 17C Shown Figure 17B . It can be seen that the interface assembly 100 is arranged on the main structure 90, which in this case is the steering wheel 200. The steering wheel 200 includes a steering wheel body, which defines a handle portion and a center portion. The axis of rotation of the steering wheel 200 is represented by a dotted line. The interface assembly 100 is arranged in the middle portion of the steering wheel, which is between the center portion and the handle portion. It can be seen that the movable member 40 is arranged in a hinged manner and attached to the rear side of the center portion of the steering wheel 200. Alternatively, the movable member 40 can be arranged in a hinged manner and attached to the rear side of the middle portion of the steering wheel 200. Therefore, the user can easily operate the movable member 40 by hand when holding the handle portion of the steering wheel 200.

[0143] Figure 18A and Figure 18B An interface assembly 100 is shown. Figure 18A and Figure 18B There is shown a cross-sectional side view of an interface assembly 100. The interface assembly 100 includes a movable member 40 defined by a portion of a substrate 22, 28 (preferably a flexible and / or formable (such as thermoformable) substrate film) and a detection portion 42 (preferably a planar element on a surface of the substrate 22, 28).

[0144] Thus, the movable member 40 may be an integral part of the functional multilayer structure 20, and the movable member 40 may still be movable relative to the structure 20. In an embodiment, the movable member 40 may advantageously comprise a portion of the substrate 22,28.

[0145] In a preferred embodiment, the detection portion 42 is a first contact pad, strip, or region of conductive material, such as a metal (copper, aluminum, silver, or a metal alloy thereof), disposed on the surface of the substrate 22, 28 (preferably a formable substrate film). The first contact pad, strip, or region can serve as a capacitive sensing element region.

[0146] The detection portion 42 can further be connected to circuitry on the same substrate 22, 28, on another substrate, on another host device, etc. The interface assembly 100 also includes a gap or empty space 82 between the substrate 22, 28 and the functional multilayer structure 20, preferably at a location corresponding to the detection portion 42. Thus, when a force is applied (such as by pressing) on ​​the outer surface of the movable member 40 or "dome", the detection portion 42 can move toward the functional multilayer structure 20.

[0147] Thus, the functional multilayer structure 20 may include a sensor 32 on the opposite side of the molded material layer 26, such as a second contact pad, a second strip, or a second area made of a conductive material (copper, aluminum, silver, etc., or a metal alloy thereof) provided on the surface of the substrate 22, 28 (preferably a formable substrate film), the sensor being at least partially embedded in the molded material layer 26 or covered on at least one side by the molded material layer 26. The second contact pad, second strip, or second area may also serve as a capacitive sensing element that interacts with the first contact pad, first strip, or first area to provide a capacitive sensing device, such as one comprising TX (transmitter) and RX (receiver) electrodes in the form of first and second contact pads.

[0148] In a preferred embodiment, the first contact pad and / or the second contact pad etc. can be produced by printing on the respective substrates 22, 28. Printing techniques such as screen printing, flexographic printing and inkjet printing can be used, which are essentially additive printing processes.

[0149] In various embodiments, the functional multilayer structure 20 may further include a ventilation channel 89 that connects the empty space 82 with the surrounding environment of the interface assembly 100, preferably via a channel portion extending through the functional multilayer structure 20. Thus, as the movable member 40 moves toward the structure 20, the pressure within the empty space can be controlled so that it does not excessively increase and / or create excessive resistance to such movement.

[0150] In some embodiments, the functional multilayer structure 20 may include a support material layer 80. The surface of the support material layer 80 facing the substrates 22, 28 preferably has a bonding strength that is not too strong, or at least not as strong as the bonding strength of the molding material layer 26, to the substrates.

[0151] In such Figure 18B In the further embodiment shown, an electrically insulating adhesive 29, such as a structural adhesive, may be used between the support material layer 80 and the substrates 22, 28 on which the detection portion 42 is located. The adhesive 29 is preferably arranged to attach the portion of the substrates 22, 28 to the support material layer 80 surrounding the portion defining the movable member 40.

[0152] 19A to 19DSome method steps for manufacturing the interface assembly 100 are presented. Figure 19A A multilayer structure is shown that includes at least one substrate 22, 28, on the surface of which a first contact pad or the like (indicated by reference numeral 42) is provided. Furthermore, a layer of molding material 26 may be molded on one side of the substrate 22, 28, or the molding material layer 26 may be provided after the substrate 22, 28 is formed into a shape that is subsequently used as the movable member 40.

[0153] exist Figure 19A In the embodiment shown, the contact pads are provided on the same side of the substrates 22, 28 as the molding material layer 26, however, the contact pads may alternatively be provided on the other side, ie, on the outer surface of the interface assembly 100 to be manufactured.

[0154] Furthermore, the multilayer structure comprises a second contact pad or the like (marked with reference numeral 32 ), which is at least partially embedded in or covered by the layer of molding material 26 . Figure 19A An optional mold 84 is shown, positioned structurally in a location corresponding to the first contact pad. It can be seen that the mold 84 can be used to apply a force, such as suction 86 or negative pressure 86, or in some cases, high pressure 86 (via ventilation channels 89, if present), to the surface of the substrates 22, 28 at a location corresponding to the first contact pad. The mold 84 includes a recess, in this case dome-shaped, but the shape could easily be other. For example, the shape could alternatively be longitudinal to provide a slider interface.

[0155] During the forming process, such as a thermoforming process using elevated temperature and pressure (such as relative to room temperature and ambient temperature), the substrates 22, 28 are separated from the underlying structure (if any), such as relative to the molding material layer 26 or the support material layer 80, so that a gap or empty space 82 is created between the first contact pad (i.e., the detection portion 42) and the multilayer structure (i.e., the functional multilayer structure 20).

[0156] Figure 19C and Figure 19D Shown with Figure 19A and Figure 19B Basically the same steps, but using perspective. Figure 19C In the embodiment, the substrate 22, 28 is in contact with the underlying structure and is at least partially in a substantially planar shape at the first contact pad. Figure 19D, once the substrates 22, 28 are at least partially molded (e.g., thermoformed) at the first contact pad, there is a dome-shaped movable member 40 and a gap or empty space 82 below the movable member 40 to allow its movement. This has the advantage that when the detection portion 42 moves within the empty space 82, which is optionally vented relative to the ambient pressure (vent channel 89), the sensor 32 (such as a capacitive sensing element or electrode) can be embedded in the mold material layer 26, or between the mold material layer 26 and the other substrate 28, thereby substantially isolating it from the ambient conditions (humidity, temperature, pressure, etc.).

[0157] The first substrate 22 and / or the second substrate 28 (such as a substrate film or general material layer included in the multilayer structure 20) may include at least one material selected from the group consisting of: a polymer, a thermoplastic material, an electrically insulating material, polymethyl methacrylate (PMMA), polycarbonate (PC), a flame retardant (FR) PC film, FR700 type PC, a copolyester, a copolyester resin, a polyimide, a copolymer of methyl methacrylate and styrene (MS resin), glass, polyethylene terephthalate (PET), carbon fiber, an organic material, a biomaterial, leather, wood, textile, fabric, metal, an organic natural material, solid wood, veneer, plywood, leather, bark, birch bark, cork, natural leather, natural textile or fabric material, naturally grown material, cotton, wool, linen, silk and any combination of the above.

[0158] The molding material layer 26 may generally include, for example, at least one material selected from the group consisting of: polymers, organic materials, biomaterials, composite materials, thermoplastic materials, thermosetting materials, elastomeric resins, PC, PMMA, ABS, PET, copolyesters, copolyester resins, nylon or polyamide (PA), polypropylene (PP), thermoplastic polyurethane (TPU), polystyrene (GPPS), TPSiV (thermoplastic silicone rubber vulcanizate), and MS resin. The molding material layer may be transparent, translucent, or opaque.

[0159] In various embodiments, substrates 22, 28 (one or both) may be printed circuit boards (PCBs), ceramic substrates, flexible printed circuits, FR-4 substrates, etc. In various embodiments, even metal substrates may be used. The metal substrate may or may not include an insulating coating on one or both of its larger surfaces.

[0160] Depending on the specific embodiment, substrates 22, 28 and / or other films or layers that may be included in structure 20 may include or be made of a substantially optically transparent or at least translucent material having an optical transmittance of approximately 80%, 90%, 95%, or higher for a target wavelength (e.g., visible light). This is particularly true when the substrate is configured in structure 20 to effectively transmit or pass light emitted by a light source. However, in some embodiments, substrates 22, 28 may be substantially opaque, black, and / or otherwise darkly colored to block incident light from passing therethrough (a shielding function).

[0161] In the case where substrates 22, 28 are substrate films, the thickness of the film, and optionally the thickness of other films or layers included in structure 20, may vary depending on the embodiment; for example, the thickness may be only tens or hundreds of millimeters, or be quite thick, on the order of one or several millimeters.

[0162] For example, in addition to housing various components such as electronics or optics, the thickness may vary locally in nature and / or may optionally include grooves or internal cavities for light guiding, processing, and / or thermal management purposes.

[0163] The substrate film and other layers (such as films, coatings, etc.) of the structure can be substantially planar (width and length are greater than thickness, e.g., differing in magnitude). This generally also applies to the overall structure as shown, although other non-planar shapes are also feasible.

[0164] In various embodiments, additional layers or general features may be added to the multilayer structure 20 by molding, laminating, or a suitable coating (e.g., deposition) process, not forgetting other possible positioning or fixing techniques. This layer may have protective, indicative, and / or aesthetic value (graphics, colors, pictures, text, digital data, etc.) and may contain, for example, textile, leather, or rubber materials instead of or in addition to other plastics. Additional elements such as electronics, modules, module internals or parts, and / or optical devices may be mounted and fixed, for example, on the outer surface of the structure, such as the outer surface of the included film or molded material layer, depending on the embodiment. The necessary material shaping / cutting may be performed. For example, a diffuser may be produced by locally lasering a light-conducting material. If provided, the connector of the multilayer structure 20 may be connected to a desired external connection element, such as an external connector of an external device, system, or structure (e.g., a host device). For example, the two connectors may together form a plug-and-socket type connection and interface. The multi-layer structure 20 may also be generally positioned herein and attached to a larger entity, such as an electronic device, such as a personal communication device, a computer, a household appliance, an industrial device, or a vehicle, for example, in embodiments in which the multi-layer structure establishes a portion of the exterior or interior of the vehicle, such as a dashboard.

[0165] In addition, the structure 20 may include circuitry, for example on substrates 22, 28, the circuitry including at least one component or element selected from the group consisting of: an electronic component, an electromechanical component, an electro-optical component, a radiation emitting component, a light emitting component, an LED (light emitting diode), an OLED (organic LED), a side-firing LED or other light source, a top-firing LED or other light source, a bottom-firing LED or other light source, a radiation detecting component, a light detecting or light sensitive component, a photodiode, a phototransistor, a photovoltaic device, a sensor, a micromechanical component, a switch, a touch switch, a touch panel, a proximity switch, a touch sensor, an atmospheric sensor, a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, a proximity sensor , capacitive switches, capacitive sensors, projected capacitive sensors or switches, single-electrode capacitive switches or sensors, capacitive buttons, multi-electrode capacitive switches or sensors, self-capacitive sensors, mutual-capacitive sensors, inductive sensors, sensor electrodes, micromechanical components, UI elements, user input elements, vibration elements, sound generating elements, communication elements, transmitters, receivers, transceivers, antennas, infrared (IR) receivers or transmitters, wireless communication elements, wireless tags, radio tags, tag readers, data processing elements, microprocessors, microcontrollers, digital signal processors, signal processors, programmable logic chips, ASICs (application-specific integrated circuits), data storage elements, and electronic subassemblies. In various embodiments, the circuitry can be at least partially embedded in the conductive molding material layer 26.

[0166] Figure 20 A flow chart of a method for manufacturing the interface assembly 100 is shown.

[0167] Step or item 300 refers to the start-up phase of the method. Appropriate equipment and components are obtained and the system is assembled and configured for operation.

[0168] At the beginning of the method, a startup phase 300 may be performed. During startup, necessary tasks such as material, component and tool selection, acquisition, calibration and other configuration tasks may occur. Special attention must be paid to the fact that the individual components and material selections work together and are protected from damage during the selected manufacturing and installation processes, which is naturally preferably checked in advance based on the manufacturing process specifications and component data sheets or, for example, by investigating and testing the produced prototypes. Equipment such as molding, IMD (in-mold decoration), lamination, bonding, (thermo) forming, electronic device assembly, cutting, drilling, printing and / or measurement (such as desired optical measurement) providing equipment, etc., can therefore be brought to an operational state during this phase.

[0169] Step or project 310 refers to obtaining or producing the first substrate 22, 28 (such as the first substrate 22 and / or the second substrate 28), for example, a thermoformable, preferably flexible substrate film. The substrate 22, 28 can be a ready-made substrate or substrate film, preferably a planar substrate (film), including a rolled substrate film. The substrate 22, 28 can be at least primarily made of substantially electrically insulating material. In certain embodiments, the substrate 22, 28 in the form of a substrate film can itself first be molded by using a mold and / or molding device or other methods by a selected starting material and produced internally. Optionally, the substrate film can be further processed at this stage. The substrate film can, for example, be provided with holes, notches, grooves, incisions, etc.

[0170] Step or item 320 is directed to obtaining at least one sensor 32 configured to detect a position or a change in position of at least one detection portion 42 .

[0171] In various embodiments, preferably by one or more additive technologies such as printed electronics or 3D printing, many conductive elements and / or heat-conducting elements are set on either side or both sides of substrate or advantageously substrate film, these elements limit such as various conductor lines (trace), Changan elements (such as electrodes) and / or contact areas (such as contact pads) to construct circuit design. For example, screen printing, inkjet, flexographic printing, gravure printing or offset printing can be applied by suitable printing device or device. In some cases, subtractive or semi-additive processes can also be utilized. Further actions of culture substrate film may occur here, relate to such as printing on film or generally arranging graphics, visual indicators, optical elements etc.

[0172] In various embodiments, the electrically conductive and / or thermally conductive elements (traces, pads, connecting elements, electrodes, etc.) may comprise at least one material selected from the group consisting of: conductive ink, conductive nanoparticle ink, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesive, carbon fiber, graphene, alloys, silver alloys, zinc, brass, titanium, solder, and any combination thereof. The conductive material used may optionally be optically opaque, translucent, and / or transparent at a desired wavelength, such as at least a portion of visible light, thereby, for example, shielding radiation, such as visible light, or causing the radiation to reflect from, be absorbed in, or pass through the conductive material. As practical examples of feasible conductive materials, Dupont TM ME602 or ME603 conductive ink.

[0173] At least some of the electronic components and / or other elements of the final multilayer structure can be conveniently provided on the substrate 22, 28 (such as a substrate film) via a fully or partially prefabricated module or subassembly. Optionally, the module or subassembly can be at least partially overmolded with a protective plastic layer before being attached to the substrate 22, 28.

[0174] For example, adhesives, pressure, and / or heat may be used to mechanically bond the module or subassembly to the primary (body) substrate. Solder, wiring, and conductive inks are examples of suitable options for providing electrical and / or thermal connections between components of the module or subassembly and the remaining electrical and / or thermal components on the host substrate.

[0175] Step or item 330 refers to molding a material on one side of the first substrate 22 , 28 to at least partially embed the sensor arrangement 30 including at least one sensor 32 in the molding material layer 26 , thereby obtaining the functional multilayer structure 20 .

[0176] Step or item 340 refers to obtaining or producing a movable member 40 including at least one detection portion 42. It should be noted that obtaining or producing the movable member 40 can be performed at any stage relative to the other stages of the method. For example, the movable member 40 can be produced or obtained before obtaining the substrates 22, 28. In some embodiments, as described above in conjunction with 18A to 19D As mentioned above, the movable member 40 can be produced during the optional thermoforming step (described below) of the substrates 22, 28 (preferably substrate films). As a further example, the movable member 40 is produced or obtained after the multilayer structure 20 is manufactured. Figure 20 , item 340 is depicted in the flow chart as having parallel branches.

[0177] Step or item 350 refers to arranging the sensor arrangement 30 and the at least one detection portion 42 relative to each other so that the position or position change of the movable member 40 can be detected by the sensor arrangement 30 based on the position or position change of the at least one detection portion 42 relative to the sensor arrangement 30.

[0178] Method execution may stop at step or item 399 .

[0179] Furthermore, the method may include thermoforming the first substrate 22, 28 to impart at least a portion of a non-planar 3D shape to the first substrate 22, 28 prior to molding 330. Preferably, thermoforming includes at least partially stretching the first substrate 22, 28 under elevated pressure to produce the non-planar 3D shape. Preferably, thermoforming is performed after providing any conductive traces and circuitry (such as including sensors 32; 32A, 32B) and other electronic components, but prior to molding 330.

[0180] In some embodiments, grooves, holes, or through-holes, or alternatively, protrusions, pins, or other shapes extending outwardly from the surface of the multilayer structure 20 , may be provided by thermoforming the substrate 28 .

[0181] Alternatively or additionally, the method includes removably attaching the movable member 40 and the functional multilayer structure 20 to each other.

[0182] Furthermore, in various embodiments, the movable member 40 and the functional multilayer structure 20 are adapted to one another such that a shape interlocking arrangement exists between them, such as between a portion of a groove, hole, or through-hole of the structure 20 and the movable member 40, thereby preventing or at least hindering separation of the movable member 40 relative to the functional multilayer structure 20. Figure 6 An example of a shape interlocking arrangement is shown, and combined with Figure 6 It will be appreciated by those skilled in the art that the shape interlocking arrangement can be provided in many different ways in terms of details such as its shape.

[0183] Still with respect to the molding material layer 26, considering, for example, a material sample approximately 2 mm or 3 mm thick, the optical transmittance of, for example, a translucent material selected for the molding material layer 26 can be between about 25% and about 90% or greater at a selected wavelength, such as at least a portion of visible light. The associated half-power angle can be between about 5 degrees and about 75 degrees (based on intensity), such as about 5 degrees, 10 degrees, 20 degrees, 30 degrees, 40 degrees, 50 degrees, 60 degrees, or 70 degrees. The desired transmittance and scattering characteristics can naturally vary in different usage scenarios.

[0184] Thus, the molded material layer 26 can comprise an optically at least translucent, optionally substantially transparent, material, wherein in some use scenarios, the optical transmittance of the overall thermoplastic layer is preferably at least 50%, although the desired transmittance may actually vary substantially between all possible use scenarios. In some embodiments, a transmittance of at least about 80% or 90% may be preferred to maximize the light output of the structure, while in other embodiments, a transmittance of 10%, 20%, or 30% may be sufficient, if not advantageous, if, for example, problems associated with light leakage are to be minimized. The transmittance can be measured or defined in a selected direction (e.g., the primary direction of light propagation) and / or along a lateral direction of the substrate film surface at the location of the lighting module on the substrate film, taking into account selected wavelengths of light emitted by the at least one light source (optionally including visible wavelengths).

[0185] Taking into account, for example, scattering / diffusion or other optical properties, the molding material layer 26 may generally include, for example, at least one material selected from the group consisting of: polymers, organic materials, biomaterials, composite materials, thermoplastic materials, thermosetting materials, elastomeric resins, PC, PMMA, ABS, PET, copolyesters, copolyester resins, nylon (PA, polyamide), polypropylene (PP), thermoplastic polyurethane (TPU), polystyrene (GPPS), thermoplastic vulcanized silicone rubber (TPSiV) and MS resin.

[0186] For example, one example of a suitable material based on polycarbonate is Makrolon TM , are available in a variety of grades, exhibiting different colors / tints (such as white / slightly white and black / slightly black or dark), transparency and scattering properties.

[0187] In various embodiments, the assembly 100 may also include one or more circuits connected to the sensing arrangement 30 and / or the movable member 40. The circuits may include a plurality of light sources and, for example, associated drivers, conductive traces or contact pads, which are optionally printed on the substrates 22, 28 and / or other material layers of the assembly 100 using printed electronics technology. For example, the traces may be configured for transmitting power and / or data (e.g., signaling data or other data) between components such as the light sources and associated drivers and / or a controller and / or power supply, typically. However, the circuits may include one or more electrodes, electrical connectors, electronic components, and integrated circuits (ICs), such as control circuits or data transmission circuits. For example, such circuits may be produced directly in or for the assembly 100 using a selected method, such as a selected printed electronics technology, optionally screen printing, or using a selected coating technology. Additionally or alternatively, the circuits may include a plurality of mounting components, such as surface mount devices (SMDs). Thus, non-conductive and / or conductive adhesives may be used to secure the components to the carrier. In some embodiments, mechanical fastening is implemented or at least enhanced by a non-conductive adhesive material, while solder or other highly conductive (but to a lesser extent, adhesive-type) materials are used for electrical connections.

[0188] If capacitive sensing of other touchless gestures, such as on assembly 100, is to be implemented, the sensing electrodes of the circuit can be configured (sized, positioned, etc.) so that they are positioned as desired within a sensing area or volume defined by, for example, an associated electric or electromagnetic field, and thereby cover, for example, areas on selected sidewalls and / or top of the structure, and / or areas that should be sensitive to touch (and / or touchless gestures in some embodiments) or other sensing targets. This type of configuration can be implemented or performed, for example, by utilizing necessary simulations or measurements.

[0189] Still, the circuit may include and / or the multilayer structure 20 may include at least one component selected from the group consisting of: an electronic component, an electromechanical component, an electro-optical component, a radiation emitting component, a light emitting component, an LED (light emitting diode), an OLED (organic LED), a side-firing LED or other light source, a top-firing LED or other light source, a bottom-firing LED or other light source, a radiation detecting component, a light detecting or light sensitive component, a photodiode, a phototransistor, a photovoltaic device, a sensor, a micromechanical component, a switch, a touch switch, a touch panel, a proximity switch, a touch sensor, an atmospheric sensor, a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, a proximity sensor, a capacitive Switches, capacitive sensors, projected capacitive sensors or switches, single-electrode capacitive switches or sensors, capacitive buttons, multi-electrode capacitive switches or sensors, self-capacitive sensors, mutual-capacitive sensors, inductive sensors, sensor electrodes, micromechanical components, UI elements, user input elements, vibration elements, sound generating elements, communication elements, transmitters, receivers, transceivers, antennas, infrared (IR) receivers or transmitters, wireless communication elements, wireless tags, radio tags, tag readers, data processing elements, microprocessors, microcontrollers, digital signal processors, signal processors, programmable logic chips, ASICs (application-specific integrated circuits), data storage elements, and electronic subassemblies.

[0190] The assembly 100 can and in many use scenarios will be connected to an external system or device, such as a main device or main arrangement of the assembly 100, wherein the connection can be implemented by a connector (e.g., an electrical connector) or a connector cable that is attached to the assembly 100 or structure 20 and its elements (such as circuits) in a selected manner (e.g., communication and / or power supply manner). The attachment point can be provided on the side or bottom of the structure, for example, via a through hole in the substrate 22, 28.

[0191] The scope of the invention is determined by the appended claims along with their equivalents. Those skilled in the art will appreciate the fact that the disclosed embodiments are constructed for illustrative purposes only and that other arrangements applying many of the above principles can be readily prepared to best suit each potential usage scenario.

Claims

1. An interface assembly (100), comprising A functional multilayer structure (20), comprising: - a first substrate (22, 28), - a layer (26) of molding material on a first side of said first substrate (22, 28), and a sensor arrangement (30) comprising at least one sensor (32; 32A, 32B), wherein the sensor arrangement (30) is arranged at least partially embedded in the layer of molding material (26); as well as a movable member (40) movable relative to the functional multilayer structure (20), wherein the movable member (40) includes at least one detection portion (42); and The sensor arrangement (30) and the at least one detection portion (42) are arranged relative to each other such that a position or a change in position of the movable member (40) can be detected by the sensor arrangement (30) based on a position or a change in position of the at least one detection portion (42) relative to the sensor arrangement (30).

2. The interface assembly (100) according to claim 1, wherein the movable member (40) and the functional multilayer structure (20) are attached to each other in a movable manner.

3. An interface assembly (100) according to claim 2, wherein the removable attachment includes a magnetic attachment arrangement, the magnetic attachment arrangement including a first attachment portion (62) on the functional multilayer structure (20) and a second attachment portion (63) on the movable member (40), wherein the magnetic attachment arrangement is arranged to apply an attractive magnetic force between the first attachment portion (62) and the second attachment portion (63).

4. An interface assembly (100) according to claim 2 or 3, wherein the removable attachment includes a mechanical attachment arrangement, which is arranged to prevent or at least hinder separation of the movable member (40) relative to the functional multilayer structure (20).

5. An interface assembly (100) according to claim 2, wherein the mechanical attachment arrangement includes a frame (61), which is suitable for at least partially confining the movable member (40) between the frame (61) and the functional multilayer structure (20), so that the movable member (40) can move within the space between the frame (61) and the functional multilayer structure (20).

6. An interface component (100) according to any one of claims 1 to 5, wherein the functional multilayer structure (20) includes a groove, a hole or a through-hole, and a portion of the movable member (40) including the at least one detection portion (42) is suitable for extending into the groove, the hole or the through-hole and is arranged to be able to move in the groove, the hole or the through-hole.

7. The interface assembly (100) according to claim 6 comprises a shape interlocking arrangement between the groove, the hole or a portion of the through hole and the movable member (40) so as to prevent or at least hinder separation of the movable member (40) relative to the functional multilayer structure (20).

8. An interface assembly (100) according to any one of claims 1 to 7, wherein the movable member (40) is capable of moving in a translational manner relative to the functional multilayer structure (20), such as linearly or nonlinearly, optionally in the groove, the hole or the through hole.

9. An interface assembly (100) according to any one of claims 1 to 8, wherein the movable member (40) is capable of moving in a rotational manner relative to the functional multilayer structure (20), optionally in the groove, the hole or the through hole.

10. An interface assembly (100) according to any one of claims 1 to 9, wherein the functional multilayer structure (20) includes a protrusion, pin or other shape extending outward from the surface of the multilayer structure (20), and the movable member (40) is capable of moving relative to the protrusion, the pin or the other shape, such as being capable of rotating around the protrusion, the pin or the other shape.

11. An interface component (100) according to any one of claims 1 to 10, wherein the at least one sensor (32; 32A, 32B) is at least one optical sensor, and the at least one optical sensor is arranged to emit an optical detection signal for detecting the position or the position change of the at least one detection part (42).

12. An interface component (100) according to any one of claims 1 to 11, wherein the at least one detection part (42) includes one or several magnets and / or ferromagnetic elements, and the sensor arrangement (30) includes a magnetometer, a coil or a Hall effect sensor for detecting the position or position change of the one or several magnets.

13. The interface assembly (100) according to any one of claims 1 to 12, wherein the sensor arrangement (30) comprises a capacitive sensing element for detecting the position or the change in position of the at least one detection portion (42).

14. The interface assembly (100) according to any one of claims 1 to 13, wherein the movable member (40) is mechanically coupled to the functional multilayer structure (20) via a spring (70).

15. The interface assembly (100) of claim 14, wherein a central portion of the spring (70) includes a through hole, and the movable member (40) extends through the through hole toward the functional multilayer structure (20).

16. An interface assembly (100) according to claim 14 or 15, wherein the spring (70) has the shape of a segmented dome, wherein when the spring (70) is not fully compressed, one or more edge portions of the segmented dome are in contact with one of the functional multilayer structure (20) and the movable member (40), and the center portion of the segmented dome is spaced apart from the other of the functional multilayer structure (20) and the movable member (40).

17. The interface assembly (100) of claim 14 or 15, wherein the spring (70) is a planar spring, such as an orthogonal planar spring.

18. The interface assembly (100) of claim 17, wherein the spring (70) is made of a plastic material, such as a thermoformable plastic film.

19. The interface assembly (100) according to any one of claims 1 to 18, wherein the movable member (40) is attached and arranged to move relative to the functional multilayer structure (20) in an articulated manner.

20. An interface component (100) according to any one of claims 1 to 19, wherein the sensor arrangement (30) includes a plurality of sensors (32; 32A, 32B), the plurality of sensors including at least two different types of sensors for detecting the position or the position change of the at least one detection part, the type of sensor being selected from the group consisting of: optical sensor, capacitive sensor, inductive sensor, resistive sensor, magnetic sensor, current sensor, audio sensor or any combination thereof.

21. The interface assembly (100) according to any one of claims 1 to 20, comprising a second substrate (28) on an opposite side of the layer of molding material (26) relative to the first substrate (22).

22. The interface assembly (100) according to any one of claims 1 to 21, wherein the sensor arrangement (30) is provided on a surface of the first substrate (22) and / or the second substrate (28).

23. The interface assembly (100) of any one of claims 1 to 22, wherein one or both of the first substrate (22) or the second substrate (28) is a thermoformable substrate film, optionally having a non-planar three-dimensional shape.

24. A method for manufacturing an interface assembly (100), the method comprising: - obtaining or producing (310) a first substrate (22, 28), such as a thermoformable substrate film; - obtaining (320) at least one sensor (32; 32A, 32B), the at least one sensor being configured to detect a position or a change in position of at least one detection portion (42); - molding (330) a material on one side of said first substrate (22, 28) to at least partially embed the sensor arrangement (30) comprising said at least one sensor (32; 32A, 32B) in a layer (26) of molding material, thereby obtaining a functional multilayer structure (20); - obtaining or generating (340) a movable member (40) comprising said at least one detection portion (42); and - arranging (350) the sensor arrangement (30) and the at least one detection portion (42) relative to each other such that a position or a change in position of the movable member (40) can be detected by the sensor arrangement (30) based on a position or a change in position of the at least one detection portion (42) relative to the sensor arrangement (30).

25. The method of claim 24, comprising thermoforming the first substrate (22, 28) to have at least a portion of a non-planar 3D shape prior to the molding (330).

26. The method of claim 25, wherein the thermoforming comprises at least partially stretching the first substrate (22, 28) under elevated pressure to produce the non-planar 3D shape.

27. The method according to any one of claims 24 to 26, comprising attaching the movable member (40) and the functional multilayer structure (20) to each other in a movable manner.

28. A method according to any one of claims 25 to 27, comprising providing during the thermoforming grooves, holes or through-holes; or protrusions, pins or other shapes extending outwardly from a surface of the functional multilayer structure (20).

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