A semiconductor integrated circuit lead frame washing device

Abstract

The application provides a semiconductor integrated circuit lead frame washing device and relates to the technical field of lead frame production. The semiconductor integrated circuit lead frame washing device is provided with a nozzle main body with a nozzle protective cover. When a water pump is started, water pressure is generated in a pressure cabin. At this time, a nozzle extension rod slides out of the pressure cabin until the nozzle protective cover is attached to the semiconductor integrated circuit lead frame body. At this time, the water source in the pressure cabin reaches the nozzle main body through a one-way valve structure. The nozzle main body sprays the water source obliquely upwards. An arc-shaped suction disc and a water blocking strip are attached to the semiconductor integrated circuit lead frame body to form a water blocking area. At this time, the water source flows along a certain track and finally flows out of the area of a ball main body. The water source forms a backflow in the interior of the nozzle protective cover. The backflow water source continuously flushes the semiconductor integrated circuit lead frame body. The particle debris flushed down flows with the water source to flush the lead frame, which is beneficial to improving the water washing effect of the device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of lead frame production, and particularly relates to a semiconductor integrated circuit lead frame water washing device. BACKGROUND

[0002] The semiconductor integrated circuit lead frame is a frame structure usually made of metal for supporting chips, transmitting electrical signals and providing mechanical support, and is a bridge for connecting chips and external circuits. The semiconductor integrated circuit lead frame water washing device is a special device for cleaning the surface of the lead frame through a water circulation system and a spraying assembly to ensure the cleanliness and subsequent process quality.

[0003] In the Chinese patent No. CN212494160U, the utility model discloses a high -efficient environmental protection's lead frame water washing device, including base, the base is fixedly connected with guide rail and support, be equipped with two side baffle on the guide rail, the side baffle can slide on the guide rail, be connected with the pivot between the side baffle, the pivot transmission coupling motor, at least two guide pulleys are fixedly connected on the pivot, the guide pulley is sheathed with O ring, and the guide pulley is located between the side baffle, water pipe is fixedly connected on the support, and the water pipe is provided with a nozzle. The water washing device with the structure has the following advantages: the width of the conveying belt can be adjusted, and it can be widely used for various specifications of products; the cleaning area is wide, and the cleaning effect is good; the setting of the nozzle saves water and has good cleaning effect; the structure is simple, and production and use are convenient.

[0004] In the Chinese patent No. CN222020188U, the utility model relates to the technical field of lead frame production, and particularly relates to a lead frame water washing equipment. Including the transfer platform, the first rotating shaft is rotatably connected to the transfer platform, the bottom end of the transfer platform is fixedly connected with the first motor, the output end of the first motor is in transmission connection with the bottom end of the first rotating shaft, the first motor drives the rotating disc to rotate, the installation table drives the adsorption mechanism to rotate to the upper side of the conveying belt, the adsorption mechanism is driven downward by the electric push rod, the lead frame is adsorbed, the adsorption mechanism is driven to descend by the electric push rod, the lead frame is soaked in water for water washing, the lead frame on the adsorption mechanism is lifted by the electric push rod, water is sprayed from the nozzle by the water pump, the lead frame is secondarily washed, the lead frame water washing operation is carried out in the water washing box, the washing water is effectively prevented from splashing out, and the cleanliness of the lead frame is improved by the secondary washing.

[0005] The existing semiconductor integrated circuit lead frame washing device is provided with a washing nozzle, and the semiconductor integrated circuit lead frame is sprayed by the washing nozzle to realize the cleaning of the semiconductor integrated circuit lead frame. However, when the nozzle directly flushes the semiconductor integrated circuit lead frame, water stains may splash, causing secondary pollution of the semiconductor integrated circuit lead frame by sewage and foreign matters. SUMMARY

[0006] The technical problem to be solved by the present application is to overcome the defects of the prior art. The present application provides a semiconductor integrated circuit lead frame washing device, which solves the problem of secondary pollution of the semiconductor integrated circuit lead frame by water stains.

[0007] To solve the above technical problems, the technical scheme adopted by the present application is as follows: a semiconductor integrated circuit lead frame washing device, comprising: a washing device outer frame, the inside of the washing device outer frame is provided with a driving assembly, the driving assembly comprises a lead frame clamp and a water blocking block connecting plate, the side of the lead frame clamp is clamped and connected with a semiconductor integrated circuit lead frame body, the side of the water blocking block connecting plate is fixedly connected with a synchronous sliding water blocking block, the inside of the synchronous sliding water blocking block is clamped and connected with a washing device main body, the inside of the washing device main body is provided with a telescopic nozzle assembly, the telescopic nozzle assembly comprises a nozzle protection cover, the inside of the nozzle protection cover is clamped and connected with the washing device main body, the top of the nozzle protection cover is fixedly connected with an arc-shaped suction cup, the outer wall of the nozzle protection cover is provided with a ball main body, the bottom of the nozzle protection cover is fixedly connected with a water blocking strip, the inside of the nozzle protection cover is fixedly connected with a nozzle main body, the side of the nozzle protection cover is fixedly connected with a nozzle extension rod, the inside of the nozzle extension rod is fixedly connected with a one-way valve structure, the side of the one-way valve structure is provided with a closed water blocking column, the closed water blocking column and the nozzle extension rod are fixedly connected, the outer wall of the nozzle extension rod is fixedly connected with a return spring, the side of the return spring is fixedly connected with a pressure tank, and the inside of the pressure tank is provided with a water pipeline.

[0008] Preferably, the nozzle protection cover is arranged in a horn shape, and the nozzle main body is arranged in an upward inclination.

[0009] Preferably, the nozzle extension rod is located in the inside of the pressure tank, and the outer diameter of the nozzle extension rod is the same as the inner diameter of the pressure tank.

[0010] Preferably, the closed water blocking column and the water pipeline form a clamping structure, and the diameter of the closed water blocking column is the same as the diameter of the water pipeline.

[0011] Preferably, the outer wall of the nozzle extension rod is fixedly connected with a limiting block, the inner wall of the pressure tank is provided with a limiting sliding groove, and the limiting block and the limiting sliding groove form a sliding structure.

[0012] Preferably, the outer wall of the lead frame clamp is fixedly connected with a clamp connecting column, one end of the clamp connecting column is fixedly connected with a clamp clamping block, and the inside of the water blocking block connecting plate is provided with a connecting plate sliding groove, and the clamp clamping block and the connecting plate sliding groove form a sliding structure.

[0013] Preferably, the inside of the lead frame clamp is fixedly connected with an electric telescopic rod, and one end of the electric telescopic rod is fixedly connected with a threaded sliding block.

[0014] Preferably, the inside of the threaded sliding block is threadedly connected with a threaded rod main body, the bottom of the threaded rod main body is rotatably connected with a threaded rod rotating shaft, the bottom of the threaded rod rotating shaft is fixedly connected with a threaded rod shell, and the threaded rod shell and the water washing device outer frame are fixedly connected.

[0015] Preferably, the outer wall of the threaded sliding block is clampedly connected with the threaded rod shell, the top of the threaded rod shell is fixedly connected with a servo motor, and the threaded rod main body is fixedly connected to the output end of the servo motor.

[0016] Preferably, the bottom of the water washing device main body is fixedly connected with a water pump pipeline support column, and the water pump pipeline support column and the water washing device outer frame are fixedly connected.

[0017] Compared with the prior art, the beneficial effects of the present application include: the spray head body is provided with a spray head protective cover, when the water pump is started, water pressure is generated in the pressure chamber, at this time the spray head extension rod slides out of the pressure chamber until the spray head protective cover is attached to the semiconductor integrated circuit lead frame body, at this time the water source in the pressure chamber reaches the spray head body through the one-way valve structure, the spray head body sprays the water source obliquely upwards, the arc-shaped suction disc and the water blocking strip are attached to the semiconductor integrated circuit lead frame body to form a water blocking area, at this time the water source flows along a certain trajectory and finally flows out from the area of the ball main body, the water source forms a backflow in the inside of the spray head protective cover, the backflow water source continuously flushes the semiconductor integrated circuit lead frame body, the particle debris flushed down is carried away with the water source to flush the lead frame, which is beneficial to improve the water washing effect of the device, the spray head protective cover is used for preventing water from splashing, avoiding sewage and foreign matters from splashing to the surrounding environment, which is beneficial to prevent the sewage and foreign matters from causing secondary pollution to the lead frame, at the same time, the water flow circulates back in the spray head protective cover according to the trajectory, continuously flushing the lead frame, enhancing the carrying and flushing effect of the particle debris and improving the cleanliness. BRIEF DESCRIPTION OF DRAWINGS

[0018] The disclosure of the present application will be described with reference to the accompanying drawings. It should be understood that the drawings are only for illustrative purposes, and are not intended to limit the scope of protection of the present application. In the drawings, the same reference signs are used to refer to the same parts. Among them:

[0019] Figure 1 is an internal structure schematic view of a semiconductor integrated circuit lead frame water washing device according to one embodiment of the present application.

[0020] Figure 2 is the enlarged structural schematic diagram of the semiconductor integrated circuit lead frame washing device according to an embodiment of the application;

[0021] Figure 3 is the enlarged structural schematic diagram of the driving assembly part according to an embodiment of the application;

[0022] Figure 4 is the exploded structural schematic diagram of the clamp block part according to an embodiment of the application;

[0023] Figure 5 is the enlarged structural schematic diagram of the synchronous sliding water blocking block and the washing device main body connection part according to an embodiment of the application;

[0024] Figure 6 is the enlarged structural schematic diagram of the telescopic nozzle assembly part according to an embodiment of the application;

[0025] Figure 7 is the cross-sectional structural schematic diagram of the pressure tank part according to an embodiment of the application;

[0026] Figure 8 is the exploded structural schematic diagram of the pressure tank part according to an embodiment of the application;

[0027] Figure 9 is the enlarged structural schematic diagram of the nozzle protective cover and the lead frame adhering part according to an embodiment of the application.

[0028] Label in the figure: 1, washing device outer frame; 2, driving assembly; 201, lead frame clamp; 202, water blocking block connecting plate; 203, clamp connecting column; 204, clamp block; 205, connecting plate sliding groove; 206, electric telescopic rod; 207, threaded sliding block; 208, threaded rod main body; 209, threaded rod rotating shaft; 210, threaded rod shell; 211, servo motor; 3, semiconductor integrated circuit lead frame body; 4, synchronous sliding water blocking block; 5, washing device main body; 6, telescopic nozzle assembly; 601, nozzle protective cover; 602, arc-shaped suction cup; 603, ball main body; 604, water blocking strip; 605, nozzle main body; 606, nozzle extension rod; 607, one-way valve structure; 608, closed water blocking column; 609, reset spring; 610, pressure tank; 611, water pipeline; 612, limiting block; 613, limiting sliding groove; 7, water pump pipeline support column. DETAILED DESCRIPTION

[0029] It is easy to understand that, according to the technical solutions of the present application, a person skilled in the art can propose various structural modes and implementation modes which can be replaced with each other without changing the essential spirit of the present application. Therefore, the following specific embodiments and drawings are only exemplary descriptions of the technical solutions of the present application, and should not be regarded as the whole or regarded as the limitation or restriction of the technical solutions of the present application.

[0030] According to the embodiments of the present application, the semiconductor integrated circuit lead frame washing device is provided with Figures 1 to 9 It is shown that a semiconductor integrated circuit lead frame washing device comprises a washing device outer frame 1 for collecting and transferring sewage, a driving assembly 2 arranged inside the washing device outer frame 1 for controlling the movement of internal components of the device, the driving assembly 2 comprising a lead frame clamp 201 and a water blocking block connecting plate 202, the lead frame clamp 201 being provided with a pair of lead frame clamps 201 at both ends for clamping a semiconductor integrated circuit lead frame body 3, the side of the lead frame clamp 201 being engaged with the semiconductor integrated circuit lead frame body 3, the side of the water blocking block connecting plate 202 being fixedly connected with a synchronous sliding water blocking block 4 for limiting a washing device main body 5, the number of work nozzles being adjusted according to the size of the semiconductor integrated circuit lead frame body 3, the inside of the synchronous sliding water blocking block 4 being engaged with the washing device main body 5 for washing the semiconductor integrated circuit lead frame body 3, the inside of the washing device main body 5 being provided with a telescopic nozzle assembly 6, the bottom of the washing device main body 5 being fixedly connected with a water pump pipeline support column 7 for conveying water source and supporting the washing device main body 5, the water pump pipeline support column 7 and the washing device outer frame 1 being fixedly connected.

[0031] According to the embodiments of the present application, the semiconductor integrated circuit lead frame washing device is provided with Figures 6 to 9As shown, a semiconductor integrated circuit lead frame washing device, the telescopic nozzle assembly 6 includes a nozzle protective cover 601, the nozzle protective cover 601 is used to cover the nozzle body 605 to prevent water stains from splashing, the nozzle protective cover 601 is clamped and connected to the inside of the washing device body 5, the nozzle protective cover 601 can be completely retracted into the inside of the washing device body 5, when needed, the nozzle protective cover 601 can be extended, the top of the nozzle protective cover 601 is fixedly connected with an arc suction cup 602, the arc suction cup 602 is used to suck the semiconductor integrated circuit lead frame body 3, so that the arc suction cup 602 and the semiconductor integrated circuit lead frame body 3 cannot move in the horizontal direction, but there are water stains on the surface of the semiconductor integrated circuit lead frame body 3, at this time, when the semiconductor integrated circuit lead frame body 3 moves downward, the arc suction cup 602 can slide in the vertical direction on the surface of the semiconductor integrated circuit lead frame body 3, and the arc suction cup 602 can block the upward water flow to avoid the upward water flow, prevent the upward water flow from polluting the cleaned lead frame part, avoid secondary pollution, the outer wall of the nozzle protective cover 601 is provided with a ball body 603, the ball body 603 can roll on the surface of the semiconductor integrated circuit lead frame body 3, and the ball body 603 has a gap, and sewage dirt can be discharged through the gap, the bottom of the nozzle protective cover 601 is fixedly connected with a water blocking strip 604, the water blocking strip 604 is used to block the downward water flow to avoid the water flow directly falling and discharging, the water blocking strip 604 makes the water flow backflow, the backflow water flow can continuously flush the semiconductor integrated circuit lead frame body 3, and the cleaning effect is improved, the inside of the nozzle protective cover 601 is fixedly connected with a nozzle body 605, the nozzle body 605 is inclined, the side of the nozzle protective cover 601 is fixedly connected with a nozzle extension rod 606, the nozzle extension rod 606 can slide in the inside of a pressure tank 610, the inside of the nozzle extension rod 606 is fixedly connected with a one-way valve structure 607, the one-way valve structure 607 is a mechanical structure similar to a biological heart valve, its core characteristic is to allow fluid to flow in only one direction and prevent reverse flow, it is usually made of a valve leaflet or valve flap made of elastic material, and automatic opening and closing are realized through fluid pressure difference, when the upstream fluid pressure is greater than the downstream, the valve is opened to allow fluid to pass, when the downstream pressure is higher than the upstream or no pressure, the valve is automatically closed to block the reverse flow, the side of the one-way valve structure 607 is provided with a closed water blocking column 608, the closed water blocking column 608 is fixedly connected with the nozzle extension rod 606, the outer wall of the nozzle extension rod 606 is fixedly connected with a return spring 609, the return spring 609 is used to control the return of the nozzle extension rod 606, when the pressure in the pressure tank 610 disappears, the return spring 609 pulls the nozzle extension rod 606 to return, the side of the return spring 609 is fixedly connected with the pressure tank 610, the inside of the pressure tank 610 is provided with a water pipeline 611, the nozzle protective cover 601 is arranged in a horn shape,The nozzle body 605 is tilted upward, and the nozzle extension rod 606 is located inside the pressure chamber 610. The outer diameter of the nozzle extension rod 606 is the same as the inner diameter of the pressure chamber 610. The closed water blocking column 608 and the water supply pipe 611 form a snap-fit ​​structure. The diameter of the closed water blocking column 608 is the same as the diameter of the water supply pipe 611. The outer wall of the nozzle extension rod 606 is fixedly connected to the limit block 612. The inner wall of the pressure chamber 610 has a limit slot 613. The limit block 612 and the limit slot 613 form a sliding structure.

[0032] According to the embodiment of the present invention, Figures 3 to 5 The present invention shows a semiconductor integrated circuit lead frame water washing device, wherein the outer wall of the lead frame clamp 201 is fixedly connected with a clamp connecting column 203, and one end of the clamp connecting column 203 is fixedly connected with a clamp block 204. The lead frame clamp 201, the clamp connecting column 203, and the clamp block 204 are integrated. The water blocking block connecting plate 202 is provided with a connecting plate slide 205 inside. The clamp block 204 and the connecting plate slide 205 form a sliding structure. The clamp block 204 and the connecting plate slide 205 cooperate with each other so that the clamp block 204 can move up and down on the inner wall of the connecting plate slide 205. The lead frame clamp 201 is fixedly connected with an electric telescopic rod 206. The electric telescopic rod 206 is used to control the horizontal movement of the lead frame clamp 201, so that the lead frame clamp 201 clamps the semiconductor integrated circuit lead frame body 3. The electric telescopic rod 206 is used to control the horizontal movement of the lead frame clamp 201, so that the lead frame clamp 201 clamps the semiconductor integrated circuit lead frame body 3. One end of 06 is fixedly connected to a threaded slider 207, and the internal thread of the threaded slider 207 is connected to a threaded rod body 208. The threaded slider 207 and the threaded rod body 208 are threadedly connected. When the threaded rod body 208 rotates, the threaded slider 207 is driven to perform lifting movements. The bottom of the threaded rod body 208 is rotatably connected to a threaded rod rotating shaft 209, and the bottom of the threaded rod rotating shaft 209 is fixedly connected to a threaded rod shell 210. The threaded rod shell 210 is fixedly connected to the outer frame 1 of the water washing device. The outer wall of the threaded slider 207 is snap-connected to the threaded rod shell 210, and the top of the threaded rod shell 210 is fixedly connected to a servo motor 211. The threaded rod body 208 is fixedly connected to the output end of the servo motor 211. The servo motor 211 is used to control the forward and reverse rotation of the threaded rod body 208, and can control the lifting and lowering of the semiconductor integrated circuit lead frame body 3 according to actual conditions.

[0033] In this embodiment, when the device is in use, the semiconductor integrated circuit lead frame body 3 is placed on the side of the lead frame clamp 201, the electric telescopic rod 206 is started, the electric telescopic rod 206 pushes the lead frame clamp 201 to move horizontally until the lead frame clamp 201 at both ends clamps the semiconductor integrated circuit lead frame body 3, when the lead frame clamp 201 moves horizontally, the clamp connecting column 203, the clamp clamping block 204, the water blocking block connecting plate 202 and the synchronous sliding water blocking block 4 move horizontally under the lead frame clamp 201, at this time the synchronous sliding water blocking block 4 slides on the outer wall of the washing device main body 5, the synchronous sliding water blocking block 4 moves synchronously with the lead frame clamp 201, so that the washing area width of the washing device main body 5 is the same as the width of the semiconductor integrated circuit lead frame body 3, so that the water source of washing acts on the semiconductor integrated circuit lead frame body 3, then the servo motor 211 is started, the servo motor 211 drives the threaded rod main body 208 to rotate around the threaded rod rotating shaft 209, at this time the threaded sliding block 207 moves downward under the action of the thread, the threaded sliding block 207 drives the electric telescopic rod 206 and the lead frame clamp 201 to move downward, the lead frame clamp 201 drives the clamped semiconductor integrated circuit lead frame body 3 to move downward, when the lead frame clamp 201 moves downward, the clamp connecting column 203 and the clamp clamping block 204 move in the track of the connecting plate sliding groove 205 at this time, the clamp clamping block 204 and the connecting plate sliding groove 205 cooperate with each other to limit the position, the water pump is started, at this time the water source reaches the position of the water pipeline 611 through the water pump pipeline support column 7, at this time the situation of the nozzle protection cover 601 is divided into two kinds, one is covered by the synchronous sliding water blocking block 4, and the other is not covered by the synchronous sliding water blocking block 4, in the nozzle protection cover 601 covered by the synchronous sliding water blocking block 4, the closed water blocking column 608 is clamped with the water pipeline 611, and the water source cannot enter the pressure cabin 610, in the nozzle protection cover 601 not covered by the synchronous sliding water blocking block 4, the water source pushes the closed water blocking column 608 to move, at this time the water source enters the pressure cabin 610, when the water source continuously supplements the cavity of the pressure cabin 610, the pressure in the pressure cabin 610 continuously increases, at this time the water pressure pushes the nozzle extension rod 606 out of the inside of the pressure cabin 610, the nozzle extension rod 606 moves horizontally with the nozzle protection cover 601 until the arc-shaped suction disc 602, the ball main body 603 and the water blocking strip 604 on the side of the nozzle protection cover 601 are attached to the semiconductor integrated circuit lead frame body 3, at this time the water source in the pressure cabin 610 breaks through the one-way valve structure 607 to reach the position of the nozzle main body 605, the nozzle main body 605 sprays the water source obliquely upwards, the water source first reaches the top of the inner wall of the nozzle protection cover 601, at this time the water source is blocked by the arc-shaped suction disc 602, then the water source flows downward to the bottom of the inner wall of the nozzle protection cover 601, at this time the water source is blocked by the water blocking strip 604, then the water source flows back to the area of the ball main body 603, part of the water source is discharged in the area of the ball main body 603,Another part returns to the circulating water flow, the water source is sucked by the arc-shaped suction cup 602 when it is in contact with the semiconductor integrated circuit lead frame body 3, which can prevent the arc-shaped suction cup 602 and the semiconductor integrated circuit lead frame body 3 from moving horizontally, but there is water stain on the surface of the semiconductor integrated circuit lead frame body 3, at this time the arc-shaped suction cup 602 can slide vertically on the surface of the semiconductor integrated circuit lead frame body 3, when the device is washed, the water pump is turned off, the pressure in the pressure chamber 610 disappears, the one-way valve structure 607 is closed, the nozzle extension rod 606 is reset under the action of the reset spring 609, the limiting block 612 slides in the limiting slot 613, the water source in the pressure chamber 610 returns through the water pipeline 611, at this time the nozzle protection cover 601 is reset.

[0034] The nozzle body 605 is provided with a nozzle protection cover 601, when the water pump is started, water pressure is generated in the pressure chamber 610, at this time the nozzle extension rod 606 slides out of the pressure chamber 610 until the nozzle protection cover 601 is attached to the semiconductor integrated circuit lead frame body 3, at this time the water source in the pressure chamber 610 reaches the nozzle body 605 through the one-way valve structure 607, the nozzle body 605 sprays the water source obliquely upwards, the arc-shaped suction cup 602 and the water-blocking strip 604 are attached to the semiconductor integrated circuit lead frame body 3 to form a water-blocking area, at this time the water source flows along a certain trajectory and finally flows out from the area of the ball body 603, the water source forms a backflow in the nozzle protection cover 601, the backflow water source continuously flushes the semiconductor integrated circuit lead frame body 3, the particles and debris flushed down are carried away with the water source to flush the lead frame, which helps to improve the washing effect of the device, the nozzle protection cover 601 is used to prevent water from splashing, avoiding sewage and foreign matter from splashing into the surrounding environment, which causes pollution to the surrounding environment and needs additional cleaning work, thereby improving the overall production efficiency, which helps to prevent secondary pollution of the lead frame caused by sewage and foreign matter, at the same time, the water flow circulates back in the nozzle protection cover 601 according to the trajectory, continuously flushing the lead frame, enhancing the carrying and flushing effect of the particles and debris, improving the cleanliness, the circulating backflow of the backflow water source in the nozzle protection cover 601 can make the cleaning water evenly distributed on the surface of the lead frame, compared with the traditional straight spraying method of the nozzle, this circulating water flow can avoid the situation of over-washing or under-washing in some local areas, ensuring that each part of the lead frame can be fully and uniformly washed, thereby improving the overall cleanliness and consistency, the circulating water flow can continuously flush the lead frame, which can continuously impact and rub the stubborn pollutants, especially for some pollutants attached to the gaps, holes or lead pins, the backflow water flow can gradually loosen and carry away the pollutants through multiple flushing and penetration, effectively improving the removal ability of stubborn pollutants.

[0035] The technical scope of the present application is not limited to the above-described embodiments, and various modifications and changes can be made to the above-described embodiments without departing from the technical idea of the present application, and these modifications and changes should be included in the scope of the present application.

Claims

1. A semiconductor integrated circuit lead frame washing device, characterized in that: include: The outer frame of the water washing device is provided with a driving assembly inside the outer frame of the water washing device, and the driving assembly includes a lead frame clamp and a water blocking block connecting plate, the side of the lead frame clamp is clamped and connected to the semiconductor integrated circuit lead frame body, the side of the water blocking block connecting plate is fixedly connected to the synchronous sliding water blocking block, the interior of the synchronous sliding water blocking block is clamped and connected to the water washing device body, and a telescopic nozzle assembly is provided inside the water washing device body, the telescopic nozzle assembly includes a nozzle guard cover, the nozzle guard cover is clamped and connected to the interior of the water washing device body, the top of the nozzle guard cover is fixedly connected to the arc suction cup, the outer wall of the nozzle guard cover is provided with a ball body, the bottom of the nozzle guard cover is fixedly connected to the water blocking strip, the interior of the nozzle guard cover is fixedly connected to the nozzle body, the side of the nozzle guard cover is fixedly connected to the nozzle extension rod, the interior of the nozzle extension rod is fixedly connected to a one-way valve structure, the side of the one-way valve structure is provided with a closed water blocking column, and the closed water blocking column is fixedly connected to the nozzle extension rod. The outer wall of the nozzle extension rod is fixedly connected to a return spring, the side of the return spring is fixedly connected to the pressure chamber, the interior of the pressure chamber is provided with a water supply pipe, the nozzle guard cover is arranged in a trumpet shape, the nozzle main body is arranged to be inclined upward, the nozzle extension rod is located inside the pressure chamber, the outer diameter of the nozzle extension rod is the same as the inner diameter of the pressure chamber, the closed water blocking column and the water supply pipe form a clamping structure, the diameter of the closed water blocking column is the same as the diameter of the water supply pipe, the outer wall of the nozzle extension rod is fixedly connected to a limiting block, the inner wall of the pressure chamber is provided with a limiting slide groove, the limiting block and the limiting slide groove form a sliding structure, the outer wall of the lead frame clamp is fixedly connected to a clamp connecting column, one end of the clamp connecting column is fixedly connected to the clamp block, the interior of the water blocking block connecting plate is provided with a connecting plate slide groove, the clamp block and the connecting plate slide groove form a sliding structure, the interior of the lead frame clamp is fixedly connected to an electric telescopic rod, and one end of the electric telescopic rod is fixedly connected to a threaded slider.

2. The semiconductor integrated circuit lead frame water washing device according to claim 1, characterized in that: The internal thread of the threaded slider is connected to the threaded rod body, the bottom of the threaded rod body is rotatably connected to the threaded rod shaft, the bottom of the threaded rod shaft is fixedly connected to the threaded rod shell, and the threaded rod shell is fixedly connected to the outer frame of the water washing device.

3. The semiconductor integrated circuit lead frame water washing device according to claim 2, characterized in that: The outer wall of the threaded slider is snap-connected with a threaded rod housing, the top of the threaded rod housing is fixedly connected with a servo motor, and the threaded rod body is fixedly connected to the output end of the servo motor.

4. The semiconductor integrated circuit lead frame water washing device according to claim 1, characterized in that: A water pump pipeline support column is fixedly connected to the bottom of the water washing device body, and the water pump pipeline support column is fixedly connected to the outer frame of the water washing device.

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