Wastewater management inline cleaner

Abstract

A cleaning apparatus for cleaning an electronic substrate is disclosed, the cleaning apparatus including a rinse module having a rinse station configured to rinse the electronic substrate, and a rinse tank in fluid communication with the rinse station and configured to receive wastewater from the rinse station. The cleaning apparatus further includes a wastewater management and filtration system in fluid communication with the rinse tank. The wastewater management and filtration system includes a pump in fluid communication with a rinse tank, the pump configured to pump wastewater from the rinse tank; a first filter in fluid communication with the pump, the first filter configured to remove larger particles from the wastewater; and a second filter in fluid communication with the first filter and the rinse tank, the second filter configured to decompose organic matter from the wastewater.

Description

Background of the Invention 1. Technical Field

[0001] The present application relates generally to an apparatus for cleaning electronic substrates, including printed circuit boards and semiconductor product components, and more particularly to a system and method for filtering and cleaning contaminated water, sometimes referred to as wastewater, within a cleaning apparatus. 2. Background Technology

[0002] Various types of liquid cleaning equipment (often referred to as cleaners or cleaning machines) are used to clean electronic substrates and remove contaminants such as flux residues, resins, etc. Typically, these contaminants may remain on the electronic substrates as a result of the soldering process.

[0003] Soldering processes have recently advanced in two important ways: the transition from tin-lead solder to lead-free materials; and the reduction in size of electronic substrates and the associated increase in the density of smaller, low-profile components. These new solder materials require increased soldering temperatures and are typically formulated with higher flux content (by weight). The combination of lead-free processes and new electronic substrate designs requires more time and energy to meet industry cleanliness standards.

[0004] Cleaners are used to clean the unwanted materials left by the soldering process on electronic substrates. This type of cleaner is equipped with one or more cleaning modules for cleaning electronic substrates, including a washing station and a rinsing station. When the conveyor of the cleaning equipment passes through the washing station, the conveyor picks up unwanted chemicals and pollutants. These unwanted pollutants are usually removed in the chemical isolation section of the rinse tank of the rinsing station. The pollutants are too diluted to return to the washing station and are too dirty to enter the rinsing station. Contaminated water is removed from the cleaning equipment through a drain provided in the rinse tank, which may be undesirable. Summary of the Invention

[0005] One aspect of the present disclosure relates to a cleaning device for cleaning electronic substrates including printed circuit boards and semiconductor product components. In one embodiment, the cleaning device includes a rinse module, which includes a rinse station configured to rinse the electronic substrate, and a rinse tank fluidically connected to the rinse station and configured to receive wastewater from the rinse station. The cleaning device further includes a wastewater management and filtration system fluidically connected to the rinse tank. The wastewater management and filtration system includes: a pump fluidically connected to the rinse tank, the pump configured to pump wastewater from the rinse tank; a first filter fluidically connected to the pump, the first filter configured to remove larger particles from the wastewater; and a second filter fluidically connected to the first filter and the rinse tank, the second filter configured to decompose organic matter from the wastewater.

[0006] Embodiments of the cleaning apparatus may further include configuring the rinse tank to have a chemical isolation return device that is fluidically connected to the pump. The rinse module may further include a chemical isolation station that is fluidically connected to the rinse station and the chemical isolation return device of the rinse tank. The rinse module may further include a final rinse station that is fluidically connected to the rinse tank, wherein the final rinse station is configured to perform a final rinse on the electronic substrate. The wastewater management and filtration system may further include a first valve that is configured to control the flow of wastewater to the first filter; and a second valve that is configured to control the flow of wastewater from the first filter to the second filter. The cleaning apparatus may further include a wash module that includes a wash station configured to wash the electronic substrate and a wash tank that is fluidically connected to the wash station. The wash tank may be configured to receive wastewater from the wash station. The wastewater management and filtration system may further include a third valve that is configured to control the flow of wastewater from the first filter to the wash tank. The third valve may further be configured to control the flow of wastewater to the chemical isolation return device of the rinse tank. The cleaning apparatus may further include a controller coupled to the pump, the first valve, and the second valve to control the flow of wastewater through the wastewater management and filtration system. The cleaning apparatus may further include a deionized water feed configured to deliver deionized water to the final rinse station. The deionized water feed may further be configured to deliver deionized water to at least one of the first filter and the second filter to perform a backflow cleaning operation. The first filter may be a ceramic water filter, and the organics filter may be configured to employ an advanced oxidation process using ultraviolet (UV) light to decompose organic matter remaining in the wastewater.

[0007] Another aspect of the present disclosure relates to a method for removing contaminants from wastewater within a cleaning apparatus, the cleaning apparatus comprising a rinse module having a rinse station configured to rinse electronic substrates, and a rinse tank in fluid communication with the rinse station and configured to receive wastewater from the rinse station. In one embodiment, the method comprises: transporting the electronic substrates through the rinse module via a conveyor system; pumping wastewater from the rinse tank to a first filter using a pump; filtering the wastewater using the first filter; transporting the wastewater from the first filter to a second filter; filtering the wastewater using the second filter; and returning the filtered wastewater to the rinse tank.

[0008] Embodiments of the method may further include controlling the flow of wastewater from the pump to the first filter using a first valve. The method may further include controlling the flow of wastewater from the first filter to the second filter using a second valve. The method may further include controlling the flow of wastewater from the first filter to a wash tank of a wash module having wash stations configured to wash electronic substrates. The method may further include controlling the flow of wastewater from the first filter to a chemical isolation return of a rinse tank. The method may further include delivering deionized water to a final rinse station of the rinse module. The method may further include delivering deionized water to a second filter to perform a backflow cleaning operation on the second filter.

[0009] Yet another aspect of the present disclosure relates to a wastewater management and filtration system for cleaning equipment configured to clean electronic substrates, including printed circuit boards and semiconductor product components. In one embodiment, the wastewater management and filtration system includes: a pump in fluid communication with a rinse tank of a rinse module, the pump configured to pump wastewater from the rinse tank; a first filter in fluid communication with the pump, the first filter configured to remove larger particles from the wastewater; and a second filter in fluid communication with the first filter and the rinse tank, the second filter configured to decompose organic matter from the wastewater.

[0010] Embodiments of the wastewater management and filtration system may further include configuring the rinse tank to have a chemical isolation return device, the chemical isolation return device being in fluid communication with the pump. The rinse module may further include a chemical isolation station, the chemical isolation station being in fluid communication with the rinse station and the chemical isolation return device of the rinse tank. The rinse module may further include a final rinse station in fluid communication with the rinse tank, wherein the final rinse station is configured to perform a final rinse on the electronic substrate. The wastewater management and filtration system may further include a first valve configured to control the flow of wastewater to the first filter; and a second valve configured to control the flow of wastewater from the first filter to the second filter. The wastewater management and filtration system may further include a third valve configured to control the flow of wastewater from the first filter to the wash tank of the wash module. The third valve may further be configured to control the flow of wastewater to the chemical isolation return device of the rinse tank. The wastewater management and filtration system may further include a controller coupled to the pump to control the flow of wastewater through the wastewater management and filtration system via the first valve and the second valve. The deionized water feed device may be configured to deliver deionized water to a final rinse station. The deionized water feed device may further be configured to deliver deionized water to at least one of a first filter and a second filter to perform a backflow cleaning operation. The first filter may be a ceramic water filter, and the organics filter may be configured to employ an advanced oxidation process using ultraviolet (UV) light to decompose organic matter remaining in the wastewater. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is shown in various figures is represented by a like reference numeral. For clarity, not every component may be labeled in every figure. In the drawings:

[0012] Figure 1 is a perspective view of an electronic substrate cleaning apparatus; and

[0013] Figure 2 A schematic diagram of a portion of a cleaning apparatus. DETAILED DESCRIPTION

[0014] Solder paste is commonly used when assembling electronic substrates, including printed circuit boards and semiconductor product assemblies, to bond electronic components to the substrate. Solder paste includes solder for forming solder joints and flux for preparing metal surfaces for solder attachment. Solder paste can be deposited onto metal surfaces (e.g., electronic soldering areas) disposed on the electronic substrate using any number of application methods. In one example, a stencil printer can employ a scraper to force solder paste through a metal stencil laid over the exposed surface of the electronic substrate. In another example, a dispenser can dispense solder paste material onto specific areas of the electronic substrate. The leads of the electronic components are aligned with the solder deposits and pressed into these solder deposits to form the assembly. During the reflow soldering process, the solder is then heated to a temperature sufficient to melt the solder and then cooled to permanently electrically and mechanically couple the electronic components to the electronic substrate. The solder typically comprises an alloy with a melting temperature lower than that of the metal surfaces to be bonded. Its melting temperature must also be low enough not to damage the electronic components. In certain embodiments, the solder can be a tin-lead alloy. However, solders using lead-free materials can also be used.Another process for attaching components to electronic substrates is the wave soldering process.

[0015] In solder, flux typically includes a carrier, solvent, activator and other additives. The carrier is a solid or non-volatile liquid that is applied to the surface to be soldered and can include rosin, resin, ethylene glycol, polyethylene glycol, polyethylene glycol surfactant and glycerin. The solvent that evaporates during the preheating and soldering process is used to dissolve the carrier activator and other additives. Examples of typical solvents include ethanol, ethylene glycol, glycol esters and / or glycol ethers and water. The activator promotes the removal of metal oxides from the surface to be soldered. Common activators include amine hydrochlorides, dicarboxylic acids (such as adipic acid or succinic acid), and organic acids (such as citric acid, malic acid or abietic acid). Other flux additives may include surfactants, viscosity modifiers and additives for providing low slump or good viscosity characteristics to hold components in place before reflow.

[0016] As previously mentioned, the soldering process described herein can leave unwanted contaminants on the electronic substrate, which must be cleaned before being demolded for use. Disclosed herein is an inline cleaning process for removing unwanted contaminants from wastewater used in a manufacturing process. Specifically, a cleaning apparatus is used to clean the electronic substrate of unwanted material left by the soldering process. Embodiments of the present disclosure relate to a cleaning apparatus in which the height of the cleaning apparatus's spray nozzle can be automatically adjusted to adjust the distance between the spray nozzle and the electronic substrate being cleaned.

[0017] It should be understood that the application of the embodiments of the systems and devices discussed herein is not limited to the details of the construction and arrangement of the components set forth in the following description or shown in the accompanying drawings. These systems and devices can be implemented in other embodiments and can be practiced or performed in various ways. The examples of specific embodiments provided herein are for illustrative purposes only and are not intended to be limiting. Similarly, the words and terms used herein are for descriptive purposes and should not be considered limiting. The use of "including," "comprising," "having," "containing," "involving," and their variations herein is intended to encompass the items listed thereafter and their equivalents and additional items. References to "or" can be interpreted as inclusive, so that any term described using "or" can indicate any one of a single item, multiple items, and all items in the described term. Any reference to front and back, left and right, top and bottom, upper and lower, and vertical and horizontal is intended to facilitate description and does not limit the systems and methods or their components to any one position or spatial orientation.

[0018] Referring now to the drawings, and more particularly to Figure 1 , the electronic substrate cleaning apparatus is generally represented by 10. As shown, the cleaning apparatus 10 is an elongated structure including several modules (each of which is represented by 12) for cleaning and processing electronic substrates. In an exemplary embodiment, the cleaning apparatus 10 includes one or more of the following modules: a pre-wash module, a wash module, a pre-rinse module, a rinse module, and a drying module. The electronic substrates traveling through the cleaning apparatus 10 are cleaned in the pre-wash module and the wash module, rinsed in the pre-rinse module and the rinse module, and dried in the drying module. A control module (collectively represented by 14) with a user interface provides an operator with the ability to program and monitor the cleaning apparatus 10. In certain embodiments, the cleaning apparatus 10 may include a control module provided by ElectrovertCleaners, an ITW Electronic Assembly Equipment company in Camdenton, Missouri. Series of cleaning platforms.

[0019] The cleaning equipment 10 further comprises an elongated conveyor 16, which is configured to transport electronic substrates (such as electronic substrates 18) through each module 12 of the cleaning equipment. The conveyor 16 is designed to securely hold the electronic substrates during the sometimes very strict cleaning process. Trays are sometimes used to support the articles that are transported through the cleaning equipment 10 for cleaning by the conveyor 16. Embodiments of the present disclosure relate to cleaning the wastewater generated by this cleaning process, thereby reducing the needs of distributing wastewater by drains. In one embodiment, the cleaning equipment 10 is configured to clean used water by a filtration process so that water can be reused in the cleaning equipment.

[0020] See also Figure 2 , washing module is represented by 20 usually, and rinsing module is represented by 22 usually.As shown in the figure, washing module 20 comprises washing station 24 and the wash tank 26 that is communicated with the washing station fluid.In washing module 20, the object (such as electronic substrate 18) that is washed advances to the rinse module 22 for rinsing.The washing station 24 of washing module 20 is provided for washing or otherwise cleans electronic substrate, thereby removes pollutants from electronic substrate.The water that is used for washing electronic substrate in washing station 24 is transported to wash tank 26, and wherein used water or contaminated water or wastewater can be handled in the following manner.

[0021] like Figure 2 As shown, the rinse module 22 includes a rinse station 28, a final rinse station 30, and a rinse tank 32. As its name implies, the rinse station 28 and the final rinse station 30 are provided for rinsing away contaminants and other undesirable substances remaining on the electronic substrate after the wash station 24 of the wash module 20. The rinse station 28 and the final rinse station 30 are in fluid communication with the rinse tank 32. Specifically, the used water or contaminated water (wastewater) produced in the rinse station 28 and the final rinse station 30 is discharged into the rinse tank 32. The used water is discharged from the rinse station 28 and the final rinse station 30 into the rinse tank 32. The rinse module 22 further includes a deionized (DI) water feed device 34, which is configured to transport deionized water to the final rinse station 30. As shown, the DI water feed device 34 is in fluid communication with the final rinse station 30 to supply deionized water to the final rinse station. Additionally, a DI water feed 34 may supply deionized water to the wash stations 24 of the wash module 20. Although deionized water is indicated, any type of purified water suitable for removing contaminants from electronic substrates may be employed.

[0022] The water that is delivered to the rinse tank 32 by the rinse station 28 and the final rinse station 30 can be recycled in the cleaning device 10. Specifically, the rinse module 22 further includes a pump 36, which is configured to pump water back from the rinse tank 32 to the rinse station 28 to perform a rinse function before the final rinse function at the final rinse station 30. When pollutants accumulate in the rinse station 28, the water is transferred to the chemical isolation station 38 to isolate the contaminated water. This contaminated water is delivered to the chemical isolation return device 40 associated with the rinse tank from the chemical isolation station 38. In one embodiment, the chemical isolation return device 40 is a part of the rinse tank 32. As discussed above, this contaminated water is usually discharged from the rinse tank 32 through a drain.

[0023] Aspects of the present disclosure relate to a wastewater management and filtration system that is generally Figure 2 50 is indicated in the figure. As is known, filtration is a physical separation process designed to separate solid matter and particles from a fluid, typically by means of a filter or filter medium having a structure that only allows the fluid to pass through. Solid particles that cannot pass through the filter can be identified as filtrate. As shown in the figure, the wastewater management and filtration system 50 includes a multi-stage system, namely a solid filter 52 and an organic filter 54. As used herein, the solid filter 52 is sometimes referred to as the first filter, and the organic filter 54 is sometimes referred to as the second filter.

[0024] The wastewater management and filtration system 50 further includes a pump 56 configured to pump contaminated water from the chemical isolation return 40 of the rinse tank 32 to a solids filter 52. As will be described in more detail below, the solids filter 52 is configured to remove larger particles from the wastewater. Once the wastewater is filtered by the solids filter, the water is transferred to an organics filter 54. Specifically, pressurized wastewater flows from the solids filter 52 to the organics filter 54. As will be described in more detail further below, the organics filter 54 is configured to decompose organic matter from the wastewater. Once the multi-stage filtration process is complete, the treated water is returned to the rinse tank 32.

[0025] Wastewater management and filtration system 50 further includes several valves to control the flow of wastewater to solids filter 52, organics filter 54, and wash tank 26 associated with wash module 20. In one embodiment, valve 58 is disposed between pump 56 and solids filter 52 to control the flow of wastewater from chemical isolation return 40 of rinse tank 32 to the solids filter. As used herein, valve 58 is sometimes referred to as a first valve. Another valve 60 is disposed between solids filter 52 and organics filter 54 to control the flow of wastewater treated by the solids filter toward the organics filter. As used herein, valve 60 is sometimes referred to as a second valve.

[0026] Yet another valve 62 is provided between the solids filter 52 and the wash tank 26 of the wash module 20 to divert flow to the wash tank during a backwash operation. Specifically, the valve 62 is opened during a backwash operation in which untreated water laden with dirt is sent back to the wash tank 26. During normal operation, the valve 62 is configured to allow wastewater to flow through the solids filter 52 and back to the chemical isolation return 40 of the rinse tank 32.

[0027] In one embodiment, a controller (such as the control module 14 of the cleaning apparatus 10) is coupled to the pump 56 and valves 58, 60, and 62 to control the flow of wastewater through the wastewater management and filtration system 50. In a "normal" cycle, valve 58 is open to allow contaminated wastewater to be pumped from the chemical isolation return 40 to the solids filter 52 by the pump 56. Valve 60 is also open to allow wastewater under pressure and treated by the solids filter 52 to flow to the organics filter 54. The fully treated water is returned to the rinse tank 32 under pressure. At the rinse tank 32, the treated water can be used to perform a rinse function at the rinse station 28, with the pump 36 controlling the flow of treated water to the rinse station. The controller is further configured to control the pump 36.

[0028] To clean the solids filter 52 , valve 58 is closed. Although not shown, the DI water feed 34 is configured to deliver deionized water to the solids filter to clean the solids filter. When cleaning the solids filter 52 , valve 62 is opened to allow backwash solids to flow to the wash tank 26 .

[0029] To clean the organic filter 54, the DI water feed 34 is configured to deliver deionized water to the organic filter. Another valve 64 is provided between the DI water feed 34 and valve 60 to control the flow of deionized water to the organic filter 54. The deionized water delivered to the organic filter 54 is provided to perform a backflow cleaning operation on the organic filter. As shown, valve 64 and valve 60 control the flow of deionized water to the organic filter 54. Like valves 58, 60, and 62, valve 64 is coupled to a controller to control the flow of deionized water. Once the deionized water passes through the organic filter 54, it returns to the rinse tank 32.

[0030] In one embodiment, the solid filter 52 is a ceramic water filter having a small pore size of ceramic material to filter out particulate matter from the water. As is known, ceramic water filters are used to capture particles in water.

[0031] In one embodiment, organic filter 54 is a water filter specifically designed to degrade organic matter in wastewater. In a specific embodiment, organic filter 54 is configured to utilize ultraviolet (UV) light to apply an advanced oxidation process to degrade residual organic matter in the wastewater. This process can utilize titanium dioxide tubes and a UV light process. Other types of organic filters, such as carbon filters, can be used in addition to or in place of titanium dioxide tubes.

[0032] It should be observed that the wastewater management and filtration system 50 provides a closed loop system to remove contaminants from the wastewater. In some embodiments, nearly all of the water used within the rinse module 22 can be recycled and reused.

[0033] A process for removing contaminated materials from wastewater is further provided. Such a process can include three stages or steps. In one embodiment, stage 1 includes collecting contaminated materials from the wastewater in the chemical isolation return device 40. Next, stage 2 includes operating a pump 56 to drive the contaminated materials to move to a solid filter 52 to remove larger contaminants. Next, stage 3 includes conveying the filtered wastewater from the solid filter 52 to an organic filter 54 (e.g., a titanium dioxide tube), which provides an advanced oxidation process using UV light to decompose organic matter remaining in the filtered wastewater. Once processed by the solid filter 52 and the organic filter 54, the treated water is conveyed to the rinse tank 32 and ultimately to the DI generation system for recirculation.

[0034] The process further includes cleaning the filters, including cleaning the solid filter 52 and the organic filter 54 as described above. Specifically, the solid filter 52 can be cleaned offline by automatic backwashing of the solid filter, which will clear the pores of the solid filter.

[0035] It should be understood that the above description is for the purpose of illustration and example only, not for the purpose of limitation, and that various changes and modifications may be made. For example, the cleaning device 10 described above may be any type of cleaning machine for cleaning electronic substrates. Accordingly, other embodiments are contemplated, and modifications and changes may be made without departing from the scope of the present application.

[0036] In one embodiment, the control module 14 of the cleaning device 10 is configured with an operating system (e.g., based on The user interface provides a user-friendly operating system that offers familiar drop-down menus and features data logging and barcoding capabilities. The operating system is easily networked for downloading recipes and remotely accessing operational data. The user interface enables quick and easy viewing of system pressure, water level, pump and blower operation, temperature, and fill / drain operation. Furthermore, the user interface can be configured to control the operation of the adjustable-height spray system, particularly the actuator.

[0037] A variety of different controllers (such as control module 14) can perform the various different operations discussed above. Using data stored in associated memory and / or storage devices, control module 14 also executes one or more instructions stored in one or more non-transitory computer-readable media, which control module 14 may include and / or be connected to, which may generate manipulation data. In some examples, control module 14 may include one or more processors or other types of controllers. In one example, control module 14 is at least one processor or includes at least one processor. In another example, in addition to or instead of a general-purpose processor, control module 14 uses a dedicated integrated circuit to perform at least a portion of the operations discussed above, which is customized to perform a particular operation. As illustrated by these examples, many specific combinations of hardware and software may be used to perform the operations described herein according to examples of the present disclosure, and the present disclosure is not limited to any specific combination of hardware and software components. Examples of the present disclosure may include a computer program product configured to perform the methods, processes, and / or operations discussed above. The computer program product may be or include one or more controllers and / or processors configured to execute instructions to perform the methods, processes, and / or operations discussed above.

[0038] Many process parameters can be configured in the computer-controlled operator interface provided in the cleaning apparatus 10. System pressure, water level and temperature are easily accessible. Data logging and bar coding capabilities are features that enhance and simplify the production process.

[0039] In some embodiments, the cleaning apparatus 10 may include one or more rear panels that can be easily removed for maintenance. A front door may further be provided to provide quick access to electrical panels, computers, heaters, floats, thermocouples, and components of wastewater management and filtration systems. The cleaning apparatus 10 may include hinged tempered glass windows to provide optimal viewing and accessibility.

[0040] Having thus described several aspects of at least one embodiment of the present disclosure, it will be appreciated that various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be a part of this disclosure and are intended to fall within the spirit and scope of this disclosure. Therefore, the foregoing description and accompanying drawings are intended only as examples.

[0041] Claims.

Claims

1. A cleaning device for cleaning electronic substrates including printed circuit boards and semiconductor product components, the cleaning device comprising: a rinsing module comprising a rinsing station configured to rinse the electronic substrate, and a rinsing tank in fluid communication with the rinsing station and configured to receive wastewater from the rinsing station; as well as A wastewater management and filtration system in fluid communication with the rinse tank, the wastewater management and filtration system comprising: a pump in fluid communication with the rinse tank, the pump being configured to pump wastewater from the rinse tank, a first filter in fluid communication with the pump, the first filter configured to remove larger particles from the wastewater, and A second filter is in fluid communication with the first filter and the rinse tank, the second filter being configured to decompose organic matter from the wastewater.

2. The cleaning device according to claim 1, wherein The rinse tank includes a chemical isolation return in fluid communication with the pump.

3. The cleaning device according to claim 2, wherein: The rinse module further includes a chemical isolation station in fluid communication with the rinse station and a chemical isolation return of the rinse tank.

4. The cleaning device according to claim 1, wherein The rinse module further includes a final rinse station in fluid communication with the rinse tank, the final rinse station being configured to perform a final rinse on the electronic substrate.

5. The cleaning device according to claim 1, wherein The wastewater management and filtration system further includes a first valve configured to control the flow of wastewater to the first filter and a second valve configured to control the flow of wastewater from the first filter to the second filter.

6. The cleaning apparatus of claim 5 , further comprising a washing module, the washing module comprising a washing station configured to wash the electronic substrate and a washing tank in fluid communication with the washing station, the washing tank being configured to receive wastewater from the washing station. in, The wastewater management and filtration system further includes a third valve configured to control the flow of wastewater from the first filter to the wash tank.

7. The cleaning device according to claim 6, wherein The third valve is further configured to control the flow of wastewater to the chemical isolation return of the rinse tank.

8. The cleaning apparatus of claim 5, further comprising a controller coupled to the pump, the first valve, and the second valve to control the flow of wastewater through the wastewater management and filtration system. 9 . The cleaning apparatus of claim 1 , further comprising a deionized water feed device configured to deliver deionized water to the final rinse station.

10. The cleaning device according to claim 9, wherein The deionized water feeding device is further configured to deliver deionized water to at least one of the first filter and the second filter to perform a backflow cleaning operation.

11. The cleaning device according to claim 1, wherein The first filter is a ceramic water filter, and the organics filter is configured to apply an advanced oxidation process using ultraviolet (UV) light to decompose residual organics in the wastewater.

12. A method for removing contaminants from wastewater in a cleaning apparatus, the cleaning apparatus comprising a rinse module having a rinse station configured to rinse an electronic substrate, and a rinse tank in fluid communication with the rinse station and configured to receive wastewater from the rinse station, the method comprising: transporting the electronic substrate through the rinse module via the conveyor system; pumping the wastewater from the rinse tank to the first filter using a pump; Performing a filtering operation on the wastewater using the first filter; transferring wastewater from the first filter to a second filter; performing a filtering operation on the wastewater using the second filter; as well as The filtered wastewater is returned to the rinse tank.

13. The method of claim 12, further comprising: A first valve is used to control the flow of wastewater from the pump to the first filter.

14. The method of claim 13, further comprising: A second valve is used to control the flow of wastewater from the first filter to the second filter.

15. The method of claim 14, further comprising: The flow of wastewater from the first filter is controlled to a wash tank of a washing module having a washing station configured to wash electronic substrates.

16. The method of claim 15, further comprising: The flow of wastewater from the first filter to the chemical isolation return of the rinse tank is controlled.

17. The method of claim 12, further comprising: Deionized water is delivered to the final rinse station of the rinse module.

18. The method of claim 17, further comprising: Deionized water is delivered to at least one of the first filter and the second filter to perform a backwash cleaning operation.

19. A wastewater management and filtration system for cleaning equipment configured to clean electronic substrates including printed circuit boards and semiconductor product components, the wastewater management and filtration system comprising: a pump in fluid communication with a rinse tank of the rinse module, the pump being configured to pump wastewater from the rinse tank; a first filter in fluid communication with the pump, the first filter configured to remove larger particles from the wastewater; as well as A second filter is in fluid communication with the first filter and the rinse tank, the second filter being configured to decompose organic matter from the wastewater.

20. The wastewater management and filtration system of claim 19, further comprising a first valve configured to control the flow of wastewater to the first filter; and a second valve configured to control the flow of wastewater from the first filter to the second filter.

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