Laser cutting method, device and system

Abstract

The invention discloses a laser cutting method, device and system. The method comprises the steps that triggering of an operation instruction used for obtaining plate information and the current machining speed of a machining point is detected; and based on the plate information and the current processing speed, executing an instruction of automatically selecting an optimal waveform corresponding to the current processing speed and the plate information from an optimal processing waveform library stored in the laser, and controlling the laser to emit light according to the optimal waveform. By the adoption of the cutting method, the current machining speed of the machining point is detected in real time, the board information is combined, the corresponding optimal waveform is called as needed, and the problem that in the traditional cutting process, due to the fact that light emitting parameters are fixed, the output energy is improperly matched with the current path condition can be solved; and particularly, the problem that slag adheres to the cutting end face at the corner easily is solved, and the machining precision and the cutting quality are greatly improved.

Description

Technical Field

[0001] The present application relates to the field of laser cutting technology, and in particular to a laser cutting method, device and system thereof. Background Art

[0002] Laser cutting technology uses a high-energy-density laser beam to thermally process materials. When a high-power-density laser beam is focused onto the surface of the material being cut, it rapidly heats the material to its vaporization temperature, vaporizing it and forming holes. As the laser beam moves along a predetermined path through the material, these holes align, ultimately forming a kerf of a predetermined width, achieving precise cutting.

[0003] Traditional laser cutting often uses fixed beam parameters (such as laser power and modulation frequency), which cannot be dynamically adjusted based on the plate material, processing path, and speed, resulting in significant drawbacks. For example, at corners in the cutting path, the laser power is not adjusted synchronously when the cutting head decelerates. This causes the material to be heated for a longer time, energy to accumulate, and excessive melting. This causes slag to form after cooling, seriously affecting the flatness and finish of the cut surface. Furthermore, due to the maximum power limit of the laser, the energy input during the perforation process is insufficient, resulting in low perforation efficiency and making it difficult to meet the high-precision, high-efficiency requirements of modern processing. Summary of the Invention

[0004] The embodiments of the present application aim to provide a laser cutting method, device and system thereof to solve the technical problems in the traditional cutting process where the output energy does not match the current path conditions and the perforation efficiency is low due to the fixed light output parameters.

[0005] To solve the above technical problems, a first embodiment of the present application provides a laser cutting method, which includes the following steps: Detecting the triggering of an operation instruction for obtaining plate information and the current processing speed of a processing point; Based on the plate information and the current processing speed, an instruction is executed to automatically select the optimal waveform corresponding to the current processing speed and the plate information from the optimal processing waveform library stored in the laser, and the laser is controlled to emit light using the optimal waveform.

[0006] As a preferred solution, obtaining the current processing speed of the processing point includes: Real-time monitoring of the actual position of the processing point; Based on the change of the actual position and the corresponding time interval, the instantaneous speed of the processing point is calculated as the current processing speed.

[0007] As a preferred solution, the optimal processing waveform library is established based on the mapping relationship between the plate information, processing speed and the corresponding optimal waveform. The optimal waveform refers to a laser pulse waveform that can make the cutting quality reach a preset standard.

[0008] As a preferred solution, the optimal waveform is obtained by designing different waveforms at different processing speeds based on the plate information to perform cutting tests on the plate.

[0009] As a preferred solution, the waveform parameters of the optimal waveform include one or a combination of output power, duty cycle and light output frequency.

[0010] As a preferred solution, each optimal waveform in the optimal processing waveform library is assigned a unique waveform number, and the waveform number forms a mapping relationship with the plate information and processing speed, which is used to quickly locate the target waveform during real-time processing.

[0011] As a preferred solution, before the triggering of the detection of the operation instruction for obtaining the plate information and the current processing speed of the processing point, the method further includes: when it is detected that the processing point is a perforation starting point, executing the following steps: Detecting the triggering of an operation instruction for obtaining plate information; Based on the plate information, an instruction is executed to automatically select a perforation-specific waveform corresponding to the current plate from the optimal processing waveform library stored in the laser, and the laser is controlled to emit light using the perforation-specific waveform.

[0012] As a preferred solution, the output power of the perforation-specific waveform is 1-1.2 times the rated power of the laser.

[0013] To solve the above technical problems, a second embodiment of the present application provides a laser cutting device, comprising: Lasers; An acquisition module, used to obtain plate information and the current processing speed of the processing point; and The control module is used to automatically select the optimal waveform corresponding to the current processing speed and plate information from the optimal processing waveform library stored in the laser based on the plate information and the current processing speed, and control the laser to emit light according to the optimal waveform.

[0014] In order to solve the above technical problems, the third embodiment of the present application provides a laser cutting system, which includes the laser cutting device in the above solution.

[0015] Compared with the existing technology, the laser processing method of the present application obtains the current processing speed of the processing point in real time and combines it with the plate information, automatically calls the relevant optimal waveform from the optimal processing waveform library, and realizes real-time changes in the output power, light output frequency and duty cycle of the laser in the cutting process, ensuring the best cutting quality. It can avoid the problem of improper matching between the output energy and the current cutting path due to the fixed light output parameters in the traditional cutting process, and especially solves the problem of easy slag on the cutting end face at the corner, thereby greatly improving the processing accuracy and cutting quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0017] Figure 1 Flowchart of the steps of the laser cutting method in the embodiment of the present application; Figure 2 A schematic diagram comparing the effects of cutting a workpiece using the cutting method of the present application and using a cutting method of the prior art; Figure 3 The figure is a schematic diagram comparing the effects of cutting another workpiece using the cutting method of the present application and cutting the workpiece using the cutting method of the prior art. DETAILED DESCRIPTION

[0018] In order to facilitate the understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as being "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "upper", "lower", "inner", "outer", "bottom" and the like used in this specification indicate an orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" and the like are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0019] Unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification and in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" as used in this specification includes any and all combinations of one or more of the relevant listed items.

[0020] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0021] In traditional laser cutting, the processing point of the cutting head has significant changing characteristics as it moves along the processing path. For example, for a cutting path that includes a straight line, a corner, and a straight line in sequence, the processing point of the cutting head needs to accelerate from a stationary state (v=0) along the straight path to the set cutting speed vmax, maintaining a uniform speed of vmax; decelerate to a safe speed vcor when approaching a corner, and pass the corner at a constant or slightly variable speed; after entering a new straight path, re-accelerate to vmax, and then move at a uniform speed for a period of time before finally decelerating to a stop. In this process, the laser always outputs laser light with standard parameters, and the standard parameters only match the set cutting speed vmax. When the cutting point is in the acceleration and deceleration section and at the corner, its cutting speed is lower than the set cutting speed. This causes the corresponding part of the material to be cut to be heated for a longer time and accumulate energy, eventually forming slag at the cutting part, resulting in poor cutting quality.

[0022] Based on this, please refer to Figure 1 , the present application first provides a laser cutting method, the method comprising the following steps: S1. Detecting the triggering of an operation instruction for obtaining plate information and the current processing speed of a processing point; wherein the plate information is relevant parameters of the plate to be cut, including at least the material and thickness of the plate, and the current processing speed of the processing point is fed back in real time by the machine tool motion system.

[0023] S2. Based on the plate information and the current processing speed, execute the instruction of automatically selecting the optimal waveform corresponding to the current processing speed and the plate information from the optimal processing waveform library stored in the laser, and control the laser to emit light according to the optimal waveform.

[0024] It can be understood that the present application obtains the original basic data of the optimal processing waveform library through multiple cutting tests. For example, for a plate of a certain material and thickness, a plurality of different speed points are set in the full speed range that can cover the actual movement of the processing point for cutting tests, and different laser parameters (such as light output power, light output frequency and duty cycle, etc.) are set at each speed point. By evaluating the cutting effect at each speed, the laser parameter data with the best effect at each speed point is found. In this way, the plate information, processing speed and the corresponding optimal laser parameter data are used as the original basic data, and the optimal processing waveform library is subsequently formed based on the original basic data. During formal processing, the current processing speed and plate information obtained in real time can be used to directly switch to the optimal waveform that can produce the best processing effect, thereby ensuring cutting quality and efficiency.

[0025] This application obtains the current processing speed of the processing point in real time and combines it with the plate information, automatically calls the relevant optimal waveform from the optimal processing waveform library, and realizes real-time changes in the output power, light output frequency and duty cycle of the laser in the cutting process to ensure the best cutting quality. It can avoid the problem of improper matching between the output energy and the current cutting path due to the fixed light output parameters in the traditional cutting process, and especially solves the problem of easy slag on the cutting end face at the corner, which greatly improves the processing accuracy and cutting quality.

[0026] In order to facilitate understanding of the above application concepts of the present application, the above application concepts of the present application are described in more detail below with reference to the accompanying drawings and specific embodiments.

[0027] In this application, obtaining the current processing speed of the processing point in step S1 includes: Detect the actual position of the processing point in real time; Based on the change in the actual position and the corresponding time interval, the instantaneous speed of the processing point is calculated as the current processing speed.

[0028] In one embodiment, a multi-axis servo encoder can be used to achieve real-time detection of the current processing speed of the processing point. In the laser cutting system of the present application, the multi-axis servo encoder is installed at the rear end of the servo motor that drives the cutting head or inside the motor to measure the angular displacement of the motor. The numerical control system calculates the actual position coordinates of the cutting head at the processing point on the plate surface based on the angular displacement data and preset mechanical transmission parameters. Then, by continuously collecting the position difference and time interval of adjacent cycles, the instantaneous speed on each axis is obtained through differential operation. Finally, vector synthesis can be used to obtain the real-time composite speed of the processing point, that is, the current processing speed.

[0029] By accurately acquiring the current processing speed of the processing point in real time and using it as one of the waveform index parameters, the laser cutting system can accurately call the waveform parameters that match the current actual working conditions from the pre-stored optimal processing waveform library, effectively avoiding cutting defects caused by the mismatch between the processing speed (processing path) and the output waveform parameters (output power, duty cycle, and output frequency). For example, when the cutting point reaches a corner, the cutting speed slows down, and the system quickly calls the waveform parameters of low power and long pulses to reduce the heat input of the laser to the plate, thereby preventing the problem of dross caused by excessive heating of the plate.

[0030] To facilitate quick indexing and recall, each optimal waveform in the optimal processing waveform library is assigned a unique waveform number. This number, bound to the plate material information and processing speed, serves as the waveform's identifier in the library, significantly improving the system's parameter retrieval efficiency during real-time processing. After obtaining the current processing speed and plate material information, the system can directly locate the target waveform and trigger the call through the mapping relationship between the two and the waveform number, reducing the calculation time of parameter matching and ensuring that the switching response speed of the laser output parameters is synchronized with the motion state of the processing point.

[0031] In an embodiment of the present application, the optimal processing waveform library is established based on the mapping relationship between the plate information, processing speed and the corresponding optimal waveform. The optimal waveform refers to a laser pulse waveform that can make the cutting quality reach a preset standard.

[0032] Specifically, the optimal processing waveform library, a data set, precisely defines the optimal laser pulse waveform for each specific plate at every possible processing speed. In this application, when using this optimal waveform to cut a specific plate at a specific speed, the final cut quality must meet a preset standard. Key indicators involved in this standard (such as dross, roughness, and perpendicularity) must strictly meet pre-defined process quality requirements (e.g., no dross at all, roughness Ra ≤ a certain value).

[0033] The optimal waveform is obtained by designing different waveforms at different processing speeds for a certain plate and then performing cutting tests on it. For example, the cutting test process is as follows: For the target plate (such as SUS304 stainless steel, 3mm thickness), a series of discrete test speed points are selected within the speed range that may be involved in its actual processing. Multiple sets of cutting tests are performed at each selected speed point. Each set of tests uses a different combination of laser pulse waveform parameters (including output power, modulation frequency, and duty cycle) for testing. The quality of the plate after cutting with each waveform is then evaluated using the above-mentioned relevant indicators. The waveform parameter combination that can achieve the best cutting quality at this speed point is screened out. Finally, the determined waveform parameter set is defined as the optimal waveform for the plate at this speed. This application traverses all target plates and all preset speed points, establishes a mapping relationship between the plate information, speed points, and corresponding optimal waveform parameters, and stores them, ultimately forming an optimal processing waveform library. In this way, it can be ensured that at any speed point in the dynamic cutting path (especially acceleration and deceleration sections and corner areas), the system can call the laser output parameters that can guarantee the best cutting quality at the current speed, fundamentally improving the quality and efficiency of laser cutting and achieving high-quality cutting without dross and overburning.

[0034] In some embodiments, the waveform parameters of the optimal waveform include one or a combination of output power, duty cycle, and light output frequency.

[0035] In this application, the key indicators involved in the preset standard (such as dross amount, roughness, and verticality) must strictly meet the preset process quality requirements (for example, no dross at all, roughness Ra ≤ a certain value). Optionally, the preset standard for cutting quality is that the residual dross height on the cut end face is ≤ 0.10 mm, and there is no non-point-shaped continuous dross.

[0036] The laser cutting method provided in this application detects the current processing speed of the processing point in real time, combines it with pre-established plate material information, and automatically calls the optimal laser pulse waveform parameters that match the current working conditions. This allows for precise and adaptive adjustment of laser energy output in response to dynamic changes in processing speed, thereby improving the quality of the cut section. For complex working conditions such as linear acceleration sections, high-speed uniform speed sections, and sections with small curvature corners, the input energy per unit length of the cutting path is significantly improved, resolving the existing problem of energy oversaturation in low-speed areas and insufficient energy in high-speed areas due to fixed parameters.

[0037] It can be understood that by binding the cutting speed (path characteristics) with the waveform called by the laser, the laser cutting system can more accurately capture the dynamic changes in the processing process - not only considering the differences in energy input efficiency caused by speed, but also taking into account the changes in material stress state and heat dissipation conditions caused by path curvature, thereby making the regulation of the laser pulse waveform more accurate and comprehensive, and ultimately achieving stable cutting quality throughout the entire path, effectively eliminating cutting defects in different characteristic paths.

[0038] Please refer to Figure 2 and Figure 3 , which shows a schematic diagram comparing the cutting effects of different workpieces using the cutting method of the present application and the cutting method of the prior art. It can be seen that when the cutting method of the present application is used to process the workpiece, defects such as dross and ablation are significantly reduced at the cut portion (marked in red), and the cut edge is smoother. In contrast, workpieces processed using the prior art cutting method not only have more burrs and dross at the cut portion, but also have more prominent deformation and ablation marks caused by heat at the edge, resulting in more severe material loss and quality defects.

[0039] In one embodiment, before step S1, the method further includes: when the processing point is detected to be a perforation starting point, performing the following steps: Detecting the triggering of an operation instruction for obtaining plate information; Based on the plate information, the instruction of automatically selecting the perforation-specific waveform corresponding to the current plate from the optimal processing waveform library stored in the laser is executed, and the laser is controlled to emit light using the perforation-specific waveform.

[0040] It can be understood that the perforation-specific waveform is also obtained by designing different waveforms at different processing speeds for a certain plate information and then performing cutting tests on it. The testing principle is the same as the principle of obtaining the aforementioned optimal waveform, which will not be elaborated here.

[0041] In one embodiment, the output power of the perforation-specific waveform is 1-1.2 times the rated power of the laser. This not only reasonably utilizes the power upper limit, but also can use short-term high-energy pulses to quickly penetrate the plate, thereby improving perforation efficiency.

[0042] As a second aspect of the present application, the present application further provides a laser cutting device, comprising an acquisition module and a control module. The acquisition module is configured to acquire plate information and a current processing speed of a processing point; the control module is configured to automatically select an optimal waveform corresponding to the current processing speed and plate information from an optimal processing waveform library stored in a laser, based on the plate information and the current processing speed, and control the laser to emit light according to the optimal waveform.

[0043] As a third aspect of the present application, the present application further proposes a laser cutting system, which includes the laser cutting device of the above-mentioned solution. In some embodiments, the laser cutting system also includes a machine tool body, a cutting head assembly, a multi-axis drive system, and a numerical control system. Among them, the machine tool body is used to carry the plate to be cut to ensure stability during the processing process; the cutting head assembly is installed on the motion axis of the machine tool, and is used to focus the laser beam output by the laser to the processing point of the plate to be cut; the multi-axis drive system (such as the XYZ three-axis drive mechanism) is controlled by the CNC system to drive the cutting head assembly to move along the preset path, and at the same time, the position information of the processing point is fed back to the acquisition module of the laser cutting device in real time to calculate the current processing speed; the CNC system is used to receive and analyze the information in the processing drawing and plan the cutting path, and send motion instructions to the multi-axis drive system; the laser cutting system of this application deeply integrates the waveform dynamic control function of the laser cutting device with the motion control and CNC planning of the machine tool through the collaborative work of various components, and can realize the full process automation from drawing analysis, path planning to real-time waveform adaptation and cutting execution, ensuring the precise matching of the processing point speed and the light output parameters, and further improving the efficiency and quality stability of laser cutting.

[0044] It can be understood that the above-mentioned embodiments of the laser cutting method and the embodiments of the laser cutting device and the laser cutting system all belong to the same concept. The specific implementation process is detailed in the embodiments of the laser cutting method, and the technical features in the embodiments of the laser cutting device and the technical features in the embodiments of the laser cutting system are all applicable in the application embodiments of the above-mentioned laser cutting method, and will not be repeated here.

[0045] Compared with the existing technology, the laser processing method of the present application automatically calls the relevant optimal waveform from the optimal processing waveform library by obtaining the current processing speed of the processing point in real time and combining it with the plate information, so as to realize the real-time change of the laser output power, light output frequency and duty cycle in the cutting process, ensure the best cutting quality, and avoid the problem of improper matching between the output energy and the current cutting path due to the fixed light output parameters in the traditional cutting process. In particular, it can solve the problem of easy slag on the cut end face at the corner, greatly improving the processing accuracy and cutting quality. At the same time, the present application detects the perforation starting point at the initial stage of the cutting process, and calls a special perforation waveform with an output power of 1-1.2 times the rated power of the laser based on the plate information, thereby solving the problems of low efficiency, easy overburning or incomplete perforation caused by perforation with a general waveform in traditional cutting, significantly improving the perforation speed and perforation quality, and laying a good foundation for subsequent cutting processes. Therefore, the present application effectively overcomes the various shortcomings of the existing technology and has high industrial utilization value.

[0046] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0047] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Based on the idea of ​​the present application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes in different aspects of the present application as described above. For the sake of simplicity, they are not provided in detail. Although the present application has been described in detail with reference to the above embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the above embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A laser cutting method, characterized in that: The method comprises the following steps: Detecting the triggering of an operation instruction for obtaining plate information and the current processing speed of a processing point; Based on the plate information and the current processing speed, an instruction is executed to automatically select the optimal waveform corresponding to the current processing speed and the plate information from the optimal processing waveform library stored in the laser, and the laser is controlled to emit light using the optimal waveform.

2. The laser cutting method according to claim 1, characterized in that: The obtaining of the current processing speed of the processing point includes: Real-time monitoring of the actual position of the processing point; Based on the change of the actual position and the corresponding time interval, the instantaneous speed of the processing point is calculated as the current processing speed.

3. The laser cutting method according to claim 1, wherein: The optimal processing waveform library is established based on the mapping relationship between the plate information, processing speed and the corresponding optimal waveform. The optimal waveform refers to a laser pulse waveform that can make the cutting quality reach a preset standard.

4. The laser cutting method according to claim 3, characterized in that: The optimal waveform is obtained by designing different waveforms at different processing speeds based on the plate information to perform cutting tests on the plate.

5. The laser cutting method according to claim 1, wherein: The waveform parameters of the optimal waveform include one or a combination of output power, duty cycle and light output frequency.

6. The laser cutting method according to claim 1, characterized in that: Each optimal waveform in the optimal processing waveform library is assigned a unique waveform number, and the waveform number forms a mapping relationship with the plate information and processing speed, which is used to quickly locate the target waveform during real-time processing.

7. The laser cutting method according to claim 1, characterized in that: Before the triggering of the operation instruction for obtaining the plate information and the current processing speed of the processing point, the method further includes: when it is detected that the processing point is a perforation starting point, executing the following steps: Detecting the triggering of an operation instruction for obtaining plate information; Based on the plate information, an instruction is executed to automatically select a perforation-specific waveform corresponding to the current plate from the optimal processing waveform library stored in the laser, and the laser is controlled to emit light using the perforation-specific waveform.

8. The laser cutting method according to claim 7, characterized in that: The output power of the perforation-specific waveform is 1-1.2 times the rated power of the laser.

9. A laser cutting device, characterized in that: The laser cutting device comprises: Lasers; An acquisition module, used to obtain plate information and the current processing speed of the processing point; and The control module is used to automatically select the optimal waveform corresponding to the current processing speed and the plate information from the optimal processing waveform library stored in the laser based on the plate information and the current processing speed, and control the laser to emit light using the optimal waveform.

10. A laser cutting system, characterized in that: The laser cutting system includes the laser cutting device according to claim 9.

Images