Welding device for LED display screen chip production

Abstract

The invention relates to the technical field of chip welding, in particular to a welding device for LED display screen chip production. According to the technical scheme, two symmetrically-arranged hydraulic boxes are arranged on a suction cup, the hydraulic boxes are fixedly connected with the pushing end of an electric cylinder, the air suction end of an air suction device penetrates through the center of the suction cup, a pushing seat fixedly connected with the top of the suction cup is slidably installed at the bottom of each hydraulic box, magnetorheological fluid is arranged in each hydraulic box, and a round frame is installed outside each hydraulic box; an electromagnetic coil is installed in the circular frame, the top of the hydraulic box comprises an observation protruding pipe, and a liquid level sensor is arranged on the observation protruding pipe. Whether chip positioning is accurate or not is judged by comparing the liquid levels of the magnetorheological fluid entering the two observation protruding pipes, if the liquid levels in the two observation protruding pipes are consistent under the same acting force, positioning is accurate, if the liquid levels in one observation protruding pipe and the other observation protruding pipe are consistent under the same acting force, deviation occurs in band edge positioning, the liquid level sensor can transmit an electric signal to the arc motor sliding table, and the arc motor sliding table is started. Therefore, the positioning position can be adjusted in real time.

Description

Technical Field

[0001] The present invention relates to the technical field of chip welding, and in particular to a welding device for producing LED display screen chips. Background Art

[0002] With technological advancements, curved LED displays have become a core technology for high-end display applications, offering a more immersive visual experience and spatial adaptability. They are becoming a core technology for computer displays, automotive displays, aerospace instruments, and other applications. According to the "2024 Global Automotive Display Market Report," global installations of curved screens in new energy vehicles will reach 18.7 million units in 2023, with the installation rate climbing from 18.3% in 2020 to 63.7%, a compound annual growth rate (CAGR) of 22.5%. In the aerospace sector, curved screens already account for over 40% of instrument display systems in new manned spacecraft, as their curved shape better adapts to the curved interior space.

[0003] Soldering chips on curved LED displays presents numerous technical challenges due to their unique form and structure. For example, the irregular shape of the curved surface makes it difficult to precisely locate the chip soldering position. Traditional flat soldering positioning methods are poorly adaptable and struggle to provide stable adhesion to the chip on curved surfaces, causing chip displacement and dropping during handling, movement, and placement. On curved substrates, solder is affected by gravity and surface tension, causing it to flow and aggregate, resulting in defects such as cold and leaky solder joints. Currently, existing soldering technologies and equipment struggle to effectively address these issues, severely impacting the production quality and efficiency of curved LED displays. Summary of the Invention

[0004] The purpose of the present invention is to address the problems existing in the background technology and to provide a welding device for producing LED display chip.

[0005] The technical solution of the present invention is: a welding device for producing LED display chip, comprising a curved substrate positioning mechanism and a chip positioning mechanism mounted on a frame;

[0006] The curved substrate positioning mechanism includes an arc motor slide and mounting seats installed on both sides of the arc motor slide, and two clamping members are installed on the mounting seats;

[0007] The chip positioning mechanism includes an electric cylinder and an air suction device fixed to the frame, and a magnetic suction device installed on the electric cylinder;

[0008] The magnetic suction device includes a suction cup, on which are provided two symmetrically arranged hydraulic boxes, which are fixedly connected to the pushing end of the electric cylinder. The suction end of the suction device passes through the center of the suction cup, and a push seat fixedly connected to the top of the suction cup is slidably installed on the bottom of the hydraulic box. Magnetorheological fluid is provided in the hydraulic box, and a circular frame is installed outside the hydraulic box. An electromagnetic coil is installed in the circular frame. The top of the hydraulic box includes an observation convex tube, and a liquid level sensor is provided at the observation convex tube.

[0009] Preferably, the arc motor slide includes a slide, two mounting seats are fixed on both sides of the slide, the clamping member includes a hydraulic rod fixed on the mounting seat, the hydraulic rod includes a side hydraulic head, and the side hydraulic head is installed with an arc pad.

[0010] Preferably, an auxiliary vibration device is installed in the magnetic attraction device, and the auxiliary vibration device includes a plurality of equally spaced rotor seats fixedly installed in a circular frame, a magnet is rotatably installed in the rotor seat, and the auxiliary vibration device also includes an annular pad installed around the suction cup.

[0011] Preferably, the end of the magnet passes through the bottom of the circular frame, and a number of equally spaced force-bearing convex plates are provided in the annular pad. The convex parts of the force-bearing convex plates pass through the annular pad. The end of the magnet contacts the convex parts of the force-bearing convex plates, and an insulating sleeve in a wrapped shape is provided outside the contact point. The insulating sleeve is fixed between the annular pad and the circular frame.

[0012] Preferably, a number of equally spaced chamber groups are provided in the suction cup, and the chamber group consists of a plurality of cavities that are connected at the front and descend in a stepped manner. A ceramic vibration plate is provided in each cavity, and the ceramic vibration plates are stacked on each other at the front. The plate portion of the force-bearing convex plate passes through the suction cup and enters into one of the chamber groups and overlaps with the ceramic vibration plate there.

[0013] Preferably, a cooling frame is fixedly installed around the circular frame, cooling water is provided in the cooling frame, and the cooling frame is connected to an external circulating water source.

[0014] Preferably, a paste applying device is installed on the frame, and the paste applying device includes a first electric push rod and a tin storage tank installed on the frame, a second electric push rod is installed on the pushing end of the first electric push rod, and a paste injection tube is installed on the pushing end of the second electric push rod, and a material delivery pipe is connected between the tin storage tank and the paste injection tube.

[0015] Preferably, an electric movable platform is installed on the frame, and a dust-free platform is installed on the electric movable platform.

[0016] Compared with the existing technology, the beneficial effects of the present invention are:

[0017] 1. The present invention sets up a curved substrate positioning mechanism and a chip positioning mechanism. The curved substrate positioning mechanism includes an arc motor slide, and the chip positioning mechanism includes a magnetic device. When the two are in operation, the chip can be adsorbed by the magnetic device and then positioned on the substrate. During the re-positioning process, the accuracy of the chip positioning is determined by comparing the liquid levels of the magnetorheological fluid entering the two observation convex tubes. If the liquid levels in the two observation convex tubes are consistent under the same force, it means that the positioning is accurate. If one is high and the other is low, there is a deviation in the edge positioning. At this time, the liquid level sensor will transmit an electrical signal to the arc motor slide, causing it to drive the mounting seat to move, so the positioning position can be adjusted in real time.

[0018] 2. When the magnetic suction device of the present invention is in operation, after the chip is positioned, a current of appropriate strength is passed through the electromagnetic coil, generating a magnetic field that acts on the magnetorheological fluid. This instantly increases the viscosity of the magnetorheological fluid, leaving no room for the pusher to move into the hydraulic tank. This creates a stable downward pressure on the top of the suction cup, further strengthening the contact between the chip and the curved substrate welding area. This effectively resists external interference caused by positioning and welding operations on a curved surface, ensuring the precise positioning of the chip before welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the present invention;

[0020] Figure 2 Schematic diagram of the cross-sectional structure of the magnetic attraction device of the present invention;

[0021] Figure 3 Schematic diagram of the three-dimensional structure of the magnetic attraction device of the present invention;

[0022] Figure 4 for Figure 3 Schematic diagram of the structure viewed from above;

[0023] Figure 5 for Figure 2 Schematic diagram of the enlarged structure at A in the middle;

[0024] Figure 6 A top cross-sectional schematic diagram of the installation of the ceramic vibration plate of the present invention;

[0025] Figure 7 Schematic diagram of the structure of the paste applying device of the present invention.

[0026] Figure numerals: 1. Arc motor slide; 2. Mounting seat; 3. Clamping member; 4. Electric cylinder; 5. Magnetic device; 6. Suction device; 7. Auxiliary vibration device; 31. Hydraulic rod; 32. Lateral hydraulic head; 33. Arc pad; 51 Suction cup; 52. Hydraulic box; 53. Push seat; 54. Magnetorheological fluid; 55. Observation convex tube; 56. Liquid level sensor; 57. Circular frame; 58. Electromagnetic coil; 59. Cooling frame; 71. Rotor seat; 72. Magnet; 73. Ring pad; 74. Insulating sleeve; 75. Force-bearing convex plate; 76. Ceramic vibration plate; 77. Chamber group; 100. Frame; 200. First electric push rod; 300. Second electric push rod; 400. Tin storage tank; 500. Paste injection tube; 600. Electric moving platform; 700. Dust-free platform. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0028] Example 1

[0029] Refer to the attached Figure 1-6 , a welding device for producing LED display chip, comprising a curved substrate positioning mechanism and a chip positioning mechanism mounted on a frame 100;

[0030] The curved substrate positioning mechanism includes an arc motor slide 1 and mounting bases 2 installed on both sides of the arc motor slide 1, and two clamping members 3 are installed on the mounting base 2;

[0031] The chip positioning mechanism includes an electric cylinder 4 and an air suction device 6 fixed to the frame 100, and a magnetic suction device 5 installed on the electric cylinder 4;

[0032] The magnetic device 5 includes a suction cup 51, on which are provided two symmetrically arranged hydraulic boxes 52. The hydraulic boxes 52 are fixedly connected to the pushing end of the electric cylinder 4. The suction end of the suction device 6 passes through the center of the suction cup 51. A push seat 53 fixedly connected to the top of the suction cup 51 is slidably installed at the bottom of the hydraulic box 52. Magnetorheological fluid 54 is provided in the hydraulic box 52. A circular frame 57 is installed outside the hydraulic box 52, and an electromagnetic coil 58 is installed in the circular frame 57. The top of the hydraulic box 52 includes an observation convex tube 55, and a liquid level sensor 56 is provided at the observation convex tube 55.

[0033] Most of the existing LED display chip production welding devices are designed for flat screens. When producing and welding curved screen LED display chips, the irregular shape of the curved surface makes it difficult to accurately locate the chip welding position. The traditional flat welding positioning method has poor applicability and it is difficult to provide stable adsorption force for the chip in a curved surface environment, which will cause the chip to shift and fall during the grasping, moving and placement process.

[0034] When the present invention is used, the curved substrate is first installed on the curved substrate positioning mechanism. The two ends of the curved substrate are between two clamping parts 3 located on the same side, and it is clamped by the two. Then, it can be moved on the arc motor slide 1 through the mounting seat 2, so that the welding part of the curved substrate corresponds to the magnetic suction device 5, and the chip can be adsorbed and fixed by the magnetic suction device 5.

[0035] Specifically, when magnetic device 5 is used to grab a chip, the chip is positioned below suction cup 51. Air suction device 6 then expel the air between the chip and suction cup 51, reducing the air pressure between them and allowing suction cup 51 to successfully hold the chip. At this point, electromagnetic coil 58 within circular frame 57 is de-energized, and magnetorheological fluid 54 is at a low viscosity, allowing the suction nozzle to adhere tightly to the chip surface.

[0036] Subsequently, the magnetic suction device 5 is moved toward the curved substrate by operating the electric cylinder 4, so that the chip is attached to the welding part of the curved substrate. At this time, the downward pressure will cause the suction cup 51 to push the push seat 53 in the opposite direction to move into the hydraulic box 52, so that the magnetorheological fluid 54 in the hydraulic box 52 is injected into the observation convex tube 55. It should be noted that due to the special shape of the curved substrate, when the chip is positioned on it, if the positions of the two sides are not symmetrical, it means that the chip positioning is inaccurate, which will be manifested as different liquid levels of the magnetorheological fluid 54 in the two observation convex tubes 55. The information can be directly obtained through the liquid level sensor 56.

[0037] The above details are the focus of the present invention, which is to judge whether the chip positioning is accurate by comparing the liquid levels of the magnetorheological fluid 54 entering the two observation convex tubes 55. If the liquid levels in the two observation convex tubes 55 are consistent under the same force, it means that the positioning is accurate. If one is high and the other is low, it means that there is a deviation in the positioning. At this time, the liquid level sensor 56 will transmit an electrical signal to the arc motor slide 1, so that it drives the mounting seat 2 to move, so the positioning position can be adjusted in real time.

[0038] Specifically, in this embodiment, the arc motor slide 1 includes a slide, two mounting seats 2 are fixed on both sides of the slide, the clamping member 3 includes a hydraulic rod 31 fixed on the mounting seat 2, the hydraulic rod 31 includes a side hydraulic head 32, and the side hydraulic head 32 is installed with an arc pad 33.

[0039] During operation, if the liquid level of the observation convex tube 55 on one side is high and the liquid level of the observation convex tube 55 on the other side is low, then the liquid level sensor 56 on the higher side will transmit an electrical signal to the signal controller of the arc motor slide 1, and then the encoder will control the motor to drive the mounting seat 2 to move. The specific movement is to control the mounting seat 2 to move toward the observation convex tube 55 where the liquid level is high. In this way, because it is an arc-shaped moving trajectory, the support position of the curved substrate for the chip at this location can be lowered, so it can play a regulating role. It should also be noted that in this embodiment, the arc motor slide 1 includes a slide, and both are fixed on the slide. It should be noted that the arc motor slide 1 is a direct application of the existing technology.

[0040] This process can solve the problem of difficult positioning of curved substrates when producing soldered chips, and can quickly and accurately determine the positioning modification information.

[0041] After the chip is successfully positioned, it needs to be fixed on the welding part of the curved substrate to avoid difficulty in providing stable adsorption force for the chip in a curved environment, which will cause the chip to shift and fall during the process of grabbing, moving and placing.

[0042] Specifically, after the chip is positioned, a current of appropriate strength is passed through the electromagnetic coil 58, generating a magnetic field that acts on the magnetorheological fluid 54. The viscosity of the magnetorheological fluid increases instantly, leaving no space for the push seat 53 to move into the hydraulic box 52. This allows the push seat 53 to exert a stable downward pressure on the top of the suction cup 51, thus strengthening the contact between the chip and the welding portion of the curved substrate. This effectively resists external interference caused by position adjustment and welding operations in a curved environment, ensuring the precise positioning of the chip before welding. After completing the welding preparation work, the current of the electromagnetic coil is reduced, the magnetorheological fluid returns to a low viscosity state, and the air pressure inside the suction nozzle is restored through the pressure regulating component, achieving a smooth release of the chip.

[0043] Specifically, in this embodiment, the magnetorheological fluid 54 includes a base fluid made of silicone oil, micron-scale or nano-scale ferromagnetic particles, and a certain amount of dispersant, stabilizer, and antioxidant.

[0044] The specific operating principle is that by applying power to the electromagnetic coil 58 to generate a magnetic force, the magnetic particles are acted upon by the magnetic field and rapidly arrange themselves into chain-like or columnar structures along the magnetic field. The particles form a mechanical network through magnetic dipole interaction. This chain-like structure hinders the flow of the base fluid, causing a sharp increase in the fluid's viscosity and shear stress, and even exhibiting solid-like properties. The greater the magnetic field intensity, the denser the particle arrangement, the more stable the chain-like structure, and the higher the shear stress and viscosity of the fluid. When the magnetic force is removed, the chain-like structure of the magnetic particles quickly disintegrates, the particles return to a random distribution, and the magnetorheological fluid returns to a low-viscosity fluid state.

[0045] This can solve the problem of chip displacement and falling during the process of grabbing, moving and placing.

[0046] Example 2

[0047] Refer to the attached Figure 2-6 Based on the first embodiment, an auxiliary vibration device 7 is installed in the magnetic attraction device 5. The auxiliary vibration device 7 includes a plurality of equally distributed rotor seats 71 fixedly installed in the circular frame 57. A magnet 72 is rotatably installed in the rotor seat 71. The auxiliary vibration device 7 also includes an annular pad 73 installed on the circumferential side of the suction cup 51. The end of the magnet 72 passes through the bottom of the circular frame 57. A plurality of equally distributed force-bearing convex plates 75 are provided in the annular pad 73. The convex portion of the force-bearing convex plate 75 passes through the annular pad 73. The end of the magnet 72 contacts the convex portion of the force-bearing convex plate 75. An insulating sleeve 74 in a wrapped shape is provided outside the contact portion. The insulating sleeve 74 is fixed between the annular pad 73 and the circular frame 57.

[0048] Several equally spaced chamber groups 77 are provided in the suction cup 51. The chamber group 77 consists of a plurality of cavities that are connected at the first position and descend in a stepped manner. A ceramic vibration plate 76 is provided in each cavity. The ceramic vibration plates 76 are stacked on top of each other at the first position. The plate portion of the force-bearing convex plate 75 passes through the suction cup 51 and enters into one of the chamber groups 77 to overlap with the ceramic vibration plate 76 at that position.

[0049] On a curved substrate, the existing solder is easily affected by gravity and surface tension, and tends to flow and aggregate, resulting in defects such as cold solder joints and leaking solder joints.

[0050] In this embodiment, after the chip is positioned, it is raised by the electric cylinder 4, and solder is then applied. The precise solder application system uses a jet solder application device, combined with information fed back by the visual positioning system, to precisely spray the solder in the form of tiny droplets onto the soldering area, completing the solder application. This is a direct application of existing technology, so it will not be elaborated on in detail.

[0051] After the solder is applied, the chip is fixed to the welding point of the curved substrate, and then the power supply direction of the electromagnetic coil 58 is changed, which causes the direction of the magnetic field to change in the circular frame 57. The magnet 72 will rotate due to the change in the force direction to adapt to the direction of the magnetic field, thereby achieving rotation. The rotating magnet 72 will use the end to knock the force-bearing convex plate 75, so that the knocking force will be transmitted to each ceramic vibration plate 76 through the force-bearing convex plate 75. In this way, several ceramic vibration plates 76 distributed at equal distances can vibrate the chip a little, so that the welding between the chip and the substrate can be fully in contact. Specifically, the vibration causes the solder and the chip and the substrate surface to produce a slight relative motion, using mechanical impact force to break the oxide layer, exposing the fresh metal surface, and reducing the interface contact resistance. In addition, the shear force generated by the vibration reduces the viscosity of the solder, making it easier to fill small gaps, reduce void defects, and enhance welding strength.

[0052] It should be noted that, in this embodiment, the chamber group 77 is composed of a plurality of cavities that are connected in a first position and descend in a step-like manner, and then a ceramic vibration plate 76 is provided in each cavity, and each ceramic vibration plate 76 is stacked on top of each other, and the plate portion of the force-bearing convex plate 75 passes through the suction cup 51 and enters one of the chamber groups 77 to overlap with the ceramic vibration plate 76 there. Through this setting, since the vibration intensity decreases with distance, the vibration effect can be improved and guaranteed as much as possible by setting the position lower as it is closer to the center of the chip. It also does not cause the problem of unstable positioning due to excessive vibration amplitude at the edge. In addition, at this time, the magnetorheological fluid 54 still has solid-like properties, which can ensure the stability of chip positioning.

[0053] In this embodiment, both the annular pad 73 and the suction cup 51 are made of carbon fiber reinforced plastic (CFRP), a composite material of carbon fiber and a high-performance resin matrix. This material has extremely high specific strength and specific modulus, significantly reducing the weight of the suction nozzle while ensuring its high strength, thereby improving the operating efficiency of the device. The addition of carbon fiber also imparts excellent electrical conductivity to the material, effectively eliminating static electricity generated by the suction nozzle during operation through grounding, thus preventing static electricity from damaging the chip. At the same time, its low coefficient of thermal expansion ensures the dimensional stability of the suction nozzle during temperature changes. Furthermore, due to its strong wrapping properties, the annular pad 73 can also serve as a shield to prevent solder from overflowing.

[0054] In this embodiment, a cooling frame 59 is fixedly installed around the circular frame 57. Cooling water is provided in the cooling frame 59, and the cooling frame 59 is connected to an external circulating water source. The cooling water can cool the circular frame 57 to avoid excessive temperature.

[0055] Example 3

[0056] Based on the above-mentioned embodiment one or two, a paste applying device is installed on the frame 100, and the paste applying device includes a first electric push rod 200 and a tin storage tank 400 installed on the frame 100, a second electric push rod 300 is installed on the pushing end of the first electric push rod 200, a paste injection tube 500 is installed on the pushing end of the second electric push rod 300, and a material delivery pipe is connected between the tin storage tank 400 and the paste injection tube 500.

[0057] Since the traditional soldering method requires printing solder paste instead of directly spraying solder, in this embodiment, Figure 7 As shown in the figure, A is a curved substrate and B is a soldering portion on the curved substrate. During the first operation, after B and the chip are positioned, the first electric push rod 200 and the second electric push rod 300 adjust the position of the paste injection pipe 500. Then, the tin storage tank 400 supplies solder paste into the paste injection pipe 500, and solder paste is applied to B through the paste injection pipe 500. After the solder paste is applied, the next operation is carried out. Specifically, the operation of Example 1 is repeated.

[0058] Furthermore, an electric moving table 600 is mounted on the frame 100, and a dust-free table 700 is mounted on the electric moving table 600. Considering how the chip is attracted to the suction cup 51, the electric moving table 600 and the dust-free table 700 are mounted on the frame 100. Together, they form a feeding device. The chip is placed on the dust-free table 700, which then pushes the chip under the suction cup 51.

[0059] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0060] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0061] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A welding device for producing LED display chips, characterized in that: It includes a curved substrate positioning mechanism and a chip positioning mechanism mounted on a frame; The curved substrate positioning mechanism includes an arc motor slide and mounting seats installed on both sides of the arc motor slide, and two clamping members are installed on the mounting seats; The chip positioning mechanism includes an electric cylinder and an air suction device fixed to the frame, and a magnetic suction device installed on the electric cylinder; The magnetic suction device includes a suction cup, on which are provided two symmetrically arranged hydraulic boxes, which are fixedly connected to the pushing end of the electric cylinder. The suction end of the suction device passes through the center of the suction cup, and a push seat fixedly connected to the top of the suction cup is slidably installed on the bottom of the hydraulic box. Magnetorheological fluid is provided in the hydraulic box, and a circular frame is installed outside the hydraulic box. An electromagnetic coil is installed in the circular frame. The top of the hydraulic box includes an observation convex tube, and a liquid level sensor is provided at the observation convex tube.

2. A welding device for producing LED display chips according to claim 1, characterized in that: The arc motor slide includes a slide seat, two mounting seats are fixed on both sides of the slide seat, the clamping member includes a hydraulic rod fixed on the mounting seat, the hydraulic rod includes a side hydraulic head, and the side hydraulic head is installed with an arc pad.

3. A welding device for producing LED display chips according to claim 1, characterized in that: An auxiliary vibration device is installed in the magnetic device. The auxiliary vibration device includes several equidistant rotor seats fixedly installed in a circular frame, magnets are rotatably installed in the rotor seats, and the auxiliary vibration device also includes an annular pad installed around the suction cup.

4. A welding device for producing LED display chips according to claim 3, characterized in that: The end of the magnet passes through the bottom of the circular frame. A number of equally spaced force-bearing convex plates are provided inside the annular pad. The convex parts of the force-bearing convex plates pass through the annular pad. The end of the magnet contacts the convex parts of the force-bearing convex plates. An insulating sleeve in a wrapped shape is provided outside the contact point. The insulating sleeve is fixed between the annular pad and the circular frame.

5. A welding device for producing LED display chips according to claim 4, characterized in that: Several equally spaced chamber groups are provided in the suction cup. The chamber group consists of multiple cavities that are connected at the first position and descend in a stepped manner. A ceramic vibration plate is provided in each cavity. The ceramic vibration plates are stacked on top of each other at the first position. The plate part of the force-bearing convex plate passes through the suction cup and enters one of the chamber groups and overlaps with the ceramic vibration plate at that position.

6. The LED display chip production welding device according to claim 1, characterized in that: A cooling frame is fixedly installed around the circular frame. Cooling water is provided in the cooling frame, and the cooling frame is connected to an external circulating water source.

7. The LED display chip production welding device according to claim 1, characterized in that: A paste applying device is installed on the frame, which includes a first electric push rod and a tin storage tank installed on the frame, a second electric push rod is installed on the pushing end of the first electric push rod, a paste injection tube is installed on the pushing end of the second electric push rod, and a material delivery pipe is connected between the tin storage tank and the paste injection tube.

8. The LED display chip production welding device according to claim 1, characterized in that: An electric moving platform is installed on the frame, and a dust-free platform is installed on the electric moving platform.

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