Punching device and punching method using same

Abstract

A punching device and a punching method using the same are disclosed. The stamping apparatus includes: a die for receiving a substrate; a stripper spaced apart from the mold and facing the mold, and configured to move toward the substrate to fix the substrate; and a punch for moving toward the substrate and cutting the substrate. The stripper includes: a punch accommodating portion for accommodating a punch; and a press oil supply passage located inside the ejector and for supplying press oil to a side surface of the punch accommodating portion.

Description

Technical Field

[0001] Aspects of embodiments of the present disclosure relate to a stamping device, and more particularly, to a stamping device including a stamping oil supply channel located inside a demolding device, and a stamping method using the stamping device. Background Art

[0002] Unlike primary batteries that are not designed to be (re)charged, secondary (or rechargeable) batteries are batteries designed to be discharged and recharged. Low-capacity secondary batteries are used in portable small electronic devices such as smart phones, feature phones, notebook computers, digital cameras and video cameras, while large-capacity secondary batteries are widely used as a power source for driving motors in hybrid vehicles and electric vehicles and for storing electricity (e.g., household and / or utility-scale electricity storage). Secondary batteries generally include an electrode assembly consisting of a positive electrode and a negative electrode, a housing for accommodating the electrode assembly, and electrode terminals connected to the electrode assembly.

[0003] The positive and negative electrode plates of lithium-ion batteries can be manufactured by applying the positive active material in the form of a metal film (e.g., aluminum foil) to the positive electrode current collector, and applying the negative active material in the form of a metal film (e.g., copper foil) to the negative electrode current collector. The electrode plates can be manufactured through a mixing, coating, and pressing process to produce a roll of metal film substrates coated with the active material, and a cutting and punching process to cut the roll of metal film substrates according to the required battery specifications.

[0004] Electrode plates meeting the required specifications can be manufactured by punching out the substrate using a punching process using a punching device. Punching oil is sprayed onto the substrate so that the punching oil is applied to the substrate, and punching is performed on the substrate to which the punching oil has been applied. If the specifications of the electrode plate change, it may be necessary to install a new punching oil spraying device or change the settings according to the specifications of the electrode plate. However, installing a new punching oil spraying device or changing the settings may require a lot of time and cost.

[0005] The above information disclosed in this Background section is for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute related (or prior) art. Summary of the Invention

[0006] Embodiments of the present disclosure may relate to a stamping device and a stamping method using the same.

[0007] These and other aspects and features of the present disclosure will be described in, or will be apparent from, the following description of embodiments of the present disclosure.

[0008] According to one or more embodiments of the present disclosure, a stamping device includes: a die configured to receive a substrate; an ejector spaced apart from and facing the die and configured to move toward the substrate to secure the substrate; and a punch configured to move toward the substrate and cut the substrate. The ejector includes: a punch receiving portion configured to receive the punch; and a stamping oil supply channel located within the ejector and configured to supply stamping oil to a side surface of the punch receiving portion.

[0009] In one embodiment, the punch receiving portion may have a shape of a through hole, and the punch may be configured to be inserted into the through hole via the ejector.

[0010] In one embodiment, one side surface of the punch accommodating portion may be open.

[0011] In one embodiment, the punch accommodating portion may include a plurality of side surfaces, the nozzle of the punch oil supply channel may be located on a first side surface among the plurality of side surfaces of the punch accommodating portion, and the side surface of the punch may be configured to face the first side surface.

[0012] In one embodiment, the stamping oil supply channel may include a plurality of stamping oil supply channels, a first nozzle of a first stamping oil supply channel and a second nozzle of a second stamping oil supply channel among the plurality of stamping oil supply channels may be located on the first side surface of the punch accommodating portion, and the side surface of the punch may be configured to face the first side surface.

[0013] In one embodiment, the stamping oil supply channel may include a plurality of stamping oil supply channels, a first nozzle of a first stamping oil supply channel among the plurality of stamping oil supply channels may be located on the first side surface of the punch accommodating portion, a second nozzle of a second stamping oil supply channel among the plurality of stamping oil supply channels may be located on a second side surface among the plurality of side surfaces of the punch accommodating portion, and the side surface of the punch may be configured to be surrounded by the first side surface and the second side surface.

[0014] In one embodiment, the ejector may further include an air supply channel located inside the ejector and configured to supply air to the side surface of the punch accommodating portion.

[0015] In an embodiment, the punch may include an air supply hole extending through the punch and configured to supply air to a bottom surface of the punch.

[0016] In one embodiment, the air may be supplied at a pressure of 0.1 MPa or higher.

[0017] In one embodiment, the air supply passage may be located below the ram oil supply passage.

[0018] In one embodiment, the demolding device may include a plurality of punch accommodating portions configured to respectively accommodate a plurality of punches and a plurality of stamping oil supply channels configured to supply the stamping oil. A first nozzle of a first stamping oil supply channel among the plurality of stamping oil supply channels may be located on a side surface of a first punch accommodating portion among the plurality of punch accommodating portions, and a second nozzle of a second stamping oil supply channel among the plurality of stamping oil supply channels may be located on a side surface of a second punch accommodating portion among the plurality of punch accommodating portions. The side surface of the first punch among the plurality of punches may be configured to face the side surface of the first punch accommodating portion, and the side surface of the second punch among the plurality of punches may be configured to face the side surface of the second punch accommodating portion.

[0019] In one embodiment, the stamping oil may be supplied in a quantitative discharge method.

[0020] In one embodiment, the stamping oil may be supplied at a predetermined flow rate.

[0021] In one embodiment, the punching device may further include a controller configured to adjust the amount of the punching oil. The controller may be configured to control a pump connected to the punching oil supply channel to supply the punching oil in proportion to the number of times the punch is raised and lowered.

[0022] In one embodiment, the punching device may further include a controller configured to adjust the amount of the air. The controller may be configured to control an air pump connected to the air supply channel to supply the air in proportion to the number of times the punch is raised and lowered.

[0023] According to one or more embodiments of the present disclosure, a stamping method includes: supplying a substrate between a demolding device and a die; supplying stamping oil to a side surface of a punch receiving portion of the demolding device through a stamping oil supply channel located inside the demolding device; and moving a punch and the demolding device toward the substrate so that the demolding device fixes the substrate and the punch cuts the substrate. The side surface of the punch is arranged to face the side surface of the punch receiving portion.

[0024] In one embodiment, supplying the stamping oil to the side surface of the punch accommodating portion may include supplying the stamping oil to multiple stamping oil supply channels through a pump, so that the stamping oil can be supplied sequentially through multiple nozzles located on the side surface of the punch accommodating portion.

[0025] In an embodiment, the method may further include removing foreign matter attached to the surface of the punch by supplying air to the surface of the punch using at least one of an air supply channel in the ejector and an air supply hole in the punch.

[0026] In one embodiment, supplying the punching oil to the side surface of the punch receiving portion may include supplying the punching oil to the side surface of the punch receiving portion before cutting the substrate.

[0027] In one embodiment, the removing the foreign matter attached to the surface of the punch may include removing the foreign matter attached to the surface of the punch by supplying air to the surface of the punch after punching the substrate.

[0028] According to some embodiments of the present disclosure, even in the case where friction occurs when the punch and the metal thin film substrate contact each other, damage to the punch may be prevented or substantially prevented.

[0029] According to some embodiments of the present disclosure, repeated punching may prevent or substantially prevent foreign matter (eg, metal powder, etc.) from adhering to the mold, or may prevent or substantially prevent burrs from forming on the substrate.

[0030] According to some embodiments of the present disclosure, by supplying punching oil to the side surface of the punch and the side surface of the punch receiving portion of the ejector, adhesion of foreign matter and formation of burrs may be effectively prevented.

[0031] According to some embodiments of the present disclosure, low voltage defects and short circuit defects in a secondary battery may be prevented or substantially prevented.

[0032] According to some embodiments of the present disclosure, the removal of foreign matter adhered or attached to the surface of the punch may be further facilitated by the air supply nozzle and / or the air supply hole.

[0033] According to some embodiments of the present disclosure, the punching device may supply punching oil directly to the cutting area, so that the punching oil may be supplied evenly or substantially evenly.

[0034] According to some embodiments of the present disclosure, because the demolding device may not be designed to directly cut the metal film substrate, even in the case where the demolding device includes a stamping oil supply channel, a stamping oil supply nozzle, an air supply channel and / or an air supply nozzle, the corresponding channels or nozzles will not be easily damaged, thereby improving the durability of the stamping device.

[0035] According to some embodiments of the present disclosure, the air supply nozzle may be disposed to face the side surface of the punch, so that air with a stronger pressure may be supplied to the side surface of the punch to which a relatively large amount of powder may adhere.

[0036] According to some embodiments of the present disclosure, the air supply nozzle may prevent or substantially prevent flowing punch oil from flowing into the air supply nozzle by supplying air to a side surface of the punch receiving portion.

[0037] According to some embodiments of the present disclosure, in a structure in which multiple punches are raised and lowered, punching oil can be effectively supplied to multiple punches by forming a channel with a simpler structure (for example, only in) a demolding device without forming a channel in each punch.

[0038] According to some embodiments of the present disclosure, by forming the stamping oil supply nozzles on a plurality of side surfaces of the demolding device, the stamping oil may be supplied more smoothly.

[0039] According to some embodiments of the present disclosure, the stamping devices may collectively control the supply of stamping oil through the stamping oil channel, thereby making it easier to manage the supply of stamping oil.

[0040] However, aspects and features of the present disclosure are not limited to those described above, and other aspects and features not mentioned will be clearly understood by those skilled in the art from the detailed description described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The following figures attached to this specification illustrate embodiments of the present disclosure and, together with the detailed description of the present disclosure, further describe aspects and features of the present disclosure. Therefore, the present disclosure should not be construed as being limited to the figures:

[0042] Figure 1 An exploded perspective view illustrating a punching device according to an embodiment of the present disclosure;

[0043] Figure 2 A front view illustrating a punching device according to an embodiment of the present disclosure;

[0044] Figure 3 A side view illustrating a punching device according to an embodiment of the present disclosure;

[0045] Figure 4 A side view illustrating a punching device according to an embodiment of the present disclosure;

[0046] Figure 5 A side view illustrating a state in which punching oil is supplied in a punching device according to an embodiment of the present disclosure;

[0047] Figure 6 A side view illustrating a state where a metal film substrate is punched by a punching device according to an embodiment of the present disclosure is shown;

[0048] Figure 7 A side view illustrating a state in which air is supplied in a punching device according to an embodiment of the present disclosure;

[0049] Figure 8 A perspective view illustrating a demolding device according to an embodiment of the present disclosure;

[0050] Figure 9 A perspective view illustrating a demolding device according to an embodiment of the present disclosure; and

[0051] Figure 10 A flowchart illustrating an example of a stamping method according to an embodiment of the present disclosure is illustrated. DETAILED DESCRIPTION

[0052] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The terms or words used in this specification and claims should not be restrictively interpreted as general or dictionary meanings, but should be interpreted as meanings and concepts consistent with the technical idea of ​​the present disclosure based on the principle that the inventor can be his / her own lexicon compiler to appropriately define the concept of the term in order to best describe his / her invention.

[0053] The embodiments described in this specification and the configurations shown in the figures are only some embodiments of the present disclosure and do not represent all technical spirits, aspects and features of the present disclosure. Accordingly, it should be understood that at the time of filing this application, various equivalents and modifications that can replace or modify the embodiments described herein may exist.

[0054] It will be understood that when an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it can be directly on, connected to, or coupled to the other element or layer, or one or more intervening elements or layers may be present. When an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers. For example, when a first element is described as being “coupled to” or “connected to” a second element, the first element can be directly coupled or connected to the second element, or the first element can be indirectly coupled or connected to the second element via one or more intervening elements.

[0055] In the figures, the sizes of various elements, layers, etc. may be exaggerated for clarity of illustration. The same reference numerals indicate the same elements. As used herein, the term "and / or" includes any and all combinations of one or more related listed items. Further, when describing embodiments of the present disclosure, the use of "may" relates to "one or more embodiments of the present disclosure." Expressions such as "at least one of" and "any one of," when following a column of elements, modify the entire column of elements and do not modify the individual elements of the column. When phrases such as "at least one of A, B, and C," "at least one of A, B, or C," "at least one selected from the group of A, B, and C," or "at least one selected from A, B, and C," are used to specify a column of elements A, B, and C, the phrase may refer to any and all suitable combinations or subsets of A, B, and C, such as A, B, C, A and B, A and C, B and C, or A and B and C. As used herein, the term "use" may be considered synonymous with the term "utilize." As used herein, the terms "substantially," "about," and similar terms are used as terms of approximation rather than terms of degree, and are intended to take into account the inherent variations in measurements or calculations that those of ordinary skill in the art would recognize.

[0056] It will be understood that although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, a first element, component, region, layer, or section discussed below may be referred to as a second element, component, region, layer, or section without departing from the teachings of the example embodiments.

[0057] For ease of description, spatially relative terms such as "below," "beneath," "below," "above," "on," etc. may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figures. It will be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is flipped, an element described as being "below" or "beneath" other elements or features would then be oriented as being "above" or "above" the other elements or features. Thus, the term "below" may encompass both above and below. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0058] The terms used herein are for the purpose of describing the embodiments of the present disclosure and are not intended to limit the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular form "a" and "an" are also intended to include the plural form. It will be further understood that the terms "comprise" and / or "comprising" when used in this specification specify the presence of stated features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups thereof.

[0059] In addition, any numerical range disclosed and / or listed herein is intended to include all subranges of the same numerical precision contained within the listed range. For example, the range of "1.0 to 10.0" is intended to include all subranges between the listed minimum value 1.0 and the listed maximum value 10.0 (and including the listed minimum value 1.0 and the listed maximum value 10.0), that is, a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Any maximum numerical limit listed herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit listed in this specification is intended to include all higher numerical limits contained therein. Accordingly, the applicant reserves the right to amend this specification including the claims to explicitly list any subranges contained within the range explicitly listed herein.

[0060] Referring to two compared elements, features, etc. as "the same" may mean that they are "substantially the same." Thus, the phrase "substantially the same" may include variations that are considered low in the art, for example, 5% or less. Furthermore, when a parameter is referred to as being consistent in a given region, this may mean that it is consistent in terms of average value.

[0061] Throughout the specification, unless otherwise stated, each element may be singular or plural.

[0062] Arranging an arbitrary element "above (or below)" or "on (below)" another element may mean that the arbitrary element may be set to be in contact with the upper surface (or lower surface) of the element, and another element may also be interposed between the element and any element set on (or below) the element.

[0063] In addition, it will be understood that when a component is referred to as being “linked,” “coupled,” or “connected” to another component, these elements can be directly “coupled,” “linked,” or “connected” to each other or another component may be “interposed” between these components.

[0064] Throughout this specification, unless otherwise specified, when "A and / or B" is stated, it means A, B, or A and B. That is, "and / or" includes any or all combinations of the listed items. Unless otherwise specified, when "C to D" is stated, it means C or more and D or less.

[0065] Figure 1 An exploded perspective view of a punching device 100 according to an embodiment of the present disclosure is illustrated.

[0066] The punching device 100 according to an embodiment of the present disclosure may include (for example, may be) a punching die that can punch a continuously provided metal film substrate and cut the film substrate into substrates that meet a required standard (for example, a predetermined standard). Figure 1 The stamping device 100 may include a first mold 110 and a second mold 120. The first mold 110 may be referred to as an upper mold. The second mold 120 may be referred to as a lower mold. As used herein, an upper portion may be a portion facing the first mold 110 (or a portion thereof), and a lower portion may be a portion facing the second mold 120 (or a portion thereof). In one embodiment, a substrate coated with an active material may be provided to the stamping device 100.

[0067] The first die 110 may include a first base plate 112, a stripper plate 114, a punch 116, and an ejector 118. The stripper plate 114 may be fixedly connected to (e.g., coupled to or attached to) a lower portion of the first base plate 112. The ejector 118 may be connected to (e.g., coupled to or attached to) the stripper plate 114. For example, an ejector connecting pin may connect the ejector 118 to the stripper plate 114. The ejector 118 may include a punch receiving portion 118a. The punch 116 may be connected to (e.g., coupled to or attached to) the stripper plate 114 and may be received in the punch receiving portion 118a of the ejector 118.

[0068] refer to Figure 1 , one side of the punch receiving portion 118a is shown as an open structure. However, the present disclosure is not limited thereto, and the punch receiving portion 118a may be in the form of a through hole, and the punch 116 is inserted into the through hole via the demolding device 118. Figure 8 and Figure 9 Some embodiments of the punch receiving portion 118a are described in greater detail.

[0069] The ejector 118 may include a punching oil supply channel 118b located inside the ejector 118. The punching oil supply channel 118b can supply punching oil to the side surface of the punch receiving portion 118a. In some embodiments, the side surface of the punch 116 may be arranged to face the side surface of the punch receiving portion 118a so that punching oil can be supplied to the side surface of the punch 116.

[0070] In one embodiment, the punch oil supply channel 118b may be located inside the ejector 118, and the ejector 118 may further include an air supply channel through which air is supplied to the side surface of the punch receiving portion 118a. In some embodiments, the air supply channel may be located below the punch oil supply channel 118b. In some embodiments, the side surface of the punch 116 may be arranged to face the side surface of the punch receiving portion 118a, so that air can be supplied to the side surface of the punch 116.

[0071] The second mold 120 may include a second base plate 124 and a die 122. The die 122 may be fixedly connected to (e.g., coupled to or attached to) the second base plate 124. The die 122 may be fixedly connected to (e.g., coupled to or attached to) an upper portion of the second base plate 124. The die 122 may include a punch insertion portion 122a.

[0072] The first mold 110 and the second mold 120 may be spaced apart from each other and may be connected to each other. For example, a base guide column may connect the first base plate 112 to the second base plate 124, so that the first mold 110 and the second mold 120 are connected to each other (e.g., coupled or attached). However, the present disclosure is not limited thereto, and the stamping device according to an embodiment of the present disclosure may further include other required components for cutting the metal film substrate in the coupling structure between the first mold 110 and the second mold 120. In some embodiments, the demolding device 118 may be spaced apart from the mold 122 and face the mold 122.

[0073] The first mold 110 can be lowered or raised toward the second mold 120. In some embodiments, the second mold 120 can be lowered or raised toward the first mold 110. When the first mold 110 is lowered, the demolding device 118 can contact the mold 122. When the metal film substrate is placed on the mold 122, the demolding device 118 can be fixed so as to contact the substrate. In some embodiments, when the first mold 110 is lowered, the punch 116 can be lowered and inserted into the punch insertion portion 122a. When the metal film substrate is placed on the mold 122, the punch 116 can punch and cut the metal film substrate. The cut metal film substrate can be separated by the punch insertion portion 122a.

[0074] The punch insertion portion 122a and / or the punch 116 may be formed into a shape corresponding to a desired standard (e.g., a predetermined standard). For example, the punch insertion portion 122a and / or the punch 116 may correspond to the shape of the metal film substrate to be cut. Similarly, the punch receiving portion 118a may be formed into a shape corresponding to the punch 116 so as to accommodate the punch 116.

[0075] In addition to the above structures and configurations, as will be understood by those of ordinary skill in the art, Figure 1 The punching apparatus 100 illustrated in FIG. 1 may further include configurations and components required for manufacturing an electrode plate for a secondary battery.

[0076] Figure 2 A front view of a punching device 200 according to an embodiment of the present disclosure is illustrated.

[0077] The punching device 200 according to an embodiment of the present disclosure can manufacture an electrode plate for a secondary battery of a desired standard (e.g., a specific or predetermined standard) by lowering a first mold 210 to fix a metal film substrate 230 and cutting a portion of the metal film substrate 230. The punching device 200 may include a Figure 1 The structure of the punching device 100 is illustrated in FIG.

[0078] The metal film substrate 230 may be provided between the first mold 210 and the second mold 220. The metal film substrate 230 may be disposed on the mold 222. In some embodiments, the disposed metal film substrate 230 may be a cutting target. Thereafter, as the first mold 210 descends, the first mold 210 and the second mold 220 may secure the metal film substrate 230 therebetween. In some embodiments, as the stripper plate 212 descends, the punch 214 and the stripper 216 connected to (e.g., coupled to or attached to) the stripper plate 212 may descend together. In some embodiments, the second base plate 224 connected to (e.g., coupled to or attached to) the mold 222 may be fixed. The stripper 216 may secure the metal film substrate 230 disposed on the mold 222.

[0079] The punch 214 can be lowered together with the stripper plate 212, and the metal film substrate 230 can be cut to a desired standard (e.g., a predetermined standard). For example, when the first mold 210 is lowered and the metal film substrate 230 is fixed between the stripper 216 and the mold 222, the punch 214 can be further lowered. The stripper 216 can be connected to the stripper plate 212 using an elastic connecting member (e.g., a spring pin). In this way, the stripper plate 212 can be further lowered while the stripper 216 is fixing the metal film substrate 230. The punch 214, which is further lowered together with the stripper plate 212, can be inserted into the punch insertion portion 222a. During the insertion of the punch 214 into the punch insertion portion 222a, the metal film substrate 230 can be cut to a desired standard (e.g., a predetermined standard).

[0080] In some embodiments, the surface of the punch 214 may be supplied with stamping oil. The surface of the punch 214 may include the side surface of the punch 214 and the bottom surface of the punch 214. For example, stamping oil supplied through a stamping oil supply channel included in the ejector 216 may be supplied to the surface of the punch 214. In this way, even if friction occurs when the punch 214 and the metal film substrate 230 contact each other, damage to the punch 214 can be prevented or substantially prevented.

[0081] In some embodiments, as the punching is repeated, foreign matter (e.g., metal powder, etc.) may adhere to the dies 210, 220, or burrs may be formed therein. In the punching apparatus 200 according to an embodiment of the present disclosure, punching oil may be supplied to the side surface of the punch 214 and the punch receiving portion (e.g., Figure 1 The supplied stamping oil can prevent or substantially prevent the adhesion of foreign matter and the formation of burrs. Low voltage defects, short circuit defects, etc. can be prevented or substantially prevented in secondary batteries manufactured using the stamping device 200 according to one or more embodiments of the present disclosure.

[0082] Figure 3 A side view of a punching device according to an embodiment of the present disclosure is illustrated.

[0083] The punching device may include an ejector 310, a punch 320, and a die 330. The ejector 310 may include a punch oil supply channel 312 and an air supply channel 316 therein. In some embodiments, the air supply channel 316 may be located below the punch oil supply channel 312. In some embodiments, the ejector 310 may include a punch receiving portion that can receive the punch 320.

[0084] refer to Figure 3 , with the first mold (e.g., Figure 1 The first mold 110 and Figure 2 The first die 210 in the mold is lowered, and the metal film substrate 340 can be in a state of being fixed by the mold 330 and the demolding device 310. As the first die is further lowered, the punch 320 can punch and cut the metal film substrate 340. Figures 5 to 7 The process of the punch 320 cutting the metal thin film substrate 340 will be described in more detail.

[0085] In one embodiment, a stamping oil supply nozzle 314 corresponding to the stamping oil outlet may be formed on the side surface of the punch accommodating portion. The stamping oil supply channel 312 can supply stamping oil through the stamping oil supply nozzle 314, so that the stamping oil can be supplied to the side surface of the punch accommodating portion and / or the side surface of the punch 320. In some embodiments, an air supply nozzle 318 corresponding to the air outlet may be formed on the side surface of the punch accommodating portion. The air supply channel 316 can supply air through the air supply nozzle 318, so that air can be supplied to the side surface of the punch accommodating portion and / or the side surface of the punch 320.

[0086] In one embodiment, the punching device may further include a pump 350 and an air pump 360. The pump 350 may be connected to the punching oil supply channel 312. The pump 350 may supply punching oil to the punching oil supply channel 312. The punching oil may be supplied to the side surface of the punch accommodating portion and / or the side surface of the punch 320 through the punching oil supply channel 312 and the punching oil supply nozzle 314. The air pump 360 may be connected to the air supply channel 316. The air pump 360 may supply air to the air supply channel 316. The air may be supplied to the side surface of the punch accommodating portion and / or the side surface of the punch 320 through the air supply channel 316 and the air supply nozzle 318.

[0087] In one embodiment, the pump 350 can supply stamping oil at a suitable flow rate (e.g., a predetermined flow rate). For example, the pump 350 can continuously supply stamping oil to the stamping oil supply channel 312 at the flow rate (e.g., a predetermined flow rate), regardless of the number of times the punch 320 is raised and lowered. In other embodiments, the pump 350 can supply stamping oil by a quantitative discharge method. The quantitative discharge method may refer to a method of repeatedly discharging a certain amount (e.g., a specific amount) of stamping oil. For example, the pump 350 may correspond to a quantitative discharge pump, and the stamping oil may be supplied by a quantitative discharge method. In some embodiments, the pump 350 may supply stamping oil in proportion to the number of times it is raised and lowered. The pump 350 may supply stamping oil to the stamping oil supply channel 312 when the timing is raised or lowered n times, where n is a natural number.

[0088] In one embodiment, the stamping device may further include a controller 370. The controller 370 can control the pump 350 to adjust the amount of stamping oil supplied. For example, the controller 370 can adjust the flow rate of the stamping oil supplied to the stamping oil supply channel 312. In some embodiments, the controller 370 can adjust the amount of stamping oil supplied in a quantitative discharge method (e.g., a specific or predetermined amount). In some embodiments, the controller 370 can control the air pump 360 to adjust the amount of air supplied. For example, the controller 370 can adjust the volume and atmospheric pressure of the air supplied to the air supply channel 316. The controller 370 can communicate with the pump 350 and / or the air pump 360 using various suitable wired or wireless methods.

[0089] In one embodiment, the controller 370 may control the pump 350 to supply the punching oil so as to be associated with the raising and lowering of the punch 320. For example, the controller 370 may control the pump 350 to supply the punching oil in proportion to the number of times the punch 320 is raised and lowered. For example, the controller 370 may control the pump 350 to supply the punching oil each time the punch 320 is raised and lowered.

[0090] Similarly, the controller 370 may control the air pump 360 to supply air in association with the raising and lowering of the punch 320. For example, the controller 370 may control the air pump 360 to supply air in proportion to the number of times the punch 320 is raised and lowered. For example, the controller 370 may control the air pump 360 to supply air every time the punch 320 is raised and lowered.

[0091] Figure 4 A side view of a punching device according to an embodiment of the present disclosure is illustrated.

[0092] refer to Figure 4 The metal film substrate 440 may be fixed by the mold 430 and the demolding device 410. The demolding device 410 may include a punching oil supply channel 412.

[0093] In one embodiment, the punch 420 may include an air supply hole 422 rather than the ejector 410 including an air supply channel (e.g., Figure 3 In some embodiments, an air supply hole 422 may be formed through the punch 420. The air supply hole 422 may supply air to the bottom surface of the punch 420.

[0094] The air supply hole 422 may include an air supply line 422a and a push pin 422b. The push pin 422b may include a push pin spring 422b_1 and a push pin hole 422b_2. The push pin spring 422b_1 helps to lift the lowered push pin 422b to its initial position. The push pin hole 422b_2 may be formed to pass through the interior of the push pin 422b.

[0095] Air supply line 422a can supply air to air supply hole 422. Push pin 422b can block air supplied from air supply line 422a at a pressure lower than a specified atmospheric pressure. When air supply line 422a supplies air at a pressure higher than a specified atmospheric pressure, air can be supplied to the interior space of air supply hole 422. The supplied air can be supplied to the bottom surface of punch 420 through push pin hole 422b_2. Thereafter, when the air supplied from air supply line 422a is at a pressure lower than a specified atmospheric pressure, push pin spring 422b_1 can lift push pin 422b to its initial position.

[0096] Figure 4In the example, the punch 420 includes air supply holes 422, rather than the ejector 410 including an air supply channel, but the present disclosure is not limited thereto. For example, the ejector 410 may also include an air supply channel, while the punch 420 may include air supply holes 422. In this case, air can be more smoothly supplied to the surface of the punch 420. In some embodiments, the air supply channel may supply air to the side surfaces of the punch 420, and the air supply holes 422 may supply air to the bottom surface of the punch 420. In this manner, foreign matter adhering to or attached to the surface of the punch 420 can be more easily removed.

[0097] Figure 5 A side view illustrating a state in which punching oil O is supplied in a punching device according to an embodiment of the present disclosure is shown. Figures 5 to 7 The punching device described in more detail is exemplified as including an air supply channel 515 without an air supply hole, but the present disclosure is not limited thereto. For example, the punching device may include Figure 4 The air supply hole 422 is provided.

[0098] The following references Figures 5 to 7 A more detailed description of the process can be found in Figures 5 to 7 Execute in the order shown in . Figure 5 The punch 520 may be shown as being in a state before it descends and cuts the metal film substrate 540. In some embodiments, Figure 5 The metal film substrate 540 is shown as being fixed by the mold 530 and the demolding device 510, but the present disclosure is not limited thereto. For example, the process of supplying the stamping oil O may be performed before the first mold is lowered and the demolding device 510 fixes the metal film substrate 540 disposed on the mold 530. In other embodiments, the process of supplying the stamping oil O may be performed regardless of whether the first mold is raised or lowered.

[0099] The stamping oil supply channel 512 can supply the stamping oil O to the side surface of the punch accommodating portion. In some embodiments, the stamping oil O can be supplied by a stamping oil supply nozzle 514 formed on the side surface of the punch accommodating portion. In some embodiments, the side surface of the punch 520 can be set to face the side surface of the punch accommodating portion on which the stamping oil supply nozzle 514 is formed. The supplied stamping oil O can flow between the side surface of the punch accommodating portion and the side surface of the punch 520. In this way, the stamping oil O can be supplied to the side surface of the punch 520. In some embodiments, the stamping oil O can flow between the side surface of the punch accommodating portion and the side surface of the punch 520, and can be supplied to the cutting portion of the metal film substrate 540.

[0100] Figure 6 A side view illustrating a state in which a metal thin film substrate 640 is punched by a punching device according to an embodiment of the present disclosure is shown.

[0101] In a state where the metal film substrate 640 is fixed by the mold 630 and the demolding device 610, the punch 620 may be lowered to cut the metal film substrate 640. The metal film substrate 640 may be separated into a cut substrate 642 and a separated substrate 644. After cutting the metal film substrate 640, the lowered punch 620 may be raised again.

[0102] During the process of lowering the punch 620 to cut the metal thin film substrate 640, foreign matter B may adhere to or adhere to the surface of the punch 620. For example, powder generated when cutting the metal thin film substrate 640 may adhere to or adhere to the surface of the punch 620. In some embodiments, the supplied punching oil may not adhere uniformly to the surface of the punch 620. Foreign matter B may affect the quality of the cutting (e.g., subsequent cutting) of the metal thin film substrate 640 to be performed later, and therefore may need to be removed.

[0103] Figure 7 A side view illustrating a state in which air A is supplied in a punching device according to an embodiment of the present disclosure is shown.

[0104] Figure 7 The state after the punch 720 is lowered to cut the metal film substrate 740 can be illustrated. In some embodiments, Figure 7 The metal film substrate 740 is shown to be fixed by the mold 730 and the demolding device 710, but the present disclosure is not limited thereto. For example, after the first mold is raised and lowered, the cut substrate (eg, Figure 6 The process of supplying air A may be performed while the cut substrate 642 is disposed on the mold 730. In other embodiments, the process of supplying air A may be performed after the cut substrate is moved. In other embodiments, the process of supplying air A may be performed regardless of whether the first mold is raised or lowered.

[0105] The ejector 710 may include an air supply channel 714. The air supply channel 714 may supply air A to the side surface of the punch receiving portion. In some embodiments, the air A may be supplied through an air supply nozzle 716 formed on the side surface of the punch receiving portion. In some embodiments, the side surface of the punch 720 may be positioned to face the side surface of the punch receiving portion on which the air supply nozzle 716 is formed. For example, the air supply nozzle 716 may be positioned to face the side surface of the punch 720. In this case, air with a higher pressure may be supplied to the side surface of the punch 720, to which a relatively large amount of powder may adhere.

[0106] Foreign matter B may adhere to the surface of the raised punch 720. The air A supplied through the air supply channel 714 may be supplied at a pressure higher than an appropriate level (e.g., a specific or predetermined level) to remove the adhered foreign matter B. For example, the air A may be supplied at a pressure of 0.1 MPa or higher. The air A may include various suitable components. For example, the air A may be atmospheric air. In some embodiments, the air A may be an inert gas.

[0107] In one embodiment, the air supply nozzle 716 may be positioned lower than the punch oil supply nozzle 712 located inside the ejector. Punching oil may be supplied from the punch oil supply nozzle 712 and may flow toward the air supply nozzle 716. In some embodiments, the air supply nozzle 716 supplies air to the side surface of the punch receiving portion, thereby preventing or substantially preventing the flowing punch oil from flowing into the air supply nozzle 716.

[0108] When the punch 720 repeatedly cuts the metal film substrate, the punch 720 may break or crack. The punching device according to some embodiments of the present disclosure can prevent or substantially prevent damage to the mold by supplying stamping oil. In some embodiments, damage to the punch 720 can be prevented or substantially prevented by supplying air A to remove foreign matter B that may adhere to or attach to the surface of the punch 720. In some embodiments, since burrs are not formed in the mold, the metal film substrate 740 can be cut more evenly.

[0109] Supplying stamping oil from within the stripper 710 may be easier and more stable. For example, when the stamping oil is sprayed and applied to the metal film substrate 740, the stamping oil may not be applied evenly or substantially evenly, or a large amount of stamping oil may be applied. In other embodiments, the stamping device may supply the stamping oil directly to the cutting area, so that the stamping oil can be supplied more evenly.

[0110] In other embodiments, when the stamping oil is supplied from the inside of the punch 720, the stamping oil supply nozzle may be formed on the surface of the punch 720. Because the punch 720 may be easily damaged by cutting through direct contact with the metal film substrate 740, the stamping oil supply nozzle formed on the surface of the punch 720 may be damaged. In other embodiments, because the demolding device 710 may not directly cut the metal film substrate 740, even if the demolding device 710 includes a stamping oil supply channel, a stamping oil supply nozzle 712, an air supply channel 714 and / or an air supply nozzle 716, the demolding device 710 will not be easily damaged. In this way, the durability of the stamping device according to some embodiments of the present disclosure can be improved.

[0111] Figure 8 A perspective view illustrating a demolding tool 800 according to an embodiment of the present disclosure is shown.

[0112] The demolding tool 800 may include a plurality of punch receiving portions 810 , 820 , and 830 . Figure 8 Three punch receiving portions 810 , 820 , and 830 are illustrated, but the present disclosure is not limited thereto. For example, the ejector 800 may include fewer than three or more than three punch receiving portions.

[0113] In one embodiment, the punch receiving portions 810, 820, and 830 may have a through-hole shape. In the assembled punching device, the punch may be inserted through the ejector 800. In some embodiments, the punch may be inserted and received in the punch receiving portions 810, 820, and 830.

[0114] In one embodiment, one or more punch oil supply nozzles 812_1 to 812_4 may be formed on a side surface of each of the plurality of punch receiving portions 810, 820, and 830. Figure 8 , a plurality of stamping oil supply nozzles 812_1 to 812_4 may be formed on one side surface of the first punch accommodating portion 810. However, the present disclosure is not limited thereto, and one or more stamping oil supply nozzles may be formed on the other side surface of the first punch accommodating portion 810. For example, one or more stamping oil supply nozzles may be formed on each of the plurality of side surfaces of the first punch accommodating portion 810. One or more stamping oil supply nozzles may be formed on each of the first side surface and the second side surface of the first punch accommodating portion 810. In this structure, the side surface of the punch may be arranged to be surrounded by the first side surface and the second side surface (for example, around its periphery). By forming the stamping oil supply nozzles on the plurality of side surfaces of the demolding device 800, the stamping oil can be supplied more smoothly.

[0115] The demolding device may include a plurality of stamping oil supply channels 814_1 to 814_4. A plurality of stamping oil supply nozzles 812_1 to 812_4 may be connected to the plurality of stamping oil supply channels 814_1 to 814_4, respectively. For example, the first stamping oil supply channel 814_1 may be connected to the first stamping oil supply nozzle 812_1, so that stamping oil can be supplied from the first stamping oil supply channel 814_1 to the first stamping oil supply nozzle 812_1. For example, the second stamping oil supply channel 814_2 may be connected to the second stamping oil supply nozzle 812_2, so that stamping oil can be supplied from the second stamping oil supply channel 814_2 to the second stamping oil supply nozzle 812_2.

[0116] Multiple stamping oil supply channels 814_1 to 814_4 may be connected to one stamping oil channel 816. In some embodiments, the stamping oil channel 816 may be branched to form multiple stamping oil supply channels 814_1 to 814_4. Multiple stamping oil supply channels 814_1 to 814_4 may be connected to one or more stamping oil supply nozzles 812_1 to 812_4 formed in the multiple punch receiving portions 810, 820, and 830. Accordingly, the stamping oil channel 816 may be connected to the multiple stamping oil supply nozzles 812_1 to 812_4.

[0117] The ram oil passage 816 may be connected to a pump (e.g., Figure 3 The pump 350 in FIG. 1 is used to supply stamping oil to the stamping oil channel 816. The stamping oil can then be supplied to the plurality of stamping oil supply channels 814_1 to 814_4 through the stamping oil channel 816. The supplied stamping oil can then be supplied again to the stamping oil supply nozzles 812_1 to 812_4, which are respectively connected to the plurality of stamping oil supply channels 814_1 to 814_4. In some embodiments, the stamping oil can be sequentially supplied from the stamping oil channel 816 to the stamping oil supply nozzles 812_1 to 812_4 through the stamping oil supply channels 814_1 to 814_4.

[0118] Figure 8 The demolding device 800 is shown to include one stamping oil passage 816, but the present disclosure is not limited thereto. For example, the demolding device 800 may include multiple stamping oil passages, and the pump may be connected to each of the multiple stamping oil passages. In some embodiments, each of the multiple stamping oil passages 816 may be connected to a separate stamping oil supply passage.

[0119] Although the air supply nozzle, air supply channel, and air channel are not illustrated, the demolding device 800 is not limited thereto. For example, the air supply nozzle may be formed inside the demolding device 800 similarly to the stamping oil supply nozzles 812_1 to 812_4, except that air is supplied instead of stamping oil. The air supply channel may be formed similarly to the stamping oil supply channels 814_1 to 814_4, except that air is supplied instead of stamping oil. The air channel may be formed similarly to the stamping oil channel 816, except that air is supplied instead of stamping oil.

[0120] Because a stamping oil supply channel can be formed for each punch and the stamping oil supply channel can be controlled separately for each punch, the configuration of supplying stamping oil from the inside of the punch may be complicated. In other embodiments, the stamping device according to some embodiments of the present disclosure can jointly control the supply of stamping oil through the stamping oil channel 816, thereby making it easier to manage the supply of stamping oil. In more detail, in a structure in which multiple punches are raised and lowered, by forming a channel with a simpler structure only in the demoulder 800 without forming a channel in each punch, stamping oil can be effectively supplied to multiple punches.

[0121] Figure 9 A perspective view illustrating a demolding tool 900 according to an embodiment of the present disclosure is shown.

[0122] Based on the above reference Figure 8 The description provided hereof can be understood as to the punching oil supply nozzle, the punching oil supply channel, and the punching oil channel formed in the ejector 900. Figure 9 , which may be described in more detail below with reference to the above Figure 8 The differences in the stripper 800 are described.

[0123] In one embodiment, the demolding device 900 may include a plurality of punch receiving portions 910, 920, and 930. The punch receiving portions 910, 920, and 930 may have a structure in which one side surface is open. Figure 9 , at least a portion of the side surface of the ejector 900 may be open, and thus, one side surface of each of the punch receiving portions 910, 920, and 930 may be open. In the assembled punching device including the ejector 900, at least a portion of the side surface of the punch may be surrounded by (e.g., around the periphery of) the side surfaces of the punch receiving portions 910, 920, and 930. In some embodiments, the remaining portion of the side surface of the punch may not face the side surfaces of the punch receiving portions 910, 920, and 930.

[0124] Figure 10 The flowchart of an example of a stamping method S1000 according to an embodiment of the present disclosure is shown. In one embodiment, the stamping method S1000 may be performed by a stamping device (e.g., Figure 1 The punching device 100) is executed.

[0125] The stamping method S1000 may begin, and a substrate may be supplied between a stripper and a mold (S1010). In one embodiment, the stamping device may supply stamping oil to a side surface of a punch receiving portion formed in the stripper through a stamping oil supply channel formed inside the stripper (S1020). The stamping device may use a pump to supply stamping oil through multiple stamping oil supply channels, and may sequentially supply stamping oil through multiple nozzles formed on the side surface of the punch receiving portion.

[0126] In one embodiment, the punching device may supply punching oil to the side surface of the punch receiving portion before cutting the substrate. In some embodiments, the punching device may supply punching oil to the side surface of the punch receiving portion while or substantially while cutting the substrate.

[0127] In one embodiment, the punching device may move the punch and the ejector toward the substrate so that the ejector fixes the substrate and the punch cuts the substrate (S1030), and the method S1000 may end. The side surface of the punch may be disposed to face the side surface of the punch receiving portion.

[0128] In one embodiment, the punching device can remove foreign matter attached to the surface of the punch by supplying air to the surface of the punch using at least one of an air supply channel formed in the demolding device and an air supply hole formed in the punch. The punching device can remove foreign matter attached to the surface of the punch by supplying air to the surface of the punch after punching the substrate.

[0129] However, the present disclosure is not limited to Figure 10 For example, one or more processes in the flowcharts and related descriptions may be added, changed, or deleted, the order of one or more processes may be modified in various ways as needed or desired, and / or multiple processes may be performed simultaneously or substantially simultaneously with each other.

[0130] The electronic or electrical devices and / or any other related devices or components (e.g., controllers, etc.) according to the embodiments of the present disclosure described herein can be implemented using any suitable hardware, firmware (e.g., application specific integrated circuits), software, or a combination of software, firmware, and hardware. For example, the various components of these devices can be formed on a single integrated circuit (IC) chip or on separate IC chips. In addition, the various components of these devices can be implemented on a flexible printed circuit film, a tape carrier package (TCP), or a printed circuit board (PCB), or formed on a substrate. In addition, the various components of these devices can be processes or threads that run on one or more processors in one or more computing devices, execute computer program instructions, and interact with other system components to perform the various functions described herein. The computer program instructions can be stored in a memory that can be implemented in a computing device using a standard memory device such as a random access memory (RAM). The computer program instructions can also be stored in other non-transitory computer-readable media such as a CD-ROM or a flash drive. In addition, those skilled in the art will appreciate that, without departing from the spirit and scope of the exemplary embodiments of the present disclosure, the functions of various computing devices can be combined or integrated into a single computing device, or the functions of a particular computing device can be distributed to one or more other computing devices.

[0131] Although the present disclosure has been described with reference to the embodiments and drawings illustrating aspects of the present disclosure, the present disclosure is not limited thereto. Various modifications and variations may be made by those skilled in the art within the technical spirit of the present disclosure and claims and their equivalents.

Claims

1. A stamping device comprising: a mold configured to receive a substrate; a demolding device spaced apart from and facing the mold and configured to move toward the substrate to fix the substrate; as well as a punch configured to move toward the substrate and cut the substrate, The demoulding device comprises: a punch receiving portion configured to receive the punch; and A punching oil supply channel is located inside the ejector and is configured to supply punching oil to a side surface of the punch accommodating portion. 2 . The punching device according to claim 1 , wherein the punch receiving portion has a shape of a through hole, and the punch is configured to be inserted into the through hole via the ejector. 3 . The punching device according to claim 1 , wherein one side surface of the punch accommodating portion is open.

4. The punching device according to claim 1, wherein the punch receiving portion includes a plurality of side surfaces, The nozzle of the punch oil supply passage is located on a first side surface among the plurality of side surfaces of the punch accommodating portion, and The side surface of the punch is configured to face the first side surface.

5. The punching device according to claim 4, wherein the punching oil supply channel comprises a plurality of punching oil supply channels, A first nozzle of a first punch oil supply channel and a second nozzle of a second punch oil supply channel among the plurality of punch oil supply channels are located on the first side surface of the punch accommodating portion.

6. The punching device according to claim 4, wherein the punching oil supply channel comprises a plurality of punching oil supply channels, A first nozzle of a first punching oil supply channel among the plurality of punching oil supply channels is located on the first side surface of the punch accommodating portion, A second nozzle of a second punch oil supply channel among the plurality of punch oil supply channels is located on a second side surface among the plurality of side surfaces of the punch accommodating portion, and The side surface of the punch is configured to be surrounded by the first side surface and the second side surface. 7 . The punching device according to claim 1 , wherein the ejector further comprises an air supply channel located inside the ejector and configured to supply air to the side surface of the punch accommodating portion. 8 . The punching device of claim 1 , wherein the punch includes an air supply hole extending through the punch and configured to supply air to a bottom surface of the punch.

9. The punching device according to claim 7, wherein the air is supplied at a pressure of 0.1 MPa or higher.

10. The punching device according to claim 7, wherein the air supply passage is located below the punching oil supply passage.

11. The punching device according to claim 1 , wherein the ejector comprises a plurality of punch receiving portions configured to respectively receive a plurality of punches and a plurality of punching oil supply channels configured to supply the punching oil, A first nozzle of a first punch oil supply channel among the plurality of punch oil supply channels is located on a side surface of a first punch accommodating portion among the plurality of punch accommodating portions, a second nozzle of a second punch oil supply passage among the plurality of punch oil supply passages being located on a side surface of a second punch accommodating portion among the plurality of punch accommodating portions, A side surface of a first punch among the plurality of punches is configured to face the side surface of the first punch accommodating portion, and A side surface of a second punch among the plurality of punches is configured to face the side surface of the second punch accommodating portion.

12. The punching device according to claim 1, wherein the punching oil is supplied in a quantitative discharge method.

13. The punching device according to claim 1, wherein the punching oil is supplied at a predetermined flow rate.

14. The punching device according to claim 1, further comprising a controller configured to adjust the amount of the punching oil. The controller is configured to control a pump connected to the punch oil supply passage so as to supply the punch oil in proportion to the number of times the punch is raised and lowered.

15. The punching device according to claim 7, further comprising a controller configured to adjust the amount of the air, The controller is configured to control an air pump connected to the air supply passage so as to supply the air in proportion to the number of times the punch is raised and lowered.

16. A stamping method comprising: supplying the substrate between the demoulder and the mold; supplying punching oil to a side surface of a punch receiving portion of the ejector through a punching oil supply channel located inside the ejector; as well as moving the punch and the stripper toward the substrate so that the stripper holds the substrate and the punch cuts the substrate, The side surface of the punch is arranged to face the side surface of the punch receiving portion.

17. The stamping method according to claim 16, wherein supplying the stamping oil to the side surface of the punch accommodating portion includes supplying the stamping oil to a plurality of stamping oil supply channels by a pump, so that the stamping oil is supplied sequentially through a plurality of nozzles located on the side surface of the punch accommodating portion.

18. The punching method according to claim 16, further comprising removing foreign matter attached to the surface of the punch by supplying air to the surface of the punch using at least one of an air supply channel in the ejector and an air supply hole in the punch. 19 . The punching method according to claim 16 , wherein the supplying the punching oil to the side surface of the punch receiving portion includes supplying the punching oil to the side surface of the punch receiving portion before cutting the substrate. 20 . The punching method according to claim 18 , wherein the removing the foreign matter attached to the surface of the punch comprises removing the foreign matter attached to the surface of the punch by supplying air to the surface of the punch after punching the substrate.

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