Punching device and punching method using same

Abstract

A punching device and a punching method using the same are disclosed. The press apparatus includes: a die for receiving a substrate as a cutting target to be disposed on the die; a stripper spaced apart from the mold and facing the mold, and configured to move toward the substrate to press and fix the substrate; and a punch for moving toward the substrate, thereby cutting the substrate to form a waste material. The punch includes a first cutting portion and a second cutting portion having different shapes from each other with respect to a movement axis of the punch.

Description

Technical Field

[0001] Aspects of embodiments of the present disclosure relate to a stamping device and a stamping method using the same. Background Art

[0002] Unlike primary batteries that are not designed to be (re)charged, secondary (or rechargeable) batteries are batteries designed to be discharged and recharged. Low-capacity secondary batteries are used in portable small electronic devices such as smart phones, feature phones, notebook computers, digital cameras and video cameras, while large-capacity secondary batteries are widely used as a power source for driving motors in hybrid vehicles and electric vehicles and for storing electricity (e.g., household and / or utility-scale electricity storage). Secondary batteries generally include an electrode assembly consisting of a positive electrode and a negative electrode, a housing for accommodating the electrode assembly, and electrode terminals connected to the electrode assembly.

[0003] The positive and negative electrode plates of lithium-ion batteries are manufactured by applying the positive active material to the positive electrode current collector in the form of a metal film (e.g., aluminum foil), and applying the negative active material to the negative electrode current collector in the form of a metal film (e.g., copper foil). The electrode plates are manufactured by a mixing, coating, and pressing process to produce a roll-shaped metal film substrate coated with the active material, and a cutting and punching process to cut the roll-shaped metal film substrate according to the required battery specifications. The electrode plates that have completed the punching process are separated from each other by cutting between the electrode plates.

[0004] The punching device used in the notching process includes a punch with a push pin formed at its end. Waste material formed when the electrode plate is cut can be pushed and discharged by the push pin. In this case, the push pin may contact the electrode plate before the punch, causing damage to the electrode plate. Furthermore, undischarged waste material may become stuck in the punching device or flow into the battery.

[0005] The above information disclosed in this Background section is for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute related (or prior) art. Summary of the Invention

[0006] Embodiments of the present disclosure may relate to a stamping device and a stamping method using the same.

[0007] These and other aspects and features of the present disclosure will be described in, or will be apparent from, the following description of embodiments of the present disclosure.

[0008] According to one or more embodiments of the present disclosure, a punching device includes: a die configured to receive a substrate as a cutting target and place it on the die; a stripper spaced apart from the die and facing the die, and configured to move toward the substrate to pressurize and secure the substrate; and a punch configured to move toward the substrate to cut the substrate to form a scrap. The punch includes a first cutting portion and a second cutting portion, the first cutting portion and the second cutting portion having different shapes relative to the punch's movement axis.

[0009] In one embodiment, the first cutting portion and the second cutting portion may be configured to cut the first portion and the second portion of the substrate, respectively, as the punch moves downward, and the scrap formed by cutting the first portion and the second portion may have a width between the first portion and the second portion.

[0010] In one embodiment, a timing of cutting the first portion and a timing of cutting the second portion may be different from each other.

[0011] In one embodiment, the timing of cutting the first portion and the timing of cutting the second portion may be different from each other according to a height difference between sidewalls of the first cutting portion and the second cutting portion.

[0012] In one embodiment, a width between the first portion and the second portion may be two or more times the height difference between the sidewalls of the first cutting portion and the second cutting portion.

[0013] In one embodiment, the height difference between the side walls of the first cutting portion and the second cutting portion may be 0.8 mm to 1.2 mm.

[0014] In one embodiment, the width between the first portion and the second portion may be 2 mm to 6 mm.

[0015] In one embodiment, the first cutting portion may include: a first sidewall parallel to the moving axis of the punch; and a first cutting surface extending from the first sidewall in the width direction of the punch. The second cutting portion may include: a second sidewall parallel to the moving axis of the punch; and a second cutting surface extending from the second sidewall in the width direction of the punch.

[0016] In an embodiment, each of an angle between the first sidewall of the first cutting portion and the first cutting surface and an angle between the second sidewall of the second cutting portion and the second cutting surface may be 90 degrees.

[0017] In one embodiment, each of the angles between the first side wall of the first cutting portion and the first cutting surface and the angle between the second side wall of the second cutting portion and the second cutting surface may be less than 90 degrees, and the first cutting surface and the second cutting surface may be recessed toward the interior of the punch.

[0018] In one embodiment, each of the angles between the first side wall of the first cutting portion and the first cutting surface and the angle between the second side wall of the second cutting portion and the second cutting surface may be less than 90 degrees, and at least one of the first cutting surface and the second cutting surface may be recessed toward the interior of the punch.

[0019] In one embodiment, an angle between the first sidewall of the first cutting portion and the first cutting surface may be 90 degrees or greater, and an angle between the second sidewall of the second cutting portion and the second cutting surface may be less than 90 degrees.

[0020] In one embodiment, the ejector may have a punch receiving portion configured to receive the punch, and the punch receiving portion may have a shape of a through hole, and the punch may be configured to be inserted through the ejector through the through hole.

[0021] In one embodiment, the die may include a discharge portion extending in a direction corresponding to the punch receiving portion to communicate with the punch receiving portion, and the waste material may be cut to be discharged in an inclined state through the discharge portion.

[0022] According to one or more embodiments of the present disclosure, a punching method includes: placing a substrate to be cut on a die; lowering a demolding device to pressurize and secure the substrate placed on the die; cutting the substrate using a punch; and discharging waste material formed by cutting the substrate. The punch includes a first cutting portion and a second cutting portion, each having a different shape relative to the punch's axis of movement.

[0023] In one embodiment, a first height of a sidewall of the first cutting portion may be different from a second height of a sidewall of the second cutting portion.

[0024] In one embodiment, the cutting of the substrate may include: lowering the punch; cutting a first portion of the substrate with the first cutting portion; and cutting a second portion of the substrate with the second cutting portion. The first portion and the second portion may be cut at different timings depending on the height difference between the sidewalls of the first cutting portion and the second cutting portion, so that the waste material can be discharged in an inclined state.

[0025] In one embodiment, a width between the first portion and the second portion may be two or more times the height difference between the sidewalls of the first cutting portion and the second cutting portion.

[0026] In one embodiment, the height difference between the side walls of the first cutting portion and the second cutting portion may be 0.8 mm to 1.2 mm.

[0027] In one embodiment, a width between the first portion and the second portion may be 2 mm to 6 mm.

[0028] According to some embodiments of the present disclosure, the timing at which the first cutting portion cuts the substrate can be different from the timing at which the second cutting portion cuts the substrate, allowing waste to fall off in an inclined state. Accordingly, even when the width of the discharge portion and the width of the waste are the same or similar, the waste can be smoothly discharged through the discharge portion.

[0029] According to some embodiments of the present disclosure, by forming the contact area between the cutting portion of the punch and the substrate into an acute angle, the contact area between the cutting portion and the substrate can be minimized or reduced. Accordingly, a structure for transmitting shear force to the substrate can be formed.

[0030] According to some embodiments of the present disclosure, each of an angle formed by the first sidewall and the first cutting surface and an angle formed by the second sidewall and the second cutting surface may be formed to be 90 degrees, thereby forming a structure for pushing out waste materials.

[0031] According to some embodiments of the present disclosure, by appropriately changing the curvature of the first cutting surface and / or the second cutting surface concave toward the inside of the punch, a structure for transmitting shear force to the first cutting portion and / or the second cutting portion of the substrate may be formed.

[0032] According to some embodiments of the present disclosure, problems that may occur when waste is not discharged smoothly and accumulates in the punching device can be prevented. For example, low voltage defects, short circuit defects, and capacity defects that may occur when waste flows into the battery can be prevented.

[0033] According to some embodiments of the present disclosure, waste materials may be smoothly discharged by simply changing the structure of a cutting surface without enlarging a diameter of a discharge portion.

[0034] However, aspects and features of the present disclosure are not limited to those described above, and other aspects and features not mentioned will be clearly understood by those skilled in the art through detailed description described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The following figures attached to this specification illustrate embodiments of the present disclosure and, together with the detailed description of the present disclosure, further describe aspects and features of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the figures:

[0036] Figure 1 An exploded perspective view illustrating a punching device according to an embodiment of the present disclosure;

[0037] Figure 2 An example of a punching device according to an embodiment of the present disclosure is illustrated;

[0038] Figure 3 An example of a punching device according to an embodiment of the present disclosure is illustrated;

[0039] Figure 4 The present invention illustrates an embodiment of the present invention. Figure 3 An enlarged view of the punch;

[0040] Figure 5 An example of a punching device according to an embodiment of the present disclosure is illustrated;

[0041] Figure 6 The present invention illustrates an embodiment of the present invention. Figure 5 An enlarged view of the punch;

[0042] Figure 7 An example of a punching device according to an embodiment of the present disclosure is illustrated;

[0043] Figure 8 The present invention illustrates an embodiment of the present invention. Figure 7 An enlarged view of the punch;

[0044] Figure 9 An example of a punching device according to an embodiment of the present disclosure is illustrated;

[0045] Figure 10 The present invention illustrates an embodiment of the present invention. Figure 9 An enlarged view of the punch;

[0046] Figure 11 illustrating a ratio of a height difference between a first cutting portion and a second cutting portion to a width of a waste material according to an embodiment of the present disclosure; and

[0047] Figure 12 A flowchart illustrating an example of a stamping method according to an embodiment of the present disclosure is illustrated. DETAILED DESCRIPTION

[0048] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The terms or words used in this specification and claims should not be interpreted as limited to the customary or dictionary meanings, and should be interpreted as meanings and concepts consistent with the technical idea of ​​the present disclosure based on the principle that the inventor can be his / her own lexicon compiler to appropriately define the concept of the term in order to best explain his / her invention.

[0049] The embodiments described in this specification and the configurations shown in the figures are only some embodiments of the present disclosure and do not represent all technical ideas, aspects and features of the present disclosure. Accordingly, it should be understood that at the time of filing this application, various equivalents and modifications that can replace or modify the embodiments described herein may exist.

[0050] It will be understood that when an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it can be directly on, connected to, or coupled to the other element or layer, or one or more intervening elements or layers may be present. When an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers. For example, when a first element is described as being “coupled to” or “connected to” a second element, the first element can be directly coupled or connected to the second element, or the first element can be indirectly coupled or connected to the second element via one or more intervening elements.

[0051] In the figures, the sizes of various elements, layers, etc. may be exaggerated for clarity of illustration. The same reference numerals indicate the same elements. As used herein, the term "and / or" includes any and all combinations of one or more related listed items. Further, when describing embodiments of the present disclosure, the use of "may" relates to "one or more embodiments of the present disclosure." Expressions such as "at least one of" and "any one of," when following a column of elements, modify the entire column of elements and do not modify the individual elements of the column. When phrases such as "at least one of A, B, and C," "at least one of A, B, or C," "at least one selected from the group of A, B, and C," or "at least one selected from A, B, and C," are used to specify a column of elements A, B, and C, the phrase may refer to any and all suitable combinations or subsets of A, B, and C, such as A, B, C, A and B, A and C, B and C, or A and B and C. As used herein, the term "use" may be considered synonymous with the term "utilize." As used herein, the terms "substantially," "about," and similar terms are used as terms of approximation rather than terms of degree, and are intended to take into account the inherent variations in measurements or calculations that those of ordinary skill in the art would recognize.

[0052] It will be understood that although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, a first element, component, region, layer, or section discussed below may be referred to as a second element, component, region, layer, or section without departing from the teachings of the example embodiments.

[0053] For ease of description, spatially relative terms such as "below," "beneath," "below," "above," "on," etc. may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figures. It will be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is flipped, an element described as being "below" or "beneath" other elements or features would then be oriented as being "above" or "above" the other elements or features. Thus, the term "below" may encompass both above and below. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0054] The terms used herein are for the purpose of describing the embodiments of the present disclosure and are not intended to limit the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular form "a" and "an" are also intended to include the plural form. It will be further understood that the terms "comprise" and / or "comprising" when used in this specification specify the presence of stated features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups thereof.

[0055] In addition, any numerical range disclosed and / or listed herein is intended to include all subranges of the same numerical precision contained within the listed range. For example, the range of "1.0 to 10.0" is intended to include all subranges between the listed minimum value 1.0 and the listed maximum value 10.0 (and including the listed minimum value 1.0 and the listed maximum value 10.0), that is, a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Any maximum numerical limit listed herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit listed in this specification is intended to include all higher numerical limits contained therein. Accordingly, the applicant reserves the right to amend this specification including the claims to explicitly list any subranges contained within the range explicitly listed herein.

[0056] Referring to two compared elements, features, etc. as "the same" may mean that they are "substantially the same." Thus, the phrase "substantially the same" may include variations that are considered low in the art, for example, 5% or less. Furthermore, when a parameter is referred to as being consistent in a given region, this may mean that it is consistent in terms of average value.

[0057] Throughout the specification, unless otherwise stated, each element may be singular or plural.

[0058] Arranging an arbitrary element "above (or below)" or "on (below)" another element may mean that the arbitrary element may be set to be in contact with the upper surface (or lower surface) of the element, and another element may also be interposed between the element and any element set on (or below) the element.

[0059] In addition, it will be understood that when a component is referred to as being “linked,” “coupled,” or “connected” to another component, these elements can be directly “coupled,” “linked,” or “connected” to each other or another component may be “interposed” between these components.

[0060] Throughout this specification, unless otherwise specified, when "A and / or B" is stated, it means A, B, or A and B. That is, "and / or" includes any or all combinations of the listed items. Unless otherwise specified, when "C to D" is stated, it means C or more and D or less.

[0061] Figure 1 An exploded perspective view of a punching device 100 according to an embodiment of the present disclosure is illustrated.

[0062] The punching device 100 according to one embodiment of the present disclosure may be a punching die that can punch a continuously supplied metal film substrate and cut the film substrate into electrode plates that meet a desired standard (e.g., a predetermined standard). In some embodiments, the punching device 100 may be a punching die that can cut between electrode plates to separate the electrode plates cut according to a standard (e.g., a predetermined standard).

[0063] refer to Figure 1 The stamping device 100 may include a first mold 110 and a second mold 120. The first mold 110 may be referred to as an upper mold. The second mold 120 may be referred to as a lower mold. Hereinafter, the upper portion may be a portion facing the first mold 110 (or a portion thereof), and the lower portion may be a portion facing the second mold 120 (or a portion thereof). In one embodiment, a substrate coated with an active material may be provided to the stamping device 100.

[0064] The first die 110 may include a first base plate 112, a stripper plate 114, a punch 116, and an ejector 118. The stripper plate 114 may be fixedly connected to (e.g., coupled to or attached to) a lower portion of the first base plate 112. The ejector 118 may be connected to (e.g., coupled to or attached to) the stripper plate 114. For example, an ejector connecting pin may connect the ejector 118 to the stripper plate 114. The ejector 118 may include a punch receiving portion 118a. The punch 116 may be connected to (e.g., coupled to or attached to) the stripper plate 114 and may be received in the punch receiving portion 118a of the ejector 118.

[0065] A cutting portion having an asymmetrical shape may be formed on the lower surface of the punch 116 relative to the direction of the moving axis of the punch 116. Figures 3 to 10 Some examples of the shape of the punch 116 are described in more detail.

[0066] The second die 120 may include a second base plate 124 and a die 122. The die 122 may be fixedly connected to (e.g., coupled to or attached to) the second base plate 124. The die 122 may be fixedly connected to (e.g., coupled to or attached to) the upper portion of the second base plate 124. The die 122 may include a discharge portion 122a. In some embodiments, the discharge portion 122a may extend in a direction corresponding to the punch receiving portion 118a to communicate with the punch receiving portion 118a.

[0067] The first mold 110 and the second mold 120 may be spaced apart from each other and may be connected to each other. For example, a base guide post may connect the first base plate 112 to the second base plate 124, thereby connecting (e.g., coupling or attaching) the first mold 110 and the second mold 120 to each other. However, the present disclosure is not limited thereto, and the stamping device may additionally include other components for cutting the metal film substrate in the coupling structure between the first mold 110 and the second mold 120.

[0068] The first mold 110 may descend or rise toward the second mold 120. When the first mold 110 descends, the demoulder 118 may contact the mold 122. When the metal film substrate (e.g., electrode plate) is provided on the mold 122, the demoulder 118 may be fixed to contact the substrate (e.g., electrode plate). In some embodiments, when the first mold 110 descends, the punch 116 may descend and be inserted into the discharge portion 122a. When the metal film substrate (e.g., electrode plate) is provided on the mold 122, the punch 116 may cut the metal film substrate (e.g., electrode plate). Waste formed when cutting the metal film substrate (e.g., electrode plate) can be discharged through the discharge portion 122a.

[0069] The discharge portion 122a and / or the punch 116 may be formed into a shape corresponding to a desired standard (e.g., a predetermined standard). For example, the discharge portion 122a and / or the punch 116 may correspond to the cut shape of the metal film substrate. Similarly, the punch receiving portion 118a may be formed into a shape corresponding to the punch 116 to accommodate the punch 116.

[0070] refer to Figure 1 , one side of the punch receiving portion 118a is shown as an open structure, but the present disclosure is not limited thereto. For example, the punch receiving portion 118a may be in the form of a through hole through which the punch 116 is inserted through the stripper 118.

[0071] In addition to the above construction, Figure 1 The punching apparatus 100 illustrated in FIG. 1 may further include a configuration for manufacturing an electrode plate of a secondary battery.

[0072] Figure 2 An example of a punching device 200 according to an embodiment of the present disclosure is illustrated.

[0073] In one embodiment, the punching device 200 may include a die 210, an ejector 220, and a punch 230. The ejector 220 may be spaced apart from an upper portion of the die 210 so as to face the die 210. The ejector 220 may include a punch receiving portion 222 for receiving the punch 230. The punch 230 may be moved upward or downward through the punch receiving portion 222.

[0074] In one embodiment, the punch 230 may include a push pin 232. The push pin 232 may be formed on the lower surface of the punch 230 and may first contact the substrate 240 disposed on the mold 210 when the punch 230 moves downward. The substrate 240 may refer to a metal film before being coated with an active material. The substrate 240 may refer to an electrode plate coated with an active material.

[0075] In one embodiment, the punching device 200 may cut the substrate 240. The substrate 240 to be cut may be placed on the upper surface of the mold 210. Thereafter, the demolding device 220 may move downward toward the substrate 240, and pressurize and fix the substrate 240. Figure 2 An example is illustrated in which the substrate 240 is pressurized and fixed in a state in which the ejector 220 moves downward.

[0076] Afterwards, the punch 230 may be moved downward through the punch receiving portion 222. In this case, the push pins 232 formed on the lower surface of the punch 230 may first contact the substrate 240. In the case where the punch 230 is further moved downward, the push pins 232 may be pulled into the interior of the punch 230, and the punch 230 and the substrate 240 may come into contact with each other, causing the substrate 240 to be cut. Waste material formed when the substrate 240 is cut may be pushed by the push pins 232 and discharged through the discharge portion 212.

[0077] If the waste material formed when cutting the substrate is not properly discharged, the waste material may get stuck in the punching device or may cause accumulation in the discharge portion. In this case, the waste material may flow into the battery, causing low voltage defects, short circuit defects, and capacity defects. Figure 2 As shown in the example of FIG, the push pin 232 may be formed on the lower surface of the punch 230. However, even in this case, the waste material may fall vertically through the discharge portion 212. Before the punch 230 contacts the substrate 240, the push pin 232 may first contact the substrate 240, thereby causing a risk of damaging the substrate 240.

[0078] Figure 3 An example of a punching device 300 according to an embodiment of the present disclosure is illustrated. Figure 4 The present invention illustrates an embodiment of the present invention. Figure 3 An enlarged view of the punch 330 .

[0079] refer to Figure 3 The punching device 300 may include a die 310, an ejector 320, and a punch 330. The ejector 320 may be spaced apart from the upper portion of the die 310 so as to face the die 310. The ejector 320 may include a punch receiving portion 322 for receiving the punch 330. The punch 330 may move upward or downward through the punch receiving portion 322.

[0080] In one embodiment, the punching device 300 can cut a substrate 340. In some embodiments, the substrate 340 to be cut can be placed on the upper surface of the mold 310. Thereafter, the demolding device 320 can move downward toward the substrate 340 and pressurize and secure the substrate 340. In some embodiments, the punch 330 can cut the substrate 340 by moving downward to pass through the punch receiving portion 322. Waste material generated when cutting the substrate 340 can be discharged through the discharge portion 312 formed in the mold 310.

[0081] In one embodiment, the discharge portion 312 and / or the punch 330 may be formed into an appropriate shape corresponding to a desired standard (e.g., a predetermined standard). For example, the discharge portion 312 and / or the punch 330 may have a shape corresponding to the cut shape of the substrate 340. Similarly, the punch receiving portion 322 may be formed to correspond to the shape of the punch 330 so as to accommodate the punch 330. Accordingly, the shape of the waste material formed by the punch 330 may also correspond to the shape of the discharge portion 312.

[0082] In one embodiment, the punch 330 may include a cutting portion having an asymmetrical shape relative to the direction of the punch 330's axis of movement 350. For example, the first cutting portion of the punch 330 may correspond to the left side of the punch 330 relative to the direction of the punch 330's axis of movement 350, and the second cutting portion of the punch 330 may correspond to the right side of the punch 330 relative to the direction of the punch 330's axis of movement 350. The two sidewalls of the first cutting portion and the second cutting portion may be formed to have different heights. Accordingly, the timing at which the substrate 340 is cut by the cutting portions on opposite sides of the punch 330 may be different from each other. For example, the timing at which the first portion 342 of the substrate 340 is cut by the first cutting portion of the punch 330 may be different from the timing at which the second portion 344 of the substrate 340 is cut by the second cutting portion of the punch 330.

[0083] Figure 4 Example Figure 3 An enlarged view of the punch 330. Figure 4 The punch 330 may include a first cutting portion 410 and a second cutting portion 420 formed in shapes different from each other. The first cutting portion 410 and the second cutting portion 420 may be arranged side by side with each other in a width direction of the punch 330.

[0084] In one embodiment, the first cutting portion 410 may include a first sidewall 412 that is parallel or substantially parallel to the axis of movement 350 of the punch 330, and a first cutting surface 414 that extends from the first sidewall 412. The first cutting surface 414 may bend and extend from the first sidewall 412 in the width direction of the punch 330 while forming an angle (e.g., a specific or predetermined angle) therebetween. The angle formed between the first sidewall 412 and the first cutting surface 414 may be less than 90 degrees.

[0085] Similarly, the second cutting portion 420 may include a second sidewall 422 that is parallel to or substantially parallel to the axis of movement 350 of the punch 330, and a second cutting surface 424 that bends and extends from the second sidewall 422 in the width direction of the punch 330 while forming an angle (e.g., a specific or predetermined angle) therebetween. The angle formed between the second sidewall 422 and the second cutting surface 424 may be less than 90 degrees. The first cutting surface 414 and the second cutting surface 424 may each be a flat surface, and may each be formed into a shape or surface that is concave toward the interior of the punch 330 relative to the axis of movement 350 of the punch 330.

[0086] In one embodiment, the height of the first sidewall 412 of the first cutting portion 410 may be different from the height of the second sidewall 422 of the second cutting portion 420. Accordingly, a height difference (Δh) may be formed between the first sidewall 412 and the second sidewall 422.

[0087] In one embodiment, the timing at which the substrate is cut by the first cutting portion 410 may be different from the timing at which the substrate is cut by the second cutting portion 420. In some embodiments, as the punch 330 moves downward, the second cutting portion 420 having a higher sidewall height may first cut the substrate while in contact with the substrate. Thereafter, as the punch 330 moves downward further, the first cutting portion 410 may cut the substrate while in contact with the substrate. In some embodiments, at the second portion (e.g., Figure 3 After the second portion 344 in the substrate is cut by the second cutting portion 420, the first portion of the substrate (eg, Figure 3 The first portion 342 in the embodiment may be cut by the first cutting portion 410. In this case, a waste material having a width (w) between the first portion and the second portion may be formed.

[0088] Figure 4 The height of the second cutting portion 420 is illustrated as being greater than (e.g., higher than) the height of the first cutting portion 410, but the present disclosure is not limited thereto, and the height of the first cutting portion 410 may be greater than (e.g., higher than) the height of the second cutting portion 420. In some embodiments, in the first portion (e.g., Figure 3 After the first portion 342 in the substrate is cut by the first cutting portion 410, the second portion of the substrate (eg, Figure 3 The second portion 344 in the embodiment can be cut by the second cutting portion 420.

[0089] Figure 4The width ratio of the first cutting portion 410 to the second cutting portion 420 is 1:1, but the present disclosure is not limited thereto. For example, in some embodiments, a height difference (Δh) may be formed between the first cutting portion 410 and the second cutting portion 420, and each of the angles formed by the first sidewall 412 and the first cutting surface 414 and the angle formed by the second sidewall 422 and the second cutting surface 424 may be less than 90 degrees. The widths of the two cutting portions may be appropriately modified as needed or desired.

[0090] Figure 4 The first cutting surface 414 and the second cutting surface 424 are shown as being connected to each other in a V-shape, but the present disclosure is not limited thereto. For example, the inclination of the first cutting surface 414 and / or the second cutting surface 424 may be modified in various ways at an appropriate point (e.g., a specific or predetermined point) inside the punch 330. In some embodiments, the angle formed by the first sidewall 412 and the first cutting surface 414 and the angle formed by the second sidewall 422 and the second cutting surface 424 each form an acute angle, and the structure of the cutting surface may be modified in various ways.

[0091] As such, the timing of the substrate being cut by the first cutting portion 410 and the timing of the substrate being cut by the second cutting portion 420 can be different from each other, so that the waste can fall off in an inclined state. Accordingly, even when the width of the discharge portion and the width of the waste correspond to the same or similar values, the waste can be smoothly discharged through the discharge portion.

[0092] In some embodiments, by forming the contact area between the cutting portion of the punch and the substrate into an acute angle, the contact area between the cutting portion and the substrate can be minimized or reduced. Accordingly, a structure for transmitting shear force to the substrate can be formed.

[0093] Figure 5 An example of a punching device 500 according to an embodiment of the present disclosure is illustrated. Figure 6 The present invention illustrates an embodiment of the present invention. Figure 5 An enlarged view of the punch 530 .

[0094] refer to Figure 5 , the punching device 500 may include a die 510, a demoulder 520 and a punch 530. Figure 5 and Figure 6 , descriptions that are repeated with the above descriptions about other figures may not be repeated.

[0095] refer to Figure 5 and Figure 6, the punch 530 may include a first cutting portion 610 and a second cutting portion 620 formed in shapes different from each other. The first cutting portion 610 and the second cutting portion 620 may be arranged side by side with each other in a width direction of the punch 530.

[0096] In one embodiment, the first cutting portion 610 may include a first sidewall 612 that is parallel or substantially parallel to the moving axis 550 of the punch 530, and a first cutting surface 614 extending from the first sidewall 612. The first cutting surface 614 may extend from the first sidewall 612 in the width direction of the punch 530. The angle formed between the first sidewall 612 and the first cutting surface 614 may be 90 degrees.

[0097] Similarly, the second cutting portion 620 may include a second sidewall 622 that is parallel or substantially parallel to the moving axis 550 of the punch 530, and a second cutting surface 624 that extends from the second sidewall 622 in the width direction of the punch 530. The angle formed between the second sidewall 622 and the second cutting surface 624 may be 90 degrees.

[0098] In one embodiment, the height of the first sidewall 612 of the first cutting portion 610 may be different from the height of the second sidewall 622 of the second cutting portion 620. Accordingly, a height difference (Δh) may be formed between the first sidewall 612 and the second sidewall 622.

[0099] In one embodiment, a step may be formed between the first cutting surface 614 and the second cutting surface 624. For example, by forming a height difference (Δh) between the first sidewall 612 and the second sidewall 622, a step having a height difference (Δh) may be formed between the first cutting surface 614 and the second cutting surface 624.

[0100] The first cutting surface 614 and the first sidewall 612 form a 90-degree angle up to a point (e.g., a specific or predetermined point) inside the punch 530, and the surface inclination after this point can be changed. Similarly, the second cutting surface 624 and the second sidewall 622 form a 90-degree angle up to a point (e.g., a specific or predetermined point) inside the punch 530, and the surface inclination after this point can be changed. In some embodiments, each of the angles formed by the first sidewall 612 and the first cutting surface 614 and the angles formed by the second sidewall 622 and the second cutting surface 624 form a 90-degree angle, and the structure of the cutting surfaces can be modified in various ways as needed or desired.

[0101] In one embodiment, the timing at which the substrate 540 is cut by the first cutting portion 610 may be different from the timing at which the substrate 540 is cut by the second cutting portion 620. In some embodiments, as the punch 530 moves downward, the second cutting portion 620 having a larger (e.g., higher) sidewall height may cut the substrate 540 while in contact with the substrate 540. Thereafter, as the punch 530 moves further downward, the first cutting portion 610 may cut the substrate 540 while in contact with the substrate 540. In some embodiments, at the second portion (e.g., Figure 5 After the second portion 544 in the substrate 540 is cut by the second cutting portion 620, the first portion of the substrate 540 (eg, Figure 5 The first portion 542 in the drawing may be cut by the first cutting portion 610. In this case, a waste material having a width (w) between the first portion and the second portion may be formed.

[0102] With the above reference Figure 4 Similar to the description, Figure 6 The height of the second cutting portion 620 is illustrated to be greater than (eg, higher than) the height of the first cutting portion 610 , but the present disclosure is not limited thereto, and the height of the first cutting portion 610 may be greater than (eg, higher than) the height of the second cutting portion 620 . Figure 6 The width ratio of the first cutting portion 610 to the second cutting portion 620 is also illustrated as 1:1, but the present disclosure is not limited thereto. For example, a height difference (Δh) may be formed between the first cutting portion 610 and the second cutting portion 620, and each of the angles formed by the first sidewall 612 and the first cutting surface 614 and the angle formed by the second sidewall 622 and the second cutting surface 624 may be 90 degrees or less. The widths of the two cutting portions may be appropriately modified as needed or desired.

[0103] In some embodiments, the angle formed by the first sidewall 612 and the first cutting surface 614 and the angle formed by the second sidewall 622 and the second cutting surface 624 each form 90 degrees, and the structures of the cutting surfaces may be modified in various ways as needed or desired.

[0104] Figure 7 An example of a punching device 700 according to an embodiment of the present disclosure is illustrated. Figure 8 An example of an embodiment of the present disclosure Figure 7 An enlarged view of the punch 730 is shown.

[0105] refer to Figure 7 , the punching device 700 may include a die 710, a demoulder 720 and a punch 730. Figure 7 and Figure 8 , descriptions that are repeated with the above descriptions about other figures may not be repeated.

[0106] refer to Figure 7 and Figure 8 The punch 730 may include a first cutting portion 810 and a second cutting portion 820 formed in different shapes from each other. The first cutting portion 810 and the second cutting portion 820 may be arranged side by side with each other in a width direction of the punch 730.

[0107] In one embodiment, the first cutting portion 810 may include a first sidewall 812 that is parallel to or substantially parallel to the axis of movement 750 of the punch 730, and a first cutting surface 814 that extends from the first sidewall 812 in the width direction of the punch 730. The first cutting surface 814 may be in the form of a curved surface that is concave toward the interior of the punch 730 relative to the axis of movement 750 of the punch 730. Accordingly, the angle formed between the first sidewall 812 and the first cutting surface 814 may be less than 90 degrees. In some embodiments, the inclination of a tangent line of the first cutting surface 814 at the point where the first sidewall 812 and the first cutting surface 814 connect to each other may be less than 90 degrees.

[0108] Similarly, the second cutting portion 820 may include a second sidewall 822 that is parallel to or substantially parallel to the axis of movement 750 of the punch 730, and a second cutting surface 824 that extends from the second sidewall 822 in the width direction of the punch 730. The second cutting surface 824 may be in the form of a curved surface that is concave toward the interior of the punch 730 relative to the axis of movement 750 of the punch 730. Accordingly, the angle formed between the second sidewall 822 and the second cutting surface 824 may be less than 90 degrees. In some embodiments, the inclination of a tangent to the second cutting surface 824 at the point where the second sidewall 822 and the second cutting surface 824 connect to each other may be less than 90 degrees.

[0109] In one embodiment, the height of the first sidewall 812 of the first cutting portion 810 may be different from the height of the second sidewall 822 of the second cutting portion 820. Accordingly, a height difference (Δh) may be formed between the first sidewall 812 and the second sidewall 822.

[0110] In one embodiment, the timing at which the substrate 740 is cut by the first cutting portion 810 may be different from the timing at which the substrate 740 is cut by the second cutting portion 820. In some embodiments, as the punch 730 moves downward, the second cutting portion 820 having a larger (e.g., higher) sidewall height may cut the substrate 740 while in contact with the substrate 740. Thereafter, as the punch 730 moves further downward, the first cutting portion 810 may cut the substrate 740 while in contact with the substrate 740. In some embodiments, at the second portion (e.g., Figure 7After the second portion 744 in the substrate 740 is cut by the second cutting portion 820, the first portion of the substrate 740 (eg, Figure 7 The first portion 742 in the embodiment may be cut by the first cutting portion 810. In this case, a waste material having a width (w) between the first portion and the second portion may be formed.

[0111] Figure 8 The first cutting surface 814 and the second cutting surface 824 are shown to be smoothly connected to each other without a step therebetween, but the present disclosure is not limited thereto. In some embodiments, a step may be formed between the first cutting surface 814 and the second cutting surface 824. In some embodiments, the first cutting surface 814 and the second cutting surface 824 may be formed in the form of a curved surface up to a point (e.g., a specific or predetermined point) inside the punch 730, and the surface after this point may be connected in the form of a flat or substantially flat surface. Each of the first cutting surface 814 and the second cutting surface 824 forms a curved surface concave toward the inside of the punch 730 near the first side wall 812 and the second side wall 822, and the structure of the cutting surface can be modified in various ways as needed or desired.

[0112] In one embodiment, the first cutting surface 814 may form a curved surface near the first sidewall 812, and the second cutting surface 824 may form a flat or substantially flat surface near the second sidewall 822. In other embodiments, the second cutting surface 824 may form a curved surface near the second sidewall 822, and the first cutting surface 814 may form a flat or substantially flat surface near the first sidewall 812. In some embodiments, at least one of the first cutting surface 814 and the second cutting surface 824 may form a curved surface.

[0113] By appropriately modifying the curvature of the first cutting surface 814 and / or the second cutting surface 816 concave toward the interior of the punch 730 , the first cutting portion 810 and / or the second cutting portion 820 may form a structure for transmitting shear force to the substrate.

[0114] Figure 9 An example of a punching device 900 according to an embodiment of the present disclosure is illustrated. Figure 10 The present invention illustrates an embodiment of the present invention. Figure 9 An enlarged view of the punch 930 .

[0115] refer to Figure 9 , the punching device 900 may include a die 910, a demoulder 920 and a punch 930. Figure 9 and Figure 10 , descriptions that are repeated with the above descriptions about other figures may not be repeated.

[0116] refer to Figure 9 and Figure 10 , the punch 930 may include a first cutting portion 1010 and a second cutting portion 1020 formed in shapes different from each other. The first cutting portion 1010 and the second cutting portion 1020 may be arranged side by side with each other in a width direction of the punch 930 .

[0117] In one embodiment, the first cutting portion 1010 may include a first sidewall 1012 that is parallel or substantially parallel to the moving axis 950 of the punch 930, and a first cutting surface 1014 that extends from the first sidewall 1012 in the width direction of the punch 930. The angle formed between the first sidewall 1012 and the first cutting surface 1014 may be 90 degrees or greater.

[0118] Similarly, the second cutting portion 1020 may include a second sidewall 1022 that is parallel or substantially parallel to the movement axis 950 of the punch 930, and a second cutting surface 1024 that extends from the second sidewall 1022 in the width direction of the punch 930. The angle formed between the second sidewall 1022 and the second cutting surface 1024 may be less than 90 degrees.

[0119] In one embodiment, the height of the first sidewall 1012 of the first cutting portion 1010 may be different from the height of the second sidewall 1022 of the second cutting portion 1020. Accordingly, a height difference (Δh) may be formed between the first sidewall 1012 and the second sidewall 1022.

[0120] In one embodiment, the timing at which the substrate 940 is cut by the first cutting portion 1010 may be different from the timing at which the substrate 940 is cut by the second cutting portion 1020. In some embodiments, as the punch 930 moves downward, the second cutting portion 1020 having a larger (e.g., higher) sidewall height may cut the substrate 940 while in contact with the substrate 940. Thereafter, as the punch 930 moves further downward, the first cutting portion 1010 may cut the substrate 940 while in contact with the substrate 940. In some embodiments, at the second portion (e.g., Figure 9 After the second portion 944 in the substrate 940 is cut by the second cutting portion 1020, the first portion of the substrate 940 (eg, Figure 9 The first portion 942 in the embodiment may be cut by the first cutting portion 1010. In this case, a waste material having a width (w) between the first portion and the second portion may be formed.

[0121] Figure 10In the example, the angle formed by the first sidewall 1012 and the first cutting surface 1014 is greater than 90 degrees, and the angle formed by the second sidewall 1022 and the second cutting surface 1024 is less than 90 degrees, but the present disclosure is not limited thereto. In some embodiments, one of the angle formed by the first sidewall 1012 and the first cutting surface 1014 and the angle formed by the second sidewall 1022 and the second cutting surface 1024 is less than 90 degrees, and the other is 90 degrees or greater. Therefore, the structure of the cutting surface can be modified in various ways as needed or desired.

[0122] Figure 11 The ratio of the height difference (Δh) between the first cutting portion and the second cutting portion to the width (w) of the waste material according to an embodiment of the present disclosure is illustrated.

[0123] In one embodiment, the punching device 1100 may include a mold having a discharge portion for discharging waste, a demolding device having a punch receiving portion, and a punch. In one embodiment, the punching device 1100 can cut a substrate. In some embodiments, the demolding device pressurizes and secures the substrate disposed on the upper surface of the mold, and the punch moves downward to pass through the punch receiving portion, thereby cutting the substrate. Waste generated during cutting of the substrate can be discharged through the discharge portion.

[0124] In one embodiment, the discharge portion and / or the punch may be formed into a shape corresponding to a desired standard (e.g., a predetermined standard). For example, the discharge portion and / or the punch may correspond to the cut shape of the substrate. Similarly, the punch receiving portion may be formed to correspond to the shape of the punch to accommodate the punch. Accordingly, the shape of the waste material formed by the punch may also correspond to the shape of the discharge portion.

[0125] In one embodiment, the punch has two sidewalls with different heights relative to the punch's axis of movement. This allows the cutting portions on opposite sides of the punch to cut the substrate at different times. Consequently, waste material formed by cutting the substrate can be removed at an angle.

[0126] In one embodiment, the perpendicular length (x) of the slug width can be calculated using the Pythagorean theorem according to the following equation 1. In equation 1, x is the perpendicular length of the slug width, Δh is the height difference between the sidewalls of the cut portions on opposite sides, and w is the slug width. The perpendicular length (x) of the slug width may refer to the perpendicular length of the slug relative to a plane perpendicular or substantially perpendicular to the axis of movement of the punch.

[0127] Equation 1:

[0128] x 2 =w2-Δh2

[0129] Referring to Equation 1, when the height difference (Δh) between the sidewalls of the cut portions on opposite sides is 1 mm, examples of the scrap width (w), the length perpendicular to the scrap width (x), and the difference (wx) between the scrap width and the length perpendicular to the scrap width are shown in Table 1 below. However, the present disclosure is not limited thereto, and the height difference (Δh) of the sidewalls may have any appropriate value between 0.8 mm and 1.2 mm. In some embodiments, the height difference (Δh) of the sidewalls may have a value outside (e.g., different from) the corresponding range.

[0130] Table 1:

[0131] Δh(mm) w(mm) x(mm) wx(mm) 1 2 About 1.73 About 0.27 1 3 About 2.83 About 0.17 1 4 About 3.87 About 0.13 1 5 About 4.90 About 0.1 1 6 About 5.92 About 0.08 1 7 About 6.93 About 0.07

[0132] Referring to Table 1, the ratio (w / Δh) of the scrap width (w) to the height difference (Δh) between the sidewalls of the cut portion on the opposite side formed by cutting the substrate may be 2 to 7. For example, the ratio (w / Δh) of the scrap width (w) to the height difference (Δh) between the sidewalls of the cut portion on the opposite side may be 5. In this case, assuming that the scrap width (w) is 5 mm and the height difference (Δh) between the sidewalls of the cut portion on the opposite side is 1 mm, the perpendicular length (x) of the scrap width is approximately 4.90 mm, which is shorter than the scrap width (w), and the shortened length (wx) may be approximately 0.1 mm. In some embodiments, as the scrap falls off in an inclined state, the perpendicular length (x) of the scrap width may be shortened compared to the scrap width (w).

[0133] In Table 1, only the cases where the ratio (w / Δh) of the waste width (w) to the height difference (Δh) between the side walls of the two cutting portions is 2, 3, 4, 5, 6, and 7 are shown, but the ratio of the waste width (w) to the height difference (Δh) between the side walls of the cutting portions on the opposite sides can be appropriately modified through various variables as needed or desired.

[0134] In one embodiment, the height difference (Δh) between the side walls of the cut portions on opposite sides may be 0.8 mm to 1.2 mm. In this case, the waste width (w) may be 2 mm to 6 mm. In one embodiment, the height difference (Δh) between the side walls of the cut portions on opposite sides may be 1 mm, and the waste width (w) may be 5 mm. In this case, more efficient waste discharge may be possible. When the ratio (w / Δh) of the waste width (w) to the height difference (Δh) between the side walls of the cut portions on opposite sides is 5, more efficient waste discharge may be possible.

[0135] Due to the height difference (Δh) between the side walls of the cut portions on opposite sides, the orthogonal length (x) of the scrap width may be shorter than the scrap width (w). However, the present disclosure is not limited to the aforementioned values, and the height difference (Δh) between the side walls of the cut portions on opposite sides and the scrap width (w) may be appropriately modified by various suitable variables (such as the spacing between the electrode plates applied to the substrate, the size of the punch, etc.).

[0136] According to some embodiments described above, when waste material is dropped in an inclined state, it can be smoothly discharged through the discharge portion. Accordingly, it is possible to prevent or substantially prevent waste material from being smoothly discharged and accumulating in the punching device. For example, low voltage defects, short circuit defects, and capacity defects that may occur if waste material enters the battery can be prevented or substantially prevented.

[0137] Figure 12 A flowchart illustrating an example of a stamping method according to an embodiment of the present disclosure is illustrated.

[0138] In one embodiment, the stamping method 1200 may be performed by a stamping apparatus (eg, Figure 1 The punching device 100 in the embodiment is executed.

[0139] The punching method 1200 may be started, and a substrate as a cutting target may be set on a mold (S1210). Thereafter, the punching device may lower a demolding device to pressurize and fix the substrate set on the mold (S1220).

[0140] In one embodiment, the punching device may cut the substrate using a punch (S1230). The punch may include a first cutting portion and a second cutting portion formed in different shapes relative to the axis of movement of the punch. For example, the height of the sidewall of the first cutting portion (e.g., a first height) may be different from the height of the sidewall of the second cutting portion (e.g., a second height).

[0141] In one embodiment, the punching device may lower the punch head to cut the substrate using the punch head. Thereafter, the punching device may cut a first portion of the substrate using the first cutting portion and then cut a second portion of the substrate using the second cutting portion. In some embodiments, the punching device may cut the second portion of the substrate using the second cutting portion and then cut the first portion of the substrate using the first cutting portion.

[0142] In some embodiments, the width (w) between the first portion and the second portion may be two or more times the height difference (Δh) between the side walls of the first cutting portion and the second cutting portion. Preferably, the width (w) between the first portion and the second portion may be four or more times the height difference (Δh) between the side walls of the first cutting portion and the second cutting portion. In some embodiments, the height difference (Δh) between the side walls of the first cutting portion and the second cutting portion may be 0.8 mm to 1.2 mm. In some embodiments, the width (w) between the first portion and the second portion may be 2 mm to 6 mm. In some embodiments, the height difference (Δh) between the side walls of the first cutting portion and the second cutting portion may be 1 mm, and the width (w) between the first portion and the second portion may be 5 mm.

[0143] In one embodiment, the punching device may discharge waste material formed when cutting the substrate (S1240), and may end the method 1200. In this case, due to the height difference (Δh) between the sidewalls of the first cutting portion and the second cutting portion, the first portion and the second portion are cut at different timings from each other, so that the waste material can be discharged in an inclined state.

[0144] Although the present disclosure has been described above with respect to the embodiments of the present disclosure, the present disclosure is not limited thereto. Various modifications and variations may be made by those skilled in the art within the spirit of the present disclosure and the equivalent scope of the appended claims.

[0145] Description of some reference numerals

[0146] 100: Stamping device

[0147] 110: First mold

[0148] 112: First base plate

[0149] 114: Stripping plate

[0150] 116: Punch

[0151] 118: Demolder

[0152] 118a, 522, 722, 922: Punch receiving part

[0153] 120: Second mold

[0154] 122: Mold

[0155] 122a, 512, 712, 912: Emission section

[0156] 124: Second base plate

Claims

1. A stamping device comprising: a mold configured to receive a substrate as a cutting target to be disposed on the mold; a demolding device spaced apart from and facing the mold and configured to move toward the substrate to pressurize and fix the substrate; as well as a punch configured to move toward the substrate to cut the substrate to form a scrap, The punch includes a first cutting portion and a second cutting portion, the first cutting portion and the second cutting portion having shapes different from each other with respect to a movement axis of the punch.

2. The punching device according to claim 1, wherein the first cutting portion and the second cutting portion are configured to cut the first portion and the second portion of the substrate, respectively, as the punch moves downward, and The waste formed by cutting the first portion and the second portion has a width between the first portion and the second portion. 3 . The punching device according to claim 2 , wherein a timing of cutting the first portion and a timing of cutting the second portion are different from each other. 4 . The punching device according to claim 3 , wherein the timing of cutting the first portion and the timing of cutting the second portion are different from each other according to a height difference between side walls of the first cutting portion and the second cutting portion. 5 . The punching device according to claim 4 , wherein the width between the first portion and the second portion is two or more times the height difference between the side walls of the first cutting portion and the second cutting portion. 6 . The punching device according to claim 4 , wherein the height difference between the side walls of the first cutting portion and the second cutting portion is 0.8 mm to 1.2 mm. 7 . The punching device according to claim 4 , wherein the width between the first portion and the second portion is 2 mm to 6 mm.

8. The punching device according to claim 1, wherein the first cutting portion comprises: a first side wall parallel to the movement axis of the punch; as well as a first cutting surface extending from the first side wall in a width direction of the punch, and The second cutting portion comprises: a second side wall, parallel to the movement axis of the punch; as well as A second cutting surface extends from the second side wall in the width direction of the punch. 9 . The punching device of claim 8 , wherein each of an angle between the first side wall of the first cutting portion and the first cutting surface and an angle between the second side wall of the second cutting portion and the second cutting surface is 90 degrees.

10. The punching device according to claim 8, wherein each of an angle between the first side wall of the first cutting portion and the first cutting surface and an angle between the second side wall of the second cutting portion and the second cutting surface is less than 90 degrees, and The first cutting surface and the second cutting surface are recessed toward the interior of the punch.

11. The punching device according to claim 8, wherein each of an angle between the first side wall of the first cutting portion and the first cutting surface and an angle between the second side wall of the second cutting portion and the second cutting surface is less than 90 degrees, and At least one of the first cutting surface and the second cutting surface is in the form of a curved surface that is concave toward the interior of the punch.

12. The punching device according to claim 8, wherein an angle between the first side wall of the first cutting portion and the first cutting surface is 90 degrees or greater, and Wherein an angle between the second side wall of the second cutting portion and the second cutting surface is less than 90 degrees.

13. The punching device according to claim 1, wherein the ejector has a punch receiving portion configured to receive the punch, and wherein the punch receiving portion has a shape of a through hole, and the punch is configured to be inserted through the ejector through the through hole.

14. The punching device according to claim 13, wherein the die includes a discharge portion extending in a direction corresponding to the punch receiving portion to communicate with the punch receiving portion, and The waste is cut so as to be discharged through the discharge portion in an inclined state.

15. A stamping method comprising: placing a substrate to be cut on a mold; lowering a demolding device to pressurize and fix the substrate disposed on the mold; cutting the substrate by using a punch; as well as discharging waste formed by said cutting of said substrate, The punch includes a first cutting portion and a second cutting portion, the first cutting portion and the second cutting portion having shapes different from each other with respect to a movement axis of the punch. 16 . The punching method of claim 15 , wherein a first height of a sidewall of the first cut portion is different from a second height of a sidewall of the second cut portion.

17. The stamping method according to claim 16, wherein the cutting of the substrate comprises: lowering the punch; cutting a first portion of the substrate by the first cutting portion; as well as cutting a second portion of the substrate by the second cutting portion, and The first portion and the second portion are cut at different timings from each other according to a height difference between the side walls of the first cutting portion and the second cutting portion, so that the waste is discharged in an inclined state. 18 . The punching method according to claim 17 , wherein a width between the first portion and the second portion is two or more times the height difference between the side walls of the first cut portion and the second cut portion. 19 . The punching method according to claim 17 , wherein the height difference between the side walls of the first cutting portion and the second cutting portion is 0.8 mm to 1.2 mm.

20. The punching method according to claim 17, wherein a width between the first portion and the second portion is 2 mm to 6 mm.

Images