Plastic packaging material and preparation method and application thereof

Abstract

The invention discloses a plastic packaging material as well as a preparation method and application thereof. The plastic packaging material is prepared from the following raw materials: silicon dioxide, o-cresol novolac epoxy resin, biphenyl crystal type epoxy resin, biphenyl aralkyl phenolic resin, a modifier, a coupling agent and an auxiliary agent. The modifier comprises polyether modified silicone oil and carboxyl-terminated liquid nitrile rubber. According to the plastic package material provided by the invention, through the design of the preparation raw materials, the mechanical strength of the epoxy plastic package material is maintained while high fluidity is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of epoxy molding materials, and in particular to an epoxy molding material and a preparation method and application thereof. Background Art

[0002] In the semiconductor packaging field, epoxy-phenolic resin systems, as the mainstream combination for electronic molding compounds, are widely used due to their excellent mechanical properties, electrical insulation, and heat resistance. However, existing epoxy molding compounds still have significant reliability deficiencies in response to the special requirements of wide-frame packages such as SO (Small Outline) and QFP (Quad Flat Package). These packages require materials to possess key properties such as high flowability, high adhesion, and low water absorption to meet the stringent requirements of JEDEC standards for MSL1 and L3 levels. Specifically, existing methods have the following bottlenecks: First, traditional formulations struggle to achieve both high flowability and mechanical strength, and reducing viscosity often leads to decreased performance after curing. Second, uneven dispersion of the coupling agent results in insufficient interfacial bonding, which can easily lead to delamination failure in hot and humid environments. Third, existing mixing processes lack precise control over filler dispersion and temperature, which can easily lead to problems such as pre-curing and filler sedimentation. These shortcomings severely restrict the application of molding compounds in high-density, wide-frame packages. Therefore, there is an urgent need to develop an epoxy molding compound that can significantly improve its interfacial bonding strength and process stability while maintaining the high fluidity of the material, so as to meet the strict reliability requirements of modern packaging technology. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the above-mentioned prior art. To this end, the present invention provides a molding material that, through the design of raw materials, ensures high fluidity while maintaining the mechanical strength of the epoxy molding material.

[0004] The invention provides a plastic packaging material.

[0005] The invention also provides a method for preparing the plastic packaging material.

[0006] The invention also proposes an application of the plastic packaging material in the semiconductor packaging process.

[0007] According to one aspect of the present invention, a plastic encapsulation material is provided, comprising the following raw materials: silicon dioxide, o-cresol novolac epoxy resin, biphenyl crystalline epoxy resin, biphenyl aralkyl phenolic resin, a modifier, a coupling agent, and an auxiliary agent;

[0008] The modifier comprises: polyether modified silicone oil and carboxyl-terminated liquid nitrile rubber.

[0009] According to the first aspect of the present invention, there are at least the following beneficial effects:

[0010] Silica acts as a rigid skeleton, providing foundational strength and reducing water absorption. Its spherical particle shape imparts excellent fluidity to the system. The composite resin matrix is ​​composed of o-cresol novolac epoxy resin and biphenyl crystalline epoxy resin, whose high reactivity ensures curing efficiency, while the rigid biphenyl structure enhances heat resistance and modulus. The multifunctionality of the biphenyl aralkyl phenolic resin forms a high-density crosslinking network with the epoxy groups, while the aromatic ring structure further enhances rigidity. The modifier, polyether-modified silicone oil, achieves compatibility with the epoxy resin through polyether segments and directional alignment of the siloxane segments at the filler interface. This dual effect improves silica dispersion (improving fluidity) and reduces stress in the thermosetting resin. The active carboxyl groups of the carboxyl-terminated liquid nitrile rubber chemically bond with the epoxy groups, forming a "rigid-flexible" interpenetrating structure within the crosslinked network. This significantly enhances toughness through crack pinning and energy dissipation mechanisms, while the nanoscale dispersion of the rubber phase prevents fluidity loss. The present invention uses a multi-stage collaborative design of "rigid skeleton-flexible toughening-interface optimization" to ensure that the material maintains a high fluidity of 141N / mm2 even when the spiral flow length is higher than 125cm. 2 The high bending strength breaks through the technical bottleneck of the mutual restriction between the fluidity and mechanical properties of traditional plastic packaging materials.

[0011] In some embodiments of the present invention, the auxiliary agent includes a curing agent, a release agent, a flame retardant, a colorant, and an ion capture agent.

[0012] In some embodiments of the present invention, the curing agent includes triphenyl phosphate-benzoquinone and a novolac epoxy resin curing agent.

[0013] In some embodiments of the present invention, the release agent includes at least one of montan wax, polyethylene wax, and polytetrafluoroethylene wax.

[0014] In some embodiments of the present invention, the coupling agent includes an amino coupling agent and a thiol coupling agent.

[0015] In some embodiments of the present invention, the amino coupling agent includes at least one of KH-550, KH-540, and KH-792.

[0016] In some embodiments of the present invention, the thiol coupling agent includes at least one of KH-590 and KH-580.

[0017] In some embodiments of the present invention, the flame retardant includes at least one of aluminum hydroxide, magnesium hydroxide, zinc borate and antimony trioxide.

[0018] In some embodiments of the present invention, the colorant comprises carbon black.

[0019] In some embodiments of the present invention, the ion capture agent includes at least one of hydrotalcite, sulfonated polystyrene microspheres and zeolite.

[0020] In some embodiments of the present invention, the plastic encapsulation material includes the following raw materials, by weight: 80 to 90 parts of silicon dioxide, 1 to 20 parts of o-cresol novolac epoxy resin, 1 to 20 parts of biphenyl crystalline epoxy resin, 1 to 20 parts of biphenyl aralkyl phenolic resin, 0.2 to 5 parts of modifier, 0.2 to 10 parts of coupling agent and 1 to 30 parts of auxiliary agent.

[0021] In some embodiments of the present invention, the plastic encapsulation material includes the following raw materials, measured by weight: 80 to 90 parts of silicon dioxide, 1 to 20 parts of o-cresol novolac epoxy resin, 1 to 20 parts of biphenyl crystalline epoxy resin, 1 to 20 parts of biphenyl aralkyl novolac resin, 0.2 to 5 parts of modifier, 0.2 to 10 parts of coupling agent, 0.1 to 10 parts of curing agent, 0.1 to 10 parts of release agent, 1 to 5 parts of flame retardant, 0.1 to 5 parts of colorant, and 0.1 to 5 parts of ion capture agent.

[0022] According to a second aspect of the present invention, a method for preparing the plastic encapsulation material is provided, comprising:

[0023] S1: mixing the raw materials for preparing the plastic packaging material to obtain a mixture;

[0024] S2: kneading the mixture and then forming the tablet.

[0025] In some embodiments of the present invention, a method for preparing a plastic encapsulation material includes:

[0026] S1: mixing silica, o-cresol novolac epoxy resin, biphenyl crystalline epoxy resin, biphenyl aralkyl phenolic resin, a modifier and an auxiliary agent to obtain an intermediate, and then adding a coupling agent to the intermediate to obtain a mixture;

[0027] S2: kneading the mixture and then forming the tablet.

[0028] In some embodiments of the present invention, a method for preparing a plastic encapsulation material includes:

[0029] S1: Silica, o-cresol novolac epoxy resin, biphenyl crystalline epoxy resin, biphenyl aralkyl phenolic resin, curing agent, release agent, colorant, ion scavenger and flame retardant are mixed and reacted to obtain an intermediate, and then a coupling agent and auxiliary agent are added through atomization, mixed and pressed into tablets for molding.

[0030] Following the aforementioned addition sequence, the polyether-modified silicone oil and carboxyl-terminated liquid nitrile rubber are pre-mixed with a portion of epoxy resin to form an intermediate. The polyether segments in the polyether-modified silicone oil are compatible with the epoxy resin, while the siloxane segments are oriented at the filler interface, forming a "bridging" structure that both prevents filler aggregation and reduces system viscosity. The carboxyl groups of the carboxyl-terminated liquid nitrile rubber pre-react with the epoxy groups to form a block copolymer with flexible segments. This intermediate is evenly dispersed within the cross-linked network during mixing. The pre-reaction structure of the intermediate facilitates the addition of high-viscosity liquids such as silicone oil and liquid nitrile rubber during mixing, preventing adhesion and uneven dispersion. Furthermore, the interfacial orientation of the silicone oil promotes uniform filler distribution. Finally, through a cooling, tableting, pulverization, and compression molding process, a molding compound with both high fluidity and mechanical strength is obtained.

[0031] In some embodiments of the present invention, in step S1, the mixing reaction time is 10 to 120 minutes.

[0032] In some embodiments of the present invention, in step S1, the mixing step is performed in a high-speed mixer.

[0033] In some embodiments of the present invention, the method of adding the coupling agent includes a spraying method.

[0034] According to a third aspect of the present invention, application of the epoxy molding compound in a semiconductor packaging process is proposed. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the concept and technical effects of the present invention in conjunction with the embodiments to fully understand the purpose, features and effects of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention.

[0036] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0037] The quality of the raw materials used in the preparation is only used to indicate the proportion, and does not represent the actual quality. In actual production, the output can be proportionally increased or decreased according to demand.

[0038] The embodiment of the first aspect of the present invention provides a plastic packaging material, comprising the following raw materials: silicon dioxide, o-cresol novolac epoxy resin, biphenyl crystalline epoxy resin, biphenyl aralkyl phenolic resin, a modifier, a coupling agent and an auxiliary agent;

[0039] The modifier comprises: polyether modified silicone oil and carboxyl-terminated liquid nitrile rubber.

[0040] According to the first aspect of the present invention, there are at least the following beneficial effects:

[0041] Silica acts as a rigid skeleton, providing foundational strength and reducing water absorption. Its spherical particle shape imparts excellent fluidity to the system. The composite resin matrix is ​​composed of o-cresol novolac epoxy resin and biphenyl crystalline epoxy resin, whose high reactivity ensures curing efficiency, while the rigid biphenyl structure enhances heat resistance and modulus. The multifunctionality of the biphenyl aralkyl phenolic resin forms a high-density crosslinking network with the epoxy groups, while the aromatic ring structure further enhances rigidity. The modifier, polyether-modified silicone oil, achieves compatibility with the epoxy resin through polyether segments and directional alignment of the siloxane segments at the filler interface. This dual effect improves silica dispersion (improving fluidity) and reduces stress in the thermosetting resin. The active carboxyl groups of the carboxyl-terminated liquid nitrile rubber chemically bond with the epoxy groups, forming a "rigid-flexible" interpenetrating structure within the crosslinked network. This significantly enhances toughness through crack pinning and energy dissipation mechanisms, while the nanoscale dispersion of the rubber phase prevents fluidity loss. The present invention uses a multi-stage collaborative design of "rigid skeleton-flexible toughening-interface optimization" to ensure that the material maintains a high fluidity of 141N / mm2 even when the spiral flow length is higher than 125cm. 2 The high bending strength breaks through the technical bottleneck of the mutual restriction between the fluidity and mechanical properties of traditional plastic packaging materials.

[0042] According to some embodiments of the present invention, the auxiliary agent includes a curing agent, a release agent, a flame retardant, a colorant, and an ion capture agent.

[0043] According to some embodiments of the present invention, the curing agent includes triphenyl phosphate-benzoquinone and novolac epoxy resin curing agent.

[0044] According to some embodiments of the present invention, the release agent includes at least one of montan wax, polyethylene wax and polytetrafluoroethylene wax.

[0045] According to some embodiments of the present invention, the coupling agent includes an amino coupling agent and a thiol coupling agent.

[0046] According to some embodiments of the present invention, the flame retardant includes at least one of aluminum hydroxide, magnesium hydroxide, zinc borate and antimony trioxide.

[0047] According to some embodiments of the present invention, the colorant includes carbon black.

[0048] According to some embodiments of the present invention, the ion capture agent includes at least one of hydrotalcite, sulfonated polystyrene microspheres and zeolite.

[0049] According to some embodiments of the present invention, the plastic encapsulation material includes the following raw materials, measured by weight: 80 to 90 parts of silicon dioxide, 1 to 20 parts of o-cresol novolac epoxy resin, 1 to 20 parts of biphenyl crystalline epoxy resin, 1 to 20 parts of biphenyl aralkyl phenolic resin, 0.2 to 5 parts of a modifier, 0.2 to 10 parts of a coupling agent, and 1 to 30 parts of an auxiliary agent.

[0050] According to some embodiments of the present invention, the plastic encapsulation material includes the following raw materials, measured by weight: 80 to 90 parts of silicon dioxide, 1 to 20 parts of o-cresol novolac epoxy resin, 1 to 20 parts of biphenyl crystalline epoxy resin, 1 to 20 parts of biphenyl aralkyl novolac resin, 0.2 to 5 parts of modifier, 0.2 to 10 parts of coupling agent, 0.1 to 10 parts of curing agent, 0.1 to 10 parts of release agent, 1 to 5 parts of flame retardant, 0.1 to 5 parts of colorant, and 0.1 to 5 parts of ion capture agent.

[0051] An embodiment of a second aspect of the present invention provides a molding material, comprising:

[0052] S1: mixing the raw materials for preparing the plastic packaging material to obtain a mixture;

[0053] S2: kneading the mixture and then forming the tablet.

[0054] In some embodiments of the present invention, a method for preparing a plastic encapsulation material includes:

[0055] S1: mixing silica, o-cresol novolac epoxy resin, biphenyl crystalline epoxy resin, biphenyl aralkyl phenolic resin, a modifier and an auxiliary agent to obtain an intermediate, and then adding a coupling agent to the intermediate to obtain a mixture;

[0056] S2: kneading the mixture and then forming the tablet.

[0057] According to some embodiments of the present invention, a method for preparing a plastic encapsulation material includes:

[0058] S1: Silica, o-cresol novolac epoxy resin, biphenyl crystalline epoxy resin, biphenyl aralkyl phenolic resin, curing agent, release agent, colorant, ion scavenger and flame retardant are mixed and reacted to obtain an intermediate, and then a coupling agent and auxiliary agent are added through atomization, mixed and pressed into tablets for molding.

[0059] Following the aforementioned addition sequence, the polyether-modified silicone oil and carboxyl-terminated liquid nitrile rubber are pre-mixed with a portion of epoxy resin to form an intermediate. The polyether segments in the polyether-modified silicone oil are compatible with the epoxy resin, while the siloxane segments are oriented at the filler interface, forming a "bridging" structure that both prevents filler aggregation and reduces system viscosity. The carboxyl groups of the carboxyl-terminated liquid nitrile rubber pre-react with the epoxy groups to form a block copolymer with flexible segments. This intermediate is evenly dispersed within the cross-linked network during mixing. The pre-reaction structure of the intermediate facilitates the addition of high-viscosity liquids such as silicone oil and liquid nitrile rubber during mixing, preventing adhesion and uneven dispersion. Furthermore, the interfacial orientation of the silicone oil promotes uniform filler distribution. Finally, through a cooling, tableting, pulverization, and compression molding process, a molding compound with both high fluidity and mechanical strength is obtained.

[0060] According to some embodiments of the present invention, in step S1, the mixing reaction time is 10 to 120 minutes.

[0061] According to some embodiments of the present invention, in step S1, the mixing step is performed in a high-speed mixer.

[0062] According to some embodiments of the present invention, the method of adding the coupling agent includes a spraying method.

[0063] An embodiment of the third aspect of the present invention provides the use of the epoxy molding compound in a semiconductor packaging process.

[0064] In the embodiment, the curing agent is TPP-BQ;

[0065] The release agents are TPP-BQ and PED191;

[0066] The amino coupling agent is KH-550;

[0067] The thiol coupling agent is KH-590;

[0068] The polyether-modified silicone oil SF 8421EG is Dow Corning SF 8421EG;

[0069] Carboxyl-terminated liquid nitrile rubber CAS: 25265-19-4.

[0070] Example 1

[0071] This embodiment is an epoxy molding compound and a preparation method thereof. The specific raw material contents are shown in Table 1:

[0072] Table 1: Example 1 Raw material composition

[0073]

[0074]

[0075] The specific steps are:

[0076] S1. Polyether-modified silicone oil SF 8421EG and biphenyl crystalline epoxy resin were heated, stirred, and crushed in a ratio of 1:4 to produce an intermediate. Carboxyl-terminated liquid nitrile rubber and biphenyl crystalline epoxy resin were heated, stirred, and crushed in a ratio of 1:4 to produce an intermediate. The intermediate was then placed in a high-speed blender with silica, o-cresol novolac epoxy resin, biphenyl crystalline epoxy resin, biphenyl aralkyl phenolic resin, TPP-BQ, PED191, Licowax E, aluminum hydroxide, carbon black, and hydrotalcite, and the two intermediates, and mixed for 60 minutes to obtain a mixture.

[0077] S2. The amino coupling agent and the thiol coupling agent are sprayed into a high-speed mixer and mixed with the above mixture, and then heated and mixed in a mixer, cooled and pressed into thin sheets, and then crushed and mixed. The crushed powder is pressed into finished products of different sizes by a pressure molding machine.

[0078] Example 2

[0079] This embodiment is an epoxy molding compound and its preparation method. The specific raw material contents are shown in Table 2:

[0080] Table 2: Example 2 Raw material composition

[0081]

[0082]

[0083] The specific steps are:

[0084] S1. Polyether-modified silicone oil SF 8421EG and biphenyl crystalline epoxy resin were heated, stirred, and crushed in a ratio of 1:4 to produce an intermediate. Carboxyl-terminated liquid nitrile rubber and biphenyl crystalline epoxy resin were heated, stirred, and crushed in a ratio of 1:4 to produce an intermediate. The intermediate was then placed in a high-speed blender with silica, o-cresol novolac epoxy resin, biphenyl crystalline epoxy resin, biphenyl aralkyl phenolic resin, TPP-BQ, PED191, Licowax E, aluminum hydroxide, carbon black, and hydrotalcite, and the two intermediates, and mixed for 60 minutes to obtain a mixture.

[0085] S2. The amino coupling agent and the thiol coupling agent are sprayed into a high-speed mixer and mixed with the above mixture. The mixture is then heated and mixed in a mixer, cooled and pressed into thin sheets, and then crushed and mixed. The crushed powder is pressed into finished products of different sizes in a pressure molding machine.

[0086] Example 3

[0087] This embodiment is an epoxy molding compound and a preparation method thereof. The specific raw material contents are shown in Table 3:

[0088] Table 3: Example 3 raw material composition

[0089]

[0090]

[0091] The specific steps are:

[0092] S1. Polyether-modified silicone oil SF 8421EG and biphenyl crystalline epoxy resin were heated, stirred, and crushed in a ratio of 1:4 to produce an intermediate. Carboxyl-terminated liquid nitrile rubber and biphenyl crystalline epoxy resin were heated, stirred, and crushed in a ratio of 1:4 to produce an intermediate. The intermediate was then placed in a high-speed blender with silica, o-cresol novolac epoxy resin, biphenyl crystalline epoxy resin, biphenyl aralkyl phenolic resin, TPP-BQ, PED191, Licowax E, aluminum hydroxide, carbon black, and hydrotalcite, and the two intermediates, and mixed for 60 minutes to obtain a mixture.

[0093] S2. Then, amino coupling agent and trimercapto coupling agent are added by atomization, followed by polyether-modified silicone oil SF 8421EG and resin intermediate, carboxyl-terminated liquid nitrile rubber and resin intermediate. The mixture is then mixed in a mixing kneader at a temperature of 100°C, cooled and pressed into thin sheets, then pulverized and mixed. Finally, the mixture is pressed into finished products of different sizes using a pressure molding machine and stored in a cold storage below 5°C.

[0094] Comparative Example 1

[0095] This comparative example is an epoxy molding compound and its preparation method. The specific raw material contents are shown in Table 4:

[0096] Table 4: Raw material composition of Comparative Example 1

[0097]

[0098] Comparative Example 2

[0099] This comparative example is an epoxy molding compound and a preparation method thereof. The difference between this comparative example and Example 1 is that ordinary bisphenol F epoxy resin is used instead of biphenyl crystalline epoxy resin, and other conditions are the same.

[0100] Comparative Example 3

[0101] This comparative example is an epoxy molding compound and a preparation method thereof. The difference between this comparative example and Example 1 is that ordinary phenolic resin is used instead of biphenyl aralkyl phenolic resin, and other conditions are the same.

[0102] Comparative Example 4

[0103] This comparative example is an epoxy molding compound and a preparation method thereof. The difference between this comparative example and Example 1 is that dimethyl silicone oil is used instead of polyether modified silicone oil SF 8421EG, and other conditions are the same.

[0104] Comparative Example 5

[0105] This comparative example is an epoxy molding compound and a preparation method thereof. The difference between this comparative example and Example 1 is that the carboxyl-terminated liquid nitrile rubber is replaced by nitrile rubber, and the other conditions are the same.

[0106] Test standards:

[0107] 1. Spiral flow length test: press temperature 175℃, pressure 7Mpa, read the spiral flow test mold specimen length.

[0108] 2. Gelation time: Heat the hot plate at 175°C, take 3 g of powder, scrape with a spatula until solidified, and count the time using a stopwatch.

[0109] 3. Bending strength and bending modulus: universal testing machine, specimen 80*10*4mm, pressure sensor speed 3mm / min, reading the bending modulus and bending strength at the moment of fracture.

[0110] 4. Tg: TMA tester, take two points at 80℃ and 240℃, draw a tangent line, and record the intersection as the Tg temperature.

[0111] Table 5: Properties of epoxy molding compounds

[0112]

[0113]

[0114] It can be seen from Table 5 that the epoxy molding compound of the present invention has obvious advantages in fluidity and gelation time. In terms of fluidity, the spiral flow lengths of the embodiments are 146cm, 125cm and 145cm respectively, far exceeding the standard index (≥110cm), indicating that the material has excellent filling ability in high-density, wide-frame packaging, and can effectively solve the problems of punching and filling. Secondly, the gelation time of the embodiments exceeds the standard (≥35s), which are 40s, 41s and 40s respectively, indicating that the material has a longer operating window in the process, which is conducive to the molding of complex packaging structures. In addition, the bending strength of the embodiment (141N / mm 2 、147N / mm 2 、146N / mm 2 ) and flexural modulus (23600N / mm 2 , 24000N / mm 2 、23800N / mm 2 ) are significantly higher than the standard requirements (≥120N / mm2 and ≥50N / mm 2 ), which shows that the material can maintain excellent mechanical strength while maintaining high fluidity. The viscosity test results (6.1Pa·s, 7.1Pa·s, 6.6Pa·s) also show that the material has a low processing viscosity, which further verifies its process adaptability. These advantages are due to the rigid skeleton design of silica in the formula, the synergistic effect of the composite resin matrix, and the modification and optimization of polyether-modified silicone oil and end-carboxyl liquid nitrile rubber. Through the "rigidity-flexibility-interface" multi-level synergistic effect, it breaks through the bottleneck of the mutual restriction of fluidity and mechanical properties of traditional plastic packaging materials. In addition, the spray method of adding coupling agents and the intermediate premixing process ensure the uniform dispersion of the material and the interfacial bonding strength, thereby comprehensively improving the packaging reliability and process stability.

Claims

1. A plastic packaging material, characterized in that: The preparation method comprises the following raw materials: silicon dioxide, o-cresol novolac epoxy resin, biphenyl crystalline epoxy resin, biphenyl aralkyl novolac resin, modifier, coupling agent and auxiliary agent; The modifier comprises: polyether modified silicone oil and carboxyl-terminated liquid nitrile rubber.

2. The plastic packaging material according to claim 1, characterized in that The auxiliary agents include a curing agent, a release agent, a flame retardant, a colorant and an ion capture agent.

3. The plastic packaging material according to claim 2, characterized in that The curing agent includes triphenyl phosphate-benzoquinone and novolac epoxy resin curing agent.

4. The plastic packaging material according to claim 2, characterized in that The release agent includes montan wax.

5. The molding material according to claim 1, wherein: The coupling agents include amino coupling agents and thiol coupling agents.

6. The molding material according to claim 2, characterized in that: The flame retardant includes aluminum hydroxide.

7. The molding material according to claim 1, wherein: The plastic packaging material includes the following raw materials by weight: 80 to 90 parts of silicon dioxide, 1 to 20 parts of o-cresol novolac epoxy resin, 1 to 20 parts of biphenyl crystalline epoxy resin, 1 to 20 parts of biphenyl aralkyl novolac resin, 0.2 to 5 parts of modifier, 0.2 to 10 parts of coupling agent and 1 to 30 parts of auxiliary agent.

8. A method for preparing a plastic encapsulation material according to any one of claims 1 to 7, characterized in that: include: S1: mixing the raw materials for preparing the plastic packaging material to obtain a mixture; S2: kneading the mixture and then forming the tablet.

9. The preparation method according to claim 8, characterized in that The method of adding the coupling agent includes a spraying method.

10. Use of the plastic packaging material according to any one of claims 1 to 7 in a semiconductor packaging process.

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