Deposition apparatus and deposition method
By setting up an air outlet component and a relief hole in the deposition equipment, the pressure in the external cavity is controlled to be greater than the pressure in the internal cavity, which solves the problem of reduced coating quality caused by the connection between the internal and external cavities, improves the uniformity of the coating, and reduces the complexity and maintenance cost of the sealing structure.
Patent Information
- Application Number
- CN202510869526.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-25
- Publication Date
- 2025-09-09
AI Technical Summary
The connection between the inner and outer cavities of existing deposition equipment leads to reduced coating quality, and the sealing structure is complex and costly, making it difficult to effectively control gas leakage.
By setting an air outlet component in the outer cavity, the outer cavity pressure is controlled to be greater than the inner cavity pressure, and the inner and outer cavities are connected by the relief hole to reduce gas leakage. The outer cavity pressure is adjusted by the air outlet component to achieve the function of sealing the inner cavity and reduce maintenance costs.
The coating quality and uniformity are improved, the complexity and maintenance cost of the sealing structure are reduced, and effective isolation between the inner cavity and the outer cavity is achieved.
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Figure CN120608272A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of film coating technology, and in particular to deposition equipment and deposition methods. Background Art
[0002] Deposition equipment can coat substrates by introducing ionized process gases. In related art, deposition equipment has an inner chamber and an outer chamber. Some components of the inner chamber, such as the substrate support, need to be supported in the outer chamber, resulting in a connection between the inner and outer chambers. This can cause the outer chamber to have uncontrollable effects on the inner chamber, such as gas leakage from the inner chamber to the outer chamber, which can easily lead to reduced coating quality. Summary of the Invention
[0003] The embodiments of the present application provide a deposition device and a deposition method, which can improve the coating quality of the deposition device.
[0004] In a first aspect, an embodiment of the present application provides a deposition device. The deposition device includes an outer shell, an inner shell, a supporting bracket, and an exhaust assembly. The inner shell is arranged inside the outer shell, an outer cavity is formed between the inner shell and the outer shell, and an inner cavity is formed inside the inner shell. The supporting bracket includes a support shaft, part of the support shaft is located in the inner cavity and part is located in the outer cavity. The exhaust assembly is arranged in the outer cavity for controlling the pressure of the outer cavity. The inner shell is provided with a clearance hole, the support shaft passes through the clearance hole, and the clearance hole connects the outer cavity and the inner cavity.
[0005] Optionally, the deposition device is configured such that, during operation, the pressure in the outer chamber is greater than the pressure in the inner chamber.
[0006] Optionally, the deposition device further includes a gas outlet component, which is arranged in the outer cavity, and the gas outlet component is arranged corresponding to the side of the inner shell having the clearance hole.
[0007] Optionally, the air outlet assembly includes an air outlet ring, at least two of which are provided, and the air outlet rings are arranged at circumferential intervals around the support shaft, and the air outlet rings are arranged in an arc shape.
[0008] Optionally, the inner contour of the area enclosed by the at least two air outlet rings is larger than the outer contour of the supporting bracket in a direction perpendicular to the support axis.
[0009] Optionally, a plurality of first air outlet channels and a plurality of second air outlet channels are respectively provided on both sides of the air outlet ring, the first air outlet channels discharge air in a direction toward the support shaft, and the second air outlet channels discharge air in a direction away from the support shaft.
[0010] Optionally, the carrier is fixedly mounted on the support shaft, and the support shaft is rotatably engaged with the housing.
[0011] Optionally, a plurality of carriers are provided, and the plurality of carriers are spaced apart along the extension direction of the support axis; the deposition device further includes a process gas source module connected to the inner cavity, and the gas outlet of the process gas source module is located on one side of the carrier in a direction perpendicular to the support axis.
[0012] Optionally, the deposition equipment also includes an exhaust duct, which passes through the outer shell and is connected to the inner shell, and is communicated with the inner cavity. The exhaust duct is connected to the side of the inner shell opposite to the gas outlet of the process gas source module; an exhaust gap is formed between the exhaust duct and the outer shell, and the exhaust gap is communicated with the outer cavity.
[0013] Optionally, the inner cavity includes a main cavity corresponding to the supporting bracket and an exhaust cavity corresponding to a side of the supporting bracket close to the exhaust pipe, and the cross-sectional area of the exhaust cavity gradually decreases in the direction of the supporting bracket toward the exhaust pipe.
[0014] Optionally, the exhaust cavity includes a first cavity and a second cavity in sequence in the direction from the supporting bracket toward the exhaust duct;
[0015] The cross-sectional area of the first cavity is greater than the cross-sectional area of the second cavity, and the cross-sectional area of the first cavity remains unchanged, while the cross-sectional area of the second cavity remains unchanged or gradually decreases in the direction from the supporting bracket toward the exhaust pipe.
[0016] Alternatively, the cross-sectional area of the first cavity is larger than that of the second cavity, and in the direction from the supporting bracket toward the exhaust pipe, the cross-sectional area of the first cavity gradually decreases, while the cross-sectional area of the second cavity remains unchanged or gradually decreases.
[0017] Optionally, the deposition device also includes two gas outlet components, and the spacing direction of the two gas outlet components is set at an angle to the spacing direction of the gas outlet and the exhaust pipe. The component of the gas outlet direction of the gas outlet component in the spacing direction of the gas outlet and the exhaust pipe is smaller than the component in the spacing direction of the gas outlet component, and the gas outlet direction of one gas outlet component is toward the other gas outlet component.
[0018] Optionally, the outer shell includes an outer shell body and an outer shell cover, and the inner shell includes an inner shell body and an inner shell cover; the outer shell body has a first opening connected to the outer cavity, the inner shell body has a second opening connected to the inner cavity, the outer shell cover is used to cover the first opening, and the inner shell cover is used to cover the second opening, and the first opening and the second opening are oriented in the same direction; the outer shell cover and the inner shell cover are installed on the support shaft, and the support shaft, the inner shell cover and the outer shell cover are detachably matched with the outer shell body and the inner shell body.
[0019] In a second aspect, the present application provides a deposition method. The deposition method uses the above-mentioned deposition apparatus. The method includes controlling the gas outlet of the gas outlet assembly during operation of the deposition apparatus so that the pressure of the outer chamber is greater than the pressure of the inner chamber.
[0020] The beneficial effects of the present application are as follows: unlike the prior art, the support shaft of the support bracket is partially disposed within the inner cavity and partially disposed outside the outer cavity, enabling the support bracket to be driven by a driving device from outside the housing to drive the portion of the support shaft located in the outer cavity. Furthermore, by disposing a gas outlet assembly in the outer cavity, the pressure in the outer cavity can be controlled, at least achieving the function of sealing the inner cavity and reducing gas leakage in the inner cavity, thereby improving the coating quality of the deposition device. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 This is a schematic structural diagram of an embodiment of a deposition device of the present application;
[0022] Figure 2 This is a schematic diagram of an embodiment of the gas outlet assembly of the present application;
[0023] Figure 3 This is a schematic diagram of an embodiment of an air outlet ring of the present application;
[0024] Figure 4 This is a schematic diagram of the structure of the disassembly of the support bracket of the deposition equipment of the present application;
[0025] Figure 5 This is a schematic diagram of flow field simulation when an embodiment of the deposition device of the present application is in operation;
[0026] Figure 6 This is a schematic diagram of flow field simulation during operation of another embodiment of the deposition device of the present application;
[0027] Figure 7 This is a schematic diagram of the simulation of the concentration distribution between different layers in the inner cavity of the deposition device of the present application;
[0028] Figure 8 This is a schematic diagram of the simulation of the concentration distribution of the first layer in the inner cavity of the deposition equipment of the present application;
[0029] Figure 9 This is a schematic diagram of the simulation of the concentration distribution of the second layer in the inner cavity of the deposition equipment of the present application;
[0030] Figure 10 This is a schematic diagram of the simulation of the concentration distribution of the third layer in the inner cavity of the deposition equipment of the present application;
[0031] Figure 11 This is a schematic diagram of the simulation of the concentration distribution of the fourth layer in the inner cavity of the deposition equipment of the present application;
[0032] Figure 12 This is a schematic diagram of the simulation of the concentration distribution of the fifth layer in the inner cavity of the deposition equipment of this application.
[0033] Reference numerals:
[0034] Deposition equipment, 1; outer shell, 11; outer cavity, 111; outer shell body, 112; first opening, 1121; outer shell cover, 113; inner shell, 12; inner cavity, 121; clearance hole, 122; inner shell body, 123; second opening, 1231; inner shell cover, 124; supporting bracket, 13; carrier, 131; support shaft, 132; gas outlet assembly, 14; gas outlet ring, 141; main gas channel, 1411; first gas outlet channel, 1412; second gas outlet channel, 1413; exhaust pipe, 15; process gas source module, 16; gas outlet, 161. DETAILED DESCRIPTION
[0035] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0036] The deposition equipment can coat the substrate by introducing ionized process gas. In the related art. The deposition equipment has an inner cavity and an outer cavity. Some components of the inner cavity, such as the bracket for carrying the substrate, need to be supported in the outer cavity, resulting in the connection between the inner cavity and the outer cavity, which makes the outer cavity have an uncontrollable influence on the inner cavity, and easily leads to a reduction in the quality of the coating. Based on this, in order to reduce the influence of the outer cavity on the inner cavity, it is usually necessary to seal between the outer cavity and the inner cavity. However, the bracket in some deposition equipment needs to rotate, resulting in the sealing structure of the inner and outer cavities needing to adopt a dynamic sealing solution, resulting in a more complex sealing structure, high sealing cost and inconvenient maintenance.
[0037] Combine Figure 1 The embodiment of the present application provides a deposition device 1. The deposition device 1 includes an outer shell 11, an inner shell 12, a supporting bracket 13 and an air outlet assembly 14.
[0038] Specifically, the inner shell 12 is arranged inside the outer shell 11, and an outer cavity 111 is formed between the inner shell 12 and the outer shell 11, and an inner cavity 121 is formed inside the inner shell 12. The inner cavity 121 can be used to accommodate the supporting bracket 13, and the supporting bracket 13 can carry the substrate to be coated. The inner cavity 121 can accommodate process gas, and the process gas can deposit a thin film on the substrate on the supporting bracket 13. The outer cavity 111 can be provided with a heating element, so that the inner cavity 121 is heated through the inner shell 12, so that the inner cavity 121 can reach the temperature required for the process. The supporting bracket 13 is movably arranged. On the one hand, the supporting bracket 13 can rotate relative to the inner shell 12 and the outer shell 11, so as to stir the process gas and change the position of the substrate in the inner cavity 121, thereby improving the uniformity of the coating; on the other hand, the supporting bracket 13 can be disassembled from the inner cavity 121, so as to realize the placement and removal of the substrate. The outer cavity 111 can also be used to accommodate part of the supporting bracket 13 , so that the part of the supporting bracket 13 in the outer cavity 111 can be driven from outside the housing 11 by a contactless motor, thereby realizing the rotation of the supporting bracket 13 .
[0039] In some embodiments, the support bracket 13 includes a carrier 131 and a support shaft 132. The carrier 131 is mounted on the support shaft 132. The carrier 131 is located within the inner cavity 121, with the support shaft 132 partially located within the inner cavity 121 and partially located within the outer cavity 111. Optionally, the carrier 131 is fixedly mounted on the support shaft 132, and the support shaft 132 rotates with the housing 11. The rotation of the support bracket 13 can agitate the process gas and change the position of the substrate within the inner cavity 121, thereby improving the uniformity of the process gas in the inner cavity 121 and enhancing the uniformity of the coating. The carrier 131 can be used to place the substrate. The support shaft 132 can provide mechanical support for the carrier 131 and can drive the carrier 131 to rotate. The support shaft 132 of the support bracket 13 is partially located within the inner cavity 121 and partially located within the outer cavity 111, so that the support bracket 13 can be driven by a contactless motor from outside the housing 11 to drive the portion of the support shaft 132 located in the outer cavity 111. The inner shell 12 is provided with a clearance hole 122, through which the support shaft 132 passes, connecting the outer cavity 111 and the inner cavity 121. The clearance hole 122 not only allows the support shaft 132 to pass through, but also connects the outer cavity 111 to the inner cavity 121. The clearance hole 122 does not require a seal. While the clearance hole 122 can connect the outer cavity 111 and the inner cavity 121, a gap exists between the support shaft 132 and the wall of the clearance hole 122, thereby reducing interference with the movement of the support shaft 132 by the wall of the clearance hole 122.
[0040] Furthermore, the gas outlet assembly 14 is disposed in the outer chamber 111 and is used to control the pressure of the outer chamber 111. The gas outlet assembly 14 can discharge gas into the outer chamber 111 to achieve a pressure in the outer chamber 111 that is greater than the pressure in the inner chamber 121. Alternatively, the gas outlet assembly 14 can choose not to discharge gas into the outer chamber 111 and then achieve a pressure in the outer chamber 111 that is lower than the pressure in the inner chamber 121 by cooperating with other components.
[0041] Specifically, by arranging the gas outlet component 14 in the outer cavity 111, the pressure of the outer cavity 111 can be controlled, and the function of sealing the inner cavity 121 can be achieved at least by controlling the pressure of the outer cavity 111 to be greater than the pressure of the inner cavity 121, thereby reducing the gas leakage of the inner cavity 121, thereby increasing the coating quality of the deposition device 1, and reducing the coating on the wall surface and equipment of the outer cavity 111 caused by the gas leakage from the inner cavity 121 to the outer cavity 111, thereby reducing the maintenance cost of the deposition device 1. Optionally, the rapid discharge of the gas in the inner cavity 121 can also be achieved by controlling the pressure of the inner cavity 121 to be greater than the pressure of the outer cavity 111. In the above manner, it is no longer necessary to make a traditional dynamic seal between the inner cavity 121 and the outer cavity 111, thereby reducing the manufacturing cost and maintenance cost. Optionally, the gas outlet component 14 is used to discharge inert gases such as argon or nitrogen that cannot be used for coating.
[0042] Combine Figure 1 , Figure 1 The dotted arrow in the figure indicates the direction of the airflow from the outer chamber 111 to the inner chamber 121. In some embodiments, the deposition device 1 is configured so that the air pressure in the outer chamber 111 is greater than the air pressure in the inner chamber 121 when in operation. It should be further emphasized that when the deposition device 1 is in operation, by setting the pressure of the outer chamber 111 to be greater than the pressure of the inner chamber 121, the gas in the outer chamber 111 can be blown into the inner chamber 121 through the evacuation hole 122. The gas entering the inner chamber 121 from the evacuation hole 122 can disturb the flow of the process gas in the inner chamber 121, thereby increasing the concentration of the process gas on the side of the inner chamber 121 close to the evacuation hole 122, so as to increase the uniformity of the coating of the deposition device 1. The following will further introduce how to increase the uniformity of the deposition device 1 in combination with specific embodiments.
[0043] In some embodiments, a plurality of carriers 131 are provided, and the plurality of carriers 131 are spaced apart along the extension direction of the support shaft 132. In other words, the carriers 131 are provided in multiple layers along the support shaft 132, and the multiple layers of carriers 131 can be used to place substrates separately, thereby increasing the output of the carrier device. The deposition device 1 further includes a process gas source module 16 connected to the inner cavity 121, and the gas outlet 161 of the process gas source module 16 is located on one side of the carrier 131 in a direction perpendicular to the support shaft 132. The process gas source module 16 can pass process gas into the inner cavity 121 through the gas outlet 161, thereby achieving film coating on the substrate. The process gas source module 16 can pass process gas into the inner cavity 121 in a direction perpendicular to the support shaft 132. This can facilitate the distribution of process gas between each layer of carriers 131, reduce the obstruction of the carrier 131 to the gas supply, and facilitate full contact between the substrate and the process gas.
[0044] In some embodiments, the deposition apparatus 1 further includes an exhaust duct 15, which passes through the outer shell 11 and connects to the inner shell 12. The exhaust duct 15 communicates with the inner cavity 121 and is connected to the side of the inner shell 12 opposite the gas outlet 161 of the process gas source module 16. The relative arrangement of the gas outlet 161 and the exhaust duct 15 allows the process gas to be blown from one side of the inner shell 12 to the other side of the inner shell 12 along the extension direction of the gap formed between the carriers 131. This allows the process gas to smoothly and fully contact the substrate on the carrier 131, facilitating thin film deposition.
[0045] Combined with the above embodiments, and combined with Figures 4 to 11 , Figure 4 and Figure 5 Flow field simulation diagrams in the device are shown respectively when the gas outlet volume of the gas outlet component 14 is 800 sccm and when the gas outlet volume of the gas outlet component is 400 sccm. Figure 6 shows the concentration distribution simulation between different layers in the cavity, Figures 7 to 11 The concentration distribution simulation diagram between different positions in each layer of the support 13 is shown. It should be noted that Figures 7 to 11 Represent in turn Figure 6The first to fifth layers from bottom to top (taking the five layers of the supporting bracket 13 as an example, it does not mean that there are only five layers). Specifically, in the process of the process gas source module 16 introducing the process gas into the inner cavity 121, and in the process of the process gas diffusing inside, there will be a problem that the process gas concentration is higher near the middle part, and the process gas concentration is lower near the two side parts. The difference in process gas concentration causes the film deposited on the substrate on the carrier 131 in the middle part to be thicker, while the film deposited on the substrate on the carrier 131 near the two end parts of the support shaft 132 is thinner. The present application sets the pressure of the outer cavity 111 to be greater than the pressure of the inner cavity 121, so that the gas in the outer cavity 111 can be blown into the inner cavity 121 through the clearance hole 122. Among them, the position of the clearance hole 122 is close to one end of the support shaft 132, and the position of the gas blown into the inner cavity 121 by the outer cavity 111 is located in the part with lower process gas concentration, and the direction of the gas blown into the inner cavity 121 by the outer cavity 111 is different from the direction of the process gas source blowing the process gas. In this manner, the gas blown from the outer cavity 111 into the inner cavity 121 can obstruct the gas blown into the process gas source module 16, reducing the rate at which the process gas is discharged, thereby allowing the process gas in the portion of the inner cavity 121 near the clearance hole 122 to remain longer. This method can increase the concentration of the process gas in the portion of the inner cavity 121 near the clearance hole 122, thereby increasing the thickness of the substrate film in this portion, making the thickness of the coating on this portion of the substrate close to the thickness of the coating on the substrate in the middle portion of the inner cavity 121, thereby achieving improved uniformity of the substrate coating.
[0046] In some embodiments, an exhaust gap is formed between the exhaust duct 15 and the outer shell 11, and the exhaust gap is connected to the outer cavity 111. By providing the exhaust gap, the gas in the outer cavity 111 can be discharged through the exhaust gap, which can reduce the pressure of the outer cavity 111. In combination with the gas outlet component 14, gas can be introduced into the outer cavity 111, and the air pressure of the outer cavity 111 can be controlled. Optionally, a pressure detection device can be provided in the outer cavity 111. By detecting the pressure of the outer cavity 111, a control basis for the pressure of the outer cavity 111 can be provided, so that the pressure of the outer cavity 111 can be controlled to be greater than the pressure of the inner cavity 121, and the gas blown into the outer cavity 111 can improve the concentration distribution of the process gas.
[0047] In some embodiments, the clearance hole 122 is disposed on a lower side of the inner shell 12 in the gravity direction, and the air outlet 161 and the exhaust duct 15 are disposed opposite to each other in the horizontal direction.
[0048] In some embodiments, the cross-sectional area of the inner cavity 121 gradually decreases along the direction from the end of the supporting bracket 13 close to the exhaust duct 15 toward the exhaust duct 15. In this way, the part of the process gas in the inner cavity 121 facing the exhaust duct 15 can be quickly discharged, while the process gas in other parts will be hindered by the wall of the inner cavity 121, thereby reducing the discharge speed and increasing the concentration. Optionally, the exhaust duct 15 is arranged in the middle of the inner shell 12. In this way, the airflow of the part with a higher concentration of the process gas can be quickly discharged through the exhaust duct 15, while the discharge of the part of the process gas with a lower concentration on both sides can be slowed down, thereby increasing the concentration of the process gas on both sides of the inner cavity 121, which is beneficial to improving the uniformity of the coating.
[0049] Optionally, the inner shell 12 and the supporting shaft 132 are respectively provided with clearance holes 122 at the corresponding parts at both ends, and two groups of air outlet components 14 are provided, which are respectively arranged on one side of the outer cavity 111 corresponding to the two clearance holes 122.
[0050] In some embodiments, the inner cavity 121 includes a main cavity corresponding to the supporting bracket 13 and an exhaust cavity corresponding to the side of the supporting bracket 13 close to the exhaust pipe 15, and the cross-sectional area of the exhaust cavity gradually decreases in the direction of the supporting bracket 13 toward the exhaust pipe 15.
[0051] Furthermore, in some embodiments, the exhaust cavity includes a first cavity and a second cavity in the direction from the support bracket 13 toward the exhaust duct 15. The cross-sectional area of the first cavity is larger than the cross-sectional area of the second cavity, and the cross-sectional area of the first cavity remains unchanged, and the cross-sectional area of the second cavity remains unchanged. In other words, the cross-sectional area of the exhaust cavity gradually decreases in a stepped manner, and the inner wall of the inner cavity 121 can form multiple stepped surfaces.
[0052] In other embodiments, the cross-sectional area of the first cavity is larger than that of the second cavity, and the cross-sectional area of the first cavity gradually decreases as the support bracket 13 moves toward the exhaust duct 15, while the cross-sectional area of the second cavity gradually decreases. In other words, the cross-sectional area of the exhaust cavity decreases continuously. Alternatively, the cross-sectional area of the exhaust cavity can be conical or frustum-shaped.
[0053] In some embodiments, the cross-sectional area of the first cavity is greater than that of the second cavity, the cross-sectional area of the first cavity remains unchanged, and the cross-sectional area of the second cavity gradually decreases in the direction from the support bracket 13 toward the exhaust duct 15. In other words, the cross-sectional area of the exhaust cavity can first be formed with a stepped surface and then be tapered or frustum-shaped to achieve a gradual decrease in cross-sectional area.
[0054] In some embodiments, the cross-sectional area of the first cavity gradually decreases as the support bracket 13 moves toward the exhaust duct 15, while the cross-sectional area of the second cavity remains unchanged. In other words, the cross-sectional area of the exhaust cavity can first be formed into a cone or a frustum to achieve a gradual decrease in cross-sectional area, and then a step surface is formed.
[0055] In some embodiments, the gas outlet assembly 14 is disposed corresponding to a side of the inner shell 12 having the clearance hole 122. The gas outlet assembly 14 disposed near the clearance hole 122 enables the gas from the gas outlet assembly 14 to quickly flow to the clearance hole 122 and enter the inner cavity 121, thereby disrupting the process gas distribution in the inner cavity 121.
[0056] Combine Figure 2 and Figure 3 In some embodiments, the gas outlet assembly 14 includes at least two gas outlet rings 141, which are spaced apart circumferentially around the support shaft 132 and arranged in an arc shape. The provision of the arc-shaped gas outlet rings 141 around the support shaft 132 allows the gas outlet assembly 14 to the relief hole 122 to be more uniform in the axial direction. This allows the gas entering the inner cavity 121 to controllably interfere with the distribution of the process gas, thereby improving the controllability of the gas outlet assembly 14 over the air pressure and interference with the process gas.
[0057] In some embodiments, the inner contour of the area enclosed by at least two air outlet rings 141 is larger than the outer contour of the supporting bracket 13 in a direction perpendicular to the support shaft 132. In this way, the possibility of interference between the supporting bracket 13 and the air outlet ring 141 during disassembly can be reduced.
[0058] In some embodiments, the diameter of the area enclosed by the multiple air outlet rings 141 is larger than the diameter of the carrier 131. In this way, the interference of the air outlet rings 141 on the movement of the carrier 13 during the disassembly process of the carrier 13 can be reduced.
[0059] In some embodiments, a plurality of first air outlet channels 1412 and a plurality of second air outlet channels 1413 are respectively provided on both sides of the air outlet ring 141. The first air outlet channels 1412 discharge air in a direction toward the support shaft 132, and the second air outlet channels 1413 discharge air in a direction away from the support shaft 132. The air outlet component 14 is used to adjust the pressure of the outer cavity 111. During the air outlet process of the air outlet component 14, the gas will gradually diffuse in the outer cavity 111. The air outlet direction of the air outlet ring 141 needs to be diffused to other positions of the outer cavity 111 at the same time, and needs to enter from the clearance hole 122. If the air outlet of the air outlet ring 141 is directed in a single direction, the direction of the air outlet will be disturbed due to the diffusion of the gas, and the air outlet of the air outlet ring 141 cannot be accurately controlled. Optionally, a main air channel 1411 is provided in the air outlet ring 141, and the main air channel 1411 is connected to the gas source through a pipeline. The first air outlet channel 1412 and the second air outlet channel 1413 are respectively communicated with the main air channel 1411 .
[0060] By disposing the first gas outlet channel 1412 to discharge gas in a direction toward the support shaft 132 and the second gas outlet channel 1413 to discharge gas in a direction away from the support shaft 132, the second gas outlet channel 1413 can be primarily used to generate gas that diffuses into the outer cavity 111, while the first gas outlet channel 1412 can be primarily used to generate gas that diffuses toward the clearance hole 122. This reduces interference between the gas outlets of the first gas outlet channel 1412 and the second gas outlet channel 1413, making the gas that enters the inner cavity 121 from the clearance ring 141 more controllable. This helps improve film uniformity by controlling the gas that enters the inner cavity 121 from the outer cavity 111.
[0061] In some embodiments, the deposition apparatus 1 further comprises two gas outlet components 14, and the spacing direction of the two gas outlet components 14 is set at an angle to the spacing direction of the gas outlet 161 and the exhaust pipe 15. Optionally, the spacing direction of the two gas outlet components 14 is perpendicular to the spacing direction of the gas outlet 161 and the exhaust pipe 15. Figure 1 For example, the process gas can be blown from the gas outlet 161 from left to right, and the gas outlet component 14 can be blown perpendicular to the Figure 1The gas outlet components 14 are arranged in the direction of the paper. In the above manner, the component of the gas outlet of the gas outlet component 14 in the direction of the process gas flow can be reduced. Since the process gas is continuously flowing, if the component of the gas outlet of the gas outlet component 14 in the direction of the process gas flow is large, then the gas outlet components 14 on both sides, one side of which is in the same direction as the process gas flow, and the other side is opposite to the process gas flow, the effect of the gas outlet components 14 on the flow field will become uneven, which is not conducive to improving the uniformity of the coating. By setting the angle between the spacing direction of the gas outlet components 14 and the flow direction of the process gas, this effect can be reduced. Furthermore, the gas outlet components 14 can be symmetrically arranged along the flow direction of the process gas, so that the effects of the gas outlet components 14 on the flow field on both sides can become symmetrical, which is conducive to improving the uniformity of the coating.
[0062] The component of the outlet direction of the outlet assembly 14 in the direction of the spacing between the outlet port 161 and the exhaust pipe 15 is smaller than the component in the spacing direction of the outlet assembly 14 , and the outlet direction of one outlet assembly 14 is toward the other outlet assembly 14 .
[0063] Combine Figure 4 In some embodiments, the outer shell 11 includes an outer shell body 112 and an outer shell cover 113, and the inner shell 12 includes an inner shell body 123 and an inner shell cover 124. The outer shell body 112 has a first opening 1121 communicating with the outer cavity 111, and the inner shell body 123 has a second opening 1231 communicating with the inner cavity 121. The outer shell cover 113 is used to cover the first opening 1121, and the inner shell cover 124 is used to cover the second opening 1231. The first opening 1121 and the second opening 1231 face the same direction. The outer shell cover 113 and the inner shell cover 124 are mounted on a support shaft 132. The support shaft 132, the inner shell cover 124, and the outer shell cover 113 are detachably coupled to the outer shell body 112 and the inner shell body 123. In this manner, the deposition apparatus 1 can conveniently disassemble the support shaft 132, the inner shell cover 124, the outer shell cover 113, and the carrier 131, facilitating access to and placement of wafers on the carrier 131.
[0064] Specifically, when wafers need to be removed or placed, the support shaft 132, inner shell cover 124, outer shell cover 113, and carrier 131 can be moved along the axis of the support shaft 132, the inner shell cover 124 can be disengaged from the second opening 1231, and the outer shell cover 113 can be disengaged from the first opening 1121. During this movement, because the inner contour of the area enclosed by the two air outlet rings 141 is larger than the outer contour of the support bracket 13 in a direction perpendicular to the support shaft 132, the possibility of interference between the support bracket 13 and the air outlet rings 141 during disassembly can be reduced. After the support shaft 132, inner shell cover 124, outer shell cover 113, and carrier 131 are disassembled, the wafers can be removed or placed from the carrier 131 using a robotic arm or other means. Furthermore, after the wafer placement operation is completed, the support shaft 132, the inner shell cover 124, the outer shell cover 113, and the carrier 131 can move along the axis of the support shaft 132. The inner shell cover 124 can cover the second opening 1231, the outer shell cover 113 can cover and seal the first opening 1121, and the carrier 131 can extend into the inner cavity 121. After being installed in place, the gas outlet ring 131 is located between the inner shell cover 124 and the outer shell cover 113 in the axis direction of the support shaft 132. The gas outlet ring 141 can control the pressure of the outer cavity 111 through the gas outlet. When the pressure of the outer cavity 111 is greater than the pressure of the inner cavity 121, the gas in the outer cavity 111 can enter the inner cavity through the clearance hole 122, thereby providing a sealing effect on the one hand and improving the concentration of the process gas in the inner cavity 121 in the aforementioned manner on the other hand.
[0065] The embodiment of the present application also provides a deposition method. The deposition method uses the aforementioned deposition device 1. The deposition method includes, during the operation of the deposition device 1, controlling the gas outlet component 14 to discharge gas so that the pressure of the outer chamber 111 is greater than the pressure of the inner chamber 121. When the deposition device 1 is in operation, by setting the pressure of the outer chamber 111 to be greater than the pressure of the inner chamber 121, the gas in the outer chamber 111 can be blown into the inner chamber 121 through the clearance hole 122. The gas entering the inner chamber 121 from the clearance hole 122 can disturb the flow of the process gas in the inner chamber 121, thereby increasing the concentration of the process gas on the side of the inner chamber 121 close to the clearance hole 122, so as to increase the uniformity of the coating of the deposition device 1.
[0066] The above are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A deposition device, characterized in that: include: shell; an inner shell disposed inside the outer shell, an outer cavity being formed between the inner shell and the outer shell, and an inner cavity being formed inside the inner shell; A supporting bracket includes a support shaft, wherein a portion of the support shaft is located in the inner cavity and another portion is located in the outer cavity; an air outlet component, disposed in the outer cavity and used to control the pressure of the outer cavity; Wherein, the inner shell is provided with a clearance hole, the support shaft passes through the clearance hole, and the clearance hole connects the outer cavity and the inner cavity.
2. The deposition apparatus according to claim 1, wherein: The deposition device is configured such that, during operation, the air pressure in the outer chamber is greater than the air pressure in the inner chamber.
3. The deposition apparatus according to claim 1, wherein: The air outlet component is arranged in the outer cavity, and the air outlet component is arranged corresponding to the side of the inner shell having the evacuation hole.
4. The deposition apparatus according to claim 3, wherein: The air outlet assembly includes an air outlet ring, at least two of which are provided. The air outlet rings are arranged at intervals in the circumferential direction around the support shaft, and the air outlet rings are arranged in an arc shape.
5. The deposition apparatus according to claim 4, wherein: The inner contour of the area surrounded by at least two of the air outlet rings is larger than the outer contour of the supporting bracket in a direction perpendicular to the support axis.
6. The deposition apparatus according to claim 4, wherein: A plurality of first air outlet channels and a plurality of second air outlet channels are respectively provided on both sides of the air outlet ring. The first air outlet channels discharge air in a direction toward the support shaft, and the second air outlet channels discharge air in a direction away from the support shaft.
7. The deposition apparatus according to claim 1, wherein: The supporting bracket includes a carrier and the support shaft. The carrier is located in the inner cavity. The carrier is fixedly installed on the support shaft. The support shaft is rotatably matched with the outer shell.
8. The deposition apparatus according to claim 7, wherein: There are multiple carriers, and the multiple carriers are arranged at intervals along the extension direction of the support axis; the deposition equipment further includes a process gas source module connected to the inner cavity, and the gas outlet of the process gas source module is located on one side of the carrier in the direction perpendicular to the support axis.
9. The deposition apparatus according to claim 8, wherein: The deposition equipment also includes an exhaust pipe, which passes through the outer shell and is connected to the inner shell. The exhaust pipe is communicated with the inner cavity. The exhaust pipe is connected to the side of the inner shell opposite to the gas outlet of the process gas source module; an exhaust gap is formed between the exhaust pipe and the outer shell, and the exhaust gap is communicated with the outer cavity.
10. The deposition apparatus according to claim 9, wherein: The inner cavity includes a main cavity corresponding to the supporting bracket and an exhaust cavity corresponding to a side of the supporting bracket close to the exhaust pipe. The cross-sectional area of the exhaust cavity gradually decreases in the direction from the supporting bracket toward the exhaust pipe.
11. The deposition apparatus according to claim 10, wherein: The exhaust cavity includes a first cavity and a second cavity in sequence in the direction from the supporting bracket toward the exhaust duct; The cross-sectional area of the first cavity is greater than the cross-sectional area of the second cavity, and the cross-sectional area of the first cavity remains unchanged, while the cross-sectional area of the second cavity remains unchanged or gradually decreases in the direction from the supporting bracket toward the exhaust duct; Alternatively, the cross-sectional area of the first cavity is greater than that of the second cavity, and in the direction from the supporting bracket toward the exhaust duct, the cross-sectional area of the first cavity gradually decreases, while the cross-sectional area of the second cavity remains unchanged or gradually decreases.
12. The deposition apparatus according to claim 9, wherein: The deposition device also includes two gas outlet components, and the spacing direction of the two gas outlet components is set at an angle to the spacing direction of the gas outlet and the exhaust pipe. The component of the gas outlet direction of the gas outlet component in the spacing direction between the gas outlet and the exhaust pipe is smaller than the component in the spacing direction of the gas outlet components, and the gas outlet direction of one of the gas outlet components is toward the other gas outlet component.
13. The deposition apparatus according to claim 1, wherein: The outer shell includes an outer shell body and an outer shell cover, and the inner shell includes an inner shell body and an inner shell cover; the outer shell body has a first opening connected to the outer cavity, and the inner shell body has a second opening connected to the inner cavity, the outer shell cover is used to cover the first opening, and the inner shell cover is used to cover the second opening, and the first opening and the second opening are oriented in the same direction; the outer shell cover and the inner shell cover are installed on the support shaft, and the support shaft, the inner shell cover and the outer shell cover are detachably matched with the outer shell body and the inner shell body.
14. A deposition method using the deposition apparatus according to any one of claims 1 to 13, characterized in that: include: During the operation of the deposition device, the gas outlet assembly is controlled to discharge gas so that the pressure of the outer chamber is greater than the pressure of the inner chamber.