Top structure of high-synchronous-measurement number testing machine

Abstract

The invention provides a top structure of a high synchronous test number tester, which comprises a load plate, and two groups of socket assemblies are symmetrically arranged on the load plate. A plurality of signal connectors are arranged around each group of socket assemblies; the socket assembly comprises a plurality of chip sockets; a socket supporting plate, a rectifying plate and an airtight box are sequentially arranged below the load plate corresponding to the socket assembly from top to bottom; a through air inlet is formed in the bottom of the airtight box; air inlet flow channels are uniformly formed in the bottom surface in the airtight box and are communicated with the air inlet; a plurality of air uniformizing holes penetrate through the rectifying plate; the air uniformizing holes are formed above the air inlet flow channel and are communicated with the air inlet flow channel; a plurality of first vent holes are formed in the socket supporting plate in a penetrating manner, and the first vent holes are communicated with the space above the rectifying plate; a plurality of second vent holes are formed in the load plate in a penetrating mode, a third vent hole is formed in each chip socket of the socket assembly in a penetrating mode, and when the socket assembly is installed on the load plate, the second vent holes are communicated with the third vent holes in a one-to-one correspondence mode.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a top structure of a high-speed tester. Background Art

[0002] FT (Final Test) is the final testing step in the chip production process after packaging. It aims to verify that the chip's functionality, performance, and reliability fully meet design specifications and is a critical step in ensuring chip mass production quality. The FT test's concurrent testing rate is influenced by various factors. For example, common memory chips, due to their relatively simple functions and regular test patterns, typically achieve high concurrent testing rates. Some advanced test equipment can even test 64 or 128 chips simultaneously.

[0003] The three-temperature test is a chip performance verification method for different temperature environments. It evaluates the chip's stability in extreme environments by testing its function, performance and reliability under three typical temperature conditions: high temperature, low temperature and room temperature.

[0004] The traditional FT test process can be simply summarized as follows: 1) The pressure arm 201 of the handler 200 drives the suction head 202 to suck the chip 1 through the suction nozzle 203 and load it into the chip socket 111 on the load board 110; 2) The tester (Testhead 100) tests the chip 1 to be tested in the chip socket 111; 3) The handler 200 sorts and unloads the chip based on the feedback test results; 4) Repeat the first step for the next round of testing. For the detailed process, please refer to Figure 1 .

[0005] In steps 1) and 3), the tester 100 is in a non-testing waiting time. When there are many simultaneous tests, the time required for steps 1) and 3) will be longer, which will greatly reduce the UPH (Units Per Hour).

[0006] In addition, at high temperatures, the power consumption of chip 1 may increase significantly (such as dynamic power consumption increases with temperature), causing the chip to heat up more and creating a risk of "thermal runaway". Therefore, high-temperature testing requires heat dissipation of chip 1. At low temperatures, water vapor will form condensation in a low-temperature environment (low dew point), causing the test spring pins or pads in the chip socket 111 to short-circuit. Therefore, low-temperature testing requires keeping the environment around chip 1 dry. Conventional practice is to pass dry air through the inside of the test machine 100 and blow it towards the bottom of the load board 4 (Loadboard). This can have some heat dissipation effect, but it is not effective in preventing condensation on the pins of chip 1. The sorting machine 200 is required to blow dry air directly from above the load board 110. When encountering large numbers of measurements, it is difficult to ensure that it is blown evenly to each chip 1.

[0007] Therefore, it is necessary to provide a top structure of a high-similarity tester to solve the above problems. Summary of the Invention

[0008] The purpose of the present invention is to provide a top structure of a high-simultaneous-testing-number tester to solve the problems of long waiting time of the tester and limited simultaneous-testing number in traditional FT testing, as well as poor heat dissipation at high temperature, easy condensation at low temperature, and difficulty in dry air reaching each chip evenly in three-temperature testing.

[0009] An embodiment of the present invention provides a top structure of a high-speed tester, comprising a load board, on which two groups of socket assemblies are symmetrically arranged; the two groups of socket assemblies are spaced apart, and each group of socket assemblies has a plurality of signal connectors evenly arranged around the socket assemblies corresponding to the socket assemblies; the socket assemblies include a plurality of chip sockets arranged in an array; a socket support plate, a rectifier plate, and an airtight box are sequentially arranged below the load board, corresponding to the positions of the socket assemblies, from top to bottom; the airtight box is sealed to the load board;

[0010] The bottom of the airtight box is provided with a through air inlet; the bottom surface of the airtight box is evenly provided with air inlet channels, and the air inlet channels are connected to the air inlet;

[0011] The rectifier plate is arranged in the airtight box, and a plurality of air balancing holes are provided through the rectifier plate; the plurality of air balancing holes are evenly distributed, and the air balancing holes are arranged above the intake air passage and communicate with the intake air passage;

[0012] The socket support plate is arranged on the top of the airtight box, and a plurality of first vent holes are provided through the socket support plate, and the first vent holes are communicated with the space above the rectifier plate;

[0013] A plurality of second vent holes are provided through the load board at positions corresponding to the socket assembly, and a third vent hole is provided through each chip socket of the socket assembly. When the socket assembly is mounted on the load board, the second vent holes are connected to the third vent holes in a one-to-one correspondence.

[0014] During the test, high-flow-rate compressed dry air enters the airtight box from the air inlet, reduces its flow rate through the inlet air duct, and becomes stable low-flow-rate dry air after entering the rectifier plate through the air equalizing hole. The stable low-flow-rate dry air enters the chip socket through the first air hole, the second air hole and the third air hole in turn.

[0015] Preferably, a test spring pin is provided in the chip socket, the top of the test spring pin is connected to the chip, and the space where the top of the test spring pin is located is connected to the third vent. During low-temperature testing, stable low-flow dry air dries the test spring pin and the pins of the chip. During high-temperature testing, stable low-flow dry air dissipates heat from the chip.

[0016] Preferably, a mounting hole is provided in the intake air duct corresponding to the air equalizing hole, the mounting hole is communicated with the intake air duct, and a silencer is provided in the mounting hole, the silencer reduces the flow rate of the air flowing through while silencing the sound.

[0017] Preferably, a ventilation groove is further provided on the top of the socket support plate, and the ventilation groove is communicated with the first ventilation hole. When the socket support plate is mounted on the load plate, the ventilation groove is communicated with the second ventilation hole.

[0018] Preferably, a partition rib is provided on the top of the rectifier plate, and the partition rib evenly divides the top space of the rectifier plate into independent compartments.

[0019] Preferably, a load board bracket is provided under the load board; the load board bracket is hollowed out corresponding to the socket assembly and the signal connector; the signal connector is connected to the load board from the bottom of the load board and fixed to the load board bracket; the airtight box is sealed to the load board bracket.

[0020] Preferably, sealing grooves are provided at the tops of the four edges of the airtight box, and sealing rings are provided in the sealing grooves. The airtight box is sealed and connected to the load plate bracket via the sealing rings.

[0021] Preferably, the socket support plate is provided with mounting threaded holes, and the socket support plate is mounted to the load plate by screws screwed into the mounting threaded holes.

[0022] Preferably, the number of the chip sockets in each group of the socket assemblies is 512, and the chip sockets are arranged in an array of 32 rows and 16 columns.

[0023] Preferably, the two groups of socket assemblies are arranged symmetrically on the load board.

[0024] Compared with the prior art, the technical solution of the embodiment of the present invention has at least the following beneficial effects:

[0025] The top structure of the high-simultaneous measurement tester provided by the present invention has two groups of socket assemblies symmetrically arranged on the load board, so that when the tester is testing the chips of one group of socket assemblies, the sorting machine can load or unload the other group of socket assemblies, and the traditional sequential process is optimized to parallel the test process with the loading and unloading process. In particular, when the test time and the loading and unloading time are equivalent, the rhythm matching is optimal. At this time, the tester has no waiting time, and the high-simultaneous measurement FT is realized, which improves the test efficiency. During the three-temperature test, the design of the airtight box, the rectifier plate and other components makes the high-flow rate compressed dry air gradually become a stable low-flow rate airflow, and can be evenly blown to the chips and test spring pins through the vents of each component, effectively solving the heat dissipation problem of high-temperature testing and the condensation problem of low-temperature testing, and ensuring the effect of the three-temperature test.

[0026] Furthermore, a silencer is provided at the air holes connected to the rectifier plate in the airtight box to achieve silence while further reducing the air flow rate.

[0027] Furthermore, a partition rib is provided on the top of the rectifier plate, and the partition rib evenly divides the top space of the rectifier plate into independent compartments, so that the air flowing out of the rectifier plate is more uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a partial cross-sectional view of the top structure of a high-speed measurement tester according to an embodiment of the present invention;

[0029] Figure 2 is a schematic diagram of a load board mounting socket assembly and a signal connector according to an embodiment of the present invention;

[0030] Figure 3 2 is a schematic structural diagram of an airtight box according to an embodiment of the present invention;

[0031] Figure 4 This is a schematic diagram of the coordination structure between the airtight box and the rectifier plate in an embodiment of the present invention;

[0032] Figure 5 Schematic diagram of the coordination structure of the airtight box, the rectifier plate and the socket support plate in an embodiment of the present invention;

[0033] Figure 6 It is a partial enlarged view of the chip socket and the load board in the embodiment of the present invention.

[0034] Description of reference numerals:

[0035] 1-Chip;

[0036] 2-socket assembly; 21-chip socket; 211-third vent; 212-test spring pin;

[0037] 3-Signal connector;

[0038] 4- load plate; 41- second vent hole;

[0039] 5-socket support plate; 51-first vent hole; 52-vent groove; 53-installation threaded hole;

[0040] 6-rectifier plate; 61-air balancing hole; 62-separating rib;

[0041] 7-airtight box; 71-air inlet; 72-inlet flow channel; 73-silencer; 74-sealing groove;

[0042] 8-Load plate bracket;

[0043] 100-testing machine; 110-load board; 111-chip socket; 200-sorting machine; 201-pressing arm; 202-suction head; 203-suction nozzle. DETAILED DESCRIPTION

[0044] To make the objectives, features, and beneficial effects of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described below are merely illustrative of the present invention and are not intended to limit the present invention. Furthermore, the same or similar reference numerals may be used in the drawings to refer to the same or similar elements in different embodiments, and descriptions of the same or similar elements in different embodiments, as well as descriptions of prior art elements, features, and effects, may be omitted.

[0045] The purpose of the present invention is to provide a top structure of a high-simultaneous-testing-number tester to solve the problems of long waiting time of the tester and limited simultaneous-testing number in traditional FT testing, as well as poor heat dissipation at high temperature, easy condensation at low temperature and difficulty in dry air reaching each chip evenly in three-temperature testing.

[0046] Figure 1 This is a partial cross-sectional view of the top structure of a high-speed measurement tester according to an embodiment of the present invention; Figure 2 is a schematic diagram of a load board mounting socket assembly and a signal connector according to an embodiment of the present invention; Figure 3 2 is a schematic structural diagram of an airtight box according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the coordination structure between the airtight box and the rectifier plate in an embodiment of the present invention; Figure 5 Schematic diagram of the coordination structure of the airtight box, the rectifier plate and the socket support plate in an embodiment of the present invention; Figure 6 It is a partial enlarged view of the chip socket and the load board in the embodiment of the present invention.

[0047] See now Figures 1 to 6The embodiment of the present invention provides a top structure of a high-speed tester, including a load board 4, on which two groups of socket assemblies 2 are symmetrically arranged; the two groups of socket assemblies 2 are spaced apart, and each group of socket assemblies 2 has a plurality of signal connectors 3 evenly arranged around the socket assemblies 2; the socket assemblies 2 include a plurality of chip sockets 21 arranged in an array; below the load board 4, corresponding to the positions of the socket assemblies 2, a socket support plate 5, a rectifier plate 6, and an airtight box 7 are sequentially arranged from top to bottom; the airtight box 7 is sealed and connected to the load board 4;

[0048] The bottom of the airtight box 7 is provided with an air inlet 71 which passes through it; the bottom surface of the airtight box 7 is evenly provided with an air inlet channel 72 which is connected to the air inlet 71;

[0049] The rectifier plate 6 is disposed in the airtight box 7 and is provided with a plurality of air equalizing holes 61 therethrough. The plurality of air equalizing holes 61 are evenly distributed and are disposed above the inlet flow passage 72 and communicate with the inlet flow passage 72.

[0050] The socket support plate 5 is arranged on the top of the airtight box 7. A plurality of first vent holes 51 are provided through the socket support plate 5. The first vent holes 51 are communicated with the space above the rectifier plate 6.

[0051] A plurality of second vent holes 41 are provided through the load board 4 at positions corresponding to the socket assembly 2. A third vent hole 211 is provided through each chip socket 21 of the socket assembly 2. When the socket assembly 2 is mounted on the load board 4, the second vent holes 41 are connected to the third vent holes 211 in a one-to-one correspondence.

[0052] During the test, high-flow-rate compressed dry air enters the airtight box 7 from the air inlet 71, reduces its flow rate through the air inlet duct 72, and becomes stable low-flow-rate dry air after entering the rectifier plate 6 through the air equalizing hole 61. The stable low-flow-rate dry air enters the chip socket 21 through the first air hole 51, the second air hole 41 and the third air hole 211 in turn.

[0053] In some embodiments, a test spring pin 212 is provided in the chip socket 21, the top of the test spring pin 212 is connected to the chip 1, and the space where the top of the test spring pin 212 is located is connected to the third vent 211. During low-temperature testing, stable low-flow dry air is used to dry the test spring pin 212 and the pins of the chip 1. During high-temperature testing, stable low-flow dry air is used to dissipate heat from the chip 1.

[0054] In some embodiments, a mounting hole is provided at the intake air duct 72 corresponding to the air equalizing hole 61 , the mounting hole is connected to the intake air duct 72 , and a silencer 73 is provided in the mounting hole, which reduces the flow rate of the air flowing through while silencing the sound.

[0055] In some embodiments, a ventilation groove 52 is further provided on the top of the socket support plate 5 , and the ventilation groove 52 is connected to the first ventilation hole 51 . When the socket support plate 5 is mounted on the load plate 4 , the ventilation groove 52 is connected to the second ventilation hole 41 .

[0056] In some embodiments, a partition rib 62 is provided on the top of the rectifying plate 6 , and the partition rib 62 evenly divides the top space of the rectifying plate 6 into independent compartments, so that the air flowing out of the rectifying plate 6 is more uniform.

[0057] In some embodiments, a load board bracket 8 is provided below the load board 4; the load board bracket 8 is hollowed out corresponding to the socket assembly 2 and the signal connector 3; the signal connector 3 is connected to the load board 4 from the bottom of the load board 4 and fixed to the load board bracket 8; the airtight box 7 is sealed and connected to the load board bracket 8.

[0058] In some embodiments, a sealing groove 74 is provided on the top of the four edges of the airtight box 7 , a sealing ring (not shown) is provided in the sealing groove 74 , and the airtight box 7 is sealedly connected to the load plate bracket 8 via the sealing ring.

[0059] In some embodiments, the socket support plate 5 is provided with mounting threaded holes 53 , and the socket support plate 5 is mounted to the load plate 4 by screws screwed into the mounting threaded holes 53 .

[0060] In some embodiments, the number of chip sockets 21 in each socket assembly 2 is 512, and the chip sockets 21 are arranged in an array of 32 rows and 16 columns.

[0061] In some embodiments, the two sets of socket assemblies 2 are disposed symmetrically on the load board 4 .

[0062] The top structure of the high-speed test machine provided by the present invention includes the following steps in specific implementation:

[0063] When the testing machine 100 is testing the chips 1 in the first group of socket assemblies 2 , the sorting machine 200 is loading the second group of socket assemblies 2 .

[0064] After the tester 100 completes the test on the chips 1 in the first group of socket assemblies 2 , it switches to testing the chips 1 in the second group of socket assemblies 2 . At this time, the sorter 200 unloads the chips 1 in the first group of socket assemblies 2 .

[0065] Repeat the above steps to realize that the testing process of the testing machine 100 and the loading and unloading processes of the sorting machine 200 are carried out in parallel.

[0066] During the three-temperature test, compressed dry air is introduced through the airtight box 7, the flow rate is reduced through the inlet air duct 72, and becomes stable low-flow dry air after entering the rectifier plate 6 through the air equalizing hole 61. The stable low-flow dry air enters the chip socket 21 through the first air hole 51, the air groove 52, the second air hole 41 and the third air hole 211 in turn, and blows to the chip 1 and the test spring pin 212, thereby achieving cooling during high-temperature testing and preventing condensation during low-temperature testing.

[0067] To sum up, the top structure of the high-speed measurement test machine provided by the present invention has two groups of socket assemblies 2 symmetrically arranged on the load board 4, so that when the test machine 100 is testing the chip 1 of one group of socket assemblies 2, the sorting machine 200 can load or unload the other group of socket assemblies 2, and optimize the traditional sequential process into a test process in parallel with the loading and unloading process. Especially when the test time and the loading and unloading time are equivalent, the rhythm matching is optimal. At this time, the test machine 100 has no waiting time, realizes the FT of the high-speed measurement, and improves the test efficiency; during the three-temperature test, through the design of the airtight box 7, the rectifier plate 6 and other components, the high-flow rate compressed dry air is gradually transformed into a stable low-flow rate airflow, and can be evenly blown to the chip 1 and the test spring needle 212 through the vents of each component, effectively solving the heat dissipation problem of high-temperature testing and the condensation problem of low-temperature testing, and ensuring the effect of the three-temperature test.

[0068] Furthermore, a silencer sheet 73 is provided at the air equalization hole 61 connected to the rectifier plate 6 in the airtight box 7 to achieve silence while further reducing the air flow rate.

[0069] Furthermore, a partition rib 62 is provided on the top of the rectifier plate 6 , and the partition rib 62 evenly divides the top space of the rectifier plate 6 into independent compartments, so that the air flowing out of the rectifier plate 6 is more uniform.

[0070] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the present disclosure, even when only a single embodiment is described with respect to specific features. The feature examples provided in the present disclosure are intended to be illustrative, not limiting, unless otherwise stated. In specific implementations, the technical features of one or more dependent claims may be combined with the technical features of the independent claim, based on actual needs and where technically feasible, and may be derived from the technical features of the corresponding independent claim in any appropriate manner rather than solely through the specific combinations listed in the claims.

[0071] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

Claims

1. A top structure of a high-speed test machine, characterized in that: The invention comprises a load board, on which two groups of socket assemblies are symmetrically arranged; the two groups of socket assemblies are spaced apart, and a plurality of signal connectors are evenly arranged around each group of socket assemblies corresponding to the socket assemblies; the socket assemblies include a plurality of chip sockets arranged in an array; a socket support plate, a rectifier plate, and an airtight box are arranged below the load board in order from top to bottom corresponding to the positions of the socket assemblies; the airtight box is sealed to the load board; The bottom of the airtight box is provided with a through air inlet; the bottom surface of the airtight box is evenly provided with air inlet channels, and the air inlet channels are connected to the air inlet; The rectifier plate is arranged in the airtight box, and a plurality of air balancing holes are provided through the rectifier plate; the plurality of air balancing holes are evenly distributed, and the air balancing holes are arranged above the intake air passage and communicate with the intake air passage; The socket support plate is arranged on the top of the airtight box, and a plurality of first vent holes are provided through the socket support plate, and the first vent holes are communicated with the space above the rectifier plate; A plurality of second vent holes are provided through the load board at positions corresponding to the socket assembly, and a third vent hole is provided through each chip socket of the socket assembly. When the socket assembly is mounted on the load board, the second vent holes are connected to the third vent holes in a one-to-one correspondence. During the test, high-flow-rate compressed dry air enters the airtight box from the air inlet, reduces its flow rate through the inlet air duct, and becomes stable low-flow-rate dry air after entering the rectifier plate through the air equalizing hole. The stable low-flow-rate dry air enters the chip socket through the first air hole, the second air hole and the third air hole in turn.

2. The top structure of the high-speed test machine according to claim 1, characterized in that: A test spring pin is provided in the chip socket, the top of the test spring pin is connected to the chip, and the space where the top of the test spring pin is located is connected to the third vent. During low-temperature testing, stable low-flow dry air dries the test spring pin and the pin of the chip. During high-temperature testing, stable low-flow dry air dissipates heat from the chip.

3. The top structure of the high-speed test machine according to claim 1, characterized in that: The intake air duct is provided with a mounting hole corresponding to the air equalizing hole, the mounting hole is communicated with the intake air duct, and a silencer is provided in the mounting hole, the silencer reduces the flow rate of the air flowing through while silencing the sound.

4. The top structure of the high-speed test machine according to claim 1, characterized in that: A ventilation groove is further provided on the top of the socket support plate, and the ventilation groove is communicated with the first ventilation hole. When the socket support plate is mounted on the load plate, the ventilation groove is communicated with the second ventilation hole.

5. The top structure of the high-speed test machine according to claim 1, characterized in that: The top of the rectifier plate is provided with a partition rib, and the partition rib evenly divides the top space of the rectifier plate into independent compartments.

6. The top structure of the high-speed test machine according to claim 1, characterized in that: A load board bracket is provided below the load board; the load board bracket is hollowed out corresponding to the socket assembly and the signal connector; the signal connector is connected to the load board from the bottom of the load board and fixed to the load board bracket; the airtight box is sealed to the load board bracket.

7. The top structure of the high-speed test machine according to claim 6, characterized in that: The tops of the four edges of the airtight box are provided with sealing grooves, and sealing rings are provided in the sealing grooves. The airtight box is sealed and connected to the load plate bracket through the sealing rings.

8. The top structure of the high-speed test machine according to claim 1, characterized in that: The socket support plate is provided with a mounting threaded hole, and the socket support plate is mounted to the load plate by screws screwed into the mounting threaded hole.

9. The top structure of the high-speed test machine according to claim 1, characterized in that: The number of the chip sockets in each group of the socket assemblies is 512, and the chip sockets are arranged in an array of 32 rows and 16 columns.

10. The top structure of the high-speed test machine according to claim 1, characterized in that: The two groups of socket assemblies are arranged symmetrically on the load board.

Images