Light-emitting structure and manufacturing method thereof, and light-emitting device and manufacturing method thereof

Abstract

The invention provides a light-emitting structure and a manufacturing method thereof, and a light-emitting device and a manufacturing method thereof, and the manufacturing method of the light-emitting structure comprises the following steps: manufacturing a lens which is provided with a mounting cavity with an opening in one side; manufacturing an LED light source, wherein the LED light source is provided with a bonding pad used for being mounted on the circuit substrate; and assembling the LED light source, inserting the LED light source into the mounting cavity from the light emitting end, and fixedly connecting the LED light source with the lens. The light-emitting device manufacturing method comprises the following steps: manufacturing a plurality of light-emitting structures through the light-emitting structure manufacturing method; and the light-emitting structures are mounted on the circuit substrate through bonding pads of the LED light sources. The light-emitting structure is manufactured through the light-emitting structure manufacturing method, and the light-emitting device is manufactured through the light-emitting device manufacturing method. The light-emitting device is manufactured through the light-emitting device, so that the manufacturing efficiency and the manufacturing quality of the light-emitting device are high.

Description

Technical Field

[0001] The present application belongs to the field of backlight technology, and more specifically, relates to a light-emitting structure and a manufacturing method thereof, a light-emitting device and a manufacturing method thereof. Background Art

[0002] In the field of TV backlight technology, a variety of different solutions can be used to achieve high color gamut and wide-angle light emission effects. In order to reduce costs, the industry usually mounts high-color gamut LED light sources on circuit substrates, and then forms specific-shaped glue droplets by dispensing to achieve wide-angle light emission. This method reduces the dependence on quantum dot light-emitting diode films to a certain extent, reduces costs, and at the same time reduces the number of LED light sources by utilizing the wide-angle light emission characteristics. However, the above solution still has obvious defects: on the one hand, the operation process of mounting LED light sources and dispensing glue droplets on circuit substrates is relatively cumbersome and requires multiple independent steps, which greatly affects production efficiency. On the other hand, the dispensing process is difficult to ensure a high degree of consistency in the shape of each dispensing. The difference in the dispensing shape will directly affect the light emission angle and light distribution uniformity of the LED light source, thereby affecting the overall display effect of the TV backlight. Summary of the Invention

[0003] The purpose of the embodiments of the present application is to provide a light-emitting structure and a manufacturing method thereof, a light-emitting device and a manufacturing method thereof, so as to solve the technical problems of low manufacturing efficiency and low manufacturing quality of light-emitting devices in the prior art.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows: In a first aspect, this application provides a light-emitting structure, comprising the following steps:

[0005] Making a lens, wherein the lens has a mounting cavity with an opening on one side;

[0006] Making an LED light source, the LED light source having a solder pad for mounting on a circuit substrate;

[0007] Assemble the LED light source, insert the LED light source into the installation cavity starting from the light emitting end, and fix the LED light source to the lens.

[0008] In some embodiments, the manufacturing of the lens includes: injecting silicone or epoxy glue raw materials into a high-precision mold, and injection molding according to a preset temperature and preset pressure to form a lens with a mounting cavity.

[0009] In some embodiments, the manufacturing of the LED light source includes: forming an arc-shaped protrusion on the light-emitting end of the LED light source by dispensing glue;

[0010] When assembling the LED light source, the arc-shaped protrusion is matched with the inner surface of the side wall of the installation cavity to guide the LED light source to be inserted into the installation cavity.

[0011] In some embodiments, the following steps are further included before assembling the LED light source:

[0012] providing a semi-transparent reflective layer on the inner surface of the mounting cavity;

[0013] When assembling the LED light source, insert the LED light source into the mounting cavity starting from the light emitting end, and make the LED light source face the semi-transparent reflective layer along its optical axis; the semi-transparent reflective layer is used to reflect at least part of the light emitted by the LED light source along its axial direction to the side.

[0014] In some embodiments, the following steps are further included before assembling the LED light source:

[0015] Filling the installation cavity with liquid adhesive;

[0016] When assembling the LED light source, the LED light source is inserted into the installation cavity starting from the light emitting end, and the liquid adhesive fills the gap between the LED light source and the lens.

[0017] In a second aspect, the present application provides a method for manufacturing a light-emitting device, comprising the following steps:

[0018] Fabricate a plurality of light-emitting structures using the above-mentioned light-emitting structure fabrication method;

[0019] Each of the light-emitting structures is mounted on a circuit substrate through the soldering pads of the LED light source.

[0020] In the third aspect, the present application provides a light-emitting structure, which is manufactured using the above-mentioned light-emitting structure manufacturing method. The light-emitting structure includes a lens and an LED light source. The lens has a mounting cavity with an opening on one side. At least the light-emitting end of the LED light source is inserted into the mounting cavity. The LED light source is fixed to the lens, and the LED light source has a solder pad for mounting on a circuit substrate.

[0021] In some embodiments, the light emitting end of the LED light source has an arc-shaped protrusion, and the arc-shaped protrusion is used to cooperate with the inner surface of the side wall of the installation cavity to guide the LED light source to be inserted into the installation cavity;

[0022] And / or, a semi-transparent reflective layer is provided in the installation cavity, and the LED light source is facing the semi-transparent reflective layer along its optical axis; the semi-transparent reflective layer is used to reflect at least part of the light emitted by the LED light source along its axial direction to the side.

[0023] In some embodiments, the mounting cavity is filled with liquid adhesive, and the LED light source is fixed to the lens by the liquid adhesive.

[0024] In a fourth aspect, the present application further provides a light-emitting device, comprising a circuit substrate and a plurality of the above-mentioned light-emitting structures, wherein each of the light-emitting structures is mounted on the circuit substrate via a soldering pad of the LED light source.

[0025] The beneficial effects of the light-emitting structure and its manufacturing method, the light-emitting device and its manufacturing method provided by the present application are: by making a lens in advance, and the lens has a mounting cavity, the mounting cavity is used to accommodate the LED light source, and the lens and the LED light source are fixed together, the above-mentioned arrangement makes it possible to transport the light-emitting structure formed by the LED light source and the lens being fixed together as a whole and fix it as a whole on the circuit substrate, that is, when making the light-emitting device, it is only necessary to weld and fix a plurality of light-emitting structures on the circuit substrate in sequence, which greatly improves the production efficiency of the light-emitting device, and there is no need to weld each LED light source to the circuit substrate and then perform a dispensing operation for each LED light source. At the same time, the lens is made in advance by a unified mold or processing tool, and the shape and size of each lens are highly uniform, and there will be no direct impact on the light output angle and light distribution uniformity of the LED light source due to the difference in the shape of each lens, thereby improving the overall display effect of the TV backlight. In addition, the use of solder pads makes the assembly operation easier and the mounting more secure when the combination of the LED light source and the lens is mounted on the circuit substrate, further improving production efficiency and product stability. During product transportation and use, it can better resist vibration and impact, reduce problems such as optical performance degradation or electrical connection failure caused by structural looseness, improve product reliability and service life, and reduce after-sales maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0027] Figure 1 A schematic top view of the light emitting device provided in an embodiment of the present application;

[0028] Figure 2 A schematic side view of the structure of a light-emitting device according to an embodiment of the present application;

[0029] Figure 3 A schematic side view of the light-emitting structure provided in an embodiment of the present application;

[0030] Figure 4 A schematic cross-sectional view of an LED light source according to an embodiment of the present invention;

[0031] Figure 5 A schematic structural diagram of a lens in a light-emitting structure provided in an embodiment of the present application;

[0032] Figure 6 A schematic diagram of a process for manufacturing a light-emitting structure according to an embodiment of the present application;

[0033] Figure 7 A schematic flow chart of a method for manufacturing a light-emitting device according to an embodiment of the present application.

[0034] Among them, the reference numerals in the figures are:

[0035] 1. Light-emitting structure; 100. LED light source; 110. Mounting frame; 111. Mounting portion; 112. Extension portion; 113. Step surface; 114. Storage cavity; 120. LED chip; 130. Encapsulation adhesive layer; 131. Arc-shaped protrusion; 132. Filling portion; 140. Solder pad; 200. Lens; 210. Mounting cavity; 211. First accommodating portion; 212. Second accommodating portion; 213. Top wall inner surface; 214. Peripheral wall inner surface; 300. Semi-transparent reflective layer; 400. Liquid adhesive; 2. Circuit substrate. DETAILED DESCRIPTION

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0037] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0038] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0040] First, please refer to Figures 1 to 6 , an embodiment of the present application provides a method for manufacturing a light-emitting structure, comprising the following steps:

[0041] S10: manufacturing a lens 200, wherein the lens 200 has a mounting cavity 210 with an opening on one side;

[0042] Specifically, the lens 200 having the mounting cavity 210 may be manufactured by injection molding; or, the lens 200 having the mounting cavity 210 may be manufactured by compression molding; or, the lens 200 having the mounting cavity 210 may be formed by high-precision machining.

[0043] S40: manufacturing the LED light source 100, wherein the LED light source 100 has a solder pad 140 for mounting on the circuit substrate 2;

[0044] Specifically, the LED light source 100 may include an LED chip 120 or an LED light-emitting device obtained by packaging the LED chip 120 .

[0045] S70 : Assemble the LED light source 100 , insert the LED light source 100 into the mounting cavity 210 starting from the light emitting end, and fix the LED light source 100 to the lens 200 .

[0046] It should be noted that the light-emitting end of the LED light source 100 is the end of the LED light source 100 that is away from the solder pad 140. The LED light source 100 generally emits light outward through the top side surface that is away from the solder pad 140 and the peripheral side surface that is connected to the top side surface. The LED light source 100 is inserted into the mounting cavity 210 starting from the light-emitting end, which means that the light-emitting end of the LED light source 100 is inserted into the mounting cavity 210 first, and then the other parts of the LED light source 100 are inserted into the mounting cavity 210. It can accommodate all of the LED light source 100 in the mounting cavity 210, or it can accommodate part of the LED light source 100 in the mounting cavity 210. The design of inserting the LED light source 100 into the mounting cavity 210 enables the LED light source 100 and the lens 200 to form a tight combination, and enables the light emitted by the LED light source 100 to be directed to different positions of the lens 200 through the mounting cavity 210, and the light is optically processed by the lens 200, thereby achieving a combination of good optical performance of the LED light source 100 and the lens 200.

[0047] It should also be noted that the LED light source 100 and the lens 200 are fixedly connected, which means that the LED light source 100 and the lens 200 are fixed together by bonding, secondary injection molding, clamping or welding, so as to facilitate the transfer and assembly of the LED light source 100 and the lens 200 as a whole, for example, to facilitate the installation of the LED light source 100 and the lens 200 as a whole on the circuit substrate 2.

[0048] The light-emitting structure 1 in the embodiment of the present application is formed by pre-fabricating the lens 200, and the lens 200 has a mounting cavity 210. The mounting cavity 210 is used to accommodate the LED light source 100 and fix the lens 200 and the LED light source 100. The above arrangement allows the light-emitting structure 1 formed by fixing the LED light source 100 and the lens 200 to be transported and fixed as a whole on the circuit substrate 2. That is, when manufacturing a light-emitting device, it is only necessary to sequentially mount and fix multiple light-emitting structures 1 on the circuit substrate 2, which greatly improves the manufacturing efficiency of the light-emitting device. There is no need to solder each LED light source 100 to the circuit substrate 2 and then perform glue dispensing operations on each LED light source 100. At the same time, the lens 200 is pre-fabricated using a unified mold or processing tool. The shape and size of each lens 200 are highly uniform, and the difference in shape of each lens 200 will not directly affect the light output angle and light distribution uniformity of the LED light source 100, thereby improving the overall display effect of the TV backlight. In addition, the use of the soldering pad 140 makes the assembly operation easier and the mounting more secure when the combination of the LED light source 100 and the lens 200 is mounted on the circuit substrate 2, further improving production efficiency and product stability. During product transportation and use, it can better resist vibration and impact, reduce problems such as optical performance degradation or electrical connection failure caused by structural looseness, improve product reliability and service life, and reduce after-sales maintenance costs.

[0049] In some embodiments, see Figure 3 The lens 200 has a first side 220 and a second side 230 disposed in opposite directions along its longitudinal direction. A mounting cavity 210 is formed on the first side 220 of the lens 200. In the transverse direction of the lens 200, a first centerline of the mounting cavity 210 coincides with a second centerline of the lens 200. During assembly, the light emitting end of the LED light source 100 is inserted into the mounting cavity 210 from the first side 200 of the lens 200. Light emitted by the LED light source 100 enters the lens 200 and is emitted from the second side 230 of the lens 200 and the surrounding side surfaces adjacent to the second side 230.

[0050] Preferably, the optical axis direction of the LED light source 100 is parallel to the longitudinal direction of the lens 200 , and the third center line of the LED light source 100 coincides with the first center line of the mounting cavity 210 .

[0051] In some embodiments, step S10 of manufacturing the lens 200 includes the following steps:

[0052] S11: injecting silicone or epoxy glue into a high-precision mold, and forming a lens 200 having a mounting cavity 210 by injection molding at a preset temperature and a preset pressure;

[0053] Specifically, the preset injection molding temperature of the lens 200 can be controlled within the range of 80°C-180°C, the preset injection molding pressure can be controlled within the range of 0.5MPa-5.0MPa, and the injection molding can be continued for 1-60 minutes so that the raw material can fully fill the mold cavity and solidify into shape, thereby obtaining a lens 200 with a mounting cavity 210.

[0054] S12: After the lens 200 is fixed, the lens 200 is demoulded and the appearance and size of the lens 200 are strictly inspected to ensure that the shape of the lens 200 and the shape and size of the mounting cavity 210 meet the design requirements, and unqualified products are rejected.

[0055] In this embodiment, a lens with a mounting cavity is formed through high-precision mold injection molding, thereby producing uniformly shaped lenses 200. This ensures highly consistent shapes among all lenses 200 within the same light-emitting device, resolving the issue of inconsistent shapes during dispensing in existing solutions. Furthermore, in actual production, multiple lenses 200 of uniform shape and size can be formed through simultaneous injection molding using multiple mold cavities of the same shape and size, thereby improving lens 200 production efficiency.

[0056] In some embodiments, see Figure 4 Step S40 of manufacturing the LED light source 100 includes: forming an arc-shaped protrusion 131 at the light-emitting end of the LED light source 100 by dispensing glue; when assembling the LED light source 100, the arc-shaped protrusion 131 is matched with the inner surface of the side wall of the installation cavity 210 to guide the LED light source 100 to be inserted into the installation cavity 210.

[0057] The provision of the arc-shaped protrusion 131 has a dual function. On the one hand, during installation, the arc-shaped protrusion 131 forms a latch structure with the mounting cavity 210 of the lens 200. The arc-shaped protrusion 131 enables the LED light source 100 to be inserted into the mounting cavity 210 of the lens 200 more easily and accurately, greatly improving the accuracy and convenience of installation and reducing the loss of optical performance caused by installation deviation. On the other hand, from the perspective of optical principles, the arc-shaped protrusion 131 changes the light propagation path of the LED light source 100, increasing the proportion of light emitted to the side, thereby significantly increasing the light-emitting angle and further improving the lighting effect of the TV backlight. It is understandable that in other embodiments of the present application, the LED light source 100 may also be provided with the arc-shaped protrusion 131. In this case, the light propagation path of the LED light source 100 can be changed by setting the inner surface of the peripheral wall of the mounting cavity 210 to be arc-shaped.

[0058] In some embodiments, see Figure 4 Step S40 of manufacturing the LED light source 100 includes the following steps:

[0059] S41: providing a mounting frame 110 and an LED chip 120, wherein the mounting frame 110 has a receiving cavity 114 with an open top;

[0060] S42: Mounting the LED chip 120 at the bottom of the receiving cavity 114;

[0061] S43: Forming an encapsulating adhesive layer 130 by dispensing adhesive, wherein the encapsulating adhesive layer 130 includes a filling portion 132 that fills the receiving cavity 114 and an arc-shaped protrusion 131 located on top of the filling portion 132. Specifically, the filling portion 132 fills between the outer circumference of the LED chip 120 and the inner circumference of the mounting frame 110, and fills the top side of the LED chip 120.

[0062] Specifically, the shape and size of the arc-shaped protrusion 131 can be controlled by controlling the amount of glue dispensed. In order to improve the glue dispensing accuracy, the glue can be dispensed using a high-precision glue dispensing device.

[0063] In this embodiment, the arc-shaped protrusion 131 is formed while manufacturing the encapsulation adhesive layer 130 of the LED light source 100 , which not only simplifies the manufacturing process of the LED light source 100 , but also reduces the manufacturing cost and improves the manufacturing efficiency.

[0064] In other embodiments of the present application, a uniform LED light source 100 can be directly purchased or manufactured. The LED light source 100 includes a mounting frame 110, an LED chip 120, and an encapsulating adhesive layer 130. Then, an arc-shaped protrusion 131 is formed on the encapsulating adhesive layer 130 of the LED light source 100 by dispensing glue. The arc-shaped protrusion 131 can be formed by precisely controlling the amount of glue dispensed using high-precision dispensing equipment, thereby ensuring the consistency of each LED light source 100. The above arrangement reduces the difficulty of manufacturing the LED light source 100 because the encapsulating adhesive layer 130 and the arc-shaped protrusion 131 are formed separately.

[0065] Optionally, the material of the arc-shaped protrusion 131 can be the same as the material of the encapsulation adhesive layer 130. For example, the arc-shaped protrusion 131 can be formed by a transparent adhesive layer, or it can also be formed by an adhesive layer with a luminescent substance added. The luminescent substance can be one or more of green phosphors, yellow phosphors, and red phosphors suitable for blue-violet light excitation.

[0066] In some embodiments, see Figure 4 The height of the arc-shaped protrusion 131 ranges from 0.4 mm to 1.4 mm. For example, the height of the arc-shaped protrusion 131 can be 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, or 1.4 mm. The height of the arc-shaped protrusion 131 cannot be too small, as this will prevent the arc-shaped protrusion 131 from forming a latching engagement with the mounting cavity 210. Furthermore, the height of the arc-shaped protrusion 131 cannot be too large, as this will prevent the arc-shaped protrusion 131 from forming an arc shape, affecting the optical effect of the arc-shaped protrusion 131 and occupying too much space within the lens 200, thereby affecting the structural strength and optical performance of the lens 200. In this embodiment, by limiting the height of the arc-shaped protrusion 131 to within the range of 0.4 mm to 1.4 mm, the arc-shaped protrusion 131 can ensure a plug-in engagement with the mounting cavity 210 while also achieving a certain optical effect.

[0067] In some embodiments, see Figure 4The mounting frame 110 includes a mounting portion 111 and an extension portion 112. The receiving cavity 114 is formed by a recessed top surface of the mounting portion 111. The extension portion 112 extends outward from the outer periphery of the bottom end of the mounting portion 111. The top surface of the mounting portion 111 is higher than the top surface of the extension portion 112 and forms a stepped surface 113. The bottom surface of the mounting portion 111 is flush with the bottom surface of the extension portion 112. The mounting cavity 210 includes a first receiving portion 211 and a second receiving portion 212. The second receiving portion 212 extends longitudinally inward from the first side 220 of the lens 200 to the first receiving portion 211. The inner surface of the second receiving portion 212 is extended outward relative to the inner surface of the first receiving portion 211. During assembly, the mounting portion 111 and the arc-shaped protrusion 131 are inserted into the first receiving portion 211, and the extension portion 112 is received in the second receiving portion 212 until the stepped surface 113 abuts the inner surface of the top wall of the second receiving portion 212. The bottom side of the extension portion 112 is flush with the bottom side of the lens 200. This arrangement facilitates the integrated mounting of the LED light source 100 and lens 200 on the circuit substrate 2 via the solder pads 140, with the mounting surfaces being flush.

[0068] In some embodiments, see Figure 3 Before assembling the LED light source 100, the following steps are also included: S50: a semi-transparent reflective layer 300 is provided on the inner surface of the mounting cavity 210; when assembling the LED light source 100, the LED light source 100 is inserted into the mounting cavity 210 starting from the light emitting end, and the LED light source 100 is arranged opposite the semi-transparent reflective layer 300 along its optical axis; the semi-transparent reflective layer 300 is used to reflect at least part of the light emitted by the LED light source 100 along its axial direction to the side.

[0069] Specifically, the mounting cavity 210 has a bottom opening for inserting the LED light source 100 into the mounting cavity 210. The translucent reflective layer 300 is disposed on the inner surface of the top wall of the mounting cavity 210, which is the inner surface of the side of the top wall that is disposed opposite the bottom opening of the mounting cavity 210.

[0070] It should be noted that the inner surface of the top wall and the bottom opening of the mounting cavity 210 are the orientations when the lens 200 is placed vertically. When the lens 200 is placed horizontally, the inner surface of the top wall and the bottom opening of the mounting cavity 210 are two positions of the mounting cavity 210 along the horizontal direction.

[0071] In addition, it should be noted that the optical axis direction of the LED light source 100 refers to the main direction of light emitted by the LED light source 100, that is, the direction in which the light is most concentrated and has the greatest intensity. In this embodiment, by providing a semi-transparent reflective layer 300 in the direction of the optical axis of the LED light source 100, the semi-transparent reflective layer 300 can block the light propagating along the axial direction of the LED light source 100, causing part of the light originally propagating vertically upward to be reflected, changing its propagation direction and propagating more to the side. This further increases the side light intensity ratio, achieves a wider light emission angle, and optimizes the lighting uniformity and coverage of the TV backlight.

[0072] In some embodiments, when manufacturing the LED light source 100, an arc-shaped protrusion 131 is formed on the light-emitting end of the LED light source 100 by dispensing glue; a semi-transparent reflective layer 300 is provided on the inner surface of the mounting cavity 210; during assembly, the LED light source 100 is inserted into the mounting cavity 210 starting from the light-emitting end, and the LED light source 100 is arranged directly opposite the semi-transparent reflective layer 300 along its optical axis; the semi-transparent reflective layer 300 is used to reflect at least part of the light emitted by the LED light source 100 along its axis to the side. Such an arrangement not only changes the light propagation path of the LED light source 100 through the arc-shaped protrusion 131, thereby increasing the proportion of light emitted to the side, thereby significantly increasing the light-emitting angle and further improving the lighting effect of the TV backlight; at the same time, the semi-transparent reflective layer 300 can also reflect part of the light originally propagating vertically upward, changing the propagation direction and propagating more to the side, thereby further increasing the side light intensity ratio and further enhancing the wide-angle light emission effect. Compared with traditional solutions, this unique optical design combination can achieve a wider lighting coverage with the same number of lamp beads, providing more uniform and sufficient backlight support for the TV screen. While improving the display effect, it also helps reduce dependence on high-brightness lamp beads, thereby reducing energy consumption.

[0073] In some embodiments, the semi-transparent reflective layer 300 is made of a semi-transparent material, and white granular substances are added to the semi-transparent material to block light, wherein the white granular substances can be granular substances made of materials such as titanium dioxide and zirconium dioxide, so that part of the light can be reflected and part of the light can pass through.

[0074] In some embodiments, the semi-transparent reflective layer 300 is formed by dot coating the inner surface of the top wall of the mounting cavity 210 , which not only simplifies the manufacturing process but also reduces the manufacturing cost.

[0075] Specifically, a precision dispensing device is used to apply an appropriate amount of semi-transparent white glue to form the semi-transparent reflective layer 300. The amount and location of the glue dispensed must be precisely controlled. Preliminary testing and calculations are used to determine the optimal amount and location for a specific lens 200 model to ensure that the semi-transparent reflective layer 300 effectively blocks axial light intensity. It is understood that in other embodiments of the present application, the semi-transparent reflective layer 300 can also be prefabricated and attached to the inner surface of the top wall of the mounting cavity 210 by gluing. For example, a white reflective sheet can be attached to the inner surface of the top wall of the mounting cavity 210.

[0076] In some embodiments, see Figure 3 and Figure 5 The mounting cavity 210 includes a top wall inner surface 213 and a peripheral wall inner surface 214. The top wall inner surface 213 extends along and is perpendicular to the longitudinal direction of the lens 200. The peripheral wall inner surface 214 is connected to a peripheral edge of the top wall inner surface 213. The peripheral wall inner surface 214 and the top wall inner surface 213 together enclose the mounting cavity 210. A semi-transparent reflective layer 300 is provided on the top wall inner surface 213. When assembling the LED light source 100, the arc-shaped protrusion 131 of the LED light source 100 and the peripheral wall inner surface 214 of the mounting cavity 210 cooperate to guide the LED light source 100 into the mounting cavity 210. This ensures that the optical axis of the assembled LED light source 100 is parallel to the longitudinal direction of the lens 200 and perpendicular to the semi-transparent reflective layer 300. This allows the semi-transparent reflective layer 300 to partially reflect the main light emitted by the LED light source 100. It can be understood that in other embodiments of the present application, the inner surface 213 of the top wall of the mounting cavity 210 may not be perpendicular to the optical axis direction of the LED light source 100, but may be at an acute angle or an obtuse angle; in addition, the inner surface 213 of the top wall of the mounting cavity 210 may also be an arc-shaped surface.

[0077] Optionally, the inner surface 214 of the peripheral wall of the mounting cavity 210 has a square cross-section; correspondingly, the cross-section of the LED light source 100 also has a square cross-section, thereby ensuring the stability of the LED light source 100 in the mounting cavity 210. It is understood that in other embodiments, when the cross-section of the LED light source 100 is circular, the cross-section of the mounting cavity 210 can also be set to a circular shape to match the LED light source 100. Furthermore, in other embodiments, when the LED light source 100 does not have the curved protrusion 131, the inner surface 214 of the peripheral wall of the mounting cavity 210 can also be set to a curved shape to change the light propagation path of the LED light source 100.

[0078] In some embodiments, see Figure 3Before assembling the LED light source 100, the following steps are also included: filling the mounting cavity 210 with liquid adhesive 400; when assembling the LED light source 100, inserting the light-emitting end of the LED light source 100 into the mounting cavity 210, and allowing the liquid adhesive 400 to fill the gap between the LED light source 100 and the lens 200. After applying a certain amount of liquid adhesive 400 to the mounting cavity 210 of the lens 200, the LED light source 100 is installed into the mounting cavity 210 of the lens 200 along the optical axis, and the gap between the LED light source 100 and the lens 200 is filled with liquid adhesive 400. The liquid adhesive 400 is then cured, firmly bonding the LED light source 100 to the lens 200. This process is relatively simple and eliminates the complex step of directly dispensing adhesive on the circuit substrate 2. In terms of production efficiency, the lens 200 of uniform shape is first manufactured, and then the LED light source 100 is installed in the mounting cavity 210 of the lens 200 and fixed by liquid adhesive 400. This simplifies the complex process of directly mounting the LED light source 100 on the circuit substrate 2 and dispensing glue, reduces the number of operating steps, reduces the probability of errors in the production process, and improves overall production efficiency. Taking large-scale production as an example, compared with traditional processes, it can save about 20% of production time, greatly improve production capacity, and be able to meet market demand more quickly. In addition, product quality stability has also been significantly improved. The lens 200 is made using a high-precision mold with high shape consistency, avoiding the shape difference problem caused by traditional dispensing methods. At the same time, the LED light source 100 and the lens 200 are firmly combined by liquid adhesive 400, and the large-sized solder pad 140 is convenient for firm mounting on the circuit substrate 2, making the structure of the entire backlight assembly more stable.

[0079] During operation, a precision dispensing device can be used to apply an appropriate amount of liquid adhesive 400 to the mounting cavity 210. Specifically, the amount of adhesive dispensed can be precisely controlled based on the size of the mounting cavity 210 for the lens 200 and the size of the LED light source 100, ensuring that after the LED light source 100 is installed, the liquid adhesive 400 just fills the gap between the lens 200 and the LED light source 100 without overflowing. It is understood that in other embodiments, optical adhesive can also be used to fill the gap between the lens 200 and the LED light source 100.

[0080] In some embodiments, the method for manufacturing a light emitting structure includes the following steps:

[0081] S11: injecting silicone or epoxy glue into a high-precision mold, and forming a lens 200 having a mounting cavity 210 by injection molding under preset temperature and preset pressure conditions;

[0082] S12: After the lens 200 is fixed, the lens 200 is demoulded and the appearance and size of the lens 200 are strictly inspected to ensure that the shape of the lens 200 and the shape and size of the mounting cavity 210 meet the design requirements, and unqualified products are rejected;

[0083] S40, providing an LED light source 100, and forming an arc-shaped protrusion 131 on the light-emitting end of the LED light source 100 by dispensing glue;

[0084] S50: Using precision dispensing equipment to apply an appropriate amount of semi-transparent reflective layer 300 on the inner surface of the mounting cavity 210;

[0085] S60: Using precision dispensing equipment, apply an appropriate amount of liquid adhesive 400 to the mounting cavity 210 of the lens 200 that has been coated with the semi-transparent reflective layer 300 and has passed inspection;

[0086] S70: Using a high-precision robotic arm or fixture, align the curved protrusion 131 of the LED light source 100 along the optical axis with the mounting cavity 210 of the lens 200 and slowly insert it. During the installation process, the curved protrusion 131 is used to guide the LED light source 100 into position, improving installation efficiency and accuracy.

[0087] S80: Place the lens 200 with the LED light source 100 in a curing machine. Set the temperature and time parameters according to the curing requirements of the liquid adhesive 400. For example, cure at 150°C-180°C for 0.5-2.0 hours to fully cure the liquid adhesive 400 and securely bond the LED light source 100 to the lens 200. After curing, inspect the appearance and dimensions of the bonded structure to ensure there are no defects such as deformation or bubbles.

[0088] Second, see Figure 7 The present invention also provides a method for manufacturing a light-emitting device, comprising the following steps:

[0089] S100: Manufacturing a plurality of light-emitting structures 1 by the above-mentioned light-emitting device manufacturing method;

[0090] S200 : mounting each light emitting structure 1 on the circuit substrate 2 via the solder pads 140 of the LED light source 100 .

[0091] The light emitting structure 1 is manufactured in the above-mentioned manner. The LED light source 100 in the light emitting structure 1 has a soldering pad 140 that is large enough for SMT mounting, and the light emitting structure 1 is mounted on the circuit substrate 2 via the soldering pad 140 .

[0092] The light-emitting device manufacturing method of the present application manufactures the light-emitting structure 1 through the above-mentioned light-emitting structure manufacturing method, and mounts each light-emitting structure 1 as a whole on the circuit substrate 2, which not only improves the manufacturing efficiency of the light-emitting device, but also improves the manufacturing quality of the light-emitting device.

[0093] In a third aspect, the present application further provides a light emitting structure 1, which is manufactured using the above light emitting structure manufacturing method. Figures 1 to 4 , the light-emitting structure 1 provided in an embodiment of the present application is now described.

[0094] The light-emitting structure 1 includes a lens 200 and an LED light source 100. The lens 200 has a mounting cavity 210 with an opening on one side. At least the light-emitting end of the LED light source 100 extends into the mounting cavity 210, and the LED light source 100 is fixedly connected to the lens 200. The LED light source 100 has a solder pad 140 for mounting on a circuit substrate 2.

[0095] In some embodiments, see Figure 4 The light-emitting end of the LED light source 100 has a curved protrusion 131, which cooperates with the inner surface of the sidewall of the mounting cavity 210 to guide the LED light source 100 into the mounting cavity 210. The provision of the curved protrusion 131 not only guides the LED light source 100 into the mounting cavity 210, thereby improving the assembly efficiency and accuracy of the LED light source 100, but also changes the light propagation path of the LED light source 100, increasing the proportion of light emitted to the side, thereby significantly increasing the light emission angle and further improving the lighting effect of the TV backlight.

[0096] In some embodiments, see Figure 3 A translucent reflective layer 300 is disposed within the mounting cavity 210. The LED light source 100 faces the translucent reflective layer 300 along its optical axis. The translucent reflective layer 300 is configured to reflect at least a portion of the light emitted by the LED light source 100 along its axial direction laterally. The translucent reflective layer 300 blocks the axially propagating light from the LED light source 100, reflecting a portion of the light originally propagating vertically upward, redirecting it more laterally. This further increases the proportion of lateral light intensity, achieves a wider luminous angle, and optimizes the illumination uniformity and coverage of the TV backlight.

[0097] In some embodiments, see Figure 3 The mounting cavity 210 is filled with liquid adhesive 400, and the LED light source 100 is fixed to the lens 200 by the liquid adhesive 400. The liquid adhesive 400 can improve the connection stability between the LED light source 100 and the lens 200.

[0098] For the fourth aspect, please refer to Figure 1 and Figure 2 The present invention provides a light-emitting device comprising a circuit substrate 2 and a plurality of light-emitting structures 1. The light-emitting structures 1 are mounted on the circuit substrate 2 via solder pads 140 of an LED light source 100. When there are multiple light-emitting structures 1, the light-emitting structures 1 are regularly distributed on the circuit substrate 2 to form the light-emitting device.

[0099] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A method for manufacturing a light-emitting structure, characterized in that: The steps include: Making a lens, wherein the lens has a mounting cavity with an opening on one side; Making an LED light source, the LED light source having a solder pad for mounting on a circuit substrate; Assemble the LED light source, insert the LED light source into the installation cavity starting from the light emitting end, and fix the LED light source to the lens.

2. The method for manufacturing a light emitting structure according to claim 1, wherein: The manufacturing of the lens comprises: injecting silica gel or epoxy glue raw materials into a high-precision mold, and forming a lens with a mounting cavity by injection molding according to a preset temperature and a preset pressure.

3. The method for manufacturing a light emitting structure according to claim 1, wherein: The manufacturing of the LED light source comprises: forming an arc-shaped protrusion at the light-emitting end of the LED light source by dispensing glue; When assembling the LED light source, the arc-shaped protrusion is matched with the inner surface of the side wall of the installation cavity to guide the LED light source to be inserted into the installation cavity.

4. The method for manufacturing a light emitting structure according to any one of claims 1 to 3, wherein: Before assembling the LED light source, the following steps are also included: providing a semi-transparent reflective layer on the inner surface of the mounting cavity; When assembling the LED light source, insert the LED light source into the mounting cavity starting from the light emitting end, and make the LED light source face the semi-transparent reflective layer along its optical axis; the semi-transparent reflective layer is used to reflect at least part of the light emitted by the LED light source along its axial direction to the side.

5. The method for manufacturing a light emitting structure according to any one of claims 1 to 3, wherein: Before assembling the LED light source, the following steps are also included: Filling the installation cavity with liquid adhesive; When assembling the LED light source, the LED light source is inserted into the installation cavity starting from the light emitting end, and the liquid adhesive fills the gap between the LED light source and the lens.

6. A method for manufacturing a light emitting device, characterized in that: The steps include: Fabricate a plurality of light-emitting structures by the light-emitting structure fabrication method according to any one of claims 1 to 5; Each of the light-emitting structures is mounted on a circuit substrate through the soldering pads of the LED light source.

7. A light-emitting structure, characterized in that: The light-emitting structure is manufactured using the light-emitting structure manufacturing method according to any one of claims 1 to 5, wherein the light-emitting structure includes a lens and an LED light source, the lens has a mounting cavity with an opening on one side, at least the light-emitting end of the LED light source is inserted into the mounting cavity, the LED light source is fixed to the lens, and the LED light source has a solder pad for mounting on a circuit substrate.

8. The light emitting structure according to claim 7, wherein: The light emitting end of the LED light source has an arc-shaped protrusion, and the arc-shaped protrusion is used to cooperate with the inner surface of the side wall of the installation cavity to guide the LED light source to be inserted into the installation cavity; And / or, a semi-transparent reflective layer is provided in the installation cavity, and the LED light source is facing the semi-transparent reflective layer along its optical axis; the semi-transparent reflective layer is used to reflect at least part of the light emitted by the LED light source along its axial direction to the side.

9. The light emitting structure according to claim 7, wherein: The mounting cavity is filled with liquid adhesive, and the LED light source is fixed to the lens through the liquid adhesive.

10. A light emitting device, characterized in that: It comprises a circuit substrate and a plurality of light-emitting structures according to any one of claims 7 to 9, wherein each of the light-emitting structures is mounted on the circuit substrate via a soldering pad of the LED light source.

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