Manufacturing method of LED display module, LED display module and LED display screen

Abstract

The invention relates to the technical field of display screen manufacturing, in particular to a manufacturing method of an LED display module, the LED display module and an LED display screen. According to the manufacturing method of the LED display module, the LED basic display assembly needs to be obtained firstly; performing photoresist coating spraying operation on the LED basic display assembly so as to spray and cover the light-transmitting part and the middle part with the prepared photoresist coating to form a photoresist coating layer; baking and curing the LED basic display assembly covered with the photoresist coating layer; determining information of a plurality of light-transmitting holes, matched with a plurality of light-transmitting parts of the LED basic display assembly, in the photoresist coating layer; and performing laser etching operation on the photoresist coating layer based on the light hole information to obtain the LED display module. The LED display module manufactured according to the manufacturing method of the LED display module is high in yield, and the LED display module also has good ink color consistency and a good LED light emitting effect.

Description

Technical Field

[0001] The present application relates to the technical field of display screen manufacturing, and in particular to a method for manufacturing an LED display module, an LED display module, and an LED display screen. Background Art

[0002] Due to their self-luminous properties, LED displays offer significant advantages over LCDs in terms of brightness, contrast, color rendering, response speed, dynamic performance, power consumption, lifespan, and splicing flexibility. Despite continuous breakthroughs in upstream processes, inconsistent ink color in downstream processes has long plagued display manufacturers.

[0003] The problem of inconsistent ink color mainly stems from the fact that LED displays are composed of multiple display modules. During the manufacturing process, there are differences in the color of the PCB substrate, the color of the LED lamp package, the saturation of the GOB / epoxy package, and the curing temperature. This leads to color inconsistencies between batch-produced LED display modules. When these LED display modules are spliced ​​into a large screen, color blocks with inconsistent depths, similar to a mosaic, appear, affecting the visual effect of the LED display when the screen is off. Although applying a uniform coating to the top surface of these LED display modules and the areas between adjacent LED display modules and intentionally leaving light-emitting holes for each LED display module during coating may solve this problem, due to the small size of LED display modules, existing processes make it difficult to ensure that uniform and beautiful light-emitting holes are left for each LED display module. In the field of LED display module processing, there is a technical prejudice that etching technology is difficult to apply to LED display modules because the LED display modules are too small and the stress generated during etching will damage the LED display modules. Summary of the Invention

[0004] The present application aims to solve at least one of the technical problems existing in the related art. To this end, the present application proposes a method for manufacturing an LED display module, an LED display module, and an LED display screen, which can enhance the ink color consistency of the LED display module and have a better LED lighting effect.

[0005] According to the first embodiment of the present application, a method for manufacturing an LED display module includes:

[0006] Obtain an LED basic display assembly; wherein the LED basic display assembly includes a printed circuit board, a plurality of LED light-emitting chips, and a light-transmitting portion, wherein the printed circuit board is provided with a plurality of chip mounting positions, each of the LED light-emitting chips is mounted in a corresponding chip mounting position, and the light-transmitting portion covers each of the LED light-emitting chips;

[0007] Performing a photoresist coating operation on the LED basic display assembly to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer, wherein the middle portion is a portion between two adjacent light-transmitting portions on the printed circuit board;

[0008] Performing a baking and curing process on the LED basic display component covered with the photoresist coating layer;

[0009] Determining information of a plurality of light-transmitting holes in the photoresist coating layer, which respectively match the plurality of light-transmitting portions of the LED basic display component;

[0010] The photoresist coating layer is laser etched based on the light-transmitting hole information to obtain an LED display module; wherein the photoresist coating layer has a light-transmitting hole formed by the laser etching operation above the light-transmitting portion, and the light-transmitting hole exposes the light-transmitting portion.

[0011] According to some embodiments of the present application, performing a laser etching operation on the photoresist coating layer based on the light-transmitting hole information to obtain an LED display module includes:

[0012] Obtaining a wavelength absorption interval of a basic component corresponding to the LED basic display component and a wavelength absorption interval of a coating corresponding to the photoresist coating layer;

[0013] Determining a target wavelength based on the wavelength absorption range of the basic component and the wavelength absorption range of the coating; wherein the target wavelength falls within the wavelength absorption range of the coating but not within the wavelength absorption range of the basic component;

[0014] A laser line matching the target wavelength is formed by a laser, and the laser line is controlled to perform a laser etching operation on the photoresist coating layer based on the light-transmitting hole information to obtain the LED display module.

[0015] According to some embodiments of the present application, performing a photoresist coating spraying operation on the LED basic display assembly to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer includes:

[0016] Determine the black prefabricated material as the photoresist coating; wherein the black prefabricated material includes black ink and epoxy-based material;

[0017] The photoresist coating is evenly sprayed on the printed circuit board and the light-transmitting portion to form the photoresist coating layer; wherein the thickness of the photoresist coating layer falls within a preset coating layer thickness range.

[0018] According to some embodiments of the present application, the step of forming a laser line matching the target wavelength by a laser and controlling the laser line to perform a laser etching operation on the photoresist coating layer based on the light-transmitting hole information to obtain the LED display module includes:

[0019] Generating an ultraviolet laser line matching the target wavelength by a laser; wherein the target wavelength is less than 300 nm;

[0020] The ultraviolet laser line is controlled to irradiate the black ink corresponding to the light-transmitting hole information to peel the black ink from the photoresist coating layer to obtain the LED display module.

[0021] According to some embodiments of the present application, performing a laser etching operation on the photoresist coating layer based on the light-transmitting hole information to obtain an LED display module includes:

[0022] performing a laser etching operation on the photoresist coating layer based on the light-transmitting hole information;

[0023] After performing a laser etching operation on the photoresist coating layer, performing a protective coating spraying operation on the LED basic display assembly to spray a pre-prepared transparent protective coating over the photoresist coating layer to form a transparent protective layer;

[0024] The LED basic display component covered with the transparent protective layer is subjected to a baking and curing process to obtain the LED display module.

[0025] According to some embodiments of the present application, determining information of a plurality of light-transmitting holes in the photoresist coating layer that respectively match the plurality of light-transmitting portions of the LED basic display assembly includes:

[0026] Based on each of the light-transmitting portions of the LED basic display assembly, a first boundary point and a second boundary point of each of the light-transmitting hole information are determined on the photoresist coating layer; wherein the first boundary point is an intersection point of a first line and an upper edge of the transparent protective layer, and the second boundary point is an intersection point of a second line and an upper edge of the transparent protective layer, the first line is an edge line of a light path of the LED light-emitting chip, the second line is an edge line of another light path of the LED light-emitting chip, and the first line and the second line are symmetrical about an axis of the LED light-emitting chip;

[0027] Determining light transmission hole orientation parameters and light transmission hole size parameters based on the first boundary point and the second boundary point;

[0028] The light hole information is determined according to the light hole orientation parameter and the light hole size parameter.

[0029] According to some embodiments of the present application, the step of baking and curing the LED basic display assembly covered with the photoresist coating layer includes:

[0030] Setting baking conditions for the tunnel oven based on a preset baking temperature range and a preset baking time range;

[0031] The LED basic display assembly covered with the photoresist coating layer is sent into the tunnel furnace, and the tunnel furnace is controlled according to the baking conditions to perform baking and curing treatment on the photoresist coating layer.

[0032] According to some embodiments of the present application, before performing a photoresist coating spraying operation on the LED basic display assembly to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer, the method further includes:

[0033] Obtaining waste LED display components, the photoresist coating, and an originally written spraying operation control program;

[0034] Performing a photoresist coating spraying operation on the waste LED display assembly according to the spraying operation control program, so as to spray the photoresist coating over the printed circuit board and the light-transmitting portion of the waste LED display assembly to form a test coating layer;

[0035] Performing a spraying consistency test on the test coating layer to obtain a spraying consistency test result;

[0036] In the case where the spraying consistency test result does not meet the preset consistency test condition, the spraying operation control program is debugged, and according to the debugged spraying operation control program, the photoresist coating spraying operation is returned to be executed on the waste LED display assembly according to the spraying operation control program until the spraying consistency test result of the test coating layer meets the preset consistency test condition, and the corresponding spraying operation control program is determined as the target control program;

[0037] The photoresist coating spraying operation is performed on the LED basic display assembly to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer, including:

[0038] A photoresist coating spraying operation is performed on the LED basic display assembly according to the target control program, so that the pre-prepared photoresist coating is sprayed to cover the light-transmitting portion and the middle portion to form the photoresist coating layer.

[0039] In a second aspect, an embodiment of the present application provides an LED display module, which is manufactured by the manufacturing method described in any one of the embodiments of the first aspect of the present application.

[0040] In a third aspect, an embodiment of the present application provides an LED display screen, which is formed by splicing the LED display modules described in the embodiment of the second aspect of the present application.

[0041] The manufacturing method of the LED display module, the LED display module, and the LED display screen according to the embodiments of the present application have at least the following beneficial effects:

[0042] The present invention overcomes the technical prejudice that stress generated by etching technology applied to LED display modules will damage the structure of the LED display modules. Through extensive experiments, it was found that if, instead of directly etching the surface of the LED display module, a photoresist coating layer is formed on the surface of the LED display module, the photoresist coating layer is then baked and cured, and then etching is performed on the photoresist coating layer, the structure of the LED display module will not be damaged. The inventors of this application formed a photoresist coating layer on 1,000 LED display modules and then etched the photoresist coating layer to form light exit holes. The etching success rate reached 98.3%, overcoming the prejudice in the industry. In addition, because a uniform photoresist coating layer is formed above the light-transmitting portion and the middle portion of the LED display module, the middle portion is the portion between two adjacent light-transmitting portions on the printed circuit board. This prevents the uneven color blocks that appear between the individual LED display modules when the LED display modules are spliced ​​into a large screen, improves the visual effect of the LED display screen when the screen is off, enhances the ink color consistency of the LED display module, and the etched light exit holes give the LED display module a better LED lighting effect.

[0043] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0045] Figure 1 A schematic diagram of a process for manufacturing an LED display module according to an embodiment of the present application;

[0046] Figure 2 This is a structural diagram of an LED display module in an embodiment of the present application;

[0047] Figure 3 This is another structural schematic diagram of the LED display module in the embodiment of the present application;

[0048] Figure 4 This is a schematic diagram of the structure of an LED lamp bead in an embodiment of the present application;

[0049] Figure 5 A schematic structural diagram of an LED display module including LED lamp beads in an embodiment of the present application;

[0050] Figure 6 This is another structural schematic diagram of an LED display module including LED lamp beads in an embodiment of the present application;

[0051] Figure 7 This is a structural diagram of an LED display module including LED lamp beads and a transparent protective layer in an embodiment of the present application;

[0052] Figure 8 This is a structural diagram of an LED display module including LED lamp beads, a transition layer and a transparent protective layer in an embodiment of the present application;

[0053] Figure 9 This is a structural diagram of an LED display screen in an embodiment of the present application.

[0054] Figure 10 A schematic diagram of a geometric relationship of light-transmitting holes in an LED display module according to an embodiment of the present application;

[0055] Figure 11 Schematic diagram of another geometric relationship of light-transmitting holes in the LED display module of the embodiment of the present application;

[0056] Figure 12 This is an absorption spectrum of the epoxy resin provided in the examples of this application. DETAILED DESCRIPTION

[0057] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0058] In the description of this application, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The terms "first" and "second" are used solely to distinguish technical features and are not to be construed as indicating or implying relative importance, or as implicitly specifying the number or order of the technical features indicated.

[0059] In the description of this application, it should be understood that descriptions involving orientations, such as up, down, left, right, front, and back, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0060] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0061] In the description of this application, it should be noted that, unless otherwise explicitly defined, terms such as "set," "install," and "connect" should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution. In addition, the identification of specific steps below does not represent a limitation on the order of steps and execution logic. The execution order and execution logic between each step should be understood and inferred with reference to the content described in the embodiments.

[0062] LED displays, or light-emitting diode displays, are devices that display text, images, animations, videos, and other information by controlling semiconductor light-emitting diodes. They offer numerous advantages, including high brightness, strong contrast, rich colors, fast response, wide viewing angles, and a long lifespan, making them widely used in numerous fields.

[0063] The modular design of LED displays allows for flexible splicing into a variety of shapes and sizes to suit the needs of different locations. Whether it's a large outdoor billboard or a small indoor display, splicing can be achieved. Therefore, the splicing nature of LED displays makes them a flexible, efficient, and reliable display solution suitable for a wide range of application scenarios and needs.

[0064] In LED display manufacturing, SMT (Surface Mount Technology) is primarily used to mount electronic components, such as LED lamp beads, onto PCBs (Printed Circuit Boards) through a patch process. This technology enables LED displays to achieve higher production efficiency and product consistency.

[0065] GOB (Glass-substrate On Board) technology directly packages LED chips onto a glass substrate to form an LED display module. This technology enables smaller pixel pitch and higher display performance, making it suitable for the manufacture of Mini LED and Micro LED displays.

[0066] Chip on Board (COB) technology directly bonds LED chips to a substrate and protects them with encapsulation adhesive. This technology enables higher integration and better display quality, making it suitable for the manufacture of high-end LED displays.

[0067] Although LED displays have made breakthroughs in upstream processes such as COB die bonding and packaging, and micro-processing, the problem of inconsistent ink color in downstream processes has long plagued display manufacturers.

[0068] It's important to note that the problem of inconsistent ink color primarily stems from the fact that LED displays are composed of multiple display modules. During the manufacturing process, variations in PCB substrate color, LED package color, GOB / epoxy package saturation, and curing temperature can occur, leading to color inconsistencies between batches of LED display modules. When these LED display modules are assembled into a large screen, inconsistent color blocks, similar to mosaics, appear, commonly known as the "tofu block phenomenon," affecting the visual quality of the LED display when it's off.

[0069] To solve this problem, the industry has tried many methods.

[0070] For SMT products, the current technology involves spraying a layer of ink between the gaps between the LED lamps in the module. However, this process is inefficient and only improves the ink color of the PCB substrate between the lamps, without changing the color of the LED lamp package. Another method is to spray a layer of black coating liquid, but this will cause the LED screen to lose more than 30% of its brightness. While this improves color consistency, it has a low yield rate and high costs.

[0071] For GOB products, one method is to spray ink between the gaps between the LED lamps, but like SMT products, this does not improve the color of the LED lamp package. Another method is to spray a layer of black film on the surface, but this will result in 20% to 40% light decay, and the color of the black film itself is not consistent.

[0072] For COB products, the relevant technology uses black glue or a layer of black film on the surface to cover the background color difference, but this process will cause 40% to 70% light attenuation, and there are batch differences between black glue and black film, which cannot be consistent.

[0073] One solution in the related art is to apply a uniform coating on the upper surface of the LED display module and the part between adjacent modules, and deliberately leave light-emitting holes during the coating process so that light can be emitted normally. The purpose of this method is to cover the color differences between different modules through the coating, thereby reducing visual inconsistencies when spliced ​​into a large screen. However, due to the small size of the LED display module, it is difficult to accurately control the coating range and thickness of the coating with the existing process level. In particular, when leaving light-emitting holes, it is difficult to ensure that the size and position of each hole are uniform. This not only affects the aesthetics of the module, but may also lead to uneven light transmittance, thereby affecting the display effect.

[0074] Furthermore, while etching technology is an alternative material removal method, there is a technical prejudice in the LED display module processing field that traditional etching technology is difficult to apply to small-sized LED display modules. This prejudice stems from the stress that may be generated during the etching process, which may damage the structural integrity of the module. Especially when dealing with delicate LED chips and fragile PCB circuits, any slight stress can cause component damage. Therefore, despite the wide application of etching technology in other fields, its application in LED display module production is limited.

[0075] It can be seen that the current relevant technologies have many limitations in solving the problem of ink color differences among LED display modules. It is impossible to completely eradicate the color differences between modules, resulting in different shades of color in space after splicing into a large screen, affecting the overall visual effect of the display.

[0076] The present application aims to solve at least one of the technical problems existing in the related art. To this end, the present application proposes a method for manufacturing an LED display module, an LED display module, and an LED display screen, which can enhance the ink color consistency of the LED display module and have a better LED lighting effect.

[0077] The present application will be further described below based on the accompanying drawings.

[0078] Reference Figure 1 According to the manufacturing method of the LED display module in the embodiment of the present application, the method may include:

[0079] Step S101, obtaining an LED basic display assembly; wherein the LED basic display assembly includes a printed circuit board, a plurality of LED light-emitting chips, and a light-transmitting portion, wherein the printed circuit board is provided with a plurality of chip mounting locations, each LED light-emitting chip is mounted in a corresponding chip mounting location, and the light-transmitting portion covers each LED light-emitting chip;

[0080] Step S102: performing a photoresist coating spraying operation on the LED basic display assembly to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer, wherein the middle portion is the portion between two adjacent light-transmitting portions on the printed circuit board;

[0081] Step S103, performing a baking and curing process on the LED basic display component covered with the photoresist coating layer;

[0082] Step S104, determining information of a plurality of light-transmitting holes in the photoresist coating layer, which respectively match a plurality of light-transmitting portions of the LED basic display assembly;

[0083] Step S105 , performing laser etching on the photoresist coating layer based on the light-transmitting hole information to obtain an LED display module; wherein the photoresist coating layer has a light-transmitting hole formed by the laser etching operation above the light-transmitting portion, and the light-transmitting hole exposes the light-transmitting portion.

[0084] The embodiments of the present application successfully overcome a common technical bias in the field of LED display module processing. This technical bias refers to the industry's general belief that etching technology is difficult to apply to small-sized LED display modules because the stress generated during the etching process may damage the module structure.

[0085] However, through extensive experimental research, the present applicants have discovered that instead of etching directly on the surface of an LED display module, a photoresist coating is first formed on the surface and then etched on top of the coating. This avoids damage to the structure of the LED display module. This discovery challenges conventional wisdom within the industry and provides a new technical approach to solving the problem of inconsistent ink color in LED display modules.

[0086] According to some embodiments of the present application, actual operations were carried out on 1,000 LED display modules. First, a photoresist coating layer was formed on the surface of these LED display modules, and then the photoresist coating layer was baked and cured. Then, light-emitting holes were formed by etching the coating layer. The experimental results showed that the etching success rate was as high as 98.3%. This high success rate fully demonstrated the feasibility and effectiveness of the manufacturing method of the LED display module of the embodiment of the present application. This result not only verifies the reliability of the technical solution, but also shows that the manufacturing method of the LED display module of the embodiment of the present application can be stably applied to the manufacture of LED display modules in mass production, thereby improving production efficiency and product yield.

[0087] In addition, the manufacturing method of the LED display module of the embodiment of the present application also plays an important role in improving the ink color consistency and display effect of the LED display module. By forming a uniform photoresist coating layer above the light-transmitting portion and the middle portion, the middle portion is the area between two adjacent light-transmitting portions on the printed circuit board, and effectively shielding the color blocks of varying shades that may appear between the modules when the modules are spliced ​​into a large screen. This significantly improves the visual effect of the LED display screen when the screen is off, making the entire screen appear uniformly dark ink when not in use, enhancing the visual beauty and professionalism.

[0088] The embodiments of the present application also provide an LED display module, which is manufactured by the manufacturing method of any one of the embodiments of the present application.

[0089] It should be understood that the contents of the above-mentioned LED display module manufacturing method embodiment are applicable to the embodiment of this LED display screen. The functions specifically implemented by this LED display screen embodiment are the same as those of the above-mentioned LED display module manufacturing method embodiment, and the beneficial effects achieved are also the same as those achieved by the above-mentioned LED display module manufacturing method embodiment.

[0090] Reference Figure 2 According to an embodiment of the present application, the LED display module may include:

[0091] A printed circuit board, wherein a plurality of chip mounting positions are provided on the printed circuit board;

[0092] A plurality of LED light-emitting chips are respectively mounted on a plurality of chip mounting positions;

[0093] The light-transmitting part is wrapped around the LED light-emitting chip;

[0094] The photoresist coating layer covers the printed circuit board, and has a light-transmitting hole above the light-transmitting portion. The light-transmitting hole exposes the light-transmitting portion, and the photoresist coating layer is sealed above the middle portion, which is the portion between adjacent LED light-emitting chips.

[0095] Reference Figure 3 According to some embodiments of the present application, the light-transmitting portion integrally covers the LED light-emitting chip and the middle portion, and the photoresist coating layer seals the area of ​​the light-transmitting portion above the middle portion.

[0096] It should be noted that the light-transmitting portion integrally covers the LED light-emitting chip and the middle portion, which can ensure that when light passes through the LED light-emitting chip, it passes through a uniform medium, thereby reducing the scattering and reflection of light during the propagation process. This design helps to improve the uniformity and consistency of light, making the entire LED display screen visually smoother and more uniform. The photoresist coating layer is sealed in the area above the middle portion of the light-transmitting portion, so that the LED display module has better ink color consistency. The uniform coating of the photoresist coating layer can ensure that the light absorption and reflection characteristics around each LED light-emitting chip remain consistent, avoiding the color difference problem caused by the scattering and reflection of light in the non-luminous area. This sealing design can also prevent external light from interfering with the LED light-emitting chip, improving the display effect of the LED display module under different lighting conditions. In this way, the embodiment of the present application not only ensures ink color consistency, but also has a better LED lighting effect.

[0097] It should be understood that there are many ways to wrap the light-transmitting portion on the surface of the LED light-emitting chip, which are not limited to the above examples.

[0098] It is worth noting that Figure 2 and Figure 3 In the structure shown, the LED light-emitting chip can be directly fixed on the chip mounting position of the printed circuit board.

[0099] Reference Figure 4 In other embodiments, the LED lamp bead may include an LED light-emitting chip, a light-transmitting portion covering the corresponding LED light-emitting chip, and a lamp bead bracket. The LED lamp bead is fixed to the chip mounting position through the lamp bead bracket so that the LED light-emitting chip is connected to the printed circuit board.

[0100] Reference Figure 5 According to some embodiments of the present application, the photoresist coating layer seals the portion between the edge of the light-transmitting hole on the outer wall of the lamp bead holder and the junction position, where the junction position is the position where the outer wall meets the middle portion.

[0101] Reference Figure 6 According to some embodiments of the present application, there is a transition layer between adjacent LED lamp beads, the transition layer covers the surface of the printed circuit board and the bracket connecting part, the bracket connecting part is located in the connecting area between the lamp bead bracket and the chip mounting position, and the photoresist coating layer is coated on the transition layer and the part between the edge of the light-transmitting hole and the junction position.

[0102] Reference Figure 7 According to some embodiments of the present application, a transparent protective layer is provided above the printed circuit board, the transparent protective layer covers the LED lamp beads and the middle part, the photoresist coating layer covers the transparent protective layer, and the light-transmitting hole exposes the light-transmitting part through the transparent protective layer.

[0103] Reference Figure 8 According to some embodiments of the present application, a transparent protective layer is provided above the printed circuit board, the transparent protective layer covers the LED lamp beads and the transition layer, the photoresist coating layer covers the transparent protective layer, and the light-transmitting hole exposes the light-transmitting portion through the transparent protective layer.

[0104] It should be understood that the contents of the above-mentioned LED display module manufacturing method embodiment are applicable to the embodiment of this LED display module. The functions specifically implemented by this LED display module embodiment are the same as those of the above-mentioned LED display module manufacturing method embodiment, and the beneficial effects achieved are also the same as those achieved by the above-mentioned LED display module manufacturing method embodiment.

[0105] Reference Figure 9 , an embodiment of the present application provides an LED display screen, which is formed by splicing the LED display modules of the embodiment of the present application.

[0106] It should be noted that the LED display modules of the embodiments of the present application have a high degree of consistency and precision in structural design. Each display module is designed and manufactured to ensure that when spliced ​​into a large screen, the modules can be seamlessly connected to form an overall display effect. Specifically, the optical performance of the LED display module has been optimized. The uniform coating of the all-black photoresist coating layer and the precise setting of the light-transmitting holes ensure that each LED display module has good ink color consistency and light uniformity when emitting light. When multiple modules are spliced ​​into a large screen, the entire screen can present uniform color and brightness, avoiding the mosaic effect or color block inconsistency problem caused by differences between modules. In this way, the LED display screen spliced ​​by LED display modules has good ink color consistency and good LED lighting effect.

[0107] In some embodiments, step S101 involves obtaining an LED basic display assembly, wherein the LED basic display assembly includes a printed circuit board, a plurality of LED light-emitting chips, and a light-transmitting portion, wherein the printed circuit board is provided with a plurality of chip mounting locations, each LED light-emitting chip is mounted in a corresponding chip mounting location, and the light-transmitting portion covers each LED light-emitting chip;

[0108] It's important to note that obtaining a basic LED display assembly is a key step in manufacturing an LED display module. This basic LED display assembly can consist of a printed circuit board (PCB), multiple LED light-emitting chips, and a light-transmitting portion. The PCB, serving as the base of the entire assembly, not only provides physical support for other components but also handles electrical connections and signal transmission. The PCB is designed with multiple chip mounting locations, which precisely arrange the LED light-emitting chip installation layout, ensuring that each chip is positioned correctly to perform its function.

[0109] LED light-emitting chips are the core components of display components. They are installed separately in the chip mounting positions of the printed circuit board. These chips are connected to the circuit board through a sophisticated soldering process to ensure stable electrical connection and signal transmission. Each LED light-emitting chip is an independent light-emitting unit. Their orderly arrangement and coordinated operation constitute the basic display function of the LED display. The light-transmitting part is a protective layer covering each LED light-emitting chip, usually made of transparent or translucent material. The main function of the light-transmitting part is to protect the LED light-emitting chip from damage by external physical and chemical factors, while allowing light to pass through, ensuring that the light emitted by the chip can be effectively transmitted to the surface of the module. In addition, the light-transmitting part can also improve the distribution and uniformity of light to a certain extent, thereby enhancing the display effect.

[0110] In step S102 of some embodiments, a photoresist coating operation is performed on the LED basic display assembly to spray a pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer, wherein the middle portion is a portion between two adjacent light-transmitting portions on the printed circuit board.

[0111] It should be noted that spraying photoresist onto LED display components is a key process in the manufacture of LED display modules. Photoresist is a special material that forms a uniform coating on the surface of the LED display components after spraying, which is crucial for the subsequent etching process. During the spraying operation, the pre-prepared photoresist is precisely sprayed over the light-transmitting portion and the middle portion, where the middle portion refers to the area between two adjacent light-transmitting portions on the printed circuit board.

[0112] It should be pointed out that the spraying of photoresist coating should not only cover the light-transmitting part to ensure that light can pass through, but also cover the middle part, that is, the printed circuit board part between two adjacent light-transmitting parts. This step is intended to provide a uniform base color for the LED display module through the coating of photoresist coating, thereby effectively covering the color differences between different modules and the color of the PCB substrate, and optimizing the visual effect after splicing. In addition, the coating of photoresist coating also provides the basis for the subsequent etching process, because laser etching needs to be performed on the photoresist coating layer to accurately remove the coating in a specific area to form a light-transmitting hole, ensuring that the light of the LED light-emitting chip can be emitted smoothly.

[0113] During the photoresist coating spraying operation in some embodiments, it is necessary to control the coating thickness and uniformity of the photoresist coating. The thickness of the coating needs to be moderate, sufficient to cover the base color, but not too thick to affect the subsequent etching efficiency and transmittance. In addition, the uniformity of the coating is also crucial to the final visual effect and etching accuracy. To achieve this goal, a reciprocating sprayer or a robotic arm spraying device can be used in this process, which can provide precise control to ensure the uniform distribution of the photoresist coating on the surface of the LED base display component.

[0114] According to some embodiments of the present application, before performing a photoresist coating spraying operation on the LED basic display assembly in step S102 to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form the photoresist coating layer, the following steps may also be included:

[0115] Step S201, obtaining waste LED display components, photoresist coatings and an originally written spraying operation control program;

[0116] Step S202: performing a photoresist coating spraying operation on the waste LED display assembly according to a spraying operation control program, so as to spray the photoresist coating over the printed circuit board and the light-transmitting portion of the waste LED display assembly to form a test coating layer;

[0117] Step S203, performing a spraying consistency test on the test coating layer to obtain a spraying consistency test result;

[0118] Step S204: If the spraying consistency test result does not meet the preset consistency test condition, the spraying operation control program is debugged, and according to the debugged spraying operation control program, the photoresist coating spraying operation is executed on the waste LED display assembly according to the spraying operation control program until the spraying consistency test result of the test coating layer meets the preset consistency test condition, and the corresponding spraying operation control program is determined as the target control program;

[0119] In step S102, a photoresist coating spraying operation is performed on the LED basic display assembly to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer, which may include:

[0120] Step S205 , performing a photoresist coating spraying operation on the LED basic display component according to the target control program, so as to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer.

[0121] In some embodiments of the present application, in order to ensure the accuracy and consistency of the photoresist coating spraying operation, a series of testing and debugging steps may be performed before the LED basic display assembly is formally sprayed.

[0122] In some embodiments, steps S201 to S202 include obtaining a waste LED display assembly, a photoresist coating, and an originally written spraying operation control program, and performing a photoresist coating spraying operation on the waste LED display assembly according to the spraying operation control program, so as to spray the photoresist coating onto the printed circuit board and the light-transmitting portion of the waste LED display assembly to form a test coating layer.

[0123] It should be noted that waste LED display components, photoresist coatings, and the original spraying operation control program were obtained. By using waste LED display components as test objects, the spraying process can be optimized and verified without wasting new components. Furthermore, according to the original spraying operation control program, the photoresist coating spraying operation is performed on the waste LED display components to form a test coating layer. This process is intended to simulate the spraying conditions in actual production in order to observe and evaluate the spraying effect. By conducting experiments on waste components, it is possible to preliminarily determine whether the spraying parameters, such as spraying speed, spraying pressure, coating range, etc., are reasonable.

[0124] In some embodiments, steps S203 to S204 perform a spray consistency test on the test coating layer to obtain a spray consistency test result; if the spray consistency test result does not meet a preset consistency test condition, debug the spray operation control program, and return to executing the photoresist coating spray operation on the waste LED display component according to the spray operation control program according to the debugged spray operation control program until the spray consistency test result of the test coating layer meets the preset consistency test condition, and determine the corresponding spray operation control program as the target control program;

[0125] It should be noted that the formed test coating layer is subjected to a spray consistency test. This step uses professional testing equipment or methods to evaluate the uniformity and coverage of the test coating layer. The test results will reveal possible problems in the spraying process, such as uneven coating thickness, incomplete coverage or overspray. If the test results do not meet the preset consistency test conditions, the spray operation control program needs to be debugged. This may include adjusting the parameters of the spraying equipment, such as changing the spraying speed, adjusting the nozzle pressure or modifying the spray trajectory. According to the debugged program, the spray test is carried out again on the LED waste display component, and the spray consistency test is repeated until the test results of the test coating layer meet the preset conditions. This iterative process ensures the accuracy and reliability of the spraying operation and provides verified spray parameters for formal production. Once the debugging is completed and a set of operation control procedures that can produce satisfactory spraying effects are determined, this set of procedures is identified as the target control procedure.

[0126] In step S205 of some embodiments, a photoresist coating spraying operation is performed on the LED basic display component according to the target control program, so as to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer.

[0127] It should be noted that the target control program obtained in the above steps is used to perform the photoresist coating spraying operation on the LED basic display component. This ensures that the photoresist coating is evenly sprayed and covers the upper part of the light-transmitting portion and the middle portion, forming a high-quality photoresist coating layer, thereby laying a good foundation for the subsequent laser etching step. Through this test and debugging process, the embodiments of the present application can effectively improve production efficiency, reduce production costs, and ensure the quality and performance of the final product.

[0128] According to some embodiments of the present application, step S102 of performing a photoresist coating spraying operation on the LED basic display assembly to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer may include:

[0129] Step S301, determining the black prefabricated material to be a photoresist coating; wherein the black prefabricated material includes black ink and epoxy-based material;

[0130] In step S302 , a photoresist coating is evenly sprayed on the printed circuit board and the transparent portion to form a photoresist coating layer. The thickness of the photoresist coating layer falls within a preset coating layer thickness range.

[0131] In step S301 of some embodiments, the black prefabricated material is determined to be a photoresist coating; wherein the black prefabricated material includes black ink and epoxy-based material;

[0132] It should be noted that performing a photoresist coating spraying operation on LED basic display components is an important process link in the manufacture of LED display modules. Specifically, this step first involves identifying a black prefabricated material as a photoresist coating, wherein the black prefabricated material includes black ink and epoxy-based materials. The selection of this material is based on its excellent hiding power and adhesion, as well as its stability in subsequent processes. Black ink can provide a good shading effect, ensuring that the LED display module presents a uniform and consistent dark ink color when the screen is off, while the epoxy-based material gives the coating high adhesion and chemical corrosion resistance after curing, so that it can remain stable during the subsequent laser etching process and will not peel off or be damaged due to mechanical stress or chemical action.

[0133] In step S302 of some embodiments, a photoresist coating is evenly sprayed on the printed circuit board and the light-transmitting portion to form a photoresist coating layer; wherein the thickness of the photoresist coating layer falls within a preset coating layer thickness range.

[0134] It should be noted that the photoresist coating is evenly sprayed on the printed circuit board and the upper portion of the light-transmitting portion to form a photoresist coating layer. This process can be achieved by using a reciprocating spraying device or a robotic arm spraying device to achieve precise spraying control.

[0135] During spraying, the thickness of the photoresist coating must fall within a predetermined range. This range needs to be thick enough to mask the color variations between the PCB substrate and the light-transmitting portion, ensuring consistent ink color between modules, but not so thick as to affect subsequent laser etching efficiency and transmittance. A uniform coating thickness is crucial to the final visual effect and etching accuracy. It ensures that when assembling a large screen, there are no noticeable color differences between individual LED display modules, while also providing a smooth and uniform surface for subsequent laser etching.

[0136] In some more specific embodiments, the coating layer thickness range is more reasonably between 5 and 10 microns.

[0137] The spraying process from steps S301 to S302 in this embodiment not only forms a uniform photoresist coating layer on the surface of the LED base display component, but also lays the foundation for the subsequent laser etching process. The uniformity and stability of the photoresist coating layer are crucial to ensuring the accuracy and consistency of laser etching, which can effectively improve production efficiency, reduce production costs, and ultimately enhance the overall quality and display effect of the LED display module.

[0138] In step S103 of some embodiments, the LED basic display component covered with the photoresist coating layer is subjected to a baking and curing process;

[0139] It should be noted that baking and curing the LED display assembly covered with a photoresist coating is a critical process step in ensuring a strong, uniform coating. After the photoresist coating is sprayed, the surface of the LED display assembly is covered with a layer of liquid or semi-solid photoresist. At this point, the coating has not yet fully cured, and its physical and chemical properties are not yet stable, making it unable to meet the requirements of subsequent processes. Therefore, the purpose of the baking and curing process is to control the temperature and time to induce physical or chemical changes in the photoresist coating layer, thereby forming a stable coating.

[0140] In some embodiments, the curing process can be performed in a dedicated tunnel oven that provides uniform heat distribution and precise temperature control. In some embodiments, during the curing process, the solvent in the photoresist coating gradually evaporates, which not only reduces the volatile components of the coating but also allows the solid components in the coating to be more tightly bound together. Furthermore, the resin components in the coating undergo a cross-linking reaction, forming a three-dimensional network structure. This structure significantly improves the coating's hardness, adhesion, and chemical resistance, ensuring that the photoresist coating layer will not easily peel or be damaged during subsequent laser etching and other processing.

[0141] Furthermore, the baking and curing process eliminates bubbles and tiny particles in the photoresist coating, further improving the coating's uniformity and optical performance. A uniform coating is crucial for the subsequent laser etching process, ensuring precision and consistency in the etching process, thereby creating uniform light-transmitting holes on the module surface. The uniformity and consistency of light-transmitting holes directly impacts the display quality of the LED display, especially when assembling large screens. This helps prevent visual inconsistencies caused by uneven light-transmitting holes.

[0142] It should be understood that after the baking and curing process, the photoresist coating layer not only has excellent mechanical properties and chemical stability, but also provides ideal surface conditions for the subsequent laser etching process. The cured coating can withstand the heat and mechanical stress generated during the laser etching process, ensuring precise removal of the etched areas and non-destructive treatment of non-etched areas.

[0143] According to some embodiments of the present application, step S103 of performing a baking and curing process on the LED basic display component covered with the photoresist coating layer may include:

[0144] Step S401, setting baking conditions for the tunnel oven based on a preset baking temperature range and a preset baking time range;

[0145] Step S402 : sending the LED basic display component covered with the photoresist coating layer into a tunnel furnace, and controlling the tunnel furnace to bake and cure the photoresist coating layer according to baking conditions.

[0146] In some embodiments, step S401 is to set baking conditions for the tunnel oven based on a preset baking temperature range and a preset baking time range;

[0147] It should be noted that the LED display base component covered with a photoresist coating undergoes a baking and curing process. This process first involves setting appropriate baking conditions in the tunnel oven based on a preset baking temperature range and a preset baking time range. The preset baking temperature range is typically between 60 and 80 degrees Celsius, and the preset baking time range is approximately one hour. These parameters are optimized to ensure that the photoresist coating layer can fully cure under appropriate conditions.

[0148] In step S402 of some embodiments, the LED basic display component covered with the photoresist coating layer is sent into a tunnel oven, and the tunnel oven is controlled according to baking conditions to perform a baking and curing process on the photoresist coating layer.

[0149] It should be noted that the LED display base components, covered with a photoresist coating, are fed into a tunnel oven. The tunnel oven is a piece of industrial equipment that provides uniform heat distribution and precise temperature control, ensuring that each module is baked under the same conditions. By controlling the operation of the tunnel oven according to the set baking conditions, the photoresist coating layer can be cured consistently, thereby improving production efficiency and product quality.

[0150] It should be understood that the primary purpose of the baking process is to evaporate the solvent in the photoresist coating through heating, causing the resin components to cross-link, resulting in a strong coating structure. This process not only enhances the adhesion and chemical resistance of the photoresist layer but also provides a stable substrate for the subsequent laser etching process. Furthermore, baking eliminates bubbles and fine particles in the coating, further improving the coating's uniformity and optical performance.

[0151] In the actual operation of some embodiments, the tunnel oven parameters may need to be adjusted based on the specific formulation of the photoresist coating and the size of the module. For example, larger modules may require longer baking times or higher temperatures to ensure complete curing of the coating. Smaller modules, on the other hand, may require lower temperatures and shorter times to avoid over-curing, which can lead to cracking or discoloration of the coating.

[0152] Furthermore, the baking process can be combined with other process steps, such as pre-curing immediately after spraying the photoresist layer to initially fix the coating before performing a full-scale curing in a tunnel oven. This step-by-step approach helps improve production efficiency and reduce defects caused by coating fluidity.

[0153] It can be seen that by baking and curing the LED basic display component covered with a photoresist coating layer, not only can the uniform curing of the photoresist coating layer be ensured, but also its adhesion and durability can be improved.

[0154] In some embodiments, step S104 is determining information of a plurality of light-transmitting holes in the photoresist coating layer, which respectively match a plurality of light-transmitting portions of the LED basic display assembly;

[0155] It's important to note that determining the multiple light-transmitting holes in the photoresist layer, each matching the multiple light-transmitting portions of the LED display assembly, is a critical step before laser etching. Each LED chip in an LED display assembly has a light-transmitting portion above it. Determining the light-transmitting hole information is crucial for the subsequent laser etching process, ensuring that the photoresist layer above each light-transmitting portion is precisely removed, forming a light-transmitting hole and exposing the portion, allowing light to pass through smoothly.

[0156] In some embodiments, the determination of the light-transmitting hole information can be based on the design drawings of the LED basic display components. The design drawings of these LED basic display components detail the position of each LED light-emitting chip and the geometric shape and size of the corresponding light-transmitting portion. By analyzing these drawings, the specific position and shape of each light-transmitting portion on the module can be determined, thereby providing accurate coordinates and dimensional parameters for the etching of the light-transmitting hole. It is worth noting that the size of the light-transmitting hole in the embodiment of the present application needs to be slightly larger than the area of ​​the light-transmitting portion to ensure efficient transmission of light while avoiding light being blocked by the photoresist coating layer.

[0157] In some specific embodiments, high-precision optical measurement equipment or automated pattern recognition systems can be used. These devices can quickly and accurately identify the location of the light-transmitting portion in the LED-based display assembly, thereby determining the etching parameters for the light-transmitting hole. The determination of the light-transmitting hole information can take into account not only the location and size of the light-transmitting portion, but also the overall layout of the LED-based display assembly and the spacing between adjacent light-transmitting portions to ensure that the etching operation does not affect the photoresist coating layer in other areas.

[0158] According to some embodiments of the present application, step S104 of determining information of a plurality of light-transmitting holes in the photoresist coating layer that respectively match a plurality of light-transmitting portions of the LED basic display assembly may include:

[0159] Step S501: Determine, on the photoresist coating layer, a first boundary point and a second boundary point of each light-transmitting hole information based on each light-transmitting portion of the LED basic display assembly; wherein the first boundary point is the intersection of a first line and the upper edge of the transparent protective layer, and the second boundary point is the intersection of a second line and the upper edge of the transparent protective layer; the first line is an edge line of a light path of the LED light-emitting chip, and the second line is another edge line of the light path of the LED light-emitting chip; and the first line and the second line are symmetrical about the axis of the LED light-emitting chip.

[0160] Step S502: determining the light hole orientation parameter and the light hole size parameter based on the first boundary point and the second boundary point;

[0161] Step S503: determining light hole information according to the light hole orientation parameters and light hole size parameters.

[0162] In some embodiments, step S501 determines, based on each light-transmitting portion of the LED basic display assembly, a first boundary point and a second boundary point of each light-transmitting hole information on the photoresist coating layer; wherein the first boundary point is an intersection point of a first line and an upper edge of the transparent protective layer, and the second boundary point is an intersection point of a second line and an upper edge of the transparent protective layer, the first line is an edge line of a light path of the LED light-emitting chip, the second line is an edge line of another light path of the LED light-emitting chip, and the first line and the second line are symmetrical about an axis of the LED light-emitting chip.

[0163] It should be noted that based on the light-transmitting parts of the LED basic display component, the first boundary point and the second boundary point of each light-transmitting hole are determined on the photoresist coating layer. The determination of these boundary points involves the light path edge line of the LED light-emitting chip. Specifically, the first boundary point is obtained by the intersection of one light path edge line of the LED light-emitting chip and the upper edge of the transparent protective layer, while the second boundary point is obtained by the intersection of another light path edge line and the upper edge of the transparent protective layer. These two light path edge lines are symmetrical about the axis of the LED light-emitting chip, ensuring the symmetry and uniformity of the light-transmitting hole. This design ensures that the light-transmitting hole can accurately match the light path requirements of the LED light-emitting chip, thereby ensuring the effective transmission and uniform distribution of light.

[0164] In step S502 of some embodiments, based on the first boundary point and the second boundary point, a light hole orientation parameter and a light hole size parameter are determined;

[0165] It should be noted that after determining the first boundary point and the second boundary point, the orientation parameters and size parameters of the light-transmitting hole are further determined based on these two boundary points. The orientation parameters describe the position of the light-transmitting hole on the photoresist coating layer, ensuring that each light-transmitting hole accurately corresponds to the corresponding LED light-emitting chip. The size parameters define the size of the light-transmitting hole, ensuring that the light-transmitting hole is slightly larger than the light-transmitting part of the LED light-emitting chip to provide sufficient light-emitting area while preventing light from being blocked by the photoresist coating layer. Such a design not only improves the light transmission efficiency, but also enhances the optical performance of the module.

[0166] In step S503 of some embodiments, light hole information is determined according to the light hole orientation parameters and the light hole size parameters.

[0167] It should be noted that complete light hole information is integrated based on the orientation and size parameters of the light holes. This information is then used to guide the operation of the laser etching equipment, ensuring that each light hole is accurately etched. The accuracy of light hole information is crucial to the display effect of the final product, directly affecting the ink color consistency between modules and the visual effect of the entire display. Through precise light hole design and etching, color consistency and uniform light distribution between modules are achieved when splicing large screens, thereby improving the overall performance and quality of LED display modules.

[0168] Reference Figure 10 、 Figure 11 According to some embodiments of the present application, the local structure of the light-transmitting hole of the LED basic display component is as follows: Figure 10 、 Figure 11 The first boundary point is the intersection of the first line and the upper edge of the transparent protective layer, the second boundary point is the intersection of the second line and the upper edge of the transparent protective layer, the first line is the edge line of one light path of the LED light-emitting chip, the second line is the edge line of another light path of the LED light-emitting chip, and the first line and the second line are symmetrical about the axis of the LED light-emitting chip.

[0169] In step S105 of some embodiments, a laser etching operation is performed on the photoresist coating layer based on the light-transmitting hole information to obtain an LED display module; wherein the photoresist coating layer has a light-transmitting hole formed by the laser etching operation above the light-transmitting portion, and the light-transmitting hole exposes the light-transmitting portion.

[0170] It's important to note that laser etching the photoresist layer based on the light-transmitting hole information is a critical step in the manufacturing of LED display modules. This operation aims to precisely form light-transmitting holes in the photoresist layer, exposing the light-transmitting portion. This ensures that light from the LED chip can efficiently pass through these holes, enabling the LED display module to function properly. The accuracy and quality of the laser etching operation directly impacts the final product's display quality and ink color consistency.

[0171] It should be noted that the laser etching operation relies on previously determined light-transmitting hole information, which provides key parameters such as the position, size, and shape of each light-transmitting hole. Based on this light-transmitting hole information, the laser etching equipment precisely controls the path and energy output of the laser beam to ensure that each hole can be accurately etched according to the design requirements. During the laser etching process, the laser beam is focused on the surface of the photoresist coating layer, and the molecular structure in the coating layer is destroyed by the high-energy-density beam, thereby achieving material removal. This process does not require physical contact, avoiding potential damage to delicate LED chips and PCB circuits from mechanical stress.

[0172] After the laser etching operation is completed, the photoresist layer forms precise light-transmitting holes above the light-transmitting portion. These holes are not only precisely sized and have neat edges, but also ensure high light transmittance. Increased light transmittance means more light can be emitted from the LED chip and pass through the module surface, thereby improving the brightness and display quality of the LED display module. Furthermore, the uniform and beautiful light-transmitting holes help solve the problem of inconsistent ink color when splicing large screens, ensuring that the entire display screen displays a uniform and consistent color even when the screen is off.

[0173] It should be understood that the application of laser etching technology not only improves production efficiency but also reduces production costs. Laser etching is a highly automated process that can process large numbers of modules in a short period of time, reducing manual intervention and potential errors. Furthermore, compared to traditional masking processes, laser etching reduces material waste and improves material utilization, thereby effectively controlling costs while ensuring product quality.

[0174] In summary, laser etching, based on light-transmitting hole information, is a key step in manufacturing high-quality LED display modules. Using high-precision laser technology, it forms precise light-transmitting holes in the photoresist coating layer, ensuring the module's optical performance and ink color consistency. This process also improves production efficiency and reduces costs, providing reliable technical support for the large-scale production of LED display modules.

[0175] According to some embodiments of the present application, step S105 of performing a laser etching operation on the photoresist coating layer based on the light-transmitting hole information to obtain an LED display module may include:

[0176] Step S601, obtaining a wavelength absorption range of a basic component corresponding to an LED basic display component and a wavelength absorption range of a coating corresponding to a photoresist coating layer;

[0177] Step S602, determining a target wavelength based on the wavelength absorption range of the base component and the wavelength absorption range of the coating; wherein the target wavelength falls within the wavelength absorption range of the coating but not within the wavelength absorption range of the base component;

[0178] Step S603 , forming a laser line matching the target wavelength by a laser, and controlling the laser line to perform a laser etching operation on the photoresist coating layer based on the light-transmitting hole information, thereby obtaining an LED display module.

[0179] It is worth noting that laser etching technology has significant advantages in the field of material removal due to its high precision and high efficiency. However, its application in the field of LED display module processing is significantly limited. This is mainly because the wavelength of laser light has strong penetrating properties, while LED chips and PCB circuits are sensitive to light of specific wavelengths. When using laser etching technology to process the ink layer, the laser beam may penetrate the ink layer and cause accidental damage to the LED chip or PCB circuit below. This damage may be localized overheating caused by thermal effects or degradation of material properties due to photochemical reactions. In either case, it may affect the electrical performance and stability of the LED display module.

[0180] The general consensus within the industry is that laser etching technology presents a high risk when processing the ink layer of LED display modules, and therefore is rarely used in actual production. This consensus stems from the need to protect the delicate structure of LED display modules and the strict requirements for reliability and consistency in the production process. Any minor damage to the LED chip and PCB circuitry can lead to a decrease in module yield, increase production costs, and even affect the quality and lifespan of the final product. Therefore, despite the excellent performance of laser etching technology in other areas, the industry prefers traditional coating or masking processes for processing the ink layer of LED display modules to avoid potential risks.

[0181] However, the method of performing the laser etching operation in the embodiment of the present application overcomes the technical prejudice commonly existing in the industry, that is, laser etching technology is not suitable for use in the processing of the ink layer of the LED display module.

[0182] In some embodiments, step S601 is to obtain a wavelength absorption range of a basic component corresponding to an LED basic display component and a wavelength absorption range of a coating corresponding to a photoresist coating layer;

[0183] It should be noted that a laser etching operation is performed on the photoresist coating layer based on the light-transmitting hole information to obtain the final LED display module. This process first requires obtaining the basic component wavelength absorption range related to the LED basic display component, and the coating wavelength absorption range related to the photoresist coating layer. The basic component wavelength absorption range refers to the absorption characteristic range of the LED basic display component (including LED chips and PCB circuits) for light of different wavelengths. The coating wavelength absorption range is the absorption characteristic range of the photoresist coating layer for light of different wavelengths. Understanding these two wavelength absorption ranges is the basis for determining the appropriate laser wavelength.

[0184] In some embodiments, step S602 is performed to determine a target wavelength based on the wavelength absorption range of the base component and the wavelength absorption range of the coating; wherein the target wavelength falls within the wavelength absorption range of the coating but not within the wavelength absorption range of the base component;

[0185] It should be noted that a target wavelength is determined based on the wavelength absorption range of the base component and the coating. This target wavelength must meet two conditions: first, it must be effectively absorbed by the photoresist coating layer, meaning it falls within the coating's wavelength absorption range; and second, it must be absorbed only slightly or not at all by the LED base display component, meaning it does not fall within the base component's wavelength absorption range. This wavelength selection ensures that the laser energy is primarily absorbed by the photoresist coating layer, achieving efficient material removal while minimizing thermal and optical damage to the underlying LED chip and PCB circuitry.

[0186] In step S603 of some embodiments, a laser is used to form a laser line matching a target wavelength, and the laser line is controlled to perform a laser etching operation on the photoresist coating layer based on the light-transmitting hole information to obtain an LED display module.

[0187] It should be noted that after determining the target wavelength, a laser is used to generate a laser line that matches the wavelength. The selection and parameter setting of the laser must precisely match the target wavelength to ensure the efficiency and accuracy of the laser etching process. By controlling parameters such as the path, power, and scanning speed of the laser line, the photoresist coating layer is laser etched based on the previously determined light-transmitting hole information. The light-transmitting hole information provides the precise position and size of each area to be etched. Based on this information, the laser etching equipment accurately removes the photoresist coating layer to form light-transmitting holes, exposing the light-transmitting portion underneath.

[0188] According to some embodiments of the present application, step S603, which forms a laser line matching a target wavelength by a laser, and controls the laser line to perform a laser etching operation on the photoresist coating layer based on the light-transmitting hole information to obtain an LED display module, may include:

[0189] Step S701, generating an ultraviolet laser line matching a target wavelength by a laser; wherein the target wavelength is less than 300 nm;

[0190] Step S702 : Control the ultraviolet laser beam to irradiate the black ink corresponding to the light-transmitting hole information to peel off the black ink from the photoresist coating layer, thereby obtaining an LED display module.

[0191] In some embodiments, step S701 is to generate an ultraviolet laser line matching a target wavelength by a laser; wherein the target wavelength is less than 300 nm;

[0192] It should be noted that the embodiment of the present application uses a laser to generate an ultraviolet laser line that matches the target wavelength. This target wavelength is selected to be less than 300nm. This wavelength selection is based on the optical properties of the material and process requirements, because ultraviolet light less than 300nm has a high absorption rate for the black ink and epoxy-based materials in the photoresist coating layer, while avoiding penetration and damage to the underlying LED chip and PCB circuit. Ultraviolet laser light in this wavelength range can be effectively absorbed by the photoresist coating layer, thereby achieving efficient material removal.

[0193] According to some embodiments provided herein, the molecular structure of epoxy resin is primarily composed of COC ring-shaped covalent bonds. This structure imparts excellent chemical stability and mechanical properties to epoxy resin, making it widely used in a variety of industrial applications, particularly where high adhesion and good insulation properties are required. Based on this, some embodiments of this application utilize a black prefabricated material comprising black ink and epoxy resin as the photoresist coating.

[0194] It should be noted that the covalent bond energy of CO at room temperature is 358.0 kJ·mol -1 Based on this, the energy required to break the COC covalent bond in epoxy resin can be calculated by the following formula:

[0195]

[0196] It should be understood that the above formula is used to calculate the energy required to break a covalent bond. Specifically, it describes how the energy of a photon depends on its wavelength. The shorter the wavelength, the higher the energy of the photon.

[0197] Among them, N A Avogadro's constant is 6.02×10 23 mol -1 ;

[0198] h is Planck's constant 6.63×10 -34 J·s;

[0199] c is the speed of light in vacuum, 3.0×10 8 m·s -1 ;

[0200] λ is the target wavelength.

[0201] It should be noted that when the target wavelength of the laser beam is less than 300nm, performing the laser etching operation can ensure that the laser energy is mainly absorbed by the photoresist coating layer, thereby achieving efficient material removal while minimizing the thermal impact and optical damage to the underlying LED chip and PCB circuit. It should be understood that if the UV radiation with a wavelength range of 100 to 300nm is considered, the required radiation energy is approximately 400 to 1200kJ·mol -1 .

[0202] Reference Figure 12 , Figure 12 The absorption spectrum of the epoxy resin obtained by testing in the examples of the present application is shown.

[0203] The epoxy resin absorption spectra provided in the examples of this application clearly demonstrate the light absorption characteristics of epoxy resin at different wavelengths. The graph uses wavelength as the horizontal axis, extending from 200 nm to 700 nm, covering the ultraviolet (200 nm to 400 nm) and visible (400 nm to 700 nm) regions. The vertical axis represents the absorption coefficient, with values ​​ranging from 0 to 4.0, intuitively reflecting the epoxy resin's absorption intensity for each wavelength of light.

[0204] In the ultraviolet region with wavelengths less than 300nm, epoxy resin exhibits a remarkably high absorption coefficient, which rises rapidly and reaches a peak value of approximately 3.8 to 4.0 near 300nm. This indicates that epoxy resin has a strong absorption capacity for short-wavelength ultraviolet light, meaning that within this wavelength range, the energy of UV photons is sufficient to be effectively absorbed by epoxy resin molecules, triggering changes in the molecular structure, such as breaking covalent bonds in photochemical reactions. This property makes epoxy resin important for applications in technologies such as UV curing and photolithography, especially when precise control of material removal is required.

[0205] As the wavelength exceeds 300nm, the absorption coefficient of epoxy resin drops sharply and stabilizes to close to zero after entering the visible light region (above 400nm).

[0206] It should be understood that this absorption spectrum characteristic is particularly important for the technical solution in this application. Selecting an ultraviolet laser with a wavelength of less than 300nm to etch the photoresist coating layer can make full use of the high absorption characteristics of epoxy resin in the ultraviolet light region to achieve efficient removal of the photoresist coating layer while avoiding damage to the LED chip and PCB circuit below. The low absorption characteristics in the visible light region ensure that when the LED display module is working, visible light can smoothly pass through the epoxy resin layer, thereby ensuring the luminous efficiency and display effect of the module. By precisely utilizing this absorption spectrum characteristic of epoxy resin, the technical solution of this application not only improves production efficiency, but also significantly improves the ink color consistency and overall performance of the LED display module.

[0207] In step S702 of some embodiments, ultraviolet laser light is controlled to irradiate the black ink corresponding to the light-transmitting hole information to peel the black ink from the photoresist coating layer to obtain an LED display module.

[0208] It's important to note that by precisely controlling the path and energy output of the UV laser beam, it irradiates the photoresist layer according to the aperture information. During this process, the UV laser beam is focused on the surface of the photoresist layer, and the high-energy-density beam causes the molecular structure of the black ink to break down and decompose. Due to the highly concentrated laser energy, the black ink is heated to a vaporized or peeling state in a relatively short period of time, thereby being stripped from the photoresist layer. This stripping process is not only highly efficient but also minimizes significant thermal impact on surrounding materials, ensuring the accuracy of the etched area and the neatness of the edges.

[0209] It's important to note that photochemical decomposition utilizes the energy of laser photons to break the chemical bonds within ink molecules, thereby achieving coating stripping. When the laser photon energy exceeds the bond energy of the ink molecules, the photon energy is absorbed by the ink molecules, disrupting their molecular structure. For example, the C—C bond energy in ink is approximately 3.6 eV, while laser photon energy above 5 eV can directly break these bonds. This decomposition achieves coating stripping through a combination of photochemical decomposition and vaporization.

[0210] The high precision and high efficiency of the laser etching process shown in steps S701 to S702 of the present application enable the final LED display module to form uniform and precisely sized light-transmitting holes above the light-transmitting portion. These light-transmitting holes can not only ensure the efficient transmission of light emitted by the LED light-emitting chip, but also maintain the overall structural integrity and stability of the module. Through this method, the produced LED display module not only performs well in ink color consistency, but also achieves an excellent level in display effect. After being spliced ​​into a large screen, the color block differences between the modules are significantly reduced, and the entire display screen presents a uniform dark ink color in the off state, and a bright and consistent color in the working state. In addition, due to the non-contact and high precision of laser etching, the process can also effectively reduce losses and defective rates in the production process, improve production efficiency, reduce production costs, and provide reliable technical guarantees for the large-scale production of LED display modules.

[0211] The laser etching process proposed in steps S601 to S603 of the embodiment of the present application is highly accurate and controllable. Since the selection of laser wavelength is based on a deep understanding of the wavelength absorption characteristics of the basic components and the coating layer, damage to the structure of the LED display module can be effectively avoided. The light-transmitting holes formed by laser etching are not only precise in size and neat in edges, but also ensure high light transmittance, thereby ensuring that the light from the LED light-emitting chip can efficiently pass through the module to achieve a good light-emitting effect. In addition, this process overcomes the industry's prejudice against the application of etching technology to LED display modules, and proves that by reasonably selecting wavelengths and process parameters, laser etching technology can be safely and effectively used in the manufacture of LED display modules, improving the ink color consistency and display effect of the product, reducing production costs, and improving production efficiency.

[0212] According to some embodiments of the present application, step S105 of performing a laser etching operation on the photoresist coating layer based on the light-transmitting hole information to obtain an LED display module may include:

[0213] Step S901, performing a laser etching operation on the photoresist coating layer based on the light-transmitting hole information;

[0214] Step S902: After performing the laser etching operation on the photoresist coating layer, performing a protective coating spraying operation on the LED basic display component to spray a pre-prepared transparent protective coating over the photoresist coating layer to form a transparent protective layer;

[0215] Step S903 , performing a baking and curing process on the LED basic display component covered with the transparent protective layer to obtain an LED display module.

[0216] In step S901 of some embodiments, a laser etching operation is performed on the photoresist coating layer based on the light-transmitting hole information;

[0217] It should be noted that laser etching is performed on the photoresist coating layer based on the light-transmitting hole information. This operation requires high-precision laser equipment and precise control to ensure that the position and size of each light-transmitting hole meet the design requirements. The light-transmitting hole information provides the precise coordinates and dimensions of each hole. Based on this information, the laser etching equipment uses ultraviolet laser to accurately remove the photoresist coating layer, forming light-transmitting holes and exposing the light-transmitting portion underneath. This process requires not only precise control of laser parameters, but also ensuring that the laser beam path and energy output are stable to achieve a uniform etching effect.

[0218] In step S902 of some embodiments, after performing the laser etching operation on the photoresist coating layer, performing a protective coating spraying operation on the LED basic display assembly to spray a pre-prepared transparent protective coating over the photoresist coating layer to form a transparent protective layer;

[0219] It should be noted that after the laser etching operation is performed on the photoresist coating layer, a protective coating spraying operation is performed on the LED base display component. A pre-prepared transparent protective coating is used here to provide additional protection for the photoresist coating layer while enhancing the optical performance of the module. Transparent protective coatings usually have good optical transparency and weather resistance, and can effectively prevent the photoresist coating layer from being physically damaged or chemically corroded during subsequent processing or use. By evenly spraying the transparent protective coating, a uniform transparent protective layer is formed, covering the top of the photoresist coating layer, which further improves the stability and reliability of the module.

[0220] In step S903 of some embodiments, the LED basic display component covered with the transparent protective layer is baked and cured to obtain an LED display module.

[0221] It should be noted that the LED basic display component covered with a transparent protective layer is subjected to a baking and curing treatment to obtain the final LED display module. The purpose of the baking and curing treatment is to cure the transparent protective coating layer by heating to form a solid protective layer. This process requires strict control of temperature and time to ensure that the protective layer is fully cured while avoiding adverse effects on the underlying photoresist coating layer and LED basic display components. The cured transparent protective layer not only provides good mechanical protection, but also optimizes the optical performance of the module, ensuring that light can pass through efficiently, thereby improving the overall display effect of the LED display module.

[0222] In steps S901 to S903 of the embodiment of the present application, precise laser etching and the addition of a protective layer not only solve the problem of inconsistent ink color of the LED display module, but also improve the durability and optical performance of the module, providing reliable technical support for the large-scale production of LED display modules.

[0223] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the numbers used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "comprise" and "comprising" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0224] It should be understood that in this application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0225] It should be understood that in the description of the embodiments of the present application, multiple (or multiple items) means more than two, greater than, less than, exceed, etc. are understood to exclude the number itself, and above, below, within, etc. are understood to include the number itself.

[0226] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of units is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interface, device or unit, which can be electrical, mechanical or other forms.

[0227] Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0228] In addition, the functional units in the various embodiments of the present application may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0229] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the relevant technology, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the various embodiments of the present application. The aforementioned storage medium may include: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0230] It should also be understood that the various implementation methods provided in the embodiments of the present application can be combined arbitrarily to achieve different technical effects.

[0231] The above is a specific description of the implementation methods of the present application, but the present application is not limited to the above implementation methods. Technical personnel familiar with the art can also make various equivalent modifications or substitutions without violating the spirit of the present application. These equivalent modifications or substitutions are all included in the scope defined by the claims of the present application.

Claims

1. A method for manufacturing an LED display module, characterized in that: include: Obtain an LED basic display assembly; wherein the LED basic display assembly includes a printed circuit board, a plurality of LED light-emitting chips, and a light-transmitting portion, wherein the printed circuit board is provided with a plurality of chip mounting positions, each of the LED light-emitting chips is mounted in a corresponding chip mounting position, and the light-transmitting portion covers each of the LED light-emitting chips; Performing a photoresist coating operation on the LED basic display assembly to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer, wherein the middle portion is a portion between two adjacent light-transmitting portions on the printed circuit board; Performing a baking and curing process on the LED basic display component covered with the photoresist coating layer; Determining information of a plurality of light-transmitting holes in the photoresist coating layer, which respectively match the plurality of light-transmitting portions of the LED basic display component; The photoresist coating layer is laser etched based on the light-transmitting hole information to obtain an LED display module; wherein the photoresist coating layer has a light-transmitting hole formed by the laser etching operation above the light-transmitting portion, and the light-transmitting hole exposes the light-transmitting portion.

2. The method according to claim 1, characterized in that The laser etching operation is performed on the photoresist coating layer based on the light-transmitting hole information to obtain an LED display module, comprising: Obtaining a wavelength absorption interval of a basic component corresponding to the LED basic display component and a wavelength absorption interval of a coating corresponding to the photoresist coating layer; Determining a target wavelength based on the wavelength absorption range of the basic component and the wavelength absorption range of the coating; wherein the target wavelength falls within the wavelength absorption range of the coating but not within the wavelength absorption range of the basic component; A laser line matching the target wavelength is formed by a laser, and the laser line is controlled to perform a laser etching operation on the photoresist coating layer based on the light-transmitting hole information to obtain the LED display module.

3. The method according to claim 2, characterized in that The photoresist coating spraying operation is performed on the LED basic display assembly to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer, including: Determine the black prefabricated material as the photoresist coating; wherein the black prefabricated material includes black ink and epoxy-based material; The photoresist coating is evenly sprayed on the printed circuit board and the light-transmitting portion to form the photoresist coating layer; wherein the thickness of the photoresist coating layer falls within a preset coating layer thickness range.

4. The method according to claim 3, characterized in that The method of forming a laser line matching the target wavelength by a laser and controlling the laser line to perform a laser etching operation on the photoresist coating layer based on the light-transmitting hole information to obtain the LED display module includes: Generating an ultraviolet laser line matching the target wavelength by a laser; wherein the target wavelength is less than 300 nm; The ultraviolet laser line is controlled to irradiate the black ink corresponding to the light-transmitting hole information to peel the black ink from the photoresist coating layer to obtain the LED display module.

5. The method according to claim 1, wherein The laser etching operation is performed on the photoresist coating layer based on the light-transmitting hole information to obtain an LED display module, comprising: performing a laser etching operation on the photoresist coating layer based on the light-transmitting hole information; After performing a laser etching operation on the photoresist coating layer, performing a protective coating spraying operation on the LED basic display assembly to spray a pre-prepared transparent protective coating over the photoresist coating layer to form a transparent protective layer; The LED basic display component covered with the transparent protective layer is subjected to a baking and curing process to obtain the LED display module.

6. The method according to claim 5, characterized in that The determining of information of a plurality of light-transmitting holes in the photoresist coating layer, which respectively match the plurality of light-transmitting portions of the LED basic display assembly, includes: Based on each of the light-transmitting portions of the LED basic display assembly, a first boundary point and a second boundary point of each of the light-transmitting hole information are determined on the photoresist coating layer; wherein the first boundary point is an intersection point of a first line and an upper edge of the transparent protective layer, and the second boundary point is an intersection point of a second line and an upper edge of the transparent protective layer, the first line is an edge line of a light path of the LED light-emitting chip, the second line is an edge line of another light path of the LED light-emitting chip, and the first line and the second line are symmetrical about an axis of the LED light-emitting chip; Determining light transmission hole orientation parameters and light transmission hole size parameters based on the first boundary point and the second boundary point; The light hole information is determined according to the light hole orientation parameter and the light hole size parameter.

7. The method according to claim 1, characterized in that The step of baking and curing the LED basic display assembly covered with the photoresist coating layer comprises: Setting baking conditions for the tunnel oven based on a preset baking temperature range and a preset baking time range; The LED basic display assembly covered with the photoresist coating layer is sent into the tunnel furnace, and the tunnel furnace is controlled according to the baking conditions to perform baking and curing treatment on the photoresist coating layer.

8. The method according to claim 1, characterized in that Before performing the photoresist coating spraying operation on the LED basic display assembly to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer, the method further includes: Obtaining waste LED display components, the photoresist coating, and an originally written spraying operation control program; Performing a photoresist coating spraying operation on the waste LED display assembly according to the spraying operation control program, so as to spray the photoresist coating over the printed circuit board and the light-transmitting portion of the waste LED display assembly to form a test coating layer; Performing a spraying consistency test on the test coating layer to obtain a spraying consistency test result; In the case where the spraying consistency test result does not meet the preset consistency test condition, the spraying operation control program is debugged, and according to the debugged spraying operation control program, the photoresist coating spraying operation is returned to be executed on the waste LED display assembly according to the spraying operation control program until the spraying consistency test result of the test coating layer meets the preset consistency test condition, and the corresponding spraying operation control program is determined as the target control program; The photoresist coating spraying operation is performed on the LED basic display assembly to spray the pre-prepared photoresist coating over the light-transmitting portion and the middle portion to form a photoresist coating layer, including: A photoresist coating spraying operation is performed on the LED basic display assembly according to the target control program, so that the pre-prepared photoresist coating is sprayed to cover the light-transmitting portion and the middle portion to form the photoresist coating layer.

9. An LED display module, characterized in that: The LED display module is manufactured by the manufacturing method according to any one of claims 1 to 8.

10. An LED display screen, characterized in that: The LED display screen is formed by splicing the LED display modules described in claim 9.

Images