Bonding device, method of manufacturing display device, and method of manufacturing electronic device

Abstract

The invention relates to a bonding device, a method of manufacturing a display device, and a method of manufacturing an electronic device. A coupling device for a display device includes: a first support unit on which a first panel is mounted; and a second support unit on which a second panel coupled to the first panel is mounted; wherein the second support unit includes: a stage on which a second panel is mounted; a main support portion disposed below the stage and supporting the stage, in which the stage rotates with the main support portion as a rotation axis when the main support portion rotates; a sub-support portion connected below the table and supporting the table, in which the sub-support portion slidably moves on a plane perpendicular to the rotation axis when the table rotates; and a base plate supporting the main support portion and the sub-support portion.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2024-0033320, filed on March 8, 2024, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present invention relates to a bonding device for a display device, and more particularly, to a bonding device for a display device capable of bonding panels with improved accuracy. Background Art

[0004] Recently, various electronic devices such as mobile electronic devices and stationary electronic devices have been used. Such electronic devices include display devices for providing visual information such as images or videos to users to support various functions.

[0005] Generally, a display device may include a display panel and a display circuit board, wherein the display panel displays an image and the display circuit board is electrically connected to the display panel and used to transmit signals thereto. The display panel and the display circuit board may be coupled and connected to each other by a coupling device for a display device. Summary of the Invention

[0006] In order to bond the display panel to the display circuit board, the display panel and the display circuit board may be aligned with each other and pressed against each other by a pressing unit. However, in the prior art, the supporting portion that receives the pressing force of the pressing unit generally has one axis, and therefore, problems such as deflection or pushing of the stage due to eccentricity may occur.

[0007] One or more embodiments include a bonding device for a display device, which can bond a display panel to a display circuit board with improved precision.

[0008] According to an embodiment, a coupling device for a display device includes: a first supporting unit on which a first panel is mounted; and a second supporting unit on which a second panel coupled to the first panel is mounted; wherein the second supporting unit includes: a table on which the second panel is mounted; a main supporting part, arranged below the table and supporting the table, wherein when the main supporting part rotates, the table rotates with the main supporting part as a rotation axis; a sub-supporting part, connected below the table and supporting the table, wherein when the table rotates, the sub-supporting part slides and moves on a plane perpendicular to the rotation axis; and a base plate, supporting the main supporting part and the sub-supporting part.

[0009] In an embodiment, the main supporting portion and the sub-supporting portion may be arranged to be spaced apart from each other by a first distance, and the first distance between the main supporting portion and the sub-supporting portion may be maintained constant when the stage rotates.

[0010] In an embodiment and in plan view, when the stage rotates, the sub-support portion may linearly move in a first direction and a second direction intersecting the first direction on a plane perpendicular to the rotation axis.

[0011] In an embodiment, the sub-support portion may include: a first linear moving portion arranged on the base plate and moving linearly in a first direction; a connecting plate connected above the first linear moving portion; and a second linear moving portion arranged on the connecting plate and moving linearly in a second direction.

[0012] In an embodiment and in plan view, the sub-support portion may perform a curved movement relative to the main support portion when the main support portion is rotated.

[0013] In an embodiment, the sub-support portion may include: a curvature movement portion disposed on the base plate and having a curved shape; and a connection plate connected above the curvature movement portion.

[0014] In an embodiment, the sub-support portion may be provided in plural and may be arranged at each of both sides of the main support portion in a plan view.

[0015] In an embodiment, the sub-support portion may be provided in plural and may be arranged at each of the upper side, the lower side, the right side, and the left side of the main support portion in a plan view.

[0016] In an embodiment, the second supporting unit may further include a driver driving the main supporting portion to rotate, wherein the driver may not drive the sub-supporting portion.

[0017] According to an embodiment, a coupling device for a display device includes: a first supporting unit on which a first panel is mounted; and a second supporting unit on which a second panel coupled to the first panel is mounted; wherein the second supporting unit includes: a table on which the second panel is mounted; a main supporting part, which is arranged under the table and supports the table; a sub-supporting part, which is connected under the table and arranged to be spaced apart from the main supporting part; and a base plate, which supports the main supporting part and the sub-supporting part, wherein when the sub-supporting part slides on a plane perpendicular to the main supporting part as a rotation axis, the table connected to the sub-supporting part rotates relative to the main supporting part.

[0018] In an embodiment, the main supporting portion and the sub-supporting portion may be arranged to be spaced apart from each other by a first distance, and the first distance between the main supporting portion and the sub-supporting portion may be maintained constant when the stage rotates.

[0019] In an embodiment and in a plan view, the stage may rotate while the sub-support portion linearly moves in a first direction and a second direction intersecting the first direction on a plane perpendicular to the rotation axis.

[0020] In an embodiment, the sub-support portion may include: a first linear moving portion arranged on the base plate and moving linearly in a first direction; a connecting plate connected above the first linear moving portion; and a second linear moving portion arranged on the connecting plate and moving linearly in a second direction.

[0021] In an embodiment and in plan view, the table may rotate as the sub-support portion performs a curved movement relative to the main support portion.

[0022] In an embodiment, the sub-support portion may include: a curvature movement portion disposed on the base plate and having a curved shape; and a connection plate connected above the curvature movement portion.

[0023] In an embodiment, the sub-support portion may be provided in plural and may be arranged at each of both sides of the main support portion in a plan view.

[0024] In an embodiment, the sub-support portion may be provided in plural and may be arranged at each of the upper side, the lower side, the right side, and the left side of the main support portion in a plan view.

[0025] In an embodiment, the second supporting unit may further include a driver driving the sub-supporting portion to linearly move the sub-supporting portion, wherein the driver may not drive the main supporting portion.

[0026] According to an embodiment, a method for manufacturing a display device includes: arranging a first panel on a first supporting unit; arranging a second panel on a second supporting unit; correcting an axial rotation of the second supporting unit for aligning the second panel; and pressing the first panel over the second supporting unit to couple the first panel to the second panel while a portion of the first panel is disposed on the second supporting unit to overlap with the second panel, wherein the second supporting unit includes a table on which the second panel is mounted, a main supporting part arranged below the table, and a sub-supporting part connected below the table, wherein correcting the axial rotation includes the following steps: when the main supporting part rotates, the table rotates with the main supporting part as a rotation axis, and when the table rotates, the sub-supporting part slides and moves on a plane perpendicular to the rotation axis.

[0027] According to an embodiment, a method for manufacturing an electronic device includes manufacturing a display device and accommodating the display device in a housing, wherein manufacturing the display device includes: arranging a first panel on a first supporting unit; arranging a second panel on a second supporting unit; correcting the axial rotation of the second supporting unit for aligning the second panel; and pressing the first panel above the second supporting unit to couple the first panel to the second panel while a portion of the first panel is disposed on the second supporting unit to overlap with the second panel, wherein the second supporting unit includes a table on which the second panel is mounted, a main supporting part arranged below the table, and a sub-supporting part connected below the table, wherein correcting the axial rotation includes the following steps: when the main supporting part rotates, the table rotates with the main supporting part as the rotation axis, and when the table rotates, the sub-supporting part slides and moves on a plane perpendicular to the rotation axis. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other aspects, features and advantages of certain embodiments of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 is a schematic plan view of a portion of a display device according to an embodiment, showing a display panel in an unbent state;

[0030] Figure 2 is a schematic transverse cross-sectional view of a portion of a display device according to an embodiment, showing a display panel in a bent state;

[0031] Figure 3 is a schematic equivalent circuit diagram of a pixel circuit applicable to a display device according to an embodiment;

[0032] Figure 4 is taken along line AA' according to an embodiment Figure 1 A schematic cross-sectional view of a portion of a display device;

[0033] Figure 5 is a schematic cross-sectional view of a combining device for a display device according to an embodiment;

[0034] Figure 6 is a schematic front view of a second supporting unit according to an embodiment, wherein the first supporting unit is omitted;

[0035] Figure 7 is a schematic plan view of a second supporting unit showing a main supporting portion and a sub-supporting portion according to an embodiment, wherein the first supporting unit is omitted; and

[0036] Figure 8 According to the implementation method Figure 7Schematic plan view of a substantially identical second support unit. DETAILED DESCRIPTION

[0037] Reference will now be made in detail to embodiments, examples of which are shown in the accompanying drawings, wherein like reference numerals represent like elements throughout. In this regard, the embodiments may have different forms and should not be construed as being limited to the description set forth herein. Accordingly, embodiments will be described below solely with reference to the accompanying drawings to illustrate aspects of this specification. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items. Throughout this disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0038] Although the present invention is capable of various modifications and alternative forms, embodiments of the invention are shown by way of example in the drawings and will be described in detail herein. The effects and characteristics of the present invention and methods for achieving the same will become apparent by reference to the embodiments described in detail below in conjunction with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

[0039] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings, wherein when describing the drawings, the same or mutually corresponding elements will be given the same reference numerals, and repeated description thereof will not be given.

[0040] It will be understood that although the terms "first," "second," etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another.

[0041] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0042] It will also be understood that the terms “comprises” and / or “comprising” as used herein specify the presence of stated features or elements, but do not preclude the presence or addition of one or more other features or elements.

[0043] It will also be understood that when a layer, region or element is referred to as being formed "on" another layer, region or element, it can be directly or indirectly formed on the other layer, region or element. That is, for example, intervening layers, regions or elements may be present.

[0044] For the convenience of explanation, the size of the elements in the drawings may be exaggerated. For example, for the convenience of explanation, the size and thickness of the elements in the drawings are randomly indicated, and therefore, the present invention is not necessarily limited to the illustrations of the drawings.

[0045] In the embodiments below, the x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0046] When a specific embodiment can be implemented differently, a specific process order can be performed differently from the order described. For example, two processes described in succession can be performed substantially simultaneously, or in the reverse order of the order described.

[0047] Figure 1 is a schematic plan view of a portion of the display device 1 according to the embodiment, and for convenience of explanation, shows the display panel 10 in an unbent state. Figure 2 is a schematic transverse sectional view of a portion of the display device 1 according to the embodiment, and shows the display panel 10 in a bent state.

[0048] In the embodiments and with reference to Figure 1 and Figure 2 , the display device 1 can display dynamic images or static images, and can be used not only as a display screen for portable electronic devices (such as mobile phones, smart phones, tablet personal computers (PCs), mobile communication terminals, electronic notebooks, electronic books, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs)), but also as a display screen for various products (such as televisions (TVs), notebook computers, monitors, billboards, Internet of Things (IOT) devices, etc.). In addition, the display device 1 according to the embodiment can be used for wearable devices such as smart watches, watch phones, glasses-type displays, and head-mounted displays (HMDs). In addition, the display device 1 according to the embodiment can be used as a central information display (CID) on an instrument panel or a central dashboard or instrument panel of a vehicle, an interior mirror display that replaces a side mirror of a vehicle, or a display arranged on the rear surface of a front seat as an entertainment device for a rear seat of a vehicle.

[0049] In an embodiment, the display device 1 may be housed in a housing of an electronic device. The housing may serve as a cover that protects internal components such as the display device 1 and defines the appearance of the electronic device. Furthermore, the display device 1 may be connected to an electronic module of the electronic device and may be driven within the electronic device. The following explanation will focus on the display device 1.

[0050] In an embodiment, Figure 1As shown in FIG, the display device 1 may have a generally rectangular shape. Figure 1 As shown in , the display device 1 may have a generally rectangular planar shape having a short side extending in a first direction (e.g., the x direction or the −x direction) and a long side extending in a second direction (e.g., the y direction or the −y direction). According to an embodiment, the portion where the short side extending in the first direction (e.g., the x direction or the −x direction) and the long side extending in the second direction (e.g., the y direction or the −y direction) of the display device 1 intersect with each other may be right angles or rounded to have a specific curvature. However, the shape of the display device 1 is not limited to a rectangular planar shape, and may include other planar shapes such as a polygonal planar shape, a circular planar shape, or an elliptical planar shape.

[0051] The display device 1 may include a display area DA and a peripheral area PA, wherein the display area DA may display an image. Here, pixels PX may be arranged in the display area DA. The display device 1 may provide an image by using light emitted from the pixels PX, wherein each pixel PX may emit light by using a display element. Depending on the embodiment, each pixel PX may emit red light, green light, or blue light. According to another embodiment, each pixel PX may emit red light, green light, blue light, or white light.

[0052] In an embodiment, the peripheral area PA may be a non-display area that does not display an image. The peripheral area PA may at least partially surround the display area DA. For example, the peripheral area PA may completely surround the display area DA. A driver configured to provide an electrical signal to the pixel PX and a power line configured to provide power, etc. may be arranged in the peripheral area PA. For example, a scan driver configured to apply a scan signal to the pixel PX may be arranged in the peripheral area PA. In addition, a data driver configured to apply a data signal to the pixel PX may be arranged in the peripheral area PA. According to an embodiment, the peripheral area PA may include an adjacent area AA disposed adjacent to the display area DA and surrounding the display area DA, a bending area BA connected to one side of the adjacent area AA and capable of bending, and a pad area PDA connected to the bending area BA and having a pad arranged therein.

[0053] In the embodiments and with reference to Figure 2 The display device 1 may include a display panel 10 , a cover window 20 , a display driver 30 , a display circuit board 40 , a touch sensor driver 50 , a cover panel 60 , and a protection film PTF.

[0054] The display panel 10 may display information processed by the display apparatus 1. For example, the display panel 10 may display execution screen information of an application driven by the display apparatus 1, or the display panel 10 may display user interface (UI) or graphical user interface (GUI) information based on the execution screen information.

[0055] The display panel 10 may include a display element. For example, the display panel 10 may include an organic light-emitting display panel using organic light-emitting diodes, a micro light-emitting diode display panel using micro light-emitting diodes, a quantum dot light-emitting display panel using quantum dot light-emitting diodes including a quantum dot emission layer, or an inorganic light-emitting display panel using inorganic light-emitting diodes including inorganic semiconductors. Hereinafter, an embodiment in which the display panel 10 includes an organic light-emitting display panel using organic light-emitting diodes as display elements will be mainly described in detail.

[0056] In embodiments, the display panel 10 may include a substrate 100 and a plurality of layers disposed on the substrate 100. Depending on the embodiment, the display panel 10 may include the substrate 100, a display layer DSL, an encapsulation layer TFE, a touch sensor layer TSL, and an optical function layer OFL. Here, the display area DA and the peripheral area PA may be defined within the substrate 100 and / or the plurality of layers. For example, the substrate 100 may include the display area DA and the peripheral area PA. Furthermore, the peripheral area PA may include a pad area PDA and a bending area BA.

[0057] In an embodiment, the substrate 100 may include a polymer resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate. According to an embodiment, the substrate 100 may have a multilayer structure including a base layer including the above polymer resin and a barrier layer (not shown). The substrate 100 including the polymer resin may be flexible, such as rollable or bendable.

[0058] In an embodiment, the substrate 100 may be bent in the bending area BA. In this case, according to an embodiment, the substrate 100 may be bent in the bending area BA to have a "U" shape so that at least portions of the lower surface 100LS of the substrate 100 may face each other, and the pad area PDA of the substrate 100 may be located below other portions of the substrate 100. Therefore, the area of ​​the peripheral area PA visible to the user may be reduced. Figure 2 Only the substrate 100 is shown to be bent. However, according to another embodiment, at least a portion of the display layer DSL, at least a portion of the encapsulation layer TFE, and at least a portion of the touch sensor layer TSL may also correspond to the bending area BA and the pad area PDA. In this case, at least a portion of the display layer DSL, at least a portion of the encapsulation layer TFE, and at least a portion of the touch sensor layer TSL may also be bent in the bending area BA.

[0059] In an embodiment, the display layer DSL may be provided on the substrate 100 and may include pixel circuits and display elements. Here, the pixel circuits may be connected to the display elements respectively. The pixel circuits may include transistors and storage capacitors. Therefore, the display layer DSL may include multiple display elements, multiple transistors, and storage capacitors. In addition, the display layer DSL may further include an insulating layer provided between the multiple display elements, multiple transistors, and storage capacitors.

[0060] In an embodiment, the encapsulation layer TFE may be provided on the display layer DSL, wherein the encapsulation layer TFE may be provided on the display element and may cover the display element. According to an embodiment, the encapsulation layer TFE may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. The at least one inorganic encapsulation layer may include a material selected from Al2O3, TiO2, Ta2O5, ZnO, SiO2, SiN x and one or more inorganic materials selected from SiON. At least one organic encapsulation layer may include a polymer-based material. The polymer-based material may include an acrylic-based resin, an epoxy-based resin, polyimide, polyethylene, etc. According to an embodiment, at least one organic encapsulation layer may include acrylate.

[0061] In an embodiment, a touch sensor layer TSL may be provided on the encapsulation layer TFE, wherein the touch sensor layer TSL may sense coordinate information according to an external input (e.g., a touch event). The touch sensor layer TSL may include sensor electrodes and touch wires connected to the sensor electrodes. The touch sensor layer TSL may sense the external input according to a magnetocapacitive method or a mutual capacitance method.

[0062] In an embodiment, the touch sensor layer TSL may be formed on the encapsulation layer TFE. In another embodiment, after the touch sensor layer TSL may be separately formed on the touch substrate, the touch sensor layer TSL may be attached to the encapsulation layer TFE through an adhesive layer such as an optically clear adhesive. Depending on the embodiment, the touch sensor layer TSL may be directly formed on the encapsulation layer TFE, and in this case, the adhesive layer may not be provided between the touch sensor layer TSL and the encapsulation layer TFE.

[0063] In an embodiment, the optical functional layer OFL may be provided on the touch sensor layer TSL and may reduce the reflectivity of light (external light) that may be incident from the outside toward the display device 1 and / or improve the color purity of the light emitted from the display device 1. According to an embodiment, the optical functional layer OFL may include a phase retarder and a polarizer. The phase retarder may include a film-type phase retarder or a liquid crystal coating type phase retarder, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also include a film-type polarizer or a liquid crystal coating type polarizer. The film-type polarizer may include an elongated synthetic resin film, and the liquid crystal coating type polarizer may include liquid crystals arranged in a specific shape. The phase retarder and the polarizer may also include a protective film.

[0064] According to another embodiment, the optical functional layer OFL may include a black matrix and a color filter, wherein the color filter may be arranged by taking into account the color of light emitted from each pixel PX in the display device 1. Each color filter may include a red, green, or blue pigment or a red, green, or blue dye. In another embodiment, in addition to the above-mentioned pigments or dyes, each color filter may further include quantum dots. In yet another embodiment, some of the color filters may not include the above-mentioned pigments or dyes, and may include scattering particles such as titanium oxide.

[0065] According to another embodiment, the optical functional layer OFL may include a destructive interference structure, wherein the destructive interference structure may include a first reflective layer and a second reflective layer provided on different layers. The first reflected light and the second reflected light reflected from the first reflective layer and the second reflective layer, respectively, may destructively interfere with each other, thereby reducing the reflectivity of external light.

[0066] In an embodiment, the cover window 20 may be provided on the display panel 10 and may protect the display panel 10. According to an embodiment, the cover window 20 may include a flexible window. The cover window 20 may protect the display panel 10 by being easily bent due to external force without cracks, etc. The cover window 20 may include at least one of glass, sapphire, and plastic. The cover window 20 may include, for example, ultra-thin glass (UTG) or colorless polyimide (CPI). According to an embodiment, the cover window 20 may have a structure in which a flexible polymer layer is provided on the surface of a glass substrate, or may have a structure including only a polymer layer.

[0067] In an embodiment, the cover window 20 can be attached to the display panel 10 by an adhesive member, wherein the adhesive member can include a transparent adhesive member, such as an optically clear adhesive (OCA). In addition, the adhesive member can include various other well-known adhesive materials. The adhesive member can be attached to the display panel 10 as a film, or a type of material can be distributed as an adhesive member over the display panel 10. As such, the adhesive member can be formed over the display panel 10 in various ways.

[0068] In an embodiment, the display driver 30 may be disposed in the pad area PDA, and may receive control signals and power voltages, and may generate and output signals and voltages for driving the display panel 10. The display driver 30 may include an integrated circuit (IC).

[0069] In an embodiment, the display circuit board 40 may be electrically connected to the display panel 10. For example, the display circuit board 40 may be electrically connected to the pad area PDA of the substrate 100 through an anisotropic conductive film.

[0070] The display circuit board 40 may include a flexible printed circuit board (FPCB) that can bend or a rigid printed circuit board (PCB) that is rigid and not easily bent. In another embodiment, the display circuit board 40 may include a composite printed circuit board including both a PCB and an FPCB.

[0071] In an embodiment, the touch sensor driver 50 may be provided on the display circuit board 40 and may include an IC. The touch sensor driver 50 may be attached to the display circuit board 40. The touch sensor driver 50 may be electrically connected to the sensor electrodes of the touch sensor layer TSL of the display panel 10 through the display circuit board 40.

[0072] However, in addition to this, a power supply part may be further provided on the display circuit board 40 , wherein the power supply part may provide a driving voltage for driving the pixels PX of the display panel 10 and the display driver 30 .

[0073] In an embodiment, the protection film PTF may be patterned and attached to the lower surface 100LS of the substrate 100, wherein the protection film PTF may be attached to an area of ​​the substrate 100 other than the bending area BA. Here, a portion of the protection film PTF may be disposed to be spaced apart from the display layer DSL with the substrate 100 disposed therebetween. Another portion of the protection film PTF may be attached to the lower surface 100LS of the substrate 100 to correspond to the pad area PDA.

[0074] According to an embodiment, the cover panel 60 may be provided between portions of the protective film PTF. In other words, when the substrate 100 is bent to have a "U" shape, the cover panel 60 may be provided between a portion (e.g., the first portion) and another portion (e.g., the second portion) of the substrate 100 that face each other. The cover panel 60 may absorb external impact to prevent the display panel 10 from breaking.

[0075] Figure 3 is a schematic equivalent circuit diagram of a pixel circuit PC suitable for a display device according to an embodiment.

[0076] In the embodiments and with reference to Figure 3 The pixel circuit PC may be electrically connected to the display element DE and may include a first transistor T1, a second transistor T2, and a storage capacitor Cst. According to an embodiment, the display element DE may emit red, green, or blue light or red, green, blue, or white light.

[0077] In an embodiment, the second transistor T2 may be connected to the scan line SL and the data line DL and may be configured to transmit a data signal or a data voltage Dm input from the data line DL to the first transistor T1 in response to a scan signal or a switching voltage Sn input from the scan line SL.

[0078] In an embodiment, the storage capacitor Cst may be connected to the second transistor T2 and the driving voltage line PL and may be configured to store a voltage corresponding to a difference between a voltage received from the second transistor T2 and the first power voltage ELVDD supplied to the driving voltage line PL.

[0079] In an embodiment, the first transistor T1 may be connected to a driving voltage line PL and a storage capacitor Cst, and may be configured to control a driving current flowing from the driving voltage line PL through the display element DE according to the value of the voltage stored in the storage capacitor Cst. The display element DE may emit light having a specific brightness according to the driving current. An opposite electrode of the display element DE may receive a second power voltage ELVSS.

[0080] Figure 3 FIG. 4 shows that the pixel circuit PC may include two transistors and one storage capacitor. However, in other embodiments, the pixel circuit PC may include more than Figure 3 The transistors and / or storage capacitors shown in FIG.

[0081] Figure 4 According to the implementation method Figure 1 The line A-A' in Figure 1 Schematic cross-sectional view of a portion of the display device 1.

[0082] In the embodiments and with reference to Figure 1 and Figure 4 , the display device 1 may include a display panel 10. The display panel 10 may include a substrate 100, a display layer DSL, an encapsulation layer 300, a touch sensor layer and an optical function layer. For ease of explanation, Figure 4 In the illustration, the touch sensor layer and the optical functional layer are omitted.

[0083] In an embodiment, the display layer DSL may be disposed on the substrate 100 and may include a buffer layer 111 , a pixel circuit layer PCL, and a display element layer DEL.

[0084] The substrate 100 may include glass or a polymer resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate. The substrate 100 including the polymer resin may be flexible, such as rollable or bendable. The substrate 100 may have a multilayer structure including a base layer containing the above-mentioned polymer resin and a barrier layer (not shown).

[0085] In an embodiment, the buffer layer 111 may include an inorganic insulating material such as SiN x , SiON and SiO2, and may include a single layer or multiple layers containing the above-mentioned inorganic insulating materials.

[0086] In an embodiment, the pixel circuit layer PCL may be disposed on the buffer layer 111 and may include a transistor TFT included in the pixel circuit and an inorganic insulating layer IIL disposed below or / and above the components of the transistor TFT, a first planarization layer 115, and a second planarization layer 116. The inorganic insulating layer IIL may include a first gate insulating layer 112, a second gate insulating layer 113, and an interlayer insulating layer 114.

[0087] In an embodiment, the transistor TFT may include a semiconductor layer A, and the semiconductor layer A may include polycrystalline silicon. In another embodiment, the semiconductor layer A may include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The semiconductor layer A may include a channel region, a drain region and a source region respectively arranged on both sides of the channel region. The gate electrode G may overlap the channel region.

[0088] In an embodiment, the gate electrode G may include a low-resistance metal material. The gate electrode G may include a conductive material including Mo, Al, Cu, Ti, etc., and may include a multilayer or single layer including the above conductive materials.

[0089] In an embodiment, the first gate insulating layer 112 disposed between the semiconductor layer A and the gate electrode G may include an inorganic insulating material such as SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, HfO2, ZnO x etc. ZnO x ZnO and / or ZnO2 may be included.

[0090] In an embodiment, the second gate insulating layer 113 may be provided to cover the gate electrode G. Similar to the first gate insulating layer 112, the second gate insulating layer 113 may include an inorganic insulating material such as SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, HfO2, ZnO x etc. ZnO x ZnO and / or ZnO2 may be included.

[0091] In an embodiment, the upper electrode CE2 of the storage capacitor Cst may be disposed above the second gate insulating layer 113, wherein the upper electrode CE2 may overlap the gate electrode G thereunder. Here, the gate electrode G and the upper electrode CE2, which overlap with each other with the second gate insulating layer 113 disposed therebetween, may form the storage capacitor Cst of the pixel circuit. That is, the gate electrode G may function as the lower electrode CE1 of the storage capacitor Cst. As described above, the storage capacitor Cst and the transistor TFT may be formed to overlap each other. According to some embodiments, the storage capacitor Cst may not be formed to overlap the transistor TFT.

[0092] In an embodiment, the upper electrode CE2 may include Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Ca, Mo, Ti, W, and / or Cu, and may include a single layer or multiple layers including the above materials.

[0093] In an embodiment, the interlayer insulating layer 114 may cover the upper electrode CE2. The interlayer insulating layer 114 may include SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, HfO2, ZnO x etc. ZnO x ZnO and / or ZnO 2 may be included. The interlayer insulating layer 114 may include a single layer or multiple layers including the above-mentioned inorganic insulating material.

[0094] In an embodiment, each of the drain electrode D and the source electrode S may be disposed on the interlayer insulating layer 114, wherein the drain electrode D and the source electrode S may include a highly conductive material. The drain electrode D and the source electrode S may include a conductive material including Mo, Al, Cu, Ti, etc., and may include a multilayer or single layer including the above materials. Depending on the embodiment, the drain electrode D and the source electrode S may have a stacked structure of Ti / Al / Ti.

[0095] In an embodiment, the first planarization layer 115 may be provided to cover the drain electrode D and the source electrode S, wherein the first planarization layer 115 may include an organic insulating layer. The first planarization layer 115 may include an organic insulating material, such as a general polymer (such as polymethyl methacrylate (PMMA) or polystyrene (PS)), a polymer derivative having a phenolic group, an acrylic acid-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a paraxylene-based polymer, a vinyl alcohol-based polymer, and a blend thereof.

[0096] In an embodiment, the connection electrode CML may be disposed on the first planarization layer 115. Here, the connection electrode CML may be connected to the drain electrode D or the source electrode S through a contact hole in the first planarization layer 115. The connection electrode CML may include a highly conductive material. The connection electrode CML may include a conductive material including Mo, Al, Cu, Ti, etc., and may include multiple layers or a single layer including the above conductive materials. Depending on the embodiment, the connection electrode CML may have a stacked structure of Ti / Al / Ti.

[0097] In an embodiment, the second planarization layer 116 may be provided to cover the connection electrode CML. The second planarization layer 116 may include an organic insulating layer. The second planarization layer 116 may include an organic insulating material, such as a general polymer (such as PMMA or PS), a polymer derivative having a phenolic group, an acrylic acid-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a paraxylene-based polymer, a vinyl alcohol-based polymer, and a blend thereof.

[0098] In an embodiment, the display element layer DEL may be disposed on the pixel circuit layer PCL and may include a display element DE. The display element DE may include an organic light emitting diode (OLED). The pixel electrode 211 of the display element DE may be electrically connected to the connection electrode CML through a contact hole of the second planarization layer 116.

[0099] In an embodiment, the pixel electrode 211 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO) or aluminum zinc oxide (AZO). According to another embodiment, the pixel electrode 211 may include a reflective layer comprising Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a compound thereof. According to yet another embodiment, the pixel electrode 211 may further include a layer comprising ITO, IZO, ZnO or In2O3 above / below the reflective layer.

[0100] In an embodiment, a pixel defining layer 118 having an opening 118OP exposing a central portion of the pixel electrode 211 may be disposed on the pixel electrode 211. The pixel defining layer 118 may include an organic insulating material and / or an inorganic insulating material. The opening 118OP may define an emission region (hereinafter referred to as an emission region EA) of light emitted from the display element DE. For example, the width of the opening 118OP may correspond to the width of the emission region EA of the display element DE.

[0101] In an embodiment, according to a method of manufacturing a display device, a spacer 119 may be provided on the pixel defining layer 118, wherein the spacer 119 may be provided to prevent breakage of the substrate 100. In the manufacturing process of the display panel, a mask sheet may be used. Here, when a deposition material is deposited on the substrate 100, a portion of the substrate 100 may be damaged or broken due to the mask sheet that is inserted into the opening 118OP of the pixel defining layer 118 or is manufactured to adhere to the pixel defining layer 118. The spacer 119 can prevent such damage or breakage.

[0102] In an embodiment, the spacer 119 may include an organic insulating material such as polyimide. In another embodiment, the spacer 119 may include an organic insulating material such as SiN x or an inorganic insulating material such as SiO2, or may include an organic insulating material and an inorganic insulating material.

[0103] According to an embodiment, the spacer 119 may include a material different from that of the pixel defining layer 118. In another embodiment, the spacer 119 may include the same material as that of the pixel defining layer 118, and in this case, the pixel defining layer 118 and the spacer 119 may be formed together through a mask process using a half-tone mask or the like.

[0104] In an embodiment, the intermediate layer 212 may be disposed on the pixel defining layer 118, wherein the intermediate layer 212 may include an emission layer 212b disposed in the opening 118OP of the pixel defining layer 118. The emission layer 212b may include a high molecular weight or low molecular weight organic material that emits light of a specific color.

[0105] In an embodiment, the first functional layer 212a and the second functional layer 212c may be respectively disposed below and above the emission layer 212b. The first functional layer 212a may include, for example, a hole transport layer (HTL) or an HTL and a hole injection layer (HIL). The second functional layer 212c may be disposed above the emission layer 212b and may be optionally disposed. The second functional layer 212c may include an electron transport layer (ETL) and / or an electron injection layer (EIL). Like the opposing electrode 213 to be described below, the first functional layer 212a and / or the second functional layer 212c may be a common layer formed to completely cover the substrate 100.

[0106] In an embodiment, the counter electrode 213 may include a conductive material having a low work function. For example, the counter electrode 213 may include a (semi-)transparent layer containing Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, or alloys thereof. In another embodiment, the counter electrode 213 may further include a layer including ITO, IZO, ZnO, or In2O3 on the (semi-)transparent layer including the above materials.

[0107] According to some embodiments, a capping layer (not shown) may be further disposed on the opposite electrode 213 , wherein the capping layer may include LiF, an inorganic material, or / and an organic material.

[0108] In an embodiment, the encapsulation layer 300 may be provided on the opposite electrode 213. The encapsulation layer 300 may be provided on the display element layer DEL and may cover the display element layer DEL. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. According to an embodiment, Figure 4 It is shown that the encapsulation layer 300 may include a first inorganic encapsulation layer 310 , an organic encapsulation layer 320 , and a second inorganic encapsulation layer 330 that are sequentially stacked.

[0109] In an embodiment, the first inorganic encapsulating layer 310 and the second inorganic encapsulating layer 330 may include aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, ZnO, SiO x 、SiN x and SiON. The organic encapsulation layer 320 may include a polymer-based material. The polymer-based material may include an acrylic resin, an epoxy resin, polyimide, polyethylene, etc. Depending on the embodiment, the organic encapsulation layer 320 may include an acrylate. The organic encapsulation layer 320 may be formed by curing a monomer or by applying a polymer. The organic encapsulation layer 320 may be transparent.

[0110] Although not shown, in an embodiment, the above-described touch sensor layer may be provided on the encapsulation layer 300 , and the optical function layer may be provided on the touch sensor layer.

[0111] Figure 5 is a display device 1 (see, for example, Figure 1 ) is a schematic cross-sectional view of a combining device 2. According to an embodiment, the combining device 2 for the display device 1 can be used to combine the components of the display device 1 described above. Figure 6 is a schematic front view of the second supporting unit 500 according to the embodiment. Figure 6 , for convenience of explanation, the first supporting unit 400 is omitted.

[0112] In the embodiments and with reference to Figure 5 The combining device 2 for the display device 1 may be used to combine components of the display device 1, for example, the display panel 10 and the display circuit board 40. According to an embodiment, the combining device 2 for the display device 1 may include a first supporting unit 400 and a second supporting unit 500.

[0113] In an embodiment, the first support unit 400 can support the first panel, and the second support unit 500 can support the second panel. In addition, in order to couple the first and second panels to each other, a portion of the first panel can be disposed on the second support unit 500 to overlap with the second panel. Next, a pressing unit (not shown) can press the first panel above the second support unit 500 to couple the first panel to the second panel. Here, the pressing weight can be mainly concentrated in the second support unit 500. Hereinafter, the first support unit 400 and the second support unit 500 will be described in detail.

[0114] In an embodiment, the first support unit 400 may support a first panel, for example, a display panel 10. Hereinafter, an embodiment in which the first panel is the display panel 10 is mainly described. The display panel 10 may be mounted on the first stage 410. According to an embodiment, the first stage 410 may have a quadrilateral cross-section having a first direction (for example, Figure 5 The long side extending in the x direction) and the long side extending in the second direction (for example, Figure 5 The first stage 410 may have a short side extending in the first direction and a long side extending in the second direction, or may have a square cross-section with sides of the same length. Therefore, the first stage 410 may have an xy plane surface, and the display panel 10 may be mounted on the first stage 410.

[0115] In an embodiment, the first cylinder 420 may be connected below the first stage 410. The first cylinder 420 may serve as a support shaft for supporting the first stage 410 and may be connected to the first base plate 430. The first cylinder 420 may be rotatable in the third direction (e.g., Figure 5 The first cylinder 420 may extend in the z-direction (z-direction) and may be arranged between the first stage 410 and the first base plate 430. Depending on the embodiment, the first cylinder 420 may be rotated or swivel. Here, the rotation of the first cylinder 420 may mean that the first cylinder 420 rotates about an axis of rotation in the same direction (z-direction) as the direction in which the first cylinder 420 extends, wherein the axis of rotation is located at the center of the first cylinder 420. Here, the driver 600 may be connected to the first cylinder 420, and the driver 600 may drive the first cylinder 420 to rotate. The driver 600 may be located in the first cylinder 420. However, the driver 600 is not limited thereto. The driver 600 may be located outside the first cylinder 420 and may be electrically connected to the first cylinder 420. In a plan view, the first cylinder 420 may be rotated by a certain angle to rotate and align the first stage 410 connected to the first cylinder 420. Through this alignment, the first panel and the second panel may be relatively better aligned with each other and bonded to each other.

[0116] In the embodiments and with reference to Figure 5 and Figure 6 The second support unit 500 may support a second panel, for example, a display circuit board 40. Hereinafter, an embodiment in which the second panel is the display circuit board 40 will be mainly described. The display circuit board 40 may be mounted on the second stage 510. According to an embodiment, the second stage 510 may have a quadrilateral cross-section having a first direction (for example, Figure 5 The long side extending in the x direction) and the long side extending in the second direction (for example, Figure 5 The second stage 510 may have a short side extending in the first direction and a long side extending in the second direction, or may have a square cross-section with sides of equal length. Therefore, the second stage 510 may have an xy plane surface, and the display circuit board 40 may be mounted on the second stage 510.

[0117] In an embodiment, the support portion 520 may be disposed under the second stage 510 to support the second stage 510. According to an embodiment, the support portion 520 may include a main support portion 520M and a sub-support portion 520S.

[0118] In an embodiment, the main support portion 520M may be arranged below the center of the second stage 510 to support the center of the second stage 510. The upper end of the main support portion 520M may be connected to the second stage 510, and the lower end of the main support portion 520M may be connected to the second base plate 530. In addition, according to an embodiment, the main support portion 520M may include a second cylinder 521M, wherein the second cylinder 521M may serve as a support shaft that supports the second stage 510 and can be connected to the second base plate 530. The second cylinder 521M may be rotatable in a third direction (e.g., Figure 5 The second cylinder 521M extends in the z direction (z direction) and can be arranged between the second stage 510 and the second base plate 530. According to an embodiment, the second cylinder 521M can rotate. It should be understood that the fact that the second cylinder 521M rotates can mean that the second cylinder 521M rotates relative to a rotation axis in the same direction (z direction) as the extension direction of the second cylinder 521M, wherein the rotation axis is located at the center of the second cylinder 521M. According to an embodiment, the driver 600 can be connected to the second cylinder 521M, and the driver 600 can drive the second cylinder 521M to rotate. The driver 600 can be located in the second cylinder 521M. However, the driver 600 is not limited to this. In another embodiment, the driver 600 can be located outside the second cylinder 521M and can be electrically connected to the second cylinder 521M. The second cylinder 521M can rotate a specific angle in a plan view to rotate and align the second stage 510 connected to the second cylinder 521M. Through this alignment, the second panel and the first panel can be relatively better aligned with each other and bonded to each other.

[0119] In an embodiment, the sub-support portion 520S may be arranged to support the second stage 510 together with the main support portion 520M. The sub-support portion 520S may be arranged at one side of the main support portion 520M. In detail, the sub-support portion 520S may be arranged in a first direction (e.g., Figure 6 In addition, the sub-support portion 520S may include two sub-support portions 520S, and in this case, the sub-support portion 520S may be arranged in the first direction (for example, Figure 6On both sides of the +x direction and -x direction). According to another embodiment, the sub-support portion 520S may include more than two sub-support portions 520S, and in this case, each of the plurality of sub-support portions 520S may be arranged to be distributed relative to the main support portion 520M. For example, when the sub-support portion 520S includes four sub-support portions 520S, each of the sub-support portions 520S may be arranged at the upper side, the lower side, the right side, or the left side relative to the main support portion 520M in a plan view. The number of sub-support portions 520S may be related to the size of the second table 510. That is, as the size of the second table 510 increases, a greater number of sub-support portions 520S may be arranged to support the distributed weight of the second table 510 together with the main support portion 520M. Hereinafter, the following will mainly describe the following. Figure 6 The sub-support portion 520S shown in FIG. 5 includes an embodiment of two sub-support portions 520S.

[0120] According to an embodiment, the sub-support portion 520S may include a third cylinder 521S and a linear moving portion. The third cylinder 521S may serve as a supporting shaft for supporting the second stage 510, wherein the third cylinder 521S may extend in a third direction (e.g., the z-direction) and may be arranged between the second stage 510 and the second base plate 530.

[0121] The first linear moving portion 522S and the second linear moving portion 523S may be disposed below the third cylinder 521S, wherein the first linear moving portion 522S may be movable in a first direction (eg, Figure 6 The first linear moving portion 522S may be configured to slide in the first direction (x-direction). Depending on the embodiment, the first linear moving portion 522S may include a linear motor to slide in the first direction. The first linear moving portion 522S may be fixed to the second base plate 530 below it. In other words, the guide rails of the first linear moving portion 522S may be fixed to the second base plate 530, and the moving unit of the first linear moving portion 522S may slide on the guide rails.

[0122] In an embodiment, a connecting plate 524S may be disposed above the first linear moving portion 522S, that is, above the moving unit of the first linear moving portion 522S. The connecting plate 524S may be fixed to the moving unit of the first linear moving portion 522S and may move together with the moving unit when the moving unit moves in the first direction.

[0123] In an embodiment, the second linear moving portion 523S may be disposed on the connecting plate 524S, wherein the second linear moving portion 523S may be moved in the second direction (eg, Figure 6The second linear moving portion 523S may be configured to slide in the second direction (y-direction). Depending on the embodiment, the second linear moving portion 523S may include a linear motor to slide in the second direction. The second linear moving portion 523S may be fixed to a connecting plate 524S therebelow. In other words, the guide rails of the second linear moving portion 523S may be fixed to the connecting plate 524S, and the moving unit of the second linear moving portion 523S may slide on the guide rails.

[0124] In an embodiment, the third cylinder 521S may be disposed above the second linear moving portion 523S, that is, above the moving unit of the second linear moving portion 523S. The third cylinder 521S may be fixed to the moving unit of the second linear moving portion 523S and may move together with the moving unit as the moving unit moves in the second direction.

[0125] According to an embodiment, a heater 550 may be further arranged between the main support portion 520M and the sub-support portion 520S and the second stage 510. The heater 550 can heat the second panel (e.g., the display circuit board 40) arranged on the second stage 510 to a bonding temperature. In addition, a heat insulating layer 560 may be further arranged to be provided between the heater 550 and the second and third cylinders 521M and 521S. The heat insulating layer 560 can prevent the heat provided by the heater 550 from being transferred to the second and third cylinders 521M and 521S, as well as the moving parts below the second and third cylinders 521M and 521S.

[0126] In addition, although not shown in the drawings, in an embodiment, an ion generator (not shown) for removing electrostatic force in the bonding process of the first panel and the second panel may be disposed.

[0127] Figure 7 is a schematic plan view of the second supporting unit 500 according to the embodiment. Figure 7 , for convenience of explanation, the first supporting unit 400 is omitted, and the main supporting portion 520M and the sub-supporting portion 520S are mainly shown.

[0128] In the embodiments and with reference to Figure 6 and Figure 7In the process of bonding the first panel to the second panel, an operation of aligning the second supporting unit 500 to align the first panel with the second panel will be described. As described above, the second panel can be mounted on the second supporting unit 500, and the pressing unit can perform a pressing operation above the second supporting unit 500. Therefore, according to the prior art, the pressing weight of the pressing unit can be concentrated in the second supporting unit 500, and deflection or pushing problems can occur particularly in the second stage 510 due to the pressing weight. According to an embodiment, the second supporting unit 500 may include not only a main supporting portion 520M, but also at least one sub-supporting portion 520S. Therefore, the pressing weight can be distributed between the main supporting portion 520M and the sub-supporting portion 520S, wherein the main supporting portion 520M can be arranged in the center of the second stage 510, and the sub-supporting portion 520S can be arranged to be spaced apart from the main supporting portion 520M so as to be disposed adjacent to the outer periphery of the second stage 510. Therefore, the second stage 510 can be stably supported, and a deflection or jostling problem in the second stage 510 can be prevented.

[0129] In addition, by including multiple support parts 520M and 520S, the second support unit 500 according to the embodiment can distribute the pressing weight and easily correct the axis rotation for alignment of the second panel. In detail, as described above, the main support part 520M can be rotated to a specific angle by the driver 600. Therefore, the second stage 510 connected above the main support part 520M can rotate together. In this embodiment, because the second stage 510 can rotate with the main support part 520M as the rotation axis in plan view, when the sub-support part 520S arranged to be spaced apart from the main support part 520M and the rotation axis is fixed, the second stage 510 can not rotate.

[0130] However, according to an embodiment, the sub-support portion 520S may include Figure 7 The first linear moving portion 522S slidable in the x direction) and the second linear moving portion 522S slidable in the x direction Figure 7The second linear moving portion 523S is slidable in the y-direction (y-direction) of the main support portion 520M. Therefore, when the main support portion 520M rotates so that the second stage 510 rotates with the main support portion 520M as the rotation axis, as the second stage 510 rotates, the sub-support portion 520S can move linearly in the first direction and the second direction on a plane perpendicular to the main support portion 520M as the rotation axis. According to an embodiment, the main support portion 520M and the sub-support portion 520S can be arranged to be spaced apart from each other by a first distance D1 in a plan view. In addition, when the second stage 510 rotates via the main support portion 520M, the sub-support portion 520S can move linearly in the first direction and the second direction, and therefore, the sub-support portion 520S can move by maintaining the first distance D1. In a plan view, the movement of the sub-support portion 520S can be a linear movement in the first direction and the second direction. However, the movement of the sub-support portion 520S can be substantially similar to a track movement having the main support portion 520M as the rotation axis.

[0131] As described above, in the embodiment, the main support portion 520M can rotate as a fixed end, and the sub-support portion 520S can slide and move as a free end due to the rotation of the second stage 510. Therefore, the second support unit 500 can distribute the pressing weight through the plurality of support portions 520M and 520S, and can easily perform shaft rotation correction.

[0132] Figure 8 is a schematic plan view of a second supporting unit 500 according to an embodiment, and is similar to Figure 7 . refer to Figure 8 The second supporting unit 500 according to the described embodiment may be similar to the above-described second supporting unit 500. Therefore, hereinafter, only the differences will be mainly described.

[0133] In the embodiments and with reference to Figure 8 , the sub-support portion 520S may include a curvature moving portion 525S provided between the third cylinder 521S and the second base plate 530. That is, the sub-support portion 520S may include the curvature moving portion 525S instead of the first linear moving portion 522S and the second linear moving portion 523S. The curvature moving portion 525S may allow the sub-support portion 520S to perform a curved movement relative to the main support portion 520M. In detail, the guide rail of the curvature moving portion 525S may have a shape such as Figure 8The curved shape with curvature shown in . The guide rail can extend along a portion of an arc having a first distance D1 between the main support portion 520M and the sub-support portion 520S as a radius. Here, the moving unit of the curvature moving portion 525S can move along the curved guide rail. In this case, the connecting plate 524S can be arranged above the curvature moving portion 525S, that is, above the moving unit of the curvature moving portion 525S. The connecting plate 524S can be fixed to the moving unit of the curvature moving portion 525S, and when the moving unit performs a curved movement, the connecting plate 524S can move together. The third cylinder 521S can be arranged above the connecting plate 524S.

[0134] In the embodiment and as described above, when the main support portion 520M rotates so that the second stage 510 rotates with the main support portion 520M as the rotation axis, the sub-support portion 520S connected to the second stage 510 can slide along the guide rail of the curvature moving portion 525S. Therefore, the second support unit 500 can distribute the pressing weight through the multiple support portions 520M and 520S, and can easily perform axis rotation correction.

[0135] In the embodiment, reference Figure 7 The second supporting unit 500 according to the embodiment is further described. The second supporting unit 500 according to the embodiment may be similar to the above-described second supporting unit 500. Therefore, in the following, only the differences are mainly described.

[0136] According to an embodiment, the driver 600 may be connected to the sub-support portion 520S. In detail, the first linear moving portion 522S and the second linear moving portion 523S of the sub-support portion 520S may be driven by the driver 600 to move linearly. Therefore, the second stage 510 connected above the third cylinder 521S of the sub-support portion 520S may rotate with the main support portion 520M as a rotation axis. Here, the main support portion 520M may not be rotated by the driver 600, but may be rotated by the movement of the linear moving portion and the second stage 510. That is, for comparison, according to Figure 7 In the embodiment, the main support portion 520M may be driven by the driver 600 to rotate so that the second stage 510 may rotate, thereby causing the linear movement of the linear moving portion. However, depending on the embodiment, the linear moving portion may be driven by the driver 600 to move linearly so that the second stage 510 may rotate to cause the rotation of the main support portion 520M.

[0137] In addition, it is understood that when the second support unit 500 includes a curvature moving portion 525S instead of a linear moving portion, the driving operation can be similar to that described above. That is, the curvature moving portion 525S can be driven by the driver 600 to perform a curved movement, and thus, the second stage 510 can rotate with the main support portion 520M as a rotation axis.

[0138] According to an embodiment, the coupling device 2 for the display device 1 may support the display device 1 by distributing a pressing weight applied by the pressing unit.

[0139] Therefore, panels (eg, the display panel 10 and the display circuit board 40 ) may be bonded to each other with increased precision.

[0140] Furthermore, when the pressing weight is distributed on the supported display device 1 , axis rotation correction of the support unit can be easily performed to align the panel.

[0141] Effects of one or more of the above-described embodiments are not limited to the above-described effects, and other effects that are not described can be clearly understood by those of ordinary skill in the art.

[0142] It should be understood that the embodiments described herein should be considered as merely descriptive meanings, rather than for the purpose of limitation. The description of the features or aspects within each embodiment should generally be considered as other similar features or aspects that can be used in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present invention. In addition, embodiments or parts of embodiments may be combined in whole or in part without departing from the scope of the present invention.

Claims

1. A combination device for a display device, the combination device comprising: a first supporting unit on which a first panel is mounted; as well as a second supporting unit on which a second panel coupled to the first panel is mounted, Wherein, the second supporting unit comprises: a platform on which the second panel is mounted; a main supporting portion disposed below the table and supporting the table, wherein when the main supporting portion rotates, the table rotates with the main supporting portion as a rotation axis; a sub-support portion connected below the table and supporting the table, wherein when the table rotates, the sub-support portion slidably moves on a plane perpendicular to the rotation axis; and A base plate supports the main supporting portion and the sub-supporting portion.

2. The binding device according to claim 1, wherein: The main supporting portion and the sub-supporting portion are arranged to be spaced apart from each other by a first distance, and the first distance between the main supporting portion and the sub-supporting portion is constant when the stage rotates.

3. The binding device according to claim 1, wherein: In a plan view, when the stage rotates, the sub-support portion moves linearly on the plane in a first direction and a second direction intersecting the first direction.

4. The binding device according to claim 3, wherein: The sub-support portion includes: a first linear moving portion disposed on the base plate and linearly moving in the first direction; a connecting plate connected above the first linear moving portion; and A second linear moving portion is disposed on the connecting plate and moves linearly in the second direction.

5. The binding device according to claim 1, wherein: In a plan view, when the main support portion rotates, the sub support portion performs a curved movement relative to the main support portion.

6. The binding device according to claim 5, wherein: The sub-support portion includes: a curvature moving portion disposed on the base plate and having a curved shape; and A connecting plate is connected above the curvature moving part.

7. The binding device according to claim 1, wherein: The sub-support portion is provided in plural and is arranged at each of both sides of the main support portion in a plan view.

8. The binding device according to claim 1, wherein: The sub-support portion is provided in plural and is arranged at each of an upper side, a lower side, a right side, and a left side of the main support portion in a plan view.

9. The binding device according to claim 1, wherein: The second supporting unit further includes a driver driving the main supporting portion to rotate, wherein the driver does not drive the sub-supporting portion.

10. A combining device for a display device, the combining device comprising: a first supporting unit on which a first panel is mounted; as well as a second supporting unit on which a second panel coupled to the first panel is mounted, Wherein, the second supporting unit comprises: a platform on which the second panel is mounted; a main support portion disposed below the table and supporting the table; a sub-support portion connected below the table and arranged to be spaced apart from the main support portion; and a base plate supporting the main supporting portion and the sub-supporting portion, wherein, when the sub-support portion slidably moves on a plane perpendicular to the main support portion as a rotation axis, the stage rotates relative to the main support portion.

11. The binding device according to claim 10, wherein: The main supporting portion and the sub-supporting portion are arranged to be spaced apart from each other by a first distance, and the first distance between the main supporting portion and the sub-supporting portion is constant when the stage rotates.

12. The binding device according to claim 10, wherein: In a plan view, when the sub-support portion moves linearly on the plane in a first direction and a second direction intersecting the first direction, the stage rotates.

13. The binding device according to claim 12, wherein: The sub-support portion includes: a first linear moving portion disposed on the base plate and linearly moving in the first direction; a connecting plate connected above the first linear moving portion; and A second linear moving portion is disposed on the connecting plate and moves linearly in the second direction.

14. The binding device according to claim 10, wherein: When the sub-support portion performs a curved movement relative to the main support portion in a plan view, the stage rotates.

15. The binding device according to claim 14, wherein: The sub-support portion includes: a curvature moving portion disposed on the base plate and having a curved shape; and A connecting plate is connected above the curvature moving part.

16. The binding device according to claim 10, wherein: The sub-support portion is provided in plural and is arranged at each of both sides of the main support portion in a plan view.

17. The binding device according to claim 10, wherein: The sub-support portion is provided in plural and is arranged at each of an upper side, a lower side, a right side, and a left side of the main support portion in a plan view.

18. The binding device according to claim 10, wherein: The second supporting unit further includes a driver driving the sub-supporting portion to linearly move the sub-supporting portion, wherein the driver does not drive the main supporting portion.

19. A method for manufacturing a display device, the method comprising: placing the first panel on the first supporting unit; placing a second panel on the second supporting unit; Correcting an axial rotation of the second supporting unit for aligning the second panel; as well as while a portion of the first panel is disposed on the second supporting unit to overlap the second panel, pressing the first panel over the second supporting unit to couple the first panel to the second panel; wherein the second supporting unit comprises a table on which the second panel is mounted, a main supporting portion arranged below the table, and a sub-supporting portion connected below the table, wherein correcting the axis rotation comprises the steps of rotating the stage with the main support portion as a rotation axis when the main support portion rotates, and slidingly moving the sub-support portion on a plane perpendicular to the rotation axis when the stage rotates.

20. A method of manufacturing an electronic device, the method comprising: manufacturing display devices; as well as The display device is housed in a housing, Wherein, manufacturing the display device includes: placing the first panel on the first supporting unit; placing a second panel on the second supporting unit; correcting an axial rotation of the second supporting unit for aligning the second panel; and while a portion of the first panel is disposed on the second supporting unit to overlap the second panel, pressing the first panel over the second supporting unit to couple the first panel to the second panel; wherein the second supporting unit comprises a table on which the second panel is mounted, a main supporting portion arranged below the table, and a sub-supporting portion connected below the table, wherein correcting the axis rotation comprises the steps of rotating the stage with the main support portion as a rotation axis when the main support portion rotates, and slidingly moving the sub-support portion on a plane perpendicular to the rotation axis when the stage rotates.

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