Circuit board welding device

Abstract

The invention discloses a circuit board welding device, and relates to the technical field of circuit board welding. The circuit board welding device comprises a first moving assembly, a carrier, a second moving assembly, a welding assembly, a tin supply assembly, a first image acquisition assembly and a controller. The carrier is arranged at the output end of the first moving assembly; the welding assembly is arranged at the output end of the second moving assembly. The tin supply assembly is arranged at the output end of the second moving assembly; the first image acquisition assembly is used for acquiring image information of the circuit board in the carrier; the controller is electrically connected with the first moving assembly, the second moving assembly, the welding assembly and the first image collecting assembly, and the controller is used for controlling movement of the first moving assembly and the second moving assembly according to image information obtained by the first image collecting assembly so as to drive the welding assembly to move to the welding spot position. And the tin supply speed and time of the tin supply assembly are controlled. The welding quality and the welding efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board welding, and in particular to a circuit board welding device. Background Art

[0002] The assembly process of a circuit board primarily involves attaching electronic components to the circuit board through soldering, forming circuit connections to complete the circuit's functionality. Soldering is a common process for soldering circuit boards. In related technologies, soldering components to a circuit board, or removing and re-soldering already soldered components to fix a defective board, is typically done manually. This can easily lead to inaccurate soldering control and poor solder joint quality. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems in the related art to a certain extent. To this end, an embodiment of the present invention provides a circuit board soldering device that can adjust the tin supply amount according to the actual soldering situation to improve the soldering quality.

[0004] The present application provides a circuit board welding device, including a first moving component, a carrier, a second moving component, a welding component, a tin supply component, a first image acquisition component and a controller, wherein the first moving component has an output end that moves along the Y direction, and the first moving component has a loading station, a welding station and an unloading station distributed in sequence along the Y direction; the carrier is arranged at the output end of the first moving component, and the carrier is used to position the circuit board; the second moving component has an output end that moves along the X direction and the Z direction, and the output end of the second moving component is located above the welding station, and the X direction, the Y direction and the Z direction are mutually orthogonal; the welding component is arranged at the output end of the second moving component, and the welding component is used to align the circuit board the tin supply component is arranged at the output end of the second moving component and is located on one side of the welding component, and the tin supply component is used to supply tin wire to the soldering point when the welding component solders the circuit board; the first image acquisition component is used to obtain image information of the circuit board in the carrier; the controller is electrically connected to the first moving component, the second moving component, the welding component, and the first image acquisition component, and the controller is used to control the movement of the first moving component and the second moving component according to the image information obtained by the first image acquisition component to drive the welding component to move to the soldering point position, and control the speed and time of the tin supply component when supplying tin.

[0005] When welding is performed using the circuit board welding device in this embodiment, the carrier is moved to the loading station by the first moving component, and the circuit board is placed on the carrier at the loading station. The first moving component then moves the circuit board to the welding station through the carrier, and the first image acquisition component acquires image information of the circuit board located at the welding station. The controller obtains the position information of the solder joints of the circuit board based on the image information of the circuit board acquired by the first image acquisition component, and controls the first moving component to move the carrier, and controls the second moving component to align the welding component and the tin supply component with the solder joints for welding. At the same time, the speed and time of the tin supply component when supplying tin are controlled according to the size of the corresponding solder joints to accurately provide the amount of tin, thereby improving the quality of welding. After the first solder joint is welded, the next solder joint is welded according to the preset path until the welding is completed. After the welding of the circuit board is completed, the second moving component drives the welding component and the tin supply component to reset, and the first moving component drives the carrier to move to the unloading station for unloading and then reset, thereby realizing automatic welding of the circuit board, which is beneficial to improving welding efficiency.

[0006] In this embodiment, the carrier includes a carrier body and a positioning component, and a positioning groove for placing the circuit board is provided on the top of the carrier body; the positioning component includes a plurality of positioning members, and the positioning members are relatively provided on both sides of the carrier body along the X direction and the Y direction. The position of the positioning portion of each positioning member along the positioning direction is adjustable to be suitable for positioning circuit boards of different specifications.

[0007] In this embodiment, the positioning member includes a positioning drive member, a transmission member, and a positioning block. The positioning drive member is arranged on the carrier body, the transmission member is arranged on the carrier body and connected to the positioning drive member, and the positioning block is arranged on the transmission member. The positioning drive member can drive the positioning block to move along the positioning direction through the transmission member. In this embodiment, the carrier further includes a pressing component, which is disposed on the carrier body and is used to press the circuit board located in the positioning groove from the Z direction.

[0008] In this embodiment, there are multiple clamping components, and the multiple clamping components are distributed at the four corners of the carrier body. The clamping components include a support seat, a clamping drive, a support member and a flip crimping member. The support seat is arranged on the carrier body; the clamping drive is arranged on the support seat; the support member is arranged on the support seat and is located on one side of the clamping drive; the middle part of the flip crimping member is hinged to the support member, and one end of the flip crimping member is hinged to the output end of the clamping drive, and the other end of the flip crimping member is used to be crimped on the circuit board in the positioning groove, and the clamping drive is used to drive the flip crimping member to rotate around the support member.

[0009] In this embodiment, the circuit board welding device also includes a second image acquisition component, which is arranged at the loading station and electrically connected to the controller. Each of the positioning members is electrically connected to the controller. The second image acquisition component is used to obtain image information of the circuit board in the carrier located at the loading station, and the controller is used to control the moving position of the positioning part of the positioning member according to the image information obtained by the second image acquisition component.

[0010] In this embodiment, the tin supply assembly includes a mounting frame, a tin supply drive, a transmission component, two rotating shafts and two toggle wheels. The mounting frame is arranged at the output end of the second moving assembly; the tin supply drive is arranged on the mounting frame and is electrically connected to the controller; the transmission component is arranged on the mounting frame, and the input end of the transmission component is connected to the output end of the tin supply drive; the two rotating shafts are arranged in parallel and at intervals on the mounting frame, and the two toggle wheels are arranged on the two rotating shafts in a one-to-one correspondence. A gap is formed between the two toggle wheels for the tin wire to pass through, and the two rotating shafts are connected to the output end of the transmission component. The tin supply drive drives the two rotating shafts to rotate relative to each other through the transmission component.

[0011] In this embodiment, the tin supply assembly further includes a first conduit and a second conduit, the first conduit being arranged at the entrance of the gap between the two toggle wheels, and the second conduit being arranged at the exit of the gap between the two toggle wheels.

[0012] In this embodiment, the tin supply assembly further includes a third conduit and a hose. The third conduit is arranged on one side of the welding assembly. One end of the hose is connected to the outlet of the second conduit, and the other end of the hose is connected to the inlet of the third conduit.

[0013] In this embodiment, the circuit board welding device also includes a limit assembly, which includes a sensing plate and three photoelectric sensors sequentially arranged at the loading station, the welding station and the unloading station, the sensing plate is arranged on the carrier, and each of the photoelectric sensors is electrically connected to the controller so as to control the first moving assembly to stop when the carrier moves to the loading station, the welding station and the unloading station through the controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0015] Figure 1 A schematic structural diagram of a circuit board welding device provided in an embodiment of the present application; Figure 2 for Figure 1 Enlarged view of point A in the middle; Figure 3 for Figure 1 Enlarged view of point B in the middle; Figure 4 A schematic diagram of the structure of the carrier provided in an embodiment of the present application after removing the pressing component; Figure 5 A schematic structural diagram of a compression component provided in an embodiment of the present application; Figure 6 A schematic diagram of a portion of the structure of the tin supply assembly provided in an embodiment of the present application.

[0016] The above drawings include the following reference numerals: 1. First moving assembly; 11. Moving drive member; 12. Belt conveying member; 13. Guide rail; 14. Base; 2. Carrier; 21. Carrier body; 211. Avoidance groove; 22. Positioning member; 221. Positioning member; 2211. Positioning drive member; 2212. Transmission member; 2213. Positioning block; 2214. First protective pad; 23. Pressing member; 231. Support seat; 232. Pressing drive member; 233. Support member; 234. Flipping crimping member; 235. Second protective pad; 3. Second moving assembly; 31. Frame; 32. First linear module; 33. Second linear module; 4. Welding assembly; 5. Tin supply assembly; 51. Mounting frame; 52. Tin supply drive member; 53. Transmission member; 54. Rotating shaft; 55. Driving wheel; 56. First conduit; 57. Second conduit; 58. Third conduit; 59. Hose; 510. Reel; 6. First image acquisition assembly; 7. Limiting assembly; 71. Photoelectric sensor; 72. Sensor sheet. DETAILED DESCRIPTION

[0017] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0018] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0019] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0020] The embodiment of the present application provides a circuit board welding device, such as Figure 1As shown, the circuit board welding device includes a first moving component 1, a carrier 2, a second moving component 3, a welding component 4, a tin supply component 5, a first image acquisition component 6 and a controller. The first moving component 1 has an output end that moves along the Y direction, and the first moving component 1 has a loading station, a welding station and an unloading station distributed in sequence along the Y direction; the carrier 2 is arranged at the output end of the first moving component 1, and the carrier 2 is used to position the circuit board; the second moving component 3 has an output end that moves along the X direction and the Z direction, and the output end of the second moving component 3 is located above the welding station, and the X direction, Y direction and Z direction are orthogonal to each other; the welding component 4 is arranged at the output end of the second moving component 3, and the welding component 5 is provided at the output end of the second moving component 3. Component 4 is used to solder the circuit board; the tin supply component 5 is arranged at the output end of the second moving component 3 and is located on one side of the welding component 4. The tin supply component 5 is used to supply tin wire to the soldering point when the welding component 4 solders the circuit board; the first image acquisition component 6 is used to obtain image information of the circuit board in the carrier 2; the controller is electrically connected to the first moving component 1, the second moving component 3, the welding component 4, and the first image acquisition component 6. The controller is used to control the movement of the first moving component 1 and the second moving component 3 according to the image information obtained by the first image acquisition component 6 to drive the welding component 4 to move to the soldering point position, and control the speed and time of the tin supply component 5 when supplying tin.

[0021] Among them, the first moving component 1 has a loading station, a welding station and an unloading station distributed in sequence along the Y direction, which means that the first moving component 1 can drive the carrier 2 to move to the loading station, the welding station and the unloading station in sequence.

[0022] When welding is performed using the circuit board welding device in this embodiment, the carrier 2 is moved to the loading station by the first moving component 1, and the circuit board is placed on the carrier 2 at the loading station. The first moving component 1 then moves the circuit board to the welding station through the carrier 2, and the first image acquisition component 6 acquires image information of the circuit board located at the welding station. The controller obtains the position information of the solder joints of the circuit board based on the image information of the circuit board acquired by the first image acquisition component 6, and controls the first moving component 1 to move the carrier 2, and controls the second moving component 3 to align the welding component 4 and the tin supply component 5 with the solder joints for welding. At the same time, the speed and time of the tin supply component 5 when supplying tin are controlled according to the size of the corresponding solder joints to accurately provide the amount of tin, which is beneficial to improving the quality of welding. After the first solder joint is welded, the next solder joint is welded according to the preset path until the welding is completed. After the circuit board is welded, the second moving component 3 drives the welding component 4 and the tin supply component 5 to reset, and the first moving component 1 drives the carrier 2 to move to the unloading station for unloading and then reset, thereby realizing automatic welding of the circuit board, which is beneficial to improving welding efficiency.

[0023] In this embodiment, a robotic arm can be set at the loading station for loading materials, and a robotic arm can also be set at the unloading station to facilitate loading and unloading and improve work efficiency.

[0024] In this embodiment, if Figure 1 As shown, the first moving assembly 1 includes a moving drive 11, a belt conveyor 12, and a guide rail 13. The moving drive 11 is electrically connected to a controller. The belt conveyor 12 has at least two conveyor rollers distributed along the conveying direction, and the conveying direction of the belt conveyor 12 is the Y direction. The output end of the moving drive 11 is connected to one of the conveyor rollers. The guide rail 13 is provided on one side of the belt conveyor 12 and extends along the conveying direction of the belt conveyor 12. The carrier 2 is connected to the conveyor belt of the belt conveyor 12 and to the guide rail 13. The carrier 2 is movable relative to the guide rail 13.

[0025] For example, the moving driving member 11 is a servo motor.

[0026] Specifically, if Figure 1 As shown, the first moving assembly 1 further includes a base 14, on which the belt conveyor 12 and the guide rails 13 are both mounted. Guide rails 13 are provided on both sides of the belt conveyor 12, and the two sides of the carrier 2 are connected to the two guide rails 13 in a one-to-one correspondence, which is beneficial to improving the stability of the carrier 2 in movement.

[0027] It can be understood that by setting up a mobile driving member 11 to drive the belt conveying component 12 to operate, the belt conveying component 12 drives the carrier 2 to move along the Y direction. By connecting the carrier 2 to the guide rail 13, the carrier 2 can be guided by the guide rail 13, which can improve the stability and reliability of the carrier 2 during movement.

[0028] In this embodiment, if Figure 1 As shown, the second moving assembly 3 includes a frame 31, a first linear module 32, and a second linear module 33. The first linear module 32 is arranged on the frame 31, and the first linear module 32 has an output end in the X direction. The second linear module 33 is arranged at the output end of the first linear module 32, and the second linear module 33 has an output end along the Z direction. The first linear module 32 and the second linear module 33 are both electrically connected to the controller so that the movement of the first linear module 32 and the second linear module 33 can be controlled by the controller. The tin supply assembly 5, the welding assembly 4, and the first image acquisition assembly 6 are all arranged at the output end of the second linear module 33. For example, the frame 31 can be a gantry, which is conducive to the stable installation of the first linear module 32 and the second linear module 33. The specific structure of the first linear module 32 and the second linear module 33 is conventional existing technology, and those skilled in the art can select according to needs, and will not be described in detail here.

[0029] In this embodiment, the structure and working principle of the welding assembly 4 are conventional prior art and will not be described in detail here.

[0030] In this embodiment, the distance between the outlet of the tin supply assembly 5 and the soldering iron tip of the soldering gun of the soldering assembly 4 is D, and D is 0.3 mm-0.5 mm.

[0031] For example, D can be 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm or 0.5 mm, etc. If D is too large, it is not conducive to the tin wire to melt through the soldering iron tip. If D is too small, the tin wire is easily melted, affecting the welding quality.

[0032] In this embodiment, the distance between the outlet of the tin supply component 5 and the soldering iron tip of the soldering gun of the soldering component 4 is set to 0.3 mm-0.5 mm, which is conducive to ensuring the soldering quality.

[0033] In this embodiment, if Figure 1 As shown, the first image acquisition assembly 6 includes a first CCD camera and a first light source. The first CCD camera can be disposed at the output end of the second movable assembly 3, and the first light source is connected to the first CCD camera. The first CCD camera is electrically connected to the controller. The operating principles of the first CCD camera and the first light source are conventional in the art and will not be described in detail here.

[0034] In this embodiment, if Figure 1 and Figure 4 As shown, the carrier 2 includes a carrier body 21 and a positioning component 22. A positioning groove for placing a circuit board is provided on the top of the carrier body 21; the positioning component 22 includes a plurality of positioning members 221. Positioning members 221 are relatively provided on both sides of the carrier body 21 along the X direction and the Y direction. The position of the positioning portion of each positioning member 221 along the positioning direction is adjustable to be suitable for positioning circuit boards of different specifications.

[0035] Specifically, the positioning groove can accommodate circuit boards of different specifications to expand the scope of application.

[0036] Positioning members 221 are arranged oppositely on both sides of the carrier body 21 along the X direction and the Y direction. For example, there are four positioning members 221, and the four positioning members 221 can be arranged opposite to each other in pairs, with two positioning members 221 distributed along the X direction and the other two positioning members 221 distributed along the Y direction.

[0037] It can be understood that by arranging multiple positioning members 221 on the carrier body 21, the circuit board placed in the positioning groove is positioned, and the position of each positioning member 221 along the positioning direction is adjustable, that is, the position of the positioning portion of the positioning member 221 can be adjusted according to the size of the circuit board, so that the carrier body 21 can position circuit boards of different specifications, thereby realizing the welding of circuit boards of different specifications.

[0038] In this embodiment, if Figure 4As shown, the positioning member 221 includes a positioning drive member 2211, a transmission member 2212, and a positioning block 2213. The positioning drive member 2211 is arranged on the carrier body 21, the transmission member 2212 is arranged on the carrier body 21 and connected to the positioning drive member 2211, and the positioning block 2213 is arranged on the transmission member 2212. The positioning drive member 2211 can drive the positioning block 2213 to move along the positioning direction through the transmission member 2212. For example, the transmission member 2212 may be a screw, and a mounting slot is provided on the carrier body 21. The screw is disposed in the mounting slot and is rotatably connected to the carrier body 21. The positioning block 2213 is threadedly connected to the transmission member 2212, and one end of the positioning block 2213 connected to the transmission member 2212 is located in the mounting slot and can slide relative to the mounting slot. The positioning block 2213 can be limited by the mounting slot. The positioning drive member 2211 is a servo motor, and the output end of the positioning drive member 2211 is connected to one end of the transmission member 2212. When the positioning member 221 needs to position the circuit board, the positioning drive member 2211 drives the transmission member 2212 to rotate, converting the rotational motion of the transmission member 2212 into movement of the positioning block 2213 along the positioning direction.

[0039] It can be understood that when the circuit board needs to be positioned, the positioning drive member 2211 drives the positioning block 2213 to move along the positioning direction through the transmission member 2212. After the positioning block 2213 abuts against the circuit board, it stops moving. After multiple positioning blocks 2213 abut against the circuit board, the positioning of the circuit board can be achieved.

[0040] In this embodiment, if Figure 4 As shown, the positioning member 221 further includes a first protection pad 2214 , which is disposed on the positioning surface of the positioning block 2213 .

[0041] For example, the first protective pad 2214 may be made of rubber, which is soft and has a certain elasticity, and can prevent the positioning block 2213 from directly and hard contacting the circuit board.

[0042] Furthermore, the positioning surface of the first protective pad 2214 is an inclined surface, which slopes from the top to the bottom of the first protective pad 2214, from the side closest to the positioning center to the side farther away from the positioning center. The inclined surface preferentially contacts the top edge of the circuit board. As the positioning block 2213 continues to advance, the inclined surface generates a downward force component on the circuit board, compressing the circuit board and improving the stability of the circuit board's positioning.

[0043] It can be understood that by providing the first protection pad 2214 , the circuit board can be protected when the circuit board is positioned.

[0044] In this embodiment, if Figure 1 and Figure 5As shown, the carrier 2 further includes a pressing component 23 . The pressing component 23 is disposed on the carrier body 21 . The pressing component 23 is used to press the circuit board in the positioning groove from the Z direction.

[0045] It can be understood that by setting the clamping component 23, by setting the clamping component 23, and by the cooperation between the clamping component 23 and the bottom plate of the positioning groove, the circuit board can be fixed from the Z direction to avoid the circuit board from jumping, which is conducive to improving the accuracy of welding.

[0046] In this embodiment, if Figure 1 and Figure 5 As shown, there are multiple clamping parts 23, and the multiple clamping parts 23 are distributed at the four corners of the carrier body 21. The clamping parts 23 include a support seat 231, a clamping drive 232, a support member 233 and a flip crimping member 234. The support seat 231 is arranged on the carrier body 21; the clamping drive 232 is arranged on the support seat 231; the support member 233 is arranged on the support seat 231 and is located on one side of the clamping drive 232; the middle part of the flip crimping member 234 is hinged to the support member 233, and one end of the flip crimping member 234 is hinged to the output end of the clamping drive 232, and the other end of the flip crimping member 234 is used to be crimped on the circuit board in the positioning groove, and the clamping drive 232 is used to drive the flip crimping member 234 to rotate around the support member 233.

[0047] For example, the crimping drive member can be a cylinder, the cylinder body of the cylinder is hinged to the support seat 231, and the cylinder rod of the cylinder is hinged to the flip crimping member 234. The flip crimping member 234 is driven to rotate around the support member 233 by the extension and contraction of the cylinder rod. When the circuit board needs to be compressed, the cylinder rod of the cylinder is extended, the connection end of the flip crimping member 234 and the cylinder rod rises, and the other end of the flip crimping member 234 is pressed down; when the circuit board needs to be loosened, the cylinder rod of the cylinder is retracted, the connection end of the flip crimping member 234 and the cylinder rod drops, and the other end of the flip crimping member 234 rises away from the circuit board.

[0048] Specifically, the support base 231 can be connected to the side wall of the carrier body 21 by bolts. The support base 231 has a horizontal surface, and the pressing driving member 232 and the support member 233 can both be disposed on the horizontal surface of the support base 231.

[0049] When the circuit board needs to be fixed by the clamping component 23, the clamping drive 232 drives the flip crimping piece 234 to rise at one end connected to it. Since the middle part of the flip crimping piece 234 rotates around the support piece 233, the flip crimping piece 234 can be lowered away from one end of the clamping drive 232 and crimped on the circuit board. When the circuit board needs to be loosened, the clamping drive 232 drives the flip crimping piece 234 to fall at one end connected to it, while the other end of the flip crimping piece 234 rises, thereby loosening the circuit board.

[0050] Furthermore, if Figure 1 and Figure 4 As shown, the carrier body 21 is provided with an avoidance groove 211 at the position corresponding to the flip crimping piece 234. When the flip crimping piece 234 presses the circuit board, it can be flipped into the avoidance groove 211, so that the flip crimping piece 234 can fit more closely with the circuit board, ensuring more reliable fixation.

[0051] In this embodiment, if Figure 1 and Figure 5 As shown, the pressing component 23 further includes a second protective pad 235 , and one end of the flip crimping piece 234 that crimps the circuit board has an arc-shaped crimping angle, and the second protective pad 235 is arranged at the arc-shaped crimping angle.

[0052] The second protective pad 235 can be made of rubber, which is soft and elastic, and can provide better protection for the circuit board.

[0053] By providing the second protective pad 235, when the flip crimping piece 234 is turned over to crimp the circuit board, the second protective pad 235 contacts the circuit board, which can reduce damage to the circuit board, and can better fit the circuit board, thereby improving the reliability of the circuit board crimping.

[0054] In this embodiment, the circuit board welding device also includes a second image acquisition component (not shown in the figure), which is arranged at the loading station and electrically connected to the controller. Each positioning member 221 is electrically connected to the controller. The second image acquisition component is used to obtain image information of the circuit board in the carrier 2 located at the loading station, and the controller is used to control the moving position of the positioning part of the positioning member 221 according to the image information obtained by the second image acquisition component.

[0055] Specifically, the second image acquisition assembly includes a fixed frame, a second CCD camera, and a second light source. The fixed frame, which can be a gantry frame, is located at the loading station of the first mobile assembly 1. The second CCD camera is installed on the fixed frame and is electrically connected to the controller. The second light source is connected to the second CCD camera.

[0056] It can be understood that by setting up a second image acquisition component to obtain image information of the circuit board at the loading station, the specifications of the circuit board can be judged based on the image information, so that the moving distance of the positioning part of the positioning member 221 can be controlled according to the specifications of the circuit board, so as to automatically position the circuit board through the positioning member 221.

[0057] In this embodiment, the circuit board welding device further includes a third image acquisition component (not shown), which is disposed at the blanking station and electrically connected to the controller. The third image acquisition component captures image information of the circuit board at the blanking station, and the soldering quality of the circuit board is determined based on this image information. The structure of the third image acquisition component is identical to that of the second image acquisition component and will not be described in detail here. Of course, the first image acquisition component 6 can also be used to capture image information of the circuit board after soldering to determine the soldering quality of the circuit board, without limitation here.

[0058] In this embodiment, if Figure 1 and Figure 6 As shown, the tin supply assembly 5 includes a mounting frame 51, a tin supply drive member 52, a transmission member 53, two rotating shafts 54 and two toggle wheels 55. The mounting frame 51 is arranged at the output end of the second moving assembly 3; the tin supply drive member 52 is arranged on the mounting frame 51 and is electrically connected to the controller; the transmission member 53 is arranged on the mounting frame 51, and the input end of the transmission member 53 is connected to the output end of the tin supply drive member 52; the two rotating shafts 54 are arranged in parallel and at intervals on the mounting frame 51, and the two toggle wheels 55 are arranged on the two rotating shafts 54 in a one-to-one correspondence, and a gap is formed between the two toggle wheels 55 for the tin wire to pass through, and the two rotating shafts 54 are connected to the output end of the transmission member 53, and the tin supply drive member 52 drives the two rotating shafts 54 to rotate relative to each other through the transmission member 53.

[0059] Specifically, the mounting frame 51 includes a first mounting plate, a second mounting plate, a third mounting plate, a fourth mounting plate, and a fifth mounting plate. The first mounting plate is disposed at the output end of the second movable assembly 3. The second mounting plate is spaced parallel to the first mounting plate and connected via the third mounting plate. The tin-feeding driver 52 is disposed in the space between the first and second mounting plates and connected to the second mounting plate. The fourth and fifth mounting plates are disposed on the side of the second mounting plate facing away from the first mounting plate, and are spaced parallel to each other above and below. The transmission component 53, two transmission shafts, and two toggle wheels 55 are all disposed between the fourth and fifth mounting plates. One end of each transmission shaft is rotatably connected to the second mounting plate.

[0060] For example, the tin supply driving member 52 may be a servo motor.

[0061] It is understood that when tin wire is supplied through the tin supply assembly 5 of this embodiment, the tin wire is first passed through the gap between the two toggle wheels 55. The tin supply driver 52 drives the two rotating shafts 54 to rotate relative to each other via the transmission component 53. The two rotating shafts 54 drive the two toggle wheels 55 to rotate relative to each other. Under the friction of the two toggle wheels 55, the tin wire can be transported downstream. By controlling the speed of the output of the tin supply driver 52, the toggle speed of the toggle wheels 55 can be controlled. The faster the toggle speed of the toggle wheels 55, the faster the tin wire is supplied.

[0062] In this embodiment, if Figure 1 and Figure 6 As shown, the transmission component 53 includes a driving gear, a first driven gear, and a second driven gear. The driving gear is disposed on the output shaft of the tin supply drive 52. The first and second driven gears are disposed one-to-one on two rotating shafts 54. The first driven gear and the driving gear mesh with each other, and the first and second driven gears mesh with each other. The tin supply drive 52 drives the driving gear to rotate, which in turn drives the first driven gear to rotate, which in turn drives the second driven gear to rotate, thereby driving the two rotating shafts 54 to rotate. The two toggle wheels 55 rotate synchronously with the two rotating shafts 54.

[0063] In this embodiment, if Figure 1 、 Figure 2 and Figure 6 As shown, the tin supply assembly 5 further includes a first conduit 56 and a second conduit 57 . The first conduit 56 is disposed at the entrance of the gap between the two toggle wheels 55 , and the second conduit 57 is disposed at the exit of the gap between the two toggle wheels 55 .

[0064] Specifically, the first conduit 56 is provided on the fourth mounting plate, and the second conduit 57 is provided on the fifth mounting plate.

[0065] It can be understood that by setting a first conduit 56 at the entrance of the gap between the two toggle wheels 55, the tin wire can be guided by the first conduit 56 when entering the gap between the two toggle wheels 55, and by setting a second conduit 57 at the exit of the gap between the two toggle wheels 55, the tin wire can be guided by the second conduit 57 when moving out of the gap between the two toggle wheels 55, which is conducive to the smooth transportation of the tin wire downstream.

[0066] In this embodiment, if Figure 1 and Figure 2 As shown, the tin supply assembly 5 also includes a third conduit 58 and a hose 59. The third conduit 58 is arranged on one side of the welding assembly 4. One end of the hose 59 is connected to the outlet of the second conduit 57, and the other end of the hose 59 is connected to the inlet of the third conduit 58.

[0067] The provision of a third conduit 58 to guide the tin wire outputted by the tin supply assembly 5 facilitates accurate control of the tin supply position by the tin supply assembly 5, thereby improving soldering quality. A hose 59 is provided between the third conduit 58 and the second conduit 57 to guide the tin wire, facilitating smooth transfer of the tin wire from the second conduit 57 to the third conduit 58.

[0068] In this embodiment, if Figure 1 and Figure 6 As shown, the tin supply assembly 5 further includes a reel 510, which is disposed on the mounting frame 51 and above the two toggle wheels 55. By arranging the reel 510, a tin wire roll can be disposed on the reel 510 to facilitate conveying the tin wire downstream.

[0069] In this embodiment, if Figure 1 and Figure 3 As shown, the circuit board welding device also includes a limit assembly 7, which includes a sensing plate 72 and three photoelectric sensors 71 sequentially arranged at the loading station, welding station and unloading station. The sensing plate 72 is arranged on the carrier 2, and each photoelectric sensor 71 is electrically connected to the controller to control the first moving assembly 1 to stop when the carrier 2 moves to the loading station, welding station and unloading station through the controller.

[0070] It can be understood that by setting photoelectric sensors 71 at the loading station, welding station and unloading station, and setting a sensing plate 72 on the carrier 2, the sensing plate 72 moves to the loading station, welding station and unloading station to trigger the photoelectric switch to feedback a signal to the controller, so that the controller controls the first moving component 1 to stop at the loading station, welding station and unloading station, so as to stop the carrier 2 at the loading station for loading, at the welding station for welding, and at the unloading station for unloading.

[0071] The above is a detailed introduction to a circuit board welding device provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only intended to help understand the method and core concept of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A circuit board welding device, characterized in that: include: A first moving assembly having an output end that moves along the Y direction, and the first moving assembly having a loading station, a welding station, and an unloading station sequentially distributed along the Y direction; A carrier, which is arranged at the output end of the first moving component and is used to position the circuit board; a second movable assembly having an output end movable along an X direction and a Z direction, wherein the output end of the second movable assembly is located above the welding station, and the X direction, the Y direction, and the Z direction are mutually orthogonal in pairs; a welding assembly, the welding assembly being arranged at an output end of the second moving assembly and being used for welding a circuit board; a tin supply assembly, the tin supply assembly being arranged at the output end of the second moving assembly and being located on one side of the soldering assembly, the tin supply assembly being used to supply tin wire to the soldering point when the soldering assembly solders the circuit board; a first image acquisition component, configured to acquire image information of the circuit board in the carrier; A controller is electrically connected to the first movable component, the second movable component, the welding component, and the first image acquisition component. The controller is used to control the movement of the first movable component and the second movable component according to the image information obtained by the first image acquisition component to drive the welding component to move to the welding point position, and control the speed and time of the tin supply component when supplying tin.

2. The circuit board welding device according to claim 1, characterized in that: The carrier includes: A carrier body, wherein a positioning groove for placing the circuit board is provided on the top of the carrier body; The positioning component includes a plurality of positioning members, and the positioning members are relatively arranged on both sides of the carrier body along the X direction and the Y direction. The position of the positioning portion of each positioning member along the positioning direction is adjustable to be suitable for positioning circuit boards of different specifications.

3. The circuit board welding device according to claim 2, characterized in that: The positioning member includes a positioning drive member, a transmission member, and a positioning block. The positioning drive member is arranged on the carrier body, the transmission member is arranged on the carrier body and connected to the positioning drive member, and the positioning block is arranged on the transmission member. The positioning drive member can drive the positioning block to move along the positioning direction through the transmission member.

4. The circuit board welding device according to claim 2, characterized in that: The carrier further includes a pressing component, which is disposed on the carrier body and is used to press the circuit board located in the positioning groove from a Z direction.

5. The circuit board welding device according to claim 4, characterized in that: There are multiple pressing components, which are distributed at the four corners of the carrier body. The pressing components include: A support base, the support base being arranged on the carrier body; a pressing drive member, the pressing drive member being arranged on the support seat; a support member, the support member being arranged on the support seat and located on one side of the pressing drive member; A flip crimping piece, the middle part of which is hinged to the support piece, and one end of which is hinged to the output end of the clamping drive piece, the other end of which is used to be crimped onto the circuit board in the positioning groove, and the clamping drive piece is used to drive the flip crimping piece to rotate around the support piece.

6. The circuit board welding device according to claim 2, characterized in that: It also includes a second image acquisition component, which is arranged at the loading station and electrically connected to the controller. Each of the positioning members is electrically connected to the controller. The second image acquisition component is used to obtain image information of the circuit board in the carrier located at the loading station. The controller is used to control the moving position of the positioning part of the positioning member according to the image information obtained by the second image acquisition component.

7. The circuit board welding device according to claim 1, characterized in that: The tin supply assembly includes: a mounting frame, the mounting frame being arranged at an output end of the second moving assembly; a tin supply driving member, the tin supply driving member being arranged on the mounting frame and electrically connected to the controller; A transmission component, the transmission component is arranged on the mounting frame, and the input end of the transmission component is connected to the output end of the tin supply drive component; Two rotating shafts and two toggle wheels, the two rotating shafts are arranged in parallel and at intervals on the mounting frame, the two toggle wheels are arranged on the two rotating shafts in a one-to-one correspondence, a gap is formed between the two toggle wheels for the tin wire to pass through, the two rotating shafts are connected to the output end of the transmission component, and the tin supply drive drives the two rotating shafts to rotate relative to each other through the transmission component.

8. The circuit board welding device according to claim 7, characterized in that: The tin supply assembly further includes a first conduit and a second conduit, wherein the first conduit is arranged at the entrance of the gap between the two toggle wheels, and the second conduit is arranged at the exit of the gap between the two toggle wheels.

9. The circuit board welding device according to claim 8, characterized in that: The tin supply assembly further includes a third conduit and a hose. The third conduit is arranged on one side of the welding assembly. One end of the hose is connected to the outlet of the second conduit, and the other end of the hose is connected to the inlet of the third conduit.

10. The circuit board welding device according to any one of claims 1 to 9, characterized in that: It also includes a limit assembly, which includes a sensing plate and three photoelectric sensors arranged in sequence at the loading station, the welding station and the unloading station. The sensing plate is arranged on the carrier, and each of the photoelectric sensors is electrically connected to the controller so as to control the first moving assembly through the controller to stop when the carrier moves to the loading station, the welding station and the unloading station.

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