Disclosed are a round plate secondary groove processing method and device, a computer device and a storage medium.

Abstract

The application discloses a kind of round plate secondary groove machining method, device, computer equipment and storage medium, belong to the technical field of groove laser cutting.The application can accurately obtain the edge coordinates and center point position of circular plate without manual intervention by using the automatic edge searching function of capacitive sensor, so as to automatically calculate the radius and center coordinates of the round plate, significantly improve the accuracy and efficiency of processing positioning, avoid cutting deviation caused by manual measurement or misalignment.In addition, by obtaining the processing parameters and automatically generating the corresponding numerical control programming program, the whole process automation from measurement to processing is realized, which greatly reduces the operation steps and human error.The application is suitable for secondary groove machining process with high precision requirement, which not only improves the processing quality and consistency, but also enhances the intelligent level and flexible production capacity of the equipment, and has good application and promotion value.

Description

Technical Field

[0001] This application belongs to the field of beveling laser cutting technology, specifically relating to a method, apparatus, computer equipment, and storage medium for secondary beveling of circular plates. Background Technology

[0002] Laser beveling technology, due to its advantages of high precision, high efficiency, and minimal heat-affected zone, is widely used in the metal sheet metal processing field, especially suitable for complex shapes and demanding welding pretreatment scenarios. In the sheet metal processing industry, stamped or one-piece formed circular sheets are commonly used to manufacture structural components such as flanges, tube sheets, and end caps. These components often require beveling before subsequent welding to ensure weld strength and forming quality. Since these parts are mostly mass-produced, precise and rapid secondary beveling is crucial for improving production capacity and reducing costs. Therefore, there is a certain demand for secondary beveling of stamped or one-piece formed circular sheets.

[0003] Traditional beveling secondary processing methods rely heavily on mechanical tooling fixtures, combined with drawing programs or vision systems for positioning and machining. However, for circular materials, adding specialized tooling presents challenges such as structural complexity, poor adaptability, and lengthy setup times, significantly limiting its flexibility and versatility. Furthermore, drawing programs typically require independent machining paths for each part, making the programming process cumbersome and increasing both the workload of programmers and the need for manual intervention on-site. This approach is particularly inefficient in small-batch or multi-variety production models, failing to meet the demands of flexible manufacturing and automation. Summary of the Invention

[0004] The purpose of this application is to provide a method, apparatus, computer equipment, and storage medium for secondary beveling of circular plates, in order to solve the technical problems that traditional methods have great limitations due to the addition of tooling, and that the output of the drawing program increases labor costs to some extent.

[0005] To address the aforementioned technical problems, this application provides a method for secondary beveling of a circular plate, employing the following technical solution:

[0006] A method for secondary beveling of a circular plate is disclosed. The method is applied to a beveling laser cutting equipment, which includes a laser cutting head and a worktable. The laser cutting head is positioned above the worktable, which is used to hold the circular plate to be cut. The processing method includes:

[0007] Move the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point;

[0008] Based on the first edge finding point, perform edge finding operation on the preset first coordinate axis to obtain the first edge finding endpoint and the second edge finding endpoint;

[0009] The landing point of the second edge search is determined based on the endpoints of the first and second edge searches.

[0010] Based on the second edge finding point, an edge finding operation is performed on the preset second coordinate axis to obtain the third edge finding point and the fourth edge finding point, wherein the first coordinate axis and the second coordinate axis are perpendicular to each other;

[0011] The center point and radius of the circular plate are determined based on the third and fourth edge-finding endpoints.

[0012] Obtain the machining parameters for the secondary beveling process, generate a CNC programming program for the secondary beveling process based on the machining parameters, the center point and radius of the circular plate, and execute the CNC programming program to complete the secondary beveling process of the circular plate.

[0013] Furthermore, the bevel laser cutting equipment also includes a nozzle located below the laser cutting head, and a capacitive sensor is installed on the nozzle. The processing method also includes:

[0014] During the edge finding operation, the endpoint of the edge finding is determined by the change in the capacitance value of the capacitance sensor.

[0015] Furthermore, before obtaining the first edge-finding point by moving the laser cutting head to any position on the circular plate, the processing method also includes:

[0016] Construct a Cartesian coordinate system within the plane containing the circular plate, where the first coordinate axis is either the X-axis or the Y-axis of the Cartesian coordinate system.

[0017] Furthermore, based on the first edge-finding point, an edge-finding operation is performed on a preset first coordinate axis to obtain the first edge-finding endpoint and the second edge-finding endpoint, specifically including:

[0018] Starting from the first edge-finding point, the laser cutting head is moved along the first axial direction of the first coordinate axis, and during the movement of the laser cutting head, the position where the capacitance value of the capacitance sensor changes abruptly is identified to obtain the first position;

[0019] The point on the Cartesian coordinate system corresponding to the first position is determined as the first endpoint of the edge search;

[0020] Move the laser cutting head to the first edge-finding landing point, and then move the laser cutting head along the second axis of the first coordinate axis again, starting from the first edge-finding landing point. During the movement of the laser cutting head, identify the position where the capacitance value of the capacitance sensor changes abruptly to obtain the second position.

[0021] The point corresponding to the second position in the Cartesian coordinate system is determined as the second endpoint for finding the edge.

[0022] Furthermore, the second edge-finding point is determined based on the first and second edge-finding endpoints, specifically including:

[0023] Determine the midpoint of the line connecting the first and second edge-finding endpoints to obtain the midpoint of the first edge-finding point;

[0024] The midpoint of the first edge search is determined as the landing point of the second edge search.

[0025] Furthermore, based on the second edge-finding point, an edge-finding operation is performed on the preset second coordinate axis to obtain the third and fourth edge-finding endpoints, specifically including:

[0026] Move the laser cutting head to the second edge-finding point. Starting from the second edge-finding point, move the laser cutting head along the first axial direction of the second coordinate axis. During the movement of the laser cutting head, identify the position where the capacitance value of the capacitance sensor changes abruptly to obtain the third position.

[0027] The point corresponding to the third position in the Cartesian coordinate system is determined as the third endpoint of the edge search;

[0028] Move the laser cutting head to the second edge-finding point, and then move the laser cutting head along the second axis of the second coordinate axis again, starting from the second edge-finding point. During the movement of the laser cutting head, identify the position where the capacitance value of the capacitance sensor changes abruptly to obtain the fourth position.

[0029] The point corresponding to the fourth position in the Cartesian coordinate system is determined as the fourth endpoint of the edge search.

[0030] Furthermore, the center point and radius of the circular plate are determined based on the third and fourth edge-finding endpoints, specifically including:

[0031] Determine the midpoint of the line connecting the endpoints of the third and fourth edge searches to obtain the midpoint of the second edge search;

[0032] The midpoint of the second edge search is determined as the center point of the circular plate.

[0033] Calculate the coordinate difference between the endpoint of the third or fourth edge finding and the midpoint of the second edge finding, and determine the coordinate difference as the radius of the circular plate.

[0034] To address the aforementioned technical problems, this application also provides a device for secondary beveling of circular plates, employing the following technical solution:

[0035] A circular plate secondary beveling processing device is disclosed. This device performs the circular plate secondary beveling processing method described above. The processing method is applied to a beveling laser cutting equipment, which includes a laser cutting head and a worktable. The laser cutting head is positioned above the worktable, which is used to place the circular plate to be cut. The processing device includes:

[0036] The first landing point module is used to move the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point;

[0037] The first edge-finding module is used to perform edge-finding operations on a preset first coordinate axis based on the first edge-finding landing point, and obtain the first edge-finding endpoint and the second edge-finding endpoint.

[0038] The second landing point module is used to determine the second edge landing point based on the first edge finding endpoint and the second edge finding endpoint.

[0039] The second edge-finding module is used to perform edge-finding operations on a preset second coordinate axis based on the second edge-finding landing point, to obtain the third edge-finding endpoint and the fourth edge-finding endpoint, wherein the first coordinate axis and the second coordinate axis are perpendicular to each other.

[0040] The center determination module is used to determine the center point and radius of a circular plate based on the third and fourth edge finding endpoints.

[0041] The secondary machining module is used to obtain the machining parameters for secondary beveling, generate a CNC programming program for secondary beveling based on the machining parameters, the center point and radius of the circular plate, and execute the CNC programming program to complete the secondary beveling of the circular plate.

[0042] To address the aforementioned technical problems, this application also provides a computer device that employs the following technical solution:

[0043] A computer device includes a memory and a processor, the memory storing computer-readable instructions, the processor executing the computer-readable instructions to implement the steps of the circular plate secondary beveling method as described in any of the preceding claims.

[0044] To address the aforementioned technical problems, this application also provides a computer-readable storage medium, employing the technical solution described below:

[0045] A computer-readable storage medium storing computer-readable instructions, which, when executed by a processor, implement the steps of the circular plate secondary beveling method as described above.

[0046] Compared with the prior art, the embodiments of this application have the following main advantages:

[0047] This application discloses a method, apparatus, computer equipment, and storage medium for secondary beveling of circular plates, belonging to the field of laser beveling technology. By utilizing the automatic edge-finding function of a capacitive sensor, this application can accurately acquire the edge coordinates and center point position of a circular plate without manual intervention, thereby automatically calculating the radius and center coordinates of the plate. This significantly improves the accuracy and efficiency of processing positioning and avoids cutting deviations caused by manual measurement or misalignment. Furthermore, by acquiring processing parameters and automatically generating corresponding CNC programming programs, the entire process from measurement to processing is automated, greatly reducing operational steps and human error. This application is applicable to secondary beveling processes with high precision requirements, not only improving processing quality and consistency but also enhancing the intelligence level and flexible production capabilities of the equipment, possessing significant application and promotion value. Attached Figure Description

[0048] To more clearly illustrate the solutions in this application, the accompanying drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 An exemplary system architecture diagram is shown, in which this application can be applied;

[0050] Figure 2 A flowchart of one embodiment of the circular plate secondary beveling method according to this application is shown;

[0051] Figure 3 It shows Figure 2 A flowchart of one embodiment of steps S202-S203;

[0052] Figure 4 It shows Figure 2 A flowchart of one embodiment of steps S204-S205;

[0053] Figure 5 One of the schematic diagrams shows an edge-finding operation performed according to the circular plate secondary beveling method of this application;

[0054] Figure 6 The second schematic diagram shows the edge-finding operation performed according to the circular plate secondary beveling method of this application;

[0055] Figure 7 A schematic diagram of one embodiment of the circular plate secondary beveling apparatus according to this application is shown;

[0056] Figure 8A schematic diagram of the structure of one embodiment of a computer device according to this application is shown. Detailed Implementation

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0058] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0059] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0060] like Figure 1 As shown, system architecture 100 may include terminal device 101, network 102, and server 103. Terminal device 101 may be a laptop 1011, tablet 1012, or mobile phone 1013. Network 102 is used as a medium to provide a communication link between terminal device 101 and server 103. Network 102 may include various connection types, such as wired, wireless communication links, or fiber optic cables.

[0061] Users can use terminal device 101 to interact with server 103 via network 102 to receive or send messages, etc. Various communication client applications can be installed on terminal device 101, such as web browser applications, shopping applications, search applications, instant messaging tools, email clients, social media platform software, etc.

[0062] Terminal device 101 can be various electronic devices with a display screen and support web browsing. In addition to laptops 1011, tablets 1012, or mobile phones 1013, terminal device 101 can also be e-book readers, MP3 players (Moving Picture Experts Group Audio Layer III), MP4 players (Moving Picture Experts Group Audio Layer IV), laptops, and desktop computers.

[0063] Server 103 can be a server that provides various services, such as a backend server that provides support for the pages displayed on terminal device 101.

[0064] It should be noted that the circular plate secondary beveling processing method provided in this application embodiment is generally executed by a server / terminal device, and correspondingly, the circular plate secondary beveling processing device is generally set in the server / terminal device.

[0065] It should be understood that Figure 1 The number of terminal devices, networks, and servers shown is merely illustrative; the system can have any number of terminal devices, networks, and servers depending on implementation needs.

[0066] A method for secondary beveling of a circular plate is disclosed. This method is applied to a beveling laser cutting equipment, which includes a laser cutting head and a worktable. The laser cutting head is positioned above the worktable, which is used to hold the circular plate to be cut. Furthermore, the beveling laser cutting equipment also includes a nozzle located below the laser cutting head. The laser nozzle is an auxiliary component of the cutting head, typically located below it, and is used to assist in gas injection, helping to remove slag generated during the cutting process and simultaneously cooling the cutting area.

[0067] A capacitive sensor is installed on the nozzle. The height distance between the capacitive sensor and the cutting plate is equivalent to the distance between the two plates of a capacitor. The detection capacitance value of the capacitive sensor changes with the distance between the plates. By detecting the feedback capacitance value, it is possible to identify whether the edge of the cutting plate has been found, thereby obtaining the corresponding coordinates of the plate edge, and then calculating the center coordinates and the size of the disk.

[0068] Continue to refer to Figure 2 A flowchart illustrating an embodiment of a method for secondary beveling of a circular plate according to this application is shown. The method for secondary beveling of a circular plate includes the following steps:

[0069] S201, Move the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point;

[0070] Specifically, a Cartesian coordinate system is constructed within the plane where the circular plate is located. The laser cutting equipment control system moves the cutting head above any contact point of the circular plate according to the initially set displacement parameters. The contact point is taken as the first edge-finding landing point. The position coordinates of the contact point are determined according to the constructed Cartesian coordinate system and the displacement parameters, which are the position coordinates of the first edge-finding landing point.

[0071] S202, based on the first edge finding point, perform an edge finding operation on the preset first coordinate axis to obtain the first edge finding endpoint and the second edge finding endpoint;

[0072] Specifically, starting from the first edge-finding point, the laser cutting head is controlled to move along two directions (X-axis or Y-axis) of the preset first coordinate axis. At the same time, the change in capacitance value is monitored by a capacitance sensor to determine in real time whether the cutting head has contacted the edge of the board. The positions where the laser cutting head leaves the board in the two directions of the first coordinate axis are recorded as the first edge-finding endpoint and the second edge-finding endpoint.

[0073] S203, determine the second edge-finding point based on the first edge-finding endpoint and the second edge-finding endpoint;

[0074] Specifically, connect the first edge-finding endpoint and the second edge-finding endpoint, determine the midpoint of the line connecting the first edge-finding endpoint and the second edge-finding endpoint, obtain the first edge-finding midpoint, and determine the coordinates of the midpoint. This first edge-finding midpoint is also the second edge-finding landing point, which is located on the center line of the circular plate in the direction of the first coordinate axis. It is the key starting point for vertical edge-finding.

[0075] S204, based on the second edge finding point, perform edge finding operation on the preset second coordinate axis to obtain the third edge finding endpoint and the fourth edge finding endpoint, wherein the first coordinate axis and the second coordinate axis are perpendicular to each other;

[0076] Specifically, the laser cutting head is controlled to move to the midpoint of the line connecting the first and second edge-finding endpoints, i.e., the second edge-finding landing point. Starting from this second edge-finding landing point, the cutting head is moved along two directions of the second coordinate axis perpendicular to the first coordinate axis (e.g., when the first coordinate axis is the X-axis, the second coordinate axis is the Y-axis; when the first coordinate axis is the Y-axis, the second coordinate axis is the X-axis). The edge contact situation is further detected using a capacitive sensor, and the positions where the laser cutting head leaves the board in the two directions of the second coordinate axis are recorded respectively, serving as the third and fourth edge-finding endpoints.

[0077] S205, determine the center point and radius of the circular plate based on the third and fourth edge-finding endpoints;

[0078] Specifically, connect the third and fourth edge-finding endpoints, determine the midpoint of the line connecting the third and fourth edge-finding endpoints (which is also the midpoint of the second edge-finding), determine the coordinates of the midpoint (which is also the center point of the circular board), calculate the coordinate difference between the third or fourth edge-finding endpoint and the midpoint of the second edge, and determine the radius of the circular board.

[0079] S206: Obtain the machining parameters for the secondary beveling process, generate a CNC programming program for the secondary beveling process based on the machining parameters, the center point and radius of the circular plate, and execute the CNC programming program to complete the secondary beveling process of the circular plate.

[0080] Specifically, based on the processing requirements, the system imports processing parameters such as bevel angle, plate thickness, and part radius. Combined with the measured center coordinates and radius, it automatically generates a G-code program for the CNC machine tool. After the program is generated, the system controls the laser cutting head to perform processing operations according to the preset path and parameters, completing the secondary bevel cutting task of the circular plate.

[0081] In the above embodiments, this application discloses a method for secondary beveling of circular plates, belonging to the field of laser beveling technology. By utilizing the automatic edge-finding function of a capacitive sensor, this application can accurately acquire the edge coordinates and center point position of a circular plate without manual intervention, thereby automatically calculating the radius and center coordinates of the plate. This significantly improves the accuracy and efficiency of processing positioning and avoids cutting deviations caused by manual measurement or misalignment. Furthermore, by acquiring processing parameters and automatically generating corresponding CNC programming programs, the entire process from measurement to processing is automated, greatly reducing operational steps and human error. This application is applicable to secondary beveling processes with high precision requirements, not only improving processing quality and consistency but also enhancing the intelligence level and flexible production capabilities of the equipment, possessing significant application and promotion value.

[0082] Furthermore, before obtaining the first edge-finding point by moving the laser cutting head to any position on the circular plate, the processing method also includes:

[0083] Construct a Cartesian coordinate system within the plane containing the circular plate, where the first coordinate axis is either the X-axis or the Y-axis. Specifically, when the first coordinate axis is the X-axis, the second coordinate axis is the Y-axis; and when the first coordinate axis is the Y-axis, the second coordinate axis is the X-axis.

[0084] Further, please refer to Figure 3 Based on the first edge-finding point, an edge-finding operation is performed on a preset first coordinate axis to obtain the first edge-finding endpoint and the second edge-finding endpoint, specifically including:

[0085] S301, Starting from the first edge-finding point, the laser cutting head moves along the first axial direction of the first coordinate axis, and during the movement of the laser cutting head, the position where the capacitance value of the capacitance sensor changes abruptly is identified to obtain the first position;

[0086] S302, the point corresponding to the first position on the plane rectangular coordinate system is determined as the first edge-finding endpoint;

[0087] S303, move the laser cutting head to the first edge finding point, and then move the laser cutting head along the second axial direction of the first coordinate axis, starting from the first edge finding point. During the movement of the laser cutting head, identify the position where the capacitance value of the capacitance sensor changes abruptly to obtain the second position.

[0088] S304, the point corresponding to the second position on the Cartesian coordinate system is determined as the second endpoint of the edge search.

[0089] In this embodiment, the edge-finding operation of the laser cutting head effectively identifies the edge position of the worktable surface through a capacitive sensor. In steps S301 and S302, the laser cutting head moves along the first axis of the first coordinate axis, and accurately locates the first edge-finding endpoint by monitoring sudden changes in capacitance value. Real-time feedback is provided by the capacitive sensor, ensuring high accuracy and reliability of position identification. Steps S303 and S304 correspondingly perform edge-finding operations in the second direction, further expanding the detection range. This not only improves the speed of edge detection but also ensures the consistency and accuracy of position identification in different directions. Through cyclic edge-finding operations, the positioning error throughout the cutting process is significantly reduced.

[0090] Through the above steps, high-precision and rapid edge detection is achieved, improving the accuracy and automation of laser cutting.

[0091] Furthermore, the second edge-finding point is determined based on the first and second edge-finding endpoints, specifically including:

[0092] S305, determine the midpoint of the line connecting the first edge finding endpoint and the second edge finding endpoint, and obtain the midpoint of the first edge finding;

[0093] S306, determine the midpoint of the first edge search as the landing point of the second edge search.

[0094] In this embodiment, the landing point of the second edge finding can be accurately determined based on the line connecting the first and second edge finding endpoints. Specifically, step S305 calculates the midpoint of the line connecting the first and second edge finding endpoints to obtain the first edge finding midpoint, and step S306 sets the first edge finding midpoint as the landing point of the second edge finding, so that the subsequent secondary edge finding operation can start from a more central position, ensuring the symmetry and balance of the overall processing.

[0095] Through the above steps, this scheme improves the accuracy and efficiency of the cutting path, and ensures the smoothness and quality of the secondary edge finding process.

[0096] Further, please refer to Figure 4 Based on the second edge-finding point, an edge-finding operation is performed on the preset second coordinate axis to obtain the third and fourth edge-finding endpoints, specifically including:

[0097] S401, move the laser cutting head to the second edge-finding point, and move the laser cutting head along the first axial direction of the second coordinate axis starting from the second edge-finding point. During the movement of the laser cutting head, identify the position where the capacitance value of the capacitance sensor changes abruptly to obtain the third position.

[0098] S402, the point corresponding to the third position in the Cartesian coordinate system is determined as the third endpoint of the edge search;

[0099] S403, move the laser cutting head to the second edge finding point, and then move the laser cutting head along the second axis of the second coordinate axis again, starting from the second edge finding point. During the movement of the laser cutting head, identify the position where the capacitance value of the capacitance sensor changes abruptly to obtain the fourth position.

[0100] S404, the point corresponding to the fourth position on the Cartesian coordinate system is determined as the fourth endpoint of the edge search.

[0101] In this embodiment, the edge-finding operation based on the second edge-finding point can efficiently obtain the third and fourth edge-finding endpoints. In step S401, the laser cutting head moves along the first axis of the second coordinate axis from the second edge-finding point according to the settings. By monitoring the changes in the readings of the capacitance sensor, it accurately identifies the location of the sudden change in capacitance value and determines it as the third position point. Subsequently, in step S402, this third position is converted into a point on a Cartesian coordinate system and marked as the third edge-finding endpoint. Next, in step S403, the laser cutting head returns to the second edge-finding point and moves along the second axis of the second coordinate axis in the same way, and identifies the change in capacitance value again to determine the fourth position. Finally, in step S404, it is marked as the fourth edge-finding endpoint.

[0102] Through the above steps, high-precision and rapid edge detection is achieved, improving the accuracy and automation of laser cutting.

[0103] Furthermore, the center point and radius of the circular plate are determined based on the third and fourth edge-finding endpoints, specifically including:

[0104] S405, determine the midpoint of the line connecting the endpoints of the third and fourth edge searches, and obtain the midpoint of the second edge search;

[0105] S406, the midpoint of the second edge search is determined as the center point of the circular plate;

[0106] S407, calculate the coordinate difference between the endpoint of the third or fourth edge finding and the midpoint of the second edge finding, and determine the coordinate difference as the radius of the circular plate.

[0107] In this embodiment, the center point and radius of the circular plate can be accurately determined based on the line connecting the third and fourth edge-finding endpoints. Step S405 calculates the midpoint of the line connecting the third and fourth edge-finding endpoints to obtain the second edge-finding midpoint, which serves as the center point of the circular plate, ensuring highly accurate positioning of the center. In step S407, the coordinate difference between the third or fourth edge-finding endpoint and the center point is calculated, and this difference is defined as the radius of the circular plate.

[0108] Through the above steps, the geometric features of the circular plate were determined with high precision.

[0109] Example 1

[0110] Taking the first coordinate axis as the X-axis and the second coordinate axis as the Y-axis as an example, please refer to... Figure 5 P 01 (X 01 ,Y 01 The laser cutting head is moved to the first edge-finding point. Based on this point, an edge-finding operation is performed on the X-axis. The laser cutting head first moves in the X+ direction. When the capacitance value of the capacitance sensor changes abruptly, the first edge-finding endpoint P is found. 11 (X 11 ,Y 01 Then move the laser cutting head in the X- direction. When the capacitance value of the capacitance sensor changes abruptly again, the second edge-finding endpoint P is found. 12 (X 12 ,Y 01 According to the first edge finding endpoint P, 11 (X 11 ,Y 01 ) and the second edge-finding endpoint P 12 (X 12 ,Y 01 Determine the second edge-finding point P. 10 The second edge-finding point P 10 Let P be the midpoint of the line connecting the endpoints of the first and second edge searches. Therefore, the endpoint of the second edge search is P. 10 The X-axis coordinate is (X 11 +X 12 ) / 2, the second edge-finding point P 10 The coordinates are [(X 11 +X 12 ) / 2,Y 01].

[0111] Then, find the second edge point P. 10 [(X 11 +X 12 ) / 2,Y 01 The laser cutting head is moved to the second edge-finding point. Based on the second edge-finding point, an edge-finding operation is performed on the Y-axis. The laser cutting head is first moved in the Y+ direction. When the capacitance value of the capacitance sensor changes abruptly, the third edge-finding endpoint P is found. 21 [(X 11 +X 12 ) / 2,Y 21 Then move the laser cutting head in the Y-direction. When the capacitance value of the capacitance sensor changes abruptly again, the fourth edge-finding endpoint P is found. 22 [(X 11 +X 12 ) / 2,Y 22 According to the third edge-finding endpoint P 21 [(X 11 +X 12 ) / 2,Y 21 ] and the fourth edge-finding endpoint P 22 [(X 11 +X 12 ) / 2,Y 22 Determine the center point P of the circular plate. 20 The center point P of the circular plate 20 P is the midpoint of the line connecting the third and fourth edge-finding endpoints. Therefore, the center point P of the circular plate is... 20 The Y-axis coordinate is (Y 21 +Y 22 ) / 2, the center point P of the circular plate 20 The coordinates are [(X 11 +X 12 ) / 2,(Y 21 +

[0112] Y 22 ) / 2].

[0113] Meanwhile, in one embodiment of this application, the third edge-finding endpoint P can be used as a basis. 21 [(X 11 +X 12 ) / 2,Y 21 The fourth edge-finding endpoint P 22 [(X 11 +X 12 ) / 2,Y 22 And the center point P of the circular plate. 20 [(X 11 +X 12 ) / 2,(Y21 +Y 22 ) / 2] Calculate the radius of the circular plate. Specifically, the radius of the circular plate R1 = Y 21 -(Y 21 +Y 22 ) / 2, or, the radius R1 of the circular plate = (Y) / 2. 21 +Y 22 ) / 2-Y 22 In another embodiment of this application, the method can also be based on the third edge-finding endpoint P. 21 [(X 00 +X 12 ) / 2,Y 21 ] and the fourth edge-finding endpoint P 22 [(X 11 +X 12 ) / 2,Y 22 Calculate the radius of the circular plate. Specifically, the radius of the circular plate is R1 = (Y... 21 -Y 22 ) / 2.

[0114] Example 2

[0115] Taking the first coordinate axis as the Y-axis and the second coordinate axis as the X-axis as an example, please refer to... Figure 6 P 01 (X 00 ,Y 01 The laser cutting head is moved to the first edge-finding point. Based on this point, an edge-finding operation is performed on the Y-axis. The laser cutting head first moves in the Y+ direction. When the capacitance value of the capacitance sensor changes abruptly, the first edge-finding endpoint P is found. 11 (X 01 ,Y 11 Then move the laser cutting head in the Y-direction. When the capacitance value of the capacitance sensor changes abruptly again, the second edge-finding endpoint P is found. 12 (X 01 ,Y 12 According to the first edge finding endpoint P, 11 (X 01 ,Y 11 ) and the second edge-finding endpoint P 12 (X 01 ,Y 12 Determine the second edge-finding point P. 10 The second edge-finding point P 10 Let P be the midpoint of the line connecting the endpoints of the first and second edge searches. Therefore, the endpoint of the second edge search is P. 10 The Y-axis coordinate is (Y 11 +Y 12 ) / 2, the second edge-finding point P 10 Coordinates are [X01 ,(Y 11 +Y 12 ) / 2].

[0116] Then, find the second edge point P. 10 [X 01 ,(Y 11 +Y 12 [2] Move the laser cutting head to the second edge-finding point, and perform edge-finding operation on the X-axis based on the second edge-finding point. Move the laser cutting head first in the X+ direction. When the capacitance value of the capacitance sensor changes abruptly, find the third edge-finding endpoint P. 21 [X 21 ,(Y 11 +Y 12 [) / 2]; Then move the laser cutting head in the X- direction. When the capacitance value of the capacitance sensor changes abruptly again, the fourth edge-finding endpoint P is found. 22 [X 22 ,(Y 10 +Y 12 ) / 2], according to the third edge finding endpoint P 21 [X 21 ,(Y 11 +Y 12 [) / 2] and the fourth edge-finding endpoint P 22 [X 22 ,(Y 11 +Y 12 Determine the center point P of the circular plate. 20 The center point P of the circular plate 20 P is the midpoint of the line connecting the third and fourth edge-finding endpoints. Therefore, the center point P of the circular plate is... 20 The X-axis coordinate is (X 21 +X 22 ) / 2, the center point P of the circular plate 20 The coordinates are [(X 21 +X 22 ) / 2,(Y 11 +

[0117] Y 12 ) / 2].

[0118] Meanwhile, in one embodiment of this application, the third edge-finding endpoint P can be used as a basis. 21 [X 21 ,(Y 11 +Y 12 ) / 2]、The fourth edge-finding endpoint P 22 [X 22 ,(Y 11 +Y 12 ) / 2] and the center point P of the circular plate 20[(X 21 +X 22 ) / 2,(Y 11 +Y 12 ) / 2] Calculate the radius of the circular plate. Specifically, the radius of the circular plate is R1 = X 21 -(X 21 +X 22 ) / 2, or, the radius R1 of the circular plate = (X 21 +X 22 ) / 2-X 22 In another embodiment of this application, the method can also be based on the third edge-finding endpoint P. 21 [X 21 ,(Y 11 +Y 12 [) / 2] and the fourth edge-finding endpoint P 22 [X 22 ,(Y 11 +Y 12 ) / 2] Calculate the radius of the circular plate. Specifically, the radius of the circular plate R1 = (X 21 -X 22 ) / 2.

[0119] In the above embodiments, this application discloses a method for secondary beveling of circular plates, belonging to the field of laser beveling technology. By utilizing the automatic edge-finding function of a capacitive sensor, this application can accurately acquire the edge coordinates and center point position of a circular plate without manual intervention, thereby automatically calculating the radius and center coordinates of the plate. This significantly improves the accuracy and efficiency of processing positioning and avoids cutting deviations caused by manual measurement or misalignment. Furthermore, by acquiring processing parameters and automatically generating corresponding CNC programming programs, the entire process from measurement to processing is automated, greatly reducing operational steps and human error. This application is applicable to secondary beveling processes with high precision requirements, not only improving processing quality and consistency but also enhancing the intelligence level and flexible production capabilities of the equipment, possessing significant application and promotion value.

[0120] In this embodiment, the circular plate secondary beveling method operates on electronic equipment (e.g., Figure 1 The server shown can receive instructions or acquire data via wired or wireless connection. It should be noted that the aforementioned wireless connection methods may include, but are not limited to, 3G / 4G connections, WiFi connections, Bluetooth connections, WiMAX connections, Zigbee connections, UWB (ultra-wideband) connections, and other currently known or future wireless connection methods.

[0121] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by instructing related hardware with computer-readable instructions. These computer-readable instructions can be stored in a computer-readable storage medium. When executed, the program can include the processes of the embodiments of the above methods. The aforementioned storage medium can be a non-volatile storage medium such as a magnetic disk, optical disk, or read-only memory (ROM), or random access memory (RAM).

[0122] It should be understood that although the steps in the flowcharts of the accompanying figures are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the accompanying figures may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0123] Further reference Figure 7 As a response to the above Figure 2 To implement the method shown, this application provides an embodiment of a circular plate secondary beveling device, which is similar to... Figure 2 Corresponding to the method embodiments shown, this device can be specifically applied to various electronic devices.

[0124] like Figure 7 As shown, the circular plate secondary beveling processing device 700 described in this embodiment performs the circular plate secondary beveling processing method as described above. The processing method is applied to a beveling laser cutting equipment, which includes a laser cutting head and a worktable. The laser cutting head is disposed above the worktable, and the worktable is used to place the circular plate to be cut. The circular plate secondary beveling processing device 700 includes:

[0125] The first landing point module 701 is used to move the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point;

[0126] The first edge finding module 702 is used to perform edge finding operations on a preset first coordinate axis based on the first edge finding point to obtain the first edge finding endpoint and the second edge finding endpoint.

[0127] The second landing point module 703 is used to determine the second edge-finding landing point based on the first edge-finding endpoint and the second edge-finding endpoint.

[0128] The second edge-finding module 704 is used to perform edge-finding operations on a preset second coordinate axis based on the second edge-finding landing point to obtain the third edge-finding endpoint and the fourth edge-finding endpoint, wherein the first coordinate axis and the second coordinate axis are perpendicular to each other.

[0129] The center determination module 705 is used to determine the center point and radius of the circular plate based on the third and fourth edge finding endpoints.

[0130] The secondary processing module 706 is used to obtain the processing parameters for secondary beveling, generate a CNC programming program for secondary beveling based on the processing parameters, the center point and radius of the circular plate, and execute the CNC programming program to complete the secondary beveling of the circular plate.

[0131] Furthermore, the beveling laser cutting equipment also includes a nozzle located below the laser cutting head, and a capacitive sensor is installed on the nozzle. The circular plate secondary beveling processing device 700 also includes:

[0132] The capacitance value determination module is used to determine the endpoint of the edge finding operation by measuring the change in capacitance value of the capacitance sensor.

[0133] Furthermore, before obtaining the first edge-finding point by moving the laser cutting head to any position on the circular plate, the circular plate secondary beveling device 700 also includes:

[0134] The coordinate system construction module is used to construct a Cartesian coordinate system in the plane where the circular plate is located, wherein the first coordinate axis is the X-axis or Y-axis of the Cartesian coordinate system.

[0135] Furthermore, the first edge-finding module 702 specifically includes:

[0136] The first position unit is used to move the laser cutting head along the first axial direction of the first coordinate axis, starting from the first edge-finding point, and to identify the position where the capacitance value of the capacitance sensor changes abruptly during the movement of the laser cutting head, thereby obtaining the first position.

[0137] The first edge-finding endpoint determination unit is used to determine the point on the plane rectangular coordinate system corresponding to the first position as the first edge-finding endpoint;

[0138] The second position unit is used to move the laser cutting head to the first edge-finding landing point, and then move the laser cutting head again along the second axial direction of the first coordinate axis, starting from the first edge-finding landing point. During the movement of the laser cutting head, the unit identifies the position where the capacitance value of the capacitance sensor changes abruptly, and obtains the second position.

[0139] The second edge finding endpoint determination unit is used to determine the point on the plane rectangular coordinate system corresponding to the second position as the second edge finding endpoint.

[0140] Furthermore, the second landing point module 703 specifically includes:

[0141] The first edge finding midpoint unit is used to determine the midpoint of the line connecting the first edge finding endpoint and the second edge finding endpoint, and thus obtain the first edge finding midpoint.

[0142] The edge finding point determination unit is used to determine the midpoint of the first edge finding as the second edge finding point.

[0143] Furthermore, the second edge-finding module 704 specifically includes:

[0144] The third position unit is used to move the laser cutting head to the second edge-finding landing point, and move the laser cutting head along the first axial direction of the second coordinate axis starting from the second edge-finding landing point. During the movement of the laser cutting head, the unit identifies the position where the capacitance value of the capacitance sensor changes abruptly to obtain the third position.

[0145] The third edge-finding endpoint determination unit is used to determine the point on the plane rectangular coordinate system corresponding to the third position as the third edge-finding endpoint.

[0146] The fourth position unit is used to move the laser cutting head to the second edge-finding landing point, and then move the laser cutting head again along the second axial direction of the second coordinate axis, starting from the second edge-finding landing point. During the movement of the laser cutting head, the unit identifies the position where the capacitance value of the capacitance sensor changes abruptly, and obtains the fourth position.

[0147] The fourth edge finding endpoint determination unit is used to determine the point corresponding to the fourth position on the plane rectangular coordinate system as the fourth edge finding endpoint.

[0148] Furthermore, the center determination module 705 specifically includes:

[0149] The second edge-finding midpoint unit is used to determine the midpoint of the line connecting the third edge-finding endpoint and the fourth edge-finding endpoint, thus obtaining the second edge-finding midpoint.

[0150] The center determination unit is used to determine the midpoint of the second edge finding as the center point of the circular plate.

[0151] The radius determination unit is used to calculate the coordinate difference between the endpoint of the third or fourth edge finding and the midpoint of the second edge finding, and to determine the coordinate difference as the radius of the circular plate.

[0152] In the above embodiments, this application discloses a device for secondary beveling of circular plates, belonging to the field of laser beveling technology. By utilizing the automatic edge-finding function of a capacitive sensor, this application can accurately acquire the edge coordinates and center point position of a circular plate without manual intervention, thereby automatically calculating the radius and center coordinates of the plate. This significantly improves the accuracy and efficiency of processing positioning and avoids cutting deviations caused by manual measurement or misalignment. Furthermore, by acquiring processing parameters and automatically generating corresponding CNC programming programs, the entire process from measurement to processing is automated, greatly reducing operational steps and human error. This application is suitable for secondary beveling processes with high precision requirements, not only improving processing quality and consistency but also enhancing the intelligence level and flexible production capabilities of the equipment, possessing significant application and promotion value.

[0153] To address the aforementioned technical problems, embodiments of this application also provide a computer device. Please refer to [link / reference needed]. Figure 8 , Figure 8 This is a basic structural block diagram of the computer device in this embodiment.

[0154] The computer device 8 includes a memory 81, a processor 82, and a network interface 83 that are interconnected via a system bus. It should be noted that only a computer device 8 with a memory 81, processor 82, and network interface 83 is shown in the figure; however, it should be understood that it is not required to implement all the components shown, and more or fewer components can be implemented alternatively. Those skilled in the art will understand that the computer device described here is a device capable of automatically performing numerical calculations and / or information processing according to pre-set or stored instructions, and its hardware includes, but is not limited to, microprocessors, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0155] The computer device can be a desktop computer, laptop, handheld computer, or cloud server, etc. The computer device can interact with the user via a keyboard, mouse, remote control, touchpad, or voice control.

[0156] The memory 81 includes at least one type of readable storage medium, including flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the memory 81 may be an internal storage unit of the computer device 8, such as the hard disk or memory of the computer device 8. In other embodiments, the memory 81 may also be an external storage device of the computer device 8, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the computer device 8. Of course, the memory 81 may also include both the internal storage unit and its external storage device of the computer device 8. In this embodiment, the memory 81 is typically used to store the operating system and various application software installed on the computer device 8, such as computer-readable instructions for the secondary beveling method of a circular plate. In addition, the memory 81 can also be used to temporarily store various types of data that have been output or will be output.

[0157] In some embodiments, the processor 82 may be a central processing unit (CPU), controller, microcontroller, microprocessor, or other data processing chip. The processor 82 is typically used to control the overall operation of the computer device 8. In this embodiment, the processor 82 is used to execute computer-readable instructions stored in the memory 81 or to process data, for example, to execute computer-readable instructions for the circular plate secondary beveling method.

[0158] The network interface 83 may include a wireless network interface or a wired network interface, which is typically used to establish communication connections between the computer device 8 and other electronic devices.

[0159] This application also provides an implementation method, namely, a computer device including a memory and a processor. The memory stores computer-readable instructions, and the processor, when executing the computer-readable instructions, implements the steps of the user insurance demand assessment method described above, that is, it implements:

[0160] A method for secondary beveling of a circular plate is disclosed. The method is applied to a beveling laser cutting equipment, which includes a laser cutting head and a worktable. The laser cutting head is positioned above the worktable, which is used to hold the circular plate to be cut. The processing method includes:

[0161] Move the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point;

[0162] Based on the first edge finding point, perform edge finding operation on the preset first coordinate axis to obtain the first edge finding endpoint and the second edge finding endpoint;

[0163] The landing point of the second edge search is determined based on the endpoints of the first and second edge searches.

[0164] Based on the second edge finding point, an edge finding operation is performed on the preset second coordinate axis to obtain the third edge finding point and the fourth edge finding point, wherein the first coordinate axis and the second coordinate axis are perpendicular to each other;

[0165] The center point and radius of the circular plate are determined based on the third and fourth edge-finding endpoints.

[0166] Obtain the machining parameters for the secondary beveling process, generate a CNC programming program for the secondary beveling process based on the machining parameters, the center point and radius of the circular plate, and execute the CNC programming program to complete the secondary beveling process of the circular plate.

[0167] This application also provides another embodiment, namely, a computer-readable storage medium storing computer-readable instructions that can be executed by at least one processor to cause the at least one processor to perform the steps of the circular plate secondary beveling method described above, i.e., to achieve:

[0168] A method for secondary beveling of a circular plate is disclosed. The method is applied to a beveling laser cutting equipment, which includes a laser cutting head and a worktable. The laser cutting head is positioned above the worktable, which is used to hold the circular plate to be cut. The processing method includes:

[0169] Move the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point;

[0170] Based on the first edge finding point, perform edge finding operation on the preset first coordinate axis to obtain the first edge finding endpoint and the second edge finding endpoint;

[0171] The landing point of the second edge search is determined based on the endpoints of the first and second edge searches.

[0172] Based on the second edge finding point, an edge finding operation is performed on the preset second coordinate axis to obtain the third edge finding point and the fourth edge finding point, wherein the first coordinate axis and the second coordinate axis are perpendicular to each other;

[0173] The center point and radius of the circular plate are determined based on the third and fourth edge-finding endpoints.

[0174] Obtain the machining parameters for the secondary beveling process, generate a CNC programming program for the secondary beveling process based on the machining parameters, the center point and radius of the circular plate, and execute the CNC programming program to complete the secondary beveling process of the circular plate.

[0175] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0176] This application can be used in a wide variety of general-purpose or special-purpose computer system environments or configurations. Examples include: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics devices, network PCs, minicomputers, mainframe computers, and distributed computing environments including any of the above systems or devices. This application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform specific tasks or implement specific abstract data types. This application can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.

[0177] It should be noted that the software tools or components not belonging to this company that appear in the various embodiments of this application are merely illustrative examples and do not represent actual use.

[0178] Obviously, the embodiments described above are only some embodiments of this application, not all embodiments. The accompanying drawings show preferred embodiments of this application, but do not limit the patent scope of this application. This application can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this application's specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the scope of patent protection of this application.

Claims

1. A method for secondary beveling of a circular plate, characterized in that, The processing method is applied to a bevel laser cutting device, which includes a laser cutting head and a worktable. The laser cutting head is positioned above the worktable, and the worktable is used to place a circular plate to be cut. The processing method includes: Move the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point; Based on the first edge finding point, an edge finding operation is performed on the preset first coordinate axis to obtain the first edge finding endpoint and the second edge finding endpoint. The second edge-finding point is determined based on the first edge-finding endpoint and the second edge-finding endpoint; Based on the second edge finding point, an edge finding operation is performed on the preset second coordinate axis to obtain the third edge finding point and the fourth edge finding point, wherein the first coordinate axis and the second coordinate axis are perpendicular to each other; The center point and radius of the circular plate are determined based on the third and fourth edge-finding endpoints; Obtain the machining parameters for the secondary beveling process, generate a CNC programming program for the secondary beveling process based on the machining parameters, the center point and radius of the circular plate, and execute the CNC programming program to complete the secondary beveling process of the circular plate.

2. The method for secondary beveling of a circular plate as described in claim 1, characterized in that, The bevel laser cutting equipment further includes a nozzle located below the laser cutting head, and a capacitive sensor is installed on the nozzle. The processing method further includes: During the edge-finding operation, the endpoint of the edge-finding is determined by the change in the capacitance value of the capacitance sensor.

3. The method for secondary beveling of a circular plate as described in claim 2, characterized in that, Before moving the laser cutting head to any position on the circular plate to obtain the first edge-finding point, the processing method further includes: A Cartesian coordinate system is constructed in the plane where the circular plate is located, wherein the first coordinate axis is the X-axis or Y-axis of the Cartesian coordinate system.

4. The method for secondary beveling of a circular plate as described in claim 3, characterized in that, The step of performing an edge-finding operation on a preset first coordinate axis based on the first edge-finding landing point to obtain a first edge-finding endpoint and a second edge-finding endpoint specifically includes: Starting from the first edge-finding point, the laser cutting head is moved along the first axial direction of the first coordinate axis, and during the movement of the laser cutting head, the position where the capacitance value of the capacitance sensor changes abruptly is identified to obtain the first position; The point on the Cartesian coordinate system corresponding to the first position is determined as the first edge-finding endpoint; The laser cutting head is moved to the first edge-finding point, and then, starting from the first edge-finding point, the laser cutting head is moved along the second axial direction of the first coordinate axis. During the movement of the laser cutting head, the position where the capacitance value of the capacitance sensor changes abruptly is identified to obtain the second position. The point on the Cartesian coordinate system corresponding to the second position is determined as the second endpoint of the edge finding.

5. The method for secondary beveling of a circular plate as described in claim 1, characterized in that, The determination of the second edge-finding point based on the first edge-finding endpoint and the second edge-finding endpoint specifically includes: Determine the midpoint of the line connecting the first edge-finding endpoint and the second edge-finding endpoint to obtain the midpoint of the first edge-finding; The midpoint of the first edge search is determined as the endpoint of the second edge search.

6. The method for secondary beveling of a circular plate as described in claim 4, characterized in that, Based on the second edge-finding point, an edge-finding operation is performed on the preset second coordinate axis to obtain the third and fourth edge-finding endpoints, specifically including: The laser cutting head is moved to the second edge-finding point. Starting from the second edge-finding point, the laser cutting head is moved along the first axial direction of the second coordinate axis. During the movement of the laser cutting head, the position where the capacitance value of the capacitance sensor changes abruptly is identified to obtain the third position. The point on the Cartesian coordinate system corresponding to the third position is determined as the third edge-finding endpoint; The laser cutting head is moved to the second edge-finding point. Then, starting from the second edge-finding point, the laser cutting head is moved along the second axial direction of the second coordinate axis. During the movement of the laser cutting head, the position where the capacitance value of the capacitance sensor changes abruptly is identified to obtain the fourth position. The point on the Cartesian coordinate system corresponding to the fourth position is determined as the fourth endpoint of the edge finding.

7. The method for secondary beveling of a circular plate as described in claim 1, characterized in that, The determination of the center point and radius of the circular plate based on the third and fourth edge-finding endpoints specifically includes: Determine the midpoint of the line connecting the third edge-finding endpoint and the fourth edge-finding endpoint to obtain the second edge-finding midpoint; The midpoint of the second edge search is determined as the center point of the circular plate. Calculate the coordinate difference between the third or fourth edge-finding endpoint and the midpoint of the second edge-finding point, and determine the coordinate difference as the radius of the circular plate.

8. A device for secondary beveling of a circular plate, characterized in that, The circular plate secondary beveling processing device performs the circular plate secondary beveling processing method as described in any one of claims 1-7. The processing method is applied to a beveling laser cutting device, which includes a laser cutting head and a worktable. The laser cutting head is positioned above the worktable, and the worktable is used to place the circular plate to be cut. The processing device includes: The first landing point module is used to move the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point; The first edge-finding module is used to perform edge-finding operations on a preset first coordinate axis based on the first edge-finding landing point to obtain the first edge-finding endpoint and the second edge-finding endpoint. The second landing point module is used to determine the second edge-finding landing point based on the first edge-finding endpoint and the second edge-finding endpoint; The second edge-finding module is used to perform edge-finding operations on a preset second coordinate axis based on the second edge-finding landing point to obtain the third edge-finding endpoint and the fourth edge-finding endpoint, wherein the first coordinate axis and the second coordinate axis are perpendicular to each other. The center determination module is used to determine the center point and radius of the circular plate based on the third edge finding endpoint and the fourth edge finding endpoint. The secondary processing module is used to obtain the processing parameters for secondary beveling, generate a CNC programming program for secondary beveling based on the processing parameters, the center point and radius of the circular plate, and execute the CNC programming program to complete the secondary beveling of the circular plate.

9. A computer device, characterized in that, The method includes a memory and a processor, wherein the memory stores computer-readable instructions, and the processor executes the computer-readable instructions to implement the steps of the circular plate secondary beveling method as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-readable instructions, which, when executed by a processor, implement the steps of the circular plate secondary beveling method as described in any one of claims 1 to 7.

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