PCB laser drilling path control method and system

Abstract

The invention relates to the technical field of laser processing, in particular to a PCB laser drilling path control method and system. The method comprises the steps of receiving hole geometric data; based on geometric data of the hole, identifying a sharp concave angle in the contour of the hole, and calculating the geometric shape and volume of a residual material area left due to the defect generated by the conventional path; a main filling path of the hole main body area is generated based on the hole geometric data, a supplementary cleaning path is generated for the residual material area, and the supplementary cleaning path and the main filling path are spatially separated from each other; matching laser energy parameters for the supplementary cleaning path based on material characteristics and volume of the residual material region; in the machining process, matched laser machining parameters are applied in stages corresponding to the main filling path and the supplementary cleaning path respectively. The problem of carbonization layering caused by material residues and excessive energy injection in laser drilling with sharp inner concave angles can be effectively solved, and the machining quality and the product reliability are ensured.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a PCB laser drilling path control method and system. Background Art

[0002] In the field of printed circuit board (PCB) manufacturing, laser drilling has become a key technology for micro-hole processing due to its high precision and non-contact processing advantages. However, when processing holes with complex geometries, especially those with sharp indented corners (e.g., fork-shaped holes with angles less than 45 degrees), traditional laser drilling path generation typically uses a general offset filling strategy, which generates a scanning path by shrinking the hole outline inward. This method performs well for conventional holes, but when encountering extremely sharp indented corners, the generated path is prone to self-intersection. To ensure path validity, existing path correction programs often directly delete these self-intersecting path segments. However, this approach has the side effect of leaving unprocessed material at the apex of the sharp indented corners, resulting in incomplete hole processing. This fails to meet the stringent hole wall quality requirements of high-reliability electronic devices and may affect the subsequent electroplating filling quality and long-term product reliability.

[0003] In view of the above problems, the existing technology is in urgent need of improvement. Summary of the Invention

[0004] In order to address the shortcomings of the existing technology, the present application provides a PCB laser drilling path control method and system, which can effectively solve the problem of carbonization delamination caused by material residue and excessive energy injection in laser drilling with sharp concave corners, thereby ensuring processing quality and product reliability.

[0005] This application provides a PCB laser drilling path control method, the method comprising: Receiving hole geometry data, the hole geometry data including contour segments and vertex coordinates of the hole to be processed; Based on the hole geometry data, the sharp indented corners in the hole profile are identified and the geometry and volume of the residual material area left by the defect generated by the conventional path are calculated; Based on the hole geometry data, a main filling path is generated for the main area of ​​the hole, and a supplementary cleaning path is generated for the residual material area. The supplementary cleaning path is spatially separated from the main filling path, and the residual material area is located outside the coverage of the main filling path. Matching laser energy parameters for the supplemental cleaning path based on the material properties and volume of the residual material area; During the processing, the matching laser processing parameters are applied in stages corresponding to the main filling path and the supplementary cleaning path to complete the laser drilling processing task of the entire hole area.

[0006] Through the above solution, by identifying the residual material area and generating an independent supplementary cleaning path for it, and applying matching laser parameters in stages, the problem of residual material and path overlap at sharp concave corners in the traditional method, which causes material damage, is effectively solved, ensuring the integrity and quality of hole processing.

[0007] Furthermore, a supplementary cleaning path is generated for the residual material area, including: Based on the geometric characteristics of the sharp concave corners, the distribution position of the residual material area in the hole contour is determined; A closed trajectory segment group covering the residual material area is constructed by boundary extension fitting as a path structure to supplement the cleaning path; The constructed supplementary sweeping path is smoothed to separate it from the main filling path in space.

[0008] Through the above scheme, by determining the distribution of the residual material area, constructing a closed trajectory segment group and performing smoothing, the accuracy of the supplementary cleaning path and its spatial separation from the main filling path are ensured, thus avoiding repeated processing and material damage.

[0009] Furthermore, the laser energy parameters are matched to supplement the cleaning path, including: Based on the hole geometry data, multi-layer geometry data including the hole outer contour, inner micropore structure and filling status are extracted; Based on the multi-layer geometric data, determine whether there is a copper-filled microvia structure under the residual material area; If there are copper-filled microporous structures, based on the material properties and volume of the residual material area, the laser energy parameters after being increased according to the preset increase rules are selected and configured to the supplementary cleaning path; If there is no copper-filled microvia structure, select conventional laser energy parameters and configure them to the supplementary cleaning path.

[0010] Through the above scheme, by judging whether there is a copper-filled microporous structure under the residual material area and adjusting the laser energy parameters accordingly, accurate matching of different material properties is achieved, overburning or underprocessing is avoided, and the processing effect is improved.

[0011] Furthermore, based on the hole geometry data, the sharp indented corners in the hole profile are identified, and the geometry and volume of the residual material area left behind by the conventional path defect generation are calculated, including: Based on the hole geometry data, the line segment structure and vertex coordinates of the hole contour are extracted; Calculate the angle between adjacent contour segments and identify areas with angles less than a preset threshold as sharp concave corners; Based on the area where the sharp concave corner is located, the conventional filling path generation rule is simulated to construct a simulated path coverage area, simulating the path coverage effect without considering the influence of the concave corner structure; The simulation path coverage area and the hole contour are overlapped and analyzed, and the area outside the simulation path coverage area is identified as the residual material area. The corresponding geometric shape and volume are calculated based on the boundary contour of the residual material area.

[0012] Through the above scheme, by calculating the angles between adjacent contour segments, simulating conventional path coverage and performing overlay analysis, the residual material areas at sharp concave corners can be accurately identified and quantified, providing an accurate geometric basis for subsequent supplementary cleaning.

[0013] Furthermore, during the processing, matching laser processing parameters are applied in stages corresponding to the main filling path and the supplementary cleaning path, including: Obtaining the processing execution order of the main filling path and the supplementary cleaning path, and determining the path switching node position of the main filling path and the supplementary cleaning path; When the laser source reaches a preset distance from the path switching node position, a laser parameter preloading instruction corresponding to the next stage processing path is sent, so that the laser source enters a preparatory state for the target laser parameter configuration of the next stage processing path; When the laser head reaches the path switching node position, the laser parameters are switched to the target laser parameters; In the preset path segment after switching the laser parameters, an output power correction value is obtained from the preset energy compensation data according to the transient response characteristics of the laser source under the conditions of each parameter switching, and the output power of the laser source is corrected according to the output power correction value.

[0014] Through the above scheme, by obtaining the path switching node, preloading the laser parameters, and performing power correction after switching, the smooth and precise switching of the laser parameters is achieved, avoiding the processing defects caused by the untimely transient response of the parameters.

[0015] Furthermore, within a preset path segment after switching the laser parameters, an output power correction value is obtained from preset energy compensation data according to the transient response characteristics of the laser source under the switching conditions of each parameter, and the output power of the laser source is corrected according to the output power correction value, including: Calibrate the transient response behavior of the laser source under various parameter switching conditions and construct the corresponding response curve model; Based on the response curve model, energy compensation data corresponding to the switching conditions of each parameter is generated; In the preset path segment after switching the laser parameters, the energy compensation data corresponding to the current parameter switching condition is called to obtain the output power correction value; The output power of the laser source is corrected according to the output power correction value to compensate for the transient response deviation of the laser source.

[0016] Through the above scheme, by calibrating the transient response behavior of the laser source and generating energy compensation data, the transient response deviation of the laser source during parameter switching can be effectively compensated to ensure the stability of the laser energy output.

[0017] Furthermore, the output power of the laser source is corrected according to the output power correction value to compensate for the transient response deviation of the laser source, including: According to the output power correction value, the driving parameters of the laser source are dynamically adjusted. The driving parameters include the amplitude of the driving current or the duty cycle of the pulsed laser. By adjusting the driving parameters point by point, the transient response deviation of the laser source is compensated.

[0018] Through the above scheme, by dynamically adjusting the driving parameters of the laser source (such as the driving current amplitude or the pulse laser duty cycle), the transient response deviation of the laser source is accurately compensated point by point, further improving the processing accuracy and quality.

[0019] Furthermore, multi-layer geometric data including the outer contour of the hole and the inner microporous structure and filling status are extracted, including: Obtaining layer structure information contained in the hole geometry data, the layer structure information including metal filling structure information of the micropore area in each layer and the inter-layer alignment relationship; Based on the layer structure information, identify the location of the outer contour of the hole and the inner microporous structure in each layer; Combining the inter-layer alignment relationship with the metal filling structure information, the filling state of the inner microporous structure is determined; Multi-layer geometric data including spatial position and filling state are constructed based on the outer contour of the hole, the inner micropore structure and its filling state.

[0020] Through the above scheme, by obtaining layer structure information, identifying micropore positions and combining the inter-layer alignment relationship, it is possible to construct multi-layer geometric data including spatial position and filling status, providing comprehensive data support for the precise matching of laser parameters.

[0021] Furthermore, based on the material properties and volume of the residual material area, the laser energy parameters after being increased according to the preset increase rules are selected and configured to the supplementary cleaning path, including: Extract the material stacking structure information of the residual material area in the vertical direction based on the multi-layer geometric data; Dividing the residual material area into a plurality of sub-areas according to the material stacking structure information and the position of the residual material area; For each sub-region, extract its corresponding material properties and volume; According to the material properties and volume of each sub-area, the corresponding enhanced laser energy parameters are configured according to the preset enhancement rules and associated with the corresponding sections in the supplementary cleaning path.

[0022] Through the above scheme, by extracting the material stacking structure information in the vertical direction and dividing it into sub-regions, the improved laser energy parameters can be configured according to the material properties and volume of different sub-regions, achieving more refined energy control and optimizing the processing effect.

[0023] Furthermore, the present application also proposes a PCB laser drilling path control system, which includes: A receiving module is used to receive hole geometry data, where the hole geometry data includes contour segments and vertex coordinates of the hole to be processed; An identification and calculation module is used to identify sharp concave corners in the hole contour based on the hole geometry data, and calculate the geometry and volume of the residual material area left due to the defect generated by the conventional path; A path generation module is used to generate a main filling path for the main area of ​​the hole based on the hole geometry data, and to generate a supplementary cleaning path for the residual material area, wherein the supplementary cleaning path is spatially separated from the main filling path, and the residual material area is located outside the coverage of the main filling path; A laser parameter matching module is used to match laser energy parameters for the supplemental cleaning path based on the material properties and volume of the residual material area; The processing module is used to apply matching laser processing parameters in stages corresponding to the main filling path and the supplementary cleaning path during the processing process to complete the laser drilling processing task of the entire hole area.

[0024] Through the above scheme, a system for implementing the above method is provided. Through modular design, the coordinated work of various functional links is ensured, and the automation and intelligence level of PCB laser drilling path control is improved.

[0025] In summary, the present application provides a PCB laser drilling path control method and system, which identifies sharp concave corners and residual material areas in the hole contour, and generates a supplementary cleaning path for the residual material area that is spatially separated from the main filling path. At the same time, it matches laser energy parameters based on material properties and volume, and applies the matching laser processing parameters in stages during the processing, thereby avoiding material damage caused by residual material and path overlap at sharp concave corners in traditional methods. It has the advantage of being able to effectively solve the problem of carbonization stratification caused by residual material and excessive energy injection in laser drilling of complex holes (especially those with sharp concave corners), thereby ensuring processing quality and product reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1A schematic flow chart of a PCB laser drilling path control method provided in this application.

[0027] Figure 2 This is a flowchart of a PCB laser drilling path control system provided in this application.

[0028] In the figure: 1. Receiving module; 2. Identification and calculation module; 3. Path generation module; 4. Laser parameter matching module; 5. Processing module. DETAILED DESCRIPTION

[0029] The technical solutions in this application will be clearly and completely described below in conjunction with the drawings in this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all of the embodiments. The components of the present application generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application for which protection is claimed, but merely represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application.

[0030] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and should not be understood as indicating or implying relative importance.

[0031] Traditional PCB laser drilling technology typically uses a general offset fill strategy when processing special-shaped holes with sharp concave corners. However, this strategy may generate self-intersecting paths when encountering extremely sharp concave corners. Existing path correction programs often directly delete these self-intersecting paths when processing them, resulting in unprocessed material residue at the apex of the concave corner. If this problem is not addressed, the manufacturing of printed circuit boards will face serious quality challenges. The unprocessed material residue will directly affect the quality of subsequent electroplating hole filling, resulting in defects inside the hole, which may become a potential failure point in the long-term operation of electronic equipment, seriously affecting the reliability and service life of the product.

[0032] Reference Figure 1 In this regard, the present application proposes a PCB laser drilling path control method, which includes: S1000: Receive hole geometry data, which includes the contour line segments and vertex coordinates of the hole to be processed; S2000: Based on the hole geometry data, it identifies sharp indented corners in the hole profile and calculates the geometry and volume of the residual material area left behind by the conventional path defect generation; S3000: Based on the hole geometry data, a main filling path is generated for the main hole area, and a supplementary cleaning path is generated for the residual material area. The supplementary cleaning path is spatially separated from the main filling path, and the residual material area is located outside the coverage of the main filling path. S4000: Matches laser energy parameters for the supplemental cleaning path based on the material properties and volume of the residual material area; S5000: During the machining process, matching laser machining parameters are applied in stages corresponding to the main filling path and the supplementary cleaning path to complete the laser drilling task of the entire hole area.

[0033] In this embodiment, a sharp concave corner refers to a recessed area within the hole contour with an angle less than a specific threshold, such as the vertex of a forked hole with an angle less than 45 degrees. This area can be identified using geometric analysis algorithms or image processing techniques, for example by calculating the angle between adjacent contour segments and comparing it to a preset angle threshold. A residual material area refers to unprocessed material remaining within the hole due to path self-intersections being deleted or incomplete coverage when using a conventional laser drilling path generation strategy. Its geometry and volume can be calculated using a combination of geometric modeling and path simulation analysis, for example by simulating the coverage of a conventional fill path and overlaying it on the actual hole contour. This is primarily to accurately quantify the material that requires additional removal, providing a basis for generating supplemental cleaning paths and matching laser parameters. A supplemental cleaning path refers to a laser scanning trajectory generated specifically for the residual material area. This path can be constructed using methods such as boundary extension fitting or local area scanning, for example by extending the boundary segments of the sharp concave corner and constructing a closed trajectory. This path is primarily to accurately remove residual material not covered by the primary fill path, ensuring the integrity of the hole. The spatial separation of the supplementary cleaning path and the main filling path means that the trajectory of the supplementary cleaning path does not overlap with the trajectory of the main filling path in space, that is, there is a clear interval or non-interference area between the two. This can be ensured by using path optimization algorithms or geometric constraints, such as by smoothing the supplementary cleaning path and checking its minimum distance from the main filling path. This is mainly to avoid repeated application of laser energy in the same area, thereby preventing carbonization or stratification of the material due to excessive heat accumulation. The phased application of matching laser processing parameters means that during the laser drilling process, according to the type of current processing path and the material properties of the target area, pre-matched laser energy parameters are dynamically switched and applied. This can be achieved by combining path switching node identification with laser source parameter preloading control, such as sending parameter preloading instructions before the path switching point. This is mainly to provide customized energy input for the processing requirements of different areas, ensure processing quality and avoid material damage.

[0034] The core innovation of this application lies in intelligently identifying the sharp concave corners in the hole contour and calculating the residual material area, thereby generating a main filling path for the main area of ​​the hole, and generating spatially separated supplementary cleaning paths for the residual material area, and matching the laser energy parameters based on the characteristics of the residual material. Finally, these parameters are applied in stages during the processing, thereby solving the problems of traditional methods leaving residual material at sharp concave corners and manual remediation leading to repeated energy application, and achieving the effect of ensuring complete material removal and avoiding material damage.

[0035] In some preferred embodiments, the present application is specifically implemented as follows: First, the hole geometry data from the PCB design file is received through a CAD / CAM software interface. This data is represented as vector graphics, containing the precise boundary segments and key vertex coordinates of the hole. A geometric analysis module then processes this data, traversing all vertices along the hole outline and calculating the angles between adjacent segments. When the angle is less than a preset obtuse angle threshold, the area is identified as a sharp reentrant corner. This module then simulates conventional offset fill path generation, for example, by shrinking the outline inward in steps of half the laser spot radius. It identifies triangular or irregularly shaped areas at the sharp reentrant corner that are outside the coverage of these conventional paths, marks them as residual material areas, and calculates their area and depth information. Based on this, the path generation module first generates a standard main fill path for the remainder of the hole, using, for example, a serpentine scan or spiral fill pattern. Simultaneously, independent supplementary cleaning paths are generated for the identified residual material areas. For example, by extending and connecting two boundary line segments at a sharp indented corner, a small closed loop or group of short line segments covering the residual material area is formed as a supplementary cleaning path. During the generation process, the system ensures that this supplementary cleaning path maintains a minimum safe distance from the previously generated main filling path, ensuring spatial separation and avoiding any overlap. Furthermore, a laser parameter matching module selects or adjusts laser energy parameters from a pre-set material processing database based on the material type and calculated volume of the residual material area. For example, it adjusts the laser power, pulse frequency, or scanning speed to ensure effective material removal in this area. Finally, when the laser drilling machine performs a machining task, the control system first executes the main filling path according to the pre-planned path sequence. When the laser head moves near the switching node between the main filling path and the supplementary cleaning path, the control system sends a pre-command to preload the laser energy parameters matched to the supplementary cleaning path. Once the laser head precisely reaches the switching node, the laser parameters immediately switch to those optimized for the residual material area, and the supplementary cleaning path is then executed. This staged parameter application ensures that the material in the entire hole area is completely removed, while avoiding material damage caused by repeated energy application.

[0036] Another embodiment of the present application further proposes that the sub-step of S3000: generating a supplementary cleaning path for the residual material area includes: S3210: Determine the distribution of the residual material area in the hole contour based on the geometric characteristics of the sharp concave corners; S3220: Use boundary extension fitting to construct a closed trajectory segment group covering the residual material area as a path structure to supplement the cleaning path; S3230: Smoothing the constructed supplementary cleaning path so that it is spatially separated from the main filling path.

[0037] Among them, the boundary extension fitting method refers to a path generation strategy, which uses the existing boundary information of the residual material area, and logically extends and geometrically fits it through an algorithm to form one or more closed path segments. It can analyze the boundary points of the residual material area, identify its edge direction, and then expand outward or inward according to the preset extension rules, and connect these extension points to form a closed geometric shape. Its purpose is to ensure that the generated supplementary cleaning path can accurately cover and adapt to the complex shape of the residual material area, thereby achieving complete removal of the material; smoothing processing refers to optimizing the generated path, eliminating sharp corners, discontinuous points or irregular segments that may exist in the path, so that its motion trajectory becomes continuous and smooth. It can be achieved by applying curve fitting algorithms, moving average filtering or local path resampling and other technologies. Its purpose is to optimize the motion trajectory of the laser head, reduce mechanical shock and vibration, improve processing accuracy and efficiency, and at the same time ensure that a clear spatial interval is maintained between the supplementary cleaning path and the main filling path to avoid repeated energy injection.

[0038] The solution of the present application optimizes the laser drilling path control method. First, after identifying the sharp concave angles in the hole contour and calculating the residual material area, the specific distribution position of the residual material area in the hole contour is further accurately determined based on the geometric characteristics of the sharp concave angles. Through accurate positioning, adaptive path construction and important smooth separation processing, a complete and efficient supplementary cleaning path generation mechanism is formed, which ensures the processing quality and reliability of special-shaped holes and effectively overcomes the problems of residual material residue and repeated energy injection in the existing technology.

[0039] As an implementation method, this application is specifically implemented as follows: Suppose the hole to be machined is a "Y"-shaped hole with sharp concave corners. First, after identifying the three sharp concave corners of the "Y"-shaped hole and calculating the corresponding residual material areas, the system accurately determines the specific distribution of each residual material area within the hole contour based on the geometric characteristics of these sharp concave corners, such as the coordinates of their vertices and the vector directions of the two line segments forming the concave corners. For example, for a concave corner with an angle less than 45 degrees, the residual material area can be determined as a fan-shaped or triangular area centered at the vertex of the concave corner. Then, for each identified residual material area, the system uses boundary extension fitting to construct a closed trajectory segment set covering the area. Specifically, starting from the boundary segment of the residual material area, it extends outward along its normal direction a small preset distance. The extended points are then connected and fitted to form a closed polygon or curve slightly larger than the residual material area, which serves as the path structure for the supplementary cleaning path. For example, if the residual material area is a small triangle, its three sides can be slightly extended outward and reconnected to form a slightly larger closed triangular path. Finally, the constructed supplementary cleaning path is smoothed. This is achieved by applying a B-spline curve fitting algorithm to each vertex on the path, converting sharp corners in the path into smooth curve segments, thereby optimizing the motion trajectory of the laser head. During the smoothing process, the system ensures that the smoothed supplementary cleaning path maintains a preset minimum safety distance from the main filling path to avoid any spatial interference or overlap during the processing process.

[0040] Another embodiment of the present application further proposes that S4000 includes: S4100: Extract multi-layer geometric data including the outer contour of the hole, the inner micropore structure, and the filling status based on the hole geometry data; S4200: Based on multi-layer geometry data, determine whether there is a copper-filled microvia structure below the residual material area; S4300: If there is a copper-filled microporous structure, based on the material properties and volume of the residual material area, select the laser energy parameter that is increased according to the preset increase rule and configure it to the supplementary cleaning path; S4400: If there is no copper-filled microvia structure, select the conventional laser energy parameters and configure them to the supplementary cleaning path.

[0041] Multi-layer geometry data refers to a comprehensive digital representation of a PCB hole. It goes beyond the hole's surface contour to include internal structural details and their fill status at different levels. This includes information about the hole's outer boundary, the presence and location of any internal microvias or vias, and their material composition or fill status, such as whether they are copper-filled or unfilled. Its purpose is to provide complete structural context for laser processing, especially when processing complex internal features that affect energy absorption and dissipation. Copper-filled microvia structures are conductive structures formed by filling tiny holes with copper material through electroplating or other processes within a PCB. During laser processing, copper's high reflectivity and high thermal conductivity to laser energy significantly alter the energy absorption and conduction characteristics of the local area, affecting the laser's removal efficiency of the residual material above and the risk of damage to the structure itself. Predefined boosting rules are predefined strategies or algorithms for increasing or adjusting laser energy parameters based on specific conditions, such as the material properties and volume of the residual material, as well as specific parameters of the underlying copper-filled microvia structure, such as density, depth, or geometry. The goal is to ensure that the laser energy can effectively penetrate and remove residual material in the presence of copper-filled microporous structures, while avoiding damage to the microporous structures and achieving refined control of the laser energy. Conventional laser energy parameters refer to the standard combination of laser power, pulse frequency, scanning speed, and other parameters used to effectively remove material without causing damage, targeting specific materials and thicknesses without the influence of special structures. It represents the optimized settings under general processing conditions and is designed to provide basic, efficient material removal capabilities.

[0042] The solution of this application realizes intelligent matching of laser energy parameters of the supplementary cleaning path by introducing consideration of the complex internal structure of the PCB hole.

[0043] In some preferred embodiments, the present application is implemented as follows: First, the system receives a digital design file of the PCB to be processed, such as an ODB++ format file. This file not only contains the outer contour information of the hole, but also details the PCB's layer structure, the metal filling information of the microvia areas in each layer, and the inter-layer alignment relationship. A data parsing module processes these design files to extract multi-layer geometric data, including the outer contour of the hole and the inner microvia structure and filling status. For example, this may include storing the location, diameter, and copper filling information of the microvias at different levels in the form of three-dimensional coordinates and attribute tags. Furthermore, when matching laser energy parameters for an identified residual material area, the system utilizes this multi-layer geometric data. It performs a spatial query to determine whether the residual material area overlaps vertically with any copper-filled microvia structures. For example, the system can check whether the two-dimensional projection of the residual material area overlaps the projection of any copper-filled microvia structures on the corresponding layer, and determine their vertical relationship based on the inter-layer alignment information. If the system determines that copper-filled microvias exist beneath the residual material area, it searches a pre-set parameter database or generates enhanced laser energy parameters using a computational model based on the material properties and volume of the residual material area, as well as the specific parameters of the underlying copper-filled microvias, such as their diameter, depth, or fill density. For example, if a specific volume of residual material overlies a copper-filled microvia with a diameter of 100 microns, the system can increase the laser power by a predetermined percentage or increase the pulse energy based on preset enhancement rules. Conversely, if the system determines that no copper-filled microvias exist beneath the residual material area, it directly selects conventional laser energy parameters from a standard parameter library, tailored to the current PCB substrate material and residual material type. These parameters are typically optimized to effectively remove material without damaging the substrate. Ultimately, these intelligently matched laser energy parameters are assigned to the corresponding supplementary cleaning path, guiding the laser drilling equipment for precise processing.

[0044] Another embodiment of the present application further proposes that S2000: identifying sharp concave corners in the hole contour based on the hole geometry data, and calculating the geometry and volume of the residual material area left due to defects generated by the conventional path, including: S2100: Extract the line segment structure and vertex coordinates of the hole contour based on the hole geometry data; S2200: Calculate the angle between adjacent contour segments and identify areas with angles less than a preset angle threshold as sharp concave corners; S2300: Based on the area where the sharp concave corner is located, the conventional filling path generation rules are simulated to construct a simulated path coverage area, simulating the path coverage effect without considering the influence of the concave corner structure; S2400: Performing an overlay analysis on the simulated path coverage area and the hole contour, identifying an area outside the simulated path coverage area as a residual material area, and calculating a corresponding geometric shape and volume based on the boundary contour of the residual material area.

[0045] Among them, the preset angle threshold refers to a predetermined angle limit used to distinguish between ordinary bends in the hole contour and sharp concave angles that require special treatment. It can be obtained using empirical values, calculated based on material properties or processing accuracy requirements, or trained through machine learning models. Its purpose is to provide a quantitative standard to automate and standardize the identification process of sharp concave angles. The conventional filling path generation rule refers to the general algorithm or strategy used to generate the filling path inside the hole in the field of laser drilling. It can adopt various methods such as offset filling, spiral filling, and Z-shaped scanning. Its purpose is to simulate the theoretical coverage of the laser path on the hole area without considering the influence of specific geometric defects. The simulated path coverage area refers to the geometric range that is virtually constructed in the sharp concave angle area according to the conventional filling path generation rule and should theoretically be covered by the laser path. It can be constructed using Boolean operations, path simulation algorithms, or grid-based area filling algorithms in geometric modeling software. Overlay analysis refers to the geometric comparison and superposition of the simulated path coverage area with the actual hole contour. It can be implemented using Boolean difference operations, pixel-level comparison, or vector graphics processing technology. Its purpose is to accurately identify the portion of the hole contour that is not covered by the simulated path, that is, the residual material area.

[0046] The solution of this application achieves accurate identification of sharp concave corners in the hole contour and quantitative calculation of the residual material area through a series of logically rigorous steps. This precise identification and quantification enables the entire laser drilling path control method to intelligently adapt to the complex hole geometric features and achieve thorough and high-quality processing of the entire hole area.

[0047] In some preferred embodiments, the present application is implemented as follows: Assume that a PCB hole with multiple sharp, concave corners, such as a "fork-shaped" hole, needs to be machined. First, the system can receive the hole's geometric data from a computer-aided design (CAD) file. This data is typically represented in a vector format (such as DXF or Gerber), containing line segment information for the hole's outline and the coordinates of each segment's endpoints. The system parses this data and converts it into an internally processable geometric model, such as a list of ordered vertices and connected line segments.

[0048] Next, to identify sharp indented corners, the system iterates through every vertex on the hole's contour. For each vertex, the angle between its two adjacent contour segments is calculated. For example, if a vertex connects line segments AB and BC, the system calculates the angle between vectors BA and BC. If the calculated angle is less than a preset angle threshold, such as 45 degrees, the vertex and its surrounding area are identified as a sharp indented corner. This threshold can be adjusted based on actual machining experience or material properties.

[0049] The system then simulates conventional laser fill path generation for these identified sharp indented corners. For example, a typical offset fill strategy can be simulated, generating a series of indented contours from the hole outline inward at a fixed step size (e.g., half the laser spot radius). These indented contours constitute the simulated path coverage area, reflecting the theoretical coverage effect of a conventional path on the area, ignoring the special geometry of the sharp indented corners.

[0050] Finally, to accurately identify the residual material area, the system can perform a geometric fit analysis. This can be a Boolean subtraction operation, subtracting the simulated path coverage area from the geometric area of ​​the original hole outline. The result of the subtraction operation is the geometric area not covered by the regular path, namely the residual material area. Once the boundary outline of this area is identified, the system can further calculate its area and estimate its volume by multiplying it by the thickness of the PCB board. For example, for an irregular residual area, it can be decomposed into multiple triangles or polygons, and their areas can be accumulated to obtain the total area.

[0051] Another embodiment of the present application further proposes that S5000 includes: S5100: Obtain the processing execution order of the main filling path and the supplementary cleaning path, and determine the path switching node position of the main filling path and the supplementary cleaning path; S5200: When the laser source reaches a preset distance from the path switching node position, a laser parameter preloading instruction corresponding to the next stage processing path is sent, so that the laser source enters a preparation state for the target laser parameter configuration of the next stage processing path; S5300: When the laser head reaches the path switching node, the laser parameters are switched to the target laser parameters; S5400: In a preset path segment after switching the laser parameters, an output power correction value is obtained from preset energy compensation data according to transient response characteristics of the laser source under various parameter switching conditions, and the output power of the laser source is corrected according to the output power correction value.

[0052] The path switching node position refers to the precise spatial point in the laser processing path where one processing path (e.g., the main filling path) transitions to another processing path (e.g., the supplemental cleaning path). This can be determined using path planning software based on preset path connection rules or geometric intersections. The preset distance refers to the spatial interval that triggers the laser parameter preloading operation before the laser head actually reaches the path switching node position. This can be set based on the response speed of the laser source, the acceleration of the motion system, and the processing accuracy requirements. The laser parameter preloading instruction refers to a control signal sent to the laser source controller before the laser head reaches the path switching node position to prepare the laser parameters required for the next stage of processing. This signal can be transmitted in the form of a digital or analog signal via a communication interface. The preparatory state of the target laser parameter configuration refers to the state in which the internal circuits or optical components of the laser source are adjusted to be close to or ready to output the laser parameters required for the next stage after receiving the preloading instruction. This can include adjusting the laser's pump current, Q-switch frequency, or pulse width. The preset path segment refers to a path of a specific length that the laser head continues to move after the laser parameters are switched. It can be determined based on the transient response time of the laser source, the processing speed, and the required compensation accuracy. The transient response characteristics refer to the dynamic change process of the laser source's output power, pulse energy, or spot pattern and other parameters transitioning from the current value to the target value after receiving the parameter switching instruction. It can be obtained by experimental calibration, mathematical modeling, or table lookup. Energy compensation data refers to a data set pre-stored based on the transient response characteristics of the laser source and used to dynamically adjust the laser output power during the parameter switching process. It can be stored in the form of a lookup table, function model, or correction curve. The output power correction value refers to a specific value calculated based on the energy compensation data and used to adjust the output power of the laser source in real time. It can be an incremental value or a proportional factor.

[0053] This solution solves the problem of heat accumulation or insufficient processing caused by untimely or inaccurate switching of laser parameters when switching between the main filling path and the supplementary cleaning path by finely controlling the switching timing and process of laser parameters. This allows the main filling path and the supplementary cleaning path to each achieve the best processing effect, while ensuring the processing quality and efficiency of the entire hole area, thereby achieving thorough processing of special-shaped holes and avoiding material damage.

[0054] In some preferred embodiments, the present application is specifically implemented as follows: Before laser drilling begins, the control system reads the G-code sequences for the main fill path and supplemental purge path from the machining file generated by the CAM (computer-aided manufacturing) software. These G-codes contain the path geometry and machining sequence. The system parses these G-codes, identifies the end points of the main fill path and the start points of the supplemental purge path, and marks these points as path switch nodes. For example, if the main fill path ends at coordinates (X1, Y1) and the supplemental purge path begins at (X1, Y1), then (X1, Y1) is the path switch node.

[0055] As the laser head moves along the main filling path, the control system monitors the distance between the laser head and the next path switching node in real time. When the laser head reaches a preset distance from the path switching node, such as 5 mm, the control system immediately sends a laser parameter preload instruction to the laser source controller. This instruction can be a specific digital signal or a command packet sent via a communication bus. It instructs the power module or pulse generator inside the laser source to begin adjusting its operating state so that its parameters such as output power, pulse frequency, or pulse width gradually approach the target laser parameters required for the supplementary cleaning path. However, at this time, the laser output is not yet activated or still maintains the parameters of the current path.

[0056] When the laser head precisely reaches the path switching node, the control system sends an immediate switching command. Upon receiving this command, the laser source controller immediately switches the laser output parameters to the pre-loaded target laser parameters, for example, switching the laser power from 10W for the main filling path to 15W for the supplementary cleaning path.

[0057] After the laser parameter switching is completed, the laser head will continue to move along the supplementary cleaning path. Within the preset path segment after the switch, such as the next 2 mm path length, the control system will dynamically correct the output power of the laser source according to the pre-stored energy compensation data. These energy compensation data are obtained by experimentally calibrating the transient response behavior of a specific laser source under different parameter switching conditions and can be stored in a lookup table. For example, if switching from 10W to 15W, the laser source may have a brief overshoot or undershoot at the moment of switching. The system will temporarily adjust the output power to 15.2W in the first 0.5 mm path after the switch according to the lookup table, and adjust it to 15.1W in the next 0.5 mm, and so on, until the laser output stabilizes at 15W, thereby compensating for the transient response deviation of the laser source and ensuring uniform and stable energy output in the entire transition area.

[0058] Another embodiment of the present application further proposes that S5400 includes: S5410: Calibrate the transient response behavior of the laser source under various parameter switching conditions and construct the corresponding response curve model; S5420: Generate energy compensation data corresponding to each parameter switching condition based on the response curve model; S5430: In the preset path segment after the laser parameters are switched, energy compensation data corresponding to the current parameter switching condition is called to obtain an output power correction value; S5440: Correct the output power of the laser source according to the output power correction value to compensate for the transient response deviation of the laser source.

[0059] Among them, the calibration of transient response behavior refers to the systematic measurement and recording of the dynamic process of key performance parameters such as output power and beam quality of the laser source changing with time when different input parameters change through experiments or simulations. Its purpose is to obtain the true response characteristics of the laser source at the moment of parameter switching and provide a data basis for subsequent compensation; the response curve model refers to a mathematical expression or data structure constructed based on calibration data through mathematical modeling methods, which can describe the change of laser source output power over time. Its purpose is to generalize discrete calibration data into continuous and predictable response laws for easy calculation and application; energy compensation data refers to the response curve model constructed based on the response curve model. A series of numerical values ​​or functional relationships calculated or derived by a model are used to adjust the output power of the laser source in real time during the laser parameter switching process. Specifically, they can be power corrections, time delays, or pulse width adjustments, etc. The purpose is to offset the output deviation caused by the transient response of the laser source and ensure the stability and accuracy of the processing energy. The parameter switching condition refers to the specific combination of the laser source switching from one working parameter state to another. It can include the power value, pulse frequency, pulse width, scanning speed, etc. before and after the switching. The purpose is to distinguish the differentiated transient responses of the laser source in different switching scenarios, so as to achieve targeted compensation.

[0060] The solution of the present application finely calibrates the transient response behavior of the laser source under different parameter switching conditions, and constructs a corresponding response curve model based on these calibration results, so as to accurately capture the dynamic characteristics of the laser source at the moment of parameter switching, realize effective compensation for the transient response deviation of the laser source, and ensure the smooth transition and accurate output of the laser energy at the path switching node, thereby ensuring that the laser energy parameters matched to the main filling path and the supplementary cleaning path can be accurately applied, avoiding processing defects caused by unstable transient response of the laser source, and enabling the laser drilling processing task of the entire hole area to be completed with higher quality and efficiency.

[0061] In some preferred embodiments, the transient response behavior of the laser source under various parameter switching conditions is calibrated. Specifically, before the laser drilling system is put into use, a series of preset parameter switching experiments are performed on the laser source by connecting a high-precision optical power meter and an oscilloscope. For example, multiple combinations such as switching from low power to high power, or switching from one pulse frequency to another can be set. At each switch, the complete time curve of the laser source output power transitioning from the initial value to the target value is recorded. Based on these calibration data, the corresponding response curve model is constructed, and piecewise linear interpolation or exponential fitting can be used. For example, for switching from power Switch to In this case, a function can be fitted

[0062] Where τ is the time constant and t is the power Switch to After that, the elapsed time; e is a mathematical constant used to construct an exponential function, e≈2.71828. For more complex responses, a multidimensional lookup table can be constructed. Its index can be parameters such as power and frequency before and after the switch, and the values ​​in the table represent the power deviations at different time points. Based on the response curve model, energy compensation data corresponding to each parameter switching condition is generated. Specifically, the response curve model can be used to calculate the instantaneous deviation between the laser source output power and the target power within a preset path segment, and these deviations can be stored as energy compensation data. For example, if the model indicates that the laser power will be lower than the target value within the first 100 microseconds after the switch, the compensation data can be the power increase at different time points within this 100 microseconds. This data can be stored in a database, using the parameter switching condition as the key. Within the preset path segment after the laser parameter switch, the energy compensation data corresponding to the current parameter switching condition is called to obtain the output power correction value. Specifically, when the system detects a laser parameter switch, such as switching from the main filling path to the supplemental sweeping path, the system identifies the current parameter switching condition. Then, the system will search and load the corresponding energy compensation data from the preset database according to the parameter switching conditions. During the processing of the preset path segment, the system will obtain the corresponding output power correction value from the loaded energy compensation data in real time based on the current position of the laser head or the time it has traveled. The output power of the laser source is corrected according to the output power correction value to compensate for the transient response deviation of the laser source. Specifically, the system will superimpose the obtained output power correction value on the target output power to form a corrected instantaneous target power value, and send it to the drive controller of the laser source in real time. For example, if the target power is 15W, and the compensation data indicates that an additional 0.5W of power is required, the instantaneous target power of the laser source will be set to 15.5W. Through this dynamic adjustment, the actual output power of the laser source can be reached and maintained at the target level faster and more accurately after the parameter switching, thereby ensuring energy stability during the processing process.

[0063] Another embodiment of the present application further proposes that S5440 includes: S5441: Dynamically adjust the driving parameters of the laser source according to the output power correction value. The driving parameters include the amplitude of the driving current or the duty cycle of the pulsed laser. By adjusting the driving parameters point by point, the transient response deviation of the laser source is compensated.

[0064] Dynamic adjustment of the laser source's drive parameters refers to the continuous or discrete, non-fixed pattern change of key electrical or optical parameters that control the laser source's output energy based on real-time output power correction values. This can be achieved using a control unit such as a digital signal processor (DSP) or field-programmable gate array (FPGA), combined with a high-speed digital-to-analog converter (DAC) or pulse-width modulation (PWM) controller. Drive parameters refer to input control quantities that directly affect the laser source's energy output. Specifically, they can include the amplitude of the drive current (i.e., the current supplied to the laser diode or laser tube) or the duty cycle of the pulsed laser (i.e., the proportion of time the laser is on during its operating cycle). The goal is to directly control the instantaneous or average output power of the laser source by varying these parameters. Point-by-point adjustment involves the real-time, independent calculation and application of the laser source's drive parameters based on the corresponding output power correction values ​​at each discrete point or very short segment of the laser processing path. High-speed data sampling and control systems can be used to ensure that the laser energy output precisely matches every tiny position along the path as the laser head moves, thereby achieving precise compensation for transient response deviations.

[0065] The solution of the present application achieves precise compensation for the transient response deviation of the laser source by dynamically adjusting the driving parameters of the laser source. It not only solves the problem of transient response deviation of the laser source, but also ensures the stability and consistency of the laser energy throughout the entire processing path through direct and point-by-point intervention in the driving parameters, thereby improving the processing quality and accuracy of laser drilling. This fine control is particularly important in scenarios where laser parameters need to be quickly switched to adapt to different processing areas.

[0066] In some preferred embodiments, the present application is specifically implemented as follows: During the PCB laser drilling process, when the laser head switches from the main fill path to the supplemental cleaning path, or when the laser energy needs to be changed within the supplemental cleaning path to adapt to different material properties, laser parameter switching is triggered. At this point, the laser control system calculates an output power correction value based on a pre-established laser source transient response model and the current parameter switching conditions. Specifically, this output power correction value is fed into the laser source's driver controller. If the laser source is a semiconductor laser, the driver controller can be a high-precision current source that adjusts its output current amplitude in real time based on the received output power correction value. For example, if the correction value indicates that the current laser output power is 0.5 watts below the target, the driver controller will immediately increase the drive current by a preset increment, such as 50 mA, to boost the laser output power. Conversely, if the correction value indicates that the power is too high, the drive current will be reduced. If the laser source is a pulsed laser, the driver controller can be a pulse-width modulation (PWM) module. This module dynamically changes the duty cycle of the laser pulses based on the output power correction value. For example, when the correction value indicates low power, the PWM module will extend the laser on-time, for example, increasing the duty cycle from 50% to 55%, thereby increasing the average output power. When the correction value indicates high power, the laser on-time will be shortened. This adjustment is performed point by point, meaning that for every microsecond or micron of movement of the laser head, the drive controller will calculate and adjust the drive current amplitude or pulse duty cycle based on the latest output power correction value. For example, when the laser head moves at a speed of 100 mm per second, the control system can update the drive parameters every 10 microseconds, ensuring precise energy compensation for every 1-micron path. In this way, the actual output power of the laser source can closely follow the target power curve, effectively eliminating energy deviations caused by the transient response characteristics of the laser source and ensuring processing quality.

[0067] Another embodiment of the present application further proposes that S4100 includes: S4110: Acquire layer structure information included in the hole geometry data, the layer structure information including metal filling structure information of the micropore area of ​​each layer and the alignment relationship between layers; S4120: Based on the layer structure information, identifying the position of the outer layer contour of the hole and the inner layer microporous structure in each layer; S4130: Determine the filling state of the inner microporous structure by combining the interlayer alignment relationship and the metal filling structure information; S4140: Construct multi-layer geometric data including spatial position and filling status based on the outer contour of the hole, the inner microporous structure and its filling status.

[0068] The layer structure information contained in the hole geometry data refers to a data set describing the structural characteristics of PCB holes at different physical layers. This information can be obtained by parsing PCB design files (such as Gerber files, ODB++ data, and IPC-2581 standard data) or by processing and analyzing image data obtained through non-destructive testing techniques such as X-ray scanning and CT scanning of the PCB board. The metal filling structure information of the microvia areas of each layer refers to the presence of metal material filling within the microvia areas at each layer of the PCB, as well as the degree and type of filling. This information can be determined by analyzing the electroplating or filling process information about the microvias in the design data, or by analyzing the density distribution within the microvias through X-ray images. The purpose is to clarify the conductive connection status and material composition of the microvias at different layers, which is crucial for the absorption and effectiveness of laser energy. The interlayer alignment relationship refers to the relative position correspondence between different physical layers of the PCB in the horizontal and vertical directions. This information can be obtained through the stacking information in the PCB design file, the alignment marks in the drilling file, or through measurement and calibration of an optical alignment system.

[0069] Identifying the position of the outer contour of the hole and the inner microporous structure in each layer means accurately parsing the outer boundary shape of the hole at each level and the specific geometric shape and coordinates of the internal micropores from the layer structure information. This can be achieved through image processing algorithms (such as edge detection, shape recognition), CAD data analysis or feature point matching. Its purpose is to obtain the precise geometric information of the hole on the two-dimensional plane and provide a basis for subsequent three-dimensional construction; determining the filling state of the inner microporous structure means judging whether the inside of the micropore is completely filled, partially filled or unfilled with metal material based on the acquired metal filling structure information and the inter-layer alignment relationship. This can be achieved through a preset rule engine, a threshold-based graph Judging by using analytical or machine learning models is intended to provide a key basis for the precise matching of laser energy parameters, because whether or not metal is filled will significantly affect the laser absorption and material removal efficiency; constructing multi-layer geometric data containing spatial position and filling status refers to integrating the outer contour of the hole at different levels, the inner micropore structure, its position in each layer, and the filling status of the micropores to form a three-dimensional digital model with hierarchical and attribute information. It can be achieved through three-dimensional modeling software, data structured storage or customized data format. Its purpose is to provide a comprehensive and accurate three-dimensional model of the hole as a reliable data source for subsequent laser drilling path generation and parameter matching.

[0070] The solution of this application achieves accurate modeling of the internal structure of PCB holes and their filling status by systematically acquiring and processing the deep geometric information of the holes. It effectively solves the processing quality problems caused by missing or inaccurate information in traditional methods, ensures the complete removal of residual material, and avoids excessive damage to the material, thereby improving the overall quality and reliability of PCB laser drilling.

[0071] In some preferred embodiments, the present application is implemented as follows: First, the layer structure information contained in the hole geometry data is obtained. This can be parsed from a standard data format exported by PCB design software. For example, the geometry of each layer (including hole outlines and microvia locations) and stacking information (such as layer thickness, material type, and interlayer alignment marks) are extracted from the ODB++ data package. This data provides the two-dimensional projections of the hole at different physical levels and the relative positional relationships between layers. Next, based on this layer structure information, the location of the hole's outer layer outline and the inner layer microvia structure in each layer is identified. Specifically, a geometric parsing algorithm can be used to extract the precise outer boundary segments and vertex coordinates of the hole from the graphic data of each layer, while also identifying the center coordinates and diameter of the inner microvia. For example, for a through-hole on a multilayer board, its outer layer outline on the top and bottom layers, as well as any microvia structures that may exist in the middle layers, can be identified. Subsequently, the filling status of the inner layer microvia structure is determined by combining the interlayer alignment relationship with the metal fill structure information. For example, whether a microvia is fully filled with copper can be determined based on the design rule specifications for microvia electroplating filling, or by analyzing the grayscale distribution of the microvia area in an X-ray inspection image. If the design file indicates that a microvia is blind and has been electroplated, or if the X-ray image shows a uniform and high density in the area, it can be determined to be filled. Finally, based on the outer contour of the hole, the inner microvia structure, and its filling status, multi-layer geometric data containing spatial location and filling status is constructed. This can be achieved by associating all extracted 2D geometric information (contour, microvia location) with corresponding layer IDs, layer thicknesses, and filling status attributes to form a 3D digital model. For example, a data structure can be created in which each hole object contains a list of layers, each of which contains the hole contour geometry data, microvia geometry data, and a Boolean or enumeration value indicating the microvia filling status on that layer. This model intuitively represents the 3D structure and material distribution of the hole within the PCB, providing an accurate digital twin for subsequent laser processing path planning and parameter optimization.

[0072] Another embodiment of the present application further proposes that S4000 further includes: S4500: Extract the material stacking structure information of the residual material area in the vertical direction based on the multi-layer geometric data; S4600: Divide the residual material area into a plurality of sub-areas based on the material stacking structure information and the position of the residual material area; S4700: For each sub-region, extract its corresponding material properties and volume; S4800: Based on the material properties and volume corresponding to each sub-area, the corresponding enhanced laser energy parameters are configured according to the preset enhancement rules, and are associated with the corresponding sections in the supplementary cleaning path.

[0073] Among them, multi-layer geometric data refers to a digital representation of the structural information of each layer of the PCB board in the vertical direction, such as the material type, thickness, and projection and filling status of each layer at different levels. It can be used to provide detailed composition information of the residual material area in the depth direction; material stacking structure information refers to the specific arrangement order of different material layers (such as copper layer, dielectric layer, filled microvia, etc.) stacked in the vertical direction of the residual material area, the material type of each layer and its thickness distribution, which can be used to finely identify the heterogeneity of the residual material in depth; the preset lifting rule refers to an established algorithm or lookup table for adjusting the laser energy parameters according to different material properties, volume and stacking structure, which can be used to ensure that the laser energy can effectively remove specific material combinations without causing damage; the corresponding section in the supplementary cleaning path refers to the part of the supplementary cleaning path that corresponds to the specific sub-area in spatial position, which can be used to ensure that the refined configuration of the laser energy parameters can accurately act on the target area.

[0074] The solution of this application achieves precise configuration of laser energy parameters through in-depth analysis of the residual material area.

[0075] In some preferred embodiments, the present application is implemented as follows: First, the system receives hole geometry data containing PCB board stacking information. This data can be derived from a CAD design file, which records the material type (e.g., FR-4 dielectric, copper foil), thickness, and filling status of the inner microvias of each layer. Based on this multi-layer geometric data, the system analyzes the vertical composition of the residual material area. For example, if the residual material area extends downward from the board surface, the system can identify that it first passes through a layer of copper foil, then FR-4 dielectric, and may then encounter a copper-filled microvia structure, and finally another layer of FR-4 dielectric. This information constitutes the material stacking structure information.

[0076] Based on this material stackup information and the precise location of the residual material area on the PCB, the system divides the residual material area into multiple sub-areas. For example, if the residual material area spans both copper and dielectric layers, the system can divide it into a "copper layer sub-area" and a "dielectric layer sub-area." If the dielectric layer also contains filled microvias, it can be further subdivided into a "dielectric-microvia sub-area" and a "pure dielectric sub-area."

[0077] For each identified sub-region, the system accurately extracts its corresponding material properties (e.g., copper absorptivity, FR-4 ablation threshold) and volume. This data can be pre-stored in a material database and queried based on the sub-region identification results.

[0078] Finally, based on the material properties and volume of each sub-region, the system configures the corresponding boosted laser energy parameters according to pre-set boosting rules. For example, for the copper layer sub-region, due to copper's high laser reflectivity and high thermal conductivity, the pre-set boosting rules may set a high energy boost factor; for the FR-4 dielectric sub-region, a low energy boost factor may be set to avoid excessive ablation. If filled microvias are present, the energy can be further adjusted based on the type of filler material (such as copper or resin). These configured laser energy parameters are accurately linked to the section of the supplemental cleaning path corresponding to that sub-region. This means that when the laser head moves to the section processing the copper layer sub-region, high energy parameters optimized for the copper layer are applied; when it moves to the section processing the dielectric layer sub-region, energy parameters optimized for the dielectric layer are switched to. This ensures that the laser energy application matches the material properties, achieving efficient and high-quality material removal.

[0079] Reference Figure 2 Another embodiment of the present application further proposes a PCB laser drilling path control system, the system comprising: Receiving module 1, used to receive hole geometry data, the hole geometry data including the contour line segments and vertex coordinates of the hole to be processed; an identification and calculation module 2, for identifying sharp concave corners in the hole contour based on the hole geometry data, and calculating the geometry and volume of the residual material area left due to defects generated by the conventional path; Path generation module 3, for generating a main filling path for the main area of ​​the hole based on the hole geometry data, and generating a supplementary cleaning path for the residual material area, wherein the supplementary cleaning path is spatially separated from the main filling path, and the residual material area is located outside the coverage of the main filling path; a laser parameter matching module 4 for matching laser energy parameters for the supplemental cleaning path based on the material properties and volume of the residual material area; The processing module 5 is used to apply matching laser processing parameters in stages corresponding to the main filling path and the supplementary cleaning path during the processing process to complete the laser drilling processing task of the entire hole area.

[0080] The solution of the present application achieves precise control of the PCB laser drilling path through a modular system design, thereby effectively solving the problem of residual material and repeated energy application caused by sharp concave corners in the prior art. Specifically, the receiving module 1 first obtains the geometric data of the hole to be processed. These data contain the contour line segments and vertex coordinates of the hole, laying the foundation for all subsequent processing. Based on these geometric data, the recognition and calculation module 2 can intelligently analyze the hole contour, identify those sharp concave corners that are prone to defects generated by conventional paths, and accurately calculate the geometric shape and volume of residual materials that may be left in these areas. This recognition and calculation process is the key to subsequent refined processing.

[0081] Path Generation Module 3 then uses this geometric data to first generate an efficient primary fill path for the bulk of the hole. Simultaneously, it independently generates a supplemental sweep path for the identified residual material areas. The supplemental sweep path is spatially separated from the primary fill path, with the residual material areas clearly located outside the primary fill path's coverage area. This separation fundamentally avoids the energy duplication problem caused by path overlap in traditional methods.

[0082] Next, the laser parameter matching module 4 matches customized laser energy parameters for the supplemental cleaning path based on the material properties and volume of the residual material area. This refined parameter matching ensures that the appropriate amount of energy is applied when removing residual material, avoiding unnecessary damage to the material.

[0083] Finally, during the actual machining process, Processing Module 5 intelligently identifies and applies laser processing parameters tailored to each path in stages. It first processes the primary fill path, then switches to the supplemental sweeping path and applies the laser energy parameters tailored for that path, completely removing any remaining material.

[0084] Through the close collaboration of these modules, this system accurately executes PCB laser drilling path control methods, achieving residue-free and damage-free processing of irregular-shaped holes, especially those with sharp concave corners. This systematic approach automates and intelligentizes the previously complex and error-prone path planning and processing processes, ensuring processing quality while improving production efficiency. This fundamentally addresses the challenges faced by traditional laser drilling technology when processing complex holes.

[0085] The above description is merely an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, various modifications and variations of the present application are possible. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A PCB laser drilling path control method, characterized in that: The method comprises: Receiving hole geometry data, wherein the hole geometry data includes contour segments and vertex coordinates of the hole to be processed; Based on the hole geometry data, identifying sharp reentrant corners in the hole profile and calculating the geometry and volume of the residual material region left behind due to defect generation using a conventional path; generating a main filling path for the main area of ​​the hole based on the hole geometry data, and generating a supplementary sweeping path for the residual material area, wherein the supplementary sweeping path is spatially separated from the main filling path, and the residual material area is located outside the coverage of the main filling path; matching laser energy parameters for the supplemental cleaning path based on material properties and volume of the residual material region; During the processing, the matching laser processing parameters are applied in stages corresponding to the main filling path and the supplementary cleaning path respectively to complete the laser drilling processing task of the entire hole area.

2. The PCB laser drilling path control method according to claim 1, characterized in that: The generating of a supplementary cleaning path for the residual material area includes: Determining the distribution position of the residual material area in the hole contour based on the geometric characteristics of the sharp concave corner; A closed trajectory segment group covering the residual material area is constructed by a boundary extension fitting method as a path structure of the supplementary cleaning path; The constructed supplementary cleaning path is smoothed so as to be spatially separated from the main filling path.

3. The PCB laser drilling path control method according to claim 1, characterized in that: Matching laser energy parameters for the supplementary cleaning path includes: Extracting multi-layer geometric data including the outer contour of the hole and the inner microporous structure and filling state based on the hole geometric data; determining, based on the multi-layer geometric data, whether a copper-filled microvia structure exists below the residual material region; If there is a copper-filled microporous structure, based on the material properties and volume of the residual material area, the laser energy parameter after being increased according to the preset increase rule is selected and configured to the supplementary cleaning path; If there is no copper-filled microvia structure, conventional laser energy parameters are selected and configured to the supplementary cleaning path.

4. The PCB laser drilling path control method according to claim 1, characterized in that: The method of identifying sharp concave corners in the hole profile based on the hole geometric data and calculating the geometry and volume of the residual material area left due to defects generated by conventional paths includes: Extracting the line segment structure and vertex coordinates of the hole contour based on the hole geometric data; Calculate the angle between adjacent contour segments and identify areas with angles less than a preset threshold as sharp concave corners; Based on the area where the sharp concave corner is located, a conventional filling path generation rule is simulated to construct a simulated path coverage area, and the path coverage effect is simulated without considering the influence of the concave corner structure; The simulation path coverage area and the hole contour are overlapped and analyzed, the area outside the simulation path coverage area is identified as the residual material area, and the corresponding geometric shape and volume are calculated according to the boundary contour of the residual material area.

5. The PCB laser drilling path control method according to claim 1, characterized in that: During the processing, matching laser processing parameters are applied in stages corresponding to the main filling path and the supplementary cleaning path, including: Obtaining a processing execution order of the main filling path and the supplementary cleaning path, and determining a path switching node position of the main filling path and the supplementary cleaning path; When the laser source reaches a preset distance from the path switching node position, a laser parameter preloading instruction corresponding to the next stage processing path is sent, so that the laser source enters a preparatory state for the target laser parameter configuration of the next stage processing path; When the laser head reaches the path switching node position, the laser parameters are switched to the target laser parameters; In the preset path segment after switching the laser parameters, an output power correction value is obtained from the preset energy compensation data according to the transient response characteristics of the laser source under the conditions of each parameter switching, and the output power of the laser source is corrected according to the output power correction value.

6. The PCB laser drilling path control method according to claim 5, characterized in that: The method of obtaining an output power correction value from preset energy compensation data according to the transient response characteristics of the laser source under the switching conditions of various parameters within the preset path segment after the laser parameters are switched, and correcting the output power of the laser source according to the output power correction value includes: Calibrate the transient response behavior of the laser source under various parameter switching conditions and construct the corresponding response curve model; generating energy compensation data corresponding to each parameter switching condition based on the response curve model; In the preset path segment after the laser parameters are switched, the energy compensation data corresponding to the current parameter switching condition is called to obtain an output power correction value; The output power of the laser source is corrected according to the output power correction value to compensate for the transient response deviation of the laser source.

7. The PCB laser drilling path control method according to claim 6, characterized in that: The step of correcting the output power of the laser source according to the output power correction value to compensate for the transient response deviation of the laser source includes: According to the output power correction value, the driving parameters of the laser source are dynamically adjusted. The driving parameters include the amplitude of the driving current or the duty cycle of the pulsed laser. By adjusting the driving parameters point by point, the transient response deviation of the laser source is compensated.

8. The PCB laser drilling path control method according to claim 3, characterized in that: The extraction includes multi-layer geometric data of the outer contour of the hole and the inner microporous structure and filling state, including: Acquiring layer structure information contained in the hole geometry data, wherein the layer structure information includes metal filling structure information of micropore areas in each layer and inter-layer alignment relationship; Based on the layer structure information, identifying the positions of the outer contour of the holes and the inner microporous structure in each layer; Determining the filling state of the inner microporous structure by combining the interlayer alignment relationship with the metal filling structure information; Multi-layer geometric data including spatial position and filling state are constructed according to the outer contour of the hole, the inner microporous structure and the filling state.

9. The PCB laser drilling path control method according to claim 3, characterized in that: The step of selecting, based on the material properties and volume of the residual material area, laser energy parameters that have been increased according to a preset increasing rule and configuring the parameters to the supplementary cleaning path comprises: extracting material stacking structure information of the residual material region in a vertical direction based on the multi-layer geometric data; Dividing the residual material area into a plurality of sub-areas according to the material stacking structure information and the position of the residual material area; For each of the sub-regions, extracting the corresponding material properties and volume; According to the material properties and volumes corresponding to the sub-regions, the corresponding enhanced laser energy parameters are configured according to the preset enhancement rules and associated with the corresponding sections in the supplementary cleaning path.

10. A PCB laser drilling path control system, characterized in that: The system comprises: A receiving module, configured to receive hole geometry data, wherein the hole geometry data includes contour segments and vertex coordinates of the hole to be processed; an identification and calculation module for identifying sharp concave corners in the hole profile based on the hole geometric data, and calculating the geometry and volume of the residual material area left due to defects generated by the conventional path; a path generation module, configured to generate a main filling path for the main area of ​​the hole based on the hole geometry data, and to generate a supplementary cleaning path for the residual material area, wherein the supplementary cleaning path is spatially separated from the main filling path, and the residual material area is located outside the coverage of the main filling path; a laser parameter matching module for matching laser energy parameters for the supplemental cleaning path based on material properties and volume of the residual material region; The processing module is used to apply matching laser processing parameters in stages corresponding to the main filling path and the supplementary cleaning path during the processing process to complete the laser drilling processing task of the entire hole area.

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