High-refractive-index high-temperature-resistant epoxy acrylic photo-thermal curing composition

Abstract

The invention discloses a high-refractive-index high-temperature-resistant epoxy acrylic photo-thermal curing composition, and relates to the technical field of adhesives. The coating comprises an epoxy-acrylic acid derivative, an inorganic nanoparticle dispersion liquid, a photoinitiator, a thermal initiator and an additive. According to the system, an inorganic nanoparticle dispersion liquid and an epoxy-acrylic acid derivative are uniformly mixed, and the epoxy-acrylic acid photo-thermal curing glue with high refractive index and high temperature resistance is prepared by optimizing the proportion of each component and regulating and controlling the component and proportion of the epoxy-acrylic acid derivative. The high-refractive-index glass adhesive has the advantages of high refractive index, low viscosity and favorable bonding strength for glass bonding; the problems that the pure light curing process of the existing high-refractive-index optical element and optical electronic element is not complete, the dark area is not cured and the like can be solved; the cured high-refractive-index epoxy acrylic adhesive layer is free of obvious cracking and embrittlement after being baked at the high temperature of 220 DEG C for two hours, and has excellent temperature resistance.

Description

Technical Field

[0001] The invention belongs to the technical field of adhesives, and in particular relates to a high-refractive-index, high-temperature-resistant epoxy acrylic light-heat-curing composition. Background Art

[0002] High refractive index materials have been widely studied and researched due to their applications in optical lenses, anti-reflective coatings, optical waveguides, holographic recording systems, optoelectronic devices and other technical fields. Generally speaking, the higher the refractive index of a material, the thinner the material will be to achieve the same display effect. For example, when the refractive index of the packaging material changes from

[0003] When the refractive index is increased from 1.50 to 2.00, the light extraction efficiency of the light-emitting diode can be doubled. Therefore, functional materials with a higher refractive index are more suitable for the manufacture of advanced optical devices. The high refractive index materials for optoelectronic applications currently produced in industry (here usually refers to a high refractive index greater than 1.70, generally with carbon as the main molecular chain, and the refractive index of organic materials used in optical and electronic applications is between 1.45 and 1.55) mainly include the following technologies: (1) Synthesis of high refractive index materials containing "sulfur elements or a large number of aromatic benzene rings"; (2) Dispersing high refractive index inorganic particles in general organic materials to prepare organic and inorganic high refractive index materials.

[0004] UV glue is a type of adhesive that uses ultraviolet light (UV light) to initiate a chemical polymerization reaction. It primarily relies on UV light to trigger the curing mechanism, resulting in rapid curing. Because UV glue's rapid curing properties are well-suited for the precision assembly of optical components (such as lens bonding and optical module packaging), and the core application scenarios of high-refractive-index glues are concentrated in the optical field, high-refractive-index formula glues are often UV-cured, resulting in "UV-curable high-refractive-index glues."

[0005] Research has shown that introducing sulfur atoms or sulfur-containing groups into the molecular structure can effectively increase the refractive index of organic optical materials. For example, patent CN110951403A synthesizes a polythiol compound monomer and combines it with an acrylate oligomer to produce a pure organic high-refractive-index adhesive system with a refractive index of up to 1.70, solving the problem of low refractive index in adhesives currently used in high-end optical components, optical fiber coatings, and optical electronic components. However, the high-refractive-index polymer optical materials produced by this method suffer from complex synthesis steps, long synthesis times, and poor light transmittance. Using simply modified high-refractive-index organic resins can increase the refractive index to a certain extent, but the range of refractive index increase is small, and at room temperature, the resin is usually solid, which has the problem of high viscosity. For special processes such as coating or dispensing processes, especially in fields such as precision electronics and optical systems, low-viscosity glue (room temperature formula viscosity <5000cps) is required. This solid resin needs to be combined with other low-viscosity resins or solvents to adjust the overall formula viscosity before use.

[0006] Adding high-refractive-index inorganic nanoparticles such as TiO2, ZrO2, ZnS, and ZnO to the material is also one of the effective ways to increase the refractive index of packaging materials. For example, patent CN104495921A mixes an acetic acid-functionalized zirconium oxide nanoparticle hydrosol with a ligand containing an N-hydroxyurea functional group, and removes the acetic acid through a replacement reaction to obtain stable surface-modified zirconium oxide nanoparticles. The modified nanoparticles can be evenly dispersed in an organic matrix acrylic resin to prepare a transparent film with a refractive index of up to 1.74, while maintaining a high light transmittance (>90%) and low haze (<0.8%). This technology is suitable for scenes with high refractive index and transparency requirements, such as optical films, anti-reflective coatings, and optical adhesives.

[0007] For example, patent CN119463712A, by adjusting the ratio of a modified titanium oxide nanoparticle dispersion, monofunctional monomers, and multifunctional monomers (the monofunctional and multifunctional monomers are typically acrylate monomers containing a naphthalene ring structure, as well as acrylate monomers with a benzene ring structure and sulfur), produces a high-refractive-index nanoimprint UV-curable adhesive for use in diffractive waveguide fabrication. After curing, the adhesive achieves a refractive index of 2.0, and after demolding, the resulting diffractive waveguide product with a grating structure achieves a refractive index exceeding 2.0. The adhesive also exhibits excellent fluidity, enabling the transfer of grating structures. However, this technology is limited to light-curing processes and is inapplicable to areas that are not accessible to light or require a deep cure.

[0008] For example, patent CN113583539A uses a solvent method to ring-open epoxy resin to obtain chain or multi-branched acrylic oligomers, which are then mechanically mixed with high-refractive-index inorganic nanoparticles, photoinitiators, and other additives to prepare an optical resin composition using a photocuring method. The refractive index can reach up to 1.77. The above patent embodiments all prepare high-refractive-index adhesives by mixing an inorganic nanoparticle dispersion with an acrylic oligomer system. The prepared acrylic system glues are all cured under a free radical-initiated photocuring system. When the film layer is an extremely thin film (thickness <1mm), due to surface oxygen inhibition, the surface of the adhesive layer becomes sticky or incompletely cured after curing, affecting the performance of the structural adhesive layer and potentially posing a hidden danger to structural bonding.

[0009] As advanced optical equipment continues to develop towards high performance, miniaturization, and integration, the demand for high-refractive index optical materials continues to increase. High-refractive index glue can effectively improve the optical coupling efficiency between optical components and enhance the performance of optical systems. Currently, high-refractive index optical components are cured through photocuring. However, for future industrial production and manufacturing requirements for particularly thin or thick layers, incomplete illumination, or inability to perform UV curing, simple photocuring of high-refractive index glue has the defect of not being able to meet application requirements. Some special optical material processes may still require back-end heating or high-temperature processes. Therefore, there are still applications that require photothermal dual curing processes. For example, capacitive touch screens have structures such as opaque circuit boards on the sensor, which block the ultraviolet light of the UV glue, making it impossible to fully cure the bonding of this part of the structure. Usually, photothermal dual curing is required to solve this problem. Summary of the Invention

[0010] This patent provides a high-refractive-index epoxy acrylic photothermal curing adhesive composition system, which can effectively respond to the needs of further high-refractive-index optical components and optical electronic components that require glue with high refractive index and dual photothermal curing properties, solving problems such as incomplete photocuring alone and uncured dark areas.

[0011] To solve the above technical problems, the present invention is achieved through the following technical solutions:

[0012] The invention discloses a high-refractive-index, high-temperature-resistant epoxy-acrylic photothermal curing composition, comprising the following components in parts by weight: 5 to 70 parts of an epoxy-acrylic derivative, 30 to 95 parts of an inorganic nanoparticle dispersion, 0.1 to 10 parts of a photoinitiator, 0.1 to 10 parts of a thermal initiator, and 0.5 to 10 parts of an additive.

[0013] Furthermore, the epoxy-acrylic acid derivative is a derivative of acrylic resin having at least one oxygen heterocyclic functional group and at least one carbon-carbon double bond unsaturated hydrocarbon functional group in its molecular structure.

[0014] Furthermore, the epoxy-acrylic acid derivative is at least one of epoxy-acrylic acid ester resin, 2,3-epoxypropyl methacrylate, oxetane methacrylate, tetrahydrofurfuryl methacrylate, and methacrylate containing alicyclic epoxy groups.

[0015] Furthermore, the epoxy-acrylate resin is at least one of bisphenol A epoxy-acrylate, bisphenol F epoxy-acrylate, novolac epoxy-acrylate or epoxy-acrylate oligomer.

[0016] Furthermore, the inorganic nanoparticle dispersion is a modified inorganic nanoparticle dispersion formed by dispersing inorganic nanoparticles of titanium dioxide or zirconium dioxide in a solvent, the particle size of the inorganic nanoparticles is less than 30 nm, and the solvent is at least one of water, methanol, methyl ethyl ketone, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, benzyl acrylate, isobornyl acrylate, isobornyl methacrylate or N-vinyl pyrrolidone.

[0017] Furthermore, the photoinitiator is any one of a free radical photoinitiator, an α-hydroxy ketone photoinitiator, a benzoin compound, an acylphosphine oxide photoinitiator, an acetophenone photoinitiator, and a morpholino ketone photoinitiator.

[0018] Furthermore, the thermal initiator is an imidazole curing agent or an acid anhydride curing agent.

[0019] Furthermore, the additive is at least one of an antioxidant and a coupling agent.

[0020] Furthermore, the photothermal curing composition is prepared by the following preparation method, comprising the following steps:

[0021] S1. Weigh the epoxy-acrylic acid derivative according to the corresponding parts by weight, add it to a non-invasive homogenizer, and stir it evenly at 1200 rpm for 60 seconds;

[0022] S2, after fully mixing, adding inorganic nano-dispersion liquid and photoinitiator;

[0023] S3. After mechanical stirring, finally add the thermal initiator and additives, and stir at a constant speed of 1800 rpm for 40 seconds and then at a constant speed of 2500 rpm for 60 seconds in a homogenizer;

[0024] S4. Finally, the mixture was stirred at a rotation speed of 1800 rpm for 30 seconds to obtain a high-refractive-index, high-temperature-resistant epoxy acrylic photothermal curing composition.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] (1) It has a high refractive index property, and the refractive index of the glue formula can be adjusted. By adjusting the ratio of the inorganic nanoparticle dispersion and the above-mentioned mixed liquid, the refractive index of the final glue formula can be adjusted in the range of 1.70 to 2.10.

[0027] (2) It has a low viscosity, and the formula viscosity can be adjusted. The overall formula viscosity can be adjusted within the range of 10.0 cps to 2000.0 cps;

[0028] (3) The system is further ensured to be fully cured through photothermal dual curing. The epoxy acrylic adhesive curing system initiator includes a photoinitiator and a thermal initiator. For parts that cannot be fully cured by photocuring during special processes, thermal curing can be used to further improve and assist the curing.

[0029] (4) Good bonding strength for glass bonding;

[0030] (5) Good high temperature resistance. The glue after spin coating and curing has no obvious change after being baked at 220℃ for 2h. Compared with pure acrylic light-curing glue, the heat resistance of the formula is significantly improved.

[0031] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 This is a comparison chart of the surface drying effect of the adhesive layer after curing of the epoxy acrylic light-curing glue of Example 3 and the pure acrylic light-curing glue of Comparative Example 1;

[0034] Figure 2 This is a comparison photo of the adhesive layer after baking at 220°C for 2 hours in an embodiment of the present invention. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0036] The high-refractive-index, high-temperature-resistant epoxy-acrylic photothermal curing composition of the present invention comprises the following components, measured by weight: 5 to 70 parts of an epoxy-acrylic derivative, 30 to 95 parts of an inorganic nanoparticle dispersion, 0.1 to 10 parts of a photoinitiator, 0.1 to 10 parts of a thermal initiator, and 0.5 to 10 parts of an additive.

[0037] Epoxy-acrylate derivatives are derivatives of acrylic resins having at least one or more oxygen heterocyclic functional groups and one or more unsaturated hydrocarbon functional groups having carbon-carbon double bonds in their molecular structures. The chemical structure is preferably an epoxy-acrylate resin, such as one or more of bisphenol A epoxy-acrylate, bisphenol F epoxy-acrylate, novolac epoxy-acrylate, or epoxy-acrylate oligomers. Specifically, they are one or more of SEA-187A1, SEA-A130H, SEA-A150H, SEA-A170H, SEA-F130H, SEA-F150H, SEA-F170H, CN153 NS; 2,3-epoxypropyl methacrylate (GMA), oxetane methacrylate (OXMA), tetrahydrofurfuryl methacrylate (THFMA), or a methacrylate containing an alicyclic epoxy group (CYCLOMER M100).

[0038] The inorganic nanoparticle dispersion is a modified inorganic nanoparticle dispersion formed by dispersing titanium dioxide (TiO2) or zirconium dioxide (ZrO2) inorganic nanoparticles in a suitable solvent. The particle size of the nanoparticles is no greater than 30 nm. The titanium dioxide nanoparticle dispersion can be Nissan Chemical Co., Ltd.'s OT-RA305W7-20 (70% water content), OT-RA305M7-20 (70% methanol content), OT-RA305K7-AC (70% MEK content), OT RB300M7-20 (70% methanol content), or OT-RA205P7-AC (80% PGME content). The particle size of the modified zirconium oxide nanoparticles is no greater than 30 nm. Modified titanium oxide nanoparticle dispersions can be Nissan Chemical Co., Ltd.'s OZSH (80% water content), OZS30M (70% methanol content), OZ-540K-AC (60% MEK content), or OZ-S30P-AC (70% PGME content). The solvent in the inorganic nanoparticle dispersion is preferably water, methanol, methyl ethyl ketone (MEK), propylene glycol monomethyl ether acetate (PGMEA), an inorganic nanoparticle dispersion of propylene glycol monomethyl ether (PGME), benzyl acrylate, isobornyl acrylate (IBOA), isobornyl methacrylate (IBOMA), or N-vinyl pyrrolidone (NVP), or a mixture thereof.

[0039] The photoinitiator is one of the free radical photoinitiators α-hydroxy ketone photoinitiator, benzoin compound, acylphosphine oxide photoinitiator, acetophenone photoinitiator and morpholinyl ketone photoinitiator. The α-hydroxy ketone photoinitiator is selected from the group consisting of: 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-2-methyl-1-[4-(tert-butyl)phenyl]-1-propanone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, 2-hydroxy-2-methyl-1-(4-hydroxyethoxy)phenyl-1-propanone, polymerized [2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone], and bifunctional α-hydroxy ketone; the benzoin compound is selected from the group consisting of: benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, benzoin dimethyl ether, and benzoin diethyl ether; the acylphosphine oxide photoinitiator is selected from the group consisting of: (2 ,4,6-trimethylbenzoyl)diphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, (2,4,6-trimethylbenzoyl)phenylphosphine oxide, ethyl (2,4,6-trimethylbenzoyl)phenylphosphine ester; the acetophenone photoinitiator is selected from: 2,2-dimethoxyacetophenone, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone; the morpholinyl ketone photoinitiator is selected from: 2-methyl-1-(4-methylthiophenyl)-2-morpholinyl-1-propanone, 2-(4-methylbenzyl)-2-(dimethylamino)-1-(4-morpholinophenyl)-1-butanone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone, one or more combinations thereof.

[0040] The thermal initiator is an imidazole curing agent or an acid anhydride curing agent, and the imidazole curing agent is preferably imidazole, 2-methylimidazole, 2-ethylimidazole, 2-propylimidazole, 2-phenylimidazole, 2-isopropylimidazole, 2-phenylimidazoline, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole or 1-cyanoethyl-2-ethyl-4-methylimidazole. Specifically, the acid anhydride curing agent is preferably maleic anhydride (MA), adipic anhydride (AA), sebacic anhydride (SA), phthalic anhydride (PA), trimellitic anhydride (TMA), pyromellitic dianhydride (PMDA), tetrahydrophthalic anhydride (THPA), hexahydrophthalic anhydride (HHPA), methyltetrahydrophthalic anhydride (MTHPA), methylhexahydrophthalic anhydride (MHHPA), tetrabromophthalic anhydride (TBPA), a mixture of phthalic anhydride and maleic anhydride, and a mixture of methyltetrahydrophthalic anhydride and hexahydrophthalic anhydride, or a combination thereof.

[0041] The additive is one or a combination of an antioxidant and a coupling agent. The antioxidant is preferably BASF's Antioxidant 1010, Antioxidant 1076, Antioxidant 1098, Antioxidant 245, Antioxidant 1330, Antioxidant 3114, IRGAFOS 168, IRGAFOS 38, IRGAFOS 126, or Revonox 501, Revonox 420, Revonox 420V, Revonox 608, Revonox 6PLUS, Deox 1412, Revonox U 5024, Revonox U 5035, DeoxMD 1024, or Chiguard 234 available from ChiTi Chemical Technology. The coupling agent is preferably one or a combination of γ-aminopropyltriethoxysilane (KH-550), γ-(2,3-epoxypropyloxy)propyltrimethoxysilane (KH-560), γ-(methacryloyloxy)propyltrimethoxysilane (KH-570), N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane (KH-602), N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane (KH-792), and vinyltrimethoxysilane (A-171).

[0042] Formula preparation method:

[0043] The present invention also provides a method for preparing a high-refractive-index, high-temperature-resistant epoxy acrylic photothermal curing composition. The method for preparing the high-refractive-index epoxy acrylic photothermal curing glue as described above comprises the following steps:

[0044] According to the above weight parts, the epoxy-acrylic acid derivative having at least one or more oxygen heterocyclic functional groups and one or more carbon-carbon double bond unsaturated hydrocarbon functional groups in the molecular structure is accurately weighed, and stirred at a constant speed of 1200 rpm for 60 seconds in a non-invasive material homogenizer ZYMC-580HV (equipment purchased from Suzhou Zhongyi Precision Technology Co., Ltd.) and fully mixed. Then, the inorganic nanoparticle dispersion and the photoinitiator are added thereto, and the thermal initiator and other auxiliary agents are finally added after mechanical stirring. Then, the mixture is stirred at a constant speed of 1800 rpm for 40 seconds in the homogenizer, then at a constant speed of 2500 rpm for 60 seconds, and finally at a speed of 1800 rpm for 30 seconds to obtain a high refractive index epoxy acrylic acid photothermal curing composition.

[0045] Preparation method of adhesive layer test sample:

[0046] Open the pressure valve of the KW-4A desktop glue roller, firmly adsorb a 50mm diameter quartz glass in the center of the glue roller, use a disposable glue-tipped dropper to drop the prepared high-refractive index epoxy acrylic acid photothermal curing glue on the center of the quartz glass (about 5 drops), and after it stabilizes, close the glue roller cover and rotate at 2000rpm for 20s to evenly spread the glue, and then rotate at a high speed of 8000rpm for 30s to control the thickness of the glue layer to less than 15um. After the entire process is completed, close the pressure valve and remove the quartz glass containing the high-refractive index epoxy acrylic acid photothermal curing glue layer. Place it on a 110℃ constant temperature heating table NY-HP-4 (equipment purchased from Enyi flagship store) and keep it at a constant temperature for 1 to 3 minutes to remove the solvent. After completion, the quartz glass containing the adhesive layer was placed in a ZT1365 UV curing chamber for light curing. It was then placed in a 150°C electric blast drying oven (purchased from Shanghai Yiheng Scientific Instrument Co., Ltd.) for heat curing for one hour to obtain a sample containing a high-refractive-index epoxy acrylic photothermally curable adhesive layer. The UV wavelength used for light curing ranged from 290nm to 365nm, preferably 365nm. The heat curing temperature was 150°C for one hour.

[0047] The following performance tests were performed on the examples and comparative examples:

[0048] (1) Refractive index test: The test method uses a NAR-4T Abbe refractometer (equipment purchased from ATAGO Guangzhou Aito Scientific Instrument Co., Ltd.), and places the sample to be tested on the work surface of the refracting mirror of the Abbe refractometer. Use a clean pipette to suck 2 drops of liquid sample and place them on the working surface of the prism, and then cover the upper light-entering prism. Repeat three times and take the average value. Obtain the refractive index of the adhesive layer at a wavelength of 589nm (it should be noted that the wavelength of 589nm is only an example, and other wavelengths can also be used). For solid adhesive layers, use an ME-Mapping-L spectroscopic ellipsometer (equipment purchased from Wuhan Yiguang Technology Co., Ltd.) to test the refractive index of the adhesive layer and obtain the refractive index of the adhesive layer in the wavelength range of 600-1650nm.

[0049] (2) Light transmittance: The transmittance was tested with a spectrophotometer using an ultraviolet-visible near-infrared spectrophotometer UV-3600iPlus (purchased from Shimadzu Corporation, Japan), scanning within the visible light wavelength range of 380 to 1100 nm.

[0050] (3) Viscosity test: According to GB / T 2794, the viscosity was tested using a Brookfield DVNX LV viscometer equipped with a Thermosel heating unit and a 21# rotor.

[0051] (4) Bonding strength: Use a scraper to scrape the prepared high-refractive index epoxy acrylic photothermal curing glue to form a 100um thick glue layer, evenly apply the glue layer on the surface of a 4mm*4mm*1mm transparent small glass (about 5-20um thick glue layer), and overlap it with the surface of a tempered glass (100*25*5mm) (the overlap area is 4mm*4mm). Place the patch glass in the glue layer, then place it on the tempered glass sheet, and press it lightly with tweezers to complete the sample preparation. Place the bonding block of the glass and the small glass on a 110℃ constant temperature heating table for 3 minutes to dry out the solvent. After cooling to room temperature, place it in a ZT1365 box-type UV curing box for UV light curing and then place it in a 150℃ oven for 1 hour for complete thermal curing. After 24 hours of photothermal curing, place it on a chip thruster (equipment purchased from Nordson China Co., Ltd.) for thrust testing. A set of data has 10 samples as parallel data and the average value is taken.

[0052] (5) High temperature resistance test: Place the quartz glass containing the cured high refractive index epoxy acrylic photothermal curing adhesive layer in a 220°C oven for 2 hours. Visually observe the film and see if there are no wrinkles, bubbles or detachment. If any of the above phenomena are found, the film is unqualified.

[0053] Compared with the prior art, the present invention provides a high-refractive-index, high-temperature-resistant epoxy acrylic photothermal curing adhesive and a preparation method thereof, which has the following beneficial effects:

[0054] (1) It has a high refractive index property, and the refractive index of the glue formula can be adjusted. By adjusting the ratio of the inorganic nanoparticle dispersion and the above-mentioned mixed liquid, the refractive index of the final glue formula can be adjusted in the range of 1.70 to 2.10;

[0055] (2) It has a low viscosity, and the formula viscosity can be adjusted. The overall formula viscosity can be adjusted within the range of 10.0cps to 2000.0cps

[0056] (3) The system is further ensured to be fully cured through photothermal dual curing. The epoxy acrylic adhesive curing system initiator includes a photoinitiator and a thermal initiator. For parts that cannot be fully cured by photocuring during special processes, thermal curing can be used to further improve and assist the curing.

[0057] (4) Good bonding strength for glass bonding;

[0058] (5) Good high temperature resistance. The glue after spin coating and curing has no obvious change after being baked at 220℃ for 2h. Compared with pure acrylic light-curing glue, the heat resistance of the formula is significantly improved.

[0059] The following description sets forth numerous specific details to facilitate a thorough understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0060] Example 1

[0061] The high refractive index UV-curable adhesive of this embodiment includes the following components by weight:

[0062] 50 parts of modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC;

[0063] Epoxy acrylate CN153NS 50 parts;

[0064] 1 part of photoinitiator 2,4,6-trimethylbenzoylphenyl ethylphosphonate;

[0065] 1 part of thermal initiator 2-ethyl-4-methylimidazole;

[0066] 2 parts of antioxidant tris[2,4-di-tert-butylphenyl]phosphite;

[0067] The method for preparing the high refractive index UV-curable adhesive of this embodiment includes the following steps:

[0068] Accurately weigh the aforementioned weight portions of epoxy acrylate CN153NS, modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, 2-ethyl-4-methylimidazole, and tris[2,4-di-tert-butylphenyl]phosphite. Stir the epoxy acrylate CN153NS and modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC uniformly in a non-invasive material homogenizer ZYMC-580HV (available from Suzhou Zhongyi Precision Technology Co., Ltd.) at 1200 rpm for 60 seconds until uniform. Then, add the photoinitiator ethyl 2,4,6-trimethylbenzoylphenylphosphonate. After mechanical stirring, add the thermal initiator 2-ethyl-4-methylimidazole and other additives. The high refractive index epoxy acrylic photothermal curing adhesive was prepared by stirring the mixture at a constant speed of 1800 rpm for 40 s, at a constant speed of 2500 rpm for 60 s, and finally at a constant speed of 1800 rpm for 30 s in a non-invasive material homogenizer ZYMC-580HV.

[0069] Open the pressure valve of the desktop glue spreader KW-4A and firmly adsorb the quartz glass with a diameter of 50mm in the center of the desktop glue spreader. Drop the epoxy acrylic glue in the middle of the quartz glass with a diameter of 50mm. After it stabilizes, cover the lid of the desktop glue spreader and rotate it at a low speed of 2000rpm for 20s, and then at a high speed of 8000rpm for 30s to evenly spin-coat it on the quartz glass (the thickness of the glue layer is controlled to be below 15um). After the whole process is completed, close the pressure valve and remove the quartz glass containing the high refractive index epoxy acrylic photothermal curing glue layer. Place the quartz glass containing the epoxy acrylic photothermal curing glue layer on a 110℃ constant temperature heating table NY-HP-4 (equipment purchased from Enyi flagship store) and let it stand for 3 minutes to remove the solvent. After the end, place the quartz glass containing the glue layer in the UV curing box ZT1365 for 5000mj / cm 2 After UV curing, it was placed in a 150°C electric blast drying oven (equipment purchased from Shanghai Yiheng Scientific Instrument Co., Ltd.) for thermal curing for 1 hour to obtain a cured high-refractive index epoxy acrylic photothermal curing adhesive layer.

[0070] Example 2

[0071] The high refractive index UV-curable adhesive of this embodiment includes the following components by weight:

[0072] 60 parts of modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC;

[0073] Epoxy acrylate CN153NS 40 parts;

[0074] 1 part of photoinitiator 2,4,6-trimethylbenzoylphenyl ethylphosphonate;

[0075] 1 part of thermal initiator 2-ethyl-4-methylimidazole;

[0076] 2 parts of antioxidant tris[2,4-di-tert-butylphenyl]phosphite;

[0077] The method for preparing the high refractive index UV-curable adhesive of this embodiment includes the following steps:

[0078] Accurately weigh the aforementioned weight portions of epoxy acrylate CN153NS, modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, 2-ethyl-4-methylimidazole, and tris[2,4-di-tert-butylphenyl]phosphite. Stir the epoxy acrylate CN153NS and modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC uniformly in a non-invasive material homogenizer ZYMC-580HV (available from Suzhou Zhongyi Precision Technology Co., Ltd.) at 1200 rpm for 60 seconds until uniform. Then, add the photoinitiator ethyl 2,4,6-trimethylbenzoylphenylphosphonate. After mechanical stirring, add the thermal initiator 2-ethyl-4-methylimidazole and other additives. The high refractive index epoxy acrylic photothermal curing adhesive was prepared by stirring the mixture at a constant speed of 1800 rpm for 40 s, at a constant speed of 2500 rpm for 60 s, and finally at a constant speed of 1800 rpm for 30 s in a non-invasive material homogenizer ZYMC-580HV.

[0079] Open the pressure valve of the desktop glue spreader KW-4A and firmly adsorb the quartz glass with a diameter of 50mm in the center of the desktop glue spreader. Drop the epoxy acrylic glue in the middle of the quartz glass with a diameter of 50mm. After it stabilizes, cover the lid of the desktop glue spreader and rotate it at a low speed of 2000rpm for 20s, and then at a high speed of 8000rpm for 30s to evenly spin-coat it on the quartz glass (the thickness of the glue layer is controlled to be below 15um). After the whole process is completed, close the pressure valve and remove the quartz glass containing the high refractive index epoxy acrylic photothermal curing glue layer. Place the quartz glass containing the epoxy acrylic photothermal curing glue layer on a 110℃ constant temperature heating table NY-HP-4 (equipment purchased from Enyi flagship store) and let it stand for 3 minutes to remove the solvent. After the end, place the quartz glass containing the glue layer in the UV curing box ZT1365 for 5000mj / cm 2 After UV curing, it was placed in a 150°C electric blast drying oven (equipment purchased from Shanghai Yiheng Scientific Instrument Co., Ltd.) for thermal curing for 1 hour to obtain a cured high-refractive index epoxy acrylic photothermal curing adhesive layer.

[0080] Example 3

[0081] The high refractive index UV-curable adhesive of this embodiment includes the following components by weight:

[0082] 74 parts of modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC;

[0083] Epoxy acrylate CN153NS 26 parts;

[0084] 1 part of photoinitiator 2,4,6-trimethylbenzoylphenyl ethylphosphonate;

[0085] 1 part of thermal initiator 2-ethyl-4-methylimidazole;

[0086] 2 parts of antioxidant tris[2,4-di-tert-butylphenyl]phosphite;

[0087] The method for preparing the high refractive index UV-curable adhesive of this embodiment includes the following steps:

[0088] Accurately weigh the aforementioned weight portions of epoxy acrylate CN153NS, modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, 2-ethyl-4-methylimidazole, and tris[2,4-di-tert-butylphenyl]phosphite. Stir the epoxy acrylate CN153NS and modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC uniformly in a non-invasive material homogenizer ZYMC-580HV (available from Suzhou Zhongyi Precision Technology Co., Ltd.) at 1200 rpm for 60 seconds until uniform. Then, add the photoinitiator ethyl 2,4,6-trimethylbenzoylphenylphosphonate. After mechanical stirring, add the thermal initiator 2-ethyl-4-methylimidazole and other additives. The high refractive index epoxy acrylic photothermal curing adhesive was prepared by stirring the mixture at a constant speed of 1800 rpm for 40 s, at a constant speed of 2500 rpm for 60 s, and finally at a constant speed of 1800 rpm for 30 s in a non-invasive material homogenizer ZYMC-580HV.

[0089] Open the pressure valve of the desktop glue spreader KW-4A and firmly adsorb the quartz glass with a diameter of 50mm in the center of the desktop glue spreader. Drop the epoxy acrylic glue in the middle of the quartz glass with a diameter of 50mm. After it stabilizes, cover the lid of the desktop glue spreader and rotate it at a low speed of 2000rpm for 20s, and then at a high speed of 8000rpm for 30s to evenly spin-coat it on the quartz glass (the thickness of the glue layer is controlled to be below 15um). After the whole process is completed, close the pressure valve and remove the quartz glass containing the high refractive index epoxy acrylic photothermal curing glue layer. Place the quartz glass containing the epoxy acrylic photothermal curing glue layer on a 110℃ constant temperature heating table NY-HP-4 (equipment purchased from Enyi flagship store) and let it stand for 3 minutes to remove the solvent. After the end, place the quartz glass containing the glue layer in the UV curing box ZT1365 for 5000mj / cm 2 After UV curing, it was placed in a 150°C electric blast drying oven (equipment purchased from Shanghai Yiheng Scientific Instrument Co., Ltd.) for thermal curing for 1 hour to obtain a cured high-refractive index epoxy acrylic photothermal curing adhesive layer.

[0090] Example 4

[0091] The high refractive index UV-curable adhesive of this embodiment includes the following components by weight:

[0092] 84 parts of modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC;

[0093] Epoxy acrylate CN153NS 16 parts;

[0094] 1 part of photoinitiator 2,4,6-trimethylbenzoylphenyl ethylphosphonate;

[0095] 1 part of thermal initiator 2-ethyl-4-methylimidazole;

[0096] 2 parts of antioxidant tris[2,4-di-tert-butylphenyl]phosphite;

[0097] The method for preparing the high refractive index UV-curable adhesive of this embodiment includes the following steps:

[0098] Accurately weigh the aforementioned weight portions of epoxy acrylate CN153NS, modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, 2-ethyl-4-methylimidazole, and tris[2,4-di-tert-butylphenyl]phosphite. Stir the epoxy acrylate CN153NS and modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC uniformly in a non-invasive material homogenizer ZYMC-580HV (available from Suzhou Zhongyi Precision Technology Co., Ltd.) at 1200 rpm for 60 seconds until uniform. Then, add the photoinitiator ethyl 2,4,6-trimethylbenzoylphenylphosphonate. After mechanical stirring, add the thermal initiator 2-ethyl-4-methylimidazole and other additives. The high refractive index epoxy acrylic photothermal curing adhesive was prepared by stirring the mixture at a constant speed of 1800 rpm for 40 s, at a constant speed of 2500 rpm for 60 s, and finally at a constant speed of 1800 rpm for 30 s in a non-invasive material homogenizer ZYMC-580HV.

[0099] Open the pressure valve of the desktop glue spreader KW-4A and firmly adsorb the quartz glass with a diameter of 50mm in the center of the desktop glue spreader. Drop the epoxy acrylic glue in the middle of the quartz glass with a diameter of 50mm. After it stabilizes, cover the lid of the desktop glue spreader and rotate it at a low speed of 2000rpm for 20s, and then at a high speed of 8000rpm for 30s to evenly spin-coat it on the quartz glass (the thickness of the glue layer is controlled to be below 15um). After the whole process is completed, close the pressure valve and remove the quartz glass containing the high refractive index epoxy acrylic photothermal curing glue layer. Place the quartz glass containing the epoxy acrylic photothermal curing glue layer on a 110℃ constant temperature heating table NY-HP-4 (equipment purchased from Enyi flagship store) and let it stand for 3 minutes to remove the solvent. After the end, place the quartz glass containing the glue layer in the UV curing box ZT1365 for 5000mj / cm 2 After UV curing, it was placed in a 150°C electric blast drying oven (equipment purchased from Shanghai Yiheng Scientific Instrument Co., Ltd.) for thermal curing for 1 hour to obtain a cured high-refractive index epoxy acrylic photothermal curing adhesive layer.

[0100] Example 5

[0101] The high refractive index UV-curable adhesive of this embodiment includes the following components by weight:

[0102] 70 parts of modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC;

[0103] Epoxy acrylate CN153NS 27 parts;

[0104] 3 parts of glycidyl methacrylate;

[0105] 1 part of photoinitiator 2,4,6-trimethylbenzoylphenyl ethylphosphonate;

[0106] 1 part of thermal initiator 2-ethyl-4-methylimidazole;

[0107] 2 parts of antioxidant tris[2,4-di-tert-butylphenyl]phosphite;

[0108] The method for preparing the high-refractive-index UV-curable adhesive of this embodiment comprises the following steps: accurately weighing the above-mentioned weight portions of epoxy acrylate CN153NS, glycidyl methacrylate, modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, 2-ethyl-4-methylimidazole, and tris[2,4-di-tert-butylphenyl]phosphite. The epoxy acrylate CN153NS and glycidyl methacrylate were stirred uniformly at 1200 rpm for 60 seconds in a non-invasive material homogenizer ZYMC-580HV (equipment purchased from Suzhou Zhongyi Precision Technology Co., Ltd.). After stirring uniformly, the modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC and the photoinitiator ethyl 2,4,6-trimethylbenzoylphenylphosphonate were then added. After mechanical stirring, the thermal initiator 2-ethyl-4-methylimidazole and other additives were added. The high refractive index epoxy acrylic photothermal curing adhesive was prepared by stirring the mixture at a constant speed of 1800 rpm for 40 s, at a constant speed of 2500 rpm for 60 s, and finally at a constant speed of 1800 rpm for 30 s in a non-invasive material homogenizer ZYMC-580HV.

[0109] Open the pressure valve of the desktop glue spreader KW-4A and firmly adsorb the quartz glass with a diameter of 50mm in the center of the desktop glue spreader. Drop the epoxy acrylic glue in the middle of the quartz glass with a diameter of 50mm. After it stabilizes, cover the lid of the desktop glue spreader and rotate it at a low speed of 2000rpm for 20s, and then at a high speed of 8000rpm for 30s to evenly spin-coat it on the quartz glass (the thickness of the glue layer is controlled to be below 15um). After the whole process is completed, close the pressure valve and remove the quartz glass containing the high refractive index epoxy acrylic photothermal curing glue layer. Place the quartz glass containing the epoxy acrylic photothermal curing glue layer on a 110℃ constant temperature heating table NY-HP-4 (equipment purchased from Enyi flagship store) and let it stand for 3 minutes to remove the solvent. After the end, place the quartz glass containing the glue layer in the UV curing box ZT1365 for 5000mj / cm 2 After UV curing, it was placed in a 150°C electric blast drying oven (equipment purchased from Shanghai Yiheng Scientific Instrument Co., Ltd.) for thermal curing for 1 hour to obtain a cured high-refractive index epoxy acrylic photothermal curing adhesive layer.

[0110] Comparative Example 1

[0111] The high refractive index UV-curable adhesive of this embodiment includes the following components by weight:

[0112] 70 parts of modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC;

[0113] 30 parts of 3-phenoxybenzyl acrylate;

[0114] 1 part of photoinitiator 2,4,6-trimethylbenzoylphenyl ethylphosphonate;

[0115] 3 parts of antioxidant tris[2,4-di-tert-butylphenyl]phosphite;

[0116] The method for preparing the high refractive index UV-curable adhesive of this embodiment includes the following steps:

[0117] Accurately weigh the above-mentioned parts by weight of 3-phenoxybenzyl acrylate, modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, and tris[2,4-di-tert-butylphenyl]phosphite. Stir the 3-phenoxybenzyl acrylate and modified titanium dioxide nanoparticle dispersion OT-RA205P7-AC in a non-invasive material homogenizer ZYMC-580HV (available from Suzhou Zhongyi Precision Technology Co., Ltd.) at 1200 rpm for 60 seconds. After uniform mixing, add the photoinitiator ethyl 2,4,6-trimethylbenzoylphenylphosphonate and other additives in sequence. Stir the mixture in the non-invasive material homogenizer ZYMC-580HV at 1800 rpm for 40 seconds, then at 2500 rpm for 60 seconds, and finally at 1800 rpm for 30 seconds to produce a high-refractive-index acrylic light-curing adhesive.

[0118] Open the pressure valve of the desktop glue roller and firmly adsorb the quartz glass with a diameter of 50 mm in the center of the desktop glue roller.

[0119] Drop the acrylic glue in the middle of a quartz glass sheet with a diameter of 50mm. After it stabilizes, cover the desktop glue machine with a lid and spin it at a low speed of 2000rpm for 20s, and then at a high speed of 8000rpm for 30s to evenly spin-coat it on the quartz glass (the thickness of the glue layer is controlled to be below 15um). After the whole process is completed, close the pressure valve and remove the quartz glass containing the high refractive index acrylic light-curing glue layer. Place the quartz glass containing the acrylic light-curing glue layer on a 110℃ constant temperature heating platform and let it stand for 3 minutes to remove the solvent. Place the quartz glass containing the glue layer in a UV curing box for light curing at 5000mj / cm 2 After the film is cured by ultraviolet light with high energy, it is placed in a 150°C oven for thermal curing for 1 hour to obtain a cured high-refractive index acrylic light-curing adhesive layer.

[0120]

[0121]

[0122] Table 1: Recipe composition table;

[0123]

[0124] Table 2: Performance comparison table;

[0125] (1) The refractive index of the formula can be adjusted from 1.70 to 2.10. The test results of Examples 1 to 4 in Tables 1 and 2 above show that the epoxy acrylic photothermal curing glue provided by the present invention can adjust the refractive index of the glue in the range of 1.75 to 2.01 by adjusting the ratio of the inorganic nanoparticle dispersion and the epoxy acrylic oligomer and monomer mixture. When the content of inorganic nanoparticles in Formula Example 1 of the present invention is 25%, the refractive index of the formula is 1.75. As the relative proportion of the inorganic nanoparticle content increases, the refractive index of the formula shows an upward trend. When the content of inorganic nanoparticles is 42%, the refractive index of the glue layer reaches 2.01. Therefore, as the high-refractive-index inorganic nanoparticles increase, the refractive index of the glue film layer after photothermal curing can be adjusted within a certain ratio, and the refractive index of the system can reach a maximum of 2.10.

[0126] (2) Low viscosity can be configured, and the overall viscosity of the formula can be adjusted within the range of 10.0cps to 2000.0cps. It can be seen from the test results of the above Examples 1 to 5 and Comparative Example 1 that the epoxy acrylic acid photothermal curing adhesive provided by the present invention has a lower viscosity. For example, the viscosity of the acrylic acid system comparative example 1 is 275.6cps, and the viscosity of the epoxy acrylic acid system embodiment 5 is 10cps, which can meet the process requirements under different processes. The transmittance of the adhesive layer at 550nm (adhesive layer thickness <15um) is greater than 90%, which has excellent transmittance.

[0127] (3) The high refractive index glue can be further ensured to be fully cured by the light-heat dual curing system. By comparing Example 3 with Comparative Example 1 in the above table, Figure 1 This is a comparison of the surface drying effects of the cured adhesive layer of the epoxy acrylic light-curing glue of Example 3 and the pure acrylic light-curing glue of Comparative Example 1. After touching with a glove (the same quartz glass sheet was used before and after touching), it can be clearly seen that the surface drying effect of the cured adhesive layer of Comparative Example 1 ( Figure 1 A is before the test and Figure 1 B is the comparison after the test) the surface is sticky and has obvious fingerprints, while Example 3 ( Figure 1 C is the difference between before and after test Figure 1 D is the comparison after the test) and the surface is smooth and unchanged. This shows that the adhesive layer of a simple acrylic adhesive will be sticky after free radical light curing. However, the high-refractive-index epoxy acrylic photothermal curing adhesive provided by the present invention, which includes a photoinitiator and a thermal initiator, is not sticky after light curing and heat treatment, indicating complete surface curing.

[0128] (4) It has good bonding strength for glass bonding. By comparing Example 3 and Comparative Example 1, it can be seen that in the thrust test with glass as the substrate, the bonding strength of the acrylic system Comparative Example 1 to the glass is 4.5 MPa, while the bonding strength of the epoxy-acrylic derivative system Example 3 to the glass is 5.6 MPa. Compared with the acrylic system, the epoxy-acrylic system glue has good bonding strength for glass bonding. From the above Example 5 and Example 3, it can be seen that Example 3 is a simple epoxy-acrylic oligomer system, and Example 5 is a composition of epoxy-acrylic resin and epoxy-acrylic monomer in different proportions. In the thrust test with glass as the substrate, the addition of an appropriate proportion of epoxy-acrylic monomer can increase the bonding strength from 5.6 MPa to 17.3 MPa. Compared with the simple epoxy-acrylic oligomer system, the appropriate amount of epoxy-acrylic monomer added can effectively improve the bonding strength of the adhesive layer to the glass by constructing an epoxy-acrylic cross-linking structure.

[0129] (5) It has excellent high temperature resistance and can be baked at 220℃ for 2 hours without any obvious changes. Figure 2 As shown in the table above, by comparing Example 3 with Comparative Example 1, it can be seen that the surface of the adhesive layer of the pure acrylic adhesive after free radical light curing is cracked and brittle after being baked at 220℃ for 2h, and the adhesive layer breaks into powder after high temperature baking (such as Figure 2 The epoxy acrylic acid photothermal curing glue provided by the present invention is completely cured after light curing, heat treatment and spin coating curing, and there is no obvious change after high temperature baking at 220℃ for 2h (as shown in Figure 2 B), the surface remains smooth and flat with no visible cracking, delamination, or yellowing. Compared to conventional high-refractive index products cured with simple light, the formulation of the present invention significantly improves both bulk strength and appearance after prolonged high-temperature treatment.

[0130] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the invention. Obviously, the embodiments described are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the present invention according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the present invention in essence, and these technical solutions also fall within the scope of protection of the present invention.

Claims

1. A high refractive index, high temperature resistant epoxy acrylic photothermal curing composition, characterized in that: The invention comprises the following components in parts by weight: 5 to 70 parts of epoxy-acrylic acid derivative, 30 to 95 parts of inorganic nanoparticle dispersion, 0.1 to 10 parts of photoinitiator, 0.1 to 10 parts of thermal initiator and 0.5 to 10 parts of additives.

2. The high-refractive-index, high-temperature-resistant epoxy acrylic photothermal curing composition according to claim 1, characterized in that: The epoxy-acrylic acid derivative is a derivative of acrylic resin having at least one oxygen heterocyclic functional group and at least one carbon-carbon double bond unsaturated hydrocarbon functional group in its molecular structure.

3. The high-refractive-index, high-temperature-resistant epoxy acrylic photothermal curing composition according to claim 2, characterized in that: The epoxy-acrylic acid derivative is at least one of epoxy-acrylic acid ester resin, 2,3-epoxypropyl methacrylate, oxetane methacrylate, tetrahydrofurfuryl methacrylate, and methacrylate containing alicyclic epoxy groups.

4. The high-refractive-index, high-temperature-resistant epoxy acrylic photothermal curing composition according to claim 3, characterized in that: The epoxy-acrylate resin is at least one of bisphenol A epoxy-acrylate, bisphenol F epoxy-acrylate, novolac epoxy-acrylate or epoxy-acrylate oligomer.

5. The high-refractive-index, high-temperature-resistant epoxy acrylic photothermal curing composition according to claim 1, characterized in that: The inorganic nanoparticle dispersion is a modified inorganic nanoparticle dispersion formed by dispersing inorganic nanoparticles of titanium dioxide or zirconium dioxide in a solvent. The particle size of the inorganic nanoparticles is less than 30 nm, and the solvent is at least one of water, methanol, methyl ethyl ketone, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, benzyl acrylate, isobornyl acrylate, isobornyl methacrylate or N-vinyl pyrrolidone.

6. The high-refractive-index, high-temperature-resistant epoxy acrylic photothermal curing composition according to claim 1, characterized in that: The photoinitiator is any one of a free radical photoinitiator, an α-hydroxy ketone photoinitiator, a benzoin compound, an acylphosphine oxide photoinitiator, an acetophenone photoinitiator, and a morpholinyl ketone photoinitiator.

7. The high-refractive-index, high-temperature-resistant epoxy acrylic photothermal curing composition according to claim 1, characterized in that: The thermal initiator is an imidazole curing agent or an acid anhydride curing agent.

8. The high-refractive-index, high-temperature-resistant epoxy acrylic photothermal curing composition according to claim 1, characterized in that: The additive is at least one of an antioxidant and a coupling agent.

9. The high-refractive-index, high-temperature-resistant epoxy acrylic photothermal curing composition according to claim 1, characterized in that: The photothermal curing composition is prepared by the following preparation method, comprising the following steps: S1. Weigh the epoxy-acrylic acid derivative according to the corresponding parts by weight, add it to a non-invasive homogenizer, and stir it evenly at 1200 rpm for 60 seconds; S2, after fully mixing, adding inorganic nano-dispersion liquid and photoinitiator; S3. After mechanical stirring, finally add the thermal initiator and additives, and stir at a constant speed of 1800 rpm for 40 seconds and then at a constant speed of 2500 rpm for 60 seconds in a homogenizer; S4. Finally, the mixture was stirred at a rotation speed of 1800 rpm for 30 seconds to obtain a high-refractive-index, high-temperature-resistant epoxy acrylic photothermal curing composition.

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