Control method for energy-saving type semiconductor industrial oven system

Abstract

The invention provides a control method for an energy-saving semiconductor industrial oven system. The control method comprises the steps that automatic feeding is conducted, an AI intelligent master control center controls a feeding and discharging conveying assembly to open a drawer of a semiconductor industrial oven, a material disc is stacked in, and the drawer is closed; baking the raw materials, conveying high-temperature gas into a semiconductor industrial oven by a heat source assembly, and heating a material tray in a drawer of the semiconductor industrial oven; automatic discharging is achieved, the feeding and discharging conveying assembly opens drawers, the number and positions of material trays are determined through photographing, and the material trays are taken out one by one; and feeding is conducted after automatic discharging, the feeding and discharging conveying assembly grabs the unbaked material trays and puts the unbaked material trays into the drawers, the drawers are closed, and the second step is executed. The automatic feeding and discharging device has the beneficial effects that mechanical full-automatic feeding and discharging can be achieved, programmed temperature rising and multi-section temperature baking operation are automatically controlled, meanwhile, baking data logs are recorded, and heat energy is recycled.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial ovens, and in particular to a control method for an energy-saving semiconductor industrial oven system. Background Art

[0002] Industrial ovens are a key thermal treatment equipment widely used in modern industrial production, including electronics, chemicals, food, medicine, automotive manufacturing, metalworking, and other fields. In the semiconductor field, industrial ovens are primarily used for hot-melt fixing of electronic components. Their principle is to heat-melt solder at high temperatures to secure electronic components to circuit boards. Their advantage lies in precise temperature control. Using an advanced temperature control system, the oven's internal temperature can be precisely controlled, ensuring fluctuations within a set temperature range, meeting the temperature accuracy requirements of different processes. By optimizing air duct design and using high-efficiency heating elements, the oven achieves uniform temperature distribution, preventing quality issues caused by uneven heating of the material.

[0003] At present, in the production process of semiconductor circuit boards, semiconductor industrial ovens are an indispensable production equipment. However, the existing semiconductor industrial ovens have the following disadvantages because each hot melt fixation needs to be heated from room temperature:

[0004] 1. The heating speed is slow, resulting in low production efficiency;

[0005] 2. The heating time is long and the energy consumption is high, which leads to high production costs for heating;

[0006] 3. Direct discharge of high-temperature waste will pollute the atmosphere and is not friendly to environmental protection.

[0007] The main production process for processing semiconductor circuit boards using a semiconductor industrial oven is as follows: a worker removes a semiconductor circuit board cassette from a transfer station and places it on a cart. The cassette is then pushed to the side of the semiconductor industrial oven. The worker manually opens the oven door and places the cassette in the oven. After placing the cassette in the oven, the door is closed and fastened. A button is pressed to start the oven and bake the cassette according to the set temperature and time. After baking, an audible and visual alarm alerts the worker to open the oven door. The worker removes the baked cassette and places it on a cart. The unbaked cassette holder is placed in the oven, the door is closed and fastened, and a button is pressed. The worker then moves the baked cassette holder to the transfer station to await the next process. This process is labor-intensive and prone to errors due to fatigue, resulting in low production quality and efficiency. Furthermore, the additional transfer station takes up a lot of space and equipment, increasing production costs. Summary of the Invention

[0008] In order to solve the problems in the prior art, the present invention provides a control method for an energy-saving semiconductor industrial oven system. By arranging mutually coordinated heat source components, exhaust gas treatment tanks, heat exchangers, loading and unloading conveying components, an AI intelligent main control center and multiple semiconductor industrial ovens in the semiconductor industrial oven system, mechanized and fully automatic loading and unloading can be realized, and programmed heating and multi-stage temperature baking operations can be automatically controlled. At the same time, baking data logs can be recorded, thereby improving production efficiency, reducing energy consumption, achieving environmentally friendly emissions, and not polluting the atmosphere, thereby protecting the environment. The problems of slow heating speed, high energy consumption, lack of environmental friendliness, high labor intensity, low production efficiency and high production cost in the prior art of semiconductor industrial oven operations are solved.

[0009] A control method for an energy-saving semiconductor industrial oven system of the present invention comprises the following steps:

[0010] Step 1: Automatic loading: The AI ​​intelligent main control center controls the loading and unloading conveyor assembly to open the drawer of the semiconductor industrial oven and neatly place material trays filled with semiconductor circuit boards into the drawer. This process continues until the drawer is filled with five material trays, and the drawer is then closed and locked.

[0011] Step 2: Raw material baking. After receiving the information instruction, the AI ​​intelligent main control center controls the heat source component to deliver high-temperature gas to the semiconductor industrial oven, heating the material tray in the semiconductor industrial oven drawer according to the programmed time and temperature. At the same time, the temperature inside the semiconductor industrial oven is monitored in real time, and the temperature inside the semiconductor industrial oven is controlled by delivering room temperature gas to the semiconductor industrial oven to maintain it within the set temperature range.

[0012] Step 3: Automatic unloading: The AI ​​intelligent main control center controls the loading and unloading conveyor assembly to open the drawer of the semiconductor industrial oven that has completed the baking operation. The camera on the loading and unloading conveyor assembly takes pictures of the material trays in the semiconductor industrial oven drawer to confirm the quantity and position. At the same time, it takes pictures and reads the identification information of each material tray and grabs and moves it to the loading and unloading conveyor belt of the loading and unloading conveyor assembly, and removes all the material trays in the semiconductor industrial oven drawer one by one;

[0013] Step 4: After automatic unloading, the material is loaded again. The AI ​​intelligent main control center controls the loading and unloading conveying components to grab the unbaked material trays on the loading and unloading conveyor belt and put them into the drawer of the semiconductor industrial oven until the drawer of the semiconductor industrial oven is filled with five material trays. The drawer of the semiconductor industrial oven is pushed to close and lock, and step 2 is executed.

[0014] The present invention is further improved. In step 2, a heat recovery action is also performed. The AI ​​intelligent main control center controls the heat exchanger to recover the heat energy of the high-temperature exhaust gas discharged from the semiconductor industrial oven and re-transport it to the semiconductor industrial oven to preheat the material tray in the drawer of the semiconductor industrial oven to be heated.

[0015] The present invention is further improved. In step 1, the loading and unloading conveying assembly includes a ground rail, a six-axis robot and a loading and unloading conveyor belt. The six-axis robot is provided with a camera for shooting. The six-axis robot is slidably connected to the ground rail. The loading and unloading conveyor belt cooperates with the ground rail. The six-axis robot can clamp the material tray on the loading and unloading conveyor belt and move it into the drawer of the semiconductor industrial oven for baking operations. The six-axis robot can also clamp the material tray in the drawer of the semiconductor industrial oven and move it into the loading and unloading conveyor belt for unloading operations.

[0016] The present invention is further improved. In step 1, the semiconductor circuit board is a semiconductor circuit board that has been preliminarily connected to electronic components and is waiting to be baked to melt the tin and fix the electronic components.

[0017] The present invention is further improved. In step 1, the semiconductor industrial oven is fastened with mechanical snaps. The method for automatically opening the drawer of the semiconductor industrial oven is that the AI ​​intelligent main control center controls the six-axis robot to first press the mechanical snaps on both sides of the drawer of the semiconductor industrial oven with two cylinders, and at the same time controls the third cylinder to extend and suck the outer panel of the drawer of the semiconductor industrial oven and then retract and pull back until the drawer is fully open.

[0018] The present invention is further improved. In step 2, the baking temperature and baking time in the semiconductor industrial oven are controlled by an AI intelligent main control center, and the material box in the semiconductor industrial oven is baked at multiple temperatures, and a baking data log is generated and saved.

[0019] The present invention is further improved, in step 3, the identification information of the single material tray is a QR code or a bar code.

[0020] The present invention is further improved. In step 2, the heat energy exchanger for heat energy recovery is provided with a high-temperature exhaust gas inlet of the exchanger, a normal-temperature air inlet of the exchanger, a normal-temperature exhaust gas exhaust port of the exchanger and a high-temperature air outlet of the exchanger. The high-temperature exhaust gas exhaust port of the semiconductor industrial oven is connected to the high-temperature exhaust gas inlet of the exchanger through a gas pipeline, the high-temperature air outlet of the exchanger is connected to the air inlet of the semiconductor industrial oven, and the normal-temperature exhaust gas exhaust port of the exchanger is connected to the exhaust gas treatment tank.

[0021] The present invention is further improved in that in step 2, activated carbon for filtering the waste gas is provided in the waste gas treatment tank.

[0022] The present invention is further improved. In step 2, a high-temperature exhaust gas combustion chamber is provided between the semiconductor industrial oven and the heat exchanger. The high-temperature exhaust gas combustion chamber is provided with a variety of catalytic catalysts for decomposing organic matter in the exhaust gas, including low-temperature catalysts, biological catalysts and photocatalysts.

[0023] The beneficial effects of the present invention are as follows: a control method for an energy-saving semiconductor industrial oven system provided by the present invention can realize mechanized and fully automatic loading and unloading, and automatically control program heating and multi-stage temperature baking operations by arranging mutually coordinated heat source components, exhaust gas treatment tanks, heat exchangers, loading and unloading conveying components, AI intelligent main control center and multiple semiconductor industrial ovens in the semiconductor industrial oven system. At the same time, it can record baking data logs for quality traceability and analysis. The AI ​​intelligent main control center can also control the heat exchanger to recover the heat energy of the high-temperature exhaust gas discharged from the semiconductor industrial oven and re-transmit it to the semiconductor industrial oven The oven preheats the material tray in the drawer of the semiconductor industrial oven to be heated, and at the same time, the exhaust gas after the heat energy is recovered is harmlessly treated before being discharged. It can purify the high-temperature exhaust gas and recycle the heat energy in the high-temperature exhaust gas, circulate and preheat the material tray to be heated, and greatly reduce the time required for hot-melt fixing of electronic components on the semiconductor circuit board, improve production efficiency, reduce energy consumption, achieve environmentally friendly emissions, will not pollute the atmosphere, and protect the environment. It solves the problems of slow heating speed, high energy consumption, lack of environmental friendliness, high labor intensity, low production efficiency, and high production cost in the prior art of semiconductor industrial oven operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a flow chart of a control method for an energy-saving semiconductor industrial oven system according to the present invention;

[0025] Figure 2 This is a schematic diagram of an energy-saving semiconductor industrial oven system according to the present invention.

[0026] In the figure, 1-heat source component, 2-exhaust gas treatment tank, 3-heat energy exchanger, 4-loading and unloading conveying component, 41-ground rail, 42-six-axis robot, 43-loading and unloading conveyor belt. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0028] See Figure 1-Figure 2 A control method for an energy-saving semiconductor industrial oven system of the present invention comprises the following steps:

[0029] Step 1: Automatic loading, the AI ​​intelligent main control center controls the loading and unloading conveying assembly to open the drawer of the semiconductor industrial oven, and neatly stack the material trays filled with semiconductor circuit boards in the drawer of the semiconductor industrial oven until the drawer of the semiconductor industrial oven is filled with five material trays, and pushes the drawer of the semiconductor industrial oven to close and lock; Among them, the loading and unloading conveying assembly includes a ground rail, a six-axis robot and a loading and unloading conveyor belt. The six-axis robot is equipped with a camera for shooting. The six-axis robot is slidably connected to the ground rail, and the loading and unloading conveyor belt cooperates with the ground rail. The six-axis robot can clamp the material tray on the loading and unloading conveyor belt and move it into the semiconductor industry. The six-axis robot can also pick up the material tray in the drawer of the semiconductor industrial oven and move it to the loading and unloading conveyor belt for unloading operations; the semiconductor circuit board is a semiconductor circuit board that has initially connected electronic components and is waiting for the baking heat to melt the tin to fix the electronic components; the semiconductor industrial oven is mechanically fastened, and the way to automatically open the semiconductor industrial oven drawer is that the AI ​​intelligent main control center controls the six-axis robot to first use two cylinders to press the mechanical clips on both sides of the semiconductor industrial oven drawer, and at the same time controls the third cylinder to extend and suck the outer panel of the semiconductor industrial oven drawer and then retract, pulling back until the drawer is fully open. In this embodiment, the AI ​​intelligent main control center can control the heat exchanger to recover the heat energy of the high-temperature exhaust gas discharged from the semiconductor industrial oven and re-transmit it to the semiconductor industrial oven, preheat the material tray in the drawer of the semiconductor industrial oven to be heated, and at the same time, perform harmless treatment on the exhaust gas after the heat energy is recovered before being discharged. It can purify the high-temperature exhaust gas and recycle the heat energy in the high-temperature exhaust gas, circulate and preheat the material tray that needs to be heated, greatly reduce the time required for hot-melt fixing of electronic components on semiconductor circuit boards, improve production efficiency, reduce energy consumption, achieve environmentally friendly emissions, will not pollute the atmosphere, and protect the environment.

[0030] Step 2: Baking of raw materials. After receiving the information instruction, the AI ​​intelligent main control center controls the heat source component to deliver high-temperature gas to the semiconductor industrial oven, and heats the material tray in the drawer of the semiconductor industrial oven according to the time and temperature set by the program. At the same time, the temperature in the semiconductor industrial oven is monitored in real time, and the temperature in the semiconductor industrial oven is controlled by delivering room temperature gas to the semiconductor industrial oven to maintain it within the set temperature range. There is also a heat recovery action. The AI ​​intelligent main control center controls the heat exchanger to recover the heat energy of the high-temperature exhaust gas discharged from the semiconductor industrial oven, and re-delivers it to the semiconductor industrial oven to preheat the material tray in the drawer of the semiconductor industrial oven to be heated. Among them, the baking temperature and baking time in the semiconductor industrial oven are controlled by the AI ​​intelligent main control center, and the temperature in the semiconductor industrial oven is controlled by the AI ​​intelligent main control center. The material box is baked at multiple temperatures, and a baking data log is generated and saved at the same time for traceability and analysis. The heat exchanger used for heat recovery is provided with a high-temperature exhaust gas inlet of the exchanger, a normal-temperature air inlet of the exchanger, a normal-temperature exhaust gas exhaust port of the exchanger and a high-temperature air outlet of the exchanger. The high-temperature exhaust gas exhaust port of the semiconductor industrial oven is connected to the high-temperature exhaust gas inlet of the exchanger through a gas pipeline, and the high-temperature air outlet of the exchanger is connected to the air inlet of the semiconductor industrial oven. The normal-temperature exhaust gas exhaust port of the exchanger is connected to a waste gas treatment tank, and the waste gas treatment tank is provided with activated carbon for filtering the waste gas. A high-temperature waste gas full combustion chamber is also provided between the semiconductor industrial oven and the heat exchanger. The high-temperature waste gas full combustion chamber is provided with a variety of catalytic catalysts for decomposing organic matter in the waste gas, including low-temperature catalysts, biological catalysts and photocatalysts. In this embodiment, multiple semiconductor industrial ovens share a heat source assembly, which is transported to each semiconductor industrial oven through a pipeline. High-temperature gas and room-temperature gas are mixed in proportion to achieve the required gas temperature. The gas temperature change in each semiconductor industrial oven is independently controlled, so that the gas temperature in each semiconductor industrial oven will not be the same at the same time.

[0031] Step 3: Automatic unloading. The AI ​​intelligent main control center controls the loading and unloading conveying component to open the drawer of the semiconductor industrial oven that has completed the baking operation. The camera on the loading and unloading conveying component takes pictures of the material trays in the drawer of the semiconductor industrial oven to confirm the quantity and position. At the same time, it takes pictures and reads the identification information of a single material tray and grabs and moves it to the loading and unloading conveyor belt of the loading and unloading conveying component, and takes out all the material trays in the drawer of the semiconductor industrial oven one by one; among which, the identification information of a single material tray is a QR code or barcode, and each material tray has unique identification information.

[0032] Step 4: After automatic unloading, the material is loaded again. The AI ​​intelligent main control center controls the loading and unloading conveyor assembly to grab the unbaked material trays on the loading and unloading conveyor belt and place them into the drawer of the semiconductor industrial oven until the drawer of the semiconductor industrial oven is filled with five material trays. The drawer of the semiconductor industrial oven is pushed to close and lock, and step 2 is executed. In this embodiment, the entire baking operation process is an assembly line operation, eliminating the traditional material transfer station, thereby saving equipment and manpower. In addition, the corresponding number of semiconductor industrial ovens can be equipped according to the production capacity of the previous stage, thereby avoiding unnecessary equipment, space and electricity waste. The ovens are arranged in a shelf-like manner, utilizing the upper space, thereby saving floor space.

[0033] From the above, it can be seen that the beneficial effects of the present invention are: the present invention provides a control method for an energy-saving semiconductor industrial oven system, which can realize mechanized and fully automatic loading and unloading, and automatically control the program heating and multi-stage temperature baking operations by arranging mutually coordinated heat source components, exhaust gas treatment tanks, heat exchangers, loading and unloading conveying components, AI intelligent main control center and multiple semiconductor industrial ovens in the semiconductor industrial oven system. At the same time, it can record the baking data log for quality traceability and analysis. The AI ​​intelligent main control center can also control the heat exchanger to recover the heat energy of the high-temperature exhaust gas discharged from the semiconductor industrial oven and re-transmit it to the semiconductor industry. The semiconductor industrial oven preheats the material tray to be heated in the drawer of the semiconductor industrial oven, and at the same time, the exhaust gas after the heat energy is recovered is harmlessly treated before being discharged. It can purify the high-temperature exhaust gas and recycle the heat energy in the high-temperature exhaust gas, circulate and preheat the material tray to be heated, and greatly reduce the time required for hot-melt fixing of electronic components on semiconductor circuit boards, improve production efficiency, reduce energy consumption, achieve environmentally friendly emissions, will not pollute the atmosphere, and protect the environment. It solves the problems of slow heating speed, high energy consumption, lack of environmental friendliness, high labor intensity, low production efficiency, and high production cost in the existing technology of semiconductor industrial oven operations.

[0034] The specific implementation manner described above is a preferred implementation manner of the present invention, and is not intended to limit the specific implementation scope of the present invention. The scope of the present invention includes but is not limited to this specific implementation manner. All equivalent changes made in accordance with the present invention are within the protection scope of the present invention.

Claims

1. A control method for an energy-saving semiconductor industrial oven system, characterized in that: The following steps are included: Step 1: Automatic loading: The AI ​​intelligent main control center controls the loading and unloading conveyor assembly to open the drawer of the semiconductor industrial oven and neatly place material trays filled with semiconductor circuit boards into the drawer. This process continues until the drawer is filled with five material trays, and the drawer is then closed and locked. Step 2: Raw material baking. After receiving the information instruction, the AI ​​intelligent main control center controls the heat source component to deliver high-temperature gas to the semiconductor industrial oven, heating the material tray in the semiconductor industrial oven drawer according to the programmed time and temperature. At the same time, the temperature inside the semiconductor industrial oven is monitored in real time, and the temperature inside the semiconductor industrial oven is controlled by delivering room temperature gas to the semiconductor industrial oven to maintain it within the set temperature range. Step 3: Automatic unloading: The AI ​​intelligent main control center controls the loading and unloading conveyor assembly to open the drawer of the semiconductor industrial oven that has completed the baking operation. The camera on the loading and unloading conveyor assembly takes pictures of the material trays in the semiconductor industrial oven drawer to confirm the quantity and position. At the same time, it takes pictures and reads the identification information of each material tray and grabs and moves it to the loading and unloading conveyor belt of the loading and unloading conveyor assembly, and removes all the material trays in the semiconductor industrial oven drawer one by one; Step 4: After automatic unloading, the material is loaded again. The AI ​​intelligent main control center controls the loading and unloading conveying components to grab the unbaked material trays on the loading and unloading conveyor belt and put them into the drawer of the semiconductor industrial oven until the drawer of the semiconductor industrial oven is filled with five material trays. The drawer of the semiconductor industrial oven is pushed to close and lock, and step 2 is executed.

2. The control method for an energy-saving semiconductor industrial oven system according to claim 1, wherein: In step 2, there is also a heat recovery action. The AI ​​intelligent main control center controls the heat exchanger to recover the heat energy of the high-temperature exhaust gas discharged from the semiconductor industrial oven and re-transfer it to the semiconductor industrial oven to preheat the material tray in the semiconductor industrial oven drawer to be heated.

3. The control method for an energy-saving semiconductor industrial oven system according to claim 2, wherein: In step 1, the loading and unloading conveying assembly includes a ground rail, a six-axis robot and a loading and unloading conveyor belt. The six-axis robot is provided with a camera for shooting. The six-axis robot is slidably connected to the ground rail. The loading and unloading conveyor belt cooperates with the ground rail. The six-axis robot can clamp the material tray on the loading and unloading conveyor belt and move it into the drawer of the semiconductor industrial oven for baking operations. The six-axis robot can also clamp the material tray in the drawer of the semiconductor industrial oven and move it into the loading and unloading conveyor belt for unloading operations.

4. The control method for an energy-saving semiconductor industrial oven system according to claim 3, wherein: In step 1, the semiconductor circuit board is a semiconductor circuit board that has been preliminarily connected to electronic components and is waiting to be baked to melt the tin and fix the electronic components.

5. The control method for an energy-saving semiconductor industrial oven system according to claim 4, wherein: In step 1, the semiconductor industrial oven is fastened with mechanical snaps, and the method for automatically opening the drawer of the semiconductor industrial oven is that the AI ​​intelligent main control center controls the six-axis robot to first use two cylinders to press the mechanical snaps on both sides of the drawer of the semiconductor industrial oven, and at the same time controls the third cylinder to extend and suck the outer panel of the drawer of the semiconductor industrial oven and then retract and pull back until the drawer is fully opened.

6. The control method for an energy-saving semiconductor industrial oven system according to claim 5, wherein: In step 2, the baking temperature and baking time in the semiconductor industrial oven are controlled by the AI ​​intelligent main control center, and the material box in the semiconductor industrial oven is baked at multiple temperatures, and a baking data log is generated and saved.

7. The control method for an energy-saving semiconductor industrial oven system according to claim 6, wherein: In step 3, the identification information of a single material tray is a QR code or a bar code.

8. The control method for an energy-saving semiconductor industrial oven system according to claim 7, wherein: In step 2, the heat energy exchanger for heat energy recovery is provided with a high-temperature exhaust gas inlet of the exchanger, a normal-temperature air inlet of the exchanger, a normal-temperature exhaust gas exhaust port of the exchanger and a high-temperature air outlet of the exchanger. The high-temperature exhaust gas exhaust port of the semiconductor industrial oven is connected to the high-temperature exhaust gas inlet of the exchanger through a gas pipeline, the high-temperature air outlet of the exchanger is connected to the air inlet of the semiconductor industrial oven, and the normal-temperature exhaust gas exhaust port of the exchanger is connected to the exhaust gas treatment tank.

9. The control method for an energy-saving semiconductor industrial oven system according to claim 8, wherein: In step 2, activated carbon for filtering waste gas is provided in the waste gas treatment tank.

10. The control method for an energy-saving semiconductor industrial oven system according to claim 9, wherein: In step 2, a high-temperature exhaust gas combustion chamber is provided between the semiconductor industrial oven and the heat exchanger. The high-temperature exhaust gas combustion chamber is provided with a variety of catalytic catalysts for decomposing organic matter in the exhaust gas, including low-temperature catalysts, biocatalysts and photocatalysts.

Images