IGBT temperature measuring mechanism, control device and compressor

Abstract

An IGBT temperature measurement mechanism, a control device and a compressor relate to the technical field of temperature monitoring, the IGBT temperature measurement mechanism comprises a circuit board, a temperature sensor and an insulating heat conduction base, and the circuit board is provided with a first clamping part; a second clamping part is arranged on the insulating heat-conducting base, and the temperature sensor is fixed on the insulating heat-conducting base; the first clamping part is clamped and matched with the second clamping part; the temperature sensor is electrically connected with the circuit board, and the temperature sensor is used for monitoring the temperature of the IGBT module. The cost can be reduced, the installation space is saved, and the installation difficulty is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature monitoring, and in particular to an IGBT temperature measuring mechanism, a control device and a compressor. Background Art

[0002] An IGBT (Insulated Gate Bipolar Transistor) is a power semiconductor device that combines the high input impedance and fast switching characteristics of a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) with the low on-state voltage drop and high current handling capability of a BJT (Bipolar Junction Transistor). IGBTs are widely used in various applications requiring efficient power conversion and control, such as variable frequency drives, uninterruptible power supplies (UPS), electric vehicles, wind turbines, and solar inverters. For example, in vehicle air conditioning systems, IGBT modules are used in compressors or heaters. IGBT modules generate heat during operation. To prevent the IGBT from overheating and affecting its performance, a temperature sensor is generally required to monitor the temperature of the IGBT module. In the prior art, there are three main ways to install temperature sensors. The first is to connect one end of the temperature sensor to the copper nose, fix the copper nose to the shell with screws, connect the other end of the temperature sensor to the connector, and then electrically connect the connector to the circuit board; the second is to connect one end of the temperature sensor to the copper nose, fix the copper nose to the shell with screws, and weld the other end of the temperature sensor to the circuit board; the third is to directly weld the temperature sensor to the circuit board, and fix the temperature sensor to the shell with glue.

[0003] The inventors discovered during their research that the conventional temperature sensor installation structure has at least the following disadvantages:

[0004] The first and second methods are expensive, and the use of copper noses increases creepage distance, requiring a larger distance between the circuit board and the housing, which takes up a lot of space. The third method has poor positioning and is difficult to install. Summary of the Invention

[0005] The objects of the present invention include, for example, providing an IGBT temperature measurement mechanism, a control device and a compressor, which can reduce costs, save installation space and reduce installation difficulty.

[0006] The embodiments of the present invention can be implemented as follows:

[0007] In a first aspect, the present invention provides an IGBT temperature measurement mechanism, comprising a circuit board, a temperature sensor, and an insulating heat-conducting base, wherein:

[0008] A first clamping portion is provided on the circuit board; a second clamping portion is provided on the insulating heat-conducting base, and the temperature sensor is fixed to the insulating heat-conducting base; the first clamping portion and the second clamping portion are clamped together; the temperature sensor is electrically connected to the circuit board, and the temperature sensor is used to monitor the temperature of the IGBT module.

[0009] In an optional embodiment, an assembly through hole is provided on the circuit board, the first clamping portion is provided on the outside of the assembly through hole, and the insulating heat-conductive base is provided in the assembly through hole.

[0010] In an optional embodiment, the insulating heat-conducting base and the circuit board are relatively fixed in a circumferential direction of the assembly through hole.

[0011] In an optional embodiment, an anti-rotation groove is provided on the hole wall of the assembly through hole, and the two ends of the anti-rotation groove respectively extend to the end faces where the two ports of the assembly through hole are located, and the outer peripheral surface of the base is provided with an anti-rotation protrusion, and the anti-rotation protrusion is clamped in the anti-rotation groove.

[0012] In an optional embodiment, the first clamping portion and the second clamping portion are configured as mutually fitting inverted structures.

[0013] In an optional embodiment, the temperature sensor and the insulating heat-conducting base are configured as an integrated structure.

[0014] In a second aspect, the present invention provides a control device, comprising:

[0015] A controller housing, an IGBT module and the IGBT temperature measurement mechanism according to any one of the aforementioned embodiments, wherein the IGBT module is mounted on the circuit board and contacts the controller housing; the temperature sensor or the insulating heat-conductive base contacts the controller housing.

[0016] In an optional embodiment, a positioning groove is provided on the controller housing, and the temperature sensor or the insulating heat-conductive base is inserted into the positioning groove.

[0017] In an optional embodiment, a thermally conductive silicone layer is provided between the controller housing and the temperature sensor or the insulating thermally conductive base.

[0018] In a third aspect, the present invention provides a compressor, comprising:

[0019] The control device according to any one of the preceding embodiments.

[0020] The beneficial effects of the embodiments of the present invention include, for example:

[0021] In summary, the IGBT temperature measurement mechanism provided in this embodiment installs an insulating thermally conductive base on the temperature sensor, and the insulating thermally conductive base is clipped into place with the circuit board. There is no need to set up an additional copper nose and use screws and other structural parts to fix the temperature sensor to the controller housing. This does not increase the creepage distance, simplifies the structure, and reduces processing and manufacturing costs. At the same time, since the creepage distance is not increased, the safety distance between the circuit board and the controller housing is sufficient. The distance between the circuit board and the controller housing does not need to be increased, and the occupied space will not be increased, thereby improving the compactness of the overall structure. At the same time, the insulating thermally conductive base is clipped into place with the circuit board, and the installation structure is simple, the assembly difficulty is low, and the assembly efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 is a partial schematic diagram of the compressor of this embodiment;

[0024] Figure 2 is a schematic diagram of a circuit board of this embodiment;

[0025] Figure 3 Schematic diagram of the temperature sensor and the insulating thermal conductive base of this embodiment;

[0026] Figure 4 is a schematic diagram of a modified example of the temperature sensor and the insulating thermally conductive base of this embodiment;

[0027] Figure 5 Schematic diagram of the cooperation between the insulating heat-conducting base and the circuit board of this embodiment.

[0028] icon:

[0029] 100-housing; 200-controller housing; 210-positioning groove; 220-thermal conductive silicone layer; 300-IGBT module; 400-circuit board; 410-first snap-fit ​​buckle; 420-assembly through-hole; 430-anti-rotation groove; 500-temperature sensor; 510-pin; 600-insulating thermal conductive base; 610-second snap-fit ​​buckle; 620-anti-rotation protrusion. DETAILED DESCRIPTION

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0033] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the product of the invention is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0034] In addition, the terms "first", "second", etc., if used, are merely used to distinguish and describe, and should not be understood as indicating or implying relative importance.

[0035] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0036] In the prior art, the temperature sensor 500 used to monitor the IGBT module 300 is typically fixed to the housing via a copper lug. The temperature sensor 500 indirectly obtains the temperature of the IGBT module 300 by monitoring the temperature of the housing near the IGBT module 300. Because the copper lug is a metal conductor, it increases creepage distance. To ensure safety, the distance between the circuit board 400 and the housing must be increased, which takes up a lot of space. Furthermore, the copper lug is fixed to the housing using screws, which is costly but inefficient.

[0037] In view of this, the designer provides an IGBT temperature measurement mechanism that can simplify the structure, reduce costs, reduce occupied space, and also reduce installation difficulty and improve installation efficiency.

[0038] Please refer to Figure 1This embodiment provides a compressor, comprising a housing 100 and a control device, wherein the control device is mounted on the housing 100. The control device comprises a controller housing 200, an IGBT module 300, and an IGBT temperature measurement mechanism. The controller housing 200 and the IGBT temperature measurement mechanism are both mounted on the housing 100, and the IGBT module 300 is mounted on the IGBT temperature measurement mechanism and affixed to the controller housing 200. Heat generated during operation of the IGBT module 300 can be dissipated through the controller housing 200. The IGBT temperature measurement mechanism can monitor the temperature of the IGBT module 300 during operation.

[0039] Optionally, the controller housing 200 can be configured as an aluminum shell, which is easy to manufacture and has good thermal conductivity, thereby facilitating the dissipation of heat generated during operation of the IGBT module 300 .

[0040] Optionally, the IGBT module 300 is an existing well-known structure, and its structure and working principle are not improved in this embodiment. In order to avoid repeated description, the detailed structure of the IGBT module 300 is not described in detail in this embodiment.

[0041] Please refer to Figure 1-Figure 5 Optionally, the IGBT temperature measurement mechanism includes a circuit board 400, a temperature sensor 500, and an insulating thermally conductive base 600. The circuit board 400 is mounted in the housing 100, with a distance L between the circuit board 400 and the controller housing 200. The temperature sensor 500 is connected to the insulating thermally conductive base 600, which is directly connected to the circuit board 400. The temperature sensor 500 or the insulating thermally conductive base 600 is in contact with the controller housing 200. By obtaining the temperature of the controller housing 200, the operating temperature of the IGBT module 300 is indirectly obtained.

[0042] In other words, the heat generated by the IGBT module 300 during operation can be transferred to the controller housing 200, dissipated through the controller housing 200, and simultaneously heated, thereby increasing the temperature of the controller housing 200. By monitoring the temperature of the controller housing 200 near the IGBT module 300 using the temperature sensor 500, the temperature of the IGBT module 300 can be indirectly obtained, thereby preventing the IGBT module 300 from overheating.

[0043] Please refer to Figure 4 and Figure 5Optionally, a first clamping portion is provided on the circuit board 400, and the first clamping portion may include two first clamping undercuts 410. At the same time, an assembly through-hole 420 is also provided on the circuit board 400. The assembly through-hole 420 may be a cylindrical hole, and the assembly through-hole 420 passes through the two board surfaces in the thickness direction of the circuit board 400. The two first clamping undercuts 410 are distributed on the edges of the assembly through-hole 420 and are arranged symmetrically. Two anti-rotation grooves 430 are provided on the hole wall of the assembly through-hole 420, and each anti-rotation groove 430 may be a rectangular groove, and the two ends of each anti-rotation groove 430 extend to the two board surfaces in the thickness direction of the circuit board 400 respectively. It should be understood that the position of the assembly through-hole 420 is designed to be adaptive according to the position of the temperature sensor 500, so as to ensure that the temperature sensor 500 can be closer to the IGBT module 300 after being positioned through the assembly through-hole 420, thereby improving the accuracy of the temperature measurement results.

[0044] For example, the IGBT module 300 is generally in the shape of a long strip, and the pins 510 thereon are fixed on the circuit board 400. The IGBT module 300 has a long side and a short side. The heat dissipation on the long side is large and the temperature is high. The position of the assembly through hole 420 can correspond to the middle position of the long side of the IGBT module 300.

[0045] It should be understood that when the circuit board 400 and the controller housing 200 are both installed in the housing 100, the two first snap-fit ​​buckles 410 on the circuit board 400 are located on the side of the circuit board 400 away from the controller housing 200, which facilitates the assembly of the temperature sensor 500 and the circuit board 400.

[0046] It should be understood that the number of first snap-fit ​​undercuts 410 is not limited to two. Similarly, the number of anti-rotation grooves 430 is not limited to two. The number of first snap-fit ​​undercuts 410 and anti-rotation grooves 430 can be designed as needed. This embodiment is merely an example and does not limit the number of the two.

[0047] Please refer to Figure 3 In this embodiment, optionally, the insulating thermally conductive base 600 can be set as an integrated structure with the temperature sensor 500. The two structures are firm and reliable, and the insulating thermally conductive base 600 can wrap the temperature sensor 500 to better protect the temperature sensor 500.

[0048] Please refer to Figure 4 Obviously, in some embodiments, the insulating thermally conductive base 600 can be designed independently from the temperature sensor 500, and then the two are assembled together by plugging, which reduces the difficulty of processing and manufacturing, and also facilitates the disassembly and maintenance of the insulating thermally conductive base 600 and the temperature sensor 500.

[0049] Please refer to Figure 3-Figure 5Optionally, the insulating thermally conductive base 600 is provided with a second engaging portion and two anti-rotation protrusions 620. The second engaging portion may include two second engaging undercuts 610 located at the first end of the insulating thermally conductive base 600, and two anti-rotation protrusions 620 located on the outer circumference of the insulating thermally conductive base 600. During assembly, the second end of the insulating thermally conductive base 600, opposite the first end, is inserted into the assembly through-hole 420, and the two anti-rotation protrusions 620 are engaged with the two anti-rotation grooves 430 in a one-to-one correspondence. This can restrict the rotation of the insulating thermally conductive base 600 relative to the circuit board 400 and improve the stability of the position of the temperature sensor 500. As the depth of insertion of the insulating thermally conductive base 600 increases, the two second snap-fit ​​undercuts 610 respectively snap-fit ​​with the two first snap-fit ​​undercuts 410, and the insulating thermally conductive base 600 and the temperature sensor 500 do not move relative to the circuit board 400 in a direction away from the controller housing 200. At the same time, the temperature sensor 500 or the insulating thermally conductive base 600 is in contact with the controller housing 200. In other words, when the insulating thermally conductive base 600 and the temperature sensor 500 are an integrated structure, the insulating thermally conductive base 600 wraps around the temperature sensor 500. At this time, the insulating thermally conductive base 600 is in contact with the controller housing 200, and heat is transferred to the temperature sensor 500 through the insulating thermally conductive base 600 for temperature measurement. When the insulating thermally conductive base 600 and the temperature sensor 500 are configured as a separate structure, a portion of the temperature sensor 500 is exposed, allowing direct contact with the controller housing 200 for temperature measurement.

[0050] Optionally, in some embodiments, in order to improve thermal conductivity, a thermally conductive silicone layer 220 is provided on the controller housing 200, and the temperature sensor 500 or the insulating thermally conductive base 600 is in contact with the thermally conductive silicone layer 220, with good contact and good thermal conductivity.

[0051] Please refer to Figure 1 Furthermore, a positioning groove 210 is provided on the controller housing 200, the thermal conductive silicone layer 220 is located in the positioning groove 210, and the temperature sensor 500 or the insulating thermal conductive base 600 is inserted into the positioning groove 210, with a tight combination and good contact effect.

[0052] The assembly method of the compressor control device provided in this embodiment is as follows:

[0053] First, install the controller housing 200 into the housing 100 through its top opening. Then, place a thermally conductive silicone layer 220 in the positioning groove 210 of the controller housing 200. Install the circuit board 400 with the IGBT module 300 mounted thereon into the housing 100, with the IGBT module 300 on the circuit board 400 in contact with the controller housing 200. Next, insert the insulating thermally conductive base 600 into the assembly through-hole 420 on the circuit board 400, and insert the temperature sensor 500 or the insulating thermally conductive base 600 into the positioning groove 210. Position the insulating thermally conductive base 600 and the circuit board 400 by snapping them together. Next, solder the pins 510 on the temperature sensor 500 to the corresponding pads on the circuit board 400. Finally, close the top opening of the housing 100.

[0054] Because the temperature sensor 500 lacks a metal housing such as a copper nose, creepage distance is not increased. The distance between the circuit board 400 and the controller housing 200 is small, occupying less space and resulting in a compact structure. Furthermore, the sensor utilizes a snap-fit ​​method for fastening, making assembly easier and more efficient. The absence of copper noses and screws reduces the number of components and reduces costs.

[0055] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An IGBT temperature measurement mechanism, characterized in that: The invention comprises a circuit board (400), a temperature sensor (500) and an insulating heat-conducting base (600), wherein: The circuit board (400) is provided with a first clamping portion; the insulating heat-conducting base (600) is provided with a second clamping portion, and the temperature sensor (500) is fixed to the insulating heat-conducting base (600); the first clamping portion and the second clamping portion are engaged with each other; the temperature sensor (500) is electrically connected to the circuit board (400), and the temperature sensor (500) is used to monitor the temperature of the IGBT module (300).

2. The IGBT temperature measurement mechanism according to claim 1, characterized in that: An assembly through hole (420) is provided on the circuit board (400), the first clamping portion is provided on the outside of the assembly through hole (420), and the insulating heat-conducting base (600) is passed through the assembly through hole (420).

3. The IGBT temperature measurement mechanism according to claim 2, characterized in that: The insulating heat-conducting base (600) and the circuit board (400) are relatively fixed in the circumferential direction of the assembly through hole (420).

4. The IGBT temperature measurement mechanism according to claim 3, characterized in that: An anti-rotation groove (430) is provided on the hole wall of the assembly through hole (420), and both ends of the anti-rotation groove (430) respectively extend to the end surface where the two ports of the assembly through hole (420) are located. An anti-rotation protrusion (620) is provided on the outer peripheral surface of the base, and the anti-rotation protrusion (620) is clamped in the anti-rotation groove (430).

5. The IGBT temperature measurement mechanism according to claim 1, characterized in that: The first clamping portion and the second clamping portion are configured as mutually matching inverted buckle structures.

6. The IGBT temperature measurement mechanism according to any one of claims 1 to 5, characterized in that: The temperature sensor (500) and the insulating heat-conducting base (600) are configured as an integrated structure.

7. A control device, characterized in that: The control device comprises: A controller housing (200), an IGBT module (300), and an IGBT temperature measuring mechanism according to any one of claims 1 to 6, wherein the IGBT module (300) is mounted on the circuit board (400) and in contact with the controller housing (200); and the temperature sensor (500) or the insulating heat-conducting base (600) is in contact with the controller housing (200).

8. The control device according to claim 7, characterized in that: A positioning groove (210) is provided on the controller housing (200), and the temperature sensor (500) or the insulating heat-conducting base (600) is inserted into the positioning groove (210).

9. The control device according to claim 7, characterized in that: A heat-conducting silica gel layer (220) is provided between the controller housing (200) and the temperature sensor (500) or the insulating heat-conducting base (600).

10. A compressor, characterized in that: The compressor comprises: The control device according to any one of claims 7 to 9.

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