Glass substrate and crack detection method thereof

Abstract

The invention relates to a glass substrate and a crack detection method thereof. The glass substrate comprises a substrate; the first circuit layer is arranged on the substrate; the first insulating layer is arranged on one side, far away from the substrate, of the first circuit layer; the second circuit layer is arranged on the side, away from the first insulating layer, of the first circuit layer, and the second circuit layer is electrically connected with an external control circuit and a display assembly and used for receiving a control signal from the external control circuit and controlling the display assembly to display; the first circuit layer is arranged on the layer closest to the substrate, so that a foundation is provided for detecting whether the cracking of the substrate is caused by the steps in the subsequent preparation process or not.

Description

Technical Field

[0001] The present application relates to the display field, and in particular to a glass substrate and a crack detection method thereof. Background Art

[0002] In modern electronics manufacturing, optical device production, and the processing of various precision glass products, glass substrates are a key base material, and their integrity plays a decisive role in the quality and performance of the final product. However, due to the inherent brittleness of glass, it is easily damaged during the manufacturing process.

[0003] To reduce losses, a carrier is usually used to isolate and support the glass substrate to reduce cracking of the glass substrate caused by bumps. However, since the carrier cannot completely protect the glass substrate, and the position where the chip is installed in the glass substrate often adopts a hollow design, it is easy to cause cracks when subjected to force, which in turn causes cracks in the glass substrate.

[0004] Traditional methods often perform crack detection on glass substrates before packaging, ignoring the problem that the preparation steps are more likely to cause glass substrate cracking. Testing before packaging cannot determine which specific step causes the glass substrate to crack. Summary of the Invention

[0005] Based on this, it is necessary to provide a glass substrate and a crack detection method thereof in order to solve the problem of being unable to determine which specific step causes the substrate to crack.

[0006] To achieve the above objectives, the present application provides a glass substrate, comprising:

[0007] substrate;

[0008] A first circuit layer is provided on the base substrate;

[0009] a first insulating layer, disposed on a side of the first circuit layer away from the base substrate;

[0010] The second circuit layer is arranged on a side of the first circuit layer away from the first insulating layer. The second circuit layer is electrically connected to the external control circuit and the display component, and is used to receive a control signal from the external control circuit and control the display of the display component.

[0011] In one embodiment, the first circuit layer includes evenly distributed grid-shaped traces.

[0012] In one embodiment, the first circuit layer includes a conductive material covering the entire surface of the base substrate.

[0013] In one embodiment, it further includes:

[0014] An intermediate connecting layer is provided on a side of the first insulating layer away from the first circuit layer, and is used to improve the adhesion of the second circuit layer.

[0015] In one embodiment, it further includes:

[0016] The second insulating layer is arranged on a side of the second circuit layer away from the first circuit layer, and is used to isolate the second circuit layer from an external circuit.

[0017] In one embodiment, the material of the second insulating layer includes solder resist ink and deformation-changing color ink, wherein the solder resist ink is used to provide insulation protection, and the deformation-changing color ink is used to change color when deformation occurs.

[0018] The above-mentioned first circuit layer is arranged at the layer closest to the base substrate, which provides a basis for detecting whether the subsequent preparation steps cause the base substrate to crack; a first insulating layer is arranged between the first circuit layer and the second circuit layer, which can reduce the probability of short circuit in the first circuit layer, thereby improving the accuracy of detecting whether the base substrate is cracked through the first circuit layer.

[0019] The present application also provides a crack detection method for detecting cracks in the preparation process of the glass substrate, comprising:

[0020] After the first circuit layer is provided on the base substrate, conductive contacts are provided on at least two sides of the circumference of the first circuit layer, wherein the conductive contacts are electrically connected to the first circuit layer and are used to electrically connect to an external device to measure the resistance value of the first circuit layer;

[0021] Based on the resistance value of the first circuit layer, it is determined whether the preparation steps after the first circuit layer cause the substrate to crack, and the area where the crack is located is determined according to the conductive contacts.

[0022] In one embodiment, determining the crack location based on the conductive contact includes:

[0023] Obtain the resistance value between any two conductive contacts, and determine whether the resistance value is greater than a preset resistance value of the shortest path between the two conductive contacts. If so, determine that the area where the positive projection of the shortest path between the two conductive contacts on the substrate is located is the crack area.

[0024] In one embodiment, when the first circuit layer is a grid-shaped routing, the shortest path is the shortest routing path;

[0025] When the first circuit layer is a conductive material covering the entire surface of the base substrate, the shortest path is a line connecting two conductive contacts.

[0026] In one embodiment, the determining, based on the resistance value of the first circuit layer, whether a preparation step subsequent to the first circuit layer causes the substrate to crack comprises:

[0027] When performing each preparation step or a specific preparation process in each preparation step, measuring the resistance value of the first circuit layer, and when the resistance value of the first circuit layer is greater than a preset resistance value, determining that the corresponding step or the corresponding preparation process causes cracking of the substrate;

[0028] The preparation steps after the first circuit layer at least include: preparing a first insulating layer and a second circuit layer.

[0029] The above-mentioned conductive contacts are electrically connected to the first circuit layer. During the subsequent preparation process, the resistance of the first circuit layer can be measured through the conductive contacts at any time, and the change in resistance can be used to determine which step causes the cracking of the substrate, thereby providing a basis for optimizing the production steps and reducing the number of cracked substrates caused by the same reason. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 A cross-sectional view of a glass substrate formed in one embodiment;

[0032] Figure 2 A schematic diagram of a grid-shaped first circuit layer according to an embodiment;

[0033] Figure 3 This is a schematic diagram of a first circuit layer entirely covered with conductive material according to an embodiment;

[0034] Figure 4 A cross-sectional view of a glass substrate formed in accordance with another embodiment;

[0035] Figure 5 is a flow chart of a crack detection method according to an embodiment;

[0036] Figure 6 A schematic diagram of a conductive material covering the area where the conductive contacts are located according to an embodiment;

[0037] Figure 7 A schematic diagram of resistance measurement of a grid-shaped first circuit layer according to an embodiment;

[0038] Figure 8FIG1 is a schematic diagram showing resistance measurement of a first circuit layer entirely covered with conductive material according to an embodiment.

[0039] Description of reference numerals:

[0040] Base substrate: 10; first circuit layer: 20; grid-like routing: 210; conductive material covering the entire base substrate 220; shortest routing path between the two conductive contacts A1 and B1: 230; connection line between the two conductive contacts A1 and D15: 240; first insulating layer: 30; second circuit layer: 40; intermediate connecting layer: 50; second insulating layer: 60; conductive contact: 70. DETAILED DESCRIPTION

[0041] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0043] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if there is transmission of electrical signals or data between the connected circuits, modules, units, etc.

[0044] It is understood that “at least one” refers to one or more, “a plurality” refers to two or more, and “at least a portion of an element” refers to a portion or all of an element.

[0045] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include," "comprising," "having," and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Furthermore, the term "and / or" as used in this specification includes any and all combinations of the relevant listed items.

[0046] Glass substrates have good thermal stability, a low coefficient of thermal expansion, and high thermal conductivity. Compared to PCB substrates (Printed Circuit Boards), they are less susceptible to deformation due to temperature changes. They can effectively dissipate the heat generated by LED chips during operation, reducing device performance fluctuations. They are widely used in the direct display industry, especially in the field of PM LEDs (Passive Matrix Light Emitting Diodes). The glass substrates used in the PM LED field are typically obtained by drilling TGV (Through Glass Via) holes on transparent glass, followed by copper circuits and ink spraying on the surface. However, due to the brittle nature of glass itself, cracks are easily caused during the production process and are difficult to detect. In addition, the existing technology often detects cracks on the substrate before packaging. Even if cracks are detected before packaging, the cracked glass substrate has already undergone multiple processing steps, which not only increases labor costs but also wastes preparation materials. Therefore, in order to accurately detect cracks during the production process, the present application provides a glass substrate capable of detecting cracks during the production process, as well as a crack detection method for the glass substrate.

[0047] The present invention provides a glass substrate, such as Figure 1 Shown, including:

[0048] Base substrate 10;

[0049] Optionally, the base substrate 10 is a glass sheet that has been TGV punched, wherein the TGV punching method is a prior art and will not be described in detail here; the TGV punching provides a basis for the front and back circuits of the base substrate to be connected.

[0050] A first circuit layer 20 is provided on the base substrate 10;

[0051] Optionally, the first circuit layer 20 can be made of materials such as ITO (Indium Tin Oxide), FTO (Fluorine-doped Tin Oxide), AZO (Aluminum-doped Zinc Oxide), and IZO (Indium Zinc Oxide). The specific material can be selected based on experience or needs and is not limited here.

[0052] Optionally, the first circuit layer 20 is arranged in the display area of ​​the base substrate 10. The method of setting the first circuit layer 20 on the base substrate 10 includes chemical vapor deposition, vacuum evaporation and magnetron sputtering, etc. Different setting methods can be adopted for different materials based on experience, and there is no limitation here.

[0053] Setting the first circuit layer 20 as the first layer on the base substrate 10 is the core of detecting whether the subsequent multiple steps cause the base substrate 10 to crack. The closer the setting position of the first circuit layer 20 is to the base substrate 10, the more subsequent steps can be detected.

[0054] The first insulating layer 30 is arranged on the side of the first circuit layer 20 away from the base substrate 10; the first insulating layer 30 is used to isolate the first circuit layer 20 from other circuit layers except the first circuit layer 20; to avoid short circuit, the first insulating layer 30 can be made of non-conductive metal oxides or nitrides, such as aluminum oxide and boron nitride, and can be arranged on the first circuit layer 20 by physical vapor deposition and atomic layer deposition, etc., which is not limited here.

[0055] The second circuit layer 40 is arranged on a side of the first circuit layer 20 away from the first insulating layer 30. The second circuit layer 40 is electrically connected to the external control circuit and the display component, and is used to receive a control signal from the external control circuit and control the display of the display component.

[0056] Optionally, the second circuit layer 40 can be a copper circuit layer or other metal circuit layer, which is not limited here; the methods of setting the second circuit layer include physical vapor deposition, chemical plating, electroplating and atomic layer deposition, etc., which are not limited here.

[0057] Since this solution mainly sets up a first circuit layer 10 in the display area to detect cracks in the substrate preparation process, only the circuit layout of the lamp surface is described in detail. For the IC surface not described, the existing structure is adopted and is not repeated here.

[0058] The glass substrate composed of the first circuit layer 20, the first insulating layer 30, the second circuit layer 40 and the base substrate 10 has the simplest structure. More circuit layers and intermediate layers can be set on the base substrate 10. The specific number and type of intermediate layers and circuit layers are determined according to needs.

[0059] In one embodiment, the glass substrate includes the base substrate 10, the first circuit layer 20, the first insulating layer 30 and the second circuit layer 40, wherein the first circuit layer 20 includes a uniformly distributed grid-shaped trace 210, such as Figure 2 As shown; since the first circuit layer is not necessarily a square, the evenly distributed grid-like routing mainly refers to the internal routing being a uniform grid, and there is no requirement for whether the grid formed between the routing at the end and the boundary of the first circuit layer is consistent with the internal grid.

[0060] Setting the first circuit layer 20 to a uniformly distributed grid-like routing 210 can ensure that the resistance of each line is uniform, and the staff can determine the shortest transmission path of the electrical signal based on experience; even if the subsequent preparation steps cover the first circuit layer 20, resulting in the inability to intuitively observe the situation of the first circuit layer 20, the staff can still determine the shortest routing path of the electrical signal through experiments or based on experience, providing a basis for subsequent positioning of open routing.

[0061] In one embodiment, the glass substrate includes the base substrate 10, the first circuit layer 20, the first insulating layer 30 and the second circuit layer 40, wherein the first circuit layer 20 includes a conductive material 220 covering the entire surface of the base substrate, such as Figure 3 As shown, in order to more clearly show the conductive material 220 set on the entire surface, Figure 3 Dense dots are used for illustration.

[0062] By laying the conductive material on the entire surface of the first circuit layer, cracks at any location on the entire substrate can be detected, thereby improving detection accuracy.

[0063] In one embodiment, the glass substrate includes the base substrate 10, the first circuit layer 20, the first insulating layer 30 and the second circuit layer 40, and the intermediate connecting layer 50 arranged on the side of the first insulating layer 30 away from the first circuit layer 20, and the intermediate connecting layer 50 is used to improve the adhesion of the second circuit layer 40.

[0064] Optionally, the intermediate connection layer 50 may be a seed layer, and may be disposed on the first insulating layer 30 by physical vapor deposition, atomic layer deposition, or other methods.

[0065] In one embodiment, the glass substrate includes the base substrate 10, the first circuit layer 20, the first insulating layer 30, the second circuit layer 40, and the second insulating layer 60;

[0066] The second insulating layer 60 is provided on a side of the second circuit layer 40 away from the first circuit layer 20 , and is used to isolate the second circuit layer 20 from an external circuit;

[0067] In another embodiment, the glass substrate includes the base substrate 10, the first circuit layer 20, the first insulating layer 30, the second circuit layer 40, the intermediate connecting layer 50, and the second insulating layer 60. Figure 4 As shown;

[0068] The second insulating layer 60 is also used to prevent oxidation and corrosion.

[0069] In one embodiment, the material of the second insulating layer 60 includes solder resist ink and deformation-changing color ink. The solder resist ink is used to provide insulation protection, and the deformation-changing color ink is used to change color when deformation occurs.

[0070] The deformation-changing color ink can be made of photonic crystals prepared with polystyrene microspheres as raw materials, shape memory polymer composites containing photochromic groups such as spiropyran, cholesteric liquid crystals, electrochromic polymer composites such as carbon nanotubes and polypyrrole, and inks formed by a composite of metal nanoparticles and polyacrylates.

[0071] Optionally, the method of setting the second insulating layer 60 on the second circuit layer 40 is: first, the solder resist ink and the deformation color-changing ink are evenly mixed in a certain proportion, such as a one-to-one ratio, and then the mixed ink is processed on the surface of the second circuit layer; finally, the mixed ink is cured by light of a certain wavelength, and after a certain period of time, the uncured ink is removed.

[0072] Adding deformation-changing color ink to solder mask ink can quickly reflect whether the substrate is deformed by external force in the subsequent process.

[0073] The above-mentioned first circuit layer 20 is arranged at the layer closest to the base substrate 10, providing a basis for detecting whether the subsequent preparation steps cause the base substrate 10 to crack; a first insulating layer 30 is arranged between the first circuit layer 20 and the second circuit layer 40, which can reduce the probability of short circuit in the first circuit layer 20, thereby improving the accuracy of detecting whether the base substrate is cracked through the first circuit layer 20.

[0074] The present application also relates to a crack detection method for detecting cracks in the glass substrate preparation process.

[0075] See Figure 5 and Figure 6 , the crack detection method includes steps 102 and 104.

[0076] Step 102: After a first circuit layer 20 is provided on a base substrate 10, conductive contacts 70 are provided on at least two sides of the first circuit layer 20 in a circumferential direction. The conductive contacts 70 are electrically connected to the first circuit layer 20 and are used to electrically connect to an external device to measure the resistance value of the first circuit layer.

[0077] Optionally, the conductive contacts 70 may be arranged on two sides, three sides or four sides of the first circuit layer 20 in the circumferential direction. Figure 3 The reference direction refers to the four directions of the first circuit layer 20, Figure 3It is a top view of the first circuit layer 20 and the conductive contacts 70 after step 102 , wherein the conductive contacts 70 are arranged around the first circuit layer 20 .

[0078] Optionally, the conductive contacts 70 are made of the same material as the first circuit layer 20. In one embodiment, the first circuit layer 20 and the conductive contacts 70 can be provided in the same step to shorten the preparation cycle.

[0079] In one embodiment, the conductive material 220 extends to the conductive contacts 70. Figure 6 As shown, the conductive material is represented by dense dots; since a mask needs to be made before plating the conductive material 220 on the base substrate 10 to achieve precise control of the plating range, in order to simplify the complexity of mask production, the conductive material 220 can be extended to the boundary of the conductive contact 70.

[0080] The conductive contact 70 can be connected to an external device such as a resistance tester to measure the resistance in the first circuit layer 20. Measuring the resistance of the first circuit layer 20 through the conductive contact 70 is an important step in detecting cracks, because cracks can cause the circuit to open, thereby causing the current path to change, thereby changing the resistance. By determining whether the measured resistance value of the first circuit layer changes, it can be inferred whether the substrate has cracks. Furthermore, by measuring the resistance of the first circuit layer 20, some fine cracks that cannot be detected by the naked eye or conventional instruments can be detected. For example, a conventional optical microscope cannot detect cracks with a width less than 100 mm. Its resolution is small; and if an optical microscope is used to detect cracks in the production process, the base substrate 10 needs to be repeatedly taken out and inspected during the production process, which is not only cumbersome, but may also cause damage to the base substrate during the removal process; and when a solder resist ink layer is provided on the base substrate, the position of the crack cannot be located by an optical microscope; in the present application, the first circuit layer is directly provided on the base substrate, and even fine cracks will change the transmission path of the electrical signal, so that the fine cracks can be reflected by the measured resistance value of the first circuit layer, which not only improves the detection accuracy but also simplifies the detection steps.

[0081] Step 104 : Based on the resistance value of the first circuit layer 20 , determine whether subsequent preparation steps of the first circuit layer 20 cause cracks in the base substrate 10 , and determine the crack region based on the conductive contacts 70 .

[0082] Optionally, each time a step is executed or a complete step is completed, the resistance between the pair of conductive contacts 70 can be measured by an external device. By measuring the resistance, the measured resistance can be compared with the preset resistance. If the measured resistance changes significantly and is greater than the preset resistance, it means that a certain step has caused the base substrate 10 to crack, and the area where the crack is located can be further determined through the pair of conductive contacts 70.

[0083] In one embodiment, determining the crack location based on the conductive contact 70 includes:

[0084] Obtain the resistance value between any two conductive contacts 70, and determine whether the resistance value is greater than the preset resistance value of the shortest path between the two conductive contacts 70. If so, determine that the area where the positive projection of the shortest path between the two conductive contacts 70 on the base substrate 10 is located is the crack area.

[0085] The shortest path can be determined based on experience or experiments. If the area where the shortest routing path is projected onto the substrate 10 is cracked, the shortest path will be open, and the electrical signal will not be able to choose the initial shortest path to pass, but can only choose other paths, which will cause the resistance between the two conductive contacts 70 to increase. Therefore, by measuring the resistance between the two conductive contacts 70, it can be determined whether there is an open circuit between the conductive contacts 70, thereby determining whether the area where the shortest path is projected onto the substrate 10 is cracked.

[0086] Optionally, the preset resistance value can be determined through experience or experiments. In one embodiment, the method of determining the preset resistance value through experiments includes: in the step before the current step, obtaining the resistance value R1 between the two conductive contacts 70, and using the resistance value R1 as the preset resistance value corresponding to the two conductive contacts 70 in the current step; if after the current step is completed, the difference between the measured resistance value between the conductive contact pair and the resistance value R1 (i.e., the preset resistance value) is too large, it means that the current step causes the substrate to crack.

[0087] Optionally, the preset resistance value may be a fixed value or a range, which is determined according to specific requirements and is not limited here.

[0088] In one embodiment, when the first circuit layer 20 is a grid-shaped trace 210 , the conductive contact 70 is electrically connected to the end of the grid-shaped trace 210 , and the shortest path is the shortest trace path;

[0089] See Figure 7 , Figure 7The first circuit layer 20 is a grid-like routing 210, and conductive contacts 70 are set around the first circuit layer 20; optionally, different parameters are used to represent different conductive contacts 70, and the setting method can be determined according to needs. Figure 7 The conductive contacts are arranged as follows: the left conductive contacts 70 are sequentially represented by A1, ..., A4, ...A7, the right conductive contacts 70 are sequentially represented by B1, ..., B7, ...B15, the upper conductive contacts 70 are sequentially represented by C1, ..., C4, ...C7, and the lower conductive contacts 70 are sequentially represented by D1, ..., D7, ...D15; further, Figure 7 The resistance value R between two conductive contacts A1 and B1 is measured. A1B1 , if the resistance value R A1B1 If the resistance value is greater than the preset resistance value, it means that there is a crack in the orthographic projection area of ​​the shortest routing path 230 between the two conductive contacts A1 and B1 on the substrate 10. Combining the orthographic projection area of ​​the shortest routing path 230 between the two conductive contacts A1 and B1 on the substrate 10 with the preparation steps implemented before detecting the resistance value can quickly determine the preparation step that caused the crack in the substrate 10, providing a basis for subsequent optimization of the preparation steps and reducing cracks caused by the same reason.

[0090] In another embodiment, when the first circuit layer 20 is a conductive material 220 covering the entire surface of the base substrate, the conductive material 220 is electrically connected to the conductive contacts 70, and the shortest path is the line between the two conductive contacts. Since the entire surface is the conductive material 220, the shortest transmission path of the electrical signal measured by an external device is the line between the two conductive contacts 70. If the resistance value between the two conductive contacts 70 increases abnormally, it indicates that there is an open circuit on the line between the two conductive contacts 70, further indicating that the orthographic projection area of ​​the line between the two conductive contacts 70 on the base substrate 10 is the area where the crack is located.

[0091] See Figure 8 , Figure 8 The conductive contacts 70 are provided in a manner similar to that described in the preceding text. Figure 7 same, Figure 8 The resistance value between the two conductive contacts A1 and D15 is measured. If the resistance value between the two conductive contacts 70 A1 and D15 is greater than the preset resistance value, it means that the positive projection area of ​​the connection line 240 between the two conductive contacts 70 A1 and D15 on the base substrate 10 is the crack area.

[0092] By covering the entire surface of the base substrate 10, cracks at any position on the base substrate 10 can be detected. By further combining the preparation steps with the position of the base substrate 10 corresponding to the line connecting the two conductive contacts 70, the location of the crack and the preparation steps that caused the cracking of the base substrate 10 can be inferred, providing a basis for optimizing the preparation process.

[0093] In one embodiment, judging whether a subsequent preparation step of the first circuit layer 20 causes cracking of the substrate based on the resistance value of the first circuit layer 20 includes:

[0094] When performing each preparation step or a specific preparation process in each preparation step, the resistance value of the first circuit layer 20 is measured. When the resistance value of the first circuit layer 20 is greater than a preset resistance value, it is determined that the corresponding step or the corresponding preparation process causes the substrate to crack.

[0095] The preparation steps after the first circuit layer 20 at least include: preparing a first insulating layer 30 and a second circuit layer 40; and may also include preparing an intermediate connecting layer 50 and preparing a second insulating layer 60;

[0096] After preparing the second insulating layer 60, the following steps may be further included:

[0097] Components are mounted on the side of the base substrate 10 away from the display area; and the base substrate 10 after component mounting is transferred and bonded. During the transfer and bonded process, the base substrate 10 is supported by support columns, and there is a possibility that the base substrate 10 is damaged.

[0098] Furthermore, the process may also include: repairing failed components; performing underfill and encapsulation on the substrate 10; during the repair process, components need to be plugged in and out, which may damage the substrate 10; during the underfill and encapsulation process, the substrate needs to be clamped for operation, which may damage the substrate 10. By providing the first circuit layer 20 and the conductive contacts 70, it is possible to detect whether the aforementioned steps have caused cracks in the substrate 10. After encapsulating the substrate, all circumferential conductive contacts 70 should be cut off; and insulating material should be applied to the circumference of the substrate 10, the first circuit layer 20, the first insulating layer 30, and the second circuit layer 40; if there are other circuit layers or intermediate layers, insulating material should also be applied.

[0099] In one embodiment, the method further includes: determining whether the second insulating layer 60 changes color, and if so, issuing a cracking warning;

[0100] Optionally, the judgment method includes visual judgment, instrument detection, such as a colorimeter and a colorimeter, etc., and taking pictures with a camera and using an existing deep learning model to analyze the color of the picture, which is not limited here.

[0101] Optionally, the crack warning may be issued by a buzzer, a speaker, an indicator light, etc., which are not limited here.

[0102] When the ink changes color, the substrate may be deformed by external force but has not yet cracked. At this time, an early warning can alert the staff to stop actions that may cause the substrate to crack, thereby reducing the risk of substrate cracking.

[0103] In the description of this specification, reference to the terms "some embodiments" or "other embodiments" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0104] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0105] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A glass substrate, characterized in that: include: substrate; A first circuit layer is provided on the base substrate; a first insulating layer, disposed on a side of the first circuit layer away from the base substrate; The second circuit layer is arranged on a side of the first circuit layer away from the first insulating layer. The second circuit layer is electrically connected to the external control circuit and the display component, and is used to receive a control signal from the external control circuit and control the display of the display component.

2. The glass substrate according to claim 1, wherein The first circuit layer includes evenly distributed grid-shaped wiring.

3. The glass substrate according to claim 1, wherein The first circuit layer includes a conductive material covering the entire surface of the base substrate.

4. The glass substrate according to claim 1, wherein Also includes: An intermediate connecting layer is provided on a side of the first insulating layer away from the first circuit layer, and is used to improve the adhesion of the second circuit layer.

5. The glass substrate according to any one of claims 1 or 4, wherein: Also includes: The second insulating layer is arranged on a side of the second circuit layer away from the first circuit layer, and is used to isolate the second circuit layer from an external circuit.

6. The glass substrate according to claim 5, wherein The material of the second insulating layer includes solder resist ink and deformation-changing color ink. The solder resist ink is used to provide insulation protection, and the deformation-changing color ink is used to change color when deformation occurs.

7. A crack detection method for detecting cracks in the preparation process of the glass substrate, characterized in that: include: After a first circuit layer is provided on a base substrate, conductive contacts are provided on at least two sides of a circumference of the first circuit layer, the conductive contacts being electrically connected to the first circuit layer and configured to be electrically connected to an external device to measure a resistance value of the first circuit layer; Based on the resistance value of the first circuit layer, it is determined whether the preparation steps after the first circuit layer cause the substrate to crack, and the area where the crack is located is determined according to the conductive contacts.

8. The crack detection method according to claim 7, characterized in that: Determining the crack area according to the conductive contact includes: Obtain the resistance value between any two conductive contacts, and determine whether the resistance value is greater than a preset resistance value of the shortest path between the two conductive contacts. If so, determine that the area where the positive projection of the shortest path between the two conductive contacts on the substrate is located is the crack area.

9. The crack detection method according to claim 8, characterized in that: When the first circuit layer is a grid-shaped routing, the shortest path is the shortest routing path; When the first circuit layer is a conductive material covering the entire surface of the base substrate, the shortest path is a line connecting two conductive contacts.

10. The crack detection method according to claim 7, characterized in that: The determining, based on the resistance value of the first circuit layer, whether a preparation step subsequent to the first circuit layer causes the substrate to crack comprises: When performing each preparation step or a specific preparation process in each preparation step, measuring the resistance value of the first circuit layer, and when the resistance value of the first circuit layer is greater than a preset resistance value, determining that the corresponding step or the corresponding preparation process causes cracking of the substrate; The preparation steps after the first circuit layer at least include: preparing a first insulating layer and a second circuit layer.

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