Display module and display equipment

Abstract

The embodiment of the invention discloses a display module and display equipment. An optical function device is arranged on the light emitting side of a flexible display panel; the flexible circuit board is bound on the binding area of the flexible display panel, the flexible circuit board is located on one side of the optical function device, and in the transition area and the binding area, the peripheral side face of the flexible circuit board, the face, facing the flexible circuit board, of the flexible display panel and the side face, facing the flexible circuit board, of the optical function device define a concave space; the backboard layer is arranged on the backlight side of the flexible display panel. And the filling body is arranged in the concave space. According to the embodiment of the invention, the filling body is arranged in the concave space, so that the height of the display module corresponding to the transition area and the binding area is increased, the height difference between the part of the display module corresponding to the transition area and the binding area and the optical function device is reduced, and the risk of bubbles is reduced when the backboard layer is attached. And secondly, the filling body can better protect the flexible display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] During the flexible display manufacturing process, the polyimide layer and the upper device layer must be removed from the glass substrate using a laser to achieve the panel's flexibility. However, to protect the polyimide layer PI and the upper device layer E1, a backplane Bp is attached underneath the polyimide layer PI, which also provides support.

[0003] In the process of research and practice of the prior art, the inventors of this application found that when the backplane Bp is attached, the outer lead bonding (OLB) area has a chip-on-chip film Cof distributed therein, and during the bonding process, there is a step difference (such as Figure 1 As shown), bubbles are easily generated, which affects the yield rate of backplane Bp bonding. Summary of the Invention

[0004] The embodiments of the present application provide a display module and a display device, which can reduce the risk of bubbles generated in the backplane layer during the bonding process, thereby improving the bonding yield.

[0005] An embodiment of the present application provides a display module, comprising:

[0006] A flexible display panel comprises a display area, a transition area and a binding area, wherein the binding area is arranged on a side of the transition area away from the display area;

[0007] an optical functional device, arranged on the light-emitting side of the flexible display panel and located in the display area;

[0008] a flexible circuit board, bound to a binding region of the flexible display panel, the flexible circuit board being located on one side of the optical functional device, wherein a recessed space is defined in the transition region and the binding region by a peripheral side surface of the flexible circuit board, a side of the flexible display panel facing the flexible circuit board, and a side surface of the optical functional device facing the flexible circuit board;

[0009] a backplane layer, disposed on the backlight side of the flexible display panel; and

[0010] The filling body is arranged in the recessed space.

[0011] Optionally, in some embodiments of the present application, the filling body includes a glue layer and a main body portion, the glue layer is provided on the flexible display panel, and the main body portion is connected to a surface of the glue layer on a side away from the back plate layer;

[0012] The filling body is provided with an escape space, which penetrates the adhesive layer and extends through at least a portion of the main body in the thickness direction of the display module, and a part of the flexible circuit board is arranged in the escape space.

[0013] Optionally, in some embodiments of the present application, the main body includes a first buffer layer, a support layer, and a second buffer layer. In the thickness direction of the display module, the support layer is disposed between the first buffer layer and the second buffer layer, and the first buffer layer is disposed between the adhesive layer and the support layer.

[0014] The elastic modulus of the support layer is greater than the elastic modulus of the first buffer layer and the elastic modulus of the second buffer layer.

[0015] Optionally, in some embodiments of the present application, the supporting layer is a conductive layer, the flexible display panel is provided with a ground terminal in the binding area, and the supporting layer is connected to the ground terminal.

[0016] Optionally, in some embodiments of the present application, the filling body is provided with a contact hole, the contact hole passes through the glue layer and the first buffer layer, a conductor is provided in the contact hole, and the conductor connects the support layer and the ground terminal.

[0017] Optionally, in some embodiments of the present application, in the thickness direction of the display module, there is a height difference between a side of the optical functional device away from the backplane layer and a side of the flexible circuit board away from the backplane layer;

[0018] The avoidance space passes through a portion of the first buffer layer and the adhesive layer, and the support layer and the second buffer layer cover the flexible circuit board in the avoidance space.

[0019] Optionally, in some embodiments of the present application, the thickness of the second buffer layer is less than the thickness of the first buffer layer.

[0020] Optionally, in some embodiments of the present application, the filler is a colloid, the filler fills the recessed space, and the filler connects the side surface of the optical functional device and the peripheral side surface of the flexible circuit board.

[0021] Optionally, in some embodiments of the present application, in the thickness direction of the display module, there is a height difference between a side of the optical functional device away from the backplane layer and a side of the flexible circuit board away from the backplane layer;

[0022] The filling body also extends to cover the flexible circuit board located in the binding area.

[0023] Optionally, in some embodiments of the present application, in the thickness direction of the display module, the height difference between the side of the optical functional device away from the back panel layer and the side of the filling body away from the back panel layer is less than 7 / 24 of the optical functional device.

[0024] Optionally, in some embodiments of the present application, in the thickness direction of the display module, the height difference between a side of the optical functional device away from the backplane layer and a side of the filling body away from the backplane layer is less than 30 microns.

[0025] Optionally, in some embodiments of the present application, a surface of the optical functional device away from the backplane layer is flush with a surface of the filling body away from the backplane layer.

[0026] Optionally, in some embodiments of the present application, the optical functional device is a polarizer or a cover plate.

[0027] Correspondingly, an embodiment of the present application further provides a display device, which includes the display module as described in any one of the above embodiments.

[0028] The display module of an embodiment of the present application includes a flexible display panel, an optical functional device, a flexible circuit board, a backplane layer, and a filler. The optical functional device is disposed on the light-emitting side of the flexible display panel and is located in the display area. The flexible circuit board is bonded to the binding area of ​​the flexible display panel and is located on one side of the optical functional device. In the transition area and the binding area, a recessed space is defined by the peripheral side surface of the flexible circuit board, the side of the flexible display panel facing the flexible circuit board, and the side of the optical functional device facing the flexible circuit board. The backplane layer is disposed on the backlight side of the flexible display panel. The filler is disposed within the recessed space.

[0029] It is understandable that the embodiment of the present application uses a filler disposed within the recessed space to increase the height of the display module corresponding to the transition and binding areas, thereby reducing the height difference between the portion of the display module corresponding to the transition and binding areas and the optical functional device, thereby reducing the risk of bubbles when attaching the backplane layer. Secondly, the filler covering the recessed space can also better protect the flexible display panel, reducing the risk of scratches and impacts from foreign objects. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the structure of the existing display module attached to the back plate;

[0031] Figure 2 This is a schematic diagram of a top view of the display module provided in an embodiment of the present application;

[0032] Figure 3 yes Figure 2 Schematic diagram of the cross section along the M1M1 line;

[0033] Figure 4 yes Figure 2 Schematic cross-section diagram along the M2M2 line;

[0034] Figure 5 This is another schematic diagram of a top view of the display module provided in an embodiment of the present application;

[0035] Figure 6 This is another schematic diagram of a top view of the display module provided in an embodiment of the present application;

[0036] Figure 7 yes Figure 6 Schematic cross-section diagram along line N1N1;

[0037] Figure 8 yes Figure 6 Schematic diagram of the cross section along the N2N2 line;

[0038] Figure 9 It is a structural schematic diagram of the display device provided in an embodiment of the present application.

[0039] Description of reference numerals:

[0040] Backplane Bp; polarizer Pol; polyimide layer PI; device layer El; flip chip Cof; carrier St; display device 1000; housing 200; display module 100; flexible display panel 11; optical functional device 12; flexible circuit board 13; backplane layer 14; filler 15; printed circuit board 16; display area AA; transition area AB; binding area OB; recessed space 1a; grounding terminal 11a; adhesive layer 151; main body 152; conductor 153; avoidance space 15a; first buffer layer 15b; support layer 15c; second buffer layer 15d; contact hole 15f. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described here are only used to illustrate and explain the present application and are not used to limit the present application. In this application, the various embodiments can be combined with each other but will not be repeated one by one. In addition, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inner" and "outer" refer to the outline of the device; the terms "first", "second", "third", etc. are used only as labels and do not impose numerical requirements or establish an order.

[0042] It should be noted that if Figure 1 As shown, during the backplane Bp attachment process, the side of the display module with the polarizer Pol is placed on the stage St. Subsequently, the backplane Bp is attached to the polyimide layer PI by rolling. However, due to the large step between the polyimide layer PI and the device layer E1 above it on the chip-on-film Cof side and the polarizer Pol, bubbles are easily generated in the area of ​​the backplane Bp corresponding to this large step, reducing the backplane Bp attachment yield.

[0043] Based on this, the display module of the embodiment of the present application is provided with a filler to compensate for the step difference during attachment, thereby reducing the generation of attachment bubbles and improving the attachment yield.

[0044] The embodiments of the present application provide a display module and a display device, which are described in detail below. It should be noted that the order of description of the following embodiments does not limit the preferred order of the embodiments.

[0045] Please refer to Figures 2 to 4 An embodiment of the present application provides a display module 100 , which includes a flexible display panel 11 , an optical functional device 12 , a flexible circuit board 13 , a backplane layer 14 and a filler 15 .

[0046] The flexible display panel 11 includes a display area AA, a transition area AB, and a binding area OB. The binding area OB is arranged on the side of the transition area AB away from the display area AA. The optical functional device 12 is arranged on the light-emitting side of the flexible display panel 11 and is located in the display area AA.

[0047] The flexible circuit board 13 is bonded to the bonding area OB of the flexible display panel 11. The flexible circuit board 13 is located to one side of the optical functional device 12. Within the transition area AB and the bonding area OB, a recessed space 1a is defined by the peripheral side of the flexible circuit board 13, the side of the flexible display panel 11 facing the flexible circuit board 13, and the side of the optical functional device 12 facing the flexible circuit board 13.

[0048] The back plate layer 14 is disposed on the backlight side of the flexible display panel 11. The filler 15 is disposed in the recessed space 1a.

[0049] It is understood that the embodiment of the present application employs a filler 15 disposed within the recessed space 1a to increase the height of the display module 100 corresponding to the transition region AB and the binding region OB, thereby reducing the height difference between the portion of the display module 100 corresponding to the transition region AB and the binding region OB and the optical functional device 12, thereby reducing the risk of bubbles when attaching the backplane layer 14. Furthermore, the filler 15 covering the recessed space 1a further protects the flexible display panel 11, reducing the risk of scratches and impacts from foreign objects.

[0050] Optionally, in some embodiments of the present application, when the optical functional device 12 is a polarizer, based on flexibility requirements, the thickness of the polarizer is between 50 microns and 100 microns.

[0051] Optionally, in the thickness direction of the display module 100, the height difference between the side of the optical functional device 12 away from the back panel layer 14 and the side of the filling body 15 away from the back panel layer 14 is less than 7 / 24 of the optical functional device 12, so as to better reduce the height difference and thereby better reduce the risk of bubble generation.

[0052] Optionally, in some embodiments of the present application, in the thickness direction of the display module 100 , the height difference between the side of the optical functional device 12 away from the backplane layer 14 and the side of the filler 15 away from the backplane layer 14 is less than 30 microns.

[0053] It should be understood that the smaller the height difference between the side of the optical functional device 12 away from the backplane layer 14 and the side of the filler 15 away from the backplane layer 14, the lower the probability of bubbles being generated when attaching the backplane layer 14. When the height difference between the side of the optical functional device 12 away from the backplane layer 14 and the side of the filler 15 away from the backplane layer 14 is less than 30 microns, bubbles are almost not generated during the attachment process of the backplane layer 14, which can meet the attachment requirements.

[0054] It should be noted that during the process of attaching the backplane layer 14, when the actual height difference between the two regions is less than or equal to the threshold height difference, no bubbles will be generated during the attachment of the backplane layer 14. The threshold height difference is related to the actual process and varies with different processes and production equipment. For example, in the rolling process, the threshold height difference is 30 microns.

[0055] Optionally, in some embodiments of the present application, a surface of the optical functional device 12 away from the backplane layer 14 is flush with a surface of the filling body 15 away from the backplane layer 14 .

[0056] It can be understood that the side of the optical functional device 12 away from the back layer 14 is flush with the side of the filling body 15 away from the back layer 14, so that the height difference between the two is zero, thereby minimizing the occurrence rate of bubbles and better improving the yield of attaching the back layer 14.

[0057] Optionally, in some embodiments of the present application, the flexible display panel 11 may be an organic light emitting diode panel, a quantum dot light emitting diode panel, or an inorganic light emitting diode panel.

[0058] The display area AA is the area containing pixels that display an image. The transition area AB may be the area containing fan-out wiring. The binding area OB is the area that is bonded to the flexible circuit board 13. One side of the transition area AB is connected to the display area AA, and the other side is connected to the binding area OB.

[0059] Optionally, in some embodiments of the present application, the optical functional device 12 is a polarizer or a cover plate. However, the present invention is not limited thereto and the optical functional device 12 may also be other optical film layers, such as an anti-reflection film or an anti-glare film. The optical functional device 12 may also include other optical film layers in addition to the polarizer or cover plate.

[0060] Optionally, in some embodiments of the present application, the flexible circuit board 13 may be a chip-on-film (COF) or simply a flexible circuit board.

[0061] Optionally, the number of flexible circuit boards 13 may be determined according to the size of the flexible display panel 11. The larger the size of the flexible display panel 11, the more the number of flexible circuit boards 13. Figure 2 As shown, the binding area OB of the flexible display panel 11 is provided with a plurality of binding parts, and one binding part is bound to one flexible circuit board 13 .

[0062] The binding portion and the flexible circuit board 13 may be bound and connected using conductive glue.

[0063] Optionally, in some embodiments, the backplane layer 14 is a support film layer with a certain degree of flexibility to support and protect the flexible display panel 11. For example, the backplane layer 14 can be a polyimide film layer, a polymer composite film or other film layer.

[0064] Optionally, in some embodiments, the display module 100 further includes a printed circuit board 16 , and one end of the flexible circuit board 13 away from the flexible display panel 11 is connected to the printed circuit board 16 .

[0065] Optionally, in some embodiments of the present application, the filling body 15 includes a glue layer 151 and a main body 152 , the glue layer 151 is disposed on the flexible display panel 11 , and the main body 152 is connected to a surface of the glue layer 151 on one side away from the back panel layer 14 .

[0066] The filler 15 defines an escape space 15 a that penetrates the adhesive layer 151 and extends through at least a portion of the main body 152 in the thickness direction of the display module 100 . A portion of the flexible circuit board 13 is disposed within the escape space 15 a .

[0067] It can be understood that the filling body 15 is set in the recessed space 1a in an attached manner, which is simple and low-cost; and the surface of the main body 152 is flat, which is convenient for contact with the carrier in the process of attaching the back plate layer 14, thereby improving the flatness during attachment.

[0068] Secondly, the elastic modulus of the main body 152 is greater than that of the adhesive layer 151, which makes the main body 152 more supportive, making it easier to support the flexible display panel 11 when attaching the backplane layer 14. When rolling the backplane layer 14, the risk of deformation of the filler 15 is reduced, the smoothness of the rolling process is improved, and the attachment yield rate is improved. The softer adhesive layer 151 can buffer a certain amount of compressive stress, reducing the risk of cracks in the flexible display panel 11 due to rolling.

[0069] Furthermore, it should be noted that, in the thickness direction of the display module 100, the escape space 15a penetrates the adhesive layer 151 and extends through at least a portion of the main body 152. The escape space 15a may completely penetrate the filler 15, i.e., the depth of the escape space 15a is equal to the thickness of the filler 15. Alternatively, the escape space 15a may partially penetrate the main body 152 and completely penetrate the adhesive layer 151, i.e., the depth of the escape space 15a is less than the thickness of the filler 15.

[0070] For example, in some embodiments, there is a height difference between the flexible circuit board 13 and the optical functional device 12, the depth of the avoidance space 15a is less than the thickness of the filling body 15, and the part of the filling body 15 away from the flexible display panel 11 covers the flexible circuit board 13, so as to reduce the difference between the physical height of the flexible circuit board 13 area and the height of the optical functional device 12, thereby further reducing the risk of bubble generation.

[0071] It should be understood that during the process of attaching the backplane layer 14, when the actual height difference between the two regions is less than or equal to the threshold height difference, no bubbles will be generated during the attachment of the backplane layer 14. The threshold height difference is related to the actual process and varies with different processes and production equipment. For example, in the rolling process, the threshold height difference is 30 microns.

[0072] Therefore, in some embodiments, the height difference between the flexible circuit board 13 and the optical functional device 12 is less than or equal to the threshold height difference, and the avoidance space 15a completely penetrates the filling body 15, that is, the depth of the avoidance space 15a is equal to the thickness of the filling body 15, so as to simplify the process of preparing the filling body 15 and reduce the difficulty of attaching the filling body 15.

[0073] Optionally, in some embodiments, the thickness of the main body 152 is greater than the thickness of the adhesive layer 151. It is understood that the thickness of the main body 152 is set to be larger to enhance the elastic modulus of the filler 15, which can improve the support for the flexible display panel 11 when attached to the backplane layer 14. Secondly, it can also narrow the gap in elastic modulus between the filler 15 and the optical functional device 12, so that the flexible display panel 11 is evenly stressed when attached to the backplane layer 14, reducing the risk of sudden force changes, thereby improving the attachment yield.

[0074] Secondly, the main body 152 is thicker, which can better protect the flexible display panel 11 and reduce the risk of being scratched or hit by foreign objects.

[0075] Optionally, in some embodiments, the main body 152 is a single-layer structure.

[0076] Optionally, the material of the main body 152 may include one of an organic substance and an inorganic substance, such as a metal oxide, silicon oxide, silicon nitrogen, polyethylene (PE), polypropylene (PP), polystyrene (PS), polyethylene diphthalate, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyethersulfone (PES), aromatic fluorotoluene containing polyarylate, polycyclic olefin (PCO), polyimide or polyurethane (PU).

[0077] Optionally, in some embodiments of the present application, the main body 152 includes a first buffer layer 15b, a support layer 15c, and a second buffer layer 15d. In the thickness direction of the display module 100, the support layer 15c is disposed between the first buffer layer 15b and the second buffer layer 15d, and the first buffer layer 15b is disposed between the adhesive layer 151 and the support layer 15c.

[0078] The elastic modulus of the support layer 15c is greater than the elastic modulus of the first buffer layer 15b and the elastic modulus of the second buffer layer 15d.

[0079] It can be understood that the main body 152 adopts a multi-layer stacking structure, and uses a support layer 15c with a larger elastic modulus in the middle and a buffer layer with a smaller elastic modulus on both sides. Such a combination can not only meet the support requirements when attaching the back panel layer 14, but also better absorb external forces and improve the protection performance of the flexible display panel 11.

[0080] Optionally, in some embodiments of the present application, the supporting layer 15c is a conductive layer. The flexible display panel 11 is provided with a ground terminal 11a in the binding area OB, and the supporting layer 15c is connected to the ground terminal 11a.

[0081] It is understandable that the conductive layer is used as the support layer 15c and is connected to the ground terminal 11a, so that the support layer 15c can shield external signals and improve the anti-static performance of the flexible display panel 11 without the need for additional shielding layers and conductive layers, thereby simplifying the structure.

[0082] Optionally, in some embodiments of the present application, the filler 15 is provided with a contact hole 15f that penetrates the glue layer 151 and the first buffer layer 15b. A conductor 153 is provided in the contact hole 15f, and the conductor 153 connects the support layer 15c and the ground terminal 11a.

[0083] It is understandable that by disposing the conductor 153 in the contact hole 15f to connect the support layer 15c and the ground terminal 11a, wiring can be simplified.

[0084] Optionally, the opening area of ​​the contact hole 15f is larger than the area of ​​the ground terminal 11a, and the conductor 153 fills the contact hole 15f to improve the yield of the overlap between the conductor 153 and the ground terminal 11a.

[0085] Optionally, the materials of the support layer 15c and the conductor 153 can be metal, metal alloy, metal oxide, etc.

[0086] Optionally, the material of the first buffer layer 15b and the second buffer layer 15d can each be one of an organic substance and an inorganic substance, such as a metal oxide, silicon oxide, silicon nitrogen, polyethylene (PE), polypropylene (PP), polystyrene (PS), polyethylene diphthalate, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyethersulfone (PES), aromatic fluorotoluene containing polyarylate, polycyclic olefin (PCO), polyimide (PI) or polyurethane (PU).

[0087] Optionally, in some embodiments of the present application, in the thickness direction of the display module 100 , there is a height difference between a side of the optical functional device 12 away from the backplane layer 14 and a side of the flexible circuit board 13 away from the backplane layer 14 .

[0088] The escape space 15 a penetrates a portion of the first buffer layer 15 b and the adhesive layer 151 , and the support layer 15 c and the second buffer layer 15 d cover the flexible circuit board 13 in the escape space 15 a .

[0089] It can be understood that, based on the height difference between the flexible circuit board 13 and the optical functional device 12, the support layer 15c and the second buffer layer 15d are used to compensate for the height of the flexible circuit board 13 area, thereby narrowing the height gap with the optical functional device 12. This not only reduces the risk of bubble generation, but also allows the support layer 15c to shield external signals from interfering with the flexible circuit board 13, and reduce the risk of the flexible circuit board 13 being impacted and scratched.

[0090] Optionally, in some embodiments, only the second buffer layer 15 d may be used to cover the flexible circuit board 13 in the avoidance space 15 a .

[0091] Optionally, in some embodiments, Figure 5 As shown, when the height difference between the flexible circuit board 13 and the optical functional device 12 is less than or equal to the threshold height difference, the avoidance space 15a continuously passes through the glue layer 151, the first buffer layer 15b, the support layer 15c and the second buffer layer 15d, that is, the avoidance space 15a passes through the entire filling body 15.

[0092] Optionally, in some embodiments of the present application, the thickness of the second buffer layer 15d is less than that of the first buffer layer 15b. Because the height difference between the flexible circuit board 13 and the optical functional device 12 is relatively small, the thickness of the second buffer layer 15d is relatively small, resulting in a smaller thickness covering the flexible circuit board 13, which can better match the optical functional device 12. Secondly, the greater thickness of the first buffer layer 15b can effectively buffer the rolling force when attaching the backplane layer 14, reducing the risk of cracks in the flexible display panel 11.

[0093] Figure 6 FIG. 1 shows another schematic top view of the display module 100 according to an embodiment of the present application. Figure 7 Shown is Figure 6 Schematic diagram of the cross section along the N1N1 line, Figure 8 Shown is Figure 6 Schematic diagram of the cross section along the N2N2 line. Figures 6 to 8 In the embodiment, parts different from the above embodiments will be described to avoid redundant description.

[0094] Please refer to Figures 6 to 8 In some embodiments of the present application, the filler 15 is a colloid, the filler 15 fills the recessed space 1a, and the filler 15 connects the side surface of the optical functional device 12 and the peripheral side surface of the flexible circuit board 13.

[0095] It can be understood that a colloid is used as the filler 15 to fill the recessed space 1a. Based on the fluidity of the colloid, the filler 15 can be tightly connected to the sides of the flexible display panel 11, the flexible circuit board 13 and the optical functional device 12, avoiding the risk of attachment seams and improving the continuity and uniformity of the support.

[0096] Optionally, in some embodiments of the present application, in the thickness direction of the display module 100 , there is a height difference between a side of the optical functional device 12 away from the backplane layer 14 and a side of the flexible circuit board 13 away from the backplane layer 14 .

[0097] The filling body 15 also extends to cover the flexible circuit board 13 located in the binding area OB.

[0098] It is understandable that the use of the filler 15 to cover the flexible circuit board 13 to make up for the height of the flexible circuit board 13 area, thereby narrowing the height difference with the optical functional device 12, can not only reduce the risk of bubble generation, but also reduce the risk of the flexible circuit board 13 being impacted and scratched.

[0099] Secondly, the colloid filler 15 is used to cover the peripheral side of the flexible circuit board 13, thereby improving the packaging performance of the flexible circuit board 13 in the binding area OB and reducing the risk of water and oxygen intrusion.

[0100] Optionally, the colloid may be a light-curing adhesive, a temperature-curing adhesive or other packaging adhesive, such as an ultraviolet light-curing adhesive, an infrared light-curing adhesive or a heat-curing adhesive.

[0101] Optionally, the viscosity of the colloid is between 500 cps and 1500 cps, for example, 500 cps, 600 cps, 700 cps, 800 cps, 900 cps, 1000 cps, 1100 cps, 1200 cps, 1300 cps, 1400 cps or 1500 cps.

[0102] Optionally, the elastic modulus of the filling body 15 is between 50 MPa and 500 MPa, for example, 50 MPa, 100 MPa, 150 MPa, 200 MPa, 250 MPa, 300 MPa, 350 MPa, 400 MPa, 450 MPa or 500 MPa.

[0103] Please refer to Figure 9 Accordingly, an embodiment of the present application further provides a display device 1000 , which includes the display module 100 as described in any one of the above embodiments.

[0104] It should be noted that the structure of the display module 100 of the display device 1000 of the embodiment of the present application is similar or identical to the structure of the display module 100 of any of the above embodiments. Figures 1 to 8 , so I will not repeat it here.

[0105] Optionally, the display device 1000 further includes a housing 200 , and the display module 100 is disposed in the housing 200 .

[0106] Optionally, the display device 1000 can be a smart phone, a tablet computer, a mobile phone, a video phone, an e-book reader, a desktop computer, a laptop, a netbook, a workstation, a server, a personal digital assistant, a portable media player, an MP3 player, a television, a mobile medical machine, a camera, a game console, a digital camera, a car navigation system, a car display screen, an electronic billboard, an ATM or at least one of a wearable device, a VR device, and an AR device.

[0107] The display module 100 of the display device 1000 according to an embodiment of the present application includes a flexible display panel 11, an optical functional device 12, a flexible circuit board 13, a backplane layer 14, and a filler 15. The optical functional device 12 is disposed on the light-emitting side of the flexible display panel 11 and is located in the display area AA. The flexible circuit board 13 is bonded to the bonding area OB of the flexible display panel 11. The flexible circuit board 13 is located on one side of the optical functional device 12. In the transition area AB and the bonding area OB, a recessed space 1a is defined by the peripheral side surface of the flexible circuit board 13, the side of the flexible display panel 11 facing the flexible circuit board 13, and the side of the optical functional device 12 facing the flexible circuit board 13. The backplane layer 14 is disposed on the backlight side of the flexible display panel 11. The filler 15 is disposed within the recessed space 1a.

[0108] It can be understood that the embodiment of the present application adopts a filler 15 set in the recessed space 1a to increase the height of the display module 100 corresponding to the transition area AB and the binding area OB, thereby reducing the height difference between the part of the display module 100 corresponding to the transition area AB and the binding area OB and the optical functional device 12, thereby reducing the risk of bubbles when attaching the back panel layer 14.

[0109] The above is a detailed introduction to a display module and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display module, characterized in that: include: A flexible display panel comprises a display area, a transition area and a binding area, wherein the binding area is arranged on a side of the transition area away from the display area; an optical functional device, arranged on the light-emitting side of the flexible display panel and located in the display area; a flexible circuit board, bound to a binding region of the flexible display panel, the flexible circuit board being located on one side of the optical functional device, wherein a recessed space is defined in the transition region and the binding region by a peripheral side surface of the flexible circuit board, a side of the flexible display panel facing the flexible circuit board, and a side surface of the optical functional device facing the flexible circuit board; a backplane layer, disposed on the backlight side of the flexible display panel; as well as The filling body is arranged in the recessed space.

2. The display module according to claim 1, wherein: The filling body includes a glue layer and a main body, wherein the glue layer is provided on the flexible display panel, and the main body is connected to a surface of the glue layer on a side away from the back plate layer; The filling body is provided with an escape space, which penetrates the adhesive layer and extends through at least a portion of the main body in the thickness direction of the display module, and a part of the flexible circuit board is arranged in the escape space.

3. The display module according to claim 2, wherein: The main body includes a first buffer layer, a support layer, and a second buffer layer. In the thickness direction of the display module, the support layer is arranged between the first buffer layer and the second buffer layer, and the first buffer layer is arranged between the glue layer and the support layer. The elastic modulus of the support layer is greater than the elastic modulus of the first buffer layer and the elastic modulus of the second buffer layer.

4. The display module according to claim 3, wherein: The supporting layer is a conductive layer, the flexible display panel is provided with a grounding terminal in the binding area, and the supporting layer is connected to the grounding terminal.

5. The display module according to claim 4, wherein: The filling body is provided with a contact hole, the contact hole passes through the glue layer and the first buffer layer, a conductor is provided in the contact hole, and the conductor connects the support layer and the grounding end.

6. The display module according to claim 4, wherein: In the thickness direction of the display module, there is a height difference between a side of the optical functional device away from the backplane layer and a side of the flexible circuit board away from the backplane layer; The avoidance space passes through a portion of the first buffer layer and the adhesive layer, and the support layer and the second buffer layer cover the flexible circuit board in the avoidance space.

7. The display module according to claim 1, wherein: The filler is a colloid, fills the concave space, and connects the side surface of the optical functional device and the peripheral side surface of the flexible circuit board.

8. The display module according to claim 7, wherein: In the thickness direction of the display module, there is a height difference between a side of the optical functional device away from the backplane layer and a side of the flexible circuit board away from the backplane layer; The filling body also extends to cover the flexible circuit board located in the binding area.

9. The display module according to any one of claims 1 to 8, wherein: In the thickness direction of the display module, a height difference between a side of the optical functional device away from the back plate layer and a side of the filling body away from the back plate layer is less than 7 / 24 of the optical functional device.

10. The display module according to claim 9, wherein: In the thickness direction of the display module, a height difference between a side of the optical functional device away from the back plate layer and a side of the filling body away from the back plate layer is less than 30 micrometers.

11. The display module according to claim 10, wherein: A side of the optical functional device away from the back plate layer is flush with a side of the filling body away from the back plate layer.

12. The display module according to any one of claims 1 to 8, wherein: The optical functional device is a polarizer or a cover plate.

13. A display device, characterized in that: Comprising the display module according to any one of claims 1-12.

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