Wafer six surface detection device

Abstract

The application provides a wafer six-surface detection equipment, and relates to the technical field of wafer detection, which comprises an equipment detection platform and a numerical control gantry truss. The top end of the equipment detection platform is provided with a feeding module for carrying samples to be detected and a qualified discharging module for carrying samples after detection. A feeding transfer correction module is arranged between the feeding module and the qualified discharging module. The other top end of the equipment detection platform is provided with a six-surface detection module for detecting samples and an NG discharging module for separating unqualified samples. A discharging transfer correction module is arranged between the qualified discharging module and the NG discharging module. After the wafer is corrected by the feeding transfer correction module, the wafer is placed on a detection station for six-surface detection. After detection, the wafer is corrected again by the discharging transfer correction module. The qualified wafer is sequentially placed into a carrier by the qualified discharging module, and the unqualified wafer is discharged by the NG discharging module.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection, and in particular to a wafer six-side detection device. Background Art

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. Its starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. Silicon ingots are ground, polished, and sliced ​​into silicon wafers, or wafers. As the fundamental raw material for the integrated circuit (IC) and chip industries, wafer quality directly impacts the performance of subsequent ICs and chips. During the wafer production process, each step can introduce defects, which can lead to chip performance degradation or failure. Therefore, wafer inspection is a critical step in ensuring chip manufacturing quality and improving production yield.

[0003] Deficiencies in existing technologies: Existing wafer AOI inspection equipment usually inspects the entire wafer. During inspection, only one side of the wafer can be inspected, and all sides of the die cannot be effectively inspected at the same time. At the same time, the position of the wafer to be inspected cannot be adjusted and corrected during the inspection process, which easily affects the accuracy of the wafer inspection position and results. When the front-end cutting process needs to be improved, or when there are higher appearance control standards for the sides of the die, ordinary wafer AOI inspection equipment cannot meet its inspection needs, which greatly reduces the inspection efficiency of the equipment. Summary of the Invention

[0004] The problem to be solved by the present invention is that the existing detection equipment cannot effectively detect all sides of the grain at the same time, and the position of the wafer to be detected cannot be adjusted and corrected during the detection process, which easily affects the accuracy of the wafer detection position and results, and cannot meet the demand for higher appearance control standards for the sides of the grain.

[0005] In order to solve the above technical problems, the present invention provides a six-sided inspection device for wafers, comprising an equipment inspection platform and a CNC gantry truss arranged at the top thereof, wherein a loading module for carrying samples to be inspected and a qualified unloading module for carrying inspected samples are provided on one side of the top of the equipment inspection platform, a loading transfer and correction module is provided between the loading module and the qualified unloading module, a six-sided inspection module for inspecting samples and an NG unloading module for separating unqualified samples are installed on the other side of the top of the equipment inspection platform, and a unloading transfer and correction module is provided between the qualified unloading module and the NG unloading module;

[0006] The upper feeding transfer deviation correction module comprises an adjusting frame located at the top end of the equipment detection platform, the top end of the adjusting frame is provided with a movable base, the top end of the movable base is provided with a deviation correction table, and the top end of the deviation correction table is fixedly connected with a first adsorption table;

[0007] The six-side detection module comprises a rotating disc arranged at the top end of the equipment detection platform, a plurality of detection stations are arranged on the rotating disc, a second adsorption table is arranged on each detection station, and six wafer detection devices are arranged on the outer side of the rotating disc.

[0008] Preferably, the bottom end of the numerical control gantry truss is provided with a material taking assembly, the position of the material taking assembly corresponds to the position of the deviation correction table, and the position of the deviation correction table corresponds to the position of the detection station.

[0009] Preferably, the inner cavity of the movable base is provided with a first driving device, the output end of the first driving device is fixedly connected with the bottom end of the deviation correction table, one end of the movable base is provided with a fastener, and the movable base is movably connected with the adjusting frame.

[0010] Preferably, the material taking assembly comprises a linear guide rail fixedly installed at the bottom end of the numerical control gantry truss, a material taking device is installed on the linear guide rail, and the material taking device corresponds to the positions of the deviation correction table and the detection station.

[0011] Preferably, the middle part of the numerical control gantry truss is provided with an equipment rack, the equipment rack is provided with a second driving device for driving the rotating disc to rotate, the output end of the second driving device is fixedly connected with the central shaft of the rotating disc, a plurality of detection stations are arranged in a ring array, six wafer detection devices are arranged in a ring array at the top end of the equipment detection platform, and the positions of the wafer detection devices correspond to the positions of the detection stations.

[0012] Preferably, one end of the numerical control gantry truss is provided with an upper feeding robot and a first lower feeding robot, the upper feeding robot is located between the upper feeding module and the upper feeding transfer deviation correction module, the qualified lower feeding module is provided with a carrier for storing qualified wafers, and the upper feeding transfer deviation correction module and the lower feeding transfer deviation correction module are the same in structure.

[0013] Preferably, the other end of the numerical control gantry truss is provided with a second lower feeding robot, the structure of the second lower feeding robot is the same as that of the first lower feeding robot, and the second lower feeding robot is located between the NG lower feeding module and the detection station.

[0014] Preferably, the top end of the numerical control gantry truss is provided with an air path system for driving the device to realize corresponding actions, the top end of the equipment detection platform is provided with an equipment shell, and the equipment shell is provided with an operation panel.

[0015] The technical effects and advantages of the present application are as follows:

[0016] 1. The present application detects the wafer by setting a six-face detection module. Before detection, the wafer sample to be detected is first moved to the loading transfer correction module by the loading module for correction. The corrected wafer sample to be detected is moved to the detection station by the material taking assembly. The wafer sample to be detected is adsorbed on the detection station by the second adsorption table. During the detection process, the second driving device is started to drive the rotating disc to rotate. The six detection devices are arranged in an annular array around the rotating disc. With the rotation of the rotating disc, the wafer sample to be detected on the detection station passes through the six wafer detection devices in turn. The six faces of the wafer sample are detected by the six wafer detection devices in turn. The function of detecting the side face of the wafer sample by the device is realized. The demand for high appearance control of the wafer side face is met. The working efficiency of the device detection and the accuracy of the detection result are effectively improved.

[0017] 2. The present application corrects the wafer sample to be detected by setting the loading transfer correction module. The wafer sample to be detected is placed on the correction table by the loading robot. When the loading module is used for loading operation of the wafer sample to be detected, the wafer sample is first placed on the correction table. The wafer sample is adsorbed and fixed on the correction table by the first adsorption table. Then, the first driving device is started to drive the correction table to rotate. The position of the wafer sample is corrected. The position of the correction table on the adjusting frame can be adjusted according to the specifications and sizes of different samples. After the position adjustment is completed, the position of the movable base is fixed by the fastener. It is ensured that the wafer samples of different specifications and sizes can be accurately placed on the correction table for correction.

[0018] 3. The present application sets the unloading transfer correction module between the qualified unloading module and the NG unloading module. The position and angle of the wafer after detection are accurately corrected by the unloading transfer correction module. After correction, the qualified wafer is moved to the qualified unloading module by the material taking mechanical arm in the first unloading robot. The carrier for storing the wafer is installed on the qualified unloading module. The qualified wafer can be orderly placed in the carrier. The working efficiency of the device for wafer detection is effectively improved. The unqualified wafer is processed by the NG unloading module. The delay and error of manual sorting are avoided. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 The overall structure of the present application is shown in the figure Figure 1 .

[0020] Figure 2 The overall structure of the present application is shown in the figure

[0021] Figure 3 The overall structure of the present application is shown in the figure Figure 1A magnified schematic diagram of the structure in the middle.

[0022] Figure 4 It is a schematic diagram of the structure of the six-side detection module of the present invention.

[0023] Figure 5 The overall structure of the present invention is shown in FIG. Figure 2 .

[0024] Figure 6 It is a schematic diagram of the overall cross-sectional structure of the present invention.

[0025] Figure 7 It is a schematic diagram of the overall external structure of the present invention.

[0026] The accompanying drawings are marked as follows: 1. Equipment detection platform; 2. CNC gantry truss; 3. Loading module; 4. Qualified unloading module; 5. Loading transfer correction module; 51. Adjustment frame; 52. Movable base; 53. Correction platform; 54. First adsorption platform; 55. First drive device; 56. Fastener; 6. Six-sided detection module; 61. Turntable; 62. Inspection station; 63. Second adsorption platform; 64. Wafer detection device; 65. Picking assembly; 651. Linear guide rail; 652. Picking equipment; 66. Equipment frame; 67. Second drive device; 7. NG unloading module; 8. Unloading transfer correction module; 9. Loading robot; 10. First unloading robot; 11. Carrier; 12. Second unloading robot; 13. Air system; 14. Equipment housing; 15. Operation panel. DETAILED DESCRIPTION

[0027] The present invention provides a wafer six-side detection device, such as Figure 1 - Figure 7 As shown, it includes an equipment detection platform 1 and a CNC gantry truss 2 arranged at the top thereof, a loading module 3 for carrying samples to be detected and a qualified unloading module 4 for carrying samples after detection are arranged on one side of the top of the equipment detection platform 1, a loading transfer and correction module 5 is arranged between the loading module 3 and the qualified unloading module 4, a six-sided detection module 6 for detecting samples and an NG unloading module 7 for separating unqualified samples are installed on the other side of the top of the equipment detection platform 1, and a unloading transfer and correction module 8 is arranged between the qualified unloading module 4 and the NG unloading module 7.

[0028] Further, such as Figure 1 and Figure 3 As shown, the loading and transfer correction module 5 includes an adjustment frame 51 located at the top of the equipment detection platform 1, a movable base 52 is provided at the top of the adjustment frame 51, a correction platform 53 is provided at the top of the movable base 52, and a first adsorption platform 54 is fixedly connected to the top of the correction platform 53, and the wafer sample is adsorbed on the correction platform 53 through the first adsorption platform 54.

[0029] Further, as shown in Figure 2 and Figure 4 , the six-face detection module 6 includes a turntable 61 arranged at the top end of the device detection platform 1, the turntable 61 is provided with a plurality of detection stations 62, each detection station 62 is provided with a second adsorption table 63, the outer side of the turntable 61 is installed with six wafer detection devices 64, after the corrected wafer sample to be detected is adsorbed on the detection station 62 through the second adsorption table 63, the wafer sample is detected by the wafer detection device 64.

[0030] Further, as shown in Figure 5 and Figure 6 , the bottom end of the numerical control gantry truss 2 is installed with a material taking assembly 65, the position of the material taking assembly 65 corresponds to the position of the deviation correction table 53, the position of the deviation correction table 53 corresponds to the position of the detection station 62, the wafer sample is first corrected in position by the feeding transfer deviation correction module 5, and then moved to the detection station 62, so as to prevent the wafer sample from being moved to the detection station 62 by the feeding module 3 and the position from being deviated, thereby affecting the accuracy of the detection position.

[0031] Further, as shown in Figure 3 and Figure 6 , the inner cavity of the movable base 52 is provided with a first driving device 55, the output end of the first driving device 55 is fixedly connected with the bottom end of the deviation correction table 53, one end of the movable base 52 is provided with a fastener 56, the movable base 52 is movably connected with the adjusting frame 51, when the wafer sample to be detected is fed by the feeding module 3, the wafer sample is first adsorbed on the deviation correction table 53 through the first adsorption table 54, then the first driving device 55 is started to drive the deviation correction table 53 to rotate, so as to correct the position of the wafer sample, thereby ensuring the accuracy of the detection position, at the same time, since the specifications of different wafer samples are different, the positions of the wafer samples placed on the feeding module 3 may be different, therefore, the position of the deviation correction table 53 on the adjusting frame 51 can be adjusted according to the specifications of different wafer samples, after the position adjustment is completed, the position of the movable base 52 is fixed by the fastener 56, so as to ensure that wafer samples of different specifications can be accurately moved from the feeding module 3 to the deviation correction table 53 for correction.

[0032] Further, as shown in Figure 6As shown, the material taking assembly 65 includes a linear guide rail 651 fixedly installed at the bottom end of the numerical control gantry truss 2, and a material taking device 652 is installed on the linear guide rail 651. The material taking device 652 corresponds to the positions of the deviation rectifying table 53 and the detection station 62. The material taking device 652 adopts a vacuum adsorption material taking hand in the prior art. The prior art of the vacuum adsorption material taking hand is relatively mature, and will not be described in detail here. The working principle is that a negative pressure is formed in the inner cavity of the suction cup through the built-in vacuum air circuit design, so that the wafer sample is adsorbed to complete the material taking operation. The linear guide rail 651 includes a servo motor, a lead screw, and a sliding block, and belongs to the prior art. The servo motor drives the lead screw to drive the sliding block to move linearly, so that the linear guide rail 651 drives the material taking device 652 to move linearly towards the detection station 62, and drives the corrected wafer sample to be accurately placed on the second adsorption table 63. The wafer sample is fixed on the detection station 62 by the second adsorption table 63 for detection.

[0033] Further, as shown in Figure 2 and Figure 5 The middle part of the numerical control gantry truss 2 is provided with a device rack 66. The device rack 66 is provided with a second driving device 67 for driving the rotating disc 61 to rotate. The output end of the second driving device 67 is fixedly connected with the middle shaft of the rotating disc 61. The plurality of detection stations 62 are arranged in a ring array. The six wafer detection devices 64 are arranged in a ring array at the top end of the device detection platform 1 and surround the rotating disc 61. The positions of the wafer detection devices 64 correspond to the positions of the detection stations 62. During detection, the second driving device 67 is started to drive the rotating disc 61 to rotate, so that the rotating disc 61 drives the wafer samples to be detected on the detection stations 62 to pass through the six wafer detection devices 64 in sequence. The six wafer detection devices 64 simultaneously detect the six faces of the wafer samples to be detected. After detection, the wafer detection devices 64 output the detection results. The device can simultaneously detect the side faces of the wafer, meets the demand for high appearance control of the side faces of the wafer, and effectively improves the working efficiency and result accuracy of the device.

[0034] Further, as shown in Figure 1 and Figure 6As shown, one end of the numerical control gantry truss 2 is provided with a feeding robot 9 and a first discharging robot 10, both of which are single-arm mechanical arms. The prior art of the single-arm mechanical arm is relatively mature, and will not be described in detail here. Generally, it is composed of a driving motor, a speed reducer, a main arm and an end effector. The end effector is a vacuum chuck, which can realize non-destructive handling of wafers and accurately place the wafers on the correction table 53 and the detection station 62. The feeding robot 9 is located between the feeding module 3 and the feeding transfer correction module 5. The qualified discharging module 4 is provided with a carrier 11 for storing qualified wafers. The feeding transfer correction module 5 and the discharging transfer correction module 8 have the same structure. The wafer samples placed on the feeding module 3 are moved to the correction table 53 by the taking mechanical arm in the feeding robot 9 for correction operation. After the correction operation is completed, the wafer is transferred by the taking equipment 652 to move the wafer sample on the correction table 53 to the top end of the second adsorption table 63, so that the position of each wafer sample can remain consistent to avoid position deviation during the feeding process, which affects the accuracy of detection and the accuracy of detection results. After detection, the detection result data is processed internally, and the qualified wafers are moved to the discharging transfer correction module 8 by the taking mechanical arm in the first discharging robot 10. The position and angle of the detected wafers are accurately corrected by the discharging transfer correction module 8. After correction, the qualified wafers are moved to the carrier 11 on the qualified discharging module 4 by the taking mechanical arm in the first discharging robot 10. The carrier 11 can be a wafer box or an expanded wafer ring or an iron ring, so that the qualified wafers can be accurately and orderly placed in the carrier 11, which is beneficial to the subsequent operation of the wafers and effectively improves the working efficiency of the device for wafer detection.

[0035] Further, as shown in Figure 1 and Figure 2 The other end of the numerical control gantry truss 2 is provided with a second discharging robot 12. The structure of the second discharging robot 12 is the same as that of the first discharging robot 10. The second discharging robot 12 is located between the NG discharging module 7 and the detection station 62. The unqualified wafers are detected by the taking mechanical arm in the second discharging robot 12 and moved to the NG discharging module 7. The NG discharging module 7 includes mechanical arms, air cylinders or belts and other automatic components, which can quickly identify and separate unqualified products from qualified products. The NG discharging module 7 processes the unqualified wafers to avoid the delay and error of manual sorting.

[0036] Further, as shown in Figure 2 and Figure 7As shown, the top end of the numerical control gantry truss 2 is provided with a gas circuit system 13 for driving the device to realize corresponding actions, the top end of the device detection platform 1 is provided with a device shell 14, and the device shell 14 is provided with an operation panel 15, wherein the prior art of the gas circuit system 13 is relatively mature, and will not be described in detail here. The corresponding functions are realized by controlling the flow and pressure of the gas. The gas source provides compressed air, which is delivered to the control element and the execution element through the gas circuit pipeline. The control element controls the flow and pressure of the gas according to the preset logic or signal, and then drives the execution element to complete the corresponding action.

[0037] The working principle of the present application is as follows: first, place the wafer sample to be detected on the feeding module 3, operate the device by using the operation panel 15, the gas circuit system 13 in the device controls the equipment in the device to realize corresponding actions, the corresponding functions are realized by controlling the flow and pressure of the gas, the gas source provides compressed air which is delivered to the control element and the execution element through the gas circuit pipeline, the control element controls the flow and pressure of the gas according to the preset logic or signal, and then drives the execution element to complete the corresponding action, according to the operation, first start the feeding robot 9, the end effector of the taking mechanical arm in the feeding robot 9 adopts a vacuum chuck, the wafer sample is adsorbed by the vacuum chuck to realize lossless handling of the wafer, and the wafer is accurately placed on the correction table 53, then the first driving device 55 is started, the correction table 53 is driven to rotate by the first driving device 55, the position of the wafer sample is corrected to ensure the accuracy of the detection position, because the specifications of different wafer samples are different, the position on the feeding module 3 may be different, the position of the correction table 53 on the adjusting frame 51 can be adjusted according to the specifications of different samples, after the position adjustment is completed, the position of the movable base 52 is fixed by using the fastener 56 to ensure that wafer samples of different specifications can be accurately placed on the correction table 53 for correction, after the correction is completed, the vacuum air circuit design built in the taking device 652 forms negative pressure in the suction cup cavity to adsorb the wafer sample and complete the taking operation, after the taking is completed, the linear guide rail 651 drives the taking device 652 to move linearly to the direction of the detection station 62, so that the corrected wafer sample adsorbed on the taking device 652 moves to the second adsorption table 63, and then the second adsorption table 63 is fixed on the detection station 62, then the second driving device 67 drives the turntable 61 to rotate, so that the wafer sample to be detected fixed on the detection station 62 is driven by the turntable 61 to pass through the six wafer detection devices 64 in turn, the six wafer detection devices 64 detect the wafer sample to be detected from six sides at the same time, and the detection results are output by the wafer detection devices 64 after the detection is completed, so that the device can detect the side surface of the wafer at the same time, the working efficiency of wafer detection is effectively improved, after the detection is completed, the detection result data is processed by the data processing equipment in the equipment, the qualified wafer is grabbed by the taking mechanical arm in the first unloading robot 10 and moved to the unloading transfer correction module 8, the operation process of the unloading transfer correction module 8 is the same as that of the feeding transfer correction module 5, therefore, the position and angle of the wafer after detection are accurately corrected by the unloading transfer correction module 8, after the correction is completed, the wafer is moved to the qualified unloading module 4 by the taking mechanical arm in the first unloading robot 10, the carrier 11 for storing the wafer is placed on the qualified unloading module 4, so that the qualified wafer can be orderly placed in the carrier 11, which is conducive to the subsequent operation of the wafer, the unqualified wafer is grabbed by the taking mechanical arm in the second unloading robot 12 and moved to the NG unloading module 7,The NG blanking module 7 quickly identifies and separates unqualified products and qualified products, and performs NG blanking treatment on the unqualified wafers, thereby avoiding delay and error of manual sorting.

[0038] It is to be understood that the present application is described by way of example only, and that modifications or alterations can be made to the features and embodiments described without departing from the spirit or scope of the application as set out in the claims. In addition, modifications can be made to the features and embodiments described to suit particular circumstances and materials without departing from the spirit and scope of the application. Accordingly, the application is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims are intended to be within the scope of the application.

Claims

1. A wafer six-surface detection device, comprising a device detection platform (1) and a numerical control gantry truss (2) arranged at the top end of the device detection platform (1), characterized in that: The top side of the equipment detection platform (1) is provided with a feeding module (3) for carrying the sample to be detected and a qualified discharging module (4) for carrying the sample after detection, a feeding transfer deviation correction module (5) is arranged between the feeding module (3) and the qualified discharging module (4), the other side of the top of the equipment detection platform (1) is provided with a six-surface detection module (6) for detecting the sample and an NG discharging module (7) for separating the unqualified sample, and a discharging transfer deviation correction module (8) is arranged between the qualified discharging module (4) and the NG discharging module (7); The feeding transfer deviation correction module (5) comprises an adjusting frame (51) arranged at the top of the equipment detection platform (1), the top of the adjusting frame (51) is provided with a movable base (52), and the top of the movable base (52) is provided with a deviation correction table (53); and the top of the deviation correction table (53) is fixedly connected with a first adsorption table (54). The six-surface detection module (6) comprises a turntable (61) arranged at the top of the equipment detection platform (1), a plurality of detection stations (62) are arranged on the turntable (61), a second adsorption table (63) is arranged on each detection station (62), and six wafer detection devices (64) are mounted on the outer side of the turntable (61); one side of the bottom of the numerical control gantry truss (2) is provided with a material taking assembly (65), the position of the material taking assembly (65) corresponds to the position of the deviation correction table (53), and the position of the deviation correction table (53) corresponds to the position of the detection station (62). One end of the numerical control gantry truss (2) is provided with a feeding robot (9) and a first discharging robot (10), the feeding robot (9) is located between the feeding module (3) and the feeding transfer deviation correction module (5), the qualified discharging module (4) is provided with a carrier (11) for storing qualified wafers, and the feeding transfer deviation correction module (5) and the discharging transfer deviation correction module (8) have the same structure. The other end of the numerical control gantry truss (2) is provided with a second discharging robot (12), the structure of the second discharging robot (12) is the same as that of the first discharging robot (10), and the second discharging robot (12) is located between the NG discharging module (7) and the detection station (62).

2. The wafer six surface inspection apparatus according to claim 1, wherein: The inner cavity of the movable base (52) is provided with a first driving device (55), the output end of the first driving device (55) is fixedly connected with the bottom end of the deviation correction table (53), one end of the movable base (52) is provided with a fastener (56), and the movable base (52) is movably connected with the adjusting frame (51).

3. The wafer six surface inspection apparatus of claim 1, wherein: The material taking assembly (65) comprises a linear guide rail (651) fixedly mounted at the bottom of the numerical control gantry truss (2), and a material taking device (652) is mounted on the linear guide rail (651); and the positions of the material taking device (652), the deviation correction table (53) and the detection station (62) correspond to each other.

4. The apparatus of claim 1, wherein: The middle part of the numerical control gantry truss (2) is provided with an equipment rack (66), the equipment rack (66) is provided with a second driving device (67) for driving the rotation of the rotating disc (61), the output end of the second driving device (67) is fixedly connected with the middle shaft of the rotating disc (61), and a plurality of detection stations (62) are arranged in an annular array, and six wafer detection devices (64) are arranged in an annular array at the top of the equipment detection platform (1), and the positions of the wafer detection devices (64) correspond to the positions of the detection stations (62).

5. The apparatus of claim 1, wherein: The top of the numerical control gantry truss (2) is provided with an air path system (13) for driving the corresponding action of the device, the top of the equipment detection platform (1) is provided with an equipment shell (14), and the equipment shell (14) is provided with an operation panel (15).

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