Immersed heat dissipation structure and preparation method thereof

Abstract

The invention discloses an immersed heat dissipation structure and a preparation method thereof, and relates to the technical field of heat dissipation structures.The immersed heat dissipation structure comprises a first cooling shell, the interior of the first cooling shell is provided with a cooling cavity, the upper end of the first cooling shell is a condensation end, and at least part of the peripheral side wall of the cooling cavity is provided with a refrigerant-loving microstructure; the interior of the cooling cavity is used for containing a heating part, the interior of the cooling cavity is used for being filled with a liquid refrigerant, the heating part can be immersed in the liquid refrigerant, the liquid refrigerant can absorb heat of the heating part and evaporate into a gaseous state, the gaseous refrigerant is condensed into a liquid state at the condensation end, and part of the condensed refrigerant can be attached to the peripheral side wall of the cooling cavity. And the refrigerant-loving microstructures can guide the flowing refrigerant downwards. According to the immersed heat dissipation structure and the preparation method thereof provided by the invention, the heat dissipation efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation structures, and in particular to an immersion heat dissipation structure and a preparation method thereof. Background Art

[0002] At present, the power density of electronic components such as power chips has exceeded 1000W / cm 2 When power chips operate under high heat flux density, if they cannot be efficiently dissipated, their temperature rise will far exceed the allowable value for normal operation. Therefore, it is very important to use a thermal management structure and cooling method with high heat exchange efficiency to solve the thermal reliability issues brought about by high heat flux density.

[0003] In the existing immersion heat management structure, the coolant is condensed after evaporation due to heat. However, the condensed coolant cannot return to the evaporation end quickly and effectively, which affects the heat dissipation efficiency. Summary of the Invention

[0004] The object of the present invention is to provide an immersion heat dissipation structure and a preparation method thereof, so as to solve the problems existing in the above-mentioned prior art and improve the heat dissipation efficiency.

[0005] To achieve the above object, the present invention provides the following solutions:

[0006] The present invention provides an immersion heat dissipation structure, comprising a first cooling shell with a cooling cavity inside, the upper end of the first cooling shell being a condensation end, and at least a portion of the peripheral side walls of the cooling cavity being provided with a refrigerant-friendly microstructure; the cooling cavity is used to place a heating element, and the cooling cavity is used to fill a liquid refrigerant, the heating element can be immersed in the liquid refrigerant, the liquid refrigerant can absorb the heat of the heating element and evaporate into a gaseous state, the gaseous refrigerant condenses into a liquid state at the condensation end, and part of the condensed refrigerant can attach to the peripheral side walls of the cooling cavity, and the refrigerant-friendly microstructure can divert the refrigerant flowing through downward.

[0007] Preferably, the refrigerant-friendly microstructure is provided on the peripheral side walls of the cooling cavity.

[0008] Preferably, the refrigerant is a fluorine-containing coolant, and the refrigerant-friendly microstructure includes a base membrane, which is covered on the peripheral side wall of the cooling cavity. A microstructure surface is provided on a side of the base membrane away from the peripheral side wall of the cooling cavity, and the base membrane is made of a fluorine-containing material.

[0009] Preferably, it further includes a heat dissipation portion, which is arranged outside the first cooling shell and connected to the condensation end; the heat dissipation portion is used to dissipate heat from the condensation end.

[0010] Preferably, the heat dissipation part includes a second cooling shell, which is in contact with the condensing end shell surface. A cooling channel is provided in the second cooling shell, and a liquid inlet and a liquid outlet connected to the cooling channel are provided on the second cooling shell. The cooling channel is used to circulate coolant.

[0011] Preferably, the cooling channel is configured as a zigzag channel, and the cooling channel is filled with a first heat dissipation microstructure.

[0012] Preferably, it further comprises a second heat dissipation microstructure, which is used to be arranged on the heating surface of the heating element.

[0013] Preferably, the first heat dissipation microstructure and the second heat dissipation microstructure are both configured as three-periodic minimal surface structures; the aperture size of the second heat dissipation microstructure gradually increases from bottom to top.

[0014] The present invention also provides a method for preparing the above-mentioned immersion heat dissipation structure, comprising the following steps:

[0015] Forming a first cooling shell, and forming a refrigerant-friendly microstructure on a corresponding portion of a peripheral side wall of the first cooling shell, and fixing the heating element in a cooling cavity of the first cooling shell;

[0016] The cooling chamber is evacuated, and then a refrigerant is charged into the cooling chamber, and the charging pressure of the refrigerant can be regulated.

[0017] Preferably, the method further comprises the following steps:

[0018] forming a heat dissipation portion at the condensing end of the first cooling shell, and circulating a coolant in the heat dissipation portion;

[0019] forming a second heat dissipation microstructure on the heating surface of the heating element and fixing it in the cooling cavity;

[0020] Before evacuating the cooling chamber, a pressure maintaining test is performed on the cooling chamber.

[0021] Compared with the prior art, the present invention has achieved the following technical effects:

[0022] The immersion heat dissipation structure provided by the present invention is that the heating element is directly immersed in the refrigerant in the cooling chamber, eliminating the obstruction of inefficient heat transfer media such as air, greatly shortening the heat transfer path, achieving efficient heat conduction, reducing overall energy consumption, improving energy utilization efficiency, and making the structure more compact, effectively saving equipment space; and by arranging a refrigerant-friendly microstructure on the peripheral side wall of the cooling chamber, the liquid refrigerant can absorb the heat of the heating element and evaporate into a gaseous state, and the gaseous refrigerant condenses into a liquid state at the condensation end. Part of the condensed refrigerant directly falls back to the bottom from the condensation end, and part of the refrigerant can adhere to the peripheral side wall of the cooling chamber. The refrigerant-friendly microstructure can significantly The surface tension between the refrigerant and the liquid refrigerant is significantly changed, the wettability of the surface to the refrigerant is enhanced, the contact angle between the liquid refrigerant and the surface becomes smaller, and the refrigerant is easier to spread on the surface. Under the action of the refrigerant-friendly microstructure, this spreading effect is further enhanced, allowing the refrigerant to flow more quickly on the surface and promote reflux; the tiny channels, pores and other structures on the surface of the microstructure can produce capillary action, and the capillary force can overcome the resistance to liquid flow, guide the liquid refrigerant to flow in the microstructure, and cooperate with the refrigerant's own gravity to promote the refrigerant to quickly return to the bottom, contact with the heating element again, continue to absorb heat and repeat the cycle of vaporization and condensation to achieve continuous and efficient cooling.

[0023] The preparation method of the immersion heat dissipation structure provided by the present invention is as follows: after forming the first cooling shell, the cooling cavity is evacuated to a vacuum state before operation, and then a refrigerant of a certain pressure is filled into the cavity. By controlling the filled pressure, the evaporation temperature of the refrigerant is regulated, so that the refrigerant is within the optimal evaporation temperature range, ensuring that the coolant efficiently absorbs and transfers heat, realizing effective energy utilization, maintaining the refrigerant liquid circulation, stabilizing the system pressure, preventing overheating and damage of electronic heating components, and making the cooling system operate under optimal working conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 This is an axial schematic diagram of the immersion heat dissipation structure provided in the first embodiment of the present invention;

[0026] Figure 2 A schematic diagram of the internal heat dissipation principle of the immersion heat dissipation structure provided in the first embodiment of the present invention;

[0027] Figure 3 A partial schematic diagram of a refrigerant-friendly microstructure provided in Example 1 of the present invention;

[0028] Figure 4 This is a schematic diagram of the interior of the heat dissipation unit provided in the first embodiment of the present invention;

[0029] Figure 5 A schematic diagram of a second heat dissipation microstructure provided in embodiment 1 of the present invention;

[0030] Figure 6 A schematic diagram of the principle of the second heat dissipation microstructure provided in the first embodiment of the present invention;

[0031] Figure 7 A schematic diagram of a cell of a three-periodic minimal surface structure provided in Example 1 of the present invention;

[0032] Figure 8 A schematic diagram of another cell of the three-periodic minimal surface structure provided in the first embodiment of the present invention;

[0033] Figure 9 Schematic diagram of another cell of the three-periodic minimal surface structure provided in Example 1 of the present invention.

[0034] In the figure: 1-first cooling shell; 11-cooling chamber; 12-condensation end; 13-refrigerant-friendly microstructure; 2-heating element; 3-heat dissipation part; 31-second cooling shell; 32-cooling flow channel; 33-liquid inlet; 34-liquid outlet; 35-first heat dissipation microstructure; 4-second heat dissipation microstructure. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0036] The object of the present invention is to provide an immersion heat dissipation structure and a preparation method thereof, so as to solve the problems existing in the above-mentioned prior art and improve the heat dissipation efficiency.

[0037] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] Example 1

[0039] This embodiment provides an immersion heat dissipation structure. Figure 1-Figure 3, including a first cooling shell 1, which has a cooling cavity 11 inside. The upper end of the first cooling shell 1 is a condensation end 12, and the surrounding side walls of the cooling cavity 11 are at least partially provided with a refrigerant-friendly microstructure 13; the cooling cavity 11 is used to place the heating element 2, and the cooling cavity 11 is used to fill the liquid refrigerant. The heating element 2 can be immersed in the liquid refrigerant, and the liquid refrigerant can absorb the heat of the heating element 2 and evaporate into a gaseous state. The gaseous refrigerant condenses into a liquid at the condensation end 12, and part of the condensed refrigerant can attach to the surrounding side walls of the cooling cavity 11, and the refrigerant-friendly microstructure 13 can divert the refrigerant flowing through downward.

[0040] Its working principle is as follows: the heating element 2 is directly immersed in the refrigerant in the cooling chamber 11, eliminating the obstruction of inefficient heat transfer media such as air, greatly shortening the heat transfer path, achieving efficient heat conduction, reducing overall energy consumption, improving energy utilization efficiency, and making the structure more compact, effectively saving equipment space; and by arranging a refrigerant-friendly microstructure 13 on the side wall of the cooling chamber 11, the liquid refrigerant can absorb the heat of the heating element and evaporate into a gaseous state, and the gaseous refrigerant condenses into a liquid state at the condensation end 12. Part of the condensed refrigerant directly falls back to the bottom from the condensation end 12, and part of the refrigerant can adhere to the side wall of the cooling chamber 11, and the refrigerant-friendly microstructure 13 can significantly change the surface tension between the surface and the liquid refrigerant, enhance the wettability of the surface to the refrigerant, reduce the contact angle between the liquid refrigerant and the surface, and make it easier for the refrigerant to spread on the surface. Under the action of the refrigerant-friendly microstructure 13, this spreading effect is further enhanced, allowing the refrigerant to flow more quickly on the surface and promote reflux; the tiny channels, pores and other structures on the surface of the microstructure can produce capillary action, and the capillary force can overcome the resistance to liquid flow, guide the liquid refrigerant to flow in the microstructure, and cooperate with the refrigerant's own gravity to promote the refrigerant to quickly return to the bottom, contact the heating element again, continue to absorb heat and repeat the cycle of vaporization and condensation, to achieve continuous and efficient cooling.

[0041] The heating element 2 is fixedly arranged at the bottom of the cooling cavity 11 , and a threading hole is provided at the bottom of the cooling cavity 11 so that the heating element 2 can be electrically connected to an external device to work.

[0042] In an optional solution of this embodiment, more preferably, refrigerant-friendly microstructures 13 are provided on the peripheral side walls of the cooling cavity 11 .

[0043] Among them, by providing the refrigerant-friendly microstructures 13 on the peripheral side walls, the refrigerant condensed on the peripheral side walls is fully guided, thereby further improving the refrigerant return efficiency.

[0044] In the optional scheme of the embodiment, it is more preferred that the refrigerant adopts fluorine-containing coolant, and the refrigerant-friendly microstructure 13 includes a base film, the base film is covered on the peripheral side wall of the cooling cavity 11, and a microstructure surface is provided on the side of the base film away from the peripheral side wall of the cooling cavity 11, and the base film adopts fluorine-containing material.

[0045] Among them, the common refrigerants are all fluorine-containing: such as tetrafluoroethane, tetrafluoropropane or trifluoromethane, so the base membrane can choose polytetrafluoroethylene, polyvinylidene fluoride, fluorinated ethylene propylene and other fluorine-containing materials as the material for constructing the refrigerant-friendly surface. This is because the similar chemical structure makes there a certain affinity between them, such as van der Waals force, which produces a certain attraction; if the base membrane is made of polytetrafluoroethylene and the refrigerant is trifluoromethane, when polytetrafluoroethylene comes into contact with trifluoromethane, the polar part of the trifluoromethane molecule will induce the polytetrafluoroethylene molecule to produce a certain polarization, thereby increasing the mutual attraction between them, and the trifluoromethane molecule will enter the molecular chain gap of polytetrafluoroethylene by diffusion, etc., thereby generating a certain attraction with polytetrafluoroethylene. interaction; since polytetrafluoroethylene has the advantages of excellent chemical stability, very low friction coefficient, excellent thermal stability, etc., the refrigerant can flow better on the surface, so polytetrafluoroethylene can be selected as the material for constructing a refrigerant-friendly microstructure surface; when the basement membrane surface has refrigerant-friendly properties, the contact angle between the liquid refrigerant and the surface becomes smaller, and the refrigerant is easier to spread on the surface. Under the action of the microstructure of the basement membrane surface, this spreading effect is further enhanced, allowing the refrigerant to flow more quickly on the surface and promote reflux; the tiny channels, pores and other structures on the microstructure surface can produce capillary action, and the capillary force can overcome the liquid flow resistance and guide the liquid refrigerant to flow in the microstructure; the microstructure surface can adopt a columnar microstructure.

[0046] In the optional solution of the embodiment, it is more preferred that the immersion heat dissipation structure provided in this embodiment further includes a heat dissipation part 3, see Figure 1 and Figure 4 The heat dissipation part 3 is arranged outside the first cooling shell 1 and is connected to the condensation end 12; the heat dissipation part 3 is used to dissipate heat from the condensation end 12.

[0047] By providing an additional heat dissipation portion, the condensation end 12 is kept at a relatively low temperature, thereby maintaining the stability of heat dissipation in the cooling chamber 11 .

[0048] In the optional scheme of the embodiment, it is more preferred that the heat dissipation part 3 includes a second cooling shell 31, the second cooling shell 31 is in contact with the shell surface of the condensation end 12, a cooling channel 32 is provided in the second cooling shell 31, and a liquid inlet 33 and a liquid outlet 34 connected to the cooling channel 32 are provided on the second cooling shell 31, and the cooling channel 32 is used for circulating the coolant.

[0049] Among them, the liquid inlet 33 and the liquid outlet 34 are connected to the external coolant circulation system, and the coolant circulates in the cooling channel 32. The coolant can be tetrafluoroethane coolant, and a compressor refrigeration circulation system is used to make the coolant circulate in the cooling channel 32 for heat exchange; compared with traditional condensation methods, such as natural convection air cooling, it can efficiently take away a large amount of heat, has high heat dissipation efficiency, is convenient for precise temperature control, and reduces energy loss.

[0050] In an optional solution of the embodiment, more preferably, the cooling channel 32 is configured as a zigzag channel, and the cooling channel 32 is filled with a first heat dissipation microstructure 35 .

[0051] The zigzag flow channel can be set as a serpentine flow channel, and the first heat dissipation microstructure 35 is filled in the cooling flow channel 32 to fully improve the heat exchange efficiency with the condensation end 12.

[0052] In the optional solution of the embodiment, it is more preferred that the immersion heat dissipation structure provided in this embodiment further includes a second heat dissipation microstructure 4, see Figure 2 and Figure 5 The second heat dissipation microstructure 4 is used to be arranged on the heating surface of the heating element 2.

[0053] Among them, by providing the second heat dissipation microstructure 4 on the heating surface of the heating element 2 , the heat exchange efficiency between the heating element 2 and the refrigerant is improved, thereby improving the cooling efficiency of the heating element 2 .

[0054] In the optional solutions of the embodiment, more preferably, the first heat dissipation microstructure 35 and the second heat dissipation microstructure 4 are both configured as three-periodic minimal surface structures; the aperture size of the second heat dissipation microstructure 4 gradually increases from bottom to top.

[0055] Among them, the three-periodic minimal surface structure is the TPMS structure, and its cell can be adopted as follows Figure 7 The structure shown is a Diamond-type three-periodic minimal surface structure, such as Figure 6As shown in the figure, the middle arrow indicates that the capillary force pushes the bubble to detach, and the arrows on both sides are the direction of refrigerant flow; the holes on the three-periodic minimal curved surface porous surface structure constrain bubble growth and hinder bubble merging, so that the bubble detachment diameter is smaller and the detachment frequency is faster. The faster the bubble detachment frequency, the better the transient heat conduction effect, which can significantly enhance the boiling heat transfer performance; the three-periodic minimal curved surface porous surface structure can increase the density of active nucleation sites and the heat transfer area. At the same time, the wide range of voids provides a channel for gas-liquid separation, reducing the backflow resistance. The increase in the number of nucleation sites increases the number of bubbles detached from the heating wall per unit time, and obvious transient heat conduction occurs at more locations, thereby improving the overall heat dissipation performance of the heating wall. In addition, the pore size of the second heat dissipation microstructure 4 gradually increases from bottom to top, that is, the second heat dissipation microstructure 4 forms a horizontal liquid replenishment channel through the network structure between the double-layer porous layers. The size of the double-layer pores gradually increases from bottom to top. The use of a gradient pore structure better matches the trend of increasing bubble diameter during boiling, uses capillary action to increase the liquid phase reflux velocity, and provides a channel for steam escape.

[0056] In addition, the cell structure of the three-periodic minimal surface structure can also be adopted as follows Figure 8 The Gyroid-type three-periodic minimal surface structure shown, or Figure 9 The primitive three-periodic minimal surface structure shown in FIG. 1 is a schematic diagram of a primitive three-periodic minimal surface structure. In practical applications, the above type or other existing types can be selected according to actual needs, and the corresponding parameters of the structure can be adjusted according to the corresponding implicit equations.

[0057] Example 2

[0058] The present embodiment provides a preparation method of an immersion heat dissipation structure as in the first embodiment, comprising the following steps: forming a first cooling shell 1, and forming a refrigerant-friendly microstructure 13 on a corresponding portion of the peripheral side wall of the first cooling shell 1, and fixing the heating element 2 in the cooling cavity 11 of the first cooling shell 1; evacuating the cooling cavity 11, and then filling the cooling cavity 11 with refrigerant, and being able to control the filling pressure of the refrigerant.

[0059] Initially, the cooling chamber 11 is in a vacuum state, and then a refrigerant of a certain pressure is filled into the cooling chamber 11; since the evaporation temperature of the refrigerant is related to the pressure, the pressure in the cooling chamber 11 can be controlled by the liquid filling device to achieve the control of the refrigerant evaporation temperature, so that the cooling system operates under the best working conditions.

[0060] Among the optional schemes of this embodiment, it is more preferred to further include the following steps: forming a heat dissipation part 3 at the condensation end 12 of the first cooling shell 1, and circulating the coolant in the heat dissipation part 3; forming a second heat dissipation microstructure 4 on the heating surface of the heating element 2, and fixing it in the cooling cavity 11; and performing a pressure holding test on the cooling cavity 11 before evacuating the cooling cavity 11.

[0061] Among them, the first cooling shell 1 and the second cooling shell 31 are made of metal materials with good thermal conductivity such as copper, and are manufactured by metal additive manufacturing technology, such as selective laser melting (SLM) technology; the heating element 2 is fixed in the cooling cavity 11 and sealed by welding methods such as spot welding, gas welding or arc welding, and the heating element 2 is connected to the external system through the wire hole at the bottom; the first cooling shell 1 and the second cooling shell 31 can be sealed by sealing screws with sealant or welding to ensure that the refrigerant vapor does not leak.

[0062] Among them, the chemical vapor deposition (CVD) method is used to form a polytetrafluoroethylene film on the inner wall of the cooling chamber 11. The principle is that a gaseous fluorine-containing organic compound is used as a precursor, which undergoes thermal decomposition or chemical reactions with other reactive gases on the metal surface to form polytetrafluoroethylene; a microstructure surface is engraved on a silicon wafer using photolithography, the engraved silicon wafer is placed in a mold, and the mixed polydimethylsiloxane is poured in. After the polydimethylsiloxane is cured, it is used as a mold to pour the mixed epoxy resin. After the epoxy resin is cured, the microstructure on its surface is hot-pressed onto the polytetrafluoroethylene film on the inner wall of the container using hot pressing to form a 1.5μm microstructure surface, thereby forming a refrigerant-friendly microstructure 13; it should be noted that the bottom wall of the cooling chamber 11 can be formed last, and the cooling chamber 11 is sealed after the internal refrigerant-friendly microstructure 13 is formed.

[0063] Among them, a pressure holding test is carried out on the cooling chamber 11, and nitrogen 1.5 times the maximum working pressure is filled into the container, and the pressure holding time is 12 hours; after the pressure holding is completed, a vacuum pump is used to evacuate the cooling chamber 11 into a vacuum state to prevent other incompressible gases from remaining in the cooling chamber 11, and then liquid refrigerant is filled into the cooling chamber 11. The size of the filling pressure is determined according to the requirements of the evaporation temperature, and the injection pressure of the refrigerant can be set by a pressure reducing valve; it should be noted that, in the process of forming the first cooling shell 1, a through hole for vacuuming and injecting refrigerant is retained, and after completing the test and pressure adjustment, the through hole is sealed, or a through hole for injecting refrigerant is retained, and the opening and closing of the corresponding through hole is controlled by a switch valve arranged on the liquid injection pipeline, so as to facilitate flexible refrigerant charging pressure.

[0064] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. At the same time, those skilled in the art will find that the specific implementation methods and application scopes may vary based on the concept of the present invention. In summary, the contents of this specification should not be construed as limiting the present invention.

Claims

1. An immersion heat dissipation structure, characterized in that: include: A first cooling shell (1) has a cooling cavity (11) therein, the upper end of the first cooling shell (1) is a condensation end (12), and a refrigerant-friendly microstructure (13) is at least partially provided on the peripheral side wall of the cooling cavity (11); the cooling cavity (11) is used to place a heating element (2), and the cooling cavity (11) is used to fill a liquid refrigerant, the heating element (2) can be immersed in the liquid refrigerant, the liquid refrigerant can absorb the heat of the heating element (2) and evaporate into a gaseous state, the gaseous refrigerant condenses into a liquid state at the condensation end (12), and the condensed part of the refrigerant can adhere to the peripheral side wall of the cooling cavity (11), and the refrigerant-friendly microstructure (13) can guide the refrigerant flowing through downward.

2. The immersion heat dissipation structure according to claim 1, characterized in that: The refrigerant-friendly microstructure (13) is provided on the peripheral side walls of the cooling cavity (11).

3. The immersion heat dissipation structure according to claim 2, characterized in that: The refrigerant is a fluorine-containing coolant, and the refrigerant-friendly microstructure (13) includes a base film, which is covered on the peripheral side wall of the cooling cavity (11). A microstructure surface is provided on a side of the base film away from the peripheral side wall of the cooling cavity (11), and the base film is made of a fluorine-containing material.

4. The immersion heat dissipation structure according to claim 1, wherein: It also includes a heat dissipation portion (3), which is arranged outside the first cooling shell (1) and connected to the condensation end (12); the heat dissipation portion (3) is used to dissipate heat from the condensation end (12).

5. The immersion heat dissipation structure according to claim 4, characterized in that: The heat dissipation portion (3) includes a second cooling shell (31), the second cooling shell (31) is in contact with the shell surface of the condensation end (12), a cooling channel (32) is provided in the second cooling shell (31), and a liquid inlet (33) and a liquid outlet (34) connected to the cooling channel (32) are provided on the second cooling shell (31), and the cooling channel (32) is used for circulating cooling liquid.

6. The immersion heat dissipation structure according to claim 5, characterized in that: The cooling channel (32) is configured as a zigzag channel, and the cooling channel (32) is filled with a first heat dissipation microstructure (35).

7. The immersion heat dissipation structure according to claim 6, characterized in that: It also includes a second heat dissipation microstructure (4), which is used to be arranged on the heating surface of the heating element (2).

8. The immersion heat dissipation structure according to claim 7, characterized in that: The first heat dissipation microstructure (35) and the second heat dissipation microstructure (4) are both configured as three-periodic minimal surface structures; the aperture size of the second heat dissipation microstructure (4) gradually increases from bottom to top.

9. A method for preparing an immersion heat dissipation structure according to any one of claims 1 to 8, characterized in that: The steps include: Forming a first cooling shell (1), and forming a refrigerant-friendly microstructure (13) on a corresponding portion of a peripheral side wall of the first cooling shell (1), and fixing the heating element (2) in a cooling cavity (11) of the first cooling shell (1); The cooling chamber (11) is evacuated, and then a refrigerant is charged into the cooling chamber (11), and the charging pressure of the refrigerant can be regulated.

10. The preparation method according to claim 9, characterized in that: The following steps are also included: A heat dissipation portion (3) is formed at the condensation end (12) of the first cooling shell (1), and a coolant is circulated in the heat dissipation portion (3); A second heat dissipation microstructure (4) is formed on the heating surface of the heating element (2) and fixed in the cooling cavity (11); Before evacuating the cooling chamber (11), a pressure maintaining test is performed on the cooling chamber (11).

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