Antenna comprising air microstrip

Abstract

The invention relates to an antenna comprising an air microstrip, and the antenna comprises a first substrate which is formed in a flat plate shape, is provided with a first surface and a second surface which are oppositely disposed, and comprises one or more structural bodies protruding from the first surface and / or the second surface; the grounding layer is formed on one surface of the first substrate and / or the structural body; the microstrip line is arranged opposite to the grounding layer, and the microstrip line is formed on the other surface of the first substrate and / or the structural body; and an interval is formed between the microstrip line and the opposite grounding layer, so that the air microstrip is formed based on an air medium in the interval.

Description

Technical Field

[0001] The present application relates to the technical field of communication equipment, and in particular to an antenna including an air microstrip. Background Art

[0002] Reducing antenna insertion loss directly increases antenna gain, thereby improving the MMU's product coverage. As the 5G market matures and 6G standards become clearer, minimizing antenna stripline loss, particularly in 5G low-frequency MMUs and 6G ultra-large antenna array MMUs, will determine product success.

[0003] The PPS+40% glass fiber material used in existing traditional plastic antennas has a large Df value (0.0045). The RF microstrip line and ground plating layer use this substrate as the medium, resulting in large RF loss in the antenna and thus reducing the gain.

[0004] Another commonly used PTFE laminated substrate antenna has a complex process and high cost. Although the Df value of the PTFE laminate substrate can reach 0.001, it is still larger than that of the air dielectric. At the same time, the material is soft and has problems such as cracking of the copper layer; it still requires expensive metal plates for support. Summary of the Invention

[0005] An embodiment of the present application provides an antenna including an air microstrip, in which the strip line and ground layer of the air dielectric microstrip are integrated on a substrate. The air microstrip structure can be placed at any position on the antenna, thereby achieving an optimal product architecture.

[0006] In one embodiment of the present application, an antenna including an air microstrip is provided, including: a first substrate, the first substrate being formed in a flat plate shape, the first substrate having a first surface and a second surface opposite to each other, and the first substrate including one or more structures protruding from the first surface and / or the second surface; a ground layer formed on a surface of the first substrate and / or the structural body; a microstrip line, disposed opposite to the ground layer, wherein the microstrip line is formed on the first substrate and / or another surface of the structural body; An air microstrip is formed with a gap between the microstrip line and an opposite ground layer.

[0007] In one embodiment, it includes: A feed line is covered on the first surface or the second surface, and the microstrip line is electrically connected to the feed line via a power splitting via hole penetrating the first substrate.

[0008] In one embodiment, the structure comprises: The first plate protrudes from the first surface or the second surface, and the first plate forms an acute angle with the first surface or the second surface, and the air microstrip is formed between the first plate and the first surface or the second surface.

[0009] In one embodiment, the microstrip line is formed on the first surface or the second surface and is located within the projection range of the first plate on the first surface or the second surface; The ground layer covers a surface of the first plate facing the first surface or the second surface.

[0010] In one embodiment, the structure comprises: A first straight wall and a second straight wall, the first straight wall and the second straight wall are arranged in parallel and spaced apart and perpendicular to the first surface or the second surface, the ground layer and the microstrip line are respectively covered on the first straight wall and the second straight wall, and the air microstrip is formed between the adjacent first straight wall and the second straight wall.

[0011] In one embodiment, the structure comprises: a plurality of first straight walls and a plurality of second straight walls, wherein the number of the first straight walls is greater than the number of the second straight walls; Any second straight wall is provided between a pair of first straight walls.

[0012] In one embodiment, the height of the first straight wall is greater than the height of the second straight wall; The ground layer covers a surface of the first straight wall facing the second straight wall; The microstrip line covers a surface of the second straight wall facing the first straight wall.

[0013] In one embodiment, the first straight wall has a first inner surface perpendicular to the first surface or the second surface, and the second straight wall has a second outer surface forming a first angle with the first surface or the second surface; The ground layer and the microstrip line are formed by laser scanning, and the incident angle of the laser scanning is a second angle.

[0014] In one embodiment, the first angle is smaller than or equal to the complementary angle of the second angle, and the microstrip line covers the top of the second straight wall.

[0015] In one embodiment, the first angle is greater than the complementary angle of the second angle, the microstrip line covers the second outer surface of the second straight wall, and the gap between the microstrip line and the ground layer is formed at the gap between the first straight wall and the second straight wall.

[0016] In one embodiment, the first angle is greater than the complementary angle of the second angle, and the microstrip line covers the top of the second straight wall; The height of the first straight wall is configured so that the first straight wall avoids the laser scanning device that obliquely extends between the first straight wall and the second straight wall to form the second angle with the second outer surface.

[0017] Compared to traditional antenna manufacturing processes, this example uses minimal additional material, maintains a consistent process flow, and maintains minimal manufacturing time. Without increasing manufacturing costs or time, a simple air microstrip structure can be implemented, optimizing antenna performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following drawings are merely provided to illustrate and explain the present application, and do not limit the scope of the present application.

[0019] Figure 1 Schematic diagram of the structure of the first embodiment of the antenna including the air microstrip in the embodiments of the present application.

[0020] Figure 2 for Figure 1 BB section view in .

[0021] Figure 3 Schematic diagram of the structure of the second embodiment of the antenna including the air microstrip in the embodiment of the present application.

[0022] Figure 4 for Figure 3 A local enlarged schematic diagram in .

[0023] Figures 5a to 5c Schematic diagram of the structure of the air microstrip formation process in the embodiment of the present application. DETAILED DESCRIPTION

[0024] In order to have a clearer understanding of the technical features, purposes and effects of the invention, specific embodiments of the present invention are now described with reference to the accompanying drawings, in which the same reference numerals represent the same parts.

[0025] In this document, “illustrative” means “serving as an example, instance or illustration”, and any diagram or implementation described in this document as “illustrative” should not be interpreted as a more preferred or more advantageous technical solution.

[0026] To simplify the drawings, only the parts relevant to the present invention are schematically shown in each figure and do not represent the actual structure of the product. In addition, to simplify the drawings and facilitate understanding, in some figures, only one of the components with the same structure or function is schematically depicted or labeled.

[0027] In this document, “upper”, “lower”, “front”, “back”, “left”, “right”, etc. are only used to indicate the relative position relationship between related parts, rather than to limit the absolute positions of these related parts.

[0028] In this article, "first", "second", etc. are only used to distinguish each other, and do not indicate the importance and order, or the prerequisite for each other's existence.

[0029] In this document, "equal" and "same" are not strictly limited in the mathematical and / or geometric sense, but also include errors that can be understood by those skilled in the art and are allowed in manufacturing or use. Unless otherwise specified, the numerical ranges herein include not only the entire range within its two endpoints, but also several sub-ranges contained therein.

[0030] An embodiment of the present application provides an antenna including an air microstrip, wherein the strip line and the ground layer of the air microstrip line are integrated on a substrate. The air microstrip structure can be placed at any position on the antenna, thereby achieving an optimal product architecture.

[0031] An embodiment of the present application provides an antenna including an air microstrip, comprising: a first substrate, the first substrate being formed in a flat plate shape, the first substrate having a first surface and a second surface disposed opposite to each other, the first substrate including one or more structures protruding from the first surface and / or the second surface; a ground layer formed on a surface of the first substrate and / or the structural body; a microstrip line, disposed opposite to the ground layer, the microstrip line being formed on another surface of the first substrate and / or the structural body; The air microstrip has a gap between the microstrip line and the opposite ground layer to form the air microstrip based on the air medium in the gap.

[0032] Example embodiments will now be described more fully with reference to the accompanying drawings.

[0033] like Figures 1 to 2 As shown, one embodiment of the present application provides an antenna including an air microstrip, including: A first substrate 10 is formed in a flat plate shape. The first substrate 10 has a first surface and a second surface opposite to each other. The first substrate 10 includes one or more structures protruding from the first surface and / or the second surface. A ground layer 20 is formed on a surface of the first substrate 10 and / or the structural body; A microstrip line 30 is disposed opposite to the ground layer 20 , and the microstrip line 30 is formed on another surface of the first substrate 10 and / or the structural body; The air microstrip 40 has a gap between the microstrip line 30 and the opposing ground layer 20 to form the air microstrip 40 based on the air medium in the gap.

[0034] In this example, structures protruding from the first substrate of the antenna are formed. Air microstrips are formed based on the air dielectric between the structures or between the structures and the substrate. The air microstrips are matched by a microstrip line on one side and a ground layer on the other. The antenna device of this example is directly molded into a complex structure using plastic injection molding, and the air microstrip line and ground layer are directly electroplated on the molded part.

[0035] The first substrate 10 is formed into a flat rectangular plate, having a first surface and a second surface arranged opposite each other along the height direction, i.e., the two largest surfaces of the first substrate. The first and second surfaces are used to mount structures and form air microstrips. The structures can be mounted only on the first surface, only on the second surface, or on both surfaces.

[0036] Due to the confining effect of air cavities on microwave signals, when microwave signals are transmitted through metal conductors, the induced magnetic and electric fields are confined within the cavity, preventing signal radiation loss. Furthermore, because the dielectric constant of air is close to 1, its propagation speed approaches the speed of light. Air microstrip antennas offer advantages such as low loss, high bandwidth, ease of manufacturing, immunity to electromagnetic interference, and flexible design. By introducing an air layer into a microstrip antenna to broaden its operating frequency band while maintaining a simple and easily manufactured antenna structure, microstrip antennas with an air layer have a significantly increased operating bandwidth compared to conventional single-layer microstrip antennas. They also exhibit excellent radiation characteristics across the entire operating frequency band, with high gain and very low backscatter.

[0037] Compared to traditional antenna manufacturing processes, this example uses minimal additional material, maintains a consistent process flow, and maintains minimal manufacturing time. Without increasing manufacturing costs or time, a simple air microstrip structure can be implemented, optimizing antenna performance.

[0038] In one example, this includes: The feed line is covered on the first surface or the second surface, and the microstrip line 30 is electrically connected to the feed line via the power splitting via 11 penetrating the first substrate 10. The microstrip line 30 also has an input port 12 connected to the input end of the circuit board.

[0039] Among them Figure 1 and Figure 2 As shown, the structure includes: The first plate 51 protrudes from the first surface or the second surface, and forms an acute angle with the first surface or the second surface. The air strip 40 is formed between the first plate 51 and the first surface or the second surface.

[0040] The microstrip line 30 is formed on the first surface or the second surface and is located within the projection range of the first plate 51 on the first surface or the second surface; The ground layer 20 covers a surface of the first plate 51 facing the first surface or the second surface.

[0041] The second surface of the first substrate 10 forms two inverted V-shaped grooves via an inclined first flat plate 51. One side of the grooves houses the RF microstrip line 30, while the other side houses the ground layer 20, forming a V-grooved air microstrip structure. The main feeder is equipped with a pogo pin port, which can also be connected to the filter board using embedded metal pins. Corresponding vias are provided on the ground layer 20 side of the V-groove.

[0042] If the microstrip line 30 is formed within the vertical projection of the first flat plate 51, then the microstrip line is formed on a surface of the first substrate 10. A surface here refers to a surface that is obstructed from view. For example, if the microstrip line 30 is formed within the projection of the first flat plate 51, then the first flat plate 51 is the outer surface that obstructs the microstrip line 30. A surface of the first substrate 10 includes: the surface of the second surface that is outside the projection of the first flat plate 51, and the surface of the first flat plate 51 that faces outward from the first substrate.

[0043] like Figure 3 and Figure 4 As shown, the structure includes: The first straight wall 52 and the second straight wall 53 are arranged in parallel and spaced apart and perpendicular to the first surface or the second surface. The ground layer 20 and the microstrip line 30 are respectively covered on the first straight wall 52 and the second straight wall 53. The air microstrip 40 is formed between the adjacent first straight walls 52 and the second straight walls 53.

[0044] In this example, unlike the inclined first flat plate, the first straight wall 52 and the second straight wall 53 are perpendicular to the first surface or the second surface, thereby forming a vertical air microstrip on the first straight wall 52 and the second straight wall 53. The ground layer 20 and the microstrip line 30 are respectively covered on the first straight wall 52 and the second straight wall 53.

[0045] Preferably, the structure comprises: a plurality of first straight walls 52 and a plurality of second straight walls 53 , wherein the number of the first straight walls 52 is greater than the number of the second straight walls 53 ; Any one of the second straight walls 53 is provided between the pair of first straight walls 52 .

[0046] like Figure 3 and Figure 4 As shown, in one example, the structure may include, for example, three first straight walls 52 and two second straight walls 53, wherein each second straight wall 53 is disposed between a pair of first straight walls 52, thereby forming an E-shape. The ends of the plurality of first straight walls 52 are connected together, and the ends of the plurality of second straight walls 53 are connected together. The ground layer 20 and microstrip line 30 covering the first straight walls 52 and the second straight walls 53 thus form an integral structure with the same potential.

[0047] The ground layer 20 may cover the surface of the first straight wall 52, and the microstrip line 30 may cover the surface of the second straight wall 53. Each microstrip line is disposed between a pair of ground layers. The microstrip lines may be respectively covered on a pair of opposing surfaces of the second straight wall 53, with the opposing surfaces facing different first straight walls 52, thereby forming air microstrips 40 on both sides of each second straight wall 53.

[0048] The microstrip line 30 is electrically connected to the feeder line on the first substrate via the power splitting via 11. In one example, Figure 3 and Figure 4 The structure shown is protruded from the first surface of the first substrate 10. Figure 1 and Figure 2 The structure shown is protruded from the second surface of the first substrate 10 , and the microstrip lines 30 on two opposite surfaces are connected through a power splitting via 11 .

[0049] In a specific example, the height of the first straight wall 52 is greater than the height of the second straight wall 53 , the ground layer 20 covers the side surface of the first straight wall 52 facing the second straight wall 53 , and the microstrip line 30 covers the side surface of the second straight wall 53 facing the first straight wall 52 .

[0050] The first surface of the first substrate has an E-shaped staggered serpentine wall structure, in which the taller wall covers the ground layer 20. A microstrip line 30 is provided at the top of the shorter wall, at the center of the ground layer height, to form a vertical air microstrip 40. The microstrip line 30 is connected to the main feed line through a power splitter via 11. By adjusting the length and number of bends of the staggered serpentine path, different line lengths can be achieved, thereby achieving the goal of achieving the same phase for each array.

[0051] In this example, the first surface of the first substrate has a vertical E-shaped phase-matched air microstrip, and the second surface has a V-groove air microstrip 40 and a main feed line; the air microstrips 40 on the above two surfaces are connected by a power splitting via 11; the ground layer in the antenna can be connected through the spare parts at both ends of the first substrate, or through the power splitting via 11, so as to realize the complete ground and reflector function.

[0052] By adjusting the length and number of bends of the air strip line structure, different routing lengths can be achieved, thereby achieving the goal of the same phase for each array.

[0053] The plastic antenna electroplating process involves depositing chemical nickel on the entire plastic surface, followed by partial laser engraving to eliminate electrical continuity between the inside and outside of the laser-engraved frame. After selective copper plating is applied to the area within the laser-engraved frame, the areas outside the laser-engraved frame are stripped of nickel to create the antenna's striplines and ground plane. To better accommodate high-volume production, a conveyor-based laser scanning method is recommended for the plastic antenna substrate. However, due to the minimum laser incident angle of 30°, product designs below this value require robotic angle adjustment or real-time laser power adjustments, making them unsuitable for mass production. This incident angle restriction is intended to ensure clear stripline etching.

[0054] Regardless of E or V, according to the plastic metallization process, the specific implementation of air strip line can be divided into the following three types but not limited to them. Figure 5a The form shown and Figure 5b The form shown is the laser flat scanning form, the incident angle of the laser is 30°, Figure 5a The slope of the strip line plating surface is less than 60°, and the strip line width can be freely adjusted; Figure 5b If the strip line plating surface is larger than 60°, the entire surface needs to be plated to meet the process requirements; if the strip line width larger than 60° is to be freely adjusted, the height of the ground wall needs to be lowered so that the laser can achieve the 30° incident angle requirement through the rotation of the robot relative to the plastic substrate.

[0055] Overall, the first straight wall 52 and the second straight wall 53 are generally perpendicular to the first surface or the second surface, but the first straight wall 52 or the second straight wall 53 may have one or more surfaces that form an angle with the first surface or the second surface, but the central axis direction of the first straight wall 52 and the second straight wall 53 is perpendicular to the first surface or the second surface.

[0056] like Figure 5a As shown, the first straight wall 52 has a first inner surface perpendicular to the first surface or the second surface, and the second straight wall 53 has a second outer surface forming a first angle α with the first surface or the second surface; The ground layer 20 and the microstrip line 30 are formed by laser scanning, and the incident angle of the laser scanning is a second angle β.

[0057] The first angle α is smaller than or equal to the complementary angle of the second angle β, and the microstrip line 30 covers the top of the second straight wall 53 .

[0058] For example, the first straight wall 52, the second straight wall 53, and the gap between the first straight wall 52 and the second straight wall 53 are entirely covered with a metal layer, and the laser scanning device is incident at an angle perpendicular to the first surface or the second surface to remove metal, for example, in the gap between the first straight wall 52 and the second straight wall 53 and at the bottom of the second straight wall 53, thereby achieving a metal layer (serving as a ground layer 20) on the surface of the first straight wall 52 and a metal layer (serving as a microstrip line 30) on the top surface of the second straight wall 53.

[0059] Alternatively, as Figure 5b As shown, the first angle α is greater than the complementary angle of the second angle β, the microstrip line 30 covers the second outer surface of the second straight wall 53, and the gap between the microstrip line 30 and the ground layer 20 is formed at the gap between the first straight wall 52 and the second straight wall 53.

[0060] For example, a metal layer is integrally covered on the first straight wall 52, the second straight wall 53, and the gap between the first straight wall 52 and the second straight wall 53, and a laser scanning device is incident at an angle perpendicular to the first surface or the second surface to remove metal at the gap between the first straight wall 52 and the second straight wall 53, so that the surface of the first straight wall 52 has a metal layer (serving as the ground layer 20) and the surface of the second straight wall 53 has a metal layer (serving as the microstrip line 30).

[0061] Alternatively, as Figure 5c As shown, the first angle α is greater than the complementary angle of the second angle β, and the microstrip line 30 covers the top of the second straight wall 53; The height of the first straight wall 52 is configured such that the first straight wall 52 avoids the laser scanning device, wherein the laser scanning device obliquely extends into the gap between the first straight wall 52 and the second straight wall 53 at a second angle with the second outer surface.

[0062] When the first angle α is greater than the complementary angle of the second angle β, the laser scanning device cannot remove the metal layer on the surface of the second straight wall 53 when incident at an angle perpendicular to the first surface or the second surface. To achieve treatment of the metal layer on the surface of the second straight wall 53, the laser scanning device can be incident at a second angle to the surface of the second straight wall 53. In this case, the laser scanning device needs to extend into the gap between the first straight wall 52 and the second straight wall 53, and the height of the first straight wall 52 is reduced to avoid the laser scanning device.

[0063] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. An antenna comprising an air microstrip, characterized in that include: A first substrate (10), the first substrate (10) being formed in a flat plate shape, the first substrate (10) having a first surface and a second surface arranged opposite to each other, the first substrate (10) comprising one or more structures protruding from the first surface and / or the second surface; a grounding layer (20), the grounding layer (20) being formed on a surface of the first substrate (10) and / or the structure; a microstrip line (30) disposed opposite to the ground layer (20), the microstrip line (30) being formed on the first substrate (10) and / or another surface of the structure; An air microstrip (40) is provided, wherein a gap is provided between the microstrip line (30) and the opposite ground layer (20), so as to form the air microstrip (40) based on an air medium within the gap.

2. The antenna comprising an air microstrip according to claim 1, wherein: include: A feed line is covered on the first surface or the second surface, and the microstrip line (30) is electrically connected to the feed line via a power division via (11) penetrating the first substrate (10).

3. The antenna comprising an air microstrip according to claim 1, wherein: The structure includes: A first flat plate (51), the first flat plate (51) protrudes from the first surface or the second surface, and the first flat plate (51) forms an acute angle with the first surface or the second surface, and the air microstrip (40) is formed between the first flat plate (51) and the first surface or the second surface.

4. The antenna comprising an air microstrip according to claim 3, wherein: The microstrip line (30) is formed on the first surface or the second surface and is located within the projection range of the first flat plate (51) on the first surface or the second surface; The grounding layer (20) covers a side surface of the first flat plate (51) facing the first surface or the second surface.

5. The antenna comprising an air microstrip according to claim 1, wherein: The structure includes: A first straight wall (52) and a second straight wall (53), wherein the first straight wall (52) and the second straight wall (53) are arranged in parallel and spaced apart and perpendicular to the first surface or the second surface, the ground layer (20) and the microstrip line (30) are respectively covered on the first straight wall (52) and the second straight wall (53), and the air microstrip (40) is formed between the adjacent first straight wall (52) and the second straight wall (53).

6. The antenna comprising an air microstrip according to claim 5, characterized in that The structure includes: a plurality of first straight walls (52) and a plurality of second straight walls (53), wherein the number of the first straight walls (52) is greater than the number of the second straight walls (53); Any second straight wall (53) is provided between a pair of first straight walls (52).

7. The antenna comprising an air microstrip according to claim 5, characterized in that The height of the first straight wall (52) is greater than the height of the second straight wall (53); The grounding layer (20) covers a surface of the first straight wall (52) facing the second straight wall (53); The microstrip line (30) covers a surface of the second straight wall (53) facing the first straight wall (52).

8. The antenna comprising an air microstrip according to claim 7, characterized in that The first straight wall (52) has a first inner surface perpendicular to the first surface or the second surface, and the second straight wall (53) has a second outer surface forming a first angle (α) with the first surface or the second surface; The ground layer (20) and the microstrip line (30) are formed by laser scanning, and the incident angle of the laser scanning is a second angle (β).

9. The antenna comprising an air microstrip according to claim 8, characterized in that The first included angle (α) is smaller than or equal to the complementary angle of the second included angle (β), and the microstrip line (30) covers the top of the second straight wall (53).

10. The antenna comprising an air microstrip according to claim 8, characterized in that The first angle (α) is greater than the complementary angle of the second angle (β), the microstrip line (30) covers the second outer surface of the second straight wall (53), and the gap between the microstrip line (30) and the ground layer (20) is formed at the gap between the first straight wall (52) and the second straight wall (53).

11. The antenna comprising an air microstrip according to claim 8, wherein: The first included angle (α) is greater than the complementary angle of the second included angle (β), and the microstrip line (30) covers the top of the second straight wall (53); The height of the first straight wall (52) is configured such that the first straight wall (52) avoids the laser scanning device that obliquely extends between the first straight wall (52) and the second straight wall (53) to form the second angle with the second outer surface.

Images